WO2021115169A1 - 一种芯片检测装置、芯片检测系统及控制方法 - Google Patents

一种芯片检测装置、芯片检测系统及控制方法 Download PDF

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Publication number
WO2021115169A1
WO2021115169A1 PCT/CN2020/133240 CN2020133240W WO2021115169A1 WO 2021115169 A1 WO2021115169 A1 WO 2021115169A1 CN 2020133240 W CN2020133240 W CN 2020133240W WO 2021115169 A1 WO2021115169 A1 WO 2021115169A1
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WO
WIPO (PCT)
Prior art keywords
chip
turntable
tray
air hole
pressure air
Prior art date
Application number
PCT/CN2020/133240
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English (en)
French (fr)
Inventor
孟萌
李向东
Original Assignee
山东才聚电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山东才聚电子科技有限公司 filed Critical 山东才聚电子科技有限公司
Priority to EP20898474.0A priority Critical patent/EP4075154A4/en
Priority to JP2022535908A priority patent/JP7267507B2/ja
Priority to KR1020227023338A priority patent/KR20220112819A/ko
Priority to US17/784,912 priority patent/US20230003794A1/en
Publication of WO2021115169A1 publication Critical patent/WO2021115169A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/912—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rectilinear movements only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Definitions

  • the invention relates to chip detection equipment, in particular to a chip detection device, a chip detection system and a control method.
  • the chip generally refers to the carrier of the integrated circuit, and is also the result of the design, manufacture, packaging, and testing of the integrated circuit. It is usually an independent whole that can be used immediately.
  • Electronic chip is a kind of miniature electronic device or component. It uses a certain process to interconnect the transistors, resistors, capacitors and inductors and wiring required in a circuit to make one or several small semiconductor wafers or On the dielectric substrate, it is then packaged in a tube case to become a microstructure with the required circuit functions; all of the components have been structured as a whole, which makes the electronic components towards microminiaturization, low power consumption, intelligence and high reliability A big step forward in terms of sex.
  • the current detection method of the electronic chip is that the inspection worker holds the detection probe drawn from the electrical detection box and observes The status of the indicator light on the electrical test box and the size of the parameters displayed on the display screen determine whether the electronic chip is qualified.
  • this test method not only greatly increases the work intensity of the tester, but also leads to the test process. The swaying of the middle detection probe causes errors, which seriously affects the detection accuracy and poor practicability. Therefore, it is an urgent requirement to design an automated equipment for fast and efficient detection of chips.
  • the technical problem to be solved by the present invention is to provide a chip detection device, a chip detection system and a control method for fast and efficient chip detection.
  • the present invention provides a chip detection device, which includes: a support plate, a detection platform erected between two support plates, a first driving device provided on the support plate and capable of linear movement, and a first drive device arranged on the upper part of the detection platform and connected to the The probe holder connected to the first driving device;
  • the detection platform includes: a turntable: a cylindrical structure, the two ends of the turntable are rotatably connected with the support plate; a vacuum ring: the end surface of one end of the vacuum ring is fixedly connected with the support plate, and the other vacuum ring The end face of one end is connected to the end face of the turntable in a sealed and rotating connection;
  • the second driving device installed on the support plate and capable of driving the turntable to rotate;
  • chip test disk at least three groups are provided and evenly distributed on the cylindrical surface of the turntable, each set of chip test disks Arranged in the length direction of the cylinder of the turntable; the chip test disk is provided with chip placement grooves, the bottoms of the chip placement
  • the present invention also provides a chip detection system, which includes a cabinet in which a controller, a loading manipulator, a discharging manipulator, a chip tray bracket provided on one side of the loading manipulator, and a discharging robot are provided.
  • the controller is electrically connected to the loading manipulator, the unloading manipulator, and the chip detection device, and the controller controls the loading manipulator to place the chip on the chip tray carrier on the rotating detection platform; when the chip is rotated to the upper part, the detection The needle holder is lowered
  • the present invention also provides a control method of a chip detection system, which includes the following steps: after the chip detection system is started, the negative pressure air source of the negative pressure air hole on the vacuum ring and the positive pressure air source of the positive pressure air hole are connected; a rotating turntable The main air hole on the upper side obtains the air source through the vacuum ring; step A, control the loading manipulator to move to the upper part of the chip tray, and adjust the vacuum suction head of the loading manipulator to face down, so that the vacuum suction head of the loading manipulator is aligned with the line on the chip tray Chip corresponding; the loading manipulator is connected to the negative pressure air source, and the loading manipulator moves down until the vacuum suction head of the loading manipulator absorbs the chips on the chip tray; or, the loading manipulator moves down until the vacuum of the loading manipulator When the suction head is close to the chip, turn on the negative pressure air source to adsorb the chip to the vacuum suction head of the loading manipulator; control the movement of the loading manipulator, and rotate the operating arm
  • the present invention greatly improves the work efficiency by completing the placement, detection and removal of the chip during the rotation of the turntable;
  • the chip detection device of the present invention is provided with a cavity to accommodate the probe, and an inert gas is introduced into the cavity to protect the chip during detection, preventing sparks from contact between the probe and the chip during the detection process, thereby improving the quality of the chip ;
  • the chip inspection system of the present invention is electrically connected with the loading manipulator, the unloading manipulator and the chip detection device by setting the controller. During the rotation of the turntable, the filling of the chip, the detection of the chip and the classification of the chip are all controlled automatically The program control is automatically completed, which has the beneficial effect of being faster and more efficient than the existing manual operation and assembly line operation;
  • the chip detection system of the present invention can prevent the chip from getting stuck in the chip placement slot by setting the overflow box, improve the utilization rate of the chip placement slot, and reduce the damage and waste of the chip;
  • the chip detection system of the present invention can realize automatic feeding by setting a rotating feeding platform, and the staff can replace the external vacant chip tray regularly, which reduces the labor cost and physical consumption of the workers.
  • FIG. 1 is a three-dimensional schematic diagram of a chip detection device according to an embodiment of the present invention.
  • Figure 2 is a front view of a turntable according to an embodiment of the present invention.
  • Figure 3 is a left side view of the turntable of an embodiment of the present invention.
  • Figure 4 is a cross-sectional view of a turntable according to an embodiment of the present invention.
  • Fig. 5 is a partial enlarged view of area A in Fig. 1;
  • Fig. 6 is a schematic diagram of a vacuum ring according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a chip inspection system according to an embodiment of the present invention.
  • Fig. 8 is a schematic diagram of a vacuum manipulator according to an embodiment of the present invention.
  • Figure 9 is a schematic diagram of a transfer pallet platform according to an embodiment of the present invention.
  • Figure 10 is a front view of a probe holder according to an embodiment of the present invention.
  • Figure 11 is a cross-sectional view of a probe holder according to an embodiment of the present invention.
  • Fig. 12 is an enlarged view of the connecting part of the vacuum ring and the turntable in the present invention.
  • the present invention provides a chip detection device, which includes a support plate 100, a probe holder 110 arranged on the upper part of the support plate 100, a first driving device 120 that drives the probe holder 110 to move up and down, and a detection platform erected on the support plate 100 .
  • the supporting plate 100 is used for erecting a testing platform.
  • the two supporting plates 100 can be arranged on a base to ensure its stability.
  • two supporting plates 100 and the base are integrally formed into a frame structure with a U-shaped cross-sectional shape, which includes a base part and two vertical supporting parts. Even better, in order to maintain stability, a connecting rod is provided between the two supporting plates 100 to ensure stability.
  • the detection platform is used to place the chip to be detected. When the chip rotates to the uppermost part, the probe drops and combines with the chip, and then the detection is performed.
  • a first driving device 120 is provided on the outer side of the support plate 100.
  • the first driving device 120 has a linear motion function, such as an electric push rod, an electric hydraulic push rod, a linear motor, etc., and may also be an air cylinder or a hydraulic cylinder push rod.
  • the first driving device 120 is arranged at the lower part of the two support plates 100, and is fixedly connected to the two support plates 100 To maintain stability.
  • the first driving device 120 is a linear driving device composed of an electric screw and a sliding block.
  • a sliding rail 101 and a landing connecting plate 119 are provided on the outer side of the support plate.
  • the length direction of the sliding rail 101 is the vertical direction
  • the middle part of the take-off and landing connecting plate 119 is slidably connected with the sliding rail 101
  • the upper part of the take-off and landing connecting plate 119 is fixedly connected with the probe base 110.
  • the probe base 110 is erected between the two take-off and landing connecting plates 119.
  • the lower ends of the two take-off and landing connecting plates 119 are connected by a cross beam 140, and the middle part of the cross beam 140 is fixedly connected with the sliding block of the first driving device 120.
  • the probe base 110 is used to install probes, and the probes include a test needle and a common end needle.
  • the detection platform is located at the lower part of the probe base 110, and the length directions of the two are parallel and overlapped vertically. After the probe holder 110 is lowered, the probe contacts the chip on the chip test board 220. At this time, the test needle is connected to the upper part of the chip, the common end needle is connected to the chip test board 220, and the chip test board 220 is connected to the lower part of the chip. Can realize power-on detection.
  • a test control circuit is also provided on the probe base 110.
  • the test control circuit can be set outside the body and connected by wires.
  • the test control circuit is arranged on the upper part of the probe base 110 for nearby detection, and the detection result is stored or transmitted to other devices through a communication line.
  • the probe of the probe holder 110 is arranged inside the cavity 115 connected with the positive pressure inert gas source.
  • the cavity 115 is open (ie, open) on the side where the probe needle is located. Since the cavity 115 is connected to the positive pressure inert gas source, the oxygen in the cavity 115 is driven out and the oxygen concentration is reduced, which prevents the generation of sparks when the chip is electrocuted, and ensures the quality of the chip.
  • the cavity 115 is enclosed by the probe holder 110 and the enclosure 113 provided on the outer periphery of the probe holder 110.
  • the enclosure 113 or the probe base 110 is provided with a main protective air hole 111 and a dispersed air hole 112, and the length direction of the main protective air hole 111 is parallel to the length direction of the probe arrangement.
  • the dispersed air hole 112 communicates with the main protective air hole 111 and the cavity 115, and the main protective air hole 111 communicates with a positive pressure inert gas source.
  • the enclosure 113 is in the shape of a long strip and is arranged perpendicular to the probe base.
  • the enclosure 113 and the probe base are connected by screwing or clamping.
  • the enclosure 113 is arranged around the probe and closed in the outer circumferential direction. ,
  • the inner side of the enclosure 113 forms a cavity 115 with an open lower part.
  • the main protection air hole 111 is provided on the upper part of the probe base 110, and the enclosure 113 is provided with an air inlet interface communicating with the main protection air hole 111.
  • the lower part of the dispersing air hole 112 is inclined toward the end of the probe.
  • the main protective air hole 111 is communicated with the external positive pressure inert gas through the air inlet port provided on the probe base 110 or the enclosure 113.
  • the positive pressure inert gas is nitrogen.
  • the distance between the lower end of the enclosure 113 and the bottom surface of the probe base is slightly smaller than the distance between the bottom end of the probe and the bottom surface of the probe base 110.
  • the distance between the lower end of the enclosure 113 and the bottom surface of the probe base is 3 mm to 5 mm smaller than the distance between the bottom end of the probe and the bottom surface of the probe base 110.
  • the upper part of the enclosure 113 is slidably connected with the probe holder 110 up and down.
  • the enclosure 113 first abuts the chip test tray 220 to close the cavity 115
  • the probe holder 110 continues to descend to contact the chip for detection.
  • the length direction of at least two dispersing pores 112 is inclined toward the needle of the probe. At this time, the gas is blown toward the needle, and the needle can be in the inert gas when it contacts the chip.
  • the inspection platform is used to implement continuous chip inspection, and the inspection platform mainly includes a turntable 200, a vacuum ring 400, and a second driving device 130.
  • the turntable 200 has a cylindrical structure, and at least three sets of evenly distributed chip test disks 220 are provided on the cylindrical surface of the turntable 200.
  • Each set of chip test discs 220 is provided with a plurality of chip test discs 220, the length of the chip test disc 220 is the same as the axial direction of the turntable 200, and the chip test discs 220 of each group are along the length direction on the cylinder of the turntable 200 Arrange in a row.
  • the chip test disk 220 is rectangular, and its length direction coincides with the axial direction of the turntable 200. In order to increase the structural strength of the turntable 200, the turntable 200 generally adopts a metal structure. In order to prevent the chip test disk 220 from conducting electricity, the chip test disk 220 is designed as a multilayer structure.
  • the lower part of the chip test tray 220 is made of insulating material for contact with the turntable 200.
  • the middle or upper part of the chip test tray 220 is embedded with metal materials to achieve conductivity.
  • the chip test tray 220 is provided with a chip placement for placing chips.
  • the slot 222 is used as the common end of the chip test tray 220, and the chip placement slot 222 is opened on the metal material.
  • the chip placement slots 222 in the chip test tray 220 need to provide power to the chips, so all the chip placement slots 222 are conductors and all the chip placement slots 222 are electrically connected as common terminals for chip detection. One of the probes is individually in contact with the chip placement groove to realize the electrical connection of the common terminal.
  • the length of the chip test disk 220 may be slightly smaller than the length of the turntable 200, that is, a chip test disk 220 is provided within an arc range of the side of the turntable 200.
  • the length of the chip test disk 220 is 3mm ⁇ 5mm smaller than the length of the turntable 200. .
  • a suction through hole 221 is provided in the middle of the chip placement groove 222, and the suction through hole 221 communicates with the bronchus hole 212 on the turntable 200, as shown in FIG. 2. Even better, in order to reduce waste of gas source and save energy, the adsorption through hole 221 and the bronchus hole 212 are connected in a sealed manner.
  • the detection of the chip is a separate detection, that is, the test probe is charged separately for the test.
  • the cycle detection takes a long time. Therefore, in order to improve the detection speed, the present invention arranges the chip test disc 220 in multiple groups, with multiple groups in each group, that is, a plurality of chip tests arranged in a row are arranged in a length direction of the cylinder surface parallel to the axial direction. Disk 220, the chips in each chip test disk 220 are tested at the same time, so the detection efficiency can be greatly improved. That is, the chip test disk 220 has at least three groups, each group has multiple, and the multiple chip test disks 220 of each group are sequentially arranged in a row in the length direction of the turntable 200.
  • Both ends in the length direction of the turntable 200 are rotatably connected with the support plate 100.
  • two ends of the turntable 200 are extended with fixed shafts or connected to the fixed shafts, and a bearing fixing seat is provided on the supporting plate 100 to install the fixed shafts.
  • the fixed shaft at one end of the turntable 200 passes through the vacuum ring 400 and is rotatably connected to the support plate 100, and the fixed shaft at the other end of the turntable 200 is connected to the rotation output mechanism of the second driving device 130.
  • the second driving device 130 is a motor, and the fixed shaft at the other end of the turntable 200 is fixedly connected to the rotating shaft of the motor.
  • the turntable 200 may be set as a cylinder, and the chip test disk 220 is set on the cylindrical surface of the turntable 200.
  • the contact surface of the chip test disk 220 and the turntable 200 can be designed as an arc surface with the same curvature as the turntable 200 to facilitate the bonding of the two.
  • the turntable 200 and the chip test disk 220 can be connected by screws.
  • the turntable 200 may be configured as a regular polyhedral cylinder, and the number of faces of the regular polyhedral cylinder is at least three.
  • the turntable 200 is designed as a regular hexahedral cylinder and a regular octahedral cylinder.
  • the chip test board 220 is installed on each side of the regular polyhedral cylinder.
  • the turntable 200 in this embodiment adopts a regular six-sided cylinder, which is also the optimal design solution.
  • an overflow box 300 is provided at the lower part of the turntable 200.
  • the overflow box 300 is a long rectangular box, and its two ends are respectively fixedly connected to the two supporting plates 100 or detachably connected.
  • the opening of the overflow box 300 faces upwards and is used to collect the fallen chips.
  • the overflow box 300 is located below the turntable 200, and the opening of the overflow box 300 faces the turntable 200.
  • the chip test tray 220 is provided with multiple rows of chip placement grooves 222, preferably two or three rows of chip placement grooves 222 are provided.
  • the turntable 200 is provided with the same number of branch holes 212 as the chip placement groove 222 to communicate with the suction through holes 221 of the chip placement groove 222.
  • the turntable 200 is provided with main vents 211 whose length direction is parallel to the axial direction of the turntable 200.
  • the number of the main vents 211 is equal to
  • the number of groups of the chip test disk 220 is the same.
  • the main air holes 211 and the chip test disk 220 correspond one-to-one in the radial direction.
  • the main air hole 211 of the turntable 200 is open close to the hole on the end surface of the vacuum ring 400, and the other hole of the main air hole 211 is closed.
  • the chip test disk 220 and the main air hole 211 are located in the same radial direction of the turntable 200.
  • the turntable 200 is further provided with a bronchus hole 212.
  • the bronchus hole 212 communicates with the main air hole 211 and the adsorption through hole 221 of the chip test disk 220.
  • each main air hole 211 corresponds to two groups of adjacent chip test disks 220, and each main air hole 211 is provided with two sets of bronchus holes 212.
  • the present invention implements continuous detection by rotating the turntable 200, so it is necessary to provide a second driving device 130 to drive the turntable 200 to rotate.
  • the second driving device 130 is a rotary driving device, and common stepping motors, servo motors, reluctance motors, etc., can also be applied to pneumatic rotary driving devices.
  • the second driving device 130 is arranged on another supporting plate 100, and the rotating shaft of the second driving device 130 is directly connected with the turntable 200 or connected through a reducer, a coupling, or the like to drive the turntable 200 to rotate.
  • the rotating shaft of the second driving device 130 is rotatably connected with the support plate 100 through a bearing.
  • the function of the second driving device 130 is to drive the turntable 200 to rotate, and the vacuum ring 400 is used to realize the connection of the air source.
  • the vacuum ring 400 is ring-shaped, and its middle part is used to pass through a fixed shaft for fixing the turntable 200, and the fixed shaft is rotatably connected with the support plate 100 through a bearing.
  • One end surface of the vacuum ring 400 is fixedly connected to the support plate 100, and the other end surface of the vacuum ring 400 is connected to the end surface of the turntable 200 in a sealed and rotating manner.
  • the opposing surface of the vacuum ring 400 and the turntable 200 is a mirror surface, and the butting surface is coated with grease.
  • the vacuum ring 400 is provided with a wire hole, and the vacuum ring 400 is installed on the upper part of the support plate 100 through the wire hole.
  • the vacuum ring 400 serves as a valve to control the air source inside the main air hole 211.
  • the vacuum ring 400 is provided with a negative pressure air hole 401 for ventilating the main air hole 211.
  • One orifice of the negative pressure air hole 401 is located on the end surface opposite to the turntable 200 and on the same circumference as the main air hole 211, and the other orifice of the negative pressure air hole 401 is used to connect a negative pressure air source.
  • the negative pressure air hole 401 is connected to a negative pressure air source through an electronically controlled air valve.
  • the turntable 200 rotates during operation, the main air hole 211 and the negative pressure air hole 401 sometimes face each other, and sometimes they are staggered.
  • the opening of the negative pressure air hole 401 or the orifice of the main air hole 211 is provided There is a communication groove 213 to realize the communication between the negative pressure air hole 401 and the main air hole 211 when they are staggered.
  • the orifice of the main air hole 211 or the cross-sectional shape of the main air hole 211 may be the same as the shape of the communication groove 213.
  • the vacuum ring 400 may be provided with a negative pressure air hole.
  • the communication groove 213 at the position of the main air hole 211 is in a circular ring shape.
  • the width of the communication groove 213 is greater than or equal to the diameter of the main air hole 211.
  • the vacuum ring can also be provided with a positive pressure air hole 402.
  • the negative pressure air hole 401 and the positive pressure air hole 402 are arranged symmetrically up and down.
  • the positive pressure air hole 402 is used to connect with a positive pressure air source.
  • the communication groove 213 is provided on the vacuum ring 400.
  • the vacuum ring 400 is provided with three negative pressure air holes 401.
  • one of the main air holes 211 is located at the highest point of the upper part, and the three negative pressure air holes 401 and the upper main air hole 211 and the positions of the two main air holes 211 adjacent to the upper main air hole 211 correspond, that is, the negative pressure air hole 401 communicates with the three main air holes 211 on the upper part.
  • the negative pressure air hole 401 is connected to a negative pressure gas source, or is communicated with a negative pressure gas source through a gas valve.
  • the communicating groove 213 at the position of the main air hole 211 is arc-shaped, and the distance between the two communicating grooves 213 is greater than the radius of the negative pressure air hole 401 and smaller than the diameter of the negative pressure air hole 401.
  • the vacuum ring 400 can also be provided with a positive pressure air hole 402.
  • the turntable 200 is rotated to one of the chip test discs 220 at the upper level, that is, when one of the chip test discs 220 faces the probe base 110, three negative pressure air holes 401 corresponds to the positions of the upper main air hole 211 and the two main air holes 211 adjacent to the upper main air hole 211, while the positive pressure air hole 402 corresponds to the position of the main air hole 211 corresponding to the overflow box 300.
  • the positive pressure gas source can blow the chips remaining or stuck in the chip placement groove 222 into the overflow box 300 through the positive pressure gas hole 402.
  • the turntable 200 is driven by the second driving device 130 to rotate. Since the main air hole 211 located on the upper part of the turntable 200 is connected to the negative pressure air source through the vacuum ring 400, the chip placement groove 222 can absorb the chip.
  • the chip can be placed inside the chip placement groove 222 by manual or automated mechanical structure. The principle of placement is that, taking the axis of the turntable 200 horizontally and rotating clockwise as an example, the chip is placed on the left side of the turntable 200 in the vertical direction when viewed from the end face of the turntable 200.
  • the first driving device 120 drives The probe base 110 is lowered.
  • the turntable 200 can be rotated in a step-by-step manner, with one moving and one stopping, and chip detection is performed during a pause. After the detection is completed, the chip rotates with the turntable 200 to the vertical right side of the turntable 200, and the chip is removed manually or mechanically at this time.
  • the present invention can be electrically connected to a PLC controller, and the controller is electrically connected to the electrical components of the present invention, including the first and second driving devices, probes, detection circuits, and the like.
  • a light-shielding film is provided on the rotating shaft of the turntable 200, and the light-shielding film is provided with a gap at the position corresponding to the center line of the side of the turntable 200.
  • a through-beam detection device is designed. During the detection, the rotation is temporarily paused.
  • the present invention also provides a chip detection system, as shown in FIG. 7, comprising a cabinet 600 in which a controller, a loading manipulator 910, an unloading manipulator 920, and a chip arranged on one side of the loading manipulator 910 are provided.
  • the tray bracket 700 and the distributing tray 800 provided on the side of the unloading robot 920 are provided.
  • the loading manipulator 910 and the unloading manipulator 920 are used to realize the adsorption and grabbing of the chip.
  • a chip detection device is provided between the loading manipulator 910 and the unloading manipulator 920.
  • the loading manipulator 910 places the chips on the chip tray carrier 700 on the chip detection device, and the unloading manipulator 920 takes the chips from the chip detection device. And place it inside the corresponding feed tray 800.
  • the chip detection device includes: a support plate 100 fixedly connected to the cabinet 600, a detection table erected between the two support plates 100, a probe holder 110 provided on the upper part of the detection table, and a probe holder 110 that is provided on the support plate 100 and can drive the probe A first driving device 120 that moves the seat 110 up and down, and a second driving device 130 that is provided on the support plate 100 and can drive the inspection table to rotate.
  • the controller is electrically connected to the loading manipulator 910, the unloading manipulator 920, and the chip detection device.
  • the controller controls the loading manipulator 910 to place the chip on the chip tray carrier 700 on the rotating detection table; the chip rotates to the top When the probe holder 110 is lowered to detect the chips; the controller controls the unloading manipulator 920 to remove the detected chips from the inspection platform and place them in the corresponding distribution tray 800.
  • the support plate 100 is used to erect a testing platform, and the support plate 100 is fixedly connected to the cabinet 600, wherein a horizontal platform is provided in the middle of the cabinet 600, and the bottom of the support plate 100 is installed on the platform.
  • There are two supporting plates 100 the supporting plates 100 are plate-shaped, and the planes of the two supporting plates 100 are arranged in parallel.
  • the two supporting plates 100 can be arranged on a base to ensure its stability.
  • two supporting plates 100 and the base are integrally formed into a frame structure with a U-shaped cross-sectional shape, which includes a base part and two vertical supporting parts. Even better, in order to maintain stability, a connecting rod is provided between the two supporting plates 100 to ensure stability.
  • the first driving device 120 is arranged at the lower part of the two supporting plates 100, that is, the lower part of the horizontal platform arranged in the middle of the cabinet 600.
  • the horizontal platform rope is provided with a through hole for placing the landing connecting plate 119.
  • the first driving device 120 It is fixedly connected to the lower part of the cabinet 600.
  • the chip detection device is located in the middle of the horizontal platform in the middle of the cabinet 600. As shown in FIG. 8, the loading manipulator 910 and the unloading manipulator 920 are respectively located on both sides of the chip detection device. The structure of the loading robot 910 and the unloading robot 920 are the same.
  • the loading manipulator 910 adopts a vacuum adsorption type manipulator.
  • the loading manipulator 910 includes a horizontal movement module, a vertical movement module arranged on the horizontal movement module, and a rotation module arranged on the lower end of the vertical movement module.
  • the rotation module is provided with an adsorption module 903, and the vertical movement module is provided with a gas
  • One end of the air valve is connected to the adsorption module 903, and the other end of the air valve is connected to the air source.
  • the horizontal movement module includes a horizontal sliding rail 900, a horizontal sliding block 909, and a horizontal driving device.
  • the horizontal sliding block 909 is slidably connected to the horizontal sliding rail 900, and the horizontal driving device drives the horizontal sliding block 909 to move horizontally on the horizontal sliding rail 900.
  • the linear motion driving is a relatively mature technology.
  • a linear motor is used to realize the linear motion driving.
  • the horizontal driving device is arranged inside the horizontal slide rail 900, which is not shown.
  • the up and down movement module includes an up and down sliding arm 901 and an up and down driving device 905, the up and down sliding arm 901 and the horizontal sliding block 909 are slidably connected up and down, and the up and down driving device 905 drives the up and down sliding arm 901 to move up and down.
  • the upper end of the upper and lower sliding arm 901 is slidably connected to the horizontal sliding block 909, and the upper and lower driving device 905 is arranged on the horizontal sliding block 909 to drive the upper and lower sliding arms 901 to slide up and down.
  • the upper and lower driving device 905 is a linear motion driving device.
  • the rotating module includes an operating arm 902, a suction module 903, and a driving device.
  • the driving device and the operating arm are arranged at the lower part of the upper and lower sliding arm 901, the operating arm 902 is rotatably connected with the lower end of the upper and lower sliding arm 901, and the rotation driving device 904 drives the operating arm 902 to rotate. Since the chip is located on a horizontal surface, the chip test disk 220 may be on a vertical plane or an inclined surface, so it is necessary to rotate the operating arm 902 to realize the picking and placement of the chip.
  • the adsorption module 903 is arranged at the end of the operating arm 902, the upper end of the adsorption module 903 is provided with an air inlet, and the lower end is provided with a vacuum suction head.
  • the driving device also includes an air valve to control the on and off of the air source of the air inlet.
  • an air valve to control the on and off of the air source of the air inlet.
  • a two-way switching valve can be set, or a three-way valve can be set, and the positive pressure air source and the negative pressure air source can be respectively connected through the two air valves.
  • a positive pressure air source is used to blow out the adsorbed chip to prevent it from being missed or stuck on the vacuum suction head.
  • air valves are provided on the upper and lower sliding arms 901.
  • the air valves are electric air valves or electromagnetic air valves, and the on and off of the air valves are controlled by the controller. One end of the air valve is connected with the air source, and the other end is connected with the adsorption module.
  • the unloading manipulator 920 takes out the chips on the turntable 200 and places them in the distribution tray 800.
  • the material distribution tray 800 is a box with an open upper part.
  • the material distribution tray 800 is arranged side by side on the right side of the chip detection device. More preferably, the material distribution tray 800 is arranged side by side.
  • the unloading manipulator 920 removes all the material distribution trays 800 from each other.
  • the upper part passes, and when it reaches the corresponding position, the air source is switched to blow the chips into the distribution tray 800.
  • the upper part of the inside of the distribution tray 800 is provided with an inclined sliding plate, and the inclined sliding plate is fixedly connected to the inner wall of the distribution plate 800.
  • the unloading manipulator 920 After the unloading manipulator 920 absorbs the chips, rotate the vacuum suction head to face the inclined slide plate inside the distribution tray 800.
  • the vacuum suction head of the unloading robot 920 moves to the upper part of the distribution tray 800, the vacuum suction of the unloading robot 920
  • the head and the inclined slide plate have a certain included angle, preferably an included angle of 30 degrees to 80 degrees, so as to prevent the chips from directly hitting the distribution tray 800 or the chips inside the distribution tray 800.
  • the chip is first blown down on the inclined sliding plate, and then the inclined sliding plate slides down to achieve buffering.
  • the detected empty chip tray is removed, and a new chip tray is put in, and a feeding device is provided at the lower part of the chip tray holder 700 of the cabinet 600.
  • a notch is provided in the position of the cabinet body 600 where the chip tray bracket 700 is located.
  • the chip tray holder 700 extends to the outside.
  • the chip tray can be pushed into the cabinet 600 from the gap, or taken out of the cabinet 600.
  • One end of the chip tray holder 700 is arranged inside the cabinet 600 and the other end is arranged outside the cabinet 600.
  • the main body of the chip tray holder 700 is frame-shaped, that is, there is a gap in the middle of the chip tray holder 700. Both ends can support the chip tray.
  • the transfer tray 520 is just embedded in the gap of the chip tray holder 700.
  • the transfer tray 520 rises and is in two planes with the chip tray holder 700. Therefore, the transfer tray 520 can be realized by rotating. The positions of the two ends are exchanged to realize the entry of a new chip tray and the exit of an empty chip tray. After the rotation is completed, the transfer tray 520 falls into the gap of the chip tray holder 700, and the chip tray is erected on the chip tray holder 700.
  • the present invention includes a lifting platform 510, a transfer tray 520, a fixed platform 530, a rotation driving device 540, and a lifting driving device 550.
  • the transfer tray 520, the lifting platform 510 and the fixed platform 530 are arranged in order from top to bottom.
  • the middle part of the fixed platform 530 is provided with a cavity through up and down.
  • the fixed platform 530 may be a rectangular frame, or hollow in the middle, and a stable hole is provided on the outer periphery of the hollow part.
  • the axial direction of the stabilizing hole is the up and down direction. Since the lifting platform 510 and the fixed platform 530 need to move up and down in the vertical direction, a stable rod 511 is provided at the position of the lifting platform 510 corresponding to the stable hole. The stable rod 511 is inserted into the stable hole and can move up and down in the stable hole. slide.
  • a limit pillar 531 is provided between the fixed platform 530 and the lifting platform 510.
  • the limiting pillar 531 and the fixed platform 530 are fixedly connected.
  • the limiting pillar 531 is tubular, and the lumen of the limiting pillar 531 overlaps with the stabilizing hole up and down, and the stabilizing rod 511 is inserted into the lumen and the stabilizing hole of the limiting pillar 531, and is in it. slide.
  • the lifting platform 510 is provided with a rotating shaft hole at a position corresponding to the cavity of the fixed platform 530.
  • the middle part of the tray rotating shaft 521 is arranged in the cavity of the fixed platform 530 and does not contact the wall of the cavity.
  • the tray rotating shaft 521 is inserted in the rotating shaft hole and is rotatably connected with the rotating shaft hole through a bearing. After being connected by the bearing, a fixing effect on the tray rotating shaft 521 is formed.
  • the upper end of the tray rotating shaft 521 is fixedly connected with the transfer tray 520 to drive the transfer tray 520 to rotate.
  • the lifting driving device 550 is a linear motion driving device, and the lifting driving device 550 is connected with the lifting platform 510 to drive the lifting platform 510 to lift.
  • the lifting driving device 550 may be an electric push rod.
  • the electric push rod and the fixed platform 530 are fixedly connected.
  • the upper end of the electric push rod is fixedly connected to the lifting platform 510.
  • the electric push rod can control the lifting of the lifting platform 510.
  • the lifting driving device 550 includes a sliding table 552, an air cylinder 551, and a top rod 553.
  • the sliding table 552 is fixedly connected to the fixed platform 530, the sliding table is an installation platform, and the air cylinder 551 is arranged on the sliding table 552.
  • the upper part of the top rod 553 is hingedly connected to the lower part of the lifting platform 510, and the lower part of the top rod 553 is hingedly connected to the push rod of the air cylinder 551.
  • a horizontal displacement groove is provided on the inner side of the fixed platform 530, and the lower end of the top rod 553 is provided with a protrusion and is slidably arranged inside the displacement groove. Under the action of the push rod, the ejector rod 553 slides the lower part of the ejector rod 553 horizontally in the displacement groove.
  • the top rod 553 When the lower end of the top rod 553 is close to the position of the cylinder 551, the top rod 553 is tilted, and after the push rod pushes the top rod 553, the top rod 553 changes from inclination to vertical, and lifts the lifting platform 510.
  • the rotation driving device 540 is a circular motion driving device, and the rotation driving device 540 is connected to the tray rotation shaft 521 for driving the transfer tray 520 to rotate.
  • the rotation driving device 540 includes a motor and a linkage tube.
  • the cross-sectional shape of the lumen of the linkage tube is non-circular.
  • the motor and the fixed platform 530 are fixedly connected.
  • the cross-sectional shape of the lower end of the tray rotation shaft 521 is the same as the cross-sectional shape of the lumen of the linkage tube, and is inserted into the lumen of the linkage tube.
  • the rotating shaft of the motor is connected with the linkage pipe, or the rotating shaft of the motor is connected with the linkage pipe through a reducer.
  • the length of the tray rotating shaft 521 inserted into the linkage tube is greater than the maximum lifting height of the lifting platform 510.
  • the rotation driving device 540 includes a motor 541, a U-shaped linkage frame 542 and a rotating shaft fixing seat 543.
  • a linkage shaft 544 is provided in the middle of the closed end of the U-shaped linkage frame 542, and the linkage shaft 544 is fixedly connected to the U-shaped linkage frame 542.
  • the linkage shaft 544 is connected to the rotating shaft fixing seat 543 through a bearing.
  • the rotating shaft fixing seat 543 is used to keep the linkage shaft 544 and the U-shaped linkage frame 542 stable.
  • the rotating shaft fixing seat 543 is connected to the fixed platform 530 by a bracket such as a rectangular plate. The length direction of the rectangular plate is up and down.
  • the rotating shaft fixing seat 543 is provided at the lower part of the rectangular plate and is rotatably connected with the tray rotating shaft 521. Or the rotating shaft fixing base 543 is installed on other fixed structures, such as the box or cabinet 600 of the detection equipment.
  • the lower part of the tray rotating shaft 521 is inserted into the middle of the open end of the U-shaped linkage frame 542, and both sides of the tray rotating shaft 521 are slidingly connected by linear bearings 545 and two ends of the U-shaped linkage frame 542. At this time, both the relative sliding in the up and down direction can be achieved, and the U-shaped linkage frame 542 can also drive the tray rotation shaft 521 to rotate.
  • the motor 541 and the linkage shaft 544 are linked by a belt or gear.
  • the rotating shaft of the motor 541 is directly connected with the linkage shaft 544 to drive it to rotate.
  • the linkage shaft 544 drives the tray rotation shaft 521 to rotate through the U-shaped linkage frame 542. This structure can greatly improve the stability of the tray rotating shaft 521.
  • the motor 541 can be fixedly connected to the fixed platform 530 through a bracket, or can be fixed on other equipment.
  • positioning protrusions are provided at both ends of the transfer tray 520.
  • a positioning groove can be provided at the corresponding position of the chip tray.
  • the chip testing device is applied to a chip testing equipment.
  • the chip testing equipment is provided with a frame-shaped chip tray holder 700.
  • One end of the chip tray holder 700 is set inside the testing equipment, and the other end is set outside the testing equipment.
  • the lifting platform 510 is located The inside of the chip tray carrier 700.
  • the positions of the transfer tray 520 and the chip tray bracket are the same.
  • One end is located inside the chip detection device, and the other end is located outside the chip detection device.
  • the position of the empty chip tray is exchanged with the new chip tray located outside the chip inspection equipment.
  • the lifting driving device 550 lifts the lifting platform 510, the lifting platform 510 lifts the transfer tray 520, and the transfer tray 520 lifts the tested chip trays inside the testing equipment and the untested chip trays outside the testing equipment and separates them from the chip trays Bracket 700;
  • the rotation driving device 540 drives the transfer tray 520 to rotate 180 degrees, so that the internal and external chip trays of the detection equipment can exchange positions;
  • the lifting driving device 550 drops the lifting platform 510, and the lifting platform 510 drops the transfer tray 520.
  • the transfer tray 520 places the untested chip tray outside the testing equipment on the end of the chip tray bracket 700 located inside the testing equipment to complete the replacement of the chip tray. .
  • the present invention can greatly improve the efficiency and optimize the work process.
  • the staff only need to replace the empty chip tray outside the chip inspection equipment with a new one without having to Waiting at the equipment, so it has the beneficial effect of improving work efficiency, and one person can take care of multiple equipment.
  • the turntable 200 is a regular six-sided cylinder, each side of the turntable 200 is provided with a chip test disk 220, and the lower part of the side of the turntable 200 is provided with a main air hole 211. There are six main air holes 211 in total.
  • the vacuum ring 400 is provided with three negative pressure vents 401 and one positive pressure vent 402. When the chip test disk 220 rotates to the upper horizontal position, the upper three main vents 211 and the negative pressure vent 401 are opposite, and the lower one is positive pressure vent 402 is opposite to the lowermost main air hole 211.
  • the electrical equipment and the controller are electrically connected.
  • the controller adopts a PLC module.
  • the manipulator and chip detection device need to apply the air valve of the air source to the electromagnetic air valve.
  • the electromagnetic air valve is connected to the controller and connected to the air source at the same time. , The controller controls the on and off of the air source.
  • the axis of the turntable 200 is horizontal, and the rotating arm is parallel to the axis of the turntable 200.
  • the main air hole 211 will switch to another negative pressure air hole after rotating a certain angle. 401 is connected. Therefore, the negative pressure air hole 401 corresponding to the detected chip placement slot 222 can be individually shut off to facilitate the removal of the chip.
  • the main air hole 211 is rotated to communicate with the positive pressure air hole 402
  • the gas is blown outward from the main air hole 211, and the chips stuck in the chip placement groove 222 are blown off.
  • the process of rotating the turntable 200 realizes the process of switching the air source. After the chip detection system is started, turn on the negative pressure air source and the positive pressure air source on the vacuum ring 400;
  • Step A Control the loading robot 910 to move to the upper part of the chip tray, and adjust the vacuum suction head of the loading robot 910 to face down so that the vacuum suction head of the loading robot 910 corresponds to a row of chips on the chip tray;
  • the loading manipulator 910 is connected to the negative pressure air source, and the loading manipulator 910 moves downwards until the vacuum suction head of the loading manipulator 910 absorbs the chips on the chip tray;
  • the loading manipulator 910 moves downwards until the vacuum suction head of the loading manipulator 910 is close to the chip, and the negative pressure air source is connected to adsorb the chip to the vacuum suction head of the loading manipulator 910. At this time, the impact on other chips can be reduced, and other chips can be prevented from disturbing to avoid missing chips;
  • control the loading manipulator 910 After adsorbing the chips, control the loading manipulator 910 to move upward, and rotate the operating arm 902 to make the vacuum suction head of the loading manipulator 910 face the chip placement slot 222 on the chip test tray 220 on the turntable 200;
  • Step B When the turntable 200 rotates until one of the side surfaces is horizontal and is located on the upper part, the first driving device 120 is controlled to drive the probe holder 110 to descend, so that the probe on the probe holder 110 and the chip in the chip placement groove 222 abut Connect
  • test result is recorded, and the first driving device 120 is controlled to drive the probe holder 110 to rise; the recorded test result is sent to the controller;
  • Step C Turn on the negative pressure air source of the unloading robot 920, and adjust the vacuum suction head of the unloading robot 920 to face the chip placement slot 222 on the right side of the turntable 200;
  • control the unloading manipulator 920 to move to a suitable height from the vacuum suction head to the splitting tray, which is the vertical distance between the two, and then control the unloading robot 920 to move from the near-to-far splitting tray ,
  • the unloading manipulator 920 moves to the position of the corresponding feeding tray, switch the air source to make the chips fall into the feeding tray;
  • Step D When the side of the turntable 200 where the chips that are not adsorbed or clamped in the chip placement groove 222 are located are rotated to the lower horizontal plane, the positive pressure gas source passed through the main air hole 211 in the lower part will remove the remaining chips. Discharge into the overflow box 300;
  • Step E After all the chips on the chip tray are tested,
  • the lifting driving device 550 lifts the lifting platform 510, and the lifting platform 510 lifts the transfer tray 520.
  • the transfer tray 520 lifts and removes the detected chip trays inside the cabinet 600 and the untested chip trays outside the cabinet 600.
  • the rotation driving device 540 drives the transfer tray 520 to rotate 180 degrees, so that the internal and external chip trays of the cabinet 600 switch positions;
  • the lifting driving device 550 drops the lifting platform 510, the lifting platform 510 drops the transfer tray 520, and the transfer tray 520 places the chip trays that have not been detected outside the cabinet 600 on the chip tray holder 700.
  • the loading manipulator 910, the unloading manipulator 920 and the turntable 200 operate at the same time, which greatly improves the detection efficiency of the chip.
  • the upper part of the distribution tray 800 is provided with a tilting slide plate.
  • the negative pressure air source of the unloading robot 920 is disconnected and the positive pressure air source is switched, and the chip falls on the inclined sliding plate and then slides into the distribution tray 800.
  • the turntable 200 is a regular six-sided cylinder and is provided with six main air holes 211.
  • the vacuum ring 400 is provided with three negative pressure vents 401 and one positive pressure vent 402; when one of the chip test disks 220 is located on the upper horizontal plane: the three negative pressure vents 401 and the upper three main vents 211 correspond to and communicate with each other, and the positive pressure
  • the position of the air hole 402 and the lower main air hole 211 correspond and communicate; correspondingly, the communicating groove 213 is provided at the orifice of the main air hole 211, the communicating groove 213 is arc-shaped, and the length of the communicating groove 213 is less than or equal to two.
  • the distance between the two main air holes 211; the positive pressure air hole 402 is used to connect with a positive pressure air source, and communicate with an electromagnetic air valve and a positive pressure air source to achieve opening and closing control.
  • the air source is connected through the communication groove 213, and the connection between the main air hole 211 and the negative pressure air hole 401 and the positive pressure air hole 402 of different vacuum rings is switched during the rotation; in the step C :
  • the unloading robot 920 When the unloading robot 920 is controlled to move to the turntable 200 until the vacuum suction head of the unloading robot 920 moves near the detected chip, the air source of the negative pressure air hole 401 corresponding to the detected chip is turned off, and the unloading robot 920 is activated. Negative pressure air source to adsorb the chip;

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Abstract

一种芯片检测装置、芯片检测系统及控制方法，芯片检测装置包括支撑板(100)、设置在支撑板(100)上部的探针座(110)、检测台以及与探针座(110)连接的第一驱动装置(120)。芯片检测系统包括柜体(600)，柜体(600)的内部设有芯片检测装置、控制器、装料机械手(910)、卸料机械手(920)、设于装料机械手(910)一侧的芯片盘托架(700)和设于卸料机械手(920)一侧的分料盘(800)。芯片检测装置、芯片检测系统及控制方法在转盘(200)转动的过程中，芯片的填装、芯片的检测以及芯片的分类都通过自动化控制程序控制自动完成，大大提高了芯片检测的效率。

Description

一种芯片检测装置、芯片检测系统及控制方法
相关申请
本申请要求专利申请号为201911284507.3，申请日为2019年12月13日，发明名称为“一种芯片检测系统及方法”的中国发明专利、以及专利申请号为201911284104.9，申请日为2019年12月13日，发明名称为“一种芯片检测装置”的中国发明专利的优先权。
技术领域
本发明涉及芯片检测设备，具体为一种芯片检测装置、芯片检测系统及控制方法。
背景技术
芯片一般是指集成电路的载体，也是集成电路经过设计、制造、封装、测试后的结果，通常是一个可以立即使用的独立的整体。电子芯片是一种微型电子器件或部件，采用一定的工艺，把一个电路中所需的晶体管、电阻、电容和电感等元件及布线互连一起，制作在一小块或几小块半导体晶片或介质基片上，然后封装在一个管壳内，成为具有所需电路功能的微型结构；其中所有元件在结构上已组成一个整体，使电子元件向着微小型化、低功耗、智能化和高可靠性方面迈进了一大步。电子芯片设备在生产完电子芯片之后，需要对电子芯片进行综合测试及各种电流电压的测试，目前的电子芯片的检测方式是检测工人手持着从电气检测箱上引出的检测探针，通过观察着电气检测箱上的指示灯的状态和显示屏所显示的参数大小来判断着该电子芯片是否合格，然而这种检测方式不仅极大的增加了检测人员的工作强度，同时也会导致检测过程中检测探针发生晃动引起误差，严重影响检测精度，实用性差。因此设计一种快速、高效检测芯片的一种自动化设备成为一种迫切的要求。
发明内容
本发明要解决的技术问题是：提供了快速、高效检测芯片的一种芯片检测装置、芯片检测系统及控制方法。
本发明要解决的技术问题的技术方案是：
本发明提供一种芯片检测装置，其包括：支撑板、架设在两支撑板之间的检测台、设于支撑板上并能做直线运动的第一驱动装置、以及设于检测台上部且与第一驱动装置连接的探针座；所述检测台包括：转盘：为柱体结构，转盘的两端与支撑板转动连接；真空环：真空环一端的端面与支撑板固定连接，真空环另一端的端面与转盘的端面密封转动连接；第二驱动装置：设于支撑板上并能驱动转盘转动；芯片测试盘：至少设有三组且均匀分布在转盘的柱面上，每组芯片测试盘在转盘的柱面的长度方向上排列；所述芯片测试盘上设有芯片放置 槽，所有芯片测试盘上的芯片放置槽的底部电性连通，所述芯片放置槽的底部中心设有吸附通孔；所述转盘设有：主气孔：设于转盘的轴向方向上且与芯片测试盘在径向方向上对应设置；所述主气孔的靠近真空环的一端敞开且另一端封闭；支气孔：连通主气孔与芯片测试盘的吸附通孔；所述真空环设有负压气孔，所述负压气孔的一个孔口位于与转盘相对接的端面上且与主气孔位于同一圆周上，所述负压气孔的另一个孔口用以连接负压气源；所述负压气孔的孔口处或主气孔的孔口处设有连通槽，连通槽用以在负压气孔与主气孔错开时实现两者的连通。
本发明还提供一种芯片检测系统，其包括柜体，柜体内设有控制器、装料机械手、卸料机械手、设于所述装料机械手一侧的芯片盘托架、以及设于卸料机械手一侧的分料盘；所述装料机械手和卸料机械手之间设有芯片检测装置；所述芯片检测装置包括：与柜体固定连接的支撑板、架设在两支撑板之间的检测台、设于所述检测台上部的探针座、设于支撑板上并能驱动探针座上下运动的第一驱动装置、以及设于支撑板上并能驱动检测台转动的第二驱动装置；所述控制器和装料机械手、卸料机械手、芯片检测装置电气连接，所述控制器控制装料机械手将芯片盘托架上的芯片放置在转动的检测台上；当芯片转动至上部时探针座下降对芯片进行检测；所述控制器控制卸料机械手将检测台上检测完的芯片取下并放置在对应的分料盘内部。
本发明还提供一种芯片检测系统的控制方法，其包括以下步骤：芯片检测系统启动后，接通真空环上负压气孔的负压气源和正压气孔的正压气源；转动的转盘上的主气孔通过真空环获取气源；步骤A、控制装料机械手移动至芯片盘的上部，调整装料机械手的真空吸头朝下，使装料机械手的真空吸头与芯片盘上的一列芯片对应；装料机械手接通负压气源，装料机械手向下移动，直至装料机械手的真空吸头吸附芯片盘上的芯片；或者，装料机械手向下移动，直至装料机械手的真空吸头与芯片靠近时接通负压气源将芯片吸附到装料机械手的真空吸头上；控制装料机械手上移，并转动操作臂使装料机械手的真空吸头与转盘上的芯片测试盘上的芯片放置槽相对；控制装料机械手向转盘移动，直至将芯片放置到芯片放置槽内部，断开装料机械手的负压气源；重复步骤A，直至将转盘左侧的芯片放置槽填满；步骤B、所述转盘转动至其中一侧面为水平面且位于上部时，控制第一驱动装置驱动探针座下降，使探针座上的探针与芯片放置槽中的芯片抵接；启动测试程序进行芯片测试；芯片测试完成后记录测试结果，控制第一驱动装置驱动探针座上升；步骤C、接通卸料机械手的负压气源，调整卸料机械手的真空吸头与转盘右侧的芯片放置槽相对；控制卸料机械手向转盘移动，直至卸料机械手的真空吸头吸附转盘上的检测完成的芯片；所述卸料机械手的真空吸头的真空度大于转盘上的真空度；读取检测结果，根据检测结果控制卸料机械手移动至相应的分料盘的上部；控制卸料机械手向下移动，当卸料机械手的真空吸头位于分料盘上部之后，断开卸料机械手的负压气源，芯片落入分料盘内部；步骤D、未被吸附或者卡接在芯片放置槽中的芯片所在的转盘的侧面在转动到位于下部的水平面时，由下部的主气孔中通入的正压气源将残 留的芯片排入溢料盒中；步骤E、当芯片盘上的芯片全部检测完成之后，升降驱动装置将升降平台抬起，升降平台将转运托盘抬起，转运托盘将柜体内部已检测完的芯片盘和位于柜体外部未检测的芯片盘托起并脱离芯片盘托架；转动驱动装置驱动转运托盘转动180度，使柜体内部和外部芯片盘转换位置；升降驱动装置将升降平台落下，升降平台将转运托盘落下，转运托盘将柜体外部未检测完的芯片盘放置在芯片盘托架上。
本发明的有益效果为：
1、本发明通过在转盘转动过程中完成芯片的放置、检测和取下，大大提高了工作效率；
2、本发明的芯片检测装置通过设置空腔来容纳探针，检测时向空腔内通入惰性气体对芯片进行保护，防止检测过程中探针与芯片接触产生火花，进而提高了芯片的质量；
3、本发明的芯片检测系统通过设置控制器与装料机械手、卸料机械手和芯片检测装置电气连接，在转盘转动的过程中，芯片的填装、芯片的检测以及芯片的分类都通过自动化控制程序控制自动完成，具有比现有人工操作以及流水线操作更加快速和高效的有益效果；
4、本发明的芯片检测系统通过设置溢料盒，可以防止芯片卡在芯片放置槽内部，提高了芯片放置槽的利用率，降低芯片的损坏和浪费；
5、本发明的芯片检测系统通过设置转动进料平台，可以实现自动进料，工作人员定时更换外部的空置的芯片盘即可，降低了工人的劳动成本和体力消耗。
附图说明
以下附图仅旨在于对本发明做示意性说明和解释，并不限定本发明的范围。其中：
图1是本发明一种实施例的芯片检测装置的立体示意图；
图2是本发明一种实施例的转盘的主视图；
图3是本发明一种实施例的转盘的左视图；
图4是本发明一种实施例的转盘的剖视图；
图5是图1中A区域的局部放大图；
图6是本发明一种实施例的真空环的示意图；
图7是本发明一种实施例的芯片检测系统的示意图；
图8是本发明一种实施例的真空式机械手的示意图；
图9是本发明一种实施例的转运托盘平台的示意图；
图10是本发明一种实施例的探针座的主视图；
图11是本发明一种实施例的探针座的剖视图；
图12是本发明中真空环与转盘连接部位的放大图。
具体实施方式
为使本发明的技术方案和有益效果更加清楚，下面对本发明的实施方式做进一步的详细 解释。
实施方式一
本发明提供一种芯片检测装置，包括支撑板100、设置在支撑板100上部的探针座110、驱动探针座110上下运动的第一驱动装置120、以及架设在支撑板100上的检测台。
支撑板100用以架设检测台。支撑板100设有两个，支撑板100为板状，两个支撑板100的平面平行设置。两个支撑板100可以设置在一个底座上用以保证其稳定。如图1所示，两个支撑板100与底座一体成型为截面形状为设有U形的一种框架结构，其包括一个底座部分和两个竖直的支撑部分。更好的，为了保持稳定，在两个支撑板100之间设有连杆以保证稳定。
检测台用以放置待检测的芯片，在芯片转动至最上部时，探针降落并与芯片结合，然后进行检测。为了控制探针的上下移动，在支撑板100的外侧面设有第一驱动装置120。第一驱动装置120具有直线运动功能，如电动推杆、电动液压推杆、直线电机等，也可以为气缸或者液压缸推杆。本实施例中，为了保持探针座110的水平，两侧的支撑板100上的升降距离一致，第一驱动装置120设置于两个支撑板100的下部，并与两个支撑板100固定连接，以保持稳定。具体为，第一驱动装置120为电动丝杠和滑块组成的直线驱动装置。在支撑板的外侧面设有滑动轨道101和起降连接板119。滑动轨道101的长度方向为竖直方向，起降连接板119的中部与滑动轨道101滑动连接，起降连接板119的上部与探针座110固定连接。探针座110架设在两个起降连接板119之间。两个起降连接板119的下端通过一个横梁140连接，横梁140的中部与第一驱动装置120的滑块固定连接。第一驱动装置120启动之后电动丝杠转动驱动滑块上下移动，进而通过起降连接板119带动探针座110升降。
探针座110用以安装探针，探针包括测试针头和公共端针头。检测台位于探针座110的下部，两者的长度方向平行且上下重合。探针座110下降后，探针与芯片测试盘220上的芯片接触，此时测试针头与芯片的上部连接，公共端针头与芯片测试盘220连接，芯片测试盘220与芯片的下部连接，进而可以实现通电检测。
更好的，探针座110上还设有测试控制电路。同时测试控制电路可以设置在本体之外，并通过导线连接。但是检测时如果信号传输距离较远检测结果就会存在较大的误差，因此测试控制电路设置在探针座110上部，就近检测，并将检测结果存储或者通过通信线传输到其他设备。
更好的，由于在芯片检测的过程中，探针与芯片接触的瞬间会产生火花，进而会影响芯片的质量，为了防止火花的产生，采用惰性气体保护的方式实现。因此将探针座110的探针设于与正压惰性气源连通的空腔115内部。空腔115在探针针头所在的一面敞开(即敞口)。由于空腔115和正压惰性气源连接，空腔115内部的氧气被驱赶进而氧气浓度降低，防止了芯片触电时火花的产生，保证了芯片的质量。
如图10、图11所示，空腔115由探针座110和设于探针座110外周的围挡113围成。为 了实现惰性气体的导通，围挡113或者探针座110上设有主保护气孔111和分散气孔112，主保护气孔111的长度方向与探针排列的长度方向平行。分散气孔112连通主保护气孔111和空腔115，主保护气孔111和正压惰性气源连通。围挡113为长条片状，并与探针座垂直设置，围挡113和探针座通过螺接或者卡接的方式连接，围挡113设于探针的四周，并且在外周方向上闭合，围挡113的内侧形成一个下部敞开的腔体115。如图7所示，本实施例中主保护气孔111设于探针座110上部，并且围挡113上设有与主保护气孔111连通的进气接口。为了实现惰性气体的分散同时保证探针接触部位的惰性气体的含量，分散气孔112下部向探针的端部倾斜。通过设置在探针座110或者围挡113上的进气接口将主保护气孔111和外部的正压惰性气体连通。更好的，正压惰性气体采用氮气。
为了实现空腔115密封的同时保证探针与芯片的良好接触，围挡113下端距离探针座底面的距离略小于探针底端距离探针座110底面的距离。例如，围挡113下端距离探针座底面的距离比探针底端距离探针座110底面的距离小3mm～5mm。
或者围挡113的上部与探针座110上下滑动连接，当第一驱动装置120驱动探针座110朝芯片测试盘220下降时，围挡113先与芯片测试盘220抵接使空腔115封闭度增加且惰性气体浓度更高，探针座110继续下降与芯片接触进行检测。
更好的，为了保证惰性气体的浓度，至少有两个分散气孔112的长度方向朝探针的针头处倾斜，此时气体吹向针头处，针头与芯片接触时可处于惰性气体中。
检测台用以实现连续地进行芯片检测，检测台主要包括转盘200、真空环400和第二驱动装置130。
转盘200为柱体结构，在转盘200的柱面上设有至少三组均匀分布的芯片测试盘220。每组芯片测试盘220设有多个芯片测试盘220，芯片测试盘220的长度方向与转盘200的轴向方向相同，并且每一组的芯片测试盘220在转盘200的柱面上沿长度方向排列成一行。
芯片测试盘220为矩形，且其长度方向与转盘200的轴向方向重合。为了增加转盘200的结构强度，转盘200一般采用金属结构，为了防止芯片测试盘220导电，芯片测试盘220设计为多层结构。芯片测试盘220的下部由绝缘材料制成，用以与转盘200接触，芯片测试盘220的中部或者上部嵌设有金属材料用以实现导电，芯片测试盘220上设有用以放置芯片的芯片放置槽222，作为芯片测试盘220的公共端，芯片放置槽222开设在金属材料上。芯片测试盘220中的芯片放置槽222需要给芯片提供电源，因此所有的芯片放置槽222为导体且所有的芯片放置槽222电性连接作为芯片检测的公共端。探针中有一个探针单独与芯片放置槽接触实现公共端的电气连接。芯片测试盘220的长度可以略小于转盘200的长度，即转盘200的侧面的一个弧度范围内设有一个芯片测试盘220即可，例如芯片测试盘220的长度比转盘200的长度小3mm～5mm。为了保持芯片的稳定吸附，芯片放置槽222的中部设有吸附通孔221，吸附通孔221与转盘200上的支气孔212相通，如图2所示。更好的，为了减少气源浪费，节约能源，吸附通孔221与支气孔212密封连接。
现有技术中，芯片的检测是单独检测，即测试探针单独带电进行测试，此时循环检测的耗时较长。因此本发明为了提高检测速度，将芯片测试盘220设置成多组、每组多个的形式，即在柱面的一个与轴向方向平行的长度方向上设有多个排列成一行的芯片测试盘220，每一个芯片测试盘220中芯片同时检测，因此可以大大提高检测效率。即芯片测试盘220设有至少三组，每一组设有多个，并且每一组的多个芯片测试盘220在转盘200的长度方向上依次排列成一行。
转盘200的长度方向的两端与支撑板100转动连接。如图1所示，转盘200的两端延伸有固定轴或者与固定轴连接，在支撑板100上设有轴承固定座用以安装固定轴。如图12所示，转盘200的其中一端的固定轴穿过真空环400与支撑板100转动连接，转盘200的另一端的固定轴和第二驱动装置130的转动输出机构连接。本实施中第二驱动装置130为电机，转盘200的另一端的固定轴和电机的转轴固定连接。
转盘200可以设置为圆柱体，芯片测试盘220在转盘200的圆柱面上设置。芯片测试盘220与转盘200接触的一面可以设计为与转盘200曲率相同的弧面，以便于两者贴合，转盘200和芯片测试盘220可以通过螺丝实现连接。
为了便于芯片测试盘220的安装，转盘200可以设置为正多面柱体，正多面柱体的面数为至少三面。更好的，转盘200设计为正六面柱体和正八面柱体。芯片测试盘220安装在正多面柱体的每一侧面上。如图3所示，本实施例中转盘200采用正六面柱体，也是最优的设计方案。
在转盘200转动的过程中，以及在放置芯片和取下芯片、检测芯片的过程中，芯片可能会脱落，为了收集脱落的芯片，在转盘200的下部设有溢料盒300。溢料盒300为长条形的矩形盒，其两端分别和两支撑板100固定连接或者可拆卸式连接。溢料盒300的开口朝上，用以收集脱落的芯片，如图1所示，溢料盒300位于转盘200的下方，溢料盒300的开口朝向转盘200。
更好的，转盘200的每一侧面上或者侧面的一个弧度范围内设有多行芯片测试盘220，以此来提高效率。进一步的，芯片测试盘220上设有多行芯片放置槽222，优选的设有两行或者三行芯片放置槽222。相应的，如图2所示，转盘200上设有与芯片放置槽222同等数量的支气孔212来连通芯片放置槽222的吸附通孔221。
为了实现气源的导通，以便通过真空吸附的方式实现芯片的固定，转盘200设有长度方向与转盘200的轴向方向平行的主气孔211，如图4所示，主气孔211的数量与芯片测试盘220的组数相同。主气孔211与芯片测试盘220在径向方向上一一对应。转盘200的主气孔211靠近真空环400的端面上的孔口敞开，主气孔211的另一孔口封闭。芯片测试盘220与主气孔211位于转盘200的同一径向方向上。
如图4、图5所示，为了实现给每一个芯片放置槽222供气，转盘200还设有支气孔212。支气孔212连通主气孔211与芯片测试盘220的吸附通孔221。或者，每一个主气孔211与 两组相邻的芯片测试盘220对应，每个主气孔211上设有两组支气孔212。
本发明通过转动转盘200的方式实现连续的检测，因此需要设置第二驱动装置130来驱动转盘200转动。第二驱动装置130为转动驱动装置，常见的有步进电机、伺服电机、磁阻电机等，也可以应用气动转动驱动装置。第二驱动装置130设于另一支撑板100上，第二驱动装置130的转轴与转盘200直接连接或者通过减速器、联轴器等连接以驱动转盘200转动。为了增加稳定性，第二驱动装置130的转轴通过轴承与支撑板100转动连接。
第二驱动装置130的功能是驱动转盘200转动，真空环400用以实现气源的接通。真空环400为环状，其中部用以穿过用以固定转盘200的固定轴，该固定轴与支撑板100通过轴承转动连接。真空环400的一端面与支撑板100固定连接，真空环400的另一端的端面与转盘200的端面密封转动连接，真空环400和转盘200的相对接的面为镜面，并且对接面上涂有润滑脂。真空环400上设有丝孔，真空环400通过丝孔安装在支撑板100的上部。真空环400作为一个阀门控制主气孔211内部的气源。
如图6所示，真空环400设有负压气孔401，用以给主气孔211通气。负压气孔401的一个孔口位于与转盘200相对接的端面上且与主气孔211位于同一圆周上，负压气孔401的另一个孔口用以连接负压气源。为了便于控制，负压气孔401通过电控气阀与负压气源连接。
由于转盘200在工作时是转动的，因此主气孔211和负压气孔401有时会相对，有时会错开，为了保证连续通气，在负压气孔401的孔口处或主气孔211的孔口处设有连通槽213，用以在负压气孔401与主气孔211错开时实现两者的连通。
当连通槽213设置在转盘200上时，主气孔211的孔口或者主气孔211的截面形状可以与连通槽213的形状相同。
真空环的实例一
真空环400可设有一个负压气孔，此时主气孔211位置的连通槽213为圆环形。连通槽213的宽度大于或者等于主气孔211的直径。
此时真空环还可以设置一个正压气孔402。负压气孔401与正压气孔402上下对称设置。正压气孔402用以与正压气源连接。此时连通槽213设于真空环400上。负压气孔401对应的连通槽213的弧度大于180度，正压气孔402对应的连通槽的弧度小于D，D＝360/n，其中n为主气孔211的个数。因此不管设有多少个主气孔211，在最下的主气孔211和正压气源连通，用以将卡接在芯片放置槽222内部的芯片吹落。
真空环的实例二
真空环400设有三个负压气孔401，转盘200转至其中一个芯片测试盘220位于上部水平时，此时，其中一个主气孔211位于上部最高点，三个负压气孔401和上部的主气孔211以及与上部主气孔211相邻的两个主气孔211的位置对应，即负压气孔401与上部的三个主气孔211连通。负压气孔401与负压气源连接，或者通过气阀与负压气源连通。此时主气孔211位置的连通槽213为弧形，两个连通槽213之间的间距大于负压气孔401的半径且小于 负压气孔401的直径。
此时真空环400还可设有一个正压气孔402，在转盘200转至其中一个芯片测试盘220位于上部水平时，即其中一个芯片测试盘220朝向探针座110时，三个负压气孔401和上部的主气孔211以及与上部主气孔211相邻的两个主气孔211的位置对应，同时正压气孔402和与溢料盒300对应的主气孔211的位置对应。正压气源可以通过正压气孔402将遗留或者卡接在芯片放置槽222内部的芯片吹入溢料盒300内部。
在运行过程中，转盘200在第二驱动装置130的驱动下进行转动。由于位于转盘200上部的主气孔211通过真空环400和负压气源连接，因此芯片放置槽222内部可以吸附芯片。可以通过人工或者自动化机械结构将芯片放置到芯片放置槽222内部。其放置的原则为，以转盘200轴线水平放置且顺时针转动为例，将芯片放置在从转盘200端面看转盘200竖直方向的左侧，芯片转动至最上部时，第一驱动装置120驱动探针座110下降，由于探针座110上的探针和芯片放置槽222的位置对应，因此探针会和芯片接触，实现导电，进而实现测试。转盘200可以采用步进式转动，一走一停，在停顿的时候进行芯片检测。检测完成后，芯片随转盘200转动到转盘200竖直方向的右侧，此时通过手动或者机械的方式将芯片取下。更好的，为了实现自动控制，本发明可以与PLC控制器电气连接，控制器和本发明中的电气部件电气连接，包括第一、二驱动装置、探针、检测电路等。
更好的，为了增加稳定性，在转盘200的转轴上设置一个遮光片，遮光片对应转盘200侧面中心线的位置设有缝隙，同时设计对射检测装置，通过对射检测装置检测位置，在检测的时候短暂停转。
为了提高效率，现在多采用机械臂的形式进行芯片的装料和卸料的操作。在实际的运行过程中，由于各种原因，芯片可能卡接在芯片放置槽222内部，为了排除卡接的芯片，在转盘200侧面转动到下部的平面时，由于正压气孔402与下部的主气孔211连通，气体由主气孔211内部向外吹，因此可以将芯片吹入溢料盒300的内部。
实施方式二
本发明还提供一种芯片检测系统，如图7所示，包括柜体600，柜体600内设有控制器、装料机械手910、卸料机械手920、设于装料机械手910一侧的芯片盘托架700、以及设于卸料机械手920一侧的分料盘800。装料机械手910和卸料机械手920用以实现芯片的吸附抓取。在装料机械手910和卸料机械手920之间设有芯片检测装置，装料机械手910将芯片盘托架700上的芯片放置到芯片检测装置上，卸料机械手920将芯片检测装置上的芯片取下并放置到相应的分料盘800内部。
芯片检测装置包括：与柜体600固定连接的支撑板100、架设在两支撑板100之间的检测台、设于检测台上部的探针座110、设于支撑板100上并能驱动探针座110上下运动的第一驱动装置120、以及设于支撑板100上并能驱动检测台转动的第二驱动装置130。为了实现上述操作，控制器和装料机械手910、卸料机械手920、芯片检测装置电气连接，控制器控制 装料机械手910将芯片盘托架700上的芯片放置在转动的检测台上；芯片转动至上部时探针座110下降对芯片进行检测；控制器控制卸料机械手920将检测台上检测完的芯片取下并放置在对应的分料盘800内部。
支撑板100用以架设检测台，支撑板100与柜体600固定连接，其中，柜体600的中部设有水平的平台，支撑板100的底部安装在平台上。支撑板100设有两个，支撑板100为板状，两个支撑板100的平面平行设置。两个支撑板100可以设置在一个底座上用以保证其稳定。如图1所示，两个支撑板100与底座一体成型为截面形状为U形的一种框架结构，其包括一个底座部分和两个竖直的支撑部分。更好的，为了保持稳定，在两个支撑板100之间设有连杆以保证稳定。
第一驱动装置120设置于两个支撑板100的下部，即设于柜体600中部的水平平台的下部，在水平平台绳上开设有通孔以放置起降连接板119，第一驱动装置120与柜体600下部固定连接。
本实施方式中芯片检测装置的其他结构、工作原理和有益效果与实施方式一相同，在此不再赘述。
芯片检测装置位于柜体600中部水平平台的中部，如图8所示，装料机械手910和卸料机械手920分别位于芯片检测装置的两侧。装料机械手910和卸料机械手920的结构相同。装料机械手910采用真空式吸附型的机械手。
装料机械手910包括水平移动模块、设于水平移动模块上的上下移动模块、以及设于上下移动模块下端的转动模块，转动模块上设有吸附模组903，所述上下移动模块上设有气阀，气阀的一端与吸附模组903连通，气阀的另一端与气源连接。
如图8所示，水平移动模块包括水平滑轨900、水平滑动块909以及水平驱动装置。水平滑动块909和水平滑轨900滑动连接，水平驱动装置驱动水平滑动块909在水平滑轨900上水平移动。直线运动的驱动属于较为成熟的技术，本实施例中采用直线电机实现直线运动的驱动，在图中水平驱动装置设置在水平滑轨900内部，没有示出。
上下移动模块包括上下滑动臂901和上下驱动装置905，上下滑动臂901和水平滑动块909上下滑动连接，上下驱动装置905驱动上下滑动臂901上下移动。上下滑动臂901的上端和水平滑动块909滑动连接，上下驱动装置905设置在水平滑动块909上，用以驱动上下滑动臂901上下滑动，例如上下驱动装置905为直线运动驱动装置。
转动模块包括操作臂902、吸附模组903以及驱动装置。其中驱动装置和操作臂设置在上下滑动臂901的下部，操作臂902与上下滑动臂901下端转动连接，旋转驱动装置904驱动操作臂902转动。由于芯片位于水平面上，芯片测试盘220可能处于竖直平面或者斜面，因此需要转动操作臂902实现芯片的吸取和放置。吸附模组903设置在操作臂902的端部，吸附模组903上端设有进气孔，下端设有真空吸头。驱动装置还包括气阀，用以控制进气孔气源的通断。更好的，为了实现吸气和喷气，可以设置双向的切换阀，或者设置三通，通过 两个气阀分别连接正压气源和负压气源。此时，在完成芯片吸附的工作后，采用正压气源将吸附的芯片吹出，以防止其遗漏或者卡在真空吸头上。为了实现气源的控制，在上下滑动臂901上设置了气阀，气阀为电动气阀或电磁气阀，通过控制器控制气阀的通断。气阀一端与气源连接，另一端与吸附模组连通。
卸料机械手920将转盘200上的芯片取出后放置在分料盘800内部。分料盘800为的上部敞开的盒体，分料盘800并列设置在芯片检测装置的右侧，更好的，分料盘800为多个并排设置，卸料机械手920从所有分料盘800上部经过，到达相应的位置时切换气源将芯片吹入分料盘800。更好的，为了实现缓冲，分料盘800内部的上部设有倾斜滑板，倾斜滑板和分料盘800的内壁固定连接。卸料机械手920吸附芯片之后，转动真空吸头使其朝向分料盘800内部的倾斜滑板，当卸料机械手920的真空吸头移动至分料盘800上部的时候，卸料机械手920的真空吸头与倾斜滑板具有一定的夹角，最好的为30度～80度的夹角，以免芯片直接撞击分料盘800或者分料盘800内部的芯片。芯片首先吹落在倾斜滑板上，再由倾斜滑板滑下实现缓冲。
为了便于芯片盘的更换，将检测完的空芯片盘移出，将新的芯片盘放入，在柜体600的芯片盘托架700的下部设置了进料装置。为了便于更换新的芯片盘，在柜体600位于芯片盘托架700的位置设有缺口。芯片盘托架700延伸至外部。可将芯片盘从缺口处推入柜体600内部，或者从柜体600内部取出。芯片盘托架700的一端设于柜体600内部且另一端设于柜体600外部，芯片盘托架700的主体形状为框形，即芯片盘托架700中部设有缺口。其两端可以支撑芯片盘。
转运托盘520正好嵌设在芯片盘托架700的缺口内部，在需要进行芯片盘更换的时候，转运托盘520升起，与芯片盘托架700处于两个平面，因此可以通过转动实现转运托盘520两端的位置的调换，进而实现新的芯片盘的进入，空的芯片盘的退出。转动完成之后，转运托盘520落入芯片盘托架700的缺口中，芯片盘架设在芯片盘托架700上。
如图9所示，为了实现上述升降和转动功能，本发明包括升降平台510、转运托盘520、固定平台530、转动驱动装置540和升降驱动装置550。
转运托盘520、升降平台510和固定平台530由上至下依次设置。固定平台530中部设有上下贯通的空腔。固定平台530可为矩形框，或者其中部镂空，镂空部分的外周设有稳固孔。稳固孔的轴向方向为上下方向。由于升降平台510要与固定平台530之间产生上下方向的位移，因此在升降平台510对应稳固孔的位置设置了稳固杆511，稳固杆511插接在稳固孔中，并且可以在稳固孔中上下滑动。为了保证升降平台510上下滑动顺利，减少升降驱动装置550的压力，在固定平台530与升降平台510之间设置了限位支柱531。本实施例中限位支柱531和固定平台530固定连接。更好的，为了节约成本，限位支柱531为管状，并且限位支柱531的管腔与稳固孔上下重合，稳固杆511插接在限位支柱531的管腔和稳固孔中，并在其中滑动。
为了便于托盘转动轴521的安装，除了固定平台530中部设有空腔外，升降平台510对应固定平台530的空腔的位置设有转轴孔。托盘转动轴521中部设于固定平台530的空腔内并且与空腔的壁不接触。托盘转动轴521插设在转轴孔中并且与转轴孔通过轴承转动连接。通过轴承连接之后，形成了对托盘转动轴521的固定作用。托盘转动轴521的上端与转运托盘520固定连接，以驱动转运托盘520转动。
升降驱动装置550为直线运动驱动装置，升降驱动装置550与升降平台510连接用以驱动升降平台510升降。
升降驱动装置550可为电动推杆。电动推杆和固定平台530固定连接。电动推杆的上端和升降平台510固定连接。电动推杆便可实现对升降平台510升降的控制。
更好的，升降驱动装置550包括滑台552、气缸551和顶杆553。
滑台552与固定平台530固定连接，滑台为一安装平台，气缸551设于滑台552上。顶杆553的上部与升降平台510的下部铰接连接，顶杆553的下部与气缸551的推杆铰接连接。为了限定顶杆553的运动轨迹，固定平台530内侧设有水平的位移槽，顶杆553下端设有凸起并滑动设置在位移槽内部。顶杆553在推杆的作用下，顶杆553的下部在位移槽内水平滑动。在顶杆553下端靠近气缸551的位置时，顶杆553倾斜设置，推杆推动顶杆553之后，顶杆553由倾斜向竖直变化，并将升降平台510顶起。
转动驱动装置540为圆周运动驱动装置，转动驱动装置540与托盘转动轴521连接，用以驱动转运托盘520转动。
转动驱动装置540包括电机和联动管。联动管的管腔的截面形状为非圆形。电机和固定平台530固定连接。托盘转动轴521的下端的截面形状与联动管的管腔的截面形状相同，并且插接在联动管的管腔内部。电机的转轴与联动管连接，或者电机的转轴通过减速器和联动管连接。托盘转动轴521插入联动管的长度大于升降平台510最大的升起高度。
或者，如图9所示，转动驱动装置540包括电机541、U形联动架542和转轴固定座543。U形联动架542的闭合端的中部设有联动轴544，联动轴544与U形联动架542固定连接。联动轴544通过轴承与转轴固定座543连接。转轴固定座543用以保持联动轴544和U形联动架542的稳定。转轴固定座543通过矩形板等支架与固定平台530连接，矩形板的长度方向为上下方向，转轴固定座543设于矩形板的下部，并与托盘转动轴521转动连接。或者转轴固定座543安装在其他固定的结构上，如检测设备的箱体或者柜体600上。托盘转动轴521的下部插接在U形联动架542的开口端的中部，托盘转动轴521的两侧通过直线轴承545和U形联动架542的两端滑动连接。此时，既可以实现两者的上下方向的相对滑动，U形联动架542还可带动托盘转动轴521转动。电机541与联动轴544通过皮带或者齿轮联动。或者电机541的转轴直接与联动轴544连接来驱动其转动。联动轴544通过U形联动架542带动托盘转动轴521转动。该结构可以大大的提高托盘转动轴521的稳定性。电机541可以通过支架与固定平台530固定连接，也可以固定在其他设备上。
更好的，为了保持在转动过程中，芯片盘的稳定，在转运托盘520的两端设置了定位凸起。相应的，芯片盘对应的位置可以设置定位凹槽。通过该定位凸起，不仅可以实现定位的功能，还可实现稳固作用，防止在转动的过程中，芯片盘与转运托盘520发生相对移动，致使芯片盘进入后无法到达指定的位置。
该芯片检测装置应用于一种芯片检测设备，芯片检测设备设有框形的芯片盘托架700，芯片盘托架700一端设于检测设备内部，另一端设于检测设备外部，升降平台510位于芯片盘托架700的内部。本发明在工作过程中，转运托盘520和芯片盘托架的位置相同，均为一端位于芯片检测设备的内部，另一端位于芯片检测设备的外部，通过转动的方式，将位于芯片检测设备内部的空芯片盘与位于芯片检测设备外部的新的芯片盘进行位置的调换，在出料的同时，完成了进料，进而实现芯片盘的进出，具体的：
升降驱动装置550将升降平台510抬起，升降平台510将转运托盘520抬起，转运托盘520将检测设备内部已检测完的芯片盘和位于检测设备外部未检测的芯片盘托起并脱离芯片盘托架700；
转动驱动装置540驱动转运托盘520转动180度，使检测设备内部和外部芯片盘调换位置；
升降驱动装置550将升降平台510落下，升降平台510将转运托盘520落下，转运托盘520将检测设备外部未检测的芯片盘放置在芯片盘托架700位于检测设备内部的一端，完成芯片盘的更换。
与传统的推入推出的方式相比，本发明可以大大提高效率，同时优化了工作流程，工作人员只需将位于芯片检测设备外部的空的芯片盘更换为新的芯片盘即可，无需在设备处等待，因此具有提高工作效率的有益效果，一人可以看管多台设备。
本实施例中，转盘200为正六面柱体，转盘200的每个侧面上设有芯片测试盘220，转盘200的侧面的下部设有主气孔211。主气孔211共设有六个。真空环400设有三个负压气孔401和一个正压气孔402，当芯片测试盘220转动至上部水平位置时，上部的三个主气孔211和负压气孔401正对，下部的一个正压气孔402和最下部的主气孔211相对。本方案中的电气设备和控制器电气连接，控制器采用PLC模块，机械手以及芯片检测装置需要应用气源的气阀设于电磁气阀，电磁气阀与控制器连接，同时对外与气源连接，控制器控制气源的导通和关闭。
实施方式三
基于实施方式二的芯片检测系统的控制方法为：
转盘200的轴线方向水平，转动臂与转盘200的轴线方向平行，从转盘200看向真空环400，以顺时针转动为例，主气孔211转动一定的角度后会切换为与另一负压气孔401连通，因此检测完的芯片放置槽222对应的负压气孔401可以实现单独断气，以便于芯片的卸下。主气孔211转动至与正压气孔402连通时，气体由主气孔211向外吹，将卡在芯片放置槽222 中的芯片吹落。转盘200转动的过程即实现了气源切换的过程。芯片检测系统启动之后，接通真空环400上的负压气源和正压气源；
步骤A、控制装料机械手910移动至芯片盘的上部，调整装料机械手910的真空吸头朝下，使装料机械手910的真空吸头与芯片盘上的一列芯片对应；
装料机械手910接通负压气源，装料机械手910向下移动，直至装料机械手910的真空吸头吸附芯片盘上的芯片；
或者，装料机械手910向下移动，直至装料机械手910的真空吸头与芯片靠近时接通负压气源，将芯片吸附到装料机械手910的真空吸头上。此时可以减少对其他芯片的影响，防止扰动其他芯片进而避免漏取芯片的情况发生；
吸附芯片之后，控制装料机械手910上移，并转动操作臂902使装料机械手910的真空吸头与转盘200上的芯片测试盘220上的芯片放置槽222相对；
控制装料机械手910向转盘200移动，直至将芯片放置到芯片放置槽222内部，此时，断开装料机械手910的负压气源；由于转盘200本身具有负压，吸附通孔221将放置的芯片吸住；
重复本步骤A，直至将转盘200左侧的芯片放置槽222填满；
步骤B、所述转盘200转动至其中一侧面为水平面且位于上部时，控制第一驱动装置120驱动探针座110下降，使探针座110上的探针与芯片放置槽222中的芯片抵接；
启动测试程序进行芯片测试；
芯片测试完成后记录测试结果，控制第一驱动装置120驱动探针座110上升；记录的测试结果发送给控制器；
步骤C、接通卸料机械手920的负压气源，调整卸料机械手920的真空吸头与转盘200右侧的芯片放置槽222相对；
控制卸料机械手920向转盘200移动，直至卸料机械手920的真空吸头吸附转盘200上的检测完成的芯片；所述卸料机械手920的真空吸头的真空度大于转盘200上的真空度；
读取检测结果，根据检测结果控制卸料机械手920移动至相应的分料盘800的上部；
控制卸料机械手920向下移动，当卸料机械手920的真空吸头位于分料盘800上部之后，断开卸料机械手920的负压气源，芯片落入分料盘800内部；
或者，控制卸料机械手920移动至真空吸头距离分料盘合适的高度，该高度为两者的垂直距离，然后控制卸料机械手920由近处的分料盘向远处的分料盘移动，根据读取的检测结果，在卸料机械手920移动至相应的分料盘的位置时，切换气源使芯片落入分料盘中；
步骤D、未被吸附或者卡接在芯片放置槽222中的芯片所在的转盘200的侧面在转动到位于下部的水平面时，由下部的主气孔211中通入的正压气源将残留的芯片排入溢料盒300中；
步骤E、当芯片盘上的芯片全部检测完成之后，
升降驱动装置550将升降平台510抬起，升降平台510将转运托盘520抬起，转运托盘520将柜体600内部已检测完的芯片盘和位于柜体600外部未检测的芯片盘托起并脱离芯片盘托架700；
转动驱动装置540驱动转运托盘520转动180度，使柜体600内部和外部芯片盘转换位置；
升降驱动装置550将升降平台510落下，升降平台510将转运托盘520落下，转运托盘520将柜体600外部未检测完的芯片盘放置在芯片盘托架700上。
在运行过程中，装料机械手910、卸料机械手920和转盘200同时运作，大大提高了芯片的检测效率。
更好的，为了增加对芯片的保护，分料盘800的上部设有倾斜滑板，在所述步骤C中：
在卸料机械手920的真空吸头吸附芯片之后，转动卸料机械手920的真空吸头使其朝向分料盘800内部的倾斜滑板；
当卸料机械手920的真空吸头位于分料盘800上部之后，断开卸料机械手920的负压气源并切换正压气源，芯片落到倾斜滑板上然后滑落入分料盘800内部。
更好的，转盘200为正六面柱体且设有六个主气孔211。真空环400设有三个负压气孔401和一个正压气孔402；在其中一个芯片测试盘220位于上部水平面时：三个负压气孔401和上部的三个主气孔211位置对应并连通，正压气孔402和下部的主气孔211的位置对应并连通；相应的，连通槽213设于主气孔211的孔口处，所述连通槽213为弧形，所述连通槽213的长度小于或等于两个主气孔211之间的间距；正压气孔402用以与正压气源连接，并且同电磁气阀与正压气源连通以实现开闭控制。
主气孔211转动过程中通过连通槽213实现气源的导通、并且在转动过程中切换主气孔211与不同的真空环的负压气孔401和正压气孔402的连通；在所述步骤C中：
当控制卸料机械手920向转盘200移动至卸料机械手920的真空吸头移动到检测完的芯片附近时，关闭与检测完的芯片对应的负压气孔401的气源，启动卸料机械手920的负压气源，将芯片吸附；
在卸料机械手920的真空吸头吸附芯片之后，重新启动之前关闭的负压气孔401的负压气源，卸料机械手920的真空吸头移动到对应的分料盘800之后，断开卸料机械手920的负压气源，芯片落到分料盘800内部。
综上所述，仅为本发明的较佳实施例而已，并非用来限定本发明的范围，通过上述的说明内容，相关工作人员完全可以在不偏离本项发明技术思想的范围内，进行多样的变更以及修改。本发明的技术性范围并不局限于说明书上的内容，凡依本发明的要求范围所述的形状、构造、特征及精神所谓的均等变化与修饰，均应包括与本发明的权利要求范围内。

Claims (34)

  1. 一种芯片检测装置，其中，所述芯片检测装置包括：支撑板(100)、架设在两支撑板(100)之间的检测台、设于支撑板(100)上并能做直线运动的第一驱动装置(120)和设于检测台上部且与第一驱动装置(120)连接的探针座(110)；
    所述检测台包括：
    转盘(200)：为柱体结构，转盘(200)的两端与支撑板(100)转动连接；
    真空环(400)：真空环(400)一端的端面与支撑板(100)固定连接，真空环(400)另一端的端面与转盘(200)的端面密封转动连接；
    第二驱动装置(130)：设于支撑板(100)上并能驱动转盘(200)转动；
    芯片测试盘(220)：至少设有三组且均匀分布在转盘(200)的柱面上，每组芯片测试盘(220)在转盘(200)的柱面的长度方向上排列；
    所述芯片测试盘(220)上设有芯片放置槽(222)，所有芯片测试盘(220)上的芯片放置槽(222)的底部电性连通，所述芯片放置槽(222)的底部中心设有吸附通孔(221)；
    所述转盘(200)设有：
    主气孔(211)：设于转盘(200)的轴向方向上且与芯片测试盘(220)在径向方向上对应设置；所述主气孔(211)的靠近真空环(400)的一端敞开且另一端封闭；
    支气孔(212)：连通主气孔(211)与芯片测试盘(220)的吸附通孔(221)；
    所述真空环(400)设有负压气孔(401)，所述负压气孔(401)的一个孔口位于与转盘(200)相对接的端面上且与主气孔(211)位于同一圆周上，所述负压气孔(401)的另一个孔口用以连接负压气源；
    所述负压气孔(401)的孔口处或主气孔(211)的孔口处设有连通槽(213)，连通槽(213)用以在负压气孔(401)与主气孔(211)错开时实现两者的连通。
  2. 根据权利要求1所述的一种芯片检测装置，其中：
    所述负压气孔(401)设有一个，相应的，所述连通槽(213)为环形。
  3. 根据权利要求1所述的一种芯片检测装置，其中：
    所述负压气孔(401)设有一个，所述真空环(400)还设有一个正压气孔(402)，所述负压气孔(401)与正压气孔(402)上下对称设置，所述正压气孔(402)用以与正压气源连接；
    相应的，所述连通槽(213)设于真空环(400)上，所述负压气孔(401)对应的连通槽(213)的弧度大于180度，正压气孔(402)对应的连通槽(213)的弧度小于D，D＝360/n，其中n为主气孔(211)的个数。
  4. 根据权利要求1所述的一种芯片检测装置，其中：
    所述负压气孔(401)设有三个，在其中一个芯片测试盘(220)位于上部水平面时：三个负压气孔(401)和上部的三个主气孔(211)位置对应并连通，
    相应的，所述连通槽(213)设于主气孔(211)的孔口处，连通槽(213)为弧形；
    或者主气孔(211)与连通槽(213)的截面形状相同，且都为弧形，主气孔(211)与连通槽(213)组成一个通孔。
  5. 根据权利要求4所述的一种芯片检测装置，其中：
    所述真空环(400)还设有一个正压气孔(402)，在其中一个芯片测试盘(220)位于上部水平面时：三个负压气孔(401)和上部的三个主气孔(211)位置对应并连通，正压气孔(402)和下部的主气孔(211)的位置对应并连通；
    所述正压气孔(402)用以与正压气源连接。
  6. 根据权利要求1-5任一项所述的一种芯片检测装置，其中：
    还包括溢料盒(300)，所述溢料盒(300)设于所述检测台的下部，溢料盒(300)和支撑板(100)可拆卸连接。
  7. 根据权利要求1-5任一项所述的一种芯片检测装置，其中：
    所述转盘(200)为圆柱体，所述芯片测试盘(220)的长度方向与转盘(200)的轴向方向相同，且芯片测试盘(220)在转盘(200)的柱面的长度方向上依次排列；
    或所述转盘(200)为正多面柱体，所述正多面柱体的侧面的面数至少为三面；所述芯片测试盘(220)的长度方向与转盘(200)的轴向方向相同，所述芯片测试盘(220)在转盘(200)的柱面的长度方向上依次排列且在长度方向上设有多行。
  8. 根据权利要求6所述的一种芯片检测装置，其中：
    所述转盘(200)为圆柱体，所述芯片测试盘(220)的长度方向与转盘(200)的轴向方向相同，且芯片测试盘(220)在转盘(200)的柱面的长度方向上依次排列；
    或所述转盘(200)为正多面柱体，所述正多面柱体的侧面的面数至少为三面；所述芯片测试盘(220)的长度方向与转盘(200)的轴向方向相同，所述芯片测试盘(220)在转盘(200)的柱面的长度方向上依次排列且在长度方向上设有多行。
  9. 根据权利要求7所述的一种芯片检测装置，其中：
    所述转盘(200)为正六面柱体或正八面柱体。
  10. 根据权利要求8所述的一种芯片检测装置，其中：
    所述芯片测试盘(220)在其长度方向上设有多行芯片放置槽(222)。
  11. 根据权利要求7所述的一种芯片检测装置，其中：
    所述芯片测试盘(220)包括导电层和绝缘层，所述绝缘层与转盘(200)接触。
  12. 根据权利要求7所述的一种芯片检测装置，其中：
    所述探针座(110)的探针设于与正压惰性气源连通的空腔(115)内部，所述空腔(115)在探针的针头所在的一面敞开。
  13. 根据权利要求8所述的一种芯片检测装置，其中：
    所述探针座(110)的探针设于与正压惰性气源连通的空腔(115)内部，所述空腔(115) 在探针的针头所在的一面敞开。
  14. 根据权利要求12所述的一种芯片检测装置，其中：
    所述空腔(115)由探针座(110)和设于探针座(110)外周的围挡(113)组成，所述围挡(113)或者探针座(110)上设有主保护气孔(111)和分散气孔(112)，所述主保护气孔(111)的长度方向与探针排列的长度方向平行，所述分散气孔(112)连通主保护气孔(111)和空腔(115)，所述主保护气孔(111)和正压惰性气源连通。
  15. 根据权利要求14所述的一种芯片检测装置，其中：
    所述分散气孔(112)与探针的数量相同，探针一侧的每一个分散气孔(112)向一个探针的针头处倾斜；
    所述围挡(113)的下端距离探针座的底面的距离略小于探针的底端距离探针座(110)的底面的距离；
    或，所述围挡(113)的上部与探针座(110)上下滑动连接，当第一驱动装置(120)驱动探针座(110)朝芯片测试盘(220)下降时，围挡(113)先与芯片测试盘(220)抵接以增加空腔(115)的封闭度并提高空腔(115)内惰性气体的浓度，所述探针座(110)继续下降与芯片接触进行检测。
  16. 一种芯片检测系统，其中，所述芯片检测系统包括柜体(600)，柜体(600)内设有控制器、装料机械手(910)、卸料机械手(920)、设于所述装料机械手(910)一侧的芯片盘托架(700)、以及设于卸料机械手(920)一侧的分料盘(800)；
    所述装料机械手(910)和卸料机械手(920)之间设有芯片检测装置；
    所述芯片检测装置包括：与柜体(600)固定连接的支撑板(100)、架设在两支撑板(100)之间的检测台、设于所述检测台上部的探针座(110)、设于支撑板(100)上并能驱动探针座(110)上下运动的第一驱动装置(120)和设于支撑板(100)上并能驱动检测台转动的第二驱动装置(130)；
    所述控制器和装料机械手(910)、卸料机械手(920)、芯片检测装置电气连接，所述控制器控制装料机械手(910)将芯片盘托架(700)上的芯片放置在转动的检测台上；当芯片转动至上部时探针座(110)下降对芯片进行检测；所述控制器控制卸料机械手(920)将检测台上检测完的芯片取下并放置在对应的分料盘(800)内部。
  17. 根据权利要求16所述的一种芯片检测系统，其中：
    所述检测台包括：
    转盘(200)：为柱体结构，转盘(200)的两端与支撑板(100)转动连接；
    真空环(400)：真空环(400)一端的端面与支撑板(100)固定连接，真空环(400)另一端的端面与转盘(200)的端面密封转动连接；
    所述转盘(200)设有主气孔(211)，所述主气孔(211)设于转盘(200)的轴向方向上，所述主气孔(211)的靠近真空环(400)的一端敞开且另一端封闭；所述主气孔(211)至少 设有三个且在圆周方向上均匀分布，所述主气孔(211)的长度方向上设有均匀分布的支气孔(212)，所述支气孔(212)的孔口开设于转盘(200)的侧面；
    所述转盘(200)的侧面对应主气孔(211)的位置设有芯片测试盘(220)；所述芯片测试盘(220)上设有芯片放置槽(222)，所有芯片测试盘(220)上的芯片放置槽(222)的底部电性连通，所述芯片放置槽(222)的底部中心设有吸附通孔(221)，所述吸附通孔(221)和支气孔(212)位置对应且密封连通；
    所述真空环(400)设有负压气孔(401)，所述负压气孔(401)的一个孔口位于与转盘(200)相对接的端面上且与主气孔(211)位于同一圆周上，所述负压气孔(401)的另一个孔口通过进气阀与负压气源连通；
    所述负压气孔(401)的孔口处或主气孔(211)的孔口处设有连通槽(213)，连通槽(213)用以在负压气孔(401)与主气孔(211)错开时实现两者的连通。
  18. 根据权利要求17所述的一种芯片检测系统，其中：
    所述负压气孔(401)设有一个，相应的，所述连通槽(213)为环形。
  19. 根据权利要求17所述的一种芯片检测系统，其中：
    所述负压气孔(401)设有三个，所述真空环(400)还设有一个正压气孔(402)；
    在其中一个芯片测试盘(220)位于上部水平面时：三个负压气孔(401)和上部的三个主气孔(211)位置对应并连通，正压气孔(402)和下部的主气孔(211)的位置对应并连通；
    相应的，所述连通槽(213)设于主气孔(211)的孔口处，所述连通槽(213)为弧形，所述连通槽(213)的长度小于或等于两个主气孔(211)之间的间距；
    所述正压气孔(402)用以与正压气源连接。
  20. 根据权利要求17所述的一种芯片检测系统，其中：
    所述转盘(200)为圆柱体，或所述转盘(200)为正多面柱体，所述正多面柱体的侧面的面数为至少三面；
    所述芯片测试盘(220)的长度方向与转盘(200)的轴向方向相同，且芯片测试盘(220)在转盘(200)的柱面的长度方向上依次排列。
  21. 根据权利要求17所述的一种芯片检测系统，其中：
    每一个所述主气孔(211)对应两组芯片测试盘(220)，相应的，主气孔(211)设有两组支气孔(212)分别与两组芯片测试盘(220)的吸附通孔(221)连通。
  22. 根据权利要求16-21任一所述的一种芯片检测系统，其中：
    所述分料盘(800)为上部敞开的盒体，分料盘(800)并列设置在芯片检测装置的右侧，所述分料盘(800)的上部设有倾斜滑板。
  23. 根据权利要求22所述的一种芯片检测系统，其中：
    还包括溢料盒(300)，所述溢料盒(300)设于所述检测台的下部，溢料盒(300)和支撑板(100)或柜体(600)可拆卸连接。
  24. 根据权利要求22所述的一种芯片检测系统，其中：
    所述探针座(110)的探针设于与正压惰性气源连通的空腔(115)内部，所述空腔(115)在探针的针头所在的一面敞开；
    所述空腔(115)由探针座(110)和设于探针座(110)外周的围挡(113)组成；所述围挡(113)或者探针座(110)上设有主保护气孔(111)和分散气孔(112)；所述主保护气孔(111)的长度方向与探针排列的长度方向平行，所述分散气孔(112)连通主保护气孔(111)和空腔(115)，所述主保护气孔(111)和正压惰性气源连通。
  25. 根据权利要求24所述的一种芯片检测系统，其中：
    所述分散气孔(112)的长度方向指向探针的端部。
  26. 根据权利要求23-24任一所述的一种芯片检测系统，其中：
    还包括进料装置，所述进料装置包括升降平台(510)、转运托盘(520)、固定平台(530)、转动驱动装置(540)和升降驱动装置(550)，所述芯片盘托架(700)的中部设有贯通的缺口，所述转运托盘(520)设于所述缺口内部；
    所述固定平台(530)的中部设有上下贯通的空腔(115)，空腔(115)的四周设有稳固孔，所述升降平台(510)的下部对应所述稳固孔的位置设有稳固杆(511)，所述稳固杆(511)滑动插接在所述稳固孔中，所述升降平台(510)对应空腔(115)的位置设有转轴孔；
    所述转运托盘(520)的下部设有与其固定连接的托盘转动轴(521)，所述托盘转动轴(521)的中部插设于固定平台(530)的空腔和升降平台(510)的转轴孔中，并且与所述转轴孔转动连接；
    所述升降驱动装置(550)为直线运动驱动装置，升降驱动装置(550)与升降平台(510)连接用以驱动升降平台(510)升降；
    所述转动驱动装置(540)为圆周运动驱动装置，转动驱动装置(540)与托盘转动轴(521)的下端连接，用以驱动转运托盘(520)转动；
    所述升降驱动装置(550)、转动驱动装置(540)和控制器电气连接。
  27. 根据权利要求26所述的一种芯片检测系统，其中：
    所述固定平台(530)的上部设有限位支柱(531)，所述限位支柱(531)为管状，所述限位支柱(531)的管腔与所述稳固孔上下重合。
  28. 根据权利要求26所述的一种芯片检测系统，其中：
    所述升降驱动装置(550)包括滑台(552)、气缸(551)和顶杆(553)；
    所述滑台(552)与固定平台(530)固定连接，所述气缸(551)设于滑台(552)上，所述固定平台(530)内侧设有水平的位移槽；
    所述顶杆(553)的上部与升降平台(510)的下部铰接连接，所述顶杆(553)的下部与气缸(551)的推杆铰接连接，所述顶杆(553)的下端设有凸起并滑动设置在所述位移槽内部。
  29. 根据权利要求26所述的一种芯片检测系统，其中：
    所述转动驱动装置(540)包括电机(541)、U形联动架(542)和转轴固定座(543)；
    所述U形联动架(542)的闭合端中部设有联动轴(544)，所述联动轴(544)与转轴固定座(543)连接；
    所述托盘转动轴(521)的下部插接在U形联动架(542)的开口端的中部，托盘转动轴(521)的两侧通过直线轴承(545)和U形联动架(542)的两分支滑动连接；
    所述电机(541)驱动联动轴(544)转动，进而通过U形联动架(542)带动托盘转动轴(521)转动。
  30. 根据权利要求16所述的一种芯片检测系统，其中：
    装料机械手(910)包括水平移动模块、设于水平移动模块上的上下移动模块、以及设于上下移动模块下端的转动模块，转动模块上设有吸附模组(903)，所述上下移动模块上设有气阀，气阀的一端与吸附模组(903)连通，气阀的另一端与气源连接。
  31. 根据权利要求16所述的一种芯片检测系统，其中：
    卸料机械手(920)包括水平移动模块、设于水平移动模块上的上下移动模块、以及设于上下移动模块下端的转动模块，转动模块上设有吸附模组，所述上下移动模块上设有气阀，气阀的一端与吸附模组连通，气阀的另一端与气源连接。
  32. 一种用于权利要求16所述的芯片检测系统的控制方法，其中：所述控制方法包括以下步骤：
    芯片检测系统启动后，接通真空环(400)上负压气孔(401)的负压气源和正压气孔(402)的正压气源；转动的转盘(200)上的主气孔(211)通过真空环(400)获取气源；
    步骤A、控制装料机械手(910)移动至芯片盘的上部，调整装料机械手(910)的真空吸头朝下，使装料机械手(910)的真空吸头与芯片盘上的一列芯片对应；
    装料机械手(910)接通负压气源，装料机械手(910)向下移动，直至装料机械手(910)的真空吸头吸附芯片盘上的芯片；或者，装料机械手(910)向下移动，直至装料机械手(910)的真空吸头与芯片靠近时接通负压气源将芯片吸附到装料机械手(910)的真空吸头上；
    控制装料机械手(910)上移，并转动操作臂(902)使装料机械手(910)的真空吸头与转盘(200)上的芯片测试盘(220)上的芯片放置槽(222)相对；
    控制装料机械手(910)向转盘(200)移动，直至将芯片放置到芯片放置槽(222)内部，断开装料机械手(910)的负压气源；
    重复步骤A，直至将转盘(200)左侧的芯片放置槽(222)填满；
    步骤B、所述转盘(200)转动至其中一侧面为水平面且位于上部时，控制第一驱动装置(120)驱动探针座(110)下降，使探针座(110)上的探针与芯片放置槽(222)中的芯片抵接；
    启动测试程序进行芯片测试；
    芯片测试完成后记录测试结果，控制第一驱动装置(120)驱动探针座(110)上升；
    步骤C、接通卸料机械手(920)的负压气源，调整卸料机械手(920)的真空吸头与转盘(200)右侧的芯片放置槽(222)相对；
    控制卸料机械手(920)向转盘(200)移动，直至卸料机械手(920)的真空吸头吸附转盘(200)上的检测完成的芯片；所述卸料机械手(920)的真空吸头的真空度大于转盘(200)上的真空度；
    读取检测结果，根据检测结果控制卸料机械手(920)移动至相应的分料盘(800)的上部；
    控制卸料机械手(920)向下移动，当卸料机械手(920)的真空吸头位于分料盘(800)上部之后，断开卸料机械手(920)的负压气源，芯片落入分料盘(800)内部；
    步骤D、未被吸附或者卡接在芯片放置槽(222)中的芯片所在的转盘(200)的侧面在转动到位于下部的水平面时，由下部的主气孔(211)中通入的正压气源将残留的芯片排入溢料盒(300)中；
    步骤E、当芯片盘上的芯片全部检测完成之后，
    升降驱动装置(550)将升降平台(510)抬起，升降平台(510)将转运托盘(520)抬起，转运托盘(520)将柜体(600)内部已检测完的芯片盘和位于柜体(600)外部未检测的芯片盘托起并脱离芯片盘托架(700)；
    转动驱动装置(540)驱动转运托盘(520)转动180度，使柜体(600)内部和外部芯片盘转换位置；
    升降驱动装置(550)将升降平台(510)落下，升降平台(510)将转运托盘(520)落下，转运托盘(520)将柜体(600)外部未检测完的芯片盘放置在芯片盘托架(700)上。
  33. 根据权利要求32所述的一种芯片检测系统的控制方法，其中：
    所述分料盘(800)的上部设有倾斜滑板，在所述步骤C中：
    在卸料机械手(920)的真空吸头吸附芯片之后，转动卸料机械手(920)的真空吸头使其朝向分料盘(800)内部的倾斜滑板；
    当卸料机械手(920)的真空吸头位于分料盘(800)上部之后，断开卸料机械手(920)的负压气源并切换正压气源，芯片落到倾斜滑板上然后滑落入分料盘(800)内部。
  34. 根据权利要求32所述的一种芯片检测系统的控制方法，其中：
    所述转盘(200)为正六面柱体且设有六个主气孔(211)，所述真空环(400)设有三个负压气孔(401)和一个正压气孔(402)；在其中一个芯片测试盘(220)位于上部水平面时：三个负压气孔(401)和上部的三个主气孔(211)位置对应并连通，正压气孔(402)和下部的主气孔(211)的位置对应并连通；相应的，所述连通槽(213)设于主气孔(211)的孔口处，所述连通槽(213)为弧形，所述连通槽(213)的长度小于或等于两个主气孔(211)之间的间距；所述正压气孔(402)用以与正压气源连接；
    主气孔(211)转动过程中通过连通槽(213)实现气源的导通、并且在转动过程中切换主气孔(211)与不同的真空环(400)的负压气孔(401)和正压气孔(402)的连通；
    在所述步骤C中：
    当控制卸料机械手(920)向转盘(200)移动至卸料机械手(920)的真空吸头移动到检测完的芯片附近时，关闭与检测完的芯片对应的负压气孔(401)的气源，启动卸料机械手(920)的负压气源，将芯片吸附；
    在卸料机械手(920)的真空吸头吸附芯片之后，重新启动之前关闭的负压气孔(401)的负压气源，卸料机械手(920)的真空吸头移动到对应的分料盘(800)之后，断开卸料机械手(920)的负压气源，芯片落到分料盘(800)内部。
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