Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
  • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
  • B25J15/00—Gripping heads and other end effectors
  • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
  • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
  • B25J15/00—Gripping heads and other end effectors
  • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
  • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
  • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
  • H10P72/3402—Mechanical parts of transfer devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
  • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Definitions

• the present invention relates to the manufacture of electronic devices, and more specifically to end effector apparatus, systems, and methods for transporting substrates.
• precursor articles to such semiconductor wafers may be transported between various components of the manufacturing facility and within tools by robot apparatus.
• transport may be from one process chamber to another within a transfer chamber, from a load lock to a process chamber, from a substrate carrier to a load port in a factory interface of a cluster tool, or the like.
• movement and placement of the substrate with speed and precision is desired. Any slippage of the substrate on the end effector may cause unwanted particles to be generated and may require misalignment correction, which may be time consuming.
• an end effector apparatus for transporting a substrate between system components in an electronic device manufacturing system.
• the end effector apparatus includes a base adapted to be connected to a robotic component, and a pneumatic suction element positioned on the base.
• a substrate transportation system for transporting a substrate between electronic device manufacturing system components.
• the substrate transportation system includes a robotic
• the end effector including a base adapted to be connected to a robotic component, and a pneumatic suction element positioned on the base.
• a method of transporting a substrate between components of an electronic device manufacturing system includes providing an end effector coupled to a robotic component, the end effector having one or more pneumatic suction elements and three or more contact pads, supporting a substrate on the three or more contact pads, and generating suction via operation of the one or more pneumatic suction elements to draw the substrate into increased contact with the at least three contact pads over that provided by a force of gravity.
• FIG. 1 illustrates a perspective view of an end effector including pneumatic suction elements according to embodiments .
• FIG. 2 illustrates a perspective underside view of a portion of an embodiment of an end effector base including exposed pneumatic channels (with covers removed) according to embodiments.
• FIG. 3A illustrates a partial cross-sectioned view of a pneumatic suction element of an end effector taken along Section line 3A-3A of FIG. 1.
• FIG. 3B is a perspective view of a suction element of an end effector apparatus according to embodiments.
• FIG. 4 illustrates a top schematic view of an electronic device processing system including an end effector with one or more pneumatic suction elements according to embodiments.
• FIG. 5 is a flowchart illustrating a method of transporting a substrate between components of an electronic device manufacturing system according to embodiments.
• FIGs. 6A-6C illustrates various assembly and component views of another end effector with one or more pneumatic suction elements according to embodiments .
• Electronic device manufacturing processes use a variety of precursor articles to produce the final device, such as semiconductor wafers, glass plates, masks (all such precursor articles are herein referred to as a "substrate” or “substrates”) .
• the substrate may be carried by an end effector (sometimes referred to as a "blade") .
• the substrate rests on the end effector during transport and it may be desirable that slippage between the blade and the substrate be reduced or eliminated.
• Reducing or eliminating such relative sliding motion between the end effector and the substrate when undergoing lateral motions may reduce positioning errors, reduce repositioning time when sliding actually occurs (e.g., misalignment correction time), and may further reduce particle generation, which may serve to contaminate the tool, other system components, and the substrates.
• an end effector apparatus may include a base having one or more pneumatic suction elements (and a plurality in the depicted embodiment) thereon.
• the pneumatic elements may be operable to increase an adherent force attracting the substrate to contact pads of the end
• more rapid motions of the end effector and secured substrate may be carried out by using the one or more pneumatic elements .
• a substrate transportation system is provided.
• the substrate is provided.
• the transportation system may include a robotic member, such as a robot wrist, robot arm, and/or a series of robotic components, and an end effector apparatus including one or more pneumatic suction elements coupled to the robotic member.
• the end effector including one or more pneumatic suction elements may generate suitably high adherent forces (sometimes referred to as "chucking forces") such that slippage between the end effector and substrate may be reduced or eliminated during vertical and/or lateral motions. In some instances, suction forces of greater than 1 pound on the substrate may be achieved.
• FIGs. 1-3B illustrates the end effector 100 and various components thereof according to one or more
• the end effector 100 includes a base 102 including a first end adapted to be attached to a robotic component (not shown), and a second end on an end opposite from the first end including a first leg 106 and a second leg 107.
• the base 102 may be
• substantially planar as shown, and may have a thickness of between about 0.118 inches (3 mm) and about 0.157 inches (4 mm) , and may be manufactured from a suitable material, such as aluminum, titanium, stainless steel or ceramic, for example. Other materials and dimensions may be used
• the base 102 and first and second legs 106, 107 may be as wide as practical to accommodate passing by substrate supports (e.g., lift pins of a process chamber (not shown)), for example.
• the end effector 100 may attach to the robotic component 109 (e.g., robot wrist shown dotted in FIG. 4 or optionally to a robotic arm) on the first end by any suitable means, such as by fasteners (e.g., bolts, screws, rivets, clamps, guick disconnect, or the like) .
• pneumatic suction elements 105A-105D Positioned on the base 102 by either mechanical fastening or recessing, may be one or more pneumatic suction elements (e.g., pneumatic suction elements 105A-105D) .
• pneumatic suction elements 105A-105D Positioned on the base 102 by either mechanical fastening or recessing, may be one or more pneumatic suction elements (e.g., pneumatic suction elements 105A-105D) .
• Four pneumatic suction elements are shown, but as few as one and as many as four or more may be provided, depending on the level of additional adherence force desired.
• a plurality of pneumatic suction elements 105A - 105D are positioned on the base 102.
• the plurality of pneumatic suction elements 105A - 105D may be provided at appropriate intervals. For example, in the depicted
• a first pneumatic suction element 105A may be provided on the first leg 106 adjacent to a first leg tip 106T.
• a second pneumatic suction element 105B may be provided on the second leg 107 adjacent to a second leg tip 107T.
• a third pneumatic suction element 105C, and even a fourth pneumatic suction element 105D, may be provided on the base 102 adjacent to the connecting portion 108.
• Connecting portion 108 is adapted to couple to a robotic component 109 (shown dotted) .
• the end effector 100 is adapted to produce a total downward suction force due to the provided suction of at least 1 lb. (at least 1.1N) to hold a substrate 345 onto the end effector 100 (see FIG. 4) .
• a force of about 0.43 lb. (about 1.9N) may be generated. So using four pneumatic suction elements 105A-105D and
• the end effector 100 may include one or more pneumatic passageways (e.g., 111A-111D) formed within the base 102. As depicted, four pneumatic passageways 111A-111D are provided. The pneumatic passageways 111A-111D connect to, and provide pneumatic flow at, the pneumatic suction elements 105A-105D. Passageways 111A-111D may be formed by the assembly of grooves 112A-112D and one or more covers 114 received over the grooves (only one cover 114 shown in FIG. 2) . Grooves 112A-112D may be formed in an underside of the base 102 as shown in FIG. 2. Thus, the pneumatic passageways 111A-111D may be formed between layers of the base 102.
• 111A-111D may be formed between layers of the base 102.
• Cover 114 (only one shown) may be received in recessed pockets surrounding the grooves 112A-112D in the base 102 and secured therein. Securing may be by fasteners, braising, adhesive, or the like.
• the pneumatic passageways 111A-111D in the base 102 may be comprised of a first layer having the grooves 112A-112D formed therein and second layer comprising the covers 114.
• the pneumatic passageways 111A-111D may be formed between layers, such as between layers of the base 102.
• Pneumatic passageways 111A-111D may extend to, and may interconnect the pneumatic suction elements 105A-105D in some embodiments. Each pneumatic passageway 111A-111D may interconnect to a main connection 115. Main connection 115 may couple to main pneumatic supply channel 116 (shown dotted in FIG. 1), which may connect the pneumatic
• main pneumatic supply channel 116 may pass through the various arm components of a robot to which the end effector 100 is attached.
• Pneumatic supply system 118 may include a pneumatic source 120, one or more valves 122, and a controller 124.
• Pneumatic source 120 may include a pump, reservoir, accumulator, and/or other suitable pneumatic components to supply a flow rate of between about 25 slm and about 90 slm. Other flow rates and means for controlling the gas flow may be employed. Flow may be turned on and off by the pneumatic supply system 118 or the flow rate may be otherwise controlled or adjusted.
• each of the pneumatic suction elements 105A-105D may be identical to the pneumatic suction element 105A described herein.
• the pneumatic suction element 105A comprises a body 325 adapted to couple to the base 102 and having a pilot portion 326, an inner recessed portion 328, and one or more flow ports 330A-330C intersecting and passing into the inner recessed portion 328.
• a flanged portion 332 may also be provided.
• pneumatic suction element 105A includes an annular flow channel 333 formed between the body 325 and a cavity 334 formed in the base 102.
• the annular flow channel 333 interconnects to the pneumatic passage 111A formed in the base 102 and received air flow therefrom.
• the cover 114 and a main plate 335 of the base 102 may form the pneumatic passage 111A.
• flow ports 330A-330C are shown. However fewer or more may be used.
• the flow ports 330A-330C connect between the annular flow channel 333 and the inner recessed portion 328.
• the flow ports 330A-330C intersect an outer wall 336 of the inner recessed portion 328.
• the one or more flow ports 330A-330C pass into the inner recessed portion 328 and are arranged to project flow at the outer wall 336 of the inner recessed portion 328.
• the flow ports 330A-330C may be angled so that the flow enters the inner recessed portion 328 in a manner that is tangent to the outer wall 336 of the inner recessed portion 328. In this manner, flow through the flow ports 330A-330C may set up a vortex-like flow pattern traveling circularly around in the inner recessed portion 328.
• the body 325 may be received in the cavity 334 and flanged portion 332 may be provided into sealing contact with seal 338, such as O-ring seal.
• Fastener 340 may secure the pneumatic suction element 105A to the base 102.
• the pneumatic suction element 105A may include a contact pad 342 for spacing a substrate 345 (only a portion shown) a suitable distance from the base 102.
• the contact pad 342 is coupled to the body 325, such as to a post 346 extending upwardly within the inner recessed portion 328.
• the number of contact pads 342 may consist essentially of one contact pad per pneumatic suction element 105A-105D.
• the contact pads 342 may be coupled to or integral with the base 102 at appropriate locations, i.e., at different locations than the pneumatic suction elements 105A-105D.
• the contact pad 342 may be of any suitable shape (in top view), such as round, oval, sguare, hexagonal, octagonal or rectangular. Other shapes may be used.
• two contact pads 342 may be spaced apart in a lateral direction, such as on first and second legs 106, 107, and at least one more may be elsewhere provided on the base 102.
• contact pad 342 may be located substantially on a centerline of the pneumatic suction element 105A.
• the contact pads 342 may provide at least a three-point contact with the substrate 345 thereby providing a gap between the substrate 345 and the top surface of the base 102.
• the gap may be between about 0.5 mm and about 1.5 mm in some embodiments. For example, a gap of less than 0.15 mm, or even less than 0.10 mm, or even less than 0.9 mm may be used. Other gap dimensions may be used.
• the contact pad 342 may be secured to the body 325 by any suitable means, such as welding, press fitting, adhering, screwing, bolting, or other mechanical fastening, or the like.
• the contact pad 342 may have a flat or a domed profile .
• FIG. 4 illustrates a substrate transportation system 400 adapted for transporting a substrate 345 (shown dotted) between electronic device manufacturing system components.
• the substrate transportation system 400 includes a robotic component 109, such as a robotic wrist element or other moveable robotic element or arm.
• the robotic component 109 may be a component (e.g., robotic wrist member) of a robot 450, which may be provided in a transfer chamber 452 of a mainframe housing 454 in the depicted embodiment.
• the robot 450 and coupled end effector 100 may be configured and adapted to transport substrates 345 (shown dotted in FIG.
• the end effector 100 coupled to the robotic component 109 may be any of the end effectors 100 including one or more pneumatic suction elements 105A-105D described herein.
• the main pneumatic supply channel 116 which may couple to the main connect 115 (FIG. 1) of the end effector 100 may pass through the various components of the robot 450, such as through robotic component 109 and arms 458, 460 and couple to the pneumatic supply system 118.
• the robot 450 may be any form of robot, such as a three-link robot, four-link robot, a Selective Compliance Articulated Robot Arm (SCARA) robot, or independently- controllable-arm robot. Other types of robots may be employed.
• the robot 450 may, for example, include a support base adapted to be mounted to the mainframe housing 454, for example.
• a factory interface robot 461 (shown as a dotted box) including the end effector 100 described herein may be used in a factory interface 462 to transport substrates from substrate carriers 464 coupled to load ports of the factory interface 462 and the load lock chambers 456A, 456B.
• the robots 450, 461 may include a vertical (Z-axis) motion capability. Vertical movement of the end effector 100 along the Z-axis may be used to accomplish a placement of the substrate 345 onto a substrate support, such as by placing the substrate 345 onto lift pins in a process chamber (e.g., any one or more of process chambers 455A-455F) or onto slots in a substrate carrier 464 or load lock chamber 456A, 456B, for example.
• the robots 450, 461 may include any number of robot arms, which may be connected and driven by belts or other
• a robot controller may provide suitable control signals to the robots 450, 461 to control the motion of the end effectors 100.
• the controller 124 (FIG. 1) of the pneumatic supply system 118 may be integral with or otherwise communicate with the robot controller to accomplish transport of the substrate 345.
• the end effector 100 may be adapted for use with any suitable robot 450, 461 adapted to transport substrates 345.
• end effector 100 may be adapted for use with the robots described in US Patent Nos . 5,789,878;
• FIG. 5 illustrates a method 500 of transporting a substrate between components of an electronic device manufacturing system (see FIG. 4) .
• the method 500 includes, in 502, providing an end effector (e.g., end effector 100) coupled to a robotic component (e.g., robotic component 109, such as a wrist member or other robotic component), the end effector having one or more pneumatic suction elements (e.g., pneumatic suction element 105A, 105B, 105C, and/or 105D) and three or more contact pads (e.g., contact pad 342) .
• an end effector e.g., end effector 100
• a robotic component e.g., robotic component 109, such as a wrist member or other robotic component
• the end effector having one or more pneumatic suction elements (e.g., pneumatic suction element 105A, 105B, 105C, and/or 105D) and three or more contact pads (e.g., contact pad 342) .
• the method 500 further includes, in 504,
• FIGs. 6A-6C illustrates another embodiment of end effector 600 and various components thereof.
• the end effector 600 includes a base 602 including a first end adapted to be attached to a robotic component (not shown), and a second end on an end opposite from the first end including a first leg 606 and a second leg 607.
• the base 602 may be substantially planar, as shown, and may have a thickness and be made of a material as was discussed above.
• the end effector 100 may attach to the robotic component 109 (e.g., robot wrist such as shown in FIG. 4 or to a robotic arm) by any suitable means, such as by
• fasteners e.g., bolts, screws, rivets, clamps, guick disconnect, or the like.
• FIG. 602 Positioned on the base 602 by either mechanical fastening, braising, or recessing, may be one or more pneumatic suction elements.
• Two pneumatic suction elements 605A, 605B are shown, but as few as one and as many as four or more may be provided, depending on the level of
• the pneumatic suction elements 605A, 605B are positioned on the base 602.
• the pneumatic suction elements 605A, 605B may be provided on the base 602 at other than on the legs 606, 607.
• the end effector 600 may include one or more pneumatic passageways (e.g., 611A, 611B) formed therein.
• the pneumatic passageways 611A, 611B provide pneumatic flow at the pneumatic suction elements 605A, 605B.
• Passageways 611A, 611B may be formed by an assembly of grooves 612A, 612B formed in the base 602 and grooves 612C, 612D formed in the body 625.
• the pneumatic passageways 611A, 611B may be formed between layers of the base 602 and the body 625.
• Body 625 may be received in recessed pockets formed in the base 602. Securing may be by fasteners or adhesive, or the like.
• Pneumatic passageways 611A, 611B may extend to, and may interconnect the pneumatic suction elements 605A, 605B in some embodiments.
• Each pneumatic passageway 611A, 611B may interconnect to a main connection 615.
• Main connection 615 may couple to main pneumatic supply channel, such as main pneumatic supply channel 116 shown in FIG. 1.
• each of the pneumatic suction elements 605A, 605B may be identical, but mirror images.
• the pneumatic suction elements 605A, 605B comprise the body 625 adapted to couple to the base 602.
• the body 625 and the base 602 form a pilot portion 626, an inner recessed portion 628, and one or more flow ports 630A-630D intersecting and passing into the inner recessed portion 628.
• pneumatic suction elements 605A, 605B each include an annular flow channel 633 formed between the body 625 and the base 602, wherein the annular flow channels 633 interconnect the pneumatic passageways 611A, 611B.
• flow ports 630A- 630D are shown. However fewer or more may be used.
• the flow ports 630A-630D connect and provide a flow port between the annular flow channel 633 and the inner recessed portion 628.
• the flow ports 630A-630D intersect an outer wall 636 of the inner recessed portion 628.
• the one or more flow ports 630A-630D pass into the inner recessed portion 628 and are arranged to project gas flow at the outer wall 636 of the inner recessed portion 628.
• the flow ports 630A-630D may be angled so that the gas flow enters into the inner recessed portion 628 in a manner that is substantially tangent to the outer wall 636 of the inner recessed portion 328. In this manner, flow through the flow ports 630A-630D may set up a vortex-like gas flow pattern in the inner recessed portion 628 which produces down force on the substrate 645 (shown dotted in FIG.6A) .
• the body 625 may be received in a cavity of the base 602 and may be in sealed contact with the body, such as by welding, braising, adhesive, fasteners or the like .
• the base 602 may include contact pads 642 for spacing a substrate 645 a suitable distance from the base 602.
• a number of contact pads 642 may comprise three or more and may be coupled to or integral with the base 602 at appropriate locations.
• the contact pad 642 may be of any suitable shape (in top view), such as round, oval, sguare, hexagonal, octagonal or rectangular. Other shapes may be used.
• two contact pads 642 may be spaced apart in a lateral direction, such as on legs 606, 607, and at least one more may be elsewhere provided on the base 602.
• the contact pads 642 provide at least a three-point contact with the substrate 645 thereby providing a gap between the substrate 645 and the top surface of the base 602.
• the gap may be between about 0.5 mm and about 1.5 mm in some embodiments. For example, a gap of less than 0.15 mm, or even less than 0.10 mm, or even less than 0.9 mm may be used. Other gap dimensions may be used.
• the contact pad 342 may have a flat or a domed profile.

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• Engineering & Computer Science (AREA)
• Robotics (AREA)
• Mechanical Engineering (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Manipulator (AREA)

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• 2014
  • 2014-09-25 TW TW103133258A patent/TWI611997B/zh not_active IP Right Cessation
  • 2014-09-25 KR KR1020167010890A patent/KR20160062095A/ko not_active Ceased
  • 2014-09-25 CN CN201480051766.0A patent/CN105556654B/zh not_active Expired - Fee Related
  • 2014-09-25 US US14/496,088 patent/US9202738B2/en active Active
  • 2014-09-25 WO PCT/US2014/057479 patent/WO2015048303A1/en not_active Ceased
  • 2014-09-25 JP JP2016517529A patent/JP6362681B2/ja not_active Expired - Fee Related

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