WO2014027673A1 - Pellicule de blindage em et procédé permettant de couvrir un composant électronique - Google Patents

Pellicule de blindage em et procédé permettant de couvrir un composant électronique Download PDF

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Publication number
WO2014027673A1
WO2014027673A1 PCT/JP2013/071923 JP2013071923W WO2014027673A1 WO 2014027673 A1 WO2014027673 A1 WO 2014027673A1 JP 2013071923 W JP2013071923 W JP 2013071923W WO 2014027673 A1 WO2014027673 A1 WO 2014027673A1
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layer
electromagnetic wave
wave shielding
shielding film
base material
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PCT/JP2013/071923
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English (en)
Japanese (ja)
Inventor
太一 八束
白石　史広
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住友ベークライト株式会社
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Priority to SG11201501162UA priority Critical patent/SG11201501162UA/en
Priority to CN201380043449.XA priority patent/CN104584707A/zh
Priority to KR1020147035705A priority patent/KR101799631B1/ko
Publication of WO2014027673A1 publication Critical patent/WO2014027673A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the present invention relates to an electromagnetic wave shielding film and a method for coating an electronic component.
  • an electromagnetic wave shielding film for example, an electromagnetic wave shielding film having a base material layer made of an insulating material and a metal layer laminated on one or both surfaces of the base material layer has been developed (for example, see Patent Document 1.)
  • Patent Document 1 when the electromagnetic wave shielding film has a metal layer, there has been a problem that it has not been possible to cope with the reduction in weight and thickness that have been increasingly demanded in recent years.
  • An electromagnetic wave shielding film used for covering convex portions on a substrate Comprising a base material layer and an electromagnetic wave shielding layer laminated on one surface side of the base material layer, The electromagnetic wave shielding film, wherein the base material layer has a storage elastic modulus at 150 ° C. of 2.0E + 05 to 5.0E + 08 Pa.
  • the base material layer is a laminate having a three-layer structure in which the first layer, the second layer, and the third layer are laminated in this order from the other surface side (1 ) Or the electromagnetic wave shielding film according to (2).
  • the thickness T (A) of the first layer, the thickness T (B) of the third layer, and the thickness T (C) of the second layer satisfy the following relational expression (I).
  • the electromagnetic wave shielding film according to any one of (3) to (9) above. 0.05 ⁇ T (C) / (T (A) + T (B)) ⁇ 10 (I)
  • the electromagnetic wave shielding layer includes a reflective layer and an absorption layer, and the layers (1) to (11) are laminated bodies laminated in this order from the one surface side of the base material layer.
  • the electromagnetic wave shielding film according to any one of 1).
  • the shape followability when the electromagnetic wave shielding film is thermocompression bonded to the convex portion on the substrate under conditions of a temperature of 150 ° C., a pressure of 2 MPa, and a time of 5 minutes is 500 ⁇ m or more and 3,000 ⁇ m or less.
  • An electronic component coating method comprising: a peeling step of peeling the base material layer from the electromagnetic wave shielding layer after the pasting step.
  • the storage elastic modulus at 150 ° C. of the base material layer included in the electromagnetic wave shielding film is 2.0E + 05 to 5.0E + 08 Pa, thereby increasing the degree of freedom in designing the substrate covered with the electromagnetic wave shielding film.
  • favorable shape followability can be exhibited with respect to the electronic component which has a board
  • FIG. 1 is a longitudinal sectional view showing a first embodiment of an electromagnetic wave shielding film of the present invention.
  • FIG. 2 is a longitudinal sectional view for explaining a method of coating an electronic component using the electromagnetic wave shielding film shown in FIG.
  • FIG. 3 is a longitudinal sectional view showing a second embodiment of the electromagnetic wave shielding film of the present invention.
  • FIG. 4 is a longitudinal sectional view showing a third embodiment of the electromagnetic wave shielding film of the present invention.
  • FIG. 5 is a longitudinal sectional view showing a fourth embodiment of the electromagnetic wave shielding film of the present invention.
  • FIG. 6 is a longitudinal sectional view showing a fifth embodiment of the electromagnetic wave shielding film of the present invention.
  • FIG. 7 is a longitudinal sectional view showing a sixth embodiment of the electromagnetic wave shielding film of the present invention.
  • FIG. 8 is a longitudinal sectional view for explaining a method for coating an electronic component using the electromagnetic wave shielding film shown in FIG.
  • FIG. 9 is a longitudinal sectional view showing a seventh embodiment of the electromagnetic wave shielding film of the present invention.
  • FIG. 10 is a longitudinal sectional view showing an eighth embodiment of the electromagnetic wave shielding film of the present invention.
  • FIG. 11 is a longitudinal sectional view showing a ninth embodiment of the electromagnetic wave shielding film of the present invention.
  • FIG. 12 is a longitudinal sectional view showing a tenth embodiment of the electromagnetic wave shielding film of the present invention.
  • FIG. 13 is a longitudinal sectional view showing an eleventh embodiment of the electromagnetic wave shielding film of the present invention.
  • FIG. 14 is a longitudinal sectional view showing a twelfth embodiment of the electromagnetic wave shielding film of the present invention.
  • the electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film used for covering the convex portions on the substrate.
  • the electromagnetic wave shielding film includes a base material layer and an electromagnetic wave shielding layer laminated on one surface side of the base material layer.
  • the base material layer has a storage elastic modulus at 150 ° C. of 2.0E + 05 to 5.0E + 08 Pa.
  • the method for coating an electronic component of the present invention includes a pasting step in which the electromagnetic wave shielding film is pasted on the substrate so that the electromagnetic wave blocking layer and the electronic component that is a convex portion adhere to each other, and the pasting step And a peeling step of peeling the base material layer from the electromagnetic wave shielding layer.
  • the electromagnetic wave shielding film and the substrate are pressed close to each other while heating the electromagnetic wave shielding film in the attaching step.
  • the base material layer and the electromagnetic wave shielding layer function as a base material having shape followability with respect to the convex portion. From this, the electromagnetic wave shielding layer can be pushed into the concave portion in a state of following the shape of the convex portion. As a result, the substrate provided with the convex portions can be reliably covered with the electromagnetic wave shielding layer. Therefore, the electromagnetic wave shielding property of the substrate provided with the convex portion is improved by the electromagnetic wave shielding layer.
  • FIG. 1 is a longitudinal sectional view showing a first embodiment of an electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 1 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film used for covering the protrusions 61 on the substrate 5.
  • the electromagnetic wave shielding film 100 includes a base material layer 1 and an electromagnetic wave shielding layer 3.
  • the electromagnetic wave shielding layer 3 is laminated on the lower surface (one surface) side of the base material layer 1 in contact with the base material layer 1.
  • the base material layer 1 includes a first layer 11, a second layer 13, and a third layer 12. These are laminated in this order from the upper surface (the other surface) side of the base material layer 1.
  • the electronic component 4 is mounted (placed) on the substrate 5, and the mounting of the electronic component 4 forms a convex portion 61 on the substrate 5 and a concave portion 62 between the convex portions 61.
  • the case where the convex portion 61 is covered with the electromagnetic wave shielding film 100 will be described.
  • Examples of the electronic component 4 mounted on the substrate 5 include an LCD driver IC mounted on a flexible circuit board (FPC), an IC + capacitor around the touch panel, or an electronic circuit board (motherboard).
  • the base material layer 1 pushes (embeds) the electromagnetic wave shielding layer 3 when the convex portion 61 is covered by pushing the electromagnetic wave shielding layer 3 of the electromagnetic wave shielding film 100 into the concave portion 62 on the substrate 5 in the attaching step. ), Which functions as a base material for improving the shape followability to the convex portion 61 of the electromagnetic wave shielding layer 3. Moreover, the base material layer 1 is peeled from the electromagnetic wave shielding layer 3 in a state where the electromagnetic wave shielding layer 3 is pushed into the recess 62 in the peeling step.
  • the storage elastic modulus at 150 ° C. of the base material layer 1 is 2.0E + 05 to 5.0E + 08 Pa.
  • the electromagnetic wave shielding layer 3 can be reliably covered in a state corresponding to the shape of the convex portion 61.
  • the electromagnetic wave shielding (blocking) against the substrate 5 provided with the convex portions 61 by the electromagnetic wave shielding layer 3 is achieved. Will be improved.
  • the height of the convex portion 61 provided on the substrate 5 is 500 ⁇ m or more, and further 1.0 to 3.0 mm. Even if the separation distance (pitch) between the convex portions 61 is as small as 200 ⁇ m or less, and further 100 ⁇ m to 150 ⁇ m, the electromagnetic wave blocking layer 3 is surely formed in the concave portion 62 in a state corresponding to the shape of the convex portion 61. Can be pushed into.
  • the storage elastic modulus at 150 ° C. of the base material layer 1 may be 2.0E + 05 to 5.0E + 08 Pa, but is preferably 1.0E + 06 to 3.0E + 08 Pa, and is preferably 3.0E + 06 to 9.0E + 07 Pa. It is more preferable that Thereby, the said effect can be exhibited more notably.
  • the base material layer 1 preferably has a storage elastic modulus at 25 ° C. of 1.0E + 07 to 1.0E + 10 Pa, and more preferably 5.0E + 08 to 5.0E + 09 Pa.
  • room temperature room temperature
  • the base material layer 1 is not liquid but heated before heating the electromagnetic shielding film 100.
  • the electromagnetic wave shielding film 100 is heated, it can be made semi-solid (gel). Therefore, when the base material layer 1 (electromagnetic wave shielding film 100) is attached to the substrate 5, the base material layer 1 can be attached to the substrate 5 without causing wrinkles or the like.
  • operativity at the time of cutting the electromagnetic wave shielding film 100 to a regular size is also improved.
  • the electromagnetic wave shielding layer 3 can be reliably pushed into the concave portion 62 by the base material layer 1 when being pushed into the concave portion 62 provided on the substrate 5.
  • the base material layer 1 having the characteristics of the storage elastic modulus at least the first layer 11 and the third layer 12 are composed of a thermoplastic resin, and even after the heating of the electromagnetic wave shielding film 100 in the pasting step, The storage elastic modulus at 25 ° C. is preferably maintained within the above range. Thereby, the base material layer 1 can be easily peeled from the electromagnetic wave shielding layer 3 in the peeling step.
  • the storage elastic modulus at 120 ° C. of the base material layer 1 is A [Pa] and the storage elastic modulus at 150 ° C. of the base material layer 1 is B [Pa], 0.02 ⁇ A / B ⁇ 1. It is preferable to satisfy the relationship of 00, and it is more preferable to satisfy the relationship of 0.02 ⁇ A / B ⁇ 0.50. It can be said that the base material layer 1 satisfying such a relationship has a small range of change in the storage elastic modulus of the base material layer 1 due to the temperature change during the heating. Therefore, even if the temperature condition at the time of heating is changed, the range of change in the storage elastic modulus of the base material layer 1 due to this temperature change can be kept to the minimum necessary. Therefore, the electromagnetic wave shielding layer 3 can be more reliably pushed into the recess 62 by the base material layer 1.
  • the storage elastic modulus in 25 degreeC, 120 degreeC, and 150 degreeC of each layer is obtained using the dynamic viscoelasticity measuring apparatus (Seiko Instruments company make, "DMS6100"), for example.
  • the storage elastic modulus of each layer to be measured is measured under the conditions of 25 to 200 ° C., tensile mode with a constant load of 49 mN, a heating rate of 5 ° C./min, and a frequency of 1 Hz.
  • the storage elastic modulus at 25 ° C., 120 ° C. and 150 ° C. in the dynamic viscoelasticity measuring device is read. Thereby, a storage elastic modulus can be calculated
  • the base material layer 1 is composed of a first layer 11, a second layer 13, and a third layer 12.
  • the base material layer 1 is laminated in this order from the upper surface (the other surface) side of the base material layer 1.
  • the types, thicknesses, and the like of these layers 11 to 13 are appropriately combined so that the characteristics of the base material layer 1 described above are exhibited.
  • the first layer 11 releases the pressing portion of the vacuum pressurizing laminator or the like.
  • the first layer 11 has a function of applying a pressing force from the pressing portion to the second layer 13 side.
  • the constituent material of the first layer (first release layer) 11 is not particularly limited.
  • a resin such as syndiotactic polystyrene, polymethylpentene, polybutylene terephthalate, polypropylene, cyclic olefin polymer, and silicone. Materials and the like. Among these, it is preferable to use syndiotactic polystyrene.
  • polystyrene having a syndiotactic structure as polystyrene, polystyrene comes to have crystallinity. Due to this, it is possible to make the first layer 11 excellent in releasability from the device, and further in heat resistance and shape followability.
  • the content thereof is not particularly limited, but is preferably 60% by weight or more, more preferably 70% by weight or more and 95% by weight or less. Further, it is preferably 80% by weight or more and 90% by weight or less.
  • content of syndiotactic polystyrene is less than the said lower limit, there exists a possibility that the releasability of the 1st layer 11 may fall.
  • content of syndiotactic polystyrene exceeds the said upper limit, there exists a possibility that the shape followable
  • the first layer 11 may be composed of only syndiotactic polystyrene.
  • the first layer 11 may further contain a styrene elastomer, polyethylene, polypropylene, or the like in addition to the syndiotactic polystyrene.
  • the thickness T (A) of the first layer 11 is not particularly limited, but is preferably 5 ⁇ m or more and 100 ⁇ m or less, more preferably 10 ⁇ m or more and 70 ⁇ m or less, and further preferably 20 ⁇ m or more and 50 ⁇ m or less. is there.
  • the thickness of the 1st layer 11 is less than the said lower limit, the 1st layer 11 may fracture
  • the thickness of the 1st layer 11 exceeds the said upper limit, the shape followability of the base material layer 1 may fall, and there exists a possibility that the shape followability of the electromagnetic wave shielding layer 3 may fall.
  • the average linear expansion coefficient of the first layer 11 at 25 to 150 ° C. is preferably 40 to 1000 [ppm / ° C.], and more preferably 80 to 700 [ppm / ° C.].
  • the first layer 11 has excellent stretchability when the electromagnetic wave shielding film 100 is heated. Therefore, the shape followability with respect to the convex portion 61 of the electromagnetic wave shielding layer 3 can be improved more reliably.
  • the average linear expansion coefficient of each layer is obtained using, for example, a thermomechanical analyzer (“TMASS6100” manufactured by Seiko Instruments Inc.). Specifically, the storage elastic modulus of each layer to be measured is measured at 25 to 200 ° C. under the condition of a constant load of 49 mN and a heating rate of 5 ° C./min. The average linear expansion coefficient at 25 ° C. to 150 ° C. in the thermomechanical analyzer at this time is read. Thereby, an average linear expansion coefficient can be calculated
  • the surface tension of the first layer 11 is preferably 20 to 40 [mN / m], and more preferably 25 to 35 [mN / m].
  • the first layer 11 having a surface tension within such a range has excellent releasability.
  • the 1st layer 11 can be peeled from a press part after the indentation process using a vacuum pressurization type laminator.
  • the third layer 12 is formed by pressing the electromagnetic wave shielding layer 3 into the concave portion 62 on the substrate 5 using a vacuum pressurizing laminator or the like in the attaching step, and then removing the base material layer 1 from the electromagnetic wave shielding layer in the peeling step.
  • the base layer 1 has a function of imparting peelability.
  • the third layer 12 has a follow-up function to follow in accordance with the shape of the convex portion 61 on the substrate 5 and applies a pressing force from the pressing portion to the electromagnetic wave shielding layer 3 side. It has both functions.
  • the constituent material of the third layer (second release layer) 12 is not particularly limited.
  • syndiotactic polystyrene polymethylpentene, polybutylene terephthalate, polypropylene, cyclic olefin polymer, resin such as silicone Materials.
  • polystyrene is provided with crystallinity by using polystyrene having a syndiotactic structure as polystyrene. Due to this, it is possible to make the third layer 12 excellent in releasability from the electromagnetic wave shielding layer 3, and further in heat resistance and shape followability.
  • the content of the syndiotactic polystyrene in the third layer 12 is not particularly limited and may be composed only of syndiotactic polystyrene, but is preferably 60% by weight or more, and 70% by weight or more. 95% by weight or less, more preferably 80% by weight or more and 90% by weight or less.
  • content of syndiotactic polystyrene is less than the said lower limit, there exists a possibility that the mold release property of the 3rd layer 12 may fall.
  • content of syndiotactic polystyrene exceeds the said upper limit there exists a possibility that the shape followable
  • the third layer 12 may further contain a styrenic elastomer, polyethylene, polypropylene, or the like in addition to the syndiotactic polystyrene. Further, the resin constituting the third layer 12 and the first layer 11 may be the same or different.
  • the thickness T (B) of the third layer 12 is not particularly limited, but is preferably 5 ⁇ m or more and 100 ⁇ m or less, more preferably 10 ⁇ m or more and 70 ⁇ m or less, and further preferably 20 ⁇ m or more and 50 ⁇ m or less. is there.
  • the thickness of the third layer 12 is less than the lower limit, the heat resistance is lowered, the heat resistance of the base material layer is lowered in the thermocompression bonding step, the deformation occurs, and the electromagnetic wave shielding layer may be deformed. .
  • the thickness of the 3rd layer 12 exceeds the said upper limit, the total thickness of the whole film for electromagnetic wave shields becomes thick, and there exists a possibility that workability
  • the thickness of the third layer 12 and the first layer 11 may be the same or different.
  • the average linear expansion coefficient of the third layer 12 at 25 to 150 ° C. is preferably 40 to 1000 [ppm / ° C.], and more preferably 80 to 700 [ppm / ° C.].
  • the third layer 12 has excellent stretchability when the electromagnetic wave shielding film 100 is heated. Therefore, the shape followability to the convex part 61 of the 3rd layer 12, and also the electromagnetic wave shielding layer 3 can be improved more reliably.
  • the surface tension of the third layer 12 is preferably 20 to 40 [mN / m], and more preferably 25 to 35 [mN / m].
  • the third layer 12 having a surface tension within such a range has an excellent releasability.
  • the base material layer 1 is peeled from the electromagnetic wave shielding layer 3 after the indentation process using a vacuum pressurizing laminator or the like, the base material layer 1 is formed at the interface between the third layer 12 and the electromagnetic wave shielding layer 3. It can be surely peeled off.
  • the second layer 13 When the electromagnetic wave shielding layer 3 is pushed into the concave portion 62 on the substrate 5 using the base material layer 1 as a pushing base material, the second layer 13 is formed into the concave portion in the attaching step. Cushion function for pushing (embedding) 62. Further, the second layer 13 has a function of uniformly imparting this pushing force to the third layer 12 and further to the electromagnetic wave shielding layer 3 via the third layer 12. Thereby, the electromagnetic wave shielding layer 3 can be pushed into the concave portion 62 with excellent sealing properties without generating a void between the electromagnetic wave shielding layer 3 and the concave portion 62 and the convex portion 61.
  • an ⁇ -olefin polymer such as polyethylene or polypropylene, ethylene, propylene, butene, pentene, hexene, methylpentene, or the like is included as a copolymer component.
  • Engineering plastics resins such as ⁇ -olefin copolymer, polyethersulfone, polyphenylene sulfide and the like may be used, and these may be used alone or in combination. Among these, it is preferable to use an ⁇ -olefin copolymer.
  • a copolymer of ⁇ -olefin such as ethylene and (meth) acrylic acid ester, a copolymer of ethylene and vinyl acetate, a copolymer of ethylene and (meth) acrylic acid (EMMA), And a partial ion cross-linked product thereof.
  • the ⁇ -olefin-based copolymer is excellent in shape followability and further excellent in flexibility as compared with the constituent material of the third layer 12. From this, the cushion function for pushing (embedding) the 3rd layer 12 with respect to the recessed part 62 can be reliably provided to the 2nd layer 13 comprised with such a constituent material.
  • the thickness T (C) of the second layer 13 is not particularly limited, but is preferably 10 ⁇ m or more and 100 ⁇ m or less, more preferably 20 ⁇ m or more and 80 ⁇ m or less, and further preferably 30 ⁇ m or more and 60 ⁇ m or less. is there.
  • the thickness of the 2nd layer 13 is less than the said lower limit, there exists a possibility that the shape followable
  • the thickness of the second layer 13 exceeds the upper limit, in the thermocompression bonding step, resin stain from the second layer 13 increases, and it adheres to the heating platen of the crimping apparatus, thereby improving workability. May decrease.
  • the average linear expansion coefficient at 25 to 150 ° C. of the second layer 13 is preferably 400 or more [ppm / ° C.], more preferably 800 or more [ppm / ° C.].
  • the second layer 13 is more elastic than the third layer 12 when the electromagnetic wave shielding film 100 is heated. Has the property easily. Therefore, the shape followability of the second layer 13 and the electromagnetic wave shielding layer 3 with respect to the unevenness 6 can be improved more reliably.
  • the storage modulus at 150 ° C. of the base material layer 1 can be easily within the range of 2.0E + 05 to 5.0E + 08 Pa by appropriately setting the average linear expansion coefficient of each layer 11 to 13 within the above-mentioned range. Can be set to
  • the thickness T (A) of the first layer 11, the thickness T (B) of the third layer 12, and the thickness T (C) of the second layer 13 satisfy the following relational expression, for example.
  • 0.05 ⁇ T (C) / (T (A) + T (B)) ⁇ 10
  • the following relational expression is satisfied: 0.14 ⁇ T (C) / (T (A) + T (B)) ⁇ 4
  • the following relational expression is satisfied: 0.3 ⁇ T (C) / (T (A) + T (B)) ⁇ 1.5.
  • the shape follows. More improved.
  • the total thickness T (F) of the base material layer 1 is not particularly limited, but is preferably 20 ⁇ m or more and 300 ⁇ m or less, more preferably 40 ⁇ m or more and 220 ⁇ m or less, and further preferably 70 ⁇ m or more and 160 ⁇ m or less. It is.
  • the 1st layer 11 may fracture
  • the whole thickness of the base material layer 1 exceeds the said upper limit, there exists a possibility that the shape followability of the base material layer 1 may fall and the shape followability of the electromagnetic wave shielding layer 3 may fall.
  • Electromagnetic wave blocking layer 3 Next, the electromagnetic wave blocking layer (blocking layer) 3 will be described.
  • the electromagnetic wave shielding layer 3 includes an electronic component 4 (convex portion 61) provided on the substrate 5, and other electronic components located on the opposite side of the substrate 5 (electronic component 4) via the electromagnetic wave shielding layer 3. And has a function of shielding (shielding) electromagnetic waves generated from at least one of the above.
  • the electromagnetic wave shielding layer 3 is not particularly limited, and may be any type of electromagnetic wave shielding material.
  • a reflection layer that shields (shields) the electromagnetic wave incident on the electromagnetic wave shielding layer 3 by reflecting the electromagnetic wave
  • an absorption layer that blocks (shields) the electromagnetic wave incident on the electromagnetic wave blocking layer 3 by absorbing the electromagnetic wave.
  • the reflection layer blocks the electromagnetic wave incident on the reflection layer by reflecting it.
  • the reflective layer examples include a conductive adhesive layer, a metal thin film layer, a metal mesh, a layer subjected to surface treatment of a conductive material such as ITO, and the like. These may be used alone or in combination. Among these, it is preferable to use a conductive adhesive layer.
  • the conductive adhesive layer is preferably used as a reflective layer because it exhibits excellent electromagnetic shielding properties even when its film thickness (thickness) is set to be relatively thin.
  • the conductive adhesive layer includes metal powder and a binder resin.
  • the metal powder include gold, silver, copper, silver-coated copper, and nickel. Among these, it is preferable to use silver because it has excellent electromagnetic shielding properties.
  • the content ratio of the metal powder and the binder resin in the conductive adhesive layer is not particularly limited, but is preferably 40:60 to 90:10, and preferably 50:50 to 80:20 by weight. More preferably, it is preferably 55:45 to 70:30.
  • the content ratio of the metal powder and the binder resin is less than the lower limit, it may be difficult to develop conductivity.
  • the content ratio of metal powder and binder resin exceeds the said upper limit, there exists a possibility that flexibility and adhesiveness with an electronic device component may fall.
  • the conductive adhesive layer may further contain a flame retardant, a leveling agent, a viscosity modifier and the like in addition to the metal powder and the binder resin.
  • the thickness T (E1) of the reflective layer is not particularly limited, but is preferably 5 ⁇ m or more and 100 ⁇ m or less, more preferably 8 ⁇ m or more and 50 ⁇ m or less, and further preferably 10 ⁇ m or more and 30 ⁇ m or less.
  • the thickness of the reflective layer is less than the lower limit value, depending on the constituent material of the reflective layer, the goblet folding resistance may be reduced, and the mounted component may be broken at the end.
  • the thickness of the reflective layer exceeds the upper limit, the shape following property may be lowered depending on the constituent material of the reflective layer.
  • the thickness T (E1) of the reflective layer is set within such a range, excellent electromagnetic shielding properties can be exhibited. Therefore, it is possible to reduce the thickness of the reflective layer T (E1), and thus to reduce the weight of the substrate 5 on which the electronic component 4 covered with the electromagnetic wave shielding layer (reflective layer) 3 is mounted. .
  • the absorbing layer absorbs the electromagnetic wave incident on the absorbing layer and converts the electromagnetic wave energy into thermal energy, thereby blocking the electromagnetic wave.
  • a conductive absorption layer composed mainly of a conductive absorption material such as metal powder and a conductive polymer material, and a dielectric absorption material such as a carbon-based material and a conductive polymer material as a main material.
  • a dielectric absorption layer a magnetic absorption layer composed mainly of a magnetic absorption material such as a soft magnetic metal, and these may be used alone or in combination.
  • the conductive absorption layer absorbs electromagnetic waves by converting electromagnetic energy into heat energy by a current flowing inside the material when an electric field is applied.
  • a dielectric absorption layer absorbs electromagnetic waves by converting the energy of electromagnetic waves into thermal energy by dielectric loss.
  • the magnetic absorption layer absorbs electromagnetic waves by converting and consuming radio wave energy into heat due to magnetic losses such as overcurrent loss, hysteresis loss, and magnetic resonance.
  • the film thickness is set to be relatively thin, the dielectric absorption layer and the conductive absorption layer exhibit particularly excellent electromagnetic wave shielding properties. Therefore, it is preferably used as an absorption layer.
  • the particle size of the material contained in the layer is small and the amount of addition can be reduced, the film thickness can be set relatively easily and the weight can be reduced.
  • examples of the conductive absorbing material include conductive polymers, metal oxides such as ATO, and conductive ceramics.
  • Examples of the conductive polymer include polyacetylene, polypyrrole, PEDOT (poly-ethylenedithiothiophene), PEDOT / PSS, polythiophene, polyaniline, poly (p-phenylene), polyfluorene, polycarbazole, polysilane, and derivatives thereof. 1 type or 2 types or more of these can be used in combination.
  • Examples of the dielectric absorbing material include carbon-based materials and conductive polymers.
  • Examples of carbon-based materials include carbon nanotubes such as single-walled carbon nanotubes and multi-walled carbon nanotubes, carbon nanofibers, CN nanotubes, CN nanofibers, BCN nanotubes, BCN nanofibers, graphene, carbon microcoils, carbon Examples thereof include carbon such as nanocoil, carbon nanohorn, and carbon nanowall, and one or more of these can be used in combination.
  • examples of the magnetic absorption material include iron, silicon steel, magnetic stainless steel (Fe—Cr—Al—Si alloy), sendust (Fe—Si—Al alloy), permalloy (Fe—Ni alloy), silicon copper (Fe -Cu-Si alloy), Fe-Si alloy, soft magnetic metal such as Fe-Si-B (-Cu-Nb) alloy, ferrite and the like.
  • the thickness T (E2) of the absorbing layer is not particularly limited, but is preferably 1 ⁇ m or more and 100 ⁇ m or less, more preferably 2 ⁇ m or more and 80 ⁇ m or less, and further preferably 3 ⁇ m or more and 50 ⁇ m or less.
  • the thickness of the absorbent layer is less than the lower limit, depending on the constituent material of the absorbent layer, the board-mounted component may be broken at the end.
  • the thickness of an absorption layer exceeds the said upper limit, there exists a possibility that shape followability may fall depending on the constituent material etc. of an absorption layer.
  • the thickness T (E2) of the absorption layer is set within such a range, excellent electromagnetic shielding properties can be exhibited. Therefore, it is possible to reduce the thickness T (E2) of the absorption layer and to reduce the weight of the substrate 5 on which the electronic component 4 covered with the electromagnetic wave blocking layer (absorption layer) 3 is mounted. .
  • the electromagnetic wave shielding layer 3 as described above preferably has an electromagnetic wave shielding property for shielding (shielding) an electromagnetic wave of 5 dB or more, more preferably 30 dB or more, and further preferably 50 dB or more.
  • the electromagnetic wave shielding layer 3 having such an electromagnetic wave shielding property has an excellent electromagnetic wave shielding property, and can more reliably block electromagnetic waves.
  • the electromagnetic wave shielding layer 3 preferably has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa, and more preferably 5.0E + 05 to 5.0E + 08 Pa.
  • the electromagnetic wave shielding layer 3 is formed in the recess 62 on the substrate 5 by the pressing force from the base material layer 1 after the heating of the electromagnetic wave shielding film 100 in the attaching step.
  • the electromagnetic wave shielding layer 3 can be deformed corresponding to the shape of the convex portion 61 according to the pressing force from the base material layer 1 when the convex portion 61 is covered by pushing. That is, the shape followability with respect to the convex portion 61 of the electromagnetic wave shielding layer 3 can be improved.
  • the electromagnetic wave shielding layer 3 may be either a reflective layer or an absorbing layer, but is preferably an absorbing layer when they have substantially the same electromagnetic shielding properties.
  • the electromagnetic wave incident on the absorption layer is absorbed, and the electromagnetic wave is blocked by converting the electromagnetic wave energy into thermal energy. Therefore, the electromagnetic wave disappears due to this absorption, so that it is ensured that the reflected electromagnetic wave, such as the reflection layer, has an adverse effect such as malfunction on other members not covered with the electromagnetic wave blocking layer 3. Can be prevented.
  • the electromagnetic wave shielding film 100 having the above configuration is heated on the concave portion 62 and the convex portion 61 formed by mounting the electronic component 4 on the substrate 5 under conditions of a temperature of 150 ° C., a pressure of 2 MPa, and a time of 5 minutes.
  • the shape following property of the electromagnetic wave shielding film 100 is preferably 500 ⁇ m or more, more preferably 800 ⁇ m or more, and still more preferably 1000 ⁇ m or more.
  • the difference between the top surface of the convex portion 61 and the bottom surface of the concave portion 62, that is, the convex portion 61 having a height of 500 ⁇ m or more can be covered with the electromagnetic wave shielding film 100, and the convex portion 61 having a height of 800 ⁇ m or more More preferably, the convex portion 61 having a height of 1000 ⁇ m or more can be covered.
  • the electromagnetic wave shielding film 100 that can cover the convex portion 61 (having a large step) having a high height has excellent shape followability.
  • the convex portion 61 can be covered with the electromagnetic wave shielding layer 3 with an excellent filling rate with respect to the concave portion 62.
  • the shape following property can be obtained as follows. That is, first, a printed wiring board (motherboard) having a length of 100 mm, a width of 100 mm, and a height of 2 mm is formed by forming grooves having a width of 0.2 mm and predetermined steps in a grid pattern at intervals of 0.2 mm. Get the substrate. Then, the film for electromagnetic wave shielding is pressure-bonded to the printed wiring board under a condition of 150 ° C. ⁇ 2 MPa ⁇ 5 minutes using a vacuum pressurizing laminator, and attached to the printed wiring board. After pasting, the base material layer is peeled from the electromagnetic wave shielding film. Next, it is determined whether or not there is a gap between the blocking layer attached to the printed wiring board and the groove on the printed wiring board. In addition, it observed and evaluated with the microscope and the microscope whether there was a space
  • the electromagnetic wave shielding film is attached to the substrate so that the electromagnetic wave shielding layer and the electronic component are adhered to each other, and the base material layer is attached after the attaching step. And a peeling step for peeling from the electromagnetic wave shielding layer.
  • FIG. 2 is a longitudinal sectional view for explaining a method of coating an electronic component using the electromagnetic wave shielding film shown in FIG.
  • the affixing step is a step of affixing the electromagnetic wave shielding film 100 to the substrate 5 so as to cover the convex portions 61 provided on the substrate 5 as shown in FIG.
  • the method of attaching is not particularly limited, and examples thereof include a vacuum / pressure forming method.
  • the vacuum / pressure forming method is a method of covering the convex portion 61 on the substrate 5 with the electromagnetic wave shielding film 100 using, for example, a vacuum pressurizing laminator.
  • a vacuum pressurizing laminator First, in the closed space that can be set to a vacuum atmosphere, the surface of the substrate 5 on which the convex portion 61 is formed and the surface of the electromagnetic wave shielding film 100 on the electromagnetic wave shielding layer 3 side face each other. And the electromagnetic wave shielding film 100 are set in a superposed state. Thereafter, under heating, the closed space is brought into a vacuum atmosphere so that the electromagnetic wave shielding film 100 is made to approach the substrate 5 uniformly from the electromagnetic wave shielding film 100 side. Thereafter, they are pressurized. Thereby, the vacuum / pressure forming method is carried out.
  • the storage elastic modulus at 150 ° C. of the base material layer 1 is 2.0E + 05 to 2.0E + 08 Pa. Therefore, the base material layer 1 exhibits excellent shape followability with respect to the protrusion 61 when heated by the vacuum / pressure forming method.
  • the base layer 1 corresponds to the shape of the convex portion 61 by uniformly pressing the electromagnetic wave shielding film 100 from the electromagnetic wave shielding film 100 side and making the closed space under a vacuum atmosphere. And deform. Further, in conjunction with this deformation, the electromagnetic wave shielding layer 3 located closer to the substrate 5 than the base material layer 1 is deformed corresponding to the shape of the convex portion 61. Accordingly, the convex portion 61 is covered with the electromagnetic wave blocking layer 3 in a state where the electromagnetic wave blocking layer 3 is pushed into the concave portion 62 corresponding to the shape of the convex portion 61.
  • the temperature for pasting is not particularly limited, but is preferably 100 ° C. or higher and 200 ° C. or lower, more preferably 120 ° C. or higher and 180 ° C. or lower.
  • the pressure to be applied is not particularly limited, but is preferably 0.5 MPa or more and 5.0 MPa or less, more preferably 1.0 MPa or more and 3.0 MPa or less.
  • the sticking time is not particularly limited, but is preferably 1 minute or more and 30 minutes or less, more preferably 5 minutes or more and 15 minutes or less.
  • the electromagnetic wave shielding layer 3 can be reliably covered with the electromagnetic wave shielding layer 3 while the electromagnetic wave shielding layer 3 is pushed into the concave part 62 on the substrate 5. .
  • the said peeling process is a process of peeling the base material layer 1 from the film 100 for electromagnetic wave shields after the said sticking process, for example, as shown in FIG.2 (b).
  • peeling occurs at the interface between the base material layer 1 and the electromagnetic wave shielding layer 3 in the electromagnetic wave shielding film 100, and as a result, the base material layer 1 is peeled from the electromagnetic wave shielding layer 3. .
  • the convex portion 61 is covered with the electromagnetic wave shielding layer 3 in a state where the base material layer 1 is peeled from the electromagnetic wave shielding layer 3.
  • the convex part 61 corresponds to the shape of the electromagnetic wave shielding film 100 to be attached. Can be covered with the electromagnetic wave shielding layer 3. Therefore, by appropriately setting the shape of the electromagnetic wave shielding film 100 corresponding to the shape of the convex portion 61 to be covered, the convex portion 61 to be covered can be selectively covered with the electromagnetic wave shielding layer 3. That is, the electromagnetic wave shielding layer 3 can selectively shield the convex portion 61 from electromagnetic waves.
  • the method for peeling the base material layer 1 is not particularly limited, but the base material layer 1 is stretched when the electromagnetic wave shielding film 100 after the completion of the vacuum / pressure forming method (the pasting step) is at a high temperature. As a result, a resin residue or the like is generated, and the peeling workability may be lowered.
  • the base material layer 1 is gripped. Next, the base material layer 1 is peeled off from the electromagnetic wave shielding layer 3 with the gripped end as a starting point. Next, the base material layer 1 is sequentially peeled off from the electromagnetic wave shielding layer 3 from this end portion to the central portion of the base material layer 1 and further to the other end portion of the base material layer 1. By doing so, the base material layer 1 is peeled from the electromagnetic wave shielding layer 3.
  • the peeling temperature is preferably 180 ° C. or lower, more preferably 150 ° C. or lower, and further preferably 100 ° C. or lower.
  • the convex part 61 can be coat
  • the base material layer 1 first layer 11, second layer 13, third layer 12
  • electromagnetic wave shielding layer 3 are laminated in this order.
  • the case where the convex portion 61 on the substrate 5 is covered with the electromagnetic wave shielding layer 3 using the electromagnetic wave shielding film 100 has been described.
  • the layer configuration of the electromagnetic wave shielding film 100 is not limited to such a case.
  • the electromagnetic wave shielding film 100 has a layer configuration as shown in the second to twelfth embodiments as described below. Also good.
  • FIG. 3 is a longitudinal sectional view showing a second embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 3 is referred to as “upper” and the lower side is referred to as “lower”.
  • 3 is the same as the electromagnetic wave shielding film 100 shown in FIG. 1 except that the formation of the first layer 11 included in the base material layer 1 is omitted.
  • the electromagnetic wave shielding film 100 is a laminate in which the base material layer 1 composed of the second layer 13 and the third layer 12 and the electromagnetic wave shielding layer 3 are laminated in this order. Yes.
  • the pressing portion of the vacuum pressurizing laminator or the like used when the electromagnetic wave shielding layer 3 is pushed into the concave portion 62 on the substrate 5 in the attaching step is separated from the second layer 13. It has moldability, whereby the formation of the first layer 11 is omitted.
  • the degree of releasability of the contact surface in contact with the second layer 13 of the pressing portion can be expressed by the surface tension of the contact surface.
  • the surface tension of the contact surface is preferably 20 to 40 mN / m, and more preferably 25 to 35 mN / m.
  • the pressing portion can be reliably peeled from the second layer 13 after the pressing process using a vacuum pressurizing laminator or the like.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained.
  • FIG. 4 is a longitudinal sectional view showing a third embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 4 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 is a laminated body in which the base material layer 1 including the first layer 11 and the second layer 13 and the electromagnetic wave shielding layer 3 are laminated in this order. ing.
  • the electromagnetic wave shielding film 100 having such a configuration, when the base material layer 1 is peeled from the electromagnetic wave shielding layer 3 in the peeling step, the base material layer 1 is shielded from electromagnetic waves at the interface between the second layer 13 and the electromagnetic wave shielding layer 3. Peel from layer 3. In such peeling, the electromagnetic wave shielding layer 3 has releasability from the second layer 13, thereby omitting the formation of the third layer 12.
  • the degree of releasability of the contact surface in contact with the second layer 13 of the electromagnetic wave shielding layer 3 can be expressed by the surface tension of the contact surface.
  • the surface tension of the contact surface is preferably 20 to 40 mN / m, and more preferably 25 to 35 mN / m.
  • the contact surface has a surface tension within such a range, the second layer 13 can be reliably peeled from the electromagnetic wave shielding layer 3 after the pressing process using a vacuum pressurizing laminator or the like.
  • Examples of such an electromagnetic wave shielding layer 3 having surface tension include a resin in which a conductive polymer or a carbon-based material is dispersed in a thermosetting resin such as polyurethane.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained.
  • FIG. 5 is a longitudinal sectional view showing a fourth embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 5 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding layer 3 is not a single layer structure but a laminated body composed of an absorption layer 31 and a reflective layer 32, which are the lower surface (one surface) of the base material layer 1. It is the same as that of the electromagnetic wave shielding film 100 shown in FIG. 1 except that the layers are laminated in that order from the side and the absorbing layer 31 is in contact with the base material layer 1 (third layer 12).
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11, the second layer 13, and the third layer 12, and the blocking layer including the absorption layer 31 and the reflection layer 32.
  • 3 is a laminated body laminated in this order.
  • the absorbing layer 31 is formed on the reflective layer 32 with respect to the convex portion 61.
  • the convex portion 61 is covered with the electromagnetic wave shielding layer 3 in a state where the reflective layer 32 is disposed on the side in contact with the convex portion 61.
  • the shielding layer 3 is composed of a laminated body including the absorption layer 31 and the reflective layer 32, the electromagnetic wave shielding property by the electromagnetic wave shielding layer 3 can be further improved.
  • the absorption layer 31 preferably has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa, more preferably 5.0E + 05 to 5.0E + 08 Pa. .
  • the reflective elastic layer 32 preferably has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa, more preferably 5.0E + 05 to 5.0E + 08 Pa.
  • the electromagnetic wave shielding layer 3 including the reflective layer 32 can be more reliably deformed corresponding to the shape of the convex portion 61.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained.
  • FIG. 6 is a longitudinal sectional view showing a fifth embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 6 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding layer 3 is not a single layer structure but a laminated body composed of a reflective layer 32 and an absorbing layer 31, and these are the lower surface (one surface) of the base material layer 1. It is the same as that of the electromagnetic wave shielding film 100 shown in FIG. 1 except that the layers are laminated in that order from the side and the reflective layer 32 is in contact with the base material layer 1 (third layer 12).
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11, the second layer 13, and the third layer 12, and the blocking layer including the reflection layer 32 and the absorption layer 31.
  • 3 is a laminated body laminated in this order.
  • the convex portion 61 on the substrate 5 With the electromagnetic wave shielding film 100 including the blocking layer 3, which is configured by such a laminate, the reflective layer 32 of the absorbing layer 31 is made to the convex portion 61.
  • the convex portion 61 is covered with the electromagnetic wave blocking layer 3 in a state where the absorption layer 31 is disposed on the side in contact with the convex portion 61.
  • the shielding layer 3 is composed of a laminate composed of the reflective layer 32 and the absorbing layer 31, the electromagnetic wave shielding property by the electromagnetic wave shielding layer 3 can be further improved.
  • the reflective layer 32 preferably has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa, more preferably 5.0E + 05 to 5.0E + 08 Pa.
  • the storage layer 31 preferably has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa, and more preferably 5.0E + 05 to 5.0E + 08 Pa.
  • the reflecting layer 32 and the reflecting layer 32 and the absorbing layer 31 are set according to the pressing force from the base material layer 1.
  • the blocking layer 3 including the absorption layer 31 can be more reliably deformed corresponding to the shape of the convex portion 61.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained.
  • the electromagnetic wave shielding film 100 of the fourth embodiment and the electromagnetic wave shielding film 100 of the fifth embodiment are different except that the order of lamination of the reflective layer 32 and the absorbing layer 31 of the blocking layer 3 is different. Are identical to each other.
  • the absorption layer 31 absorbs the electromagnetic wave incident on the absorption layer 31 and blocks the electromagnetic wave, so that the electromagnetic wave disappears due to this absorption. From this, the electromagnetic wave shielding film 100 of the fourth embodiment reliably prevents the electromagnetic wave reflected by the reflective layer 32 from adversely affecting other members not covered by the blocking layer 3.
  • the absorbing layer 31 is the electromagnetic wave shielding film 100 of the fourth embodiment positioned on the opposite side of the reflective layer 32 with respect to the convex portion 61. Is preferred.
  • the blocking layer 3 includes one reflection layer 32 and one absorption layer 31 each. It was set as the laminated body of.
  • the blocking layer 3 is not limited to such a two-layer structure, and is formed of a three-layer structure including at least one of the reflective layer 32 and the absorption layer 31. It may be.
  • FIG. 7 is a longitudinal sectional view showing a sixth embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 7 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 shown in FIG. 7 is the same as the electromagnetic wave shielding film 100 shown in FIG. 1 except that the insulating layer 2 is formed between the base material layer 1 and the electromagnetic wave shielding layer 3. .
  • the electromagnetic wave shielding film 100 includes the base material layer 1, the insulating layer 2, and the electromagnetic wave shielding layer 3.
  • the insulating layer 2 and the electromagnetic wave shielding layer 3 are laminated in this order from the lower surface (one surface) side of the base material layer 1, and the insulating layer 2 is in contact with the base material layer 1.
  • the storage elastic modulus of the base material layer 1 at 150 ° C. may be 2.0E + 05 to 2.0E + 08 Pa, but is preferably 1.0E + 06 to 1.0E + 08 Pa, and preferably 3.0E + 06 to 6.0E + 07 Pa. It is more preferable that Thereby, the said effect can be exhibited more notably.
  • the average linear expansion coefficient of the first layer 11 at 25 to 150 ° C. is preferably 50 to 1000 [ppm / ° C.], more preferably 100 to 700 [ppm / ° C.].
  • the first layer 11 has excellent stretchability when the electromagnetic wave shielding film 100 is heated.
  • the shape followability with respect to the convex part 61 of the layer 3 and the insulating layer 2 can be improved more reliably.
  • the average linear expansion coefficient of the third layer 12 at 25 to 150 ° C. is preferably 50 to 1000 [ppm / ° C.], and more preferably 100 to 700 [ppm / ° C.].
  • the third layer 12 has excellent stretchability when the electromagnetic wave shielding film 100 is heated. It is possible to more reliably improve the shape followability of the layer 12 and the electromagnetic wave shielding layer 3 and the convex portion 61 of the insulating layer 2.
  • the average linear expansion coefficient at 25 to 150 ° C. of the second layer 13 is preferably 500 or more [ppm / ° C.], more preferably 1000 or more [ppm / ° C.].
  • the second layer 13 is more elastic than the third layer 12 when the electromagnetic wave shielding film 100 is heated. Has the property easily. Therefore, the shape followability of the second layer 13 and further the electromagnetic wave shielding layer 3 and the convex portion 61 of the insulating layer 2 can be improved more reliably.
  • the storage modulus at 150 ° C. of the base material layer 1 can be easily within the range of 2.0E + 05 to 2.0E + 08 Pa by appropriately setting the average linear expansion coefficient of each layer 11 to 13 within the above-mentioned range. Can be set to
  • the insulating layer 2 is provided in contact with the base material layer 1 (third layer 12).
  • the insulating layer 2 and the electromagnetic wave shielding layer 3 are laminated in this order from the base material layer 1 side.
  • the electromagnetic wave shielding layer 3 comes into contact with the substrate 5 and the electronic component 4 by covering the convex portion 61 on the substrate 5 using the electromagnetic wave shielding film 100 including the insulating layer 2 and the electromagnetic wave shielding layer 3 laminated in this manner.
  • the electronic component 4 is coated in the order of the electromagnetic wave shielding layer 3 and the insulating layer 2 from the substrate 5 side.
  • the insulating layer 2 covers the substrate 5 and the electronic component 4 via the electromagnetic wave shielding layer 3.
  • substrate 5, the electronic component 4, and the electromagnetic wave shielding layer 3 are insulated from the other members (electronic components etc.) located in the opposite side to the board
  • the insulating layer 2 examples include a thermosetting insulating resin or a thermoplastic insulating resin (insulating film). Among these, it is preferable to use an insulating resin having thermoplasticity.
  • An insulating resin having thermoplasticity is a film having excellent flexibility. Therefore, in the pasting step, when the base layer 1 is used as a base for pressing into the recess 62 and the insulating layer 2 and the electromagnetic wave shielding layer 3 are pressed into the recess 62 on the substrate 5, the insulating layer 2 can be made to follow reliably corresponding to the shape of the convex part 61.
  • an insulating resin having thermoplasticity is particularly useful when repairing a substrate because it can be re-peeled from the substrate to be bonded when heated to its softening point temperature.
  • thermoplastic polyester examples include thermoplastic polyester, ⁇ -olefin, vinyl acetate, polyvinyl acetal, ethylene vinyl acetate, vinyl chloride, acrylic, polyamide, and cellulose.
  • thermoplastic polyesters and ⁇ -olefins because they have excellent adhesion to the substrate, flexibility and chemical resistance.
  • the insulating resin having thermoplasticity is a phenolic resin, a silicone resin, a urea resin, an acrylic resin, a polyester resin, a polyamide resin, as long as the performance such as heat resistance and flex resistance is not impaired.
  • a polyimide resin or the like can be contained.
  • a silane coupling agent, an antioxidant, a pigment, a dye, as long as the adhesiveness and solder reflow resistance are not reduced. You may add tackifying resin, a plasticizer, a ultraviolet absorber, an antifoamer, a leveling regulator, a filler, a flame retardant, etc.
  • the thickness T (D) of the insulating layer 2 is not particularly limited, but is preferably 3 ⁇ m or more and 50 ⁇ m or less, more preferably 4 ⁇ m or more and 30 ⁇ m or less, and further preferably 5 ⁇ m or more and 20 ⁇ m or less.
  • the thickness of the insulating layer 2 is less than the lower limit value, the goblet folding resistance is lowered, and cracks may occur in the bent portion after thermocompression bonding to the convex portion 61.
  • film strength falls and it is difficult to play the role as an insulating support body of a conductive adhesive layer.
  • shape followability may be reduced.
  • the insulating layer 2 can be made more excellent in flexibility.
  • the insulating layer 2 is Further, it can be made to follow more reliably corresponding to the shape of the convex portion 61.
  • the average linear expansion coefficient at 25 to 150 ° C. of the insulating layer 2 is preferably 50 to 1000 [ppm / ° C.], more preferably 100 to 700 [ppm / ° C.].
  • the insulating layer 2 has excellent stretchability when the electromagnetic wave shielding film 100 is heated. Therefore, it is possible to more reliably improve the shape followability of the insulating layer 2 and further the convex portion 61 of the electromagnetic wave shielding layer 3.
  • the insulating layer 2 may be a laminated body of two or more layers in which different ones of the above-described insulating films are laminated in addition to the one constituted by one layer.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained.
  • FIG. 9 is a longitudinal sectional view showing a seventh embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 9 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 shown in FIG. 9 is the same as the electromagnetic wave shielding film 100 shown in FIG. 3 except that an insulating layer is formed between the base material layer 1 and the electromagnetic wave shielding layer 3.
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the second layer 13 and the third layer 12, the insulating layer 2, and the electromagnetic wave shielding layer 3 laminated in this order.
  • the laminated body is made. Since the insulating layer 2 is the same as the insulating layer 2 of the sixth embodiment, the description thereof is omitted.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the second embodiment, and is similar to the electromagnetic wave shielding film 100 of the second embodiment. The effect is obtained. Moreover, since the electromagnetic wave shielding film 100 of this embodiment has the insulating layer 2, it can be used in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, and the electromagnetic wave of the sixth embodiment. The same effect as the shielding film 100 can be obtained.
  • FIG. 10 is a longitudinal sectional view showing an eighth embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 10 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 shown in FIG. 10 is the same as the electromagnetic wave shielding film 100 shown in FIG. 4 except that the insulating layer 2 is formed between the base material layer 1 and the electromagnetic wave shielding layer 3. .
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11 and the second layer 13, the insulating layer 2, and the electromagnetic wave shielding layer 3 laminated in this order.
  • the laminated body is made. Since the insulating layer 2 is the same as the insulating layer 2 of the sixth embodiment, the description thereof is omitted.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained. Moreover, since the electromagnetic wave shielding film 100 of this embodiment has the insulating layer 2, it can be used in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, and the electromagnetic wave of the sixth embodiment. The same effect as the shielding film 100 can be obtained.
  • FIG. 11 is a longitudinal sectional view showing a ninth embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 11 is referred to as “upper” and the lower side is referred to as “lower”.
  • the formation of the third layer 12 included in the base material layer 1 is omitted, and the stacking order of the insulating layer 2 and the electromagnetic wave shielding layer 3 is reversed. This is the same as the electromagnetic wave shielding film 100 shown in FIG.
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11 and the second layer 13, the electromagnetic wave shielding layer 3, and the insulating layer 2 laminated in this order.
  • the laminated body is made.
  • the electromagnetic wave shielding film 100 having such a configuration, when the base material layer 1 is peeled from the electromagnetic wave shielding layer 3 in the peeling step, the base material layer 1 is shielded from electromagnetic waves at the interface between the second layer 13 and the electromagnetic wave shielding layer 3. Peel from layer 3. In such peeling, the electromagnetic wave shielding layer 3 has releasability from the second layer 13, thereby omitting the formation of the third layer 12.
  • the degree of releasability of the contact surface in contact with the second layer 13 of the electromagnetic wave shielding layer 3 can be expressed by the surface tension of the contact surface.
  • the surface tension of the contact surface is preferably 20 to 40 mN / m, and more preferably 25 to 35 mN / m.
  • the contact surface has a surface tension within such a range, the second layer 13 can be reliably peeled from the electromagnetic wave shielding layer 3 after the pressing process using a vacuum pressurizing laminator or the like.
  • Examples of such an electromagnetic wave shielding layer 3 having surface tension include a resin in which a carbon-based material or a conductive polymer is dispersed in a thermosetting resin such as polyurethane.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, and is similar to the electromagnetic wave shielding film 100 of the sixth embodiment. The effect is obtained.
  • FIG. 12 is a longitudinal sectional view showing a tenth embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 12 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 shown in FIG. 12 will be described, but differences from the electromagnetic wave shielding film 100 shown in FIG. 7 will be mainly described, and description of similar matters will be omitted.
  • the electromagnetic wave shielding film 100 shown in FIG. 12 is the same as the electromagnetic wave shielding film 100 shown in FIG. 7 except that the stacking order of the insulating layer 2 and the electromagnetic wave shielding layer 3 is reversed.
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11, the second layer 13, and the third layer 12, the insulating layer 2, and the electromagnetic wave shielding layer 3.
  • the laminated body is laminated in this order.
  • the insulating layer 2 comes into contact with the substrate 5 and the electronic component 4 by covering the convex portion 61 on the substrate 5 with the electromagnetic wave shielding film 100 including the electromagnetic wave shielding layer 3 and the insulating layer 2 laminated in this manner.
  • the electronic component 4 is coated in the order of the insulating layer 2 and the electromagnetic wave shielding layer 3 from the substrate 5 side.
  • the insulating layer 2 covers the substrate 5 and the electronic component 4 in contact with them.
  • substrate 5 and the electronic component 4 are insulated from the electromagnetic wave shielding layer 3 and other members (electronic components etc.) located on the opposite side to the board
  • the electromagnetic wave shielding film 100 having such a configuration for example, even if the electromagnetic wave shielding layer 3 includes a conductive material, adjacent electronic components 4 can be reliably insulated by the insulating layer 2.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, and is similar to the electromagnetic wave shielding film 100 of the sixth embodiment. The effect is obtained.
  • FIG. 13 is a longitudinal sectional view showing an eleventh embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 13 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 shown in FIG. 13 is the same as the electromagnetic wave shielding film 100 shown in FIG. 5 except that the insulating layer 2 is formed between the electromagnetic wave shielding layer 3 and the base material layer 1. .
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11, the second layer 13, and the third layer 12, the insulating layer 2, the absorption layer 31, and the reflection layer.
  • the electromagnetic wave shielding layer 3 made of 32 forms a laminated body laminated in this order. Since the insulating layer 2 is the same as the insulating layer 2 of the sixth embodiment, the description thereof is omitted.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the fourth embodiment, and is the same as the electromagnetic wave shielding film 100 of the fourth embodiment. The effect is obtained. Moreover, since the electromagnetic wave shielding film 100 of this embodiment has the insulating layer 2, it can be used in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, and the electromagnetic wave of the sixth embodiment. The same effect as the shielding film 100 can be obtained.
  • FIG. 14 is a longitudinal sectional view showing a twelfth embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 14 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 shown in FIG. 14 is the same as the electromagnetic wave shielding film 100 shown in FIG. 6 except that the insulating layer 2 is formed between the electromagnetic wave shielding layer 3 and the base material layer 1. .
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11, the second layer 13, and the third layer 12, the insulating layer 2, the reflection layer 32, and the absorption layer.
  • the electromagnetic wave shielding layer 3 composed of 31 forms a laminated body laminated in this order. Since the insulating layer 2 is the same as the insulating layer 2 of the sixth embodiment, the description thereof is omitted.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained. Moreover, since the electromagnetic wave shielding film 100 of this embodiment has the insulating layer 2, it can be used in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, and the electromagnetic wave of the sixth embodiment. The same effect as the shielding film 100 can be obtained.
  • the electromagnetic wave shielding film 100 of the eleventh embodiment and the electromagnetic wave shielding film 100 of the twelfth embodiment are different from each other in the order of lamination of the reflective layer 32 and the absorbing layer 31 of the electromagnetic wave shielding layer 3. Are identical to each other.
  • the absorption layer 31 absorbs the electromagnetic wave incident on the absorption layer 31 and blocks the electromagnetic wave, so that the electromagnetic wave disappears due to this absorption.
  • the electromagnetic wave shielding film 100 of the eleventh embodiment reliably prevents the electromagnetic wave reflected by the reflective layer 32 from adversely affecting other members that are not covered by the electromagnetic wave shielding layer 3. Has the advantage of being able to.
  • the absorbing layer 31 is the electromagnetic wave shielding film 100 of the eleventh embodiment located on the opposite side of the reflective layer 32 with respect to the convex portion 61. Is preferred.
  • the electromagnetic wave shielding layer 3 includes two layers each of the reflective layer 32 and the absorbing layer 31. It was set as the laminated body of a structure.
  • the electromagnetic wave shielding layer 3 is not limited to such a two-layer laminate, and is constituted by a three-layer laminate including at least one of the reflective layer 32 and the absorption layer 31. May be.
  • the said embodiment demonstrated the case where the one insulating layer 2 was laminated
  • the insulating layer 2 may be laminated as a separate layer on each of the two layers.
  • any configuration of the first to twelfth embodiments can be combined.
  • the electromagnetic wave shielding film of the present invention may be added with an arbitrary layer that can exhibit the same function.
  • an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) was prepared.
  • a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave shielding layer.
  • the syndiotactic polystyrene as a first layer, the syndiotactic polystyrene as a third layer, and the ethylene-methyl acrylate copolymer as a second layer are co-polymerized using a feed block and a multi-manifold die.
  • a film was formed by extrusion.
  • the conductive adhesive layer as an electromagnetic wave shielding layer was coated on a base material layer to produce an electromagnetic wave shielding film.
  • the total thickness of the electromagnetic wave shielding film of Example 1A is 140 ⁇ m, the thickness of the first layer is 30 ⁇ m, the thickness of the third layer is 30 ⁇ m, the thickness of the second layer is 60 ⁇ m, and the thickness of the electromagnetic wave shielding layer.
  • the thickness of the electromagnetic wave shielding layer was 20 ⁇ m.
  • the average linear expansion coefficients of the first layer, the second layer and the third layer in the electromagnetic wave shielding film of Example 1A were measured, they were 420, 2400 and 420 ppm / ° C., respectively.
  • the obtained electromagnetic wave shielding film was placed on the surface of a personal computer memory substrate (trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300, manufactured by Samsung Corp.) (step: 1,000 ⁇ m) at a temperature of 150 ° C. and a pressure of 2. Affixed by a vacuum / pressure forming method for 5 minutes under the condition of 0 MPa. After pasting, only the base material layer was peeled off from the electromagnetic wave shielding layer manually to produce an electronic component.
  • a personal computer memory substrate trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300, manufactured by Samsung Corp.
  • Example 2A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the first layer was 80 ⁇ m.
  • Example 3A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the first layer was 10 ⁇ m.
  • Example 4A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the second layer was 90 ⁇ m.
  • Example 5A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the second layer was 20 ⁇ m.
  • Example 6A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the third layer was 10 ⁇ m.
  • Example 7A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the third layer was 90 ⁇ m.
  • Example 8A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the electromagnetic wave shielding layer was 5 ⁇ m.
  • Example 9A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the electromagnetic wave shielding layer was 150 ⁇ m.
  • Example 10A As the first layer, syndiotactic polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and styrene-ethylene-butylene-styrene block copolymer (made by Kuraray Co., Ltd., trade name: Septon S8007) ) was prepared in the same manner as in Example 1A, except that a blended product having a weight percent concentration of 60 wt% and 40 wt% was prepared.
  • syndiotactic polystyrene made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107
  • styrene-ethylene-butylene-styrene block copolymer made by Kuraray Co., Ltd., trade name: Septon S8007
  • Example 11A As the first layer, syndiotactic polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and styrene-ethylene-butylene-styrene block copolymer (made by Kuraray Co., Ltd., trade name: Septon S8007) ) was prepared in the same manner as in Example 1A except that a blended product was prepared at a weight percent concentration of 80 wt% and 20 wt%, respectively.
  • syndiotactic polystyrene made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107
  • styrene-ethylene-butylene-styrene block copolymer made by Kuraray Co., Ltd., trade name: Septon S8007
  • Example 12A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that polymethylpentene (trade name: TPX MX004, manufactured by Mitsui Chemicals, Inc.) was prepared as the first layer.
  • polymethylpentene trade name: TPX MX004, manufactured by Mitsui Chemicals, Inc.
  • Example 13A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that polybutylene terephthalate (manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: NOVADURAN 5505S) was prepared as the first layer.
  • polybutylene terephthalate manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: NOVADURAN 5505S
  • Example 14A As the second layer, an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) are in a concentration by weight.
  • a film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A, except that a blended product of 70 wt% and 30 wt% was prepared.
  • Example 15A As the second layer, ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) and polyethylene (manufactured by Ube Industries, Ltd., trade name: UBE polyethylene F222NH) are in weight percent.
  • An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that a blended product was prepared at a concentration of 70 wt% and 30 wt%, respectively.
  • Example 16A As the second layer, an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106), polyethylene (manufactured by Ube Industries, Ltd., trade name: UBE polyethylene F222NH) and polypropylene (Sumitomo).
  • Example 17A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the first layer was 5 ⁇ m.
  • Example 18A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the second layer was 120 ⁇ m.
  • Example 19A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the third layer was 3 ⁇ m.
  • Example 20A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the second layer was 80 ⁇ m and the thickness of the first layer was 10 ⁇ m.
  • Example 21A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A, except that the thickness of the first layer was 5 ⁇ m, the thickness of the second layer was 80 ⁇ m, and the thickness of the third layer was 5 ⁇ m.
  • Example 22A An electromagnetic wave shielding film and an electronic component were formed in the same manner as in Example 1A, except that the formation of the first layer was omitted and a conductive polymer polyaniline dispersion (PANI-PD manufactured by Regulus Co., Ltd.) was used for the electromagnetic wave shielding layer. Manufactured.
  • Example 23A An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1A except that the formation of the third layer was omitted.
  • Comparative Example 1A As a base material layer, only a polyethylene terephthalate (manufactured by Toray Industries, Inc., trade name: Lumirror S10) was prepared, and the thickness of the base material layer was changed to 30 ⁇ m. Parts and manufactured.
  • Comparative Example 2A As a base material layer, only polyethylene terephthalate (manufactured by Toray Industries, Inc., trade name: Lumirror S10) was prepared, and the thickness of the base material layer was set to 100 ⁇ m. Parts and manufactured.
  • a groove having a width of 0.2 mm and a predetermined step (depth) is formed in a grid pattern at intervals of 0.2 mm on a printed wiring board (motherboard) having a length of 100 mm, a width of 100 mm, and a height of 3 mm.
  • the film for electromagnetic wave shielding is pressure-bonded to the printed wiring board at 150 ° C. ⁇ 1 MPa ⁇ 10 minutes using a vacuum / pressure forming apparatus, and is attached to the printed wiring board.
  • the base material layer was peeled off from the electromagnetic wave shielding layer.
  • step difference is less than 500 micrometers.
  • ⁇ The level difference is 500 ⁇ m or more and less than 1000 ⁇ m.
  • Double-circle A level
  • the releasability can be determined as follows.
  • An electromagnetic wave shielding film was thermocompression bonded to the same printed wiring board as in the shape followability evaluation method. Thereafter, only the base material layer was evaluated by ease of peeling when manually peeling from the electromagnetic wave shielding layer.
  • symbol is as follows. X was rejected, and the others were determined to be acceptable.
  • the goblet folding resistance can be determined as follows.
  • the electromagnetic shielding film is bonded to a flexible substrate such as a flexible circuit board.
  • the bonded material was folded in a goblet and the bent portion was observed with a microscope. However, the folding is performed by hand, and the folding is performed only once.
  • Second layer spotting ability The second layer smearing property of the base material layer can be determined as follows.
  • the base material layer was hot pressed at 150 ° C. ⁇ 2.0 MPa ⁇ 5 minutes.
  • the maximum distance from the end of the second layer of the constituent material of the second layer that was smeared out was measured with calipers or the like.
  • symbol is as follows. X was rejected, and the others were determined to be acceptable. X: The maximum distance is 1.0 mm or more. ⁇ : The maximum distance is 0.5 mm or more and less than 1.0 mm. A: The maximum distance is less than 0.5 mm.
  • the heat resistance of the base material layer can be determined as follows.
  • the electromagnetic wave shielding film is pressure-bonded to a printed wiring board at 150 ° C. ⁇ 2 MPa ⁇ 5 minutes using a vacuum / pressure forming apparatus, and is attached to the printed wiring board. After pasting, the base material layer was peeled off from the electromagnetic wave shielding layer. Next, it is visually observed whether the electromagnetic wave shielding layer attached to the printed wiring board has wrinkles.
  • the electromagnetic wave shielding films of Examples 1A to 23A showed good shape following properties, and further had release properties, gouge folding resistance, second layer spotting property of the base material layer, Excellent balance in terms of electromagnetic shielding shielding and punching workability.
  • the electromagnetic wave shielding films of Comparative Examples 1A and 2A resulted in insufficient shape followability as compared with the electromagnetic wave shielding films of Examples 1A to 23A.
  • an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) was prepared.
  • a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave shielding layer.
  • the syndiotactic polystyrene as a first layer, the syndiotactic polystyrene as a third layer, and the ethylene-methyl acrylate copolymer as a second layer are co-polymerized using a feed block and a multi-manifold die.
  • a film was formed by extrusion.
  • the conductive adhesive layer as an electromagnetic wave shielding layer was coated on a base material layer to produce an electromagnetic wave shielding film.
  • the total thickness of the electromagnetic wave shielding film of Example 1B is 140 ⁇ m, the thickness of the first layer is 30 ⁇ m, the thickness of the third layer is 30 ⁇ m, the thickness of the second layer is 60 ⁇ m, and the thickness of the electromagnetic wave shielding layer.
  • the thickness of the electromagnetic wave shielding layer was 20 ⁇ m.
  • the average linear expansion coefficients of the first layer, the second layer, and the third layer in the electromagnetic wave shielding film of Example 1B were measured, they were 420, 2400, and 420 ppm / ° C., respectively.
  • the obtained electromagnetic wave shielding film was placed on the surface of a personal computer memory substrate (trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300, manufactured by Samsung Corp.) (step: 1,000 ⁇ m) at a temperature of 150 ° C. and a pressure of 2.
  • the film was pasted by a vacuum / pressure forming method for 5 minutes under the condition of 0 MPa. After pasting, only the base material layer was peeled off from the electromagnetic wave shielding layer manually to produce an electronic component.
  • Example 2B As the second layer, an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) are in a concentration by weight.
  • a film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B, except that a blended product of 70 wt% and 30 wt% was prepared.
  • Example 3B An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1B, except that the thickness of the first layer was 10 ⁇ m.
  • Example 4B An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1B, except that the thickness of the second layer was 90 ⁇ m.
  • Example 5B As the first layer, syndiotactic polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and styrene-ethylene-butylene-styrene block copolymer (made by Kuraray Co., Ltd., trade name: Septon S8007) ) was prepared in the same manner as in Example 1B, except that a blended product was blended at a weight percent concentration of 60 wt% and 40 wt%, respectively.
  • syndiotactic polystyrene made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107
  • styrene-ethylene-butylene-styrene block copolymer made by Kuraray Co., Ltd., trade name: Septon S8007
  • Example 6B An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1B except that the thickness of the first layer was 80 ⁇ m.
  • Example 7B An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1B except that the thickness of the first layer was 100 ⁇ m.
  • Example 8B As a first layer, syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) at a weight percent concentration of 60 wt. %, A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B except that a blended product blended at 40 wt% was prepared.
  • Example 9B An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1B, except that polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) was prepared as the second layer.
  • polypropylene manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2
  • Example 10B An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1B, except that polybutylene terephthalate (manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: NOVADURAN 5020) was prepared as the first layer.
  • polybutylene terephthalate manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: NOVADURAN 5020
  • Example 11B An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1B except that 6-nylon (manufactured by Ube Industries, Ltd., trade name: UBE nylon 1022B) was prepared as the first layer.
  • 6-nylon manufactured by Ube Industries, Ltd., trade name: UBE nylon 1022B
  • Example 1B A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B, except that a cyclic olefin copolymer (manufactured by Polyplastics Co., Ltd., trade name: TOPAS6017) was prepared as the base material layer.
  • a cyclic olefin copolymer manufactured by Polyplastics Co., Ltd., trade name: TOPAS6017
  • Example 2B An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1B except that the thickness of the third layer was 1 ⁇ m and the thickness of the first layer was 1 ⁇ m.
  • the storage elastic modulus at 150 ° C. of the base material layer was not set within an appropriate range, resulting in insufficient shape following ability. .
  • an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) was prepared.
  • a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave shielding layer.
  • the syndiotactic polystyrene as a first layer, the syndiotactic polystyrene as a third layer, and the ethylene-methyl acrylate copolymer as a second layer are co-polymerized using a feed block and a multi-manifold die.
  • a film was formed by extrusion.
  • the conductive adhesive layer as an electromagnetic wave shielding layer was coated on a base material layer to produce an electromagnetic wave shielding film.
  • the total thickness of the electromagnetic wave shielding film of Example 1C is 140 ⁇ m, the thickness of the first layer is 30 ⁇ m, the thickness of the third layer is 30 ⁇ m, the thickness of the second layer is 60 ⁇ m, and the thickness of the electromagnetic wave shielding layer.
  • the thickness of the electromagnetic wave shielding layer was 20 ⁇ m.
  • the obtained electromagnetic wave shielding film was placed on the surface of a personal computer memory substrate (trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300, manufactured by Samsung Corp.) (step: 1,000 ⁇ m) at a temperature of 150 ° C. and a pressure of 2.
  • the film was pasted for 5 minutes by vacuum / pressure forming under the condition of 0 MPa. After pasting, only the base material layer was peeled off from the electromagnetic wave shielding layer manually to produce an electronic component.
  • Example 2C An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1C except that a conductive adhesive layer (trade name: DW-250H-5, manufactured by Toyobo Co., Ltd.) was used as the electromagnetic wave shielding layer.
  • a conductive adhesive layer trade name: DW-250H-5, manufactured by Toyobo Co., Ltd.
  • Example 3C An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1C, except that a conductive adhesive layer (trade name: DW-250H-23, manufactured by Toyobo Co., Ltd.) was used as the electromagnetic wave shielding layer.
  • a conductive adhesive layer trade name: DW-250H-23, manufactured by Toyobo Co., Ltd.
  • Example 4C An electromagnetic wave shielding film and an electronic component were prepared in the same manner as in Example 1C, except that a conductive adhesive layer (trade name: CA-2504-4B, manufactured by Daiken Chemical Industry Co., Ltd.) was used as the electromagnetic wave shielding layer. Manufactured.
  • Example 5C Electromagnetic waves as in Example 1C, except that a polyaniline dispersion (trade name: PANI-PD, thickness: 20 ⁇ m, manufactured by Regulus Co., Ltd.) was prepared for the conductive absorption layer functioning as the absorption layer as the resin constituting the barrier layer. Shielding films and electronic parts were manufactured.
  • a polyaniline dispersion trade name: PANI-PD, thickness: 20 ⁇ m, manufactured by Regulus Co., Ltd.
  • Example 6C Example 1C, except that a multilayer carbon nanotube dispersion (trade name: NT-7K, thickness: 20 ⁇ m) manufactured by Hodogaya Chemical Co., Ltd. was prepared for the dielectric absorption layer functioning as the absorption layer as the resin constituting the barrier layer. In the same manner, an electromagnetic wave shielding film and an electronic component were produced.
  • a multilayer carbon nanotube dispersion (trade name: NT-7K, thickness: 20 ⁇ m) manufactured by Hodogaya Chemical Co., Ltd. was prepared for the dielectric absorption layer functioning as the absorption layer as the resin constituting the barrier layer.
  • NT-7K thickness: 20 ⁇ m
  • Example 7C Example 1C, except that PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 20 ⁇ m) was prepared as the resin constituting the barrier layer in the conductive absorption layer functioning as the absorption layer. In the same manner, an electromagnetic wave shielding film and an electronic component were produced.
  • PEDOT / PSS manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 20 ⁇ m
  • Example 8C As the resin constituting the barrier layer, a conductive adhesive layer (trade name: DW260-H1, manufactured by Toyobo Co., Ltd., thickness 10 ⁇ m) that functions as a reflective layer, and a polyaniline dispersion (Regulus) Except that the product is a product name, PANI-PD, thickness 10 ⁇ m), and the film is coated in the order of a reflective layer and an absorbing layer. Films and electronic components were manufactured.
  • a conductive adhesive layer (trade name: DW260-H1, manufactured by Toyobo Co., Ltd., thickness 10 ⁇ m) that functions as a reflective layer
  • a polyaniline dispersion (Regulus) Except that the product is a product name, PANI-PD, thickness 10 ⁇ m)
  • the film is coated in the order of a reflective layer and an absorbing layer. Films and electronic components were manufactured.
  • Example 9C As a resin constituting the barrier layer, a conductive adhesive layer functioning as a reflective layer (manufactured by Daiken Chemical Industry Co., Ltd., trade name: CA-2503-4B, thickness 10 ⁇ m) and a dielectric functioning as an absorbing layer Absorbing layer (PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 10 ⁇ m)) was prepared, and these were coated on the film in the order of the reflective layer and the absorbing layer. An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1C.
  • a conductive adhesive layer functioning as a reflective layer manufactured by Daiken Chemical Industry Co., Ltd., trade name: CA-2503-4B, thickness 10 ⁇ m
  • a dielectric functioning as an absorbing layer Absorbing layer PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 10 ⁇ m)
  • Example 10C As the resin constituting the barrier layer, a conductive adhesive layer (trade name: DW260-H1, manufactured by Toyobo Co., Ltd., thickness 10 ⁇ m) that functions as a reflective layer, and a polyaniline dispersion (Regulus) Except that the product is a product name, PANI-PD, thickness 10 ⁇ m), and these are coated on the film in the order of the absorbing layer and the reflecting layer. Films and electronic components were manufactured.
  • a conductive adhesive layer trade name: DW260-H1, manufactured by Toyobo Co., Ltd., thickness 10 ⁇ m
  • PANI-PD thickness 10 ⁇ m
  • Example 11C As a resin constituting the barrier layer, a conductive adhesive layer functioning as a reflective layer (manufactured by Daiken Chemical Industry Co., Ltd., trade name: CA-2503-4B, thickness 10 ⁇ m) and a dielectric functioning as an absorbing layer Example 1C, except that an absorbent layer (PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 10 ⁇ m)) was prepared, and these were coated on the film in the order of the absorbent layer and the reflective layer. In the same manner, an electromagnetic wave shielding film and an electronic component were produced.
  • PEDOT / PSS manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 10 ⁇ m
  • an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) was prepared.
  • a polyolefin emulsion (manufactured by Unitika Ltd., trade name: Arrow Base TC-4010) was prepared as a resin constituting the insulating layer.
  • a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave shielding layer.
  • the syndiotactic polystyrene as a first layer, the syndiotactic polystyrene as a third layer, and the ethylene-methyl acrylate copolymer as a second layer are co-polymerized using a feed block and a multi-manifold die.
  • a film was formed by extrusion.
  • a film for electromagnetic wave shielding was prepared by coating the base material layer with the conductive adhesive layer as an electromagnetic wave shielding layer and the polyolefin emulsion as an insulating layer in this order.
  • the total thickness of the electromagnetic wave shielding film of Example 1D is 160 ⁇ m, the thickness of the first layer is 30 ⁇ m, the thickness of the third layer is 30 ⁇ m, the thickness of the second layer is 60 ⁇ m, and the thickness of the insulating layer is The thickness of the electromagnetic wave shielding layer was 20 ⁇ m.
  • the average linear expansion coefficients of the first layer, the second layer, and the third layer in the electromagnetic wave shielding film of Example 1D were measured, they were 420, 2400, and 420 ppm / ° C., respectively.
  • the obtained electromagnetic shielding film was placed on the surface of a personal computer memory board (trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300, manufactured by Samsung Corp.) (step: 1,000 ⁇ m) at a temperature of 150 ° C. and a pressure of 2.
  • the film was pasted for 5 minutes by vacuum / pressure forming under the condition of 0 MPa. After pasting, only the base material layer was peeled off from the electromagnetic wave shielding layer manually to produce an electronic component.
  • Example 2D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D except that the thickness of the first layer was 80 ⁇ m.
  • Example 3D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D except that the thickness of the first layer was 10 ⁇ m.
  • Example 4D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D except that the thickness of the second layer was 90 ⁇ m.
  • Example 5D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D except that the thickness of the second layer was 20 ⁇ m.
  • Example 6D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D except that the thickness of the third layer was 10 ⁇ m.
  • Example 7D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D, except that the thickness of the third layer was 90 ⁇ m.
  • Example 8D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D, except that the thickness of the insulating layer was 5 ⁇ m.
  • Example 9D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D, except that the thickness of the insulating layer was 50 ⁇ m.
  • Example 10D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D, except that the thickness of the electromagnetic wave shielding layer was 5 ⁇ m.
  • Example 11D Except for the thickness of the electromagnetic wave shielding layer being 150 ⁇ m, an electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D.
  • Example 12D As the first layer, syndiotactic polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and styrene-ethylene-butylene-styrene block copolymer (made by Kuraray Co., Ltd., trade name: Septon S8007) ) was prepared in the same manner as in Example 1D, except that a blended product was prepared at a weight percent concentration of 60 wt% and 40 wt%, respectively.
  • syndiotactic polystyrene made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107
  • styrene-ethylene-butylene-styrene block copolymer made by Kuraray Co., Ltd., trade name: Septon S8007
  • Example 13D As the first layer, syndiotactic polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and styrene-ethylene-butylene-styrene block copolymer (made by Kuraray Co., Ltd., trade name: Septon S8007) ) was prepared in the same manner as in Example 1D, except that a blended product having a weight percent concentration of 80 wt% and 20 wt% was prepared.
  • syndiotactic polystyrene made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107
  • styrene-ethylene-butylene-styrene block copolymer made by Kuraray Co., Ltd., trade name: Septon S8007
  • Example 14D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D, except that polymethylpentene (manufactured by Mitsui Chemicals, Inc., trade name: TPX MX004) was prepared as the first layer.
  • polymethylpentene manufactured by Mitsui Chemicals, Inc., trade name: TPX MX004
  • Example 15D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D, except that polybutylene terephthalate (manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: Nova Duran 5505S) was prepared as the first layer.
  • polybutylene terephthalate manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: Nova Duran 5505S
  • Example 16D As the second layer, an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) are in a concentration by weight.
  • a film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D, except that preparations blended at 70 wt% and 30 wt% were prepared.
  • Example 17D As the second layer, ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) and polyethylene (manufactured by Ube Industries, Ltd., trade name: UBE polyethylene F222NH) are in weight percent.
  • An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D, except that a blended product containing 70 wt% and 30 wt% was prepared.
  • Example 18D As the second layer, an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106), polyethylene (manufactured by Ube Industries, Ltd., trade name: UBE polyethylene F222NH) and polypropylene (Sumitomo).
  • Example 19D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D, except that a saturated copolymerized polyester emulsion (trade name: Elitel KT-8803, manufactured by Unitika Ltd.) was prepared as an insulating layer.
  • a saturated copolymerized polyester emulsion (trade name: Elitel KT-8803, manufactured by Unitika Ltd.) was prepared as an insulating layer.
  • Example 20D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D, except that the thickness of the first layer was 5 ⁇ m.
  • Example 21D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D except that the thickness of the second layer was 120 ⁇ m.
  • Example 22D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D, except that the thickness of the third layer was 3 ⁇ m.
  • Example 23D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D, except that the thickness of the second layer was 80 ⁇ m and the thickness of the first layer was 10 ⁇ m.
  • Example 24D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D except that the thickness of the first layer was 5 ⁇ m, the thickness of the second layer was 80 ⁇ m, and the thickness of the third layer was 5 ⁇ m.
  • Example 25D An electromagnetic wave shielding film and an electronic component were formed in the same manner as in Example 1D, except that the formation of the first layer was omitted and a conductive polymer polyaniline dispersion (PANI-PD manufactured by Regulus Co., Ltd.) was used for the electromagnetic wave shielding layer. Manufactured.
  • Example 26D An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1D except that the formation of the third layer was omitted.
  • Comparative Example 1D As a base material layer, only a polyethylene terephthalate (manufactured by Toray Industries, Inc., trade name: Lumirror S10) is prepared, and the thickness of the base material layer is 30 ⁇ m. Parts and manufactured.
  • Example 2D As a base material layer, only a polyethylene terephthalate (manufactured by Toray Industries, Inc., trade name: Lumirror S10) was prepared, and a film for electromagnetic wave shielding and an electron were prepared in the same manner as in Example 1D except that the thickness of the base material layer was 100 ⁇ m. Parts and manufactured.
  • the electromagnetic wave shielding films of Examples 1D to 26D exhibit good shape following properties, and further have mold release properties, gouge folding resistance, second layer spotting property of the base material layer, Excellent balance in terms of electromagnetic shielding shielding and punching workability.
  • the electromagnetic wave shielding films of Comparative Examples 1D and 2D resulted in insufficient shape followability as compared with Examples 1D to 26D.
  • an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) was prepared.
  • a polyolefin emulsion (manufactured by Unitika Ltd., trade name: Arrow Base TC-4010) was prepared as a resin constituting the insulating layer.
  • a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave shielding layer.
  • the syndiotactic polystyrene as a first layer, the syndiotactic polystyrene as a third layer, and the ethylene-methyl acrylate copolymer as a second layer are co-polymerized using a feed block and a multi-manifold die.
  • a film was formed by extrusion.
  • a film for electromagnetic wave shielding was prepared by coating the base material layer with the conductive adhesive layer as an electromagnetic wave shielding layer and the polyolefin emulsion as an insulating layer in this order.
  • the total thickness of the electromagnetic wave shielding film of Example 1E is 160 ⁇ m, the thickness of the first layer is 30 ⁇ m, the thickness of the third layer is 30 ⁇ m, the thickness of the second layer is 60 ⁇ m, and the thickness of the insulating layer is The thickness of the electromagnetic wave shielding layer was 20 ⁇ m.
  • the obtained electromagnetic wave shielding film was placed on the surface of a personal computer memory substrate (trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300, manufactured by Samsung Corp.) (step: 1,000 ⁇ m) at a temperature of 150 ° C. and a pressure of 2.
  • the film was pasted by a vacuum / pressure forming method for 5 minutes under the condition of 0 MPa. After pasting, only the base material layer was peeled off from the electromagnetic wave shielding layer manually to produce an electronic component.
  • Example 2E As the second layer, an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) are in a concentration by weight.
  • a film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E, except that a blended product of 70 wt% and 30 wt% was prepared.
  • Example 3E An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1E, except that the thickness of the first layer was 10 ⁇ m.
  • Example 4E An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1E, except that the thickness of the second layer was 90 ⁇ m.
  • Example 5E As the first layer, syndiotactic polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and styrene-ethylene-butylene-styrene block copolymer (made by Kuraray Co., Ltd., trade name: Septon S8007) ) was prepared in the same manner as in Example 1E, except that a blended product having a weight percent concentration of 60 wt% and 40 wt% was prepared.
  • syndiotactic polystyrene made by Idemitsu Kosan Co., Ltd., trade name: Zarek S107
  • styrene-ethylene-butylene-styrene block copolymer made by Kuraray Co., Ltd., trade name: Septon S8007
  • Example 6E An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1E, except that the thickness of the first layer was 80 ⁇ m.
  • Example 7E An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1E, except that the thickness of the first layer was 100 ⁇ m.
  • Example 8E As a first layer, syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) in a weight percent concentration of 60 wt. %, A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E, except that a blended product blended at 40 wt% was prepared.
  • Example 9E An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1B, except that polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) was prepared as the second layer.
  • polypropylene manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2
  • Example 10E An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1E, except that polybutylene terephthalate (manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: NOVADURAN 5020) was prepared as the first layer.
  • polybutylene terephthalate manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: NOVADURAN 5020
  • Example 1E A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E, except that a cyclic olefin copolymer (manufactured by Polyplastics Co., Ltd., trade name: TOPAS6017) was prepared as the base material layer.
  • a cyclic olefin copolymer manufactured by Polyplastics Co., Ltd., trade name: TOPAS6017
  • Example 2E An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1E except that the thickness of the third layer was 1 ⁇ m and the thickness of the first layer was 1 ⁇ m.
  • Examples 1E to 10E exhibited good shape following properties because the storage elastic modulus at 150 ° C. of the base material layer was set within an appropriate range. Furthermore, the results were excellent in a well-balanced manner with respect to releasability, goblet folding resistance, second layer spotting of the base material layer, and electromagnetic wave shield cutting / punching workability.
  • an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) was prepared.
  • a polyolefin emulsion (manufactured by Unitika Ltd., trade name: Arrow Base TC-4010) was prepared as a resin constituting the insulating layer.
  • a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave shielding layer.
  • the syndiotactic polystyrene as a first layer, the syndiotactic polystyrene as a third layer, and the ethylene-methyl acrylate copolymer as a second layer are co-polymerized using a feed block and a multi-manifold die.
  • a film was formed by extrusion.
  • a film for electromagnetic wave shielding was prepared by coating the base material layer with the conductive adhesive layer as an electromagnetic wave shielding layer and the polyolefin emulsion as an insulating layer in this order.
  • the total thickness of the electromagnetic wave shielding film of Example 1F is 160 ⁇ m, the thickness of the first layer is 30 ⁇ m, the thickness of the third layer is 30 ⁇ m, the thickness of the second layer is 60 ⁇ m, and the thickness of the insulating layer is The thickness of the electromagnetic wave shielding layer was 20 ⁇ m.
  • the obtained electromagnetic wave shielding film was placed on the surface of a personal computer memory substrate (trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300, manufactured by Samsung Corp.) (step: 1,000 ⁇ m) at a temperature of 150 ° C. and a pressure of 2.
  • the film was pasted for 5 minutes by vacuum / pressure forming under the condition of 0 MPa. After pasting, only the base material layer was peeled off from the electromagnetic wave shielding layer manually to produce an electronic component.
  • Example 2F An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1F, except that a conductive adhesive layer (trade name: DW-250H-5, manufactured by Toyobo Co., Ltd.) was used as the electromagnetic wave shielding layer.
  • a conductive adhesive layer trade name: DW-250H-5, manufactured by Toyobo Co., Ltd.
  • Example 3F An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1F, except that a conductive adhesive layer (trade name: DW-250H-23, manufactured by Toyobo Co., Ltd.) was used as the electromagnetic wave shielding layer.
  • a conductive adhesive layer trade name: DW-250H-23, manufactured by Toyobo Co., Ltd.
  • Example 4F An electromagnetic wave shielding film and an electronic component were prepared in the same manner as in Example 1F, except that a conductive adhesive layer (trade name: CA-2504-4B, manufactured by Daiken Chemical Industry Co., Ltd.) was used as the electromagnetic wave shielding layer. Manufactured.
  • Example 5F Electromagnetic waves as in Example 1F, except that a polyaniline dispersion (trade name: PANI-PD, thickness: 20 ⁇ m) was prepared for the conductive absorption layer functioning as the absorption layer as the resin constituting the barrier layer. Shielding films and electronic parts were manufactured.
  • a polyaniline dispersion trade name: PANI-PD, thickness: 20 ⁇ m
  • Example 6F Example 1F, except that a multilayer carbon nanotube dispersion (made by Hodogaya Chemical Co., Ltd., trade name: NT-7K, thickness 20 ⁇ m) was prepared as a resin constituting the barrier layer in the dielectric absorption layer functioning as the absorption layer. In the same manner, an electromagnetic wave shielding film and an electronic component were produced.
  • a multilayer carbon nanotube dispersion made by Hodogaya Chemical Co., Ltd., trade name: NT-7K, thickness 20 ⁇ m
  • Example 7F As in Example 1F, except that PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 20 ⁇ m) was prepared as the resin constituting the barrier layer in the conductive absorption layer functioning as the absorption layer. An electromagnetic shielding film and an electronic component were produced.
  • PEDOT / PSS manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 20 ⁇ m
  • Example 8F As the resin constituting the barrier layer, a conductive adhesive layer (trade name: DW260-H1, manufactured by Toyobo Co., Ltd., thickness 10 ⁇ m) that functions as a reflective layer, and a polyaniline dispersion (Regulus) Except that the film was coated with a reflective layer and an absorbing layer in this order, and the film for electromagnetic wave shielding and the electronic device were the same as in Example 1F. Parts and manufactured.
  • a conductive adhesive layer trade name: DW260-H1, manufactured by Toyobo Co., Ltd., thickness 10 ⁇ m
  • a polyaniline dispersion (Regulus) Except that the film was coated with a reflective layer and an absorbing layer in this order, and the film for electromagnetic wave shielding and the electronic device were the same as in Example 1F. Parts and manufactured.
  • Example 9F As a resin constituting the barrier layer, a conductive adhesive layer functioning as a reflective layer (manufactured by Daiken Chemical Industry Co., Ltd., trade name: CA-2503-4B, thickness 10 ⁇ m) and a dielectric functioning as an absorbing layer Absorbing layer (PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 10 ⁇ m)) was prepared, and these were coated on the film in the order of the reflective layer and the absorbing layer. An electromagnetic wave shielding film and an electronic component were produced in the same manner as in Example 1F.
  • a conductive adhesive layer functioning as a reflective layer manufactured by Daiken Chemical Industry Co., Ltd., trade name: CA-2503-4B, thickness 10 ⁇ m
  • a dielectric functioning as an absorbing layer Absorbing layer PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 10 ⁇ m)
  • Example 10F As the resin constituting the barrier layer, a conductive adhesive layer (trade name: DW260-H1, manufactured by Toyobo Co., Ltd., thickness 10 ⁇ m) that functions as a reflective layer, and a polyaniline dispersion (Regulus) Except that the film was coated with a film in the order of an absorption layer and a reflection layer, and an electromagnetic wave shielding film and an electronic device were prepared in the same manner as in Example 1F. Parts and manufactured.
  • a conductive adhesive layer trade name: DW260-H1, manufactured by Toyobo Co., Ltd., thickness 10 ⁇ m
  • Regular polyaniline dispersion
  • Example 11F As a resin constituting the barrier layer, a conductive adhesive layer functioning as a reflective layer (manufactured by Daiken Chemical Industry Co., Ltd., trade name: CA-2503-4B, thickness 10 ⁇ m) and a dielectric functioning as an absorbing layer Example 1F, except that an absorbent layer (PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 10 ⁇ m)) was prepared, and these were coated on the film in the order of the absorbent layer and the reflective layer. In the same manner, an electromagnetic wave shielding film and an electronic component were produced.
  • PEDOT / PSS manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 10 ⁇ m
  • the film for electromagnetic wave shielding according to the present invention can increase the degree of freedom in designing a substrate and can be reduced in weight and thickness, and has a good shape following property with respect to a convex portion 61 of 500 ⁇ m or more. It is an electromagnetic wave shielding film.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
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Abstract

La pellicule de blindage EM selon l'invention est utilisée pour couvrir les convexités sur un substrat et comprend une couche de base et une couche bloquante EM stratifiée sur une surface de ladite couche de base. La couche de base est conçue de manière à présenter un module élastique de conservation compris entre 2,0 × 105 et 5,0 × 108 Pa à 150 °C. La présente invention concerne une pellicule de blindage EM qui accroît le degré de liberté disponible lors de la conception d'un substrat, permet des réductions de poids et d'épaisseur et présente une bonne performance de suivi de forme par rapport aux composants électroniques dont les tailles de convexités sont supérieures ou égales à 500 µm. La présente invention concerne aussi un procédé dans lequel ladite pellicule de blindage EM est utilisée pour couvrir un composant électronique.
PCT/JP2013/071923 2012-08-16 2013-08-14 Pellicule de blindage em et procédé permettant de couvrir un composant électronique WO2014027673A1 (fr)

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SG11201501162UA SG11201501162UA (en) 2012-08-16 2013-08-14 Electromagnetic shielding film and method of covering electronic component
CN201380043449.XA CN104584707A (zh) 2012-08-16 2013-08-14 电磁波屏蔽用膜和电子部件的覆盖方法
KR1020147035705A KR101799631B1 (ko) 2012-08-16 2013-08-14 전자파 차폐용 필름, 및 전자부품의 피복 방법

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