SG11201501162UA - Electromagnetic shielding film and method of covering electronic component - Google Patents

Electromagnetic shielding film and method of covering electronic component

Info

Publication number
SG11201501162UA
SG11201501162UA SG11201501162UA SG11201501162UA SG11201501162UA SG 11201501162U A SG11201501162U A SG 11201501162UA SG 11201501162U A SG11201501162U A SG 11201501162UA SG 11201501162U A SG11201501162U A SG 11201501162UA SG 11201501162U A SG11201501162U A SG 11201501162UA
Authority
SG
Singapore
Prior art keywords
electronic component
shielding film
electromagnetic shielding
covering electronic
covering
Prior art date
Application number
SG11201501162UA
Inventor
Taichi Yatsuzuka
Fumihiro Shiraishi
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG11201501162UA publication Critical patent/SG11201501162UA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
SG11201501162UA 2012-08-16 2013-08-14 Electromagnetic shielding film and method of covering electronic component SG11201501162UA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012180537 2012-08-16
JP2013051098A JP6263846B2 (en) 2012-08-16 2013-03-13 Electromagnetic wave shielding film and method for coating electronic component
JP2013051100A JP6263847B2 (en) 2012-08-16 2013-03-13 Electromagnetic wave shielding film and method for coating electronic component
PCT/JP2013/071923 WO2014027673A1 (en) 2012-08-16 2013-08-14 Em-shielding film and method for covering electronic component

Publications (1)

Publication Number Publication Date
SG11201501162UA true SG11201501162UA (en) 2015-04-29

Family

ID=50614085

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201501165XA SG11201501165XA (en) 2012-08-16 2013-08-14 Em-shielding film and method for covering electronic component
SG11201501162UA SG11201501162UA (en) 2012-08-16 2013-08-14 Electromagnetic shielding film and method of covering electronic component

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201501165XA SG11201501165XA (en) 2012-08-16 2013-08-14 Em-shielding film and method for covering electronic component

Country Status (6)

Country Link
JP (4) JP6263846B2 (en)
KR (2) KR101799631B1 (en)
CN (2) CN104584707A (en)
SG (2) SG11201501165XA (en)
TW (2) TWI675617B (en)
WO (2) WO2014027673A1 (en)

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EP3163995B1 (en) 2014-08-01 2019-01-02 Huawei Technologies Co. Ltd. Electromagnetic shielding material and method for packaging optical module
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JP2018060990A (en) * 2016-07-08 2018-04-12 住友ベークライト株式会社 Sealing film, method for sealing electronic component-mounted substrate, and electronic component-mounted substrate covered with sealing film
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CN106131991B (en) * 2016-07-28 2022-09-16 杭州信多达智能科技有限公司 Wire coil assembly with surround shielding radiation function
JP2018060991A (en) * 2016-09-28 2018-04-12 住友ベークライト株式会社 Sealing film, method for sealing electronic component-mounted substrate, and sealing film-covered electronic component-mounted substrate
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JP2019029549A (en) * 2017-08-01 2019-02-21 住友ベークライト株式会社 Film set
JP6516108B2 (en) * 2017-08-10 2019-05-22 東洋インキＳｃホールディングス株式会社 Electromagnetic wave shield laminate for vacuum forming, and electromagnetic wave shield molded body using the same
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JP7277092B2 (en) * 2017-08-31 2023-05-18 積水化学工業株式会社 release film
US11710645B2 (en) * 2017-12-14 2023-07-25 Nagase Chemtex Corporation Manufacturing method of mounting structure, and sheet therefor
JP2019119820A (en) * 2018-01-09 2019-07-22 住友ベークライト株式会社 Encapsulation film, encapsulation film coated electronic component loading substrate and re-detachment method
KR102616814B1 (en) * 2018-03-09 2023-12-21 삼성전자주식회사 Semiconductor package and semiconductor module
KR102016500B1 (en) 2018-04-02 2019-09-02 삼성전기주식회사 Coil Component
JP6504302B1 (en) 2018-06-12 2019-04-24 東洋インキＳｃホールディングス株式会社 Electromagnetic wave shield sheet, component mounting board, and electronic device
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Also Published As

Publication number Publication date
WO2014027672A1 (en) 2014-02-20
JP2014057043A (en) 2014-03-27
JP6225436B2 (en) 2017-11-08
JP2014057042A (en) 2014-03-27
JP6225437B2 (en) 2017-11-08
JP6263846B2 (en) 2018-01-24
CN104584708A (en) 2015-04-29
KR101799630B1 (en) 2017-11-20
JP2014057041A (en) 2014-03-27
KR101799631B1 (en) 2017-11-20
TW201419997A (en) 2014-05-16
SG11201501165XA (en) 2015-05-28
JP2014057040A (en) 2014-03-27
KR20150042747A (en) 2015-04-21
CN104584707A (en) 2015-04-29
KR20150044853A (en) 2015-04-27
TW201419996A (en) 2014-05-16
WO2014027673A1 (en) 2014-02-20
TWI675617B (en) 2019-10-21
JP6263847B2 (en) 2018-01-24

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