JP2014057041A - Film for electromagnetic wave shield and method for coating electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film for an electromagnetic wave shield which enhances design flexibility of a circuit board, achieves a lightweight and thin board and has good shape followability for an electronic component having a ruggedness of 500 μm or more, and a method for coating an electronic component by using the film for an electromagnetic wave shield.SOLUTION: The film for an electromagnetic wave shield is used to cover ruggedness on a circuit board, and comprises a substrate layer and an insulating layer and an electromagnetic wave shielding layer deposited on one surface of the substrate layer. The substrate layer shows an elastic modulus of 2.0E+05 to 2.0E+08 Pa at 150°C.

Description

  The present invention relates to an electromagnetic wave shielding film and a method for coating an electronic component.

  Conventionally, electronic components that are easily affected by electromagnetic waves, such as mobile phones and medical devices, exothermic electronic components such as semiconductor elements, various electronic components such as capacitors and coils, or these electronic components are mounted on a circuit board. In order to reduce the influence of noise caused by electromagnetic waves, an electromagnetic shielding film has been attached to the surface of the electronic devices.

  As such an electromagnetic wave shielding film, for example, a film having a base material layer made of an insulating material and a metal layer laminated on one or both surfaces of the base material layer has been developed (for example, Patent Documents). 1).

  However, as described in Patent Document 1, when the electromagnetic wave shielding film has a configuration having a metal layer, there is a problem that it is not possible to cope with the reduction in weight and thickness that has been increasingly demanded in recent years.

JP 2006-156946 A

  Furthermore, in addition to the above problems in the prior art, when trying to cover an electronic component having a substrate with unevenness with an electromagnetic shielding film, the shape followability to the unevenness of the electromagnetic shielding film is not excellent, Shielding methods called metal can shields such as aluminum and SUS have been taken for electronic components having a substrate with unevenness. However, this metal can shield cannot be applied to each individual component on the board, and is applied to the assembly of components arranged according to type, and there is a restriction on the arrangement of each component on the substrate due to the influence. The design freedom of the board is not always the best from the functional aspect.

  Therefore, the object of the present invention is to increase the degree of freedom in designing the substrate, reduce the weight and reduce the thickness, and for an electronic component having a substrate with unevenness, an electromagnetic shielding film having good shape followability, Another object of the present invention is to provide a method for coating an electronic component using the electromagnetic wave shielding film.

Such an object is achieved by the present invention described in the following (1) to (17).
(1) An electromagnetic wave shielding film used for coating unevenness on a substrate,
Comprising a base material layer, an insulating layer and an electromagnetic wave shielding layer laminated on one surface side of the base material layer,
The base material layer has a storage elastic modulus at 150 ° C. of 2.0E + 05 to 2.0E + 08 Pa.

  (2) When the storage elastic modulus at 120 ° C. of the base material layer is A [Pa] and the storage elastic modulus at 150 ° C. of the base material layer is B [Pa], 0.02 ≦ A / B ≦ 1 The film for electromagnetic wave shielding as described in (1) above, which satisfies the relationship of .00.

  (3) The base material layer is a laminated body having a three-layer structure in which the first layer, the second layer, and the third layer are laminated in this order from the other surface side (1 ) Or the electromagnetic wave shielding film according to (2).

  (4) The film for electromagnetic wave shielding according to (3), wherein the first layer has an average linear expansion coefficient at 25 to 150 ° C. of 50 to 1000 [ppm / ° C.].

  (5) The film for electromagnetic wave shielding according to (3) or (4), wherein the thickness T (A) of the first layer is 5 μm or more and 100 μm or less.

  (6) The electromagnetic wave shielding film according to any one of (3) to (5), wherein the third layer has an average linear expansion coefficient at 25 to 150 ° C of 50 to 1000 [ppm / ° C]. .

  (7) The electromagnetic wave shielding film according to any one of (3) to (6), wherein a thickness T (B) of the third layer is 5 μm or more and 100 μm or less.

  (8) The electromagnetic wave shielding film according to any one of (3) to (7), wherein the second layer has an average linear expansion coefficient at 25 to 150 ° C. of 500 or more [ppm / ° C.].

  (9) The electromagnetic wave shielding film according to any one of (3) to (8), wherein a thickness T (C) of the second layer is 10 μm or more and 100 μm or less.

(10) The thickness T (A) of the first layer, the thickness T (B) of the third layer, and the thickness T (C) of the second layer satisfy the following relational expression (I). The electromagnetic wave shielding film according to any one of (3) to (9) above.
0.05 <T (C) / (T (A) + T (B)) <10 (I)

  (11) The electromagnetic wave shield according to any one of (1) to (10), wherein the insulating layer and the electromagnetic wave shielding layer form a laminated body laminated in this order from the one surface side. Film.

  (12) The electromagnetic shielding film according to (11), wherein the insulating layer is made of an insulating resin having thermoplasticity.

  (13) The electromagnetic shielding film according to (11) or (12), wherein the insulating layer has a thickness T (D) of 3 μm or more and 50 μm or less.

  (14) The electromagnetic wave shielding film according to any one of (1) to (13), wherein the electromagnetic wave shielding layer has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa.

  (15) The electromagnetic wave shielding layer includes a reflective layer and an absorption layer, and any one of the above (1) to (14), which is a laminated body laminated in this order from the one surface side. Item 4. An electromagnetic wave shielding film described in the item.

  (16) The shape following property when the electromagnetic wave shielding film is thermocompression bonded to the unevenness on the substrate under the conditions of a temperature of 150 ° C., a pressure of 2 MPa, and a time of 5 minutes is 500 μm or more and 3,000 μm or less (1 ) To (15) The electromagnetic wave shielding film according to any one of the above.

(17) Affixing the electromagnetic wave shielding film according to any one of (1) to (16) on the unevenness on the substrate so that the electromagnetic wave shielding layer or the insulating layer and the electronic component are adhered. Process,
An electronic component coating method comprising: a peeling step of peeling the base material layer after the sticking step.

  According to the present invention, the storage elastic modulus at 150 ° C. of the base material layer included in the electromagnetic wave shielding film is 2.0E + 05 to 2.0E + 08 Pa, thereby increasing the degree of freedom in designing the substrate covered with the electromagnetic wave shielding film. In addition, it is possible to reduce the weight and thickness, and to have a good shape following property for an electronic component having a substrate with unevenness.

It is a longitudinal cross-sectional view which shows 1st Embodiment of the film for electromagnetic wave shields of this invention. It is a longitudinal cross-sectional view for demonstrating the coating method of an electronic component using the electromagnetic wave shielding film shown in FIG. It is a longitudinal cross-sectional view which shows 2nd Embodiment of the film for electromagnetic wave shields of this invention. It is a longitudinal cross-sectional view which shows 3rd Embodiment of the film for electromagnetic wave shields of this invention. It is a longitudinal cross-sectional view which shows 4th Embodiment of the film for electromagnetic wave shields of this invention. It is a longitudinal cross-sectional view which shows 5th Embodiment of the film for electromagnetic wave shields of this invention. It is a longitudinal cross-sectional view which shows 6th Embodiment of the film for electromagnetic wave shields of this invention. It is a longitudinal cross-sectional view which shows 7th Embodiment of the film for electromagnetic wave shields of this invention.

  Hereinafter, the film for electromagnetic wave shielding of the present invention and the method for coating an electronic component will be described in detail based on preferred embodiments shown in the accompanying drawings.

  The electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film used for coating unevenness on a substrate, and includes a base material layer, an insulating layer laminated on one surface side of the base material layer, and an electromagnetic wave. The base material layer has a storage elastic modulus at 150 ° C. of 2.0E + 05 to 2.0E + 08 Pa.

  Also, the method for coating an electronic component of the present invention includes a pasting step of pasting the electromagnetic shielding film on the unevenness on the substrate so that the electromagnetic shielding layer or the insulating layer and the electronic component are bonded, and the pasting step And a peeling step of peeling the base material layer.

  When such an electromagnetic wave shielding film is applied to the uneven coating on the substrate, in the attaching step, the electromagnetic wave shielding film and the substrate are pressed so as to approach each other while heating the electromagnetic wave shielding film. Therefore, since the base material layer functions as a base material for the insulating layer and the electromagnetic wave shielding layer to follow the shape with respect to the unevenness, the insulating layer and the electromagnetic wave blocking layer are pushed in a state following the shape of the unevenness. Can do. As a result, the substrate provided with the unevenness can be reliably covered with the electromagnetic wave shielding layer, so that the electromagnetic wave shielding property of the substrate provided with the unevenness due to the electromagnetic wave shielding layer is improved.

<Electromagnetic wave shielding film>
First, the electromagnetic wave shielding film of the present invention will be described.

<First Embodiment>
FIG. 1 is a longitudinal sectional view showing a first embodiment of an electromagnetic wave shielding film of the present invention. In the following description, for convenience of description, the upper side in FIG. 1 is referred to as “upper” and the lower side is referred to as “lower”.

  The electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film used for covering the unevenness 6 on the substrate 5.

  As shown in FIG. 1, in this embodiment, the electromagnetic wave shielding film 100 includes a base material layer 1, an insulating layer 2, and an electromagnetic wave shielding layer 3, and the insulating layer 2 and the electromagnetic wave shielding layer 3 are The insulating layer 2 contacts the base material layer 1 from the lower surface (one surface) side of the base material layer 1 and is laminated in this order.

  The base material layer 1 includes a first layer 11, a second layer 13, and a third layer 12, which are arranged in this order from the upper surface (the other surface) side of the base material layer 1. Are stacked.

  In the following description, the electronic component 4 is mounted (placed) on the substrate 5, and the unevenness 6 including the convex portions 61 and the concave portions 62 is formed on the substrate 5 by mounting the electronic component 4. The case where 6 is covered with the electromagnetic wave shielding film 100 will be described. Examples of the electronic component 4 mounted on the substrate 5 include an LCD driver IC mounted on a flexible circuit board (FPC), an IC + capacitor around the touch panel, or an electronic circuit board (motherboard).

<Base material layer 1>
First, the base material layer 1 will be described.

  When the base material layer 1 covers the unevenness 6 by pressing the insulating layer 2 and the electromagnetic wave shielding layer 3 into the unevenness 6 on the substrate 5 using the electromagnetic wave shielding film 100 in the attaching step, the insulating layer 2 and the electromagnetic wave shielding layer 3 are pressed (embedded), and the insulating layer 2 and the electromagnetic wave shielding layer 3 function as a base material for improving the shape followability to the unevenness 6. Further, in the peeling step, the insulating layer 2 and the electromagnetic wave shielding layer 3 are pressed into the unevenness 6 and peeled from these.

  In this invention, the storage elastic modulus in 150 degreeC of this base material layer 1 is 2.0E + 05-2.0E + 08Pa.

  Thus, by setting the storage elastic modulus at the time of heating of the base material layer 1 functioning as a base material for improving the shape followability to the unevenness 6 of the insulating layer 2 and the electromagnetic wave shielding layer 3 within the above range. When the unevenness 6 on the substrate 5 is covered using the electromagnetic wave shielding film 100, the insulating layer 2 and the electromagnetic wave shielding layer 3 can be reliably pushed in a state corresponding to the shape of the unevenness 6. As a result, since the substrate 5 provided with the unevenness 6 can be reliably covered with the electromagnetic wave shielding layer 3, the electromagnetic wave shielding (blocking) property to the substrate 5 provided with the unevenness 6 by the electromagnetic wave shielding layer 3 is provided. Will be improved.

  Further, by setting the storage elastic modulus at 150 ° C. of the base material layer 1 within the above range, the step in the unevenness 6 provided on the substrate 5 is 500 μm or more, preferably 1.0 to 3.0 mm. Even if the separation distance (pitch) between the protrusions 61 in the unevenness 6 is 200 μm or less, preferably 100 μm to 150 μm, the insulation layer 2 and the electromagnetic wave The blocking layer 3 can be reliably pushed in a state corresponding to the shape of the irregularities 6.

  In addition, although the storage elastic modulus in 150 degreeC of the base material layer 1 should just be 2.0E + 05-2.0E + 08Pa, it is preferable that it is 1.0E + 06-1.0E + 08Pa, 3.0E + 06-6.0E + 07Pa. It is more preferable that Thereby, the said effect can be exhibited more notably.

  Moreover, it is preferable that the storage elastic modulus in 25 degreeC is 1.0E + 07-1.0E + 10Pa, and, as for the base material layer 1, it is more preferable that it is 5.0E + 08-5.0E + 09Pa. Thus, by setting the storage elastic modulus at room temperature (room temperature), that is, at 25 ° C., within the above range, the base material layer 1 is not liquid but solid before heating the electromagnetic shielding film 100. When the electromagnetic wave shielding film 100 is heated, it may be semi-solid (gel). Therefore, when the base material layer 1 (electromagnetic wave shielding film 100) is attached to the substrate 5, the base material layer 1 can be attached to the substrate 5 without causing wrinkles or the like, and cut to a specified size. In addition to improving the workability, the insulating layer 2 and the electromagnetic wave shielding layer 3 are surely pushed into the concave portion 62 of the concave and convex portion 6 with the base material layer 1 when pushed into the concave and convex portion 6 provided on the substrate 5. be able to. In addition, the base material layer 1 having such storage elastic modulus characteristics is such that at least the first layer 11 and the third layer 12 are made of a thermoplastic resin, and even after the heating of the electromagnetic wave shielding film 100 in the attaching step, The storage elastic modulus at 25 ° C. is preferably maintained within the above range. Thereby, the base material layer 1 can be easily peeled from the insulating layer 2 in the peeling step.

Furthermore, when the storage elastic modulus at 120 ° C. of the base material layer 1 is A [Pa] and the storage elastic modulus at 150 ° C. of the base material layer 1 is B [Pa], 0.02 ≦ A / B ≦ 1. It is preferable to satisfy the relationship of 00, and it is more preferable to satisfy the relationship of 0.02 ≦ A / B ≦ 0.50. It can be said that the base material layer 1 satisfying such a relationship has a small range of change in the storage elastic modulus of the base material layer 1 due to the temperature change during the heating. Therefore, even if the temperature condition at the time of heating is changed, the range of change in the storage elastic modulus of the base material layer 1 due to this temperature change can be kept to the minimum necessary. The base layer 1 can be pushed more reliably into the concave portion 62 of the concave and convex portion 6 of the layer 3.
In addition, the storage elastic modulus in 25 degreeC, 120 degreeC, and 150 degreeC of each layer is the storage elastic modulus of each layer which should be measured, for example using a dynamic viscoelasticity measuring apparatus (the Seiko Instruments company make, "DMS6100"). Is measured from 25 to 200 ° C. in a tensile mode with a constant load of 49 mN at a heating rate of 5 ° C./min and a frequency of 1 Hz, and the storage elastic moduli at 25 ° C., 120 ° C. and 150 ° C. are respectively read. be able to.

  In the present embodiment, the base material layer 1 includes a first layer 11, a second layer 13, and a third layer 12, which are from the upper surface (the other surface) side of the base material layer 1. These layers are laminated in this order, and the types, thicknesses, and the like of these layers 11 to 13 are appropriately combined so that the characteristics of the base material layer 1 described above are exhibited.

Hereinafter, each of these layers 11 to 13 will be described.
The first layer 11 is a pressing force possessed by a vacuum pressure laminator or the like when the insulating layer 2 and the electromagnetic wave shielding layer 3 are pushed into the unevenness 6 on the substrate 5 using, for example, a vacuum pressure laminator or the like in the pasting step. This is to provide a function of releasability with the part. Moreover, it is for propagating the pressing force from a pressing part to the 2nd layer 13 side.

  The constituent material of the first layer (first release layer) 11 is not particularly limited. For example, a resin such as syndiotactic polystyrene, polymethylpentene, polybutylene terephthalate, polypropylene, cyclic olefin polymer, and silicone. Materials. Among these, it is preferable to use syndiotactic polystyrene. Thus, since polystyrene can be provided with crystallinity by using what has a syndiotactic structure as polystyrene, the mold release from the apparatus of the 1st layer 11 originates in this. Properties, heat resistance and shape followability can be improved.

  When the syndiotactic polystyrene is used for the first layer 11, the content thereof is not particularly limited, but is preferably 60% by weight or more, more preferably 70% by weight or more and 95% by weight or less. Further, it is preferably 80% by weight or more and 90% by weight or less. When content of syndiotactic polystyrene is less than the said lower limit, there exists a possibility that the releasability of the 1st layer 11 may fall. Moreover, when content of syndiotactic polystyrene exceeds the said upper limit, there exists a possibility that the shape followability of the 1st layer 11 may become insufficient.

  The first layer 11 may be composed of only syndiotactic polystyrene. The first layer 11 may further contain a styrene elastomer, polyethylene, polypropylene, or the like in addition to the syndiotactic polystyrene.

  The thickness T (A) of the first layer 11 is not particularly limited, but is preferably 5 μm or more and 100 μm or less, more preferably 10 μm or more and 70 μm or less, and further preferably 20 μm or more and 50 μm or less. is there. When the thickness of the 1st layer 11 is less than the said lower limit, the 1st layer 11 may fracture | rupture and there exists a possibility that the release property may fall. Moreover, when the thickness of the 1st layer 11 exceeds the said upper limit, the shape followability of the base material layer 1 may fall, and there exists a possibility that the shape followability of the electromagnetic wave shielding layer 3 and the insulating layer 2 may fall.

  Moreover, it is preferable that the average linear expansion coefficient in 25-150 degreeC of the 1st layer 11 is 50-1000 [ppm / degrees C], and it is more preferable that it is 100-700 [ppm / degrees C]. By setting the average linear expansion coefficient of the first layer 11 within such a range, the first layer 11 has excellent stretchability when the electromagnetic wave shielding film 100 is heated. The shape followability with respect to the unevenness 6 of the layer 3 and the insulating layer 2 can be improved more reliably.

  In addition, the average linear expansion coefficient of each layer is, for example, a storage elastic modulus of each layer to be measured from 25 to 200 ° C., 49 mN using a thermomechanical analyzer (“TMASS6100” manufactured by Seiko Instruments Inc.). The average linear expansion coefficient at 25 ° C. to 150 ° C. can be obtained by measuring at a temperature rising rate of 5 ° C./min in a constant load tension mode.

  Furthermore, the surface tension of the first layer 11 is preferably 20 to 40 [mN / m], and more preferably 25 to 35 [mN / m]. The first layer 11 having a surface tension within such a range can be said to have excellent releasability, and the first layer 11 is peeled from the pressing portion after being pressed using a vacuum pressure laminator or the like. Can be made.

  The third layer 12 is formed by pressing the insulating layer 2 and the electromagnetic wave shielding layer 3 against the unevenness 6 on the substrate 5 using a vacuum pressure laminator or the like in the attaching step, and then in the peeling step. When the layer is peeled from the insulating layer 2, the base layer 1 is provided with a peelable function. Moreover, according to the uneven | corrugated shape on the board | substrate 5, it has the function of the tracking property which the 3rd layer 12 follows, and also has the function to propagate the pressing force from a press part on the insulating layer 2 side. is there.

  The constituent material of the third layer (second release layer) 12 is not particularly limited. For example, syndiotactic polystyrene, polymethylpentene, polybutylene terephthalate, polypropylene, cyclic olefin polymer, resin such as silicone Materials. Among these, it is preferable to use syndiotactic polystyrene. Thus, since polystyrene can be provided with crystallinity by using what has a syndiotactic structure as polystyrene, it originates in this, and with the insulating layer 2 of the 3rd layer 12 The mold releasability, as well as the heat resistance and shape followability can be improved.

  The content of the syndiotactic polystyrene in the third layer 12 is not particularly limited and may be composed only of syndiotactic polystyrene, but is preferably 60% by weight or more, and 70% by weight or more. 95% by weight or less, more preferably 80% by weight or more and 90% by weight or less. When content of syndiotactic polystyrene is less than the said lower limit, there exists a possibility that the mold release property of the 3rd layer 12 may fall. Moreover, when content of a syndiotactic polystyrene exceeds the said upper limit, there exists a possibility that the shape followability of the 3rd layer 12 may become insufficient.

  The third layer 12 may further contain a styrene elastomer, polyethylene, polypropylene, or the like in addition to the syndiotactic polystyrene. Further, the resin constituting the third layer 12 and the first layer 11 may be the same or different.

  The thickness T (B) of the third layer 12 is not particularly limited, but is preferably 5 μm or more and 100 μm or less, more preferably 10 μm or more and 70 μm or less, and further preferably 20 μm or more and 50 μm or less. is there. When the thickness of the third layer 12 is less than the lower limit, the heat resistance is insufficient, the heat resistance of the base material layer is insufficient in the thermocompression bonding process, deformation occurs, and the electromagnetic wave shielding layer and the insulating layer are deformed. There is a fear. Moreover, when the thickness of the 3rd layer 12 exceeds the said upper limit, the total thickness of the whole film for electromagnetic wave shielding becomes thick, there exists a possibility that workability | operativity, such as a cut, may fall, and it is not economical also in terms of cost. .

  The thicknesses of the third layer 12 and the first layer 11 may be the same or different.

  Moreover, it is preferable that the average linear expansion coefficient in 25-150 degreeC of the 3rd layer 12 is 50-1000 [ppm / degreeC], and it is more preferable that it is 100-700 [ppm / degreeC]. By setting the average linear expansion coefficient of the third layer 12 within this range, the third layer 12 has excellent stretchability when the electromagnetic wave shielding film 100 is heated. The shape followability of the layer 12 and the electromagnetic wave shielding layer 3 and the insulating layer 2 with respect to the irregularities 6 can be improved more reliably.

  Furthermore, the surface tension of the third layer 12 is preferably 20 to 40 [mN / m], and more preferably 25 to 35 [mN / m]. The third layer 12 having a surface tension within such a range can be said to have excellent releasability, and the base material layer 1 is peeled from the insulating layer 2 after being pushed in using a vacuum pressure laminator or the like. In doing so, the base material layer 1 can be reliably peeled off at the interface between the third layer 12 and the insulating layer 2.

  The second layer 13 is a third layer when the insulating layer 2 and the electromagnetic wave shielding layer 3 are pressed into the unevenness 6 on the substrate 5 using the base material layer 1 as a pressing base material in the attaching step. 12 has a cushioning function for pushing (embedding) 12 into the irregularities 6. Further, the second layer 13 has a function of causing the pushing force to uniformly act on the third layer 12 and further on the insulating layer 2 and the electromagnetic wave shielding layer 3 via the third layer 12. Thus, the insulating layer 2 and the electromagnetic wave shielding layer 3 can be pushed into the irregularities 6 with excellent sealing properties without generating voids between the electromagnetic wave shielding layer 3 and the irregularities 6.

  As a constituent material of the second layer (cushion layer) 13, for example, an α-olefin polymer such as polyethylene or polypropylene, ethylene, propylene, butene, pentene, hexene, methylpentene, or the like is included as a copolymer component. Engineering plastics resins such as α-olefin copolymer, polyethersulfone, polyphenylene sulfide and the like may be used, and these may be used alone or in combination. Among these, it is preferable to use an α-olefin copolymer. Specifically, a copolymer of α-olefin such as ethylene and (meth) acrylic acid ester, a copolymer of ethylene and vinyl acetate, a copolymer of ethylene and (meth) acrylic acid (EMMA), And a partial ion cross-linked product thereof. Since the α-olefin copolymer is excellent in shape followability and further excellent in flexibility as compared with the constituent material of the third layer 12, the second layer 13 made of the constituent material has the The cushion function for pushing (embedding) the third layer 12 into the unevenness 6 can be surely provided.

  The thickness T (C) of the second layer 13 is not particularly limited, but is preferably 10 μm or more and 100 μm or less, more preferably 20 μm or more and 80 μm or less, and further preferably 30 μm or more and 60 μm or less. is there. When the thickness of the second layer 13 is less than the lower limit value, the shape followability of the second layer 13 is insufficient, and the followability to the unevenness 6 may be insufficient in the thermocompression bonding step. Further, when the thickness of the second layer 13 exceeds the upper limit value, the resin from the second layer 13 is increased in the thermocompression bonding process, and adheres to the hot platen of the crimping apparatus, thereby reducing workability. There is a risk of doing.

  The average linear expansion coefficient of the second layer 13 at 25 to 150 ° C. is preferably 500 or more [ppm / ° C.], more preferably 1000 or more [ppm / ° C.]. By setting the average linear expansion coefficient of the second layer 13 within such a range, the second layer 13 can be expanded and contracted more excellently than the third layer 12 when the electromagnetic wave shielding film 100 is heated. It can be made easy to have a property. Therefore, the shape followability of the second layer 13 and the electromagnetic wave shielding layer 3 and the insulating layer 2 with respect to the irregularities 6 can be improved more reliably.

  In addition, it is easy to set the storage elastic modulus at 150 ° C. of the base material layer 1 within the range of 2.0E + 05 to 2.0E + 08 Pa by appropriately setting the average linear expansion coefficient of each layer 11 to 13 within the above-described range. Can be set to

The thickness T (A) of the first layer 11, the thickness T (B) of the third layer 12, and the thickness T (C) of the second layer 13 satisfy the following relational expression, for example. Preferably,
0.05 <T (C) / (T (A) + T (B)) <10,
More preferably, the following relational expression is satisfied:
0.14 <T (C) / (T (A) + T (B)) <4,
More preferably, the following relational expression is satisfied:
0.3 <T (C) / (T (A) + T (B)) <1.5.

  When the thickness T (A) of the first layer 11, the thickness T (B) of the third layer 12, and the thickness T (C) of the second layer 13 satisfy the relational expression, the shape follows. More improved.

  The total thickness T (F) of the base material layer 1 is not particularly limited, but is preferably 20 μm or more and 300 μm or less, more preferably 40 μm or more and 220 μm or less, and further preferably 70 μm or more and 160 μm or less. It is. When the whole thickness of the base material layer 1 is less than the said lower limit, the 1st layer 11 may fracture | rupture and there exists a possibility that the release property of the base material layer 1 may fall. Moreover, when the whole thickness of the base material layer 1 exceeds the said upper limit, there exists a possibility that the shape followability of the base material layer 1 may fall and the shape followability of the electromagnetic wave shielding layer 3 and the insulating layer 2 may fall.

<Insulating layer 2>
Next, the insulating layer 2 will be described.

  In this embodiment, the insulating layer 2 is provided in contact with the base material layer 1 (third layer 12), and is laminated in the order of the insulating layer 2 and the electromagnetic wave shielding layer 3 from the base material layer 1 side. The electromagnetic wave shielding layer 3 comes into contact with the substrate 5 and the electronic component 4 by covering the unevenness 6 on the substrate 5 with the electromagnetic wave shielding film 100 including the insulating layer 2 and the electromagnetic wave shielding layer 3 laminated in this manner. The electromagnetic wave shielding layer 3 and the insulating layer 2 are coated in this order from the substrate 5 side.

  Thus, in the present embodiment, the insulating layer 2 covers the substrate 5 and the electronic component 4 via the electromagnetic wave shielding layer 3, whereby the substrate 5, the electronic component 4 and the electromagnetic wave shielding layer 3 are covered with the insulating layer. 2 to insulate from other members (such as electronic components) located on the opposite side of the substrate 5.

  Examples of the insulating layer 2 include a thermosetting insulating resin or a thermoplastic insulating resin (insulating film). Among these, it is preferable to use an insulating resin having thermoplasticity. Since the insulating resin having thermoplasticity is a film having excellent flexibility, the insulating layer 2 and the electromagnetic waves are formed on the unevenness 6 on the substrate 5 by using the base material layer 1 as a pressing base material in the attaching step. When the blocking layer 3 is pushed in, the insulating layer 2 can be made to reliably follow the shape of the irregularities 6. In addition, an insulating resin having thermoplasticity is particularly useful when repairing a substrate because it can be re-peeled from the substrate to be bonded when heated to its softening point temperature.

  Examples of the thermoplastic insulating resin include thermoplastic polyester, α-olefin, vinyl acetate, polyvinyl acetal, ethylene vinyl acetate, vinyl chloride, acrylic, polyamide, and cellulose. Among these, it is preferable to use thermoplastic polyesters and α-olefins because they are excellent in adhesion to the substrate, flexibility and chemical resistance.

  Furthermore, the insulating resin having thermoplasticity is a phenolic resin, a silicone resin, a urea resin, an acrylic resin, a polyester resin, a polyamide resin, as long as the performance such as heat resistance and flex resistance is not impaired. A polyimide resin or the like can be contained. In addition, in the insulating resin having thermoplasticity, as in the case of the conductive adhesive layer described later, a silane coupling agent, an antioxidant, a pigment, a dye, as long as the adhesiveness and solder reflow resistance are not deteriorated. You may add tackifying resin, a plasticizer, a ultraviolet absorber, an antifoamer, a leveling regulator, a filler, a flame retardant, etc.

  The thickness T (D) of the insulating layer 2 is not particularly limited, but is preferably 3 μm or more and 50 μm or less, more preferably 4 μm or more and 30 μm or less, and further preferably 5 μm or more and 20 μm or less. When the thickness of the insulating layer 2 is less than the lower limit value, the resistance to goby folds is insufficient, cracks are generated at the bent portions after thermocompression bonding to the projections and depressions 6, the film strength decreases, and the conductive adhesive layer It is difficult to play a role as an insulating support. If the upper limit is exceeded, shape followability may be insufficient. That is, by setting the thickness T (D) of the insulating layer 2 within the above range, the insulating layer 2 can be made more flexible, and the base material layer 1 can be used as a base for pushing in the attaching step. When the insulating layer 2 and the electromagnetic wave shielding layer 3 are pushed into the unevenness 6 on the substrate 5 by using as a material, the insulating layer 2 can be made to follow more reliably corresponding to the shape of the unevenness 6.

  Moreover, it is preferable that the average linear expansion coefficient in 25-150 degreeC of the insulating layer 2 is 50-1000 [ppm / degrees C], and it is more preferable that it is 100-700 [ppm / degrees C]. By setting the average linear expansion coefficient of the insulating layer 2 within this range, the insulating layer 2 has excellent stretchability when the electromagnetic wave shielding film 100 is heated. The shape following property with respect to the unevenness 6 of the electromagnetic wave shielding layer 3 can be improved more reliably.

  In addition, as shown in FIGS. 1 and 2, the insulating layer 2 may be a laminated body of two or more layers obtained by laminating different ones of the above-described insulating films in addition to the one constituted by one layer. .

<Electromagnetic wave blocking layer 3>
Next, the electromagnetic wave blocking layer (blocking layer) 3 will be described.

  The electromagnetic wave shielding layer 3 includes an electronic component 4 provided on the substrate 5, and other electronic components located on the opposite side of the substrate 5 (electronic component 4) via the electromagnetic wave shielding layer 3. It has a function of shielding (shielding) electromagnetic waves generated from one side.

  The electromagnetic wave shielding layer 3 is not particularly limited, and may be any type of electromagnetic wave shielding material. For example, a reflection layer that shields (shields) an electromagnetic wave incident on the electromagnetic wave shielding layer 3; And an absorption layer that blocks (shields) the electromagnetic wave incident on the electromagnetic wave blocking layer 3 by absorbing the electromagnetic wave.

Hereinafter, each of the reflective layer and the absorbing layer will be described.
As described above, the reflective layer blocks the electromagnetic wave incident on the reflective layer by reflecting it.

  Examples of the reflective layer include a surface treatment of a conductive material such as a conductive adhesive layer, a metal thin film layer, a metal mesh, and ITO. These may be used alone or in combination. Among these, it is preferable to use a conductive adhesive layer. The conductive adhesive layer is preferably used as a reflective layer because it exhibits excellent electromagnetic shielding properties even when its film thickness (thickness) is set to be relatively thin.

  The conductive adhesive layer includes a metal powder and a binder resin, and examples of the metal powder include gold, silver, copper, silver-coated copper, and nickel. Among these, it is preferable to use silver because it has excellent electromagnetic shielding properties.

  The content ratio of the metal powder and the binder resin in the conductive adhesive layer is not particularly limited, but is preferably 40:60 to 90:10 by weight, and preferably 50:50 to 80:20. More preferably, it is more preferably 55:45 to 70:30. When the content ratio of the metal powder and the binder resin is less than the lower limit, it may be difficult to develop conductivity. Moreover, when the content ratio of metal powder and binder resin exceeds the said upper limit, there exists a possibility that flexibility and adhesiveness with an electronic device component may fall.

  In addition to the metal powder and the binder resin, the conductive adhesive layer may further contain a flame retardant, a leveling agent, a viscosity modifier, and the like.

  The thickness T (E1) of the reflective layer is not particularly limited, but is preferably 5 μm or more and 100 μm or less, more preferably 8 μm or more and 50 μm or less, and further preferably 10 μm or more and 30 μm or less. When the thickness of the reflective layer is less than the lower limit, depending on the constituent material of the reflective layer and the like, there is a risk that the folding resistance will be insufficient, and there is a possibility of breaking at the end of the mounted component. When the thickness of the reflective layer exceeds the upper limit, the shape following property may be insufficient depending on the constituent material of the reflective layer. Further, even when the thickness T (E1) within such a range can be exhibited excellent electromagnetic wave shielding properties, it is possible to reduce the thickness of the reflective layer T (E1), and thus the insulating layer 2 and the shielding layer. It is possible to reduce the weight of the substrate 5 on which the electronic component 4 covered with the layer (reflective layer) 3 is mounted.

  As described above, the absorption layer absorbs the electromagnetic wave incident on the absorption layer and converts it into heat energy to block it.

  As this absorption layer, for example, a conductive absorption layer composed mainly of a conductive absorption material such as metal powder and a conductive polymer material, and a dielectric absorption material such as a carbon-based material and a conductive polymer material as a main material. Examples thereof include a dielectric absorption layer, a magnetic absorption layer composed mainly of a magnetic absorption material such as a soft magnetic metal, and these may be used alone or in combination.

  The conductive absorption layer absorbs electromagnetic waves by converting electromagnetic energy into thermal energy by the current flowing inside the material when an electric field is applied, and the dielectric absorption layer converts electromagnetic waves into thermal energy by dielectric loss. Thus, the electromagnetic wave is absorbed, and the magnetic absorption layer absorbs the electromagnetic wave by converting the energy of the radio wave to heat due to magnetic loss such as overcurrent loss, hysteresis loss, and magnetic resonance.

Among these, it is preferable to use a dielectric absorption layer and a conductive absorption layer.
Even if the film thickness (thickness) is set to be relatively thin, the dielectric absorption layer and the conductive absorption layer are preferably used as the absorption layer because they exhibit particularly excellent electromagnetic shielding properties. In addition, since the particle size of the material contained in the layer is small and the amount of addition can be reduced, the film thickness can be set relatively easily and the weight can be reduced.

  Examples of the conductive absorption material include conductive polymers, metal oxides such as ATO, and conductive ceramics.

  Examples of the conductive polymer include polyacetylene, polypyrrole, PEDOT (poly-ethylene dioxythiophene), PEDOT / PSS, polythiophene, polyaniline, poly (p-phenylene), polyfluorene, polycarbazole, polysilane, and derivatives thereof. 1 type or 2 types or more of these can be used in combination.

Examples of the dielectric absorbing material include carbon-based materials and conductive polymers.
Examples of carbon-based materials include carbon nanotubes such as single-walled carbon nanotubes and multi-walled carbon nanotubes, carbon nanofibers, CN nanotubes, CN nanofibers, BCN nanotubes, BCN nanofibers, graphene, carbon microcoils, carbon Examples thereof include carbon such as nanocoil, carbon nanohorn, and carbon nanowall, and one or more of these can be used in combination.

  Further, examples of the magnetic absorbing material include iron, silicon steel, magnetic stainless steel (Fe—Cr—Al—Si alloy), sendust (Fe—Si—Al alloy), permalloy (Fe—Ni alloy), silicon copper (Fe -Cu-Si alloy), Fe-Si alloy, soft magnetic metal such as Fe-Si-B (-Cu-Nb) alloy, ferrite and the like.

  The thickness T (E2) of the absorbent layer is not particularly limited, but is preferably 1 μm or more and 100 μm or less, more preferably 2 μm or more and 80 μm or less, and further preferably 3 μm or more and 50 μm or less. When the thickness of the absorbent layer is less than the lower limit, depending on the constituent material of the absorbent layer, there is a risk of breaking at the end of the board-mounted component. Moreover, when the thickness of an absorption layer exceeds the said upper limit, there exists a possibility that shape followability may be insufficient depending on the constituent material etc. of an absorption layer. Further, even if the thickness T (E2) within such a range can be exhibited excellent electromagnetic wave shielding properties, it is possible to reduce the thickness T (E2) of the absorption layer, and thus the insulating layer 2 and the shielding layer. It is possible to reduce the weight of the substrate 5 on which the electronic component 4 covered with the layer (absorbing layer) 3 is mounted.

  The electromagnetic wave shielding layer 3 as described above preferably has an electromagnetic wave shielding property for shielding (shielding) electromagnetic waves of 5 dB or more, more preferably 30 dB or more, and further preferably 50 dB or more. It can be said that the electromagnetic wave shielding layer 3 having such an electromagnetic wave shielding property has an excellent electromagnetic wave shielding property, and can more reliably block electromagnetic waves.

  Moreover, it is preferable that the storage elastic modulus in 150 degreeC of the electromagnetic wave shielding layer 3 is 1.0E + 05-1.0E + 09Pa, and it is more preferable that it is 5.0E + 05-5.0E + 08Pa. By setting the storage elastic modulus within such a range, in the pasting step, after heating the electromagnetic wave shielding film 100, the insulating layer 2 and the electromagnetic wave are formed on the unevenness 6 on the substrate 5 by pressing force from the base material layer 1. By pressing the blocking layer 3, the electromagnetic wave blocking layer 3 can be deformed corresponding to the shape of the unevenness 6 according to the pressing force from the base material layer 1 when covering the unevenness 6. That is, the shape followability of the electromagnetic wave shielding layer 3 with respect to the unevenness 6 can be improved.

  As described above, the electromagnetic wave shielding layer 3 may be either a reflection layer or an absorption layer. However, when the electromagnetic wave shielding layer 3 has substantially the same electromagnetic wave shielding properties, it is preferably an absorption layer. In the absorption layer, the electromagnetic wave incident on the absorption layer is absorbed and blocked by converting it into thermal energy. This absorption causes the electromagnetic wave to disappear, so that the reflected electromagnetic wave is covered with the electromagnetic wave blocking layer 3 as in the reflective layer. It is possible to reliably prevent adverse effects such as malfunctions from being exerted on other members that are not provided.

  The electromagnetic wave shielding film 100 having the above-described configuration is a shape when thermocompression bonding is performed on the unevenness 6 formed by mounting the electronic component 4 on the substrate 5 at a temperature of 150 ° C., a pressure of 2 MPa, and a time of 5 minutes. The followability is preferably 500 μm or more, more preferably 800 μm or more, and still more preferably 1000 μm or more. That is, the electromagnetic wave shielding film 100 can preferably cover the unevenness 6 having a height of 500 μm or more, which is the difference in height between the upper surface of the convex portion 61 and the upper surface of the concave portion 62, and can cover a thickness of 800 μm or more. More preferably, it is more preferable that a film having a thickness of 1000 μm or more can be coated. Thus, it can be said that the electromagnetic wave shielding film 100 that can be covered even with the unevenness 6 having a high height (a large level difference) has excellent shape followability, and the insulating layer 2 and the electromagnetic wave shielding. The layer 3 can cover the unevenness 6 with an excellent filling rate.

The shape following property can be obtained as follows.
That is, first, a printed wiring board (motherboard) having a length of 100 mm × width 100 mm × height 2 mm has a width of 0.2 mm and grooves of each necessary step are formed in a grid pattern at intervals of 0.2 mm. Get the substrate. Then, the film for electromagnetic wave shielding is pressure-bonded to the printed wiring board under a condition of 150 ° C. × 2 MPa × 5 minutes using a vacuum pressurizing laminator, and attached to the printed wiring board. After pasting, the base material layer is peeled off from the electromagnetic wave shielding film, and it is determined whether or not there is a gap between the blocking layer and insulating layer stuck on the printed wiring board and the groove on the printed wiring board. In addition, it observed and evaluated with the microscope and the microscope whether there was a space | gap.

<Method of coating electronic parts>
Next, the method for coating an electronic component according to the present invention will be described.

  The method for coating an electronic component according to the present invention includes a pasting step of pasting the electromagnetic shielding film on the unevenness on the substrate so that the electromagnetic wave shielding layer or the insulating layer and the electronic component are bonded, and after the pasting step And a peeling step for peeling off the base material layer.

  FIG. 2 is a longitudinal sectional view for explaining a method of coating an electronic component using the electromagnetic wave shielding film shown in FIG.

Hereafter, each process of the coating method of an electronic component is demonstrated sequentially.
(Attaching process)
The affixing step is a step of affixing the electromagnetic wave shielding film 100 to the unevenness 6 provided on the substrate 5, for example, as shown in FIG.

The method for attaching is not particularly limited, and examples thereof include vacuum / pressure forming.
Vacuum / pressure forming is, for example, a method of covering the irregularities 6 on the substrate 5 with the electromagnetic wave shielding film 100 using a vacuum pressurizing laminator. First, the substrate 5 is placed in a closed space that can be in a vacuum atmosphere. The substrate 5 and the electromagnetic wave shielding film 100 are set in an overlapped state so that the surface on which the unevenness 6 is formed and the surface on the insulating layer 2 side of the electromagnetic wave shielding film 100 face each other, and thereafter In the heating process, the closed space is placed in a vacuum atmosphere and then pressurized so that the electromagnetic wave shielding film 100 and the substrate 5 approach each other uniformly from the electromagnetic wave shielding film 100 side.

  Under the present circumstances, in this invention, the storage elastic modulus in 150 degreeC of the base material layer 1 is 2.0E + 05-2.0E + 08Pa. Therefore, the base material layer 1 exhibits excellent shape followability with respect to the irregularities 6 during heating in vacuum / pressure forming.

  Therefore, in this state, the base layer 1 is deformed in accordance with the shape of the irregularities 6 by uniformly pressing from the electromagnetic wave shielding film 100 side while making the closed space under a vacuum atmosphere. Along with the deformation, the insulating layer 2 and the electromagnetic wave shielding layer 3 located closer to the substrate 5 than the base material layer 1 are deformed corresponding to the shape of the irregularities 6. Accordingly, the unevenness 6 is covered with the insulating layer 2 and the electromagnetic wave shielding layer 3 in a state where the insulating layer 2 and the electromagnetic wave shielding layer 3 are pushed in corresponding to the shape of the unevenness 6.

  In such a pasting step, the temperature for pasting is not particularly limited, but is preferably 100 ° C. or higher and 200 ° C. or lower, more preferably 120 ° C. or higher and 180 ° C. or lower.

  Moreover, the pressure to stick is not particularly limited, but is preferably 0.5 MPa or more and 5.0 MPa or less, more preferably 1.0 MPa or more and 3.0 MPa or less.

  Furthermore, although the time to stick is not specifically limited, It is preferable that it is 1 minute or more and 30 minutes or less, More preferably, it is 5 minutes or more and 15 minutes or less.

  By setting the conditions in the pasting step within the above range, the insulating layer 2 and the electromagnetic wave shielding layer 3 are pushed into the concave and convex portions 6 on the substrate 5, and the concave and convex portions 6 are formed by the insulating layer 2 and the electromagnetic wave shielding layer 3. It can be reliably coated.

(Peeling process)
The said peeling process is a process of peeling the base material layer 1 from the film 100 for electromagnetic wave shields after the said sticking process, for example, as shown in FIG.2 (b).

  By this peeling process, in this embodiment, peeling arises in the interface of the base material layer 1 and the insulating layer 2 in the electromagnetic wave shielding film 100, and as a result, the base material layer 1 is peeled from the insulating layer 2. Thus, the unevenness 6 is covered with the insulating layer 2 and the electromagnetic wave shielding layer 3 in a state where the base material layer 1 is peeled from the insulating layer 2.

  In addition, in the covering of the unevenness 6 with the insulating layer 2 and the electromagnetic wave shielding layer 3 using such an electromagnetic wave shielding film 100, as shown in FIG. 2, the shape of the electromagnetic wave shielding film 100 to be applied corresponds, The unevenness 6 can be covered with the insulating layer 2 and the electromagnetic wave shielding layer 3. Therefore, the unevenness 6 to be covered can be selectively covered with the insulating layer 2 and the electromagnetic wave shielding layer 3 by appropriately setting the shape of the electromagnetic wave shielding film 100 corresponding to the shape of the unevenness 6 to be covered. . That is, the electromagnetic wave can be selectively shielded from the unevenness 6 by the insulating layer 2 and the electromagnetic wave shielding layer 3.

  Further, the method for peeling the base material layer 1 is not particularly limited. However, when the electromagnetic wave shielding film 100 after the vacuum pressure forming (the pasting step) is in a high temperature state, the base material layer 1 is stretched and resin Since the remainder etc. generate | occur | produce and peeling workability | operativity may fall, the peeling by manual work is mentioned.

  In this manual peeling, for example, first, one end portion of the base material layer 1 is gripped, the base material layer 1 is peeled off from the insulating layer 2 from the gripped end portion, and then the central portion is cut from the end portion. Furthermore, the base material layer 1 is peeled from the insulating layer 2 by sequentially peeling the base material layer 1 to the other end.

  The peeling temperature is preferably 180 ° C. or lower, more preferably 150 ° C. or lower, and further preferably 100 ° C. or lower.

  By passing through the above processes, the unevenness | corrugation 6 can be coat | covered with the insulating layer 2 and the electromagnetic wave shielding layer 3 in the state which peeled the base material layer 1 from the insulating layer 2. FIG.

  In the present embodiment, as shown in FIG. 1, as the electromagnetic wave shielding film 100, the base material layer 1 (first layer 11, second layer 13, third layer 12) from the upper surface side. The case where the insulating layer 2 and the electromagnetic wave shielding layer 3 are laminated in this order to cover the unevenness 6 on the substrate 5 with the insulating layer 2 and the electromagnetic wave shielding layer 3 has been described. The layer configuration of 100 is not limited to this case, and may be, for example, the electromagnetic shielding film 100 having the layer configuration as shown in the second to seventh embodiments as described below.

Second Embodiment
Hereinafter, 2nd Embodiment of the film for electromagnetic wave shielding of this invention is described.

  FIG. 3 is a longitudinal sectional view showing a second embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 3 is referred to as “upper” and the lower side is referred to as “lower”.

  Hereinafter, although the electromagnetic wave shielding film 100 shown in FIG. 3 will be described, the description will focus on differences from the electromagnetic wave shielding film 100 shown in FIG. 1, and description of similar matters will be omitted.

  The electromagnetic wave shielding film 100 shown in FIG. 3 is the same as the electromagnetic wave shielding film 100 shown in FIG. 1 except that the formation of the first layer 11 included in the base material layer 1 is omitted.

  That is, in the present embodiment, the electromagnetic wave shielding film 100 includes the base material layer 1 including the second layer 13 and the third layer 12, the insulating layer 2, and the electromagnetic wave shielding layer 3 laminated in this order. The laminated body is made.

  In the electromagnetic wave shielding film 100 having such a configuration, the pressing portion of the vacuum pressurizing laminator or the like used when the insulating layer 2 and the electromagnetic wave shielding layer 3 are pressed into the unevenness 6 on the substrate 5 in the attaching step is the second layer. 13, so that the formation of the first layer 11 is omitted.

  In this case, the degree of releasability of the contact surface in contact with the second layer 13 of the pressing portion can be expressed by the surface tension of the contact surface, and the surface tension of the contact surface is 20 to 40 mN / m. It is preferable that it is 25-35 mN / m. When the contact surface has a surface tension within such a range, the pressing portion can be reliably peeled off from the second layer 13 after pressing using a vacuum pressurizing laminator or the like.

  The electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained.

<Third Embodiment>
Next, a third embodiment of the electromagnetic wave shielding film of the present invention will be described.

  FIG. 4 is a longitudinal sectional view showing a third embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 4 is referred to as “upper” and the lower side is referred to as “lower”.

  Hereinafter, the electromagnetic wave shielding film 100 shown in FIG. 4 will be described. However, the difference from the electromagnetic wave shielding film 100 shown in FIG. 1 will be mainly described, and the description of the same matters will be omitted.

  The electromagnetic wave shielding film 100 shown in FIG. 4 is the same as the electromagnetic wave shielding film 100 shown in FIG. 1 except that the formation of the third layer 12 included in the base material layer 1 is omitted.

  That is, in this embodiment, the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11 and the second layer 13, the insulating layer 2, and the electromagnetic wave shielding layer 3 laminated in this order. The laminated body is made.

  In the electromagnetic wave shielding film 100 having such a configuration, when the base material layer 1 is peeled from the insulating layer 2 in the peeling step, the base material layer 1 is separated from the insulating layer 2 at the interface between the second layer 13 and the insulating layer 2. It is peeled off. In such peeling, the insulating layer 2 has releasability from the second layer 13, whereby the formation of the third layer 12 is omitted.

  In this case, the degree of releasability of the contact surface in contact with the second layer 13 of the insulating layer 2 can be expressed by the surface tension of the contact surface, and the surface tension of the contact surface is 20 to 40 mN / m. It is preferable that it is 25-35 mN / m. When the contact surface has a surface tension within such a range, the second layer 13 can be reliably peeled off from the insulating layer 2 after being pressed using a vacuum pressure laminator or the like.

  Examples of the insulating layer 2 having surface tension include thermoplastic polyester and α-olefin.

  The electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained.

<Fourth embodiment>
Next, a fourth embodiment of the electromagnetic wave shielding film of the present invention will be described.

  FIG. 5 is a longitudinal sectional view showing a fourth embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 5 is referred to as “upper” and the lower side is referred to as “lower”.

  Hereinafter, although the electromagnetic wave shielding film 100 shown in FIG. 5 will be described, differences from the electromagnetic wave shielding film 100 shown in FIG. 1 will be mainly described, and description of similar matters will be omitted.

  In the electromagnetic wave shielding film 100 shown in FIG. 5, the formation of the third layer 12 included in the base material layer 1 is omitted, and the stacking order of the insulating layer 2 and the electromagnetic wave shielding layer 3 is reversed, This is the same as the electromagnetic wave shielding film 100 shown in FIG.

  That is, in this embodiment, the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11 and the second layer 13, the electromagnetic wave shielding layer 3, and the insulating layer 2 laminated in this order. The laminated body is made.

  In the electromagnetic wave shielding film 100 having such a configuration, when the base material layer 1 is peeled from the electromagnetic wave shielding layer 3 in the peeling step, the base material layer 1 is shielded from electromagnetic waves at the interface between the second layer 13 and the electromagnetic wave shielding layer 3. Peel from layer 3. In such peeling, the electromagnetic wave shielding layer 3 has releasability from the second layer 13, and thus the formation of the third layer 12 is omitted.

  In this case, the degree of releasability of the contact surface in contact with the second layer 13 of the electromagnetic wave shielding layer 3 can be expressed by the surface tension of the contact surface, and the surface tension of the contact surface is 20 to 40 mN / m is preferable, and 25 to 35 mN / m is more preferable. When the contact surface has a surface tension within such a range, the second layer 13 can be reliably peeled from the electromagnetic wave shielding layer 3 after being pressed using a vacuum pressurizing laminator or the like.

  Examples of the electromagnetic wave shielding layer 3 having surface tension include a material obtained by dispersing a carbon-based material or a conductive polymer in a thermosetting resin such as polyurethane.

  The electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained.

<Fifth Embodiment>
Next, a fifth embodiment of the electromagnetic wave shielding film of the present invention will be described.

  FIG. 6 is a longitudinal sectional view showing a fifth embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of description, the upper side in FIG. 6 is referred to as “upper” and the lower side is referred to as “lower”.

  Hereinafter, although the electromagnetic wave shielding film 100 shown in FIG. 6 will be described, the description will focus on differences from the electromagnetic wave shielding film 100 shown in FIG. 1, and description of similar matters will be omitted.

  The electromagnetic wave shielding film 100 shown in FIG. 6 is the same as the electromagnetic wave shielding film 100 shown in FIG. 1 except that the stacking order of the insulating layer 2 and the electromagnetic wave shielding layer 3 is reversed.

  That is, in this embodiment, the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11, the second layer 13, and the third layer 12, the insulating layer 2, and the electromagnetic wave shielding layer 3. The laminated body is laminated in this order. The electromagnetic wave shielding layer 3 comes into contact with the substrate 5 and the electronic component 4 by coating the unevenness 6 on the substrate 5 using the electromagnetic wave shielding film 100 including the electromagnetic wave shielding layer 3 and the insulating layer 2 laminated in this manner. The electromagnetic wave shielding layer 3 and the insulating layer 2 are coated in this order from the substrate 5 side.

  As described above, in the present embodiment, the electromagnetic wave shielding layer 3 covers the substrate 5 and the electronic component 4 in contact with them, whereby the substrate 5 and the electronic component 4 are disposed via the insulating layer 2. 5 is insulated from the electromagnetic wave shielding layer 3 and other members (electronic parts, etc.) located on the side opposite to the side 5.

  Therefore, in the electromagnetic wave shielding film 100 having such a configuration, for example, even when the electromagnetic wave shielding layer 3 includes a conductive material, the adjacent electronic components 4 can be reliably insulated by the insulating layer 2. it can.

  The electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained.

<Sixth Embodiment>
Next, a sixth embodiment of the electromagnetic wave shielding film of the present invention will be described.

  FIG. 7 is a longitudinal sectional view showing a sixth embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 7 is referred to as “upper” and the lower side is referred to as “lower”.

  Hereinafter, although the electromagnetic wave shielding film 100 shown in FIG. 7 will be described, differences from the electromagnetic wave shielding film 100 shown in FIG. 1 will be mainly described, and description of similar matters will be omitted.

  In the electromagnetic wave shielding film 100 shown in FIG. 7, the electromagnetic wave shielding layer 3 is not a single layer structure, but a laminated body composed of an absorption layer 31 and a reflective layer 32, and from the lower surface (one surface) side of the base material layer 1, The electromagnetic wave shielding film 100 shown in FIG. 1 is the same as the electromagnetic wave shielding film 100 except that the absorbing layer 31 contacts the insulating layer 2 and is laminated in that order.

  That is, in this embodiment, the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11, the second layer 13, and the third layer 12, the insulating layer 2, the absorption layer 31, and the reflection layer. The electromagnetic wave shielding layer 3 made of 32 forms a laminated body laminated in this order. By coating the unevenness 6 on the substrate 5 using the electromagnetic wave shielding film 100 including the electromagnetic wave shielding layer 3 constituted of such a laminate, the absorbing layer 31 is disposed outside the unevenness 6, and the reflective layer 32. Is disposed on the inner side with respect to the unevenness 6, and the unevenness 6 is covered with the insulating layer 2 and the electromagnetic wave shielding layer 3. Thus, in this embodiment, since the electromagnetic wave shielding layer 3 is composed of a laminated body including the absorption layer 31 and the reflective layer 32, the electromagnetic wave shielding property by the electromagnetic wave shielding layer 3 can be further improved.

  Moreover, in the electromagnetic wave shielding layer 3 having such a configuration, the absorption layer 31 preferably has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa, and more preferably 5.0E + 05 to 5.0E + 08 Pa. .

  Furthermore, the reflective layer 32 preferably has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa, and more preferably 5.0E + 05 to 5.0E + 08 Pa.

  By setting the storage elastic modulus in the absorption layer 31 and the reflection layer 32 laminated in the order as described above within the ranges, respectively, the absorption layer 31 and the absorption layer 31 according to the pressing force from the base material layer 1 The electromagnetic wave shielding layer 3 including the reflective layer 32 can be more reliably deformed corresponding to the shape of the irregularities 6.

  The electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained.

<Seventh embodiment>
Next, a seventh embodiment of the electromagnetic wave shielding film of the present invention will be described.

  FIG. 8 is a longitudinal sectional view showing a seventh embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 8 is referred to as “upper” and the lower side is referred to as “lower”.

  Hereinafter, although the electromagnetic wave shielding film 100 shown in FIG. 8 will be described, differences from the electromagnetic wave shielding film 100 shown in FIG. 1 will be mainly described, and description of similar matters will be omitted.

  In the electromagnetic wave shielding film 100 shown in FIG. 8, the electromagnetic wave shielding layer 3 is not a single layer structure, but a laminated body composed of the reflective layer 32 and the absorbing layer 31, and from the lower surface (one surface) side of the base material layer 1, Except that the reflective layer 32 is in contact with the insulating layer 2 and laminated in that order, it is the same as the electromagnetic wave shielding film 100 shown in FIG.

  That is, in this embodiment, the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11, the second layer 13, and the third layer 12, the insulating layer 2, the reflection layer 32, and the absorption layer. The electromagnetic wave shielding layer 3 composed of 31 forms a laminated body laminated in this order. By covering the unevenness 6 on the substrate 5 with the electromagnetic wave shielding film 100 including the electromagnetic wave shielding layer 3 constituted of such a laminate, the reflective layer 32 is placed outside the unevenness 6, and the absorbing layer 31. Is disposed on the inner side with respect to the unevenness 6, and the unevenness 6 is covered with the insulating layer 2 and the electromagnetic wave shielding layer 3. Thus, in this embodiment, since the electromagnetic wave shielding layer 3 is composed of a laminated body including the reflective layer 32 and the absorbing layer 31, the electromagnetic wave shielding property by the electromagnetic wave shielding layer 3 can be further improved.

  Moreover, in the electromagnetic wave shielding layer 3 having such a configuration, the reflection layer 32 preferably has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa, and more preferably 5.0E + 05 to 5.0E + 08 Pa. .

  Furthermore, the absorption layer 31 preferably has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa, and more preferably 5.0E + 05 to 5.0E + 08 Pa.

  By setting the storage elastic modulus in the reflecting layer 32 and the absorbing layer 31 laminated in the order as described above within the above range, the reflecting layer 32 and the reflecting layer 32 and the absorbing layer 31 are set according to the pressing force from the base material layer 1. The electromagnetic wave shielding layer 3 including the absorption layer 31 can be more reliably deformed corresponding to the shape of the irregularities 6.

  The electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and is similar to the electromagnetic wave shielding film 100 of the first embodiment. The effect is obtained.

  The electromagnetic wave shielding film of the sixth embodiment and the electromagnetic wave shielding film of the seventh embodiment, except that the order of lamination of the reflective layer 32 and the absorbing layer 31 of the electromagnetic wave shielding layer 3 is different. Although the same as each other, as described above, the absorption layer 31 is blocked by absorbing the electromagnetic wave incident on the absorption layer 31, and the electromagnetic wave disappears due to this absorption. Can be reliably prevented from adversely affecting other members not covered with the electromagnetic wave shielding layer 3. Therefore, in the electromagnetic wave shielding films of the sixth and seventh embodiments, it is preferable that the absorbing layer 31 is the electromagnetic wave shielding film of the sixth embodiment positioned outside the unevenness 6.

  Further, the electromagnetic wave shielding film of the sixth embodiment and the electromagnetic wave shielding film of the seventh embodiment have a two-layer configuration in which the electromagnetic wave shielding layer 3 includes one reflective layer 32 and one absorbing layer 31 respectively. The electromagnetic wave shielding layer 3 is not limited to such a two-layer laminated body, but includes three or more layers including at least one of the reflective layer 32 and the absorbing layer 31. You may be comprised with the laminated body.

  Moreover, in the said embodiment, although the insulating layer 2 demonstrated the case where one layer was laminated | stacked on either the upper surface or the lower surface of the electromagnetic wave shielding layer 3, it is not limited to such a case, The electromagnetic wave shielding layer 3 One layer may be laminated as a separate layer on both the upper surface and the lower surface.

  As mentioned above, although the film for electromagnetic wave shielding of this invention and the coating method of an electronic component were demonstrated, this invention is not limited to these.

  For example, in the electromagnetic wave shielding film of the present invention, the arbitrary configurations of the first to seventh embodiments can be combined.

  Moreover, the arbitrary layers which can exhibit the same function may be added to the film for electromagnetic wave shielding of this invention.

  Furthermore, one or two or more arbitrary steps may be added to the method for coating an electronic component of the present invention.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example, this invention is not limited to this.

1. Study on layer structure of electromagnetic shielding film (Example 1A)
<Manufacture of electromagnetic shielding film>
In order to obtain an electromagnetic wave shielding film, syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zalec S107) was prepared as a resin constituting the first layer (first release layer). Syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) was prepared as a resin constituting the third layer (second release layer). As the resin constituting the second layer (cushion layer), an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) was prepared. A polyolefin emulsion (manufactured by Unitika Ltd., trade name: Arrow Base TC-4010) was prepared as a resin constituting the insulating layer. As a resin constituting the electromagnetic wave shielding layer, a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared.

  The syndiotactic polystyrene as the first layer, the syndiotactic polystyrene as the third layer, and the ethylene-methyl acrylate copolymer as the second layer are combined using a feed block and a multi-manifold die. A film was formed by extrusion. A film for electromagnetic wave shielding was prepared by coating the base material layer with the conductive adhesive layer as an electromagnetic wave shielding layer and the polyolefin emulsion as an insulating layer in this order.

  The total thickness of the electromagnetic wave shielding film of Example 1A is 160 μm, the thickness of the first layer is 30 μm, the thickness of the third layer is 30 μm, the thickness of the second layer is 60 μm, and the thickness of the insulating layer is The thickness of the electromagnetic wave shielding layer was 20 μm.

  Moreover, when the average linear expansion coefficient of the 1st layer, the 2nd layer, and the 3rd layer in the electromagnetic wave shielding film of Example 1A was measured, they were 420, 2400, and 420 ppm / ° C., respectively.

  Furthermore, when the storage elastic modulus in 150 degreeC of the base material layer and the electromagnetic wave shielding layer was measured, they were 1.8E + 07 Pa and 1.2E + 07 Pa, respectively.

<Manufacture of electronic components>
The obtained electromagnetic wave shielding film was placed on the surface of a personal computer memory substrate (trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300, manufactured by Samsung Corp.) (step: 1,000 μm) at a temperature of 150 ° C. and a pressure of 2. Affixing was performed by vacuum-pressure forming for 5 minutes under the condition of 0 MPa. After pasting, only the base material layer was peeled off manually to produce an electronic component.

(Example 2A)
The same operation as in Example 1A was performed except that the thickness of the first layer was 80 μm.

(Example 3A)
The same operation as in Example 1A was performed except that the thickness of the first layer was 10 μm.

(Example 4A)
The same operation as in Example 1A was performed except that the thickness of the second layer was 90 μm.

(Example 5A)
The same operation as in Example 1A was performed except that the thickness of the second layer was 20 μm.

(Example 6A)
The same operation as in Example 1A was performed except that the thickness of the third layer was 10 μm.

(Example 7A)
The same operation as in Example 1A was performed except that the thickness of the third layer was 90 μm.

(Example 8A)
The same operation as in Example 1A was performed except that the thickness of the insulating layer was changed to 5 μm.

(Example 9A)
The same operation as in Example 1A was performed except that the thickness of the insulating layer was 50 μm.

(Example 10A)
The same operation as in Example 1A was performed except that the thickness of the electromagnetic wave shielding layer was 5 μm.

(Example 11A)
The same operation as in Example 1A was performed except that the thickness of the electromagnetic wave shielding layer was 150 μm.

(Example 12A)
As the first layer, syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and styrene-ethylene-butylene-styrene block copolymer (Kuraray Co., Ltd., trade name: Septon S8007) ) Was prepared in the same manner as in Example 1A, except that 60 wt% and 40 wt% of the blended products were prepared in weight percent concentrations.

(Example 13A)
As the first layer, syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and styrene-ethylene-butylene-styrene block copolymer (Kuraray Co., Ltd., trade name: Septon S8007) ) Was prepared in the same manner as in Example 1A except that 80 wt% and 20 wt% blended products were prepared.

(Example 14A)
The first layer was prepared in the same manner as in Example 1A except that polymethylpentene (manufactured by Mitsui Chemicals, Inc., trade name: TPX MX004) was prepared.

(Example 15A)
The first layer was prepared in the same manner as in Example 1A, except that polybutylene terephthalate (Mitsubishi Engineering Plastics Co., Ltd., trade name: Nova Duran 5505S) was prepared.

(Example 16A)
As a second layer, ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) in a weight percent concentration. Preparations were made in the same manner as in Example 1A, except that 70 wt% and 30 wt% blends were prepared.

(Example 17A)
As a second layer, ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) and polyethylene (manufactured by Ube Industries, Ltd., trade name: UBE polyethylene F222NH) are in a concentration by weight. Were prepared in the same manner as in Example 1A except that 70 wt% and 30 wt% blended products were prepared.

(Example 18A)
As the second layer, an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106), polyethylene (manufactured by Ube Industries, Ltd., trade name: UBE polyethylene F222NH) and polypropylene (Sumitomo). A product manufactured by Chemical Co., Ltd., trade name: Nobrene FS2011DG2) was prepared in the same manner as Example 1A except that 60 wt%, 20 wt%, and 20 wt% of the blended products were prepared in weight percent concentrations.

(Example 19A)
The insulating layer was prepared in the same manner as in Example 1A except that a saturated copolymerized polyester emulsion (trade name: Elitel KT-8803, manufactured by Unitika Ltd.) was prepared.

(Example 20A)
The same operation as in Example 1A was performed except that the thickness of the first layer was 5 μm.

(Example 21A)
The same operation as in Example 1A was performed except that the thickness of the second layer was 120 μm.

(Example 22A)
The same operation as in Example 1A was performed except that the thickness of the third layer was 3 μm.

(Example 23A)
The same operation as in Example 1A was performed except that the thickness of the second layer was 80 μm and the thickness of the first layer was 10 μm.

(Example 24A)
The same operation as in Example 1A was performed except that the thickness of the first layer was 5 μm, the thickness of the second layer was 80 μm, and the thickness of the third layer was 5 μm.

(Example 25A)
The formation was performed in the same manner as in Example 1A except that the formation of the first layer was omitted and a conductive polymer polyaniline dispersion (PANI-PD manufactured by Regulus Co., Ltd.) was used for the electromagnetic wave shielding layer.

(Example 26A)
The same procedure as in Example 1A was performed except that the formation of the third layer was omitted.

(Comparative Example 1A)
As a base material layer, only polyethylene terephthalate (manufactured by Toray Industries, Inc., trade name: Lumirror S10) was prepared, and prepared in the same manner as in Example 1A, except that the thickness of the base material layer was 30 μm.

(Comparative Example 2A)
As a base material layer, only polyethylene terephthalate (manufactured by Toray Industries, Inc., trade name: Lumirror S10) was prepared, and prepared in the same manner as in Example 1A, except that the thickness of the base material layer was 100 μm.

<Evaluation test>
For the electromagnetic wave shielding films or electronic parts produced in Examples 1A to 26A and Comparative Examples 1A and 2A, shape followability, releasability, gouge folding resistance, second layer spotting property of the base material layer, The heat resistance and electromagnetic wave shield cutting / punching workability were evaluated. Below, these evaluation methods are demonstrated.

<< Shape followability >>
The shape following property can be obtained as follows.

  On a printed wiring board (motherboard) having a length of 100 mm, a width of 100 mm, and a height of 3 mm, grooves having a width of 0.2 mm and each necessary step are formed in a grid pattern at intervals of 0.2 mm. Thereafter, the film for electromagnetic wave shielding is pressure-bonded to the printed wiring board at 150 ° C. × 1 MPa × 10 minutes using a vacuum / pressure forming apparatus, and is attached to the printed wiring board. After sticking, the base material layer is peeled off, and it is determined whether or not there is a gap between the electromagnetic wave shielding layer attached to the printed wiring board and the groove on the printed wiring board. In addition, it observed and evaluated with the microscope and the microscope whether there was a space | gap.

Each code | symbol is as follows. X was rejected, and the others were determined to be acceptable.
×: Step is less than 500 μm ○: Step is 500 μm or more and less than 1000 μm ◎: Step is 1000 μm or more and less than 2000 μm ◎: Step is 2000 μm or more

<< Releasability >>
The releasability can be determined as follows.

The film for electromagnetic wave shielding was thermocompression-bonded to the same printed wiring board as in the method for evaluating shape followability, and then evaluated by the ease of peeling when only the base material layer was manually peeled off.
Each code | symbol is as follows. X was rejected, and the others were determined to be acceptable.

×: Residual residue is generated in the base material layer ○: Residual residue is not generated in the base material layer, but peeling is slightly heavy ◎: There is no residual resin in the base material layer, and it can be easily peeled off

<< Haze fold resistance >>
The goblet folding resistance can be determined as follows.

  The film for electromagnetic wave shielding was attached to a flexible substrate, for example, a flexible circuit substrate, and the bonded one was folded in a goblet, and the bent portion was observed with a microscope. However, the folding is done by hand and the folding is done only once.

Each code | symbol is as follows. X was rejected, and the others were determined to be acceptable.
×: Cracks occur in the bent part ○: Some wrinkles in the bent part ◎: No cracks occur in the bent part

<< Second layer spotting ability >>
The second layer smearing property of the base material layer can be determined as follows.

  The base material layer was hot-pressed at 150 ° C. × 2.0 MPa × 5 minutes, and the maximum length of the second layer that was stained was measured with a caliper or the like.

Each code | symbol is as follows. X was rejected, and the others were determined to be acceptable.
×: The maximum length of the second layer that is smeared out is 1.0 mm or more ○: The maximum length of the second layer that is smeared out is 0.5 mm or more and less than 1.0 mm ◎: The second layer that is smeared out Maximum length of less than 0.5mm

<< Heat resistance >>
The heat resistance of the base material layer can be determined as follows.

  In the same manner as the method for evaluating the shape following property, the electromagnetic wave shielding film is pressure-bonded to a printed wiring board at 150 ° C. × 2 MPa × 5 minutes using a vacuum / pressure forming apparatus, and is attached to the printed wiring board. After pasting, the base material layer is peeled off, and it is judged by visual observation whether or not there are wrinkles in the electromagnetic wave shielding layer and the insulating layer stuck on the printed wiring board.

Each code | symbol is as follows. X was rejected, and the others were determined to be acceptable.
×: Wrinkles are generated in the electromagnetic wave blocking layer and the insulating layer ○: Fine wrinkles are generated in the electromagnetic wave blocking layer and the insulating layer ◎: No wrinkles are generated in the electromagnetic wave blocking layer and the insulating layer

<< Cut / Punching workability >>
The workability of cutting and punching the electromagnetic wave shield can be obtained as follows.

  Judgment is made by whether man-hours are required when cutting and punching the electromagnetic wave shielding film into a predetermined size and shape, and workability is significantly reduced.

Each code | symbol is as follows. X was rejected, and the others were determined to be acceptable.
X: Workability is remarkably lowered. ○: Workability is slightly lowered. A: Workability is not problematic. Table 1 shows the evaluation results of each of the above Examples and Comparative Examples.

  As is apparent from Table 1, Examples 1A to 26A show good shape followability, and further, release property, goblet folding resistance, second layer spotting property of the base material layer, electromagnetic wave shield cut In comparison with Examples 1A to 26A, Comparative Examples 1A and 2A resulted in inadequate shape followability, while the punching workability was excellent in a well-balanced manner.

2. Study on storage elastic modulus of base material layer (Example 1B)
<Manufacture of electromagnetic shielding film>
In order to obtain an electromagnetic wave shielding film, syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zalec S107) was prepared as a resin constituting the first layer (first release layer). Syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) was prepared as a resin constituting the third layer (second release layer). As the resin constituting the second layer (cushion layer), an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) was prepared. A polyolefin emulsion (manufactured by Unitika Ltd., trade name: Arrow Base TC-4010) was prepared as a resin constituting the insulating layer. As a resin constituting the electromagnetic wave shielding layer, a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared.

  The syndiotactic polystyrene as the first layer, the syndiotactic polystyrene as the third layer, and the ethylene-methyl acrylate copolymer as the second layer are combined using a feed block and a multi-manifold die. A film was formed by extrusion. A film for electromagnetic wave shielding was prepared by coating the base material layer with the conductive adhesive layer as an electromagnetic wave shielding layer and the polyolefin emulsion as an insulating layer in this order.

  The total thickness of the electromagnetic wave shielding film of Example 1B is 160 μm, the thickness of the first layer is 30 μm, the thickness of the third layer is 30 μm, the thickness of the second layer is 60 μm, and the thickness of the insulating layer is The thickness of the electromagnetic wave shielding layer was 20 μm.

  Moreover, when the average linear expansion coefficient of the 1st layer in the film for electromagnetic wave shields of Example 1B, the 2nd layer, and the 3rd layer was measured, they were 420, 2400, and 420 ppm / degreeC, respectively.

  Furthermore, when the storage elastic modulus in 150 degreeC of the base material layer and the electromagnetic wave shielding layer was measured, they were 1.8E + 07 Pa and 1.2E + 07 Pa, respectively.

<Manufacture of electronic components>
The obtained electromagnetic wave shielding film was placed on the surface of a personal computer memory substrate (trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300, manufactured by Samsung Corp.) (step: 1,000 μm) at a temperature of 150 ° C. and a pressure of 2. Under the condition of 0 MPa, vacuum / pressure forming was performed for 5 minutes, and pasting was performed. After pasting, only the base material layer was peeled off manually to produce an electronic component.

(Example 2B)
As a second layer, ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) in a weight percent concentration. Preparations were made in the same manner as in Example 1B, except that 70 wt% and 30 wt% blends were prepared.

(Example 3B)
The same operation as in Example 1B was performed except that the thickness of the first layer was 10 μm.

(Example 4B)
The same operation as in Example 1B was performed except that the thickness of the second layer was 90 μm.

(Example 5B)
As the first layer, syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and styrene-ethylene-butylene-styrene block copolymer (Kuraray Co., Ltd., trade name: Septon S8007) ) Was carried out in the same manner as in Example 1B, except that preparations of 60 wt% and 40 wt% in weight percent concentration were prepared.

(Example 6B)
The same operation as in Example 1B was performed except that the thickness of the first layer was 80 μm.

(Example 7B)
The same operation as in Example 1B was performed except that the thickness of the first layer was 100 μm.

(Example 8B)
As the first layer, syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) are each 60 wt% in weight percent concentration. , Except that a 40 wt% blended product was prepared.

(Example 9B)
The same procedure as in Example 1B was performed except that polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: Nobrene FS2011DG2) was prepared as the second layer.

(Example 10B)
The first layer was prepared in the same manner as in Example 1B except that polybutylene terephthalate (Mitsubishi Engineering Plastics Co., Ltd., trade name: NOVADURAN 5020) was prepared.

(Comparative Example 1B)
As a base material layer, it prepared similarly to Example 1B except having prepared the cyclic olefin type copolymer (Polyplastics Co., Ltd. make, brand name: TOPAS6017).

(Comparative Example 2B)
Prepared in the same manner as in Example 1B except that the thickness of the third layer was 1 μm and the thickness of the first layer was 1 μm.

<Evaluation test>
Regarding the electromagnetic wave shielding films or electronic parts produced in Examples 1B to 10B and Comparative Examples 1B and 2B, the electromagnetic wave shielding films or electronic parts produced in Examples 1A to 26A and Comparative Examples 1A and 2A In the same manner as performed, the shape followability, mold release property, goby folding resistance, base layer second layer spotting property, heat resistance, and electromagnetic wave shielding / punching workability were evaluated.
Table 2 shows the evaluation results of the above examples and comparative examples.

  As is apparent from Table 2, in Examples 1B to 10B, the storage elastic modulus at 150 ° C. of the base material layer is set within an appropriate range, and thus good shape followability is exhibited. The results were excellent in balance with respect to releasability, gouge folding resistance, second layer spotting of the base material layer, and electromagnetic wave shield cutting / punching workability.

  On the other hand, in Comparative Examples 1B and 2B, the storage elastic modulus at 150 ° C. of the base material layer was not set within an appropriate range, which resulted in insufficient shape following ability.

3. Examination on layer structure and storage elastic modulus of barrier layer (Example 1C)
<Manufacture of electromagnetic shielding film>
In order to obtain an electromagnetic wave shielding film, syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zalec S107) was prepared as a resin constituting the first layer (first release layer). Syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: Zarek S107) was prepared as a resin constituting the third layer (second release layer). As the resin constituting the second layer (cushion layer), an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) was prepared. A polyolefin emulsion (manufactured by Unitika Ltd., trade name: Arrow Base TC-4010) was prepared as a resin constituting the insulating layer. As a resin constituting the electromagnetic wave shielding layer, a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared.

  The syndiotactic polystyrene as the first layer, the syndiotactic polystyrene as the third layer, and the ethylene-methyl acrylate copolymer as the second layer are combined using a feed block and a multi-manifold die. A film was formed by extrusion. A film for electromagnetic wave shielding was prepared by coating the base material layer with the conductive adhesive layer as an electromagnetic wave shielding layer and the polyolefin emulsion as an insulating layer in this order.

  The total thickness of the electromagnetic wave shielding film of Example 1C is 160 μm, the thickness of the first layer is 30 μm, the thickness of the third layer is 30 μm, the thickness of the second layer is 60 μm, and the thickness of the insulating layer is The thickness of the electromagnetic wave shielding layer was 20 μm.

  Moreover, when the average linear expansion coefficient of the 1st layer in the film for electromagnetic wave shields of Example 1C, the 2nd layer, and the 3rd layer was measured, they were 420, 2400, and 420, respectively.

  Furthermore, when the storage elastic modulus in 150 degreeC of the base material layer and the electromagnetic wave shielding layer was measured, they were 1.8E + 07 Pa and 1.2E + 07 Pa, respectively.

<Manufacture of electronic components>
The obtained electromagnetic wave shielding film was placed on the surface of a personal computer memory substrate (trade name: DDR2 667 M470T6554EZ3-CE6 PC2-5300, manufactured by Samsung Corp.) (step: 1,000 μm) at a temperature of 150 ° C. and a pressure of 2. Affixing was performed by vacuum-pressure forming for 5 minutes under the condition of 0 MPa. After pasting, only the base material layer was peeled off manually to produce an electronic component.

(Example 2C)
The same operation as in Example 1C was performed except that a conductive adhesive layer (trade name: DW-250H-5, manufactured by Toyobo Co., Ltd.) was used as the electromagnetic wave shielding layer.

(Example 3C)
The same operation as in Example 1C was performed except that a conductive adhesive layer (trade name: DW-250H-23, manufactured by Toyobo Co., Ltd.) was used as the electromagnetic wave shielding layer.

(Example 4C)
The same operation as in Example 1C was performed except that a conductive adhesive layer (trade name: CA-2503-4B, manufactured by Daiken Chemical Industry Co., Ltd.) was used as the electromagnetic wave shielding layer.

(Example 5C)
The same procedure as in Example 1C was performed except that a polyaniline dispersion (trade name: PANI-PD, thickness: 20 μm) manufactured by Regulus Co., Ltd. was prepared for the conductive absorption layer functioning as the absorption layer as the resin constituting the barrier layer. It was.

(Example 6C)
Example 1C, except that a multilayer carbon nanotube dispersion (trade name: NT-7K, thickness: 20 μm, manufactured by Hodogaya Chemical Co., Ltd.) was prepared in the dielectric absorption layer functioning as the absorption layer as the resin constituting the barrier layer. As well as.

(Example 7C)
As in Example 1C, except that PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 20 μm) was prepared as the resin constituting the barrier layer in the conductive absorption layer functioning as the absorption layer. went.

(Example 8C)
As a resin constituting the blocking layer, a conductive adhesive layer (trade name: DW260-H1, manufactured by Toyobo Co., Ltd., thickness 10 μm) functioning as a reflective layer, and a polyaniline dispersion (Regulus) on a conductive absorption layer functioning as an absorption layer The product was manufactured in the same manner as Example 1C except that a product name, PANI-PD, thickness 10 μm) was prepared, and the film was coated on the film in the order of the reflective layer and the absorbing layer.

(Example 9C)
As a resin constituting the barrier layer, a conductive adhesive layer functioning as a reflective layer (manufactured by Daiken Chemical Industry Co., Ltd., trade name: CA-2503-4B, thickness 10 μm), and a dielectric functioning as an absorption layer Absorbing layer (PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 10 μm)), except that these were coated on the film in the order of the reflective layer and the absorbing layer, Performed in the same manner as Example 1C.

(Example 10C)
As a resin constituting the blocking layer, a conductive adhesive layer (trade name: DW260-H1, manufactured by Toyobo Co., Ltd., thickness 10 μm) functioning as a reflective layer, and a polyaniline dispersion (Regulus) on a conductive absorption layer functioning as an absorption layer The product was manufactured in the same manner as Example 1C, except that the product was manufactured by the company, trade name: PANI-PD, thickness 10 μm), and these were coated on the film in the order of the absorption layer and the reflection layer.

(Example 11C)
As a resin constituting the barrier layer, a conductive adhesive layer functioning as a reflective layer (manufactured by Daiken Chemical Industry Co., Ltd., trade name: CA-2503-4B, thickness 10 μm), and a dielectric functioning as an absorption layer Example 1C, except that an absorbent layer (PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd., trade name: S-941, thickness 10 μm)) was prepared, and these were coated on the film in the order of the absorbent layer and the reflective layer. As well as.

<Evaluation test>
Regarding the electromagnetic wave shielding films or electronic parts produced in Examples 1C to 11C, the same method as that carried out for the electromagnetic wave shielding films or electronic parts produced in Examples 1A to 26A and Comparative Examples 1A and 2A was used. The shape following property, mold release property, goby folding resistance, base layer second layer spotting property, heat resistance, and electromagnetic wave shielding / punching workability were evaluated.
Table 3 shows the evaluation results of the above examples and comparative examples.

  As apparent from Table 3, as shown in Examples 1C to 11C, not only the storage elastic modulus at 150 ° C. of the base material layer was set within an appropriate range, but also the storage elastic modulus at 150 ° C. of the electromagnetic wave shielding layer. By setting the value within the appropriate range, good shape followability is exhibited, and further, mold release property, gond folding resistance, second layer spot bleeding property of the base material layer, heat resistance, electromagnetic wave shield cutting and punching It was found that the workability could be excellent in a balanced manner.

  The electromagnetic wave shielding film according to the present invention increases the degree of design freedom of the substrate, can be reduced in weight and thickness, and has an excellent shape following property with respect to irregularities 6 of 500 μm or more. This is a shielding film.

DESCRIPTION OF SYMBOLS 100 Electromagnetic wave shielding film 1 Base material layer 11 1st layer 12 3rd layer 13 2nd layer 2 Insulating layer 3 Electromagnetic wave shielding layer 31 Absorbing layer 32 Reflecting layer 4 Electronic component 5 Substrate 6 Concavity and convexity 61 Convex part 62 Concave part

Claims (17)

An electromagnetic wave shielding film used to coat unevenness on a substrate,
Comprising a base material layer, an insulating layer and an electromagnetic wave shielding layer laminated on one surface side of the base material layer,
The base material layer has a storage elastic modulus at 150 ° C. of 2.0E + 05 to 2.0E + 08 Pa.   When the storage elastic modulus at 120 ° C. of the base material layer is A [Pa] and the storage elastic modulus at 150 ° C. of the base material layer is B [Pa], 0.02 ≦ A / B ≦ 1.00. The electromagnetic wave shielding film according to claim 1, which satisfies the relationship.   The said base material layer is a laminated body which makes | forms the 3 layer structure on which the 1st layer, the 2nd layer, and the 3rd layer were laminated | stacked in this order from the other surface side. The film for electromagnetic wave shielding as described.   The film for electromagnetic wave shielding according to claim 3, wherein the first layer has an average linear expansion coefficient at 25 to 150 ° C. of 50 to 1000 [ppm / ° C.].   5. The electromagnetic wave shielding film according to claim 3, wherein a thickness T (A) of the first layer is 5 μm or more and 100 μm or less.   The film for electromagnetic wave shielding according to any one of claims 3 to 5, wherein the third layer has an average linear expansion coefficient at 25 to 150 ° C of 50 to 1000 [ppm / ° C].   The film for electromagnetic wave shielding according to any one of claims 3 to 6, wherein a thickness T (B) of the third layer is 5 µm or more and 100 µm or less.   The electromagnetic wave shielding film according to any one of claims 3 to 7, wherein the second layer has an average linear expansion coefficient at 25 to 150 ° C of 500 or more [ppm / ° C].   9. The electromagnetic wave shielding film according to claim 3, wherein a thickness T (C) of the second layer is 10 μm or more and 100 μm or less. The thickness T (A) of the first layer, the thickness T (B) of the third layer, and the thickness T (C) of the second layer satisfy the following relational expression (I). The film for electromagnetic wave shields of any one of thru | or 9.
0.05 <T (C) / (T (A) + T (B)) <10 (I)   The film for electromagnetic wave shielding according to any one of claims 1 to 10, wherein the insulating layer and the electromagnetic wave shielding layer form a laminated body laminated in this order from the one surface side.   The film for electromagnetic wave shielding according to claim 11, wherein the insulating layer is made of an insulating resin having thermoplasticity.   The film for electromagnetic wave shielding according to claim 11 or 12, wherein a thickness T (D) of the insulating layer is 3 µm or more and 50 µm or less.   The electromagnetic wave shielding layer according to any one of claims 1 to 13, wherein the electromagnetic wave shielding layer has a storage elastic modulus at 150 ° C of 1.0E + 05 to 1.0E + 09Pa.   The electromagnetic wave shielding layer according to any one of claims 1 to 14, wherein the electromagnetic wave shielding layer is composed of a reflective layer and an absorbing layer, which are laminated in this order from the one surface side. Film.   The shape following property when the electromagnetic wave shielding film is thermocompression bonded to the unevenness on the substrate under conditions of a temperature of 150 ° C, a pressure of 2 MPa, and a time of 5 minutes is 500 µm or more and 3,000 µm or less. The electromagnetic wave shielding film according to any one of the above items. An attaching step of attaching the electromagnetic wave shielding film according to any one of claims 1 to 16 to the irregularities on the substrate so that the electromagnetic wave shielding layer or the insulating layer and the electronic component are adhered,
An electronic component coating method comprising: a peeling step of peeling the base material layer after the sticking step.

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