SG11201501165XA - Em-shielding film and method for covering electronic component - Google Patents

Em-shielding film and method for covering electronic component

Info

Publication number
SG11201501165XA
SG11201501165XA SG11201501165XA SG11201501165XA SG11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA
Authority
SG
Singapore
Prior art keywords
electronic component
shielding film
covering electronic
covering
shielding
Prior art date
Application number
SG11201501165XA
Inventor
Taichi Yatsuzuka
Fumihiro Shiraishi
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG11201501165XA publication Critical patent/SG11201501165XA/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/027Thermal properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/033 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19105Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
SG11201501165XA 2012-08-16 2013-08-14 Em-shielding film and method for covering electronic component SG11201501165XA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012180537 2012-08-16
JP2013051099A JP6225437B2 (en) 2012-08-16 2013-03-13 Electromagnetic wave shielding film and method for coating electronic component
JP2013051097A JP6225436B2 (en) 2012-08-16 2013-03-13 Electromagnetic wave shielding film and method for coating electronic component
PCT/JP2013/071922 WO2014027672A1 (en) 2012-08-16 2013-08-14 Em-shielding film and method for covering electronic component

Publications (1)

Publication Number Publication Date
SG11201501165XA true SG11201501165XA (en) 2015-05-28

Family

ID=50614085

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201501165XA SG11201501165XA (en) 2012-08-16 2013-08-14 Em-shielding film and method for covering electronic component
SG11201501162UA SG11201501162UA (en) 2012-08-16 2013-08-14 Electromagnetic shielding film and method of covering electronic component

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201501162UA SG11201501162UA (en) 2012-08-16 2013-08-14 Electromagnetic shielding film and method of covering electronic component

Country Status (6)

Country Link
JP (4) JP6263846B2 (en)
KR (2) KR101799631B1 (en)
CN (2) CN104584708A (en)
SG (2) SG11201501165XA (en)
TW (2) TW201419996A (en)
WO (2) WO2014027672A1 (en)

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WO2018008657A1 (en) * 2016-07-08 2018-01-11 住友ベークライト株式会社 Sealing film, sealing method for electronic component mounted substrate, and electronic component mounted substrate coated with sealing film
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CN106131991B (en) * 2016-07-28 2022-09-16 杭州信多达智能科技有限公司 Wire coil assembly with surround shielding radiation function
JP2018060991A (en) * 2016-09-28 2018-04-12 住友ベークライト株式会社 Sealing film, method for sealing electronic component-mounted substrate, and sealing film-covered electronic component-mounted substrate
JP6865340B2 (en) * 2017-03-31 2021-04-28 ナガセケムテックス株式会社 Manufacturing method of mounting structure and laminated sheet used for this
JP2019029549A (en) * 2017-08-01 2019-02-21 住友ベークライト株式会社 Film set
JP6516108B2 (en) * 2017-08-10 2019-05-22 東洋インキScホールディングス株式会社 Electromagnetic wave shield laminate for vacuum forming, and electromagnetic wave shield molded body using the same
JP6451801B1 (en) * 2017-08-10 2019-01-16 東洋インキScホールディングス株式会社 Electromagnetic shielding film used for manufacturing method of electromagnetic shielding electronic device and manufacturing method of electromagnetic shielding electronic device
KR102530753B1 (en) * 2017-08-11 2023-05-10 삼성전자주식회사 Semiconductor package blocking electromagnetic interference and electronic system having the same
WO2019044512A1 (en) * 2017-08-31 2019-03-07 住友ベークライト株式会社 Electromagnetic wave shield film
JP7277092B2 (en) * 2017-08-31 2023-05-18 積水化学工業株式会社 release film
JP6718106B2 (en) * 2017-12-14 2020-07-08 ナガセケムテックス株式会社 Manufacturing method of mounting structure
JP2019119820A (en) * 2018-01-09 2019-07-22 住友ベークライト株式会社 Encapsulation film, encapsulation film coated electronic component loading substrate and re-detachment method
KR102616814B1 (en) * 2018-03-09 2023-12-21 삼성전자주식회사 Semiconductor package and semiconductor module
KR102016500B1 (en) 2018-04-02 2019-09-02 삼성전기주식회사 Coil Component
JP6504302B1 (en) 2018-06-12 2019-04-24 東洋インキScホールディングス株式会社 Electromagnetic wave shield sheet, component mounting board, and electronic device
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Also Published As

Publication number Publication date
KR20150042747A (en) 2015-04-21
JP6263847B2 (en) 2018-01-24
JP2014057042A (en) 2014-03-27
SG11201501162UA (en) 2015-04-29
TW201419997A (en) 2014-05-16
WO2014027672A1 (en) 2014-02-20
WO2014027673A1 (en) 2014-02-20
JP6263846B2 (en) 2018-01-24
TWI675617B (en) 2019-10-21
JP6225437B2 (en) 2017-11-08
JP2014057040A (en) 2014-03-27
CN104584708A (en) 2015-04-29
TW201419996A (en) 2014-05-16
KR20150044853A (en) 2015-04-27
JP6225436B2 (en) 2017-11-08
CN104584707A (en) 2015-04-29
JP2014057041A (en) 2014-03-27
KR101799631B1 (en) 2017-11-20
JP2014057043A (en) 2014-03-27
KR101799630B1 (en) 2017-11-20

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