SG11201501165XA - Em-shielding film and method for covering electronic component - Google Patents

Em-shielding film and method for covering electronic component

Info

Publication number
SG11201501165XA
SG11201501165XA SG11201501165XA SG11201501165XA SG11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA
Authority
SG
Singapore
Prior art keywords
electronic component
shielding film
covering electronic
covering
shielding
Prior art date
Application number
SG11201501165XA
Inventor
Taichi Yatsuzuka
Fumihiro Shiraishi
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG11201501165XA publication Critical patent/SG11201501165XA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
SG11201501165XA 2012-08-16 2013-08-14 Em-shielding film and method for covering electronic component SG11201501165XA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012180537 2012-08-16
JP2013051099A JP6225437B2 (en) 2012-08-16 2013-03-13 Electromagnetic wave shielding film and method for coating electronic component
JP2013051097A JP6225436B2 (en) 2012-08-16 2013-03-13 Electromagnetic wave shielding film and method for coating electronic component
PCT/JP2013/071922 WO2014027672A1 (en) 2012-08-16 2013-08-14 Em-shielding film and method for covering electronic component

Publications (1)

Publication Number Publication Date
SG11201501165XA true SG11201501165XA (en) 2015-05-28

Family

ID=50614085

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201501165XA SG11201501165XA (en) 2012-08-16 2013-08-14 Em-shielding film and method for covering electronic component
SG11201501162UA SG11201501162UA (en) 2012-08-16 2013-08-14 Electromagnetic shielding film and method of covering electronic component

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201501162UA SG11201501162UA (en) 2012-08-16 2013-08-14 Electromagnetic shielding film and method of covering electronic component

Country Status (6)

Country Link
JP (4) JP6263846B2 (en)
KR (2) KR101799631B1 (en)
CN (2) CN104584708A (en)
SG (2) SG11201501165XA (en)
TW (2) TW201419996A (en)
WO (2) WO2014027672A1 (en)

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JP2016009809A (en) * 2014-06-26 2016-01-18 住友ベークライト株式会社 Film for electromagnetic wave shield and electronic component mounting board
WO2016015325A1 (en) 2014-08-01 2016-02-04 华为技术有限公司 Electromagnetic shielding material and method for packaging optical module
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WO2018008657A1 (en) * 2016-07-08 2018-01-11 住友ベークライト株式会社 Sealing film, sealing method for electronic component mounted substrate, and electronic component mounted substrate coated with sealing film
JP2018060990A (en) * 2016-07-08 2018-04-12 住友ベークライト株式会社 Sealing film, method for sealing electronic component-mounted substrate, and electronic component-mounted substrate covered with sealing film
CN106163247A (en) * 2016-07-18 2016-11-23 福建星宏新材料科技有限公司 A kind of wide frequency domain absorbing material
CN106131991B (en) * 2016-07-28 2022-09-16 杭州信多达智能科技有限公司 Wire coil assembly with surround shielding radiation function
JP2018060991A (en) * 2016-09-28 2018-04-12 住友ベークライト株式会社 Sealing film, method for sealing electronic component-mounted substrate, and sealing film-covered electronic component-mounted substrate
JP6865340B2 (en) * 2017-03-31 2021-04-28 ナガセケムテックス株式会社 Manufacturing method of mounting structure and laminated sheet used for this
JP2019029549A (en) * 2017-08-01 2019-02-21 住友ベークライト株式会社 Film set
JP6516108B2 (en) * 2017-08-10 2019-05-22 東洋インキＳｃホールディングス株式会社 Electromagnetic wave shield laminate for vacuum forming, and electromagnetic wave shield molded body using the same
JP6451801B1 (en) * 2017-08-10 2019-01-16 東洋インキＳｃホールディングス株式会社 Electromagnetic shielding film used for manufacturing method of electromagnetic shielding electronic device and manufacturing method of electromagnetic shielding electronic device
KR102530753B1 (en) * 2017-08-11 2023-05-10 삼성전자주식회사 Semiconductor package blocking electromagnetic interference and electronic system having the same
WO2019044512A1 (en) * 2017-08-31 2019-03-07 住友ベークライト株式会社 Electromagnetic wave shield film
JP7277092B2 (en) * 2017-08-31 2023-05-18 積水化学工業株式会社 release film
JP6718106B2 (en) * 2017-12-14 2020-07-08 ナガセケムテックス株式会社 Manufacturing method of mounting structure
JP2019119820A (en) * 2018-01-09 2019-07-22 住友ベークライト株式会社 Encapsulation film, encapsulation film coated electronic component loading substrate and re-detachment method
KR102616814B1 (en) * 2018-03-09 2023-12-21 삼성전자주식회사 Semiconductor package and semiconductor module
KR102016500B1 (en) 2018-04-02 2019-09-02 삼성전기주식회사 Coil Component
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Also Published As

Publication number Publication date
KR20150042747A (en) 2015-04-21
JP6263847B2 (en) 2018-01-24
JP2014057042A (en) 2014-03-27
SG11201501162UA (en) 2015-04-29
TW201419997A (en) 2014-05-16
WO2014027672A1 (en) 2014-02-20
WO2014027673A1 (en) 2014-02-20
JP6263846B2 (en) 2018-01-24
TWI675617B (en) 2019-10-21
JP6225437B2 (en) 2017-11-08
JP2014057040A (en) 2014-03-27
CN104584708A (en) 2015-04-29
TW201419996A (en) 2014-05-16
KR20150044853A (en) 2015-04-27
JP6225436B2 (en) 2017-11-08
CN104584707A (en) 2015-04-29
JP2014057041A (en) 2014-03-27
KR101799631B1 (en) 2017-11-20
JP2014057043A (en) 2014-03-27
KR101799630B1 (en) 2017-11-20

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