WO2018008657A1

WO2018008657A1 - Sealing film, sealing method for electronic component mounted substrate, and electronic component mounted substrate coated with sealing film

Info

Publication number: WO2018008657A1
Application number: PCT/JP2017/024556
Authority: WO
Inventors: 明徳橋本; 雅彦渡邊; 白石　史広
Original assignee: 住友ベークライト株式会社
Priority date: 2016-07-08
Filing date: 2017-07-04
Publication date: 2018-01-11
Also published as: JP6358405B2; TW201806100A; JPWO2018008657A1

Abstract

A sealing film 100 according to the present invention is used for sealing an electronic component mounted substrate 45 that is provided with a substrate 5 and an electronic component 4 mounted on one surface side of the substrate 5, and is provided with: an insulating layer 12; and an electromagnetic wave shield layer 13. The insulating layer 12 and the electromagnetic wave shield layer 13 contain resin materials, and the elongation rate of the sealing film 100 at a softening point required on the basis of JIS K 6251 is 150-3500%. The electromagnetic wave shield layer 13 can be configured by being provided with a projected part that projects beyond the end of the insulating layer 12.

Description

Film for sealing, sealing method for electronic component mounting substrate, and film-covered electronic component mounting substrate for sealing

The present invention relates to a sealing film, an electronic component mounting substrate sealing method, and a sealing film-covered electronic component mounting substrate.

Conventionally, in electronic devices such as mobile phones, smartphones, calculators, electronic newspapers, tablet terminals, videophones, personal computers, for example, electronic component mounting substrates on which electronic components such as semiconductor elements, capacitors, and coils are mounted. Although mounted, the electronic component mounting board may be sealed with resin for the purpose of preventing contact with external factors such as moisture and dust.

Sealing with such a resin includes, for example, a potting method in which a thermosetting resin such as a highly fluid urethane resin is injected and sealed after an electronic component mounting substrate is placed in a metal cavity. A coating method is known in which a plastic resin is applied to an electronic component mounting substrate in a molten state and then solidified to be coated (sealed).

However, the potting method has a problem in that it takes time to cure the thermosetting resin, and usually requires a metal cavity for sealing, resulting in an increase in the weight of the resulting electronic device. In addition, the coating method requires the viscosity management of the thermoplastic resin in a molten state, and there is a problem that time and labor are required for separately coating the thermoplastic resin coating area.

For the purpose of solving such problems, it has been proposed to attach a barrier film having hot melt properties to an electronic component mounting substrate (see, for example, Patent Document 1).

However, in this case, the followability to the unevenness formed due to the electronic component mounting substrate including the electronic component is not sufficiently obtained, and as a result, the barrier property against external factors such as moisture and dust is sufficiently improved. It has not reached.

In addition to providing barrier properties against external factors such as moisture and dust, the barrier film (sealing film) may be provided with electromagnetic wave shielding properties for reducing the influence of noise caused by electromagnetic waves on the electronic component. There was a demand.

JP 2009-99417 A

An object of the present invention is to provide excellent followability to unevenness caused by mounting of an electronic component provided on the electronic component mounting board and electromagnetic wave shielding property to reduce the influence of noise due to electromagnetic waves on the electronic component. A sealing film that can be sealed in a sealed manner, a method for sealing an electronic component mounting substrate using such a sealing film, and a sealing film-covered electronic component mounting substrate provided with such a sealing film are provided. There is.

Such an object is achieved by the present invention described in the following (1) to (29).
(1) A sealing film used for sealing an electronic component mounting substrate comprising a substrate and an electronic component mounted on one surface side of the substrate,
Having an insulating layer and an electromagnetic wave shielding layer laminated on one side of the insulating layer;
Both the insulating layer and the electromagnetic wave shielding layer contain a resin material, and the sealing film has an elongation at a softening point required in accordance with JIS K 6251 of 150% or more and 3500% or less. A film for sealing.

(2) The electronic component mounting substrate further includes an electrode provided on one surface side of the substrate and electrically connected to the electronic component,
The said electromagnetic wave shielding layer is a film for sealing as described in said (1) provided with the protrusion part which protrudes beyond the edge part of the said insulating layer.

(3) The sealing film according to (2), wherein the protruding portion is formed corresponding to the electrode, and contacts the electrode when the electronic component mounting substrate is sealed.

(4) The sealing film according to (2) or (3), wherein the electrode is provided at an edge of the substrate or around an electronic component.

(5) The sealing film according to any one of (2) to (4), wherein the electrode is a ground electrode.

(6) The sealing film further includes a coating layer laminated on the opposite side of the electromagnetic shielding layer from the insulating layer,
The sealing film according to (1), wherein the electronic component mounting substrate is sealed with the insulating layer on one surface side of the substrate.

(7) The coating layer includes a first protruding portion that protrudes beyond an end portion of the electromagnetic wave shielding layer, and the first electronic component mounting substrate is sealed when the electronic component mounting substrate is sealed from one surface side of the substrate. The projecting portion is the sealing film according to (6), which is configured to cover the other surface side of the substrate by being folded on the other surface side of the substrate.

(8) The electronic component mounting substrate further includes an electrode provided on one surface side of the substrate and electrically connected to the electronic component,
The electromagnetic wave shielding layer includes a second protruding portion that protrudes beyond an end portion of the insulating layer, and when the electronic component mounting substrate is sealed from one surface side of the substrate, the second protruding portion is The sealing film according to (6) or (7), wherein the sealing film is configured to contact the electrode on one surface side of the substrate.

(9) The electronic component mounting substrate further includes an electrode provided on the other surface side of the substrate and electrically connected to the electronic component,
The electromagnetic wave shielding layer includes a second protruding portion that protrudes beyond an end portion of the insulating layer, and when the electronic component mounting substrate is sealed from one surface side of the substrate, the second protruding portion is The sealing film according to (6) or (7), wherein the film is configured to be in contact with the electrode on the other surface side of the substrate by being folded on the other surface side of the substrate.

(10) The insulating layer includes a third protruding portion that protrudes beyond the end portion of the electromagnetic wave shielding layer and is stacked in contact with the first protruding portion, and the electronic component is provided from one surface side of the substrate. When the mounting substrate is sealed, the first projecting portion and the third projecting portion are folded to the other surface side of the substrate so that the third projecting portion is placed on the other surface side of the substrate. The sealing film according to (7), wherein the sealing film is configured to contact and cover.

(11) The electronic component mounting substrate further includes an electrode provided on one surface side of the substrate and electrically connected to the electronic component,
The electromagnetic wave shielding layer includes a fourth projecting portion projecting beyond the end portion of the coating layer, and when sealing the electronic component mounting substrate from one surface side of the substrate, the fourth projecting portion is The sealing film according to (6), wherein the sealing film is configured to be in contact with the electrode on one surface side of the substrate by being folded on one surface side of the substrate.

(12) The sealing film according to (1), wherein the insulating layer includes a protruding portion that protrudes beyond an end portion of the electromagnetic wave shielding layer.

(13) The sealing film according to (12), wherein the electromagnetic wave shielding layer is selectively formed at a position corresponding to the electronic component.

(14) The protruding portion covers the other surface side of the substrate by being folded into the other surface side of the substrate when the electronic component mounting substrate is sealed from the one surface side of the substrate. The film for sealing according to the above (12) or (13), which is configured to perform.

(15) The electronic component mounting substrate further includes a connection member having an open end surface and electrically connected to the electronic component,
The sealing film according to (1), wherein the sealing film has an escape portion at a position corresponding to the connection member when sealing the electronic component mounting substrate.

(16) The sealing film according to (15), wherein the resin material constituting the insulating layer and the electromagnetic wave shielding layer is a thermoplastic resin.

(17) The electronic component mounting substrate further includes an electrode provided on the other surface side of the substrate and electrically connected to the electronic component,
The electromagnetic wave shielding layer includes a protruding portion that protrudes beyond the end portion of the insulating layer, and when the electronic component mounting substrate is sealed from one surface side of the substrate, the protruding portion is formed on the substrate. The sealing film according to (1), which is configured to be in contact with the electrode by being folded on the other surface side.

(18) The sealing film according to (17), wherein the electrode is provided on an edge of the substrate.

(19) The sealing film according to (17) or (18), wherein the electrode is a ground electrode.

(20) The sealing film according to any one of (1) to (19), wherein the sealing film has a linear expansion coefficient of 100 ppm / K or less in a temperature range of 25 ° C. or more and 80 ° C. or less.

(21) The sealing film according to any one of (1) to (20), wherein at least one of the insulating layer and the electromagnetic wave shielding layer contains a polyolefin resin as the resin material.

(22) The sealing film according to any one of (1) to (21), wherein the sealing film has an average thickness of 10 μm to 700 μm.

(23) The sealing film according to any one of (1) to (22), wherein the substrate is a printed wiring board.

(24) A sealing method of an electronic component mounting substrate for sealing the substrate, the electronic component, and the electrode using the sealing film according to any one of (2) to (5),
Placing the sealing film on the electronic component mounting substrate with the insulating layer facing the electronic component mounting substrate so as to cover the substrate, the electronic component, and the electrode;
Heating and softening the sealing film, and depressurizing;
The step of sealing the substrate, the electronic component, and the electrode with the sealing film in a state where the protruding portion is in contact with the electrode by cooling and pressurizing the sealing film. A method for sealing an electronic component mounting substrate, comprising:

(25) A sealing method for an electronic component mounting substrate for sealing the substrate and the electronic component using the sealing film according to any one of (6) to (11),
Disposing the sealing film on the electronic component mounting substrate with the insulating layer facing the electronic component mounting substrate so as to cover the substrate and the electronic component;
Heating and softening the sealing film, and depressurizing;
A method for sealing an electronic component mounting substrate, comprising: cooling the sealing film and applying pressure to seal the substrate and the electronic component with the sealing film.

(26) A sealing method for an electronic component mounting substrate for sealing the substrate and the electronic component using the sealing film according to any one of (12) to (14),
Disposing the sealing film on the electronic component mounting substrate with the insulating layer facing the electronic component mounting substrate so as to cover the substrate and the electronic component;
Heating and softening the sealing film, and depressurizing;
By cooling and pressurizing the sealing film, the substrate and the electronic component are sealed with the sealing film while the electronic component is covered with the electromagnetic wave shielding layer through the insulating layer. And a step of stopping the electronic component mounting substrate.

(27) A sealing method for an electronic component mounting substrate for sealing the substrate and the electronic component using the sealing film according to (15) or (16),
A step of covering the substrate and the electronic component and disposing the sealing film on the electronic component mounting substrate so that the escape portion corresponds to the connection member;
Heating and softening the sealing film, and depressurizing;
A step of sealing the substrate and the electronic component with the sealing film without sealing the connecting member by cooling and pressurizing the sealing film. An electronic component mounting substrate sealing method.

(28) A method for sealing an electronic component mounting substrate, wherein the substrate, the electronic component, and the electrode are sealed using the sealing film according to any one of (17) to (19). ,
The projecting portion is placed on the other side of the substrate while the sealing film is disposed on the electronic component mounting substrate with the insulating layer facing the electronic component mounting substrate so as to cover the substrate and the electronic component. The step of contacting the electrode by folding it to the surface side of
Heating and softening the sealing film, and depressurizing;
The step of sealing the substrate, the electronic component, and the electrode with the sealing film in a state where the protruding portion is in contact with the electrode by cooling and pressurizing the sealing film. A method for sealing an electronic component mounting substrate, comprising:

(29) The sealing film according to any one of (1) to (23), and the electronic component mounting substrate including the substrate, the electronic component, and the electrode covered with the sealing film. A film-covered electronic component mounting substrate for sealing, wherein the protruding portion is in contact with the electrode.

According to the present invention, the encapsulating film is composed mainly of a resin material, and the elongation rate of the encapsulating film at the softening point required in accordance with JIS K 6251 is 150% or more and 3500% or less. . First, the sealing film is placed on the electronic component mounting substrate so as to cover the substrate and the electronic component. Thereafter, the sealing film is heated and softened, and the pressure is reduced. Thereafter, the sealing film is cooled and pressurized. Through the above steps, the sealing film covers the substrate and the electronic component in a state of sealing with excellent followability with respect to the unevenness formed by mounting the electronic component on the substrate. be able to. Therefore, in the sealing film-covered electronic component mounting substrate obtained by coating this sealing film, the electronic component (particularly, the electronic component) is accurately suppressed from coming into contact with external factors such as moisture and dust. Or it can be prevented.
Further, when the substrate and the electronic component are covered with the sealing film, the electronic component is sealed with the electromagnetic wave shielding layer through the insulating layer, so that the obtained sealing film-covered electronic component mounting substrate is obtained. In this case, the influence of noise due to electromagnetic waves on the electronic component is appropriately suppressed or prevented.

FIG. 1 is a longitudinal sectional view showing a first embodiment of a sealing film of the present invention. 2A to 2C are longitudinal sectional views for explaining a method for sealing an electronic component mounting substrate using the sealing film shown in FIG. FIG. 3 is a longitudinal sectional view showing a second embodiment of the sealing film of the present invention. 4A to 4C are longitudinal sectional views for explaining a method for sealing an electronic component mounting board using the sealing film shown in FIG. FIG. 5 is a longitudinal sectional view showing a third embodiment of the sealing film of the present invention. 6A to 6C are longitudinal sectional views for explaining a method for sealing an electronic component mounting substrate using the sealing film shown in FIG. FIG. 7 is a longitudinal sectional view showing a fourth embodiment of the sealing film of the present invention. FIGS. 8A to 8C are longitudinal sectional views for explaining a method for sealing an electronic component mounting board using the sealing film shown in FIG. FIG. 9 is a longitudinal sectional view showing a fifth embodiment of the sealing film of the present invention. FIGS. 10A to 10C are longitudinal sectional views for explaining a method for sealing an electronic component mounting board using the sealing film shown in FIG. FIG. 11: is a longitudinal cross-sectional view which shows 6th Embodiment of the film for sealing of this invention. 12 (a) to 12 (c) are longitudinal sectional views for explaining a method for sealing an electronic component mounting board using the sealing film shown in FIG. FIG. 13: is a longitudinal cross-sectional view which shows 7th Embodiment of the film for sealing of this invention. FIGS. 14A to 14C are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. FIG. 15 is a longitudinal sectional view showing an eighth embodiment of the sealing film of the present invention. 16 (a) to 16 (c) are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. FIG. 17: is a longitudinal cross-sectional view which shows 9th Embodiment of the film for sealing of this invention. 18 (a) to 18 (c) are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. FIG. 19 is a longitudinal sectional view showing a tenth embodiment of the sealing film of the present invention. 20A to 20C are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. FIG. 21 is a longitudinal sectional view showing an eleventh embodiment of the sealing film of the present invention. FIGS. 22A to 22C are longitudinal sectional views for explaining a method of sealing an electronic component mounting substrate using the sealing film shown in FIG. FIGS. 23A and 23B are views showing a first reference form of the sealing film. 24A to 24C are longitudinal sectional views for explaining a method for sealing an electronic component mounting board using the sealing film shown in FIG. FIGS. 25A and 25B are views showing a twelfth embodiment of the sealing film of the present invention. FIGS. 26A to 26C are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. FIGS. 27A and 27B are views showing a thirteenth embodiment of the sealing film of the present invention. FIGS. 28A to 28C are longitudinal sectional views for explaining a method for sealing an electronic component mounting board using the sealing film shown in FIG. FIGS. 29A and 29B are views showing a fourteenth embodiment of a sealing film of the present invention. FIGS. 30A to 30C are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. FIGS. 31A and 31B are views showing a fifteenth embodiment of a sealing film of the present invention. 32 (a) to 32 (c) are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. FIGS. 33A and 33B are views showing a sixteenth embodiment of the sealing film of the present invention. 34A to 34C are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. FIGS. 35A and 35B are views showing a seventeenth embodiment of the sealing film of the present invention. 36 (a) to 36 (c) are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. FIGS. 37A and 37B are views showing an eighteenth embodiment of the sealing film of the present invention. FIGS. 38A to 38C are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. FIGS. 39A and 39B are views showing a nineteenth embodiment of a sealing film of the present invention. 40A to 40C are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. 41 (a) and 41 (b) are views showing a twentieth embodiment of the sealing film of the present invention. 42 (a) to 42 (c) are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG. FIG. 43 is a longitudinal sectional view showing a twenty-first embodiment of the sealing film of the present invention. 44 (a) to 44 (c) are longitudinal sectional views for explaining a method of sealing an electronic component mounting board using the sealing film shown in FIG.

Hereinafter, a sealing film, an electronic component mounting substrate sealing method, and a sealing film-covered electronic component mounting substrate according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

The sealing film of the present invention is a sealing film used for sealing an electronic component mounting substrate comprising a substrate and an electronic component mounted on one surface side of the substrate, and an insulating layer And an electromagnetic wave shielding layer laminated on one surface side of the insulating layer. The insulating layer and the electromagnetic wave shielding layer both contain a resin material, and this sealing film conforms to JIS K 6251. The elongation at the softening point determined in conformity is 150% or more and 3500% or less.

Moreover, the sealing method of the electronic component mounting substrate of the present invention is a sealing method of the electronic component mounting substrate that covers the electronic component mounting substrate and the electronic component mounting substrate, using the sealing film described above. A step of placing the sealing film on the electronic component mounting substrate with the insulating layer facing the electronic component mounting substrate so as to cover the substrate and the electronic component (placement step), and heating and softening the sealing film The step of reducing pressure (heating / depressurization step) and the step of cooling the sealing film and pressurizing the substrate and the electronic component with the sealing film (cooling / pressurization step) It is characterized by having.

When such a sealing film is applied to an uneven coating formed by mounting an electronic component on a substrate, the softened sealing film is added in the cooling / pressurizing step. Since it cools in the pressed state, it can coat | cover a board | substrate and an electronic component in the state sealed with the outstanding followable | trackability with respect to an unevenness | corrugation. Therefore, in the sealing film-covered electronic component mounting substrate obtained by coating the sealing film, it is possible to accurately suppress or prevent the electronic component from coming into contact with external factors such as moisture and dust. Therefore, it is possible to improve the reliability of the obtained electronic device equipped with the sealing film-covered electronic component mounting substrate and thus the sealing film-covered electronic component mounting substrate.

Further, when the substrate and the electronic component are covered with the sealing film, the electronic component is sealed with the electromagnetic wave shielding layer through the insulating layer. Therefore, in the obtained film-covered electronic component mounting substrate for sealing, the influence of noise due to electromagnetic waves on the electronic component is accurately suppressed or prevented.

When an electrode that is electrically connected to the electronic component is provided on one surface side of the substrate on which the electronic component is mounted, the sealing film is mounted on the substrate and the electronic component and the electrode are mounted on the substrate. Thus, the substrate, the electronic component, and the electrode can be sealed (coated) with excellent followability to the unevenness formed. Also in this case, the above-described effects can be obtained.

<First Embodiment>
[Sealing film]
First, 1st Embodiment of the film 100 for sealing of this invention is described.

FIG. 1 is a longitudinal sectional view showing a first embodiment of a sealing film of the present invention, and FIGS. 2A to 2C are diagrams for sealing an electronic component mounting substrate using the sealing film of the present invention. It is a longitudinal cross-sectional view for demonstrating a method. In the following description, for convenience of description, the upper side in FIGS. 1 and 2 is referred to as “upper” and the lower side is referred to as “lower”.

The sealing film 100 includes an insulating layer 12 and an electromagnetic wave shielding layer 13 laminated on one surface side (upper surface side) of the insulating layer 12, and both the insulating layer 12 and the electromagnetic wave shielding layer 13 are made of resin. It contains materials, and the elongation at the softening point required in accordance with JIS K 6251 is 150% or more and 3500% or less.

If the sealing film 100 comprised by the laminated body provided with such an insulating layer 12 and the electromagnetic wave shielding layer 13 will be sufficient if the said elongation rate can satisfy | fill the said range, these insulating layers 12 and an electromagnetic wave shield The resin material contained in the layer 13 may be composed of any material. Such resin materials include, for example, low density polyethylene, high density polyethylene, ethylene copolymer, polyolefin resin such as stretched polypropylene and unstretched polypropylene, ionomer resin, polyethylene terephthalate, polyester resin such as polybutylene terephthalate, polycarbonate Resin, nylon-6, nylon-6,6, nylon-6,10, nylon-6T composed of hexamethylenediamine and terephthalic acid, nylon-6I composed of hexamethylenediamine and isophthalic acid, nonanediamine and terephthalic acid Nylon-9T, Nylon-M5T composed of methylpentadiamine and terephthalic acid, Nylon-6,12 composed of caprolactam and lauryllactam, Hexamethylenediamine and adipic acid Examples thereof include polyamide resins such as nylon-6 and nylon-6,6 made of prolactam, thermoplastic resins such as acrylic resins, styrene resins, polyvinyl chloride and polyvinyl alcohol, one of these or Two or more kinds can be used in combination. Moreover, the resin material contained in each of the insulating layer 12 and the electromagnetic wave shielding layer 13 may be the same or different.

Further, the resin material contained in the insulating layer 12 and the electromagnetic wave shielding layer 13 may be a thermosetting resin such as an epoxy resin, a phenol resin, a melamine resin, or a silicone resin, an acrylic resin, A UV curable resin such as a urethane resin may be included.

Of the insulating layer 12 and the electromagnetic wave shielding layer 13 containing such a resin material, the insulating layer 12 is composed of a layer containing the resin material as a main material, and the electromagnetic wave shielding layer 13 is electrically conductive with the resin material. It is comprised by the layer containing the electroconductive particle provided with property. By adopting such a configuration as the insulating layer 12 and the electromagnetic wave shielding layer 13, the insulating layer 12 has insulating properties, and the electromagnetic wave shielding layer 13 has both conductivity and electromagnetic wave shielding properties.

The sealing film 100 including the insulating layer 12 containing the resin material as described above and the electromagnetic wave shielding layer 13 includes a layer containing a polyolefin-based resin as the resin material, among the insulating layer 12 and the electromagnetic wave shielding layer 13. It is preferable to provide as at least one layer. Thereby, the elongation at the softening point of the sealing film 100 can be easily set to 150% or more and 3500% or less.

Therefore, in the following, an insulating layer 12 containing the resin material as a main material and an electromagnetic wave shielding layer 13 containing the resin material and conductive particles are provided, and the resin material contained in the insulating layer 12 is a polyolefin resin. An example of the sealing film 100 will be described.

As shown in FIGS. 1 and 2, in this embodiment, the sealing film 100 includes an electromagnetic wave shielding layer 13 and an insulating layer 12, which are on the opposite side (upper surface) of the electronic component mounting substrate 45 to be covered. (Side) from the side, it is comprised with the laminated body laminated | stacked in this order. The electromagnetic wave shielding layer 13 is formed larger than the insulating layer 12, and an end portion thereof is exposed from an end portion (edge portion) of the insulating layer 12. In other words, the electromagnetic wave shielding layer 13 includes the protruding portion 15 formed by protruding beyond the end portion of the insulating layer 12.

The electronic component mounting substrate 45 covered with the sealing film 100 includes the substrate 5, the electronic component 4 mounted (mounted) on the center of the upper surface (one surface) of the substrate 5, and the electronic component. 4 and an electrode 3 formed on the end of the upper surface of the substrate 5. In such an electronic component mounting substrate 45, by mounting the electronic component 4 and the electrode 3 on the upper surface of the substrate 5, the unevenness 6 including the convex portions 61 and the concave portions 62 is formed on the substrate 5. It is covered with a sealing film 100. Examples of the substrate 5 include a printed wiring board. Examples of the electronic component 4 mounted on the substrate 5 include a semiconductor element, a capacitor, a coil, a connector, and a resistor. For example, an electrode for connecting to a power source for supplying electricity from the outside, an electrode for electrically connecting to another electronic component, a ground electrode for grounding the electronic component 4 and the like can be mentioned.

The insulating layer 12 has an elongation at the softening point of the sealing film 100 set to 150% or more and 3500% or less, for the purpose of having excellent adhesion to the irregularities 6 and excellent shape followability. In this embodiment, the layer contains an ethylene-vinyl acetate copolymer as a polyolefin resin (ethylene copolymer) as a main material.

Further, the insulating layer 12 is a layer having insulation properties by containing an ethylene-vinyl acetate copolymer as a resin material as a main material. The insulating layer 12 is interposed between the electronic component 4 and the electromagnetic wave shielding layer 13 having conductivity when the electronic component mounting substrate 45 is covered with the sealing film 100, so that the electronic components 4, Functions as a layer for preventing a short circuit between the electronic component 4 and the electrode 3.

In this ethylene-vinyl acetate copolymer, the VA content to be copolymerized is preferably 5% by weight to 30% by weight, and more preferably 10% by weight to 20% by weight. If it is less than the lower limit, it may be difficult to set the elongation at the softening point of the sealing film 100 within the above range. On the other hand, if the upper limit is exceeded, the crystal part of the resin constituting the insulating layer 12 decreases and the non-crystalline part tends to increase, so that the antioxidant remaining in the insulating layer 12 Such additives may be eluted. For this reason, the electronic component mounting board 45 side is shifted, and as a result, there is a possibility that the characteristics of the electronic component 4 may be inconvenient.

Further, the average thickness of the insulating layer 12 is preferably 5 μm or more and 200 μm or less, and more preferably 20 μm or more and 120 μm or less. By setting the average thickness of the insulating layer 12 within such a range, the elongation at the softening point of the sealing film 100 can be reliably set within a range of 150% to 3500%. In addition, the insulation of the electromagnetic wave shielding layer 13 with respect to the electronic component 4 can be more reliably ensured.

The resin material contained in the insulating layer 12 may be an ionomer resin contained in the electromagnetic wave shielding layer 13 described later, in addition to an ethylene-vinyl acetate copolymer as a polyolefin resin (ethylene copolymer). Further, a polyolefin resin other than the ethylene-vinyl acetate copolymer may be used.

The electromagnetic wave shielding layer 13 has an elongation at the softening point of the sealing film 100 set to 150% or more and 3500% or less, and has excellent adhesion to the unevenness 6 and shape followability, For the purpose of making the sealing film 100 excellent in toughness, in this embodiment, an ionomer resin is contained as a resin material. The resin material (ionomer) also functions as a binder that holds the following conductive material in the layer.

Further, the electromagnetic wave shielding layer 13 is a layer having conductivity and electromagnetic wave shielding properties by further containing conductive particles having conductivity in addition to the ionomer resin as a resin material. The electromagnetic wave shielding layer 13 is formed larger than the insulating layer 12, and the insulating layer 12 is laminated at the center portion thereof, but is formed by protruding beyond the end portion of the insulating layer 12 at the end portion. The protrusion part 15 is provided.

When the electronic component mounting substrate 45 is covered with the sealing film 100 by such an electromagnetic wave shielding layer 13, the electronic component 4 is covered through the insulating layer 12 at the center. Therefore, the influence of noise due to electromagnetic waves on the electronic component 4 is accurately suppressed or prevented in the sealing film-covered electronic component mounting substrate 50 obtained by covering the electronic component mounting substrate 45 with the sealing film 100. Can be. Further, at the end portion of the electromagnetic wave shielding layer 13, the insulating projecting portion 15 directly covers the electrode 3 without the insulating layer 12, so that the electrode 3 becomes the projecting portion 15 (the electromagnetic shielding layer 13). Electrically connected. Therefore, in the obtained film-covered electronic component mounting substrate 50 for sealing, it is possible to ensure electrical connection between the electrode 3 and the outside via the protruding portion 15.

Here, in this specification, the ionomer resin as the resin material means a binary copolymer containing ethylene and (meth) acrylic acid as a constituent component of the polymer, ethylene, (meth) acrylic acid and (meta ) Refers to a resin obtained by crosslinking a terpolymer having an acrylic ester as a constituent of a polymer with a metal ion, and one or two of them can be used in combination.

Examples of the metal ion include potassium ion (K ⁺ ), sodium ion (Na ⁺ ), lithium ion (Li ⁺ ), magnesium ion (Mg ⁺⁺ ), and zinc ion (Zn ⁺⁺ ). Among these, sodium ions (Na ⁺ ) or zinc ions (Zn ⁺⁺ ) are preferable. Thereby, since the crosslinked structure in the ionomer resin is stabilized, the function as the electromagnetic wave shielding layer 13 described above can be exhibited more remarkably.

Further, a binary copolymer having ethylene and (meth) acrylic acid as constituent components of the polymer, or a ternary copolymer having ethylene, (meth) acrylic acid and (meth) acrylic acid ester as constituent components of the polymer. The degree of neutralization by the cation (metal ion) in the carboxyl group of the polymer is preferably 40 mol% or more and 75 mol% or less.

Further, the conductive particles are not particularly limited as long as they can impart both conductivity and electromagnetic wave shielding properties to the electromagnetic wave shielding layer 13. For example, gold, silver, copper, iron, nickel and aluminum, or these And metal oxides such as ferrite, ITO, ATO, and FTO represented by metals such as alloys containing AFe ₂ O ₄ (wherein A is Mn, Co, Ni, Cu, or Zn) Etc. are included, and one or more of these can be used in combination. The conductive particles include those containing such metals and / or metal oxides, conductive polymers such as polyacetylene, polypyrrole, polythiophene, polyaniline, poly (p-phenylene) and polyfluorene, carbon nanotubes, It may contain a carbon-based material such as carbon nanofiber or carbon black.

The average particle diameter of the conductive particles is preferably 1.0 μm or more and 10.0 μm or less, and more preferably 3.0 μm or more and 8.0 μm or less. As a result, the conductive particles can be uniformly dispersed in the electromagnetic wave shielding layer 13. Therefore, the electromagnetic wave shielding layer 13 can exhibit its characteristics uniformly.

Further, the content of the conductive particles in the electromagnetic wave shielding layer 13 is preferably 10% by weight or more and 95% by weight or less, and more preferably 50% by weight or more and 90% by weight or less. By setting the content of the conductive particles within such a range, both the conductivity and the electromagnetic wave shielding property are surely imparted to the electromagnetic wave shielding layer 13, and the elongation at the softening point is in the range of 150% to 3500%. The film 100 for sealing set reliably in the inside can be obtained.

Further, the average thickness of the electromagnetic wave shielding layer 13 is preferably 1 μm or more and 400 μm or less, and more preferably 5 μm or more and 200 μm or less. By setting the average thickness of the electromagnetic wave shielding layer 13 within such a range, the sealing film 100 is excellent in toughness, and the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. It can be reliably set within the range. Furthermore, both the conductivity and the electromagnetic wave shielding property can be reliably imparted to the electromagnetic wave shielding layer 13.

The resin material contained in the electromagnetic wave shielding layer 13 may be an ionomer resin, an ethylene-vinyl acetate copolymer contained in the insulating layer 12, or other polyolefin resin.

Further, in the sealing film 100, an adhesive layer may be provided between the insulating layer 12 and the electromagnetic wave shielding layer 13 as necessary in order to impart adhesiveness or to improve adhesiveness. it can. Moreover, in order to improve the adhesiveness between the insulating layer 12 and the electronic component mounting substrate 45, an adhesive layer can be provided inside the insulating layer 12 as necessary.

Examples of the adhesive resin contained in the adhesive layer include EVA, ethylene-maleic anhydride copolymer, EAA, EEA, ethylene-methacrylate-glycidyl acrylate terpolymer, or various polyolefins such as acrylic acid, methacrylic acid, Monobasic unsaturated fatty acids such as acids, dibasic unsaturated fatty acids such as maleic acid, fumaric acid, itaconic acid or the like grafted with these anhydrides, such as maleic acid grafted EVA, maleic acid grafted ethylene Known adhesive resins and adhesive resins such as -α-olefin copolymers, styrene elastomers and acrylic resins can be used as appropriate.

Further, the production method for producing the sealing film 100 in which the electromagnetic wave shielding layer 13 and the insulating layer 12 are laminated is not particularly limited. For example, a known co-extrusion method, dry lamination method, extrusion lamination method, coating method It can be obtained by performing film formation and lamination using a process lamination or the like.

Here, by forming the sealing film 100 as a multilayer body including the electromagnetic wave shielding layer 13 and the insulating layer 12 having the above-described configuration, the elongation at the softening point of the sealing film 100 is relatively easy. Although it can be set to 150% or more and 3500% or less, this elongation may be 150% or more and 3500% or less, but it is preferably 150% or more and 2000% or less, and 1000% or more and 2000% or less. More preferably. As a result, when the sealing film 100 is used to coat the unevenness 6 included in the electronic component mounting substrate 45, it can be covered in a state of being sealed with excellent followability to the shape of the unevenness 6. It is possible to accurately suppress or prevent the sealing film 100 from being broken in the middle.

Moreover, even if the level | step difference in the unevenness | corrugation 6 provided in the board | substrate 5 was a big level | step difference as 10 mm or more by making elongation rate in the softening point of the film | membrane 100 for sealing | blocking in the said range, the film | membrane for sealing 100 can be made to follow the shape of the irregularities 6.

The elongation at break (elongation at the softening point) can be measured according to the method described in JIS K 6251 using an autograph apparatus (for example, AUTOGRAPH AGS-X manufactured by Shimadzu Corporation). it can.

In addition, the softening point of the sealing film 100 is determined by using a dynamic viscoelasticity measuring apparatus (for example, EXSTAR6000 manufactured by Seiko Instruments Inc.), a distance between chucks of 20 mm, a heating rate of 5 ° C./min, and an angular frequency of 10 Hz. It can be measured under the following conditions.

Furthermore, the linear expansion coefficient in the temperature range of 25 ° C. or more and 80 ° C. or less of the sealing film 100 is preferably 100 ppm / K or less, and more preferably 5 ppm / K or more and 50 ppm / K or less. When the linear expansion coefficient in the temperature range of 25 ° C. or higher and 80 ° C. or lower of the sealing film 100 is a value in such a range, the sealing film 100 is excellent when the sealing film 100 is heated. Since it has elasticity, the shape followability to the unevenness 6 of the sealing film 100 can be improved more reliably. Furthermore, since excellent adhesiveness can be maintained among the sealing film 100, the substrate 5, the electronic component 4, and further the electrode 3, it is generated by repeatedly driving the electronic component mounting substrate 45. The peeling from the electronic component mounting substrate 45 of the sealing film 100 due to heat generation can be suppressed or prevented more accurately. The linear expansion coefficient of the sealing film 100 can be calculated using, for example, a dynamic viscoelasticity measuring apparatus (for example, EXSTAR6000 manufactured by Seiko Instruments Inc.).

The average thickness of the sealing film 100 as a whole is preferably 10 μm or more and 700 μm or less, and more preferably 20 μm or more and 400 μm or less. By setting the average thickness of the sealing film 100 within this range, the sealing film 100 can be accurately suppressed or prevented from breaking in the middle of the sealing film 100, and for sealing. The elongation at the softening point of the film 100 can be reliably set within a range of 150% to 3500%.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting board using the sealing film of the first embodiment described above will be described.

The electronic component mounting substrate sealing method of the present embodiment includes a step of placing the sealing film 100 on the electronic component mounting substrate 45 so as to cover the substrate 5, the electronic component 4, and the electrode 3, The sealing film 100 is heated and softened, and the pressure reducing process (heating / depressurizing process) and the sealing film 100 are cooled and pressurized to seal the substrate 5, the electronic component 4, and the electrode 3. And a step (cooling / pressurizing step) of covering with the film 100 for use.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 2 (a), the electronic component mounting board in the state where the insulating layer 12 of the electromagnetic wave shielding layer 13 and the insulating layer 12 included in the sealing film 100 is opposed to the electronic component mounting board 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5, the electronic component 4, and the electrode 3 included in the 45.

(Heating and decompression process)
Next, as shown in FIG. 2B, the sealing film 100 is heated and softened, and the pressure is reduced.

Thus, by heating the sealing film 100, the sealing film 100, that is, the electromagnetic wave shielding layer 13 and the insulating layer 12 are softened. As a result, the electronic component 4 and the electrode 3 are mounted on the substrate 5. It will be in the state which can follow the shape of the unevenness | corrugation 6 formed by (1).

At this time, the electronic component mounting substrate 45 and the sealing film 100 are arranged in a reduced-pressure atmosphere, so that not only the upper side of the sealing film 100 but also the electronic component mounting substrate 45 and the sealing film 100 The gas (air) in between is degassed.

Thereby, while the sealing film 100 extends, the shape of the irregularities 6, that is, the shape of the electronic component 4 and the electrode 3 on the substrate 5 is slightly followed.

By this step, the sealing film 100 can be made to follow the shape of the unevenness 6 formed on the electronic component mounting substrate 45.

The heating of the sealing film 100 and the reduced pressure of the atmosphere may be reduced after the heating or may be heated after the reduced pressure, but it is preferable to perform the heating and the reduced pressure almost simultaneously. Thereby, the softened film 100 for sealing can be made into the state which followed the shape of the unevenness | corrugation 6 a little reliably.

(Cooling / pressurization process)
Next, as shown in FIG. 2C, the sealing film 100 is cooled and pressurized.

Thus, by pressurizing from the decompressed atmosphere, in the heating and decompression step, the space between the electronic component mounting substrate 45 and the sealing film 100 is degassed, and the decompressed state is maintained. As a result, the sealing film 100 is further extended. As a result, the sealing film 100 is softened in a state in which the shape of the unevenness 6 (the shape of the electronic component 4 and the electrode 3) follows with an excellent degree of adhesion (air density). The substrate 5, the electronic component 4, and the electrode 3 are covered with the film 100 for use. In the heating and depressurizing step, the pressing step can be omitted if the sealing film 100 sufficiently follows the shape of the irregularities 6.

At this time, in the present invention, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Therefore, since the sealing film 100 can be extended with better shape followability with respect to the unevenness 6 formed on the electronic component mounting substrate 45 during this pressurization, the sealing film in a softened state By 100, the board | substrate 5 and the electronic component 4 can be coat | covered with the outstanding adhesiveness.

And in the state which coat | covered the board | substrate 5 and the electronic component 4 with the outstanding adhesiveness (airtightness) with the film 100 for sealing, by cooling the film 100 for sealing, this state is maintained, The sealing film 100 is solidified.

Thus, the sealing film-covered electronic component in which the substrate 5, the electronic component 4, and the electrode 3 are covered with the sealing film 100 while following the shape of the unevenness 6 formed on the electronic component mounting substrate 45. A mounting substrate 50 is obtained. Therefore, in this film-covered electronic component mounting substrate 50 for sealing, it is possible to accurately suppress or prevent the external component such as moisture and dust from contacting the electronic component 4 and the electrode 3. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

In addition, the sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12 and the electromagnetic wave shielding layer 13, and the electromagnetic wave shielding layer 13 is composed of the insulating layer 12. The insulating layer 12 is formed at a central portion of the insulating layer 12. The protruding portion 15 is formed at the end portion so as to protrude beyond the end portion of the insulating layer 12.

Therefore, in this step, the electronic component 4 is covered with the insulating layer 12 in the central portion of the electromagnetic wave shielding layer 13. Therefore, in the obtained film-covered electronic component mounting substrate 50 for sealing, the influence of noise due to electromagnetic waves on the electronic component 4 can be accurately suppressed or prevented.

Further, at the end portion of the electromagnetic wave shielding layer 13, the insulating projecting portion 15 directly covers the electrode 3 without the insulating layer 12, so that the electrode 3 becomes the projecting portion 15 (the electromagnetic shielding layer 13). Electrically connected. Therefore, in the obtained film-covered electronic component mounting substrate 50 for sealing, it is possible to ensure electrical connection between the electrode 3 and the outside via the protruding portion 15.

In addition, although cooling of the film 100 for sealing and pressurization of an atmosphere may be cooled after pressurization, it is preferable to perform cooling and pressurization substantially simultaneously. Thereby, the film 100 for sealing can be coat | covered with the more excellent adhesiveness corresponding to the shape of the unevenness | corrugation 6. FIG.

By passing through said process, the sealing film covering electronic component mounting board | substrate 50 with which the board | substrate 5 and the electronic component 4 were coat | covered with the film 100 for sealing can be obtained.
Second Embodiment
[Sealing film]
Next, 2nd Embodiment of the film 100 for sealing of this invention is described.

FIG. 3 is a longitudinal sectional view showing a second embodiment of the sealing film of the present invention, and FIGS. 4 (a) to 4 (c) show the sealing of the electronic component mounting substrate using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the stopping method. In the following description, for convenience of description, the upper side in FIGS. 3 and 4A to 4C is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the second embodiment will be described, but the description will focus on the differences from the first embodiment, and the description of the same matters will be omitted.

In 2nd Embodiment, the film 100 for sealing is further provided with the coating layer 14 laminated | stacked on the opposite side to the insulating layer 12 of the electromagnetic wave shield layer 13, as shown in FIG. 3, FIG. The same as in the first embodiment. That is, in the sealing film 100 of this embodiment, the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 are laminated in this order from the electronic component mounting substrate 45 side to be coated. In the sealing film 100 of the present embodiment, as shown in FIG. 4, the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 have substantially the same size.

Here, in this embodiment, the electronic component mounting substrate 45 covered with the sealing film 100 is mounted on the substrate 5 and the central portion on the upper surface (one surface) side of the substrate 5 as shown in FIG. The electronic component 4 is placed (placed). In such an electronic component mounting substrate 45, the mounting of the electronic component 4 on the upper surface of the substrate 5 forms the unevenness 6 including the convex portions 61 and the concave portions 62 on the substrate 5. Examples of the substrate 5 include a printed wiring board, and examples of the electronic component 4 mounted on the substrate 5 include a semiconductor element, a capacitor, a coil, a connector, and a resistor.

When the electronic component mounting substrate 45 on which the electronic component 4 is mounted on the upper surface is coated with the sealing film 100 with the insulating layer 12 on the lower side and the coating layer 14 on the upper side, The component 4 is sealed with the electromagnetic wave shielding layer 13 through the insulating layer 12. Therefore, in the obtained film-covered electronic component mounting substrate 50 for sealing, the influence of noise due to electromagnetic waves on the electronic component 4 is accurately suppressed or prevented.

Further, since the electronic component 4 is sealed by the electromagnetic wave shielding layer 13 through the insulating layer 12, the electromagnetic wave shielding layer 13 is ensured to be insulated from the electronic component 4. Further, the electromagnetic wave shielding layer 13 is covered with a covering layer 14 on the surface opposite to the electronic component 4. For this reason, the electromagnetic wave shielding layer 13 is also provided with insulation against other electronic components located outside the obtained sealing film-covered electronic component mounting substrate 50.

Further, the covering layer 14 of such a sealing film 100 contains a resin material in the same manner as the insulating layer 12 and the electromagnetic wave shielding layer 13 described above. Further, as in the first embodiment described above, the elongation at the softening point of the sealing film 100 determined in accordance with JIS K 6251 is 150% or more and 3500% or less, but 150% or more and 2000% or less. It is preferable that it is 1000% or more and 2000% or less.

When the softening point of the sealing film 100 is within such a range, when the sealing film 100 is used to cover the unevenness 6 included in the electronic component mounting substrate 45, the shape of the unevenness 6 is reduced. It can coat | cover in the state sealed with the outstanding followable | trackability. Therefore, in the sealing film-covered electronic component mounting substrate 50 obtained by covering the sealing film 100, the electronic component 4 on the substrate 5 is accurately prevented from coming into contact with external factors such as moisture and dust. Or it can be prevented. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

In addition, by setting the elongation at the softening point of the sealing film 100 within the above range, the step in the unevenness 6 provided on the substrate 5 was as large as 10 mm or more as a specific size. Even so, the sealing film 100 can be made to follow the shape of the irregularities 6.

The covering layer 14 included in the sealing film 100 having an elongation at the softening point of 150% or more and 3500% or less contains a resin material, like the insulating layer 12 and the electromagnetic wave shielding layer 13 described above. . As such a resin material, the same resin material as the insulating layer 12 and the electromagnetic wave shielding layer 13 described above can be used. In addition, if the resin material contained in each of the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 can set the elongation at the softening point of the sealing film 100 to 150% or more and 3500% or less, It may be the same or different.

Moreover, in order to make elongation rate in the said softening point of the film 100 for sealing into the said range, the insulating layer 12 among the insulating layers 12, the electromagnetic wave shield layer 13, and the coating layer 14 containing the above resin materials. And the coating layer 14 is comprised by the layer which contains the said resin material as a main material, and the electromagnetic wave shield layer 13 is comprised by the layer containing the said resin material and the electroconductive particle provided with the said electroconductivity. By having the insulating layer 12, the electromagnetic wave shielding layer 13 and the covering layer 14 in this configuration, the insulating layer 12 and the covering layer 14 have insulating properties, and the electromagnetic wave shielding layer 13 has both conductivity and electromagnetic wave shielding properties. Have.

The sealing film 100 including the insulating layer 12, the electromagnetic wave shielding layer 13, and the covering layer 14 each including the resin material having the above-described configuration includes a polyolefin resin as the resin material among the resin materials described above. The layer to be contained is preferably provided as at least one of the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer. Thereby, the elongation at the softening point of the sealing film 100 can be set to 150% or more and 3500% or less more reliably.

Therefore, hereinafter, the sealing film 100 in which the resin materials included in the insulating layer 12 and the covering layer 14 are both polyolefin-based resins will be described as an example.

For the purpose of the coating layer 14, the elongation at the softening point of the sealing film 100 is set to 150% or more and 3500% or less, and the coating layer 14 is excellent in adhesion to the unevenness 6 and shape followability. In the embodiment, the layer contains an ethylene-vinyl acetate copolymer as a polyolefin resin (ethylene copolymer) as a main material.

The coating layer 14 is a layer having an insulating property by containing an ethylene-vinyl acetate copolymer as a resin material as a main material. When the electronic component mounting substrate 45 is covered with the sealing film 100, By covering the surface of the electromagnetic shielding layer 13 having conductivity opposite to the electronic component 4, it functions as a layer for ensuring insulation against other electronic components located outside the electronic component mounting substrate 45. .

In this ethylene-vinyl acetate copolymer, the VA content to be copolymerized is set within the same range as the VA content to be copolymerized shown in the insulating layer 12 described above.

The average thickness of the coating layer 14 is preferably 5 μm or more and 200 μm or less, and more preferably 20 μm or more and 120 μm or less. By setting the average thickness of the covering layer 14 within such a range, the elongation at the softening point of the sealing film 100 can be reliably set within a range of 150% or more and 3500% or less. Moreover, the insulation of the electromagnetic wave shielding layer 13 with respect to the electronic component located outside the sealing film-covered electronic component mounting substrate 50 can be more reliably ensured.

The resin material contained in the coating layer 14 is contained in the electromagnetic wave shielding layer 13 as well as the ethylene-vinyl acetate copolymer as a polyolefin resin (ethylene copolymer), as in the case of the insulating layer 12. It may be an ionomer resin or a polyolefin resin other than an ethylene-vinyl acetate copolymer.

Moreover, in the sealing film 100, in order to provide adhesiveness between the insulating layer 12 and the electromagnetic wave shielding layer 13, and between the electromagnetic wave shielding layer 13 and the coating layer 14, or to improve adhesiveness. If necessary, an adhesive layer may be provided. Further, in order to improve the adhesion between the insulating layer 12 and the electronic component mounting substrate 45, the first embodiment described above may be provided inside the insulating layer 12, that is, between the insulating layer 12 and the substrate 5, as necessary. It is also possible to provide an adhesive layer similar to the above.

Furthermore, a manufacturing method for manufacturing the sealing film 100 in which the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 are laminated is not particularly limited. For example, a known coextrusion method, dry lamination method, extrusion It can be obtained by film formation and lamination using a lamination method, coating lamination, or the like.

Here, by forming the sealing film 100 as a multilayer body including the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 having the above-described configuration, the elongation at the softening point of the sealing film 100 can be increased. It can be set to 150% or more and 3500% or less relatively easily.

Furthermore, as in the first embodiment, the linear expansion coefficient in the temperature range of 25 ° C. to 80 ° C. of the sealing film 100 is preferably 100 ppm / K or less. Thus, also by prescribing the linear expansion coefficient of the sealing film 100, the sealing film 100 has excellent stretchability when the sealing film 100 is heated. The shape followability to the unevenness 6 of the film 100 can be improved more reliably. Furthermore, since excellent adhesion can be maintained between the sealing film 100 and the substrate 5 and further the electronic component 4, the sealing caused by the heat generated by repeatedly driving the electronic component mounting substrate 45 is achieved. The peeling from the electronic component mounting substrate 45 of the stop film 100 can be suppressed or prevented more accurately.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting board using the sealing film of the second embodiment described above will be described.

The electronic component mounting substrate sealing method of this embodiment is such that the sealing film 100 is placed on the electronic component mounting substrate 45 with the insulating layer 12 facing the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4. And placing the substrate 5 and the electronic component 4 together by heating and softening the sealing film 100, heating and decompressing the sealing film 100, and cooling and pressurizing the sealing film 100. And a cooling / pressurizing step of sealing with the sealing film 100.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 4A, in the state where the insulating layer 12 of the insulating film 12, the electromagnetic wave shielding layer 13 and the covering layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component mounting substrate 45 (FIG. 4B).

(Heating and decompression process)
Next, the sealing film 100 is heated and softened while maintaining the state shown in FIG.

Thus, by heating the sealing film 100, the sealing film 100, that is, the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 are softened. As a result, on the upper surface side of the substrate 5, It will be in the state which can follow the shape of the unevenness | corrugation 6 formed by mounting the electronic component 4. FIG.

At this time, the electronic component mounting substrate 45 and the sealing film 100 are arranged in a reduced-pressure atmosphere, so that not only the outside of the sealing film 100 but also the electronic component mounting substrate 45 and the sealing film 100 The gas (air) in between is degassed.

Thus, while the sealing film 100 is extended, the shape of the unevenness 6, that is, the shape of the electronic component 4 on the substrate 5 is slightly followed on the upper side of the substrate 5.

By this step, the sealing film 100 can be made to follow the shape of the irregularities 6 formed on the upper surface side of the electronic component mounting substrate 45.

(Cooling / pressurization process)
Next, as shown in FIG. 4C, the sealing film 100 is cooled and pressurized.

Thus, by pressurizing from the decompressed atmosphere, in the heating and decompression step, the space between the electronic component mounting substrate 45 and the sealing film 100 is degassed, and the decompressed state is maintained. The sealing film 100 is further extended.

As a result, on the upper side of the substrate 5, the substrate 5 and the electronic component are formed by the softened sealing film 100 in a state in which the shape of the unevenness 6 (the shape of the electronic component 4) follows with an excellent degree of adhesion (density). 4 are coated.

In the heating and decompression step, if the sealing film 100 sufficiently follows the shape of the irregularities 6, the pressing step can be omitted.

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Therefore, the sealing film 100 can be extended with better shape followability to the unevenness 6 formed on the electronic component mounting substrate 45 at the time of pressurization. Therefore, the substrate 5 and the electronic component 4 can be coated on the upper side of the substrate 5 with excellent adhesion by the softened sealing film 100.

Then, the sealing film 100 is cooled in a state where the substrate 5 and the electronic component 4 are coated with excellent adhesion (airtightness) by the sealing film 100, and the sealing film 100 is maintained while maintaining this state. The stop film 100 is solidified.

Thereby, the substrate 5 and the electronic component 4 are in contact with the insulating layer 12 on the upper side of the substrate 5 by the sealing film 100 while following the shape of the unevenness 6 formed on the electronic component mounting substrate 45. The coated sealing film-covered electronic component mounting substrate 50 is obtained. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to accurately suppress or prevent the electronic component 4 from coming into contact with external factors such as moisture and dust. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

Further, the sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12, the electromagnetic wave shielding layer 13, and the covering layer 14.

Therefore, in this step, the electronic component 4 is covered with the electromagnetic wave shielding layer 13 through the insulating layer 12. Therefore, the obtained film-covered electronic component mounting substrate 50 for sealing can be one in which the influence of noise due to electromagnetic waves on the electronic component 4 is appropriately suppressed or prevented.

Furthermore, since the electronic component 4 is sealed by the electromagnetic wave shielding layer 13 through the insulating layer 12, the electromagnetic wave shielding layer 13 covers the electronic component 4 in a state in which insulation against the electronic component 4 is ensured. be able to. Moreover, since the electromagnetic wave shielding layer 13 is covered with the coating layer 14 on the surface opposite to the electronic component 4, the electromagnetic wave shielding layer 13 is disposed outside the obtained film-covered electronic component mounting substrate 50 for sealing. The electronic component mounting substrate 45 can be covered with insulation of other electronic components that are positioned.

Through the above steps, the sealing film-covered electronic component mounting substrate 50 in which the substrate 5 and the electronic component 4 are covered with the sealing film 100 can be obtained.

<Third Embodiment>
[Sealing film]
Next, 3rd Embodiment of the film 100 for sealing of this invention is described.

FIG. 5 is a longitudinal sectional view showing a third embodiment of the sealing film of the present invention, and FIGS. 6 (a) to 6 (c) show the sealing of the electronic component mounting substrate using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the stopping method. In the following description, for convenience of description, the upper side in FIGS. 5 and 6 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the third embodiment will be described, but the description will focus on differences from the first and second embodiments, and description of similar matters will be omitted.

In 3rd Embodiment, the structure of the coating layer 14 with which the film 100 for sealing is provided differs, and other than that is the same as that of the said 2nd Embodiment.

In the sealing film 100 of the third embodiment, as shown in FIGS. 5 and 6, the covering layer 14 is formed larger than the electromagnetic shielding layer 13, and the end thereof is the end (edge) of the electromagnetic shielding layer 13. Exposed). In other words, the coating layer 14 includes the protruding portion 15 (first protruding portion) formed by protruding beyond the end portion of the electromagnetic wave shielding layer 13.

Using such a sealing film 100, with respect to the electronic component mounting substrate 45 on which the electronic component 4 is mounted on the upper surface (one surface) side, the insulating layer 12 is on the lower side and the covering layer 14 is on the upper side. When covered, the electronic component 4 is sealed with the electromagnetic wave shielding layer 13 through the insulating layer 12.

Further, in the present embodiment, the projecting portion 15 included in the coating layer 14 is configured to be able to be folded to the lower surface (the other surface) side of the substrate 5 at the time of coating using the sealing film 100. Has been. Therefore, the end portion 51 on the lower surface of the substrate 5 can be covered with the protruding portion 15. Therefore, the sealing film 100 according to the present embodiment can cover not only the upper surface side of the substrate 5 but also the end portion 51 on the lower surface of the substrate 5 with the coating layer 14, and the electronic component with better airtightness. The mounting substrate 45 can be covered. Therefore, in the sealing film-covered electronic component mounting substrate 50 obtained by covering with the sealing film 100, the electronic component 4 on the substrate 5 is more accurately suppressed from coming into contact with external factors such as moisture and dust. Or it can be prevented.

Further, as in the first embodiment, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, by folding the protruding portion 15 from the upper surface side to the lower surface side of the substrate 5, when covering the end portion 51, it is possible to appropriately suppress or prevent the protruding portion 15 from breaking at the bent portion. Can be prevented.

Furthermore, as in the first embodiment, the linear expansion coefficient in the temperature range of 25 ° C. to 80 ° C. of the sealing film 100 is preferably 100 ppm / K or less. Thus, by defining the linear expansion coefficient of the sealing film 100, the folding of the protruding portion 15 from the upper surface side to the lower surface side of the substrate 5 is caused to break at the bent portion that bends the protruding portion 15. It can be surely implemented without any problems.

Moreover, the length of the protrusion part 15 of the coating layer 14 which protrudes beyond the edge part of the electromagnetic wave shield layer 13 in the film 100 for sealing is not specifically limited, It may be 0.1 cm or more and 5.0 cm or less. Preferably, it is 0.5 cm or more and 2.5 cm or less. By setting the length of the protruding portion 15 within such a range, the protruding portion 15 can reach the end portion 51 on the lower surface of the substrate 5 while being folded from the upper surface side of the substrate 5 to the lower surface side. It is possible to reliably realize the covering of the end portion 51 by the protruding portion 15.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting substrate using the sealing film of the third embodiment described above will be described.

The electronic component mounting substrate sealing method of this embodiment is such that the sealing film 100 is placed on the electronic component mounting substrate 45 with the insulating layer 12 facing the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4. And placing the protruding portion 15 in contact with the end portion 51 on the lower surface of the substrate 5 by folding the protruding portion 15 toward the lower surface (the other surface) of the substrate 5 and heating and softening the sealing film 100. The substrate 5 and the electronic component 4 are brought into contact with the end portion 51 on the lower surface of the substrate 5 by cooling and pressurizing the heating film / depressurization step for reducing the pressure and the sealing film 100. And a cooling / pressurizing step of sealing with the sealing film 100.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 6A, the insulating layer 12 of the insulating film 12, the electromagnetic wave shielding layer 13, and the coating layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component mounting substrate 45.

At this time, the protruding portion 15 of the covering layer 14 protruding beyond the end portion of the electromagnetic wave shielding layer 13 is folded to the lower surface side of the substrate 5, thereby bringing the protruding portion 15 into contact with the end portion 51 (FIG. 6). (B)).

Thus, by heating the sealing film 100, the sealing film 100, that is, the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 are softened. As a result, on the upper surface side of the substrate 5, It will be in the state which can follow the shape of the unevenness | corrugation 6 formed by mounting the electronic component 4, and also will be in the state which can coat | cover the edge part 51 in the lower surface side of the board | substrate 5. FIG.

Thereby, while the sealing film 100 is extended, the shape of the unevenness 6 on the upper side of the substrate 5, that is, the shape of the electronic component 4 on the substrate 5 is slightly followed. The part 51 is slightly covered.

By this step, the sealing film 100 can be made to follow the shape of the unevenness 6 formed on the upper surface side of the electronic component mounting substrate 45, and the protrusion 15 is folded to the lower surface side of the substrate 5, The end portion 51 can be covered.

(Cooling / pressurization process)
Next, as shown in FIG. 6C, the sealing film 100 is cooled and pressurized.

As a result, the upper side of the substrate 5 follows the shape of the unevenness 6 (the shape of the electronic component 4) with an excellent degree of adhesion (air density), and further covers the end portion 51 with an excellent degree of adhesion. Thus, the substrate 5 and the electronic component 4 are covered with the sealing film 100 in a softened state.

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, the film 100 for sealing can be extended with the more excellent shape followability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization. Therefore, the sealing film 100 in a softened state can cover the substrate 5 and the electronic component 4 on the upper side of the substrate 5 and further the end portion 51 with excellent adhesion. Further, when the protruding portion 15 is folded from the upper surface side to the lower surface side of the substrate 5 and brought into contact with the end portion 51, it is possible to accurately suppress or prevent the protruding portion 15 from breaking at the bent portion. be able to.

Then, the sealing film 100 is cooled with the sealing film 100 in a state where the substrate 5 and the electronic component 4 are covered with the end 51 with excellent adhesion (airtightness). The sealing film 100 is solidified while maintaining the state.

Thereby, the substrate 5 and the electronic component 4 are in contact with the insulating layer 12 on the upper side of the substrate 5 by the sealing film 100 while following the shape of the irregularities 6 formed on the electronic component mounting substrate 45. The sealing film-covered electronic component mounting substrate 50 is obtained in a state where the projecting portion 15 of the folded covering layer 14 covers the end portion 51 on the lower side of the substrate 5. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to more accurately suppress or prevent the external component such as moisture and dust from contacting the electronic component 4 and the electrode 3. Therefore, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

<Fourth embodiment>
[Sealing film]
Next, 4th Embodiment of the film 100 for sealing of this invention is described.

FIG. 7 is a longitudinal sectional view showing a fourth embodiment of the sealing film of the present invention, and FIGS. 8A to 8C are views for sealing an electronic component mounting substrate using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the stopping method. In the following description, for convenience of description, the upper side in FIGS. 7 and 8 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, although the fourth embodiment will be described, the description will focus on differences from the first to third embodiments, and description of similar matters will be omitted.

In the fourth embodiment, the configurations of the insulating layer 12 and the covering layer 14 included in the sealing film 100 are different, and the other configurations are the same as those in the second embodiment.

In the sealing film 100 of the fourth embodiment, the insulating layer 12 and the covering layer 14 are each formed larger than the electromagnetic wave shielding layer 13 as shown in FIG. 7 and FIG. It is exposed from the end (edge) of the layer 13. In other words, the projecting portion 15 (first projecting portion) and the projecting portion 16 (third projecting portion) formed by the insulating layer 12 and the covering layer 14 projecting beyond the end of the electromagnetic wave shielding layer 13 are provided. I have. And these protrusion part 15 and protrusion part 16 form the lamination | stacking protrusion part 65 provided by laminating | stacking in the position beyond the edge part of the electromagnetic wave shield layer 13. FIG.

Using such a sealing film 100, with respect to the electronic component mounting substrate 45 on which the electronic component 4 is mounted on the upper surface (one surface) side, the insulating layer 12 is on the lower side and the covering layer 14 is on the upper side. Then, the electronic component 4 is sealed with the electromagnetic wave shielding layer 13 through the insulating layer 12.

Furthermore, in the present embodiment, the laminated projection 65 formed by laminating the projection 15 and the projection 16 at the time of coating using the sealing film 100 is the bottom surface of the substrate 5 (the other side). It is configured so that it can be folded to the surface) side. Therefore, the end portion 51 on the lower surface of the substrate 5 can be covered with the protruding portion 15 included in the stacked protruding portion 65. Therefore, the sealing film 100 of the present embodiment can cover not only the upper surface side of the substrate 5 but also the end portion 51 on the lower surface of the substrate 5 with the laminated projecting portion 65, and has an excellent airtightness. The component mounting board 45 can be covered. Therefore, in the sealing film-covered electronic component mounting substrate 50 obtained by covering with the sealing film 100, the electronic component 4 on the substrate 5 is more accurately suppressed from coming into contact with external factors such as moisture and dust. Or it can be prevented.

The laminated protrusion 65 is formed by laminating the protrusion 15 and the protrusion 16 at a position beyond the end of the electromagnetic wave shielding layer 13, and the end of the electromagnetic wave shielding layer 13 is also formed on the insulating layer 12. By covering with the covering layer 14, the insulating property of the electromagnetic wave shielding layer 13 with respect to the electronic component 4 and the electronic component located outside the electronic component mounting board 45 can be more reliably ensured.

Furthermore, as in the first embodiment, the elongation at the softening point is 150% or more and 3500% or less. Thus, by folding the laminated protrusion 65 from the upper surface side to the lower surface side of the substrate 5, it is possible to accurately break the laminated protrusion 65 at the bent portion when covering the end portion 51. It can be suppressed or prevented.

Further, similarly to the first embodiment, the linear expansion coefficient in the temperature range of 25 ° C. to 80 ° C. of the sealing film 100 is preferably 100 ppm / K or less. As described above, by defining the linear expansion coefficient of the sealing film 100, the folding of the laminated protrusion 65 from the upper surface side to the lower surface side of the substrate 5 is broken at the bent portion that bends the laminated protrusion 65. It can be carried out reliably without causing it.

Further, the length of the laminated protrusion 65 protruding beyond the end of the electromagnetic wave shielding layer 13 in the sealing film 100 is not particularly limited, and is preferably 0.1 cm or more and 5.0 cm or less. More preferably, it is 5 cm or more and 2.5 cm or less. By setting the length of the laminated protrusion 65 within such a range, the laminated protrusion 65 can reach the end 51 on the lower surface of the substrate 5 while being folded from the upper surface side to the lower surface side of the substrate 5. Therefore, it is possible to reliably realize the covering of the end portion 51 by the stacked projecting portion 65.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting substrate using the sealing film of the fourth embodiment described above will be described.

The electronic component mounting substrate sealing method of this embodiment is such that the sealing film 100 is placed on the electronic component mounting substrate 45 with the insulating layer 12 facing the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4. The stacking protrusion 65 is placed on the lower surface (the other surface) side of the substrate 5 to be brought into contact with the end portion 51 on the lower surface of the substrate 5 and the sealing film 100 is heated and softened. At the same time, the substrate 5 and the electronic component 4 are brought into contact with the end portion 51 on the lower surface of the substrate 5 by cooling and pressurizing the sealing film 100 with the heating / decompression step of reducing the pressure. And a cooling / pressurizing step for sealing with the sealing film 100.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 8A, the insulating layer 12 of the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component mounting substrate 45.

At this time, the laminated protrusion 65 that protrudes beyond the end of the electromagnetic wave shielding layer 13 is folded to the lower surface side of the substrate 5, thereby bringing the laminated protrusion 65 into contact with the end 51 (FIG. 8B). )).

By this step, the sealing film 100 can be made to follow the shape of the unevenness 6 formed on the upper surface side of the electronic component mounting substrate 45, and the laminated protrusion 65 is folded on the lower surface side of the substrate 5. The end portion 51 can be covered.

(Cooling / pressurization process)
Next, as shown in FIG. 8C, the sealing film 100 is cooled and pressurized.

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, the film 100 for sealing can be extended with the more excellent shape followability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization. Therefore, the sealing film 100 in a softened state can cover the substrate 5 and the electronic component 4 on the upper side of the substrate 5 and further the end portion 51 with excellent adhesion. In addition, when the laminated protrusion 65 is folded from the upper surface side to the lower surface side of the substrate 5 to be brought into contact with the end portion 51, it is possible to accurately suppress or prevent the laminated protrusion 65 from being broken at the bent portion. Can be prevented.

Thereby, the substrate 5 and the electronic component 4 are in contact with the insulating layer 12 on the upper side of the substrate 5 by the sealing film 100 while following the shape of the irregularities 6 formed on the electronic component mounting substrate 45. The film-covered electronic component mounting substrate 50 for sealing is obtained in a state where the folded laminated protrusion 65 covers the end 51 on the lower side of the substrate 5. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to more accurately suppress or prevent the external component such as moisture and dust from contacting the electronic component 4 and the electrode 3. Therefore, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

<Fifth Embodiment>
Next, 5th Embodiment of the film 100 for sealing of this invention is described.

FIG. 9 is a longitudinal sectional view showing a fifth embodiment of the sealing film of the present invention, and FIGS. 10 (a) to 10 (c) show the sealing of the electronic component mounting substrate using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the stopping method. In the following description, for convenience of description, the upper side in FIGS. 9 and 10 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the fifth embodiment will be described, but the description will focus on differences from the first to fourth embodiments, and description of similar matters will be omitted.

In the fifth embodiment, the configurations of the electromagnetic wave shielding layer 13 and the covering layer 14 included in the sealing film 100 are different, and further, the configuration of the electronic component mounting substrate 45 covered with the sealing film 100 is different. Is the same as in the second embodiment.

In the sealing film 100 of the fifth embodiment, the electromagnetic wave shielding layer 13 and the covering layer 14 are formed larger than the insulating layer 12 as shown in FIGS. Thereby, the edge part of the electromagnetic wave shielding layer 13 located in the insulating layer 12 side among the electromagnetic wave shielding layer 13 and the coating layer 14 is exposed from the edge part (edge part) of the insulating layer 12. In other words, the electromagnetic wave shielding layer 13 includes the protruding portion 17 (second protruding portion) formed by protruding beyond the end portion of the insulating layer 12.

Moreover, the electronic component mounting substrate 45 covered with the sealing film 100 of the fifth embodiment is mounted on the substrate 5 and the central portion on the upper surface (one surface) side of the substrate 5 (see FIG. 10). The electronic component 4 that is placed) and the electrode 3 that is electrically connected to the electronic component 4 and is formed on the end portion 52 on the upper surface (one surface) side of the substrate 5 are provided. In such an electronic component mounting substrate 45, the unevenness 6 including the convex portion 61 and the concave portion 62 is formed on the substrate 5 by mounting the electronic component 4 and the electrode 3 on the upper surface of the substrate 5. In addition, as the electrode 3, for example, an electrode for connecting to a power source for supplying electricity from the outside, an electrode for electrically connecting to another electronic component located outside the electronic component mounting board 45, In addition, a ground electrode for grounding the electronic component 4 may be used.

Thus, the electronic component mounting substrate 45 on which the electronic component 4 and the electrode 3 are mounted on the upper surface side is covered with the sealing film 100 with the insulating layer 12 on the lower side and the coating layer 14 on the upper side. Then, the electronic component 4 is sealed with the electromagnetic wave shielding layer 13 through the insulating layer 12.

Furthermore, in this embodiment, the electromagnetic wave shielding layer 13 is exposed from the insulating layer 12 at the projecting portion 17 provided in the electromagnetic wave shielding layer 13 when the sealing film 100 is used for coating. Therefore, the protruding portion 17 can be brought into contact with the electrode 3 formed on the end portion 52 on the upper surface of the substrate 5. Therefore, since the protrusion 17 is composed of the electromagnetic wave shielding layer 13 and has conductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the electromagnetic wave shielding layer 13 are provided. Can be secured. In the present embodiment, since the coating layer 14 is formed on almost the entire upper surface of the electromagnetic wave shielding layer 13, the electrical connection between the electrode 3 and the outside via the electromagnetic wave shielding layer 13 is ensured. Is formed by removing a part of the coating layer 14 to form an exposed portion where the electromagnetic wave shielding layer 13 is exposed, and electrically connecting the electromagnetic wave shielding layer 13 and the outside at the exposed portion. Realized.

In addition, the length of the protruding portion 17 of the electromagnetic wave shielding layer 13 protruding beyond the end portion of the insulating layer 12 in the sealing film 100 is not particularly limited, and may be 0.1 cm or more and 5.0 cm or less. Preferably, it is 0.5 cm or more and 2.5 cm or less. By setting the length of the projecting portion 17 within such a range, the projecting portion 17 covers the electrode 3 located on the upper side of the substrate 5 and realizes electrical connection between the projecting portion 17 and the electrode 3. can do.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting substrate using the sealing film of the fifth embodiment described above will be described.

The electronic component mounting substrate sealing method of this embodiment is such that the sealing film 100 is placed on the electronic component mounting substrate 45 with the insulating layer 12 facing the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4. An arrangement step of bringing the protrusion 17 into contact with the electrode 3 on the upper surface (one surface) side of the substrate 5, a heating / decompression step of heating and softening the sealing film 100, and reducing the pressure, The sealing film 100 is cooled and pressurized so that the substrate 17, the electronic component 4, and the electrode 3 are sealed with the sealing film 100 in a state where the protruding portion 17 is in contact with the electrode 3. Pressure step.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 10A, the insulating layer 12 of the insulating film 12, the electromagnetic wave shielding layer 13, and the coating layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5, the electronic component 4, and the electrode 3 included in the electronic component mounting substrate 45.

At this time, the electronic component 4 is covered with the insulating layer 12 located at the center of the sealing film 100, and the electrode 3 is covered with the protruding portion 17 protruding beyond the end of the insulating layer 12 (FIG. 10B). )).

(Heating and decompression process)
Next, while maintaining the state shown in FIG. 10B, the sealing film 100 is heated and softened, and the pressure is reduced.

Thus, by heating the sealing film 100, the sealing film 100, that is, the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 are softened. As a result, on the upper surface side of the substrate 5, It will be in the state which can follow the shape of the unevenness | corrugation 6 formed by mounting the electronic component 4 and the electrode 3. FIG.

Thereby, while the sealing film 100 extends, the shape of the unevenness 6, that is, the shape of the electronic component 4 and the electrode 3 on the substrate 5 is slightly followed on the upper side of the substrate 5.

(Cooling / pressurization process)
Next, as shown in FIG. 10C, the sealing film 100 is cooled and pressurized.

As a result, on the upper side of the substrate 5, the substrate 5 is sealed by the softened sealing film 100 in a state in which the shape of the unevenness 6 (the shape of the electronic component 4 and the electrode 3) is followed with excellent adhesion (air density). The electronic component 4 and the electrode 3 are covered.

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, since the film 100 for sealing can be extended with the more excellent shape followable | trackability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization, for the sealing of the softened state With the film 100, the substrate 5, the electronic component 4, and the electrode 3 can be coated on the upper side of the substrate 5 with excellent adhesion.

And this state was maintained by cooling the sealing film 100 in the state which coat | covered the board | substrate 5, the electronic component 4, and the electrode 3 with the outstanding adhesiveness (airtightness) with the sealing film 100. The sealing film 100 is solidified.

Thereby, the substrate 5 and the electronic component 4 are in contact with the insulating layer 12 on the upper side of the substrate 5 by the sealing film 100 while following the shape of the irregularities 6 formed on the electronic component mounting substrate 45. In addition, a sealing film-covered electronic component mounting substrate 50 in which the electrode 3 is coated in a state where the electromagnetic wave shielding layer 13 is in contact with the substrate is obtained. Therefore, in this film-covered electronic component mounting substrate 50 for sealing, it is possible to accurately suppress or prevent the external component such as moisture and dust from contacting the electronic component 4 and the electrode 3. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

Further, the sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12, the electromagnetic wave shielding layer 13, and the covering layer 14, but the electromagnetic wave shielding layer 13 is At the end portion, a protruding portion 17 formed by protruding beyond the end portion of the insulating layer 12 is provided. In the present embodiment, the protruding portion 17 directly covers the electrode 3 without the insulating layer 12 interposed therebetween. Thereby, since the electrode 3 is electrically connected to the projecting portion 17 (electromagnetic wave shield layer 13) having conductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode via the projecting portion 17 is used. 3 and the outside can be secured.

Through the above steps, the sealing film-covered electronic component mounting substrate 50 in which the substrate 5, the electronic component 4, and the electrode 3 are covered with the sealing film 100 can be obtained.

<Sixth Embodiment>
[Sealing film]
Next, 6th Embodiment of the film 100 for sealing of this invention is described.

FIG. 11 is a longitudinal sectional view showing a sixth embodiment of the sealing film of the present invention, and FIGS. 12 (a) to 12 (c) show the sealing of the electronic component mounting substrate using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the stopping method. In the following description, for convenience of description, the upper side in FIGS. 11 and 12 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, although the sixth embodiment will be described, the description will focus on differences from the first to fifth embodiments, and description of similar matters will be omitted.

In the sixth embodiment, the configurations of the electromagnetic wave shielding layer 13 and the covering layer 14 included in the sealing film 100 are different, and further, the configuration of the electronic component mounting substrate 45 covered using the sealing film 100 is different. Is the same as in the second embodiment.

In the sealing film 100 of the sixth embodiment, as shown in FIGS. 11 and 12, the electromagnetic wave shielding layer 13 is formed larger than the insulating layer 12, and its end is the end (edge) of the insulating layer 12. ) Is exposed. In other words, the electromagnetic wave shielding layer 13 includes the protruding portion 17 (second protruding portion) formed by protruding beyond the end portion of the insulating layer 12. Furthermore, the coating layer 14 is formed larger than the electromagnetic wave shielding layer 13, and its end portion is exposed from the end portion (edge portion) of the electromagnetic wave shielding layer 13. In other words, the coating layer 14 includes the protruding portion 15 (first protruding portion) formed by protruding beyond the end portion of the electromagnetic wave shielding layer 13.

Moreover, the electronic component mounting substrate 45 covered with the sealing film 100 of the sixth embodiment is mounted on the substrate 5 and the central portion on the upper surface (one surface) side of the substrate 5 (see FIG. 12). The electronic component 4 that is placed) and the electrode 3 that is electrically connected to the electronic component 4 and is formed at the end portion on the upper surface (one surface) side of the substrate 5 are provided. In such an electronic component mounting substrate 45, the unevenness 6 including the convex portion 61 and the concave portion 62 is formed on the substrate 5 by mounting the electronic component 4 and the electrode 3 on the upper surface of the substrate 5.

In this embodiment, the electromagnetic wave shielding layer 13 is exposed from the insulating layer 12 at the protrusion 17 provided in the electromagnetic wave shielding layer 13 when the sealing film 100 is used for coating. Therefore, the protruding portion 17 can be brought into contact with the electrode 3 formed on the end portion 52 on the upper surface of the substrate 5. Therefore, since the protrusion 17 is composed of the electromagnetic wave shielding layer 13 and has conductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the electromagnetic wave shielding layer 13 are provided. Can be secured. In the present embodiment, since the coating layer 14 is formed on almost the entire upper surface of the electromagnetic wave shielding layer 13, the electrical connection between the electrode 3 and the outside via the electromagnetic wave shielding layer 13 is ensured. Is formed by removing a part of the coating layer 14 to form an exposed portion where the electromagnetic wave shielding layer 13 is exposed, and electrically connecting the electromagnetic wave shielding layer 13 and the outside at the exposed portion. Realized.

Furthermore, in this embodiment, the protrusion 15 provided in the coating layer 14 is configured to be foldable to the lower surface (the other surface) side of the substrate 5. Therefore, the end portion 51 on the lower surface of the substrate 5 can be covered with the protruding portion 15. Therefore, the sealing film 100 according to the present embodiment can cover not only the upper surface side of the substrate 5 but also the end portion 51 on the lower surface of the substrate 5 with the coating layer 14, and the electronic component with better airtightness. The mounting substrate 45 can be covered. Therefore, in the sealing film-covered electronic component mounting substrate 50 obtained by covering with the sealing film 100, the electronic component 4 on the substrate 5 is more accurately suppressed from coming into contact with external factors such as moisture and dust. Or it can be prevented.

Further, as in the first embodiment, the elongation at the softening point is 150% or more and 3500% or less. Thereby, by folding the protruding portion 15 from the upper surface side to the lower surface side of the substrate 5, when covering the end portion 51, it is possible to appropriately suppress or prevent the protruding portion 15 from breaking at the bent portion. Can be prevented.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting substrate using the sealing film of the sixth embodiment described above will be described.

The electronic component mounting substrate sealing method of this embodiment is such that the sealing film 100 is placed on the electronic component mounting substrate 45 with the insulating layer 12 facing the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4. The projecting portion 17 is brought into contact with the electrode 3 on the upper surface (one surface) side of the substrate 5 while the projecting portion 15 is folded on the lower surface (the other surface) side of the substrate 5. The projecting portion 17 is formed by placing the bottom surface 51 in contact with the end portion 51, heating and softening the sealing film 100, reducing the pressure, and cooling and pressurizing the sealing film 100. Is in contact with the electrode 3 and the protruding portion 15 is in contact with the end portion 51 on the lower surface of the substrate 5, and the substrate 5, the electronic component 4, and the electrode 3 are sealed with the sealing film 100. Pressure process

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 12A, the insulating layer 12 of the insulating film 12, the electromagnetic wave shielding layer 13, and the coating layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5, the electronic component 4, and the electrode 3 included in the electronic component mounting substrate 45.

At this time, the electronic component 4 is covered with the insulating layer 12 positioned at the center of the sealing film 100, and the electrode 3 is covered with the protruding portion 17 protruding beyond the end of the insulating layer 12. Further, the protruding portion 15 of the covering layer 14 protruding beyond the end portion of the electromagnetic wave shielding layer 13 is folded to the lower surface side of the substrate 5, thereby bringing the protruding portion 15 into contact with the end portion 51 (FIG. 12B). ).

Thus, by heating the sealing film 100, the sealing film 100, that is, the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 are softened. As a result, on the upper surface side of the substrate 5, It will be in the state which can follow the shape of the unevenness | corrugation 6 formed by mounting the electronic component 4 and the electrode 3. FIG. Furthermore, the end 51 can be covered on the lower surface side of the substrate 5.

As a result, while the sealing film 100 extends, the shape of the unevenness 6 on the upper side of the substrate 5, that is, the shape of the electronic component 4 and the electrode 3 on the substrate 5 is slightly followed. Then, the end 51 is slightly covered.

By this step, the sealing film 100 can be made to follow the shape of the unevenness 6 formed on the upper surface side of the electronic component mounting substrate 45, and the protruding portion 15 is folded on the lower surface side of the substrate 5. Thus, the end 51 can be covered.

(Cooling / pressurization process)
Next, as shown in FIG. 12C, the sealing film 100 is cooled and pressurized.

As a result, on the upper side of the substrate 5, the shape of the unevenness 6 (the shape of the electronic component 4 and the electrode 3) follows with an excellent degree of adhesion (air density), and further, the end 51 is covered with an excellent degree of adhesion. In this state, the substrate 5, the electronic component 4, and the electrode 3 are covered with the sealing film 100 in a softened state.

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, the film 100 for sealing can be extended with the more excellent shape followability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization. Therefore, the sealing film 100 in a softened state covers the substrate 5, the electronic component 4, and the electrode 3 on the upper side of the substrate 5, and further, the end portion 51 on the lower side of the substrate 5 with excellent adhesion. Can do. Further, when the protruding portion 15 is folded from the upper surface side to the lower surface side of the substrate 5 and brought into contact with the end portion 51, it is possible to accurately suppress or prevent the protruding portion 15 from breaking at the bent portion. be able to.

Thereby, the substrate 5 and the electronic component 4 are in contact with the insulating layer 12 on the upper side of the substrate 5 by the sealing film 100 while following the shape of the irregularities 6 formed on the electronic component mounting substrate 45. In addition, the electrode 3 is covered in a state where the electromagnetic wave shielding layer 13 is in contact, and further, the projecting portion 15 of the folded covering layer 14 is covered with the end portion 51 below the substrate 5. The stop film-covered electronic component mounting substrate 50 is obtained. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to more accurately suppress or prevent the external component such as moisture and dust from contacting the electronic component 4 and the electrode 3. Therefore, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

<Seventh embodiment>
[Sealing film]
Next, a seventh embodiment of the sealing film 100 of the present invention will be described.

FIG. 13 is a longitudinal sectional view showing a seventh embodiment of the sealing film of the present invention, and FIGS. 14 (a) to 14 (c) show the sealing of the electronic component mounting substrate using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the stopping method. In the following description, for convenience of description, the upper side in FIGS. 13 and 14 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the seventh embodiment will be described, but the description will focus on differences from the first to sixth embodiments, and description of similar matters will be omitted.

In the seventh embodiment, the configurations of the insulating layer 12 and the electromagnetic wave shielding layer 13 included in the sealing film 100 are different, and further, the configuration of the electronic component mounting substrate 45 covered with the sealing film 100 is different. Is the same as in the second embodiment.

In the sealing film 100 of the seventh embodiment, the insulating layer 12 and the electromagnetic wave shielding layer 13 are formed larger than the covering layer 14 as shown in FIGS. Thereby, the edge part of the electromagnetic wave shielding layer 13 located in the coating layer 14 side among the insulating layer 12 and the electromagnetic wave shielding layer 13 is exposed from the edge part (edge part) of the coating layer 14. In other words, the electromagnetic wave shielding layer 13 includes the protruding portion 18 (fourth protruding portion) formed by protruding beyond the end portion of the covering layer 14.

Moreover, the electronic component mounting substrate 45 covered with the sealing film 100 of the seventh embodiment is mounted on the substrate 5 and a central portion on the upper surface (one surface) side of the substrate 5 (see FIG. 14). The electronic component 4 that is placed) and the electrode 3 that is electrically connected to the electronic component 4 and is formed on the end portion 52 on the upper surface (one surface) side of the substrate 5 are provided. In such an electronic component mounting substrate 45, the unevenness 6 including the convex portion 61 and the concave portion 62 is formed on the substrate 5 by mounting the electronic component 4 and the electrode 3 on the upper surface of the substrate 5.

Furthermore, in the present embodiment, the electromagnetic wave shielding layer 13 is exposed from the covering layer 14 at the protruding portion 18 included in the electromagnetic wave shielding layer 13 when the sealing film 100 is used for coating. 18 is configured such that it can be folded to the upper surface (one surface) side of the substrate 5 so that the protruding portion 18 and the electrode 3 can face each other. Therefore, the protruding portion 18 can be brought into contact with the electrode 3 formed on the end portion 52 on the upper surface of the substrate 5. Therefore, since the protrusion 18 is composed of the electromagnetic wave shielding layer 13 and has conductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the electromagnetic wave shielding layer 13 are provided. Can be secured. In the present embodiment, since the coating layer 14 is formed on almost the entire surface except the protruding portion 18 on the upper surface of the electromagnetic wave shielding layer 13, the electrical connection between the electrode 3 and the outside via the electromagnetic wave shielding layer 13 is achieved. When securing the connection, a part of the coating layer 14 is removed to form an exposed portion where the electromagnetic shielding layer 13 is exposed, and the electromagnetic shielding layer 13 and the outside are electrically connected at the exposed portion. This connection is realized.

Further, as in the first embodiment, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, when the protrusion 18 is folded in order to make the electrode 3 on the upper surface of the substrate 5 and the protrusion 18 face each other, the protrusion 18 is accurately suppressed or prevented from breaking at the bent portion. can do.

Furthermore, as in the first embodiment, the linear expansion coefficient in the temperature range of 25 ° C. to 80 ° C. of the sealing film 100 is preferably 100 ppm / K or less. Thus, by defining the linear expansion coefficient of the sealing film 100, the protrusion 18 is bent so that the electrode 3 on the upper surface of the substrate 5 faces the protrusion 18. The bending portion can be reliably carried out without causing breakage.

Further, the length of the protruding portion 18 of the electromagnetic wave shielding layer 13 protruding beyond the end portion of the coating layer 14 in the sealing film 100 is not particularly limited, and may be 0.1 cm or more and 5.0 cm or less. Preferably, it is 0.5 cm or more and 2.5 cm or less. By setting the length of the projecting portion 18 within such a range, the projecting portion 18 covers the electrode 3 located on the upper side of the substrate 5 and realizes electrical connection between the projecting portion 18 and the electrode 3. can do.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting substrate using the sealing film of the seventh embodiment described above will be described.

In the method for sealing an electronic component mounting substrate of the present invention, the sealing film 100 is placed on the electronic component mounting substrate 45 with the insulating layer 12 facing the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4. While disposing, the projecting portion 18 is folded, and the disposing step for contacting the electrode 3 on the upper surface (one surface) of the substrate 5 is brought into contact, and the sealing film 100 is heated and softened, and the heating is performed to reduce the pressure. -The substrate 5, the electronic component 4, and the electrode 3 are sealed with the sealing film 100 in a state where the projecting portion 18 is in contact with the electrode 3 by cooling and pressurizing the sealing film 100. Cooling / pressurizing step to stop.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 14A, the insulating layer 12 of the insulating film 12, the electromagnetic wave shielding layer 13, and the coating layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5, the electronic component 4, and the electrode 3 included in the electronic component mounting substrate 45.

At this time, the electronic component 4 is covered with the insulating layer 12 of the sealing film 100, and the protruding portion 18 protruding beyond the end portion of the covering layer 14 is folded to cover the electrode 3 with the protruding portion 18 ( FIG. 14 (b)).

Thereby, while the sealing film 100 is extended, the shape of the projections and depressions 6, that is, the shape of the electronic component 4 and the electrode 3 on the substrate 5, while the electrode 3 and the protrusion 18 are in contact with each other on the upper side of the substrate 5. It will be in the state which followed slightly.

(Cooling / pressurization process)
Next, as shown in FIG. 14C, the sealing film 100 is cooled and pressurized.

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, the film 100 for sealing can be extended with the more excellent shape followability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization. Therefore, the substrate 5, the electronic component 4, and the electrode 3 can be coated with excellent adhesion on the upper side of the substrate 5 by the softened sealing film 100. Further, when the projecting portion 18 is folded and opposed to the electrode 3, when the projecting portion 18 is brought into contact with the electrode 3, the projecting portion 18 can be accurately suppressed or prevented from being broken at the bent portion.

Further, the sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12, the electromagnetic wave shielding layer 13, and the covering layer 14, but the electromagnetic wave shielding layer 13 is At the end portion, a protruding portion 18 formed by protruding beyond the end portion of the coating layer 14 is provided. In the present embodiment, the protruding portion 18 directly covers the electrode 3 without the covering layer 14 being interposed. Thereby, since the electrode 3 is electrically connected to the projecting portion 18 (electromagnetic wave shield layer 13) having conductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode via the projecting portion 18 is used. 3 and the outside can be secured.

<Eighth Embodiment>
Next, 8th Embodiment of the film 100 for sealing of this invention is described.

FIG. 15 is a longitudinal sectional view showing an eighth embodiment of the sealing film of the present invention, and FIGS. 16 (a) to 16 (c) show the sealing of the electronic component mounting substrate using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the stopping method. In the following description, for convenience of description, the upper side in FIGS. 15 and 16 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, although the eighth embodiment will be described, the description will focus on differences from the first to seventh embodiments, and description of similar matters will be omitted.

In the eighth embodiment, the configurations of the electromagnetic wave shielding layer 13 and the covering layer 14 included in the sealing film 100 are different, and further, the configuration of the electronic component mounting substrate 45 covered using the sealing film 100 is different. Is the same as in the first embodiment.

In the sealing film 100 of the eighth embodiment, the electromagnetic wave shielding layer 13 and the covering layer 14 are formed larger than the insulating layer 12 as shown in FIGS. Thereby, the edge part of the electromagnetic wave shielding layer 13 located in the insulating layer 12 side among the electromagnetic wave shielding layer 13 and the coating layer 14 is exposed from the edge part (edge part) of the insulating layer 12. In other words, the electromagnetic wave shielding layer 13 and the protruding portion 17 (second protruding portion) formed by protruding beyond the end portions of the insulating layer 12 are provided.

Moreover, the electronic component mounting substrate 45 covered with the sealing film 100 of the eighth embodiment is mounted on the substrate 5 and the central portion on the upper surface (one surface) side of the substrate 5 (see FIG. 16). The electronic component 4 that is placed) and the electrode 3 that is electrically connected to the electronic component 4 and formed on the end 51 on the lower surface (the other surface) side of the substrate 5 are provided. In such an electronic component mounting substrate 45, the mounting of the electronic component 4 on the upper surface of the substrate 5 forms the unevenness 6 including the convex portions 61 and the concave portions 62 on the substrate 5.

Furthermore, in the present embodiment, the projecting portion 17 provided in the electromagnetic wave shielding layer 13 is configured to be able to be folded to the lower surface side of the substrate 5 when the sealing film 100 is used for coating. Therefore, the protruding portion 17 can be brought into contact with the electrode 3 formed on the end portion 51 on the lower surface of the substrate 5. Therefore, since this protrusion part 17 is comprised with the electromagnetic wave shield layer 13 and has electroconductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 via the electromagnetic wave shield layer 13 and the outside The electrical connection can be ensured. In the present embodiment, since the coating layer 14 is formed on almost the entire upper surface of the electromagnetic wave shielding layer 13, the electrical connection between the electrode 3 and the outside via the electromagnetic wave shielding layer 13 is ensured. Is formed by removing a part of the coating layer 14 to form an exposed portion where the electromagnetic wave shielding layer 13 is exposed, and electrically connecting the electromagnetic wave shielding layer 13 and the outside at the exposed portion. Realized.

Further, as in the first embodiment, the elongation at the softening point is 150% or more and 3500% or less. Thereby, when the protrusion 17 is folded from the upper surface side to the lower surface side of the substrate 5, when the electrode 3 provided on the end portion 51 is covered, the bent portion is broken at the bent portion. Can be accurately suppressed or prevented.

Furthermore, as in the first embodiment, the linear expansion coefficient in the temperature range of 25 ° C. to 80 ° C. of the sealing film 100 is preferably 100 ppm / K or less. Thus, by defining the linear expansion coefficient of the sealing film 100, the folding of the protruding portion 17 from the upper surface side to the lower surface side of the substrate 5 is caused to break at the bent portion that bends the protruding portion 17. It can be surely implemented without any problems.

In addition, the length of the protruding portion 17 of the electromagnetic wave shielding layer 13 protruding beyond the end portion of the insulating layer 12 in the sealing film 100 is not particularly limited, and may be 0.5 cm or more and 8.0 cm or less. Preferably, it is 1.0 cm or more and 5.0 cm or less. By setting the length of the projecting portion 17 within such a range, the projecting portion 17 reaches the electrode 3 formed on the end portion 51 on the lower surface of the substrate 5 while folding the projecting portion 17 from the upper surface side to the lower surface side of the substrate 5. Therefore, the electrical connection of the electrode 3 by the protrusion 17 can be reliably realized.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting substrate using the sealing film of this embodiment will be described.

The electronic component mounting substrate sealing method of this embodiment is such that the sealing film 100 is placed on the electronic component mounting substrate 45 with the insulating layer 12 facing the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4. And placing the protrusion 17 on the lower surface (the other surface) side of the substrate 5 to be in contact with the electrode 3, and heating / depressurizing the sealing film 100 while heating and softening the sealing film 100. Cooling / heating which seals the board | substrate 5 and the electronic component 4 with the film 100 for sealing in the state which the protrusion 17 contacted the electrode 3 while cooling the process and the film 100 for sealing. Pressure step.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 16A, in the state where the insulating layer 12 of the insulating film 12, the electromagnetic wave shielding layer 13 and the covering layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component mounting substrate 45.

At this time, the protruding portion 17 protruding beyond the end portion of the insulating layer 12 is folded to the lower surface side of the substrate 5, thereby bringing the protruding portion 17 into contact with the electrode 3 (FIG. 16B).

Thus, by heating the sealing film 100, the sealing film 100, that is, the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 are softened. As a result, on the upper surface side of the substrate 5, The shape of the unevenness 6 formed by mounting the electronic component 4 can be followed, and on the lower surface side of the substrate 5, the shape of the electrode 3 provided at the end 51 on the lower surface of the substrate 5. It will be in the state which can track.

As a result, while the sealing film 100 is extended, the shape of the irregularities 6 on the upper side of the substrate 5, that is, the shape of the electronic component 4 on the substrate 5 is slightly followed. 3 slightly follows the shape of 3.

By this step, the sealing film 100 can follow the shape of the irregularities 6 formed on the upper surface side of the electronic component mounting substrate 45 and the shape of the electrodes 3 formed on the lower surface side. be able to.

(Cooling / pressurization process)
Next, as shown in FIG. 16C, the sealing film 100 is cooled and pressurized.

As a result, the upper surface of the substrate 5 is softened while following the shape of the unevenness 6 (the shape of the electronic component 4), and the lower side of the substrate 5 with the excellent degree of adhesion (air density) of the shape of the electrode 3. The sealing film 100 covers the substrate 5, the electronic component 4, and the electrode 3.

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, since the film 100 for sealing can be extended with the more excellent shape followability with respect to the unevenness | corrugation 6 and the electrode 3 which were formed in the electronic component mounting board | substrate 45 at the time of this pressurization, the state of the softened state The sealing film 100 can cover the substrate 5 and the electronic component 4 on the upper side of the substrate 5 and the electrode 3 on the lower side of the substrate 5 with excellent adhesion. Further, when the protruding portion 17 is folded from the upper surface side to the lower surface side of the substrate 5 to be brought into contact with the electrode 3, it is possible to accurately suppress or prevent the protruding portion 17 from being broken at the bent portion. Can do.

Then, the sealing film 100 is cooled in a state where the sealing film 100 covers the substrate 5 and the electronic component 4, and further the electrode 3 with excellent adhesion (airtightness). The sealing film 100 is solidified while maintaining the above.

Thereby, the substrate 5 and the electronic component 4 are in contact with the insulating layer 12 on the upper side of the substrate 5 by the sealing film 100 while following the shape of the unevenness 6 formed on the electronic component mounting substrate 45. The sealing film-covered electronic component mounting substrate 50 covered with the substrate 5 with the electromagnetic wave shielding layer 13 in contact with the lower side of the substrate 5 is obtained. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to more accurately suppress or prevent the external component such as moisture and dust from contacting the electronic component 4 and the electrode 3. Therefore, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

Further, the sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12, the electromagnetic wave shielding layer 13, and the covering layer 14, but the electromagnetic wave shielding layer 13 is The insulating layer 12 is formed so as to be larger than the insulating layer 12, and the insulating layer 12 is laminated at the center portion thereof, but at the end portion, the protruding portion 17 formed by protruding beyond the end portion of the insulating layer 12 is provided. Then, the protruding portion 17 is folded under the substrate 5 to directly cover the electrode 3. Thereby, since the electrode 3 is electrically connected to the protrusion 17 (electromagnetic wave shield layer 13), in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the protrusion 17 It is possible to ensure electrical connection.

<Ninth Embodiment>
[Sealing film]
Next, 9th Embodiment of the film 100 for sealing of this invention is described.

FIG. 17 is a longitudinal sectional view showing a ninth embodiment of the sealing film of the present invention, and FIGS. 18 (a) to 18 (c) show the sealing of the electronic component mounting substrate using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the stopping method. In the following description, for convenience of description, the upper side in FIGS. 17 and 18 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the ninth embodiment will be described, but the description will focus on differences from the first to eighth embodiments, and description of similar matters will be omitted.

In the ninth embodiment, as shown in FIGS. 17 and 18, the insulating layer 12 included in the sealing film 100 is the same as the first embodiment except that the insulating layer 12 is formed larger than the electromagnetic wave shielding layer 13. is there.
As shown in FIGS. 17 and 18, the sealing film 100 is configured by a laminate including an insulating layer 12 and an electromagnetic wave shielding layer 13 laminated on one surface side (upper surface side) of the insulating layer 12. Has been. The insulating layer 12 is formed to be larger than the electromagnetic wave shielding layer 13, and its end portion is exposed from the end portion (edge portion) of the electromagnetic wave shielding layer 13. In other words, the insulating layer includes the protruding portion 16 formed by protruding beyond the end portion of the electromagnetic wave shielding layer 13.

Thus, with respect to the electronic component mounting substrate 45 on which the electronic component 4 is mounted on the upper surface side, the insulating layer 12 is on the lower side, the electromagnetic wave shielding layer 13 is on the upper side, and the covering is performed using the sealing film 100. The electronic component 4 is sealed with an electromagnetic wave shielding layer 13 through an insulating layer 12. Therefore, in the obtained film-covered electronic component mounting substrate 50 for sealing, the influence of noise due to electromagnetic waves on the electronic component 4 is accurately suppressed or prevented.

Further, the electronic component 4 is sealed by the electromagnetic wave shielding layer 13 through the insulating layer 12 including the protruding portion 16 protruding beyond the end portion of the electromagnetic wave shielding layer 13, and the electronic component 4 is interposed between the electronic component 4 and the electromagnetic wave shielding layer 13. Therefore, the electromagnetic wave shielding layer 13 is ensured to be insulated from the electronic component 4.

Furthermore, this sealing film 100 has an elongation at the softening point required in accordance with JIS K 6251 of 150% or more and 3500% or less.

Since the softening point of the sealing film 100 is within such a range, when the electronic component mounting substrate 45 is covered with the sealing film 100, the convex portion 61 and the concave portion 62 included in the electronic component mounting substrate 45 are provided. It can coat | cover in the state sealed with the outstanding followable | trackability with respect to the unevenness | corrugation 6 which becomes. Therefore, in the sealing film-covered electronic component mounting substrate 50 obtained by covering the sealing film 100, the electronic component 4 on the substrate 5 is accurately prevented from coming into contact with external factors such as moisture and dust. Or it can be prevented. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

Here, the elongation at the softening point of the sealing film 100 is obtained by making the sealing film 100 of the present embodiment a multilayer body including the electromagnetic wave shielding layer 13 and the insulating layer 12 having the above-described configuration. It can be set to 150% or more and 3500% or less relatively easily. The elongation may be 150% or more and 3500% or less, but is preferably 1000% or more and 3500% or less, and more preferably 1000% or more and 2000% or less. As a result, when the sealing film 100 is used to coat the unevenness 6 included in the electronic component mounting substrate 45, it can be covered in a state of being sealed with excellent followability to the shape of the unevenness 6. It is possible to accurately suppress or prevent the sealing film 100 from being broken in the middle.

Furthermore, the linear expansion coefficient in the temperature range of 25 ° C. or more and 80 ° C. or less of the sealing film 100 is preferably 100 ppm / K or less, and more preferably 5 ppm / K or more and 50 ppm / K or less. When the linear expansion coefficient in the temperature range of 25 ° C. or higher and 80 ° C. or lower of the sealing film 100 is a value in such a range, the sealing film 100 is excellent when the sealing film 100 is heated. Since it has a stretching property, the shape followability with respect to the unevenness 6 of the sealing film 100 can be improved more reliably. Furthermore, since excellent adhesiveness can be maintained between the sealing film 100, the substrate 5, and the electronic component 4, sealing caused by heat generated by repeatedly driving the electronic component mounting substrate 45 The peeling of the film for use 100 from the electronic component mounting board 45 can be suppressed or prevented more accurately.

Moreover, the length of the protrusion part 16 of the insulating layer 12 which protrudes beyond the edge part of the electromagnetic wave shield layer 13 in the film 100 for sealing is not specifically limited, It is 0.5 cm or more and 2.5 cm or less. Preferably, it is 0.2 cm or more and 1.5 cm or less. By setting the length of the protruding portion 16 within such a range, the electronic component 4 and the electromagnetic wave shielding layer 13 can be prevented from inadvertently contacting each other and causing a short circuit between them. it can.

[Method of sealing electronic component mounting board]
Next, the electronic component mounting substrate sealing method (the electronic component mounting substrate sealing method of the present invention) using the above-described sealing film of the present invention will be described.

The electronic component mounting substrate sealing method of the present embodiment includes an arrangement step of disposing the sealing film 100 on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4, and the sealing film 100. In the state where the electronic component 4 is covered with the electromagnetic wave shielding layer 13 through the insulating layer 12 by heating and softening and heating / depressurizing step for reducing the pressure, cooling the sealing film 100, and applying pressure. 5 and a cooling / pressurizing step for sealing the electronic component 4 with the sealing film 100.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 18A, the electronic component mounting substrate in a state where the insulating layer 12 of the electromagnetic wave shielding layer 13 and the insulating layer 12 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component 45.

(Heating and decompression process)
Next, as shown in FIG. 18B, the sealing film 100 is heated and softened, and the pressure is reduced.

Thus, by heating the sealing film 100, the sealing film 100, that is, the electromagnetic wave shielding layer 13 and the insulating layer 12 are softened. As a result, the electronic film 4 is mounted on the substrate 5. It will be in the state which can be followed to the shape of the unevenness 6 which became.

Thereby, while the sealing film 100 extends, the shape of the unevenness 6, that is, the shape of the electronic component 4 on the substrate 5 is slightly followed.

(Cooling / pressurization process)
Next, as shown in FIG. 18C, the sealing film 100 is cooled and pressurized.

Thus, by pressurizing from the decompressed atmosphere, in the heating and decompression step, the space between the electronic component mounting substrate 45 and the sealing film 100 is degassed, and the decompressed state is maintained. As a result, the sealing film 100 is further extended. As a result, the sealing film 100 in a softened state follows the adhesion (air density) excellent in the shape of the unevenness 6 (the shape of the electronic component 4). Thus, the substrate 5 and the electronic component 4 are covered. In the heating and depressurizing step, the pressing step can be omitted if the sealing film 100 sufficiently follows the shape of the irregularities 6.

Accordingly, the sealing film-covered electronic component mounting substrate 50 in which the substrate 5 and the electronic component 4 are covered with the sealing film 100 in a state of following the shape of the unevenness 6 formed on the electronic component mounting substrate 45. Will be obtained. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to accurately suppress or prevent the electronic component 4 from coming into contact with external factors such as moisture and dust. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

The sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12 and the electromagnetic wave shielding layer 13, and the insulating layer 12 is composed of the electromagnetic wave shielding layer 13. The electromagnetic wave shielding layer 13 is laminated at the central portion thereof, and the projecting portion 16 formed by projecting beyond the end portion of the electromagnetic wave shielding layer 13 is provided at the end portion.

Therefore, in this step, the electromagnetic wave shielding layer 13 covers the electronic component 4 through the central portion of the insulating layer 12 and covers the protruding portion 16 that is the end portion of the insulating layer 12 in a state that does not exist. Therefore, in the obtained film-covered electronic component mounting substrate 50 for sealing, in which insulation against the electronic component 4 is reliably ensured, the influence of noise due to electromagnetic waves on the electronic component 4 is accurately suppressed or prevented. It can be.

<Tenth Embodiment>
[Sealing film]
Next, 10th Embodiment of the film 100 for sealing of this invention is described.

FIG. 19 is a longitudinal sectional view showing a tenth embodiment of a sealing film of the present invention, and FIGS. 20A to 20C are diagrams for sealing an electronic component mounting substrate using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the stopping method. In the following description, for convenience of description, the upper side in FIGS. 19 and 20 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the tenth embodiment will be described, but the description will focus on differences from the first to ninth embodiments, and description of similar matters will be omitted.

In the tenth embodiment, the configuration of the insulating layer 12 included in the sealing film 100 is different, and the rest is the same as in the ninth embodiment.

In the sealing film 100 of the tenth embodiment, the insulating layer 12 formed larger than the electromagnetic wave shielding layer 13 is compared with the insulating layer 12 of the ninth embodiment, as shown in FIGS. 19 and 20. And larger (longer along the surface direction). Thereby, the protrusion 16 (first protrusion) formed by protruding beyond the end portion of the electromagnetic wave shielding layer 13 is formed on the lower surface of the substrate 5 (when the sealing film 100 is coated). It becomes possible to fold to the other surface side. Therefore, the end portion 51 on the lower surface of the substrate 5 can be covered with the protruding portion 16. Therefore, the sealing film 100 according to the present embodiment can cover not only the upper surface side of the substrate 5 but also the end portion 51 on the lower surface of the substrate 5 with the insulating layer 12, so that the electronic component has better airtightness. The mounting substrate 45 can be covered. Therefore, in the sealing film-covered electronic component mounting substrate 50 obtained by covering with the sealing film 100, the electronic component 4 on the substrate 5 is more accurately suppressed from coming into contact with external factors such as moisture and dust. Or it can be prevented.

Further, when the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less, the end portion 51 is formed by folding the protruding portion 16 from the upper surface side to the lower surface side of the substrate 5. When covering, it is possible to accurately suppress or prevent the protrusion 16 from being broken at the bent portion.

Furthermore, as in the first embodiment, the linear expansion coefficient in the temperature range of 25 ° C. to 80 ° C. of the sealing film 100 is preferably 100 ppm / K or less. Thus, by defining the linear expansion coefficient of the sealing film 100, the folding of the protruding portion 16 from the upper surface side to the lower surface side of the substrate 5 is caused to break at the bent portion that bends the protruding portion 16. It can be surely implemented without any problems.

Moreover, the length of the protrusion part 16 of the insulating layer 12 which protrudes beyond the edge part of the electromagnetic wave shield layer 13 in the film 100 for sealing is not specifically limited, It may be 0.1 cm or more and 5.0 cm or less. Preferably, it is 0.5 cm or more and 2.5 cm or less. By setting the length of the protrusion 16 within such a range, the protrusion 16 can reach the end 51 on the lower surface of the substrate 5 while being folded from the upper surface side to the lower surface side of the substrate 5. It is possible to reliably realize the covering of the end portion 51 by the protruding portion 16.

{Method for sealing electronic component mounting substrate}
Next, a method for sealing an electronic component mounting board using the sealing film of the tenth embodiment described above will be described.

The electronic component mounting substrate sealing method of this embodiment is such that the sealing film 100 is placed on the electronic component mounting substrate 45 with the insulating layer 12 facing the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4. And placing the projecting portion 16 on the lower surface (the other surface) side of the substrate 5 to be brought into contact with the end portion 51 on the lower surface of the substrate 5, and heating and softening the sealing film 100. The heating / depressurization step for reducing the pressure, and cooling and pressurizing the sealing film 100 cover the electronic component 4 with the electromagnetic wave shielding layer 13 through the insulating layer 12, and the protrusion 16 is formed on the substrate 5. A cooling / pressurizing step of sealing the substrate 5 and the electronic component 4 with the sealing film 100 while being in contact with the end portion 51 on the lower surface of the substrate.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 20A, the electronic component mounting board in the state where the insulating layer 12 of the insulating film 12 and the electromagnetic wave shielding layer 13 included in the sealing film 100 is opposed to the electronic component mounting board 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component 45.

At this time, the protruding portion 16 of the insulating layer 12 protruding beyond the end portion of the electromagnetic wave shielding layer 13 is folded to the lower surface side of the substrate 5, thereby bringing the protruding portion 16 into contact with the end portion 51 (FIG. 20). (B)).

Thus, by heating the sealing film 100, the sealing film 100, that is, the insulating layer 12 and the electromagnetic wave shielding layer 13 are softened. As a result, the electronic component 4 is attached to the substrate 5 on the upper surface side of the substrate 5. It will be in the state which can follow the shape of the unevenness | corrugation 6 formed by mounting, and also will be in the state which can coat | cover the edge part 51 in the lower surface side of the board | substrate 5. FIG.

By this step, the sealing film 100 can be made to follow the shape of the unevenness 6 formed on the upper surface side of the electronic component mounting substrate 45, and the protruding portion 16 is folded on the lower surface side of the substrate 5, The end portion 51 can be covered.

(Cooling / pressurization process)
Next, as shown in FIG. 20C, the sealing film 100 is cooled and pressurized.

At this time, in this embodiment, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, since the film 100 for sealing can be extended with the more excellent shape followable | trackability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization, for the sealing of the softened state The film 100 can cover the substrate 5 and the electronic component 4 on the upper side of the substrate 5 and the end portion 51 with excellent adhesion. Further, when the protruding portion 16 is folded from the upper surface side to the lower surface side of the substrate 5 to be brought into contact with the end portion 51, the protruding portion 16 is accurately suppressed or prevented from breaking at the bent portion. Can do.

Thereby, the substrate 5 and the electronic component 4 are in contact with the insulating layer 12 on the upper side of the substrate 5 by the sealing film 100 while following the shape of the irregularities 6 formed on the electronic component mounting substrate 45. The sealing film-covered electronic component mounting substrate 50 is obtained in a state where the projecting portion 16 of the folded insulating layer 12 covers the end portion 51 below the substrate 5. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to more accurately suppress or prevent the electronic component 4 from coming into contact with external factors such as moisture and dust. Therefore, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

<Eleventh embodiment>
[Sealing film]
Next, an eleventh embodiment of the sealing film 100 of the present invention will be described.

FIG. 21 is a longitudinal sectional view showing an eleventh embodiment of a sealing film of the present invention, and FIGS. 22 (a) to 22 (c) show sealing of an electronic component mounting substrate using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the stopping method. In the following description, for convenience of description, the upper side in FIGS. 21 and 22 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the eleventh embodiment will be described, but the description will focus on differences from the first to tenth embodiments, and description of similar matters will be omitted.

In the eleventh embodiment, the sealing film 100 includes a coating layer 14 laminated on the opposite side (upper surface side) of the electromagnetic wave shielding layer 13 to the insulating layer 12, and other than that, the tenth embodiment. It is the same.

In the sealing film 100 of the eleventh embodiment, the covering layer 14 is formed larger than the electromagnetic wave shielding layer 13 like the insulating layer 12 as shown in FIG. 21 and FIG. It is exposed from the end (edge) of the layer 13. In other words, the coating layer 14 includes the protruding portion 15 (second protruding portion) formed by protruding beyond the end portion of the electromagnetic wave shielding layer 13. And these protrusion part 15 and protrusion part 16 form the lamination | stacking protrusion part 65 provided by laminating | stacking in the position beyond the edge part of the electromagnetic wave shield layer 13. FIG.

Using such a sealing film 100, with respect to the electronic component mounting substrate 45 on which the electronic component 4 is mounted on the upper surface (one surface) side, the insulating layer 12 is on the lower side and the covering layer 14 is on the upper side. Then, the electronic component 4 is sealed with the electromagnetic wave shielding layer 13 through the insulating layer 12. At the time of sealing, in this embodiment, the electromagnetic wave shielding layer 13 is covered with the laminated protrusion 65 in which the protruding part 15 and the protruding part 16 protruding beyond the end of the electromagnetic wave shielding layer 13 are laminated. Therefore, since it is possible to more accurately prevent a short circuit from occurring between the electronic component 4 and the electromagnetic wave shielding layer 13, the electromagnetic wave shielding layer 13 is more reliably secured to the electronic component 4. Become. In addition, since the coating layer 14 that covers the upper surface of the electromagnetic wave shielding layer 13 is provided, insulation against other electronic components located outside the electronic component mounting substrate 45 can be ensured.

Furthermore, in the present embodiment, the laminated projection 65 formed by laminating the projection 15 and the projection 16 at the time of coating using the sealing film 100 is the bottom surface of the substrate 5 (the other side). It is configured so that it can be folded to the surface) side. Therefore, the end portion 51 on the lower surface of the substrate 5 can be covered with the protruding portion 16 included in the stacked protruding portion 65. Therefore, the sealing film 100 of the present embodiment can cover not only the upper surface side of the substrate 5 but also the end portion 51 on the lower surface of the substrate 5 with the laminated projecting portion 65, and has an excellent airtightness. The component mounting board 45 can be covered. Therefore, in the sealing film-covered electronic component mounting substrate 50 obtained by covering with the sealing film 100, the electronic component 4 on the substrate 5 is more accurately suppressed from coming into contact with external factors such as moisture and dust. Or it can be prevented.

In addition, this coating layer 14 is comprised considering a resin material as a main material, and can use the material similar to the coating layer 12 of 2nd Embodiment mentioned above.

Furthermore, in this embodiment, the elongation at the softening point is 150% or more and 3500% or less. Thereby, by folding the laminated protrusion 65 from the upper surface side to the lower surface side of the substrate 5, when the end portion 51 is covered, the laminated protrusion 65 is prevented from being broken at the bent portion. Or it can be prevented.

Furthermore, the length of the lamination | stacking protrusion part 65 in the film 100 for sealing is not specifically limited, It is preferable that they are 0.1 cm or more and 5.0 cm or less, and it is more preferable that they are 0.5 cm or more and 2.5 cm or less. preferable. By setting the length of the laminated protrusion 65 within such a range, the laminated protrusion 65 can reach the end 51 on the lower surface of the substrate 5 while being folded from the upper surface side to the lower surface side of the substrate 5. Therefore, it is possible to reliably realize the covering of the end portion 51 by the protruding portion 16.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting board using the sealing film of the eleventh embodiment described above will be described.

The electronic component mounting substrate sealing method of this embodiment is such that the sealing film 100 is placed on the electronic component mounting substrate 45 with the insulating layer 12 facing the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4. The stacking protrusion 65 is placed on the lower surface (the other surface) side of the substrate 5 to be brought into contact with the end portion 51 on the lower surface of the substrate 5 and the sealing film 100 is heated and softened. At the same time, the heating / depressurization step for reducing the pressure, cooling the sealing film 100, and applying pressure to cover the electronic component 4 with the electromagnetic wave shielding layer 13 through the insulating layer 12, and the laminated protrusion 65 is A cooling / pressurizing step of sealing the substrate 5 and the electronic component 4 with the sealing film 100 while being in contact with the end portion 51 on the lower surface of the substrate 5;

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 22A, the electronic component mounting board in a state where the insulating layer 12 of the insulating film 12 and the electromagnetic wave shielding layer 13 included in the sealing film 100 is opposed to the electronic component mounting board 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component 45.

At this time, the laminated protrusion 65 that protrudes beyond the end of the electromagnetic wave shielding layer 13 is folded to the lower surface side of the substrate 5, thereby bringing the laminated protrusion 65 into contact with the end 51 (FIG. 22B). )).

(Cooling / pressurization process)
Next, as shown in FIG. 22C, the sealing film 100 is cooled and pressurized.

At this time, in this embodiment, since the coating layer 14 that covers the upper surface of the electromagnetic wave shielding layer 13 is provided, insulation against other electronic components located outside the electronic component mounting substrate 45 can be ensured. Further, since the electromagnetic wave shielding layer 13 is covered with the laminated protrusion 65 in which the protruding

parts

15 and 16 protruding beyond the end of the electromagnetic wave shielding layer 13 are laminated, the electronic component 4 and the electromagnetic wave shielding layer 13 are covered. Therefore, the electromagnetic wave shielding layer 13 is more reliably ensured of insulation against the electronic component 4.

In the present invention, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, since the film 100 for sealing can be extended with the more excellent shape followable | trackability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization, for the sealing of the softened state The film 100 can cover the substrate 5 and the electronic component 4 on the upper side of the substrate 5 and the end portion 51 with excellent adhesion. Further, when the laminated protrusion 65 is folded from the upper surface side to the lower surface side of the substrate 5 and brought into contact with the end portion 51, the laminated protrusion 65 is accurately suppressed or prevented from breaking at the bent portion. can do.

Thereby, the substrate 5 and the electronic component 4 are in contact with the insulating layer 12 on the upper side of the substrate 5 by the sealing film 100 while following the shape of the irregularities 6 formed on the electronic component mounting substrate 45. The film-covered electronic component mounting substrate 50 for sealing is obtained in a state where the folded laminated protrusion 65 covers the end 51 on the lower side of the substrate 5. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to more accurately suppress or prevent the electronic component 4 from coming into contact with external factors such as moisture and dust. Therefore, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

<First Reference Form>
[Sealing film]
Next, the 1st reference form of the film 100 for sealing is demonstrated.

FIG. 23 is a view showing a first reference form of a sealing film ((a) longitudinal sectional view, (b) plan view), and FIGS. 24 (a) to 24 (c) are the sealing films shown in FIG. It is a longitudinal cross-sectional view for demonstrating the sealing method of an electronic component mounting board | substrate using FIG. In the following description, for convenience of description, the upper side in FIGS. 23 and 24 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the first reference embodiment will be described, but the description will focus on differences from the first to eleventh embodiments of the present invention, and description of similar matters will be omitted.

As shown in FIGS. 23 and 24, the sealing film 100 of this embodiment includes an innermost layer 12, an intermediate layer 19 laminated on one surface side (upper surface side) of the innermost layer 12, and an intermediate layer It is comprised with the laminated body provided with the outermost layer 14 laminated | stacked on the one surface side of 19. FIG. That is, the innermost layer 12, the intermediate layer 19, and the outermost layer 14 are laminated in this order from the electronic component mounting substrate 45 side to be coated.

Here, in this embodiment, the electronic component mounting substrate 45 covered with the sealing film 100 is mounted on the substrate 5 and the central portion on the upper surface (one surface) side of the substrate 5 as shown in FIG. The electronic component 4 is placed (placed), and a connection member 7 that is electrically connected to the electronic component 4 and is mounted on an end portion on the upper surface (one surface) side of the substrate 5 and having an open end surface. Yes. In such an electronic component mounting substrate 45, the mounting of the electronic component 4 on the upper surface of the substrate 5 forms the unevenness 6 including the convex portions 61 and the concave portions 62 on the substrate 5. Examples of the substrate 5 include a printed wiring board, and examples of the electronic component 4 mounted on the substrate 5 include a semiconductor element, a capacitor, a coil, and a resistor. Examples of the connection member 7 include a connector provided with a connection terminal used as an open end surface for data exchange between the electronic component 4 and another electronic component, electricity supply from the power source to the electronic component 4, and the like. .

Thus, with respect to the electronic component mounting substrate 45 on which the electronic component 4 and the connection member 7 are mounted on the upper surface side, the innermost layer 12 is on the lower side, the outermost layer 14 is on the upper side, and the sealing film 100 is used. By covering the electronic component 4, the sealing film 100, that is, a laminate in which the innermost layer 12, the intermediate layer 19, and the outermost layer 14 are laminated in this order with the innermost layer 12 as the electronic component 4 side. Is sealed. Thus, in the sealing film-covered electronic component mounting substrate 50 obtained by covering the sealing film 100, the electronic component 4 on the substrate 5 is accurately contacted with external factors such as moisture and dust. It can be suppressed or prevented. On the other hand, since the sealing film 100 of the present embodiment has the escape portion 27 at a position corresponding to the connecting member 7 when the electronic component mounting substrate 45 is sealed, the connecting member 7 is used for sealing. The film 100 can be exposed without being sealed. Accordingly, in the sealing film-covered electronic component mounting substrate 50, the electronic component mounting substrate 45 is sealed with the sealing film 100 while realizing the electrical connection between the electronic component mounting substrate 45 and another electronic component or a power source. It can be carried out.

As shown in FIG. 24, in the electronic component mounting substrate 45, the connection member 7 is formed at the end portion on the upper surface of the substrate 5, and correspondingly, the escape portion 27 is for sealing in a plan view. The end portion of the film 100 is constituted by a notch or a notch portion that is cut or missing in a U-shape. For example, in the electronic component mounting substrate 45, when the connection member 7 is formed at the center portion on the upper surface of the substrate 5, the clearance portion 27 corresponds to the center of the sealing film 100 in plan view. The part is composed of an opening (hole) having a square shape.

Further, in such a sealing film 100, the innermost layer 12, the intermediate layer 19 and the outermost layer 14 all contain a resin material, and the elongation at the softening point required in accordance with JIS K 6251 is 150. % Is preferably 3% or more and 3500% or less, more preferably 1000% or more and 3500% or less, and even more preferably 1000% or more and 2000% or less.

When the elongation at the softening point of the sealing film 100 is within such a range, when the electronic component mounting substrate 45 is covered with the sealing film 100, the convex portion 61 and the concave portion included in the electronic component mounting substrate 45 are provided. The electronic component 4 can be covered in a state in which the unevenness 6 composed of 62 is sealed with excellent followability. Therefore, in the sealing film-covered electronic component mounting substrate 50 obtained by covering the sealing film 100, the electronic component 4 on the substrate 5 is more accurately brought into contact with external factors such as moisture and dust. It can be suppressed or prevented. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

Thus, since it is preferable that the elongation at the softening point is 150% or more and 3500% or less from the viewpoint of followability to the unevenness 6 and the like, in the following, the sealing film 100 that can satisfy the elongation is provided. The layer configuration of the innermost layer 12, the intermediate layer 19, and the outermost layer 14 provided will be described.

The innermost layer 12, the intermediate layer 19 and the outermost layer 14 included in the sealing film 100 having an elongation at the softening point of 150% or more and 3500% or less each contain a resin material. By selecting as appropriate, the elongation at the softening point can be set within the range. As such a resin material, the same resin materials as those of the insulating layer 12, the electromagnetic wave shielding layer 13, and the covering layer 14 described above can be used.

Further, the resin materials contained in the innermost layer 12, the intermediate layer 19 and the outermost layer 14 may be a thermosetting resin such as an epoxy resin, a phenol resin, a melamine resin, or a silicone resin, or an acrylic resin in addition to the thermoplastic resin material described above. A UV curable resin such as a resin or a urethane resin may be included.

Further, in order to make the elongation at the softening point of the sealing film 100 within the above range, each of the innermost layer 12, the intermediate layer 19 and the outermost layer 14 containing the resin material as described above is formed of the resin material. It is comprised by the layer which contains (thermoplastic resin material) as a main material, and functions as an insulating layer which has insulation by this.

The sealing film 100 including the innermost layer 12, the intermediate layer 19, and the outermost layer 14 each containing a resin material, having the above-described configuration, includes a polyolefin-based resin as the resin material among the resin materials described above. Preferably, the layer to be provided is provided as at least one of the innermost layer 12, the intermediate layer 19, and the outermost layer 14. Thereby, the elongation at the softening point of the sealing film 100 can be set to 150% or more and 3500% or less more reliably.

Therefore, in the following, the innermost layer 12 containing the resin material as a main material, the intermediate layer 19, and the outermost layer 14 are provided, and the resin materials contained in the innermost layer 12 and the outermost layer 14 are both polyolefin-based resins. The sealing film 100 will be described as an example.

For the purpose of the innermost layer 12, the elongation at the softening point of the sealing film 100 is set to 150% or more and 3500% or less, and the adhesiveness to the irregularities 6 and the shape followability are excellent. In the embodiment, the layer contains an ethylene-vinyl acetate copolymer as a polyolefin resin (ethylene copolymer) as a main material. The innermost layer 12 has the same configuration as that of the insulating layer 12 of each embodiment described above.

The innermost layer 12 is a layer having an insulating property by containing an ethylene-vinyl acetate copolymer as a resin material as a main material. When the electronic component mounting substrate 45 is covered with the sealing film 100, Moreover, it functions as a layer for preventing a short circuit from occurring between the electronic components 4.

In this ethylene-vinyl acetate copolymer, the VA content to be copolymerized is preferably 5% by weight to 30% by weight, and more preferably 10% by weight to 20% by weight. If it is less than the lower limit, it may be difficult to set the elongation at the softening point of the sealing film 100 within the above range. On the other hand, when the upper limit is exceeded, the antioxidant remaining in the innermost layer 12 due to the tendency that the crystal part of the resin constituting the innermost layer 12 decreases and the amorphous part increases. Such additives may be eluted. For this reason, the electronic component mounting board 45 side is shifted, and as a result, there is a possibility that the characteristics of the electronic component 4 may be inconvenient.

Further, the average thickness of the innermost layer 12 is preferably 5 μm or more and 200 μm or less, and more preferably 20 μm or more and 120 μm or less. By setting the average thickness of the innermost layer 12 within such a range, the elongation at the softening point of the sealing film 100 can be reliably set within a range of 150% to 3500%. In addition, the insulation of the intermediate layer 19 with respect to the electronic component 4 can be more reliably ensured.

The resin material contained in the innermost layer 12 may be an ionomer resin contained in an intermediate layer 19 described later, in addition to an ethylene-vinyl acetate copolymer as a polyolefin resin (ethylene copolymer). Polyolefin resins other than ethylene-vinyl acetate copolymer may be used.

The intermediate layer 19 is set to have an elongation at the softening point of the sealing film 100 of 150% or more and 3500% or less so as to have excellent adhesion to the unevenness 6 and shape followability. In the present embodiment, an ionomer resin is contained as a resin material for the purpose of making the stop film 100 excellent in toughness.

Such an intermediate layer 19 covers the electronic component 4 arranged on the upper side of the substrate 5 through the innermost layer 12 when the electronic component mounting substrate 45 is covered with the sealing film 100.

Examples of the metal ion include potassium ion (K ⁺ ), sodium ion (Na ⁺ ), lithium ion (Li ⁺ ), magnesium ion (Mg ⁺⁺ ), and zinc ion (Zn ⁺⁺ ). Among these, sodium ions (Na ⁺ ) or zinc ions (Zn ⁺⁺ ) are preferable. Thereby, since the crosslinked structure in the ionomer resin is stabilized, the function as the intermediate layer 19 described above can be exhibited more remarkably.

Further, the average thickness of the intermediate layer 19 is preferably 1 μm or more and 400 μm or less, and more preferably 5 μm or more and 200 μm or less. By setting the average thickness of the intermediate layer 19 within such a range, the sealing film 100 is excellent in toughness, and the elongation at the softening point of the sealing film 100 is in the range of 150% to 3500%. It can be assumed that it is securely set within.

The resin material contained in the intermediate layer 19 may be an ionomer resin, an ethylene-vinyl acetate copolymer contained in the innermost layer 12 and the outermost layer 14, or other polyolefin resin.

For the purpose of the outermost layer 14, the elongation at the softening point of the sealing film 100 is set to 150% or more and 3500% or less, and the adhesion to the unevenness 6 and the shape followability are excellent. In the embodiment, the layer contains an ethylene-vinyl acetate copolymer as a polyolefin resin (ethylene copolymer) as a main material. The outermost layer 14 has the same configuration as the coating layer 14 of each embodiment described above.

The outermost layer 14 is an insulating layer that contains an ethylene-vinyl acetate copolymer as a resin material as a main material. When the electronic component mounting substrate 45 is covered with the sealing film 100, It functions as a layer for ensuring insulation against other electronic components located outside the electronic component mounting board 45.

In this ethylene-vinyl acetate copolymer, the VA content to be copolymerized is set within the same range as the VA content to be copolymerized shown in the innermost layer 12 described above.

Further, the average thickness of the outermost layer 14 is preferably 5 μm or more and 200 μm or less, and more preferably 20 μm or more and 120 μm or less. By setting the average thickness of the outermost layer 14 within such a range, the elongation at the softening point of the sealing film 100 can be reliably set within a range of 150% to 3500%. Moreover, the insulation of the intermediate | middle layer 19 with respect to the electronic component located in the outer side of the film coating electronic component mounting board | substrate 50 for sealing can be ensured more reliably.

As the resin material contained in the outermost layer 14, as with the innermost layer 12, in addition to the ethylene-vinyl acetate copolymer as a polyolefin resin (ethylene copolymer), the ionomer contained in the intermediate layer 19 described above. It may be a resin or a polyolefin resin other than an ethylene-vinyl acetate copolymer.

Further, in the sealing film 100, it is necessary to provide adhesion between the innermost layer 12 and the intermediate layer 19 and between the intermediate layer 19 and the outermost layer 14 or to improve the adhesion. Depending on the case, an adhesive layer may be provided. Moreover, in order to improve the adhesiveness between the innermost layer 12 and the electronic component mounting substrate 45, an adhesive layer can be provided inside the innermost layer 12, that is, between the innermost layer 12 and the substrate 5, as necessary. .

Examples of the adhesive resin contained in the adhesive layer include EVA, ethylene-maleic anhydride copolymer, EAA, EEA, ethylene-methacrylate-glycidyl acrylate terpolymer, or various polyolefins such as acrylic acid, methacrylic acid, Monobasic unsaturated fatty acids such as acids, dibasic unsaturated fatty acids such as maleic acid, fumaric acid, itaconic acid or the like grafted with these anhydrides, such as maleic acid grafted EVA, maleic acid grafted ethylene Known adhesive resins and adhesive resins such as -α-olefin copolymers, styrene elastomers, acrylic resins, epoxy resins, polyurethane resins and the like can be used as appropriate.

Furthermore, the manufacturing method for manufacturing the sealing film 100 including the relief portion 27 in which the innermost layer 12, the intermediate layer 19, and the outermost layer 14 are laminated is not particularly limited. After forming and laminating using a laminating method, an extrusion laminating method, a coating laminating method, etc., it is possible to obtain the relief portion 27 by cutting out a position corresponding to the connecting member 7.

Here, by comparing the sealing film 100 with a multilayer body including the innermost layer 12, the intermediate layer 19, and the outermost layer 14 having the above-described configuration, the elongation at the softening point of the sealing film 100 is compared. It can be easily set to 150% or more and 3500% or less.

As long as the elongation at the softening point can be set to 150% or more and 3500% or less, the sealing film 100 may have a two-layer configuration in which the outermost layer 14 is omitted. The outermost layer 14 and the intermediate layer 19 may be omitted to have a single layer configuration. That is, the sealing film 100 only needs to have one or more layers mainly composed of a thermoplastic resin such as a polyolefin-based resin.

The elongation at break (elongation at the softening point) can be measured according to the method described in JIS K 6251 using an autograph device (for example, AUTOGRAPH AGS-X manufactured by Shimadzu Corporation). it can.

Furthermore, the linear expansion coefficient in the temperature range of 25 ° C. or more and 80 ° C. or less of the sealing film 100 is preferably 100 ppm / K or less, and more preferably 5 ppm / K or more and 50 ppm / K or less. When the linear expansion coefficient in the temperature range of 25 ° C. or higher and 80 ° C. or lower of the sealing film 100 is a value in such a range, the sealing film 100 is excellent when the sealing film 100 is heated. Since it has a stretching property, the shape followability with respect to the unevenness 6 of the sealing film 100 can be improved more reliably. Furthermore, since excellent adhesion can be maintained between the sealing film 100 and the substrate 5 and further the electronic component 4, the sealing caused by the heat generated by repeatedly driving the electronic component mounting substrate 45 is achieved. The peeling from the electronic component mounting substrate 45 of the stop film 100 can be suppressed or prevented more accurately. The linear expansion coefficient of the sealing film 100 can be calculated using, for example, a dynamic viscoelasticity measuring apparatus (for example, EXSTAR6000 manufactured by Seiko Instruments Inc.).

[Method of sealing electronic component mounting board]
Next, the sealing method of the electronic component mounting substrate using the sealing film of the first reference embodiment described above will be described.

The sealing method of the electronic component mounting substrate according to the present embodiment is such that the innermost layer 12 is placed on the electronic component mounting substrate 45 side so as to cover the substrate 5 and the electronic component 4 and the escape portion 27 corresponds to the connecting member 7. While placing the sealing film 100 on the electronic component mounting substrate 45, heating and softening the sealing film 100, heating and decompressing the pressure, and cooling the sealing film 100, By pressurizing, it has the cooling and pressurization process which seals the board | substrate 5 and the electronic component 4 with the film 100 for sealing, without the connection member 7 being sealed.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 24A, the innermost layer 12 of the innermost layer 12, the intermediate layer 19, and the outermost layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is arranged on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the component mounting substrate 45 and so that the escape portion 27 corresponds to the connecting member 7 (FIG. 24 ( b)).

Thus, by heating the sealing film 100, the sealing film 100, that is, the innermost layer 12, the intermediate layer 19, and the outermost layer 14 are softened. As a result, on the upper surface side of the substrate 5, electrons are transferred to the substrate 5. It will be in the state which can follow the shape of the unevenness | corrugation 6 formed by mounting the components 4. FIG.

(Cooling / pressurization process)
Next, as shown in FIG. 24C, the sealing film 100 is cooled and pressurized.

As a result, on the upper side of the substrate 5, the connection member 7 is not exposed and sealed from the escape portion 27, and follows the shape of the unevenness 6 (the shape of the electronic component 4) with excellent adhesion (air density). In this state, the substrate 5 and the electronic component 4 are covered with the sealing film 100 in a softened state.
In the heating and depressurizing step, the pressing step can be omitted if the sealing film 100 sufficiently follows the shape of the irregularities 6.

At this time, the elongation at the softening point of the sealing film 100 is preferably 150% or more and 3500% or less. Thereby, the film 100 for sealing can be extended with the more excellent shape followability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization. Therefore, the substrate 5 and the electronic component 4 can be coated on the upper side of the substrate 5 with excellent adhesion by the softened sealing film 100.

The sealing film 100 is covered with the sealing film 100 with excellent adhesion (airtightness) and the connecting member 7 is exposed from the escape portion 27. By cooling, the sealing film 100 is solidified while maintaining this state.

As a result, the innermost layer 12 comes into contact with the upper side of the substrate 5 and the substrate 5 and the electronic component 4 are covered by the sealing film 100 while following the shape of the unevenness 6 formed on the electronic component mounting substrate 45. In addition, the sealing film-covered electronic component mounting substrate 50 in which the connection member 7 is exposed from the escape portion 27 is obtained. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to accurately suppress or prevent the electronic component 4 from coming into contact with external factors such as moisture and dust. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

Further, as described above, in the obtained sealing film-covered electronic component mounting board 50, since the connecting member 7 is exposed from the escape portion 27, the electronic component mounting board 45 and other electronic components or power supply are not connected. An electrical connection can be realized.

By passing through the above steps, the sealing film-covered electronic component mounting substrate 50 in which the substrate 5 and the electronic component 4 are covered with the sealing film 100 and the connection member 7 is exposed from the escape portion 27 is obtained. be able to.

<Twelfth embodiment>
Next, a twelfth embodiment of the sealing film 100 of the present invention will be described.

FIG. 25 is a view showing a twelfth embodiment of the sealing film of the present invention ((a) longitudinal sectional view, (b) plan view), and FIGS. 26 (a) to 26 (c) are views shown in FIG. It is a longitudinal cross-sectional view for demonstrating the sealing method of an electronic component mounting board | substrate using a film for a stop. In the following description, for convenience of description, the upper side in FIGS. 25 and 26 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the twelfth embodiment will be described. The description will focus on differences from the first to eleventh embodiments and the first reference embodiment, and the description of the same matters will be omitted.

In 12th Embodiment, it replaces with the intermediate | middle layer 19, and the film 100 for sealing is comprised by the laminated body provided with the electromagnetic wave shielding layer 13 which has electromagnetic wave shielding properties, and other than that is the same as that of the said 1st reference form. .

In this embodiment, the sealing film 100 includes an insulating layer (innermost layer) 12 and an electromagnetic wave shield laminated on one surface side (upper surface side) of the insulating layer 12 as shown in FIGS. It is comprised with the laminated body provided with the layer 13 and the coating layer (outermost layer) 14 laminated | stacked on the one surface side of the electromagnetic wave shield layer 13. FIG. That is, the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 are laminated in this order from the electronic component mounting substrate 45 side to be coated.

In addition, since the electronic component 4 is sealed by the electromagnetic wave shielding layer 13 via the insulating layer 12 having insulation properties, the electromagnetic wave shielding layer 13 is ensured to be insulated from the electronic component 4. . Furthermore, the electromagnetic wave shielding layer 13 is covered with an insulating coating layer 14 on the surface opposite to the electronic component 4. For this reason, the electromagnetic wave shielding layer 13 is also provided with insulation against other electronic components located outside the obtained sealing film-covered electronic component mounting substrate 50.

Further, in such a sealing film 100, the insulating layer 12, the electromagnetic wave shielding layer 13 and the coating layer 14 all contain a resin material, and conform to JIS K 6251 as in the first embodiment. The elongation at the softening point required is 150% or more and 3500% or less, preferably 1000% or more and 3500% or less.

Therefore, also in this embodiment, hereinafter, the layer configuration of the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 included in the sealing film 100 that satisfies the elongation rate will be described.

The insulating layer 12, the electromagnetic wave shielding layer 13 and the coating layer 14 included in the sealing film 100 having an elongation at the softening point of 150% or more and 3500% or less are as described in the first embodiment. The same resin material is contained.

Moreover, in order to make elongation rate in the said softening point of the film 100 for sealing into the said range, the insulating layer 12 and the coating layer 14 among the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 containing a resin material are included. Is composed of a layer containing the resin material (thermoplastic resin) as a main material, and the electromagnetic wave shielding layer 13 is a layer containing the resin material (thermoplastic resin) and conductive particles having conductivity. Composed. By having the insulating layer 12, the electromagnetic wave shielding layer 13 and the covering layer 14 in such a configuration, the insulating layer 12 and the covering layer 14 function as an insulating layer and a covering layer having insulating properties, respectively. Functions as an electromagnetic wave shielding layer having an electromagnetic wave shielding property and further conductivity.

The sealing film 100 including the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14 each including the resin material, having the above-described configuration, is made of the resin material described above, as in the first embodiment. Of these, a layer containing a polyolefin-based resin as the resin material is preferably provided as at least one of the insulating layer 12, the electromagnetic wave shielding layer 13, and the coating layer 14. Thereby, the elongation at the softening point of the sealing film 100 can be set to 150% or more and 3500% or less more reliably.

Therefore, in the following, the insulating layer 12 and the covering layer 14 containing the resin material as main materials, and the electromagnetic wave shielding layer 13 containing the resin material and conductive particles are provided. The sealing film 100 in which both of the resin materials included are polyolefin resins will be described as an example.

For the purpose of the insulating layer 12, the elongation at the softening point of the sealing film 100 is set to 150% or more and 3500% or less so that the adhesiveness to the unevenness 6 and the shape followability are excellent. In the embodiment, the layer contains an ethylene-vinyl acetate copolymer as a polyolefin resin (ethylene copolymer) as a main material.

The insulating layer 12 is a layer having an insulating property by containing an ethylene-vinyl acetate copolymer as a main material as a resin material. When the electronic component mounting substrate 45 is covered with the sealing film 100, Furthermore, by interposing between the electronic component 4 and the electromagnetic wave shielding layer 13 having conductivity, insulation for preventing short circuit between the electronic components 4 and between the electronic component 4 and the electrode 3 is prevented. Acts as a layer.

In the ethylene-vinyl acetate copolymer, the VA content to be copolymerized is preferably 5% by weight to 30% by weight, as in the first embodiment, and is preferably 10% by weight to 20% by weight. It is more preferable that

Further, the average thickness of the insulating layer 12 is preferably 5 μm or more and 200 μm or less, and more preferably 20 μm or more and 120 μm or less, as in the first embodiment. Thereby, the insulation with respect to the electronic component 4 of the electromagnetic wave shield layer 13 can be ensured more reliably.

Further, the electromagnetic wave shielding layer 13 is a layer having electromagnetic wave shielding properties and further conductivity by containing conductive particles having conductivity in addition to the ionomer resin as a resin material.

Such an electromagnetic wave shielding layer 13 covers the electronic component 4 disposed on the upper side of the substrate 5 via the insulating layer 12 when the electronic component mounting substrate 45 is covered with the sealing film 100. Therefore, the influence of noise due to electromagnetic waves on the electronic component 4 is accurately suppressed or prevented in the sealing film-covered electronic component mounting substrate 50 obtained by covering the electronic component mounting substrate 45 with the sealing film 100. Can be.

As the ionomer resin as the resin material, the same resin as described in the first embodiment can be used.

Also, the same conductive particles as those described in the first embodiment can be used.

Further, the content of the conductive particles in the electromagnetic wave shielding layer 13 is preferably 10% by weight or more and 95% by weight or less, and more preferably 50% by weight or more and 90% by weight or less. By setting the content of the conductive particles within such a range, the electromagnetic wave shielding layer 13 is reliably imparted with electromagnetic wave shielding property and further conductivity, and the elongation at the softening point of the sealing film 100 is 150% or more. It can be reliably set within a range of 3500% or less.

Further, the average thickness of the electromagnetic wave shielding layer 13 is preferably 1 μm or more and 400 μm or less, and more preferably 5 μm or more and 200 μm or less. By setting the average thickness of the electromagnetic wave shielding layer 13 within such a range, the sealing film 100 is excellent in toughness, and the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. It can be reliably set within the range. Furthermore, the electromagnetic wave shielding layer 13 can be reliably imparted with electromagnetic wave shielding properties and further conductivity.

The resin material contained in the electromagnetic shielding layer 13 may be an ionomer resin, an ethylene-vinyl acetate copolymer contained in the insulating layer 12 and the coating layer 14, or other polyolefin resin.

The coating layer 14 is a layer having an insulating property by containing an ethylene-vinyl acetate copolymer as a resin material as a main material. When the electronic component mounting substrate 45 is covered with the sealing film 100, By covering the surface of the electromagnetic shielding layer 13 having conductivity opposite to the electronic component 4, it functions as a coating layer for ensuring insulation against other electronic components located outside the electronic component mounting board 45. To do.

In this ethylene-vinyl acetate copolymer, the VA content to be copolymerized is set within the same range as the VA content to be copolymerized shown in the insulating layer 12 of the first embodiment.

The average thickness of the coating layer 14 is preferably 5 μm or more and 200 μm or less, and more preferably 20 μm or more and 120 μm or less. Thereby, the insulation of the electromagnetic wave shield layer 13 with respect to the electronic component located outside the sealing film-covered electronic component mounting substrate 50 can be more reliably ensured.

Moreover, in the sealing film 100, in order to provide adhesiveness between the insulating layer 12 and the electromagnetic wave shielding layer 13, and between the electromagnetic wave shielding layer 13 and the coating layer 14, or to improve adhesiveness. If necessary, an adhesive layer may be provided. Moreover, in order to improve the adhesiveness between the insulating layer 12 and the electronic component mounting substrate 45, an adhesive layer can be provided inside the insulating layer 12, that is, between the insulating layer 12 and the substrate 5, as necessary. .

Furthermore, as the adhesive resin contained in the adhesive layer, the same resin as described in the first embodiment can be used.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting substrate using the sealing film of the twelfth embodiment described above will be described.

In the sealing method of the electronic component mounting substrate of the present embodiment, the insulating layer 12 is placed on the electronic component mounting substrate 45 side so as to cover the substrate 5 and the electronic component 4 and the escape portion 27 corresponds to the connecting member 7. While placing the sealing film 100 on the electronic component mounting substrate 45, heating and softening the sealing film 100, heating and decompressing the pressure, and cooling the sealing film 100, It has the cooling and pressurization process which seals the board | substrate 5 and the electronic component 4 with the film 100 for sealing by pressurizing.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 26A, the insulating layer 12 of the insulating film 12, the electromagnetic wave shielding layer 13, and the coating layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component mounting substrate 45 and so that the escape portion 27 corresponds to the connecting member 7 (FIG. 26). (B)).

(Cooling / pressurization process)
Next, as shown in FIG. 26C, the sealing film 100 is cooled and pressurized.

At this time, the elongation at the softening point of the sealing film 100 is preferably 150% or more and 3500% or less. Thereby, since the film 100 for sealing can be extended with the more excellent shape followable | trackability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization, for the sealing of the softened state With the film 100, the substrate 5 and the electronic component 4 can be coated on the upper side of the substrate 5 with excellent adhesion.

As a result, the insulating layer 12 contacts the upper side of the substrate 5 and the substrate 5 and the electronic component 4 are covered by the sealing film 100 in a state of following the shape of the unevenness 6 formed on the electronic component mounting substrate 45. In addition, the sealing film-covered electronic component mounting substrate 50 in which the connection member 7 is exposed from the escape portion 27 is obtained. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to accurately suppress or prevent the electronic component 4 from coming into contact with external factors such as moisture and dust. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

Furthermore, the sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12, the electromagnetic wave shielding layer 13, and the covering layer 14.

Further, since the electronic component 4 is sealed by the electromagnetic wave shielding layer 13 through the insulating layer 12, the electromagnetic wave shielding layer 13 covers the electronic component 4 in a state in which insulation against the electronic component 4 is secured. be able to. Moreover, since the electromagnetic wave shielding layer 13 is covered with the coating layer 14 on the surface opposite to the electronic component 4, the electromagnetic wave shielding layer 13 is disposed outside the obtained film-covered electronic component mounting substrate 50 for sealing. The electronic component mounting substrate 45 can be covered with insulation of other electronic components that are positioned.

<13th Embodiment>
[Sealing film]
Next, a thirteenth embodiment of the sealing film 100 of the present invention will be described.

FIG. 27 is a diagram ((a) longitudinal sectional view, (b) plan view) showing a thirteenth embodiment of the sealing film of the present invention, and FIG. 28 is an electron using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the sealing method of a component mounting board. In the following description, for convenience of description, the upper side in FIGS. 27 and 28 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the thirteenth embodiment will be described. However, the description will focus on points different from the twelfth embodiment, and the description of the same matters will be omitted.

In 13th Embodiment, the structure of the coating layer 14 with which the film 100 for sealing is provided differs, and other than that is the same as that of the said 12th Embodiment.

In the sealing film 100 of the thirteenth embodiment, the covering layer 14 is formed larger than the electromagnetic wave shielding layer 13 as shown in FIGS. 27 and 28, and the end portion thereof is the end portion (edge) of the electromagnetic wave shielding layer 13. In other words, a protrusion 15 (first protrusion) formed by protruding beyond the end of the electromagnetic wave shielding layer 13 is provided.

Using such a sealing film 100, the coating layer 14 has the insulating layer 12 on the lower side with respect to the electronic component mounting substrate 45 on which the electronic component 4 and the connection member 7 are mounted on the upper surface (one surface) side. The electronic component 4 is sealed with the electromagnetic wave shielding layer 13 through the insulating layer 12 without being exposed and sealed from the escape portion 27.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting substrate using the sealing film of the thirteenth embodiment described above will be described.

In the sealing method of the electronic component mounting substrate of the present embodiment, the insulating layer 12 is placed on the electronic component mounting substrate 45 side so as to cover the substrate 5 and the electronic component 4 and the escape portion 27 corresponds to the connecting member 7. The disposing step of contacting the end portion 51 on the lower surface of the substrate 5 by folding the projecting portion 15 toward the lower surface (the other surface) of the substrate 5 while disposing the sealing film 100 on the electronic component mounting substrate 45. And heating and depressurization step for reducing the pressure while heating and softening the sealing film 100, and cooling and pressurizing the sealing film 100 so that the protruding portion 15 is formed on the end portion 51 on the lower surface of the substrate 5. A cooling / pressurizing step of sealing the substrate 5 and the electronic component 4 with the sealing film 100 in a contact state is provided.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 28A, the insulating layer 12 of the insulating film 12, the electromagnetic wave shielding layer 13, and the coating layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component mounting substrate 45 and so that the escape portion 27 corresponds to the connection member 7.

At this time, the projecting portion 15 of the covering layer 14 projecting beyond the end portion of the electromagnetic wave shielding layer 13 is folded to the lower surface side of the substrate 5, thereby bringing the projecting portion 15 into contact with the end portion 51 (FIG. 28). (B)).

Thus, by heating the sealing film 100, the sealing film 100, that is, the insulating layer 12, the electromagnetic wave shielding layer 13, and the covering layer 14 are softened. As a result, on the upper surface side of the substrate 5, the substrate 5 In this state, it is possible to follow the shape of the irregularities 6 formed by mounting the electronic component 4 on the substrate 5, and the end 51 can be covered on the lower surface side of the substrate 5.

Thereby, while the sealing film 100 extends, the shape of the unevenness 6 on the upper surface side of the substrate 5, that is, the shape of the electronic component 4 on the substrate 5 is slightly followed, and on the lower surface side of the substrate 5, The end 51 is slightly covered.

As a result, on the upper side of the substrate 5, the connection member 7 is not exposed and sealed from the escape portion 27, and has excellent adhesion (air density) with respect to the shape of the unevenness 6 (the shape of the electronic component 4). Further, the substrate 5 and the electronic component 4 are covered with the softened sealing film 100 in a state where it is covered with an excellent degree of adhesion to the end portion 51.

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, since the film 100 for sealing can be extended with the more excellent shape followable | trackability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization, for the sealing of the softened state The film 100 can cover the substrate 5 and the electronic component 4 on the upper side of the substrate 5 and the end portion 51 with excellent adhesion. In addition, when the protruding portion 15 is folded from the upper surface side to the lower surface side of the substrate 5 to be brought into contact with the end portion 51, it is possible to accurately suppress or prevent the protruding portion 15 from being broken at the bent portion. Can do.

Then, the sealing film 100 covers the substrate 5 and the electronic component 4, and further covers the end portion 51 with excellent adhesion (airtightness), and the connection member 7 is exposed from the escape portion 27. By cooling the sealing film 100, the sealing film 100 is solidified while maintaining this state.

Thereby, the insulating layer 12 is brought into contact with the upper side of the substrate 5 by the sealing film 100 in a state following the shape of the unevenness 6 formed on the electronic component mounting substrate 45, so that the substrate 5 and the electronic component 4 are Film-sealing electronic component for sealing, in which the connecting member 7 is exposed from the escape portion 27 and the end portion 51 is covered with the protruding portion 15 of the folded covering layer 14 on the lower surface side of the substrate 5 The mounting substrate 50 is obtained. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to more accurately suppress or prevent the electronic component 4 from coming into contact with external factors such as moisture and dust. Therefore, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

<Fourteenth embodiment>
Next, a fourteenth embodiment of the sealing film 100 of the present invention will be described.

FIG. 29 is a view showing a fourth embodiment of the sealing film of the present invention ((a) longitudinal sectional view, (b) plan view), and FIGS. 30 (a) to 30 (c) are the seals shown in FIG. It is a longitudinal cross-sectional view for demonstrating the sealing method of an electronic component mounting board | substrate using a film for a stop. In the following description, for convenience of description, the upper side in FIGS. 29 and 30 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the fourteenth embodiment will be described, but the description will focus on the differences from the twelfth embodiment, and description of similar matters will be omitted.

In the fourteenth embodiment, the configurations of the insulating layer 12 and the covering layer 14 included in the sealing film 100 are different, and the other configurations are the same as those in the twelfth embodiment.

In the sealing film 100 of the fourteenth embodiment, as shown in FIGS. 29 and 30, the insulating layer 12 and the covering layer 14 are each formed larger than the electromagnetic wave shielding layer 13, and their end portions are electromagnetic wave shields. The protrusion 15 (first protrusion) and the protrusion 16 (first protrusion) formed by being exposed from the end (edge) of the layer 13, in other words, protruding beyond the end of the electromagnetic wave shielding layer 13. 3 protrusions). And these protrusion part 15 and protrusion part 16 form the lamination | stacking protrusion part 65 provided by laminating | stacking in the position beyond the edge part of the electromagnetic wave shield layer 13. FIG.

Furthermore, as in the first embodiment, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thus, by folding the laminated protrusion 65 from the upper surface side to the lower surface side of the substrate 5, it is possible to accurately break the laminated protrusion 65 at the bent portion when covering the end portion 51. It can be suppressed or prevented.

Further, similarly to the first embodiment, the linear expansion coefficient in the temperature range of 25 ° C. to 80 ° C. of the sealing film 100 is preferably 100 ppm / K or less. Thus, by defining the linear expansion coefficient of the sealing film 100, the folding of the protruding portion 15 from the upper surface side to the lower surface side of the substrate 5 is caused to break at the bent portion that bends the protruding portion 15. It can be surely implemented without any problems.

Further, the length of the protruding portion 15 of the covering layer 14 protruding beyond the end portion of the electromagnetic wave shielding layer 13 in the sealing film 100 is not particularly limited, and may be 0.1 cm or more and 5.0 cm or less. Preferably, it is 0.5 cm or more and 2.5 cm or less. By setting the length of the protruding portion 15 within such a range, the protruding portion 15 can reach the end portion 51 on the lower surface of the substrate 5 while being folded from the upper surface side of the substrate 5 to the lower surface side. It is possible to reliably realize the covering of the end portion 51 by the protruding portion 15.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting substrate using the sealing film of the fourteenth embodiment described above will be described.

In the sealing method of the electronic component mounting substrate of the present embodiment, the insulating layer 12 is placed on the electronic component mounting substrate 45 side so as to cover the substrate 5 and the electronic component 4 and the escape portion 27 corresponds to the connecting member 7. The sealing film 100 is disposed on the electronic component mounting substrate 45, and the stacked projecting portion 65 is brought into contact with the end portion 51 on the lower surface of the substrate 5 by folding the laminated projecting portion 65 toward the lower surface (the other surface) of the substrate 5. Steps, heating / depressurizing step of heating and softening the sealing film 100, and cooling and pressurizing the sealing film 100 so that the laminated protrusion 65 is an end portion on the lower surface of the substrate 5 A cooling / pressurizing step of sealing the substrate 5 and the electronic component 4 with the sealing film 100 while being in contact with 51.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 30A, the insulating layer 12 of the insulating film 12, the electromagnetic wave shielding layer 13, and the coating layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component mounting substrate 45 and so that the escape portion 27 corresponds to the connection member 7.

At this time, the laminated protrusion 65 protruding beyond the end of the electromagnetic wave shielding layer 13 is folded to the lower surface side of the substrate 5, thereby bringing the laminated protrusion 65 into contact with the end 51 (FIG. 30B). )).

(Cooling / pressurization process)
Next, as shown in FIG. 30C, the sealing film 100 is cooled and pressurized.

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, since the film 100 for sealing can be extended with the more excellent shape followable | trackability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization, for the sealing of the softened state The film 100 can cover the substrate 5 and the electronic component 4 on the upper side of the substrate 5 and the end portion 51 with excellent adhesion. In addition, when the laminated protrusion 65 is folded from the upper surface side to the lower surface side of the substrate 5 to be brought into contact with the end portion 51, it is possible to accurately suppress or prevent the laminated protrusion 65 from being broken at the bent portion. Can be prevented.

As a result, the insulating layer 12 is brought into contact with the sealing film 100 on the upper surface side of the substrate 5 in a state following the shape of the unevenness 6 formed on the electronic component mounting substrate 45, and the substrate 5 and the electronic component 4. And the connecting member 7 is exposed from the escape portion 27, and further, the sealing film-covered electronic component mounting substrate in which the end portion 51 is covered by the folded projecting portion 65 on the lower surface side of the substrate 5. 50 will be obtained. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to more accurately suppress or prevent the external component such as moisture and dust from contacting the electronic component 4 and the electrode 3. Therefore, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

<Fifteenth embodiment>
[Sealing film]
Next, a fifteenth embodiment of the sealing film 100 of the present invention will be described.

FIG. 31 shows a fifteenth embodiment of a sealing film of the present invention ((a) longitudinal sectional view, (b) plan view), and FIGS. 32 (a) to (c) show the sealing shown in FIG. It is a longitudinal cross-sectional view for demonstrating the sealing method of an electronic component mounting board | substrate using a film for a stop. In the following description, for convenience of description, the upper side in FIGS. 31 and 32 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the fifteenth embodiment will be described, but the description will focus on the differences from the twelfth embodiment, and description of similar matters will be omitted.

In the fifteenth embodiment, in the sealing film 100, the formation of the coating layer 14 is omitted, and the rest is the same as in the twelfth embodiment.

In the sealing film 100 of the fifteenth embodiment, as shown in FIGS. 31 and 32, the formation of the covering layer 14 is omitted, and the insulating layer 12 and one surface side (upper surface side) of the insulating layer 12 are omitted. It is comprised with the laminated body provided with the electromagnetic wave shielding layer 13 laminated | stacked. That is, the insulating layer 12 and the electromagnetic wave shielding layer 13 are laminated in this order from the electronic component mounting substrate 45 side to be coated.

Using such a sealing film 100, an electromagnetic wave shielding layer with the insulating layer 12 on the lower side with respect to the electronic component mounting substrate 45 on which the electronic component 4 and the connection member 7 are mounted on the upper surface (one surface) side. When the cover 13 is placed on the upper side, the connecting member 7 is not exposed and sealed from the escape portion 27, and the electronic component 4 is sealed with the electromagnetic wave shielding layer 13 through the insulating layer 12.

Further, as in the first embodiment, the elongation at the softening point is 150% or more and 3500% or less. Thereby, the electronic component 4 can be covered in a state where the unevenness 6 including the convex portions 61 and the concave portions 62 included in the electronic component mounting substrate 45 is sealed with excellent followability.

Furthermore, as in the first embodiment, the linear expansion coefficient in the temperature range of 25 ° C. to 80 ° C. of the sealing film 100 is preferably 100 ppm / K or less. In this way, by regulating the linear expansion coefficient of the sealing film 100, the electronic component mounting board 45 can be sealed with excellent followability with respect to the concave and convex portions 6 including the convex portions 61 and the concave portions 62. In this state, the electronic component 4 can be covered.

[Method of sealing electronic component mounting board]
Next, an electronic component mounting substrate sealing method using the sealing film of the fifteenth embodiment described above (an electronic component mounting substrate sealing method of the present invention) will be described.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 34 (a), the electronic component mounting substrate in the state where the insulating layer 12 of the insulating film 12 and the electromagnetic wave shielding layer 13 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is arranged on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the 45 and so that the escape portion 27 corresponds to the connection member 7 (FIG. 34B). .

Thus, by heating the sealing film 100, the sealing film 100, that is, the insulating layer 12 and the electromagnetic wave shielding layer 13 are softened. As a result, the electronic component 4 is attached to the substrate 5 on the upper surface side of the substrate 5. It will be in the state which can follow the shape of the unevenness | corrugation 6 formed by mounting.

(Cooling / pressurization process)
Next, as shown in FIG. 34C, the sealing film 100 is cooled and pressurized.

Furthermore, the sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12 and the electromagnetic wave shielding layer 13.

Further, since the electronic component 4 is sealed by the electromagnetic wave shielding layer 13 through the insulating layer 12, the electromagnetic wave shielding layer 13 covers the electronic component 4 in a state in which insulation against the electronic component 4 is secured. be able to.

<Sixteenth Embodiment>
Next, a sixteenth embodiment of the sealing film 100 of the present invention will be described.

FIG. 33 is a view showing a sixteenth embodiment of the sealing film of the present invention ((a) longitudinal sectional view, (b) plan view), and FIGS. 34 (a) to (c) are the seals shown in FIG. It is a longitudinal cross-sectional view for demonstrating the sealing method of an electronic component mounting board | substrate using a film for a stop. In the following description, for convenience of description, the upper side in FIGS. 33 and 34 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the sixteenth embodiment will be described, but the description will focus on differences from the twelfth embodiment, and description of similar matters will be omitted.

The sixteenth embodiment is the same as the twelfth embodiment except that the configuration of the insulating layer 12 included in the sealing film 100 is different and the formation of the coating layer 14 is omitted.

In the sealing film 100 of the sixteenth embodiment, the insulating layer 12 is formed to be larger than the electromagnetic wave shielding layer 13 as shown in FIGS. 33 and 34, and the end portion thereof is the end portion (edge) of the electromagnetic wave shielding layer 13. A protrusion 16 (third protrusion) formed by protruding beyond the end of the electromagnetic wave shielding layer 13.

Furthermore, in the present embodiment, the protrusion 16 is configured to be able to be folded to the lower surface (the other surface) side of the substrate 5 when the sealing film 100 is used for coating. Therefore, the end portion 51 on the lower surface of the substrate 5 can be covered with the protruding portion 16. Therefore, the sealing film 100 according to the present embodiment can cover not only the upper surface side of the substrate 5 but also the end portion 51 on the lower surface of the substrate 5 with the protruding portion 16, so that the electronic component has better airtightness. The mounting substrate 45 can be covered. Therefore, in the sealing film-covered electronic component mounting substrate 50 obtained by covering with the sealing film 100, the electronic component 4 on the substrate 5 is more accurately suppressed from coming into contact with external factors such as moisture and dust. Or it can be prevented.

Furthermore, as in the first embodiment, the elongation at the softening point is 150% or more and 3500% or less. Thereby, by folding the protrusion 16 from the upper surface side to the lower surface side of the substrate 5, when the end portion 51 is covered, the protrusion 16 is prevented from being broken at the bent portion. Can be prevented.

Further, similarly to the first embodiment, the linear expansion coefficient in the temperature range of 25 ° C. to 80 ° C. of the sealing film 100 is preferably 100 ppm / K or less. Thus, by defining the linear expansion coefficient of the sealing film 100, the folding of the protruding portion 16 from the upper surface side to the lower surface side of the substrate 5 is caused to break at the bent portion that bends the protruding portion 16. It can be surely implemented without any problems.

Further, the length of the protruding portion 16 protruding beyond the end portion of the electromagnetic wave shielding layer 13 in the sealing film 100 is not particularly limited, and is preferably 0.1 cm or more and 5.0 cm or less. More preferably, it is 5 cm or more and 2.5 cm or less. By setting the length of the protrusion 16 within such a range, the protrusion 16 can reach the end 51 on the lower surface of the substrate 5 while being folded from the upper surface side to the lower surface side of the substrate 5. It is possible to reliably realize the covering of the end portion 51 by the protruding portion 16.

[Method of sealing electronic component mounting board]
Next, an electronic component mounting substrate sealing method using the sealing film of the sixteenth embodiment described above will be described.

In the sealing method of the electronic component mounting substrate of the present embodiment, the insulating layer 12 is placed on the electronic component mounting substrate 45 side so as to cover the substrate 5 and the electronic component 4 and the escape portion 27 corresponds to the connecting member 7. The disposing step of contacting the end portion 51 on the lower surface of the substrate 5 by folding the protruding portion 16 toward the lower surface (the other surface) of the substrate 5 while disposing the sealing film 100 on the electronic component mounting substrate 45. And heating and depressurizing step for reducing the pressure while heating and softening the sealing film 100, and cooling and pressurizing the sealing film 100, so that the protruding portion 16 is applied to the end portion 51 on the lower surface of the substrate 5. A cooling / pressurizing step of sealing the substrate 5 and the electronic component 4 with the sealing film 100 in a contact state is provided.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 34 (a), the electronic component mounting substrate in the state where the insulating layer 12 of the insulating film 12 and the electromagnetic wave shielding layer 13 included in the sealing film 100 is opposed to the electronic component mounting substrate 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the 45 and so that the escape portion 27 corresponds to the connecting member 7.
At this time, the protruding portion 16 protruding beyond the end portion of the electromagnetic wave shielding layer 13 is folded to the lower surface side of the substrate 5, thereby bringing the protruding portion 16 into contact with the end portion 51 (FIG. 34B). .

(Cooling / pressurization process)
Next, as shown in FIG. 36C, the sealing film 100 is cooled and pressurized.

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, since the film 100 for sealing can be extended with the more excellent shape followable | trackability with respect to the unevenness | corrugation 6 formed in the electronic component mounting board | substrate 45 at the time of this pressurization, for the sealing of the softened state The film 100 can cover the substrate 5 and the electronic component 4 on the upper side of the substrate 5 and the end portion 51 with excellent adhesion. Further, when the protruding portion 16 is folded from the upper surface side to the lower surface side of the substrate 5 to be brought into contact with the end portion 51, it is possible to accurately suppress or prevent the protruding portion 16 from breaking at the bent portion. be able to.

As a result, the insulating layer 12 is brought into contact with the sealing film 100 on the upper surface side of the substrate 5 in a state following the shape of the unevenness 6 formed on the electronic component mounting substrate 45, and the substrate 5 and the electronic component 4. And the connecting member 7 is exposed from the escape portion 27, and further, the sealing film-covered electronic component mounting substrate 50 in which the end portion 51 is covered with the folded protrusion 16 on the lower surface side of the substrate 5. Will be obtained. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to more accurately suppress or prevent the electronic component 4 from coming into contact with external factors such as moisture and dust. Therefore, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

<Seventeenth Embodiment>
[Sealing film]
Next, a seventeenth embodiment of the sealing film 100 of the present invention will be described.

FIG. 35 is a view showing a seventeenth embodiment of the sealing film of the present invention ((a) longitudinal sectional view, (b) plan view), and FIGS. 36 (a) to (c) are the seals shown in FIG. It is a longitudinal cross-sectional view for demonstrating the sealing method of an electronic component mounting board | substrate using a film for a stop. In the following description, for convenience of description, the upper side in FIGS. 35 and 36 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, although the seventeenth embodiment will be described, the points different from the twelfth embodiment will be mainly described, and description of similar matters will be omitted.

In the seventeenth embodiment, the configurations of the electromagnetic wave shielding layer 13 and the covering layer 14 included in the sealing film 100 are different, and further, the configuration of the electronic component mounting substrate 45 covered with the sealing film 100 is different. Is the same as in the twelfth embodiment.

In the sealing film 100 of the seventeenth embodiment, the electromagnetic wave shielding layer 13 and the covering layer 14 are formed larger than the insulating layer 12 as shown in FIGS. Thereby, the edge part of the electromagnetic wave shielding layer 13 located in the insulating layer 12 side among the electromagnetic wave shielding layer 13 and the coating layer 14 is exposed from the edge part (edge part) of the insulating layer 12. In other words, the electromagnetic wave shielding layer 13 includes the protruding portion 17 (second protruding portion) formed by protruding beyond the end portion of the insulating layer 12.

Moreover, the electronic component mounting substrate 45 covered with the sealing film 100 of the seventeenth embodiment is mounted on the substrate 5 and the central portion on the upper surface (one surface) side of the substrate 5 as shown in FIG. The electronic component 4 placed and the connection member 7 and the electrode 3 that are electrically connected to the electronic component 4 and formed on the end portion 52 on the upper surface (one surface) side of the substrate 5 are provided. . In such an electronic component mounting substrate 45, the unevenness 6 including the convex portion 61 and the concave portion 62 is formed on the substrate 5 by mounting the electronic component 4 and the electrode 3 on the upper surface of the substrate 5. In addition, as the electrode 3, for example, an electrode for connecting to a power source for supplying electricity from the outside, an electrode for electrically connecting to another electronic component located outside the electronic component mounting board 45, In addition, a ground electrode for grounding the electronic component 4 may be used.

Thus, with respect to the electronic component mounting substrate 45 on which the electronic component 4, the electrode 3, and the connection member 7 are mounted on the upper surface side, the insulating layer 12 is on the lower side and the covering layer 14 is on the upper side, and the sealing film 100 The electronic component 4 is sealed with the electromagnetic wave shielding layer 13 through the insulating layer 12 without the connection member 7 being exposed and sealed from the escape portion 27.

Furthermore, in the present embodiment, the electromagnetic wave shielding layer 13 is exposed from the insulating layer 12 at the projecting portion 17 included in the covering when the sealing film 100 is used for coating. Therefore, the protruding portion 17 can be brought into contact with the electrode 3 formed on the end portion 52 on the upper surface of the substrate 5. Therefore, since the protrusion 17 is composed of the electromagnetic wave shielding layer 13 and has conductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the electromagnetic wave shielding layer 13 are provided. Can be secured. In the present embodiment, since the coating layer 14 is formed on almost the entire upper surface of the electromagnetic wave shielding layer 13, the electrical connection between the electrode 3 and the outside via the electromagnetic wave shielding layer 13 is ensured. Is formed by removing a part of the coating layer 14 to form an exposed portion where the electromagnetic wave shielding layer 13 is exposed, and electrically connecting the electromagnetic wave shielding layer 13 and the outside at the exposed portion. Realized.

In addition, the length of the protruding portion 17 of the electromagnetic wave shielding layer 13 protruding beyond the end portion of the insulating layer 12 in the sealing film 100 is not particularly limited, and may be 0.1 cm or more and 5.0 cm or less. Preferably, it is 0.5 cm or more and 2.5 cm or less. By setting the length of the protruding portion 17 within such a range, the protruding portion 17 covers the electrode 3 positioned on the upper surface side of the substrate 5, and the electric connection between the protruding portion 17 and the electrode 3 is established. Can be realized.

[Method of sealing electronic component mounting board]
Next, a method for sealing an electronic component mounting board using the sealing film of the seventeenth embodiment described above will be described.

In the sealing method of the electronic component mounting substrate of the present embodiment, the insulating layer 12 is placed on the electronic component mounting substrate 45 side so as to cover the substrate 5 and the electronic component 4 and the escape portion 27 corresponds to the connecting member 7. While placing the sealing film 100 on the electronic component mounting substrate 45, the placement step of bringing the protruding portion 17 into contact with the electrode 3 on the upper surface (one surface) side of the substrate 5, and heating the sealing film 100 The substrate 5, the electronic component 4, and the electrode 3 can be softened and heated while the pressure is reduced, and the sealing film 100 is cooled and pressurized so that the protrusion 17 is in contact with the electrode 3. And a cooling / pressurizing step for sealing with a sealing film 100.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 36A, in the state where the insulating layer 12 of the insulating film 12, the electromagnetic wave shielding layer 13 and the covering layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45, The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5, the electronic component 4, and the electrode 3 included in the electronic component mounting substrate 45 and so that the escape portion 27 corresponds to the connection member 7. .

At this time, the electronic component 4 is covered with the insulating layer 12 located at the center of the sealing film 100, and the electrode 3 is covered with the protruding portion 17 protruding beyond the end of the insulating layer 12 (FIG. 36B). )).

(Heating and decompression process)
Next, while maintaining the state shown in FIG. 36 (b), the sealing film 100 is heated and softened, and the pressure is reduced.

As a result, on the upper side of the substrate 5, the connection member 7 is not exposed and sealed from the escape portion 27, and the adhesion (air density) excellent in the shape of the unevenness 6 (the shape of the electronic component 4 and the electrode 3). The substrate 5, the electronic component 4, and the electrode 3 are covered with the sealing film 100 in a softened state following the above.

Then, the sealing film 100 covers the substrate 5, the electronic component 4, and the electrode 3 with excellent adhesion (airtightness), and the connection member 7 is exposed from the escape portion 27. By cooling the film 100, the sealing film 100 is solidified while maintaining this state.

Thereby, the insulating layer 12 is brought into contact with the upper side of the substrate 5 by the sealing film 100 in a state following the shape of the unevenness 6 formed on the electronic component mounting substrate 45, so that the substrate 5 and the electronic component 4 are Thus, the sealing film-covered electronic component mounting substrate 50 that is covered and the connection member 7 is exposed from the escape portion 27 and is further in contact with the electromagnetic wave shield layer 13 to cover the electrode 3 is obtained. Therefore, in this film-covered electronic component mounting substrate 50 for sealing, it is possible to accurately suppress or prevent the external component such as moisture and dust from contacting the electronic component 4 and the electrode 3. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

Through the above steps, the substrate 5, the electronic component 4, and the electrode 3 are covered with the sealing film 100 and the connecting member 7 is exposed from the escape portion 27. 50 can be obtained.

<Eighteenth embodiment>
[Sealing film]
Next, an eighteenth embodiment of the sealing film 100 of the present invention will be described.

FIG. 37 is a view showing an eighteenth embodiment of the sealing film of the present invention ((a) longitudinal sectional view, (b) plan view), and FIGS. 38 (a) to (c) are views showing the sealing shown in FIG. It is a longitudinal cross-sectional view for demonstrating the sealing method of an electronic component mounting board | substrate using a film for a stop. In the following description, for convenience of explanation, the upper side in FIGS. 37 and 38 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the eighteenth embodiment will be described, but the description will focus on differences from the twelfth embodiment, and description of similar matters will be omitted.

In the eighteenth embodiment, the configuration of the electromagnetic wave shielding layer 13 included in the sealing film 100 is different, and further, the formation of the coating layer 14 is omitted, and the electronic component mounting to be coated using the sealing film 100 is performed. The substrate 45 is the same as the twelfth embodiment except that the configuration of the substrate 45 is different.

In the sealing film 100 of the eighteenth embodiment, the electromagnetic wave shielding layer 13 is formed larger than the insulating layer 12 as shown in FIGS. Thus, the end portion of the electromagnetic wave shielding layer 13 is exposed from the end portion (edge portion) of the insulating layer 12, in other words, the protruding portion 17 (formed by protruding beyond the end portion of the insulating layer 12 ( 2nd protrusion part) is provided.

Moreover, the electronic component mounting substrate 45 covered with the sealing film 100 of the eighteenth embodiment is mounted on the substrate 5 and the central portion on the upper surface (one surface) side of the substrate 5 as shown in FIG. The electronic component 4 placed and the connection member 7 and the electrode 3 that are electrically connected to the electronic component 4 and formed on the end portion 52 on the upper surface (one surface) side of the substrate 5 are provided. . In such an electronic component mounting substrate 45, the unevenness 6 including the convex portion 61 and the concave portion 62 is formed on the substrate 5 by mounting the electronic component 4 and the electrode 3 on the upper surface of the substrate 5. In addition, as the electrode 3, for example, an electrode for connecting to a power source for supplying electricity from the outside, an electrode for electrically connecting to another electronic component located outside the electronic component mounting board 45, In addition, a ground electrode for grounding the electronic component 4 may be used.

Thus, with respect to the electronic component mounting substrate 45 on which the electronic component 4, the electrode 3, and the connection member 7 are mounted on the upper surface side, the insulating layer 12 is on the lower side, the electromagnetic wave shielding layer 13 is on the upper side, and the sealing film When covering with 100, the electronic component 4 is sealed with the electromagnetic wave shielding layer 13 through the insulating layer 12 without the connecting member 7 being exposed and sealed from the escape portion 27.

Furthermore, in the present embodiment, the electromagnetic wave shielding layer 13 is exposed from the insulating layer 12 at the projecting portion 17 included in the covering when the sealing film 100 is used for coating. Therefore, the protruding portion 17 can be brought into contact with the electrode 3 formed on the end portion 52 on the upper surface of the substrate 5. Therefore, since the protrusion 17 is composed of the electromagnetic wave shielding layer 13 and has conductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the electromagnetic wave shielding layer 13 are provided. Can be secured.

[Method of sealing electronic component mounting board]
Next, an electronic component mounting substrate sealing method using the sealing film of the eighteenth embodiment described above will be described.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 38 (a), the electronic component mounting board in a state where the insulating layer 12 of the sealing film 100 and the electromagnetic wave shielding layer 13 are opposed to the electronic component mounting board 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5, the electronic component 4, and the electrode 3 included in the 45, and so that the escape portion 27 corresponds to the connecting member 7.

At this time, the electronic component 4 is covered with the insulating layer 12 located at the center of the sealing film 100, and the electrode 3 is covered with the protruding portion 17 protruding beyond the end of the insulating layer 12 (FIG. 38B). )).

Thus, by heating the sealing film 100, the sealing film 100, that is, the insulating layer 12 and the electromagnetic wave shielding layer 13 are softened. As a result, on the upper surface side of the substrate 5, the electronic component 4 and It will be in the state which can follow the shape of the unevenness | corrugation 6 formed by mounting the electrode 3. FIG.

(Cooling / pressurization process)
Next, as shown in FIG. 38C, the sealing film 100 is cooled and pressurized.

Further, the sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12 and the electromagnetic wave shielding layer 13, and the electromagnetic wave shielding layer 13 is formed at the end thereof. , And a protruding portion 17 formed by protruding beyond the end portion of the insulating layer 12. In the present embodiment, the protruding portion 17 directly covers the electrode 3 without the insulating layer 12 interposed therebetween. Thereby, since the electrode 3 is electrically connected to the projecting portion 17 (electromagnetic wave shield layer 13) having conductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode via the projecting portion 17 is used. 3 and the outside can be secured.

<Nineteenth embodiment>
[Sealing film]
Next, a nineteenth embodiment of the sealing film 100 of the present invention will be described.

FIG. 39 is a view showing a nineteenth embodiment of the sealing film of the present invention ((a) longitudinal sectional view, (b) plan view), and FIGS. 40 (a) to (c) are the seals shown in FIG. It is a longitudinal cross-sectional view for demonstrating the sealing method of an electronic component mounting board | substrate using a film for a stop. In the following description, for convenience of description, the upper side in FIGS. 39 and 40 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the nineteenth embodiment will be described, but the points different from the twelfth embodiment will be mainly described, and description of similar matters will be omitted.

In the nineteenth embodiment, the configurations of the electromagnetic wave shielding layer 13 and the covering layer 14 included in the sealing film 100 are different, and further, the configuration of the electronic component mounting substrate 45 covered using the sealing film 100 is different. Is the same as in the twelfth embodiment.

In the sealing film 100 of the nineteenth embodiment, the electromagnetic wave shielding layer 13 and the covering layer 14 are formed larger than the insulating layer 12 as shown in FIGS. Thereby, the edge part of the electromagnetic wave shielding layer 13 located in the insulating layer 12 side among the electromagnetic wave shielding layer 13 and the coating layer 14 is exposed from the edge part (edge part) of the insulating layer 12. In other words, the electromagnetic wave shielding layer 13 includes the protruding portion 17 (second protruding portion) formed by protruding beyond the end portion of the insulating layer 12.

Moreover, the electronic component mounting substrate 45 covered with the sealing film 100 of the nineteenth embodiment is mounted on the substrate 5 and the central portion on the upper surface (one surface) side of the substrate 5 (see FIG. 40). The electronic component 4 that is placed, the connection member 7 that is electrically connected to the electronic component 4 and is formed at the end 52 on the upper surface (one surface) side of the substrate 5, and the lower surface ( And the electrode 3 formed at the end 51 on the other surface side. In such an electronic component mounting substrate 45, the mounting of the electronic component 4 on the upper surface of the substrate 5 forms the unevenness 6 including the convex portions 61 and the concave portions 62 on the substrate 5.

Thus, with respect to the electronic component mounting substrate 45 on which the electronic component 4 and the connecting member 7 are mounted on the upper surface side and the electrode 3 is mounted on the lower surface side, the insulating layer 12 is on the lower side and the covering layer 14 is on the upper side. When the sealing film 100 is used for covering, the electronic component 4 is sealed with the electromagnetic wave shielding layer 13 through the insulating layer 12 without the connecting member 7 being exposed and sealed from the escape portion 27. .

Furthermore, in the present embodiment, the projecting portion 17 provided in the electromagnetic wave shielding layer 13 is configured to be able to be folded to the lower surface side of the substrate 5 when the sealing film 100 is used for coating. Therefore, the protruding portion 17 can be brought into contact with the electrode 3 formed on the end portion 51 on the lower surface of the substrate 5. Therefore, since the protrusion 17 is composed of the electromagnetic wave shielding layer 13 and has conductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the electromagnetic wave shielding layer 13 are provided. Can be secured. In the present embodiment, since the coating layer 14 is formed on almost the entire upper surface of the electromagnetic wave shielding layer 13, the electrical connection between the electrode 3 and the outside via the electromagnetic wave shielding layer 13 is ensured. Is formed by removing a part of the coating layer 14 to form an exposed portion where the electromagnetic wave shielding layer 13 is exposed, and electrically connecting the electromagnetic wave shielding layer 13 and the outside at the exposed portion. Realized.

In the sealing method of the electronic component mounting substrate of the present embodiment, the insulating layer 12 is placed on the electronic component mounting substrate 45 side so as to cover the substrate 5 and the electronic component 4 and the escape portion 27 corresponds to the connecting member 7. The disposing step of contacting the electrode 3 by folding the protrusion 17 on the lower surface (the other surface) side of the substrate 5 while disposing the sealing film 100 on the electronic component mounting substrate 45, and the sealing film Heating / depressurizing step for heating and softening 100, and cooling and sealing film 100 for sealing, pressurizing part 17 in contact with electrode 3 in a state where projecting part 17 is in contact with electrode 3 And a cooling / pressurizing step for sealing with a sealing film 100.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 40A, in the state where the insulating layer 12 of the insulating film 12, the electromagnetic wave shielding layer 13 and the coating layer 14 included in the sealing film 100 is opposed to the electronic component mounting substrate 45, The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component mounting substrate 45 and so that the escape portion 27 corresponds to the connection member 7.

At this time, the protruding portion 17 protruding beyond the end portion of the insulating layer 12 is folded to the lower surface side of the substrate 5, thereby bringing the protruding portion 17 into contact with the electrode 3 (FIG. 40B).

Thereby, while the sealing film 100 extends, the shape of the unevenness 6 on the upper surface side of the substrate 5, that is, the shape of the electronic component 4 on the substrate 5 is slightly followed, and on the lower surface side of the substrate 5, The state slightly follows the shape of the electrode 3.

(Cooling / pressurization process)
Next, as shown in FIG. 40C, the sealing film 100 is cooled and pressurized.

As a result, the connection member 7 is not exposed and sealed from the escape portion 27 on the upper surface side of the substrate 5, and the shape of the unevenness 6 (the shape of the electronic component 4), and the electrode 3 on the lower surface side of the substrate 5. The substrate 5, the electronic component 4, and the electrode 3 are covered with the sealing film 100 in a softened state in a state of following with an excellent adhesion degree (air density).

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, since the film 100 for sealing can be extended with the more excellent shape followability with respect to the unevenness | corrugation 6 and the electrode 3 which were formed in the electronic component mounting board | substrate 45 at the time of this pressurization, the state of the softened state The sealing film 100 can cover the substrate 5 and the electronic component 4 on the upper surface side of the substrate 5 and the electrode 3 on the lower surface side of the substrate 5 with excellent adhesion. Further, when the protruding portion 17 is folded from the upper surface side to the lower surface side of the substrate 5 to be brought into contact with the electrode 3, it is possible to accurately suppress or prevent the protruding portion 17 from being broken at the bent portion. Can do.

Then, with the sealing film 100, the substrate 5 and the electronic component 4 are further covered with excellent adhesion (air tightness) with the electrode 3, and the connection member 7 is exposed from the escape portion 27. By cooling the sealing film 100, the sealing film 100 is solidified while maintaining this state.

Thereby, the insulating layer 12 is brought into contact with the upper surface side of the substrate 5 by the sealing film 100 in a state following the shape of the unevenness 6 formed on the electronic component mounting substrate 45, so that the substrate 5 and the electronic component 4 are The sealing film-covered electronic component mounting substrate 50 is obtained, which is covered and the connection member 7 is exposed from the escape portion 27 and the electromagnetic wave shielding layer 13 is in contact with the lower surface side of the substrate 5 to cover the electrode 3. Will be. Therefore, in the sealing film-covered electronic component mounting substrate 50, it is possible to more accurately suppress or prevent the external component such as moisture and dust from contacting the electronic component 4 and the electrode 3. Therefore, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

Further, the sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12, the electromagnetic wave shielding layer 13, and the covering layer 14, but the electromagnetic wave shielding layer 13 is The insulating layer 12 is formed so as to be larger than the insulating layer 12, and the insulating layer 12 is laminated at the center portion thereof, but at the end portion, the protruding portion 17 formed by protruding beyond the end portion of the insulating layer 12 is provided. Then, the protruding portion 17 is folded on the lower surface side of the substrate 5 to directly cover the electrode 3. Thereby, since the electrode 3 is electrically connected to the protrusion 17 (electromagnetic wave shield layer 13), in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the protrusion 17 It is possible to ensure electrical connection.

<< 20th Embodiment >>
Next, a twentieth embodiment of the sealing film 100 of the present invention will be described.

41 is a view showing a twentieth embodiment of a sealing film of the present invention ((a) longitudinal sectional view, (b) plan view), and FIGS. 42 (a) to (c) are views showing the sealing shown in FIG. It is a longitudinal cross-sectional view for demonstrating the sealing method of an electronic component mounting board | substrate using a film for a stop. In the following description, for convenience of description, the upper side in FIGS. 41 and 42 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the twentieth embodiment will be described, but the description will focus on the differences from the twelfth embodiment, and description of similar matters will be omitted.

In the twentieth embodiment, the configuration of the electromagnetic wave shielding layer 13 included in the sealing film 100 is different, and further, the formation of the coating layer 14 is omitted, and the electronic component mounting to be coated using the sealing film 100 is performed. The substrate 45 is the same as the twelfth embodiment except that the configuration of the substrate 45 is different.

In the sealing film 100 of the twentieth embodiment, the electromagnetic wave shielding layer 13 is formed larger than the insulating layer 12 as shown in FIGS. Thus, the end portion of the electromagnetic wave shielding layer 13 is exposed from the end portion (edge portion) of the insulating layer 12, in other words, the protruding portion 17 (formed by protruding beyond the end portion of the insulating layer 12 ( 2nd protrusion part) is provided.

Moreover, the electronic component mounting substrate 45 covered with the sealing film 100 of the twentieth embodiment is mounted on the substrate 5 and the central portion on the upper surface (one surface) side of the substrate 5, as shown in FIG. The electronic component 4 that is placed, the connection member 7 that is electrically connected to the electronic component 4 and is formed at the end 52 on the upper surface (one surface) side of the substrate 5, and the lower surface ( And the electrode 3 formed at the end 51 on the other surface side. In such an electronic component mounting substrate 45, the mounting of the electronic component 4 on the upper surface of the substrate 5 forms the unevenness 6 including the convex portions 61 and the concave portions 62 on the substrate 5.

Thus, with respect to the electronic component mounting substrate 45 on which the electronic component 4 and the connection member 7 are mounted on the upper surface side and the electrode 3 is mounted on the lower surface side, the insulating layer 12 is on the lower side and the electromagnetic wave shielding layer 13 is on the upper side. Then, when the sealing film 100 is used for covering, the electronic component 4 is sealed with the electromagnetic wave shielding layer 13 through the insulating layer 12 without the connecting member 7 being exposed and sealed from the escape portion 27. The

Furthermore, in the present embodiment, the projecting portion 17 provided in the electromagnetic wave shielding layer 13 is configured to be able to be folded to the lower surface side of the substrate 5 when the sealing film 100 is used for coating. Therefore, the protruding portion 17 can be brought into contact with the electrode 3 formed on the end portion 51 on the lower surface of the substrate 5. Therefore, since the protrusion 17 is composed of the electromagnetic wave shielding layer 13 and has conductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the electromagnetic wave shielding layer 13 are provided. Can be secured.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 42 (a), the electronic component mounting board in the state where the insulating layer 12 of the insulating film 12 and the electromagnetic wave shielding layer 13 included in the sealing film 100 is opposed to the electronic component mounting board 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the 45 and so that the escape portion 27 corresponds to the connecting member 7.
At this time, the protruding portion 17 protruding beyond the end portion of the insulating layer 12 is folded to the lower surface side of the substrate 5, thereby bringing the protruding portion 17 into contact with the electrode 3 (FIG. 42B).

Thus, by heating the sealing film 100, the sealing film 100, that is, the insulating layer 12 and the electromagnetic wave shielding layer 13 are softened. As a result, the electronic component 4 is attached to the substrate 5 on the upper surface side of the substrate 5. It becomes a state that can follow the shape of the irregularities 6 formed by mounting, and on the lower surface side of the substrate 5, with respect to the shape of the electrode 3 provided on the end portion 51 of the lower surface of the substrate 5, It will be in a state where it can follow.

(Cooling / pressurization process)
Next, as shown in FIG. 42C, the sealing film 100 is cooled and pressurized.

Further, the sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12 and the electromagnetic wave shielding layer 13, and the electromagnetic wave shielding layer 13 is formed from the insulating layer 12. The insulating layer 12 is laminated at the central portion thereof, and the end portion is provided with a protruding portion 17 formed by protruding beyond the end portion of the insulating layer 12. Then, the protruding portion 17 is folded under the substrate 5 to directly cover the electrode 3. Thereby, since the electrode 3 is electrically connected to the protrusion 17 (electromagnetic wave shield layer 13), in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the protrusion 17 It is possible to ensure electrical connection.

<Twenty-first embodiment>
[Sealing film]
Next, a twenty-first embodiment of the sealing film 100 of the present invention will be described.

FIG. 43 is a longitudinal sectional view showing a twenty-first embodiment of the sealing film of the present invention, and FIGS. 44 (a) to 44 (c) show the sealing of an electronic component mounting substrate using the sealing film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the stopping method. In the following description, for convenience of description, the upper side in FIGS. 43 and 44 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, the twenty-first embodiment will be described, but the description will focus on differences from the first to twentieth embodiments, and description of similar matters will be omitted.

In the twenty-first embodiment, the configurations of the electromagnetic wave shielding layer 13 and the covering layer 14 included in the sealing film 100 are different, and further, the configuration of the electronic component mounting substrate 45 covered with the sealing film 100 is different. Is the same as in the first embodiment.

43 and 44, the sealing film 100 includes a laminated body including an insulating layer 12 and an electromagnetic wave shielding layer 13 laminated on one surface side (upper surface side) of the insulating layer 12. Has been. That is, the electromagnetic wave shielding layer 13 is laminated on the insulating layer 12 on the opposite side (upper surface side) of the electronic component mounting substrate 45 to be covered. The electromagnetic wave shielding layer 13 is formed to be larger than the insulating layer 12, and its end is exposed from the end (edge) of the insulating layer 12. In other words, the electromagnetic wave shielding layer 13 includes the protruding portion 15 formed by protruding beyond the end portion of the insulating layer 12.

Here, as shown in FIG. 44, the electronic component mounting substrate 45 covered with the sealing film 100 is mounted (placed) on the substrate 5 and the central portion on the upper surface (one surface) side of the substrate 5. The electronic component 4 and the electrode 3 electrically connected to the electronic component 4 and formed on the lower surface (the other surface) side of the substrate 5 are provided. In such an electronic component mounting substrate 45, the electronic component 4 is mounted on the upper surface of the substrate 5 and the electrode 3 is formed on the lower surface of the substrate 5, so that the upper surface and the lower surface of the substrate 5 are formed with the convex portions 61 and the concave portions 62. Unevenness 6 is formed. Examples of the substrate 5 include a printed wiring board. Examples of the electronic component 4 mounted on the substrate 5 include a semiconductor element, a capacitor, a coil, a connector, and a resistor. For example, an electrode for connecting to a power source for supplying electricity from the outside, an electrode for electrically connecting to another electronic component, a ground electrode for grounding the electronic component 4 and the like can be mentioned.

When the electronic component mounting substrate 45 having the electronic component 4 mounted on the upper surface side is sealed with the sealing film 100 with the electromagnetic wave shielding layer 13 on the upper side, the electronic component 4 becomes an insulating layer. 12 is sealed with an electromagnetic wave shielding layer 13. Therefore, in the obtained film-covered electronic component mounting substrate 50 for sealing, the influence of noise due to electromagnetic waves on the electronic component 4 is accurately suppressed or prevented.

Furthermore, the protrusion 15 provided in the electromagnetic wave shielding layer 13 is configured to be able to be folded on the lower surface side of the substrate 5 when the sealing film 100 is used for coating. Therefore, the protruding portion 15 can be brought into contact with the electrode 3 formed on the end portion on the lower surface side of the substrate 5. Accordingly, since the protruding portion 15 is composed of the electromagnetic wave shielding layer 13 and has conductivity, in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the electromagnetic wave shielding layer 13 are provided. Can be secured.

Further, as in the first embodiment, the elongation at the softening point is 150% or more and 3500% or less, more preferably 150% or more and 2000% or less, and more preferably 1000% or more and 2000% or less. More preferably.

When the elongation at the softening point is within such a range, when the electronic component mounting substrate 45 is covered with the sealing film 100, the unevenness including the convex portions 61 and the concave portions 62 included in the electronic component mounting substrate 45 is provided. 6 can be covered in a sealed state with excellent followability. Therefore, in the sealing film-covered electronic component mounting substrate 50 obtained by covering the sealing film 100, the electronic component 4 on the substrate 5 is accurately prevented from coming into contact with external factors such as moisture and dust. Or it can be prevented. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved. Further, when the protruding portion 15 is folded from the upper surface side to the lower surface side of the substrate 5 and brought into contact with the electrode 3, it is possible to accurately suppress or prevent the protruding portion 15 from being broken at the bent portion. it can.

Further, the length of the protruding portion 15 protruding beyond the end portion of the insulating layer 12 in the sealing film 100 is not particularly limited, and is preferably 0.1 cm or more and 5.0 cm or less, 0.5 cm More preferably, it is 2.5 cm or less. By setting the length of the projecting portion 15 within such a range, the projecting portion 15 can reach the electrode 3 located on the lower surface side of the substrate 5 while being folded from the upper surface side of the substrate 5 to the lower surface side. The electrical connection between the protrusion 15 and the electrode 3 can be realized.

The electronic component mounting substrate sealing method of this embodiment is such that the sealing film 100 is placed on the electronic component mounting substrate 45 with the insulating layer 12 facing the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4. And placing the protrusion 15 on the lower surface (the other surface) side of the substrate 5 so as to be in contact with the electrode 3 while heating and depressurizing the sealing film 100 while heating and softening it. The process and the cooling film 100 are cooled and pressurized so that the substrate 5 and the electronic component 4 are sealed with the sealing film 100 in a state where the protruding portion 15 is in contact with the electrode 3 by applying pressure. Pressure step.

Hereafter, each process of the sealing method of an electronic component mounting substrate is demonstrated sequentially.
(Arrangement process)
First, as shown in FIG. 44 (a), the electronic component mounting board in a state where the insulating layer 12 of the electromagnetic wave shielding layer 13 and the insulating layer 12 included in the sealing film 100 is opposed to the electronic component mounting board 45. The sealing film 100 is disposed on the electronic component mounting substrate 45 so as to cover the substrate 5 and the electronic component 4 included in the electronic component 45.

At this time, the protruding portion 15 protruding beyond the end portion of the insulating layer 12 is folded to the lower surface side of the substrate 5, thereby bringing the protruding portion 15 into contact with the electrode 3 (FIG. 44B).

Thus, by heating the sealing film 100, the sealing film 100, that is, the electromagnetic wave shielding layer 13 and the insulating layer 12 are softened. As a result, the electronic component 4 is attached to the substrate 5 on the upper surface side of the substrate 5. It is in a state where it can follow the shape of the unevenness 6 formed by mounting, and further, it can follow the shape of the electrode 3 provided on the substrate 5 on the lower surface side of the substrate 5. .

As a result, while the sealing film 100 is extended, the shape of the irregularities 6 on the upper side of the substrate 5, that is, the shape of the electronic component 4 on the substrate 5 is slightly followed. 5 slightly follows the shape of the electrode 3 on the top.

The heating of the sealing film 100 and the reduced pressure of the atmosphere may be reduced after the heating or may be heated after the reduced pressure, but it is preferable to perform the heating and the reduced pressure almost simultaneously. Thereby, the softened film 100 for sealing can be made into the state which followed the shape of the unevenness | corrugation 6 and the shape of the electrode 3 a little reliably.

(Cooling / pressurization process)
Next, as shown in FIG. 44C, the sealing film 100 is cooled and pressurized.

At this time, the elongation at the softening point of the sealing film 100 is 150% or more and 3500% or less. Thereby, the film 100 for sealing can be extended with the more excellent shape followability with respect to the unevenness | corrugation 6 and the electrode 3 which were formed in the electronic component mounting board | substrate 45 at the time of this pressurization. Therefore, the softened sealing film 100 can cover the substrate 5 and the electronic component 4 on the upper side of the substrate 5 and the electrode 3 on the lower side of the substrate 5 with excellent adhesion. Further, when the protruding portion 15 is folded from the upper surface side to the lower surface side of the substrate 5 to be brought into contact with the electrode 3, it is possible to accurately suppress or prevent the protruding portion 15 from breaking at the bent portion. it can.

Thereby, the substrate 5 and the electronic component 4 are in contact with the insulating layer 12 on the upper side of the substrate 5 by the sealing film 100 while following the shape of the unevenness 6 formed on the electronic component mounting substrate 45. The sealing film-covered electronic component mounting substrate 50 covered with the substrate 5 and the electrode 3 with the electromagnetic wave shielding layer 13 in contact with the lower side of the substrate 5 is obtained. Therefore, in this film-covered electronic component mounting substrate 50 for sealing, it is possible to accurately suppress or prevent the external component such as moisture and dust from contacting the electronic component 4 and the electrode 3. Accordingly, the reliability of the obtained electronic device including the sealing film-covered electronic component mounting substrate 50 and thus the sealing film-covered electronic component mounting substrate 50 can be improved.

The sealing film 100 used for covering the electronic component mounting substrate 45 as described above is composed of a laminate of the insulating layer 12 and the electromagnetic wave shielding layer 13. The electromagnetic wave shielding layer 13 is formed from the insulating layer 12. The insulating layer 12 is laminated at the central portion thereof, and the projecting portion 15 formed by projecting beyond the end portion of the insulating layer 12 is provided at the end portion.

Therefore, in this step, the electronic component 4 is covered with the insulating layer 12 in the central portion of the electromagnetic wave shielding layer 13. Therefore, it is possible to obtain the sealing film-covered electronic component mounting substrate 50 in which the influence of noise due to electromagnetic waves on the electronic component 4 is accurately suppressed or prevented.

Furthermore, at the end of the electromagnetic wave shielding layer 13, the projecting portion 15 having conductivity is directly covered with the electrode 3 by being folded under the substrate 5 without the insulating layer 12 interposed. Thereby, since the electrode 3 is electrically connected to the protrusion 15 (electromagnetic wave shield layer 13), in the obtained film-covered electronic component mounting substrate 50 for sealing, the electrode 3 and the outside through the protrusion 15 It is possible to ensure electrical connection.

In addition, although cooling of the film 100 for sealing and pressurization of an atmosphere may be cooled after pressurization, it is preferable to perform cooling and pressurization substantially simultaneously. Thereby, the film 100 for sealing can be coat | covered with the more excellent adhesiveness corresponding to the shape of the unevenness | corrugation 6 and the electrode 3. FIG.

By passing through said process, the film | membrane 5 for electronic components mounting board | substrate 50 for sealing by which the board | substrate 5, the electronic component 4, and the electrode 3 were coat | covered with the film 100 for sealing can be obtained.

As described above, the sealing film, the electronic component mounting substrate sealing method, and the sealing film-covered electronic component mounting substrate of the present invention have been described, but the present invention is not limited thereto.

For example, in the sealing film of the present invention, an arbitrary layer that can exhibit the same function may be added. Moreover, you may combine each Example of the film for sealing of this invention suitably.

Furthermore, one or two or more arbitrary steps may be added to the electronic component mounting substrate sealing method of the present invention.

Hereinafter, the present invention will be described in detail based on examples, but the present invention is not limited thereto.

Example 1A
<Manufacture of sealing film>
In order to obtain the sealing film, the following resins were prepared as the resins constituting each layer of the sealing film to be formed.

First, an ionomer resin (manufactured by Mitsui DuPont Polychemical, “Himiran 1855”, density 0.940 kg / m ³ , MFR 1.3 g / 10 min (measured at 190 ° C.), melting point 97 ° C.) is used as a resin material constituting the insulating layer 12. Prepared.

In addition, as a resin material included in the electromagnetic wave shielding layer 13, an ionomer resin (manufactured by Mitsui DuPont Polychemical, “Himiran 1855”, density 0.940 kg / m ³ , MFR 1.3 g / 10 min (measured at 190 ° C.), melting point 97 ° C.) Prepared.

Furthermore, spherical particles made of silver (“Ag-XF301”, 50% particle diameter 4 to 7 μm, manufactured by Fukuda Metal Foil Powder Industry) were prepared as conductive particles contained in the electromagnetic wave shielding layer 13.

Next, the insulating layer 12 is formed by an extrusion method using a resin constituting the insulating

layer

12, and 45 parts by weight of the resin material included in the electromagnetic wave shielding layer 13 and 55 parts by weight of the conductive particles are included. The electromagnetic wave shielding layer 13 was applied and formed by a comma coater using the solvent mixture. Next, the insulating film 12 and the electromagnetic wave shielding layer 13 were bonded together by a laminator to form a laminate in which the electromagnetic wave shielding layer 13 / the insulating layer 12 were laminated in this order. Then, the edge part of the insulating layer 12 was removed using the etching method. This obtained the sealing film of Example 1A which consists of a laminated body comprised with the electromagnetic wave shield layer 13 provided with the protrusion part 15 and the insulating layer 12 as shown in FIG.

In addition, the average thickness (μm) of each layer of the obtained sealing film of Example 1A was 100/100 μm in the electromagnetic wave shielding layer 13 / insulating layer 12, and the total thickness was 200 μm. .

The elongation at the softening point of the sealing film of Example 1A was measured and found to be 880%.

Furthermore, when the linear expansion coefficient in the temperature range of 25 degreeC or more and 80 degrees C or less in the film for sealing of Example 1A was measured, it was 51 ppm / K.

<Manufacture of film-coated electronic component mounting substrate for sealing>
First, an optional electronic component mounting substrate is prepared, and then the electronic component mounting substrate and the electronic component are covered in a chamber of a skin pack packaging machine (“HI-750 series” manufactured by Hipack). The sealing film 100 of Example 1A thus obtained was arranged with the insulating layer 2 facing the electronic component mounting substrate 45 side.

Next, the sealing film was heated and softened, and the pressure in the chamber was reduced. In addition, the temperature which heated the film for sealing was 125 degreeC, the pressure of the chamber was 0.4 kPa, and the conditions of this heating and pressure reduction were hold | maintained for 1 minute.

Next, by returning the inside of the chamber to room temperature and normal pressure, the sealing film was cooled and the inside of the chamber was pressurized. Thereby, the film-covered electronic component mounting substrate for sealing of Example 1A in which the substrate and the electronic component were coated with the film for sealing was obtained.

(Example 2A)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 2A were obtained in the same manner as in Example 1A, except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 10 μm.

(Example 3A)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 3A were obtained in the same manner as in Example 1A except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 400 μm.

(Example 4A)
The same as Example 1A except that the resin material contained in the electromagnetic wave shielding layer 13 is 20 parts by weight, the conductive particles are 80 parts by weight, and the average thickness (μm) of the electromagnetic wave shielding layer 13 is 10 μm. Thus, a sealing film of Example 4A and a sealing film-coated electronic component mounting substrate were obtained.

(Example 5A)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 5A were obtained in the same manner as in Example 4A, except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 400 μm.

(Example 6A)
The sealing film and sealing film of Example 6A were the same as Example 1A except that an adhesive resin (“Admer NF536” manufactured by Mitsui Chemicals) was prepared as the resin material included in the electromagnetic wave shielding layer 13. A coated electronic component mounting substrate was obtained.

(Example 7A)
The sealing film and sealing film covering of Example 7A were the same as Example 1A except that an adhesive resin (“Admer NF536” manufactured by Mitsui Chemicals) was prepared as the resin material constituting the insulating layer 12. An electronic component mounting board was obtained.

(Example 8A)
As the resin material constituting the insulating layer 12, a polyolefin resin ( "Noblen FS2011DG2", density 0.900 g / cm ^3, melt index 2.0 g / 10min (230 ° C. Measurement), mp 160 ° C.) was prepared, formed to insulate A sealing film and a sealing film-covered electronic component mounting substrate of Example 8A were obtained in the same manner as in Example 1A, except that the average thickness (μm) of the layer 12 was 50 μm.

(Comparative Example 1A)
As Comparative Example 1A, a commercially available biaxially stretched PET film (manufactured by Toyobo Co., Ltd., brand: E5107) was prepared.

<Evaluation test>
With respect to the sealing film or the film-covered electronic component mounting substrate prepared in each of the examples (Examples 1A to 8A) and the comparative example (Comparative Example 1A), shape followability, wrinkle generation, electromagnetic wave shielding And the conductivity was evaluated. Below, these evaluation methods are demonstrated.

<< Shape followability >>
The shape followability was evaluated as follows.

That is, the sealing film-covered electronic component mounting substrate produced in each Example and Comparative Example was judged based on the following evaluation criteria based on the presence or absence of voids in the coated unevenness. The presence or absence of voids was observed using a microscope.

Each code | symbol is as follows, A and B were set as the pass, and C was set as the failure.
A: Covered in a filled state up to the bottom of the step B: Although a slight gap is formed in the bottom of the step, it is covered in a fully filled state C: Step It is covered with a clear gap formed at the bottom of

<< Wrinkle presence >>
The presence or absence of wrinkles was evaluated as follows.

That is, the sealing film-covered electronic component mounting substrate produced in each Example and Comparative Example was judged based on the following evaluation criteria depending on the presence or absence of wrinkles on the coated top surface. The presence or absence of wrinkles was observed using a microscope.

Each code | symbol is as follows, A was set as the pass and B was set as the failure.
A: No wrinkles are observed on the entire top surface of the sealing film. B: Clear wrinkles are observed at positions corresponding to the convex portions on the top surface of the sealing film.

<< Electromagnetic wave shielding properties >>
The electromagnetic shielding properties were evaluated as follows.

That is, for the sealing films produced in each Example and Comparative Example, the value of the electromagnetic wave shielding effect in the frequency range of 0.001 to 1 GHz was measured using the KEC method (electric field), and the frequency was 0.01 GHz or more. The minimum value of the electromagnetic wave shielding effect within the range of 1 GHz or less was obtained. And the calculated | required minimum value was judged based on the following evaluation criteria.

Each code | symbol is as follows, A was set as the pass and B was set as the failure.
A: The minimum value of the electromagnetic wave shielding effect is 20 dB or more. B: The minimum value of the electromagnetic wave shielding effect is less than 20 dB.

The KEC method is a method for evaluating the shielding effect of electromagnetic waves generated in the near field separately for electric and magnetic fields. Measurements using this method are based on electromagnetic waves transmitted from a transmitting antenna (transmission jig). Can be received by a receiving antenna (receiving jig) through a sheet-like sealing film. In such a KEC method, the receiving antenna passes through the sealing film ( The transmitted electromagnetic wave is measured, that is, how much the transmitted electromagnetic wave (signal) is attenuated on the receiving antenna side by the electromagnetic wave shielding layer.

<< Conductivity >>
The presence or absence of conductivity in the electromagnetic wave shielding layer was evaluated as follows.

That is, the sealing film-covered electronic component mounting substrate produced in each example and comparative example is connected to a power source at the protruding portion provided in the electromagnetic wave shielding layer, and based on the following evaluation criteria depending on whether or not the electronic component is driven. Judged.

Each code | symbol is as follows, A was set as the pass and B was set as the failure.
A: Driving of electronic components is recognized B: Driving of electronic components is not recognized Table 1 shows the results of the evaluation tests of the above examples and comparative examples.

As is clear from Table 1, in the sealing films of Examples 1A to 8A, the elongation at the softening point is 150% or more and 3500% or less, so that the gap at the bottom of the recess, and further the sealing film The generation of wrinkles on the upper surface can be suppressed or prevented, and the electronic component mounting substrate can be coated. Moreover, the electrical continuity between the external power source and the electrode could be confirmed through the protrusion provided in the electromagnetic wave shielding layer.

On the other hand, in the sealing film of Comparative Example 1A, the elongation at the softening point is less than 150%, and due to this, when covering the electronic component mounting substrate with the sealing film, As a result, voids at the bottom and wrinkles on the top surface of the sealing film were clearly generated.

(Example 1B)
<Manufacture of sealing film>
In order to obtain the sealing film, the following resins were prepared as the resins constituting each layer of the sealing film to be formed.

First, as a resin material constituting the insulating layer 12 and the coating layer 14, an ionomer resin (manufactured by Mitsui DuPont Polychemical, “Himiran 1855”, density 0.940 kg / m ³ , MFR 1.3 g / 10 min (measured at 190 ° C.), melting point 97 ° C.) was prepared.

Next, the insulating layer 12 was formed by extrusion molding using a resin constituting the insulating layer 12. Thereafter, the electromagnetic wave shielding layer 13 was formed on the insulating layer 12 by a comma coater using a solvent mixture of 45 parts by weight of the resin material and 55 parts by weight of the conductive particles contained in the electromagnetic wave shielding layer 13. Next, the coating layer 14 is formed on the electromagnetic wave shielding layer 13 by a comma coater using a resin constituting the coating layer 14, and the insulating layer 12, the electromagnetic wave shielding layer 13 and the coating layer 14 are bonded together by a laminator. Thus, after forming a laminated body in which the coating layer 14 / the electromagnetic wave shielding layer 13 / the insulating layer 12 were laminated in this order, the edge of the insulating layer 12 was removed using an etching method. This obtained the sealing film of Example 1B which consists of a laminated body comprised with the insulating layer 12, the electromagnetic wave shield layer 13, and the coating layer 14 provided with the protrusion part 17 as shown in FIG.

The average thickness (μm) of each layer of the sealing film of Example 1B obtained was 50/100/50 μm for the covering layer 14 / electromagnetic wave shielding layer 13 / insulating layer 12, respectively, and the total thickness Is 200 μm, and the length of the protruding portion 17 protruding beyond the end portion of the insulating layer 12 was 2.0 cm.

Further, when the elongation percentage at the softening point of the sealing film of Example 1B was measured, it was 890%.

Furthermore, when the linear expansion coefficient in the temperature range of 25 degreeC or more and 80 degrees C or less in the sealing film of Example 1B was measured, it was 53 ppm / K.

<Manufacture of film-coated electronic component mounting substrate for sealing>
First, an electronic component mounting board having an electronic component mounted on the substrate and electrodes formed on the edge of the lower surface of the substrate is prepared, and then a skin pack packaging machine ("HI-" manufactured by Hipack Co., Ltd.) is prepared. 750 series "), the sealing film 100 of Example 1B obtained so as to cover the electronic component mounting substrate and the electronic component mounting substrate is placed on the electronic component mounting substrate 45 side. Further, the projecting portion 17 was brought into contact with the electrode 3 by folding it into the lower surface side of the substrate 5.

Next, the sealing film was heated and softened, and the pressure in the chamber was reduced. In addition, the temperature which heated the film for sealing was 125 degreeC, the pressure in a chamber was 0.4 kPa, and the conditions of this heating and pressure reduction were hold | maintained for 1 minute.

Next, by returning the inside of the chamber to room temperature and normal pressure, the sealing film was cooled and the inside of the chamber was pressurized. Thus, the sealing film-covered electronic component mounting substrate of Example 1B in which the substrate and the electronic component are covered with the insulating layer included in the sealing film and the electrode is covered with the electromagnetic wave shielding layer included in the sealing film. Obtained.

(Example 2B)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 2B were obtained in the same manner as in Example 1B, except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 10 μm.

(Example 3B)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 3B were obtained in the same manner as in Example 1B except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 400 μm.

(Example 4B)
The same as Example 1B except that the resin material contained in the electromagnetic wave shielding layer 13 is 20 parts by weight, the conductive particles are 80 parts by weight, and the average thickness (μm) of the electromagnetic wave shielding layer 13 is 10 μm. Thus, the sealing film of Example 4B and the sealing film-coated electronic component mounting substrate were obtained.

(Example 5B)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 5B were obtained in the same manner as in Example 4B, except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 400 μm.

(Example 6B)
The sealing film and sealing film of Example 6B were the same as Example 1B except that an adhesive resin (“Admer NF536” manufactured by Mitsui Chemicals) was prepared as the resin material included in the electromagnetic wave shielding layer 13. A coated electronic component mounting substrate was obtained.

(Example 7B)
The sealing film and sealing of Example 7B were the same as Example 1B except that an adhesive resin (“Admer NF536” manufactured by Mitsui Chemicals) was prepared as the resin material constituting the insulating layer 12 and the coating layer 14. A film-coated electronic component mounting substrate for stopping was obtained.

(Example 8B)
A polyolefin resin (“Noblen FS2011DG2”, density 0.900 g / cm ³ , melt index 2.0 g / 10 min (measured at 230 ° C.), melting point 160 ° C.) is prepared as a resin material constituting the insulating layer 12 and the coating layer 14. The sealing film and the sealing film-covered electronic component mounting substrate of Example 8B were the same as Example 1B except that the average thickness (μm) of the insulating layer 12 and the coating layer 14 to be formed was 25 μm. Got.

(Reference Example 1B)
As Reference Example 1B, a commercially available biaxially stretched PET film (manufactured by Toyobo Co., Ltd., brand: E5107) was prepared.

<Evaluation test>
The sealing film produced in each Example (1B to 8B) and Reference Example (Reference Example 1B) or the evaluation method performed on Examples 1A to 8A described above for the sealing film-covered electronic component mounting substrate was used. It was used to evaluate shape followability, the presence or absence of wrinkles, electromagnetic shielding properties and electrical conductivity.
Table 2 shows the results of the evaluation test of each example and reference example.

As is apparent from Table 2, in the sealing films of Examples 1B to 8B, the elongation at the softening point is 150% or more and 3500% or less, so that the gap at the bottom of the recess, and further the sealing film The generation of wrinkles on the upper surface can be suppressed or prevented, and the electronic component mounting substrate can be coated. Moreover, the electrical continuity between the external power source and the electrode could be confirmed through the protrusion provided in the electromagnetic wave shielding layer.

On the other hand, in the sealing film of Reference Example 1B, the elongation at the softening point is less than 150%, and due to this, when covering the electronic component mounting substrate with the sealing film, As a result, voids at the bottom and wrinkles on the top surface of the sealing film were clearly generated.

(Example 1C)
<Manufacture of sealing film>
In order to obtain the sealing film, the following resins were prepared as the resins constituting each layer of the sealing film to be formed.

Next, the insulating layer 12 was formed by extrusion molding using a resin constituting the insulating layer 12. Thereafter, the electromagnetic wave shielding layer is formed such that the protrusion 16 is formed on the insulating layer 12 by a comma coater using a solvent mixture of 45 parts by weight of the resin material and 55 parts by weight of the conductive particles contained in the electromagnetic wave shielding layer 13. 13 was formed by coating. Thereafter, the insulating layer 12 and the electromagnetic wave shielding layer 13 were bonded together using a laminator. Thus, as shown in FIG. 17, the sealing film of Example 1C, which is composed of a laminated body in which the electromagnetic wave shielding layer 13 / insulating layer 12 are laminated in this order and has the protrusions 16 at the edges, was obtained.

In addition, the average thickness (μm) of each layer of the obtained sealing film of Example 1C is 100/100 μm respectively in the electromagnetic wave shielding layer 13 / insulating layer 12, and the total thickness is 200 μm. The length of the protrusion 16 was 2.0 cm.

Moreover, it was 880% when the elongation rate in the softening point of the sealing film of Example 1C was measured.

Furthermore, when the linear expansion coefficient in the temperature range of 25 degreeC or more and 80 degrees C or less in the film for sealing of Example 1C was measured, it was 51 ppm / K.

<Manufacture of film-coated electronic component mounting substrate for sealing>
First, an optional electronic component mounting substrate having electronic components mounted on the substrate is prepared, and then the electronic component mounting substrate is installed in the chamber of the skin pack packaging machine (“HI-750 series” manufactured by Hipack). The sealing film 100 of Example 1C obtained so as to cover the substrate and the electronic component included in is disposed with the insulating layer 12 facing the electronic component mounting substrate 45, and the protrusions 16 are arranged on the substrate 5. It was made to contact the edge part 51 by folding in the lower surface side.

Next, by returning the inside of the chamber to room temperature and normal pressure, the sealing film was cooled and the inside of the chamber was pressurized. Thereby, the board | substrate and the electronic component were coat | covered with the insulating layer 12 with which the film for sealing is equipped, and the film 51 for sealing of Example 1C with which the edge part 51 of the lower surface side of the board | substrate was coat | covered with the folded-out protrusion 16 An electronic component mounting board was obtained.

(Example 2C)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 2C were obtained in the same manner as in Example 1C, except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 10 μm.

(Example 3C)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 3C were obtained in the same manner as in Example 1C, except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 400 μm.

(Example 4C)
The same as Example 1C except that the resin material contained in the electromagnetic wave shielding layer 13 is 20 parts by weight, the conductive particles are 80 parts by weight, and the average thickness (μm) of the electromagnetic wave shielding layer 13 is 10 μm. Thus, the sealing film of Example 4C and the sealing film-coated electronic component mounting substrate were obtained.

(Example 5C)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 5C were obtained in the same manner as in Example 4C, except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 400 μm.

(Example 6C)
The sealing film and the sealing film of Example 6C were the same as Example 1C except that an adhesive resin (“Admer NF536” manufactured by Mitsui Chemicals) was prepared as the resin material included in the electromagnetic wave shielding layer 13. A coated electronic component mounting substrate was obtained.

(Example 7C)
The sealing film and sealing film covering of Example 7C were the same as Example 1C except that an adhesive resin (“Admer NF536” manufactured by Mitsui Chemicals) was prepared as the resin material constituting the insulating layer 12. An electronic component mounting board was obtained.

(Example 8C)
As a resin material constituting the insulating layer 12, a polyolefin resin (“Noblen FS2011DG2”, density 0.900 g / cm ³ , melt index 2.0 g / 10 min (230 ° C. measurement), melting point 160 ° C.) is prepared and formed. A sealing film and a sealing film-covered electronic component mounting substrate of Example 8C were obtained in the same manner as in Example 1C except that the average thickness (μm) of the layer 12 was 50 μm.

(Example 9C)
Except that the sealing film was manufactured as described below, the laminated protrusions in which the substrate and the electronic component were covered with the insulating layer 12 included in the sealing film and folded in the same manner as in Example 1C. The sealing film-covered electronic component mounting substrate of Example 9C in which the lower end 51 of the substrate was covered with 65 was obtained.

<Manufacture of sealing film>
In order to obtain the sealing film, the following resins were prepared as the resins constituting each layer of the sealing film to be formed.

First, a polyolefin resin (“Noblen FS2011DG2”, density 0.900 g / cm ³ , melt index 2.0 g / 10 min (230 ° C. measurement), melting point 160 ° C.) is used as a resin material constituting the insulating layer 12 and the coating layer 14. Prepared.

Next, the insulating layer 12 was formed by extrusion molding using a resin constituting the insulating layer 12. Thereafter, the electromagnetic wave is applied so that the protrusion 16 is formed on the insulating layer 12 by a comma coater using a solvent mixture of 45 parts by weight of the resin material contained in the electromagnetic wave shielding layer 13 and 55 parts by weight of the conductive particles. The shield layer 13 was formed by coating. Further, the coating layer 14 is applied and formed on the electromagnetic wave shielding layer 13 by a comma coater using a resin constituting the coating layer 14 so that the protruding portion 15 is formed, and the insulating layer 12 and the electromagnetic wave shielding layer are formed. 13 and the coating layer 14 were bonded together using a laminator. Thus, as shown in FIG. 21, the sealing film of Example 9C, which is composed of a laminated body in which the coating layer 14 / electromagnetic wave shielding layer 13 / insulating layer 12 are laminated in this order, and has the laminated protrusion 65 at the edge portion. Got.

The average thickness (μm) of each layer of the sealing film of Example 9C obtained was 50/100/50 μm for the covering layer 14 / electromagnetic wave shielding layer 13 / insulating layer 12, respectively, and the total thickness Was 200 μm, and the length of the laminated protrusion 65 was 2.0 cm.

Further, when the elongation percentage at the softening point of the sealing film of Example 9C was measured, it was 3400%.

Furthermore, when the linear expansion coefficient in the temperature range of 25 ° C. or higher and 80 ° C. or lower in the sealing film of Example 9C was measured, it was 6 ppm / K.

(Comparative Example 1C)
As Comparative Example 1C, a commercially available biaxially stretched PET film (manufactured by Toyobo Co., Ltd., brand: E5107) was prepared.

<Evaluation test>
Evaluation performed on the above-described Examples 1A to 8A for the sealing film or the film-coated electronic component mounting substrate prepared in each Example (Examples 1C to 9C) and Comparative Example (Comparative Example 1C) The method was used to evaluate shape followability, the presence or absence of wrinkles, and electromagnetic shielding properties. Moreover, about the sealing film produced by each Example and the comparative example or the film covering electronic component mounting board | substrate for sealing, edge part coverage was evaluated using the following evaluation methods.

<< End coverage >>
The end coverage (shape followability) was evaluated as follows.

That is, the sealing film-covered electronic component mounting substrate produced in each Example and Comparative Example was judged based on the following evaluation criteria, depending on whether or not there was peeling at the end of the lower surface of the substrate by the laminated protrusions. . In addition, the presence or absence of peeling was observed using a microscope.

Each code | symbol is as follows, A was set as the pass and B was set as the failure.
A: No peeling of the laminate protrusion at the end of the lower surface B: No peeling of the laminate protrusion at the end of the lower surface Table 3 shows the results of the evaluation tests of the examples and reference examples.

As is clear from Table 3, in the sealing films of Examples 1C to 9C, the elongation at the softening point was 150% or more and 3500% or less, so that the voids at the bottom of the recesses, and further the sealing film The generation of wrinkles on the upper surface can be suppressed or prevented, and the electronic component mounting substrate can be coated. Further, by folding the laminated protrusion, it was possible to cover the end portion of the lower surface of the substrate with the laminated protrusion.

On the other hand, in the sealing film of Comparative Example 1C, the elongation at the softening point is less than 150%, and due to this, when covering the electronic component mounting substrate with the sealing film, As a result, gaps at the bottom, wrinkles on the top surface of the sealing film, and separation between the laminated protrusion and the end of the bottom surface of the substrate were clearly generated.

(Example 1D)
<Manufacture of sealing film>
In order to obtain the sealing film, the following resins were prepared as the resins constituting each layer of the sealing film to be formed.

First, as a resin material constituting the insulating layer (innermost layer) 12, an ionomer resin (manufactured by Mitsui DuPont Polychemicals, “Himiran 1855”, density 0.940 kg / m ³ , MFR 1.3 g / 10 min (measured at 190 ° C.), melting point 97 ° C.) was prepared.

Next, the insulating layer 12 was formed by extrusion molding using a resin constituting the insulating layer 12. Thereafter, the electromagnetic wave shielding layer 13 was applied and formed on the insulating layer 12 by a comma coater using a solvent mixture of 45 parts by weight of the resin material contained in the electromagnetic wave shielding layer 13 and 55 parts by weight of the conductive particles. Next, the insulating layer 12 and the electromagnetic wave shielding layer 13 are bonded together by a laminator to form a laminated body in which the insulating layer 12 / the electromagnetic wave shielding layer 13 are laminated in this order, and then the end of the laminated body is cut off. Then, the relief portion 27 was formed, and then the edge portion of the insulating layer 12 was removed using an etching method. As a result, as shown in FIG. 41, the sealing film of Example 1D, which is composed of the insulating layer 12 including the protruding portion 17 and the electromagnetic wave shielding layer 13 and is formed of a laminate having the escape portion 27, was obtained.

In addition, the average thickness (μm) of each layer of the obtained sealing film of Example 1D is 100/100 μm respectively in the electromagnetic wave shielding layer 13 / insulating layer 12, and the total thickness is 200 μm. The length of the protruding portion 17 protruding beyond the end portion of the insulating layer 12 was 2.0 cm.

Further, the elongation at the softening point of the sealing film of Example 1D was measured and found to be 880%.

Furthermore, when the linear expansion coefficient in the temperature range of 25 degreeC or more and 80 degrees C or less in the film for sealing of Example 1D was measured, it was 51 ppm / K.

<Manufacture of film-coated electronic component mounting substrate for sealing>
First, an electronic component is mounted on the central portion of the substrate, a connection member is mounted on the edge portion thereof, and an arbitrary electronic component mounting substrate having electrodes formed on the edge portion of the lower surface of the substrate is prepared, Thereafter, in the chamber of the skin pack packaging machine (“HI-750 series” manufactured by Hipack Co., Ltd.), the electronic component mounting substrate and the electronic component are covered, and the connection member is exposed from the escape portion. The sealing film 100 of Example 1D formed in the above is disposed with the insulating layer 12 facing the electronic component mounting substrate 45 side, and the protruding portion 17 is further folded into the lower surface side of the substrate 5 to contact the electrode 3 I let you.

Next, by returning the inside of the chamber to room temperature and normal pressure, the sealing film was cooled and the inside of the chamber was pressurized. In this way, with the connecting member exposed from the escape portion, the substrate and the electronic component are covered with the insulating layer provided in the sealing film, and the electrode is further covered with the electromagnetic wave shielding layer provided in the sealing film. A film-coated electronic component mounting substrate for sealing of Example 1D was obtained.

(Example 2D)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 2D were obtained in the same manner as in Example 1D, except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 10 μm.

Example 3D
A sealing film and a sealing film-covered electronic component mounting substrate of Example 3D were obtained in the same manner as in Example 1D except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 400 μm.

(Example 4D)
The same as Example 1D except that the resin material contained in the electromagnetic wave shielding layer 13 is 20 parts by weight, the conductive particles are 80 parts by weight, and the average thickness (μm) of the electromagnetic wave shielding layer 13 is 10 μm. Thus, the sealing film of Example 4D and the sealing film-coated electronic component mounting substrate were obtained.

(Example 5D)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 5D were obtained in the same manner as in Example 4D except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 400 μm.

(Example 6D)
The sealing film and sealing film of Example 6D were the same as Example 1D except that an adhesive resin (“Admer NF536” manufactured by Mitsui Chemicals) was prepared as the resin material included in the electromagnetic wave shielding layer 13. A coated electronic component mounting substrate was obtained.

(Example 7)
The sealing film and sealing film covering of Example 7D were the same as Example 1D except that an adhesive resin (“Admer NF536” manufactured by Mitsui Chemicals) was prepared as the resin material constituting the insulating layer 12. An electronic component mounting board was obtained.

(Example 8)
As a resin material constituting the insulating layer 12, a polyolefin resin (“Noblen FS2011DG2”, density 0.900 g / cm ³ , melt index 2.0 g / 10 min (230 ° C. measurement), melting point 160 ° C.) is prepared and formed. A sealing film and a sealing film-covered electronic component mounting substrate of Example 8D were obtained in the same manner as in Example 1D except that the average thickness (μm) of the layer 12 was 50 μm.

(Example 9D)
Except that the sealing film was manufactured as follows, the insulating layer provided in the sealing film on the substrate and the electronic component with the connecting member exposed from the escape portion in the same manner as in Example 1D In addition, the sealing film-covered electronic component mounting substrate of Example 9D in which the electrode was covered with the electromagnetic wave shielding layer included in the sealing film was obtained.

First, as a resin material constituting the insulating layer 12 and the coating layer (outermost layer) 14, polyolefin resin (“Noblen FS2011DG2”, density 0.900 g / cm ³ , melt index 2.0 g / 10 min (230 ° C. measurement), melting point 160 ° C.).

Next, the insulating layer 12 was formed by extrusion molding using a resin constituting the insulating layer 12. Thereafter, the electromagnetic wave shielding layer 13 was applied and formed on the insulating layer 12 by a comma coater using a solvent mixture of 45 parts by weight of the resin material contained in the electromagnetic wave shielding layer 13 and 55 parts by weight of the conductive particles. Further, the coating layer 14 was formed on the electromagnetic wave shielding layer 13 by a comma coater using a resin constituting the coating layer 14. Thereafter, the insulating layer 12, the electromagnetic wave shielding layer 13 and the covering layer 14 are bonded together with a laminator to form a laminated body in which the covering layer 14 / the electromagnetic wave shielding layer 13 / the insulating layer 12 are laminated in this order. The end portion of the insulating layer 12 was cut off to form the escape portion 27, and then the edge portion of the insulating layer 12 was removed using an etching method. Thus, as shown in FIG. 39, the sealing film of Example 9D composed of the insulating layer 12 including the projecting portion 17, the electromagnetic wave shielding layer 13, and the covering layer 14 and including the laminate having the escape portion 27 is formed. Obtained.

The average thickness (μm) of each layer of the sealing film of Example 9D obtained was 50/100/50 μm for the insulating layer 12 / electromagnetic wave shield layer 13 / covering layer 14 respectively, and the total thickness. Is 200 μm, and the length of the protruding portion 17 protruding beyond the end portion of the insulating layer 12 was 2.0 cm.

Further, when the elongation percentage at the softening point of the sealing film of Example 9D was measured, it was 3400%.

Furthermore, when the linear expansion coefficient in the temperature range of 25 ° C. or higher and 80 ° C. or lower in the sealing film of Example 9D was measured, it was 6 ppm / K.

(Reference Example 1D)
As Reference Example 1D, a commercially available biaxially stretched PET film (manufactured by Toyobo Co., Ltd., brand: E5107) was prepared.

<Evaluation test>
Evaluation performed on the above-described Examples 1A to 8A for the sealing film or the film-coated electronic component mounting substrate prepared in each Example (Examples 1D to 9D) and Reference Example (Reference Example 1D) Using the method, shape followability, presence / absence of wrinkles, electromagnetic shielding properties and conductivity were evaluated.
Table 4 shows the results of the evaluation tests of the examples and reference examples.

As is apparent from Table 4, in the sealing films of Examples 1D to 9D, the elongation at the softening point is 150% or more and 3500% or less, so that the gap at the bottom of the recess, and further the sealing film The generation of wrinkles on the upper surface can be suppressed or prevented, and the electronic component mounting substrate can be coated. Moreover, the electrical continuity between the external power source and the electrode could be confirmed through the protrusion provided in the electromagnetic wave shielding layer.

On the other hand, in the sealing film of Reference Example 1D, the elongation at the softening point is less than 150%, and due to this, when covering the electronic component mounting substrate with the sealing film, As a result, voids at the bottom and wrinkles on the top surface of the sealing film were clearly generated.

(Example 1E)
<Manufacture of sealing film>
In order to obtain the sealing film, the following resins were prepared as the resins constituting each layer of the sealing film to be formed.

Next, the insulating layer 12 was formed by extrusion molding using a resin constituting the insulating layer 12. In addition, the electromagnetic wave shielding layer 13 was formed by coating with a comma coater using a solvent mixture of 45 parts by weight of the resin material contained in the electromagnetic wave shielding layer 13 and 55 parts by weight of the conductive particles. Then, the laminated body laminated | stacked in order of the electromagnetic wave shielding layer 13 / insulating layer 12 was formed by bonding the said insulating layer 12 and the said electromagnetic wave shielding layer 13 with a laminator. Then, the edge part of the insulating layer 12 was removed using the etching method. This obtained the sealing film of Example 1E which consists of a laminated body comprised with the electromagnetic wave shielding layer 13 provided with the protrusion part 15 and the insulating layer 12 as shown in FIG.

In addition, the average thickness (μm) of each layer of the obtained sealing film of Example 1E is 100/100 μm respectively in the electromagnetic wave shielding layer 13 / insulating layer 12, and the total thickness is 200 μm. The length of the protruding portion 15 protruding beyond the end portion of the insulating layer 12 was 2.0 cm.

Further, the elongation at the softening point of the sealing film of Example 1E was measured and found to be 880%.

Furthermore, when the linear expansion coefficient in the temperature range of 25 degreeC or more and 80 degrees C or less in the film for sealing of Example 1E was measured, it was 51 ppm / K.

<Manufacture of film-coated electronic component mounting substrate for sealing>
First, an electronic component mounting board having an electronic component mounted on the substrate and electrodes formed on the edge of the lower surface of the substrate is prepared, and then a skin pack packaging machine ("HI-" manufactured by Hipack Co., Ltd.) is prepared. 750 series "), the sealing film 100 of Example 1E obtained so as to cover the electronic component mounting substrate and the electronic component mounting substrate is placed on the electronic component mounting substrate 45 side. Furthermore, the protrusion 15 was brought into contact with the electrode 3 by folding it into the lower surface side of the substrate 5.

Next, by returning the inside of the chamber to room temperature and normal pressure, the sealing film was cooled and the inside of the chamber was pressurized. Thereby, the board | substrate and electronic component were coat | covered with the insulating layer with which the film for sealing is equipped, and the film was covered with the electromagnetic wave shielding layer with which the film for sealing was equipped with the film-coated electronic component mounting board for Example 1E Got.

(Example 2E)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 2E were obtained in the same manner as in Example 1E, except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 10 μm.

(Example 3E)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 3E were obtained in the same manner as in Example 1E except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 400 μm.

(Example 4E)
The same as Example 1E except that the resin material contained in the electromagnetic wave shielding layer 13 is 20 parts by weight, the conductive particles are 80 parts by weight, and the average thickness (μm) of the electromagnetic wave shielding layer 13 is 10 μm. Thus, the sealing film of Example 4E and the sealing film-coated electronic component mounting substrate were obtained.

(Example 5E)
A sealing film and a sealing film-covered electronic component mounting substrate of Example 5E were obtained in the same manner as in Example 4E except that the average thickness (μm) of the electromagnetic wave shielding layer 13 was 400 μm.

(Example 6E)
The sealing film and sealing film of Example 6E were the same as Example 1E except that an adhesive resin (“Admer NF536” manufactured by Mitsui Chemicals) was prepared as the resin material contained in the electromagnetic wave shielding layer 13. A coated electronic component mounting substrate was obtained.

(Example 7E)
The sealing film and sealing film covering of Example 7E were prepared in the same manner as in Example 1E except that an adhesive resin (“Admer NF536” manufactured by Mitsui Chemicals) was prepared as the resin material constituting the insulating layer 12. An electronic component mounting board was obtained.

(Example 8E)
As a resin material constituting the insulating layer 12, a polyolefin resin (“Noblen FS2011DG2”, density 0.900 g / cm ³ , melt index 2.0 g / 10 min (230 ° C. measurement), melting point 160 ° C.) is prepared and formed. A sealing film and a sealing film-covered electronic component mounting substrate of Example 8E were obtained in the same manner as in Example 1E except that the average thickness (μm) of the layer 12 was 50 μm.

(Reference Example 1E)
As Reference Example 1E, a commercially available biaxially stretched PET film (manufactured by Toyobo Co., Ltd., brand: E5107) was prepared.

<Evaluation test>
Evaluations performed on the above-described Examples 1A to 8A for the sealing film or the film-coated electronic component mounting substrate prepared in each Example (Examples 1E to 8E) and Reference Example (Reference Example 1E) Using the method, shape followability, presence / absence of wrinkles, electromagnetic shielding properties and conductivity were evaluated.
Table 5 shows the results of the evaluation tests of the examples and reference examples.

As is clear from Table 5, in the sealing films of Examples 1E to 8E, the elongation at the softening point was 150% or more and 3500% or less, so that the gap at the bottom of the recess, and further the sealing film The generation of wrinkles on the upper surface can be suppressed or prevented, and the electronic component mounting substrate can be coated. Moreover, the electrical continuity between the external power source and the electrode could be confirmed through the protrusion provided in the electromagnetic wave shielding layer.

On the other hand, in the sealing film of the reference example, the elongation at the softening point is less than 150%, and due to this, when the electronic component mounting substrate is covered with the sealing film, the bottom of the recess As a result, the voids and wrinkles on the upper surface of the sealing film were clearly generated.

According to the present invention, the sealing film is composed mainly of a resin material, and the elongation rate of the sealing film at the softening point required in accordance with JIS K 6251 is 150% or more and 3500% or less. . First, the sealing film is placed on the electronic component mounting substrate so as to cover the substrate and the electronic component. Thereafter, the sealing film is heated and softened, and the pressure is reduced. Thereafter, the sealing film is cooled and pressurized. Through the above steps, the sealing film covers the substrate and the electronic component in a state of sealing with excellent followability with respect to the unevenness formed by mounting the electronic component on the substrate. be able to. Therefore, in the sealing film-covered electronic component mounting substrate obtained by coating this sealing film, the electronic component (particularly, the electronic component) is accurately suppressed from coming into contact with external factors such as moisture and dust. Or it can be prevented. Further, when the substrate and the electronic component are covered with the sealing film, the electronic component is sealed with the electromagnetic wave shielding layer through the insulating layer, so that the obtained sealing film-covered electronic component mounting substrate is obtained. In this case, the influence of noise due to electromagnetic waves on the electronic component is appropriately suppressed or prevented. Therefore, the present invention has industrial applicability.

Claims

A sealing film used for sealing an electronic component mounting substrate comprising a substrate and an electronic component mounted on one surface side of the substrate,
Having an insulating layer and an electromagnetic wave shielding layer laminated on one side of the insulating layer;
Both the insulating layer and the electromagnetic wave shielding layer contain a resin material, and the sealing film has an elongation at a softening point required in accordance with JIS K 6251 of 150% or more and 3500% or less. A film for sealing.
The electronic component mounting substrate further includes an electrode provided on one surface side of the substrate and electrically connected to the electronic component,
The sealing film according to claim 1, wherein the electromagnetic wave shielding layer includes a protruding portion that protrudes beyond an end portion of the insulating layer.
The sealing film according to claim 2, wherein the protruding portion is formed corresponding to the electrode and contacts the electrode when the electronic component mounting substrate is sealed.
The sealing film according to claim 2 or 3, wherein the electrode is provided at an edge of the substrate or around an electronic component.
The sealing film according to any one of claims 2 to 4, wherein the electrode is a ground electrode.
The sealing film further includes a coating layer laminated on the side opposite to the insulating layer of the electromagnetic wave shielding layer,
The sealing film according to claim 1, wherein the electronic component mounting substrate is sealed with the insulating layer on one surface side of the substrate.
The covering layer includes a first protruding portion protruding beyond the end portion of the electromagnetic wave shielding layer, and when sealing the electronic component mounting substrate from one surface side of the substrate, the first protruding portion is The sealing film according to claim 6, configured to cover the other surface side of the substrate by being folded on the other surface side of the substrate.
The electronic component mounting substrate further includes an electrode provided on one surface side of the substrate and electrically connected to the electronic component,
The electromagnetic wave shielding layer includes a second protruding portion that protrudes beyond an end portion of the insulating layer, and when the electronic component mounting substrate is sealed from one surface side of the substrate, the second protruding portion is The sealing film according to claim 6, wherein the sealing film is configured to come into contact with the electrode on one surface side of the substrate.
The electronic component mounting substrate further includes an electrode provided on the other surface side of the substrate and electrically connected to the electronic component,
The electromagnetic wave shielding layer includes a second protruding portion that protrudes beyond an end portion of the insulating layer, and when the electronic component mounting substrate is sealed from one surface side of the substrate, the second protruding portion is The sealing film according to claim 6, wherein the sealing film is configured to be in contact with the electrode on the other surface side of the substrate by being folded on the other surface side of the substrate.
The insulating layer protrudes beyond an end portion of the electromagnetic wave shielding layer, and includes a third protruding portion stacked in contact with the first protruding portion, and the electronic component mounting substrate is provided from one surface side of the substrate. When sealing, the first protrusion and the third protrusion are folded to the other surface side of the substrate so that the third protrusion contacts the other surface side of the substrate. The sealing film according to claim 7 configured to cover.
The electronic component mounting substrate further includes an electrode provided on one surface side of the substrate and electrically connected to the electronic component,
The electromagnetic wave shielding layer includes a fourth projecting portion projecting beyond the end portion of the coating layer, and when sealing the electronic component mounting substrate from one surface side of the substrate, the fourth projecting portion is The sealing film according to claim 6, wherein the sealing film is configured to be in contact with the electrode on one surface side of the substrate by being folded on one surface side of the substrate.
The sealing film according to claim 1, wherein the insulating layer includes a protruding portion that protrudes beyond an end portion of the electromagnetic wave shielding layer.
The sealing film according to claim 12, wherein the electromagnetic wave shielding layer is selectively formed at a position corresponding to the electronic component.
The protruding portion is configured to cover the other surface side of the substrate by being folded to the other surface side of the substrate when the electronic component mounting substrate is sealed from the one surface side of the substrate. The film for sealing according to claim 12 or 13 which is made.
The electronic component mounting substrate further includes a connection member having an open end surface and electrically connected to the electronic component,
The said film for sealing is a film for sealing of Claim 1 which has an escape part in the position corresponding to the said connection member, when sealing the said electronic component mounting board | substrate.
The sealing film according to claim 15, wherein the resin material constituting the insulating layer and the electromagnetic wave shielding layer is a thermoplastic resin.
The electronic component mounting substrate further includes an electrode provided on the other surface side of the substrate and electrically connected to the electronic component,
The electromagnetic wave shielding layer includes a protruding portion that protrudes beyond the end portion of the insulating layer, and when the electronic component mounting substrate is sealed from one surface side of the substrate, the protruding portion is formed on the substrate. The sealing film according to claim 1, wherein the sealing film is configured to be in contact with the electrode by being folded to the other surface side.
The sealing film according to claim 17, wherein the electrode is provided on an edge of the substrate.
The sealing film according to claim 17 or 18, wherein the electrode is a ground electrode.
The sealing film according to any one of claims 1 to 19, wherein the sealing film has a linear expansion coefficient of 100 ppm / K or less in a temperature range of 25 ° C to 80 ° C.
The sealing film according to any one of claims 1 to 20, wherein at least one of the insulating layer and the electromagnetic wave shielding layer contains a polyolefin resin as the resin material.
The sealing film according to any one of claims 1 to 21, wherein the sealing film has an average thickness of 10 µm to 700 µm.
The sealing film according to any one of claims 1 to 22, wherein the substrate is a printed wiring board.
A sealing method of an electronic component mounting substrate for sealing the substrate, the electronic component, and the electrode using the sealing film according to any one of claims 2 to 5,
Placing the sealing film on the electronic component mounting substrate with the insulating layer facing the electronic component mounting substrate so as to cover the substrate, the electronic component, and the electrode;
Heating and softening the sealing film, and depressurizing;
The step of sealing the substrate, the electronic component, and the electrode with the sealing film in a state where the protruding portion is in contact with the electrode by cooling and pressurizing the sealing film. A method for sealing an electronic component mounting substrate, comprising:
A sealing method of an electronic component mounting substrate for sealing the substrate and the electronic component using the sealing film according to any one of claims 6 to 11,
Disposing the sealing film on the electronic component mounting substrate with the insulating layer facing the electronic component mounting substrate so as to cover the substrate and the electronic component;
Heating and softening the sealing film, and depressurizing;
A method for sealing an electronic component mounting substrate, comprising: cooling the sealing film and applying pressure to seal the substrate and the electronic component with the sealing film.
A sealing method for an electronic component mounting substrate for sealing the substrate and the electronic component using the sealing film according to any one of claims 12 to 14,
Disposing the sealing film on the electronic component mounting substrate with the insulating layer facing the electronic component mounting substrate so as to cover the substrate and the electronic component;
Heating and softening the sealing film, and depressurizing;
By cooling and pressurizing the sealing film, the substrate and the electronic component are sealed with the sealing film while the electronic component is covered with the electromagnetic wave shielding layer through the insulating layer. And a step of stopping the electronic component mounting substrate.
An electronic component mounting substrate sealing method for sealing the substrate and the electronic component using the sealing film according to claim 15 or 16,
A step of covering the substrate and the electronic component and disposing the sealing film on the electronic component mounting substrate so that the escape portion corresponds to the connection member;
Heating and softening the sealing film, and depressurizing;
A step of sealing the substrate and the electronic component with the sealing film without sealing the connecting member by cooling and pressurizing the sealing film. An electronic component mounting substrate sealing method.
An electronic component mounting substrate sealing method for sealing the substrate, the electronic component, and the electrode using the sealing film according to any one of claims 17 to 19,
The projecting portion is placed on the other side of the substrate while the sealing film is disposed on the electronic component mounting substrate with the insulating layer facing the electronic component mounting substrate so as to cover the substrate and the electronic component. The step of contacting the electrode by folding it to the surface side of
Heating and softening the sealing film, and depressurizing;
The step of sealing the substrate, the electronic component, and the electrode with the sealing film in a state where the protruding portion is in contact with the electrode by cooling and pressurizing the sealing film. A method for sealing an electronic component mounting substrate, comprising:
24. The sealing film according to claim 1, and the electronic component mounting substrate including the substrate covered with the sealing film, the electronic component, and the electrode, The film-covered electronic component mounting substrate for sealing, wherein the protrusion is in contact with the electrode.