JP7077400B2 - Manufacturing method of printed circuit board covered with protective film - Google Patents

Description

The present invention relates to a printed circuit board coated with a protective film and a method for manufacturing the same.

Japanese Unexamined Patent Publication No. 2015-129906 (Patent Document 1) discloses a method for protecting a circuit board by sealing the circuit board with a film. The circuit board protection method disclosed in Patent Document 1 includes a step of connecting a wire rod to a connection portion of the circuit board, a step of sealing the circuit board and the end portion of the wire rod with a film, and a film at the end portion of the wire rod. It is provided with a step of removing. The film has an adhesive layer on the side facing the circuit board.

JP-A-2015-129906

An object of the present invention is to provide a printed circuit board coated with a highly reliable protective film and a method for manufacturing the same.

The printed circuit board covered with the protective film of the present invention includes a printed circuit board and a protective film. The printed circuit board includes a first main surface. The first main surface includes a first region in which connection terminals are provided and a second region in which electronic components are provided. The protective film is in close contact with the second region of the printed circuit board and the electronic component via the adhesive layer. The first region is exposed from the protective film and the adhesive layer.

The method for manufacturing a printed circuit board coated with a protective film according to a first aspect of the present invention comprises supplying a release film and a protective film above the first main surface of the printed circuit board. The first main surface of the printed circuit board includes a first region provided with connection terminals and a second region provided with electronic components. The protective film includes a second main surface facing the first main surface. The protective film includes a first portion and a second portion. The first portion of the protective film faces the first region of the printed circuit board. The second portion of the protective film faces the second region of the printed circuit board. The protective film includes an adhesive layer provided on the second main surface. The adhesive layer is provided on the first and second portions of the protective film. The release film is selectively supplied between the first region of the printed circuit board and the adhesive layer on the first portion of the protective film. The method for manufacturing a printed circuit board coated with the protective film of the first aspect of the present invention further comprises laminating the first region and the second region of the printed circuit board with the protective film. The first area of the printed circuit board is covered with the first part of the protective film via the release film and the adhesive layer on the first part of the protective film. The second portion of the protective film is in close contact with the second region of the printed circuit board and the electronic components via the adhesive layer on the second portion. In the method for manufacturing a printed circuit board covered with a protective film according to the first aspect of the present invention, a first portion of the protective film and a release film and an adhesive layer on the first portion are formed in a first region of the printed circuit board. Prepare to remove from.

The method for manufacturing a printed circuit board coated with the protective film of the second aspect of the present invention comprises supplying the protective film above the first main surface of the printed circuit board. The first main surface of the printed circuit board includes a first region provided with connection terminals and a second region provided with electronic components. The protective film includes a second main surface facing the first main surface. The protective film includes a first portion and a second portion. The first portion of the protective film faces the first region. The second portion of the protective film faces the second region. The protective film includes an adhesive layer provided on the second main surface. The adhesive layer is provided on the first and second portions of the protective film. In the method for manufacturing a printed circuit board coated with the protective film of the second aspect of the present invention, the adhesive layer on the first portion of the protective film is selectively irradiated with light to cover the first portion of the protective film. It comprises converting an adhesive layer into a cured portion. The hardened part has lost its adhesiveness. The method for manufacturing a printed circuit board coated with the protective film of the second aspect of the present invention comprises laminating the first region and the second region of the printed circuit board with the protective film. The first region of the printed circuit board is covered with the first portion of the protective film via the cured portion. The second portion of the protective film is in close contact with the second region of the printed circuit board and the electronic components via the adhesive layer on the second portion. The method for manufacturing a printed circuit board coated with the protective film of the second aspect of the present invention comprises removing the cured portion and the first portion of the protective film from the first region of the printed circuit board.

The protective film is attached to the second region of the printed circuit board and the electronic component via the adhesive layer. On the other hand, the protective film is not attached to the first region of the printed circuit board. The first portion of the protective film can be easily removed from the first region. No residue of the adhesive layer adheres to the connection terminals. When the protective film is removed from the printed circuit board, destruction of the connection terminals and poor electrical contact at the connection terminals can be prevented. Therefore, a printed circuit board coated with a protective film having high reliability can be provided.

It is a schematic plan view of the printed circuit board covered with the protective film of Embodiment 1 to Embodiment 3. It is a schematic plan view which shows one step of the manufacturing method of the printed circuit board coated with the protective film of Embodiment 1. FIG. It is a schematic plan view which shows the next process of the process shown in FIG. 2 in the manufacturing method of the printed circuit board coated with the protective film of Embodiment 1. FIG. FIG. 5 is a schematic cross-sectional view taken along the cross-sectional line IV-IV of the process shown in FIG. 3 in the method for manufacturing a printed circuit board coated with the protective film of the first embodiment. FIG. 5 is a schematic cross-sectional view taken along the cross-sectional line VV of the process shown in FIG. 3 in the method for manufacturing a printed circuit board coated with the protective film of the first embodiment. It is the schematic sectional drawing of the protective film used in the manufacturing method of the printed circuit board coated with the protective film of Embodiment 1. FIG. It is a schematic plan view which shows the next process of the process shown in FIGS. 3 to 5 in the manufacturing method of the printed circuit board coated with the protective film of Embodiment 1. FIG. FIG. 5 is a schematic cross-sectional view taken along the cross-sectional line VIII-VIII of the process shown in FIG. 7 in the method for manufacturing a printed circuit board coated with the protective film of the first embodiment. FIG. 5 is a schematic cross-sectional view taken along the cross-sectional line IX-IX of the process shown in FIG. 7 in the method for manufacturing a printed circuit board coated with the protective film of the first embodiment. FIG. 5 is a schematic cross-sectional view showing a next step of the steps shown in FIGS. 7 to 9 in the method of manufacturing a printed circuit board coated with a protective film according to the first embodiment. FIG. 5 is a schematic cross-sectional view showing a next step of the steps shown in FIGS. 7 to 9 in the method of manufacturing a printed circuit board coated with a protective film according to the first embodiment. FIG. 3 is a schematic cross-sectional view showing a next step of the steps shown in FIGS. 10 and 11 in the method of manufacturing a printed circuit board coated with a protective film according to the first embodiment. FIG. 3 is a schematic cross-sectional view showing a next step of the steps shown in FIGS. 10 and 11 in the method of manufacturing a printed circuit board coated with a protective film according to the first embodiment. FIG. 3 is a schematic plan view showing the next step of the steps shown in FIGS. 12 and 13 in the method for manufacturing a printed circuit board coated with the protective film of the first embodiment. It is the schematic sectional drawing of the protective film used in the manufacturing method of the printed circuit board coated with the protective film of Embodiment 2. FIG. It is a schematic plan view which shows one step of the manufacturing method of the printed circuit board coated with the protective film of Embodiment 3. FIG. FIG. 5 is a schematic cross-sectional view taken along the cross-sectional line XVII-XVII of the process shown in FIG. 16 in the method for manufacturing a printed circuit board coated with the protective film of the third embodiment. FIG. 5 is a schematic cross-sectional view taken along the cross-sectional line XVIII-XVIII of the process shown in FIG. 16 in the method for manufacturing a printed circuit board coated with the protective film of the third embodiment. It is the schematic sectional drawing of the protective film used in the manufacturing method of the printed circuit board coated with the protective film of Embodiment 2. FIG. FIG. 3 is a schematic plan view showing the next step of the steps shown in FIGS. 16 to 18 in the method for manufacturing a printed circuit board coated with the protective film of the third embodiment. FIG. 5 is a schematic cross-sectional view taken along the cross-sectional line XXI-XXI of the process shown in FIG. 20 in the method for manufacturing a printed circuit board coated with the protective film of the third embodiment. 20 is a schematic plan view showing the next step of the steps shown in FIGS. 20 and 21 in the method of manufacturing a printed circuit board coated with the protective film of the third embodiment. FIG. 5 is a schematic cross-sectional view taken along the cross-sectional line XXIII-XXIII of the process shown in FIG. 22 in the method for manufacturing a printed circuit board coated with the protective film of the third embodiment. FIG. 5 is a schematic cross-sectional view taken along the cross-sectional line XXIV-XXIV of the process shown in FIG. 22 in the method for manufacturing a printed circuit board coated with the protective film of the third embodiment. It is a schematic plan view which shows the next process of the process shown in FIGS. 22 to 24 in the manufacturing method of the printed circuit board coated with the protective film of Embodiment 3. FIG. It is a schematic plan view of the printed circuit board covered with the protective film of Embodiment 4. FIG. It is a schematic plan view which shows one step of the manufacturing method of the printed circuit board coated with the protective film of Embodiment 4. It is the schematic sectional drawing of the protective film used in the manufacturing method of the printed circuit board coated with the protective film of Embodiment 4. It is a schematic plan view which shows one step of the manufacturing method of the printed circuit board coated with the protective film of Embodiment 4. It is the schematic sectional drawing of the protective film used in the manufacturing method of the printed circuit board coated with the protective film of Embodiment 5. It is a schematic plan view which shows one step of the manufacturing method of the printed circuit board coated with the protective film of Embodiment 5. FIG. 3 is a schematic cross-sectional view taken along the cross-sectional line XXXII-XXXII of the process shown in FIG. 31 in the method for manufacturing a printed circuit board coated with the protective film of the fifth embodiment. FIG. 3 is a schematic cross-sectional view taken along the cross-sectional line XXXIII-XXXIII of the process shown in FIG. 31 in the method for manufacturing a printed circuit board coated with the protective film of the fifth embodiment. FIG. 3 is a schematic plan view showing the next step of the steps shown in FIGS. 31 to 33 in the method for manufacturing a printed circuit board coated with the protective film of the fifth embodiment. FIG. 5 is a schematic cross-sectional view taken along the cross-sectional line XXXV-XXXV of the process shown in FIG. 34 in the method for manufacturing a printed circuit board coated with the protective film of the fifth embodiment. FIG. 3 is a schematic cross-sectional view taken along the cross-sectional line XXXVI-XXXVI of the process shown in FIG. 34 in the method for manufacturing a printed circuit board coated with the protective film of the fifth embodiment. FIG. 3 is a schematic cross-sectional view showing a next step of the steps shown in FIGS. 34 to 36 in the method of manufacturing a printed circuit board coated with a protective film according to a fifth embodiment. FIG. 3 is a schematic cross-sectional view showing a next step of the steps shown in FIGS. 34 to 36 in the method of manufacturing a printed circuit board coated with a protective film according to a fifth embodiment. FIG. 3 is a schematic plan view showing the next step of the steps shown in FIGS. 37 and 38 in the method for manufacturing a printed circuit board coated with the protective film of the fifth embodiment. It is schematic cross-sectional view which shows one step of the manufacturing method of the printed circuit board coated with the protective film of the 1st modification of Embodiment 5. It is schematic cross-sectional view which shows one step of the manufacturing method of the printed circuit board coated with the protective film of the 2nd modification of Embodiment 5. It is schematic cross-sectional view which shows one step of the manufacturing method of the printed circuit board coated with the protective film of the 3rd modification of Embodiment 5. It is schematic cross-sectional view which shows one step of the manufacturing method of the printed circuit board coated with the protective film of the 4th modification of Embodiment 5. It is a schematic plan view which shows one step of the manufacturing method of the printed circuit board coated with the protective film of the 5th modification of Embodiment 5.

Hereinafter, embodiments of the present invention will be described. The same reference number is assigned to the same configuration, and the description thereof will not be repeated.

Embodiment 1.
The printed circuit board 1 coated with the protective film of the first embodiment will be described with reference to FIG. The printed circuit board 1 covered with the protective film includes a printed circuit board 7 and a protective film 22.

The printed circuit board 7 includes a base material having an insulating property. The material of the base material may be, for example, a glass cloth containing an epoxy resin, a glass non-woven fabric, a paper base material containing a polyimide resin or a phenol resin.

The printed circuit board 7 includes a first main surface 8. The first main surface 8 includes a first region 8a and a second region 8b. A connection terminal 14 is provided in the first region 8a. The first region 8a may be located on the first peripheral edge portion of the first main surface 8. The connection terminal 14 may be an electric connector 14a or 14b, or may be a terminal electrode composed of a metal layer such as a ground connection terminal. The electric connectors 14a and 14b may include a main body portion 14p and a conductive lead 14q. The main body portion 14p may be formed of an insulating material such as nylon. The conductive lead 14q may be a tin-plated copper lead. The electric connector 14b is different from the electric connector 14a in the size of the main body 14p and at least one of the number of the conductive leads 14q.

The electronic component 10 is provided in the second region 8b. The electronic component 10 may be, for example, an integrated circuit (IC) 10a or a chip component 10b such as a chip resistor or a chip capacitor. The electronic component 10 may be bonded to the printed circuit board 7 by using a conductive bonding member such as solder. The connection terminal 14 such as the electric connectors 14a and 14b may be bonded to the printed circuit board 7 by using a conductive bonding member such as solder. The solder may be, for example, Sn-Ag-Cu solder such as Sn-3Ag-0.5Cu solder, Sn-Cu solder, Sn-Bi solder, Sn-In solder, Sn-Sb solder or Sn-. It may be Pb-based solder.

As shown in FIG. 6, the protective film 22 includes a second main surface 22 m. The protective film 22 includes an adhesive layer 23. In the present specification, the fact that the protective film 22 includes the adhesive layer 23 means that the adhesive layer 23 is provided on the second main surface 22 m, and that the second main surface 22 m of the protective film 22 itself has adhesiveness. Including that. The protective film 22 is in close contact with the second region 8b and the electronic component 10 of the printed circuit board 7 via the adhesive layer 23, and seals the second region 8b and the electronic component 10 of the printed circuit board 7. The first region 8a is exposed from the protective film 22 and the adhesive layer 23. The connection terminal 14 is exposed from the protective film 22 and the adhesive layer 23. No residue of the adhesive layer 23 adheres to the connection terminal 14.

The protective film 22 may be formed of a resin material such as an acrylic resin, a polyethylene resin, a polyimide resin, or a fluororesin. The protective film 22 may be a single layer or a multilayer. By forming the protective film 22 in a multilayer structure, the protective film 22 may be provided with a waterproof function, a gas corrosion resistant function, an ultraviolet ray resistant function, an electromagnetic shielding function, or a heat dissipation function. The protective film 22 may contain fine particles or fillers. The fine particles or filler may impart a waterproof function, a gas corrosion resistant function, an ultraviolet ray resistant function, an electromagnetic shielding function, or a heat dissipation function to the protective film 22. The protective film 22 is not particularly limited, but may have a thickness of 50 μm or more. The protective film 22 is not particularly limited, but may have a thickness of 500 μm or less.

The adhesive layer 23 may be a resin material having adhesiveness or adhesiveness such as a silicone resin, an acrylic resin or a urethane resin. The adhesive layer 23 may be formed by applying a resin material on the second main surface 22 m of the protective film 22. The adhesive layer 23 may be formed by performing a treatment for imparting adhesiveness to the second main surface 22m of the protective film 22.

A method for manufacturing the printed circuit board 1 coated with the protective film of the first embodiment will be described with reference to FIGS. 2 to 14.

As shown in FIG. 2, the method of manufacturing the printed circuit board 1 coated with the protective film of the present embodiment includes preparing the printed circuit board 7. Specifically, a connection terminal 14 such as an electric connector 14a, 14b or a terminal electrode is provided on the first region 8a of the printed circuit board 1. The first region 8a may be located on the first peripheral edge portion of the first main surface 8. An electronic component 10 such as an integrated circuit (IC) 10a or a chip component 10b is provided on the second region 8b of the printed circuit board 1. The electronic component 10 may be bonded to the printed circuit board 7 by using a conductive bonding member such as solder. The connection terminal 14 such as the electric connectors 14a and 14b may be bonded to the printed circuit board 7 by using a conductive bonding member such as solder.

As shown in FIGS. 3 to 5, the method of manufacturing the printed circuit board 1 coated with the protective film of the present embodiment includes setting the printed circuit board 7 and the protective film 22 in the laminating device 30. .. Specifically, the printed circuit board 7 is set on the stage 35 of the laminating device 30. The protective film 22 is set in the first film set portion 40 of the laminating device 30. In one example, the protective film 22 may be a long film and may be wound around a first film set portion 40 which is a first columnar body. In another example, the protective film 22 may be a single-wafer film and may be housed in a first film set portion 40 which is a tray (not shown).

The laminating device 30 includes a first chamber 31, a second chamber 32, a heater 33, a first valve 34, a stage 35, a drive unit 36, a second valve 37, a frame 38, a first film setting unit 40, and a release film removing unit. 41 may be included. The heater 33 is installed above the first chamber 31. The heater 33 is not particularly limited, but may be configured to radiate near infrared rays. The drive unit 36 is configured to move the stage 35 in a direction closer to the first chamber 31 and in a direction away from the first chamber 31. The drive unit 36 may be, for example, an air cylinder, a hydraulic cylinder, or a servo cylinder.

The release film removing unit 41 may include a release film recovery unit 41a and a roller 41b. As shown in FIG. 3, the roller 41b is arranged so as to selectively face the second portion 22b of the protective film 22. The roller 41b does not face the first portion 22a of the protective film 22. In one example, the release film 24 may be a long film, and the release film 24 peeled off from the adhesive layer 23 may be wound around the release film recovery unit 41a, which is the second columnar body. good. The release film recovery portion 41a, which is the second columnar body, may be arranged so as to selectively face the second portion 22b of the protective film 22. The release film collecting portion 41a, which is the second columnar body, does not have to face the first portion 22a of the protective film 22. In another example, the release film 24 may be a single-wafer film, and the release film 24 peeled off from the adhesive layer 23 is collected by the release film recovery unit 41a, which is a tray (not shown). May be done.

As shown in FIG. 6, the protective film 22 includes a second main surface 22 m. The protective film 22 includes a first portion 22a and a second portion 22b. The first portion 22a may be a band-shaped region extending along the longitudinal direction of the protective film 22. The second portion 22b may be a band-shaped region adjacent to the first portion 22a and extending along the longitudinal direction of the protective film 22. The boundary line between the first portion 22a and the second portion 22b is not particularly limited, but may be a straight line, a curved line, or a jagged line. The protective film 22 includes an adhesive layer 23 provided on the second main surface 22 m. The adhesive layer 23 is provided on the first portion 22a and the second portion 22b.

The protective film 22 may further include a release film 24. The release film 24 is provided on the first portion 22a and the second portion 22b via the adhesive layer 23. The release film 24 may be, for example, a fluorine-coated polyethylene terephthalate film, a polyethylene film or paper. In one example, the release film 24 may be a long film and may be wound around a first film set portion 40 which is a first columnar body. In another example, the release film 24 may be a sheet-fed film and may be stored in a tray (not shown). The release film 24 may include a first slit 25. The first slit 25 extends along the boundary line between the first portion 22a and the second portion 22b. The first slit 25 may be formed over the entire thickness of the release film 24.

As shown in FIGS. 7 to 9, in the method of manufacturing the printed circuit board 1 coated with the protective film of the present embodiment, the release film 24 and the protective film are protected above the first main surface 8 of the printed circuit board 7. It is provided with supplying the film 22. The first portion 22a of the protective film 22 faces the first region 8a of the printed circuit board 7. The second portion 22b of the protective film 22 faces the second region 8b of the printed circuit board 7. The release film 24 is selectively supplied between the first region 8a of the printed circuit board 7 and the adhesive layer 23 on the first portion 22a of the protective film 22. The release film 24 is not supplied between the second region 8b of the printed circuit board 7 and the adhesive layer 23.

Specifically, the protective film 22 including the release film 24 is supplied from the first film setting unit 40 toward the upper side of the first main surface 8 of the printed circuit board 7. The release film 24 on the second portion 22b is selectively removed before the protective film 22 containing the release film 24 reaches above the first main surface 8. The release film 24 on the first portion 22a is not removed but is supplied above the first main surface 8. In one example, the release film 24 on the second portion 22b of the protective film 22 comes into contact with the roller 41b and is peeled off from the adhesive layer 23. The release film 24 peeled off from the adhesive layer 23 may be wound up by the release film recovery unit 41a. In this way, the protective film 22 from which the release film 24 on the second portion 22b is selectively removed is set in the frame 38 arranged above the first main surface 8 of the printed circuit board 7.

The first slit 25 formed in the release film 24 facilitates the selective removal of the release film 24 on the second portion 22b of the protective film 22. When the release film 24 on the second portion 22b of the protective film 22 is selectively removed, the first slit 25 is such that the release film 24 on the first portion 22a of the protective film 22 is removed from the adhesive layer 23. Prevent it from being removed.

As shown in FIGS. 10 to 14, in the method for manufacturing the printed circuit board 1 coated with the protective film of the present embodiment, the laminating apparatus 30 is used to protect the first region 8a and the second region 8b. 22 is provided for laminating. The first region 8a of the printed circuit board 7 is covered with the first portion 22a of the protective film 22 via the release film 24 and the adhesive layer 23 on the first portion 22a of the protective film 22. The second portion 22b of the protective film 22 is in close contact with the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23 on the second portion 22b.

Specifically, as shown in FIGS. 10 and 11, the first chamber 31 and the second chamber 32 are closed. The first interior of the first chamber 31 and the second interior of the second chamber 32 are separated by a protective film 22. The first valve 34 and the second valve 37 are closed. A pump (not shown) is used to exhaust the first interior of the first chamber 31 and the second interior of the second chamber 32 to provide a first pressure inside the first chamber 31 and a second chamber 32. 2 Reduce the internal second pressure. The protective film 22 is heated by using the heater 33 to soften the protective film 22 including the adhesive layer 23. The protective film 22 outside the first chamber 31 and the second chamber 32 may be cut.

As shown in FIGS. 12 and 13, the drive unit 36 is used to move the stage 35 toward the first chamber 31. The printed circuit board 7 passes through the opening of the frame 38 and comes into contact with the protective film 22. The first valve 34 of the first chamber 31 is opened to raise the first pressure inside the first chamber 31 to atmospheric pressure. Due to the pressure difference between the first pressure inside the first chamber 31 and the second pressure inside the second chamber 32, the protective film 22 is connected to the first main surface 8 of the printed circuit board 7. It is in close contact with the terminal 14 and the electronic component 10. Then, the second valve 37 of the second chamber 32 is opened to raise the second pressure inside the second chamber 32 to atmospheric pressure. The printed circuit board 7 coated with the protective film 22 is taken out from the laminating device 30.

As shown in FIG. 14, the second portion 22b of the protective film 22 is attached to the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23. The second portion 22b of the protective film 22 is in close contact with the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23 without any gap. The second portion 22b of the protective film 22 extends along the shape of the surface of the second region 8b of the printed circuit board 7 and the electronic component 10. The second portion 22b of the protective film 22 seals the second region 8b of the printed circuit board 7 and the electronic component 10.

On the other hand, the first region 8a and the connection terminal 14 of the printed circuit board 7 are covered with the first portion 22a of the protective film 22 via the release film 24 and the adhesive layer 23. There is a release film 24 between the first region 8a and the adhesive layer 23 and between the connection terminal 14 and the adhesive layer 23. The first portion 22a of the protective film 22 is not attached to the first region 8a and the connection terminal 14 of the printed circuit board 7.

In another example of this embodiment, the first pressure of the printed circuit board 7 is set to be higher than the first pressure inside the first chamber 31 by making the second pressure inside the second chamber 32 higher than the first pressure inside the first chamber 31. The region 8a and the second region 8b may be laminated with the protective film 22. In yet another example of the present embodiment, the protective film 22 is heated by the heater 33 to be softened, and the protective film 22 is applied to the first region 8a and the second region 8b of the printed circuit board 7 by the weight of the protective film 22. The first region 8a and the second region 8b of the printed circuit board 7 may be laminated with the protective film 22 in close contact with each other. In yet another example of this, it is not necessary to change the first pressure inside the first chamber 31 and the second pressure inside the second chamber 32.

In the method of manufacturing the printed circuit board 1 covered with the protective film of the present embodiment, the first portion 22a of the protective film 22 and the release film 24 and the adhesive layer 23 on the first portion 22a are formed on the printed circuit board. 7 is provided with removal from the first region 8a. Specifically, the protective film 22 is cut along the boundary line between the first portion 22a and the second portion 22b using a cutter. In other words, the protective film 22 is cut along the first slit 25 using a cutter. The first portion 22a of the protective film 22 is not attached to the first region 8a and the connection terminal 14 of the printed circuit board 7. Therefore, the first portion 22a of the protective film 22 and the release film 24 and the adhesive layer 23 on the first portion 22a can be easily removed from the first region 8a. In this way, the printed circuit board 1 coated with the protective film shown in FIG. 1 is obtained.

The effect of the printed circuit board 1 covered with the protective film of the present embodiment and the manufacturing method thereof will be described.

The printed circuit board 1 covered with the protective film of the present embodiment includes a printed circuit board 7 and a protective film 22. The printed circuit board 7 includes a first main surface 8. The first main surface 8 of the printed circuit board 7 includes a first region 8a provided with a connection terminal 14 and a second region 8b provided with an electronic component 10. The protective film 22 is in close contact with the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23. The first region 8a is exposed from the protective film 22 and the adhesive layer 23.

The second portion 22b of the protective film 22 is attached to the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23. The second portion 22b of the protective film 22 seals the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23. The electronic component 10 is protected by the protective film 22. The printed circuit board 1 coated with the protective film of the present embodiment has high reliability.

The first portion 22a of the protective film 22 is not attached to the first region 8a and the connection terminal 14 of the printed circuit board 7. The first portion 22a of the protective film 22 and the release film 24 and the adhesive layer 23 on the first portion 22a can be easily removed from the first region 8a. The residue of the adhesive layer 23 does not adhere to the connection terminal 14. Therefore, when the protective film 22 is removed from the printed circuit board 7, it is possible to prevent the connection terminal 14 from being destroyed and the electrical contact at the connection terminal 14 from being defective. The printed circuit board 1 coated with the protective film of the present embodiment has high reliability.

The method for manufacturing the printed circuit board 1 covered with the protective film of the present embodiment includes supplying the release film 24 and the protective film 22 above the first main surface 8 of the printed circuit board 7. The first main surface 8 of the printed circuit board 7 includes a first region 8a provided with a connection terminal 14 and a second region 8b provided with an electronic component 10. The protective film 22 includes a second main surface 22 m facing the first main surface 8. The protective film 22 includes a first portion 22a and a second portion 22b. The first portion 22a of the protective film 22 faces the first region 8a of the printed circuit board 7. The second portion 22b of the protective film 22 faces the second region 8b of the printed circuit board 7. The protective film 22 includes an adhesive layer 23 provided on the second main surface 22 m. The adhesive layer 23 is provided on the first portion 22a and the second portion 22b of the protective film 22. The release film 24 is selectively supplied between the first region 8a of the printed circuit board 7 and the adhesive layer 23 on the first portion 22a of the protective film 22.

The method for manufacturing the printed circuit board 1 covered with the protective film of the present embodiment further comprises laminating the first region 8a and the second region 8b of the printed circuit board 7 with the protective film 22. The first region 8a of the printed circuit board 7 is covered with the first portion 22a of the protective film 22 via the release film 24 and the adhesive layer 23 on the first portion 22a of the protective film 22. The second portion 22b of the protective film 22 is in close contact with the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23 on the second portion 22b. In the method of manufacturing the printed circuit board 1 covered with the protective film of the present embodiment, the first portion 22a of the protective film 22 and the release film 24 and the adhesive layer 23 on the first portion 22a are formed on the printed circuit board. 7 is provided with removal from the first region 8a.

The second portion 22b of the protective film 22 is attached to the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23. The second portion 22b of the protective film 22 seals the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23. The electronic component 10 is protected by the protective film 22. According to the method for manufacturing the printed circuit board 1 coated with the protective film of the present embodiment, the printed circuit board 1 coated with the protective film having high reliability can be obtained.

The first portion 22a of the protective film 22 is not attached to the first region 8a and the connection terminal 14 of the printed circuit board 7. The first portion 22a of the protective film 22 and the release film 24 and the adhesive layer 23 on the first portion 22a can be easily removed from the first region 8a. The residue of the adhesive layer 23 does not adhere to the connection terminal 14. Therefore, when the protective film 22 is removed from the printed circuit board 7, it is possible to prevent the connection terminal 14 from being destroyed and the electrical contact at the connection terminal 14 from being defective. According to the method for manufacturing the printed circuit board 1 coated with the protective film of the present embodiment, the printed circuit board 1 coated with the protective film having high reliability can be obtained.

In the method for manufacturing the printed circuit board 1 covered with the protective film of the present embodiment, the electrical wiring is not connected to the connection terminal 14 when the printed circuit board 7 is laminated with the protective film 22. Therefore, the workability of the process of laminating the printed circuit board 7 with the protective film 22 is good, and the printed circuit board 7 including the connection terminal 14 can be laminated with the protective film 22 with higher productivity. The printed circuit board 1 coated with the protective film can be manufactured with higher productivity.

Embodiment 2.
A method of manufacturing the printed circuit board 1 coated with the protective film of the second embodiment will be described with reference to FIG. The method for manufacturing the printed circuit board 1 coated with the protective film of the present embodiment comprises the same steps as the method for manufacturing the printed circuit board 1 coated with the protective film of the first embodiment, and has the same effect. However, it differs mainly in the following points.

In the method for manufacturing the printed circuit board 1 coated with the protective film of the present embodiment, the protective film 22 includes the second slit 26. The second slit 26 extends along the boundary line between the first portion 22a and the second portion 22b of the protective film 22. The second slit 26 may be formed on the second main surface 22 m of the protective film 22. Since the protective film 22 includes the second slit 26, the release film 24 and the adhesive layer 23 on the first portion 22a and the first portion 22a of the protective film 22 are manually separated from each other without using a cutter. It can be easily removed from one region 8a. Further, it is not necessary to use a cutter when removing the first portion 22a of the protective film 22 and the release film 24 and the adhesive layer 23 on the first portion 22a from the first region 8a of the printed circuit board 7. , The cutter can prevent the printed circuit board 7 from being damaged.

The ratio d / t of the depth d of the second slit 26 to the thickness t of the protective film 22 may be 0.20 or more. Therefore, the first portion 22a of the protective film 22 can be easily removed from the first region 8a by hand without using a cutter. The ratio d / t may be 0.60 or less. Therefore, it is possible to prevent the protective film 22 from being torn when the protective film 22 is supplied from the first film set portion 40 toward the upper side of the first main surface 8 of the printed circuit board 7.

Embodiment 3.
A method of manufacturing the printed circuit board 1 coated with the protective film of the third embodiment will be described with reference to FIGS. 16 to 25. The method for manufacturing the printed circuit board 1 coated with the protective film of the present embodiment comprises the same steps as the method for manufacturing the printed circuit board 1 coated with the protective film of the first embodiment, and has the same effect. However, it differs mainly in the following points.

In the present embodiment, supplying the release film 24c and the protective film 22 above the first main surface 8 of the printed circuit board 7 selectively separates the release film 24c and the protective film 22 above the first region 8a of the printed circuit board 7. It includes supplying the mold film 24c and subsequently supplying the protective film 22 above the first region 8a and the second region 8b of the printed circuit board 7. The protective film 22 is supplied to the release film 24c on the side opposite to the printed circuit board 7. The release film 24c is not supplied above the second region 8b of the printed circuit board 7. The release film 24c is selectively arranged between the first region 8a of the printed circuit board 7 and the first portion 22a of the protective film 22.

Specifically, as shown in FIGS. 16 to 18, the printed circuit board 7, the protective film 22, and the release film 24c are set in the laminating device 30. Specifically, the printed circuit board 7 is set on the stage 35 of the laminating device 30. The protective film 22 is set in the first film set portion 40 of the laminating device 30. The protective film 22 includes an adhesive layer 23 and a release film 24. The laminating device 30 may further include a second film set portion 42. The release film 24c is set in the second film setting portion 42 of the laminating device 30. In one example, the release film 24c may be a long film and may be wound around a second film set portion 42 which is a third columnar body. In another example, the release film 24c may be a single-wafer film and may be housed in a second film set portion 42 which is a tray (not shown).

As shown in FIG. 16, the roller 41b is arranged so as to face the first portion 22a and the second portion 22b of the protective film 22. In one example, the release film 24 peeled off from the adhesive layer 23 may be wound around the release film recovery unit 41a, which is the second columnar body. The release film recovery portion 41a, which is the second columnar body, may be arranged so as to face the first portion 22a and the second portion 22b of the protective film 22. In another example, the release film 24 peeled off from the adhesive layer 23 may be stored in the release film recovery unit 41a, which is a tray (not shown).

As shown in FIG. 19, the protective film 22 of the present embodiment has the same configuration as the protective film 22 of the first embodiment, but the protective film 22 of the present embodiment is a release film 24. It is different from the protective film 22 of the first embodiment in that the first slit 25 is not formed in the film. The step of forming the first slit 25 in the release film 24 can be omitted. The commercially available release film 24 can be used as it is for manufacturing the printed circuit board 1 coated with the protective film. The printed circuit board 1 coated with the protective film can be manufactured with higher productivity and lower cost.

As shown in FIGS. 20 and 21, the release film 24c is selectively supplied from the second film set portion 42 above the first region 8a of the printed circuit board 7. The release film 24c is set on the frame 38 arranged above the first main surface 8 of the printed circuit board 7. The release film 24c is not supplied above the second region 8b of the printed circuit board 7.

Then, as shown in FIGS. 22 to 24, the protective film 22 is supplied above the first region 8a and the second region 8b of the printed circuit board 7. Specifically, the protective film 22 including the release film 24 is supplied from the first film setting unit 40 toward the upper side of the first main surface 8 of the printed circuit board 7. The release film 24 is provided on the first portion 22a and the second portion 22b via the adhesive layer 23. Before the protective film 22 including the release film 24 reaches above the first main surface 8, the release film 24 is completely removed. In one example, the release film 24 comes into contact with the roller 41b and is peeled off from the adhesive layer 23. The release film 24 peeled off from the adhesive layer 23 may be wound up by the release film recovery unit 41a.

In this way, the protective film 22 from which the release film 24 has been removed is supplied to the release film 24c on the side opposite to the printed circuit board 7. The protective film 22 from which the release film 24 has been removed is set in the frame 38. The release film 24c is selectively arranged between the first region 8a of the printed circuit board 7 and the first portion 22a of the protective film 22. The release film 24c is not supplied between the second region 8b of the printed circuit board 7 and the second portion 22b of the protective film 22.

Then, as in the first embodiment, the first region 8a and the second region 8b of the printed circuit board 7 are laminated with the protective film 22 by using the laminating device 30. As shown in FIG. 25, the second portion 22b of the protective film 22 is attached to the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23. The second portion 22b of the protective film 22 is in close contact with the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23 without any gap. The second portion 22b of the protective film 22 seals the second region 8b of the printed circuit board 7 and the electronic component 10.

On the other hand, the first region 8a and the connection terminal 14 of the printed circuit board 7 are covered with the first portion 22a of the protective film 22 via the release film 24c and the adhesive layer 23. There is a release film 24c between the first region 8a and the adhesive layer 23 and between the connection terminal 14 and the adhesive layer 23. The first portion 22a of the protective film 22 is not attached to the first region 8a and the connection terminal 14 of the printed circuit board 7.

Then, the first portion 22a of the protective film 22 and the release film 24c and the adhesive layer 23 on the first portion 22a of the protective film 22 are removed from the first region 8a of the printed circuit board 7. Specifically, the protective film 22 is cut along the boundary line between the first portion 22a and the second portion 22b using a cutter. In other words, a cutter is used to cut the protective film 22 along the outline of the release film 24c on the center side of the printed circuit board 7 in the plan view of the first main surface 8. The first portion 22a of the protective film 22 is not attached to the first region 8a and the connection terminal 14 of the printed circuit board 7. Therefore, the first portion 22a of the protective film 22 and the release film 24c and the adhesive layer 23 on the first portion 22a can be easily removed from the first region 8a. In this way, the printed circuit board 1 coated with the protective film shown in FIG. 1 is obtained.

In the method for manufacturing the printed circuit board 1 coated with the protective film of the modified example of the present embodiment, the release film 24c and the protective film 22 are supplied above the first main surface 8 of the printed circuit board 7. The protective film 22 is supplied above the first region 8a and the second region 8b of the printed circuit board 7, and subsequently, selectively between the first region 8a and the protective film 22 of the printed circuit board 7. It may include supplying the release film 24c. The release film 24c is not supplied between the second region 8b of the printed circuit board 7 and the protective film 22. The release film 24c is selectively arranged between the first region 8a of the printed circuit board 7 and the protective film 22.

Embodiment 4.
The printed circuit board 1d coated with the protective film of the fourth embodiment will be described with reference to FIG. 26. The printed circuit board 1d coated with the protective film of the present embodiment has the same configuration as that of the printed circuit board 1 coated with the protective film of the first embodiment, and has the same effect, but in the following points. Mainly different.

In the present embodiment, the first main surface 8 includes the first regions 8a and 8c and the second region 8b. The first region 8a is located on the first peripheral edge of the first main surface 8. The first region 8c is located on the second peripheral edge of the first main surface 8 opposite to the first peripheral edge. The first region 8a is provided with an electric connector 14a, 14b or a connection terminal 14 such as a terminal electrode. The first region 8c is provided with an electric connector 15a, 15b or a connection terminal 15 such as a terminal electrode. The connection terminals 14, 15 such as the electric connectors 14a, 14b, 15a, 15b may be electrically bonded to the printed circuit board 7d by using a conductive bonding member such as solder. The second region 8b is between the first peripheral edge portion and the second peripheral edge portion. The second region 8b is provided with an electronic component 10 such as an integrated circuit (IC) 10a or a chip component 10b. The electronic component 10 may be electrically bonded to the printed circuit board 7d by using a conductive bonding member such as solder.

The protective film 22 is attached to the second region 8b of the printed circuit board 7d and the electronic component 10 via the adhesive layer 23 in close contact with each other. The protective film 22 seals the second region 8b of the printed circuit board 7d and the electronic component 10. The first regions 8a and 8c are exposed from the protective film 22 and the adhesive layer 23. The connection terminals 14 and 15 are exposed from the protective film 22 and the adhesive layer 23. No residue of the adhesive layer 23 adheres to the connection terminals 14 and 15.

A method of manufacturing the printed circuit board 1d coated with the protective film of the fourth embodiment will be described with reference to FIGS. 27 to 29. The method for manufacturing the printed circuit board 1d coated with the protective film of the present embodiment comprises the same steps as the method for manufacturing the printed circuit board 1 coated with the protective film of the first embodiment, and has the same effect. However, it differs mainly in the following points.

In this embodiment, the printed circuit board 7d is prepared. Specifically, a connection terminal 14 such as an electric connector 14a, 14b or a terminal electrode is provided on the first region 8a of the printed circuit board 7d. A connection terminal 15 such as an electric connector 15a, 15b or a terminal electrode is provided on the first region 8c of the printed circuit board 7d. The connection terminals 14, 15 such as the electric connectors 14a, 14b, 15a, 15b may be electrically bonded to the printed circuit board 7d by using a conductive bonding member such as solder. The first region 8a is located on the first peripheral edge of the first main surface 8. The first region 8c is located on the second peripheral edge of the first main surface 8 opposite to the first peripheral edge. An electronic component 10 such as an integrated circuit (IC) 10a or a chip component 10b is provided on the second region 8b of the printed circuit board 7d. The second region 8b is between the first peripheral edge portion and the second peripheral edge portion. The electronic component 10 may be electrically bonded to the printed circuit board 7d by using a conductive bonding member such as solder.

Then, the release film 24 and the protective film 22 are supplied above the first main surface 8 of the printed circuit board 7d. As shown in FIG. 28, the protective film 22 of the present embodiment has the same configuration as the protective film 22 of the first embodiment, but is mainly different in the following points. The first portion 22a of the protective film 22 is located on the third peripheral edge portion of the second main surface 22m. The first portion 22c of the protective film 22 is located on the fourth peripheral edge portion of the second main surface 22m opposite to the third peripheral edge portion. The second portion 22b of the protective film 22 is located between the third peripheral edge portion and the fourth peripheral edge portion.

The first portion 22a of the protective film 22 faces the first region 8a of the printed circuit board 7. The first portion 22c of the protective film 22 faces the first region 8c of the printed circuit board 7. The second portion 22b of the protective film 22 faces the second region 8b of the printed circuit board 7. The release film 24 includes two first slits 25 and 25d. The first slit 25 extends along the boundary line between the first portion 22a and the second portion 22b. The two first slits 25d extend along the boundary between the first portion 22c and the second portion 22b.

The first regions 8a and 8c and the second region 8b are laminated with the protective film 22 in the same manner as in the first embodiment. In this way, the printed circuit board 7d coated with the protective film 22 shown in FIG. 29 is obtained. The second portion 22b of the protective film 22 is attached to the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23. The second portion 22b of the protective film 22 is in close contact with the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 23 without any gap. The second portion 22b of the protective film 22 extends along the shape of the surface of the second region 8b of the printed circuit board 7 and the electronic component 10. The second portion 22b of the protective film 22 seals the second region 8b of the printed circuit board 7 and the electronic component 10.

On the other hand, the first regions 8a and 8c of the printed circuit board 7 and the connection terminals 14 and 15 are covered with the first portion 22a of the protective film 22 via the release film 24 and the adhesive layer 23. There is a release film 24 between the first regions 8a and 8c and the adhesive layer 23, and between the connection terminals 14 and 15 and the adhesive layer 23. The first portion 22a of the protective film 22 is not attached to the first regions 8a and 8c of the printed circuit board 7 and the connection terminals 14 and 15.

Then, the release film 24 and the adhesive layer 23 on the first portions 22a and 22c and the first portions 22a and 22c of the protective film 22 are removed from the first regions 8a and 8c. Specifically, the protective film 22 is cut along the two boundary lines between the first portion 22a and 22c and the second portion 22b using a cutter. In other words, the protective film 22 is cut along the first slits 25 and 25d using a cutter. In this way, the printed circuit board 1d coated with the protective film shown in FIG. 26 is obtained.

Embodiment 5.
A method for manufacturing the printed circuit board 1 coated with the protective film of the fifth embodiment will be described with reference to FIGS. 30 to 44. The method for manufacturing the printed circuit board 1 coated with the protective film of the present embodiment includes the same steps as the method for manufacturing the printed circuit board 1 coated with the protective film of the first embodiment, but in the following points. Mainly different.

As shown in FIG. 30, the protective film 22 includes an adhesive layer 44 provided on the second main surface 22 m of the protective film 22. The adhesive layer 44 can be cured and lose its adhesiveness by being exposed to light 45. The adhesive layer 44 is, for example, an epoxy resin, a urethane resin, or a silicone resin. The adhesive layer 44 is provided on the first portion 22a and the second portion 22b of the protective film 22. The protective film 22 may not include the first slit 25 (see FIG. 6).

As shown in FIGS. 31 to 33, the method of manufacturing the printed circuit board 1 coated with the protective film of the present embodiment includes setting the printed circuit board 7 and the protective film 22 in the laminating device 30. .. In the present embodiment, the release film removing unit 41 (release film collecting unit 41a, roller 41b) is configured to remove all the release film 24 of the protective film 22. The release film removing unit 41 (release film collecting unit 41a, roller 41b) extends below the first portion 22a of the protective film 22. The release film removing unit 41 (release film collecting unit 41a, roller 41b) extends over the entire width of the protective film 22.

The laminating device 30 may further include a light irradiator 43. The light irradiator 43 is configured to selectively irradiate the adhesive layer 44 on the first portion 22a of the protective film 22 with the light 45. The light irradiator 43 is not particularly limited, but is an ultraviolet irradiator such as an ultraviolet light emitting diode (LED) or an ultraviolet lamp. The light 45 is not particularly limited, but is ultraviolet light.

The light irradiator 43 may include a first light irradiating unit 43a and a second light irradiating unit 43b. The first light irradiation unit 43a is arranged so as to correspond to the first portion 22a of the protective film 22. The second light irradiation unit 43b is arranged so as to correspond to the second portion 22b of the protective film 22. The lighting state of the first light irradiation unit 43a and the lighting state of the second light irradiation unit 43b can be controlled independently of each other. The irradiation range of the light 45 on the adhesive layer 44 by the light irradiator 43 can be changed. The light irradiator 43 is arranged below the first portion 22a and the second portion 22b of the protective film 22. The light irradiator 43 faces the adhesive layer 44. The light irradiator 43 is arranged on the downstream side of the protective film 22 in the transport direction with respect to the roller 41b. The light irradiator 43 is configured to selectively irradiate the adhesive layer 44 on the first portion 22a of the protective film 22 with the light 45 after the release film removing portion 41 removes the release film 24. There is.

As shown in FIGS. 34 to 36, the method of manufacturing the printed circuit board 1 coated with the protective film of the present embodiment supplies the protective film 22 above the first main surface 8 of the printed circuit board 7. Be prepared for that. The second main surface 22m of the protective film 22 faces the first main surface 8. The first portion 22a of the protective film 22 faces the first region 8a of the printed circuit board 7. The second portion 22b of the protective film 22 faces the second region 8b of the printed circuit board 7.

As shown in FIGS. 34 to 36, the method of manufacturing the printed circuit board 1 coated with the protective film of the present embodiment uses a light irradiator 43 to adhere to the first portion 22a of the protective film 22. The layer 44 is selectively irradiated with light 45 to convert the adhesive layer 44 on the first portion 22a of the protective film 22 into the cured portion 44c. After irradiation of the adhesive layer 44 on the first portion 22a of the protective film 22 with light 45, the cured portion 44c loses its adhesiveness, and the adhesive layer 44 on the second portion 22b of the protective film 22 is lost. Maintains stickiness.

Specifically, while supplying the protective film 22 above the first main surface 8 of the printed circuit board 7, the light irradiator 43 is used to selectively select the adhesive layer 44 on the first portion 22a of the protective film 22. Is irradiated with light 45. Specifically, while the protective film 22 is being conveyed, the first light irradiation unit 43a is turned on and the second light irradiation unit 43b is turned off. In this way, the adhesive layer 44 on the first portion 22a of the protective film 22 can be selectively converted into the cured portion 44c. The adhesive layer 44 on the second portion 22b of the protective film 22 may maintain adhesiveness. While the protective film 22 is being conveyed, the first light irradiation unit 43a and the second light irradiation unit 43b are turned on, and the second light irradiation unit 43b and the adhesive layer 44 on the second portion 22b of the protective film 22 A shading plate may be inserted between the two. Since the light irradiator 43 faces the adhesive layer 44 on the first portion 22a of the protective film 22, the surface of the adhesive layer 44 facing the connection terminal 14 can be reliably converted into the cured portion 44c. ..

As shown in FIGS. 37 to 39, in the method of manufacturing the printed circuit board 1 coated with the protective film of the present embodiment, the first region 8a and the second region 8b of the printed circuit board 7 are covered with the protective film 22. Prepare to laminate. Specifically, the first chamber 31 and the second chamber 32 are closed in the same manner as in the steps shown in FIGS. 10 and 11. The printed circuit board 7 is covered with the protective film 22 by the steps shown in FIGS. 37 and 38, which are similar to the steps shown in FIGS. 12 and 13.

As shown in FIG. 39, the second portion 22b of the protective film 22 is attached to the second region 8b and the electronic component 10 of the printed circuit board 7 via the adhesive layer 44 on the second portion 22b. There is. The second portion 22b of the protective film 22 is in close contact with the second region 8b of the printed circuit board 7 and the electronic component 10 via the adhesive layer 44 on the second portion 22b. The second portion 22b of the protective film 22 extends along the shape of the surface of the second region 8b of the printed circuit board 7 and the electronic component 10. The second portion 22b of the protective film 22 seals the second region 8b of the printed circuit board 7 and the electronic component 10.

On the other hand, the first region 8a and the connection terminal 14 of the printed circuit board 7 are covered with the first portion 22a of the protective film 22 via the cured portion 44c. There is a cured portion 44c between the first region 8a and the first portion 22a of the protective film 22 and between the connection terminal 14 and the first portion 22a of the protective film 22. The cured portion 44c does not have adhesiveness. The first portion 22a of the protective film 22 is not attached to the first region 8a and the connection terminal 14 of the printed circuit board 7.

In the method of manufacturing the printed circuit board 1 covered with the protective film of the present embodiment, the first portion 22a of the protective film 22 and the cured portion 44c on the first portion 22a are combined with the first region of the printed circuit board 7. Prepared to remove from 8a. Specifically, the protective film 22 is cut along the boundary line between the first portion 22a and the second portion 22b using a cutter. The first portion 22a of the protective film 22 is not attached to the first region 8a and the connection terminal 14 of the printed circuit board 7. Therefore, the first portion 22a of the protective film 22 and the cured portion 44c on the first portion 22a can be easily removed from the first region 8a. In this way, the printed circuit board 1 coated with the protective film shown in FIG. 1 is obtained.

A method of manufacturing the printed circuit board 1 coated with the protective film of the modified example of the present embodiment will be described. As shown in FIG. 40, in the first modification of the present embodiment, the light irradiator 43 may be arranged above the first portion 22a of the protective film 22. The light irradiator 43 may be arranged on the side opposite to the adhesive layer 44 side. As shown in FIG. 41, in the second modification of the present embodiment, the light irradiator 43 is the light irradiator 43 above the first portion 22a of the protective film 22 and the first portion 22a of the protective film 22. It may be placed both below.

As shown in FIG. 42, in the third modification of the present embodiment, the light irradiator 43 may be arranged on the upstream side of the protective film 22 in the transport direction with respect to the roller 41b. The light irradiator 43 is configured to selectively irradiate the adhesive layer 44 on the first portion 22a of the protective film 22 with light 45 before the release film removing portion 41 removes the release film 24. May be good. As shown in FIG. 43, in the fourth modification of the present embodiment, the light irradiator 43 may be provided inside the first chamber 31. The light irradiator 43 supplies the protective film 22 above the first main surface 8 of the printed circuit board 7, and then selectively irradiates the adhesive layer 44 on the first portion 22a of the protective film 22 with the light 45. It may be configured as follows. As shown in FIG. 44, in the fifth modification of the present embodiment, the light irradiator 43 may be movable in the width direction of the protective film 22. The light irradiator 43 may have a width smaller than the width of the protective film 22. Therefore, the light irradiation region of the adhesive layer 44 by the light irradiator 43 can be easily changed.

The method for manufacturing the printed circuit board 1 coated with the protective film of the present embodiment has the same following effects as the effect of the method for manufacturing the printed circuit board 1 coated with the protective film of the first embodiment.

The method of manufacturing the printed circuit board 1 covered with the protective film of the present embodiment includes supplying the protective film 22 above the first main surface 8 of the printed circuit board 7. The first main surface 8 of the printed circuit board 7 includes a first region 8a provided with a connection terminal 14 and a second region 8b provided with an electronic component 10. The protective film 22 includes a second main surface 22 m facing the first main surface 8. The protective film 22 includes a first portion 22a and a second portion 22b. The first portion 22a of the protective film 22 faces the first region 8a of the printed circuit board 7. The second portion 22b of the protective film 22 faces the second region 8b of the printed circuit board 7. The protective film 22 includes an adhesive layer 44 provided on the second main surface 22 m. The adhesive layer 44 is provided on the first portion 22a and the second portion 22b of the protective film 22.

In the method of manufacturing the printed circuit board 1 coated with the protective film of the present embodiment, the adhesive layer 44 on the first portion 22a of the protective film 22 is selectively irradiated with the light 45 by using the light irradiator 43. The adhesive layer 44 on the first portion 22a of the protective film 22 is converted into a cured portion 44c. The cured portion 44c has lost its adhesiveness. The method for manufacturing the printed circuit board 1 covered with the protective film of the present embodiment includes laminating the first region 8a and the second region 8b of the printed circuit board 7 with the protective film 22. The first region 8a of the printed circuit board 7 is covered with the first portion 22a of the protective film 22 via the cured portion 44c. The second portion 22b of the protective film 22 is in close contact with the second region 8b and the electronic component 10 via the adhesive layer 44 on the second portion 22b of the protective film 22. In the method of manufacturing the printed circuit board 1 covered with the protective film of the present embodiment, the first portion 22a of the protective film 22 and the cured portion 44c on the first portion 22a are combined with the first region of the printed circuit board 7. Prepared to remove from 8a.

The first portion 22a of the protective film 22 is not attached to the first region 8a and the connection terminal 14 of the printed circuit board 7. The first portion 22a of the protective film 22 and the cured portion 44c on the first portion 22a can be easily removed from the first region 8a. The residue of the adhesive layer 44 does not adhere to the connection terminal 14. Therefore, when the protective film 22 is removed from the printed circuit board 7, it is possible to prevent the connection terminal 14 from being destroyed and the electrical contact at the connection terminal 14 from being defective. According to the method for manufacturing the printed circuit board 1 coated with the protective film of the present embodiment, the printed circuit board 1 coated with the protective film having high reliability can be obtained. Further, by changing the light irradiation region of the adhesive layer 44 by the light irradiator 43, the printed circuit board 1 coated with various kinds of protective films can be easily manufactured.

In the method for manufacturing the printed circuit board 1 coated with the protective film of the present embodiment, the protective film 22 is supplied above the first main surface 8 of the printed circuit board 7 and on the first portion 22a of the protective film 22. The adhesive layer 44 in the above may be selectively irradiated with the light 45. Therefore, the time for covering the printed circuit board 1 with the protective film 22 is shortened.

It should be considered that the embodiments 1-5 and their variations disclosed this time are exemplary in all respects and not restrictive. As long as there is no contradiction, at least two of Embodiment 1-5 disclosed this time and variations thereof may be combined. The scope of the present invention is shown by the scope of claims rather than the above description, and is intended to include all modifications within the meaning and scope of the claims.

1,1d printed circuit board covered with protective film, 7,7d printed circuit board, 8 first main surface, 8a, 8c first area, 8b second area, 10 electronic parts, 10b chip parts, 14,15 connections Terminal, 14a, 14b, 15a, 15b Electric connector, 14p main body, 14q conductive lead, 22 protective film, 22a, 22c 1st part, 22b 2nd part, 22m 2nd main surface, 23 adhesive layer, 24, 24c separation Mold film, 25, 25d 1st slit, 26 2nd slit, 30 Laminating device, 31 1st chamber, 32 2nd chamber, 33 heater, 34 1st valve, 35 stage, 36 drive unit, 37 2nd valve, 38 Frame, 40 1st film set part, 41 release film removal part, 41a release film recovery part, 41b roller, 42 2nd film set part, 43 light irradiator, 43a 1st light irradiation part, 43b 2nd light irradiation Part, 44 adhesive layer, 44c hardened part, 45 light.

Claims (12)

A method for manufacturing a printed circuit board coated with a protective film.
A release film and the protective film are supplied above the first main surface of the printed circuit board, and the first main surface is provided with a first region provided with connection terminals and electronic components. The protective film includes a second main surface facing the first main surface, the protective film includes a first portion and a second portion, and the first portion includes the first portion. The first region faces, the second portion faces the second region, the protective film includes an adhesive layer provided on the second main surface, and the adhesive layer is: Provided on the first portion and the second portion, the release film is selectively supplied between the first region and the adhesive layer on the first portion of the protective film. And, in addition
The first region and the second region are laminated with the protective film, and the first region is protected via the release film and the adhesive layer on the first portion of the protective film. The first portion of the film is covered, and the second portion of the protective film is in close contact with the second region and the electronic component via the adhesive layer on the second portion, and further. ,
A method for manufacturing a printed circuit board coated with a protective film, comprising removing the first portion of the protective film, the release film on the first portion, and the adhesive layer from the first region. .. Supplying the release film and the protective film above the first main surface can be used.
The protective film containing the release film is supplied toward the upper side of the first main surface, and the release film is placed on the first portion and the second portion via the adhesive layer. It is provided, and in addition,
The method for manufacturing a printed circuit board coated with a protective film according to claim 1, which comprises selectively removing the release film on the second portion. The second aspect of claim 2, wherein selectively removing the release film on the second portion includes winding the release film on the second portion around a release film recovery unit. A method for manufacturing a printed circuit board coated with a protective film. The second or third aspect of the present invention, wherein the release film includes a first slit, and the first slit extends along a boundary line between the first portion and the second portion. A method for manufacturing a printed circuit board coated with a protective film. Supplying the release film and the protective film above the first main surface can be used.
To selectively supply the release film above the first region,
Subsequently, the protective film is supplied above the first region and the second region, and the protective film is supplied to the release film on the side opposite to the printed circuit board. The method for manufacturing a printed circuit board coated with the protective film according to claim 1. Supplying the release film and the protective film above the first main surface can be used.
By supplying the protective film above the first region and the second region,
The method for manufacturing a printed circuit board coated with a protective film according to claim 1, wherein the release film is selectively supplied between the first region and the protective film. Claims 1 to 3, claim 3, wherein the protective film includes a second slit, the second slit extending along a boundary line between the first portion and the second portion. 5. The method for manufacturing a printed circuit board coated with the protective film according to any one of claims 6. The method for manufacturing a printed circuit board coated with a protective film according to claim 7, wherein the second slit is formed on the second main surface. The method for manufacturing a printed circuit board covered with a protective film according to any one of claims 1 to 8, wherein the first region is located on the first peripheral edge of the first main surface. The first region is located in a first peripheral edge portion of the first main surface and a second peripheral edge portion of the first main surface opposite to the first peripheral edge portion.
The method for manufacturing a printed circuit board covered with a protective film according to any one of claims 1 to 8, wherein the second region is located between the first peripheral edge portion and the second peripheral edge portion. .. A method for manufacturing a printed circuit board coated with a protective film.
The protective film is supplied above the first main surface of the printed circuit board, and the first main surface has a first region provided with connection terminals and a second area provided with electronic components. The protective film includes a second main surface facing the first main surface, the protective film includes a first portion and a second portion, and the first portion is included in the first region. The second portion faces the second region, the protective film includes an adhesive layer provided on the second main surface, and the adhesive layer is the first portion. And, it is provided on the second part, and further
The adhesive layer on the first portion of the protective film is selectively irradiated with light using a light irradiator to convert the adhesive layer on the first portion of the protective film into a cured portion. In addition, the cured portion has lost its adhesiveness, and further
The first region and the second region are laminated with the protective film, and the first region is covered with the first portion of the protective film via the cured portion, and the protective film is covered with the first portion. The second portion is in close contact with the second region and the electronic component via the adhesive layer on the second portion of the protective film, and further.
A method for manufacturing a printed circuit board coated with a protective film, comprising removing the first portion of the protective film and the cured portion on the first portion from the first region. 11. The 11th aspect of the present invention, wherein the protective film is selectively irradiated on the adhesive layer on the first portion of the protective film while supplying the protective film above the first main surface of the printed circuit board. A method for manufacturing a printed circuit board coated with a protective film.

Images