JP2010199514A - Circuit structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit structure which is downsized. <P>SOLUTION: The circuit structure 1 includes a substrate section 2 including: a bus bar section 10 which includes an element mounting section 13 and several bus bars 11 arranged in parallel with gaps therebetween; and an insulating section 21 which is insert molded so that the element mounting section 13 and the several bus bars 11 may be integrated. Semiconductor switching elements 30 are mounted on the element mounting section 13. Outer ends (i.e. ends of the opposite side of the element mounting section 13) of the bus bars 11 which are arranged in parallel in two lines across the element mounting section 13 constitute connecting terminal sections 12 which are arranged at the end edges of the substrate section 2 for conductive connection with the outside. The end edge section of the substrate section 2 including the connecting terminal sections 12 constitutes a card edge connector section 3 with the connecting terminal sections 12 being exposed from the insulating section 21 and constituting a flat and single plate. In this structure, downsizing is achieved. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a circuit structure.

  Conventionally, the thing of patent document 1 is known as an electrical connection box which is mounted in a vehicle and controls the power interruption of on-vehicle electrical components. This has a configuration in which a circuit board that forms a desired circuit with a bus bar and electric wires is housed in a housing, and a fuse block, a connector, and the like are provided on a peripheral wall portion of the housing.

Japanese Patent Laid-Open No. 11-27829

However, in the configuration as described above, as the circuit specifications become more complicated, the number of stacked circuit components increases in the plate thickness direction, which causes a problem that the electric junction box becomes large.
The present invention has been completed based on the above circumstances, and an object thereof is to provide a circuit structure that can be reduced in size.

  The circuit structure according to the present invention includes a bus bar portion provided with an element mounting portion and a plurality of bus bars arranged parallel to each other at an interval, and an insert so as to integrate the element mounting portion and the plurality of bus bars. A board part including a molded insulating part, and a switching element mounted on the element mounting part, and at least one of the end parts of the bus bar is disposed on an edge part of the board part and externally A card edge connector part in which the end part including the terminal part in the board part is formed as a flat single plate, and the terminal part is exposed from the insulating part. It is what is said.

  According to such a configuration, since the connector portion is of a card edge connector type, even if a plurality of circuit components are stacked, the connector portion does not have to be enlarged so that the size can be reduced. In addition, since the terminal portion for external connection is integrated with the bus bar, a conventional process such as soldering for connecting the bus bar and the terminal is not required, and the number of assembling steps and costs can be reduced.

  As the embodiments of the present invention, the following embodiments are preferable.

It is preferable that the switching element and the bus bar are electrically connected by a bonding wire.
According to said aspect, since the connection circuit of a switching element and a bus bar can be comprised by the shortest distance, size reduction of a circuit structure body can be achieved. Moreover, the calorific value can be kept low.
Furthermore, when changing the specifications of the circuit structure, it is possible to easily cope with the change only by changing the wiring pattern of the bonding wire and the switching element to be mounted, and a flexible response is possible.

The substrate portion is formed by insert molding together with the insulating portion, and is provided with a frame portion that rises around the element mounting portion, and covers the switching element and the bonding wire in the frame portion. It is preferable that the filler is filled.
According to the above aspect, liquid tightness can be ensured by forming the frame portion integrally with the insulating portion.

  According to the present invention, it is possible to reduce the size of the circuit structure, and consequently, it is possible to reduce the size of the electric junction box in which the circuit structure is accommodated.

The perspective view of the circuit structure in Embodiment 1 The perspective view of the bus-bar board | substrate stamped and formed in Embodiment 1. The perspective view which shows the state in which the resin molding part was formed in Embodiment 1. The perspective view which shows the state which disconnected the bus-bar part from the frame in Embodiment 1. FIG. The perspective view which shows the state which mounted the semiconductor switching element in Embodiment 1. FIG. The perspective view which shows the state which connected the semiconductor switching element and the bus-bar by wire bonding in Embodiment 1. The partial expanded sectional view which shows the state which connected the semiconductor switching element and the bus-bar by wire bonding in Embodiment 1. The perspective view which shows a mode that the circuit structure body of Embodiment 1 was applied to the power distribution unit. The perspective view which shows a mode that the circuit structure body of Embodiment 1 was applied to the junction block. The perspective view which shows a mode that the circuit structure body of Embodiment 2 was applied to the fuse box. The perspective view which shows the state in which the resin molding part was formed in Embodiment 2. The perspective view which shows the state which disconnected the bus-bar part from the frame in Embodiment 2. FIG.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS.
A circuit structure 1 of the present embodiment is shown in FIG. This circuit component 1 is for a vehicle, and is connected between a power source such as a battery and in-vehicle electrical components, and performs on / off control of various in-vehicle electrical components. In the following description, the surface on which the semiconductor switching element 30 is mounted in the circuit structure 1 is the front surface, and the opposite surface is the back surface.

  The circuit structure 1 includes a bus bar portion 10 formed by punching a metal plate having excellent conductivity. The bus bar portion 10 includes a plurality of bus bars 11 formed in an elongated plate shape having the same thickness, and a pair of element mounting portions 13 for mounting the semiconductor switching elements 30. The plurality of bus bars 11 constitutes a set of bus bar groups 11G by being arranged in parallel with a narrow interval in the width direction, and two sets of the bus bar groups 11G are arranged in a direction along the length direction of the bus bars 11. Are in parallel.

  The element mounting portion 13 is formed in a wide plate shape, and a plurality of groove portions 14 for positioning the semiconductor switching element 30 are provided on the surface thereof (in this embodiment, five for each element mounting portion 13). Is provided. Each groove portion 14 has a rectangular shape corresponding to the outer shape of the semiconductor switching element 30 to be mounted, and is arranged in parallel at equal intervals in the length direction of the element mounting portion 13.

  The pair of element mounting portions 13 are juxtaposed in parallel along the length direction, and the length direction of the pair of bus bar groups 11G is in the direction perpendicular to the length direction of the bus bar 11. It is arranged to be sandwiched between them. Of the plurality of bus bars 11 constituting each bus bar group 11G, each of the two bus bars 11 located at both ends is connected to the element mounting portion 13 at the end, and the other bus bars 11 are mounted at the elements. It is arranged with a gap from the portion 13.

  A plurality of semiconductor switching elements 30 are mounted on the element mounting portion 13. Each semiconductor switching element 30 is placed in alignment with the groove 14 on the element mounting portion 13 and fixed by soldering or the like. Although not shown in detail on the surface of the semiconductor switching element 30, terminals are provided, and the terminals are connected to the bus bar 11 via bonding wires 31.

  The plurality of bus bars 11 and element mounting portions 13 are all the same thickness and are arranged on the same plane. In each bus bar 11, the outer end (the opposite side to the element mounting portion 13 side) is a connection terminal portion 12 for connection to an external device.

  A resin molded portion 20 is integrated with the bus bar portion 10 by insert molding. The resin molded portion 20 includes an insulating portion 21 that insulates between adjacent bus bars 11 and between the bus bar 11 and the element mounting portion 13. The insulating portion 21 is embedded between the adjacent bus bars 11 and between the bus bar 11 and the element mounting portion 13 without any gap, and is also provided on the outer side of the outermost bus bar 11 among the plurality of bus bars 11 arranged in parallel. The side of the bus bar 11 is covered. Both ends of the insulating portion 21 in the direction along the length direction of the bus bar 11 are aligned with the distal end portion of the connection terminal portion 12 in the bus bar 11. Further, the thickness of the insulating portion 21 is equal to the thickness of the bus bar 11 and the element mounting portion 13, whereby the bus bar portion 10 and the insulating portion 21 form a flat single plate with no irregularities on the surface. (Hereinafter referred to as the substrate portion 2).

  A frame portion 22 is formed on the surface of the substrate portion 2 so as to surround the element mounting portion 13 and rise to the surface side. The frame portion 22 is composed of four side walls raised from the surface of the substrate portion 2 toward the surface at a position slightly outside the periphery of the element mounting portion 13, and is viewed from the surface side of the substrate portion 2. It has a rectangular shape. The rising height of the frame portion 22 is set higher than the height of the semiconductor switching element 30 mounted on the element mounting portion 13.

  The frame portion 22 is filled with a filler 24 made of, for example, a synthetic resin, and the semiconductor switching element 30 and the bonding wire 31 are buried in the filler 24. Thereby, the periphery of the semiconductor switching element 30 is waterproofed, and the bonding wire 31 is prevented from shaking and coming off due to vibration.

  Further, a bottom wall 23 that covers the back surface of the bus bar 11 and the insulating portion 21 is formed in a region corresponding to a region surrounded by the front frame portion 22 on the back surface of the substrate portion 2.

  Both end portions excluding the region where the frame portion 22 and the bottom wall 23 are formed in the substrate portion 2, that is, the portion including the connection terminal portion 12 of the bus bar 11 has a single plate shape with flat front and back surfaces, This portion is a card edge connector portion 3. In this card edge connector part 3, the front and back surfaces of the connection terminal part 12 are exposed from the insulating part 21, and can contact the terminals of the edge connector socket.

Next, a manufacturing procedure of the circuit structure 1 configured as described above will be described.
First, a bus bar substrate 15 is formed by punching a metal plate as a material by press working (FIG. 2). It should be noted that at the time of punching, the outer end of each bus bar 11 (the end on the side that becomes the connection terminal portion 12) is extended outward to surround each bus bar 11 so that each bus bar 11 does not fall apart. It is connected to the outer frame 16.

  Next, the resin molding part 20 including the insulating part 21 and the frame part 22 is formed by installing the bus bar substrate 15 in a mold (not shown) and performing insert molding with a thermoplastic synthetic resin material (for example, PPS). (FIG. 3). By this insert molding, each bus bar 11 is integrated with the resin molding part 20.

  After forming the resin molding part 20, the bus bar 11 and the outer frame 16 are separated (FIG. 4). At the time of separation, the resin molded portion 20 is cut along the edge portion in the direction along the length direction of the bus bar 11. (In FIG. 3, the cutting position is indicated by a broken line.)

  Next, the semiconductor switching element 30 is mounted on the element mounting portion 13. First, cream solder is applied in alignment with the groove portion 14 of the element mounting portion 13. Then, the semiconductor switching element 30 is placed on the element mounting portion 13 while being aligned with the groove portion 14. In this state, the semiconductor switching element 30 is soldered to the element mounting portion 13 by performing a reflow process (FIG. 5). Subsequently, the terminal on the surface of the semiconductor switching element 30 and the bus bar 11 are connected by wire bonding (FIGS. 6 and 7).

When the mounting is completed, the frame portion 22 is filled with a liquid filler and solidified. The filler is filled to a height position that covers the semiconductor switching element 30 and the bonding wire 31. For example, an epoxy resin can be used as the filler.
As described above, the circuit structure 1 is completed.

  In addition, the circuit structure 1 of this embodiment is applicable to the power distribution unit 40 as shown, for example in FIG.

  The power distribution unit 40 is configured such that the circuit configuration body 1 having the above-described configuration is housed in a casing 41 formed of a synthetic resin in a box shape together with a control board 42. The control substrate 42 is a printed circuit board on which a circuit pattern is formed of copper foil on the surface of an insulating substrate made of a resin material, and a control semiconductor chip 43 is mounted. The rectangular shape is almost equal to the outer shape. In this control board 42, contact pads 44 are provided on the surface at positions where the control board 42 is aligned with the card edge connector portion 3 of the circuit structure 1 when it is overlapped with the circuit structure 1, and the card edge connector portion 45. Is formed. The circuit structure 1 and the control board 42 are arranged in a substantially parallel posture so as to overlap each other with an appropriate gap in the thickness direction, and are accommodated in the casing 41. In the power distribution unit 40 having such a configuration, the card edge connector portions 3 and 45 of the circuit configuration body 1 and the control board 42 are used as external devices equipped with edge connector sockets corresponding to the card edge connector portions 3 and 45. It is possible to make a batch connection.

  Furthermore, the circuit structure 1 of the present embodiment can be applied to a junction block 50 as shown in FIG. 9, for example.

  The junction block 50 includes a box-shaped casing 51 made of synthetic resin. An insertion port 52 for inserting the circuit component 1 into the inside is opened at the ceiling of the casing 51, and a cylindrical hood unit 53 that rises upward along the periphery of the insertion port 52 is provided. ing. A control circuit board 54 is disposed on the bottom surface of the casing 51. The control circuit board 54 is a printed circuit board in which a circuit pattern is formed of copper foil on the surface of an insulating board made of a resin material. On the surface of the control circuit board 54, an edge connector socket 55 is provided at a position directly below the insertion port 52. The edge connector socket 55 is normally a terminal fitting (not shown) that press-contacts the connection terminal portion 12 in a synthetic resin connector housing 56 that can accommodate the card edge connector portion 3 of the circuit structure 1. Of the configuration.

  Inside the casing 51, a plurality of circuit components 1 are accommodated vertically, and one of the card edge connector portions 3 in the circuit components 1 is attached to the edge connector socket 55. The other card edge connector portion 3 faces the hood portion 53.

  In the power distribution unit 40 having such a configuration, the card edge connector portions 3 of the plurality of circuit components 1 can be collectively connected to an external device or the like having an edge connector socket corresponding to the card edge connector portion 3. .

  As described above, according to the present embodiment, the substrate unit 2 of the circuit configuration body 1 includes the element mounting unit 13 and the bus bar unit 10 including the plurality of bus bars 11 arranged in parallel at intervals, the element mounting unit 13 and And an insulating portion 21 that is insert-molded so as to integrate a plurality of bus bars 11. A semiconductor switching element 30 is mounted on the element mounting portion 13. In the bus bars 11 arranged in two rows with the element mounting portion 13 in between, the outer end (opposite side to the element mounting portion 13 side) is arranged at the edge of the substrate portion 2 and is electrically connected to the outside. It is set as the connection terminal part 12 to perform. The edge portion including the connection terminal portion 12 in the board portion 2 is a card edge connector portion 3 in which the connection terminal portion 12 is exposed from the insulating portion 21 and is formed in a flat single plate shape.

  According to such a configuration, since the connector portion for connecting to the outside is a card edge connector type, even if a plurality of circuit components 1 are stacked, it is not necessary to make the connector portion so large and downsizing. Can be planned. Further, since the connection terminal portion 12 for external connection is integrated with the bus bar 11, a conventional process such as soldering for connecting the bus bar and the terminal is not required, and the number of assembling steps and costs can be reduced. I can plan.

  In addition, there is a card edge connector type board with contact pads on a printed circuit board, but this is for small currents that are assumed to be used for signal circuits. There has never been a thing that can handle this. The present invention provides for the first time a card edge connector type circuit structure that can handle a large current circuit by configuring the terminal portion with a bus bar made of heavy copper.

  Further, according to the present embodiment, the semiconductor switching element 30 and the bus bar 11 are electrically connected by wire bonding. According to such a configuration, since the connection circuit between the semiconductor switching element 30 and the bus bar 11 can be configured with the shortest distance, the circuit structure 1 can be reduced in size, and the amount of heat generation can be suppressed low. . Furthermore, when the specification of the circuit structure 1 is changed, it can be easily handled only by changing the wiring pattern of the bonding wires 31 and the switching elements to be mounted, and a flexible response is possible.

  Further, the substrate portion 2 is provided with a frame portion 22 formed by insert molding together with the insulating portion 21 and rising around the element mounting portion 13. The frame portion 22 is filled with a filler 24 that covers the semiconductor switching element 30. According to such a configuration, the frame portion 22 is formed integrally with the insulating portion 21, thereby ensuring liquid tightness.

<Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS. In this embodiment, the circuit structure of the present invention is applied to a module with a fuse terminal. In the following description, the surface on which the semiconductor switching element 30 is mounted in the circuit structure 60 is referred to as the front surface, and the opposite surface is referred to as the back surface.

  The circuit structure 60 of the present embodiment includes a bus bar portion 61 formed by punching a metal plate having excellent conductivity. The bus bar portion 61 includes a plurality of bus bar groups 62G and 64G in which a plurality of bus bars 62 and 64 are arranged in parallel with each other at a narrow interval in the width direction, and an element mounting portion 13 for mounting the semiconductor switching element 30. .

  A plurality of bus bars constituting one bus bar group 62G (the lower bus bar group 62G in FIG. 10) of the two sets of bus bar groups 62G and 64G are connected bus bars 62. The connection-side bus bar 62 is formed in the shape of an elongated plate having the same thickness, and one end of the connection-side bus bar 62 serves as a connection terminal portion 63 for connection to an external device or the like. On the other hand, the plurality of bus bars constituting the other bus bar group 64G (the upper bus bar group 64G in FIG. 10) are the fuse-side bus bars 64. The fuse-side bus bar 64 is formed in an elongated plate shape having the same thickness as the connection-side bus bar 62, and a fuse terminal 65 is formed at one end thereof. The fuse terminal 65 is a tuning fork-shaped terminal having a bifurcated tip, and can be connected to the fuse H.

  The two sets of bus bar groups 62G and 64G are arranged in parallel so that the end opposite to the side on which the connection terminal portion 63 and the fuse terminal 65 are provided faces the mating bus bar groups 62G and 64G, respectively. .

  The element mounting portion 13 is disposed between the two sets of bus bar groups 62G and 64G. Since the configuration of the element mounting portion 13 and the semiconductor switching element 30 mounted here is the same as that of the first embodiment, the same reference numerals are given and description thereof is omitted.

  A resin molding portion 66 is integrated with the bus bar portion 61 by insert molding. Similar to the first embodiment, the resin molding portion 66 includes an insulating portion 67 that insulates between adjacent bus bars 62 and 64 and between the bus bars 62 and 64 and the element mounting portion 13. The insulating portion 67 is embedded between the adjacent bus bars 62 and 64 and between the bus bars 62 and 64 and the element mounting portion 13 without a gap, and is located on the outermost side among the plurality of bus bars 62 and 64 arranged in parallel. Also provided on the outside of 62 and 64, the side surfaces of the bus bars 62 and 64 are covered.

  In the insulating portion 21, the end edge on the connection side bus bar 62 side is aligned with the tip end portion of the connection terminal portion 63. On the other hand, the end edge on the fuse-side bus bar 64 side is located slightly closer to the center (on the element mounting portion 13 side) than the portion where the fuse terminal 65 is formed. The thickness of the insulating part 21 is equal to the thickness of the bus bar 11 and the element mounting part 13, so that the part of the bus bar part 10 excluding the fuse terminal 65 part and the insulating part 21 are flat with no irregularities on the surface. A single plate-like substrate portion 70 is formed.

  A frame portion 22 is formed on the surface of the substrate portion 70 so as to surround the element mounting portion 13 and rise to the surface side, and the inside thereof is filled with a filler 24. A bottom wall 23 is formed on the back surface. Since the structure of the frame part 22, the filler 24, and the bottom wall 23 is the same as that of Embodiment 1, it attaches | subjects the same code | symbol and abbreviate | omits description.

  The part from the end on the connection terminal part 63 side to the edge of the frame part 22 in the board part 70 has a single plate shape with flat front and back surfaces, and this part serves as a card edge connector part 68. Yes. In this card edge connector portion 68, the front and back surfaces of the connection terminal portion 63 are exposed from the insulating portion 67, and can contact the terminals in the edge connector socket.

  In order to produce the circuit structure 60 configured as described above, first, a bus bar substrate 71 is formed by punching a metal plate by press working (FIG. 11). At the time of punching, the outer ends of the bus bars 62 and 64 (the end portions on the side that becomes the connection terminal portions 63 and the fuse terminals 65) are formed on the outer frame 72 so that the bus bars 62 and 64 do not fall apart. It is in a connected state.

  Next, the bus bar substrate 71 is placed in a mold (not shown), and insert molding is performed with a thermoplastic synthetic resin material (for example, PPS), thereby forming the resin molding portion 66 including the insulating portion 67 and the frame portion 22. The

  After forming the resin molding portion 66, the bus bars 62, 64 and the outer frame 72 are separated. In addition, the cutting at the side of the connection terminal portion 63 is performed along the end edge portion in the direction along the length direction of the connection side bus bar 62 in the resin molding portion 66 (the cutting position is indicated by a broken line in FIG. 11). After cutting, the fuse terminal 65 is bent (FIG. 12).

Next, the semiconductor switching element 30 is mounted on the element mounting portion 13 and the filling material 24 is filled and solidified in the frame portion 22. The mounting and filling / solidifying procedures are the same as in the first embodiment.
As described above, the circuit structure 60 is completed. Also with the circuit configuration body 60 of the present embodiment, the same effects as those of the first embodiment can be achieved.

  In addition, the circuit structure 60 of this embodiment can be accommodated in the rectangular box-shaped casing 81 as the module 80 with a fuse terminal, for example, as shown in FIG.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the above embodiment, the frame portion 22 is integrally formed with the insulating portions 21 and 67 by insert molding. However, the frame portion may be formed separately from the insulating portions 21 and 67.
(2) In the second embodiment, the terminal not on the card edge connector portion 68 is a tuning fork-shaped fuse terminal. However, the shape of the terminal on the side not on the card edge connector portion 68 is not particularly limited. For example, a tab-shaped terminal may be used.

DESCRIPTION OF SYMBOLS 1, 60 ... Circuit structure 2, 70 ... Board | substrate part 3, 68 ... Card edge connector part 10, 61 ... Bus-bar part 11, 62 ... Bus-bar 12, 63 ... Connection terminal Part (terminal part)
13 ... Element mounting part 21, 67 ... Insulating part 22 ... Frame part 24 ... Filler 30 ... Semiconductor switching element (switching element)
31 ... Bonding wire

Claims (3)

A board including a bus bar portion provided with an element mounting portion and a plurality of bus bars arranged parallel to each other at an interval, and an insulating portion insert-molded so as to integrate the element mounting portion and the plurality of bus bars And
A switching element mounted on the element mounting portion,
At least one of the end portions of the bus bar is disposed on an end edge portion of the substrate portion, and is a terminal portion that conducts electrical connection with the outside,
The circuit structure body in which the edge part containing the said terminal part in the said board | substrate part is made into the flat single plate shape, and is used as the card edge connector part from which the said terminal part was exposed from the said insulation part.   The circuit structure according to claim 1, wherein the switching element and the bus bar are electrically connected by a bonding wire.   The substrate portion is formed by insert molding together with the insulating portion, and is provided with a frame portion that rises around the element mounting portion, and a filler that covers the switching element and the bonding wire in the frame portion The circuit structure according to claim 1 or 2, wherein

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