JP2006135020A - Electromagnetic wave shielding film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding film which can prevent short-circuit of an electronic circuit and is superior in durability. <P>SOLUTION: The electromagnetic wave shielding film 1 covers the surface of the electronic component mounted in an electronic unit, and shields an electromagnetic wave. The electromagnetic wave shielding film 1 is provided with a substrate film 2 formed of resin, a metal layer 3 laminated on the upper face of the substrate film 2 and projection films 4 and 40 which are laminated on the upper face of the metal layer 3 and are formed of resin. The protection film 40 has end edges 41 of the protection film 40 on outer sides compared to the end edges 21 of the substrate film 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electromagnetic wave shielding film that covers an electronic component mounted inside an electronic device and shields an electromagnetic wave.

  Conventionally, there is an electromagnetic wave shielding film that shields electromagnetic waves by covering an electronic component such as an LSI (integrated circuit) mounted inside an electronic device such as a mobile phone or a digital camera (Patent Document 1). The electromagnetic wave shielding film is formed, for example, by forming a metal layer on the surface of a resin film by fusing or plating a metal foil. The electromagnetic wave is shielded by absorbing the electromagnetic wave by the metal layer. That is, the electromagnetic wave shielding film prevents the electromagnetic wave generated from the electronic component from affecting other components, or prevents the external electromagnetic wave from affecting the electronic component.

  However, with the high integration and compactness of electronic components in electronic equipment, the portion where the electromagnetic wave shielding film should be disposed may be small and narrow. In this case, the metal layer of the electromagnetic wave shielding film may come into contact with other electronic components, causing a short circuit of the electronic circuit. Further, if the metal layer is exposed, the metal layer is likely to corrode, and it may be difficult to obtain sufficient durability.

JP 2003-60387 A

  The present invention has been made in view of such conventional problems, and an object of the present invention is to provide an electromagnetic wave shielding film excellent in durability capable of preventing a short circuit of an electronic circuit.

The present invention is an electromagnetic wave shielding film that shields electromagnetic waves by covering the surface of an electronic component mounted in an electronic device,
The electromagnetic wave shielding film has a base film made of resin, a metal layer laminated on the upper surface of the base film, and a protective film made of resin laminated on the upper surface of the metal layer,
The protective film is an electromagnetic wave shielding film having an edge of the protective film on an outer side than an edge of the base film (Claim 1).

Next, the effects of the present invention will be described.
The electromagnetic wave shielding film is formed by laminating a protective film on the upper surface of the metal layer. Therefore, exposure of the metal layer can be prevented and corrosion thereof can be prevented.
Moreover, the said protective film has an edge on the outer side rather than the edge of the said base film. Therefore, when an electromagnetic wave shielding film is used, the end surface of the metal layer formed on the upper surface of the base film can be covered with the protective film. Thereby, it can prevent that the end surface of a metal layer exposes and can prevent a short circuit of an electronic circuit.

  As mentioned above, according to this invention, the electromagnetic wave shielding film excellent in durability which can prevent the short circuit of an electronic circuit can be provided.

In this invention (Invention 1), it is preferable that the edge of the said protective film is distribute | arranged 0.5-2 mm outside rather than the edge of the said base film.
When the length of the edge of the protective film protruding outward from the edge of the base film is less than 0.5 mm, the metal layer is sufficiently bonded when the electromagnetic wave shielding film is attached to the surface of the electronic component. It may be difficult to cover. On the other hand, when the protrusion length exceeds 2 mm, it may be difficult to make the electromagnetic shielding film sufficiently compact.

  The electromagnetic wave shielding film preferably has a thickness of 30 to 300 μm. Thereby, an electromagnetic wave shielding film having sufficient flexibility can be obtained. When the said thickness is less than 30 micrometers, there exists a possibility that film strength may become inadequate. Moreover, when the said thickness exceeds 300 micrometers, there exists a possibility that it may become difficult to obtain the softness | flexibility of an electromagnetic wave shield film fully.

Moreover, the said base film and the said protective film can be used as resin films, such as a PET (polyethylene terephthalate) film, a polyimide film, a PEN (polyethylene naphthalate) film, a polyethylene film, for example. Among these, a PET film is preferable from the viewpoints of heat resistance, durability, flexibility, cost, and the like.
Moreover, it is preferable that the thickness of a base film is 15-50 micrometers. Moreover, it is preferable that the thickness of a protective film is 15-75 micrometers.

The electromagnetic wave shielding film may cover a plurality of electronic components at once, or may cover individual electronic components individually.
Note that in this specification, the “upper surface” is a term used for convenience, and refers to a surface that is opposite to the electronic component side when attached to the electronic component. Conversely, the surface on the electronic component side is referred to as the “lower surface”.

Moreover, it is preferable that the said protective film provides the opening part which exposes the said metal layer partially (Claim 2).
In this case, the metal layer can be easily connected (grounded) to the ground, and the current flowing through the metal layer can be efficiently released.

The metal layer is preferably made of a film formed by sputtering.
In this case, it is possible to easily form a dense metal layer that has high adhesion to the substrate film, is thin and has a uniform film thickness.
The metal layer in the electromagnetic wave shielding film of the present invention is not limited to a sputtering layer, and for example, a vapor deposition method or a method of fusing a metal foil on a substrate film can be used.

  The metal layer includes a rust preventive layer disposed on the upper surface side to prevent corrosion of the metal layer, and a conductive layer having a lower electrical resistivity than the rust preventive layer, and the conductive layer has a thickness of 50 to 500 nm. It is preferable to have the thickness (Claim 4).

In this case, the rust preventive layer disposed on the outermost surface of the metal layer can be composed of a metal that hardly corrodes, and the conductive layer disposed below the rust preventive layer can be composed of a metal having a sufficiently low electrical resistivity.
Thereby, the electromagnetic wave shielding effect can be ensured by the conductive layer, and the corrosion of the metal layer can be prevented by the rust preventive layer. Therefore, the electromagnetic wave shielding effect can be improved while ensuring the durability of the electromagnetic wave shielding film.

Moreover, since the thickness of the said electroconductive layer is 50-500 nm, the electromagnetic wave shielding effect and the softness | flexibility of an electromagnetic wave shielding film are fully securable. Further, deformation such as warping of the film can be prevented.
Therefore, the electromagnetic wave shielding effect can be improved while ensuring the durability of the electromagnetic wave shielding film.

  If the thickness of the conductive layer is less than 50 nm, it may be difficult to obtain a sufficient electromagnetic shielding effect. When the thickness of the conductive layer exceeds 500 nm, it may be difficult to ensure sufficient flexibility of the electromagnetic wave shielding film. In addition, there is a possibility that deformation such as warping of the film may occur, and productivity may be reduced.

Moreover, it is preferable that the said metal layer has an contact | adherence layer which is distribute | arranged to the interface with the said base film, and ensures contact | adherence with this base film (Claim 5).
In this case, the adhesion between the metal layer and the substrate film is ensured by configuring the adhesion layer arranged at the interface between the metal layer and the substrate film with a metal having a high adhesion to the substrate film. can do.

The adhesion layer preferably has a thickness of 5 to 50 nm.
In this case, sufficient adhesion between the metal layer and the base film can be secured, and deformation such as warping of the film can be prevented.
When the thickness of the adhesion layer is less than 5 nm, it is difficult to ensure sufficient adhesion between the metal layer and the base film, and in some cases, the metal layer may be peeled off from the base film. On the other hand, when the thickness of the adhesion layer exceeds 50 nm, deformation such as warping of the film may occur, and productivity may decrease.

The rust prevention layer preferably has a thickness of 10 to 50 nm.
In this case, it is possible to ensure the rust prevention effect of the metal layer and to prevent deformation such as warping of the film.
When the thickness of the rust preventive layer is less than 10 nm, it may be difficult to ensure the rust preventive effect of the metal layer. When the thickness of the rust preventive layer exceeds 50 nm, deformation such as warping of the film may occur, and productivity may decrease.

The conductive layer preferably has an electric resistivity of 50 μΩcm or less.
In this case, an electromagnetic wave shielding film having a sufficient electromagnetic wave shielding effect can be obtained. Moreover, even if the thickness of a metal layer is small, since sufficient electroconductivity can be ensured, it becomes easy to ensure flexibility by reducing the thickness of an electromagnetic wave shielding film.
When the electrical resistivity of the conductive layer exceeds 50 μΩcm, it may be difficult to obtain a sufficient electromagnetic wave shielding effect.

  Examples of the material of the conductive layer satisfying an electric resistivity of 50 μΩcm or less include metals such as Cu (copper), Ag (silver), Au (gold), and Al (aluminum), or alloys thereof such as Ag and Cu. And an alloy of Cu and Ni.

Among these, the conductive layer is preferably made of Cu (claim 9).
In this case, a conductive layer having a sufficiently small electric resistivity can be obtained at low cost. Therefore, an inexpensive electromagnetic wave shielding film excellent in the electromagnetic wave shielding effect can be obtained.

Moreover, it is preferable that the said rust prevention layer consists of stainless steel (Claim 10).
In this case, a metal layer having excellent corrosion resistance can be easily obtained.
In addition, the said rust prevention layer can also be comprised by the alloy of Ni (nickel), Cr (chromium), or Ni and Cr, for example.
The adhesion layer is also preferably made of stainless steel, and may be composed of Ni, Cr, or an alloy of Ni and Cr. Further, the adhesion layer and the rust prevention layer may be the same material or different materials.

Example 1
The electromagnetic wave shielding film according to the example of the present invention will be described with reference to FIGS.
As shown in FIGS. 7 and 8, the electromagnetic wave shielding film 1 of this example covers the surface of the electronic component 5 mounted on the printed circuit board 50 in the electronic device and shields electromagnetic waves.

As shown in FIG. 1, the electromagnetic wave shielding film 1 includes a base film 2 made of resin, a metal layer 3 laminated on the upper surface of the base film 2, and a protective film made of resin laminated on the upper surface of the metal layer 3. 4, 40.
The protective film 40 has an edge 41 of the protective film 40 on the outer side than the edge 21 of the base film 2.

  The protective films 4 and 40 are arranged in a state where two sheets are stacked. That is, the protective film 4 directly attached to the upper surface of the metal layer 3 by the adhesive material layer 13 and the protective film 40 attached by the adhesive material layer 15 from above the protective film 4 are overlapped. And the edge 41 of the upper protective film 40 is located outside the edge 21 of the base film 2.

The electromagnetic wave shielding film 1 has a total thickness of 50 to 300 μm.
Moreover, the said base film 2 and the protective film 4 consist of PET films. The thickness of the base film 2 can be set to, for example, 15 to 50 μm.
The thickness of the protective film 4 can be 15-75 micrometers, for example. This is because, as shown in Example 3 below, the processing is facilitated when the processing for partially exposing the upper surface of the metal layer 3 is performed, and the flexibility of the electromagnetic wave shielding film is ensured.
Moreover, the said adhesive material layers 13 and 15 consist of acrylic resin etc., for example.

  As shown in FIG. 1, the metal layer 3 is disposed on the interface with the base film 2 to ensure close contact with the base film 2, and the metal layer 3 is disposed on the surface opposite to the close contact layer 31. And a conductive layer having a lower electrical resistivity than the adhesion layer 31 and the rust prevention layer 33 while being disposed between the adhesion layer 31 and the rust prevention layer 33. 32.

The adhesion layer 31 has a thickness of 5 to 50 nm, the rust prevention layer 33 has a thickness of 10 to 50 nm, and the conductive layer 32 has a thickness of 50 to 500 nm.
The metal layer 3 is a film formed by sputtering.
The conductive layer 32 has an electric resistivity of 50 μΩcm or less, and is specifically composed of Cu (copper).
The adhesion layer 31 and the rust prevention layer 33 are made of stainless steel (SUS).

Moreover, as shown in FIG. 5, it is preferable to previously provide an adhesive layer 11 made of an acrylic resin or the like on the lower surface of the base film 2 (surface opposite to the surface on which the metal layer 3 is disposed). In this case, a release film 12 for protecting the adhesive layer 11 is attached to the lower surface of the adhesive layer 11 before use.
Further, the electromagnetic wave shielding film 1 may individually cover each electronic component 5 as shown in FIG. 7, or may cover a plurality of electronic components 5 at a time as shown in FIG. It may be.

Below, an example of the manufacturing method of the electromagnetic wave shielding film 1 of this example is demonstrated.
First, a base film 2 made of a PET film (polyethylene terephthalate film) having a width of 500 mm and a thickness of 20 μm is wound around a feed roll by a length of 200 m and placed in a sputtering apparatus for forming a resin film.

Thereafter, for the purpose of improving the adhesion between the metal layer 3 to be deposited and the base film 2 and the electrical properties of the metal layer 3, a high molecular vacuum of 5 × 10 ⁻⁴ Pa is used for the sputtering apparatus using a turbo molecular pump. To reduce the residual gas and moisture in the sputtering system.
Sputter deposition is performed while the base film 2 is fed from the feed roll to the take-up roll in a state where the sputtering apparatus is evacuated to high vacuum in this way.

First, in forming the adhesion layer 21 as the first layer in the metal layer 3, the base film 2 is transported at a film feed speed of 1.2 m / min, and a metal target made of stainless steel (SUS). Argon (Ar) gas is introduced in an amount of 200 cc / min to the cathode electrode in the film formation chamber where the material is installed. Then, using a pulsed DC (direct current) power source capable of applying a pulse waveform, a high voltage of 200 V is applied between the base film 2 and the target material with a power of 1.5 kW.
As a result, a SUS metal film having a thickness of 25 nm is formed on the base film 2 to form the adhesion layer 31, and the film is wound on the take-up roll.

Next, a conductive layer 32 as a low-resistance metal layer that plays an important role in electromagnetic wave shielding is formed on the adhesion layer 31 made of SUS metal.
That is, first, the cathode electrode in the film formation chamber in which the Cu target material is installed by sending out the film wound in a roll shape by forming the adhesion layer 31 as described above at a film feed speed of 0.3 m / min. In contrast, argon gas is introduced in an amount of 200 cc / min. Then, a high voltage of 350 V is applied between the film and the target material with a power of 6.0 kW using a pulsed DC (direct current) power source.
As a result, a conductive layer 32 made of Cu is formed to a thickness of 200 nm on the adhesion layer 31 made of SUS.

Next, a rust preventive layer 33 that exhibits a rust preventive effect is formed on the conductive layer 32 made of Cu.
That is, while the film on which the adhesion layer 31 and the conductive layer 32 are formed is transported at a film feed speed of 1.2 m / min, 200 cc of argon gas is applied to the cathode electrode in the film formation chamber in which the SUS target material is installed. Introduce in an amount of / min. A high voltage of 200 V is applied between the film and the target material with a power of 1.5 kW using a pulsed DC (direct current) power source.
Thus, a rust prevention layer 33 made of stainless steel (SUS metal) is formed on the conductive layer 32 made of Cu with a thickness of 25 nm.

  In this way, as shown in FIG. 2, the electromagnetic wave shielding film 1 in which the three metal layers 3 (adhesion layer 31, conductive layer 32, rust prevention layer 33) are provided on the base film 2 is provided with a metal film. It is produced in the state of a roll film.

  Next, as shown in FIG. 3, the acrylic film having a thickness of 20 μm is formed on the lower surface (surface opposite to the metal layer 3) of the resin film 2 of the roll film with metal film (electromagnetic wave shielding film 1 in FIG. 2). The adhesive material layer 11 is formed. Thus, a film that can be easily bonded to an electronic component such as an LSI is obtained. Further, a release film 12 for protecting the adhesive material layer 11 is attached to the lower surface of the adhesive material layer 11 before use.

Further, a protective film 4 made of PET having a thickness of 20 μm is bonded to the upper surface of the metal layer 3 in the roll film with a metal film provided with the adhesive material layer 11 shown in FIG. 3 via the adhesive material layer 13 (FIG. 4). . Thereby, it is set as the laminated film 1a which can raise the rust prevention effect of the short circuit prevention and the metal layer 3.
Next, the laminated film 1a shown in FIG. 4 is die-cut according to the shape of an electronic component such as an LSI, so that the laminated film 1a is separated into pieces of, for example, 6 mm × 17 mm as shown in FIG. However, the release film 12 is continuous without being separated.

Next, as shown in FIG. 6, a protective film 40 is further bonded to the upper surface of the protective film 4 via an adhesive material layer 15. And the said protective film 40 is cut | disconnected so that it may become a bigger external shape than the external shape of the laminated | multilayer film 1a separated into pieces. In other words, the protective film 40 is cut so that the edge 41 is outside the edge 21 of the base film 2. For example, when the dimension of the base film 2 is 6 mm × 17 mm, the dimension of the protective film 40 is 8 mm × 19 mm.
As a result, a large number of separated electromagnetic wave shielding films 1 are obtained on the release sheet 12.

  1 to 8 are drawn for the sake of convenience without considering vertical and horizontal scales such as film thickness and film width. The same applies to FIGS. 9 to 11 described later.

In the present embodiment, a layer made of stainless steel having a thickness of 5 to 50 nm is used for the adhesion layer 31. As another method for improving the adhesion, for example, an argon gas is formed before the conductive layer 32 is formed. By applying a frequency of 20 kHz and an applied voltage of 200 V in a chamber atmosphere with a degree of vacuum of 1 torr (133 Pa) into which is introduced, the resin film (base film 2) can be cleaned by plasma treatment and the adhesion can be improved.
However, in order to obtain high reliability, the adhesion layer 31 is provided in this embodiment. The adhesion layer 31 may be a layer made of an oxide film such as SiO ₂ or TiO _2, but a metal is used from the viewpoint of cost because the film formation rate of the oxide film is low.

Next, the function and effect of this example will be described.
As shown in FIG. 1, the electromagnetic shielding film 1 is formed by laminating protective films 4 and 40 on the upper surface of a metal layer 3. Therefore, exposure of the metal layer 3 can be prevented and corrosion thereof can be prevented.
The protective film 40 has an edge 41 on the outer side than the edge 21 of the base film 2. Therefore, as shown in FIGS. 7 and 8, when the electromagnetic wave shielding film 1 is used, the end surface 34 of the metal layer 3 formed on the upper surface of the base film 2 can be covered with the protective film 40. Thereby, it can prevent that the end surface 34 of the metal layer 3 is exposed, and can prevent the short circuit of an electronic circuit.

  In addition, since the metal layer 3 is made of a film formed by sputtering, the metal layer 3 having high adhesion to the base film 2 and having a thin, uniform film thickness can be easily formed.

  The metal layer 3 includes an adhesion layer 31 having a thickness of 5 to 50 nm, a rust prevention layer 33 having a thickness of 10 to 50 nm, and a conductive layer 32 having a thickness of 50 to 500 nm. That is, the adhesion layer 31 arranged at the interface with the base film 2 is made of a metal having high adhesion to the base film 2, and the rust preventive layer 33 arranged on the outermost surface is made of a metal that hardly corrodes. The conductive layer 32 disposed between the two can be made of a metal having a sufficiently low electrical resistivity.

  Thereby, the adhesion between the metal layer 3 and the base film 2 can be secured by the adhesion layer 31, the electromagnetic wave shielding effect can be secured by the conductive layer 32, and the corrosion of the metal layer 3 can be prevented by the rust prevention layer 32. . Therefore, the electromagnetic wave shielding effect can be improved while ensuring the durability of the electromagnetic wave shielding film 1.

Moreover, since the thickness of the said adhesion layer 31 is 5-50 nm, while being able to fully ensure the adhesiveness of the metal layer 3 and the base film 2, deformation | transformation, such as curvature of a film, can be prevented.
Moreover, since the thickness of the conductive layer 32 is 50 to 500 nm, the electromagnetic wave shielding effect and the flexibility of the electromagnetic wave shielding film 1 can be sufficiently ensured. Further, deformation such as warping of the film can be prevented.

Moreover, since the thickness of the said rust prevention layer 33 is 10-50 nm, while ensuring the rust prevention effect of the metal layer 3, deformation | transformation, such as a curvature of a film, can be prevented.
Moreover, since the electrical resistivity of the conductive layer 32 is 50 μΩcm or less, the electromagnetic wave shielding film 1 having a sufficient electromagnetic wave shielding effect can be obtained. Further, by reducing the electrical resistivity, sufficient conductivity can be ensured even if the thickness of the metal layer 3 is small. As a result, it becomes easy to reduce the thickness of the electromagnetic wave shielding film 1 and ensure flexibility.

And by comprising the conductive layer 32 with Cu, the conductive layer 32 having a sufficiently small electrical resistivity can be obtained at low cost, and the inexpensive electromagnetic wave shielding film 1 excellent in the electromagnetic wave shielding effect can be obtained.
Moreover, since the contact | adherence layer 31 and the rust prevention layer 33 consist of stainless steel, while ensuring sufficient adhesiveness with the base film 2, the metal layer 3 excellent in corrosion resistance can be obtained easily.

  Moreover, since it can be set as the electromagnetic shield film 1 which is small and flexible, it can be used for the purpose of shielding electromagnetic waves in a narrow place. For example, an electronic component disposed inside a compact electronic device such as a mobile phone can be easily covered.

  As described above, according to this example, it is possible to provide an electromagnetic wave shielding film excellent in durability capable of preventing a short circuit of an electronic circuit.

(Example 2)
This example is an example of the electromagnetic wave shielding film 1 in which a protective film 40 having an outer shape larger than that of the base film 2 is directly pasted on the upper surface of the metal layer 3 as shown in FIG.
That is, the electromagnetic wave shielding film 1 in Example 1 was laminated with a protective film 4 having the same dimensions as the base film 2 and a protective film 40 having a larger outer shape as shown in FIG. As shown in FIG. 9, the electromagnetic wave shielding film 1 is obtained by laminating a protective film 40 having a large outer shape alone.

The electromagnetic wave shielding film 1 of this example is the same as that shown in Example 1, after the conductive layer 3 is provided and before the protective film 4 is provided (FIG. 3). It can be obtained by bonding a protective film 40 having a large outer shape.
Others are the same as in the first embodiment.

In the case of this example, the thickness of the electromagnetic wave shielding film 1 can be reduced, and the electromagnetic wave shielding film 1 excellent in flexibility can be easily obtained.
In addition, the same effects as those of the first embodiment are obtained.
However, in the case where corrosion due to changes over time after the metal layer 3 is formed and before the protective film 40 is disposed through a number of processes, or when weather resistance is required to be high, etc. The electromagnetic wave shielding film 1 in which the protective films 4 and 40 shown in Example 1 are double-layered is more advantageous.

(Example 3)
This example is an example of the electromagnetic wave shielding film 10 in which an opening 42 that partially exposes the metal layer 3 is provided in the protective film 40 as shown in FIGS. 10 and 11.
The electromagnetic wave shielding film 10 shown in FIG. 10 is applied to the electromagnetic wave shielding film 1 (FIG. 9) shown in Example 2.

In addition, this example can also be applied to the electromagnetic wave shielding film 1 (FIG. 1) shown in Example 1. In this case, the opening 42 is formed continuously on the two protective films 4 and 40.
Others are the same as in the first embodiment.

In this case, the metal layer 3 can be easily connected (grounded) to the ground, and the current flowing through the metal layer 3 can be efficiently released.
In addition, the same effects as those of the first embodiment are obtained.

  In the above Examples 1 to 3, an example in which the metal layer has a three-layer structure including an adhesion layer, a conductive layer, and a rust-preventing layer has been shown. However, the present invention is an electromagnetic wave shield having a three-layer metal layer. It is not limited to film.

Sectional drawing of the electromagnetic wave shielding film in Example 1. FIG. Sectional explanatory drawing which shows the state which formed the metal layer into the upper surface of the resin film in Example 1. FIG. Sectional explanatory drawing which shows the state which provided the adhesive material layer in the lower surface of the resin film in Example 1. FIG. Sectional explanatory drawing which shows the state which laminated | stacked the 1st protective film on the upper surface of the metal layer in Example 1. FIG. Sectional explanatory drawing which shows the state which separated the laminated | multilayer film in Example 1. FIG. Sectional explanatory drawing of the electromagnetic wave shielding film formed in the shape of piece on the release film in Example 1. FIG. Sectional explanatory drawing which shows the use aspect of the electromagnetic wave shielding film which covers each electronic component in Example 1 separately. Sectional explanatory drawing which shows the usage condition of the electromagnetic wave shielding film which covers a some electronic component in Example 1 at once. Sectional drawing of the electromagnetic wave shielding film in Example 2. FIG. Sectional drawing of the electromagnetic wave shielding film in Example 3. FIG. The top view of the electromagnetic wave shielding film in Example 3. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 10 Electromagnetic wave shield film 2 Base film 21 Edge 3 Metal layer 31 Adhesion layer 32 Conductive layer 33 Rust prevention layer 4, 40 Protective film 41 Edge 5 Electronic component

Claims (10)

An electromagnetic wave shielding film that shields electromagnetic waves by covering the surface of an electronic component mounted in an electronic device,
The electromagnetic wave shielding film has a base film made of resin, a metal layer laminated on the upper surface of the base film, and a protective film made of resin laminated on the upper surface of the metal layer,
The protective film has an edge of the protective film on an outer side than an edge of the substrate film.   2. The electromagnetic wave shielding film according to claim 1, wherein the protective film is provided with an opening for exposing the metal layer.   The electromagnetic wave shielding film according to claim 1, wherein the metal layer is a film formed by sputtering.   The metal layer according to any one of claims 1 to 3, wherein the metal layer is disposed on an upper surface side to prevent corrosion of the metal layer, and a conductive layer having a lower electrical resistivity than the rust preventive layer. The electromagnetic wave shielding film, wherein the conductive layer has a thickness of 50 to 500 nm.   5. The electromagnetic wave shielding film according to claim 4, wherein the metal layer has an adhesion layer that is disposed at an interface with the substrate film and ensures adhesion with the substrate film.   6. The electromagnetic wave shielding film according to claim 5, wherein the adhesion layer has a thickness of 5 to 50 nm.   The electromagnetic wave shielding film according to any one of claims 4 to 6, wherein the antirust layer has a thickness of 10 to 50 nm.   8. The electromagnetic wave shielding film according to claim 4, wherein the conductive layer has an electric resistivity of 50 μΩcm or less.   9. The electromagnetic wave shielding film according to claim 8, wherein the conductive layer is made of Cu.   The electromagnetic wave shielding film according to any one of claims 4 to 9, wherein the rust prevention layer is made of stainless steel.

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