TW201419997A - Electromagnetic wave shielding film and method of covering electronic component - Google Patents

Abstract

The present invention relates to an electromagnetic wave shielding film for covering a convex portion (electonic component) provided on a substrate. The electromagnetic wave shielding film includes a base material layer and a blocking layer laminated to the base material layer at a side of one surface thereof. The base material layer is composed of a laminated body in which at least two layers are laminated together. According to the present invention, it is possible to enhance possibility of design of the substrate. Further, it is also possible to provide an electromagnetic wave shielding film having a light weight, a thinner thickness, and excellent shape followability with respect to a convex portion with a height of 500 μ m or more. Further, the present invention provides a method of covering an electronic component by using the above electromagnetic wave shielding film.

Description

Film for electromagnetic wave shielding and coating method for electronic parts

The present invention relates to a diaphragm for electromagnetic wave shielding and a coating method for an electronic component.

In the past, such as mobile phones, electronic components that are susceptible to electromagnetic waves, and heat-generating electronic components such as semiconductor components, and various electronic components such as capacitors and coils, or electronic devices in which such electronic components are mounted on a circuit board. In order to reduce the influence of noise caused by electromagnetic waves, a diaphragm for shielding electromagnetic waves is attached to the surface thereof.

For the electromagnetic wave shielding film, for example, a substrate for electromagnetic wave shielding having a base material layer made of an insulating material and a metal layer laminated on one or both of the base material layers has been developed (for example, see Patent Document 1). .).

However, as described in Patent Document 1, when the diaphragm for electromagnetic wave shielding has a metal layer, there is a possibility that the weight reduction in recent years is required to be satisfied. The problem of thinning.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-156946

In addition to the above-described problems, there is a need for an electronic component having a substrate having a convex portion to be coated with a diaphragm for shielding an electromagnetic wave, and the diaphragm for shielding an electromagnetic wave is not excellent in shape followability with respect to the convex portion. problem. Therefore, in the related art, a method of shielding a metal can formed by aluminum or SUS for an electronic component having a substrate with a convex portion has been conventionally performed. However, this method of shielding by metal cans can not be performed individually for each component on the substrate, but is implemented for a component assembly arranged in a variety of types. Therefore, the arrangement of the components on the substrate is limited, and thus the design freedom of the substrate is not necessarily the best from the functional surface.

Therefore, an object of the present invention is to provide a diaphragm for electromagnetic wave shielding, which can achieve improved design freedom and weight reduction of a substrate. It is thinner and at the same time has good shape followability for electronic parts with bumped substrates. Moreover, another object of the present invention is to provide a coating method for an electronic component using the electromagnetic wave shielding film.

Such an object can be achieved by the present invention described in the following (1) to (17).

(1) A film for electromagnetic wave shielding, which is used for a convex portion on a coated substrate, comprising: a base material layer; and an electromagnetic wave blocking layer laminated on one surface side of the base material layer, the substrate The layer is composed of a laminate obtained by laminating at least two layers.

(2) The electromagnetic wave shielding film according to (1), wherein the base material layer is formed by laminating the first layer, the second layer, and the third layer in this order from the other surface side. Laminate.

(3) The electromagnetic wave shielding film according to (2), wherein the first layer has an average linear expansion coefficient of from 40 to 1000 [ppm/°C] at 25 to 150 °C.

(4) The electromagnetic wave shielding film according to (2) or (3), wherein the thickness T (A) of the first layer is 5 μm Above, 100 μm or less.

(5) The electromagnetic wave shielding film according to any one of (2) to (4) wherein the third layer has an average linear expansion coefficient of from 40 to 1000 [ppm/°C] at 25 to 150 °C.

(6) The electromagnetic wave shielding film according to any one of (2) to (5), wherein the third layer has a thickness T(B) of 5 μm or more and 100 μm or less.

(7) The electromagnetic wave shielding film according to any one of (2) to (6) wherein the second layer has an average linear expansion coefficient of from 400 to 150 [ppm/°C] at 25 to 150 °C.

(8) The electromagnetic wave shielding film according to any one of (2), wherein the thickness T (C) of the second layer is 10 μm or more and 100 μm or less.

The electromagnetic wave shielding film according to any one of (2) to (8), wherein the thickness T (A) of the first layer, the thickness T (B) of the third layer, and the second The thickness T(C) of the layer satisfies the following relationship (I): 0.05<T(C)/(T(A)+T(B))<10. . . (I).

(10) The electromagnetic wave shielding film according to any one of (1) to (9) wherein the electromagnetic wave blocking layer is composed of a reflective layer and an absorbing layer, and the layers are from the substrate layer. One of the sides is a laminate obtained by laminating in this order.

(11) The electromagnetic wave shielding film according to (1), wherein the base material layer is a laminate in which the first layer and the second layer are laminated in this order from the other surface side to form a two-layer structure.

(12) The electromagnetic wave shielding film according to (1), wherein the base material layer is a laminate in which the second layer and the third layer are laminated in this order from the other surface side to form a two-layer structure.

(13) The electromagnetic wave shielding film according to any one of (1) to (12), wherein the electromagnetic wave shielding film is thermocompression bonded to the substrate at a temperature of 150 ° C, a pressure of 2 MPa, and a time of 5 minutes. Shangzhi The shape followability at the time of the convex portion is 500 μm or more and 3,000 μm or less.

(14) The electromagnetic wave shielding film according to any one of (1) to (13) further comprising an insulating layer laminated between the base material layer and the electromagnetic wave blocking layer.

(15) The electromagnetic wave shielding film according to (14), wherein the insulating layer is made of a thermoplastic resin.

(16) The electromagnetic wave shielding film according to (14) or (15), wherein the insulating layer has a thickness T(D) of 3 μm or more and 50 μm or less.

(17) A method of coating an electronic component, comprising the step of attaching a film for electromagnetic wave shielding according to any one of (1) to (16) to the convex portion on the substrate The electromagnetic wave blocking layer is adhered to the electronic component; and the peeling step is performed, after the attaching step, the substrate layer is peeled off from the electromagnetic wave blocking layer.

According to the present invention, the substrate layer provided in the electromagnetic wave shielding film can be formed by the laminate obtained by laminating at least two layers, and the degree of freedom in designing the substrate covered with the electromagnetic wave shielding film can be improved. Lightweight. Thin. Furthermore, it is possible to exhibit good shape followability with respect to electronic parts of the substrate having the convex portion.

1‧‧‧ substrate layer

2‧‧‧Insulation

3‧‧‧Block

4‧‧‧Electronic parts

5‧‧‧Substrate

11‧‧‧1st floor

12‧‧‧3rd floor

13‧‧‧2nd floor

31‧‧‧Absorbent layer

32‧‧‧reflective layer

61‧‧‧ convex

62‧‧‧ recess

100‧‧‧Magnetic wave shielding diaphragm

Fig. 1 is a longitudinal cross-sectional view showing a first embodiment of the electromagnetic wave shielding film of the present invention.

2(a) to 2(b) are longitudinal cross-sectional views showing a method of coating an electronic component using the diaphragm for electromagnetic wave shielding shown in Fig. 1.

Fig. 3 is a longitudinal cross-sectional view showing a second embodiment of the electromagnetic wave shielding film of the present invention.

Fig. 4 is a longitudinal sectional view showing a third embodiment of the electromagnetic wave shielding film of the present invention.

Fig. 5 is a longitudinal cross-sectional view showing a fourth embodiment of the electromagnetic wave shielding film of the present invention.

Fig. 6 is a longitudinal sectional view showing a fifth embodiment of the electromagnetic wave shielding film of the present invention.

Fig. 7 is a longitudinal sectional view showing a sixth embodiment of the electromagnetic wave shielding film of the present invention.

8(a) to 8(b) show the coating of the electronic component using the diaphragm for electromagnetic wave shielding shown in Fig. 7. Longitudinal section of the method.

Fig. 9 is a longitudinal sectional view showing a seventh embodiment of the electromagnetic wave shielding film of the present invention.

Fig. 10 is a longitudinal sectional view showing an eighth embodiment of the electromagnetic wave shielding film of the present invention.

Fig. 11 is a longitudinal sectional view showing a ninth embodiment of the electromagnetic wave shielding film of the present invention.

Fig. 12 is a longitudinal sectional view showing a tenth embodiment of the electromagnetic wave shielding film of the present invention.

Fig. 13 is a longitudinal sectional view showing an eleventh embodiment of the electromagnetic wave shielding film of the present invention.

Fig. 14 is a longitudinal sectional view showing a twelfth embodiment of the electromagnetic wave shielding film of the present invention.

Hereinafter, a film for electromagnetic wave shielding of the present invention and a method of coating an electronic component will be described in detail based on an ideal embodiment shown in the accompanying drawings.

The electromagnetic wave shielding film of the present invention is a film for electromagnetic wave shielding used for covering a convex portion on a substrate. The electromagnetic wave shielding film is composed of a base material layer and an electromagnetic wave blocking layer laminated on one surface side of the base material layer. The base material layer is formed of a laminate obtained by laminating at least two layers.

Moreover, the method of coating an electronic component according to the present invention includes the step of attaching the electromagnetic wave shielding film to the substrate such that the electromagnetic wave blocking layer and the electronic component of the convex portion are adhered; In the peeling step, the base material layer is peeled off from the electromagnetic wave blocking layer after the attaching step.

When the electromagnetic wave shielding film is used to cover the convex portion on the substrate, the electromagnetic wave shielding film is heated while being pressed by the bonding step, so that the electromagnetic wave shielding film and the substrate are close to each other. The material layer and the electromagnetic wave blocking layer function as a substrate having shape followability to the convex portion. Thereby, the electromagnetic wave blocking layer can be pushed into the concave portion in a state of following the shape of the convex portion. As a result, the substrate provided with the convex portion can be surely covered with the electromagnetic wave blocking layer. Therefore, the electromagnetic wave shielding layer can improve the electromagnetic wave shielding property of the substrate provided with the convex portion.

<Plate for electromagnetic wave shielding>

First, the diaphragm for electromagnetic wave shielding of the present invention will be described.

<First embodiment>

Fig. 1 is a longitudinal cross-sectional view showing a first embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 1 is referred to as "upper" and the lower side is referred to as "lower".

The electromagnetic wave shielding film of the present invention is a film for electromagnetic wave shielding for covering the convex portion 61 on the substrate 5.

As shown in FIG. 1, in the present embodiment, the electromagnetic wave shielding film 100 includes a base material layer 1 and an electromagnetic wave blocking layer 3. The electromagnetic wave blocking layer 3 is placed on the bottom surface (one side) side of the base material layer 1 in contact with the base material layer 1 and laminated on the base material layer 1 in this order.

Further, the base material layer 1 is composed of the first layer 11, the second layer 13, and the third layer 12. These are laminated in this order from the top (other side) side of the base material layer 1.

In the following, the electronic component 4 is mounted (mounted) on the substrate 5, and the electronic component 4 is mounted thereon so that the convex portion 61 and the concave portion 62 between the convex portions 61 are formed on the substrate 5, and The case where the convex portion 61 is covered with the electromagnetic wave shielding film 100 will be described. Further, the electronic component 4 mounted on the substrate 5 is, for example, an LCD driver IC mounted on a flexible circuit board (FPC), an IC+ capacitor around the touch panel, or an electronic circuit board (main board).

<Substrate layer 1>

First, the substrate layer 1 will be described.

The substrate layer 1 functions as a bonding step in which the electromagnetic wave blocking layer 3 of the electromagnetic wave shielding film 100 is pushed into the concave portion 62 on the substrate 5 so that when the convex portion 61 is covered, it is pushed in. (Embedded) Electromagnetic wave blocking layer 3, a substrate for improving the shape followability of the electromagnetic wave blocking layer 3 with respect to the convex portion 61. Further, in the peeling step, the base material layer 1 is attached to the electromagnetic wave barrier that has been pushed in the concave portion 62. The state of the layer 3 is peeled off from the electromagnetic wave blocking layer 3.

In the present invention, the base material layer 1 is composed of a laminate of at least two laminated layers.

As described above, the base material layer 1 which is a base material for improving the shape followability of the electromagnetic wave blocking layer 3 to the convex portion 61 is formed of a laminate of at least two laminated layers, whereby the electromagnetic wave shielding film 100 can be used. When the convex portion 61 on the substrate 5 is covered, the electromagnetic wave blocking layer 3 is surely covered in a state corresponding to the shape of the convex portion 61. That is, an improvement in the shape followability of the electromagnetic wave blocking layer 3 with respect to the convex portion 61 can be achieved. As a result, the substrate 5 provided with the convex portion 61 can be surely covered by the electromagnetic wave blocking layer 3, so that the electromagnetic wave shielding (blocking) property of the substrate 5 provided with the convex portion 61 due to the electromagnetic wave blocking layer 3 is improved.

In addition, when the base material layer 1 is composed of a laminate of at least two laminated layers, the height of the convex portion 61 provided in the substrate 5 is 500 μm or more, and further preferably 1.0 to 3.0 mm, and the convex portions 61 are mutually The separation distance (pitch) is 200 μm or less, and further is as small as 100 μm to 150 μm, and the electromagnetic wave blocking layer 3 can be surely pushed into the concave portion 62 in accordance with the shape of the convex portion 61.

In the present embodiment, the base material layer 1 composed of a laminate obtained by laminating two or more layers is composed of the first layer 11, the second layer 13, and the third layer 12. The base material layer 1 is a three-layer laminate in which the top surface (the other surface) side of the base material layer 1 is laminated in this order. In order to improve the shape followability of the electromagnetic wave blocking layer 3 with respect to the convex portion 61, the types, thicknesses, and the like of the respective layers 11 to 13 can be appropriately combined.

The following describes each of these layers 11 to 13 separately.

The first layer 11 has a function of, in the attaching step, when the electromagnetic wave blocking layer 3 is pushed into the concave portion 62 on the substrate 5 by, for example, a vacuum pressure laminator, the vacuum pressure laminator or the like is provided. The pressing portion acts as a release. Further, the first layer 11 has a function of applying a pressing force to the second layer 13 side from the pressing portion.

The constituent material of the first layer (first release layer) 11 is not particularly limited, and for example, A resin material such as styrene, polymethylpentene, polybutylene terephthalate, polypropylene, a cyclic olefin polymer, or an anthrone. Among these, it is preferred to use a row of polystyrene. As described above, polystyrene has crystallinity by using polystyrene having a aligned structure as polystyrene. Therefore, the release property between the first layer 11 and the device, and the heat resistance and shape followability can be excellent.

When the first layer 11 is used in the above-mentioned row of polystyrene, the content thereof is not particularly limited, but is preferably 60% by weight or more, more preferably 70% by weight or more, 95% by weight or less, still more preferably 80% by weight or more, and 90%. It is preferably 1% by weight or less. When the content of the aligned polystyrene is less than the above lower limit value, the release property of the first layer 11 is lowered. Further, when the content of the aligned polystyrene exceeds the above upper limit value, the shape followability of the first layer 11 is lowered.

Further, the first layer 11 may be composed only of the aligned polystyrene. Further, the first layer 11 may further contain a styrene-based elastomer, polyethylene or polypropylene, in addition to the above-mentioned aligned polystyrene.

The thickness T (A) of the first layer 11 is not particularly limited, but is preferably 5 μm or more and 100 μm or less, more preferably 10 μm or more and 70 μm or less, and still more preferably 20 μm or more and 50 μm or less. When the thickness of the first layer 11 is less than the above lower limit value, the first layer 11 is broken and the release property is lowered. When the thickness of the first layer 11 exceeds the above upper limit value, the shape followability of the base material layer 1 is lowered, and the shape followability of the electromagnetic wave blocking layer 3 is lowered.

Further, the average linear expansion coefficient of the first layer 11 at 25 to 150 ° C is preferably 40 to 1000 [ppm / ° C], and more preferably 80 to 700 [ppm / ° C]. When the average linear expansion coefficient of the first layer 11 is set within this range, the first layer 11 has excellent stretchability when the electromagnetic wave shielding film 100 is heated. Therefore, the shape followability of the electromagnetic wave blocking layer 3 with respect to the convex portion 61 can be more surely improved.

Moreover, the average linear expansion coefficient of each layer can be obtained, for example, using a thermomechanical analyzer ("TMASS6100" manufactured by Seiko Instruments Inc.). Specifically, the storage elastic modulus of each layer to be measured was measured under the conditions of a tensile mode of a fixed load of 25 to 200 ° C and 49 mN and a temperature rising rate of 5 ° C /min. The average linear expansion coefficients at 25 ° C to 150 ° C in the thermomechanical analysis device at this time were respectively read. Thereby, the average linear expansion coefficient can be obtained.

Further, the surface tension of the first layer 11 is preferably 20 to 40 [mN/m], and more preferably 25 to 35 [mN/m]. The first layer 11 having the surface tension in this range has excellent release properties. Moreover, after the push-in process is performed using a vacuum pressure type laminator or the like, the first layer 11 can be peeled off from the pressing portion.

The third layer 12 has the following effect: in the attaching step, after the electromagnetic wave blocking layer 3 is pushed into the concave portion 62 on the substrate 5 by using a vacuum pressure laminator or the like, the substrate layer 1 is subjected to electromagnetic waves in the peeling step. When the barrier layer 3 is peeled off, the substrate layer 1 is provided with releasability. Further, the third layer 12 has a function of following the shape of the convex portion 61 on the substrate 5 and providing a pressing force to the electromagnetic wave blocking layer 3 side from the pressing portion.

The constituent material of the third layer (second release layer) 12 is not particularly limited, and examples thereof include: aligned polystyrene, polymethylpentene, polybutylene terephthalate, polypropylene, and ring. A resin material such as an olefin polymer or an anthrone. Among these, it is preferred to use a row of polystyrene. As described above, polystyrene has crystallinity by using polystyrene having a aligned structure as polystyrene. Therefore, the release property between the third layer 12 and the electromagnetic wave blocking layer 3 is excellent in heat resistance and shape followability.

In the third layer 12, the content of the above-mentioned aligned polystyrene is not particularly limited, and may be composed only of the aligned polystyrene, but is preferably 60% by weight or more, more preferably 70% by weight or more, and 95% by weight or less. More preferably, it is 80% by weight or more and 90% by weight or less. When the content of the aligned polystyrene is less than the above lower limit value, the release property of the third layer 12 is lowered. Further, when the content of the aligned polystyrene exceeds the above upper limit value, the shape followability of the third layer 12 is lowered.

Further, the third layer 12 may further contain a styrene-based elastomer, polyethylene or polypropylene, in addition to the above-mentioned aligned polystyrene. Further, the third layer 12 and the resin constituting the first layer 11 may be the same or different.

The thickness T (B) of the third layer 12 is not particularly limited, but is preferably 5 μm or more and 100 μm or less, more preferably 10 μm or more and 70 μm or less, and still more preferably 20 μm or more and 50 μm or less. When the thickness of the third layer 12 is less than the aforementioned lower limit value, heat resistance is lowered, and the base material layer is heat-resistant under the thermocompression bonding step. Drop, there is deformation and deformation of the electromagnetic wave barrier layer occurs. When the thickness of the third layer 12 exceeds the above upper limit value, the total thickness of the entire electromagnetic wave shielding film is increased, and the workability such as cutting is lowered. Moreover, the cost is not economical.

Further, the thickness of the third layer 12 and the first layer 11 may be the same or different.

Further, the average linear expansion coefficient of the third layer 12 at 25 to 150 ° C is preferably 40 to 1000 [ppm / ° C], and more preferably 80 to 700 [ppm / ° C]. When the average linear expansion coefficient of the third layer 12 is set to be within this range, when the electromagnetic wave shielding film 100 is heated, the third layer 12 has excellent stretchability. Therefore, the third layer 12 can further improve the shape followability of the electromagnetic wave blocking layer 3 with respect to the convex portion 61.

Further, the surface tension of the third layer 12 is preferably 20 to 40 [mN/m], and more preferably 25 to 35 [mN/m]. The third layer 12 having the surface tension in this range has excellent release properties. Moreover, when the base material layer 1 is peeled off from the electromagnetic wave blocking layer 3 by the pressing process using a vacuum pressure type laminator or the like, the base material layer 1 can be surely between the third layer 12 and the electromagnetic wave blocking layer 3. The interface is peeled off.

The second layer 13 is used as a substrate for pushing the substrate layer 1 into the substrate, and when the electromagnetic wave blocking layer 3 is pushed into the recess 62 on the substrate 5, the third layer 12 has a push for the recess 62. (buried) buffer function. Further, the second layer 13 has a function of imparting a pushing force to the third layer 12 and further uniformly applying the third layer 12 to the electromagnetic wave blocking layer 3. Thereby, the electromagnetic wave blocking layer 3 can be pushed into the concave portion 62 with excellent sealing properties without causing voids between the electromagnetic wave blocking layer 3 and the concave portion 62 and the convex portion 61.

The constituent material of the second layer (buffer layer) 13 is, for example, an α-olefin polymer such as polyethylene or polypropylene, or a copolymer component of ethylene, propylene, butene, pentene, hexene or methylpentene. The engineering plastic resin such as an α-olefin copolymer, a polyether oxime or a polyphenylene sulfide may be used alone or in combination. Among these, an α-olefin-based copolymer is preferably used. Specific examples thereof include a copolymer of an α-olefin such as ethylene and a (meth)acrylate, a copolymer of ethylene and vinyl acetate, a copolymer of ethylene and (meth)acrylic acid (EMMA), and a partial ion thereof. Cross-linking, etc. Alkenyl The hydrocarbon-based copolymer is excellent in shape followability and is superior in flexibility to the constituent material of the third layer 12. Thereby, the buffer function for pushing (embedding) the third layer 12 into the concave portion 62 can be surely provided to the second layer 13 composed of the constituent material.

The thickness T (C) of the second layer 13 is not particularly limited, but is preferably 10 μm or more and 100 μm or less, more preferably 20 μm or more and 80 μm or less, and still more preferably 30 μm or more and 60 μm or less. When the thickness of the second layer 13 is less than the lower limit value, the shape followability of the second layer 13 is lowered, and the followability of the convex portion 61 in the thermocompression bonding step is lowered. When the thickness of the second layer 13 exceeds the above upper limit value, the resin is oozing out from the second layer 13 in the thermocompression bonding step, and adheres to the hot plate of the pressure bonding device, and the workability is lowered.

Further, the average linear expansion coefficient of the second layer 13 at 25 to 150 ° C is preferably 400 or more [ppm / ° C], and more preferably 800 or more [ppm / ° C]. When the average linear expansion coefficient of the second layer 13 is set to be within this range, when the electromagnetic wave shielding film 100 is heated, the second layer 13 is more likely to have more excellent stretchability than the third layer 12. Therefore, the second layer 13 can be further improved in the shape followability of the electromagnetic wave blocking layer 3 with respect to the convex portion 61.

Further, by appropriately setting the average linear expansion coefficients of the respective layers 11 to 13 within the above range, it is possible to easily set the storage elastic modulus of the base material layer 1 described later at 150 ° C to be in the range of 2.0E+05 to 5.0E+08 Pa. .

Further, the thickness T (A) of the first layer 11, the thickness T (B) of the third layer 12, and the thickness T (C) of the second layer 13 are preferably, for example, satisfying the following relationship: 0.05 < T (C) ) / (T (A) + T (B)) < 10, which satisfies the following relationship, 0.14 < T (C) / (T (A) + T (B)) < 4, more preferably satisfies the following relationship Formula 0.3 < T (C) / (T (A) + T (B)) < 1.5.

The thickness T (A) of the first layer 11, the thickness T (B) of the third layer 12, and the thickness of the second layer 13 T(C), by satisfying the above relationship, shape followability is further improved.

The thickness T (F) of the entire base material layer 1 is not particularly limited, but is preferably 20 μm or more and 300 μm or less, more preferably 40 μm or more and 220 μm or less, and still more preferably 70 μm or more and 160 μm or less. When the thickness of the entire base material layer 1 is less than the above lower limit value, the first layer 11 may be broken and the release property of the base material layer 1 may be lowered. When the thickness of the entire base material layer 1 exceeds the above upper limit value, the shape followability of the base material layer 1 is lowered, and the shape followability of the electromagnetic wave blocking layer 3 is lowered.

Further, in the substrate layer 1 composed of the above laminate, the storage elastic modulus at 150 ° C is preferably 2.0E+05 to 5.0E+08Pa, more preferably 1.0E+06 to 3.0E+08Pa, 3.0. E+06~9.0E+07Pa is even better.

As described above, by setting the storage elastic modulus of the base material layer 1 serving as the base material for improving the shape followability of the electromagnetic wave blocking layer 3 to the convex portion 61 to be within the above range, the film for electromagnetic wave shielding is used. When the sheet 100 covers the convex portion 61 on the substrate 5, the electromagnetic wave blocking layer 3 can be more reliably pushed into the concave portion 62 in accordance with the shape of the convex portion 61. As a result, the substrate 5 provided with the convex portion 61 can be more reliably covered by the electromagnetic wave blocking layer 3. Therefore, the electromagnetic wave shielding layer 3 can be used to further improve the electromagnetic wave shielding (blocking) property of the substrate 5 on which the convex portion 61 is provided.

Further, the storage elastic modulus of the substrate layer 1 at 25 ° C is preferably 1.0E+07 to 1.0E+10Pa, and more preferably 5.0E+08 to 5.0E+09Pa. As described above, by setting the storage elastic modulus at room temperature (at room temperature), that is, at 25 ° C, within the above range, the base material layer 1 can be solid rather than liquid before heating the electromagnetic wave shielding film 100. Further, when the electromagnetic wave shielding film 100 is heated, it is semi-solid (gel-like). Therefore, when the base material layer 1 (the electromagnetic wave shielding film 100) is attached to the substrate 5, the base material layer 1 can be attached to the substrate 5 without wrinkles or the like. Moreover, the workability when the electromagnetic wave shielding film 100 is cut into a predetermined size is also improved. Further, when the concave portion 62 provided in the substrate 5 is pushed in, the electromagnetic wave blocking layer 3 can be surely pushed into the concave portion 62 by the base material layer 1. Further, in the base material layer 1 having the characteristics of the storage elastic modulus, at least the first layer 11 and the third layer 12 are preferably made of a thermoplastic resin, and after heating the electromagnetic wave shielding film 100 in the attaching step, It is preferred to maintain the storage modulus at 25 ° C within the above range. Thereby, the peeling step can be performed from the electromagnetic The wave blocking layer 3 easily peels off the substrate layer 1.

Furthermore, when the storage elastic modulus of the substrate layer 1 at 120 ° C is A [Pa], and the storage elastic modulus of the substrate layer 1 at 150 ° C is B [Pa], the relationship of 0.02 ≦ A / B ≦ 1.00 should be satisfied. Ideally, it is more desirable to satisfy the relationship of 0.02 ≦A/B ≦ 0.50. When the base material layer 1 satisfying this relationship is heated, it can be said that the change in the storage elastic modulus of the base material layer 1 due to the temperature change during heating is small. Therefore, even if the temperature condition at the time of heating changes, the magnitude of the change in the storage modulus of the substrate layer 1 due to this temperature change can be within the necessary minimum. Therefore, the electromagnetic wave blocking layer 3 can be more reliably pushed into the concave portion 62 by the base material layer 1.

Further, the storage elastic modulus of each layer at 25 ° C, 120 ° C, and 150 ° C can be obtained by, for example, a dynamic viscoelasticity measuring apparatus ("MSC100" manufactured by Seiko Instruments Inc.). Specifically, the storage elastic modulus of each layer to be measured was measured under the conditions of a tensile mode of a fixed load of 25 to 200 ° C and 49 mN, a temperature increase rate of 5 ° C / min, and a frequency of 1 Hz. The storage elastic coefficients at 25 ° C, 120 ° C and 150 ° C were read in the dynamic viscoelasticity measuring device, respectively. Thereby, the storage elastic coefficient can be obtained.

<Block layer 3>

Next, it is explained for the electromagnetic wave blocking layer (barrier layer) 3.

The electromagnetic wave blocking layer 3 has a function of blocking (shading) the electronic component 4 (the convex portion 61) provided on the substrate 5, and being located on the opposite side of the substrate 5 (electronic component 4) from the electromagnetic wave blocking layer 3 Electromagnetic waves generated by at least one of the other electronic components and the like.

The electromagnetic wave blocking layer 3 is not particularly limited, and may block electromagnetic waves in an arbitrary form, for example, by reflecting a reflective layer that blocks electromagnetic waves incident on the electromagnetic wave blocking layer 3, and by incident on the electromagnetic wave blocking layer 3 by absorption. An electromagnetic wave blocks to block (shadow) the absorption layer.

Hereinafter, the reflective layer and the absorbing layer will be separately described.

The reflective layer, as described above, is blocked by reflecting electromagnetic waves incident on the reflective layer.

The reflective layer is, for example, a conductive adhesive layer, a metal thin film layer, a surface treated layer of a conductive material such as a metal mesh or ITO, or the like. These can be used alone or in combination. Among these, it is preferred to use a conductive adhesive layer. The conductive adhesive layer is suitable as a reflective layer even if it has a thin film thickness (thickness) and exhibits excellent electromagnetic shielding properties.

The conductive adhesive layer is composed of a metal powder and a binder resin. Metal powders such as gold, silver, copper or silver coated with copper, nickel, and the like. Among these, silver is preferably used for the reason that the electromagnetic wave shielding property is excellent.

In the conductive adhesive layer, the content ratio of the metal powder to the binder resin is not particularly limited, and is preferably 40:60 to 90:10 by weight, more preferably 50:50 to 80:20, and more preferably. It is 55:45~70:30. When the content ratio of the metal powder to the binder resin is lower than the above lower limit value, it becomes difficult to exhibit conductivity. Further, when the content ratio of the metal powder to the binder resin exceeds the above upper limit value, flexibility or adhesion to electronic equipment components may be lowered.

The conductive adhesive layer may further contain a flame retardant, a leveling agent, a viscosity adjuster, etc., in addition to the metal powder and the binder resin.

The thickness T (E1) of the reflective layer is not particularly limited, and is preferably 5 μm or more and 100 μm or less, more preferably 8 μm or more and 50 μm or less, and still more preferably 10 μm or more and 30 μm or less. When the thickness of the reflective layer is less than the above lower limit value, the folding resistance is lowered depending on the constituent material of the reflective layer, and the loaded component has a flaw in the end portion. When the thickness of the reflective layer exceeds the above upper limit value, the shape followability may be lowered depending on the constituent material of the reflective layer or the like. In addition, when the thickness T (E1) of the reflective layer is set within this range, excellent electromagnetic wave shielding properties can be exhibited. Therefore, the thickness of the reflective layer T (E1) can be reduced, and the weight of the substrate 5 on which the electronic component 4 covered with the electromagnetic wave blocking layer (reflecting layer) 3 is loaded can be achieved.

The absorbing layer, as described above, absorbs electromagnetic waves that have been incident on the absorbing layer and converts electromagnetic energy into thermal energy to block electromagnetic waves.

The absorbing layer is, for example, a dielectric absorbing material composed of a conductive absorbing material such as a metal powder or a conductive polymer material, and a dielectric material composed of a dielectric material such as a carbon material or a conductive polymer material. The absorbing layer and the main material are magnetic absorbing layers composed of magnetic absorbing materials such as soft magnetic metals, and the like, which may be used singly or in combination.

Further, the conductive absorbing layer converts electromagnetic energy into heat energy to absorb electromagnetic waves by a current flowing inside the material when an electric field is applied. The dielectric absorbing layer converts the energy of electromagnetic waves into thermal energy by dielectric loss to absorb electromagnetic waves. The magnetic absorbing layer absorbs electromagnetic waves by converting the energy of the electric wave into heat by utilizing magnetic loss such as overcurrent loss, hysteresis loss, and magnetic resonance.

Among these, it is preferred to use a dielectric absorbing layer or a conductive absorbing layer.

The dielectric absorbing layer and the conductive absorbing layer can exhibit particularly excellent electromagnetic wave shielding properties even if they are thin. Therefore, it should be used as an absorption layer. Further, since the particle diameter of the material contained in the layer can be small or the amount of addition thereof can be small, the film thickness can be easily set to be thin, and the weight can be reduced.

Further, the conductive absorbing material is, for example, a conductive polymer, a metal oxide such as ATO, or a conductive ceramic.

Further, the conductive polymer is, for example, polyacetylene, polypyrrole, PEDOT (poly-ethylenedioxythiophene), PEDOT/PSS, polythiophene, polyaniline, poly(p-phenylene), polyfluorene, polycarbazole, polydecane or the like. One or more of these may be used, or two or more types may be used in combination.

Examples of the dielectric absorbing material include a carbon-based material and a conductive polymer.

Further, carbon-based materials such as single-layer carbon nanotubes, carbon nanotubes such as multi-layered carbon nanotubes, nano carbon fibers, CN nanotubes, CN nanofibers, BCN nanotubes, BCN nanometers For carbon, graphene, carbon microcoil, carbon nanocoil, carbon nanohorn, carbon nanowool, etc., one of these may be used or two of them may be used in combination. the above.

Further, magnetic absorbing materials such as iron, niobium steel, magnetic stainless steel (Fe-Cr-Al-Si alloy), stellite aluminum alloy (Fe-Si-Al alloy), permalloy (permalloy) Fe-Ni alloy), beryllium copper (Fe-Cu-Si alloy), Fe-Si alloy, soft magnetic metal such as Fe-Si-B (-Cu-Nb) alloy, ferrite or the like.

The thickness T (E2) of the absorbing layer is not particularly limited, and is preferably 1 μm or more and 100 μm or less, more preferably 2 μm or more and 80 μm or less, and still more preferably 3 μm or more and 50 μm or less. When the thickness of the absorbing layer is less than the aforementioned lower limit value, depending on the constituent material of the absorbing layer or the like, the substrate-loaded component has a flaw in the end portion. Further, when the thickness of the absorbing layer exceeds the above upper limit value, the shape followability may be lowered depending on the constituent material of the absorbing layer or the like. Further, when the thickness T (E2) of the absorbing layer is set to be within this range, excellent electromagnetic wave shielding properties can be exhibited. Therefore, the thickness T (E2) of the absorption layer can be reduced, and the weight of the substrate 5 on which the electronic component 4 covered with the electromagnetic wave barrier layer (absorption layer) 3 is loaded can be reduced.

As the above electromagnetic wave blocking layer 3, the electromagnetic wave shielding property of blocking (shielding) electromagnetic waves is preferably 5 dB or more, more preferably 30 dB or more, and more preferably 50 dB or more. The electromagnetic wave blocking layer 3 having such electromagnetic wave shielding properties has excellent electromagnetic wave shielding properties and can more reliably block electromagnetic waves.

Further, the electromagnetic wave blocking layer 3 preferably has a storage elastic modulus at 150 ° C of 1.0E+05 to 1.0E+09Pa, and more preferably 5.0E+05 to 5.0E+08Pa. In the range in which the storage elastic modulus is set, in the attaching step, after the electromagnetic wave shielding film 100 is heated, the electromagnetic wave blocking layer 3 is pushed into the concave portion 62 on the substrate 5 by the pressing force from the substrate layer 1 to be covered. In the case of the convex portion 61, the electromagnetic wave blocking layer 3 can be deformed in accordance with the shape of the convex portion 61 in response to the pressing force from the base material layer 1. That is, the shape followability of the electromagnetic wave blocking layer 3 with respect to the convex portion 61 can be improved.

Further, as described above, the electromagnetic wave blocking layer 3 may be either a reflective layer or an absorbing layer, but when it has approximately the same electromagnetic shielding properties, it is preferably an absorbing layer. The absorbing layer blocks electromagnetic waves by absorbing electromagnetic waves that have been incident on the absorbing layer and converting the electromagnetic wave energy into thermal energy. Therefore, since the absorption suppresses the electromagnetic wave, it is possible to surely prevent the electromagnetic wave reflected as the reflective layer from adversely affecting the malfunction of other members or the like which are not covered by the electromagnetic wave blocking layer 3.

The electromagnetic wave shielding film 100 having the above configuration is thermally bonded to the concave portion 62 and the convex portion 61 formed by mounting the electronic component 4 on the substrate 5 under the conditions of a temperature of 150 ° C, a pressure of 2 MPa, and a time of 5 minutes. The shape followability of the film 100 is preferably 500 μm or more, more preferably 800 μm or more, and still more preferably 1000 μm or more. In other words, it is preferable that the difference between the top surface of the convex portion 61 and the bottom surface of the concave portion 62, that is, the convex portion 61 having a height of 500 μm or more is coated with the electromagnetic wave shielding film 100, and the convex portion having a height of 800 μm or more can be used. The coating of 61 is better, and it is better to cover the convex portion 61 having a height of 1000 μm or more. In this manner, the electromagnetic wave shielding film 100 capable of covering the convex portion 61 having a high height (large difference) has excellent shape followability. Moreover, the electromagnetic wave blocking layer 3 can be used to cover the convex portion 61 with an excellent filling rate with respect to the concave portion 62.

Further, the shape followability can be obtained as follows.

That is, first, a printed circuit board (main board) having a length of 100 mm × a width of 100 mm × a height of 2 mm was formed in a checkerboard shape at a spacing of 0.2 mm to form a groove having a width of 0.2 mm and a predetermined height difference to obtain a printed circuit board. Thereafter, the electromagnetic wave shielding film was pressure-bonded to the printed circuit board at 150 ° C × 2 MPa × 5 minutes using a vacuum pressure laminator, and attached to the printed circuit board. After the attachment, the base material layer is peeled off from the electromagnetic wave shielding film. Then, it is judged whether there is a gap between the barrier layer attached to the printed circuit board and the groove on the printed circuit board. Further, whether or not there is a void is observed and evaluated by a microscope or a microscope.

<Method of covering electronic parts>

Next, a description will be given of a coating method of the electronic component of the present invention.

The method for coating an electronic component according to the present invention includes the step of attaching the electromagnetic wave shielding film to the substrate so that the electromagnetic wave blocking layer adheres to the electronic component, and the peeling step, in the attaching After the attaching step, the aforementioned substrate layer is peeled off from the electromagnetic wave blocking layer.

Fig. 2 is a longitudinal cross-sectional view showing a method of coating an electronic component using the diaphragm for electromagnetic wave shielding shown in Fig. 1.

The following steps for the method of covering the electronic component are described in order.

(attachment step)

The attaching step is a step of attaching the electromagnetic wave shielding film 100 to the substrate 5 so as to be applied to the convex portion 61 on the substrate 5, as shown in Fig. 2(a).

The attachment method is not particularly limited, and is, for example, a vacuum pressure forming method.

The vacuum pressure forming method is a method in which the convex portion 61 on the substrate 5 is coated with the electromagnetic wave shielding film 100 by using a vacuum pressure laminator. First, the substrate 5 and the electromagnetic wave shielding film 100 are placed in a sealed space that can be set in a vacuum gas atmosphere, and the surface of the substrate 5 on the side where the convex portion 61 is formed, and the electromagnetic wave shielding film 100 are placed. The faces on the side of the electromagnetic wave blocking layer 3 are opposed to each other. Then, this is equal to heating, and the sealed space is placed in a vacuum gas atmosphere, and the electromagnetic wave shielding film 100 is uniformly approached from the electromagnetic wave shielding film 100 side toward the substrate 5. Then pressurize this. Thereby, a vacuum pressure forming method is carried out.

In this case, in the present invention, the base material layer 1 is composed of a laminate obtained by laminating at least two layers. When the base material layer 1 is configured for this purpose, the base material layer 1 can exhibit excellent shape followability with respect to the convex portion 61 when heated by the vacuum pressure forming method.

Therefore, in this state, the electromagnetic wave shielding film 100 is uniformly pressurized from the electromagnetic wave shielding film 100 side while the sealed space is in a vacuum gas atmosphere, and the substrate layer 1 is adapted to the shape of the convex portion 61. And deformation. Further, with this deformation, the electromagnetic wave blocking layer 3 located on the substrate 5 side of the base material layer 1 is deformed in accordance with the shape of the convex portion 61. Thereby, the electromagnetic wave blocking layer 3 is pushed into the concave portion 62 in accordance with the shape of the convex portion 61, and the convex portion 61 is covered with the electromagnetic wave blocking layer 3.

In the attachment step, the attachment temperature is not particularly limited, and is preferably 100 ° C or more and 200 ° C or less, more preferably 120 ° C or more and 180 ° C or less.

Further, the attachment pressure is not particularly limited, and is preferably 0.5 MPa or more and 5.0 MPa or less, more preferably Preferably, it is 1.0 MPa or more and 3.0 MPa or less.

Further, the attachment time is not particularly limited, but is preferably 1 minute or longer and 30 minutes or shorter, more preferably 5 minutes or longer and 15 minutes or shorter.

By setting the conditions in the attaching step to the above range, the electromagnetic wave blocking layer 3 can be surely covered with the convex portion 61 in a state where the electromagnetic wave blocking layer 3 is pushed into the concave portion 62 on the substrate 5.

(peeling step)

The peeling step is, for example, a step of peeling the base material layer 1 from the electromagnetic wave shielding film 100 after the attaching step, as shown in FIG. 2(b).

In the present embodiment, the interface between the base material layer 1 and the electromagnetic wave blocking layer 3 in the electromagnetic wave shielding film 100 is peeled off, and as a result, the base material layer 1 is peeled off from the electromagnetic wave blocking layer 3. Thereby, the convex portion 61 is covered with the electromagnetic wave blocking layer 3 in a state where the base material layer 1 has been peeled off from the electromagnetic wave blocking layer 3.

In addition, the convex portion 61 is covered by the electromagnetic wave blocking layer 3 using the electromagnetic wave shielding film 100. As shown in Fig. 2, the convex portion 61 can be shielded by an electromagnetic wave in accordance with the shape of the electromagnetic wave shielding film 100 to be attached. 3 covers. Therefore, by appropriately setting the shape of the electromagnetic wave shielding film 100 in accordance with the shape of the convex portion 61 to be covered, the convex portion 61 to be coated can be selectively covered with the electromagnetic wave blocking layer 3. That is, the selective electromagnetic wave shielding of the convex portion 61 can be performed by the electromagnetic wave blocking layer 3.

In addition, the method of peeling off the base material layer 1 is not particularly limited, and when the electromagnetic wave shielding film 100 after the vacuum pressure forming method is completed (the above-described attaching step) is in a high temperature state, the substrate layer 1 may be elongated. Residual resin, etc., and the workability of peeling is lowered, so that peeling by hand can be mentioned.

This peeling by manual work, for example, first holds one end portion of the base material layer 1. then, The base layer 1 is peeled off from the electromagnetic wave blocking layer 3 with the end portion held thereby as a starting point. Next, the base material layer 1 is sequentially peeled off from the electromagnetic wave blocking layer 3 from the end portion to the central portion of the base material layer 1 and to the other end portion of the base material layer 1. In this manner, the base material layer 1 is peeled off from the electromagnetic wave blocking layer 3.

The peeling temperature is preferably 180 ° C or lower, more preferably 150 ° C or lower, and still more preferably 100 ° C or lower.

By the above steps, the convex portion 61 can be covered with the electromagnetic wave blocking layer 3 in a state where the base material layer 1 has been peeled off from the electromagnetic wave blocking layer 3.

In the present embodiment, as shown in FIG. 1, the magnetic wave shielding for the base material layer 1 (the first layer 11, the second layer 13, and the third layer 12) and the electromagnetic wave blocking layer 3 are laminated in this order. The case of the diaphragm 100 in which the convex portion 61 on the substrate 5 is covered with the electromagnetic wave blocking layer 3 will be described. However, the layer configuration of the electromagnetic wave shielding film 100 is not limited to this. For example, the electromagnetic wave shielding film 100 having the layers of the second to twelfth embodiments shown below can be used.

<Second embodiment>

The second embodiment of the electromagnetic wave shielding film of the present invention will be described below.

Fig. 3 is a longitudinal cross-sectional view showing a second embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 3 is referred to as "upper" and the lower side is referred to as "lower".

The electromagnetic wave shielding film 100 shown in FIG. 3 will be described below, but the description of the electromagnetic wave shielding film 100 shown in FIG. 1 will be omitted.

In the electromagnetic wave shielding film 100 shown in FIG. 3, the formation of the first layer 11 provided in the base material layer 1 is omitted, whereby the base material layer 1 becomes the second layer 13 and the third layer 12 from the top surface side. The laminate of the two layers laminated in this order is the same as the electromagnetic wave shielding film 100 shown in Fig. 1 .

In other words, in the present embodiment, the electromagnetic wave shielding film 100 is sequentially laminated with the second layer. 13. A substrate obtained by the third layer 12 and a laminate of the electromagnetic wave barrier layer 3.

The electromagnetic wave shielding film 100 having such a configuration is provided with a pressing portion possessed by a vacuum pressure laminator or the like that pushes the electromagnetic wave blocking layer 3 into the concave portion 62 on the substrate 5 in the attaching step, and is provided with the second portion. The release property of the layer 13 thus omits the formation of the first layer 11.

In this case, the degree of release property of the contact surface between the pressing portion and the second layer 13 can be expressed by the surface tension of the contact surface. The surface tension of the contact surface is preferably 20 to 40 mN/m, and more preferably 25 to 35 mN/m. By having the contact surface having the surface tension in this range, the pressing portion can be reliably peeled off from the second layer 13 after the push-in process using a vacuum pressure laminator or the like.

The electromagnetic wave shielding film 100 of the present embodiment, which is configured in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, can be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment. The effect.

<Third embodiment>

Next, a third embodiment of the electromagnetic wave shielding film of the present invention will be described.

Fig. 4 is a longitudinal cross-sectional view showing a third embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 4 is referred to as "upper" and the lower side is "down".

The electromagnetic wave shielding film 100 shown in FIG. 4 will be described below, but the description of the electromagnetic wave shielding film 100 shown in FIG. 1 will be omitted.

In the electromagnetic wave shielding film 100 shown in FIG. 4, the third layer 12 included in the base layer 1 is omitted. Therefore, the base layer 11 is formed by stacking the first layer 11 and the second layer 13 from the top surface side. The laminate of the two layers of the layer is the same as the diaphragm 100 for electromagnetic wave shielding shown in Fig. 1 .

In other words, in the present embodiment, the electromagnetic wave shielding film 100 is laminated in this order by the first layer. 11. A substrate obtained by the second layer 13 and a laminate of the electromagnetic wave barrier layer 3.

In the electromagnetic wave shielding film 100 having such a configuration, when the base material layer 1 is peeled off from the electromagnetic wave blocking layer 3 in the peeling step, the interface of the base material layer 1 between the second layer 13 and the electromagnetic wave blocking layer 3 is removed from the electromagnetic wave blocking layer 3 Stripped. In such peeling, since the electromagnetic wave blocking layer 3 has the release property from the second layer 13, the formation of the third layer 12 is omitted.

In this case, the degree of release of the contact surface between the electromagnetic wave blocking layer 3 and the second layer 13 can be expressed by the surface tension of the contact surface. The surface tension of the contact surface is preferably 20 to 40 mN/m, and more preferably 25 to 35 mN/m. By having the contact surface having the surface tension in this range, the electromagnetic wave blocking layer 3 can be reliably peeled off from the second layer 13 after the push-in process using a vacuum press laminator or the like.

The electromagnetic wave blocking layer 3 having such a surface tension is, for example, a resin obtained by dispersing a conductive polymer or a carbon-based material in a thermosetting resin such as polyurethane.

The electromagnetic wave shielding film 100 of the present embodiment, which is configured in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, can be used as the electromagnetic wave shielding film 100 of the first embodiment. The same effect.

<Fourth embodiment>

Next, a fourth embodiment of the electromagnetic wave shielding film of the present invention will be described.

Fig. 5 is a longitudinal sectional view showing a fourth embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 5 is referred to as "upper" and the lower side is "lower".

The electromagnetic wave shielding film 100 shown in FIG. 5 will be described below, but the description of the electromagnetic wave shielding film 100 shown in FIG. 1 will be omitted.

In the electromagnetic wave shielding film 100 shown in FIG. 5, the barrier layer 3 is not composed of a single layer but a laminate comprising an absorbing layer 31 and a reflecting layer 32, which are laminated in this order from the bottom surface (one side) side of the substrate layer 1, and the absorbing layer 31 is in contact with the substrate layer 1 (the third layer 12) Other than this, it is the same as the electromagnetic wave shielding film 100 shown in FIG.

In the present embodiment, the electromagnetic wave shielding film 100 is composed of the base layer 1 composed of the first layer 11, the second layer 13, and the third layer 12, and the absorption layer 31 and the reflection layer 32. The laminate of the barrier layer 3 is laminated. By using the electromagnetic wave shielding film 100 having the barrier layer 3 formed of such a laminate to cover the convex portion 61 on the substrate 5, the absorbing layer 31 can be disposed on the reflective layer 32 with respect to the convex portion 61. On the opposite side, the convex portion 61 is covered with the barrier layer 3 in a state where the reflective layer 32 is disposed on the side in contact with the convex portion 61. As described above, in the present embodiment, since the barrier layer 3 is composed of a laminate including the absorption layer 31 and the reflection layer 32, the electromagnetic wave shielding property by the barrier layer 3 can be improved.

Further, in the barrier layer 3 having such a configuration, the storage elastic modulus of the absorbent layer 31 at 150 ° C is preferably 1.0E+05 to 1.0E+09Pa, and more preferably 5.0E+05 to 5.0E+08Pa.

Furthermore, the storage elastic modulus of the reflective layer 32 at 150 ° C is preferably 1.0E+05~1.0E+09Pa, and more preferably 5.0E+05~5.0E+08Pa.

By setting the storage elastic coefficients of the absorption layer 31 and the reflection layer 32 laminated in the above-described order to the above-described ranges, the absorption layer 31 and the reflection layer 32 can be provided in accordance with the pressing force from the base material layer 1. The barrier layer 3 is more reliably deformed in accordance with the shape of the convex portion 61.

The electromagnetic wave shielding film 100 of the present embodiment, which is configured in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, can be used as the electromagnetic wave shielding film 100 of the first embodiment. The same effect.

<Fifth Embodiment>

Next, a fifth embodiment of the electromagnetic wave shielding film of the present invention will be described.

Fig. 6 is a longitudinal cross-sectional view showing a fifth embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 6 is referred to as "upper" and the lower side is "lower".

The electromagnetic wave shielding film 100 shown in FIG. 6 will be described below, but the description of the electromagnetic wave shielding film 100 shown in FIG. 1 will be omitted.

In the electromagnetic wave shielding film 100 shown in Fig. 6, the barrier layer 3 is not a single layer but a laminate composed of the reflective layer 32 and the absorbing layer 31, and the layers are from the bottom surface of the substrate layer 1 (one of the layers) The side is laminated in this order, and the reflective layer 32 is in contact with the substrate layer 1 (the third layer 12), and is the same as the electromagnetic wave shielding film 100 shown in Fig. 1 .

In the present embodiment, the electromagnetic wave shielding film sheet 100 is formed by sequentially laminating the base material layer 1 composed of the first layer 11, the second layer 13, and the third layer 12, and the reflective layer 32 and the absorption layer. A laminate in which the barrier layer 3 is formed by lamination. The convex portion 61 on the substrate 5 is covered by the electromagnetic wave shielding film 100 having the barrier layer 3 formed of such a laminate, and the reflective layer 32 is disposed on the opposite side of the absorption layer 31 with respect to the convex portion 61. The absorbing layer 31 is disposed on the side contacting the convex portion 61, and the convex portion 61 is covered with the barrier layer 3. As described above, in the present embodiment, since the barrier layer 3 is composed of a laminate including the reflective layer 32 and the absorption layer 31, the electromagnetic wave shielding property by the barrier layer 3 can be further improved.

Further, in the barrier layer 3 having such a configuration, the storage elastic modulus of the reflective layer 32 at 150 ° C is preferably 1.0E+05 to 1.0E+09Pa, and more preferably 5.0E+05 to 5.0E+08Pa.

Furthermore, the storage elastic modulus of the absorbing layer 31 at 150 ° C is preferably 1.0E+05~1.0E+09Pa, and 5.0E+05~5.0E+08Pa is more desirable.

By setting the storage elastic coefficients of the reflective layer 32 and the absorbing layer 31 laminated in the above-described order to the above-described ranges, the reflective layer 32 and the absorbing layer 31 can be provided in response to the pressing force from the base material layer 1. The barrier layer 3 is more surely deformed in accordance with the shape of the convex portion 61.

The electromagnetic wave shielding film 100 of the present embodiment, which is configured in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, can be used as the electromagnetic wave shielding film 100 of the first embodiment. The same effect.

In addition, the electromagnetic wave shielding film 100 of the fourth embodiment and the electromagnetic wave shielding film 100 of the fifth embodiment are different from the lamination order of the reflective layer 32 and the absorbing layer 31 of the barrier layer 3, except This is the same as each other. As described above, the absorption layer 31 absorbs electromagnetic waves incident on the absorption layer 31 to block electromagnetic waves, so that absorption is performed, and electromagnetic waves are destroyed. Therefore, the electromagnetic wave shielding film 100 of the fourth embodiment can have an advantage of reliably preventing electromagnetic waves reflected by the reflective layer 32 from adversely affecting other members not covered by the barrier layer 3. Therefore, in the electromagnetic wave shielding film 100 of the fourth and fifth embodiments, it is preferable to arrange the electromagnetic wave shielding film 100 of the fourth embodiment in which the absorption layer 31 is opposite to the convex portion 61 of the reflection layer 32. Preferably.

In addition, the electromagnetic wave shielding film 100 of the fourth embodiment and the electromagnetic wave shielding film 100 of the fifth embodiment are configured such that the barrier layer 3 has two layers of one layer of the reflective layer 32 and the absorbing layer 31. The laminate. However, the barrier layer 3 is not limited to the laminate having the two-layer structure described above, and may be composed of a laminate having at least three or more layers of at least one of the reflective layer 32 and the absorption layer 31.

<Sixth embodiment>

Next, a sixth embodiment of the electromagnetic wave shielding film of the present invention will be described.

Fig. 7 is a longitudinal sectional view showing a sixth embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 7 is referred to as "upper" and the lower side is referred to as "lower".

The electromagnetic wave shielding film 100 shown in FIG. 7 will be described below, but the description of the electromagnetic wave shielding film 100 shown in FIG. 1 will be omitted.

The electromagnetic wave shielding film 100 shown in FIG. 7 is the same as the electromagnetic wave shielding film 100 shown in FIG. 1 except that the insulating layer 2 is formed between the base material layer 1 and the electromagnetic wave blocking layer 3.

In other words, the electromagnetic wave shielding film 100 includes the base material layer 1, the insulating layer 2, and the electromagnetic wave blocking layer 3, as shown in FIG. The insulating layer 2 and the electromagnetic wave blocking layer 3 are laminated in this order from the bottom surface (one surface) side of the base material layer 1, and the insulating layer 2 contacts the base material layer 1.

<Substrate layer 1>

First, the difference from the base material layer 1 of the electromagnetic wave shielding film 100 shown in FIG. 1 will be described.

The average linear expansion coefficient of the first layer 11 at 25 to 150 ° C is preferably 50 to 1000 [ppm / ° C], and more preferably 100 to 700 [ppm / ° C]. When the average linear expansion coefficient of the first layer 11 is set to be within this range, when the electromagnetic wave shielding film 100 is heated, the first layer 11 has excellent stretchability. Therefore, the shape followability of the electromagnetic wave blocking layer 3 and the insulating layer 2 with respect to the convex portion 61 can be more surely improved.

Further, the average linear expansion coefficient of the second layer 13 at 25 to 150 ° C is preferably 500 or more [ppm / ° C], and more preferably 1000 or more [ppm / ° C]. When the electromagnetic wave shielding film 100 is heated within the range in which the average linear expansion coefficient of the second layer 13 is set, the second layer 13 is more likely to have more excellent stretchability than the third layer 12. Therefore, the second layer 13 can further improve the shape followability of the electromagnetic wave blocking layer 3 and the insulating layer 2 with respect to the convex portion 61.

Further, by appropriately setting the average linear expansion coefficients of the respective layers 11 to 13 within the above range, it is possible to easily set the storage elastic modulus of the base material layer 1 described later at 150 ° C to be in the range of 2.0E+05 to 2.0E+08 Pa. .

Further, in the base material layer 1 composed of the above laminate, the storage elastic modulus at 150 ° C is preferably 2.0E+05 to 2.0E+08 Pa, and 1.0E+06 to 1.0E+08 Pa is more preferable, 3.0E+ 06~6.0E+07Pa is even better.

Thus, by the action of increasing the insulating layer 2 and the barrier layer 3, the shape of the convex portion 61 is followed. When the storage elastic modulus at the time of heating of the base material layer 1 of the base material is set to the above range, when the convex portion 61 on the substrate 5 is coated with the electromagnetic wave shielding film 100, the insulating layer 2 and the electromagnetic wave blocking layer 3 can be used. The recess 62 is more reliably pushed in accordance with the state of the shape of the convex portion 61. the result. Since the substrate 5 provided with the convex portion 61 can be more reliably covered by the barrier layer 3, the electromagnetic wave shielding (barrier) property to the substrate 5 provided with the convex portion 61 due to the electromagnetic wave blocking layer 3 can be further improved.

<insulation layer 2>

Next, the description will be given for the insulating layer 2.

In the present embodiment, the insulating layer 2 is provided in contact with the base material layer 1 (the third layer 12). The insulating layer 2 and the electromagnetic wave blocking layer 3 are laminated in this order from the side of the base material layer 1. By coating the convex portion 61 on the substrate 5 with the electromagnetic wave shielding film 100 having the insulating layer 2 and the electromagnetic wave blocking layer 3 laminated in this manner, the electromagnetic wave blocking layer 3 can be brought into contact with the substrate 5 and the electronic component 4, and The electronic component 4 is coated with the electromagnetic wave blocking layer 3 and the insulating layer 2 in this order from the substrate 5 side.

As described above, in the present embodiment, the insulating layer 2 covers the substrate 5 and the electronic component 4 with the electromagnetic wave blocking layer 3 interposed therebetween. Thereby, the substrate 5, the electronic component 4, and the electromagnetic wave blocking layer 3 are insulated from the other member (electronic component or the like) on the opposite side of the substrate 5 from the insulating edge layer 2.

As the insulating layer 2, for example, an insulating resin having thermosetting properties or an insulating resin (insulating film) having thermoplasticity is used. Among these, it is preferred to use a thermoplastic resin. It has a thermoplastic insulating resin and is a film excellent in flexibility. Therefore, in the attaching step, when the base material layer 1 is used as a base material for pushing the concave portion 62, and the insulating layer 2 and the electromagnetic wave blocking layer 3 are pushed into the concave portion 62 on the substrate 5, the insulating layer 2 can be made to respond. The shape of the convex portion 61 surely follows. Further, since the thermoplastic insulating resin is heated to the softening point temperature and can be peeled off from the substrate to be adhered, it is particularly useful for repairing the substrate.

Thermoplastic insulating resin, for example: thermoplastic polyester, α-olefin, vinyl acetate, polyvinyl acetal, ethylene vinyl acetate, vinyl chloride, acrylic, polyamide, cellulose. Among these, thermoplastic polymerization is used for the purpose of excellent adhesion to the substrate, flexibility, and chemical resistance. Esters and α-olefins are preferred.

In addition, the thermoplastic resin may contain a phenol resin, an oxime resin, a urea resin, an acrylic resin, a polyester resin, or the like without impairing properties such as heat resistance and bending resistance. A polyamide resin, a polyimide resin, or the like. Further, in the thermoplastic resin, as in the case of the conductive adhesive layer described later, a decane coupling agent, an antioxidant, a pigment, a dye, or an adhesive can be added without reducing the adhesion and the reflow resistance. Resin, plasticizer, UV absorber, defoamer, leveling agent, filler, flame retardant, etc.

The thickness T (D) of the insulating layer 2 is not particularly limited, but is preferably 3 μm or more and 50 μm or less, more preferably 4 μm or more and 30 μm or less, and still more preferably 5 μm or more and 20 μm or less. When the thickness of the insulating layer 2 is less than the above lower limit value, the folding resistance is lowered, and after the thermocompression bonding to the convex portion 61, cracks may occur in the bent portion. Further, the film strength is lowered, and it is difficult to serve as an insulating support for the conductive adhesive layer. When the above upper limit is exceeded, the shape followability is degraded. In other words, by setting the thickness T(D) of the insulating layer 2 within the above range, the insulating layer 2 can be more excellent in flexibility. Further, in the attaching step, when the base material layer 1 serves as a base material for pushing into the concave portion 62 and the insulating layer 2 and the electromagnetic wave blocking layer 3 are pushed into the concave portion 62 on the substrate 5, the insulating layer 2 can respond to the convex portion 61. Shape and follow more surely.

Further, the average linear expansion coefficient of the insulating layer 2 at 25 to 150 ° C is preferably 50 to 1000 [ppm / ° C], and more preferably 100 to 700 [ppm / ° C]. When the average linear expansion coefficient of the insulating layer 2 is set to be within this range, the insulating layer 2 has excellent stretchability when the electromagnetic wave shielding film 100 is heated. Therefore, the insulating layer 2 can further improve the shape followability of the electromagnetic wave blocking layer 3 with respect to the convex portion 61.

In addition, as shown in FIGS. 7 and 8, the insulating layer 2 may be formed of one layer, or a laminate of two or more layers which are different among the insulating films may be laminated.

The electromagnetic wave shielding film 100 of the present embodiment, which is configured in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, can be used as the electromagnetic wave shielding film 100 of the first embodiment. The same effect.

<Seventh embodiment>

The seventh embodiment of the electromagnetic wave shielding film of the present invention will be described below.

Fig. 9 is a longitudinal cross-sectional view showing a seventh embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 9 is referred to as "upper" and the lower side is "down".

Hereinafter, the electromagnetic wave shielding film 100 shown in FIG. 9 will be described, but the description of the electromagnetic wave shielding film 100 shown in FIG. 3 will be omitted.

In the electromagnetic wave shielding film 100 shown in FIG. 9, the insulating layer 2 is formed between the base material layer 1 and the electromagnetic wave blocking layer 3, and is the same as the electromagnetic wave shielding film 100 shown in FIG.

In the present embodiment, the electromagnetic wave shielding film 100 is formed by laminating the base material layer 1 composed of the second layer 13 and the third layer 12, and the insulating layer 2 and the electromagnetic wave blocking layer 3 in this order. Layer body. Further, since the insulating layer 2 is the same as the insulating layer 2 of the sixth embodiment, the description thereof will be omitted.

The electromagnetic wave shielding film 100 of the present embodiment, which is configured in the same manner as the electromagnetic wave shielding film 100 of the second embodiment, can be used in the same manner as the electromagnetic wave shielding film 100 of the second embodiment. Effect. Further, since the electromagnetic wave shielding film 100 of the present embodiment has the insulating layer 2, it can be used in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, and is obtained in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment. effect.

<Eighth Embodiment>

Next, an eighth embodiment of the electromagnetic wave shielding film of the present invention will be described.

Fig. 10 is a longitudinal sectional view showing an eighth embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 10 is referred to as "upper" and the lower side is referred to as "lower".

The electromagnetic wave shielding film 100 shown in FIG. 10 will be described below, but the description of the electromagnetic wave shielding film 100 shown in FIG. 4 will be omitted.

In the electromagnetic wave shielding film 100 shown in FIG. 10, the insulating layer 2 is formed between the base material layer 1 and the electromagnetic wave blocking layer 3, and is the same as the electromagnetic wave shielding film 100 shown in FIG.

In the present embodiment, the electromagnetic wave shielding film 100 is formed by laminating a base layer 1, an insulating layer 2, and an electromagnetic wave blocking layer 3 composed of the first layer 11 and the second layer 13 in this order. Layer body. Further, since the insulating layer 2 is the same as the insulating layer 2 of the sixth embodiment, the description thereof will be omitted.

The electromagnetic wave shielding film 100 of the present embodiment, which is configured in the same manner as the electromagnetic wave shielding film 100 of the third embodiment, can be used in the same manner as the electromagnetic wave shielding film 100 of the third embodiment. Effect. Further, since the electromagnetic wave shielding film 100 of the present embodiment has the insulating layer 2, it can be used in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, and is obtained in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment. effect.

<Ninth Embodiment>

Next, a ninth embodiment of the electromagnetic wave shielding film of the present invention will be described.

Fig. 11 is a longitudinal sectional view showing a ninth embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 11 is referred to as "upper" and the lower side is referred to as "lower".

The electromagnetic wave shielding film 100 shown in FIG. 11 will be described below, but the description of the electromagnetic wave shielding film 100 shown in FIG. 7 will be omitted.

In the electromagnetic wave shielding film 100 shown in FIG. 11, the third layer 12 included in the base material layer 1 is omitted. Therefore, the base layer 1 and the first layer 11 and the second layer 13 are stacked one upon another from the top surface side. a laminate composed of two layers, and the stacking order of the insulating layer 2 and the electromagnetic wave blocking layer 3 is reversed, except Other than this, it is the same as the electromagnetic wave shielding film 100 shown in FIG.

In the present embodiment, the electromagnetic wave shielding film 100 is formed by laminating a base layer 1, an electromagnetic wave blocking layer 3, and an insulating layer 2 composed of the first layer 11 and the second layer 13 in this order. Layer body.

In the electromagnetic wave shielding film 100 having such a configuration, when the base material layer 1 is peeled off from the electromagnetic wave blocking layer 3 in the peeling step, the base material layer 1 is removed from the electromagnetic wave blocking layer 3 at the interface between the second layer 13 and the electromagnetic wave blocking layer 3. Stripped. In such peeling, the electromagnetic wave blocking layer 3 has a release property from the second layer 13, and thus the formation of the third layer 12 is omitted.

In this case, the degree of release of the contact surface between the electromagnetic wave blocking layer 3 and the second layer 13 can be expressed by the surface tension of the contact surface. The surface tension of the contact surface is preferably 20 to 40 mN/m, and more preferably 25 to 35 mN/m. By having the contact surface having the surface tension within this range, the second layer 13 can be reliably peeled off from the electromagnetic wave blocking layer 3 after the push-in process using a vacuum pressure laminator or the like.

The electromagnetic wave blocking layer 3 having such a surface tension is, for example, a resin obtained by dispersing a carbon-based material or a conductive polymer in a thermosetting resin such as polyurethane.

The electromagnetic wave shielding film 100 of the present embodiment, which is configured in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, can be used as the electromagnetic wave shielding film 100 of the sixth embodiment. The same effect.

<Tenth embodiment>

Next, a tenth embodiment of the electromagnetic wave shielding film of the present invention will be described.

Fig. 12 is a longitudinal sectional view showing a tenth embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 12 is referred to as "upper" and the lower side is "down".

The electromagnetic wave shielding film 100 shown in FIG. 12 will be described below. However, the description of the electromagnetic wave shielding film 100 shown in FIG. 7 will be omitted.

In the electromagnetic wave shielding film 100 shown in FIG. 12, the insulating layer 2 and the electromagnetic wave blocking layer 3 are stacked in the reverse order, and the electromagnetic wave shielding film 100 shown in FIG. 7 is the same.

In the present embodiment, the electromagnetic wave shielding film 100 is formed by sequentially laminating the base layer 1, the insulating layer 2, and the electromagnetic wave blocking layer 3 composed of the first layer 11, the second layer 13, and the third layer 12. And get the laminate. By using the electromagnetic wave shielding film 100 having the electromagnetic wave blocking layer 3 and the insulating layer 2 laminated thereon, the convex portion 61 on the substrate 5 is covered, and the insulating layer 2 contacts the substrate 5 and the electronic component 4, and The electronic component 4 is covered with the insulating layer 2 and the electromagnetic wave blocking layer 3 in this order from the substrate 5 side.

As described above, in the present embodiment, the insulating layer 2 is covered in a state of being in contact with the substrate 5 and the electronic component 4. Thereby, the substrate 5 and the electronic component 4 are insulated from the electromagnetic wave blocking layer 3 and other members (electronic components, etc.) which are located on the opposite side of the substrate 5 from the insulating layer 2 .

Therefore, even if the electromagnetic wave shielding layer 3 of this configuration contains a conductive material, for example, the insulating layer 2 can surely insulate the adjacent electronic components 4 from each other.

The electromagnetic wave shielding film 100 of the present embodiment, which is configured in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, can be used as the electromagnetic wave shielding film 100 of the sixth embodiment. The same effect.

<11th embodiment>

Next, an eleventh embodiment of the electromagnetic wave shielding film of the present invention will be described.

Fig. 13 is a longitudinal sectional view showing an eleventh embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 13 is referred to as "upper" and the lower side is "down".

The electromagnetic wave shielding film 100 shown in FIG. 13 will be described below, but the description of the electromagnetic wave shielding film 100 shown in FIG. 5 will be omitted.

In the electromagnetic wave shielding film 100 shown in FIG. 13, the insulating layer 2 is formed between the electromagnetic wave blocking layer 3 and the base material layer 1, and is the same as the electromagnetic wave shielding film 100 shown in FIG.

In the present embodiment, the electromagnetic wave shielding film 100 is composed of the first layer 11, the second layer 13, and the third layer 12, the insulating layer 2, and the absorbing layer 31 and the reflective layer. The electromagnetic wave blocking layer 3 composed of 32 is laminated in this order to form a laminate. Further, since the insulating layer 2 is the same as the insulating layer 2 of the sixth embodiment, the description thereof will be omitted.

The electromagnetic wave shielding film 100 of the present embodiment, which is configured as described above, can be used in the same manner as the electromagnetic wave shielding film 100 of the fourth embodiment, and the electromagnetic wave shielding film 100 of the fourth embodiment can be obtained. The same effect. Further, since the electromagnetic wave shielding film 100 of the present embodiment has the insulating layer 2, it can be used in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, and is obtained in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment. effect.

<Twelfth Embodiment>

Next, a twelfth embodiment of the electromagnetic wave shielding film of the present invention will be described.

Fig. 14 is a longitudinal sectional view showing a twelfth embodiment of the electromagnetic wave shielding film of the present invention. In the following description, for convenience of explanation, the upper side in FIG. 14 is referred to as "upper" and the lower side is "down".

The electromagnetic wave shielding film 100 shown in FIG. 14 will be described below, but the description of the electromagnetic wave shielding film 100 shown in FIG. 6 will be omitted.

In the electromagnetic wave shielding film 100 shown in FIG. 14, the insulating layer 2 is formed between the electromagnetic wave blocking layer 3 and the base material layer 1, and is different from the electromagnetic wave shielding film 100 shown in FIG. with.

In the present embodiment, the electromagnetic wave shielding film 100 is composed of the first layer 11, the second layer 13, and the third layer 12, the insulating layer 2, and the reflecting layer 32 and the absorbing layer. A laminated body in which the electromagnetic wave blocking layer 3 is formed in this order. Further, since the insulating layer 2 is the same as the insulating layer 2 of the sixth embodiment, the description thereof will be omitted.

The electromagnetic wave shielding film 100 of the present embodiment, which is configured in the same manner as the electromagnetic wave shielding film 100 of the fifth embodiment, can be used as the electromagnetic wave shielding film 100 of the fifth embodiment. The same effect. Further, since the electromagnetic wave shielding film 100 of the present embodiment has the insulating layer 2, it can be used in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment, and is obtained in the same manner as the electromagnetic wave shielding film 100 of the sixth embodiment. effect.

Further, in the electromagnetic wave shielding film 100 of the eleventh embodiment, the electromagnetic wave shielding film 100 of the twelfth embodiment is different from the lamination order of the reflective layer 32 and the absorbing layer 31 of the electromagnetic wave blocking layer 3, Same to each other. As described above, the absorption layer 31 blocks electromagnetic waves by absorbing electromagnetic waves incident on the absorption layer 31, so that electromagnetic waves are destroyed by this absorption. Thus, the electromagnetic wave shielding film sheet 100 of the eleventh embodiment has an advantage in that electromagnetic waves reflected by the reflection layer 32 can be surely prevented from adversely affecting other members not covered by the electromagnetic wave blocking layer 3. Therefore, in the electromagnetic wave shielding film sheet 100 of the eleventh and twelfth embodiments, the electromagnetic wave shielding film according to the eleventh embodiment in which the absorption layer 31 is positioned on the opposite side of the reflection layer 32 with respect to the convex portion 61 is preferable. 100 is preferred.

In addition, the electromagnetic wave shielding film 100 of the eleventh embodiment and the electromagnetic wave shielding film 100 of the twelfth embodiment include the electromagnetic wave blocking layer 3 including two layers of the reflective layer 32 and the absorption layer 31. Laminate. However, the electromagnetic wave blocking layer 3 is not limited to the two-layered laminate, and may be composed of a laminate of at least two or more layers of at least one of the reflective layer 32 and the absorbing layer 31.

In the above-described embodiment, the case where one insulating layer 2 is laminated on either the top surface or the bottom surface of the electromagnetic wave blocking layer 3 is described. However, the present invention is not limited to this and may be applied to the top of the electromagnetic wave blocking layer 3. One of the surface and the bottom surface is laminated with each other as the insulating layer 2 of the other layer.

The above is directed to the electromagnetic wave shielding film of the present invention and the coating method of the electronic component, but the present invention is not limited thereto.

For example, the electromagnetic wave shielding film of the present invention may be combined with any of the first to twelfth embodiments.

Further, any layer which can exhibit the same function can be added to the electromagnetic wave shielding film of the present invention.

Further, any one or two or more steps may be added to the coating method of the electronic component of the present invention.

[Examples]

The invention is described in detail below with reference to the embodiments, but the invention is not limited to the embodiments.

1. Discussion on the layer composition of the diaphragm for electromagnetic wave shielding

(Example 1A)

<Manufacture of diaphragm for electromagnetic wave shielding>

In order to obtain a film for electromagnetic wave shielding, a polystyrene (manufactured by Idemitsu Kogyo Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the first layer (first release layer). The styrene polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the third layer (second release layer). An ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) was prepared as a resin constituting the second layer (buffer layer). A conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave blocking layer.

A feed block is used as the above-mentioned aligned polystyrene of the first layer, the above-mentioned aligned polystyrene as the third layer, and the ethylene-methacrylate copolymer as the second layer. The multi-manifold mold is coextruded to form a film. The conductive adhesive layer as the electromagnetic wave blocking layer is applied to the base material layer to form a diaphragm for electromagnetic wave shielding.

The thickness of the entire electromagnetic wave shielding film of Example 1A was 140 μm, the thickness of the first layer was 30 μm, the thickness of the third layer was 30 μm, the thickness of the second layer was 60 μm, and the thickness of the electromagnetic wave blocking layer was 20 μm.

Further, the average linear expansion coefficients of the first layer, the second layer, and the third layer of the electromagnetic wave shielding film of Example 1A were measured, and as a result, each was 420, 2400, and 420 ppm/°C.

Further, the storage elastic modulus of the base material layer and the electromagnetic wave blocking layer at 150 ° C was measured, and as a result, they were each 1.8 E + 07 Pa and 1.2 E + 07 Pa.

<Manufacture of electronic parts>

The electromagnetic wave shielding film obtained was attached to a memory substrate for a personal computer (manufactured by Samsung Co., Ltd. under the conditions of a temperature of 150 degrees and a pressure of 2.0 MPa in a vacuum pressure forming method for 5 minutes). DDR2 667 M470T6554EZ3-CE6 PC2-5300) (high and low difference of 1,000μm) surface. After the attachment, the substrate layer was peeled off from the electromagnetic wave blocking layer by hand to produce an electronic component.

(Example 2A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the first layer was changed to 80 μm.

(Example 3A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the first layer was set to 10 μm.

(Example 4A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the second layer was changed to 90 μm.

(Example 5A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the second layer was set to 20 μm.

(Example 6A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the third layer was set to 10 μm.

(Example 7A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the third layer was changed to 90 μm.

(Example 8A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the electromagnetic wave blocking layer was set to 5 μm.

(Example 9A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the electromagnetic wave blocking layer was changed to 150 μm.

(Example 10A)

As the first layer, we prepare a pair of polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) and a styrene-ethylene-butylene-styrene block copolymer (Kuraray Co., Ltd.) In the same manner as in Example 1A, a film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A, except that the blended product was blended at a weight percentage of 60% by weight and 40% by weight.

(Example 11A)

As the first layer, we prepare a pair of polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) and a styrene-ethylene-butylene-styrene block copolymer (Kuraray Co., Ltd.) In the same manner as in Example 1A, a film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the blended product was obtained by blending 80% by weight and 20% by weight.

(Example 12A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that polymethylpentene (manufactured by Mitsui Chemicals, Inc., trade name: TPX MX004) was prepared as the first layer.

(Example 13A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that polybutylene terephthalate (manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: NOVADURAN 5505S) was prepared as the first layer. .

(Example 14A)

As the second layer, an ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: NOBRENE FS2011DG2) were prepared. A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the blended product was blended in an amount of 70% by weight and 30% by weight.

(Example 15A)

As the second layer, an ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) and polyethylene (manufactured by Ube Industries, Ltd., trade name: UBE polyethylene F222NH) were prepared. A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the blended product was blended in an amount of 70% by weight and 30% by weight.

(Example 16A)

As the second layer, an ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd.) was prepared. Product name: ACRYFT WD106) and polyethylene (made by Ube Industries Co., Ltd., trade name: UBE polyethylene F222NH) and polypropylene (Sumitomo Chemical Co., Ltd., trade name: NOBRENE FS2011DG2) A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the blended product was blended in an amount of 60% by weight, 20% by weight, and 20% by weight.

(Example 17A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the first layer was set to 5 μm.

(Example 18A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the second layer was set to 120 μm.

(Example 19A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the third layer was set to 3 μm.

(Example 20A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the second layer was 80 μm and the thickness of the first layer was 10 μm.

(Example 21A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the thickness of the first layer was 5 μm, the thickness of the second layer was 80 μm, and the thickness of the third layer was 5 μm.

(Example 22A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the formation of the first layer was omitted, and the conductive polymer polyaniline dispersion (PANI-PD manufactured by REGULUS Co., Ltd.) was used as the electromagnetic wave barrier layer.

(Example 23A)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1A except that the formation of the third layer was omitted.

(Comparative Example 1A)

In the same manner as in Example 1A, except that polyethylene terephthalate (manufactured by Toray Industries, Inc., trade name: LUMIRROR S10) was prepared as the base material layer, and the thickness of the base material layer was set to 30 μm. A diaphragm for electromagnetic wave shielding and an electronic component are manufactured.

(Comparative Example 2A)

In the same manner as in Example 1A, except that polyethylene terephthalate (manufactured by Toray Industries, Inc., trade name: LUMIRROR S10) was prepared as the base material layer, and the thickness of the base material layer was set to 100 μm. A diaphragm for electromagnetic wave shielding and an electronic component are manufactured.

<evaluation test>

The electromagnetic wave shielding film or electronic component produced in Examples 1A to 23A and Comparative Examples 1A and 2A was evaluated for shape followability, release property, folding resistance, second layer exudation property of substrate layer, and heat resistance. , the cutting of electromagnetic wave shielding. Stamping workability. The following describes the evaluation methods.

<<Shape followability>>

The aforementioned shape followability can be obtained as follows.

A printed circuit board (main board) having a length of 100 mm × a width of 100 mm and a height of 3 mm was formed into a groove having a width of 0.2 mm and a predetermined height difference (depth) in a checkerboard pattern at intervals of 0.2 mm. Thereafter, the electromagnetic wave shielding film was pressure-bonded to the printed circuit board under the conditions of 150 ° C × 1 MPa × 10 minutes using a vacuum pressure forming device, and attached to the printed circuit board. After the attachment, the substrate layer is peeled off from the electromagnetic wave barrier layer. Then, it is judged whether there is a gap between the electromagnetic wave blocking layer attached to the printed circuit board and the groove on the printed circuit board. Further, whether or not there is a void is observed and evaluated by a microscope or a microscope.

The symbols are as follows. × rated as unqualified, others rated as qualified.

×: The height difference is less than 500 μm.

○: The height difference is 500 μm or more and less than 1000 μm.

◎: The height difference is 1000 μm or more and less than 2000 μm.

◎ ◎: The height difference is 2000 μm or more.

<<release type>>

The above-mentioned release property can be obtained as follows.

The electromagnetic wave shielding film was thermocompression bonded to a printed circuit board similar to the above-described method for evaluating the shape followability. Thereafter, the ease of peeling when the base material layer was peeled off from the electromagnetic wave blocking layer by hand work was evaluated.

The symbols are as follows. × rated as unqualified, others rated as qualified.

×: The base material layer has a resin residue.

○: There was no resin remaining in the substrate layer, but the peeling of the substrate layer was slightly heavy.

◎: The base material layer has no resin residue, and the base material layer can be easily peeled off.

<<Folding resistance>>

The aforementioned folding resistance can be obtained by the following method.

The electromagnetic wave shielding film is bonded to a flexible substrate, for example, a flexible circuit board. The fitted person was folded and the bend was observed under a microscope. However, the bending is performed by hand and is bent only once.

The symbols are as follows. × rated as unqualified, others rated as qualified.

×: A crack occurred in the bent portion.

○: There are some wrinkles in the bent portion.

◎: No cracks occurred in the bent portion.

<<Second layer exudation>>

The second layer bleed property of the base material layer can be obtained by the following method.

The base material layer was hot pressed at 150 ° C × 2.0 MPa × 5 minutes. The maximum distance of the constituent material of the second layer which is exuded from the end of the second layer is measured by a vernier caliper or the like.

The symbols are as follows. × rated as unqualified, others rated as qualified.

×: The maximum distance is 1.0 mm or more

○: The maximum distance is 0.5 mm or more and less than 1.0 mm.

◎: The maximum distance is less than 0.5mm

<<Heat resistance>>

The heat resistance of the base material layer can be determined by the following method.

In the same manner as the evaluation method of the shape followability, the electromagnetic wave shielding film was thermocompression bonded to a printed circuit board and attached to a printed circuit board under the conditions of 150 ° C × 2 MPa × 5 minutes using a vacuum pressure forming apparatus. . After the attachment, the substrate layer is peeled off from the electromagnetic wave barrier layer. Then, it was visually observed whether or not the electromagnetic wave blocking layer attached to the printed circuit board was wrinkled.

The symbols are as follows. × rated as unqualified, others rated as qualified.

×: Wrinkles appear in the electromagnetic wave blocking layer.

○: Fine wrinkles are present at the electromagnetic wave barrier layer.

◎: No wrinkles were observed in the electromagnetic wave blocking layer.

<<Cutting. Stamping workability >>

The cutting of the aforementioned electromagnetic wave shielding. The punching workability can be obtained by the following methods.

When the diaphragm for shielding an electromagnetic wave is cut and punched into a predetermined size and shape, it is judged whether a large number of steps are required and the workability is lowered.

The symbols are as follows. × rated as unqualified, others rated as qualified.

×: Workability was significantly lowered.

○: There is a certain decrease in workability.

◎: Workability is no problem.

The evaluation results of the above respective examples and comparative examples are shown in Table 1.

As can be seen from Table 1, the electromagnetic wave shielding films of Examples 1A to 23A exhibited good shape followability, and the release property, the folding resistance, the second layer exudation property of the base material layer, and the electromagnetic wave shielding were cut. . The stamping workability is good and excellent in balance. On the other hand, in the electromagnetic wave shielding films of Comparative Examples 1A and 2A, the shape followability was not sufficiently satisfactory as compared with the electromagnetic wave shielding films of Examples 1A to 23A.

2. Discussion on the storage elastic coefficient of the substrate layer

(Example 1B)

<Manufacture of diaphragm for electromagnetic wave shielding>

In order to obtain a film for electromagnetic wave shielding, a polystyrene (manufactured by Idemitsu Kogyo Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the first layer (first release layer). The styrene polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the third layer (second release layer). An ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) was prepared as a resin constituting the second layer (buffer layer). A conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave blocking layer.

The feed layer and the multi-manifold mold are used as the first layer of the above-mentioned aligned polystyrene, the above-mentioned aligned polystyrene as the third layer, and the ethylene-methacrylate copolymer as the second layer. Co-extrusion is carried out to form a film. The conductive adhesive layer as the electromagnetic wave blocking layer is applied to the base material layer to form a diaphragm for electromagnetic wave shielding.

The thickness of the entire electromagnetic wave shielding film of Example 1B was 140 μm, the thickness of the first layer was 30 μm, the thickness of the third layer was 30 μm, the thickness of the second layer was 60 μm, and the thickness of the electromagnetic wave blocking layer was 20 μm.

Further, the average linear expansion coefficients of the first layer, the second layer, and the third layer of the electromagnetic wave shielding film of Example 1B were measured, and as a result, each was 420, 2400, and 420 ppm/°C.

Further, the storage elastic modulus of the base material layer and the electromagnetic wave blocking layer at 150 ° C was measured, and as a result, they were each 1.8 E + 07 Pa and 1.2 E + 07 Pa.

<Manufacture of electronic parts>

The obtained electromagnetic wave shielding film was subjected to a vacuum pressure forming method for 5 minutes under the conditions of a temperature of 150 ° C and a pressure of 2.0 MPa, and was attached to a memory substrate for a personal computer (manufactured by Samsung Co., Ltd., trade name: DDR2). 667 M470T6554EZ3-CE6 PC2-5300) (high and low difference of 1,000μm) surface. After the attachment, the substrate layer was peeled off from the electromagnetic wave blocking layer by hand to form an electronic component.

(Example 2B)

As the second layer, an ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: NOBRENE FS2011DG2) were prepared. A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B except that the blended product was blended in an amount of 70% by weight and 30% by weight.

(Example 3B)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B except that the thickness of the first layer was set to 10 μm.

(Example 4B)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B except that the thickness of the second layer was changed to 90 μm.

(Example 5B)

As the first layer, we prepare a pair of polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) and a styrene-ethylene-butylene-styrene block copolymer (Kuraray Co., Ltd.) In the same manner as in Example 1B, a film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B, except that the blended product was obtained by blending a product having a weight percentage of 60% by weight and 40% by weight.

(Example 6B)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B except that the thickness of the first layer was set to 80 μm.

(Example 7B)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B except that the thickness of the first layer was set to 100 μm.

(Example 8B)

As a first layer, we prepare a pair of polystyrene (manufactured by Idemitsu Kogyo Co., Ltd., trade name: XAREC S107) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: NOBRENE FS2011DG2) in weight% A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B except that the blended product was blended at a concentration of 60% by weight and 40% by weight.

(Example 9B)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B except that polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: NOBRENE FS2011 DG2) was prepared as the second layer.

(Example 10B)

A film for electromagnetic wave shielding and electronic parts were produced in the same manner as in Example 1B except that polybutylene terephthalate (manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: NOVADURAN 5020) was prepared as the first layer. .

(Example 11B)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B except that 6-nylon (manufactured by Ube Industries, Ltd., trade name: UBE Nylon 1022B) was prepared as the first layer.

(Comparative Example 1B)

As a base material layer, a cyclic olefin-based copolymer (manufactured by POLYPLASTICS Co., Ltd.) was prepared. A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B except for the product name: TOPAS 6017.

(Comparative Example 2B)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1B except that the thickness of the third layer was 1 μm and the thickness of the first layer was 1 μm.

<evaluation test>

The electromagnetic wave shielding film or the electronic component produced in each of Examples 1B to 11B and Comparative Examples 1B and 2B, and the electromagnetic wave shielding film or the electrons produced in Examples 1A to 23A and Comparative Examples 1A and 2A. The part implementer also performs the shape followability, the release property, the folding resistance, the second layer exudation property of the base material layer, the heat resistance, and the cutting of the electromagnetic wave shielding. Evaluation of stamping workability.

The evaluation results of the above respective examples and comparative examples are shown in Table 2.

As can be seen from Table 2, in the electromagnetic wave shielding film sheets of Examples 1B to 11B, since the storage elastic modulus of the base material layer at 150 ° C was set within an appropriate range, good shape followability was exhibited. Furthermore, regarding the release property, the folding resistance, the second layer exudation of the substrate layer, and the cutting of the electromagnetic wave shielding. The punching workability is also good in balance, which is an excellent result.

On the other hand, in the electromagnetic wave shielding film sheets of Comparative Examples 1B and 2B, the storage elastic modulus of the base material layer at 150 ° C was not set to an appropriate range, and the shape followability was insufficient.

3. Discussion on the layer composition of the barrier layer and the storage elastic coefficient

(Example 1C)

<Manufacture of diaphragm for electromagnetic wave shielding>

In order to obtain a film for electromagnetic wave shielding, a polystyrene (manufactured by Idemitsu Kogyo Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the first layer (first release layer). The styrene polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the third layer (second release layer). An ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) was prepared as a resin constituting the second layer (buffer layer). A conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave blocking layer.

Using the above-mentioned aligned polystyrene as the first layer, the above-mentioned aligned polystyrene as the third layer, and the ethylene-methacrylate copolymer as the second layer, using the feed group and the multi-distribution The co-extrusion of the tube mold is filmed. The conductive adhesive layer as the electromagnetic wave blocking layer is applied to the base material layer to form a diaphragm for electromagnetic wave shielding.

The thickness of the entire electromagnetic wave shielding film of Example 1C was 140 μm, the thickness of the first layer was 30 μm, the thickness of the third layer was 30 μm, the thickness of the second layer was 60 μm, and the thickness of the electromagnetic wave blocking layer was 20 μm.

Further, the first layer, the second layer, and the third layer of the electromagnetic wave shielding film of Example 1C were measured. The average linear expansion coefficient is 420, 2400, and 420 each.

Further, the storage elastic modulus of the base material layer and the electromagnetic wave blocking layer at 150 ° C was measured, and as a result, they were each 1.8 E + 07 Pa and 1.2 E + 07 Pa.

<Manufacture of electronic parts>

The electromagnetic wave shielding film obtained was attached to a memory substrate for a personal computer (manufactured by Samsung Co., Ltd. under the conditions of a temperature of 150 degrees and a pressure of 2.0 MPa in a vacuum pressure forming method for 5 minutes). DDR2 667 M470T6554EZ3-CE6 PC2-5300) (high and low difference of 1,000μm) surface. After the attachment, the substrate layer was peeled off from the electromagnetic wave blocking layer by hand to produce an electronic component.

(Example 2C)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1C except that the conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-250H-5) was used as the electromagnetic wave blocking layer.

(Example 3C)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1C except that the conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-250H-23) was used as the electromagnetic wave blocking layer.

(Example 4C)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1C except that the conductive adhesive layer (manufactured by Daikin Chemical Co., Ltd., trade name: CA-2503-4B) was used as the electromagnetic wave blocking layer.

(Example 5C)

As a resin constituting the barrier layer, a polyaniline dispersion liquid was prepared for use as a conductive absorption layer (manufactured by REGULUS Co., Ltd., trade name: PANI-PD, thickness: 20 μm) as an absorption layer, and In the same manner as in Example 1C, a diaphragm for electromagnetic wave shielding and an electronic component were produced in the same manner.

(Example 6C)

In the resin constituting the barrier layer, a multilayered carbon nanotube dispersion liquid was prepared for use as a dielectric absorbing layer (manufactured by Hodogaya Chemical Co., Ltd., trade name: NT-7K, thickness: 20 μm) as an absorbing layer, and Example 1C was used. Similarly, a diaphragm for electromagnetic wave shielding and an electronic component are manufactured.

(Example 7C)

The PEDOT/PSS was produced in the same manner as in Example 1C except that a conductive absorbing layer (manufactured by Nakagata Oil Co., Ltd., trade name: S-941, thickness: 20 μm) was used as the resin for the barrier layer. Diaphragm for electromagnetic wave shielding and electronic parts.

(Example 8C)

As the resin constituting the barrier layer, a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW260-H1, thickness: 10 μm) and a conductive absorbing layer prepared as an absorbing layer are prepared. The electromagnetic wave shielding was produced in the same manner as in Example 1C except that the liquid (manufactured by REGULUS Co., Ltd., trade name: PANI-PD, thickness: 10 μm) was applied to the film in the order of the reflection layer and the absorption layer. Diaphragms and electronic parts.

(Example 9C)

As a resin constituting the barrier layer, a conductive adhesive layer (manufactured by Daikin Chemical Co., Ltd., trade name: CA-2503-4B, thickness: 10 μm) as a reflective layer is prepared and used as an absorbing layer. Dielectric absorber layer (PEDOT/PSS (manufactured by Nakagata Oil & Fats Co., Ltd., trade name: S-941, thickness: 10 μm), which is applied to the film in the order of the reflective layer and the absorbing layer, and the examples and examples In the same manner, 1C manufactures a diaphragm for electromagnetic wave shielding and an electronic component.

(Example 10C)

As the resin constituting the barrier layer, a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW260-H1, thickness: 10 μm) and a conductive absorbing layer prepared as an absorbing layer are prepared. Liquid (REGULUS company, trade name: PANI-PD, thickness 10 μm) The film for electromagnetic wave shielding and the electronic component were produced in the same manner as in Example 1C except that the film was applied in the order of the absorbing layer and the reflecting layer.

(Example 11C)

As a resin constituting the barrier layer, a conductive adhesive layer (manufactured by Daikin Chemical Co., Ltd., trade name: CA-2503-4B, thickness: 10 μm) as a reflective layer is prepared and used as an absorbing layer. A dielectric absorbing layer (PEDOT/PSS (manufactured by Nakagisa Oil Co., Ltd., trade name: S-941, thickness: 10 μm) was produced in the same manner as in Example 1C except that the film was coated in the order of the absorbing layer and the reflecting layer. Diaphragm for electromagnetic wave shielding and electronic parts.

<evaluation test>

The electromagnetic wave shielding film or the electronic component produced in the examples 1C to 11C was also carried out in the same manner as those of the electromagnetic wave shielding film or the electronic component produced in the first to third embodiments, and the electromagnetic wave shielding film produced in the first to third embodiments. Shape follow-up, release, folding resistance, second layer exudation of the substrate layer, heat resistance, cutting of electromagnetic wave shielding. Evaluation of stamping workability.

The evaluation results of the above respective examples and comparative examples are shown in Table 3.

As can be seen from Table 3, as shown in Examples 1C to 11C, the storage elastic modulus of the electromagnetic wave barrier layer at 150 ° C was set to be appropriate by setting not only the storage elastic modulus of the substrate layer at 150 ° C in an appropriate range. Within the range, it shows good shape followability. Furthermore, the release property, the folding resistance, the second layer exudation property of the base material layer, the heat resistance, and the cutting of the electromagnetic wave shielding. Stamping workability can also achieve excellent balance.

4. Discussion on the layer composition of the diaphragm for electromagnetic wave shielding

(Example 1D)

<Manufacture of diaphragm for electromagnetic wave shielding>

In order to obtain a film for electromagnetic wave shielding, a polystyrene (manufactured by Idemitsu Kogyo Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the first layer (first release layer). The styrene polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the third layer (second release layer). An ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) was prepared as a resin constituting the second layer (buffer layer). A polyolefin emulsion (manufactured by UNITIKA Co., Ltd., trade name: A-BASE TC-4010) was prepared as a resin constituting the insulating layer. A conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave blocking layer.

Using the above-mentioned aligned polystyrene as the first layer, the above-mentioned aligned polystyrene as the third layer, and the ethylene-methacrylate copolymer as the second layer, using the feed group and the multi-manifold The mold is coextruded to form a film. The conductive adhesive layer as the electromagnetic wave blocking layer and the polyolefin emulsion as the insulating layer are applied to the base material layer in this order to form a diaphragm for electromagnetic wave shielding.

The thickness of the entire electromagnetic wave shielding film of Example 1D was 160 μm, the thickness of the first layer was 30 μm, the thickness of the third layer was 30 μm, the thickness of the second layer was 60 μm, the thickness of the insulating layer was 20 μm, and the electromagnetic wave blocking layer. The thickness is 20 μm.

Further, the first layer, the second layer, and the third layer of the electromagnetic wave shielding film of Example 1D were measured. The average coefficient of linear expansion was 420, 2400 and 420 ppm/°C.

Further, the storage elastic modulus of the base material layer and the electromagnetic wave blocking layer at 150 ° C was measured, and as a result, they were each 1.8 E + 07 Pa and 1.2 E + 07 Pa.

<Manufacture of electronic parts>

The electromagnetic wave shielding film obtained was attached to a memory substrate for a personal computer (manufactured by Samsung Co., Ltd. under the conditions of a temperature of 150 degrees and a pressure of 2.0 MPa in a vacuum pressure forming method for 5 minutes). DDR2 667 M470T6554EZ3-CE6 PC2-5300) (high and low difference of 1,000μm) surface. After the attachment, the substrate layer was peeled off from the electromagnetic wave blocking layer by hand to produce an electronic component.

(Embodiment 2D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the first layer was set to 80 μm.

(Embodiment 3D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the first layer was set to 10 μm.

(Embodiment 4D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the second layer was changed to 90 μm.

(Example 5D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the second layer was set to 20 μm.

(Example 6D)

Electromagnetic waves were produced in the same manner as in Example 1D except that the thickness of the third layer was set to 10 μm. Masking and electronic parts for shielding.

(Example 7D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the third layer was set to 90 μm.

(Example 8D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the insulating layer was set to 5 μm.

(Example 9D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the insulating layer was changed to 50 μm.

(Example 10D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the electromagnetic wave blocking layer was set to 5 μm.

(Example 11D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the electromagnetic wave blocking layer was changed to 150 μm.

(Example 12D)

As the first layer, we prepare a pair of polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) and a styrene-ethylene-butylene-styrene block copolymer (Kuraray Co., Ltd.) In the same manner as in Example 1D, a film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D, except that a blend of 60% by weight and 40% by weight of each of the blends was used.

(Example 13D)

As the first layer, we prepare a pair of polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) and a styrene-ethylene-butylene-styrene block copolymer (Kuraray Co., Ltd.) System, trade name: SEPTON S8007) respectively obtained by blending 80% by weight and 20% by weight The mixture was prepared in the same manner as in Example 1D except for the blend.

(Example 14D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that polymethylpentene (manufactured by Mitsui Chemicals, Inc., trade name: TPX MX004) was prepared as the first layer.

(Example 15D)

A film for electromagnetic wave shielding and electronic parts were produced in the same manner as in Example 1D except that polybutylene terephthalate (manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: NOVADURAN 5505S) was prepared as the first layer. .

(Example 16D)

As the second layer, an ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: NOBRENE FS2011DG2) were prepared. A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the blended product was blended in an amount of 70% by weight and 30% by weight.

(Example 17D)

As the second layer, an ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) and polyethylene (manufactured by Ube Industries, Ltd., trade name: UBE polyethylene F222NH) were prepared. A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the blended product was blended in an amount of 70% by weight and 30% by weight.

(Embodiment 18D)

As the second layer, an ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) and polyethylene (manufactured by Ube Industries, Ltd., trade name: UBE polyethylene F222NH) were prepared. And the blended product obtained by blending each of the polypropylene (Sumitomo Chemical Co., Ltd., trade name: NOBRENE FS2011 DG2) at a concentration by weight of 60% by weight, 20% by weight, or 20% by weight, except for the blended product of Example 1D. A diaphragm for electromagnetic wave shielding and an electronic component are manufactured.

(Example 19D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that a saturated copolymerized polyester emulsion (manufactured by UNITIKA Co., Ltd., trade name: ELITEL KT-8803) was prepared.

(Embodiment 20D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the first layer was set to 5 μm.

(Example 21D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the second layer was set to 120 μm.

(Example 22D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the third layer was set to 3 μm.

(Embodiment 23D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the second layer was 80 μm and the thickness of the first layer was 10 μm.

(Embodiment 24D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the thickness of the first layer was 5 μm, the thickness of the second layer was 80 μm, and the thickness of the third layer was 5 μm.

(Embodiment 25D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the formation of the first layer was omitted, and the conductive polymer polyaniline dispersion (PANI-PD manufactured by REGULUS Co., Ltd.) was used as the electromagnetic wave barrier layer.

(Embodiment 26D)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1D except that the formation of the third layer was omitted.

(Comparative Example 1D)

In the same manner as in Example 1D, except that polyethylene terephthalate (manufactured by Toray Industries, Inc., trade name: LUMIRROR S10) was prepared as the base material layer, and the thickness of the base material layer was set to 30 μm. A diaphragm for electromagnetic wave shielding and an electronic component are manufactured.

(Comparative Example 2D)

In the same manner as in Example 1D, except that polyethylene terephthalate (manufactured by Toray Industries, Inc., trade name: LUMIRROR S10) was prepared as the base material layer, and the thickness of the base material layer was set to 100 μm. A diaphragm for electromagnetic wave shielding and an electronic component are manufactured.

<evaluation test>

The film for electromagnetic wave shielding produced in Examples 1D to 26D and Comparative Examples 1D and 2D, or an electronic component, was evaluated for shape followability, release property, folding resistance, and substrate layer in the same manner as in the above <Evaluation Test>. The second layer of exudation, heat resistance, electromagnetic wave shielding cutting. Stamping workability.

The evaluation results of the above respective examples and comparative examples are shown in Table 4.

It can be understood from Table 4 that the electromagnetic wave shielding films of Examples 1D to 24D exhibit good shape followability, and are related to release property, folding resistance, second layer exudation property of the substrate layer, and shielding of electromagnetic wave shielding. The punching workability is also excellent in balance. On the other hand, in the electromagnetic wave shielding films of Comparative Examples 1D and 2D, the shape followability was not satisfactory as compared with the electromagnetic wave shielding films of Examples 1D to 26D.

5. Discussion on the storage elastic coefficient of the substrate layer

(Example 1E)

<Manufacture of diaphragm for electromagnetic wave shielding>

In order to obtain a film for electromagnetic wave shielding, a polystyrene (manufactured by Idemitsu Kogyo Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the first layer (first release layer). The styrene polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the third layer (second release layer). An ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) was prepared as a resin constituting the second layer (buffer layer). A polyolefin emulsion (manufactured by UNITIKA Co., Ltd., trade name: A-BASE TC-4010) was prepared as a resin constituting the insulating layer. A conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave blocking layer.

Using the above-mentioned aligned polystyrene as the first layer, the above-mentioned aligned polystyrene as the third layer, and the ethylene-methacrylate copolymer as the second layer, using the feed group and the multi-manifold The mold was filmed by coextrusion. The conductive adhesive layer as the electromagnetic wave blocking layer and the polyolefin emulsion as the insulating layer are applied to the base material layer in this order to form a diaphragm for electromagnetic wave shielding.

The thickness of the entire electromagnetic wave shielding film of Example 1E was 160 μm, the thickness of the first layer was 30 μm, the thickness of the third layer was 30 μm, the thickness of the second layer was 60 μm, the thickness of the insulating layer was 20 μm, and the electromagnetic wave blocking layer. The thickness is 20 μm.

Further, the first layer, the second layer, and the third layer of the electromagnetic wave shielding film of Example 1E were measured. The average coefficient of linear expansion was 420, 2400 and 420 ppm/°C.

Further, the storage elastic modulus of the base material layer and the electromagnetic wave blocking layer at 150 ° C was measured, and as a result, they were each 1.8 E + 07 Pa and 1.2 E + 07 Pa.

<Manufacture of electronic parts>

The electromagnetic wave shielding film obtained was attached to a memory substrate for a personal computer (manufactured by Samsung Co., Ltd. under the conditions of a temperature of 150 degrees and a pressure of 2.0 MPa in a vacuum pressure forming method for 5 minutes). DDR2 667 M470T6554EZ3-CE6 PC2-5300) (high and low difference of 1,000μm) surface. After the attachment, the substrate layer was peeled off from the electromagnetic wave blocking layer by hand to produce an electronic component.

(Embodiment 2E)

As the second layer, an ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: NOBRENE FS2011DG2) were prepared. A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E except that the blended product was blended in an amount of 70% by weight and 30% by weight.

(Embodiment 3E)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E except that the thickness of the first layer was set to 10 μm.

(Embodiment 4E)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E except that the thickness of the second layer was changed to 90 μm.

(Example 5E)

As the first layer, we prepare a pair of polystyrene (made by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) and a styrene-ethylene-butylene-styrene block copolymer (Kuraray Co., Ltd.) System, trade name: SEPTON S8007) each blended by weight concentration of 60wt%, 40wt% A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E except for the product.

(Embodiment 6E)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E except that the thickness of the first layer was set to 80 μm.

(Example 7E)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E except that the thickness of the first layer was set to 100 μm.

(Example 8E)

As a first layer, we prepare a pair of polystyrene (manufactured by Idemitsu Kogyo Co., Ltd., trade name: XAREC S107) and polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: NOBRENE FS2011DG2) in weight% A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E except that the blended product was blended at a concentration of 60% by weight and 40% by weight.

(Example 9E)

In the second layer, a film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E except that the polypropylene (manufactured by Sumitomo Chemical Co., Ltd., trade name: NOBRENE FS2011 DG2) was prepared.

(Example 10E)

A film for electromagnetic wave shielding and electronic parts were produced in the same manner as in Example 1E except that polybutylene terephthalate (manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: NOVADURAN 5020) was prepared as the first layer. .

(Comparative Example 1E)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E except that a cyclic olefin-based copolymer (manufactured by POLYPLASTICS Co., Ltd., trade name: TOPAS 6017) was prepared.

(Comparative Example 2E)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1E except that the thickness of the third layer was 1 μm and the thickness of the first layer was 1 μm.

<evaluation test>

The electromagnetic wave shielding film or electronic component produced in Examples 1E to 10E and Comparative Examples 1E and 2E, and the electromagnetic wave shielding film or electrons produced in Examples 1D to 26D and Comparative Examples 1D and 2D. The parts are carried out in the same manner, and the shape followability, release property, folding resistance, second layer exudation property of the base material layer, heat resistance, and electromagnetic wave shielding are performed. Evaluation of stamping workability.

The evaluation results of the above respective examples and comparative examples are shown in Table 5.

As is clear from Table 5, in Examples 1E to 10E, since the storage elastic modulus of the base material layer at 150 ° C was set to an appropriate range, good shape followability was exhibited. Furthermore, the release property, the folding resistance, the second layer exudation property of the base material layer, the heat resistance, and the cutting of the electromagnetic wave shielding. The punching workability is also good in balance, which is an excellent result.

On the other hand, in Comparative Examples 1E and 2E, the storage elastic modulus of the base material layer at 150 ° C was not set to an appropriate range, and as a result, the shape followability was not sufficiently satisfactory.

6. Discussion on the layer composition of the barrier layer and the storage elastic coefficient

(Example 1F)

<Manufacture of diaphragm for electromagnetic wave shielding>

In order to obtain a film for electromagnetic wave shielding, a polystyrene (manufactured by Idemitsu Kogyo Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the first layer (first release layer). The styrene polystyrene (manufactured by Idemitsu Kosan Co., Ltd., trade name: XAREC S107) was prepared as a resin constituting the third layer (second release layer). An ethylene-methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRYFT WD106) was prepared as a resin constituting the second layer (buffer layer). A polyolefin emulsion (manufactured by UNITIKA Co., Ltd., trade name: A-BASE TC-4010) was prepared as a resin constituting the insulating layer. A conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-260H-1) was prepared as a resin constituting the electromagnetic wave blocking layer.

Using the above-mentioned aligned polystyrene as the first layer, the above-mentioned aligned polystyrene as the third layer, and the ethylene-methacrylate copolymer as the second layer, using the feed group and the multi-manifold The mold was coextruded to form a film. The conductive adhesive layer as the electromagnetic wave blocking layer and the polyolefin-based emulsion as the insulating layer are applied to the base material layer in this order to prepare a film for electromagnetic wave shielding.

The thickness of the entire electromagnetic wave shielding film of Example 1F was 160 μm, the thickness of the first layer was 30 μm, the thickness of the third layer was 30 μm, the thickness of the second layer was 60 μm, the thickness of the insulating layer was 20 μm, and the electromagnetic wave blocking layer. The thickness is 20 μm.

Further, the average linear expansion coefficients of the first layer, the second layer, and the third layer of the electromagnetic wave shielding film of Example 1F were measured, and as a result, they were 420, 2400, and 420, respectively.

Further, the storage elastic modulus of the base material layer and the electromagnetic wave blocking layer at 150 ° C was measured, and as a result, they were each 1.8 E + 07 Pa and 1.2 E + 07 Pa.

<Manufacture of electronic parts>

The electromagnetic wave shielding film obtained was attached to a memory substrate for a personal computer (manufactured by Samsung Co., Ltd. under the conditions of a temperature of 150 degrees and a pressure of 2.0 MPa in a vacuum pressure forming method for 5 minutes). DDR2 667 M470T6554EZ3-CE6 PC2-5300) (high and low difference of 1,000μm) surface. After the attachment, the substrate layer was peeled off from the electromagnetic wave blocking layer by hand to produce an electronic component.

(Example 2F)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1F except that the conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-250H-5) was used as the electromagnetic wave blocking layer.

(Example 3F)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1F except that the conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW-250H-23) was used as the electromagnetic wave blocking layer.

(Example 4F)

A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1F except that the conductive adhesive layer (manufactured by Daikin Chemical Co., Ltd., trade name: CA-2503-4B) was used as the electromagnetic wave blocking layer.

(Example 5F)

For the resin constituting the barrier layer, a polyaniline dispersion (manufactured by REGULUS, trade name: PANI-PD, thickness: 20 μm) was prepared as a conductive absorbing layer for the absorbing layer, and In the same manner as in the example 1F, a diaphragm for electromagnetic wave shielding and an electronic component were produced.

(Example 6F)

In the resin constituting the barrier layer, a multilayered carbon nanotube dispersion (manufactured by Hodogaya Chemical Co., Ltd., trade name: NT-7K, thickness: 20 μm) was prepared as a dielectric absorbing layer for an absorbing layer, and other methods were implemented. In the same manner as in Example 1F, a diaphragm for electromagnetic wave shielding and an electronic component were produced.

(Example 7F)

An electromagnetic wave was produced in the same manner as in Example 1F except that PEDOT/PSS was used as the conductive absorbing layer for the absorbing layer (manufactured by Nippon Oil & Fat Co., Ltd., trade name: S-941, thickness: 20 μm). Masking and electronic parts for shielding.

(Example 8F)

In the resin constituting the barrier layer, a polyaniline dispersion liquid is prepared for a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW260-H1, thickness: 10 μm) as a reflective layer, and a conductive absorption layer as an absorption layer ( A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1F except that the film was made of REGULUS, and the product name was PANI-PD, and the thickness was 10 μm. .

(Example 9F)

The resin constituting the barrier layer is prepared as a conductive adhesive layer (manufactured by Daikin Chemical Co., Ltd., trade name: CA-2503-4B, thickness: 10 μm) as a reflective layer, and used as an absorption. a layer of a dielectric absorbing layer (PEDOT/PSS (manufactured by Nakagata Oil & Fats Co., Ltd., trade name: S-941, thickness: 10 μm), and these are coated in the order of the reflective layer and the absorbing layer, and In the same manner as in Example 1F, a diaphragm for electromagnetic wave shielding and an electronic component were produced.

(Example 10F)

The resin constituting the barrier layer is prepared by using a conductive adhesive layer (manufactured by Toyobo Co., Ltd., trade name: DW260-H1, thickness: 10 μm) as a reflective layer, and a conductive absorbing layer prepared as an absorbing layer. Aniline dispersion (manufactured by REGULUS, trade name: PANI-PD, thickness) A film for electromagnetic wave shielding and an electronic component were produced in the same manner as in Example 1F except that the film was applied to the film in the order of the absorbing layer and the reflecting layer.

(Example 11F)

The resin constituting the barrier layer is prepared as a conductive adhesive layer (manufactured by Daikin Chemical Co., Ltd., trade name: CA-2503-4B, thickness: 10 μm) as a reflective layer, and used as an absorption. a layer of a dielectric absorber layer (PEDOT/PSS (manufactured by Nakagata Oil Co., Ltd., trade name: S-941, thickness: 10 μm), and these were coated in the order of the absorber layer and the reflective layer, and the examples were In the same manner, 1F produces a diaphragm for electromagnetic wave shielding and an electronic component.

<evaluation test>

The electromagnetic wave shielding film or the electronic component produced in the examples 1F to 11F was also carried out in the same manner as those of the electromagnetic wave shielding film or the electronic component produced in the first to third embodiments. Perform shape follow-up, release, folding resistance, second layer exudation of substrate layer, heat resistance, and cutting of electromagnetic wave shielding. Evaluation of stamping workability.

The evaluation results of the above respective examples and comparative examples are shown in Table 6.

It can be understood from Table 6 that, as shown in Examples 1F to 11F, the storage elastic modulus of the electromagnetic wave barrier layer at 150 ° C is also set to be appropriate by setting not only the storage elastic modulus of the substrate layer at 150 ° C to an appropriate range. Within the range, good shape followability is shown. Furthermore, the cutting property, the folding resistance, the second layer exudation property of the base material layer, the heat resistance, and the shielding of the electromagnetic wave shielding can be obtained. The workability of the press is also good, and it is excellent.

[Industry Utilization]

The electromagnetic wave shielding film of the present invention can improve the design freedom of the substrate and can achieve weight reduction. The film for electromagnetic wave shielding having good shape followability to the convex portion 61 of 500 μm or more is thinned.

1‧‧‧ substrate layer

3‧‧‧Block

11‧‧‧1st floor

12‧‧‧3rd floor

13‧‧‧2nd floor

100‧‧‧Magnetic wave shielding diaphragm

Claims (17)

A diaphragm for electromagnetic wave shielding is used for a convex portion on a coated substrate, and is characterized in that it comprises a base material layer and an electromagnetic wave blocking layer laminated on one surface side of the base material layer, and the base material layer is It is composed of a laminate obtained by laminating at least two layers. The electromagnetic wave shielding film according to the first aspect of the invention, wherein the base material layer is formed by laminating the first layer, the second layer, and the third layer in this order from the other surface side. Laminate. The electromagnetic wave shielding film according to the second aspect of the invention, wherein the first layer has an average linear expansion coefficient of from 40 to 1000 [ppm/°C] at 25 to 150 °C. The electromagnetic wave shielding film according to the second or third aspect of the invention, wherein the thickness T (A) of the first layer is 5 μm or more and 100 μm or less. The electromagnetic wave shielding film according to the second or third aspect of the patent application, wherein the third layer has an average linear expansion coefficient of from 40 to 1000 [ppm/°C] at 25 to 150 °C. The electromagnetic wave shielding film according to the second or third aspect of the invention, wherein the thickness T (B) of the third layer is 5 μm or more and 100 μm or less. The electromagnetic wave shielding film according to the second or third aspect of the invention, wherein the second layer has an average linear expansion coefficient of from 400 to 150 [ppm/°C] at 25 to 150 °C. The electromagnetic wave shielding film according to the second or third aspect of the invention, wherein the thickness T (C) of the second layer is 10 μm or more and 100 μm or less. The electromagnetic wave shielding film according to the second or third aspect of the invention, wherein the thickness T (A) of the first layer, the thickness T (B) of the third layer, and the thickness T (C) of the second layer ), satisfying the following relationship (I): 0.05 < T (C) / (T (A) + T (B)) < 10. . . (I). The electromagnetic wave shielding film according to any one of claims 1 to 3, wherein the electromagnetic wave blocking layer is composed of a reflective layer and an absorbing layer, and the layers are from the substrate layer. The laminate is laminated on one side in this order. The electromagnetic wave shielding film according to the first aspect of the invention, wherein the substrate layer is a laminate in which the first layer and the second layer are laminated in this order from the other surface side to form a two-layer structure. The electromagnetic wave shielding film according to the first aspect of the patent application, wherein the substrate layer is The two layers and the third layer are laminated in this order from the other surface side to form a two-layer laminate. The electromagnetic wave shielding film according to any one of claims 1 to 3, wherein the electromagnetic wave shielding film is thermocompression-bonded to the substrate at a temperature of 150 ° C, a pressure of 2 MPa, and a time of 5 minutes. The shape followability at the time of the convex portion is 500 μm or more and 3,000 μm or less. The electromagnetic wave shielding film according to any one of claims 1 to 3, further comprising an insulating layer laminated between the base material layer and the electromagnetic wave blocking layer. The electromagnetic wave shielding film according to claim 14, wherein the insulating layer is made of a thermoplastic resin. The electromagnetic wave shielding film according to claim 14, wherein the insulating layer has a thickness T (D) of 3 μm or more and 50 μm or less. A method of coating an electronic component, comprising the step of attaching a film for electromagnetic wave shielding according to any one of claims 1 to 16 to the convex portion on the substrate, such that the convex portion is attached to the substrate The electromagnetic wave blocking layer is adhered to the electronic component; and the peeling step is performed after the attaching step, the substrate layer is peeled off from the electromagnetic wave blocking layer.