WO2013183219A1 - Led反射板用結晶性不飽和ポリエステル樹脂組成物、前記組成物からなる粒状物、及び前記粒状物を成形してなるled反射板、表面実装型発光装置、並びに該発光装置を備えた、照明装置及び画像表示装置 - Google Patents
Led反射板用結晶性不飽和ポリエステル樹脂組成物、前記組成物からなる粒状物、及び前記粒状物を成形してなるled反射板、表面実装型発光装置、並びに該発光装置を備えた、照明装置及び画像表示装置 Download PDFInfo
- Publication number
- WO2013183219A1 WO2013183219A1 PCT/JP2013/002857 JP2013002857W WO2013183219A1 WO 2013183219 A1 WO2013183219 A1 WO 2013183219A1 JP 2013002857 W JP2013002857 W JP 2013002857W WO 2013183219 A1 WO2013183219 A1 WO 2013183219A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- unsaturated polyester
- resin composition
- polyester resin
- crystalline
- copolymerizable
- Prior art date
Links
- 229920006337 unsaturated polyester resin Polymers 0.000 title claims abstract description 418
- 239000000203 mixture Substances 0.000 title claims abstract description 313
- 238000000465 moulding Methods 0.000 title claims description 89
- 239000008187 granular material Substances 0.000 title claims description 41
- 239000000178 monomer Substances 0.000 claims abstract description 171
- 229920006305 unsaturated polyester Polymers 0.000 claims abstract description 151
- 239000012463 white pigment Substances 0.000 claims abstract description 129
- 239000011256 inorganic filler Substances 0.000 claims abstract description 104
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 104
- 239000007787 solid Substances 0.000 claims abstract description 48
- 239000011342 resin composition Substances 0.000 claims description 214
- 239000002245 particle Substances 0.000 claims description 69
- -1 polyethylene Polymers 0.000 claims description 60
- 239000007788 liquid Substances 0.000 claims description 59
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 56
- 229920005992 thermoplastic resin Polymers 0.000 claims description 55
- 229920005989 resin Polymers 0.000 claims description 54
- 239000011347 resin Substances 0.000 claims description 54
- 238000001746 injection moulding Methods 0.000 claims description 46
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 42
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 22
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 20
- 238000001879 gelation Methods 0.000 claims description 19
- 239000004743 Polypropylene Substances 0.000 claims description 16
- 229920001155 polypropylene Polymers 0.000 claims description 16
- 229910002113 barium titanate Inorganic materials 0.000 claims description 11
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 11
- 239000011787 zinc oxide Substances 0.000 claims description 11
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 11
- 239000005083 Zinc sulfide Substances 0.000 claims description 10
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 10
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 10
- 239000004698 Polyethylene Substances 0.000 claims description 8
- 239000004793 Polystyrene Substances 0.000 claims description 7
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 7
- 229920000573 polyethylene Polymers 0.000 claims description 7
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 7
- 229920002223 polystyrene Polymers 0.000 claims description 7
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 6
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 6
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 6
- 239000011118 polyvinyl acetate Substances 0.000 claims description 6
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 abstract description 3
- 150000003254 radicals Chemical class 0.000 description 52
- 239000011521 glass Substances 0.000 description 47
- 238000000034 method Methods 0.000 description 45
- 238000002156 mixing Methods 0.000 description 44
- 239000000835 fiber Substances 0.000 description 43
- 238000012360 testing method Methods 0.000 description 41
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 37
- 239000012779 reinforcing material Substances 0.000 description 37
- 238000003860 storage Methods 0.000 description 36
- 239000003795 chemical substances by application Substances 0.000 description 35
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 34
- 239000003365 glass fiber Substances 0.000 description 33
- 150000007519 polyprotic acids Polymers 0.000 description 30
- 239000000047 product Substances 0.000 description 27
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 25
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 24
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 22
- 239000004745 nonwoven fabric Substances 0.000 description 21
- 239000004065 semiconductor Substances 0.000 description 21
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 20
- 238000002310 reflectometry Methods 0.000 description 20
- 229920000728 polyester Polymers 0.000 description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 18
- 230000000694 effects Effects 0.000 description 17
- 239000000463 material Substances 0.000 description 17
- 229920006395 saturated elastomer Polymers 0.000 description 17
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 16
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 16
- 235000014113 dietary fatty acids Nutrition 0.000 description 16
- 238000002845 discoloration Methods 0.000 description 16
- 239000000194 fatty acid Substances 0.000 description 16
- 229930195729 fatty acid Natural products 0.000 description 16
- 150000004665 fatty acids Chemical class 0.000 description 16
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 239000002253 acid Substances 0.000 description 15
- 239000000843 powder Substances 0.000 description 15
- 229920001187 thermosetting polymer Polymers 0.000 description 15
- 239000002759 woven fabric Substances 0.000 description 15
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 14
- 238000006116 polymerization reaction Methods 0.000 description 14
- 239000004412 Bulk moulding compound Substances 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 12
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 12
- 239000003112 inhibitor Substances 0.000 description 12
- 238000002844 melting Methods 0.000 description 12
- 230000008018 melting Effects 0.000 description 12
- 150000001451 organic peroxides Chemical class 0.000 description 12
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 12
- 150000002334 glycols Chemical class 0.000 description 11
- 238000005469 granulation Methods 0.000 description 11
- 230000003179 granulation Effects 0.000 description 11
- 230000001771 impaired effect Effects 0.000 description 11
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 239000008188 pellet Substances 0.000 description 11
- 238000002360 preparation method Methods 0.000 description 11
- 239000003566 sealing material Substances 0.000 description 11
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 10
- 239000004760 aramid Substances 0.000 description 10
- 229920006231 aramid fiber Polymers 0.000 description 10
- 229910000019 calcium carbonate Inorganic materials 0.000 description 10
- 238000005259 measurement Methods 0.000 description 10
- 239000004641 Diallyl-phthalate Substances 0.000 description 9
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 9
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 9
- 239000000945 filler Substances 0.000 description 9
- 238000011049 filling Methods 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 9
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 8
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 8
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 8
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 8
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 8
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 8
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 8
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 8
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 8
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 8
- 239000003677 Sheet moulding compound Substances 0.000 description 8
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 8
- 230000008901 benefit Effects 0.000 description 8
- KGQLBLGDIQNGSB-UHFFFAOYSA-N benzene-1,4-diol;methoxymethane Chemical compound COC.OC1=CC=C(O)C=C1 KGQLBLGDIQNGSB-UHFFFAOYSA-N 0.000 description 8
- 230000001588 bifunctional effect Effects 0.000 description 8
- 239000001530 fumaric acid Substances 0.000 description 8
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 8
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 8
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 8
- 239000000049 pigment Substances 0.000 description 8
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 8
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 8
- 150000003839 salts Chemical class 0.000 description 8
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 8
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 8
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 7
- 239000004721 Polyphenylene oxide Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 7
- 238000004898 kneading Methods 0.000 description 7
- 239000006082 mold release agent Substances 0.000 description 7
- 229920000570 polyether Polymers 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000003505 polymerization initiator Substances 0.000 description 6
- 238000010298 pulverizing process Methods 0.000 description 6
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 6
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 5
- QCXXDZUWBAHYPA-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.O=C1NC(=O)NC(=O)N1 Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.O=C1NC(=O)NC(=O)N1 QCXXDZUWBAHYPA-UHFFFAOYSA-N 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000011151 fibre-reinforced plastic Substances 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 238000001721 transfer moulding Methods 0.000 description 5
- JXCAHDJDIAQCJO-UHFFFAOYSA-N (1-tert-butylperoxy-2-ethylhexyl) hydrogen carbonate Chemical compound CCCCC(CC)C(OC(O)=O)OOC(C)(C)C JXCAHDJDIAQCJO-UHFFFAOYSA-N 0.000 description 4
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 4
- XVOUMQNXTGKGMA-OWOJBTEDSA-N (E)-glutaconic acid Chemical compound OC(=O)C\C=C\C(O)=O XVOUMQNXTGKGMA-OWOJBTEDSA-N 0.000 description 4
- VBQCFYPTKHCPGI-UHFFFAOYSA-N 1,1-bis(2-methylpentan-2-ylperoxy)cyclohexane Chemical compound CCCC(C)(C)OOC1(OOC(C)(C)CCC)CCCCC1 VBQCFYPTKHCPGI-UHFFFAOYSA-N 0.000 description 4
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 4
- XHAFIUUYXQFJEW-UHFFFAOYSA-N 1-chloroethenylbenzene Chemical compound ClC(=C)C1=CC=CC=C1 XHAFIUUYXQFJEW-UHFFFAOYSA-N 0.000 description 4
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- CHUGKEQJSLOLHL-UHFFFAOYSA-N 2,2-Bis(bromomethyl)propane-1,3-diol Chemical compound OCC(CO)(CBr)CBr CHUGKEQJSLOLHL-UHFFFAOYSA-N 0.000 description 4
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 4
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 4
- FEXBEKLLSUWSIM-UHFFFAOYSA-N 2-Butyl-4-methylphenol Chemical compound CCCCC1=CC(C)=CC=C1O FEXBEKLLSUWSIM-UHFFFAOYSA-N 0.000 description 4
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 4
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 4
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 4
- VZNSVWKHKHDGCM-UHFFFAOYSA-N 3,3,4,4,4-pentafluoro-2-methylbutan-2-ol Chemical compound CC(C)(O)C(F)(F)C(F)(F)F VZNSVWKHKHDGCM-UHFFFAOYSA-N 0.000 description 4
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 4
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 4
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 4
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 4
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 235000021355 Stearic acid Nutrition 0.000 description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 4
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Natural products CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 4
- 239000001361 adipic acid Substances 0.000 description 4
- 235000011037 adipic acid Nutrition 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 4
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 4
- 229940063655 aluminum stearate Drugs 0.000 description 4
- 239000003242 anti bacterial agent Substances 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 description 4
- 229910052599 brucite Inorganic materials 0.000 description 4
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 4
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 4
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 4
- 239000000920 calcium hydroxide Substances 0.000 description 4
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 4
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 4
- 239000008116 calcium stearate Substances 0.000 description 4
- 235000013539 calcium stearate Nutrition 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
- 239000004917 carbon fiber Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 4
- 229940018557 citraconic acid Drugs 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 4
- 238000006482 condensation reaction Methods 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- MPOGZNTVZCEKSW-UHFFFAOYSA-N ethenyl 2-hydroxypropanoate Chemical compound CC(O)C(=O)OC=C MPOGZNTVZCEKSW-UHFFFAOYSA-N 0.000 description 4
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 4
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 4
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 239000004088 foaming agent Substances 0.000 description 4
- 150000004677 hydrates Chemical class 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 239000012784 inorganic fiber Substances 0.000 description 4
- 229910052500 inorganic mineral Inorganic materials 0.000 description 4
- 229910052747 lanthanoid Inorganic materials 0.000 description 4
- 150000002602 lanthanoids Chemical class 0.000 description 4
- 239000004611 light stabiliser Substances 0.000 description 4
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 4
- 239000001095 magnesium carbonate Substances 0.000 description 4
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 4
- 239000011976 maleic acid Substances 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 4
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 4
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 4
- 239000010445 mica Substances 0.000 description 4
- 229910052618 mica group Inorganic materials 0.000 description 4
- 239000011707 mineral Substances 0.000 description 4
- 239000003607 modifier Substances 0.000 description 4
- 239000002667 nucleating agent Substances 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 4
- 239000006259 organic additive Substances 0.000 description 4
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 229950000688 phenothiazine Drugs 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000011164 primary particle Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 4
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 4
- 229940079877 pyrogallol Drugs 0.000 description 4
- 150000004053 quinones Chemical class 0.000 description 4
- 239000005368 silicate glass Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 239000008117 stearic acid Substances 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 4
- 239000002562 thickening agent Substances 0.000 description 4
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 4
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 4
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 4
- 229920001567 vinyl ester resin Polymers 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000005282 brightening Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920005906 polyester polyol Polymers 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- 239000002990 reinforced plastic Substances 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 230000001476 alcoholic effect Effects 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000004590 silicone sealant Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000003856 thermoforming Methods 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000012669 compression test Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- MHCLJIVVJQQNKQ-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O MHCLJIVVJQQNKQ-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000006081 fluorescent whitening agent Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/01—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/06—Unsaturated polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3009—Sulfides
- C08K2003/3036—Sulfides of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Definitions
- the present invention relates to an unsaturated polyester resin composition for LED reflectors, a granular material comprising the composition, and an LED reflector obtained by molding the granular material, and in particular, a resin comprising a crystalline unsaturated polyester.
- the present invention relates to a composition, a granular material composed of the composition, and an LED reflector formed by molding the granular material.
- the present invention relates to an unsaturated polyester resin composition for LED reflectors using a thermoplastic resin, a granule made of the composition, and an LED reflector made by molding the granule.
- the present invention also relates to a radically polymerizable resin composition for an LED reflector, a granular material comprising the composition, a molding method using the granular material, and an LED reflector.
- the present invention also relates to a surface-mounted light emitting device provided with a reflector formed by molding an unsaturated polyester resin composition, and an illumination device and an image display device provided with the light emitting device.
- LEDs have been adopted for many uses, taking advantage of low power consumption, long life, miniaturization, weight reduction, high-speed response, etc. Recently, they are rapidly spreading as light sources for general households as energy-saving products. is doing. Along with this, LEDs that replace existing light sources are also increasing in light quantity and current, and the amount of heat generation is increased due to the increase in emitted light and injection current density. For this reason, deterioration of peripheral materials used in LEDs is accelerated, and high performance and high reliability materials are demanded.
- the reflection plate reflects the light of the LED to the front and improves the brightness.
- the material of the reflection plate is excellent in the initial luminance, has a high reflectance, and is resistant to heat and light even after long-term use. Less discoloration is required.
- thermoplastic resin used as a reflector material due to higher output is discolored due to the strong light of high-brightness LEDs and the high temperature of the chip surface.
- problems of light reflection efficiency and LED brightness reduction are problems of light reflection efficiency and LED brightness reduction.
- Surface mounted light emitting devices such as LEDs are mainly composed of a semiconductor element, a lead frame, a reflector, and a sealing material.
- LED reflectors have been required to have surface smoothness that is evaluated by shrinkage and image clarity.
- LED reflectors made of ceramics with good heat discoloration are known (for example, Patent Document 1).
- LED general-purpose reflectors made of liquid crystal polyester resin that can be injection-molded and have good productivity are known (for example, Patent Document 2).
- an LED reflector made of an epoxy resin having a good initial reflectance is known (for example, Patent Document 3).
- a general-purpose LED reflector made of a partially aromatic polyamide resin is known (for example, Patent Document 4). These partially aromatic polyamide resins have high initial reflectivity and are inexpensive.
- Patent Document 5 the resin composition for LED reflector made of unsaturated polyester resin having heat discoloration resistance and injection molding, and the An LED reflector made of a resin composition is known (for example, Patent Document 5).
- the resin composition comprising an unsaturated polyester resin in Patent Document 5 is an amorphous unsaturated polyester resin composition, and can solve the problems in the case of comprising a partially aromatic polyamide resin.
- a surface mount type light emitting device including a reflecting plate formed of ceramics having good heat discoloration is known (for example, Patent Document 6).
- a surface-mounted light-emitting device including a reflecting plate formed with an epoxy resin composition having a good initial reflectance is known (for example, Patent Document 7).
- a surface-mounted light-emitting device that includes a reflecting plate molded with a partially aromatic polyamide resin is known (for example, Patent Document 8).
- an unsaturated polyester resin composition that eliminates the problems of a surface-mounted light-emitting device provided with a reflector formed by molding the partially aromatic polyamide resin composition, has heat-resistant discoloration properties, and can be injection-molded.
- a surface-mounted light-emitting device that includes a reflecting plate that is molded with a substrate is known (eg, Patent Document 9).
- the surface-mounted light-emitting device provided with the reflector molded from the unsaturated polyester resin composition in Patent Document 9 solves the problems of the surface-mounted light-emitting device provided with the reflector molded from the partially aromatic polyamide resin composition can do.
- Patent Documents 1 and 6 although ceramics exhibit extremely excellent heat resistance, they are not practically used as general-purpose LED reflectors because of low productivity and high price. Moreover, in the said patent document 2, although these liquid crystalline polyester resins are favorable in heat resistance, there existed a subject inferior to initial stage reflectance.
- Patent Document 3 these epoxy resins have good initial reflectivity and heat resistance, but are poor in storage stability and difficult to be post-processed after molding, and are produced by transfer molding. Since it is necessary to make an object into a tablet and the price is relatively high, there is a problem that, as a general-purpose LED reflector, it is not widely used as a general-purpose surface-mounted light-emitting device in Patent Document 7.
- the surface mount type light-emitting device made from a partial aromatic polyamide resin can be produced by injection molding,
- the heat discoloration is poor and the initial reflectance cannot be maintained, there is a problem that the brightness of the LED lamp is lowered.
- the unsaturated polyester resin has a good initial reflectivity, but has problems of poor granulation and storage shape stability.
- an amorphous unsaturated polyester resin composed of an amorphous unsaturated polyester and a copolymerizable monomer that is liquid at room temperature is liquid at room temperature.
- Amorphous unsaturated polyester resin composition for LED reflectors which uses white pigment and inorganic filler in liquid amorphous unsaturated polyester resin, is stable in storage shape like BMC (bulk molding compound). It becomes scarce and workability becomes extremely difficult.
- an amorphous unsaturated polyester resin comprising a non-crystalline unsaturated polyester and a copolymerizable multimer that is solid at room temperature is used. Used to ensure workability at room temperature.
- amorphous unsaturated polyester resin consisting of amorphous unsaturated polyester and a copolymerizable multimer that is solid at room temperature has high viscosity even in the resin composition plasticizing temperature region during LED reflector molding.
- a white pigment having a large particle diameter and an inorganic filler.
- the LED reflector made of an amorphous unsaturated polyester resin composition for an LED reflector made of a non-crystalline unsaturated polyester and a copolymerizable multimer that is solid at room temperature is composed of a white pigment having a large particle diameter and an inorganic filler. Since the material is used, the surface area of the white pigment and the inorganic filler is narrow, and the reflection area at the interface between the amorphous unsaturated polyester resin, the white pigment and the inorganic filler is also narrow. As a result, the target initial reflectance can be obtained by increasing the ratio of using the white pigment, but there is a problem that a large amount of expensive white pigment must be used.
- amorphous unsaturated polyester resin consisting of amorphous unsaturated polyester and copolymerizable multimer that is solid at room temperature is a white pigment and inorganic filler with excellent heat resistance because of its high viscosity when the resin is melted. Can not be filled high.
- the organic resin that is oxidatively colored by heat has a large resin content, so that it has a problem that the reflectivity is low after the heat test and the target cannot be reached. If a low-viscosity unsaturated polyester resin is obtained, white pigments and inorganic fillers with a small particle diameter can be used, and it is expected that the reflectance and the like can be improved, and an unsaturated polyester resin having a melting point is used.
- the storage shape stability of the resin composition (shape change of the resin composition, fusion of particles) can be improved at a temperature lower than the melting point.
- a white pigment having a small particle diameter and an inorganic filler it is possible to use a white pigment having a small particle diameter and an inorganic filler, and a resin composition excellent in heat resistance, storage shape stability and the like has not been known so far.
- the present invention eliminates the problems seen when a conventional amorphous unsaturated polyester resin is used by using a crystalline unsaturated polyester resin as the unsaturated polyester resin, and an inorganic filler or white
- An object of the present invention is to provide a crystalline unsaturated polyester resin composition having improved fluidity when blending pigments and the like.
- a general unsaturated polyester resin composition has a problem that minute unevenness is generated on the surface due to curing shrinkage or heat shrinkage at the time of molding, and the surface gloss tends to be poor. This problem has been particularly serious in unsaturated polyester resin compositions for LED reflectors that require high reflectivity and high surface gloss.
- Another problem to be solved by the present invention is to provide an unsaturated polyester resin composition excellent in low shrinkage and image clarity of a molded product and in addition, granulation of the resin composition.
- unsaturated polyester resin can be produced by injection molding, so the productivity is good, but the effect on the quality of the molded product such as viscosity, curing speed and moldability, and surface smoothness. Is not mentioned.
- Another problem to be solved by the present invention is to provide a radically polymerizable resin composition for an LED reflector that is less prone to molding defects such as burrs and insufficient filling.
- Another problem to be solved by the present invention is to provide a long-life surface-mounted light-emitting device that eliminates the problems seen when using conventional amorphous unsaturated polyester resins.
- the present inventor has found the crystalline unsaturated polyester resin composition of the present invention as a result of diversified examination from various viewpoints when the unsaturated polyester resin is used in the resin composition for LED reflectors. It was.
- the crystalline unsaturated polyester resin composition for LED reflector of the present invention is a crystalline unsaturated polyester resin composition containing at least a crystalline unsaturated polyester resin and an inorganic filler,
- the saturated polyester resin comprises a crystalline unsaturated polyester, a copolymerizable monomer and / or a copolymerizable multimer, and the crystalline unsaturated polyester resin composition contains a white pigment.
- the crystalline unsaturated polyester resin composition for LED reflector of the present invention is solid in a temperature range of 50 ° C. or lower.
- the crystalline unsaturated polyester resin comprises 40 to 95 parts by weight of the crystalline unsaturated polyester, and a copolymerizable monomer. And / or 60 to 5 parts by weight of a copolymerizable multimer.
- the copolymer which is liquid at room temperature with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer.
- the polymerizable monomer is 50% by weight or more.
- the crystalline unsaturated polyester resin composition for LED reflector of the present invention is 10 to 35% by weight based on the total amount of the composition, and an inorganic filler and
- the total amount of the white pigment is 50 to 80% by weight relative to the total amount of the composition, and the proportion of the white pigment in the total amount of the inorganic filler and the white pigment is 10 to 50% by weight. It is characterized by being.
- the proportion of the white pigment in the total amount of the inorganic filler and the white pigment is 10 to 29% by weight. It is characterized by that.
- the white pigment is selected from the group consisting of titanium oxide, barium titanate, barium sulfate, zinc oxide, and zinc sulfide. It is one or more types.
- the white pigment has an average particle size of 2.0 ⁇ m or less.
- the inorganic filler has an average particle size in the range of 0.1 to 50 ⁇ m.
- the granular material of the present invention is characterized by comprising the crystalline unsaturated polyester resin composition for LED reflector of the present invention.
- the LED reflector of the present invention is formed by molding a granular material made of the crystalline unsaturated polyester resin composition for LED reflector of the present invention.
- the present inventor has found out the unsaturated polyester resin composition of the present invention as a result of diversified examination from various viewpoints when the unsaturated polyester resin is used in the resin composition for LED reflectors. It came.
- the unsaturated polyester resin composition for LED reflector of the present invention is an unsaturated polyester resin composition containing at least an unsaturated polyester resin and an inorganic filler, and the unsaturated polyester resin is an unsaturated polyester. And a copolymerizable monomer and / or copolymerizable multimer, and a thermoplastic resin, wherein the unsaturated polyester resin composition contains a white pigment.
- the unsaturated polyester resin comprises the unsaturated polyester, the copolymerizable monomer and / or copolymerizable multimer.
- the total amount is 99 to 50 parts by weight, and the thermoplastic resin is 1 to 50 parts by weight.
- the unsaturated polyester resin composition for LED reflector of the present invention is 10 to 35% by weight with respect to the total amount of the composition, and the inorganic filler and the white pigment
- the total amount of the white pigment is 50 to 80% by weight relative to the total amount of the composition, and the proportion of the white pigment in the total amount of the inorganic filler and the white pigment is 10 to 50% by weight. It is characterized by being.
- the unsaturated polyester resin contains at least a crystalline unsaturated polyester.
- the unsaturated polyester resin is solid in a temperature range of 50 ° C. or lower.
- the copolymer which is liquid at room temperature with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer. It is characterized in that the functional monomer is 50% by weight or more.
- the ratio of the white pigment to the total amount of the inorganic filler and the white pigment is 10 to 29% by weight. It is characterized by that.
- the white pigment is selected from the group consisting of titanium oxide, barium titanate, barium sulfate, zinc oxide, and zinc sulfide. It is the above.
- the white pigment has an average particle size of 2.0 ⁇ m or less.
- the inorganic filler has an average particle size in the range of 0.1 to 50 ⁇ m.
- the thermoplastic resin is polymethyl methacrylate, polystyrene, acrylonitrile butadiene styrene, polyethylene, polypropylene, polyvinyl acetate, styrene butadiene rubber, and It is one or more types selected from the group consisting of these copolymers.
- the granular material of the present invention is characterized by comprising the unsaturated polyester resin composition for LED reflector of the present invention.
- the LED reflector of the present invention is formed by molding a granular material made of the unsaturated polyester resin composition for LED reflector of the present invention.
- the radical polymerizable resin composition for LED reflector of the present invention is a radical polymerizable resin composition containing at least a radical polymerizable resin, an inorganic filler, and a white pigment, and the viscosity of the radical polymerizable resin composition is 0.
- the range is from 1 to 100 kPa ⁇ s.
- the viscosity of the radical polymerizable resin composition is in a range of 0.1 to 100 kPa ⁇ s in a temperature range of 70 ° C. to 120 ° C. It is characterized by being.
- the radical polymerizable resin composition contains an unsaturated polyester resin.
- the radical polymerizable resin composition contains a crystalline unsaturated polyester resin.
- the gel time in the temperature range of 140 to 180 ° C. is 5 to 120 seconds in the radical polymerizable resin composition. It is characterized by things.
- the granular material of the present invention is characterized by comprising the radically polymerizable resin composition for an LED reflector of the present invention.
- the injection molding method of the present invention is characterized in that the granular material comprising the radically polymerizable resin composition for LED reflector of the present invention is heated and cured at 140 to 180 ° C.
- the LED reflector of the present invention is obtained by the injection molding method of the present invention.
- the present inventor has found a surface-mounted light-emitting device of the present invention as a result of diversified examinations from various viewpoints in the case of including a reflector formed by molding an unsaturated polyester resin composition. .
- the surface-mounted light-emitting device of the present invention is a surface-mounted light-emitting device including a reflector formed by molding an unsaturated polyester resin composition containing at least an unsaturated polyester resin and an inorganic filler
- the unsaturated polyester resin is an unsaturated polyester resin (A) comprising a crystalline unsaturated polyester and a copolymerizable monomer and / or copolymerizable multimer, or an unsaturated polyester and copolymerizable monomer.
- unsaturated polyester resins (B) comprising a copolymerizable multimer and a thermoplastic resin, wherein the unsaturated polyester resin composition contains a white pigment.
- the unsaturated polyester resin (A) comprises 40 to 95 parts by weight of a crystalline unsaturated polyester, a copolymerizable monomer and / or a copolymerizable monomer. It consists of 60 to 5 parts by weight of a multimer.
- the unsaturated polyester resin (B) comprises 35 to 95 parts by weight of an unsaturated polyester, a copolymerizable monomer and / or a copolymerizable multimer. It is characterized by comprising 99 to 50 parts by weight of a mixture composed of 60 to 5 parts by weight and 1 to 50 parts by weight of a thermoplastic resin.
- the unsaturated polyester resin (A) and / or (B) is 10 to 35% by weight based on the total amount of the composition, and the inorganic filler
- the total amount of the white pigment is 50 to 80% by weight based on the total amount of the composition, and the ratio of the white pigment to the total amount of the inorganic filler and the white pigment is 10%. It is characterized by being ⁇ 50% by weight.
- the unsaturated polyester resin (A) and / or (B) is solid in a temperature range of 50 ° C. or less.
- the unsaturated polyester resin (B) includes at least a crystalline unsaturated polyester.
- the copolymerizable monomer that is liquid at room temperature with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer is The unsaturated polyester resin composition molded body containing 50% by weight or more is included.
- the ratio of the white pigment to the total amount of the inorganic filler and the white pigment is 10 to 29% by weight.
- the white pigment is at least one selected from the group consisting of titanium oxide, barium titanate, barium sulfate, zinc oxide, and zinc sulfide.
- the lighting device of the present invention is characterized by including the surface mount light emitting device of the present invention.
- the image display device of the present invention is characterized by including the surface-mounted light emitting device of the present invention.
- the crystalline unsaturated polyester resin composition for LED reflector of the present invention exhibits fluidity at a temperature equal to or higher than the melting point of the crystalline unsaturated polyester resin by using the crystalline unsaturated polyester resin as the unsaturated polyester resin. Even if a small particle size white pigment and an inorganic filler are blended, the viscosity of the resin composition is low, and even if the blending ratio of the white pigment in the total amount of the blended amount of the inorganic filler and the white pigment is small, the small particles Since a white pigment having a diameter and an inorganic filler are blended, there is an advantageous effect that the initial reflectivity of the reflector and the reflectivity after the heat resistance test are excellent.
- the resin composition of the present invention has high initial reflectivity because there is no mixing of metal powder due to wear of manufacturing equipment during the preparation of inorganic fillers and white pigments, or during LED reflector production, Since the solid state can be maintained in a temperature range from room temperature to 50 ° C., there is an advantageous effect that the moldability and the storage shape stability are excellent.
- composition of the present invention has an advantageous effect that it can provide an LED reflector having high initial reflectance, excellent heat resistance, and high reflectance after a heat resistance test.
- the LED lamp made of the crystalline unsaturated polyester resin composition of the present invention can provide an LED reflector having a long lifetime, low cost, and excellent reflectance.
- the unsaturated polyester resin composition for LED reflectors of the present invention uses an unsaturated polyester resin containing a thermoplastic resin, so that even if an amorphous unsaturated polyester is used, an excessive amount of filler is used. Without blending, there is an advantageous effect that an LED reflector having a low shrinkage rate and excellent image clarity can be obtained. Further, the unsaturated polyester resin composition for LED reflector of the present invention can be blended with a white pigment having a small particle diameter and an inorganic filler by using crystalline unsaturated polyester. There is an advantageous effect that the initial reflectance and the reflectance after the heat test are excellent.
- the resin composition of the present invention has high initial reflectivity because there is no mixing of metal powder due to wear of manufacturing equipment during the preparation of inorganic fillers and white pigments, or during LED reflector production, Since the solid state can be maintained in a temperature range from room temperature to 50 ° C., there is an advantageous effect that the moldability and the storage shape stability are excellent.
- the composition of the present invention has an advantageous effect that it can provide an LED reflector excellent in the low shrinkage and image clarity of a molded product and further in the granulation property of a resin composition.
- the LED lamp made of the unsaturated polyester resin composition of the present invention can provide an LED reflector having a long lifetime, low cost, excellent reflectance, low shrinkage, and image clarity.
- the radically polymerizable resin composition for an LED reflector of the present invention an LED reflector having excellent productivity, reflectance, and surface glossiness is obtained which is less prone to molding defects such as burrs and insufficient filling. Therefore, there is an advantageous effect that a radical polymerizable resin composition for injection molding can be obtained.
- the unsaturated polyester resin composition molded on the reflector provided in the surface-mounted light-emitting device of the present invention by using the crystalline unsaturated polyester, a white pigment having a small particle diameter, inorganic Since a filler can be mix
- the unsaturated polyester resin composition formed on the reflector provided in the surface-mounted light-emitting device of the present invention is due to wear of manufacturing equipment during the preparation of the inorganic filler and white pigment, or during LED reflector production. High initial reflectivity is obtained because there is no mixing of metal powder, etc., and since it can maintain a solid state in a temperature range from room temperature to 50 ° C., it is advantageous in that it has excellent formability and storage shape stability. There is an effect.
- the unsaturated polyester resin composition molded on the reflection plate provided in the surface-mounted light-emitting device of the present invention since the thermoplastic resin is included, an amorphous unsaturated polyester may be used.
- the LED reflector having a low shrinkage ratio and excellent image clarity can be obtained without adding a large amount of filler.
- the surface-mounted light-emitting device of the present invention provided with a reflector formed by molding these unsaturated polyester resin compositions is advantageous in that it has excellent initial performance such as reflectance and can maintain the initial performance over a long period of time. Play.
- the lighting device provided with the surface mount type light emitting device of the present invention provided with a reflector formed by molding these unsaturated polyester resin compositions has an advantageous effect of being excellent in initial performance and having a long life.
- the image display device provided with the surface-mounted light emitting device of the present invention provided with a reflector formed by molding these unsaturated polyester resin compositions has an advantageous effect of excellent initial performance and long life.
- FIG. 1 is a graph showing the change over time in reflectance (wavelength: 450 nm) when a reflectance measurement test piece is held in a 150 ° C. hot air dryer.
- FIG. 2 is a diagram schematically illustrating the configuration of the light emitting device 1 according to an embodiment of the present invention.
- FIG. 3 is a diagram schematically illustrating the configuration of the light emitting device 2 according to an embodiment of the present invention.
- FIG. 4 is a graph showing the change over time in the reflectance (wavelength: 450 nm) when the reflectance measurement test piece is held in a hot air dryer at 150 ° C.
- FIG. 5 is a diagram showing the relationship between the position of the differential transformer and time for measuring the gelation time.
- the straight line 1 corresponds to the mold clamping speed.
- the tangent at the inflection point of the S curve obtained at this stage is the straight line 2.
- the tangent at the inflection point of the S curve obtained at this stage is the straight line 3.
- the time between the intersection 4 of the straight line 1 and the straight line 2 and the intersection 5 of the straight line 2 and the straight line 3 was defined as the gel time.
- the crystalline unsaturated polyester resin composition for LED reflector of the present invention is a crystalline unsaturated polyester resin composition containing at least a crystalline unsaturated polyester resin and an inorganic filler, and the crystalline unsaturated polyester resin
- the resin comprises a crystalline unsaturated polyester and a copolymerizable monomer and / or copolymerizable multimer, and the crystalline unsaturated polyester resin composition contains a white pigment.
- the crystalline unsaturated polyester resin composition for LED reflectors may be referred to as a crystalline unsaturated polyester resin composition.
- the crystalline unsaturated polyester resin composition of the present invention is characterized in that it consists of a crystalline unsaturated polyester resin composition. This is because the present inventors have used a resin for LED reflectors using an unsaturated polyester resin. As a result of diversified examinations from various viewpoints regarding the above-mentioned problems in the composition, it has been found that the above-mentioned problems are likely to occur when an amorphous unsaturated polyester resin is used as the unsaturated polyester resin. It is because of that.
- the crystalline unsaturated polyester resin in the present invention can be obtained by mixing a crystalline unsaturated polyester and a copolymerizable monomer and / or copolymerizable multimer.
- the copolymerizable monomer and / or copolymerizable multimer is usually mixed with the resin together with other mixtures when preparing the resin composition, but may be mixed with the resin prior to preparing the resin composition.
- crystalline and amorphous unsaturated polyester resin will be described as follows.
- unsaturated polyester resins There are two types of unsaturated polyester resins: amorphous unsaturated polyester resins and crystalline unsaturated polyester resins.
- Amorphous unsaturated polyester resins dissolved in copolymerizable monomers such as styrene monomers are common. .
- BMC As an unsaturated polyester resin composition that can be injection-molded and uses a copolymerizable monomer such as a general styrene monomer, wet BMC is known at room temperature. BMC uses amorphous unsaturated polyester resin.
- A When BMC is injection-molded, additional equipment such as a plunger to be pushed into the molding machine is required.
- B Since it is bulky, it is easy to handle and amorphous. Therefore, improvement points such as inferior workability and (c) inferior storage stability due to being wet are mentioned.
- Amorphous unsaturated polyester resin composition that can be injection-molded and solid at room temperature is used as a non-crystalline unsaturated polyester in a solid state copolymerizable monomer, copolymerizable multimer, and use at room temperature.
- the above problems (a) to (c) are solved by using a liquid copolymerizable monomer as far as possible.
- a crystalline unsaturated polyester can be combined with a liquid or solid copolymerizable monomer and copolymerizable multimer in an arbitrary range at room temperature.
- the present inventor has paid attention to the fact that there is no limitation on the combination of the polymerizable monomer and the copolymerizable multimer.
- the present invention is a crystalline unsaturated polyester resin composition for LED reflectors composed of a crystalline unsaturated polyester resin, and uses an unsaturated polyester resin having a property different from that of the unsaturated polyester resin in Patent Document 5, As described below, even a small amount of white pigment has high initial reflectivity, high heat resistance, and reflectivity after a heat test.
- a crystalline unsaturated polyester resin composed of a crystalline unsaturated polyester and a copolymerizable monomer that is liquid at room temperature is solid at room temperature and has a low viscosity above the melting point of the crystalline unsaturated polyester resin. Liquid.
- an amorphous unsaturated polyester resin composed of an amorphous unsaturated polyester and a copolymerizable monomer that is liquid at room temperature is liquid at room temperature.
- this large difference in properties has a considerable number of advantageous effects such as initial reflectance, heat resistance, storage shape stability, etc. on the resin composition, granular material, and eventually the LED reflector. Will bring.
- the crystalline unsaturated polyester resin for LED reflectors which uses a white pigment and an inorganic filler for the crystalline unsaturated polyester resin, has storage shape stability in the temperature range below the melting point and ensures workability.
- the present inventors From the properties of such crystalline unsaturated polyester, the present inventors have found that the following advantages are obtained when used for LED reflectors. That is, since the crystalline unsaturated polyester resin has a low viscosity in the resin composition plasticizing temperature region at the time of molding the LED reflector, a white pigment having a small particle diameter and an inorganic filler that increase the viscosity of the resin composition can be used. .
- LED reflector made of crystalline unsaturated polyester resin composition for LED reflector uses white pigment and inorganic filler with small particle size, so the surface area of white pigment and inorganic filler is large, crystalline unsaturated polyester The reflection area at the interface between the white pigment and the inorganic filler is wide. As a result, even when the ratio of using the white pigment is small, the target initial reflectance can be obtained.
- a crystalline unsaturated polyester resin comprising a crystalline unsaturated polyester and a copolymerizable monomer that is liquid at room temperature, and a copolymerizable multimer within a range that does not impair the characteristics of reflectance and heat discoloration. Since the resin has a low viscosity when melted, it can be filled with a white pigment and an inorganic filler excellent in heat resistance. That is, since the resin content of the organic substance that is oxidized and colored by heat can be reduced, the reflectance after the heat resistance test is high and the target can be achieved.
- the crystalline unsaturated polyester resin is 50 ° C. or less from the viewpoint of storage shape stability, handleability, and workability. Solid in the temperature range. That is, it is solid at a temperature of normal temperature or higher and 50 ° C. or lower, and can be pulverized or extruded pellets.
- the crystalline unsaturated polyester resin composition for an LED reflector of the present invention can contain an amorphous unsaturated polyester within a range that does not impair characteristics such as storage shape stability of the present invention.
- the crystalline unsaturated polyester resin comprises 40 to 95 parts by weight of the crystalline unsaturated polyester, and a copolymerizable monomer. And / or 60 to 5 parts by weight of a copolymerizable multimer.
- the crystalline unsaturated polyester resin is preferably blended in a proportion of 50 to 95 parts by weight of the crystalline unsaturated polyester and 50 to 5 parts by weight of the copolymerizable monomer and / or copolymerizable multimer.
- the above range is set so that when the amount of the copolymerizable monomer and / or copolymerizable multimer blended in the crystalline unsaturated polyester is larger than the above range, the pulverization process and the extrusion pellet process cannot be performed. On the other hand, if the amount of the copolymerizable monomer and / or copolymerizable multimer is less than the above range, the curability is lowered and a reflector having a good appearance cannot be obtained. For reasons such as fear.
- the copolymer which is liquid at room temperature with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer.
- the polymerizable monomer is 50% by weight or more.
- 50% by weight or more of a copolymerizable monomer that is liquid at room temperature is used with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer. Even in the temperature range of 50 ° C. or lower, there is an advantage that a solid crystalline unsaturated polyester resin composition can be obtained.
- the crystalline unsaturated polyester resin composition for LED reflector of the present invention is 10 to 35 with respect to the total amount of the composition from the viewpoint of fluidity and heat resistance.
- the total amount of the inorganic filler and the white pigment is 50 to 80% by weight based on the total amount of the composition.
- the ratio of the white pigment to the total amount of the inorganic filler and the white pigment is 10 to 50% by weight.
- the ratio of the white pigment to the total amount of the inorganic filler and the white pigment is more preferably 10 to 29% by weight.
- the blending ratio of the crystalline unsaturated polyester resin to the total amount of the composition is preferably in the range of 10 to 35% by weight. If it is less than 10% by weight, the fluidity may be lowered and the moldability may be deteriorated. If it is 35% by weight or more, the heat resistance may be lowered.
- the crystalline unsaturated polyester in the present invention is not compatible with acetone, styrene monomer or the like at room temperature, and is composed of a mixture of the crystalline unsaturated polyester and a copolymerizable monomer and / or copolymerizable multimer. It is a crystalline unsaturated polyester resin that is solid at room temperature. Even if acetone, a styrene monomer, or the like is added to the crystalline unsaturated polyester at room temperature, the crystalline unsaturated polyester does not dissolve.
- amorphous unsaturated polyester is compatible with acetone, styrene monomer, etc., and has the property of becoming liquid when acetone, styrene monomer, etc. are added to amorphous unsaturated polyester.
- a mixture of an unsaturated polyester and a copolymerizable monomer is a liquid resin.
- Unsaturated polyesters have unsaturated polybasic acids, saturated polybasic acids and glycols obtained by a known dehydration condensation reaction, and usually have an acid value of 5 to 40 mg-KOH / g.
- unsaturated polyester the unsaturated polybasic acid, the selection and combination of the acid components of the saturated polybasic acid, the selection and combination of glycols, and the unsaturated, which has crystallinity by appropriately selecting the blending ratio, etc. It can be polyester.
- unsaturated polybasic acids include maleic acid, maleic anhydride, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, tetrahydrophthalic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and glutaconic acid.
- Saturated polybasic acids are phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, Examples thereof include acid and tetrabromophthalic anhydride.
- Glycols include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, propylene glycol, diethylene glycol, triethylene glycol, dipropylene glycol, neopentyl
- examples include glycol, 1,3-butanediol, hydrogenated bisphenol A, bisphenol A propylene oxide compound, cyclohexanedimethanol, dibromoneopentyl glycol, and the like.
- fumaric acid is used as the unsaturated polybasic acid
- isophthalic acid or terephthalic acid is used as the saturated polybasic acid
- ethylene glycol or 1,3-propanediol as the main component as glycol.
- a crystalline unsaturated polyester using 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol or cyclohexanedimethanol is preferred.
- Examples of the copolymerizable monomer mixed with the crystalline unsaturated polyester of the present invention include vinyl aromatic compounds such as a styrene monomer having a vinyl group, ⁇ -methylstyrene, vinyltoluene, ⁇ -chlorostyrene; vinyl acetate , Vinyl esters such as vinyl propionate, vinyl lactate, vinyl butyrate, Veova monomer (manufactured by Shell Chemical Co., Ltd.); methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate And (meth) acrylic acid esters.
- vinyl aromatic compounds such as a styrene monomer having a vinyl group, ⁇ -methylstyrene, vinyltoluene, ⁇ -chlorostyrene
- vinyl acetate Vinyl esters such as vinyl propionate, vinyl lactate, vinyl butyrate, Ve
- a bifunctional or higher copolymerizable monomer such as triallyl cyanurate, diethylene glycol dimethacrylate, diallyltetrabromophthalate, phenoxyethyl acrylate, 2-hydroxyethyl acrylate, 1,6-hexanediol diacrylate.
- a solid bifunctional or higher copolymerizable monomer such as polyethylene glycol di (meth) acrylate, ethoxylated isocyanuric acid triacrylate, pentaerythritol tetraacrylate and the like can be used. These copolymerizable monomers may be used alone or in combination of two or more.
- the copolymerizable monomer a liquid copolymerizable monomer and a solid copolymerizable monomer at room temperature can be used.
- the amount of the copolymerizable monomer that is liquid at room temperature is preferably 50% by weight or more with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer.
- 50% by weight or more of a copolymerizable monomer that is liquid at room temperature with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer the amount of filler contained in the resin composition can be increased. Filling is possible and heat resistance is improved.
- the ratio of the copolymerizable monomer that is liquid at normal temperature to the total amount of the copolymerizable monomer and / or copolymerizable multimer is preferably 70% by weight or more, more preferably 90% by weight or more.
- the copolymerizable monomer that is liquid at room temperature styrene monomer, methyl methacrylate, and diethylene glycol dimethacrylate can be particularly preferably used.
- Amorphous unsaturated polyester resin composition composed of amorphous unsaturated polyester and a copolymerizable monomer that is liquid at room temperature reduces touch dryness, resulting in reduced workability and storage shape stability. There is a fear.
- a copolymerizable multimer can be used as long as the fluidity during molding is not impaired.
- diallyl phthalate prepolymer or the like can be used as the copolymerizable multimer.
- an inorganic filler can be blended.
- the inorganic filler include calcium carbonate, magnesium carbonate, barium carbonate, calcium hydroxide, aluminum hydroxide, magnesium oxide, mica, silica, and aluminum oxide.
- calcium carbonate and aluminum hydroxide are reflective. From the viewpoint of These may be used alone or in combination of two or more.
- the inorganic filler has an average particle size in the range of 0.1 to 50 ⁇ m, preferably in the range of 0.1 to 20 ⁇ m.
- the average particle diameter can be determined by measuring the median diameter or geometric mean value with a laser diffraction / scattering particle size distribution analyzer. However, the average particle size may vary depending on the calculation method employed. By using the inorganic filler having the average particle diameter, it is possible to obtain a crystalline unsaturated polyester resin composition for an LED reflector excellent in good molding fluidity, heat discoloration, and reflectance.
- the white pigment is selected from the group consisting of titanium oxide, barium titanate, barium sulfate, zinc oxide, and zinc sulfide. It is characterized by being 1 type or more or 2 types or more.
- titanium oxide can be particularly preferably used from the viewpoint of reflectance. Examples of the titanium oxide include anatase type titanium oxide, rutile type titanium oxide, and brucite type titanium oxide. Among these, rutile type titanium oxide excellent in thermal stability can be preferably used. As long as the object of the present invention is not impaired, titanium oxide surface-treated with any treating agent can be used.
- the white pigment has an average particle size of 2.0 ⁇ m or less.
- the average particle size of the white pigment is preferably 2.0 ⁇ m or less, more preferably 0.01 to 1.0 ⁇ m, and still more preferably 0.1 to 0.5 ⁇ m from the viewpoint of reflectance.
- the average particle size is determined by measuring primary particles using an electron microscope. If the average particle size of the white pigment is large, good moldability cannot be obtained and high reflectance may not be obtained.
- the total amount of the white pigment and the inorganic filler is 50 to 80% by weight, preferably based on the total amount of the crystalline unsaturated polyester resin composition. Is 60 to 75% by weight. By setting it as this compounding range, it can be set as the crystalline unsaturated polyester resin composition for LED reflectors which has the outstanding moldability. An LED reflector having excellent heat discoloration and high reflectance can be obtained by molding the reflector using the crystalline unsaturated polyester resin composition.
- the ratio of the white pigment to the total amount of the white pigment and the inorganic filler is 10 to 50% by weight, preferably 10 to 29%, from the viewpoint of reflectance and equipment wear. % By weight.
- the ratio of the white pigment is too small, the initial reflectance and the reflectance after the heat resistance test are low, and when it is too large, the metal powder due to wear of the manufacturing equipment during resin composition production or LED reflector production is resin composition. There is a risk that the initial reflectance will be reduced by mixing in the object.
- a reinforcing material can be blended. By using a reinforcing material, it can be set as the unsaturated polyester resin composition for LED reflecting plates which has the outstanding intensity
- the reinforcing material used in the present invention is usually used as a reinforcing material for unsaturated polyester resin compositions used in FRP (Fiber Reinforced Plastics) such as BMC and SMC (Sheet Molding Compound).
- FRP Fiber Reinforced Plastics
- BMC Glass Reinforced Plastics
- SMC Sheet Molding Compound
- glass fiber is used, it is not limited to glass fiber, and other glass fiber can be used.
- examples of reinforcing materials other than glass fibers include inorganic fibers such as carbon fibers and whiskers, and organic fibers such as aramid fibers and polypropylene fibers. Aramid fibers and polypropylene fibers are preferable.
- glass fibers silicate glass, E glass (alkali-free glass for electricity), C glass (alkali glass for chemistry), A glass (acid-resistant glass), S glass (high strength glass) Glass fibers such as these can be used, and those made of long fibers (roving) and short fibers (chopped strands) can be used. Furthermore, these glass fibers can also be used after surface treatment.
- short fibers chopped strands
- other resin composition components that is, an unsaturated polyester resin, a white pigment, an inorganic filler, etc.
- L / D ratio of fiber length to fiber diameter
- the preferred fiber length of the reinforcing material used in the present invention is in the range of 1.5 to 13 mm, and the fiber diameter is in the range of 6 to 15 ⁇ m.
- the unsaturated polyester resin composition for LED reflector of the present invention is further selected from the group consisting of glass fiber, aramid fiber, and polypropylene fiber.
- One or more reinforcing materials are contained in an amount of 3 to 20% by weight based on the composition.
- This crystalline unsaturated polyester resin composition for LED reflectors of the present invention in which a crystalline unsaturated polyester resin, an inorganic filler, a white pigment, and a reinforcing material are blended preferably in the above blending amount is at a temperature of 50 ° C. or less. It has storage shape stability and excellent workability.
- a heat-decomposable organic peroxide or a polymerization inhibitor usually used in unsaturated polyester resin compositions can be used as a polymerization initiator.
- organic peroxide examples include t-butylperoxy-2-ethylhexyl monocarbonate, 1,1-di (t-hexylperoxy) cyclohexane, 1,1-di (t-butylperoxy) -3,3, Examples thereof include 5-trimethylcyclohexane, t-butylperoxyoctate, benzoyl peroxide, methyl ethyl ketone peroxide, acetylacetone peroxide, t-butylperoxybenzoate, and dicumyl peroxide. These may be used alone or in combination of two or more.
- an organic peroxide having a 10-hour half-life temperature of 100 ° C. or higher it is preferable to use an organic peroxide having a 10-hour half-life temperature of 100 ° C. or higher. Specifically, dicumyl peroxide can be preferably used.
- Polymerization inhibitors include hydroquinone, monomethyl ether hydroquinone, toluhydroquinone, di-t-4-methylphenol, monomethyl ether hydroquinone, phenothiazine, t-butylcatechol, quinones such as parabenzoquinone and pyrogallol, 2,6-di-t- And phenolic compounds such as butyl-p-cresol, 2,2-methylene-bis- (4-methyl-6-tert-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane be able to. These may be used alone or in combination of two or more.
- the unsaturated polyester resin composition for an LED reflector of the present invention is appropriately blended with other inorganic fillers as long as the fluidity of the resin composition and the reflectance when the LED reflector is used are not impaired. be able to.
- Examples of these include oxides and hydrates thereof, inorganic foam particles, and hollow particles such as silica balloons.
- a mold release agent is used for the crystalline unsaturated polyester resin composition for LED reflector of the present invention.
- the release agent waxes such as fatty acids, fatty acid metal salts, and minerals that are generally used for thermosetting resins can be used. Particularly, fatty acids and fatty acid metal salts that are excellent in heat discoloration are used. A thing can be used suitably.
- these releasing agents include stearic acid, zinc stearate, aluminum stearate, and calcium stearate. These mold release agents may be used independently and may use 2 or more types together.
- release agents can be blended in an amount of 3 to 15 parts by weight with respect to 100 parts by weight of the unsaturated polyester resin.
- the blending amount of the release agent is within this range, good release properties can be ensured.
- the amount is too small, the releasability between the mold and the molded product is low, and the productivity is remarkably lowered.
- the amount is too large, the sealing material may not be adhered.
- a curing catalyst and a polymerization inhibitor for adjusting the curing conditions of the unsaturated polyester resin composition, a colorant, a thickener, a light stabilizer, a processing stabilizer, and an ultraviolet absorber.
- Agent, nucleating agent, fluorescent brightening agent, flame retardant, photopolymerization initiator, antibacterial agent, antistatic agent, foaming agent, surfactant, surface modifier, coupling agent, other organic additives, inorganic An additive etc. can be suitably mix
- the unsaturated polyester resin composition for LED reflector of the present invention is prepared with a kneader, an extruder, etc. that can be heated and pressurized after blending each component and mixing sufficiently uniformly using a mixer, blender, etc. And can be granulated and manufactured.
- a glass woven fabric is used as a reinforcing material, kneading and granulation cannot be sufficiently performed with a kneader or an extruder.
- a glass nonwoven fabric When a glass nonwoven fabric is used, the sheet-shaped nonwoven fabric collapses during kneading and does not retain the shape of the nonwoven fabric. The advantage of using woven or non-woven fabrics cannot be found.
- the granular material of the present invention is characterized by comprising the crystalline unsaturated polyester resin composition for LED reflector of the present invention.
- the granular material comprising the unsaturated polyester resin composition for LED reflector of the present invention may be a powder obtained by pulverizing the composition or may be in the form of a pellet.
- the LED reflector of the present invention is formed by molding a granular material made of the crystalline unsaturated polyester resin composition for LED reflector of the present invention.
- the LED reflector can be formed by various methods for forming a thermosetting resin composition by a conventional method.
- the crystalline unsaturated polyester resin composition for LED reflector of the present invention is dry and has good thermal stability at the time of melting. Therefore, as a molding method, an injection molding method, an injection compression molding method, a transfer molding method is used. A melt heating molding method such as the above can be suitably used.
- the resin composition In a laminated board using glass woven fabric or glass nonwoven fabric as a reinforcing material, the resin composition must be liquid because it is necessary to impregnate the woven fabric or nonwoven fabric in advance, and the unsaturated polyester of the present invention The characteristics are different from those of the resin composition.
- the molding method is also limited to the pressure molding method using a press.
- an injection molding method using an injection molding machine is particularly suitable, and an LED reflector having a complicated shape can be manufactured by the injection molding method with a shorter molding time.
- an unsaturated polyester resin composition for LED reflectors using a thermoplastic resin, a granular material composed of the composition, and an LED reflector obtained by molding the granular material will be described.
- the unsaturated polyester resin composition for LED reflector of the present invention is an unsaturated polyester resin composition containing at least an unsaturated polyester resin and an inorganic filler, and the unsaturated polyester resin is an unsaturated polyester, It consists of a copolymerizable monomer and / or copolymerizable multimer and a thermoplastic resin, and the unsaturated polyester resin composition contains a white pigment.
- the unsaturated polyester resin any unsaturated polyester can be used regardless of whether it is amorphous or crystalline.
- the thermoplastic resin generally refers to a resin that softens without causing a reaction by heating and exhibits plasticity and can be molded, but solidifies when cooled. A resin whose plasticity is reversibly maintained when cooling and heating are repeated. In the present invention, such a thermoplastic resin can be used.
- thermoplastic resin acrylonitrile butadiene styrene, polypropylene, polyethylene, polystyrene, polymethyl methacrylate, polyethylene terephthalate, polyethylene naphthalate, polyphenylene ether, polyamide, polycarbonate, polyacetal, polybutylene terephthalate, polyphenylene sulfide, polyether
- examples include ether ketone, polyether imide, polyether sulfone, liquid crystal polymer, fluororesin, polyvinyl acetate, styrene butadiene rubber, and copolymers thereof.
- the thermoplastic resin is polymethyl methacrylate, polystyrene, acrylonitrile butadiene styrene, polyethylene, polypropylene, polyvinyl acetate, styrene butadiene rubber, and their One kind selected from the group consisting of copolymers may be used alone, or two or more kinds may be used in combination.
- the unsaturated polyester resin in the present invention can be obtained by mixing an unsaturated polyester, a copolymerizable monomer and / or a copolymerizable multimer, a thermoplastic resin, and the like.
- the copolymerizable monomer and / or copolymerizable multimer and the thermoplastic resin are usually mixed with the resin together with other materials during the preparation of the resin composition, but are mixed with the resin prior to the resin composition preparation. May be.
- the thermoplastic resin can be either a method of using the powder or granule as it is, or a method of using the thermoplastic resin as a solution previously dissolved in the copolymerizable monomer and / or copolymerizable multimer.
- the content of the thermoplastic resin is not particularly limited, but in a preferred embodiment, from the viewpoint of low shrinkage and image clarity, in the unsaturated polyester resin, the total amount of the unsaturated polyester and the copolymerizable monomer and / or copolymerizable multimer is 99 to 50 parts by weight, and the thermoplastic resin is 1 to 50 parts by weight. is there. From the viewpoint of reflectance after a heat test, more preferably, in the unsaturated polyester resin, the total amount of the unsaturated polyester and the copolymerizable monomer and / or copolymerizable multimer is 97 to 60 wt. Part, and 3 to 40 parts by weight of the thermoplastic resin.
- the unsaturated polyester resin composition for LED reflector of the present invention from the viewpoint of moldability and reflectivity after a heat test, is 10 to 35 wt% with respect to the total amount of the composition.
- the total amount of the inorganic filler and the white pigment is 50 to 80% by weight based on the total amount of the composition.
- the inorganic filler From the viewpoint of the initial reflectance and the reflectance after the heat test, the inorganic filler The ratio of the white pigment to the total amount of the material and the white pigment is 10 to 50% by weight.
- the unsaturated polyester resin contains at least a crystalline unsaturated polyester.
- the total amount of the unsaturated polyester and the copolymerizable monomer and / or copolymerizable multimer including the crystalline unsaturated polyester is 99 to 50 parts by weight and the thermoplastic resin is 1 to 50 parts by weight.
- the total amount of unsaturated polyester including a crystalline unsaturated polyester, copolymerizable monomer and / or copolymerizable multimer is 97 to 60 parts by weight, and the thermoplastic resin is 3 to 40 parts by weight.
- the total amount of the unsaturated polyester including the crystalline unsaturated polyester and the copolymerizable monomer and / or copolymerizable multimer is 97 to 70 parts by weight, and the thermoplastic resin is 3 to 30 parts. The range is parts by weight. When the ratio of the thermoplastic resin is too small, the shrinkage ratio is large and the image clarity is low, and when it is too large, the reflectance after the heat test may be lowered.
- Crystalline and amorphous unsaturated polyester resins not containing a thermoplastic resin are as described in paragraphs [0094] to [0101].
- the crystalline unsaturated polyester resin has a temperature range of 50 ° C. or less from the viewpoint of storage shape stability, handleability and workability.
- the crystalline unsaturated polyester resin In solid form. That is, it is solid at a temperature of normal temperature or higher and 50 ° C. or lower, and can be pulverized or extruded pellets.
- the copolymerizable liquid at room temperature with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer is 50% by weight or more.
- a crystalline unsaturated polyester as the unsaturated polyester resin, 50% by weight of the copolymerizable monomer that is liquid at room temperature with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer. Even if it uses above, it has the advantage that a solid unsaturated polyester resin composition can be obtained in the temperature range of 50 degrees C or less.
- the crystalline unsaturated polyester resin is 10 to 35% by weight based on the total amount of the composition from the viewpoint of fluidity and heat resistance.
- the total amount of the inorganic filler and the white pigment is 50 to 80% by weight based on the total amount of the composition.
- the ratio of the white pigment to the total amount of the inorganic filler and the white pigment is 10 to 50% by weight.
- the ratio of the white pigment to the total amount of the inorganic filler and the white pigment is more preferably 10 to 29% by weight.
- the blending ratio of the crystalline unsaturated polyester resin to the total amount of the composition is preferably in the range of 10 to 35% by weight. If it is less than 10% by weight, the fluidity may be lowered and the moldability may be deteriorated. If it exceeds 35% by weight, the heat resistance may be lowered.
- the crystalline unsaturated polyester usable in the present invention is not compatible with acetone, styrene monomer, etc. at room temperature, and the crystalline unsaturated polyester and copolymerizable monomer and / or copolymerizable multimer and thermoplastic resin.
- a crystalline unsaturated polyester resin composed of a mixture containing the above also exhibits a solid state at room temperature. Even if acetone, a styrene monomer, or the like is added to the crystalline unsaturated polyester at room temperature, the crystalline unsaturated polyester does not dissolve.
- amorphous unsaturated polyester is compatible with acetone, styrene monomer, etc., and has the property of becoming liquid when acetone, styrene monomer, etc. are added to amorphous unsaturated polyester.
- a mixture of an unsaturated polyester and a copolymerizable monomer is a liquid resin.
- Unsaturated polyesters have unsaturated polybasic acids, saturated polybasic acids and glycols obtained by a known dehydration condensation reaction, and usually have an acid value of 5 to 40 mg-KOH / g.
- unsaturated polyester the unsaturated polybasic acid, the selection and combination of the acid components of the saturated polybasic acid, the selection and combination of glycols, and the unsaturated, which has crystallinity by appropriately selecting the blending ratio, etc. It can be polyester.
- unsaturated polybasic acids include maleic acid, maleic anhydride, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, tetrahydrophthalic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and glutaconic acid.
- Saturated polybasic acids are phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, Examples thereof include acid and tetrabromophthalic anhydride.
- Glycols include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, propylene glycol, diethylene glycol, triethylene glycol, dipropylene glycol, neopentyl
- examples include glycol, 1,3-butanediol, hydrogenated bisphenol A, bisphenol A propylene oxide compound, cyclohexanedimethanol, dibromoneopentyl glycol, and the like.
- fumaric acid is used as the unsaturated polybasic acid
- isophthalic acid or terephthalic acid is used as the saturated polybasic acid
- ethylene glycol or 1,3-propanediol as the main component as glycol.
- a crystalline unsaturated polyester using 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol or cyclohexanedimethanol is preferred.
- Examples of the copolymerizable monomer mixed with the unsaturated polyester in the present invention include vinyl aromatic compounds such as styrene monomer having a vinyl group, ⁇ -methylstyrene, vinyltoluene, ⁇ -chlorostyrene; vinyl acetate, Vinyl esters such as vinyl propionate, vinyl lactate, vinyl butyrate, Veova monomer (manufactured by Shell Chemical Co., Ltd.); methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, etc. (Meth) acrylic acid ester and the like.
- vinyl aromatic compounds such as styrene monomer having a vinyl group, ⁇ -methylstyrene, vinyltoluene, ⁇ -chlorostyrene
- vinyl acetate Vinyl esters such as vinyl propionate, vinyl lactate, vinyl butyrate, Veova mono
- a bifunctional or higher copolymerizable monomer such as triallyl cyanurate, diethylene glycol dimethacrylate, diallyltetrabromophthalate, phenoxyethyl acrylate, 2-hydroxyethyl acrylate, 1,6-hexanediol diacrylate.
- a solid bifunctional or higher copolymerizable monomer such as polyethylene glycol di (meth) acrylate, ethoxylated isocyanuric acid triacrylate, pentaerythritol tetraacrylate and the like can be used. These copolymerizable monomers may be used alone or in combination of two or more.
- a copolymerizable monomer that is liquid at room temperature and a solid copolymerizable monomer can be used as the copolymerizable monomer.
- a liquid copolymer at room temperature with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer It is preferable that the amount of the monomer is 50% by weight or more.
- the amount of filler contained in the resin composition can be increased. Filling is possible and heat resistance is improved.
- the ratio of the copolymerizable monomer that is liquid at normal temperature to the total amount of the copolymerizable monomer and / or copolymerizable multimer is preferably 70% by weight or more, more preferably 90% by weight or more.
- the copolymerizable monomer that is liquid at room temperature styrene monomer, methyl methacrylate, and diethylene glycol dimethacrylate can be particularly preferably used.
- Amorphous unsaturated polyester resin composition composed of amorphous unsaturated polyester and a copolymerizable monomer that is liquid at room temperature reduces touch dryness, resulting in reduced workability and storage shape stability. There is a fear.
- a copolymerizable multimer can be used as long as the fluidity during molding is not impaired.
- diallyl phthalate prepolymer or the like can be used as the copolymerizable multimer.
- an inorganic filler in the unsaturated polyester resin composition for LED reflector of the present invention, an inorganic filler can be blended.
- the inorganic filler include calcium carbonate, magnesium carbonate, barium carbonate, calcium hydroxide, aluminum hydroxide, magnesium oxide, mica, silica, and aluminum oxide. Of these, calcium carbonate and aluminum hydroxide are reflective. From the viewpoint of These may be used alone or in combination of two or more.
- the inorganic filler has an average particle size in the range of 0.1 to 50 ⁇ m, preferably in the range of 0.1 to 20 ⁇ m.
- the average particle diameter can be determined by measuring the median diameter or geometric mean value with a laser diffraction / scattering particle size distribution analyzer. However, the average particle size may vary depending on the calculation method employed.
- the white pigment is selected from the group consisting of titanium oxide, barium titanate, barium sulfate, zinc oxide, and zinc sulfide. It is the above or two or more types.
- titanium oxide can be particularly preferably used from the viewpoint of reflectance. Examples of the titanium oxide include anatase type titanium oxide, rutile type titanium oxide, and brucite type titanium oxide. Among these, rutile type titanium oxide excellent in thermal stability can be preferably used. As long as the object of the present invention is not impaired, titanium oxide surface-treated with any treating agent can be used.
- the white pigment has an average particle size of 2.0 ⁇ m or less.
- the average particle size of the white pigment is preferably 2.0 ⁇ m or less, more preferably 0.01 to 1.0 ⁇ m, and still more preferably 0.1 to 0.5 ⁇ m from the viewpoint of reflectance.
- the average particle size is determined by measuring primary particles using an electron microscope. If the average particle size of the white pigment is large, good moldability cannot be obtained and high reflectance may not be obtained.
- a reinforcing material can be blended. By using a reinforcing material, it can be set as the unsaturated polyester resin composition for LED reflecting plates which has the outstanding intensity
- glass fiber used as a reinforcing material for unsaturated polyester resin compositions used for FRP fiber, reinforced plastics
- FRP fiber, reinforced plastics
- BMC sheet molding compound
- reinforcing materials other than glass fibers include inorganic fibers such as carbon fibers and whiskers, and organic fibers such as aramid fibers and polypropylene fibers. Aramid fibers and polypropylene fibers are preferable.
- glass fibers silicate glass, E glass (alkali-free glass for electricity), C glass (alkali glass for chemistry), A glass (acid-resistant glass), S glass (high strength glass) Glass fibers such as these can be used, and those made of long fibers (roving) and short fibers (chopped strands) can be used. Furthermore, these glass fibers can also be used after surface treatment.
- short fibers chopped strands
- other resin composition components that is, an unsaturated polyester resin, a white pigment, an inorganic filler, etc.
- L / D ratio of fiber length to fiber diameter
- the preferred fiber length of the reinforcing material used in the present invention is in the range of 1.5 to 13 mm, and the fiber diameter is in the range of 6 to 15 ⁇ m.
- the unsaturated polyester resin composition for LED reflector of the present invention is further selected from the group consisting of glass fiber, aramid fiber, and polypropylene fiber.
- One or more reinforcing materials are contained in an amount of 3 to 20% by weight based on the composition.
- a heat-decomposable organic peroxide or a polymerization inhibitor usually used in unsaturated polyester resin compositions can be used as a polymerization initiator.
- organic peroxide examples include t-butylperoxy-2-ethylhexyl monocarbonate, 1,1-di (t-hexylperoxy) cyclohexane, 1,1-di (t-butylperoxy) -3,3, Examples thereof include 5-trimethylcyclohexane, t-butylperoxyoctate, benzoyl peroxide, methyl ethyl ketone peroxide, acetylacetone peroxide, t-butylperoxybenzoate, and dicumyl peroxide. These may be used alone or in combination of two or more.
- an organic peroxide having a 10-hour half-life temperature of 100 ° C. or higher it is preferable to use an organic peroxide having a 10-hour half-life temperature of 100 ° C. or higher. Specifically, dicumyl peroxide can be preferably used.
- Polymerization inhibitors include hydroquinone, monomethyl ether hydroquinone, toluhydroquinone, di-t-4-methylphenol, monomethyl ether hydroquinone, phenothiazine, t-butylcatechol, quinones such as parabenzoquinone and pyrogallol, 2,6-di-t- And phenolic compounds such as butyl-p-cresol, 2,2-methylene-bis- (4-methyl-6-tert-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane be able to. These may be used alone or in combination of two or more.
- the unsaturated polyester resin composition for an LED reflector of the present invention is appropriately blended with other inorganic fillers as long as the fluidity of the resin composition and the reflectance when the LED reflector is used are not impaired. be able to.
- Examples of these include oxides and hydrates thereof, inorganic foam particles, and hollow particles such as silica balloons.
- a release agent is used in the unsaturated polyester resin composition for LED reflector of the present invention.
- the release agent waxes such as fatty acids, fatty acid metal salts, and minerals that are generally used for thermosetting resins can be used. Particularly, fatty acids and fatty acid metal salts that are excellent in heat discoloration are used. A thing can be used suitably.
- these releasing agents include stearic acid, zinc stearate, aluminum stearate, and calcium stearate. These mold release agents may be used independently and may use 2 or more types together.
- release agents can be blended in an amount of 3 to 15 parts by weight with respect to 100 parts by weight of the unsaturated polyester resin.
- the blending amount of the release agent is within this range, good release properties can be ensured.
- the amount is too small, the releasability between the mold and the molded product is low, and the productivity is remarkably lowered.
- the amount is too large, the sealing material may not be adhered.
- a curing catalyst and a polymerization inhibitor for adjusting the curing conditions of the unsaturated polyester resin composition, a colorant, a thickener, a light stabilizer, a processing stabilizer, and an ultraviolet absorber.
- Agent, nucleating agent, fluorescent brightening agent, flame retardant, photopolymerization initiator, antibacterial agent, antistatic agent, foaming agent, surfactant, surface modifier, coupling agent, other organic additives, inorganic An additive etc. can be suitably mix
- the unsaturated polyester resin composition for LED reflector of the present invention is prepared with a kneader, an extruder, etc. that can be heated and pressurized after blending each component and mixing sufficiently uniformly using a mixer, blender, etc. And can be granulated and manufactured.
- a glass woven fabric is used as a reinforcing material, kneading and granulation cannot be sufficiently performed with a kneader or an extruder.
- a glass nonwoven fabric When a glass nonwoven fabric is used, the sheet-shaped nonwoven fabric collapses during kneading and does not retain the shape of the nonwoven fabric. The advantage of using woven or non-woven fabrics cannot be found.
- the granular material of the present invention is characterized by comprising the unsaturated polyester resin composition for LED reflector of the present invention.
- the granular material comprising the unsaturated polyester resin composition for LED reflector of the present invention may be a powder obtained by pulverizing the composition or may be in the form of a pellet.
- the LED reflector of the present invention is formed by molding a granular material made of the unsaturated polyester resin composition for LED reflector of the present invention.
- the LED reflector can be formed by various methods for forming a thermosetting resin composition by a conventional method.
- the unsaturated polyester resin composition for LED reflector of the present invention is dry and has good thermal stability at the time of melting, and therefore, as a molding method, an injection molding method, an injection compression molding method, a transfer molding method, etc.
- a melt thermoforming method can be suitably used.
- the resin composition In a laminated board using glass woven fabric or glass nonwoven fabric as a reinforcing material, the resin composition must be liquid because it is necessary to impregnate the woven fabric or nonwoven fabric in advance, and the unsaturated polyester of the present invention The characteristics are different from those of the resin composition.
- the molding method is also limited to the pressure molding method using a press.
- an injection molding method using an injection molding machine is particularly suitable, and the LED reflector for mounting a light emitting element having a complicated shape, unlike a flat laminated plate, in a short molding cycle time by the injection molding method. Can be manufactured.
- the radical polymerizable resin composition for LED reflector of the present invention the granular material comprising the composition, the molding method using the granular material, and the LED reflector will be described.
- the radical polymerizable resin composition of the present invention includes at least a radical polymerizable resin, an inorganic filler, and a white pigment, and has a viscosity in the range of 0.1 to 100 kPa ⁇ s.
- the radically polymerizable resin composition of the present invention can be used mainly for injection molding. In normal injection molding, the resin composition is filled in a hopper capable of storing a certain amount of the resin composition, and the resin composition is supplied from the hopper into the screw by its own weight. Therefore, the resin composition needs to exhibit a solid state at normal temperature. In general, the high degree of freedom in the shape of the molded product and high productivity are the characteristics of the injection molding method.
- thermosetting resins including radical polymerizable resins
- the melt viscosity of the resin composition is low.
- Another advantage is that it can be molded with low injection pressure.
- increasing the curing rate that is, shortening the cycle time, is regarded as a problem of the thermosetting resin in the injection molding method. Since the radically polymerizable resin composition of the present invention has a viscosity suitable for injection molding and further has an appropriate curing rate, it can be suitably used as a resin composition for injection molding.
- radical polymerizable resin a modification in which (meth) acrylic acid such as unsaturated polyester, epoxy (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, or polyether (meth) acrylate is added ( Mention may be made of (meth) acrylates.
- Unsaturated polyesters can have an unsaturated polybasic acid, a saturated polybasic acid and glycols by a known dehydration condensation reaction, and usually have an acid value of 5 to 40 mg-KOH / g.
- unsaturated polybasic acids include maleic acid, maleic anhydride, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, tetrahydrophthalic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, glutaconic acid and the like.
- Saturated polybasic acids include phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, Het acid, tetrabromophthalic anhydride, etc. can be mentioned.
- glycols include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, propylene glycol, diethylene glycol, triethylene glycol, dipropylene glycol, neo
- examples thereof include pentyl glycol, 1,3-butanediol, hydrogenated bisphenol A, bisphenol A propylene oxide compound, cyclohexanedimethanol, dibromoneopentyl glycol and the like.
- the unsaturated polyester resin in the present invention can be obtained by mixing an unsaturated polyester with a copolymerizable monomer and / or copolymerizable multimer.
- the copolymerizable monomer and / or copolymerizable multimer is usually mixed with the resin together with other materials during preparation of the resin composition, but may be mixed with the resin prior to preparation of the resin composition.
- examples of the copolymerizable monomer mixed with the unsaturated polyester resin include vinyl aromatic compounds such as a styrene monomer having a vinyl group, ⁇ -methylstyrene, vinyltoluene, and ⁇ -chlorostyrene; vinyl acetate.
- vinyl esters such as vinyl propionate, vinyl lactate, vinyl butyrate, Veova monomer (manufactured by Shell Chemical Co., Ltd.); methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate And (meth) acrylic acid esters.
- a bifunctional or higher copolymerizable monomer such as triallyl cyanurate, diethylene glycol dimethacrylate, diallyltetrabromophthalate, phenoxyethyl acrylate, 2-hydroxyethyl acrylate, 1,6-hexanediol diacrylate.
- a solid bifunctional or higher copolymerizable monomer such as polyethylene glycol di (meth) acrylate, ethoxylated isocyanuric acid triacrylate, pentaerythritol tetraacrylate and the like can be used. These copolymerizable monomers may be used alone or in combination of two or more.
- the epoxy (meth) acrylate in the present invention is an epoxy (meth) acrylate having an epoxy group at the molecular end obtained by addition reaction of acrylic acid or methacrylic acid to an epoxy resin having two or more glycidyl ether groups in one molecule. It is.
- An epoxy acrylate resin in which an epoxy acrylate is dissolved in a copolymerizable monomer and / or copolymerizable multimer may be used.
- the epoxy resin having two or more glycidyl ether groups in one molecule includes, for example, bisphenol A, bisphenol F, bisphenol S, etc., or bisphenol type epoxy resins derived from these derivatives, bixylenol and bixylenol derived from these derivatives.
- Type epoxy resins biphenol type epoxy resins from biphenol and its derivatives, or naphthalene type epoxy resins from naphthalene and its derivatives, and epoxy resins such as novolac type epoxy resins, which are used alone or in combination of two or more Can be used in combination.
- the copolymerizable monomer and / or copolymerizable multimer the same copolymerizable monomer and / or copolymerizable multimer as those used in the unsaturated polyester resin described above can be used.
- the urethane (meth) acrylate in the present invention reacts with a polyalcohol and / or a polyester polyol and / or a polyether polyol and a diisocyanate to react with an isocyanate at a molecular terminal to have an alcoholic hydroxyl group.
- a polyalcohol and / or a polyester polyol and / or a polyether polyol and a diisocyanate to react with an isocyanate at a molecular terminal to have an alcoholic hydroxyl group.
- dissolved urethane methacrylate in copolymerizable monomers and / or copolymerizable multimers, such as styrene and diethylene glycol dimethacrylate, may be sufficient, for example. These can be used alone or in a mixture of two or more.
- the polyester (meth) acrylate in the present invention is obtained by esterifying a polyester polyol with acrylic acid or methacrylic acid, or by reacting an acid-terminated polyester with an acrylate or methacrylate having a glycidyl group.
- Polyester acrylate or polyester methacrylate resin in which polyester acrylate or polyester methacrylate is dissolved in a copolymerizable monomer and / or copolymerizable multimer such as styrene or diethylene glycol dimethacrylate may be used. These can be used alone or in a mixture of two or more.
- the polyether (meth) acrylate in the present invention is an acrylate or acrylate at the molecular end obtained by esterification of a polyether polyol and acrylic acid or methacrylic acid, or a reaction between an acid-terminated polyether and an acrylate or methacrylate having a glycidyl group.
- Polyester acrylate or polyester methacrylate resin in which polyester acrylate or polyester methacrylate is dissolved in a copolymerizable monomer and / or copolymerizable multimer such as styrene or diethylene glycol dimethacrylate may be used. These can be used alone or in a mixture of two or more.
- the radical polymerizable resin composition for LED reflector of the present invention can be 10 to 35% by weight based on the total amount of the composition.
- the total amount of the inorganic filler and the white pigment can be 50 to 80% by weight based on the total amount of the composition.
- the inorganic filler The ratio of the white pigment in the total amount of the material and the white pigment can be 10 to 50% by weight.
- Examples of the inorganic filler used in the radical polymerizable resin composition for LED reflector of the present invention include calcium carbonate, magnesium carbonate, barium carbonate, calcium hydroxide, aluminum hydroxide, magnesium oxide, mica, silica, aluminum oxide and the like. Of these, calcium carbonate and aluminum hydroxide are preferred from the viewpoint of reflectivity. These may be used alone or in combination of two or more.
- the inorganic filler can be used with an average particle size in the range of 0.1 to 50 ⁇ m, preferably in the range of 0.1 to 20 ⁇ m.
- the average particle diameter can be determined by measuring the median diameter or geometric mean value with a laser diffraction / scattering particle size distribution analyzer. However, the average particle size may vary depending on the calculation method employed.
- examples of the white pigment used in the radical polymerizable resin composition for LED reflector of the present invention include titanium oxide, barium titanate, barium sulfate, zinc oxide, and zinc sulfide.
- titanium oxide can be particularly preferably used from the viewpoint of reflectance.
- examples of the titanium oxide include anatase type titanium oxide, rutile type titanium oxide, and brucite type titanium oxide. Among these, rutile type titanium oxide excellent in thermal stability can be preferably used. As long as the object of the present invention is not impaired, titanium oxide surface-treated with any treating agent can be used.
- the average particle diameter of the white pigment used in the radical polymerizable resin composition for LED reflector of the present invention is preferably 2.0 ⁇ m or less, more preferably 0.01 to 1.0 ⁇ m, from the viewpoint of reflectance. More preferably, it can be 0.1 to 0.5 ⁇ m.
- the average particle size is determined by measuring primary particles using an electron microscope. If the average particle size of the white pigment is large, good moldability cannot be obtained and high reflectance may not be obtained.
- the radical polymerizable resin composition for LED reflector of the present invention is characterized in that the viscosity is in the range of 0.1 to 100 kPa ⁇ s. If the viscosity is less than 0.1 kPa ⁇ s, the fluidity in the mold is too good, so that overfilling tends to occur, and molding defects such as burrs may occur. When the viscosity exceeds 100 kPa ⁇ s, the fluidity in the mold is poor, and molding defects such as insufficient filling may occur.
- thermosetting resin containing a radical polymerizable resin a resin composition is plasticized by a screw in a heated cylinder, and a molten resin composition is injected into a mold. Molded.
- the radical polymerization (gelation) reaction starts after the resin composition is filled to the end of the mold, and the molded product has sufficient strength by curing. Since it is necessary to take it out from the mold after reaching, it is important to adjust the melt viscosity of the resin composition and the speed of the polymerization reaction.
- a resin composition having a low melt viscosity has good fluidity in the mold, but is likely to be overfilled and may cause molding defects such as burrs.
- a resin composition having a high melt viscosity has poor flowability in the mold, and a molding failure such as insufficient filling may occur due to the polymerization reaction starting before the resin composition reaches the end of the molded product. .
- the radical polymerizable resin composition for LED reflector has a viscosity in the temperature range of 70 to 120 ° C. of 0.1 to 100 kPa ⁇ s. Range.
- the resin composition does not melt, so that injection molding becomes difficult. Even if injection molding can be performed, the resin composition may have a high viscosity and the resin composition may not fill up to the end of the mold.
- the temperature is higher than 120 ° C., a curing reaction may occur in the cylinder during molding, and continuous molding may be difficult.
- the radical polymerizable resin composition for LED reflectors preferably has a viscosity in the range of 0.1 to 100 kPa ⁇ s in the temperature range of 70 ° C. to 120 ° C.
- the radically polymerizable resin composition for an LED reflector of the present invention includes an unsaturated polyester resin.
- the radical polymerizable resin composition for an LED reflector includes a crystalline unsaturated polyester resin.
- the difference between the amorphous unsaturated polyester and the crystalline unsaturated polyester is as follows. That is, a crystalline unsaturated polyester resin composed of a crystalline unsaturated polyester and a copolymerizable monomer that is liquid at room temperature is solid at room temperature and has a low viscosity above the melting point of the crystalline unsaturated polyester resin. Liquid. However, an amorphous unsaturated polyester resin composed of an amorphous unsaturated polyester and a copolymerizable monomer that is liquid at room temperature is liquid at room temperature.
- BMC As an unsaturated polyester resin composition that can be injection-molded and uses a copolymerizable monomer such as a general styrene monomer, wet BMC is known at room temperature. BMC uses amorphous unsaturated polyester resin.
- A When BMC is injection-molded, additional equipment such as a plunger to be pushed into the molding machine is required.
- B Since it is bulky, it is easy to handle and amorphous. Therefore, improvement points such as inferior workability and (c) inferior storage stability due to being wet are mentioned.
- Amorphous unsaturated polyester resin composition that is injection-moldable and solid at room temperature is a copolymerizable monomer, copolymerizable multimer that is solid at room temperature to amorphous unsaturated polyester, and
- the above problems (a) to (c) are solved by using a liquid copolymerizable monomer within a usable range.
- the crystalline unsaturated polyester can be combined with a liquid or solid copolymerizable monomer and copolymerizable multimer in an arbitrary range at room temperature.
- a liquid at room temperature is used as an unsaturated polyester resin from the viewpoint that a small particle diameter white pigment and an inorganic filler that increase the viscosity of the resin composition can be used.
- a crystalline unsaturated polyester resin that can be combined with an arbitrary range of solid or solid copolymerizable monomers and copolymerizable multimers can be suitably used.
- a crystalline unsaturated polyester resin that is solid at room temperature is suitably used as the unsaturated polyester resin. Can be used.
- fumaric acid is used as the unsaturated polybasic acid
- isophthalic acid or terephthalic acid is used as the saturated polybasic acid.
- ethylene glycol, 1,3-propanediol, 1, A crystalline unsaturated polyester using 4-butanediol, 1,5-pentanediol, 1,6-hexanediol, and cyclohexanedimethanol is preferably used.
- the gelation time of the unsaturated polyester resin composition was measured by heat and pressure molding using a mold equipped with a differential transformer type position sensor. After placing the resin composition in the mold, the mold is tightened (the mold equipped with the differential transformer type position sensor is raised), and when the thickness reaches a certain level, the differential transformer stops (changes). Inflection point 1) Since the shrinkage of curing begins with the progress of curing, the position of the differential transformer rises again (inflection point 2). A displacement-time S-curve was obtained. The time from the inflection point 1 to the inflection point 2 was defined as the gel time.
- the gelation time of the radical polymerizable resin composition for LED reflector in the temperature range of 140 ° C. to 180 ° C. is 5 to 120 seconds. It is.
- the gel time in the temperature range of 140 ° C. to 180 ° C. of the radical polymerizable resin composition for LED reflector is less than 5 seconds, the resin composition is gelated before being filled into the mold cavity. As a result, there is a possibility that only a molded product having a poor surface smoothness can be obtained because the mold surface cannot be sufficiently transferred.
- the gelling time in the temperature range of 140 ° C. to 180 ° C. of the radically polymerizable resin composition for LED reflector exceeds 120 seconds, the curing time has to be lengthened. There is a possibility of not spreading as a reflector.
- the curing rate such as gelation time. If the gelation time is too short, the resin composition gelates before it is filled into the mold cavity, so that the mold surface cannot be transferred sufficiently and the molded product has poor surface smoothness. There is a possibility that it cannot be obtained. On the other hand, if the gelation time of the resin composition is too long, the curing time has to be lengthened, so that the productivity is poor and there is a possibility that it will not spread as a general-purpose reflector.
- a preferred embodiment of the present invention is an injection molding method in which the radical polymerizable resin composition for an LED reflector is heated and cured at (mold temperature) 140 ° C. to 180 ° C. If the mold temperature is less than 140 ° C., the curing speed is slow, and the curing time must be extended. Therefore, the productivity is inferior, and there is a possibility that it will not spread as a general-purpose reflector. If the mold temperature exceeds 180 ° C., the curing rate is fast, so that the end portion is likely to be insufficiently filled, and a product may not be obtained.
- a reinforcing material can be blended. By using a reinforcing material, it can be set as the radically polymerizable resin composition for LED reflecting plates which has the outstanding intensity
- glass fiber used as a reinforcing material for unsaturated polyester resin compositions used for FRP fiber, reinforced plastics
- FRP fiber, reinforced plastics
- BMC sheet molding compound
- reinforcing materials other than glass fibers include inorganic fibers such as carbon fibers and whiskers, and organic fibers such as aramid fibers and polypropylene fibers. Aramid fibers and polypropylene fibers are preferable.
- glass fibers silicate glass, E glass (alkali-free glass for electricity), C glass (alkali glass for chemistry), A glass (acid-resistant glass), S glass (high strength glass) Glass fibers such as these can be used, and those made of long fibers (roving) and short fibers (chopped strands) can be used. Furthermore, these glass fibers can also be used after surface treatment.
- the preferred fiber length of the reinforcing material used in the present invention is in the range of 1.5 to 13 mm, and the fiber diameter is in the range of 6 to 15 ⁇ m.
- a heat-decomposable organic peroxide or a polymerization inhibitor that is usually used for an unsaturated polyester resin composition can be used as a polymerization initiator.
- organic peroxide examples include t-butylperoxy-2-ethylhexyl monocarbonate, 1,1-di (t-hexylperoxy) cyclohexane, 1,1-di (t-butylperoxy) -3,3, Examples thereof include 5-trimethylcyclohexane, t-butylperoxyoctate, benzoyl peroxide, methyl ethyl ketone peroxide, acetylacetone peroxide, t-butylperoxybenzoate, and dicumyl peroxide. These may be used alone or in combination of two or more.
- an organic peroxide having a 10-hour half-life temperature of 100 ° C. or higher it is preferable to use an organic peroxide having a 10-hour half-life temperature of 100 ° C. or higher. Specifically, dicumyl peroxide can be preferably used.
- Polymerization inhibitors include hydroquinone, monomethyl ether hydroquinone, toluhydroquinone, di-t-4-methylphenol, monomethyl ether hydroquinone, phenothiazine, t-butylcatechol, quinones such as parabenzoquinone and pyrogallol, 2,6-di-t- And phenolic compounds such as butyl-p-cresol, 2,2-methylene-bis- (4-methyl-6-tert-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane be able to. These may be used alone or in combination of two or more.
- the radically polymerizable resin composition for an LED reflector of the present invention is appropriately mixed with other inorganic fillers as long as the fluidity of the resin composition and the reflectance when used as an LED reflector are not impaired. be able to.
- Examples of these include oxides and hydrates thereof, inorganic foam particles, and hollow particles such as silica balloons.
- a release agent is used in the radical polymerizable resin composition for LED reflector of the present invention.
- waxes such as fatty acids, fatty acid metal salts, and minerals that are generally used for thermosetting resins can be used.
- fatty acids and fatty acid metal salts that are excellent in heat discoloration are used. A thing can be used suitably.
- these releasing agents include stearic acid, zinc stearate, aluminum stearate, and calcium stearate. These mold release agents may be used independently and may use 2 or more types together.
- a curing catalyst and a polymerization inhibitor for adjusting the curing conditions of the radical polymerizable resin composition.
- Agent, nucleating agent, fluorescent brightening agent, flame retardant, photopolymerization initiator, antibacterial agent, antistatic agent, foaming agent, surfactant, surface modifier, coupling agent, other organic additives, inorganic An additive etc. can be suitably mix
- the radically polymerizable resin composition for LED reflector of the present invention is prepared with a kneader, an extruder, etc. that can be heated and pressurized after blending each component and mixing sufficiently uniformly using a mixer, blender, etc. And can be granulated and manufactured.
- the granular material of the present invention is characterized by comprising the radically polymerizable resin composition for an LED reflector of the present invention.
- the granular material made of the radically polymerizable resin composition for LED reflector of the present invention may be a powder obtained by pulverizing the composition or may be in the form of a pellet.
- the LED reflector of the present invention is formed by molding a granular material made of the radical polymerizable resin composition for an LED reflector of the present invention.
- the LED reflector can be formed by various methods for forming a thermosetting resin composition by a conventional method.
- the molding method includes injection molding, injection compression molding, transfer molding, etc.
- a melt thermoforming method can be suitably used.
- an injection molding method using an injection molding machine is particularly suitable.
- the surface-mounted light-emitting device of the present invention is a surface-mounted light-emitting device comprising a reflector formed by molding an unsaturated polyester resin composition containing at least an unsaturated polyester resin and an inorganic filler.
- the saturated polyester resin is an unsaturated polyester resin (A) composed of a crystalline unsaturated polyester and a copolymerizable monomer and / or copolymerizable multimer, an unsaturated polyester and a copolymerizable monomer, and / or It is 1 or more types chosen from unsaturated polyester resin (B) which consists of a copolymerizable multimer and a thermoplastic resin,
- the said unsaturated polyester resin composition contains a white pigment, It is characterized by the above-mentioned.
- the unsaturated polyester resin (A) comprises a crystalline unsaturated polyester, a copolymerizable monomer and / or a copolymerizable multimer.
- the unsaturated polyester resin (A) can be obtained by mixing a crystalline unsaturated polyester and a copolymerizable monomer and / or copolymerizable multimer.
- the copolymerizable monomer and / or copolymerizable multimer is usually mixed with the resin together with other mixtures when preparing the resin composition, but may be mixed with the resin prior to preparing the resin composition.
- the crystalline and amorphous unsaturated polyester resins used in the present invention are as described in paragraphs [0098] to [0102].
- the crystalline unsaturated polyester resin is 50 ° C. or less from the viewpoint of storage shape stability, handleability, and workability. Solid in the temperature range. That is, it is solid at a temperature of normal temperature or higher and 50 ° C. or lower, and can be pulverized or extruded pellets.
- the crystalline unsaturated polyester resin composition for LED reflector of the present invention can contain an amorphous unsaturated polyester within a range that does not impair characteristics such as storage shape stability of the present invention.
- the crystalline unsaturated polyester resin comprises 40 to 95 parts by weight of the crystalline unsaturated polyester, and a copolymerizable monomer. And / or 60 to 5 parts by weight of a copolymerizable multimer.
- the crystalline unsaturated polyester resin is preferably blended in a proportion of 50 to 95 parts by weight of the crystalline unsaturated polyester and 50 to 5 parts by weight of the copolymerizable monomer and / or copolymerizable multimer.
- the above range is set so that when the amount of the copolymerizable monomer and / or copolymerizable multimer blended in the crystalline unsaturated polyester is larger than the above range, the pulverization process and the extrusion pellet process cannot be performed. On the other hand, if the amount of the copolymerizable monomer and / or copolymerizable multimer is less than the above range, the curability is lowered and a reflector having a good appearance cannot be obtained. For reasons such as fear.
- the unsaturated polyester resin (B) comprises an unsaturated polyester, a copolymerizable monomer and / or copolymerizable multimer, and a thermoplastic resin.
- any unsaturated polyester can be used regardless of whether it is amorphous or crystalline.
- a thermoplastic resin generally refers to a resin that softens without any reaction by heating and exhibits plasticity and can be molded, but solidifies when cooled. A resin whose plasticity is reversibly maintained when cooling and heating are repeated.
- an unsaturated polyester resin composition containing such a thermoplastic resin can be used.
- thermoplastic resin used in the unsaturated polyester resin (B) acrylonitrile butadiene styrene, polypropylene, polyethylene, polystyrene, polymethyl methacrylate, polyethylene terephthalate, polyethylene naphthalate, polyphenylene ether, polyamide, polycarbonate, polyacetal, polybutylene terephthalate, Mention may be made of polyphenylene sulfide, polyether ether ketone, polyether imide, polyether sulfone, liquid crystal polymer, fluororesin, polyvinyl acetate, styrene butadiene rubber, and copolymers thereof.
- the thermoplastic resin comprises polymethyl methacrylate, polystyrene, acrylonitrile butadiene styrene, polyethylene, polypropylene, polyvinyl acetate, styrene butadiene rubber, and copolymers thereof. May be used alone, or two or more may be used in combination.
- the unsaturated polyester resin (B) can be obtained by mixing an unsaturated polyester, a copolymerizable monomer and / or a copolymerizable multimer, and a thermoplastic resin.
- the copolymerizable monomer and / or copolymerizable multimer and the thermoplastic resin are usually mixed with the resin together with other materials during the preparation of the resin composition, but are mixed with the resin prior to the resin composition preparation. May be.
- the thermoplastic resin can be either a method of using the powder or granule as it is, or a method of using the thermoplastic resin as a solution previously dissolved in the copolymerizable monomer and / or copolymerizable multimer.
- the unsaturated polyester resin (A) and the unsaturated polyester resin (B) are mixed.
- the unsaturated polyester resin (A) and the unsaturated polyester resin (B) prepared separately may be mixed and used, or the unsaturated polyester resin (B) is crystallized as shown below.
- An unsaturated polyester may be included.
- the unsaturated polyester resin (B) contains at least a crystalline unsaturated polyester.
- the content of the thermoplastic resin and the like are not particularly limited, but in a preferred embodiment, 35 to 95 parts by weight of an unsaturated polyester including a crystalline unsaturated polyester, a copolymerizable monomer and / or copolymerization are used.
- thermoplastic resin preferably 35 to 95 parts by weight of an unsaturated polyester containing a crystalline unsaturated polyester 97 to 60 parts by weight of a mixture comprising 65 to 5 parts by weight of a polymerizable monomer and / or copolymerizable multimer and 3 to 40 parts by weight of a thermoplastic resin, more preferably a crystalline unsaturated polyester Contains 97 to 70 parts by weight of a mixture of 35 to 95 parts by weight of unsaturated polyester, 65 to 5 parts by weight of copolymerizable monomer and / or copolymerizable multimer, and 3 to 3 parts of thermoplastic resin. 0 is in the range of parts by weight. When the ratio of the thermoplastic resin is too small, the shrinkage ratio is large and the image clarity is low, and when it is too large, the reflectance after the heat test may be lowered.
- (B) is 10 to 35% by weight with respect to the total amount of the composition, and the total amount of the inorganic filler and the white pigment is 50 to 80% by weight with respect to the total amount of the composition; From the viewpoint of the initial reflectance and the reflectance after the heat test, the ratio of the white pigment to the total amount of the inorganic filler and the white pigment is 10 to 50% by weight.
- the cost and catalytic effect of the white pigment, and further, the particle size is smaller than that of the inorganic filler, so that the viscosity of the resin composition is high, and therefore the total amount of the inorganic filler and the white pigment is included in the total amount.
- the ratio of the white pigment is more preferably 10 to 29% by weight.
- the blending ratio of the crystalline unsaturated polyester resin to the total amount of the composition is preferably in the range of 10 to 35% by weight. If it is less than 10% by weight, the fluidity may be lowered and the moldability may be deteriorated. If it is 35% by weight or more, the heat resistance may be lowered.
- the unsaturated polyester resin (A) and / or (B) is storage shape stability, handling property, work From the viewpoint of properties, it is solid in a temperature range of 50 ° C. or lower. That is, it is solid at a temperature of normal temperature or higher and 50 ° C. or lower, and can be pulverized or extruded pellets.
- the amount of the copolymer and / or copolymerizable multimer is 50% by weight of the copolymerizable monomer that is liquid at room temperature with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer. It is the above.
- the crystalline unsaturated polyester that can be used in the unsaturated polyester resin composition used in the surface-mounted light emitting device of the present invention is not compatible with acetone, styrene monomer, etc. at room temperature, and is copolymerizable with the crystalline unsaturated polyester.
- a crystalline unsaturated polyester resin comprising a mixture of a monomer and / or copolymerizable multimer and a thermoplastic resin also exhibits a solid state at room temperature. Even if acetone, a styrene monomer, or the like is added to the crystalline unsaturated polyester at room temperature, the crystalline unsaturated polyester does not dissolve.
- amorphous unsaturated polyester is compatible with acetone, styrene monomer, etc., and has the property of becoming liquid when acetone, styrene monomer, etc. are added to amorphous unsaturated polyester.
- a mixture of an unsaturated polyester and a copolymerizable monomer is a liquid resin.
- Unsaturated polyesters have unsaturated polybasic acids, saturated polybasic acids and glycols obtained by a known dehydration condensation reaction, and usually have an acid value of 5 to 40 mg-KOH / g.
- unsaturated polyester the unsaturated polybasic acid, the selection and combination of the acid components of the saturated polybasic acid, the selection and combination of glycols, and the unsaturated, which has crystallinity by appropriately selecting the blending ratio, etc. It can be polyester.
- unsaturated polybasic acids include maleic acid, maleic anhydride, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, tetrahydrophthalic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and glutaconic acid.
- Saturated polybasic acids are phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, Examples thereof include acid and tetrabromophthalic anhydride.
- Glycols include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, propylene glycol, diethylene glycol, triethylene glycol, dipropylene glycol, neopentyl
- examples include glycol, 1,3-butanediol, hydrogenated bisphenol A, bisphenol A propylene oxide compound, cyclohexanedimethanol, dibromoneopentyl glycol, and the like.
- the unsaturated polyester resin composition used for the surface-mounted light emitting device of the present invention among crystalline unsaturated polyesters, fumaric acid is used as the unsaturated polybasic acid, and isophthalic acid or terephthalic acid is used as the saturated polybasic acid.
- Crystalline unsaturated polyester using ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, cyclohexanedimethanol as the main component is preferred as the glycol It is.
- Examples of the copolymerizable monomer mixed with the unsaturated polyester in the unsaturated polyester resin composition used in the surface-mounted light-emitting device of the present invention include, for example, a styrene monomer having a vinyl group, ⁇ -methylstyrene, and vinyltoluene.
- Vinyl aromatic compounds such as ⁇ -chlorostyrene; vinyl esters such as vinyl acetate, vinyl propionate, vinyl lactate, vinyl butyrate, Veova monomer (manufactured by Shell Chemical Co., Ltd.); methyl acrylate, ethyl acrylate, n-butyl acrylate And (meth) acrylic acid esters such as methyl methacrylate, ethyl methacrylate, and n-butyl methacrylate.
- vinyl aromatic compounds such as ⁇ -chlorostyrene
- vinyl esters such as vinyl acetate, vinyl propionate, vinyl lactate, vinyl butyrate, Veova monomer (manufactured by Shell Chemical Co., Ltd.)
- acrylic acid esters such as methyl methacrylate, ethyl methacrylate, and n-butyl methacrylate.
- a bifunctional or higher copolymerizable monomer such as triallyl cyanurate, diethylene glycol dimethacrylate, diallyltetrabromophthalate, phenoxyethyl acrylate, 2-hydroxyethyl acrylate, 1,6-hexanediol diacrylate.
- a solid bifunctional or higher copolymerizable monomer such as polyethylene glycol di (meth) acrylate, ethoxylated isocyanuric acid triacrylate, pentaerythritol tetraacrylate and the like can be used. These copolymerizable monomers may be used alone or in combination of two or more.
- a copolymerizable monomer that is liquid at room temperature and a solid copolymerizable monomer are used as the copolymerizable monomer. I can do it.
- the unsaturated polyester resin composition containing a crystalline unsaturated polyester used in the surface-mounted light-emitting device of the present invention at normal temperature with respect to the total amount of the copolymerizable monomer and / or copolymerizable multimer.
- the liquid copolymerizable monomer is preferably 50% by weight or more.
- the amount of filler contained in the resin composition can be increased. Filling is possible and heat resistance is improved.
- the ratio of the copolymerizable monomer that is liquid at normal temperature to the total amount of the copolymerizable monomer and / or copolymerizable multimer is preferably 70% by weight or more, more preferably 90% by weight or more.
- an unsaturated polyester resin comprising 80 parts by weight of unsaturated polyester and 20 parts by weight of copolymerizable monomer and / or copolymerizable multimer
- a copolymerizable monomer of liquid at room temperature is at least 10 parts by weight, preferably at least 14 parts by weight, more preferably at least 18 parts by weight.
- the filler contained in the resin composition is highly filled. May become difficult and heat resistance may be reduced.
- copolymerizable monomer that is liquid at room temperature styrene monomer, methyl methacrylate, and diethylene glycol dimethacrylate can be particularly preferably used.
- Amorphous unsaturated polyester resin composition composed of amorphous unsaturated polyester and a copolymerizable monomer that is liquid at room temperature reduces touch dryness, resulting in reduced workability and storage shape stability. There is a fear.
- a copolymerizable multimer can be used as long as the fluidity during molding is not impaired.
- diallyl phthalate prepolymer or the like can be used as the copolymerizable multimer.
- an inorganic filler can be blended.
- the inorganic filler include calcium carbonate, magnesium carbonate, barium carbonate, calcium hydroxide, aluminum hydroxide, magnesium oxide, mica, silica, and aluminum oxide. Of these, calcium carbonate and aluminum hydroxide are reflective. From the viewpoint of These may be used alone or in combination of two or more.
- the inorganic filler has an average particle size in the range of 0.1 to 50 ⁇ m, preferably in the range of 0.1 to 20 ⁇ m.
- the average particle diameter can be determined by measuring the median diameter or geometric mean value with a laser diffraction / scattering particle size distribution analyzer. However, the average particle size may vary depending on the calculation method employed.
- the white pigment is selected from the group consisting of titanium oxide, barium titanate, barium sulfate, zinc oxide, and zinc sulfide. It is characterized by being 1 type or more or 2 types or more.
- titanium oxide can be particularly preferably used from the viewpoint of reflectance. Examples of the titanium oxide include anatase type titanium oxide, rutile type titanium oxide, and brucite type titanium oxide. Among these, rutile type titanium oxide excellent in thermal stability can be preferably used. As long as the purpose of the unsaturated polyester resin composition used in the surface-mounted light-emitting device of the present invention is not impaired, titanium oxide surface-treated with any treating agent can be used.
- the white pigment has an average particle size of 2.0 ⁇ m or less.
- the average particle size of the white pigment is preferably 2.0 ⁇ m or less, more preferably 0.01 to 1.0 ⁇ m, and still more preferably 0.1 to 0.5 ⁇ m from the viewpoint of reflectance.
- the average particle size is determined by measuring primary particles using an electron microscope. If the average particle size of the white pigment is large, good moldability cannot be obtained and high reflectance may not be obtained.
- a reinforcing material can be blended. By using a reinforcing material, it can be set as the unsaturated polyester resin composition for LED reflecting plates which has the outstanding intensity
- glass fiber used as a reinforcing material for unsaturated polyester resin compositions used for FRP fiber, reinforced plastics
- FRP fiber, reinforced plastics
- BMC sheet molding compound
- reinforcing materials other than glass fibers include inorganic fibers such as carbon fibers and whiskers, and organic fibers such as aramid fibers and polypropylene fibers. Aramid fibers and polypropylene fibers are preferable.
- glass fibers silicate glass, E glass (alkali-free glass for electricity), C glass (alkali glass for chemistry), A glass (acid-resistant glass), S glass (high strength glass) Glass fibers such as these can be used, and those made of long fibers (roving) and short fibers (chopped strands) can be used. Furthermore, these glass fibers can also be used after surface treatment.
- short fibers chopped strands
- other resin composition components that is, an unsaturated polyester resin, a white pigment, an inorganic filler or the like.
- L / D ratio of fiber length to fiber diameter
- the preferred fiber length of the reinforcing material used in the present invention is in the range of 3 to 6 mm, and the fiber diameter is in the range of 6 to 15 ⁇ m.
- the unsaturated polyester resin composition used in the surface-mounted light-emitting device of the present invention contains, as a polymerization initiator, a heat-decomposable organic peroxide or a polymerization inhibitor that is usually used in an unsaturated polyester resin composition. Can be used.
- organic peroxide examples include t-butylperoxy-2-ethylhexyl monocarbonate, 1,1-di (t-hexylperoxy) cyclohexane, 1,1-di (t-butylperoxy) -3,3, Examples thereof include 5-trimethylcyclohexane, t-butylperoxyoctate, benzoyl peroxide, methyl ethyl ketone peroxide, acetylacetone peroxide, t-butylperoxybenzoate, and dicumyl peroxide. These may be used alone or in combination of two or more.
- an organic peroxide having a 10-hour half-life temperature of 100 ° C. or higher it is preferable to use an organic peroxide having a 10-hour half-life temperature of 100 ° C. or higher. Specifically, dicumyl peroxide can be preferably used.
- Polymerization inhibitors include hydroquinone, monomethyl ether hydroquinone, toluhydroquinone, di-t-4-methylphenol, monomethyl ether hydroquinone, phenothiazine, t-butylcatechol, quinones such as parabenzoquinone and pyrogallol, 2,6-di-t- And phenolic compounds such as butyl-p-cresol, 2,2-methylene-bis- (4-methyl-6-tert-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane be able to. These may be used alone or in combination of two or more.
- the unsaturated polyester resin composition used in the surface-mounted light-emitting device of the present invention includes other inorganic fillers as long as the fluidity of the resin composition and the reflectance when used as an LED reflector are not impaired. Can be appropriately blended.
- Examples of these include oxides and hydrates thereof, inorganic foam particles, and hollow particles such as silica balloons.
- a release agent can be used for the unsaturated polyester resin composition used in the surface-mounted light-emitting device of the present invention.
- the release agent waxes such as fatty acids, fatty acid metal salts, and minerals that are generally used for thermosetting resins can be used. Particularly, fatty acids and fatty acid metal salts that are excellent in heat discoloration are used. A thing can be used suitably.
- these releasing agents include stearic acid, zinc stearate, aluminum stearate, and calcium stearate. These mold release agents may be used independently and may use 2 or more types together.
- release agents can be blended in an amount of 3 to 15 parts by weight with respect to 100 parts by weight of the unsaturated polyester resin.
- the blending amount of the release agent is within this range, good release properties can be ensured.
- the amount is too small, the releasability between the mold and the molded product is low, and the productivity is remarkably lowered.
- the amount is too large, the sealing material may not be adhered.
- a curing catalyst and a polymerization inhibitor for adjusting the curing conditions of the unsaturated polyester resin composition Colorant, thickener, light stabilizer, processing stabilizer, ultraviolet absorber, nucleating agent, fluorescent whitening agent, flame retardant, photopolymerization initiator, antibacterial agent, antistatic agent, foaming agent, surfactant, A surface modifier, a coupling agent, other organic additives, inorganic additives, and the like can be appropriately blended as necessary.
- the unsaturated polyester resin composition used in the surface-mounted light-emitting device of the present invention is a kneader capable of being heated and pressurized after blending each component and mixing sufficiently uniformly using a mixer, a blender, etc. It can be prepared and granulated with an extruder or the like.
- a glass woven fabric is used as a reinforcing material, kneading and granulation cannot be sufficiently performed with a kneader or an extruder.
- a glass nonwoven fabric When a glass nonwoven fabric is used, the sheet-shaped nonwoven fabric collapses during kneading and does not retain the shape of the nonwoven fabric. No superiority using woven or non-woven fabrics can be found.
- the unsaturated polyester resin composition used for the surface-mounted light-emitting device of the present invention can be a granular material.
- the granular material comprising the unsaturated polyester resin composition may be a powder obtained by pulverizing the composition or may be in the form of a pellet.
- the unsaturated polyester resin composition used in the surface-mounted light-emitting device of the present invention is dry and has good thermal stability when melted.
- a molding method an injection molding method, an injection compression molding method, a transfer molding method is used.
- a melt-heating method such as a method can be suitably used.
- a laminated board made of glass woven fabric or glass nonwoven fabric must be liquid because it is necessary to impregnate the resin composition with the woven fabric or nonwoven fabric in advance, and is used for the surface-mounted light emitting device of the present invention.
- the properties are different from the unsaturated polyester resin composition.
- the molding method is also limited to the pressure molding method using a press.
- an injection molding method using an injection molding machine is particularly suitable, and the LED reflector for mounting a light emitting element having a complicated shape, unlike a flat laminated plate, in a short molding cycle time by the injection molding method. Can be manufactured.
- the viscosity of the unsaturated polyester resin composition was measured using a viscometer (capillary rheometer).
- a preferred embodiment of the unsaturated polyester resin composition used for the surface-mounted light emitting device of the present invention preferably has a viscosity in the range of 0.1 to 100 kPa ⁇ s.
- the resin composition is within this range, good moldability can be secured. If the viscosity is less than 0.1 kPa ⁇ s, the fluidity in the mold is too good, so that overfilling tends to occur, and molding defects such as burrs may occur. When the viscosity exceeds 100 kPa ⁇ s, the fluidity in the mold is poor, and molding defects such as insufficient filling may occur.
- the viscosity in the temperature range of 70 ° C. to 120 ° C. is more preferably in the range of 0.1 to 100 kPa ⁇ s.
- the temperature is lower than 70 ° C., the resin composition does not melt, so that injection molding becomes difficult. Even if injection molding can be performed, the resin composition may have a high viscosity and the resin composition may not fill up to the end of the mold.
- the temperature is higher than 120 ° C., a curing reaction may occur in the cylinder during molding, and continuous molding may be difficult.
- the unsaturated polyester resin composition preferably has a viscosity in the range of 0.1 to 100 kPa ⁇ s in the temperature range of 70 ° C. to 120 ° C.
- the gelation time of the unsaturated polyester resin composition was measured by heat and pressure molding using a mold equipped with a differential transformer type position sensor. After placing the resin composition in the mold, the mold is tightened (the mold equipped with the differential transformer type position sensor is raised), and when the thickness reaches a certain level, the differential transformer stops (changes). Inflection point 1) Since the shrinkage of curing begins with the progress of curing, the position of the differential transformer rises again (inflection point 2). A displacement-time S-curve was obtained. The time from the inflection point 1 to the inflection point 2 was defined as the gel time.
- a preferred embodiment of the unsaturated polyester resin composition used in the surface-mounted light-emitting device of the present invention is that the gelation time in the temperature range of 140 ° C. to 180 ° C. of the radical polymerizable resin composition for LED reflector is described above. The range is 5 to 120 seconds.
- the gelation time in the temperature range of 140 ° C. to 180 ° C. of the unsaturated polyester resin composition is less than 5 seconds, gelation of the resin composition occurs before filling into the mold cavity. There is a possibility that only a molded product having poor surface smoothness can be obtained because the mold surface cannot be transferred sufficiently.
- the gelation time in the temperature range of 140 ° C. to 180 ° C. of the unsaturated polyester resin composition exceeds 120 seconds, the curing time must be extended, so that the productivity is low and it is widely used as a general-purpose reflector. There is a risk of not.
- the curing rate such as gelation time. If the gelation time is too short, the resin composition gelates before it is filled into the mold cavity, so that the mold surface cannot be transferred sufficiently and the molded product has poor surface smoothness. There is a possibility that it cannot be obtained. On the other hand, if the gelation time of the resin composition is too long, the curing time has to be lengthened, so that the productivity is poor and there is a possibility that it will not spread as a general-purpose reflector.
- a preferred embodiment of the unsaturated polyester resin composition used in the surface-mounted light-emitting device of the present invention is that the radical polymerizable resin composition for LED reflector is heated and cured at (mold temperature) 140 ° C. to 180 ° C.
- This is an injection molding method. If the mold temperature is less than 140 ° C., the curing speed is slow, and the curing time must be extended. Therefore, the productivity is inferior, and there is a possibility that it will not spread as a general-purpose reflector. If the mold temperature exceeds 180 ° C., the curing rate is fast, so that the end portion is likely to be insufficiently filled, and a product may not be obtained.
- the surface-mounted light-emitting device of the present invention is a light-emitting device provided with a reflecting plate formed by molding an unsaturated polyester resin composition.
- the surface-mount light-emitting device of the present invention is used for illumination light sources, automotive light sources, backlight light sources, and the like.
- FIG. 2 shows an example of a typical configuration of the surface-mounted light-emitting device of the present invention.
- FIG. 2 schematically shows a wire bonding type surface-mounted light-emitting device 1.
- the semiconductor light emitting element 10 is disposed in a concave reflector (housing) 30 that is formed integrally with the lead frame 20, and the concave (cup-shaped part) of the reflector 30 is formed.
- a sealing material 40 light-transmitting thermosetting resin
- the surface-mount light-emitting device of the present invention is not limited by the following elements.
- semiconductor light emitting device As the semiconductor light emitting device 10, one having an emission peak wavelength of 500 nm or less is preferably used. As the semiconductor light emitting device, not only a semiconductor light emitting device having a single light emission peak but also a plurality of light emission peaks, for example, a semiconductor light emitting device having one or a plurality of light emission peaks in a region having a wavelength longer than 500 nm may be used. it can.
- the semiconductor light emitting device 10 can be used without particular limitation as long as it has the above-mentioned light emission peak.
- Examples of the semiconductor formed as the light emitting layer include GaAlN, ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, and AlInGaN.
- a plurality of semiconductor light emitting elements 10 can be used as necessary.
- one or a plurality of light emitting elements capable of emitting ultraviolet light, near ultraviolet light, blue light, green light, and red light can be combined.
- connection method of the semiconductor light emitting element 10 to the lead frame 20 is not particularly limited. Epoxy-based or silicone-based, or a hybrid conductive adhesive thereof, or a metal having a low melting point such as Sn / Ag / Cu (melting point 220 degrees) or Sn / Au (melting point 282 degrees) can be used.
- the lead frame 20 is a metal frame in which a die pad for fixing a semiconductor light emitting element and a lead wiring are formed.
- a lead frame an iron strip or a copper alloy can be used, and a strip that is patterned by stamping or etching and then plated can be used.
- the reflector 30 is a member on which the semiconductor light emitting element 10 is mounted, and a part or the whole is formed of the unsaturated polyester resin composition.
- the reflection plate 30 preferably has a recess (cup-shaped portion).
- One example of the reflector 30 is a combination with the lead frame 20.
- the reflector 30 having a desired shape is bonded or integrated on the lead frame 20.
- a recess (cup-shaped part) is formed.
- the concave portion (cup-shaped portion) is formed so that its cross-sectional area has a shape that increases continuously or stepwise from the bottom toward the light extraction direction. If these conditions are satisfied, the shape of the concave portion (cup-shaped portion) is not particularly limited.
- the sealing material 40 is a member that covers the semiconductor light emitting element 10, and its purpose is mainly to protect the semiconductor light emitting element 10 and the wiring from the external environment.
- a transparent thermosetting resin is used for the sealing material 40.
- the transparent thermosetting resin include an epoxy resin, a silicone resin, an acrylate resin, and a urethane resin.
- an epoxy resin or a silicone resin excellent in heat resistance and light resistance is preferable.
- the surface of the reflecting plate 30 may be modified by treatment with corona discharge or plasma.
- Sealing material 40 may contain a phosphor. Due to the presence of the phosphor in the encapsulant 40, part of the light from the semiconductor light emitting element 10 is converted into light having a different wavelength, and as a result, the emission color of the surface mount light emitting device can be adjusted.
- any phosphor can be used as long as it can be excited by light from the semiconductor light emitting element 10.
- nitride phosphors, oxynitride phosphors and sialon phosphors mainly activated by lanthanoid elements such as Eu and Ce; mainly by lanthanoid elements such as Eu or transition metal elements such as Mn Activated alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate, alkaline earth silicon nitride, germanate; mainly lanthanoid elements such as Ce
- At least one selected from organic compounds and organic complexes mainly activated by a rare earth aluminate, a rare earth silicate, or a lanthanoid element such as Eu is preferably used.
- a plurality of types of phosphors may be combined and contained in the sealing material 40.
- Sealing material 40 may contain a light diffuser.
- the semiconductor light emitting element of the point light source can emit light from the entire surface of the concave portion of the reflecting plate 30, and light emission unevenness can be reduced.
- the light diffuser include titanium dioxide, zinc oxide, barium titanate, and aluminum oxide.
- the reflection plate 30 in which the lead frame 20 is inserted and the unsaturated polyester resin composition is injection-molded is obtained.
- the semiconductor light emitting element 10 is mounted, and the electrodes of the semiconductor light emitting element 10 and the wiring pattern on the lead frame 20 are connected to the recesses in the reflection plate by bonding wires.
- a phosphor is mixed with a liquid silicone sealant composed of a main agent and a curing agent, and potted in a recess in the reflector. In this state, the silicone sealant is cured by heating to about 150 ° C. Then, heat is dissipated in the air.
- FIG. 3 shows a schematic diagram of a surface-mounted light-emitting device 2 that is an example of the present invention having another configuration.
- the same elements as those of the surface mount light emitting device 1 are denoted by the same reference numerals.
- a heat sink is attached to the lead frame 20.
- Other configurations are the same as those of the surface-mounted light-emitting device 1.
- the wire bonding type surface mount type light emitting device has been described as a configuration example of the present invention.
- the present invention is a flip chip type surface mount in which a semiconductor light emitting element is mounted on a substrate or a lead frame in a so-called flip chip form.
- the present invention is also applicable to a type light emitting device.
- the present invention is also a lighting device including the surface-mounted light emitting device. Since the lighting device of the present invention uses the light emitting device having the long life described above, the lighting device has a long life.
- the illumination device of the present invention can be configured according to a known method. For example, in a conventional LED lighting device, a conventional light emitting device used for a light source for LED lighting can be configured by replacing the above surface mounted light emitting device.
- the present invention also provides an image display device comprising the surface-mounted light emitting device (for example, a small display such as a mobile phone, a small display such as a digital camera, a digital video camera, a car navigation system, a medium size such as a personal computer or a liquid crystal television, Large display etc.). Since the image display device of the present invention uses the above-described long-life light-emitting device, the image display device has a long life.
- the image display apparatus of the present invention can be configured according to a known method. For example, in a conventional image display device, a conventional light emitting device used for an LED backlight light source can be replaced with the above surface mounted light emitting device.
- the unsaturated polyester resin composition is blended in the blending amounts shown in the following Tables 2, 3 and 4, and uniformly prepared using a kneader capable of being heated under pressure, and then the preparation is put into an extruder. And granulated to prepare a resin composition.
- the obtained unsaturated polyester resin composition was prepared using an injection molding machine (Sumitomo Heavy Industries, Ltd., 120 ton thermosetting injection molding machine) under the conditions of a mold temperature of 165 ° C. and a curing time of 60 seconds. Produced. The molded specimens were evaluated for physical properties by the methods described below and shown in Tables 2, 3 and 4, respectively.
- Unsaturated polyester resin Unsaturated polyester 1: crystalline unsaturated polyester (T-855, manufactured by Nippon Iupika) 2.
- Unsaturated polyester 2 Amorphous unsaturated polyester (Iupica 8552, manufactured by Nippon Yupica) 3.
- Copolymerizable monomer 1 Styrene monomer (Asahi Kasei Corporation) 4).
- Copolymerizable monomer 2 Diethylene glycol dimethacrylate (NK Nakaester 2G manufactured by Shin-Nakamura Chemical Co., Ltd.) 5).
- Copolymerizable monomer 3 Ethoxylated isocyanuric acid triacrylate (A-9300, manufactured by Shin-Nakamura Chemical Co., Ltd.) 6).
- Copolymerizable multimer diallyl phthalate prepolymer (Daipu Co., Ltd. dap polymer) 7).
- Thermoplastic resin 1 Polymethylmethacrylate (Shanghai ⁇ Strange Polymer Materials Co., Ltd. MG515) 8).
- Thermoplastic resin 2 polystyrene (GPPS679 manufactured by Asahi Kasei Corporation) 9.
- Thermoplastic resin 3 polyethylene (PR-1050, manufactured by Tokyo Ink Co., Ltd.)
- Titanium oxide rutile-type titanium oxide, average particle size 0.2 ⁇ m
- CR-60 manufactured by Ishihara Sangyo Co., Ltd.
- Inorganic filler 1 Calcium carbonate (average particle size 2 ⁇ m) 2.
- Inorganic filler 2 Aluminum hydroxide (average particle size 10 ⁇ m) 3.
- Inorganic filler 3 Silica (average particle size 30 ⁇ m)
- Unsaturated polyester resin characteristics A crystalline unsaturated polyester resin and an amorphous unsaturated polyester resin were measured at 25 ° C., 50 ° C., and 70 ° C. shown in Table 1, and viscometers (Toki Sangyo Co., Ltd.) Viscosity was measured with a TVB-10 viscometer, rotor M2). The viscosity measurement was stopped for the solid crystalline unsaturated polyester resin.
- the target mold shrinkage was 0.6%, and 0.6% or less was judged good, and the case where it exceeded 0.6% was judged as poor. However, the conditions may be met even if it exceeds 0.6% depending on the desired application, required quality, etc., even if the above strict standards are not satisfied. It is.
- ⁇ represents a graph showing the change over time in the reflectance of the LED reflector of Example 15 and ⁇ is shown in FIG.
- the graph which shows the reflectance time-dependent change of the LED reflecting plate of Example 1 ( ⁇ ) and Comparative Example 1 ( ⁇ ) is shown in FIG.
- Table 2 is referred to for evaluation when an unsaturated polyester resin (A) comprising a crystalline unsaturated polyester and a copolymerizable monomer and / or copolymerizable multimer is used. .
- Examples 1 to 13 satisfying the blending amount range of the crystalline unsaturated polyester resin composition are the granulation property and the initial reflection at a measurement wavelength of 450 nm.
- the reflectance was 90% or more
- the reflectivity after a heat test stored at 150 ° C. for 1000 hours was 80% or more in most cases, and all the results of storage shape stability were good. It has been found that even if the reflectance is slightly inferior, the overall results are excellent with respect to moldability, stability, and the like.
- an unsaturated polyester resin (B) comprising an unsaturated polyester (including crystalline and / or amorphous), a copolymerizable monomer and / or a copolymerizable multimer, and a thermoplastic resin.
- an unsaturated polyester resin (B) comprising an unsaturated polyester (including crystalline and / or amorphous), a copolymerizable monomer and / or a copolymerizable multimer, and a thermoplastic resin.
- Examples 14 to 30 that satisfy the blending amount range of the unsaturated polyester resin composition are the unsaturated polyester resin compositions not using the thermoplastic resin. In comparison, it was proved to show an excellent effect.
- Comparative Example 1 is an amorphous unsaturated polyester resin composition using a diallyl phthalate prepolymer in an amorphous unsaturated polyester. Compared to most examples, the molding shrinkage was high. Since the resin composition has a very high viscosity, productivity at the time of granulation was remarkably lowered. Although the initial reflectivity was good, the reflectivity after the heat resistance test was lower than 80%. Further, slight deformation was confirmed in the storage shape stability of the resin composition.
- Comparative Example 2 is an amorphous unsaturated polyester resin composition obtained by replacing the crystalline unsaturated polyester of Example 1 with the amorphous unsaturated polyester, and from the crystalline unsaturated polyester of Example 15 to the amorphous unsaturated polyester. It is an amorphous unsaturated polyester resin composition in which a thermoplastic resin is removed instead of polyester. Compared to the examples, the molding shrinkage was high and the image clarity was low. Since it became a continuous pellet at the time of granulation, granulation property fell remarkably. The storage shape stability at 50 ° C. was poor, and the shape change of the resin composition was confirmed.
- the unsaturated polyester resin composition can exhibit properties superior to those of conventional unsaturated polyester resin compositions. Therefore, the surface mount type light emitting measure provided with the reflecting plate formed with the unsaturated polyester resin composition has a longer life than the surface mount type light emitting measure provided with the conventional reflector formed with the unsaturated polyester resin composition.
- the obtained radical polymerizable resin composition was subjected to test specimens using an injection molding machine (Sumitomo Heavy Industries, Ltd., 120 ton thermosetting injection molding machine) under conditions of a mold temperature of 165 ° C. and a curing time of 60 seconds. Produced.
- the mold used was a family mold capable of obtaining test pieces and flat plates for tensile, bending, compression and impact tests.
- the physical properties of the molded test pieces were evaluated by the methods described below, and the results are shown in Table 5 and Table 6, respectively.
- Unsaturated polyester 1 crystalline unsaturated polyester (T-855, manufactured by Nippon Iupika) 2.
- Unsaturated polyester 2 Amorphous unsaturated polyester (Iupica 8552, manufactured by Nippon Yupica) 3.
- Epoxy acrylate Epoxy acrylate (Nippon Iupika V-774) 4).
- Copolymerizable monomer 1 Styrene monomer (Asahi Kasei Corporation) 5).
- Copolymerizable multimer diallyl phthalate prepolymer (Daipu Co., Ltd. dap polymer)
- Titanium oxide rutile-type titanium oxide, average particle size 0.2 ⁇ m
- CR-60 manufactured by Ishihara Sangyo Co., Ltd.
- Inorganic filler 1 Calcium carbonate (average particle size 2 ⁇ m)
- the position of the differential transformer starts to rise, and the tangent at the inflection point of the S-curve obtained at this stage is the straight line 2.
- the tangent at the inflection point of the S-curve obtained at this stage is the straight line 3.
- the time between the intersection 4 of the straight line 1 and the straight line 2 and the intersection 5 of the straight line 2 and the straight line 3 is defined as the gel time.
- Table 5 and Table 6 show the gelation time values obtained from the figure.
- Comparative Example 3 is a radical polymerizable resin composition using a diallyl phthalate prepolymer and a styrene monomer. Since the viscosity of the resin composition was high, the measurement apparatus was overloaded and the viscosity could not be measured. In molding, since the viscosity of the resin composition was high, the resin composition did not reach the end of the test piece, and a test piece could not be obtained.
- Comparative Example 4 is a radical polymerizable resin composition using a styrene monomer and a diallyl phthalate prepolymer in an amorphous unsaturated polyester.
- the resin composition having a high resin content had a decreased reflectance after the heat resistance test. Further, deformation was confirmed in the storage shape stability of the resin composition.
- Comparative Example 5 is a radical polymerizable resin composition using a styrene monomer and a diallyl phthalate prepolymer in an amorphous unsaturated polyester. Since the resin composition with a large amount of inorganic filler has a high viscosity, the measurement apparatus is overloaded and the viscosity cannot be measured. Moreover, since the viscosity of the resin composition was high, the resin composition did not reach the end of the test piece, and a test piece could not be obtained. Furthermore, slight deformation was confirmed in the storage shape stability of the resin composition.
- Examples 31 to 41 satisfying the claims of the radically polymerizable resin composition for LED reflectors in the present invention are the radically polymerizable resin compositions shown in Table 6. It was found that an excellent effect was exhibited in comparison with.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
この結果白色顔料を使用する割合を多くする事で、目標の初期反射率を得る事が出来るが、高価な白色顔料を多量に使用しなければならない問題がある。
この結果白色顔料を使用する割合が少ない場合でも、目標の初期反射率を得る事が出来る。
不飽和ポリエステルの製造において、不飽和多塩基酸、飽和多塩基酸の酸成分の選択や組合せ、及びグリコール類の選択や組合せ、それらの配合割合等を適宜選択することにより結晶性を有する不飽和ポリエステルとすることができる。
酸化チタンとしては、例えば、アナターゼ型酸化チタン、ルチル型酸化チタン、ブルサイト型酸化チタンを挙げることができる。これらの中でも熱安定性に優れたルチル型酸化チタンを好適に用いることができる。本発明の目的を損なわない限りにおいて、いかなる処理剤で表面処理された酸化チタンも用いることができる。
不飽和ポリエステルの製造において、不飽和多塩基酸、飽和多塩基酸の酸成分の選択や組合せ、及びグリコール類の選択や組合せ、それらの配合割合等を適宜選択することにより結晶性を有する不飽和ポリエステルとすることができる。
酸化チタンとしては、例えば、アナターゼ型酸化チタン、ルチル型酸化チタン、ブルサイト型酸化チタンを挙げることができる。これらの中でも熱安定性に優れたルチル型酸化チタンを好適に用いることができる。本発明の目的を損なわない限りにおいて、いかなる処理剤で表面処理された酸化チタンも用いることができる。
不飽和ポリエステルの製造において、不飽和多塩基酸、飽和多塩基酸の酸成分の選択や組合せ、及びグリコール類の選択や組合せ、それらの配合割合等を適宜選択することにより結晶性を有する不飽和ポリエステルとすることができる。
酸化チタンとしては、例えば、アナターゼ型酸化チタン、ルチル型酸化チタン、ブルサイト型酸化チタンを挙げることができる。これらの中でも熱安定性に優れたルチル型酸化チタンを好適に用いることができる。本発明の表面実装型発光装置に用いられる不飽和ポリエステル樹脂組成物の目的を損なわない限りにおいて、いかなる処理剤で表面処理された酸化チタンも用いることができる。
本発明の表面実装型発光装置は、不飽和ポリエステル樹脂組成物を成形してなる反射板を備えた発光装置である。本発明の表面実装型発光装置は、照明用光源、自動車用光源、バックライト光源等に用いられる。
半導体発光素子10は、発光ピーク波長が500nm以下にあるものを好適に用いられる。半導体発光素子として、単一の発光ピークを有する半導体発光素子だけではなく、複数の発光ピーク、例えば、500nmよりも長波長の領域に一つあるいは複数の発光ピークを有する半導体発光素子を用いることもできる。
リードフレーム20は半導体発光素子を固定するダイパットと引出配線を形成した金属フレームである。リードフレームは鉄の条材、銅合金が使用でき、条材をスタンピング、またはエッチングにてパターン化した後、メッキ加工されるものも使用できる。
反射板30は半導体発光素子10が搭載される部材であり、一部または全体が前記不飽和ポリエステル樹脂組成物より形成される。
封止材40は半導体発光素子10を被覆する部材であり、その目的は主として外部環境から半導体発光素子10や配線を保護することにある。
本発明はまた、前記表面実装型発光装置を備えた照明装置である。本発明の照明装置は、上記の長寿命の発光装置を用いているため、長寿命である。本発明の照明装置は、公知方法に準じて構成することができる。例えば、従来のLED照明装置において、LED照明用光源に用いられている従来の発光装置を、上記の表面実装型発光装置に置き換える等により構成することができる。
本発明はまた、前記表面実装型発光装置を備えた画像表示装置(例として携帯電話等の小型ディスプレイ、デジタルカメラ、デジタルビデオカメラ、カーナビゲーションシステム等の小型ディスプレイ、パソコン、液晶テレビ等の中型、大型ディスプレイ等)である。本発明の画像表示装置は、上記の長寿命の発光装置を用いているため、長寿命となる。本発明の画像表示装置は、公知方法に準じて構成することができる。例えば、従来の画像表示装置において、LEDバックライト光源に用いられている従来の発光装置を、上記の表面実装型発光装置に置き換える等により構成することができる。
実施例1~30、比較例1~2
表2に示す実施例1~13、表3に示す実施例14~30に記載のLED反射板用不飽和ポリエステル樹脂組成物、表4に示す比較例1~2のLED反射板用非晶性不飽和ポリエステル樹脂組成物は、下記表2、3及び表4に記載の配合量にて配合し、加圧加熱可能な混練機を用いて均一に調製した後、調製物を押し出し機に投入して造粒し、樹脂組成物を作製した。
(1)不飽和ポリエステル樹脂
1.不飽和ポリエステル1:結晶性不飽和ポリエステル(日本ユピカ製 T-855)
2.不飽和ポリエステル2:非晶性不飽和ポリエステル(日本ユピカ製 ユピカ8552)
3.共重合性単量体1:スチレンモノマー(旭化成(株)製)
4.共重合性単量体2:ジエチレングリコールジメタクリレート(新中村化学(株)製 NKエステル2G)
5.共重合性単量体3:エトキシ化イソシアヌル酸トリアクリレート(新中村化学(株)製 A-9300)
6.共重合性多量体:ジアリルフタレートプレポリマー(ダイソー(株)製 ダップポリマー)
7.熱可塑性樹脂1:ポリメチルメタクリレート(上海▲けい▼奇高分子材料有限公司 MG515)
8.熱可塑性樹脂2:ポリスチレン(旭化成(株)製 GPPS679)
9.熱可塑性樹脂3:ポリエチレン(東京インキ(株)製 PR-1050)
1.白色顔料:酸化チタン(ルチル型酸化チタン 平均粒子径0.2μm)(石原産業(株)製 CR-60)
1.無機充填材1:炭酸カルシウム(平均粒子径2μm)
2.無機充填材2:水酸化アルミニウム(平均粒子径10μm)
3.無機充填材3:シリカ(平均粒子径30μm)
1.強化材:ガラス繊維(日東紡(株)製 CS 3 PE-908)
2.離型剤:ステアリン酸亜鉛(日油(株)製 GF-200)
3.重合開始剤:ジクミルパーオキサイド(日油(株)製 パークミルD)
(1)不飽和ポリエステル樹脂特性
表1に示す25℃、50℃、及び70℃の条件で結晶性不飽和ポリエステル樹脂、及び非晶性不飽和ポリエステル樹脂を、粘度計(東機産業(株)製 TVB-10形粘度計、ロータM2)により粘度を測定した。固体状の結晶性不飽和ポリエステル樹脂は粘度測定を中止した。
表2に示す実施例1~13、表3に示す実施例14~30に記載のLED反射板用不飽和ポリエステル樹脂組成物、及び表4に示す比較例1~2のLED反射板用非晶性不飽和ポリエステル樹脂組成物を、加圧加熱可能な混練機、及び押し出し機を用いてストランドを作製し、ホットカットにより造粒した。
良好に造粒できた樹脂組成物を○、造粒困難な樹脂組成物を△、造粒できない樹脂組成物を×とした。その結果を表2、3及び表4に示す。
表2に示す実施例1~13、表3に示す実施例14~30に記載のLED反射板用不飽和ポリエステル樹脂組成物、及び表4に示す比較例1~2のLED反射板用不飽和ポリエステル樹脂組成物2kgを共重合性単量体が気散しないPE(ポリエチレン)/PET(ポリエチレンテレフタレート)の多層フィルムからなる袋に詰め、更に20cm角容器に樹脂組成物が入った袋を設置し、容器内の樹脂組成物全面に10kgの荷重を加え、50℃の熱風乾燥機内に2週間保管して樹脂組成物の形状確認を行なった。変形しなかったものを○、僅かに変形したものを△、変形したものを×とした。その結果を表2、3及び表4に示す。但し、前記基準をクリアせずとも、所望の用途、要求される品質等によっては、僅かに変形する場合でも条件が適合する場合もあるので、一つの目安として検討すればよいものである。
表2に示す実施例1~13、表3に示す実施例14~30、及び表4に示す比較例1~2の試験片を紫外可視近赤外分光光度計((株)島津製作所製 UV-3100PC)を用いて反射率測定波長が450nmで反射率を測定した。その結果を表2、3及び表4に示す。目標とする初期反射率は90%とし、90%以上を良、90%未満を不良とした。但し、前記厳格な基準をクリアせずとも、所望の用途、要求される品質等によっては、90%未満でも条件が適合する場合もあるので、一つの目安として検討すればよいものである。
表2に示す実施例1~13、表3に示す実施例14~30、及び表4に示す比較例1~2の試験片を150℃に温調した熱風乾燥機内で1000時間保管し、紫外可視近赤外分光光度計((株)島津製作所製 UV-3100PC)を用いて反射率測定波長は450nmで行い、反射率を測定した。その結果を表2、3及び表4に示す。目標とする耐熱試験後反射率は80%とし、80%以上を良、80%未満を不良とした。但し、前記厳格な基準をクリアせずとも、所望の用途、要求される品質等によっては、80%未満でも条件が適合する場合もあるので、一つの目安として検討すればよいものである。
表3に示す実施例14~30、及び表4に示す比較例1~2の樹脂組成物を165℃に温調した金型に加え3分間加圧加熱した。成形片は直ちに金型から取り出し、23℃、湿度55RHの恒温恒湿下で24時間保管した。試験片の表裏に突起した環状帯の外形をお互いに直行する測定線に沿って、表面2ヶ所、裏面2ヶ所、計4箇所の寸法を測定した。試験片に対応する金型の溝の外形を同一条件で0.01mmまで測定して成形収縮率を算出した。その結果を表3及び表4に示す。目標とする成形収縮率は0.6%とし、0.6%以下を良、0.6%を超える場合を不良とした。但し、前記厳格な基準をクリアせずとも、所望の用途、要求される品質等によっては、0.6%を超える場合でも条件が適合する場合もあるので、一つの目安として検討すればよいものである。
表3に示す実施例14~30、及び表4に示す比較例1~2の試験片を写像性測定器(スガ試験機(株) ICM-2DP)を用いて光学くしが1mmの条件で測定した。その結果を表3及び表4に示す。目標とする写像性は10%とし、10%以上を良、10%未満を不良とした。
まず、本発明において、結晶性不飽和ポリエステルと、共重合性単量体及び/又は共重合性多量体とからなる不飽和ポリエステル樹脂(A)を使用した場合の評価について、表2を参照する。
実施例31~41、比較例3~5
表5に示す実施例31~41のLED反射板用ラジカル重合性樹脂組成物、表6に示す比較例3~5のLED反射板用ラジカル重合性樹脂組成物は、下記表5、及び表6に記載の配合量にて配合し、加圧加熱可能な混練機を用いて均一に調製した後、調製物を押し出し機に投入して造粒し、樹脂組成物を作製した。
(1)ラジカル重合性樹脂
1.不飽和ポリエステル1:結晶性不飽和ポリエステル(日本ユピカ製 T-855)
2.不飽和ポリエステル2:非晶性不飽和ポリエステル(日本ユピカ製 ユピカ8552)
3.エポキシアクリレート:エポキシアクリレート(日本ユピカ製 V-774)
4.共重合性単量体1:スチレンモノマー(旭化成(株)製)
5.共重合性多量体:ジアリルフタレートプレポリマー(ダイソー(株)製
ダップポリマー)
1.白色顔料:酸化チタン(ルチル型酸化チタン 平均粒子径0.2μm)(石原産業(株)製 CR-60)
1.無機充填材1:炭酸カルシウム(平均粒子径2μm)
1.強化材:ガラス繊維(日東紡(株)製 CS 3 PE-908)
2.離型剤:ステアリン酸亜鉛(日油(株)製 GF-200)
3.重合開始剤:ジクミルパーオキサイド(日油(株)製 パークミルD)
表5に示す実施例31~41、及び表6に示す比較例3~5のLED反射板用ラジカル重合性樹脂組成物について段落番号[0337]に記した方法により評価した。
表5に示す実施例31~41、及び表6に示す比較例3~5のLED反射板用ラジカル重合性樹脂組成物をBMC粘度測定機(日本ユピカ製 BMC-100T)を用いて粘度を測定した。ラジカル重合性樹脂組成物50gを90℃の試料ポットに投入し、ピストンを下ろし、3分間保持する。その後、ピストンを一定速度(50mm/min)で下ろし試料ポットの底部中央に設けられた直径4mm×L10mmのモノホールから樹脂組成物を流出させる。この時に押し込みピストンにかかる荷重から粘度を算出した。その結果を表5、及び表6に示す。粘度が高く測定できない樹脂組成物は測定を中止した。
表5に示す実施例31~41、及び表6に示す比較例3~5のLED反射板用ラジカル重合性樹脂組成物を差動トランス式位置センサーが備えられた金型を用いてゲル化時間を測定した。155℃に設定したプレス金型の中央部に240gの樹脂組成物を置いた後、直ちに金型を上昇して締めて加熱加圧成形を行った。記録計より図5に示すような金型の変位―時間曲線を得た。(直線1は型締め速度に相当する。金型内の樹脂組成物の流動につれて作動トランスの動きは遅くなり、一定の厚みとなった時点で差動トランスはいったん停止するが、硬化の進展に伴い硬化収縮が始まるため、差動トランスの位置が上昇し始める。この段階で得られるS字カーブの変曲点における接線が直線2である。硬化が終了すると作動トランスの位置は一定となる。この段階で得られるS字カーブの変曲点における接線が直線3である。直線1と直線2との交点4から直線2と直線3との交点5との間の時間をゲル化時間とした。)図より得られたゲル化時間の値を表5、及び表6に示す。
表5に示す実施例31~41、及び表6に示す比較例3~5のLED反射板用ラジカル重合性樹脂組成物を金型温度165℃・硬化時間60秒(硬化時間は射出時間と保圧時間の合計)の条件において成形性を評価した。その結果を表1、及び表2に示す。樹脂組成物が金型キャビティ末端部まで充填したものを○、金型キャビティ末端部まで充填しないものも×とした。
表5に示す実施例31~41、及び表6に示す比較例3~5のLED反射板用ラジカル重合性樹脂組成物を金型温度165℃・硬化時間60秒(硬化時間は射出時間と保圧時間の合計)の条件において成形し、金型に設けられたエアベント以外のバリの長さを測定した。評価方法は金型の固定側・可動側の隙間内を流れて生じた樹脂バリの長さの最大値をノギスで求めた。その結果を表5、及び表6に示す。目標とするバリの長さは10mmとし、10mm以下を良、10mmを超えるものを不良とした。
表5に示す実施例31~41、及び表6に示す比較例3~5のLED反射板用ラジカル重合性樹脂組成物を金型温度165℃・硬化時間60秒(硬化時間は射出時間と保圧時間の合計)の条件において、成形サイクルを評価した。その結果を表5、及び表6に示す。連続成形が可能であり、良品が得られた試験片を○、スプルーの硬化が不十分であり連続成形ができなかったものを×とした。
表5に示す実施例31~41、及び表6に示す比較例3~5の試験片をについて段落番号[0338]に記した方法により評価した。
表5に示す実施例31~41、及び表6に示す比較例3~5の試験片をについて段落番号[0339]に記した方法により評価した。
表5に示す実施例31~41、及び表2に示す比較例3~5の試験片を写像性測定器(日本電色工業(株) VGS-300A)を用いて測定した。その結果を表5、及び表6に示す。目標とする光沢率は40%とし、40%以上を良、40%未満を不良とした。但し、前記厳格な基準をクリアせずとも、所望の用途、要求される品質等によっては、40%未満でも条件が適合する場合もあるので、一つの目安として検討すればよいものである。
表5に示すように総合的に判断した結果、本発明におけLED反射板用ラジカル重合性樹脂組成物の配合量範囲を満足する実施例31~41は、表6に示すラジカル重合性樹脂組成物に比べて、優れた効果を示すことが判明した。
Claims (43)
- 結晶性不飽和ポリエステル樹脂と、無機充填材とを少なくとも含む結晶性不飽和ポリエステル樹脂組成物であって、前記結晶性不飽和ポリエステル樹脂が、結晶性不飽和ポリエステルと、共重合性単量体及び/又は共重合性多量体と、からなり、前記結晶性不飽和ポリエステル樹脂組成物が白色顔料を含むことを特徴とするLED反射板用結晶性不飽和ポリエステル樹脂組成物。
- 前記結晶性不飽和ポリエステル樹脂が、50℃以下の温度範囲において固体状であることを特徴とする請求項1記載のLED反射板用結晶性不飽和ポリエステル樹脂組成物。
- 前記結晶性不飽和ポリエステル樹脂が、結晶性不飽和ポリエステル40~95重量部と、共重合性単量体及び/又は共重合性多量体60~5重量部と、からなる請求項1又は2項に記載のLED反射板用結晶性不飽和ポリエステル樹脂組成物。
- 共重合性単量体及び/又は共重合性多量体の合計量に対して常温にて液体の前記共重合性単量体が50重量%以上であることを特徴とする請求項1~3項のいずれか1項に記載のLED反射板用結晶性不飽和ポリエステル樹脂組成物。
- 前記結晶性不飽和ポリエステル樹脂が、組成物全量に対して10~35重量%であり、無機充填材と白色顔料の配合量の合計量が、組成物全量に対して50~80重量%であり、かつ無機充填材と白色顔料の配合量の合計量に占める白色顔料の割合が10~50重量%であることを特徴とする請求項1~4項のいずれか1項に記載のLED反射板用結晶性不飽和ポリエステル樹脂組成物。
- 前記無機充填材と白色顔料の配合量の合計量に占める白色顔料の割合が10~29重量%であることを特徴とする請求項5記載のLED反射板用結晶性不飽和ポリエステル樹脂組成物。
- 前記白色顔料が、酸化チタン、チタン酸バリウム、硫酸バリウム、酸化亜鉛、硫化亜鉛からなる群から選択される1種以上であることを特徴とする請求項1~6項のいずれか1項に記載のLED反射板用結晶性不飽和ポリエステル樹脂組成物。
- 前記白色顔料の平均粒径が2.0μm以下であることを特徴とする請求項1~7項のいずれか1項に記載のLED反射板用結晶性不飽和ポリエステル樹脂組成物。
- 前記無機充填材の平均粒径が0.1~50μmの範囲であることを特徴とする請求項1~8項のいずれか1項に記載のLED反射板用結晶性不飽和ポリエステル樹脂組成物。
- 請求項1~9項のいずれか1項に記載のLED反射板用結晶性不飽和ポリエステル樹脂組成物からなる粒状物。
- 請求項10に記載のLED反射板用結晶性不飽和ポリエステル樹脂組成物よりなる粒状物を成形してなることを特徴とするLED反射板。
- 不飽和ポリエステル樹脂と、無機充填材とを少なくとも含む不飽和ポリエステル樹脂組成物であって、前記不飽和ポリエステル樹脂が、不飽和ポリエステルと、共重合性単量体及び/又は共重合性多量体と、熱可塑性樹脂とからなり、前記不飽和ポリエステル樹脂組成物が、白色顔料を含むことを特徴とするLED反射板用不飽和ポリエステル樹脂組成物。
- 前記不飽和ポリエステル樹脂は、前記不飽和ポリエステルと、前記共重合性単量体及び/又は共重合性多量体との合計量が99~50重量部、前記熱可塑性樹脂が1~50重量部であることを特徴とする請求項12記載のLED反射板用不飽和ポリエステル樹脂組成物。
- 前記不飽和ポリエステル樹脂が、組成物全量に対して10~35重量%であり、前記無機充填材と前記白色顔料の配合量の合計量が、組成物全量に対して50~80重量%であり、かつ前記無機充填材と前記白色顔料の配合量の合計量に占める前記白色顔料の割合が10~50重量%であることを特徴とする請求項12又は13項のいずれか1項に記載のLED反射板用不飽和ポリエステル樹脂組成物。
- 前記不飽和ポリエステル樹脂が、結晶性不飽和ポリエステル樹脂を少なくとも含むことを特徴とする請求項12~14項のいずれか1項に記載のLED反射板用不飽和ポリエステル樹脂組成物。
- 前記不飽和ポリエステル樹脂が、50℃以下の温度範囲において固体状であることを特徴とする請求項12~15項のいずれか1項に記載のLED反射板用不飽和ポリエステル樹脂組成物。
- 前記共重合性単量体及び/又は共重合性多量体の合計量に対して常温にて液体の前記共重合性単量体が50重量%以上であることを特徴とする請求項12~16項のいずれか1項に記載のLED反射板用不飽和ポリエステル樹脂組成物。
- 前記無機充填材と前記白色顔料の配合量の合計量に占める前記白色顔料の割合が10~29重量%であることを特徴とする請求項12~17項のいずれか1項記載のLED反射板用不飽和ポリエステル樹脂組成物。
- 前記白色顔料が、酸化チタン、チタン酸バリウム、硫酸バリウム、酸化亜鉛、硫化亜鉛からなる群から選択される1種以上であることを特徴とする請求項12~18項のいずれか1項に記載のLED反射板用不飽和ポリエステル樹脂組成物。
- 前記白色顔料の平均粒径が2.0μm以下であることを特徴とする請求項12~19項のいずれか1項に記載のLED反射板用不飽和ポリエステル樹脂組成物。
- 前記無機充填材の平均粒径が0.1~50μmの範囲であることを特徴とする請求項12~20項のいずれか1項に記載のLED反射板用不飽和ポリエステル樹脂組成物。
- 前記熱可塑性樹脂が、ポリメチルメタクリレート、ポリスチレン、アクリロニトリルブタジエンスチレン、ポリエチレン、ポリプロピレン、ポリ酢酸ビニル、スチレンブタジエンゴム、及びそれらの共重合体からなる群から選択される1種類以上であることを特徴とする請求項12~21項のいずれか1項に記載のLED反射板用不飽和ポリエステル樹脂組成物。
- 請求項12~22項のいずれか1項に記載のLED反射板用不飽和ポリエステル樹脂組成物からなる粒状物。
- 請求項23に記載のLED反射板用不飽和ポリエステル樹脂組成物よりなる粒状物を成形してなることを特徴とするLED反射板。
- ラジカル重合性樹脂、無機充填材、白色顔料を少なくとも含むラジカル重合性樹脂組成物であって、前記ラジカル重合性樹脂組成物の粘度が0.1~100kPa・sの範囲であることを特徴とするLED反射板用ラジカル重合性樹脂組成物。
- 前記ラジカル重合性樹脂組成物の粘度が、70℃~120℃の温度範囲において0.1~100kPa・sの範囲である事を特徴とする請求項25記載のLED反射板用ラジカル重合性樹脂組成物。
- 前記ラジカル重合性樹脂組成物が不飽和ポリエステル樹脂を含むことを特徴とする請求項25又は26に記載のLED反射板用ラジカル重合性樹脂組成物。
- 前記ラジカル重合性樹脂組成物が結晶性不飽和ポリエステル樹脂を含むことを特徴とする請求項25~27項のいずれか1項に記載のLED反射板用ラジカル重合性樹脂組成物。
- 前記ラジカル重合性樹脂組成物において、140~180℃の温度範囲におけるゲル化時間が5~120秒の範囲である事を特徴とする請求項25~28項のいずれか1項に記載のLED反射板用ラジカル重合性樹脂組成物。
- 請求項25~29のいずれか1項に記載のLED反射板用ラジカル重合性樹脂組成物からなる粒状物。
- 請求項30に記載のLED反射板用ラジカル重合性樹脂組成物からなる粒状物を140~180℃で加熱硬化させる射出成形方法。
- 請求項31に記載の射出成形方法に得られることを特徴とするLED反射板。
- 不飽和ポリエステル樹脂と、無機充填材とを少なくとも含む不飽和ポリエステル樹脂組成物を成形してなる反射板を備えた表面実装型発光装置であって、前記不飽和ポリエステル樹脂が、結晶性不飽和ポリエステルと、共重合性単量体及び/又は共重合性多量体とからなる不飽和ポリエステル樹脂(A)、又は不飽和ポリエステルと共重合性単量体及び/又は共重合性多量体と熱可塑性樹脂とからなる不飽和ポリエステル樹脂(B)から選ばれる1種以上であり、前記不飽和ポリエステル樹脂組成物が白色顔料を含むことを特徴とする表面実装型発光装置。
- 前記不飽和ポリエステル樹脂(A)が、結晶性不飽和ポリエステル40~95重量部と、共重合性単量体及び/又は共重合性多量体60~5重量部とからなることを特徴とする請求項33記載の表面実装型発光装置。
- 前記不飽和ポリエステル樹脂(B)が、不飽和ポリエステル35~95重量部と、共重合性単量体及び/又は共重合性多量体60~5重量部とからなる混合物99~50重量部と、熱可塑性樹脂1~50重量部とからなることを特徴とする請求項33記載の表面実装型発光装置。
- 前記不飽和ポリエステル樹脂(A)及び/又は(B)が、組成物全量に対して10~35重量%であり、前記無機充填材と前記白色顔料の配合量の合計量が、組成物全量に対して50~80重量%であり、かつ前記無機充填材と前記白色顔料の配合量の合計量に占める前記白色顔料の割合が10~50重量%であることを特徴とする請求項33~35項のいずれか1項に記載の表面実装型発光装置。
- 前記不飽和ポリエステル樹脂(A)及び/又は(B)が、50℃以下の温度範囲において固体状であることを特徴とする請求項33~36項のいずれか1項に記載の表面実装型発光装置。
- 前記不飽和ポリエステル樹脂(B)が、結晶性不飽和ポリエステルを少なくとも含むことを特徴とする請求項33~37項のいずれか1項に記載の表面実装型発光装置。
- 前記共重合性単量体及び/又は共重合性多量体の合計量に対して常温にて液体の前記共重合性単量体が50重量%以上である前記不飽和ポリエステル樹脂組成物成形体を含むことを特徴とする請求項33~38項のいずれか1項に記載の表面実装型発光装置。
- 前記無機充填材と前記白色顔料の配合量の合計量に占める前記白色顔料の割合が10~29重量%であることを特徴とする請求項33~39項のいずれか1項に記載の表面実装型発光装置。
- 前記白色顔料が、酸化チタン、チタン酸バリウム、硫酸バリウム、酸化亜鉛、硫化亜鉛からなる群から選択される1種以上であることを特徴とする請求項33~40項のいずれか1項に記載の表面実装型発光装置。
- 請求項33~41項のいずれか1項に記載の表面実装型発光装置を備えた照明装置。
- 請求項33~41項のいずれか1項に記載の表面実装型発光装置を備えた画像表示装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020147033889A KR102012306B1 (ko) | 2012-06-04 | 2013-04-26 | Led 반사판용 결정성 불포화 폴리에스테르 수지 조성물, 상기 조성물로 이루어지는 입상물, 및 상기 입상물을 성형하여 이루어지는 led 반사판, 표면 실장형 발광 장치, 및 상기 발광 장치를 구비한, 조명 장치 및 화상 표시 장치 |
US14/402,264 US20150138778A1 (en) | 2012-06-04 | 2013-04-26 | Crystalline unsaturated polyester resin composition for led reflector, granular material comprising said composition, led reflector produced by molding said granular material, surface-mount-type light-emitting device, and lighting device and image display device each equipped with said light-emitting device |
EP13800723.2A EP2858133A4 (en) | 2012-06-04 | 2013-04-26 | CRYSTALLINE UNSATURATED POLYESTER RESIN COMPOSITION FOR LED REFLECTOR, GRANULAR MATERIAL COMPRISING THE SAME, LED REFLECTOR MADE BY MOLDING SAID GRANULAR MATERIAL, SURFACE MOUNT TYPE LIGHT EMITTING DEVICE, AND LIGHTING DEVICE, AND IMAGE DISPLAY DEVICE EQUIPPED WITH SAME DUDIT LIGHT EMITTING DEVICE |
CN201380029260.5A CN104471732B (zh) | 2012-06-04 | 2013-04-26 | Led反射板用结晶性不饱和聚酯树脂组合物、包含前述组合物的粒状物、成型前述粒状物而成的led反射板、表面安装型发光装置以及具备该发光装置的照明装置及图像显示装置 |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012127464A JP5153952B1 (ja) | 2012-06-04 | 2012-06-04 | Led反射板用結晶性不飽和ポリエステル樹脂組成物、前記組成物からなる粒状物、及び前記粒状物を成形してなるled反射板 |
JP2012-127464 | 2012-06-04 | ||
JP2012157440A JP5758355B2 (ja) | 2012-07-13 | 2012-07-13 | Led反射板用不飽和ポリエステル樹脂組成物、前記組成物からなる粒状物、及び前記粒状物を成形してなるled反射板 |
JP2012-157440 | 2012-07-13 | ||
JP2012-225712 | 2012-10-11 | ||
JP2012225712A JP2014077071A (ja) | 2012-10-11 | 2012-10-11 | Led反射板用ラジカル重合性樹脂組成物、前記組成物からなる粒状物、前記粒状物を用いる成形方法、及びled反射板 |
JP2012279897A JP2014123672A (ja) | 2012-12-21 | 2012-12-21 | 表面実装型発光装置、並びに該発光装置を備えた、照明装置及び画像表示装置 |
JP2012-279897 | 2012-12-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013183219A1 true WO2013183219A1 (ja) | 2013-12-12 |
Family
ID=49711629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/002857 WO2013183219A1 (ja) | 2012-06-04 | 2013-04-26 | Led反射板用結晶性不飽和ポリエステル樹脂組成物、前記組成物からなる粒状物、及び前記粒状物を成形してなるled反射板、表面実装型発光装置、並びに該発光装置を備えた、照明装置及び画像表示装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150138778A1 (ja) |
EP (1) | EP2858133A4 (ja) |
KR (1) | KR102012306B1 (ja) |
CN (1) | CN104471732B (ja) |
TW (1) | TWI586753B (ja) |
WO (1) | WO2013183219A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016021159A1 (ja) * | 2014-08-04 | 2016-02-11 | パナソニックIpマネジメント株式会社 | 光反射体用成形材料 |
JP5946592B2 (ja) * | 2014-07-17 | 2016-07-06 | フドー株式会社 | 光反射体材料、光反射体、及び照明器具 |
JP2016152276A (ja) * | 2015-02-16 | 2016-08-22 | 日亜化学工業株式会社 | 発光装置 |
WO2016189726A1 (ja) * | 2015-05-28 | 2016-12-01 | フドー株式会社 | 光反射体材料、光反射体、及び照明器具 |
JP2017066190A (ja) * | 2015-09-28 | 2017-04-06 | パナソニックIpマネジメント株式会社 | 光反射体用成形材料、光反射体及び発光装置 |
JP2017066191A (ja) * | 2015-09-28 | 2017-04-06 | パナソニックIpマネジメント株式会社 | 光反射体用成形材料、光反射体及び発光装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6206442B2 (ja) | 2015-04-30 | 2017-10-04 | 日亜化学工業株式会社 | パッケージ及びその製造方法、並びに発光装置 |
CN107466160B (zh) * | 2016-06-06 | 2022-04-29 | 宁波舜宇光电信息有限公司 | 摄像模组的模塑电路板的制造设备及其制造方法 |
JP6583297B2 (ja) | 2017-01-20 | 2019-10-02 | 日亜化学工業株式会社 | 発光装置用複合基板および発光装置の製造方法 |
US11485801B2 (en) | 2017-03-03 | 2022-11-01 | Japan U-Pica Company, Ltd. | Crystalline radical polymerizable composition for electrical and electronic component, molded article of electrical and electronic component using the composition, and method of the molded article of electrical and electronic component |
JP7172049B2 (ja) * | 2018-02-01 | 2022-11-16 | Dic株式会社 | 熱硬化性樹脂組成物、バルクモールディングコンパウンド及びその成形品 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001322147A (ja) * | 2000-03-06 | 2001-11-20 | Sharp Corp | 樹脂注型用金型およびそれを用いた半導体素子の製造方法 |
JP2002061134A (ja) * | 2000-08-18 | 2002-02-28 | Nippon Shokubai Co Ltd | 成形品 |
WO2006013899A1 (ja) | 2004-08-03 | 2006-02-09 | Tokuyama Corporation | 発光素子収納用パッケージおよび発光素子収納用パッケージの製造方法 |
JP2006140207A (ja) | 2004-11-10 | 2006-06-01 | Hitachi Chem Co Ltd | 光反射用熱硬化性樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。 |
JP2006324410A (ja) * | 2005-05-18 | 2006-11-30 | Showa Denko Kk | 発光ダイオード封止材用樹脂組成物 |
JP2008182172A (ja) | 2006-12-27 | 2008-08-07 | Toyoda Gosei Co Ltd | Led反射板用樹脂組成物 |
JP2008270709A (ja) * | 2006-10-31 | 2008-11-06 | Techno Polymer Co Ltd | 放熱性樹脂組成物、led実装用基板、リフレクター、及び、リフレクター部を備えるled実装用基板 |
JP2009272616A (ja) | 2008-04-09 | 2009-11-19 | Hitachi Chem Co Ltd | 表面実装型発光装置及びその製造方法 |
JP2010235810A (ja) | 2009-03-31 | 2010-10-21 | Jx Nippon Oil & Energy Corp | 全芳香族サーモトロピック液晶ポリエステル樹脂組成物、成形体及びledリフレクター |
JP2011035110A (ja) * | 2009-07-31 | 2011-02-17 | Kaneka Corp | 半導体パッケージ用樹脂組成物 |
JP4674487B2 (ja) | 2005-04-25 | 2011-04-20 | パナソニック電工株式会社 | 表面実装型発光装置 |
JP4844699B1 (ja) | 2010-10-22 | 2011-12-28 | パナソニック電工株式会社 | Ledリフレクター用不飽和ポリエステル樹脂組成物及びこれを用いたledリフレクター、led照明器具 |
JP2012015485A (ja) * | 2010-05-31 | 2012-01-19 | Fujifilm Corp | Ledパッケージ |
JP2012167285A (ja) | 2011-01-28 | 2012-09-06 | Kuraray Co Ltd | 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL131512C (ja) | 1964-04-04 | 1900-01-01 | ||
CH463105A (de) | 1965-02-24 | 1968-09-30 | Phoenix Gummiwerke Ag | Lagerfähiges, trockenes und durch Hitze härtbares, pressbares Gemisch sowie Verfahren zu dessen Herstellung |
DE1720490C3 (de) * | 1967-07-27 | 1978-07-06 | Phoenix Gummiwerke Ag, 2100 Hamburg | Verfahren zur Herstellung von teilkristallinen ungesättigten Polyestern in feinkörniger Form |
JPS5318990B2 (ja) | 1971-05-17 | 1978-06-17 | ||
JPS5221653B2 (ja) | 1972-03-22 | 1977-06-11 | ||
US3989655A (en) | 1973-07-09 | 1976-11-02 | Bayer Aktiengesellschaft | Low shrink, free flowing polyester resin systems based on a mixture of a crystalline unsaturated polyester resin, a monomeric copolymerizable component and a cellulose ester |
US4079024A (en) | 1974-01-17 | 1978-03-14 | Bayer Aktiengesellschaft | Free-flowing unsaturated polyester moulding compositions hardenable with very little shrinkage |
DE2402178C2 (de) * | 1974-01-17 | 1985-04-04 | Bayer Ag, 5090 Leverkusen | Rieselfähige, schwundarm aushärtbare ungesättigte Polyesterformmassen |
JPS5257282A (en) | 1975-11-06 | 1977-05-11 | Toyobo Co Ltd | Solid unsaturated polyester resin |
JPS6049221B2 (ja) * | 1979-01-05 | 1985-10-31 | 東洋紡績株式会社 | 熱硬化性射出成形材料 |
GB2106921B (en) | 1981-09-25 | 1985-04-11 | Scott Bader Co | Unsaturated polyester moulding compositions |
EP0083837B2 (en) * | 1981-12-03 | 1992-12-09 | Scott Bader Company Limited | Thickened moulding compositions |
DE3413939A1 (de) | 1984-04-13 | 1985-10-24 | Basf Ag, 6700 Ludwigshafen | Ungesaettigte polyesterharze |
NL8501059A (nl) | 1985-04-11 | 1986-11-03 | Dsm Resins Bv | Perssamenstelling op basis van thermohardend harsmateriaal. |
JPS61235457A (ja) | 1985-04-12 | 1986-10-20 | Mitsui Toatsu Chem Inc | 繊維強化熱硬化性樹脂成形材料 |
JPH03192108A (ja) | 1989-12-21 | 1991-08-22 | Matsushita Electric Works Ltd | 不飽和ポリエステル樹脂成形材料 |
DE4415102A1 (de) | 1994-04-29 | 1995-11-02 | Basf Ag | Direkt metallisierbare Scheinwerferreflektoren |
JP3174271B2 (ja) * | 1995-07-27 | 2001-06-11 | 株式会社小糸製作所 | ランプ反射鏡用成形組成物、それを用いたランプ反射鏡の製造方法及びランプ反射鏡 |
DE19540687A1 (de) | 1995-11-01 | 1997-05-07 | Bakelite Ag | Reflektor sowie Verfahren und Mittel zu seiner Herstellung |
JPH09176331A (ja) | 1995-12-26 | 1997-07-08 | Nippon Zeon Co Ltd | 不飽和ポリエステル樹脂高強度シートモールディングコンパウンド及びその成形方法 |
JPH09174698A (ja) | 1995-12-26 | 1997-07-08 | Nippon Zeon Co Ltd | 不飽和ポリエステル樹脂シートモールディングコンパウンドの成形方法及び成形品 |
JPH09188772A (ja) | 1995-12-29 | 1997-07-22 | Nippon Zeon Co Ltd | バルクモールディングコンパウンド及びそれを用いた成形方法 |
JPH09188771A (ja) | 1995-12-29 | 1997-07-22 | Nippon Zeon Co Ltd | バルクモールディングコンパウンド |
JP3431782B2 (ja) | 1996-03-08 | 2003-07-28 | 昭和高分子株式会社 | 硬化性複合材料組成物及びその硬化方法 |
JP3956450B2 (ja) | 1997-11-13 | 2007-08-08 | 大日本インキ化学工業株式会社 | 着色成形材料、成形品及びその製造方法 |
NL1007573C2 (nl) | 1997-11-19 | 1999-05-20 | Dsm Nv | Harssamenstelling op basis van onverzadigde polyester. |
JP2000143959A (ja) | 1998-09-07 | 2000-05-26 | Takeda Chem Ind Ltd | 制振性に優れた樹脂組成物およびその成形品 |
EP1052273A1 (en) | 1999-05-12 | 2000-11-15 | Dsm N.V. | Resin composition based on unsaturated polyester |
JP2001089587A (ja) | 1999-09-24 | 2001-04-03 | Hitachi Chem Co Ltd | 不飽和ポリエステル樹脂組成物及びこれを用いたシート状成形材料並びに成形品 |
JP2001279077A (ja) | 2000-03-31 | 2001-10-10 | Hitachi Chem Co Ltd | シートモールディングコンパウンド及びそれを用いた成形品 |
JP4761615B2 (ja) | 2000-11-01 | 2011-08-31 | 日本ユピカ株式会社 | 熱硬化物の製造方法 |
KR100439809B1 (ko) * | 2001-05-23 | 2004-07-12 | 현대자동차주식회사 | 저비중 열경화성 복합재료 조성물의 제조방법 |
JP4002746B2 (ja) | 2001-10-23 | 2007-11-07 | 株式会社小糸製作所 | 不飽和ポリエステル樹脂組成物およびその硬化物、ならびにランプ反射鏡基体 |
JP2003183368A (ja) | 2001-12-18 | 2003-07-03 | Japan U-Pica Co Ltd | 熱硬化性射出成形材料及びその成形物 |
JP2003327845A (ja) | 2002-05-14 | 2003-11-19 | Japan U-Pica Co Ltd | 耐衝撃性成形材料組成物 |
JP2004010832A (ja) | 2002-06-10 | 2004-01-15 | Daikin Ind Ltd | 樹脂組成物 |
JP5296298B2 (ja) | 2006-04-03 | 2013-09-25 | アイカ工業株式会社 | 結晶性樹脂組成物およびその製造方法 |
JP5308737B2 (ja) * | 2008-08-21 | 2013-10-09 | 昭和電工株式会社 | ランプリフレクター用不飽和ポリエステル樹脂組成物及びその成形物、並びにランプリフレクター |
JP5544739B2 (ja) | 2009-03-31 | 2014-07-09 | 日立化成株式会社 | 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
-
2013
- 2013-04-26 CN CN201380029260.5A patent/CN104471732B/zh active Active
- 2013-04-26 WO PCT/JP2013/002857 patent/WO2013183219A1/ja active Application Filing
- 2013-04-26 KR KR1020147033889A patent/KR102012306B1/ko active IP Right Grant
- 2013-04-26 EP EP13800723.2A patent/EP2858133A4/en not_active Withdrawn
- 2013-04-26 US US14/402,264 patent/US20150138778A1/en not_active Abandoned
- 2013-05-31 TW TW102119426A patent/TWI586753B/zh active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001322147A (ja) * | 2000-03-06 | 2001-11-20 | Sharp Corp | 樹脂注型用金型およびそれを用いた半導体素子の製造方法 |
JP2002061134A (ja) * | 2000-08-18 | 2002-02-28 | Nippon Shokubai Co Ltd | 成形品 |
WO2006013899A1 (ja) | 2004-08-03 | 2006-02-09 | Tokuyama Corporation | 発光素子収納用パッケージおよび発光素子収納用パッケージの製造方法 |
JP2006140207A (ja) | 2004-11-10 | 2006-06-01 | Hitachi Chem Co Ltd | 光反射用熱硬化性樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。 |
JP4674487B2 (ja) | 2005-04-25 | 2011-04-20 | パナソニック電工株式会社 | 表面実装型発光装置 |
JP2006324410A (ja) * | 2005-05-18 | 2006-11-30 | Showa Denko Kk | 発光ダイオード封止材用樹脂組成物 |
JP2008270709A (ja) * | 2006-10-31 | 2008-11-06 | Techno Polymer Co Ltd | 放熱性樹脂組成物、led実装用基板、リフレクター、及び、リフレクター部を備えるled実装用基板 |
JP2008182172A (ja) | 2006-12-27 | 2008-08-07 | Toyoda Gosei Co Ltd | Led反射板用樹脂組成物 |
JP2009272616A (ja) | 2008-04-09 | 2009-11-19 | Hitachi Chem Co Ltd | 表面実装型発光装置及びその製造方法 |
JP2010235810A (ja) | 2009-03-31 | 2010-10-21 | Jx Nippon Oil & Energy Corp | 全芳香族サーモトロピック液晶ポリエステル樹脂組成物、成形体及びledリフレクター |
JP2011035110A (ja) * | 2009-07-31 | 2011-02-17 | Kaneka Corp | 半導体パッケージ用樹脂組成物 |
JP2012015485A (ja) * | 2010-05-31 | 2012-01-19 | Fujifilm Corp | Ledパッケージ |
JP4844699B1 (ja) | 2010-10-22 | 2011-12-28 | パナソニック電工株式会社 | Ledリフレクター用不飽和ポリエステル樹脂組成物及びこれを用いたledリフレクター、led照明器具 |
JP4893874B1 (ja) | 2010-10-22 | 2012-03-07 | パナソニック電工株式会社 | 表面実装型発光装置 |
JP2012167285A (ja) | 2011-01-28 | 2012-09-06 | Kuraray Co Ltd | 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2858133A1 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5946592B2 (ja) * | 2014-07-17 | 2016-07-06 | フドー株式会社 | 光反射体材料、光反射体、及び照明器具 |
JPWO2016009661A1 (ja) * | 2014-07-17 | 2017-04-27 | フドー株式会社 | 光反射体材料、光反射体、及び照明器具 |
WO2016021159A1 (ja) * | 2014-08-04 | 2016-02-11 | パナソニックIpマネジメント株式会社 | 光反射体用成形材料 |
CN106575696A (zh) * | 2014-08-04 | 2017-04-19 | 松下知识产权经营株式会社 | 光反射体用成形材料 |
CN106575696B (zh) * | 2014-08-04 | 2019-01-18 | 松下知识产权经营株式会社 | 光反射体用成形材料 |
US10196472B2 (en) | 2014-08-04 | 2019-02-05 | Panasonic Intellectual Property Management Co., Ltd. | Molding material for light-reflecting bodies |
JP2016152276A (ja) * | 2015-02-16 | 2016-08-22 | 日亜化学工業株式会社 | 発光装置 |
WO2016189726A1 (ja) * | 2015-05-28 | 2016-12-01 | フドー株式会社 | 光反射体材料、光反射体、及び照明器具 |
JP6099838B1 (ja) * | 2015-05-28 | 2017-03-22 | フドー株式会社 | 光反射体材料、光反射体、及び照明器具 |
JP2017066190A (ja) * | 2015-09-28 | 2017-04-06 | パナソニックIpマネジメント株式会社 | 光反射体用成形材料、光反射体及び発光装置 |
JP2017066191A (ja) * | 2015-09-28 | 2017-04-06 | パナソニックIpマネジメント株式会社 | 光反射体用成形材料、光反射体及び発光装置 |
Also Published As
Publication number | Publication date |
---|---|
EP2858133A4 (en) | 2016-04-13 |
KR20150023336A (ko) | 2015-03-05 |
TWI586753B (zh) | 2017-06-11 |
KR102012306B1 (ko) | 2019-08-20 |
TW201410781A (zh) | 2014-03-16 |
EP2858133A1 (en) | 2015-04-08 |
US20150138778A1 (en) | 2015-05-21 |
CN104471732A (zh) | 2015-03-25 |
CN104471732B (zh) | 2018-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2013183219A1 (ja) | Led反射板用結晶性不飽和ポリエステル樹脂組成物、前記組成物からなる粒状物、及び前記粒状物を成形してなるled反射板、表面実装型発光装置、並びに該発光装置を備えた、照明装置及び画像表示装置 | |
TWI386458B (zh) | Led反射器用不飽和聚酯樹脂組成物以及使用其的led反射器、led照明器具 | |
JP5153952B1 (ja) | Led反射板用結晶性不飽和ポリエステル樹脂組成物、前記組成物からなる粒状物、及び前記粒状物を成形してなるled反射板 | |
JP5355184B2 (ja) | 全芳香族サーモトロピック液晶ポリエステル樹脂組成物、成形体及びledリフレクター | |
TW201343743A (zh) | Led反射板用熱可塑性樹脂組成物 | |
JP6145926B2 (ja) | 光反射体用不飽和ポリエステル樹脂組成物、及び、発光素子用光反射体 | |
JP2014123672A (ja) | 表面実装型発光装置、並びに該発光装置を備えた、照明装置及び画像表示装置 | |
JP2014077071A (ja) | Led反射板用ラジカル重合性樹脂組成物、前記組成物からなる粒状物、前記粒状物を用いる成形方法、及びled反射板 | |
JP5308601B1 (ja) | Ledリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ledリフレクター、表面実装型led発光装置、led照明 | |
JP2020067603A (ja) | 光反射体用成形材料、光反射体及び発光装置 | |
JP5758355B2 (ja) | Led反射板用不飽和ポリエステル樹脂組成物、前記組成物からなる粒状物、及び前記粒状物を成形してなるled反射板 | |
JP2019104786A (ja) | 光反射体用成形材料、光反射体、ベース体及びその製造方法、並びに発光装置 | |
JP2020094208A (ja) | 電気電子部品用結晶性ラジカル重合性組成物、当該組成物を使用した電気電子部品用成形体、及び当該成形体の製造方法 | |
JP2015074772A (ja) | 光反射体用熱硬化性樹脂組成物、光反射体の製造方法、及び光反射体 | |
JP2015019011A (ja) | Ledリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ledリフレクター、表面実装型led発光装置、led照明 | |
JP7420142B2 (ja) | 熱硬化性樹脂組成物、及びその硬化物を含む電気電子部品 | |
JP6678323B2 (ja) | 不飽和ポリエステル、不飽和ポリエステル樹脂組成物、リフレクタ及び発光装置 | |
JP2021009907A (ja) | 光反射体用成形材料、光反射体及び発光装置 | |
JP2014205803A (ja) | 不飽和ポリエステル樹脂組成物およびそれを用いたスライス台 | |
JP2020154101A (ja) | 光反射体用成形材料、光反射体及び発光装置 | |
JP2020017607A (ja) | 車載用パワー半導体素子封止用結晶性ラジカル重合性組成物、当該組成物を使用した車載用パワー半導体素子封止体、及び当該封止体の製造方法 | |
JP2015003997A (ja) | Ledリフレクター構成材料、ledリフレクター、及びled照明器具 | |
WO2014109068A1 (ja) | Ledリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ledリフレクター、表面実装型led発光装置、led照明 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13800723 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14402264 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 20147033889 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2013800723 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2013800723 Country of ref document: EP |