WO2011071145A1 - 積層型セラミックコンデンサ - Google Patents

積層型セラミックコンデンサ Download PDF

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Publication number
WO2011071145A1
WO2011071145A1 PCT/JP2010/072217 JP2010072217W WO2011071145A1 WO 2011071145 A1 WO2011071145 A1 WO 2011071145A1 JP 2010072217 W JP2010072217 W JP 2010072217W WO 2011071145 A1 WO2011071145 A1 WO 2011071145A1
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WO
WIPO (PCT)
Prior art keywords
ceramic
sintered body
internal electrodes
ceramic sintered
width direction
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PCT/JP2010/072217
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English (en)
French (fr)
Japanese (ja)
Inventor
彰宏 塩田
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株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to KR1020127014433A priority Critical patent/KR101463125B1/ko
Priority to CN201080055549.0A priority patent/CN102640240B/zh
Priority to JP2011545262A priority patent/JP5362033B2/ja
Publication of WO2011071145A1 publication Critical patent/WO2011071145A1/ja
Priority to US13/491,627 priority patent/US9245688B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics

Definitions

  • the present invention relates to a multilayer ceramic capacitor.
  • the present invention includes a rectangular parallelepiped ceramic sintered body, and a plurality of first and second internal electrodes provided alternately inside the ceramic sintered body so as to face each other through a ceramic layer.
  • the present invention relates to a multilayer ceramic capacitor comprising:
  • Patent Document 1 various types of multilayer ceramic capacitors having a large capacity while being small and methods for manufacturing the same are proposed.
  • One effective method for increasing the capacity of a multilayer ceramic capacitor is to reduce the thickness of the ceramic layer interposed between the electrodes.
  • the grain size must be reduced.
  • the ceramic layer is thin, dielectric breakdown is likely to occur, and there is a problem that the reliability of the ceramic capacitor is lowered.
  • the present invention has been made in view of such a point, and an object thereof is to provide a multilayer ceramic capacitor having a large capacity and high reliability.
  • the multilayer ceramic capacitor according to the present invention includes a ceramic sintered body and first and second internal electrodes.
  • the ceramic sintered body includes a plurality of laminated ceramic layers.
  • the first and second internal electrodes are alternately provided inside the ceramic sintered body so as to face each other in the stacking direction of the ceramic layers via the ceramic layers.
  • the ceramic sintered body includes a first portion and a second portion. The first portion is located in a region where the first and second internal electrodes are opposed to each other.
  • the second part is located outside the first part. In the first part, the ceramic layer is oriented in the stacking direction.
  • the ratio (Ic / Ia) of the c-axis peak intensity (Ic) to the a-axis peak intensity (Ia) by XRD analysis (X-ray diffraction analysis) of the ceramic layer is 2 or more.
  • the ceramic sintered body includes first and second main surfaces extending along a length direction and a width direction perpendicular to the length direction. , A thickness direction perpendicular to both the length direction and the width direction, first and second side surfaces extending along the length direction, and first and first sides extending along the width direction and the thickness direction.
  • a rectangular parallelepiped ceramic sintered body having two end faces, wherein the first portion is a facing portion where the first and second internal electrodes face each other, and the second portion is the It is located on both sides of the facing portion in the length direction, the non-facing portion where the first and second internal electrodes are not facing, and the both sides of the facing portion in the width direction, Side gear in which neither of the first and second internal electrodes is provided And a flop part.
  • the ratio of the area occupied by the first portion in the ceramic sintered body when viewed from the stacking direction is 80% or more.
  • the length of each side gap portion in the width direction is set to 45 ⁇ m or less. In still another specific aspect of the multilayer ceramic capacitor according to the present invention, the length of each non-opposing portion in the length direction is 57.5 ⁇ m or less.
  • the ratio (Ic / Ia) of the c-axis peak intensity (Ic) to the a-axis peak intensity (Ia) by XRD analysis of the ceramic layer is 2 or more. For this reason, the degree of polarization of the ceramic layer in the first portion can be increased. Therefore, the capacity can be increased without making the ceramic layer too thin. Therefore, it is possible to provide a multilayer ceramic capacitor having a large capacity and high reliability.
  • FIG. 1 is a schematic perspective view of a ceramic capacitor according to a first embodiment of the present invention.
  • FIG. 2 is a sectional view taken along line II-II in FIG. 3 is a cross-sectional view taken along line III-III in FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.
  • FIG. 5 is a partially enlarged sectional view of a section taken along line VV in FIG.
  • FIG. 6 is a schematic plan view of a ceramic green sheet on which a conductor pattern is printed.
  • FIG. 7 is a schematic perspective view of a ceramic member.
  • FIG. 8 is a schematic perspective view showing a process of forming a ceramic layer on both side surfaces.
  • FIG. 9 is a schematic perspective view of the multilayer ceramic capacitor according to the second embodiment of the present invention.
  • FIG. 10 is a schematic cross-sectional view taken along line II-II in FIG. 11 is a schematic cross-sectional view taken along line III-III in FIG. 12 is a schematic cross-sectional view taken along line IV-IV in FIG.
  • FIG. 13 is a graph showing the peak intensity in the XRD analysis of the multilayer ceramic capacitors according to Samples 1 and 8.
  • FIG. 1 is a schematic perspective view of a ceramic capacitor according to a first embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG.
  • FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG.
  • This multilayer ceramic capacitor 2 includes a rectangular parallelepiped ceramic sintered body 10.
  • the ceramic sintered body 10 includes first and second main surfaces 10a and 10b, first and second side surfaces 10c and 10d, and first and second end surfaces 10e and 10f.
  • the first and second 10a and 10b extend along the length direction L and the width direction W.
  • the first and second side surfaces 10c and 10d extend along the length direction L and the thickness direction T.
  • the first and second end faces 10e and 10f extend along the width direction W and the thickness direction T.
  • the “cuboid” includes those in which at least a part of a corner portion or a ridge line portion is chamfered or rounded.
  • the dimensions of the ceramic sintered body 10 are not particularly limited.
  • the length of the ceramic sintered body 10 in the length direction L can be set to, for example, about 0.4 mm to 3.2 mm.
  • the length of the ceramic sintered body 10 in the width direction W can be set to, for example, about 0.2 mm to 2.6 mm.
  • the length in the thickness direction T of the ceramic sintered body 10 can be set to, for example, about 0.2 mm to 2.6 mm.
  • the ceramic sintered body 10 includes a plurality of laminated ceramic layers 15 (see FIGS. 2 and 4).
  • the ceramic layer 15 is made of a ceramic material containing ceramic.
  • the ceramic material may contain firing aids such as Si, Mg, B and glass components in addition to ceramic.
  • the ceramic layer 15 is formed of a dielectric ceramic.
  • a dielectric ceramic a ceramic having a perovskite structure crystal lattice mainly composed of barium titanate is used.
  • subcomponents such as a Mn compound, a Mg compound, a Si compound, a Co compound, a Ni compound, and a rare earth compound may be appropriately added to the dielectric ceramic.
  • a plurality of first and second internal electrodes 11 and 12 are provided inside the ceramic sintered body 10.
  • Each of the first and second internal electrodes 11 and 12 is provided in parallel to the first and second main surfaces 10a and 10b.
  • the planar shape of each of the first and second internal electrodes 11 and 12 is a rectangle.
  • the plurality of first and second internal electrodes 11 and 12 are alternately arranged so as to face each other in the thickness direction T. In other words, the first and second internal electrodes 11, 12 are arranged in the thickness direction T so as to face each other through the ceramic layers 15 provided on the ceramic sintered body 10.
  • the layer thickness of the ceramic layer 15 is preferably in the range of 0.3 ⁇ m to 2 ⁇ m, for example.
  • the thickness of the first and second internal electrodes 11 and 12 is preferably in the range of 0.2 ⁇ m to 1 ⁇ m, for example.
  • the layer thickness of the ceramic layer 15 is preferably in the range of 1 to 3 times the thickness of the first and second internal electrodes 11 and 12.
  • the first inner electrode 11 is exposed at the first end face 10e, while the second end face 10f, the first and second main faces 10a, 10b, and the first and second side faces 10c, 10d Not exposed.
  • the second internal electrode 12 is exposed at the second end face 10f, while the first end face 10e, the first and second main faces 10a and 10b, and the first and second side faces 10c and 10d. Is not exposed.
  • the first external electrode 13 is provided on the first end face 10e.
  • the first external electrode 13 is connected to the first internal electrode 11.
  • a second external electrode 14 is provided on the second end face 10f.
  • the second external electrode 14 is connected to the second internal electrode 12.
  • the material for forming the first and second internal electrodes 11 and 12 and the first and second external electrodes 13 and 14 is not particularly limited as long as it is a conductive material.
  • the first and second inner electrodes 11 and 12 and the first and second outer electrodes 13 and 14 are made of, for example, metals such as Ag, Au, Pt, Pd, Ni, Cr, Al, and Cu, and their metals. It can form with the alloy containing 1 or more of these.
  • the first and second internal electrodes 11 and 12 and the first and second external electrodes 13 and 14 may be formed of a laminate of a plurality of conductive films.
  • the ceramic sintered body 10 includes first and second outer layer portions 10A and 10B, first and second side gap portions 10C and 10D, and an inner layer portion 10E. Is provided.
  • the inner layer portion 10E is a portion excluding the first and second outer layer portions 10A and 10B and the first and second side gap portions 10C and 10D of the ceramic sintered body 10. Specifically, in this embodiment, the ceramic sintered body 10 is provided in a region excluding both ends in the thickness direction T and both ends in the width direction W.
  • the inner layer portion 10E includes only a portion where the first and second internal electrodes 11, 12 face each other in the thickness direction T, and the first or second internal electrodes 11, 12 when viewed from the thickness direction T. Part provided.
  • the ratio (Ic) of the c-axis peak intensity (Ic) to the a-axis peak intensity (Ia) by X-ray analysis (XRD analysis) in the stacking direction in the facing portion constituting the first portion (Ic / Ia) is 2 or more. That is, in the first part for obtaining the electrostatic capacitance, it is shown that there is a large proportion that the c-axis arrangement of the ceramic crystal lattice is aligned in parallel with the stacking direction. For this reason, the degree of polarization of the ceramic layer 15 in the facing portion (first portion) can be increased. Therefore, the capacity of the multilayer ceramic capacitor 2 can be increased without making the ceramic layer 15 too thin.
  • the multilayer ceramic capacitor 2 having a large capacity and high reliability can be provided.
  • the peak intensity of the a-axis by XRD analysis in the stacking direction of the ceramic layer (at the opposing portion constituting the first portion) is preferably 2 or more.
  • the ratio (Ic / Ia) is adjusted by adjusting the ratio of the area occupied by the facing portion (first portion) in the ceramic sintered body 10 when viewed from the width direction W (stacking direction). be able to. Specifically, as described later, by reducing the side gap portions 10C and 10D and increasing the ratio of the area occupied by the facing portion 10E1 (first portion) in the ceramic sintered body 10, the ratio (Ic / Ia) can be increased. This is because the difference in shrinkage along the thickness direction T between the side gap portions 10C and 10D and the facing portion is reduced during firing due to the reduced width of the side gap portions 10C and 10D, and the thickness applied to the facing portion. This is considered to be because the compressive stress in the direction T becomes small.
  • the ratio (Ic / Ia) can be increased by retrofitting the side gap portions 10C and 10D. This is because the difference in shrinkage amount along the thickness direction T between the side gap portion and the facing portion is reduced during firing because no step occurs between the facing portion and the side gap portion in the width direction W, and the facing This is presumably because the compressive stress in the thickness direction T applied to the part becomes small.
  • the ratio (Ic / Ia) is set to 2 or more, for example, the ratio of the area occupied by the facing portion (first portion) in the ceramic sintered body 10 when viewed from the stacking direction is 80% or more. It is preferable.
  • the ceramic green sheet 20 shown in FIG. 6 is formed.
  • the method for forming the ceramic green sheet 20 is not particularly limited.
  • the ceramic green sheet 20 can be formed by, for example, a die coater, a gravure coater, a micro gravure coater, or the like.
  • a conductor pattern 21 is formed on the ceramic green sheet 20.
  • This conductor pattern 21 is for forming the first and second internal electrodes 11, 12.
  • the method for forming the conductor pattern 21 is not particularly limited.
  • the conductor pattern 21 can be formed by, for example, a screen printing method, an ink jet method, a gravure printing method, or the like.
  • a laminate is formed by laminating a plurality of ceramic green sheets 20 on which the conductor pattern 21 is formed. Specifically, first, after laminating a plurality of ceramic green sheets 20 on which the conductor pattern 21 is not formed, the ceramic green sheet 20 on which the conductor pattern 21 is formed is placed on one side in the x direction. A plurality of sheets are stacked alternately shifted to the other side. Further, a plurality of ceramic green sheets 20 on which the conductor pattern 21 is not formed are laminated thereon to complete the laminate.
  • the ceramic green sheet 20 which is laminated at the beginning and at the end and on which the conductor pattern 21 is not formed is for forming the first and second outer layer portions 10A and 10B.
  • a plurality of rectangular parallelepiped ceramic members 23 shown in FIG. 7 are formed by cutting the laminate along a virtual cut line L shown in FIG. Note that the laminated body can be cut by dicing or pressing. Moreover, you may cut
  • ceramic layers 24 and 25 are formed on the side surfaces 23e and 23f of the ceramic member 23 so as to cover the side surfaces 23e and 23f.
  • the ceramic layers 24 and 25 are for forming the first and second side gap portions 10C and 10D.
  • the formation method of the ceramic layers 24 and 25 is not particularly limited, and can be performed by a printing method such as a screen printing method, a coating method such as an inkjet method or a gravure coating method, a spraying method, or the like.
  • the ceramic member 23 on which the ceramic layers 24 and 25 are formed is sintered. Thereby, the ceramic sintered body 10 is completed.
  • first and second external electrodes 13 and 14 are formed to complete the multilayer ceramic capacitor 2.
  • the formation method of the 1st and 2nd external electrodes 13 and 14 is not specifically limited.
  • the first and second external electrodes 13 and 14 may be formed, for example, by baking after applying a conductive paste. In that case, a conductive paste may be applied before firing the ceramic member 23, and the first and second external electrodes 13, 14 may be formed simultaneously with firing.
  • FIG. 9 is a schematic perspective view showing a multilayer ceramic capacitor according to a second embodiment of the present invention. 10 is a cross-sectional view taken along line II-II in FIG. 9, FIG. 11 is a cross-sectional view taken along line III-III in FIG. 9, and FIG. 12 is taken along line IV-V in FIG. It is sectional drawing which follows.
  • the multilayer ceramic capacitor 101 of the present embodiment includes a cuboid ceramic sintered body 10.
  • the ceramic sintered body 10 includes first and second main surfaces 10a and 10b, first and second side surfaces 10c and 10d, and first and second end surfaces 10e and 10f.
  • the first and second main surfaces 10a and 10b extend along the length direction L and the width direction W.
  • the first and second side surfaces 10c and 10d extend along the length direction L and the thickness direction T.
  • the first and second end faces 10e, 10f extend along the width direction W and the thickness direction T.
  • the dimensions of the ceramic sintered body 10 are not particularly limited.
  • the length of the ceramic sintered body 10 in the length direction L can be set to, for example, about 0.4 mm to 3.2 mm.
  • the length of the ceramic sintered body 10 in the width direction W can be set to, for example, about 0.2 mm to 2.6 mm.
  • the length in the thickness direction T of the ceramic sintered body 10 can be set to, for example, about 0.2 mm to 2.6 mm.
  • the ceramic sintered body 10 includes a plurality of laminated ceramic layers 15 (see FIGS. 10 and 12).
  • the ceramic layer 15 is made of a ceramic composition containing ceramic.
  • the ceramic composition may contain a firing aid such as Si, Mg, B, or a glass component.
  • dielectric ceramic mainly contained in the ceramic composition include, for example, BaTiO3, CaTiO3, SrTiO3, CaZrO3, and the like.
  • subcomponents such as a Mn compound, a Mg compound, a Co compound, a Ni compound, and a rare earth compound may be appropriately added to the dielectric ceramic.
  • a plurality of first and second internal electrodes 11, 12 are provided inside the ceramic sintered body 10.
  • Each of the first and second internal electrodes 11 and 12 is provided in parallel to the first and second side surfaces 10c and 10d.
  • the planar shape of each of the first and second internal electrodes 11 and 12 is a rectangle.
  • the plurality of first and second internal electrodes 11 and 12 are alternately arranged so as to face each other with the ceramic layer 15 in the width direction W (stacking direction).
  • the thickness of the ceramic layer 15 along the width direction W is not particularly limited.
  • the thickness of the ceramic layer 15 along the width direction W is preferably in the range of 0.3 ⁇ m to 0.7 ⁇ m, for example. If the thickness of the ceramic layer 15 along the width direction W is smaller than 0.3 ⁇ m, dielectric breakdown may easily occur. Therefore, the reliability of the multilayer ceramic capacitor 101 may be reduced.
  • the first internal electrode 11 is exposed to the first main surface 10a, while the second main surface 10b, the first and second side surfaces 10c and 10d, and the first and second end surfaces 10e and 10f are exposed to the first main surface 10a. Is not exposed.
  • the second internal electrode 12 is exposed to the second main surface 10b, while the first main surface 10a, the first and second side surfaces 10c and 10d, and the first and second end surfaces 10e, It is not exposed at 10f.
  • the thickness in the width direction W of each of the first and second internal electrodes 11 and 12 is not particularly limited.
  • the thickness in the width direction W of each of the first and second internal electrodes 11 and 12 can be about 0.2 ⁇ m to 0.6 ⁇ m.
  • the first external electrode 13 is provided on the first main surface 10a.
  • the first external electrode 13 is connected to the first internal electrode 11.
  • a second external electrode 14 is provided on the second main surface 10b.
  • the second external electrode 14 is connected to the second internal electrode 12.
  • the material for forming the first and second internal electrodes 11 and 12 and the first and second external electrodes 13 and 14 is not particularly limited as long as it is a conductive material.
  • the first and second internal electrodes 11 and 12 and the first and second external electrodes 13 and 14 are made of, for example, metals such as Ag, Au, Pt, Pd, Ni, Cr, and Cu, It can form with the alloy containing 1 or more types of these.
  • the first and second internal electrodes 11 and 12 and the first and second external electrodes 13 and 14 may be formed of a laminate of a plurality of conductive films.
  • the ceramic sintered body 10 includes first and second outer layer portions 10A and 10B, first and second side gap portions 10C and 10D, and an inner layer portion 10E. Is provided.
  • the inner layer portion 10E is located in a region of the ceramic sintered body 10 where at least one of the first and second inner electrodes 11, 12 is provided when viewed from the width direction W (stacking direction). Part.
  • the inner layer portion 10E includes a facing portion 10E1 and a non-facing portion 10E2.
  • the facing portion 10E1 is a portion located in a region where the first and second internal electrodes 11 and 12 face each other in the width direction W (stacking direction). For this reason, in this embodiment, the opposing part 10E1 comprises the 1st part.
  • the ceramic sintered body 10 a portion excluding the facing portion 10E1, that is, the non-facing portion 10E2, the first and second outer layer portions 10A and 10B, and the first and second side gap portions 10C and 10D.
  • the second portion 10F is configured.
  • the second portion 10F is located outside the facing portion 10E1 that constitutes the first portion.
  • the non-facing portion 10E2 is a portion where the first or second internal electrodes 11 and 12 are provided when viewed from the width direction W (stacking direction).
  • the non-facing portion 10E2 is located at both ends of the ceramic sintered body 10 in the thickness direction T (second direction).
  • the first and second outer layer portions 10A and 10B and the first and second side gap portions 10C and 10D are portions where neither the first nor second inner electrodes 11 and 12 are provided.
  • the first and second outer layer portions 10 ⁇ / b> A and 10 ⁇ / b> B are located at both end portions in the width direction W of the ceramic sintered body 10.
  • the 1st and 2nd side gap parts 10C and 10D are located in the both ends in the length direction L (1st direction) of the ceramic sintered compact 10. As shown in FIG.
  • the ratio (Ic / Ia) of the peak intensity (Ic) to the peak intensity (Ia) by XRD analysis of the ceramic layer in the ceramic sintered body is 2 or more.
  • the multilayer ceramic capacitor 101 of the present embodiment can also be manufactured by the same method as the multilayer ceramic capacitor 2 of the first embodiment.
  • a multilayer body in which the first and second side gap portions 10C and 10D described above are not formed is prepared, and the first and second side gap portions 10C, A method of forming a ceramic layer that forms 10D is used.
  • the sintered ceramic body 10 can be obtained by firing the ceramic laminate thus obtained. Thereby, the dimension in the said 1st direction of the side gap parts 10C and 10D can be made small.
  • the lengths in the first direction after firing of the side gap portions 10C and 10D are each 45 ⁇ m or less. Also in the present embodiment, it is desirable that the length of the non-opposing portion in the second direction is 57.5 ⁇ m or less. Thereby, the facing area of the first and second internal electrodes in the facing portion can be increased.
  • the first and second inner electrodes 11, 12 are parallel to the first and second side surfaces 10c, 10d, and the first inner electrode 11 is drawn out to the first main surface 10a.
  • the example in which the second internal electrode 12 is drawn out to the second main surface 10b has been described.
  • the arrangement of the first and second internal electrodes is not particularly limited as long as the gap layer is formed in the ceramic sintered body.
  • first and second internal electrodes may be formed in parallel to the first and second main surfaces or the first and second end surfaces.
  • the multilayer ceramic capacitor of the first embodiment shown in FIG. 1 was manufactured with the following design parameters.
  • Ceramic layer 15 Composition of ceramic layer 15: BaTiO 3 Layer thickness of ceramic layer 15: 0.8 ⁇ m Dimension of ceramic sintered body: 1.0mm x 0.5mm x 0.5mm (Dimensional tolerance ⁇ 0.1mm) Ceramic layer thickness: 0.8 ⁇ m Outer layer (one side) thickness: 36 ⁇ m Internal electrode material: Ni Internal electrode thickness: 0.5 ⁇ m Number of internal electrode layers: 380 layers Firing temperature: 1200 ° C. Material of external electrode: Cu (Ni, Sn plating formed thereon) External electrode baking temperature: 800 ° C
  • Multilayer ceramic capacitors 2 of Samples 1 to 8 were manufactured by varying the facing area ratio, which is the ratio of the area occupied by the facing portion in the sintered body 10, as shown in Table 1 below. Samples 1 to 4 were produced by a conventional method without retrofitting the side gap. Samples 5 to 8 were produced by a method in which side gap portions were retrofitted.
  • the peak intensity by XRD analysis was measured at the center in the length direction L and the end in the width direction W of the facing portion.
  • the XRD apparatus used is a product number: D8-Discover with GADDS manufactured by Bruker AXS.
  • each multilayer ceramic capacitor was measured by applying a voltage of 1 kHz and a voltage of 0.5 Vrms using an LCR meter (manufactured by Hewlett-Packard Company, product number: HP4284A). The relative dielectric constant was calculated from the obtained capacitance. The results are shown in Table 1 below.
  • the XRD spectra of Sample 1 and Sample 8 in Table 1 are shown in FIG. 13 as a representative example. Note that the XRD spectrum in FIG. 13 is a result of measurement at a portion corresponding to the portion indicated by the broken line X in FIG. 3 (the center in the length direction L of the facing portion and the end portion in the width direction W).
  • Multilayer ceramic capacitor 10 ... Ceramic sintered body 10A, 10B ... Outer layer part 10C, 10D ... Side gap part 10E ... Inner layer part 10E1 ... Opposing part 10E2 ... Non-opposing part 10F ... Second part 10a ... First 10b ... second main surface 10c ... first side surface 10d ... second side surface 10e ... first end surface 10f ... second end surface 11 ... first internal electrode 12 ... second internal electrode 13 ... 1st external electrode 14 ... 2nd external electrode 15 ... Ceramic layer 20 ... Ceramic green sheet 21 ... Conductive pattern 22 ... Laminate 23 ... Ceramic member 23e, 23f ... End surface 24, 25 ... Ceramic layer of ceramic member

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
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PCT/JP2010/072217 2009-12-11 2010-12-10 積層型セラミックコンデンサ WO2011071145A1 (ja)

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Application Number Priority Date Filing Date Title
KR1020127014433A KR101463125B1 (ko) 2009-12-11 2010-12-10 적층형 세라믹 콘덴서
CN201080055549.0A CN102640240B (zh) 2009-12-11 2010-12-10 层叠型陶瓷电容器
JP2011545262A JP5362033B2 (ja) 2009-12-11 2010-12-10 積層型セラミックコンデンサ
US13/491,627 US9245688B2 (en) 2009-12-11 2012-06-08 Monolithic ceramic capacitor

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JP2009281685 2009-12-11
JP2009-281685 2009-12-11

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US20120229950A1 (en) * 2011-03-09 2012-09-13 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and method of manufacturing the same
CN102842426A (zh) * 2011-06-23 2012-12-26 三星电机株式会社 多层陶瓷电容器
JP2014045008A (ja) * 2012-08-24 2014-03-13 Dexerials Corp 容量素子および共振回路
JP2019140224A (ja) * 2018-02-09 2019-08-22 太陽誘電株式会社 積層セラミック電子部品及びその製造方法
US11961673B2 (en) 2019-07-24 2024-04-16 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor

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