WO2010016223A1 - 電子部品の圧縮成形方法及び金型装置 - Google Patents

電子部品の圧縮成形方法及び金型装置 Download PDF

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Publication number
WO2010016223A1
WO2010016223A1 PCT/JP2009/003683 JP2009003683W WO2010016223A1 WO 2010016223 A1 WO2010016223 A1 WO 2010016223A1 JP 2009003683 W JP2009003683 W JP 2009003683W WO 2010016223 A1 WO2010016223 A1 WO 2010016223A1
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Prior art keywords
resin
plate
resin material
cavity
release film
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PCT/JP2009/003683
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English (en)
French (fr)
Japanese (ja)
Inventor
浦上浩
高田直毅
大槻修
Original Assignee
Ｔｏｗａ株式会社
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Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020117005300A priority Critical patent/KR101430797B1/ko
Priority to KR1020137028418A priority patent/KR101523164B1/ko
Priority to CN200980128894.XA priority patent/CN102105282B/zh
Priority to KR1020137028417A priority patent/KR101523163B1/ko
Publication of WO2010016223A1 publication Critical patent/WO2010016223A1/ja
Priority to PH12014500725A priority patent/PH12014500725A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/345—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material
    • B29C2043/3461—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material for foils, sheets, gobs, e.g. floated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/251—Particles, powder or granules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a method of compression molding an electronic component such as an IC (Integrated Circuit) and a mold apparatus used therefor.
  • a required number of electronic components 83 mounted on a substrate 82 are granulated using a compression molding die 81 for electronic components mounted on an electronic component compression molding device.
  • compression molding resin sealing molding
  • resin material granular resin
  • a release film 88 is coated in a lower mold cavity 87 provided in a compression molding die 81 (an upper mold 85 and a lower mold 86) for electronic parts, and the lower mold cavity 87 is coated with the release film 88.
  • the granular resin 84 is supplied and melted by heating, and then the above-described mold 81 (85/86) is clamped and the required number of electronic components mounted on the substrate 82 to the molten resin in the lower mold cavity 87
  • immersing 83 a required number of electronic components 83 are compression-molded (collective single-sided molding) in a resin molded body corresponding to the shape of the lower mold cavity 87.
  • the resin of the lower mold cavity 87 can be pressed by the cavity bottom member 93 for resin pressing.
  • a resin material supply mechanism 89 (lower shutter 90 and supply unit 91) is used to supply the granular resin 84 into the lower mold cavity 87 described above. That is, a predetermined amount of granular resin 84 is put into the above-described resin material supply mechanism 89 (supply unit 91), and this resin material supply mechanism 89 enters between the upper and lower molds 85 and 86, and then the resin material. By pulling and opening the lower shutter 90 of the supply mechanism 89, the granular resin 84 is dropped from the supply unit 91 into the lower mold cavity 87 and supplied.
  • the problem to be solved by the present invention is to efficiently supply resin into the mold cavity when resin is supplied into the mold cavity, and to efficiently improve the reliability of the amount of resin supplied into the mold cavity. It is to let you.
  • a compression molding method of an electronic component supplies a required amount of a resin material into a mold cavity covered with a release film, and the resin in the cavity described above.
  • An electronic component compression molding method in which the electronic component is compression molded in a resin molded body corresponding to the shape of the cavity in the cavity by immersing the electronic component in the cavity, and corresponds to the mold cavity described above
  • a step of covering the cavity surface with the release film, and a step of supplying a resin material from the resin housing portion into the mold cavity when the release film is coated on the cavity surface is characterized by including.
  • the compression molding method of the electronic component for solving the technical problem described above has been described above when forming the resin-dispersed plate in which the thickness of the resin material in the resin container is made uniform and flattened. While the required amount of resin material is being supplied to the above-described resin container of the plate before resin supply, the resin material in the resin container is uniformly distributed by moving the plate before resin supply in the X direction or the Y direction. And a step of flattening the film by forming it to a proper thickness.
  • the compression molding method for an electronic component according to the present invention for solving the technical problem described above is for forming a resin-dispersed plate that is flattened by making the thickness of the resin material in the resin container uniform.
  • the method includes a step of flattening the resin material in the resin housing portion to a required uniform thickness by vibrating the plate before resin supply.
  • the resin material is a granular resin material or a powder resin material.
  • an electronic component compression molding die apparatus for solving the above technical problem is an electronic component compression molding die comprising an upper die and a lower die arranged opposite to the upper die.
  • a mold apparatus for compression molding of an electronic component comprising: a cavity bottom member for pressing the resin, and an inloader for supplying a substrate on which the resin material and the electronic component are mounted to the mold described above.
  • a resin accommodating plate that is mounted on the inloader and has an opening, a release film that covers the lower surface side of the resin accommodating plate and forms the opening in the resin accommodating portion, and the resin accommodating portion described above.
  • the mold apparatus for compression molding of the electronic component according to the present invention for solving the technical problem described above is provided with the above-described resin container in the resin material distribution means for supplying the resin material to the resin container.
  • Resin material supplying means for supplying resin material to the resin, resin material measuring means for measuring the resin material supplied to the resin housing portion, and resin for flattening the resin material supplied to the resin housing portion A material flattening means is provided.
  • the flattening means moves the resin accommodating plate in the X direction or the Y direction. It is a horizontal movement flattening mechanism.
  • the resin material described above is a granular resin material or a powder resin material.
  • the present invention there is an excellent effect that the resin can be efficiently supplied into the mold cavity when the resin is supplied into the mold cavity. Further, according to the present invention, there is an excellent effect that the reliability of the amount of resin supplied into the mold cavity can be improved efficiently when the resin is supplied into the mold cavity.
  • FIG. 1 is a schematic perspective view schematically showing a resin-accommodating plate and a resin material distribution mechanism for explaining an electronic component compression molding method according to the present invention, in which a resin material is distributed to the plate described above.
  • Is shown. 2 (1) and 2 (2) are schematic perspective views schematically showing a resin-accommodating plate for explaining the compression molding method of the electronic component according to the present invention
  • FIG. 2 (1) is FIG. 2 shows a state in which the resin material is distributed to the plate.
  • FIG. 2B shows a resin-dispersed plate in which the resin material is distributed by the resin material distribution mechanism shown in FIG.
  • FIG. 3 is a schematic longitudinal sectional view schematically showing an electronic component compression molding apparatus for explaining an electronic component compression molding method according to the present invention.
  • FIG. 1 is a schematic perspective view schematically showing a resin-accommodating plate and a resin material distribution mechanism for explaining an electronic component compression molding method according to the present invention, in which a resin material is distributed to the plate described above.
  • FIG. 4 is a schematic longitudinal sectional view schematically showing a mold apparatus for compression molding of electronic parts corresponding to FIG. 3, and the mold is released in a lower mold cavity provided in the above-described mold apparatus (mold). A state is shown in which the resin material is dropped and supplied from the resin-dispersed plate into the cavity coated with the release film by adsorbing the film.
  • FIG. 5 is a schematic longitudinal sectional view schematically showing a mold apparatus (mold) for compression molding of an electronic component corresponding to FIG. 3 and shows a mold clamping state of the above-described mold.
  • FIG. 6 is a schematic longitudinal sectional view schematically showing a mold apparatus for compression molding of electronic parts for explaining a conventional compression molding method for electronic parts.
  • a release film is adsorbed and coated on the lower surface of the resin containing plate to close the plate lower opening of the opening, thereby forming the opening in the resin containing plate in the resin containing portion.
  • a plate before resin accommodation having a resin accommodation portion can be obtained.
  • the resin material distribution means a required amount of granular resin material (granular resin) is supplied from the upper opening of the plate to the resin accommodating portion of the plate before resin supply, and the resin material flattening means By forming and flattening the required amount of granular resin to a uniform thickness, it is possible to form a resin-dispersed plate in which the required amount of flattened granular resin is stored in the resin storage portion.
  • the substrate having the resin dispersed plate attached to the lower side of the inloader and the required number of electronic components mounted on the upper side of the inloader is placed with the electronic component mounting surface facing downward.
  • the inloader is inserted between the upper and lower molds in the compression molding mold for electronic parts. At this time, the substrate on which the electronic component is mounted on the upper substrate setting portion is supplied and set with the electronic component mounting surface facing downward.
  • the resin-dispersed plate can be placed on the lower mold surface by lowering the inloader. At this time, the plate lower opening of the resin-dispersed plate matches the position of the opening of the cavity through the release film. At this time, the required amount of granular resin is placed on the release film in a flattened state in the resin container of the resin-dispersed plate. Next, the adsorption of the release film by the resin-dispersed plate is released. Further, the release film is locked to the lower mold surface by forcibly sucking and discharging air from the lower mold surface and the cavity, and the release film is drawn into the cavity to release the release film. Can be coated in the cavity.
  • a required amount of granular resin can be supplied in a flattened state in a cavity coated with a mold film. Therefore, according to the present invention, the resin can be efficiently supplied into the mold cavity when the resin is supplied into the mold cavity.
  • a required amount of granular resin can be supplied in a flattened state in the lower mold cavity covered with the release film, it is supplied into the mold cavity when the resin is supplied into the mold cavity.
  • the reliability of the amount of resin to be improved can be improved efficiently. For this reason, the granular resin (having a uniform thickness) in a state of being flattened in the cavity covered with the release film can be uniformly heated and melted. Therefore, it is possible to efficiently prevent a part of the resin from being hardened in the cavity and generating mako.
  • an electronic component compression molding die apparatus equipped with an electronic component compression molding die (die assembly) 1 used in the electronic component compression molding method shown in the embodiment will be described.
  • an electronic component compression molding die apparatus includes an electronic component compression molding die (die assembly) 1 and a predetermined amount of granular resin material (in the above-described mold 1).
  • An unloader (not shown) for taking out the finished substrate (resin molded body 12 to be described later) and a mold clamping mechanism (not shown) for clamping the mold 1 are provided. Accordingly, by supplying the required amount of the granular resin 6 and the substrate 8 to the mold 1 with the inloader 9 and compression molding, a molded substrate (resin molded body 12) can be obtained with the mold 1. The molded substrate can be taken out from the mold 1 by the unloader.
  • the mold apparatus shown in the embodiment is provided with a resin material distribution means 31 for supplying and distributing a required amount of the granular resin 6 to the resin-dispersed plate 25 engaged by the inloader 9.
  • the resin material distribution means 31 supplies and distributes the required amount of granular resin 6 to the pre-resin supply plate 21a to form a resin dispersed plate 25 (required amount of flattened granular resin 6) to be described later. It is configured to be able to.
  • a compression molding die (die assembly) 1 for an electronic component includes a fixed upper die 2 and a movable lower die 3 disposed to face the upper die 2.
  • the mold surface of the upper mold 2 is provided with a substrate setting section 4 for supplying and setting a substrate 8 on which a required number of electronic components 7 are mounted with the electronic component mounting surface side facing downward.
  • the mold surface of the lower mold 3 is configured such that a cavity 5 for compression molding is provided upward (in the direction of the upper mold 2) with a cavity opening 10 opened. Accordingly, by clamping the upper and lower molds 1 (2 3), the electronic component 7 mounted on the substrate 8 supplied and set to the upper mold substrate setting section 4 can be fitted and set in the lower mold cavity 5. It is configured as follows.
  • the upper and lower molds 1 (2, 3) are provided with heating means (not shown) for heating the upper and lower molds 1 (2, 3) to a required temperature. Therefore, the required amount of granular resin 6 supplied into the lower mold cavity 5 by the inloader 9 (resin-dispersed plate 25 described later) can be heated and melted by the heating means of the mold 1.
  • a cavity bottom member 38 for resin pressing that presses the resin 6 in the cavity 5 with a required pressing force is provided on the bottom surface of the cavity 5. Therefore, by pressing the resin 6 in the lower mold cavity 5 with the cavity bottom member 38, the electronic component 7 mounted on the substrate 8 can be compression molded (resin sealing molding) in the lower mold cavity 5. It is configured.
  • the lower mold 3 is configured such that the lower mold surface and the surface of the cavity 5 are provided with a release film suction mechanism for adsorbing the release film 11.
  • the suction mechanism includes, for example, a suction hole, a vacuum path, and a vacuuming mechanism (vacuum pump).
  • the suction hole is provided inside the lower mold 3 so as to reach the mold surface of the lower mold 3 and the surface of the cavity 5. It is provided and configured. Accordingly, the release film 11 can be covered and fixed along the shape of the mold surface of the lower mold 3 and the surface of the cavity 5 by operating the suction mechanism and forcibly sucking and discharging air. Has been.
  • the mold release film 11 is first locked on the mold surface of the lower mold 3, and then In addition, the release film 11 can be covered and fixed along the shape of the lower mold cavity 5 by sucking and drawing the release film 11 into the lower mold cavity 5.
  • the release film 11 when the release film 11 is drawn into the lower mold cavity 5 to be coated, the required amount placed on the release film 11 in the resin-dispersed plate 25 described later at the same time.
  • the granule resin 6 (which is flattened as will be described later) is pulled into the lower mold cavity 5 together with the release film 11 and dropped, so that it is required in the cavity 5 covered with the release film 11.
  • An amount of the granular resin 6 can be supplied (in a flattened state as will be described later). Therefore, after supplying a required amount of the granule resin 6 into the cavity 5 coated with the release film 11, first, the upper and lower molds 1 (2 and 3) are clamped to form the cavity coated with the release film 11.
  • the electronic component 7 mounted on the substrate 8 supplied and set to the upper mold base plate setting unit 4 is immersed in the resin 6 heated and melted, and then the cavity bottom member 38 is interposed through the release film 11.
  • the resin (6) in the cavity 5 the electronic component 7 mounted on the substrate 8 is compression molded in the resin molded body 12 corresponding to the shape of the lower mold cavity 5 in the lower mold cavity 5 (resin sealing It is configured so that it can be molded).
  • the resin accommodating plate 21 is configured by being provided with an opening portion 37 penetrating in the vertical direction and a plate peripheral portion 24 (outer frame portion) formed around the opening portion 37.
  • the opening 37 includes a plate upper opening 39 provided on the upper side of the plate and a plate lower opening 23 provided on the lower side of the plate.
  • the lower surface of the peripheral edge 24 of the plate is provided with a release film suction fixing mechanism for sucking and fixing the release film 11.
  • the plate lower opening 23 (opening 37) can be closed by the release film 11. It is configured. That is, by closing the plate lower opening 23 of the opening 37 with the release film 11, the resin storage portion 22 having a recess capable of storing a required amount of the granular resin 6 is formed. Moreover, by forming the resin container 22 with the release film 11, the pre-resin-supply plate 21 a having the resin container 22 can be obtained. That is, the resin pre-supply plate 21 a having the resin housing portion 22 is composed of the resin housing plate 21 and the release film 11.
  • the resin material distribution means 31 can supply a required amount of the granular resin 6 from the plate upper opening 39 to the resin container 22 of the pre-resin supply plate 21a.
  • the shapes (on the plane) of the lower and upper openings 23 and 39 on the plate are formed corresponding to the shape (on the plane) of the cavity opening 10.
  • the shape of the cavity opening 10 is formed in a rectangular shape, and the shapes of the openings 37 and 39 below the plate of the opening 37 corresponding to the shape of the rectangular cavity opening 10 are formed. it can.
  • the resin material distribution means (resin material metering and flattening means) 31 shown in FIG. 1 measures the required amount of granular resin 6 in the resin container 22 of the plate 21a before resin supply.
  • the granular resin 6 is flattened with a uniform thickness (a constant amount of resin per unit area) in the resin container 22 of the pre-resin supply plate 21a.
  • the container 22 is configured so that a required amount of the flattened granular resin 6 can be distributed.
  • the resin material distribution means 31 includes a resin material input side distribution means 31a and a resin material receiving side distribution means 31b.
  • the resin material input side distribution means 31a includes resin material input means (resin material supply means) for supplying and supplying a required amount of granular resin 6 to the resin container 22 of the pre-resin supply plate 21a. ) 32 and a feeder-side weighing means (load cell) 33 of a resin material for weighing a required amount of the granular resin 6 to be charged into the resin container 22 of the plate 21a before resin supply.
  • the resin material feeding means 32 includes a granular resin hopper 34 and a granular resin 6 in the resin accommodating portion 22 of the pre-resin supply plate 21a by appropriate vibration means (not shown).
  • a linear vibration feeder 35 that moves and inputs while vibrating is provided. Further, the granular resin 6 supplied and supplied to the resin accommodating portion 22 of the pre-resin supply plate 21a can be measured by the feeder-side measuring means (load cell) 33 when the granular resin 6 is supplied and supplied. Yes. Therefore, in the resin material input side distribution means 31a, the granular resin 6 from the hopper 34 is moved while being vibrated by the linear vibration feeder 35, whereby a required amount of granules is transferred to the resin accommodating portion 22 of the plate 21a before resin supply. The resin 6 can be supplied and charged (for example, in small amounts). Note that, for example, the linear vibration feeder 35 may be configured to supply a constant amount of resin per unit time to the resin accommodating portion 22 of the pre-resin supply plate 21 a by vibrating the granular resin 6. .
  • the resin material receiving side distribution means 31 b is formed by adsorbing and fixing the release film 11 on the lower surface side of the resin containing plate 21 by the release film adsorbing and fixing mechanism of the resin containing plate 21.
  • Pre-resin supply plate forming means (not shown) for forming the pre-resin supply plate 21a having the accommodating portion 22, a plate mounting table 40 for mounting the pre-resin supply plate 21a, and the pre-resin supply plate 21a
  • Plate moving placement means (not shown) placed on the plate placement table 40 from the forming means, and the resin pre-supply plate 21a placed on the plate placement table 40 from the linear vibration feeder 35 in the resin material input side distribution means 31a.
  • the resin material flattening means (for example, described later) for flattening the required amount of the granular resin 6 supplied to the resin accommodating portion 22 to the required thickness. Horizontal movement flattening mechanism fat material 42) is formed is provided. Therefore, in the resin material receiving side distribution means 31b, first, the resin pre-supply plate 21a having the resin accommodating portion 22 is formed by the pre-resin supply plate forming means, and the pre-resin supply plate 21a is used as the plate moving mounting means. Next, it is configured so that a required amount of the granular resin 6 can be moved and supplied from the linear vibration feeder 35 to the resin accommodating portion 22 of the plate 21a before resin supply while vibrating. Has been.
  • the required amount of the granular resin 6 supplied to the resin container 22 is made to have the required uniform thickness by the cooperative operation of the flattening means (horizontal movement flattening mechanism 42) of the resin material and the linear vibration feeder 35. It is comprised so that it can planarize by (41).
  • the resin material receiving side distribution means 31b is configured with, for example, a horizontal movement flattening mechanism 42 as a resin material flattening means. That is, the horizontal movement flattening mechanism 42 moves the pre-resin supply plate 21a mounted on the plate mounting table 40 separately or simultaneously in the horizontal direction, that is, in the X direction or the Y direction shown in FIG. It is configured to be able to. Therefore, the linear vibration feeder 35 is configured to be able to move and supply a required amount of the granular resin 6 while vibrating it to the resin accommodating portion 22 of the pre-resin supply plate 21a mounted on the plate mounting table 40. Yes.
  • the horizontal movement flattening mechanism 42 moves the plate 21a before resin supply in the X direction or the Y direction, so that a predetermined amount of the granular resin 6 is required to have a uniform thickness in the resin accommodating portion 22. 41 (refer to FIG. 3) so that it can be flattened (formed to a certain amount of resin per unit area), and resin-dispersed plate 25 can be formed. .
  • a plate engaging portion for attaching a resin-dispersed plate 25 (that is, a resin containing plate 21 containing a required amount of the flattened granular resin 6 to the resin containing portion 22 formed of the release film 11).
  • 9a is provided on the lower side of the inloader.
  • the inloader 9 is configured such that a substrate placement portion 9b on which the substrate 8 is placed with the electronic component 7 facing downward is provided on the upper side of the inloader. Therefore, by moving the inloader 9 between the upper and lower molds 1 (2, 3) and moving the board 8 upward, the board 8 having the electronic component 7 mounted on the board set part 4 of the upper mold 2 is changed to electronic.
  • the supply can be set with the component mounting surface side facing downward.
  • the inloader 9 is moved between the upper and lower molds 1 (2, 3) to move the inloader 9 downward, so that the position of the plate lower opening 23 of the resin containing plate 21 is located via the release film 11. It is configured to be able to match the position of the cavity opening 10 of the lower mold 3.
  • the release film 11 is sandwiched between the mold surface of the lower mold 3 and the lower surface of the resin accommodating plate 21.
  • the release film suction by the release film suction fixing mechanism provided on the lower surface of the resin accommodating plate 21 can be released.
  • the release film 11 is locked by the mold surface of the lower mold 3 by sucking with a suction mechanism provided on the mold surface of the lower mold 3 and the surface of the cavity 5, and the release film 11. Can be drawn into the lower mold cavity 5 to cover the surface of the cavity 5 with the release film 11.
  • the required amount of the flattened granular resin 6 placed on the release film 11 in the resin accommodating portion 22 (opening 37) of the resin-dispersed plate 25 is drawn into the cavity 5. And fall into the cavity 5 together.
  • a required amount of the flattened granular resin 6 can be supplied (collectively) into the cavity 5 covered with the release film 11. Therefore, the required amount of granular resin 6 can be uniformly formed in the cavity 5 covered with the release film 11.
  • the release film 11 (short release film) used in the present invention is prepared by cutting (pre-cut) a long release film (roll-like release film) into a predetermined length in advance. It is what is done. Therefore, each time the granular resin 6 is supplied to the pre-resin supply plate 21a, the roll-shaped release film (long release film) loaded in the mold apparatus is used as the release film 11 (short release film). Compared with a mold apparatus that cuts the mold, the means for loading the mold apparatus with a roll-shaped release film can be omitted. Therefore, the size of the entire mold apparatus according to the present invention can be reduced as compared with the size of the mold apparatus loaded with a roll-shaped release film.
  • the release film 11 is adsorbed and coated on the lower surface side of the resin containing plate 21, and the plate lower opening 23 of the opening 37 is closed to form the resin containing portion 22, thereby having the resin containing portion 22.
  • the resin pre-supply plate 21a is formed (see FIGS. 2 (1) to (2) and FIG. 3).
  • the pre-resin supply plate 21 a is placed on the plate base 40 in the resin material distribution means 31. At this time, the release film 11 is sandwiched between the resin housing plate 21 and the plate base 40.
  • a required amount of the granular resin 6 is measured by the feeder side weighing means (load cell) 33 on the resin material input side distribution means 31 a side, and the linear vibration feeder 35 is fed from the hopper 34.
  • the plate upper opening 39 Through the plate upper opening 39, a required amount of the granular resin 6 can be moved without being vibrated and supplied to the resin accommodating portion 22 of the plate 21a before resin supply.
  • the pre-resin supply plate 21a placed on the plate placing table 40 is moved in the X direction or Y direction by the horizontal movement flattening mechanism 42 (resin material flattening means).
  • the required amount of granular resin 6 supplied while vibrating in the resin container 22 of the pre-resin supply plate 21a is moved in the resin container 22 of the pre- resin supply plate 21a by moving separately or simultaneously.
  • the thickness of the granular resin 6 can be formed uniformly (see FIGS. 2 (1) to (2) and FIG. 3). Therefore, in the resin material distribution means 31, by supplying a required amount of the granular resin 6 without vibration into the resin accommodating portion 22 of the pre-resin supply plate 21a placed on the plate base 40, and flattening it.
  • the resin-dispersed plate 25 can be formed.
  • a required amount of flattened granules is formed on the release film 11 on the plate lower opening 23 side of the opening 37 (on the release film 11 in the resin container 22). It can be formed in a state where the resin 6 is placed (in a state where the granule resin 6 having a uniform thickness of a required amount is placed).
  • the resin-dispersed plate 25 is engaged with the plate engaging portion 9a of the inloader 9, and the substrate 8 having the electronic component 7 mounted thereon is placed on the substrate placing portion 9b of the inloader 9.
  • the inloader 9 is inserted between the upper and lower molds 1 (2, 3), and the substrate 8 is moved upward so that the substrate 8 having the electronic component 7 mounted thereon is mounted on the substrate set portion 4 of the upper mold 2.
  • supply and setting is performed with the electronic component mounting surface facing downward.
  • the in-loader 9 is moved down to place the resin-dispersed plate 25 on the mold surface of the lower mold 3.
  • the plate lower opening 23 of the resin-dispersed plate 25 can be matched with the opening 10 of the cavity 5 through the release film 11.
  • a required amount of the granular resin 6 is placed on the release film 11 in a flattened state in the resin accommodating portion 22 of the resin-dispersed plate 25.
  • the required amount of the flattened granular resin 6 and the release film 11 placed on the release film 11 In this state, a required amount of the flattened granular resin 6 is drawn into the lower mold cavity 5 and dropped.
  • a predetermined amount of the granule resin 6 is supplied into the lower mold cavity 5 covered with the release film 11 in a flattened state, that is, in a state where the thickness of the granule resin 6 is uniform. Can do. Therefore, in this case, with the required amount of the flattened granule resin 6 placed on the release film 11 and with the required amount of the flattened granule resin 6 and the release film 11 together.
  • a predetermined amount of the granular resin 6 can be dropped into the lower mold cavity 5 in a flat state (in a uniform thickness) and supplied (in a lump).
  • the present invention has a configuration in which the plate lower opening 23 of the resin dispersed plate 25 in the inloader 9 (resin material supply mechanism) equipped with the resin dispersed plate 25 is placed on the lower mold 3 (cavity opening 10).
  • a required amount of the flattened granular resin 6 can be efficiently supplied into the lower mold cavity 5 covered with the release film 11.
  • the present invention can supply a required amount of the granular resin 6 in a flattened state (in a uniform thickness) into the lower mold cavity 5 covered with the release film 11, As shown, it is possible to efficiently prevent the resin portion 92 from being caught in the shutter 90 and remaining in the supply mechanism 89.
  • the shutter 90 shown in the conventional example is no longer necessary, and the disadvantage as shown in the conventional example that part 92 of the granular resin 84 remains on the supply mechanism 89 side is eliminated.
  • the present invention can supply a required amount of the flattened granular resin 6 (together with the release film 11) into the cavity 5 coated with the release film 11.
  • the required amount of the granule resin 6 is heated and melted in a flattened state in the cavity 5 coated with the release film 11.
  • the release film 11 is covered.
  • a required amount of the granular resin 6 can be uniformly heated (for example, from the bottom side of the cavity) to be melted. Therefore, compared with the case where the granular resin 6 is supplied non-uniformly in the lower mold cavity 5, the granular resin 6 is heated and melted non-uniformly and partially cured, so that Can be efficiently prevented.
  • the electronic component 7 mounted on the substrate 8 supplied and set to the upper mold substrate setting unit 4 is moved into the lower mold cavity 5. While being immersed in the heat-melted resin 6, the resin in the cavity 5 is pressed by the cavity bottom member 38. After the time required for curing has elapsed, the upper and lower molds 2 and 3 are opened to compress the electronic component 7 mounted on the substrate 8 in the cavity 5 into the resin molded body 12 corresponding to the shape of the cavity 5. It can be molded (resin sealing molding).
  • the resin-distributed plate 25 can be formed by supplying a required amount of the granular resin 6 to the resin accommodating portion 22 of the pre-resin supply plate 21a by the resin material distribution means 31 and flattening it. . Further, as described above, a predetermined amount of the flattened granular resin 6 placed on the release film 11 in the resin container 22 in the resin-dispersed plate 25 is put into the cavity 5 together with the release film 11. By pulling and dropping, a predetermined amount of the granular resin 6 is supplied into the cavity 5 covered with the release film 11 in a flattened state (with the required amount of the granular resin 6 formed in a uniform thickness). be able to.
  • the required amount of the flattened granular resin 6 is drawn into the cavity 5 together with the release film 11 and dropped, so that the required amount is put into the cavity 5 coated with the release film 11. Since the granular resin 6 can be supplied in a flattened state, the resin can be efficiently supplied into the mold cavity 5 when the resin is supplied into the mold cavity. Further, according to the present invention, as described above, since a required amount of the granular resin 6 can be supplied into the cavity 5 covered with the release film 11 in a flattened state, When the resin is supplied, there is an excellent effect that the reliability of the amount of resin supplied into the mold cavity 5 can be improved efficiently.
  • the resin material receiving side distribution means 31b is provided with a resin material plate side measuring means (load cell) 36 for measuring a required amount of the granular resin 6 supplied to the resin accommodating portion 22 of the pre-resin supply plate 21a. It is configured. Therefore, on the receiving side distribution means 31b side of the resin material, the resin resin plate side weighing means 36 can measure the granular resin 6 supplied to the resin accommodating portion 22 of the pre-resin supply plate 21a. Has been.
  • the weighing process by the feeder-side weighing means 33 of the resin material input-side distribution means 31a and the weighing process by the plate-side weighing means 36 of the resin material receiving-side distribution means 31b are used in combination. Can do. Moreover, you may employ
  • the resin material receiving side distribution means 31b while vibrating the granule resin 6 introduced into the resin container 22 from the linear vibration feeder 35 (with the pre-resin supply plate 21a), A resin material serving as a resin material flattening means for flattening the granular resin 6 in the resin accommodating portion 22 and uniforming the thickness of the granular resin 6 by moving separately or simultaneously in the X direction or the Y direction.
  • a vibration uniformizing means (not shown) is provided.
  • the vibration pre-supplied plate 21a is vibrated by the vibration equalizing means, whereby the granular resin 6 supplied and fed to the resin accommodating portion 22 of the pre-resin supply plate 21a is X direction. Alternatively, it can be moved in the Y direction. At this time, the thickness of the granular resin 6 can be made uniform in the resin accommodating portion 22 by moving the granular resin 6 supplied to the resin accommodating portion 22 in the X direction or the Y direction and flattening it. It is configured. Therefore, it is possible to form the resin-dispersed plate 25 having the resin accommodating portion 22 (opening portion 37) supplied with the required amount of the flattened granular resin 6 (the granular resin 6 having a uniform thickness).
  • the granular resin 6 is vibrated to be charged into the resin accommodating portion 22 of the plate 21a before resin supply with a constant amount of resin per unit time. It is configured to be able to.
  • the resin is introduced into the resin container 22 by appropriately adjusting the amount of resin charged per unit time and the vibration effect on the resin supply pre-plate 21a (granular resin 6) by the vibration equalizing means of the resin material.
  • the granular resin 6 to be formed can be formed to have a uniform thickness (a constant amount of resin per unit area).
  • the structure which drops and throws the granular resin 6 in the center part in the resin accommodating part 22 of the plate 21a before resin supply is employable. In this case, the granule resin 6 that is vibrated in the resin accommodating portion 22 can be evenly moved and flattened in the outer peripheral direction (the thickness of the granule resin 6 is made uniform).
  • an appropriate resin material flattening means that is, the resin pre-supply plate 21a is vibrated.
  • the uneven portion can be flattened, and the thickness of the granular resin 6 can be made uniform.
  • thermosetting resin material has been described.
  • thermoplastic resin material may be used.
  • the granular resin material 6 has been described.
  • various powder resin materials powder resins
  • powdered resin materials powdered resins
  • a silicon-based resin material or an epoxy-based resin material can be used.
  • various resin materials such as the resin material which has transparency, the resin material which has translucency, a phosphorescent material, and the resin material containing a fluorescent substance, can be used.
  • a configuration in which a lid member is provided on the upper surface of the resin accommodating plate 21 and the plate upper opening 39 (resin accommodating portion 22) is covered can be employed.
  • Resin material input means 33 Feeder Side weighing means 34 ... Hopper 35 ... Linear vibration feeder 36 ... Plate side weighing means 37 ... Opening 38 ... Cavity bottom member 39 ... Plate upper opening 40 ... Plate mounting part 41 ... Required thickness (distance) 42 ... Horizontal movement flattening mechanism

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
PCT/JP2009/003683 2008-08-08 2009-08-03 電子部品の圧縮成形方法及び金型装置 WO2010016223A1 (ja)

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KR1020117005300A KR101430797B1 (ko) 2008-08-08 2009-08-03 전자부품의 압축성형방법 및 금형장치
KR1020137028418A KR101523164B1 (ko) 2008-08-08 2009-08-03 전자부품의 압축성형방법 및 금형장치
CN200980128894.XA CN102105282B (zh) 2008-08-08 2009-08-03 电子部件的压缩成形方法及模具装置
KR1020137028417A KR101523163B1 (ko) 2008-08-08 2009-08-03 전자부품의 압축성형방법 및 금형장치
PH12014500725A PH12014500725A1 (en) 2008-08-08 2014-04-01 Method for compression-molding electronic component and die apparatus

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JP2008205018A JP5153509B2 (ja) 2008-08-08 2008-08-08 電子部品の圧縮成形方法及び金型装置

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KR (3) KR101523164B1 (zh)
CN (2) CN102105282B (zh)
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JP2012016883A (ja) * 2010-07-08 2012-01-26 Towa Corp 電子部品の圧縮成形方法及び成形装置
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JP6279047B1 (ja) * 2016-10-11 2018-02-14 Ｔｏｗａ株式会社 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法
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