WO2008136499A1 - 微細化パターン形成用水溶性樹脂組成物およびこれを用いた微細パターン形成方法 - Google Patents

微細化パターン形成用水溶性樹脂組成物およびこれを用いた微細パターン形成方法 Download PDF

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Publication number
WO2008136499A1
WO2008136499A1 PCT/JP2008/058341 JP2008058341W WO2008136499A1 WO 2008136499 A1 WO2008136499 A1 WO 2008136499A1 JP 2008058341 W JP2008058341 W JP 2008058341W WO 2008136499 A1 WO2008136499 A1 WO 2008136499A1
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WO
WIPO (PCT)
Prior art keywords
water
soluble resin
nitrogen
micropatterns
resist pattern
Prior art date
Application number
PCT/JP2008/058341
Other languages
English (en)
French (fr)
Inventor
Sung-Eun Hong
Yusuke Takano
Wen-Bing Kang
Original Assignee
Az Electronic Materials (Japan)K.K.
Az Electronic Materials Usa Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Az Electronic Materials (Japan)K.K., Az Electronic Materials Usa Corp. filed Critical Az Electronic Materials (Japan)K.K.
Priority to KR1020097025070A priority Critical patent/KR101426320B1/ko
Priority to CN2008800143173A priority patent/CN101675390B/zh
Priority to US12/451,150 priority patent/US20100119717A1/en
Priority to EP08752271.0A priority patent/EP2146250B1/en
Publication of WO2008136499A1 publication Critical patent/WO2008136499A1/ja

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/3085—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by their behaviour during the process, e.g. soluble masks, redeposited masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/3086—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/3088—Process specially adapted to improve the resolution of the mask

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)

Abstract

　下地基板１上に設けられたレジストパターン２上に、水溶性ビニル樹脂、分子内に少なくとも２個のアミノ基を有する化合物、溶剤および必要に応じ界面活性剤などの添加剤からなる水溶性樹脂組成物を塗布して水溶性樹脂膜３を形成した後、ミキシングによりレジストパターンに隣接する前記水溶性樹脂膜を変性させることによって、レジストパターン表面に水洗で除去出来ない水不溶化層４を形成し、次いで前記水溶性樹脂膜の未変性部を水洗除去することにより、レジストパターンの分離サイズまたはホール開口サイズを実効的に露光波長の限界解像以下に微細化する。水溶性ビニル樹脂としては、窒素原子を含有するビニルモノマー、例えばアリルアミン、アクリルアミド、ビニルピロリドン、ビニルイミダゾールなどの単一重合体、窒素原子を含有するビニルモノマーの２種以上からなる共重合体、または窒素原子を含有するビニルモノマーの少なくとも１種と窒素原子を含有しないビニルモノマーの少なくとも１種からなる共重合体が好ましい。
PCT/JP2008/058341 2007-05-01 2008-05-01 微細化パターン形成用水溶性樹脂組成物およびこれを用いた微細パターン形成方法 WO2008136499A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097025070A KR101426320B1 (ko) 2007-05-01 2008-05-01 미세화 패턴 형성용 수용성 수지 조성물 및 이를 사용한 미세 패턴 형성 방법
CN2008800143173A CN101675390B (zh) 2007-05-01 2008-05-01 用于形成精细图案的水溶性树脂组合物及使用该组合物形成精细图案的方法
US12/451,150 US20100119717A1 (en) 2007-05-01 2008-05-01 Water-soluble resin composition for the formation of micropatterns and method for the formation of micropatterns with the same
EP08752271.0A EP2146250B1 (en) 2007-05-01 2008-05-01 Water-soluble resin composition for the formation of micropatterns and process for the formation of micropatterns with the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007120833A JP5069494B2 (ja) 2007-05-01 2007-05-01 微細化パターン形成用水溶性樹脂組成物およびこれを用いた微細パターン形成方法
JP2007-120833 2007-05-01

Publications (1)

Publication Number Publication Date
WO2008136499A1 true WO2008136499A1 (ja) 2008-11-13

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PCT/JP2008/058341 WO2008136499A1 (ja) 2007-05-01 2008-05-01 微細化パターン形成用水溶性樹脂組成物およびこれを用いた微細パターン形成方法

Country Status (7)

Country Link
US (1) US20100119717A1 (ja)
EP (1) EP2146250B1 (ja)
JP (1) JP5069494B2 (ja)
KR (1) KR101426320B1 (ja)
CN (1) CN101675390B (ja)
TW (1) TW200916523A (ja)
WO (1) WO2008136499A1 (ja)

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