WO2008133018A1 - Antenne de type à couplage de champ magnétique, module d'antenne de type à couplage de champ magnétique, dispositif d'antenne de type à couplage de champ magnétique et leurs procédés de fabrication - Google Patents

Antenne de type à couplage de champ magnétique, module d'antenne de type à couplage de champ magnétique, dispositif d'antenne de type à couplage de champ magnétique et leurs procédés de fabrication Download PDF

Info

Publication number
WO2008133018A1
WO2008133018A1 PCT/JP2008/057078 JP2008057078W WO2008133018A1 WO 2008133018 A1 WO2008133018 A1 WO 2008133018A1 JP 2008057078 W JP2008057078 W JP 2008057078W WO 2008133018 A1 WO2008133018 A1 WO 2008133018A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic field
field coupling
coupling type
type antenna
insulating layer
Prior art date
Application number
PCT/JP2008/057078
Other languages
English (en)
Japanese (ja)
Inventor
Tsutomu Ieki
Hiroyuki Kubo
Masamichi Ando
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2009511768A priority Critical patent/JP5170087B2/ja
Priority to CN200880011674.4A priority patent/CN101657938B/zh
Priority to GB0917865.8A priority patent/GB2461443B/en
Publication of WO2008133018A1 publication Critical patent/WO2008133018A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H01Q7/08—Ferrite rod or like elongated core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Details Of Aerials (AREA)
  • Near-Field Transmission Systems (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Soft Magnetic Materials (AREA)

Abstract

L'invention concerne une antenne de type à couplage de champ magnétique comprenant une couche isolante (110) et un noyau magnétique (112) incorporé dans la couche isolante (110). Une bobine ayant un axe de bobine parallèle à la surface supérieure de la couche isolante est formée par un conducteur supérieur (116) formé sur la surface supérieure de la couche isolante (110), un conducteur inférieur (118) formé sur la surface inférieure de la couche isolante (110), un conducteur latéral (120) pour connecter électriquement le conducteur supérieur (116) et le conducteur inférieur (118), et un trou d'interconnexion (122). Cette antenne de type à couplage de champ magnétique peut être fabriquée par un procédé simple et a une sensibilité d'antenne élevée sans détériorer la résistance aux impacts.
PCT/JP2008/057078 2007-04-13 2008-04-10 Antenne de type à couplage de champ magnétique, module d'antenne de type à couplage de champ magnétique, dispositif d'antenne de type à couplage de champ magnétique et leurs procédés de fabrication WO2008133018A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009511768A JP5170087B2 (ja) 2007-04-13 2008-04-10 携帯電子機器
CN200880011674.4A CN101657938B (zh) 2007-04-13 2008-04-10 磁场耦合型天线、磁场耦合型天线模块及磁场耦合型天线装置、及这些的制造方法
GB0917865.8A GB2461443B (en) 2007-04-13 2008-04-10 Magnetic field coupling antenna module arrangements including a magnetic core embedded in an insulating layer and their manufacturing methods.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-105513 2007-04-13
JP2007105513 2007-04-13

Publications (1)

Publication Number Publication Date
WO2008133018A1 true WO2008133018A1 (fr) 2008-11-06

Family

ID=39925477

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057078 WO2008133018A1 (fr) 2007-04-13 2008-04-10 Antenne de type à couplage de champ magnétique, module d'antenne de type à couplage de champ magnétique, dispositif d'antenne de type à couplage de champ magnétique et leurs procédés de fabrication

Country Status (4)

Country Link
JP (2) JP5170087B2 (fr)
CN (1) CN101657938B (fr)
GB (2) GB2485318B (fr)
WO (1) WO2008133018A1 (fr)

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JP2010154007A (ja) * 2008-12-24 2010-07-08 Murata Mfg Co Ltd 磁性体アンテナ及びアンテナ装置
JP2010200227A (ja) * 2009-02-27 2010-09-09 Toko Inc 高周波結合器およびそれを用いた非接触伝送通信システム
JP2010245371A (ja) * 2009-04-08 2010-10-28 Elpida Memory Inc 半導体装置および半導体装置の製造方法
WO2010122685A1 (fr) * 2009-04-21 2010-10-28 株式会社村田製作所 Appareil d'antenne et procédé de réglage de la fréquence de résonance de celui-ci
JP2011049936A (ja) * 2009-08-28 2011-03-10 Panasonic Corp アンテナおよびアンテナ装置
JP2011160110A (ja) * 2010-01-29 2011-08-18 Dainippon Printing Co Ltd アンテナ部品
WO2012063526A1 (fr) * 2010-11-10 2012-05-18 横浜ゴム株式会社 Dispositif d'acquisition d'informations
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
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JP2013243566A (ja) * 2012-05-22 2013-12-05 Murata Mfg Co Ltd アンテナ装置および通信端末装置
JP2013243330A (ja) * 2012-04-25 2013-12-05 Nec Tokin Corp シート状インダクタ、積層基板内蔵型インダクタ及びそれらの製造方法
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
WO2014024762A1 (fr) * 2012-08-09 2014-02-13 株式会社村田製作所 Dispositif d'antenne et dispositif de communication sans fil
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
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US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
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