WO2014112243A1 - Module avec une bobine d'antenne intégrée, appareil d'antenne, et appareil de communication - Google Patents

Module avec une bobine d'antenne intégrée, appareil d'antenne, et appareil de communication Download PDF

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Publication number
WO2014112243A1
WO2014112243A1 PCT/JP2013/083019 JP2013083019W WO2014112243A1 WO 2014112243 A1 WO2014112243 A1 WO 2014112243A1 JP 2013083019 W JP2013083019 W JP 2013083019W WO 2014112243 A1 WO2014112243 A1 WO 2014112243A1
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WIPO (PCT)
Prior art keywords
antenna coil
antenna
built
wiring
module
Prior art date
Application number
PCT/JP2013/083019
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English (en)
Japanese (ja)
Inventor
郷地直樹
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201390000528.8U priority Critical patent/CN204497378U/zh
Priority to JP2014531441A priority patent/JP5633662B1/ja
Publication of WO2014112243A1 publication Critical patent/WO2014112243A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
    • G06K7/10237—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves the reader and the record carrier being capable of selectively switching between reader and record carrier appearance, e.g. in near field communication [NFC] devices where the NFC device may function as an RFID reader or as an RFID tag
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
    • G06K7/10316—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves using at least one antenna particularly designed for interrogating the wireless record carriers
    • G06K7/10336—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves using at least one antenna particularly designed for interrogating the wireless record carriers the antenna being of the near field type, inductive coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/04—Details of telephonic subscriber devices including near field communication means, e.g. RFID

Definitions

  • the present invention relates to a module with a built-in antenna coil used for, for example, an RFID (Radio Frequency Identification) system, a near field communication (NFC) system, an antenna device and a communication device including the module.
  • RFID Radio Frequency Identification
  • NFC near field communication
  • wireless communication devices such as mobile phone terminals have been equipped with various communication functions such as GPS, wireless LAN, RFID, and short-range wireless communication as well as a call function.
  • wireless communication devices are not only improved in function but also reduced in size at the same time, and it has become difficult to secure a sufficient space for mounting the communication circuit.
  • Patent Document 1 As one means for solving this problem, for example, as disclosed in Patent Document 1, it is effective to reduce the size by incorporating an antenna coil in a laminated substrate.
  • an object of the present invention is to provide an antenna coil built-in module, an antenna device including the same, and a communication device in which a deterioration in antenna characteristics is reduced while maintaining a reduction in size in a module incorporating an antenna coil.
  • the antenna coil built-in module of the present invention is configured as follows.
  • a laminated base including a plurality of base material layers on which conductor patterns are formed is laminated, an antenna coil is constituted by the conductor pattern, and a plurality of terminal electrodes are formed on the bottom surface of the laminated base,
  • the winding axis of the antenna coil is the surface direction of the base material layer,
  • the terminal electrode is disposed near the opening of the antenna coil,
  • the conductor pattern includes a plurality of first wirings connected to the terminal electrode, a plurality of second wirings connected to a chip component mounting terminal electrode on which the chip component is mounted, and the first wiring and the second wiring.
  • an interlayer connection conductor that conducts at At least one of the first wirings includes a first portion from an intermediate point (for example, an arbitrary point such as the center) to a point connected to the terminal electrode, and a point from the intermediate point to the second wiring.
  • the first part satisfies the wiring pattern shape condition that there are more components in the winding axis direction than the second part. To do.
  • the magnetic field generated in the antenna coil is high in the center of the antenna coil, but the magnetic field generated outside the antenna coil is high near the opening of the antenna coil.
  • the first wiring satisfying the shape of the wiring pattern is a pattern in which the path is directed toward the winding axis as it is closer to the opening of the antenna coil. Therefore, unnecessary coupling between the first wiring and the antenna coil is suppressed. The deterioration of antenna characteristics is suppressed.
  • the region where the second wiring is formed is a pincushion type that does not overlap with the opening of the antenna coil in a plan view or has few overlapping regions.
  • a mounting electrode is formed in a region of the bottom surface of the multilayer substrate that does not overlap with the opening of the antenna coil in plan view.
  • the layer in which the said antenna coil is formed among the said base material layers is a magnetic body.
  • a cavity is formed in a part of the base material layer in which the antenna coil is formed, and a (sintered) magnetic body is inserted into the cavity.
  • an RF communication circuit is constituted by the chip component, the first wiring, and the second wiring, a module including an RF communication circuit and an antenna coil is obtained.
  • the RF communication circuit is a circuit that operates as an RFID tag.
  • the RF communication circuit is a circuit that operates as an RF reader / writer.
  • An antenna device of the present invention includes any one of the above-described antenna built-in modules and a booster antenna that magnetically couples to an antenna coil included in the antenna built-in module. With this configuration, the communicable distance can be extended.
  • a communication device of the present invention includes a wireless communication circuit together with any one of the above-described antenna coil built-in modules or the antenna device.
  • FIG. 1 is a plan view of each layer before lamination of the antenna coil built-in module according to the first embodiment.
  • FIG. 2 is a plan view of the base material layers 12e and 12f, showing the relationship between the opening of the antenna coil and the pattern of the first wiring.
  • FIG. 3 is a diagram (sectional view) showing the antenna coil and the magnetic field strength in the vicinity thereof.
  • FIG. 4 is a plan view of the base material layers 12b, 12c, and 12g, showing the relationship between the opening of the antenna coil and the pattern of the second wiring, and the relationship between the opening of the antenna coil and the mounting electrode. is there.
  • FIG. 5 is a circuit diagram of the antenna coil built-in module.
  • FIG. 5 is a circuit diagram of the antenna coil built-in module.
  • FIG. 6 is a plan view of each layer before lamination of the antenna coil built-in module according to the second embodiment.
  • FIG. 7 is a plan view of the base material layer 12f of the antenna coil built-in module according to the third embodiment, showing the relationship between the opening of the antenna coil and the pattern of the first wiring.
  • FIG. 8 is a plan view of the base material layer 12f of another antenna coil built-in module according to the third embodiment, and is a diagram showing the relationship between the opening of the antenna coil and the pattern of the first wiring.
  • FIG. 9 is an exploded perspective view of a booster coil 301 acting as a booster antenna.
  • FIG. 10 is an equivalent circuit diagram of an antenna apparatus including the antenna coil built-in module 201 and the booster coil 301 shown in FIG.
  • FIG. 11 is a diagram illustrating a structure inside the housing of the communication device 401 according to the fifth embodiment, and is a plan view in a state where the lower housing 91 and the upper housing 92 are separated and the inside is exposed. is there.
  • FIG. 1 is a plan view of each layer before lamination of the antenna coil built-in module according to the first embodiment.
  • the antenna coil built-in module includes a multilayer base (multilayer substrate) configured by stacking a plurality of base material layers on which a conductor pattern is formed, and the antenna coil is configured by the conductor pattern.
  • a plurality of terminal electrodes are formed on the bottom surface of the substrate, and chip components are mounted on the laminated substrate.
  • (a) is a plan view of the first layer (uppermost layer) of the laminated substrate
  • (g) is a plan view of the tenth layer (lowermost layer)
  • (b) to (f) are planes of respective layers therebetween.
  • FIG. In addition, (d) is a figure represented about the 4th layer from the 7th layer.
  • the fourth to seventh layers are the same as shown in plan view.
  • the plurality of base material layers constituting the laminated base are insulating layers.
  • Each of these base material layers 12a to 12g is a dielectric (non-magnetic) layer.
  • An opening is formed in the base material layer 12d, and a cavity is formed by stacking the fourth to seventh base material layers 12d.
  • a magnetic material 31 is contained in the cavity.
  • the magnetic material 31 is, for example, a sintered magnetic ferrite plate.
  • the base material layers 12a to 12g are, for example, layers of low temperature co-fired ceramics (LTCC).
  • terminal electrodes P1 to P6 and mounting electrodes 16 are formed on the base material layer 12g.
  • a plurality of electrodes for mounting chip components and a plurality of wiring patterns are formed on the base material layer 12a.
  • FIG. 1A shows only the mounted chip components. Specifically, RFIC, secure element SE, crystal oscillator X1, chip inductors L1, L2, chip capacitors C4, C9, C14, C15, C17, C18, C19, C20, C23, C24, and chip resistor R1 are mounted. Has been.
  • the linear conductor 21 is formed on the base material layer 12c, and the linear conductor 22 is formed on the base material layer 12e.
  • two rows of antenna coil interlayer connection conductors (via conductors) 23 for connecting the linear conductors 21-22 are formed.
  • the linear conductors 21 and 22 and the antenna coil interlayer connection conductor 23 constitute an antenna coil wound in a helical shape so that the winding axis faces the surface direction of the base material layer.
  • the terminal electrodes P1 to P6 are arranged near the opening of the antenna coil.
  • the linear conductors 21 and 22 extend in the x-axis direction, and the winding axis of the antenna coil faces the y-axis direction.
  • First wirings 14a to 14f are formed on the base material layer 12f.
  • a second wiring is formed on the base material layer 12b.
  • the formation area 17 of the second wiring is comprehensively shown.
  • the base material layers 12b to 12f include interlayer connection conductors (via conductors) 13a to 13a for connecting the second wirings formed on the base material layer 12b and the first wirings 14a to 14f formed on the base material layer 12f. 13f is formed. Interlayer connection conductors for connecting the wiring pattern formed on the base material layer 12a and the second wiring formed on the base material layer 12b are formed on the base material layer 12a.
  • the base layer 12g has an interlayer connection conductor (via conductor) that connects the first wirings 14a to 14f formed on the base layer 12f and the terminal electrodes P1 to P6 formed on the base layer 12g. 15a to 15f are formed.
  • the first wirings 14a to 14f connect the interlayer connection conductors 13a to 13f and the interlayer connection conductors 15a to 15f. Accordingly, the terminal electrodes P1 to P6 are electrically connected to the second wiring via the first wirings 14a to 14f and the interlayer connection conductors 15a to 15f and 13a to 13f.
  • FIG. 2 is a plan view of the base material layers 12e and 12f, showing the relationship between the opening of the antenna coil and the pattern of the first wiring.
  • the alternate long and short dash line indicates the winding axis.
  • the first wirings 14a to 14f include a first portion Z1 from an intermediate point (break point in this example) to a point (interlayer connection conductors 15a to 15f) connected to the terminal electrode, and a point connected to the second wiring from the intermediate point ( And a second portion Z2 up to the interlayer connection conductors 13a to 13f).
  • the first portion Z1 has more components in the winding axis direction of the antenna coil than the second portion Z2.
  • the first portion Z1 faces the y-axis direction
  • the second portion Z2 faces the x-axis direction.
  • the first wires 14a to 14f extend in the direction of the winding axis of the antenna coil in the vicinity of the opening of the antenna coil, and extend in a direction perpendicular to the winding axis at a position deeper than the opening of the antenna coil.
  • FIG. 3 is a diagram (sectional view) showing the antenna coil and the magnetic field strength in the vicinity thereof.
  • the linear conductors 21 and 22 are part of the antenna coil, and the broken lines are magnetic lines generated by the antenna coil, and the magnetic field strength distribution is represented by the density of the magnetic lines.
  • the magnetic field generated in the antenna coil is high at the center of the antenna coil, but the magnetic field generated outside the antenna coil is high near the opening of the antenna coil. Therefore, if there is a conductor pattern extending in a direction orthogonal to the winding axis in the vicinity of the opening of the antenna coil, the antenna coil is strongly magnetically coupled to the conductor pattern. In FIG. 3, some of the first wirings 14e and 14b are located near the coil opening, but the first wirings 14e and 14b extend in the winding axis direction near the coil opening. Therefore, the coupling between the antenna coil and the first wiring is weak.
  • FIG. 4 is a plan view of the base material layers 12b, 12c, and 12g, and shows the relationship between the opening of the antenna coil and the pattern of the second wiring, and the relationship between the opening of the antenna coil and the mounting electrode. It is. The positions of the antenna coil opening CA shown in the base material layer 12c in plan view are also shown in the base material layers 12b and 12g.
  • the formation region 17 of the second wiring is a pincushion type that does not overlap with the opening portion CA of the antenna coil in a plan view or has a small overlapping region.
  • An offset OF is offset from the coil opening so that the area overlapping the opening CA of the antenna coil is reduced.
  • the dimension of the base material layer is 6 mm ⁇ 5 mm, and the offset OF is about 0.6 mm from the coil opening position.
  • This offset amount is preferably about 1/10 (range from 1/5 to 1/20) of the axial length of the winding axis of the antenna coil (the length in the y-axis direction in FIG. 4).
  • the magnetic field intensity outside the antenna coil is high in the vicinity of the coil opening, but the second wiring is formed in the above region, so that the magnetic field radiated from the antenna coil is mounted on the module. It is difficult to couple with a conductor pattern in a component or a module, and as a result, deterioration of antenna characteristics is further suppressed.
  • the mounting electrode 16 is formed in a region that does not overlap the opening CA of the antenna coil in plan view.
  • the clearance CL is about 0.7 mm from the coil opening position.
  • This clearance is preferably about 1/10 (range from 1/5 to 1/20) of the axial length of the winding axis of the antenna coil (the length in the y-axis direction in FIG. 4).
  • FIG. 5 is a circuit diagram of the antenna coil built-in module.
  • the antenna coil ANT is an antenna coil constituted by the linear conductors 21 and 22 and the antenna coil interlayer connection conductor 23.
  • the antenna coil ANT and the capacitor C20 constitute an LC parallel resonance circuit, and the resonance frequency is adjusted to the carrier frequency band of the communication signal (for example, the HF band such as 13.56 MHz band).
  • the capacitor C19 is a capacitor for fine adjustment of the resonance frequency.
  • the inductors L1 and L2 and the capacitors C14, C15, C17, and C18 constitute an impedance matching circuit.
  • the crystal oscillator X1, capacitors C23 and C24, and resistor R1 constitute a crystal oscillation circuit.
  • Capacitors C4 and C9 are bypass capacitors.
  • terminal electrodes P1 to P6 are power supply terminals, and the terminal electrode P4 is a ground terminal.
  • the RFIC is an RF communication circuit.
  • this RFIC is set to the tag mode, the electromagnetic field received by the antenna coil is converted into electric power, the command from the communication partner side is demodulated, and predetermined information is transmitted (response) by load modulation. .
  • this antenna coil built-in module acts as an RFID tag.
  • the RFIC when the RFIC is set to the reader / writer mode, it converts the near electromagnetic field received by the antenna coil into electric power, receives a transmission signal from the communication partner, and transmits predetermined information by load modulation. To do.
  • the antenna coil built-in module functions as an RF reader / writer.
  • FIG. 6 is a plan view of each layer before lamination of the antenna coil built-in module according to the second embodiment.
  • the module with a built-in antenna coil according to the second embodiment includes a laminated substrate formed by laminating a plurality of base material layers on which conductor patterns are formed, similar to that shown in the first embodiment.
  • An antenna coil is configured by the pattern, a plurality of terminal electrodes are formed on the bottom surface of the multilayer substrate, and a chip component is mounted on the multilayer substrate.
  • the base material layers 12a to 12g are all insulating layers, but the base material layers 12c, 12d, and 12e are magnetic layers, and the other base material layers are dielectric layers.
  • the substrate layers 12c, 12d, and 12e are different from the first embodiment in that they are magnetic layers. Further, the base material layer 12d has no opening, and therefore no cavity is formed, and the magnetic material 31 shown in FIG. 1 does not exist.
  • the dielectric layer is, for example, a low-temperature co-fired ceramic (LTCC) dielectric ceramic layer
  • the magnetic layer is, for example, a low-temperature co-fired ceramic (LTCC) ferrite layer.
  • LTCC low-temperature co-fired ceramic
  • the size of the antenna coil for obtaining a predetermined inductance is somewhat larger, but all of the base material layers 12a to 12g shown in FIG. 6 may be used as dielectric layers.
  • FIG. 7 is a plan view of the base material layer 12f of the antenna coil built-in module according to the third embodiment, showing the relationship between the opening of the antenna coil and the pattern of the first wiring.
  • FIG. 8 is a plan view of the base material layer 12f of another antenna coil built-in module according to the third embodiment, and is a diagram showing the relationship between the opening of the antenna coil and the pattern of the first wiring. 7 and 8, the configuration other than the base material layer 12f is the same as that shown in FIGS. 1 and 2 in the first embodiment.
  • the first wirings 14a to 14f have a substantially L-shaped pattern.
  • the first wiring may not be composed of only a straight line, as shown in FIG.
  • a part or all of the pattern of the first wiring may be a curve.
  • a part of the pattern of the first wiring may be oblique.
  • a portion Z2 When the direction component along the path is compared between the first portion Z1 and the second portion Z2, the shape condition that the first portion Z1 has more components in the winding axis direction of the antenna coil than the second portion Z2. Meet.
  • the intermediate point does not mean the central point of the first wirings 14a to 14f, but is between the point connected to the terminal electrode (interlayer connection conductors 15a to 15f) and the point connected to the second wiring (interlayer connection conductors 13a to 13f). Is an arbitrary point.
  • Satisfying the above-mentioned wiring pattern shape condition means that the wiring pattern has a shape along the coil winding axis direction near the opening of the antenna coil, and is orthogonal to the coil winding axis direction at a position deeper than the opening of the antenna coil. It becomes a shape along the direction. Therefore, since the first wiring has a pattern that faces the winding axis in the vicinity of the opening of the antenna coil, unnecessary coupling between the first wiring and the antenna coil is suppressed, and deterioration of antenna characteristics is suppressed.
  • the path length of the wiring pattern is shorter than that of the L-shaped pattern as shown in FIG. Can be reduced and the loss can be reduced.
  • FIG. 9 is an exploded perspective view of the booster coil 301 acting as a booster antenna.
  • the booster coil 301 includes an insulator base 3, a first coil 1 formed on the first surface, a second coil 2 formed on the second surface, and a magnetic sheet 4.
  • the first coil 1 and the second coil 2 are conductors patterned in a rectangular spiral shape, and are patterned so as to be capacitively coupled in a state where current flows in the same direction in plan view.
  • the two coil conductors are patterned so that when a clockwise current flows through one coil conductor in a plan view from the same direction, a current flows clockwise through the other coil conductor.
  • FIG. 10 is an equivalent circuit diagram of an antenna device including the antenna coil built-in module 201 and the booster coil 301 shown in FIG.
  • the configuration of the antenna coil built-in module 201 is as described in some embodiments above. In detail, a circuit as shown in FIG. 5 is configured, but is simplified here.
  • the antenna coil built-in module 201 includes an antenna coil inductance component L1, a capacitor C1, an RFIC, and the like.
  • the capacitor C1 is a capacitor (C19, C20 in FIG. 5) for adjusting the resonance frequency of the antenna coil.
  • the booster coil 301 includes inductance components L2 and L3 of the first coil 1 and the second coil 2, capacitance components C2 and C3 generated between the first coil 1 and the second coil 2, and the like.
  • the maximum communicable distance can be extended by using the booster coil 301 separate from the antenna coil built-in module as the booster antenna.
  • FIG. 11 is a diagram illustrating a structure inside the housing of the communication device 401 according to the fifth embodiment, and is a plan view in a state where the lower housing 91 and the upper housing 92 are separated and the inside is exposed. is there.
  • the communication device 401 includes a booster coil that uses the antenna coil of the antenna coil built-in module described above as a power feeding coil and is coupled to the power feeding coil.
  • printed wiring boards 71 and 81 Inside the lower housing 91, printed wiring boards 71 and 81, a battery pack 83 and the like are housed.
  • An antenna coil built-in module 201 is mounted on the printed wiring board 71.
  • the printed wiring board 71 is also equipped with a UHF band antenna 72, a camera module 76, and the like.
  • the printed wiring board 81 is equipped with a UHF band antenna 82 and the like.
  • the printed wiring board 71 and the printed wiring board 81 are connected via a coaxial cable 84.
  • a booster coil 301 is formed on the inner surface of the upper casing 92.
  • the booster coil 301 is magnetically coupled to the antenna coil (feeding coil) of the antenna coil built-in module 201.
  • a dielectric (nonmagnetic) resin sheet may be used as a base layer, and the laminated substrate may be configured by stacking resin sheets.
  • a thermoplastic resin sheet such as a liquid crystal polymer or polyimide can be used.
  • a resin sheet in which a dielectric filler is dispersed can be used as the dielectric layer.
  • a resin sheet in which a magnetic filler is dispersed or a dielectric filler is dispersed together with the magnetic filler can be used as the magnetic layer.
  • the RFID for the HF band such as the 13.56 MHz band is shown.
  • the present invention applies not only to the HF band but also to a UHF band system used in a wireless LAN or the like. it can.
  • ANT ... antenna coil CA antenna coil openings P1 to P6 ... terminal electrode SE ... secure element X1 ... crystal oscillator Z1 ... first part Z2 ... second part 1 ... first coil 2 ... second coil 3 ... insulator Base material 4 ... Magnetic sheets 12a to 12g ... Base material layer 13a ... Interlayer connection conductors 14a to 14f ... First wiring 15a to 15f ... Interlayer connection conductor 16 ... Mounting electrode 17 ... Second wiring formation regions 21, 22 ... Linear conductor 23 ... Interlayer connection conductor 31 for antenna coil ... Magnetic material 71, 81 ... Printed wiring board 72, 82 ... UHF band antenna 76 ... Camera module 83 ... Battery pack 84 ... Coaxial cable 91 ... Lower casing 92 ... Upper part Housing 201 ... Antenna coil built-in module 301 ... Booster coil 401 ... Communication equipment

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Abstract

Selon la présente invention, dans des couches de matériau de base (12b-12f), des corps conducteurs de connexion inter-couche (13a-13f) sont formés, lesdits corps conducteurs de connexion inter-couche connectant les unes aux autres une seconde ligne de câblage formée sur la couche de matériau de base (12b) et des premières lignes de câblage (14a-14f) formées sur la couche de matériau de base (12f). Dans la couche de matériau de base (12g), des corps conducteurs de connexion inter-couche (15a-15f) sont formés, lesdits corps conducteurs de connexion inter-couche (15a-15f) connectant les unes aux autres les premières lignes de câblage (14a-14f) et des électrodes de borne (P1-P6) formées sur la couche de matériau de base (12g). Par rapport à une première partie de chacune des premières lignes de câblage (14a-14f), ladite première partie allant d'un point intermédiaire à un point connecté à chacune des électrodes de borne (P1-P6), et par rapport à une seconde partie de chacune des premières lignes de câblage, ladite seconde partie allant du point intermédiaire à un point connecté à la seconde ligne de câblage, la première partie possède plus de composants dans la direction d'axe de bobinage que la seconde partie lorsque les composants directionnels le long des chemins de la première partie et de la seconde partie sont comparés les uns aux autres.
PCT/JP2013/083019 2013-01-15 2013-12-10 Module avec une bobine d'antenne intégrée, appareil d'antenne, et appareil de communication WO2014112243A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201390000528.8U CN204497378U (zh) 2013-01-15 2013-12-10 天线线圈内置模块、天线装置及通信设备
JP2014531441A JP5633662B1 (ja) 2013-01-15 2013-12-10 アンテナコイル内蔵モジュール、アンテナ装置および通信機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013004386 2013-01-15
JP2013-004386 2013-01-15

Publications (1)

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WO2014112243A1 true WO2014112243A1 (fr) 2014-07-24

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CN111068179A (zh) * 2020-01-06 2020-04-28 浙江大学 一种柔性无源无线电刺激贴片及方法
US10714822B2 (en) 2016-12-01 2020-07-14 Taiyo Yuden Co., Ltd. Wireless module and method for manufacturing wireless module

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US10714822B2 (en) 2016-12-01 2020-07-14 Taiyo Yuden Co., Ltd. Wireless module and method for manufacturing wireless module
US20180166767A1 (en) * 2016-12-09 2018-06-14 Taiyo Yuden Co., Ltd. Wireless module and method for manufacturing the same
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CN111068179A (zh) * 2020-01-06 2020-04-28 浙江大学 一种柔性无源无线电刺激贴片及方法

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