WO2002089157A1 - Enroulement multicouche et procede de fabrication - Google Patents

Enroulement multicouche et procede de fabrication Download PDF

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Publication number
WO2002089157A1
WO2002089157A1 PCT/JP2002/004239 JP0204239W WO02089157A1 WO 2002089157 A1 WO2002089157 A1 WO 2002089157A1 JP 0204239 W JP0204239 W JP 0204239W WO 02089157 A1 WO02089157 A1 WO 02089157A1
Authority
WO
WIPO (PCT)
Prior art keywords
multilayer
coil
substrate
multilayer coil
circuit
Prior art date
Application number
PCT/JP2002/004239
Other languages
English (en)
Japanese (ja)
Inventor
Kouichirou Sagawa
Masahiko Oshimura
Original Assignee
Ajinomoto Co., Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co., Inc. filed Critical Ajinomoto Co., Inc.
Priority to JP2002586364A priority Critical patent/JPWO2002089157A1/ja
Publication of WO2002089157A1 publication Critical patent/WO2002089157A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H01Q7/08—Ferrite rod or like elongated core

Definitions

  • the present invention relates to a multilayer coil having a novel structure, which has a small and fine conductor pattern, and whose winding number can be set almost arbitrarily, and a method for manufacturing the same.
  • Bluetooth which transmits and receives data wirelessly between a personal computer and a printer or between a personal computer and a mobile phone.
  • studies are being made in the field of mouth-sticks, such as RF tags, which can be attached to luggage, etc., and read the information in a non-contact manner to grasp the history of the luggage, etc.
  • These cards or elements have a structure called an antenna coil.
  • the transmitted electromagnetic wave is received by an antenna coil, and a semiconductor device such as a microcomputer is driven by the generated power to rewrite or update data, and further transmit data to a reading device. It is known that the generated power is proportional to the number of turns of the coil if the antenna coil has the same area.
  • antenna coils have been used in which a wire is spirally wound, formed by printing a conductive paste, or formed on a printed circuit board by etching.
  • Coil formed by printing conductive paste is lower in cost than wire and etching methods, but it has low conductivity and can form only sparse patterns, so it is not possible to obtain sufficient inductance
  • a high-performance microcomputer cannot be driven, and as a result, a high-performance card cannot be obtained.
  • the antenna coil occupies a large area, there is a great limitation on mounting other elements.
  • the antenna coil formed on the printed circuit board by the etching process cannot secure a sufficient number of turns on a single plane, has insufficient inductance, and has the same problems as when a conductive paste is used.
  • Japanese Patent Application Laid-Open No. Hei 9-131556 proposes a multilayer antenna coil by a transfer lamination method.
  • a wide variety of devices are used for audio equipment such as CD players, VTRs, door locks, power electronics such as power windows, home appliances such as shavers, OA equipment such as pudding and copiers, and toys.
  • audio equipment such as CD players, VTRs, door locks, power electronics such as power windows, home appliances such as shavers, OA equipment such as pudding and copiers, and toys.
  • miniaturization of devices such as portable CD players has been progressing, and small-sized devices have been required.
  • motors having a diameter of about l mm have been marketed.
  • the first class is basically composed of the following three points.
  • a coil a permanent magnet, and a brush in which an enamel wire is wound around a core such as iron.
  • Various improvements have been made to the coil section, which has a structure in which an enameled wire is wound around the core, such as the production of a very thin conductor and the development of a winding machine.
  • An object of the present invention is to provide a multilayer coil which is small and can arbitrarily secure a sufficient number of windings (number of layers) and can obtain a large inductance, and is particularly suitable as a motor coil or an antenna coil. I have.
  • the above object can be achieved by the following means.
  • a multilayer coil in which a coil having a circuit surface in the direction perpendicular to the plane of the board is formed in multiple layers in a spiral shape. Furthermore,
  • a spiral coil in which coils having a circuit surface perpendicular to the plane of the substrate are formed in multiple layers, and adjacent circuits via the insulating layer are wound in opposite directions when viewed from the same direction. Multilayer coils with patterns and electrically connected to each other. Furthermore,
  • a multilayer coil in which a coil having a circuit surface in the direction perpendicular to the plane of the substrate is formed in a spiral shape in a plurality of layers, and a core structure made of a columnar magnetic material penetrating the center of the circuit surface is provided. Furthermore,
  • a spiral coil in which a coil having a circuit surface in a direction perpendicular to the substrate plane is formed in a plurality of layers and adjacent circuits via an insulating layer are wound in opposite directions when viewed from the same direction.
  • a multilayer coil having a pattern, being electrically connected to each other, and having a core structure made of a columnar magnetic material penetrating the center of each circuit surface.
  • the above object can also be achieved by the following means.
  • Multi-layer coil It is formed integrally with the multilayer substrate, includes a winding portion parallel to the multilayer substrate and a winding portion perpendicular to the multilayer substrate, and is supported in the multilayer substrate. Multi-layer coil.
  • the unit windings of the multilayer coil each have a spiral pattern that turns in the opposite direction when viewed from the same direction as the other adjacent unit windings, and the unit windings of the adjacent unit windings
  • the multilayer coil is further characterized in that the sets are connected alternately at the tips or ends of the spiral pattern.
  • a winding portion parallel to the multilayer substrate is formed as a part of a stacked conductive layer, and a winding portion perpendicular to the multilayer substrate connects a conductive layer adjacent to the conductive layer via an insulating layer.
  • the multilayer coil further formed as:
  • a winding portion parallel to the multilayer substrate is formed as a part of the stacked conductive layers, and a winding portion perpendicular to the multilayer substrate is formed between the adjacent conductive layers through the insulating layer.
  • a multilayer coil further formed as a connecting via or through hole.
  • a multilayer coil further having a core structure made of a columnar magnetic material penetrating the inside of the multilayer coil.
  • the multilayer coils are field coils of a motor, and the central axes of the multilayer coils are respectively oriented toward the rotation axis of each motor. And the plurality of multilayer coils are arranged at equal intervals to each other.
  • An antenna comprising:
  • Such a multilayer coil having a flat board and a circuit surface in the vertical direction is a novel one that has not been known before, and because of its excellent features, it can be used as a coil for mobile phones or as a non-contact type IC card. It is suitable as an antenna coil used for a Bluetooth module, an RF tag and the like. Further, according to the present invention, the above object can also be achieved by a manufacturing method including the following means.
  • (13) a step of forming one insulating layer constituting the multilayer substrate; and forming at least a part of a winding portion of a multilayer coil parallel to the multilayer substrate on the insulating layer in the multilayer substrate.
  • At least one of the steps forming at least a part of the winding portion of the multilayer coil is defined as a winding portion of a multilayer coil parallel to the multilayer substrate and a winding of a multilayer coil perpendicular to the multilayer substrate.
  • the unit winding of the predetermined multilayer coil has a helical pattern that turns in the opposite direction when viewed from the same direction as other adjacent unit windings, and A method of manufacturing a multilayer coil, further comprising the sets of windings being alternately connected at the tips or ends of the spiral pattern.
  • the method for manufacturing a multilayer coil further comprising the vertical connection portion being a bump connecting an adjacent conductive layer via an insulating layer.
  • At least one of the steps is carried out by a build-up method, and the vertical connection portion is a via or a through hole connecting an adjacent conductive layer through an insulating layer.
  • a method for manufacturing a multilayer coil further comprising a step of forming a core structure made of a magnetic material inside the multilayer coil.
  • the multilayer coil is a motor-field coil, the central axis of the multilayer coil is oriented toward the rotation axis of the motor, and the multilayer coils are mutually equal.
  • a method of manufacturing a field coil for a motor further comprising a plurality of multilayer coils arranged at intervals.
  • Forming a circuit forming a second circuit included in the circuit of the non-contact type IC card inside or on the surface of the multilayer substrate, and connecting the multilayer coil and the first circuit And connecting the planar coil and the second circuit.
  • the first circuit is operated by an output from the multilayer coil
  • the second circuit is A method of manufacturing a circuit of a non-contact type IC card, further comprising being operated by an output of the IC card.
  • FIG. 1 is a schematic perspective view showing an example of the multilayer coil according to claims 1 and 12.
  • FIG. 2 is a conceptual perspective view showing an example of the multilayer coil according to claims 2 and 13.
  • FIG. 3 is a conceptual perspective view showing an example of the multilayer coil according to claims 3 and 16.
  • FIG. 4 is a conceptual perspective view showing an example of the multilayer coil according to claims 4 and 16.
  • FIG. 5 is a perspective view of a substrate at an early stage of manufacturing the multilayer coil of FIG.
  • FIG. 6 is a perspective view of a substrate in an intermediate stage of manufacturing the multilayer coil of FIG.
  • FIG. 7 is a perspective view of the substrate at the initial stage of manufacturing the multilayer coil of FIG.
  • 8A and 8B are cross-sectional views for explaining the production of the multilayer coil of FIG. 2 by the build-up method.
  • FIG. 9 is a sectional view for explaining the production of the multilayer coil by the batch lamination method.
  • FIG. 10 is a cross-sectional view illustrating the formation of an insulating layer.
  • 11A, 11B and 11C are cross-sectional views for explaining via formation.
  • FIGS. 12A, B, C, and D are cross-sectional views for explaining the conductivity of vias for forming a circuit.
  • FIGS. 13A, 13B and 13C are cross-sectional views illustrating connection by bumps.
  • FIG. 14 is an initial manufacturing cross-sectional view of a circuit outer layer portion.
  • FIG. 15 is a cross-sectional view of the outer layer portion of the circuit.
  • FIG. 16 is a cross-sectional view before press working.
  • FIG. 17 is a perspective view of an initial substrate for manufacturing a multilayer coil having a magnetic core structure.
  • FIG. 18 is a plan view when two multilayer coils are arranged for a motor.
  • FIG. 19 is a plan view in a case where three multilayer coils are arranged for each module.
  • FIG. 20 is a perspective view showing an example of power supply unit wiring of a multilayer coil.
  • FIG. 21 is a plan view showing an example of the non-contact type IC card according to claim 8.
  • FIG. 22 is a conceptual perspective view showing an example of the multilayer coil according to claims 4 and 16.
  • FIG. 23 is a conceptual perspective view showing an example of the multilayer coil according to claim 5.
  • FIG. 24 is a perspective conceptual view showing an example of the antenna according to claim 18. BEST MODE FOR CARRYING OUT THE INVENTION
  • the device has a structure in which conductive circuits 2 are formed in multiple layers (four layers in the drawing) in a direction perpendicular to the plane of the substrate 1.
  • the winding portion of the coil parallel to the multilayer substrate is formed as a part of the conductive layer to be laminated, and the winding portion perpendicular to the multilayer substrate is formed between the adjacent conductive layers via the insulating layer. It is formed as a connecting bump, via or through hole.
  • a plurality of coils are simultaneously formed in the multilayer substrate in the process of manufacturing the multilayer substrate by utilizing a known multilayer substrate (print substrate) manufacturing technique such as a build-up method. It is possible to do.
  • a coil-shaped circuit 3 is formed so as to have a circuit surface in a direction perpendicular to the plane of the substrate 1, and adjacent circuits via an insulating layer are viewed from the same direction.
  • a multilayer circuit which is spirally patterned in a direction opposite to each other and electrically connected to each other may be one having a small number of turns on each circuit surface constituting the multilayer as shown in FIG. Even if the number of coils is the same, a stronger inductance is given than a multilayer coil in which the winding direction of the circuit of each layer is the same.
  • the unit windings of the coil-shaped circuit 3 each have a spiral pattern that turns in the opposite direction when viewed from the same direction as the other adjacent unit windings, and the unit windings adjacent to each other Is different from the configuration of the multilayer coil shown in FIG. 1 in that it is connected to each other at the tips or ends of the spiral pattern.
  • the core of the coil (the position penetrating through the center of each circuit surface) is composed mainly of a magnetic substance made of a simple substance such as iron or nickel, or an alloy or its compound.
  • the multilayer coil of the present invention can be manufactured by applying various known methods.
  • the present invention will be described by way of examples. However, these are examples, and the present invention is not limited to these examples.
  • FIG. 5 a conductor pattern is formed on both sides of a well-known substrate, for example, a copper-clad glass epoxy laminate 5.
  • a substrate for example, a copper-clad glass epoxy laminate 5.
  • 6 is a pattern on the upper surface of the substrate
  • 7 is a pattern on the lower surface.
  • a subtractive method can be applied to the production of this pattern.
  • a substrate whose surface is not conductive it can be formed by a full additive method, a semi-additive method, or printing of a conductive paste.
  • the coil In order to use the coil as an antenna coil and to increase the opening of the coil in order to increase the inductance, it is possible to solve the problem by using a thick substrate 5.
  • it can also be manufactured by forming a pattern corresponding to the outermost layer on each single-sided plate, laminating with insulating sheets or prepregs interposed therebetween, and then making holes and performing electrical connection processing.
  • the multilayer coil of FIG. 2 which is an example of the means (2) and (7) can be manufactured by forming the substrate into a multilayer structure (corresponding to the manufacturing method of the means (14)). Public knowledge Conventional methods can be applied, but because of the structurally blind vias, appropriate processes are required.
  • an inner layer pattern 9 as shown in FIG. 7 is created.
  • a double-sided copper-clad laminate can be formed by a known method, such as drilling a hole, conducting through holes by plating, or patterning the surface by a subtractive method.
  • An insulating layer and a conductive layer may be formed on both sides of the inner layer 9 to perform patterning and electrical connection.
  • an insulating layer is formed on the substrate including the inner layer 9.
  • a glass epoxy-based or aramid resin-based pre-reader a liquid or film-like thermoplastic or thermosetting resin composition, or a copper foil and an insulating resin layer, which is generally called a resin-coated copper foil, is used.
  • a resin-coated copper foil is used.
  • One that has been integrated can be used.
  • the formation of the insulating layer is performed, for example, as follows. As shown in FIG. 8A, prepregs 10, unpatterned copper foil 11, or resin-coated copper foil 12 as shown in FIG. As described above, these are collectively laminated and cured by a lamination press method, and an insulating layer and a conductive layer are integrally formed. (Alternatively, as shown in FIG. 10, the liquid composition is applied onto the substrate 9 by a known and common method such as screen printing, force coating, spray coating, or the like, and then exposed to UV, electron beam, heat, or the like. Alternatively, the composition in the form of a film is pasted on the substrate by a method such as roll or lamination, and cured by a predetermined method to obtain an insulating layer 13.
  • a via is formed.
  • a via 14 is formed at a predetermined position on the obtained substrate by using a drill, a laser, etc.
  • Fig. 11A shows a case where a pre-predator 10 and a copper foil 11 are used as insulating layers and conductive layers.
  • Fig. 11B shows the case of using a resin-coated copper foil 12
  • Fig. 11C shows the case of using a liquid or film-like thermoplastic or thermosetting resin composition.
  • a carbon dioxide gas laser widely used for forming blind vias is used when a conductive layer is also formed together with an insulating layer by etching, if necessary, a conductor at a predetermined position is removed by etching if necessary. Mask processing may be performed.
  • a conductive layer is formed together with an insulating layer using a pre-predeer or a resin-coated copper foil, for example, as shown in Fig. 12A
  • a conductive paste in which conductive powder such as silver or copper is blended into vias is used. Is embedded by printing, dispensing, etc., and hardened by a predetermined method.
  • a normal through-hole plating that is, a method in which a plating catalyst is applied in a via, an electroless plating is performed, and then, a plating layer 16 is formed by performing an electrolytic plating. Electrical connection is achieved.
  • the insulating layer is formed using a liquid or film-like composition, as shown in FIG.
  • the blind via is made conductive by the conductive paste 15 or the plating layer 16 and connected.
  • the conductive via of the blind via may be performed first.
  • a catalyst is applied to the substrate on which the insulating layer and the blind via are formed, the electroless plating is performed, and if necessary, the electroconductive plating is performed.
  • the formation of the vias and the conduction of the blind vias can also be performed at once. In this case, the conduction of the via via can also be performed by the conductive paste 15.
  • the insulating layer, the conductive layer, and the electrical connection can be collectively performed by the following method. That is, as shown in FIGS. 13A to 13C, a sharp bump 18 is formed at a predetermined location on the inner layer circuit 9 by using a conductive paste or the like, and then (FIG. 13A) prepreg Pressing after placing 10 and copper foil 11 or (Fig. 13B) Film-shaped insulator 13 and copper foil 11 or (Fig. 13C) Resin-coated copper foil 12 As a result, the pointed conductive bumps 18 penetrate the insulating layer and realize connection with the conductive layer.
  • the hole When using the above liquid or film-shaped insulating material using a through-hole substrate connected by plating, or when further laminating on an insulating layer with a blind pier formed once by the build-up method, fill the hole.
  • the surface may be smoothed by filling the through-holes or blind vias with an ink or paint treatment.
  • a four-layer antenna coil using glass epoxy prepreg as the insulating layer is described. That is, as shown in FIG. 14, a predetermined position on the base material 19 side of the copper-clad single-sided glass epoxy substrate is punched using a laser or the like. Subsequently, electric plating is performed using the copper foil 11 as an electrode, and the resulting hole is filled with the plating 20. Then, a low melting point metal bump 21 is successively formed by a plating method.
  • the copper foil 11 is etched into a predetermined pattern as shown in FIG.
  • the same composition 22 as that used for the insulating layer is thinly applied to the bump side and semi-cured.
  • the one shown in FIG. 15 manufactured from this single-sided substrate is the outermost layer, that is, the first and fourth layers.
  • the inner layer 9 is aligned with the outermost layer in Fig. 15, and the semi-cured composition is removed from the bumps by pressing to form an interlayer insulating layer.
  • the bumps are electrically connected to the conductor in the inner layer, and an antenna coil having a four-layer structure is manufactured.
  • a known and commonly used insulating material can be used for the insulating layer.
  • epoxy resin, bismaleimide-triazine resin, polyphenylene ether resin, polyetheretherketone resin, polyimide resin, and others examples thereof include a liquid or film-like thermoplastic or thermosetting compound obtained by mixing a curing agent and an inorganic filler, and a prepreg mixed with a glass cloth or the like.
  • thermoplastic or thermosetting compound obtained by mixing a curing agent and an inorganic filler, and a prepreg mixed with a glass cloth or the like.
  • ceramic materials can be used as the insulating layer.
  • a coil can be formed by stacking and firing a sheet-like composition generally called a green sheet.
  • the thickness of the insulating layer can be arbitrarily set according to the application, but from the viewpoint of insulation reliability, it is preferably about 10 to 300 microns in practical use.
  • the thickness of the conductor can be arbitrarily set in accordance with the application as in the case of the insulating layer, but is preferably about 5 microns or 200 microns in practice.
  • the wiring pattern of each layer can be formed by a known method such as a subtractive method, a full additive method, a semi-additive method, and a transfer method.
  • a known method such as a subtractive method, a full additive method, a semi-additive method, and a transfer method.
  • a known material such as a conductive paste containing various metals, an electroless or electrolytic plating film can be used.
  • the coil of the present invention can have a structure in which a stronger inductance is obtained by having a core structure mainly composed of a magnetic material at the center of the coil. That is, the structure is as shown in FIGS.
  • a core structure 4 mainly composed of a magnetic material is formed in a base material serving as a base.
  • the core structure 4 is subjected to press working in a state where a rod-shaped magnetic body is sandwiched between the pre-preda when manufacturing the base material.
  • a core structure 4 is formed using a magnetic paste obtained by kneading and dispersing a magnetic substance powder in a polymer on a base material, and then performing a drilling process and the like.
  • the formation of the insulating layer and the conductive layer and the connection between the layers are performed by the method described above.
  • the magnetic material is generally composed of a simple substance such as iron or nickel or an alloy or a compound thereof. What is used can be used.
  • the length of the core structure mainly composed of a magnetic material is arbitrary as long as it does not exceed the length of the coil. Also, the thickness and width thereof can be set arbitrarily as long as the insulation with the coil formed therearound is maintained.
  • the motor can be formed by preparing the coil 23 (coils in FIGS. 1 to 4) (field coil), forming the substrate into a required shape, attaching a shaft of the motor and a brush, and integrally shaping.
  • the coil 23 coil in FIGS. 1 to 4
  • field coil field coil
  • the shaft can be integrated by drilling a predetermined position on the substrate on which the coil is formed, using a drill, etc., and then attaching a shaft suitable for the motor.
  • the integration can also be achieved by bonding a bin, which is used for a PGA (pin grid array), which is a form of semiconductor package, on a substrate.
  • the brush part can be a general one for a single motor. However, the motor part can be further multi-layered to form the brush part as a whole.
  • Each coil must be connected to a power supply, similar to conventional motor coils. If you want to create a coil by the various methods described above and wire the power supply IN (IN) side and OUT (OUT) side close to each other, for example, as shown in FIG. .
  • IC 1 (30), a conventional antenna coil 31 and IC 2 (32), and an antenna coil 23 of the present invention are mounted on a card.
  • the output combining means 33 combines or switches the outputs by a known maximum ratio combining receiving method, a selective combining receiving method, an equal gain combining receiving method, or the like. With this antenna, fluctuations in antenna output due to fluctuations in the polarization plane of radio waves can be reduced.
  • the multilayer coil of the present invention may have a multilayered structure of a circuit having a plurality of coils on the same plane as shown in FIG. Furthermore, as shown in Fig. 23, by providing a rod-shaped core structure 4 mainly composed of a magnetic material at a position penetrating through the center of each circuit surface, a multilayer coil with a stronger inductance can be obtained. . Further, the core structure 4 can be provided in all or some of the plurality of coils at the center. Furthermore, a core structure 4 may be provided at all or a part of the plurality of coils in addition to the center of each circuit surface to form a multilayer coil capable of obtaining a stronger inductance.
  • the above-described multilayer coil according to the present invention can set the number of turns of the coil more freely than the conventional one and has a strong inductance.
  • the degree of freedom in design is dramatically improved.
  • the coil of the present invention can be applied to a general printed circuit board manufacturing process, it is possible to produce an overwhelmingly fine conductor as compared with an enameled wire.
  • the coil is not only inexpensive, but also has essentially no variation. Therefore, a device for absorbing performance variations conventionally incorporated in a driven part is not required.
  • This coil is not only suitable for use as an antenna coil for non-contact type IC cards, B 1 uet 0 'modules, RF tags, etc., but is also excellent as a coil for motors . Furthermore, by combining with a conventional coil, it is possible to provide a non-contact type high-performance IC card capable of independently driving two functions.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

La présente invention concerne un enroulement multicouche compact dont la structure permet de réaliser un tracé conducteur fin, dont on peut déterminer à volonté le nombre de tours, et dont l'inductance peut être importante. L'enroulement se compose d'une pluralité de couches spiralées dont la surface à circuit se présente perpendiculairement au plan du substrat. En faisant passer la structure de noyau magnétique par le centre de chaque surface à circuit de l'enroulement multicouche, l'invention permet d'obtenir une inductance plus élevée.
PCT/JP2002/004239 2001-04-27 2002-04-26 Enroulement multicouche et procede de fabrication WO2002089157A1 (fr)

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JP2002586364A JPWO2002089157A1 (ja) 2001-04-27 2002-04-26 多層コイルおよびその製造方法

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JP2001132882 2001-04-27
JP2001-132882 2001-04-27

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Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006120997A1 (fr) * 2005-05-11 2006-11-16 Namiki Seimitsu Houseki Kabushikikaisha Bobine cylindrique et micromoteur cylindrique l’utilisant
WO2007007639A1 (fr) * 2005-07-07 2007-01-18 Toda Kogyo Corporation Antenne magnétique
US7170384B2 (en) 2004-12-30 2007-01-30 Samsung Electro-Mechanics Co., Ltd. Printed circuit board having three-dimensional spiral inductor and method of fabricating same
US7443362B2 (en) * 2005-07-19 2008-10-28 3M Innovative Properties Company Solenoid antenna
WO2008133018A1 (fr) * 2007-04-13 2008-11-06 Murata Manufacturing Co., Ltd. Antenne de type à couplage de champ magnétique, module d'antenne de type à couplage de champ magnétique, dispositif d'antenne de type à couplage de champ magnétique et leurs procédés de fabrication
JP2009123058A (ja) * 2007-11-16 2009-06-04 Dainippon Printing Co Ltd 非接触型ｉｃタグ及び非接触型ｉｃタグの製造方法
JP4775440B2 (ja) * 2006-06-01 2011-09-21 株式会社村田製作所 無線ｉｃデバイス及び無線ｉｃデバイス用複合部品
US8072387B2 (en) 2005-07-07 2011-12-06 Toda Kogyo Corporation Magnetic antenna and board mounted with the same
CN102569249A (zh) * 2010-12-08 2012-07-11 财团法人工业技术研究院 立体式电感
US8353459B2 (en) 2007-04-06 2013-01-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2013081327A (ja) * 2011-10-05 2013-05-02 Jtekt Corp 電動機用のステータおよびステータの製造方法
JP2013247436A (ja) * 2012-05-24 2013-12-09 Murata Mfg Co Ltd コイルアンテナおよび通信端末装置
KR101395256B1 (ko) 2010-07-23 2014-05-16 한국전자통신연구원 무선 전력 전송 장치 및 그 제작 방법
CN104204834A (zh) * 2012-03-29 2014-12-10 株式会社村田制作所 磁场探头
JP2015207614A (ja) * 2014-04-18 2015-11-19 日本電信電話株式会社 直交型ソレノイドインダクタ
JP5930137B1 (ja) * 2014-12-19 2016-06-08 株式会社村田製作所 無線ｉｃデバイス、樹脂成型体およびその製造方法
WO2016098379A1 (fr) * 2014-12-19 2016-06-23 株式会社村田製作所 Dispositif de circuit intégré sans fil, et corps moulé en résine ainsi que procédé de fabrication de celui-ci
WO2016143584A1 (fr) * 2015-03-09 2016-09-15 株式会社村田製作所 Dispositif de bobine et dispositif électronique
JP2018093650A (ja) * 2016-12-06 2018-06-14 三菱電機株式会社 積層コイル、固定子およびモータ
CN112425050A (zh) * 2018-06-15 2021-02-26 劳斯莱斯德国有限两合公司 线圈、电机和混电空中行驶工具
KR102239126B1 (ko) * 2019-11-19 2021-04-12 한양대학교 산학협력단 전류 검출이 가능한 적층형 회로 구조체
JP2022520951A (ja) * 2019-02-14 2022-04-04 株式会社 ハイディープ スタイラスペン

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JPH11345713A (ja) * 1998-06-02 1999-12-14 Nissha Printing Co Ltd 多層プリント配線板とその製造方法
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EP1079463A2 (fr) * 1999-08-24 2001-02-28 Rangestar International Corporation Antenne dipôle asymétrique
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Publication number Priority date Publication date Assignee Title
JPS59159648A (ja) * 1983-02-28 1984-09-10 Hitachi Ltd 電機子コイルの製造方法
JPH04237106A (ja) * 1991-01-21 1992-08-25 Nippon Telegr & Teleph Corp <Ntt> 集積化インダクタンス素子及び集積化トランス
JPH0945866A (ja) * 1995-08-02 1997-02-14 Hitachi Ltd マイクロ波集積回路
JPH10189339A (ja) * 1996-11-19 1998-07-21 Samsung Electron Co Ltd 半導体素子及びその製造方法
JPH1155165A (ja) * 1997-08-06 1999-02-26 Nippon Soken Inc Ｒｆタグ用送受信機
JPH11204341A (ja) * 1998-01-13 1999-07-30 Mitsubishi Materials Corp 固体電子部品
JPH11345713A (ja) * 1998-06-02 1999-12-14 Nissha Printing Co Ltd 多層プリント配線板とその製造方法
JP2000040620A (ja) * 1998-07-24 2000-02-08 Toshiba Corp インダクタ及び該インダクタを使用した回路装置
EP1079463A2 (fr) * 1999-08-24 2001-02-28 Rangestar International Corporation Antenne dipôle asymétrique
JP2001101370A (ja) * 1999-10-04 2001-04-13 Dainippon Printing Co Ltd 情報処理媒体

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7170384B2 (en) 2004-12-30 2007-01-30 Samsung Electro-Mechanics Co., Ltd. Printed circuit board having three-dimensional spiral inductor and method of fabricating same
WO2006120997A1 (fr) * 2005-05-11 2006-11-16 Namiki Seimitsu Houseki Kabushikikaisha Bobine cylindrique et micromoteur cylindrique l’utilisant
US8072387B2 (en) 2005-07-07 2011-12-06 Toda Kogyo Corporation Magnetic antenna and board mounted with the same
WO2007007639A1 (fr) * 2005-07-07 2007-01-18 Toda Kogyo Corporation Antenne magnétique
US8159405B2 (en) 2005-07-07 2012-04-17 Toda Kogyo Corporation Magnetic antenna and board mounted with the same
US7443362B2 (en) * 2005-07-19 2008-10-28 3M Innovative Properties Company Solenoid antenna
US8544754B2 (en) 2006-06-01 2013-10-01 Murata Manufacturing Co., Ltd. Wireless IC device and wireless IC device composite component
JP4775440B2 (ja) * 2006-06-01 2011-09-21 株式会社村田製作所 無線ｉｃデバイス及び無線ｉｃデバイス用複合部品
US8353459B2 (en) 2007-04-06 2013-01-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2008133018A1 (fr) * 2007-04-13 2008-11-06 Murata Manufacturing Co., Ltd. Antenne de type à couplage de champ magnétique, module d'antenne de type à couplage de champ magnétique, dispositif d'antenne de type à couplage de champ magnétique et leurs procédés de fabrication
CN101657938A (zh) * 2007-04-13 2010-02-24 株式会社村田制作所 磁场耦合型天线、磁场耦合型天线模块及磁场耦合型天线装置、及这些的制造方法
GB2461443B (en) * 2007-04-13 2012-06-06 Murata Manufacturing Co Magnetic field coupling antenna module arrangements including a magnetic core embedded in an insulating layer and their manufacturing methods.
GB2461443A (en) * 2007-04-13 2010-01-06 Murata Manufacturing Co Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device,and their manufacturing methods
CN101657938B (zh) * 2007-04-13 2014-05-14 株式会社村田制作所 磁场耦合型天线、磁场耦合型天线模块及磁场耦合型天线装置、及这些的制造方法
JP2009123058A (ja) * 2007-11-16 2009-06-04 Dainippon Printing Co Ltd 非接触型ｉｃタグ及び非接触型ｉｃタグの製造方法
KR101395256B1 (ko) 2010-07-23 2014-05-16 한국전자통신연구원 무선 전력 전송 장치 및 그 제작 방법
CN102569249A (zh) * 2010-12-08 2012-07-11 财团法人工业技术研究院 立体式电感
JP2013081327A (ja) * 2011-10-05 2013-05-02 Jtekt Corp 電動機用のステータおよびステータの製造方法
CN104204834A (zh) * 2012-03-29 2014-12-10 株式会社村田制作所 磁场探头
JP2013247436A (ja) * 2012-05-24 2013-12-09 Murata Mfg Co Ltd コイルアンテナおよび通信端末装置
JP2015207614A (ja) * 2014-04-18 2015-11-19 日本電信電話株式会社 直交型ソレノイドインダクタ
JP5930137B1 (ja) * 2014-12-19 2016-06-08 株式会社村田製作所 無線ｉｃデバイス、樹脂成型体およびその製造方法
WO2016098379A1 (fr) * 2014-12-19 2016-06-23 株式会社村田製作所 Dispositif de circuit intégré sans fil, et corps moulé en résine ainsi que procédé de fabrication de celui-ci
US10153810B2 (en) 2014-12-19 2018-12-11 Murata Manufacturing Co., Ltd. Wireless IC device, molded resin article, and method for manufacturing wireless IC device
WO2016143584A1 (fr) * 2015-03-09 2016-09-15 株式会社村田製作所 Dispositif de bobine et dispositif électronique
JPWO2016143584A1 (ja) * 2015-03-09 2018-01-25 株式会社村田製作所 コイルデバイスおよび電子デバイス
JP2018093650A (ja) * 2016-12-06 2018-06-14 三菱電機株式会社 積層コイル、固定子およびモータ
CN112425050A (zh) * 2018-06-15 2021-02-26 劳斯莱斯德国有限两合公司 线圈、电机和混电空中行驶工具
JP2022520951A (ja) * 2019-02-14 2022-04-04 株式会社 ハイディープ スタイラスペン
US11662837B2 (en) 2019-02-14 2023-05-30 Hideep Inc. Stylus pen
JP7514023B2 (ja) 2019-02-14 2024-07-10 株式会社 ハイディープ スタイラスペン
KR102239126B1 (ko) * 2019-11-19 2021-04-12 한양대학교 산학협력단 전류 검출이 가능한 적층형 회로 구조체

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