WO2007126130A1 - ソルダーレジスト材料及びそれを用いた配線板並びに半導体パッケージ - Google Patents
ソルダーレジスト材料及びそれを用いた配線板並びに半導体パッケージ Download PDFInfo
- Publication number
- WO2007126130A1 WO2007126130A1 PCT/JP2007/059420 JP2007059420W WO2007126130A1 WO 2007126130 A1 WO2007126130 A1 WO 2007126130A1 JP 2007059420 W JP2007059420 W JP 2007059420W WO 2007126130 A1 WO2007126130 A1 WO 2007126130A1
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- WIPO (PCT)
- Prior art keywords
- resin
- solder resist
- resist material
- layer
- weight
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H—ELECTRICITY
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Definitions
- the present invention relates to a solder resist material and a semiconductor package as well as a wiring board using the solder resist material.
- a wiring board for mounting a semiconductor chip made of various materials such as plastic or ceramics such as a substrate or an interposer is used. It is used for electrical connection between the electrodes of the semiconductor chip and the wiring board. Circuits constructed on this semiconductor chip mounting circuit board are introduced into electronic devices that are smaller, thinner and more dense. Therefore, the thickness of the circuit board is smaller than that of a general circuit board. The wire is very thin and the wiring is very thin. In such a package type, when the electrical connection between the electrode of the semiconductor chip and the wiring board is made, the fine wiring is connected in a high temperature atmosphere by solder reflow, etc., so that the fine wiring is protected. Need arises. As the protective layer, solder resist materials with various resin compositions have been developed.
- a solder resist is usually formed with an opening for mounting a semiconductor chip or an electronic component.
- a pattern is formed in the opening of the solder resist
- a photomask is laminated and exposed by photographic method, and then developed with a developing solution such as sodium carbonate, sodium hydroxide, or tetramethylammonium hydride (TMAH) to form an aperture.
- TMAH tetramethylammonium hydride
- the solder resist that forms apertures by exposure and development has a low glass transition temperature, a low elastic modulus, and a large coefficient of linear expansion. There is a need for materials.
- an object of the present invention is to provide a solder resist material that can suppress warping of a package.
- the present invention also provides a solder resist material having a low linear expansion coefficient and a high elasticity, excellent heat resistance and thermal shock reliability, and capable of forming fine fine holes by laser irradiation. Is one of the purposes.
- Another object of the present invention is to provide a wiring board that is excellent in low linear expansion coefficient, heat resistance, thermal shock reliability, etc., particularly in a thin wiring board.
- the present invention provides the following solder resist material and wiring board. It is.
- It has at least a first resin layer, a second resin layer, and a fiber substrate-containing layer, and the fiber substrate-containing layer is interposed between the first resin layer and the second resin layer Solder resist material.
- the ratio of the thickness B 1 of the first resin layer to the thickness B 2 of the second resin layer B 2 / B 1 is 0 and satisfies B 2ZB 1 ⁇ 1, [1] or [2 ] Solder resist material as described.
- solder resist material according to any one of [1] to [3], wherein the fiber substrate constituting the fiber substrate-containing layer is selected from a glass fiber substrate and an organic fiber substrate.
- the glass fiber base material used in the solder resist material of the present invention is preferably one that has been treated with an epoxysilane-based force pulling agent.
- the fiber substrate constituting the fiber substrate-containing layer is a glass fiber substrate having a coefficient of linear expansion (CTE) of 6 ppm or less, according to any one of [1] to [4] Solder One resist material.
- CTE coefficient of linear expansion
- the resin composition constituting the first resin layer and the second resin layer includes cyanate resin and Z or a prepolymer thereof, an epoxy resin substantially free of halogen atoms, and substantially halogen atoms.
- the solder resist material according to any one of [1] to [5], which contains a phenoxy resin not contained and an imidazole compound.
- the cyanate resin used in the solder resist material of the present invention is preferably a nopolac type cyanate resin.
- the epoxy resin is preferably an arylalkylene type epoxy resin.
- the imidazole compound preferably has two or more functional groups selected from an aliphatic hydrocarbon group, an aromatic hydrocarbon group, a hydroxyalkyl group, and a cyanoalkyl group.
- solder resist material according to any one of [1] to [6], wherein each of Na ions and C 1 ions contained in the solder resist material is l O p pm or less.
- the solder resist material further contains a pigment, from [i] to [7]
- the pigment used in the solder resist material of the present invention is preferably a green pigment. Further, the content of the pigment component in the green pigment is 0.01 to 5% by weight with respect to the total weight of the resin composition. / 0 is preferred.
- the pigment is a ratio of a weight ratio of 1:10 to 10: 1 in which the total amount of the yellow pigment not containing halogen and the orange pigment containing no Z or halogen and the amount of the blue pigment containing no halogen are:
- the solder resist material according to [8] which is a pigment prepared by
- a glass fiber base material is contained in a resin composition containing cyanate resin and Z or a prepolymer thereof, an epoxy resin substantially free of halogen atoms, a phenol resin substantially free of halogen atoms, and an imidazole compound. Solder resist material.
- a wiring board provided with a solder resist layer made of the solder resist material according to any one of [1] to [11].
- the laser used in the wiring board of the present invention is preferably a carbon dioxide laser, a third harmonic UV-Y AG laser, a fourth harmonic UV-Y AG laser, or an excimer laser.
- a semiconductor package comprising the wiring board according to [1 2] or [13].
- the fiber substrate-containing layer is interposed between the first resin layer and the second resin layer.
- Solder resist material is provided. Since the solder resist material of the present invention has a fiber base material-containing layer interposed between the first resin layer and the second resin layer, a thermosetting resin that does not contain the fiber base material containing layer or Compared with the photosensitive resin solder resist, it is possible to achieve a significantly lower linear expansion and higher elastic modulus.
- solder resist layer made of the solder resist material of the present invention By disposing such a solder resist layer made of the solder resist material of the present invention on a wiring board, warping of the package T / JP2007 / 059420 can be suppressed, and the thermal shock reliability of the thermal cycle etc. can be improved.
- the fiber base material-containing layer is unevenly distributed in the thickness direction of the solder resist material. If the amount of resin required differs depending on the circuit pattern of the inner layer, the resin may protrude or the resin that fills the circuit may be insufficient. Even in such a case, the solder resist material of the present invention changes the position in the thickness direction of the fiber substrate-containing layer, and appropriately adjusts the thicknesses of the first resin layer and the second resin layer, Circuits can be embedded sufficiently and unnecessary resin protrusion can be prevented.
- the resin composition constituting the first resin layer and the second resin layer is a cyanate resin and / or a prepolymer thereof, an epoxy resin substantially free of halogen atoms, and substantially halogen. Includes atom-free phenoxy resins, and imidazole compounds.
- the first resin layer and the second resin layer in the solder resist material are composed of the resin composition described above, so they have excellent flame retardancy, and even if they are peeled off during a thermal shock test such as a thermal cycle, etc.
- a solder resist having high heat resistance, high elastic modulus and low thermal expansion can be provided.
- a solder resist having excellent flame retardancy can be provided without using a halogen compound that is widely used as a flame retardant.
- solder resist material since there are few ionic impurities of Na ions or C 1 ions contained in the solder resist material, it is possible to provide a solder resist having excellent moisture resistance reliability.
- positioned is provided.
- the solder resist layer can be opened by a laser, and a fine opening can be formed.
- FIG. 1 is a schematic cross-sectional view schematically showing an example of the solder resist material of the present invention. is there.
- 1 is a fiber substrate-containing layer
- 10 is a solder resist material
- 21 is a first resin layer
- 22 is a second resin layer.
- FIG. 2 is a process diagram showing an example of a process for producing the solder resist material of the present invention.
- 2 is a solder resist material
- 5a and 5b are carrier materials
- 6 is a vacuum laminating apparatus
- 11 is a fiber substrate
- 61 is a laminating roll
- 62 is a hot air drying apparatus.
- Embodiments of a solder resist material of the present invention, a wiring board on which a solder resist layer made of the solder resist material is disposed, and a semiconductor package having the wiring board will be described in detail below.
- the solder resist material of the present invention has at least a first resin layer, a second resin layer, and a fiber substrate-containing layer, and the fiber substrate-containing layer is interposed between the first resin layer and the second resin layer. It will be.
- the solder resist material of the present invention has a fiber base material-containing layer interposed between the first resin layer and the second resin layer as described above, it has a low linear expansion coefficient and a high elastic modulus. Therefore, when used as a solder resist for a wiring board, it is possible to effectively suppress warping of the package. In addition, it is possible to improve the thermal shock reliability of the cold cycle and the like.
- FIG. 1 is a schematic cross-sectional view schematically showing an example of the solder resist material of the present invention.
- the fiber base material containing layer 1 is interposed between the first resin layer 21 and the second resin layer 2 2 to constitute the solder resist material 10 of the present invention.
- the fiber base material-containing layer 1 can be disposed at an arbitrary position along the thickness direction of the solder resist material 10.
- the resin amount of the first resin layer 21 and the second resin layer 22 can be adjusted according to the circuit pattern, thereby embedding the circuit. This can be performed sufficiently, and the excess resin can be prevented from protruding.
- the fiber base material containing layer 1 is preferably unevenly distributed in the thickness direction of the solder resist material 10.
- the fiber base material containing layer 1 is “unevenly distributed”, as shown in FIG. 1, with respect to the center line A—A in the thickness direction of the solder resist material 10. It means that the center of 1 is displaced.
- the fiber base material-containing layer 1 may partially overlap the center line A—A.
- the fiber base material-containing layer 1 in the solder resist material 10, can be unevenly distributed in the thickness direction of the solder resist material 10.
- the solder resist material 10 having a resin amount corresponding to the circuit pattern of the inner layer can be designed.
- the thickness of the thick first resin layer 21 is increased as shown in FIG.
- the ratio (B 2 / B 1) when B 1 and the thickness of the thin second resin layer 22 is B 2 is preferably such that 0 ⁇ B 2 / B 1 ⁇ 1.
- this ratio B 2 / B 1 is preferably 0.7 or less, particularly preferably 0.1 to 0.4.
- this ratio B 2 / B 1 is within the above range, the waviness of the fiber base material-containing layer can be reduced, and thereby the flatness of the solder resist material can be further improved.
- the solder resist material 10 of the present invention may have other components in addition to the first resin layer, the second resin layer, and the fiber base material-containing layer.
- you may have the base material (carrier film) used at the time of manufacture of a solder resist material on the surface of either the 1st resin layer or the 2nd resin layer, or both.
- a cover film may be provided on the outer surface of the first resin layer and Z or the second resin layer in order to prevent foreign matter from attaching or scratching. The carrier film and cover film may be peeled off when the solder resist material is used.
- the first resin layer and the second resin layer are, for example, filled with a resin composition. It is a resin layer formed into a film shape.
- the first resin layer and the second resin layer melt the resin component contained in the first resin layer and the second resin layer due to heat, etc. By embedding and then curing, it can be formed on the surface of the wiring board.
- the resin composition constituting the first resin layer and the second resin layer is not particularly limited as long as it has the functions as described above. It preferably has an elastic modulus and is excellent in heat resistance, thermal shock resistance, and moisture resistance reliability. Further, in order to cope with downsizing and high integration of electronic devices, it is preferable that the fine holes can be formed by laser irradiation.
- a thermosetting resin can be suitably used as the resin composition used in the present invention.
- additives such as a curing catalyst, a curing agent, an inorganic filler, a coupling agent, and a coloring agent can be blended as necessary.
- thermosetting resin used in the present invention examples include bisphenol type cyanate resins such as nopolac type cyanate resin, bisphenol A type cyanate resin, bisphenol E type cyanate resin, and tetramethylbisphenol F type cyanate resin.
- Cyanate resin Phenolic nopolac resin, Cresol nopolac resin, Nopolac type phenolic resin such as bisphenol A nopolac resin, Unmodified resole phenolic resin, Oil-modified resole phenolic resin modified with tung oil, Amani oil, Tarmi oil, etc.
- Phenolic resins such as resol phenolic resins such as: bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, bisphenol M type epoxy resin, Bisphenol type epoxy resin such as bisphenol P type epoxy resin, bisphenol Z type epoxy resin; Nopolac type epoxy resin such as phenol novolac type epoxy resin, cresol nopolac type epoxy resin; Biphenyl type epoxy resin, Biphenyl alcohol Type epoxy resin, arylene type epoxy resin, naphthalene type epoxy resin, anthracene type epoxy resin, phenoxy type epoxy resin, dicyclopentagen type epoxy resin, norbornene type epoxy Epoxy resins such as xy-resins, adamantane-type epoxy resins, fluorene-type epoxy resins; resins having a triazine ring such as urea (urea) resins, melamine resins; unsaturated polyester resins, bismaleimide resins, polyurethane resins,
- thermosetting resin is not particularly limited, but is 50 to 100 weight of the entire resin composition. / 0 is preferred. More preferably, it is 60 to 90% by weight. Within the above range, the meltability at the time of circuit embedding is improved. Although a resin having excellent flame retardancy such as brominated epoxy resin can be used as the thermosetting resin, it is desired to use a material that does not substantially contain a halogen atom due to the recent increase in environmental awareness. .
- the resin composition used in the present invention preferably contains a cyanate resin and / or its prepolymer as a thermosetting resin.
- cyanate resin By using cyanate resin, the thermal expansion coefficient of the resin layer can be reduced. Moreover, the flame retardance of the resin layer can be improved.
- cyanate resins have the advantage of being excellent in electrical properties (low dielectric constant, low dielectric loss tangent), mechanical strength, and the like.
- the resin composition constituting the first resin layer and the second resin layer includes a cyanate resin and Z or a precursor thereof, an epoxy resin that does not substantially contain a halo atom, and substantially It is preferable to include a phenoxy resin that does not contain a halogen atom. (i) Cyanate resin and Z or its prepolymer
- the resin composition used in the present invention preferably contains a cyanate resin and / or a prepolymer thereof. Thereby, the thermal expansion coefficient of the resin layer can be reduced, and flame retardancy can be improved.
- the method for obtaining cyanate resin and / or its prepolymer is not particularly limited. However, it can be obtained, for example, by reacting a cyanogen halide compound with phenols and, if necessary, prepolymerization by a method such as heating. Moreover, the commercial item prepared in this way can also be used.
- the type of cyanate resin is not particularly limited.
- bisphenol type cyanate resins such as nopolac type cyanate resin, bisphenol A type cyanate resin, bisphenol E type cyanate resin, and tetramethylbisphenol F type cyanate resin are available. Fats and the like can be mentioned.
- novolak-type cyanate resin is preferable.
- the heat resistance can be improved by increasing the crosslinking density, and the flame retardancy can be further improved. This is probably because the novolak cyanate resin has a high proportion of benzene rings due to its structure and is easily carbonized.
- the nopolac-type cyanate resin can be obtained, for example, by reacting a novolac-type phenol resin with a compound such as cyanogen chloride or cyanogen bromide. Moreover, the commercial item prepared in this way can also be used.
- nopolac cyanate resin for example, the one represented by the general formula (1) can be used.
- the weight average molecular weight of the nopolac-type cyanate resin represented by the general formula (1) is not particularly limited, but can be 5 0 to 4, 5 0 0, preferably 6 0 0 to 3, 0 0 0 is there.
- the weight average molecular weight is a value measured by GPC in terms of polystyrene.
- cyanate resin prepolymerized one should also be used. Can do. That is, a cyanate resin may be used alone, a cyanate resin having a different weight average molecular weight may be used in combination, or a cyanate resin and its prepolymer may be used in combination.
- the prepolymer is usually obtained by, for example, trimerizing a cyanate resin by a heat reaction or the like, and is preferably used for adjusting the moldability and fluidity of the resin composition. is there.
- the prepolymer is not particularly limited, but, for example, those having a trimerization rate of 20 to 50% by weight can be used.
- This trimerization rate can be determined using, for example, an infrared spectroscopic analyzer.
- the content of cyanate resin is not particularly limited. From the viewpoint of effectively expressing the properties of the cyanate resin, the content of the cyanate resin is preferably 5 to 50% by weight of the entire resin composition, more preferably 10 to 40%. % By weight.
- the content of the cyanate resin is preferably 5 to 50% by weight of the entire resin composition, more preferably 10 to 40%. % By weight.
- the resin composition used in the present invention preferably contains an epoxy resin that does not substantially contain a halogen atom.
- an epoxy resin that does not substantially contain a halogen atom.
- the epoxy resin is not particularly limited, and examples thereof include phenol novolac type epoxy resins, bisphenol type epoxy resins, naphthalene type epoxy resins, and arylene alkylene type epoxy resins. Among these, aryl alkylene type epoxy resins are preferable. Thereby, flame retardancy and moisture absorption solder heat resistance can be improved.
- arylene type epoxy resin means one or more repeating units.
- the epoxy resin having an arylene alkylene group include xylylene type epoxy resin and biphenyldimethylene type epoxy resin. Among these, biphenyldimethylene type epoxy resin is preferable.
- the biphenyldimethylene type epoxy resin for example, one represented by the general formula (2) can be used.
- n is preferably 1 to 10, and more preferably 2 to 5.
- the weight average molecular weight of the epoxy resin is not particularly limited, but is preferably 4,00 or less. More preferably, it is from 500 to 4,00, and particularly preferably from 800 to 3,00. By setting the amount within the above range, a solder resist having no tack property and excellent solder heat resistance can be obtained.
- the content of the epoxy resin is not particularly limited, but is preferably 5 to 50% by weight based on the entire resin composition. More preferably, it is 10 to 40% by weight.
- a solder resist excellent in hygroscopic solder heat resistance, adhesion and low thermal expansion can be obtained.
- the resin composition used in the present invention preferably contains a phenoxy resin that does not substantially contain a halogen atom.
- adhesion is improved when the solder resist material is thermocompression bonded to the insulating layer provided with the conductor circuit, and the solder ball for external connection of the solder resist layer is mounted and is positioned opposite to the conductor circuit.
- a laser is used to remove the resin residue (smear), but at that time, the resin residue can be easily removed by containing a phenoxy resin.
- substantially free of halogen atoms means that there is no circuit corrosion due to halogen atoms, and trace amounts of halogen atoms may be included to such an extent that reliability after mounting is not affected. It is not included.
- the phenoxy resin is not particularly limited, and examples thereof include a phenoxy resin having a bisphenol skeleton, a phenoxy resin having a nopolac skeleton, a phenoxy resin having a naphthalene skeleton, and a phenoxy resin having a biphenyl skeleton. Also, a phenoxy resin having a structure having a plurality of these skeletons can be used.
- those having a biphenyl skeleton and a bisphenol S skeleton are preferably used.
- the glass transition temperature can be increased due to the rigidity of the biphenyl skeleton.
- the combination ratio is not particularly limited.
- (1) :( 2) 2: 8 ⁇
- the molecular weight of the phenoxy resin is not particularly limited, but it is preferable to use a resin having a weight average molecular weight of 5 0 00 to 7 0 0 0 0, more preferably 5 0 0 0 to 5 0 0 0 0 preferable. More preferably, it is 1 0 0 0 0 to 4 0 0 0 0.
- the content of the phenoxy resin is not particularly limited, but the entire resin composition It is preferably 1 to 40% by weight. More preferably, it is 5 to 30% by weight. By setting the content of the phenoxy resin in the above range, a film composition is improved and a resin composition capable of maintaining low thermal expansion can be obtained. (b) Curing catalyst
- a curing catalyst can be used for the resin composition used in the present invention, if necessary.
- the curing catalyst is not particularly limited, and can be appropriately selected according to the type of the thermosetting resin to be used.
- organic metal salts such as zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bis-acetylacetonatecobalt (II), triacetylacetonate-cobalt (III), triethylamine, triptylamin, Tertiary amines such as diazabicyclo [2,2,2] octane, imidazole compounds, phenol compounds such as phenol, bisphenol A, norphenol, organic acids such as acetic acid, benzoic acid, salicylic acid, paratoluenesulfonic acid, etc. Or this mixture is mentioned. Among these, in the present invention, it is preferable to use an imidazole compound.
- the resin composition used in the present invention preferably contains an imidazole compound.
- the reaction of cyanate resin or epoxy resin can be promoted without lowering the insulating property of the solder resist.
- imidazole compound examples include, but are not limited to, 2-phenyl 4-methylolimidazole, 2-phenylenoyl 4-methyl-5-hydroxymethylenoreimidazole, 2-phenyl-1-4,5-dihydroxymethylimidazole.
- an imi having two or more functional groups selected from an aliphatic hydrocarbon group, an aromatic hydrocarbon group, a hydroxyalkyl group, and a cyanoalkyl group.
- a dazole compound is preferred, and 2-phenyl-4,5-dihydroxymethylimidazole is particularly preferred.
- the content of the curing catalyst may be appropriately selected in consideration of the type of resin and the curing time, and is not particularly limited.
- the content of the imidazole compound is not particularly limited, but is preferably 0.05 to 5% by weight, more preferably based on the total of the cyanate resin and the epoxy resin. Is 0.1 to 5% by weight, more preferably 0.1 to 3% by weight. Thereby, especially the heat resistance of the solder resist can be improved.
- epoxy resins such as brominated epoxy resin
- the curing agent and / or curing catalyst is not particularly limited as long as it is generally used as a curing agent or a curing catalyst for epoxy resins.
- an amine compound such as dicyandiamide is suitably used as the curing agent
- an imidazole compound such as 2-ethyl-4-methylimidazole is suitably used as the curing catalyst.
- the use amounts of the curing agent and the curing catalyst are not particularly limited, but are preferably 0.05 to 5% by weight, more preferably 0.1%, based on the content of the epoxy resin. -5% by weight, more preferably 0.1-3% by weight.
- the resin composition used in the present invention may further contain an inorganic filler.
- an inorganic filler As a result, low thermal expansion and flame retardancy can be improved.
- the elastic modulus can be improved by a combination of cyanate resin and Z or its prepolymer (particularly nopolac-type cyanate resin) and an inorganic filler.
- silica is preferable, and fused silica is particularly preferable because of its low expansion property.
- the fused silica has a broken shape and a spherical shape, but a spherical shape is preferred. By using fused silica having such a shape, the total amount of IB in the resin composition can be increased, and even in this case, good fluidity can be imparted.
- the average particle size of the inorganic filler 0. Is preferably 0 1 to 5 M m. More preferably, it is 0.2 to 2 ⁇ .
- the content of the inorganic filler is not particularly limited, but is preferably 20 to 70% by weight based on the entire resin composition. More preferably, it is 30 to 60% by weight.
- the resin composition used in the present invention may further contain a coupling agent.
- a coupling agent By using a coupling agent, the wettability of the interface between the resin and the inorganic filler can be improved, so that the heat resistance, particularly the moisture-absorbing solder heat resistance, can be improved.
- the coupling agent is not particularly limited, but it is preferable to use at least one coupling agent selected from an epoxy silane coupling agent, a titanate coupling agent, an amino silane coupling agent, and a silicone oil type coupling agent. . Thereby, the wettability of the interface between the resin and the inorganic filler can be particularly increased, and the heat resistance can be further improved.
- the content of the coupling agent is not particularly limited, but is preferably 0.05 to 3 parts by weight with respect to 100 parts by weight of the inorganic filler.
- a colorant can be added as necessary.
- green is an easy-to-see color when checking the opening and visually observing for a long time.
- black, green, red, blue, yellow, orange and the like can be mentioned, and green is particularly preferable.
- Chlorinated phthalocyanine green is used as the green colorant, but for dehalogenation, for example, a pigment made green by mixing a blue pigment and a yellow and / or orange pigment instead of chlorinated phthalocyanine is preferable.
- the blue pigment contained in the green pigment mixture is not particularly limited as long as it is a blue pigment containing no halogen atom in its compound structure.
- copper phthalocyanine blue C.I. Pigment Blue 1 5
- metal-free lid mouth cyanine blue C.I.Pigment Blue 1 6
- titanorephthalocyanine blue iron phthalocyanine blue
- nickel phthalocyanine blue Noley Anolemi phthalocyanine bunolei
- Tin phthalocyanine blue Anole power Li blue (C.I.P igment Bluee 1, 2, 3, 1 0, 1 4, 1 8, 1 9, 24, 5 6 , 5 7, 6 1)
- Sulfonated CuPc C.I. Pigment Bluee 1 7
- Bitumen C.I. Pigment Bluee 2 7
- Ultramarine C.I. Pig me nt B le 2 9
- cobalt blue C.
- the yellow pigment is not particularly limited as long as it does not contain a halogen atom in its compound structure.
- yellow pigments include monoazo yellow (C.I.Pigment Yellow 1, 4, 5, 9, 6 5, 74), benzidazolone yellow (C.I.Pigment Y ellow 1 2 0, 1 5 1, 1 75, 1 8 0, 1 8 1, 1 9 4), Frapantron Yellow (C.I. Pigmen t Yellow 2 4), Azzomechinole Yellow (C.I P i gm ent Y ellow 1 1 7, 1 2 9), anthraquinone yellow (C. I. P i gment Y ellow 1 2 3, 1 4 7), isoindoline yellow (C. 1.
- Pi gme nt Y ell ow 1 39, 1 8 5 diazo yellow (C. I. pi gme nt Y ell ow 1 55), condensed polycyclic system (C. I. Pigment Y ello 148, 1 82, 1 92), iron oxide (C.I. Pigment Ye llow 42), disazomethine (C.I.Pi gme nt Y e 1 1 ow 1 0 1), azo lake (C. I.
- the orange pigment is not particularly limited as long as it does not contain a halogen atom in its compound structure.
- orange pigments are perinone (C. I. Pigment Orange 43), benzimidazolone (C.I. Pigment Orange range 62), azomethine (C.I. Pigment Orange range 64). ), Diketopyro-oral pyrrole (C.I.Pi gment O range 7 1) and the like, especially benzimidazolone (C.I.Pi gment O range 6 2), azomethine (C.I. P i gmen t O range 64) is preferred.
- the mixing ratio of the blue pigment to the yellow pigment and the Z or orange pigment is the weight ratio of the yellow pigment and / or orange pigment to the blue pigment (blue pigment: yellow pigment and / or orange pigment). It is preferably 0 to 10: 1, and more preferably 3: 7 to 7: 3. 1: 1 0 to 1 0: Outside the range of 1, it does not look green and is not preferable.
- the organic solvent used to disperse the pigment component in the green pigment mixture used in the present invention includes acetone, methanol, methyl ethyl ketone, methyl isobutyl ketone, 2- (methoxymethoxy) ethanol, 2-butoxyethanol,
- Examples thereof include, but are not limited to, nonor, dipropylene glycolate, dipropylene glycol monomethine ether, dipropylene glycol monoethyl ether, and liquid polypropylene glycol.
- the organic solvent is not particularly limited as long as it has high compatibility with the pigment component and can be easily dispersed, and it is preferable to use a solvent that is easily dispersible in the resin composition.
- a physical dispersion there is no particular problem even if a stirrer or ultrasonic stirring is used.
- a blue pigment and a yellow and orange or orange pigment are mixed in advance and a green pigment is dispersed in a solvent in advance.
- the stirring time and the stirring speed are not particularly limited.
- the amount of the solvent when dispersed in the solvent in advance is preferably 20 to 20 parts by weight, more preferably 4 to 10 parts by weight with respect to 1 part by weight of the pigment. By making it within the above range, the dispersibility is good, and the solvent removal time when using the solder resist material is short and good.
- the proportion of the green pigment contained in the resin composition is preferably 0.1 to 10% by weight, more preferably 0.1 to 5% by weight in the resin composition. Within the above range, the hue is good and the circuit under the solder resist can be observed, and the circuit pad can be easily recognized by the laser irradiation device at the time of laser opening.
- the resin composition used in the present invention can contain additives such as an antifoaming agent and a leveling agent, if necessary, in addition to the components described above.
- the resin composition forming the first resin layer and the resin composition forming the second resin layer may be the same or different.
- different resin compositions may be used by changing the type and amount of resin used, or addition of inorganic fillers, etc. Different resin compositions may be obtained by changing the type and amount of the agent used. If resin compositions with different compositions can be used for the first resin layer and the second resin layer, it becomes possible to design the resin layer according to the required performance. There is an advantage that the width can be widened.
- the resin layer facing the inner layer circuit should have a flexible composition in consideration of embedding properties, and the opposite surface should have a hard composition in consideration of rigidity. Can do.
- the thickness of the first resin layer is not particularly limited, but is preferably thicker than the thickness of the second resin layer, and the circuit layer embedded by the first resin layer is embedded. It is sufficient if it is sufficient. For example, if the thickness of the embedded circuit layer is ⁇ and the thickness of the first resin layer is t, (TZ t) force
- T.sub.Zt 0.3.ltoreq.
- T.sub.Zt 0.5.ltoreq.
- T.sub.Zt 0.5.ltoreq.
- T.ltoreq.1.5 it is preferable to increase the thickness of the resin layer facing the inner layer circuit.
- the fiber base material-containing layer is a layer formed by impregnating the fiber base material with a resin material, and by having this, the solder resist material of the present invention has a low linear expansion and a high elastic modulus. Can be achieved.
- the fiber substrate used for the fiber substrate-containing layer is preferably selected from a glass fiber substrate and an organic fiber substrate.
- glass fiber substrate used in the present invention examples include glass fiber cloth and glass non-woven cloth. Of these, glass fiber cloth is preferable.
- the glass fiber substrate may be surface-treated with a coupling agent in order to improve adhesion. For example, there are aminosilane coupling treatment, biersilane coupling treatment, catoxysilane force coupling treatment, etc., and epoxysilane force coupling treatment is more suitable for impregnating the resin composition into the glass fiber substrate.
- Adhesion with cyanate resin can be improved by using a glass fiber substrate treated with an epoxy silane coupling agent.
- the organic fiber substrate used in the present invention include organic nonwoven fabrics and organic woven fabrics. By using these, the laser processability is excellent.
- a glass fiber base material in the present invention.
- a glass fiber substrate having a coefficient of thermal expansion (CTE) force of S 6 ppm or less it is preferable to use a glass fiber substrate having a coefficient of 3.5 ppm or less.
- CTE coefficient of thermal expansion
- a glass fiber substrate having a coefficient of 3.5 ppm or less By using the glass fiber base material having the linear expansion coefficient as described above, when the solder resist layer is formed on the wiring board using the solder resist material of the present invention, the warpage of the semiconductor package is more effectively suppressed. can do.
- the linear expansion coefficient can be measured by the method described in the examples.
- the glass fiber substrate used in the present invention preferably has a basis weight (weight of fiber substrate per lm 2 ) of 4 to 24 g / m 2 , more preferably 8 to 20 g / m 2. 2 More preferably 12 to 18 g / m 2 .
- the glass fiber substrate used in the present invention preferably has a Young's modulus of 6 2 to 100 GPa, more preferably 6 5 to 9 2 GPa, and still more preferably 8 6 to 9 2 GPa. It is.
- the Young's modulus of the glass fiber base is within the above range, for example, deformation of the wiring board due to reflow heat during semiconductor mounting can be effectively suppressed, so that the connection reliability of the electronic component is improved.
- the glass fiber substrate used in the present invention has a dielectric constant at 1 MHz of 3.8 to 11.1. It is preferably 1, more preferably 4.7 to 7.0, and still more preferably 5.4 to 6.8.
- the dielectric constant of the glass fiber substrate is in the above range, the dielectric constant of the solder resist can be reduced, which is suitable for a semiconductor package using a high-speed signal.
- E glass, S glass, NE glass, T glass and the like are suitably used as the glass fiber base material having the linear expansion coefficient, Young's modulus, and dielectric constant as described above.
- the thickness of the fiber base used in the present invention is preferably 5 to 35 / xm, more preferably 10 to 20 ⁇ , and still more preferably 14 to 15 ⁇ .
- the number of fiber base materials used is not limited to one, and a plurality of thin fiber base materials can be used. When a plurality of fiber base materials are used in piles, the total thickness only needs to satisfy the above range.
- the thickness 1 0 ⁇ 1 5 / X m, basis weight 8 ⁇ 1 8 g / m 2 and is glass nonwoven fabric it is preferable to use a glass fabric.
- a glass nonwoven fabric or glass woven fabric By using such a glass nonwoven fabric or glass woven fabric, the warpage of the semiconductor package can be more effectively prevented.
- the fiber base material-containing layer is a layer formed by impregnating the fiber base material with the resin composition constituting the first resin layer and the second resin layer.
- the thickness of the substrate-containing layer can be considered as the thickness of the fiber substrate. That is, the thickness of the fiber base material-containing layer is preferably 5 to 35 ⁇ m, more preferably 10 to 20 ⁇ , and still more preferably 14 to 15 m.
- the solder resist material of the present invention has a fiber base material-containing layer formed by impregnating a fiber base material such as a glass fiber base material or an organic fiber base material with a resin composition.
- a fiber base material such as a glass fiber base material or an organic fiber base material
- a resin composition excellent in thin wiring boards using solder resist materials and semiconductor packages in which semiconductor chips are mounted on thin wiring boards, there is little warping, and by selecting the composition of the resin composition appropriately, heat resistance, thermal shock
- the product is excellent in reliability and moisture resistance. Among them, high strength, low water absorption, and low thermal expansion can be achieved by having a fiber base material-containing layer obtained by impregnating a glass fiber base material with a resin composition.
- the solder resist material of the present invention comprises a fiber base material in a resin composition.
- the solder resist material of the present invention is 2007/059420 Glass fiber substrate is included in resin composition containing cyanate resin and Z or its prepolymer, epoxy resin substantially free of halogen atoms, phenoxy resin substantially free of halogen atoms and imidazole compound. It is preferable that
- the solder resist material of the present invention preferably has Na ions and C 1 ions of 10 ppm or less, respectively. As a result, the moisture resistance reliability of the solder resist can be further improved.
- Examples of the method for producing the solder resist material of the present invention include a method in which a resin composition is dissolved in an organic solvent to obtain a resin composition varnish, and this is impregnated and applied to a fiber substrate.
- a method in which a resin composition is dissolved in a solvent to prepare a resin composition base, and a fiber substrate is immersed in the resin composition varnish and a method in which the resin composition varnish is applied to a fiber substrate by various coaters And a method of spraying by a spray, a method of laminating a resin layer with a supporting substrate, and the like.
- a method of immersing the fiber base material in the resin composition varnish is preferable. Thereby, the impregnation property of the resin composition with respect to the fiber base material can be improved.
- a normal impregnation coating equipment can be used.
- the solvent used in the resin composition varnish desirably has good solubility in the resin component in the resin composition, but has an adverse effect. You may use a poor solvent in the range which is not.
- cyanate resin and / or its prepolymer, epoxy resin substantially free of halogen atoms, phenoxy resin substantially free of halogen atoms, imidazole compounds, and inorganic fillers may be used as methyl isobutyl ketone, methyl ethyl ketone, Dissolve in organic solvent such as tallacetate and cellosolvate, add additives as required, and stir at room temperature for 2-5 hours to obtain resin a adult varnish be able to.
- the inorganic filler is a resin that can be dissolved in cyanate resin and Z or its prepolymer, epoxy resin substantially free of halogen atoms, and phenoxy resin substantially free of halogen atoms.
- Pre-dispersing force ⁇ It is preferable to disperse in an organic solvent.
- inorganic 59420 By dispersing the filler, secondary agglomeration can be prevented and the inorganic filler does not disperse unevenly in the resist layer. A hole can be made.
- the organic solvents used here are acetone, methanol, methyl ethyl ketone, methyl isoptyl ketone, 21- (methoxymethoxy) ethanol, 2-butoxy ethanol, 21- (isopentyloxy) ethanol, 21- ( Xyloxy) Ethanol ⁇ ⁇
- the solid content of the resin composition varnish is not particularly limited, but is preferably 40 to 80% by weight, particularly preferably 50 to 65% by weight. Thereby, the impregnation property to the fiber base material of the resin composition varnish can be further improved.
- the solder resist material of the present invention can be obtained by impregnating the resin composition into the fiber substrate and drying it at a predetermined temperature, for example, 80 to 200 ° C.
- the resin composition varnish is applied to a substrate such as a PET film at a thickness of usually about 1 to 60 ⁇ m, and at a temperature of about 60 to 180 ° C. for about 5 to 10 minutes.
- a substrate such as a PET film
- the fiber base material is sandwiched between two resin compositions with a vacuum press laminator or the like as a solidified or prepolymerized resin composition. It is possible to obtain a solder resist material whose thickness is more accurately controlled by pressing.
- the film is filled from both sides of the fiber substrate.
- a method of laminating with a 9420-shaped resin layer is preferred.
- the amount of the resin composition impregnated into the fiber base material can be freely adjusted, and the moldability of the pre-preda can be improved.
- laminating a film-like resin layer it is more preferable to use a vacuum laminating apparatus or the like.
- FIG. 2 is a process diagram showing an example of a process for producing the solder resist material of the present invention.
- carrier materials 5 a and 5 b in which a resin composition is applied to a carrier film in advance, are manufactured, the carrier materials 5 a and 5 b are laminated on a fiber base material 11, and then the carrier film is peeled off.
- Solder resist material 2 is manufactured.
- a carrier material 5 a in which the first resin composition is applied to a carrier film and a carrier material 5 b in which the second resin composition is applied to another carrier film are manufactured.
- the carrier materials 5 a and 5 b are overlapped from both sides of the fiber base material under reduced pressure and bonded by the laminating roll 6 1.
- This can be a vacuum void or a substantial vacuum void.
- voids generated in the finally obtained solder resist material 2 can be reduced. This is because the decompression void or the vacuum void can be removed by the heat treatment described later.
- a vacuum box device or the like can be used as another device for joining the fiber base material 11 and the carrier materials 5a and 5b under such reduced pressure.
- heat treatment is performed at a temperature equal to or higher than the melting temperature of the resin applied to the carrier material by the hot air drying device 62.
- an infrared heating device for example, an infrared heating device, a heating tool device, a flat platen hot plate press device, etc. can be used.
- a solder resist material 2 including a fiber base material containing layer 1 impregnated with a resin can be obtained.
- the solder resist material of the present invention thus obtained has a higher elastic modulus than the current solder resist, and particularly has a significantly reduced expansion coefficient in the in-plane direction, so that it can be suitably used for a solder resist. . Further, since the solder resist material of the present invention can effectively suppress warping, it can be suitably used for a thin wiring board.
- the solder resist material of the present invention can be used after being laminated at a predetermined position such as a wiring board, heated and melted, and cured. For example, it is laminated at a predetermined position such as a wiring board, molded, and cured at 100 ° C to 260 ° C for 1 to 5 hours before use.
- the solder resist material of the present invention includes, for example, a BGA substrate, a BOC (Board On Ch i ⁇ ) substrate, a Si P (Syst em in Package) substrate, and a ToP for POP (Packageon Package).
- solder resist layer for circuit boards such as Bottom boards, rigid parts of module connection boards consisting of multilayer build-up wiring boards, flip chip BG A mounting interposers, passive components or the interposer mounting motherboard It is.
- the present invention also includes a wiring board having a solder resist layer made of the solder resist material of the present invention as described above.
- the solder resist layer of the wiring board of the present invention is provided with an opening (solder resist opening) for mounting a semiconductor chip, an electronic component, or the like.
- the method for forming the solder resist opening is not particularly limited, and a method of laminating after punching with a punch, a drill, or a laser in advance, or a method of laminating a solder resist layer on a wiring board, and It can be formed by irradiation or the like. Among these, it is preferable to use laser irradiation because it is easy to form fine apertures.
- the hole portion of the solder resist layer by laser irradiation such as a carbon dioxide gas laser, a third harmonic UV-YAG laser, a fourth harmonic UV-YAG laser, and an excimer laser.
- the laser to be used may be appropriately selected depending on the desired aperture size. For example, if the hole diameter is 10 to 10 ⁇ , the 3rd harmonic UV-YAG laser, 4th harmonic UV-YAG laser and It is preferable to use an excimer laser. In particular, in terms of fine workability, a third-order harmonic UV-YAG laser is more preferable, a fourth-order harmonic UV-YAG laser is more preferable, and an excimer laser is particularly preferable.
- the aperture diameter is 40 ⁇ !
- a semiconductor chip can be mounted on the wiring board of the present invention to obtain a semiconductor package.
- the present invention also includes the semiconductor package obtained as described above.
- the semiconductor package of the present invention since the solder resist layer made of the solder resist material of the present invention is disposed on the wiring board, the warpage of the semiconductor package can be effectively suppressed.
- the solder resist material of the present invention it is possible to meet the demand for miniaturization / thinning and high integration of semiconductor packages.
- the raw materials used in the examples and comparative examples are as follows.
- Epoxy resin AZ biphenyldimethylene type epoxy resin Nippon Kayaku Co., Ltd. ⁇ “NC-3000”, epoxy equivalent 275, weight average molecular weight 2000
- Epoxy resin BZ brominated epoxy resin manufactured by Japan Epoxy Resin Co., Ltd. “E p 5048”, epoxy equivalent 675
- Phenoxy resin AZ biphenyl epoxy resin and bisphenol S epoxy 0 It is a copolymer with resin, and the terminal part has an epoxy group: "YX-8100H30" manufactured by Japan Epoxy Resin Co., Ltd., weight average molecular weight 30000
- Curing catalyst A / imidazole compound “Shikoku Kasei Kogyo Co., Ltd.” “2-Ferreux 4, 5-Dihydroxymethylimidazole J
- Curing catalyst B / imidazole compound Shikoku Kasei Kogyo Co., Ltd. “2-Ethyl 4—Methinoreidamidole”
- a resin composition varnish 1 of 0 was prepared.
- the obtained resin composition varnish 1 was applied to a PET film as a base material to a thickness of 10 ⁇ m, heat-treated at 150 ° C. for 10 minutes, solidified by removing the solvent, and then resin composition Got.
- a resin composition varnish 3 was prepared.
- a solder resist material was obtained and evaluated in the same manner as in Example 1 except that the resin composition varnish 1 used in Example 1 was replaced with the resin composition varnish 3.
- Example 4
- Example 5 25 parts by weight of cyanate resin A, 25 parts by weight of epoxy resin A, 10 parts by weight of phenoxy resin A, and 0.2 part by weight of curing catalyst B were dissolved and dispersed in methyl ethyl ketone. Furthermore, 39 parts by weight of an inorganic filler, 0.2 part by weight of a coupling agent and 0.4 part by weight of a coloring agent were added, and the mixture was stirred for 10 minutes using a high-speed stirrer, and a resin composition having a solid content of 50% by weight Varnish 5 was prepared. The obtained resin composition varnish 5 was applied to a PET film as a base material with a predetermined thickness, heat-treated at 150 ° C for 5 minutes, and after removing the solvent and solidifying, a 16.5 m thick resin A composition was obtained.
- a glass woven fabric (cloth type # 101 5, width 36 Omm, thickness 15 ⁇ , basis weight 17 g / m 2 ) is sandwiched between the two resin compositions obtained as a fiber base material, and a vacuum-pressurized laminator (MVL P-500 mm, manufactured by Meiki Seisakusho Co., Ltd.) was used at 100 ° C. under reduced pressure at 0.6 MPa for about 180 seconds to obtain a solder resist material having the thickness shown in Table 2. The obtained solder resist material was evaluated by the same evaluation method as in Example 1.
- Cyanate resin A 2 5 parts by weight, epoxy resin A 2 5 parts by weight, phenoxy resin A 10 parts by weight, and curing catalyst B 0.2 parts by weight were dissolved and dispersed in methyl ethyl ketone. Furthermore, 39 parts by weight of an inorganic filler, 0 ⁇ 2 parts by weight of a coupling agent and 0 ⁇ 4 parts by weight of a coloring agent were added, and the mixture was stirred for 10 minutes using a high-speed stirrer. Resin composition varnish 8 was prepared. Solder resist materials having the thicknesses shown in Table 2 were obtained and evaluated in the same manner as in Example 5 except that the resin composition varnish 5 used in Example 5 was replaced with the resin composition varnish 8.
- Cyanate resin A 2 5 parts by weight, epoxy resin A 2 5 parts by weight, phenoxy resin A 10 parts by weight, and curing catalyst B 0.2 parts by weight were dissolved and dispersed in methyl ethyl ketone. Further, 39 parts by weight of an inorganic filler, 0.2 part by weight of a coupling agent and 0.4 part by weight of a coloring agent were added, and the mixture was stirred for 10 minutes using a high-speed stirrer, and the solid content was 50% by weight.
- a resin composition varnish 9 was prepared. Solder resist materials having the thicknesses shown in Table 2 were obtained and evaluated in the same manner as in Example 5 except that the resin composition varnish 5 used in Example 5 was replaced with the resin composition varnish 9.
- a resin composition varnish 10 having a solid content of 50% by weight was prepared in the same manner as in Example 5 except that no colorant was added.
- Solder resist materials having the thicknesses shown in Table 2 were obtained and evaluated in the same manner as in Example 5 except that the resin composition varnish 5 used in Example 5 was replaced with the resin composition varnish 10.
- Example 2 The resin composition (without glass nonwoven fabric) obtained at the time of producing Example 1 was used as a solder resist material and evaluated in the same manner as in Example 1. (Comparative Example 2)
- Example 2 The same procedure as in Example 1 was performed except that a dry film type photosensitive solder resist (PFR800-AUS 402: manufactured by Taiyo Ink Manufacturing Co., Ltd.) having an acrylic resin as the main skeleton was used as the solder resist material.
- a dry film type photosensitive solder resist PFR800-AUS 402: manufactured by Taiyo Ink Manufacturing Co., Ltd.
- solder resist material Using an ordinary pressure laminator, four sheets of the obtained solder resist material were laminated to produce a 80 m thick film, which was cured at 200 ° C for 1 hour, with a test piece (width 5 mm x length 3 OmmX thickness was 80 ⁇ m).
- a dynamic viscoelasticity measuring device (DMS 61 00 made by Seiko Instruments Inc.) was used to increase the strain at a rate of 3 ° CZ while applying a strain at a frequency of 10 Hz.
- the glass transition temperature (T g) was determined from the peak value of tan S, and the elastic modulus at 25 ° C was determined from the measurement.
- Solder Regis obtained by etching copper-clad laminate (ELC— 4785 GS: 800 m thick, manufactured by Sumitomo Beichiklite Co., Ltd.) to form a conductor circuit pattern, followed by pretreatment such as degreasing and soft etching.
- the material (20 ⁇ ) was laminated, heat-treated at 200 ° C for 1 hour, and measured by the 111 ⁇ -94 standard, vertical method.
- the obtained solder resist material is cured at 200 ° C for 1 hour, pulverized to 250 or less by freeze pulverization, 3 g of a powder sample is precisely weighed in a pressure tacker container, and 40 ml of ultrapure water is added to the container.
- the container was placed in an oven set at 125 ° C, heated and pressurized for 20 hours continuously, allowed to cool to room temperature, and the inner solution was centrifuged to obtain a test solution.
- the solution was analyzed and evaluated by ion chromatography. The evaluation criteria were as follows. ⁇ : N aion, C 1ion impurity is less than 10 p pm
- a copper-clad laminate (ELC—4785GS manufactured by Sumitomo Bakelite Co., Ltd .: 100 // m thickness and 400 ⁇ thickness) is etched to form a conductor circuit pattern, and preprocessing such as degreasing and soft etching is performed.
- ENPLATE MLB-790 Merkle Hydroxylamine Sulfate aqueous solution
- concentrated sulfuric acid and distilled water 60 to 65 ° C for 5 to 10 minutes to neutralize.
- gold plating treatment or Lux processing was carried out, and it was cut into 5 O mm squares to obtain wiring boards.
- a semiconductor chip with bumps formed on this wiring board is mounted by fusion bonding, and sealed using a sealing resin (CRP— 4 1 5 2 D 1 manufactured by Sumitomo Beichi Kritai Co., Ltd.) to produce a semiconductor package. did.
- a semiconductor package was produced.
- a semiconductor package was produced. The obtained semiconductor package was evaluated for warpage, moisture resistance and thermal shock resistance by the following method. In addition, for the semiconductor packages obtained in Examples 5A to 10A and Comparative Example 3A, circuit embedding properties and via formation properties were further evaluated.
- the amount of warpage of the obtained semiconductor package was measured using a temperature variable laser three-dimensional measuring machine (Hitachi Technology & Service, Model LS 2 2 0—MT 1 0 0 MT 5 0). The largest value of the displacement difference was taken as the amount of warpage.
- the measurement temperature was 25 ° C.
- the evaluation criteria were as follows.
- Warp value is 200 ⁇ m or less
- Warpage value is over 200,000 ⁇ m and below 400 ⁇ m
- Warp value is more than 400 ⁇ m and less than 60 00 m
- the results are shown in Tables 1 and 2 with the following criteria.
- peeling observation peeling and cracks on the surface on which the semiconductor chip was mounted were observed with an SAT (ultrasonic flaw detector). The results are shown in Tables 1 and 2, after 2000 cycles, indicating whether there was a defect such as circuit breakage, peeling of the surface on which the semiconductor chip was mounted, or cracks. The following criteria are shown.
- solder resist material (Laser Type) was laminated on both sides of a core substrate (product number ELC—4 7 8 5 GS, thickness 0.23 mm, manufactured by Sumitomo Bakelite Co., Ltd.) with circuit patterns formed on both sides .
- laser irradiation was performed to form a via hole in the resin layer portion of the pad portion.
- a C O 2 laser manufactured by Mitsubishi Electric Corporation
- the solder resist material residue (smear) at the bottom of the via hole was removed with a desmear chemical.
- the obtained vias were observed with a scanning electron microscope at 200 to 100 times, and the via shape was evaluated.
- the evaluation criteria are as follows.
- the example has less warping of the package, excellent thermal shock resistance and moisture resistance, and is embedded in a circuit. And the via-forming property was also good. In particular, it can be seen that when the fiber substrate-containing layer is unevenly distributed, the circuit embedding property is excellent. On the other hand, in Comparative Example 3 not including the fiber base material-containing layer, package warpage occurred, and thermal shock resistance was inferior. .
- the solder resist material of the present invention has less package warpage, It has been shown to be excellent in thermal shock resistance, moisture resistance, etc., and can be suitably used in a thin wiring board or a semiconductor package in which a semiconductor chip is mounted on a thin wiring board.
- the solder resist material of the present invention is excellent in heat resistance, moisture resistance and thermal shock resistance, has a high elastic modulus and a low coefficient of linear expansion, and can effectively suppress package warpage. It can be used for materials, molding materials, coating materials, interposers and interlayer insulation layers of various wiring boards.
Abstract
Description
Claims
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KR1020087025754A KR101360531B1 (ko) | 2006-04-28 | 2007-04-26 | 땜납 레지스트 재료 및 그것을 이용한 배선판 및 반도체 패키지 |
JP2008513331A JP4968257B2 (ja) | 2006-04-28 | 2007-04-26 | ソルダーレジスト材料及びそれを用いた配線板並びに半導体パッケージ |
CN2007800152746A CN101433134B (zh) | 2006-04-28 | 2007-04-26 | 阻焊材料及使用该材料的电路板和半导体封装 |
US12/298,706 US7859110B2 (en) | 2006-04-28 | 2007-04-26 | Solder resist material, wiring board using the solder resist material, and semiconductor package |
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JP (1) | JP4968257B2 (ja) |
KR (1) | KR101360531B1 (ja) |
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JP2007197706A (ja) * | 2005-12-28 | 2007-08-09 | Sumitomo Bakelite Co Ltd | ソルダーレジスト用樹脂組成物およびソルダーレジスト用樹脂シート、回路基板並びに回路基板の製造方法、回路基板を用いた半導体パッケージ。 |
US20100044081A1 (en) * | 2007-01-29 | 2010-02-25 | Sumitomo Bakelite Company Limited | Laminated body, method of manufacturing susbtrate, substrate, and semiconductor device |
US8455765B2 (en) * | 2007-01-29 | 2013-06-04 | Sumitomo Bakelite Company, Ltd. | Laminated body, method of manufacturing substrate, substrate, and semiconductor device |
JP2008221624A (ja) * | 2007-03-13 | 2008-09-25 | Sumitomo Bakelite Co Ltd | 積層板、積層板の製造方法、および半導体装置 |
JP2011146648A (ja) * | 2010-01-18 | 2011-07-28 | Cmk Corp | プリント配線板の製造方法 |
JP2012231195A (ja) * | 2010-11-18 | 2012-11-22 | Sumitomo Bakelite Co Ltd | 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置 |
WO2012067094A1 (ja) * | 2010-11-18 | 2012-05-24 | 住友ベークライト株式会社 | 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置 |
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WO2012140907A1 (ja) * | 2011-04-14 | 2012-10-18 | 住友ベークライト株式会社 | 積層板、回路基板、半導体パッケージおよび積層板の製造方法 |
JP2012228879A (ja) * | 2011-04-14 | 2012-11-22 | Sumitomo Bakelite Co Ltd | 積層板、回路基板、半導体パッケージおよび積層板の製造方法 |
WO2012140908A1 (ja) * | 2011-04-14 | 2012-10-18 | 住友ベークライト株式会社 | 積層板、回路基板、および半導体パッケージ |
KR101953404B1 (ko) * | 2011-04-14 | 2019-05-31 | 스미토모 베이클리트 컴퍼니 리미티드 | 적층판, 회로 기판, 반도체 패키지 및 적층판의 제조 방법 |
KR20140023979A (ko) * | 2011-04-14 | 2014-02-27 | 스미토모 베이클리트 컴퍼니 리미티드 | 적층판, 회로 기판, 반도체 패키지 및 적층판의 제조 방법 |
JP2013006328A (ja) * | 2011-06-23 | 2013-01-10 | Sumitomo Bakelite Co Ltd | 積層板、回路基板、および半導体パッケージ |
JPWO2013012053A1 (ja) * | 2011-07-20 | 2015-02-23 | パナソニック株式会社 | プリント配線板 |
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WO2013012053A1 (ja) * | 2011-07-20 | 2013-01-24 | パナソニック株式会社 | プリント配線板 |
WO2013171994A1 (ja) * | 2012-05-18 | 2013-11-21 | 住友ベークライト株式会社 | 積層シートの製造方法および積層シートの製造装置 |
JPWO2015045089A1 (ja) * | 2013-09-27 | 2017-03-02 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP2015115432A (ja) * | 2013-12-11 | 2015-06-22 | ローム株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2007126130A1 (ja) | 2009-09-17 |
KR20080111495A (ko) | 2008-12-23 |
TWI395527B (zh) | 2013-05-01 |
US7859110B2 (en) | 2010-12-28 |
CN101433134B (zh) | 2012-05-30 |
US20090218672A1 (en) | 2009-09-03 |
CN101433134A (zh) | 2009-05-13 |
JP4968257B2 (ja) | 2012-07-04 |
TW200812457A (en) | 2008-03-01 |
KR101360531B1 (ko) | 2014-02-10 |
MY148173A (en) | 2013-03-15 |
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