WO2007040061A1 - 銅張積層板、プリント配線板及び多層プリント配線板並びにこれらの製造方法 - Google Patents
銅張積層板、プリント配線板及び多層プリント配線板並びにこれらの製造方法 Download PDFInfo
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- WO2007040061A1 WO2007040061A1 PCT/JP2006/318757 JP2006318757W WO2007040061A1 WO 2007040061 A1 WO2007040061 A1 WO 2007040061A1 JP 2006318757 W JP2006318757 W JP 2006318757W WO 2007040061 A1 WO2007040061 A1 WO 2007040061A1
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- copper
- copper foil
- printed wiring
- clad laminate
- wiring board
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
- Y10T428/31544—Addition polymer is perhalogenated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3382—Including a free metal or alloy constituent
- Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
Definitions
- Copper-clad laminate printed wiring board, multilayer printed wiring board, and methods for producing them
- the present invention is a copper-clad laminate obtained by adhering a copper foil to an insulating substrate made of fluorine resin via an adhesive resin film, and can be suitably used even in a high-frequency region.
- the present invention relates to a copper clad laminate for a wiring board and a manufacturing method thereof, and further relates to a printed wiring board and a multilayer printed wiring board constituted by a powerful copper clad laminate and a manufacturing method thereof.
- a copper-clad laminate obtained by bonding a copper foil to an insulating substrate made of fluorine resin, and a printed wiring board and a multilayer printed wiring board constituted by the copper-clad laminate are characteristic of fluorine resin that is a dielectric layer constituent material. Therefore, it can be suitably used even in a high frequency region of GHz or higher, such as a low dielectric loss tangent (tan ⁇ ).
- a copper-clad laminate a copper foil and an insulating substrate (fluorine resin pre-preda) are bonded via an adhesive resin film.
- a film using a PFA film as a fat film is well known.
- the adhesive strength of the copper foil by the adhesive resin film is mainly obtained by the anchoring effect (anchor effect) due to the unevenness on the adhesive surface of the copper foil.
- anchor effect an adhesive effect
- the copper foil peel strength an electrolytic copper foil having a surface roughness larger than that of the rolled copper foil is used (see, for example, paragraph number [0026] of Patent Document 1).
- a rough matte surface (M surface) is used as an adhesive surface compared to a certain shy surface (S surface). Further, when the unevenness of the adhesive surface (M surface) is small and sufficient adhesive force cannot be obtained, the M surface is roughened by etching or the like.
- rolled copper foil has fewer crystal grain boundaries and superior bending resistance compared to electrolytic copper foil, so it can be used for copper clad laminates for flexible printed circuit boards.
- the surface roughness on both sides is small, a sufficient anchoring effect cannot be obtained, and it is difficult to perform a rough surface treatment sufficient to exhibit an effective anchoring effect, and The frequency of practical use is extremely low compared to electrolytic copper foil because there is also an adverse effect due to excessive roughing treatment.
- the same roughening treatment blackening treatment
- the copper foil surface of another printed wiring board to be bonded to the laminated board surface of the printed wiring board is not affected by the copper foil surface (S surface when electrolytic copper foil is used).
- a blackening treatment is applied to form fine needles.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2002-307611
- the skin effect is a phenomenon peculiar to high-frequency currents.
- This skin effect is a phenomenon in which the current concentrates on the conductor surface layer as the frequency increases. The current density decreases with increasing depth from the surface, but the depth at which the surface value is lZe (e is the natural logarithm) is called skin depth, which is a measure of the depth at which current flows. This skin depth is dependent on the frequency and decreases with increasing frequency.
- Multi-layer printed wiring boards are also equipped with IVH (In Nervia hole) and Z or BVH (blind via hole) are formed, but when PFA film is used as the adhesive resin film, the molding temperature must be 380 ° C or higher (for example, Therefore, there is a possibility that IVH and BVH may be crushed during the heat forming of the printed wiring board laminate, and a multilayer printed wiring board having IVH and BVH is obtained. It was difficult.
- the present invention has been made in view of such points, and can greatly improve the copper foil adhesive strength (copper foil peel strength) without roughening or blackening the copper foil surface.
- copper foil adhesive strength copper foil peel strength
- the object is to provide a manufacturing method.
- a first aspect of the present invention is that an insulating substrate made of fluorine resin and a copper foil having a smooth surface on which both surfaces are not roughened or blackened are treated with a small amount of tetrafluoro having functional groups.
- PFA fluoroethylene perfluoroalkyl butyl ether copolymer
- LCP liquid crystal polymer resin
- a large amount of PFA (C) We propose a copper-clad laminate characterized by being bonded via a composite film (hereinafter referred to as “LCP / PFA composite film” ⁇ ⁇ ).
- the PFA having a functional group means a PFA having a side chain functional group or a functional group bonded to a side chain, and the functional group includes an ester, an alcohol, an acid (including carbonic acid, sulfuric acid, phosphoric acid), a salt, and the like. These halogen compounds are included.
- Other functional groups include cyanide, carbamate, nitrile and the like. Specific functional groups that can be used include “-SO F”, “—CN”, “—COOH” and “—CH—Z” (Z is “—OH”, “—OCN”, “
- the insulating substrate is composed of a pre-predder in which a fibrous reinforcing material is impregnated with fluorine resin.
- a fibrous reinforcing material is impregnated with fluorine resin.
- glass woven fabric for example, E glass (alumina shelf silicate glass) cloth
- PTFE polytetrafluoroethylene
- the copper foil it is preferable to use an unroughened copper foil having a surface roughness (centerline average roughness specified in JIS-B-0601) Ra of 0.2 m or less. Generally, both sides are not roughened or blackened! ⁇ ⁇ It is preferable to use rolled copper foil with a smooth surface.
- the LCPZPFA composite film is used as a resin film for bonding copper foil and a pre-preda.
- PFA having functional groups 1 to 20 mass% and LCP: 1 to 15 mass% and having functional groups.
- No PFA It is obtained by extruding and molding a mixture of 65 to 98 mass% into a film with a thickness of about 10 to 30 m.
- “Silki Ichi Bond” made by Junen Earth Co., Ltd. Is preferred.
- the copper foil is bonded to both sides or one side of the pre-predder insulating substrate via the composite film depending on the application.
- the present invention proposes a printed wiring board characterized in that the above-described copper-clad laminate is used as a constituent substrate and a predetermined conductor pattern is formed on the copper foil surface.
- This printed wiring board is divided into a double-sided printed wiring board in which a conductor pattern is formed on both sides of a copper-clad laminate and a single-sided printed wiring board in which a conductor pattern is formed on one side of the copper-clad laminate, depending on applications. Broadly divided.
- the present invention proposes a multilayer printed wiring board formed by laminating a plurality of the single-sided printed wiring boards described above.
- the multilayer printed wiring board that can be obtained is the LCPZPFA composite that makes it possible to blacken the copper foil side of the laminated board surface of each single-sided printed wiring board and the copper foil surface of the single-sided printed wiring board that opposes this. Heat-bonded through a film.
- the firing temperature (molding temperature) for bonding the insulating substrate and copper foil with L CPZPFA composite film is 340 ° C to 345 ° C, which is a low temperature, so IVH (inner via hole) And Z or BVH (blind via holes).
- the molding temperature when a PFA film is used as an adhesive resin film, the molding temperature must be 380 ° C. or higher (see, for example, paragraph number [0026] of Patent Document 1). IVH and BVH may be crushed by the treatment, but when LCP / PFA composite film is used as an adhesive resin film, the fluidity is extremely high due to this force SLCP. Such a problem does not occur because of the ability to lower the molding temperature (5 ° C to 40 ° C higher than the melting point of PFA and lower than the melting point of LCP).
- the present invention provides the above-described copper-clad laminate, printed wiring board, and multilayer printed wiring board. A manufacturing method is proposed.
- an insulating substrate and a double-sided substrate composed of a pre-predder obtained by impregnating a fiber reinforcing material with fluorine resin or a laminated pre-predder obtained by laminating a plurality of these are provided.
- the copper foil having a smooth surface, which has been roughened and blackened, passes through the L CPZPFA composite film, and the temperature is 5 ° C to 40 ° C higher than the melting point of PFA and lower than the melting point of LCP. Adhere by heating and pressurizing.
- the copper foil is bonded to both or one side of the insulating substrate through the LCPZPFA composite film.
- a copper clad laminate is produced by bonding a copper foil to one or both sides of an insulating substrate in this way, and a predetermined value is applied to the copper foil side of the copper clad laminate.
- the conductor pattern should be formed.
- the conductor pattern is formed by a known method such as a subtractive method.
- a plurality of single-sided printed wiring boards made by attaching copper foil to one side of an insulating substrate are manufactured in this way, and these single-sided printed wiring boards are stacked.
- Bonding is performed by heating (firing) and pressure molding at 345 ° C.
- the LCPZPFA composite film is a force that exhibits extremely high adhesiveness even on a smooth copper foil surface that is not subjected to roughening treatment or blackening treatment.
- (l) LCP is a super engineering plastic that exhibits liquid crystallinity in the molten state, has high heat resistance, good fluidity, and high solidification strength. Extremely high compared to resin films (PFA film, etc.)
- the LCPZPFA composite film has a very high rigidity during melting and solidification compared to general adhesive resin films, which is considered to be a cause of damage.
- the copper foil bonding surface (both sides of the copper foil in multilayer printed wiring boards) is not roughened or blackened! / Even if it is a smooth surface, the copper foil bonding strength (copper foil peeling) Strength).
- the adhesion strength (peeling strength) of the copper foil without subjecting the copper foil surface to roughening treatment or blackening treatment can be increased. Therefore, it is possible to provide a practical copper-clad laminate, printed wiring, and multilayer printed wiring board that can reduce the loss of conductors and that can be suitably used in a high-frequency region.
- a rolled copper foil having less crystal grain boundaries and excellent bending resistance than an electrolytic copper foil can be used in a non-rough form as a copper foil.
- a fluorine resin pre-preda that has excellent elongation and toughness compared to a curable resin pre-preda, a practical flexible printed circuit board can be provided.
- FIG. 1 is a longitudinal side view of a main part showing a first copper clad laminate.
- FIG. 2 is a longitudinal side view of the main part showing the second copper-clad laminate.
- FIG. 3 is a longitudinal side view of a main part showing a third copper-clad laminate.
- FIG. 4 is a longitudinal side view of a main part showing a fourth copper-clad laminate.
- Figs. 1 to 4 are longitudinal sectional side views showing main portions of the copper-clad laminate according to the present invention, respectively.
- a copper-clad laminate (hereinafter referred to as "first copper-clad laminate") 101 shown in FIG. 1 is an LCP / PFA composite film on one side of an insulating substrate 2 composed of a fluororesin pre-preparator 2A.
- 3 is a copper-clad laminate for a single-sided printed wiring board in which a copper foil 4 is bonded through 3.
- a copper-clad laminate (hereinafter referred to as “second copper-clad laminate”) 102 shown in FIG. 2 is composed of a plate-like pre-preda 2A obtained by impregnating a fibrous reinforcing material 2a with a fluorine resin 2b.
- This is a copper-clad laminate for double-sided printed wiring boards in which copper foil 4 is bonded to both sides of insulating substrate 2 via LCPZPFA composite film 3, respectively.
- a copper-clad laminate (hereinafter referred to as "third copper-clad laminate") 103 shown in Fig. 3 includes a plurality of sheets (two sheets in the illustrated example) in which a fibrous reinforcing material 2a is impregnated with fluorine resin 2b.
- This is a copper-clad laminate for printed circuit boards with a single-sided printed wiring board, in which copper foil 4 is bonded to one side of an insulating substrate 2 formed by laminating a plate-like pre-preda 2A—)) via an LCP / PFA composite film 3 .
- a copper-clad laminate (hereinafter referred to as "fourth copper-clad laminate") 104 shown in Fig. 4 includes a plurality of sheets (two sheets in the illustrated example) obtained by impregnating the fiber reinforcing material 2a with fluorine resin 2b.
- copper foil 4 is roughened (or blackened) on both sides to form a smooth, smooth copper foil (both surfaces on both sides) Roughness Ra: 0.2 ⁇ m or less is preferable).
- Roughness Ra 0.2 ⁇ m or less is preferable.
- electrolytic copper foil has a rough surface on one side (M surface). Therefore, it is not preferable to use it.
- electrolytic copper foil can be used as copper foil 4 if its M surface is smoothed by electrical and chemical treatment (for example, surface roughness Ra: 0.2 m or less). It is.
- the LCPZPFA composite film 3 has a thickness of, for example, a mixture of PFA having functional groups: 1 to 20 mass% and LCP: 1 to 15 mass% and PFA having no functional groups: 65 to 98 mass%: 10 It is obtained by extrusion and molding into a film of about 30 / ⁇ ⁇ . Specifically, “Silky Bond” manufactured by Junko Co., Ltd. is preferable. LCPZPFA composite film 3 is extremely fluid, and even if the copper foil adhesion surface is smooth (for example, surface roughness Ra: 0.2 ⁇ m or less), it is sufficient for microscopic unevenness. Since the anchoring effect is obtained, a high degree of copper foil adhesive strength (copper foil peel strength) can be obtained.
- the pre-preder 2A is formed by impregnating a fibrous reinforcing material 2a with a fluorine resin 2b.
- a fibrous reinforcing material 2a a glass woven fabric such as E glass (alumina shelf silicate glass) cloth is used, and a glass non-woven fabric and a aramide non-woven fabric can also be used.
- Fluorine resin 2b includes tetrafluoroethylene polymer (PTFE), tetrafluoroethylene.hexafluoropropylene copolymer, tetrafluoroethylene perfluoro (alkyl butyl ether) copolymer.
- the pre-preda 2A is obtained by alternately repeating the process of impregnating the fiber reinforcing material 2a with the dispersion of the above-mentioned fluorine resin 2b and the drying process at a temperature lower than the melting point of the fluororesin. It is done.
- each of the copper-clad laminates 101, 102, 103, 104 is formed by laminating the pre-preda 2A, the LCPZPFA composite film 3 and the copper foil 4 as shown in FIG. 1, FIG. 2, FIG. 3, or FIG.
- This laminate can be obtained by firing and pressure molding under conditions of 340 ° C to 345 ° C.
- the printed wiring board according to the present invention is obtained by forming a predetermined conductor pattern on the copper foil surface of the copper-clad laminates 101, 102, 103, 104. Conductor patterns are formed by conventional methods (subtractive method, etc.).
- Single-sided printed wiring board is the first or third copper-clad laminate It is obtained by forming a conductor pattern on one side of the plates 101 and 103.
- the double-sided printed wiring board can be obtained by forming a conductor pattern on both sides of the second or third copper-clad laminates 102 and 104.
- the multilayer printed wiring board according to the present invention is formed by laminating a plurality of single-sided printed wiring boards (printed wiring boards in which a conductor pattern is formed on one side of the first or third copper-clad laminates 101 and 103). It becomes.
- This multilayer printed wiring board has an LCPZPFA composite film interposed between the laminated board surface of the single-sided printed wiring board and the copper foil surface of the other single-sided printed wiring board facing it. It can be obtained by firing and pressure molding at 345 ° C. Even in such a case, roughening treatment such as blackening treatment should not be applied to the copper foil surface to be bonded to the laminate surface! , That's ugly! /.
- an E glass cloth having a basis weight of 24 gZm 2 is impregnated with a PTFE dispersion having a concentration of 60%, and this is performed under the condition of 305 ° C lower than the melting point of PTFE (327 ° C).
- a first pre-predder having a PTFE resin infiltration rate of 91.5% and a thickness of 130 / zm was obtained.
- the first pre-preparer was manufactured in total, including four sheets used in the comparative examples described later.
- copper-clad laminate No. 1 corresponding to the second copper-clad laminate 102 was produced by adhering copper foil to both surfaces of the first pre-preder. That is, the LCPZPFA composite film ("Silky Bond” made by Jun Ento Co., Ltd.) with a thickness of 15 m is laminated on both sides of the first pre-preda, and the thickness of each LCPZPFA composite film is 18 m. Copper foil is laminated, and this laminate is fired at 345 ° C, firing time: 15 minutes, molding surface pressure: 2Mpa, reduced pressure atmosphere: 10-20hPa. Plate No. 1 was obtained. As the copper foil, a rolled copper foil having a smooth surface (surface roughness Ra: 0.2 m), which is roughened on both sides, is used. I used it.
- surface roughness Ra surface roughness Ra: 0.2 m
- two second pre-preders were laminated, and copper foils were bonded to both sides of the laminated pre-preder, and a copper-clad laminate No. 2 corresponding to the fourth copper-clad laminate 104 (see Fig. 4).
- a LCPZPFA composite film (“Silky Bond” manufactured by Jun Eneji Co., Ltd.) having a thickness of 15 / ⁇ ⁇ is laminated on both sides of the laminated pre-preda, and further, a thickness of 1 on each LCPZPFA composite film.
- Copper foil is laminated, and this laminate is fired and pressed under conditions of firing temperature: 345 ° C, firing time: 15 minutes, molding surface pressure: 2Mpa, reduced pressure atmosphere: 10-20hPa, copper-clad laminate No. 2 was obtained.
- As the copper foil a rolled copper foil having a smooth surface (surface roughness Ra: 0.2 ⁇ m) on which both surfaces were not roughened was used.
- This copper-clad laminate No. 2 has the same configuration as the copper-clad laminate No. 1 except that a laminate of two second pre-predas (laminated pre-preda) is used as the insulating substrate. .
- the copper-clad laminate No. 11 has the same copper foil as that used in the examples on both sides of the first pre-preda (both sides are roughened to form a slightly smooth surface.
- Rolled copper foil is laminated, and this laminate is fired and pressure-molded under the conditions of firing temperature: 385 ° C, firing time: 30 minutes, molding surface pressure: 2 MPa, reduced pressure atmosphere: 10-20 hPa). It was obtained by.
- This copper-clad laminate No. 11 is a copper-clad laminate except that the LCPZPFA composite film is not used. It has the same configuration as plate No. 1.
- the copper clad laminate No. 12 is the same as that used in the examples in which a PFA film having a thickness of 25 m was laminated on both sides of the first pre-predader, and each PFA film was further laminated.
- Laminated copper foil rolled copper foil with roughened surface and smooth surface
- firing time 30 minutes
- molding surface pressure 2Mpa
- Depressurized atmosphere obtained by firing and pressure molding under the conditions of 10 to 20 hPa).
- Copper-clad laminate No. 12 has the same configuration as copper-clad laminate No. 1 except that a PFA film is used as the adhesive resin film.
- the copper clad laminate No. 13 was used in the examples on both sides of the first pre-preda.
- the same LCPZPFA composite film is laminated, and then the LCPZPFA composite film is laminated with a rope mouth file electrolytic copper foil with a thickness of 18 ⁇ m with the rough surface (M surface) in contact.
- the product was obtained by firing and pressure molding under the same conditions as in the examples (firing temperature: 345 ° C, firing time: 15 minutes, molding surface pressure: 2 MPa, reduced pressure atmosphere: 10 to 20 hPa).
- This copper-clad laminate No. 13 has the same configuration as the copper-clad laminate No. 1 except that rope-file electrolytic copper foil is used as the copper foil.
- the surface roughness of the M face (adhesion face) of the rope mouth file electrolytic copper foil is Ra: 1 ⁇ m.
- the same LCPZPFA composite film as that used in the example was laminated on both sides of the first pre-predator, and the rough surface of each LCPZPFA composite film ( The copper foil with a thickness of 18 m was laminated with the M surface in contact, and this laminate was subjected to the same conditions as the example (firing temperature: 345 ° C, baking time: 15 minutes, molding surface pressure: 2 Mpa) , Reduced pressure atmosphere: 10 to 20 hPa), obtained by firing and pressure forming.
- This copper-clad laminate No. 14 has the same configuration as the copper-clad laminate No. 1 except that electrolytic copper foil is used as the copper foil.
- the surface roughness of the M surface (adhesion surface) of the electrolytic copper foil is Ra: l ⁇ m.
- the copper-clad laminates No. 1 and No. 2 of the examples had extremely high peel strength compared to the copper-clad laminates No. 11 and No. 12 of the comparative examples. It's getting higher.
- copper-clad laminates No. 11 and No. 12 are similar to copper-clad laminates No. 11 because the surface roughness at the bonding surface of the rolled copper foil that has not been roughened is low. The peel strength is low not only when the adhesive resin film is not used, but also when the adhesive resin film (PFA film) such as copper-clad laminate No. 12 is used.
- PFA film adhesive resin film
- copper-clad laminates No. 1 and No. 2 are similar to copper-clad laminates No. 11 and No.
- the peel strength is high. Therefore, it is understood that by using the LCPZPFA composite film as the adhesive resin film, a high peel strength can be obtained even if the adhesive surface of the copper foil is a smooth surface having a low surface roughness.
- the copper-clad laminate No. 2 that uses the laminate of the second pre-predder (laminated pre-predder) as the insulating substrate is superior to the copper-clad laminate No. 1 that uses the first pre-preda as the insulating substrate.
- the second prepreader uses a glass cloth with a smaller basis weight (basis weight: 12 g / m 2 ) than the first prepreader, and the unevenness of the cloth is small.
- the insulating substrate is made by laminating two second pre-preders, the molding pressure that increases cushioning during pressure molding (adhesion) acts evenly on the entire surface of the laminate. It can be considered.
- the adhesion by the LCP / PFA composite film is due to the anchoring effect on the adhesive surface.
- a high copper foil peel strength can be obtained, but the copper-clad laminate No.
- the copper foil peel strength can be further improved by configuring the insulating substrate with a laminated pre-preda. is there.
- the copper-clad laminates No. 1 and No. 2 had a larger Qu value than the copper-clad laminates No. 13 and No. 14.
- copper-clad laminates No.1, No.2, No.13 and No.14 use the same insulating substrate (fluorine resin pre-preda) and adhesive resin film (LCPZPFA composite film) Of course, the loss of the dielectric layer is the same. Therefore, it can be understood that copper-clad laminates No. 1 and No. 2 with a large Qu value compared to copper-clad laminates No. 13 and No. 14 have lower conductor layer losses. That is, both sides are smooth like copper-clad laminates No. 1 and No. 2 compared to using copper foil with high surface roughness like copper-clad laminates No. 13 and No. 14. The use of copper foil (roughened! Copper rolled copper foil) greatly reduces the conductor loss.
- a printed wiring board and a multilayer printed wiring board that can be suitably used even in a high frequency region by using a copper clad laminate formed by bonding copper foils having smooth surfaces on both sides with an LCPZPFA composite film. It is understood that can be obtained.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Textile Engineering (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN2006800360871A CN101277816B (zh) | 2005-09-30 | 2006-09-21 | 铜箔层叠板、印刷线路板和多层印刷线路板以及它们的制造方法 |
US12/088,612 US20100000771A1 (en) | 2005-09-30 | 2006-09-21 | Copper-clad laminate, printed-wiring boards, multilayer printed-wiring boards, and method for manufacturing the same |
DE112006002571.6T DE112006002571B4 (de) | 2005-09-30 | 2006-09-21 | Kupferplattierter Schichtstoff, gedruckte Leiterplatten, mehrschichtige gedruckte Leiterplatte und Verfahren zum Herstellen derselben |
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JP2005-289419 | 2005-09-30 | ||
JP2005289419A JP4377867B2 (ja) | 2005-09-30 | 2005-09-30 | 銅張積層板、プリント配線板及び多層プリント配線板並びにこれらの製造方法 |
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WO2007040061A1 true WO2007040061A1 (ja) | 2007-04-12 |
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PCT/JP2006/318757 WO2007040061A1 (ja) | 2005-09-30 | 2006-09-21 | 銅張積層板、プリント配線板及び多層プリント配線板並びにこれらの製造方法 |
Country Status (7)
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US (1) | US20100000771A1 (ja) |
JP (1) | JP4377867B2 (ja) |
KR (1) | KR100963180B1 (ja) |
CN (1) | CN101277816B (ja) |
DE (1) | DE112006002571B4 (ja) |
TW (1) | TW200740332A (ja) |
WO (1) | WO2007040061A1 (ja) |
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- 2006-09-21 CN CN2006800360871A patent/CN101277816B/zh active Active
- 2006-09-21 KR KR1020087007609A patent/KR100963180B1/ko active IP Right Grant
- 2006-09-21 DE DE112006002571.6T patent/DE112006002571B4/de active Active
- 2006-09-26 TW TW095135600A patent/TW200740332A/zh unknown
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CN102149252A (zh) * | 2010-02-04 | 2011-08-10 | 景旺电子(深圳)有限公司 | 一种铝基覆铜板的制备方法 |
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CN112433405A (zh) * | 2020-11-24 | 2021-03-02 | 中国科学技术大学 | 一种液晶高分子基板及其加工方法 |
WO2023032958A1 (ja) * | 2021-08-30 | 2023-03-09 | 国立大学法人大阪大学 | 樹脂層と金属層との積層体及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE112006002571B4 (de) | 2017-05-18 |
TW200740332A (en) | 2007-10-16 |
DE112006002571T5 (de) | 2008-08-21 |
KR20080050592A (ko) | 2008-06-09 |
CN101277816B (zh) | 2012-08-22 |
US20100000771A1 (en) | 2010-01-07 |
CN101277816A (zh) | 2008-10-01 |
KR100963180B1 (ko) | 2010-06-14 |
JP2007098692A (ja) | 2007-04-19 |
JP4377867B2 (ja) | 2009-12-02 |
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