CN110249715B - 多层布线基板及半导体装置 - Google Patents
多层布线基板及半导体装置 Download PDFInfo
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Abstract
本发明的目的在于提供一种多层布线基板,其能够抑制层间的位置偏移,并且通过使用剥离强度优异的粘接层从而能够抑制使用氟树脂基板时的电信号的传输损耗。本发明提供一种多层布线基板(1),其包含具有至少形成在其一面的导体图案(20)的氟树脂基板(30)和用于粘接所述氟树脂基板(30)的粘接层(10),所述粘接层(10)含有热固性树脂的固化物且具有20%以上且300%以下的断裂伸长率。
Description
技术领域
本发明涉及多层布线基板及半导体装置。
背景技术
近年来,电子设备的小型化和高性能化取得进展,信息传递中所使用的电信号需要进一步高速化。在传递高速电信号时,产生信号的损耗。随着电信号变得更为高速,该信号的损耗变大。作为降低该损耗的方法,一般在电路材料中使用氟树脂基板。
另外,随着部件的高功能化,电路基板等、尤其是适合于高频电路的多层布线基板的电路材料被高多层化。以往,为了多层化,而使用低介电常数-低介质损耗角正切(高频特性优异)的热塑性树脂作为粘接层。
作为多层化的氟树脂基板,已知包含粘接于氟树脂制的绝缘基板的铜箔的覆铜层压板。该覆铜箔层压板的特征为双面具有未进行过粗化处理和黑化处理的平滑面的铜箔借助LCP和PFA的复合膜而粘接于绝缘基板(专利文献1)。另外,还报告由所层叠的多个氟树脂系基材层形成、且内部具备至少1个导电体层的多层印刷电路基板(专利文献2)。该电路基板的特征为具备上述的内部导电体层的基材层和与之邻接的基材层借助包含液晶聚合物的粘接层而相互粘接。
然而,一般而言,在电路基板使用热塑性树脂的情况下,在为了多层化而反复施加热时,产生在层间引起位置偏移的问题。通过使用夹具,从而能够抑制位置偏移。但是,不能防止微小的位置偏移。
尤其,在上述的覆铜层压板及多层印刷电路基板中均使用熔点高的液晶聚合物(LCP)。因此,层间的位置偏移的现象变差。其结果导致更难以多层化。
现有技术文献
专利文献
专利文献1:日本特开2007-098692号公报
专利文献2:日本特开2005-268365号公报
发明内容
发明要解决的课题
本发明人等进行深入研究,得到一种多层布线基板,其能够抑制层间的位置偏移,并且通过使用剥离强度优异的粘接层,从而能够抑制使用氟树脂基板时的电信号的传输损耗。
本发明的目的在于提供能够抑制层间的位置偏移、并且通过使用剥离强度优异的粘接层从而能够抑制使用氟树脂基板时的电信号的传输损耗的多层布线基板以及使用该多层布线基板的半导体装置。
用于解决课题的手段
本发明涉及能够通过具有以下的构成来解决上述问题的、多层布线基板及半导体装置。
〔1〕一种多层布线基板,其包含具有至少形成在其一面的导体图案的氟树脂基板、和用于粘接上述氟树脂基板的粘接层,上述粘接层含有热固性树脂的固化物、且具有20%以上且300%以下的断裂伸长率。
〔2〕根据上述〔1〕的多层布线基板,其中,上述粘接层的拉伸弹性模量为1GPa以下。
〔3〕根据上述〔1〕或〔2〕的多层布线基板,其中,上述粘接层包含具有0.002以下的介质损耗角正切的填料。
〔4〕根据上述〔1〕~〔3〕中任一项的多层布线基板,其中,上述氟树脂基板的介电常数为100%时的、上述粘接层的介电常数为70~130%。
〔5〕根据上述〔1〕~〔4〕中任一项的多层布线基板,其中,上述粘接层上的传输损耗在20GHz下为0~―3dB/70mm。
〔6〕一种半导体装置,其包含上述〔1〕~〔5〕中任一项的多层布线基板。
发明效果
根据本发明〔1〕,能够提供一种多层布线基板,其能够抑制层间的位置偏移,并且通过使用剥离强度优异的粘接层,从而能够抑制使用氟树脂基板时的电信号的传输损耗。
根据本发明〔6〕,能够提供一种包含多层布线基板的高可靠性的半导体装置,其中,所述多层布线基板能够抑制层间的位置偏移,并且通过使用剥离强度优异的粘接层,从而能够抑制电信号的传输损耗。
附图说明
图1是表示多层布线基板的截面的一例的示意图。
具体实施方式
本发明的多层布线基板包含具有至少形成在其一面的导体图案的氟树脂基板和用于粘接上述氟树脂基板的粘接层,上述粘接层含有热固性树脂的固化物、且具有20%以上且300%以下的断裂伸长率。图1是表示多层布线基板的截面的一例的示意图。图1是2层布线基板的截面的例子。图1所示的多层布线基板1包含具有至少形成在其一面的导体图案20的氟树脂基板30和用于粘接氟树脂基板30的粘接层10。粘接层10含有热固性树脂的固化物。进而,粘接层10的断裂伸长率为20%以上且300%以下。
予以说明,如图1所示,在多层布线基板1中可以根据需要形成通孔(throughhole)40。
〔氟树脂基板〕
作为氟树脂基板,可以使用例如日本特开平07-323501号公报或日本特开2005-268365号公报中记载的氟树脂基板。作为具体的例子,可列举:使玻璃布中浸渗保持聚四氟乙烯(PTFE)而得到的、由预浸料构成的刚性基板;以及通过使用氟树脂纤维和玻璃纤维等耐热性绝缘纤维并利用湿式抄纸法来形成而得到的、所谓抄纸片。
作为在氟树脂基板中使用的氟树脂的例子,可列举聚四氟乙烯(PTFE)、四氟乙烯-全氟烷基乙烯基醚共聚物(PFA)、四氟乙烯-六氟丙烯-全氟烷基乙烯基醚共聚物(FEPPFA)、FEP、聚氯三氟乙烯(PCTFE)、偏氟乙烯树脂(PVDF)、氟化乙烯基树脂(PVF)、乙烯-四氟乙烯共聚物(ETFE)及乙烯-氯三氟乙烯共聚物(ECTFE)。在这些氟树脂中,从低介电常数、低介质损耗角正切、耐热性及耐化学品性等观点出发,优选PTFE。予以说明,PFA等的熔点优选为280℃以上。氟树脂的成型温度的一例为320~400℃。氟树脂可以单独使用,也可以并用2种以上。
作为耐热性绝缘纤维的例子,可列举:玻璃纤维、二氧化硅纤维、氧化铝纤维及硅酸铝纤维等无机纤维;聚对亚苯基苯并二噁唑纤维(PBO纤维)、芳香族聚酯纤维、聚苯硫醚纤维及全芳香族聚酰胺纤维等有机纤维。从耐热性、高强度、高弹性模量及廉价的观点出发,优选玻璃纤维。耐热性绝缘纤维可单独使用,也可以并用2种以上。
作为导体图案,可列举通过铜箔的蚀刻而形成的铜布线等。
〔粘接层〕
粘接层含有热固性树脂的固化物,且该粘接层的断裂伸长率为20%以上且300%以下。
热固性树脂对粘接层赋予粘接性及耐热性(加热时的耐熔融性)。热固性树脂只要是在其热固化后对粘接层赋予20%以上且300%以下的断裂伸长率的热固性树脂,则并无特别限定。作为例子,可列举改性聚苯醚、双酚A型环氧树脂、联苯型环氧树脂、萘型环氧树脂、双马来酰亚胺、特种丙烯酸酯及改性聚酰亚胺等。从粘接层的断裂伸长率及介电常数的观点出发,优选含有改性聚苯醚或改性聚酰亚胺的树脂。尤其是末端具有烯属不饱和基团(尤其是苯乙烯基)的改性聚苯醚(例如日本特开2004-59644号中记载的改性聚苯醚)因其极性小而对极性小的氟树脂具有高粘接性,因此更优选。予以说明,一般而言,单独的环氧树脂具有低断裂伸长率及高介电常数,因此不优选。热固性树脂可以单独使用,也可以并用2种以上。
作为热固性树脂的环氧树脂有时需要固化剂。该固化剂并无特别限定。作为例子,可列举咪唑系、胺系、酸酐系及酚系的固化剂。从反应温度及反应时间的观点出发,优选咪唑系的固化剂。更优选1-苄基-2-苯基咪唑及2-苯基-4,5-二羟基甲基咪唑。
在粘接层中也可以含有其他的树脂。在利用热固性树脂单体不能在热固化后对粘接层赋予20%以上的断裂伸长率时,为了提高伸长率而附加其他的树脂。就其他的树脂的例子而言,在聚烯烃系弹性体中,尤其作为苯乙烯系热塑性弹性体,可列举聚苯乙烯-聚(乙烯/丁烯)嵌段共聚物、聚苯乙烯-聚(乙烯-乙烯/丙烯)嵌段共聚物等。这些氢化弹性体的介电常数及介质损耗角正切低,因此优选。其他的树脂可以单独使用,也可以并用2种以上。
从与铜箔的剥离强度的观点出发,粘接层的断裂伸长率优选为20%以上且300%以下。在断裂伸长率不足20%时,粘接层变硬变脆。因此,与铜箔的剥离强度变弱。若断裂伸长率超过300%,则在层叠时容易发生位置偏移。在此,粘接层的断裂伸长率能够利用万能试验机(auto graph)进行测定。
从多层布线基板的进一步的低传输损耗化的观点出发,粘接层优选含有具有0.002以下的介质损耗角正切的填料。作为具有0.002以下的介质损耗角正切的填料的例子,可列举氟树脂填料及二氧化硅填料(包含中空二氧化硅粒子)。另外,具有0.002以下的介质损耗角正切的填料的平均粒径优选为0.01~10μm,更优选为0.01~1μm。在此,平均粒径可以利用BECKMAN COULTER公司制激光衍射粒度分布测定装置(型号:LS13320)来测定。介质损耗角正切0.002以下的填料可以单独使用,也可以并用2种以上。
在本实施方式的粘接层中,可以在不损害本实施方式的目的的范围内根据需要进一步配合添加剂。作为添加剂的例子,可列举均化剂、消泡剂、触变剂、抗氧化剂、颜料或染料。
从作为层叠体的多层布线基板的内部应力松弛、氟树脂与粘接层之间的剥离强度的观点出发,粘接层的拉伸弹性模量优选为1GPa以下。另外,从压制时的耐压的观点出发,粘接层的拉伸弹性模量优选为0.1GPa以上。若弹性模量小于0.1GPa,则粘接层的耐热性(加热压时等)变差,容易发生位置偏移。
在氟树脂基板的介电常数为100%时,粘接层的介电常数优选为70~130%。处于该范围的粘接层的介电常数接近氟树脂基板的介电常数。因此,多层布线基板的设计变得简便。
从发送接收有效的电信号的观点出发,粘接层上的传输损耗优选在20GHz下为0~―3dB/70mm。
从低电力(低能量)、降低对构件的热损伤的观点出发,粘接层优选在200℃以下的低温下也能层叠。
〔多层布线基板〕
如上述所示,本发明的多层布线基板包含:具有至少形成在其一面的导体图案的氟树脂基板和用于粘接该氟树脂基板的粘接层。该粘接层含有热固性树脂的固化物,且具有20%以上且300%以下的断裂伸长率。该多层布线基板的氟树脂基板与粘接层之间的剥离强度及导体图案与粘接层之间的剥离强度优异。认为该优异的剥离强度的原因取决于锚固效应(Anchor Effect)。认为粘接层的断裂伸长率有助于与导体(铜箔)的剥离强度。若断裂伸长率不足20%或超过300%,则铜箔剥离强度变弱。予以说明,由于氟树脂基板与粘接层之间的剥离强度高,因此在剥离试验中,有时在氟树脂基板与铜箔之间发生剥离或氟树脂基板本身被破坏。
〔半导体装置〕
本发明的半导体装置包含上述的多层布线基板。作为半导体装置的例子,可列举微波天线及无线基站。
实施例
利用实施例对本实施方式进行说明。但是,本实施方式并不受这些实施例的限定。予以说明,在以下的实施例中,只要没有特别说明,份及%均表示质量份及质量%。
作为热固性树脂1,使用了三菱瓦斯化学制改性聚苯醚(品名:OPE2St2200)。
作为热固性树脂2,使用了三菱瓦斯化学制改性聚苯醚(品名:OPE2St1200)。
作为热固性树脂3,使用了OSAKA SODA制双酚A型环氧树脂(品名:LX-01)。
作为热固性树脂4,使用了日本化药制联苯型环氧树脂(品名:NC3000)。
作为热固性树脂5,使用了DIC制萘型环氧树脂(品名:HP4032D)。
作为热固性树脂6,使用了作为KI化成制双马来酰亚胺的、双-(3-乙基-5-甲基-4-马来酰亚胺苯基)甲烷(品名:BMI-70)。
作为热固性树脂7,使用了作为东亚合成制特种丙烯酸酯的、N-丙烯酰基氧基乙基六氢邻苯二甲酰亚胺(品名:M-140)。
作为固化剂1,使用了四国化成制咪唑(品名:1B2PZ)。
作为固化剂2,使用了四国化成制咪唑(品名:2PHZ)。
作为其他的树脂1,使用了Kraton Polymers制弹性体SEBS(品名:G1652)。
作为其他的树脂2,使用了Kraton Polymers制弹性体SEBS(品名:G1657)。
作为其他的树脂3,使用了Kuraray制弹性体SEEPS(品名:SEPTON4044)。
作为其他的树脂4,使用了旭化成化学制弹性体SEBS(品名:TUFTEC H1052)。
作为其他的树脂5,使用了JSR制弹性体SBS(品名:TR2003)。
作为填料1,使用了大金工业制氟树脂填料(品名:Lubron L-2、平均粒径:2μm)。
作为填料2,使用了Admatechs二氧化硅填料(品名:SE2050、平均粒径:0.5μm)。
予以说明,填料1的介质损耗角正切及填料2的介质损耗角正切均为0.002以下。
〔实施例1~4、比较例1~4〕
以表1所示的配方按计量配合了各成分。之后,将这些成分投入加温至80℃的反应釜中,一边使其以转速250rpm旋转,一边进行3小时常压溶解混合。但是,固化剂在冷却后进行添加。予以说明,虽然在表1中并未记载,但是,在溶解及粘度调节中使用了甲苯。
将包含这样得到的粘接层用组合物的清漆涂布于支承体(实施了脱模处理的PET膜)的一面。通过使该清漆在100℃下干燥,从而得到带支承体的粘接层用膜(粘接层的厚度:约25μm、约50μm两种)。
〔粘接层的断裂伸长率的测定〕
使带支承体的粘接层用膜在200℃、60min及1MPa的条件下真空热压固化。将固化后的带支承体的粘接层用膜切割出15mm×150mm。剥离支承体后,用万能试验机在长度方向以拉伸速度200mm/min进行拉伸,测定拉伸至断裂为止的长度。粘接层的断裂伸长率为以百分率表示断裂时的长度除以初始长度所得的值的值。在表1中示出粘接层的断裂伸长率的测定结果。
〔粘接层的拉伸弹性模量的测定〕
使带支承体的粘接层用膜在200℃、60min及1MPa的条件下真空热压固化。从固化后的带支承体的粘接层用膜中切割出25mm×250mm的带支承体的固化膜。从带支承体的固化膜剥离支承体而得到试验片后,测定了试验片的厚度。接着,使用万能试验机,将试验片在其长度方向上以拉伸速度1mm/min进行拉伸。然后,测定了试验片拉伸至1~2mm时的、应力应变曲线的斜率。该值除以截面积而求得粘接层的拉伸弹性模量。粘接层的拉伸弹性模量优选为0.1~1GPa以下。在表1中示出粘接层的拉伸弹性模量的测定结果。
〔剥离强度的测定〕
在200℃、60min及2MPa的条件下一边真空热压一边在从支承体剥离后的粘接层用膜的一面贴合中兴化成工业(株)制氟树脂基板(品名:CGS-500),在另一面贴合福田金属箔粉工业(株)制铜箔(厚度:35μm、品名:CF-T8G-HTE)。这样,制作了层叠构件。之后,依据JISK6854-1,用万能试验机剥离铜箔或氟树脂基板,测定了剥离强度(90°剥离)。剥离强度优选为7N/cm以上。在表1中示出剥离强度的测定结果。
〔耐热性的评价〕
将利用与上述相同的方法制作的层叠构件在260℃的焊料浴中悬浮1分钟,目视确认有无剥离及膨胀。
〔粘接层的介电常数(ε)、介质损耗角正切(tanδ)的测定〕
使带支承体的粘接层用膜在200℃、60min、1MPa的条件下进行真空热压固化。从固化后的带支承体的粘接层用膜中切割出带支承体的固化膜(70mm×130mm)。从带支承体的固化膜剥离支承体而得到试验片后,测定了试验片的厚度。接着,利用SPDR法(1.9GHz),测定了试验片的介电常数(ε)及介质损耗角正切(tanδ)。介电常数优选为1.6~3.5,更优选为2.0~2.9。介质损耗角正切优选为0.0005~0.005。
〔氟树脂基板与粘接层的介电常数之比的计算〕
接着,计算出氟树脂基板的介电常数为100%时的、粘接层的介电常数之比(单位:%)。所使用的氟树脂基板的介电常数为2.24。氟树脂基板的介电常数为100%时,粘接层的介电常数优选为70~130%。
〔粘接层的传输损耗的测定〕
将去除支承体后的、厚度50μm的热固化前的粘接层用膜夹持于2片铜箔(福田金属箔粉(株)制、18μm、CF-T9FZ-SV)间,接着,在200℃、60min、1MPa的条件下进行真空热压。这样制作了覆铜基板。在该覆铜基板的一面以达到电阻50Ω的方式利用蚀刻处理制作成为信号布线长70mm的信号布线和接地焊盘。覆铜基板的另一面设为接地层。为了取得接地焊盘和接地层的连接,而在制作通孔后进行镀铜处理。由此制作成50Ω的微带线基板。此时,利用镀铜处理而使布线高度为约30μm。使用网络分析仪(KEYSIGHT制、N5245A)在20GHz下测定了所制作的基板。将所得的S参数插入损耗(S21)的测定值定义为粘接层上的传输损耗。粘接层上的传输损耗在20GHz下优选为0~―3dB/70mm。
[表1]
由表1可知:使用了未产生层间的位置偏移的热固性树脂的实施例1~4,粘接层的断裂伸长率均为50~280%,粘接层的拉伸弹性模量均为0.23~0.84GPa,而且剥离强度均高。在表1中虽然并未记载,但是实施例1~4均是不仅耐热性良好,而且粘接层的介电常数为2.4~2.5,粘接层的介质损耗角正切为0.0008~0.0025,氟树脂基板与粘接层的介电常数之比为107~112%,均良好。粘接层的传输损耗在实施例1中为―2.2dB,在实施例2中为―2.7dB,在实施例3中为―2.1dB,并且在实施例4中为―2.3dB。与此相对,在粘接层的断裂伸长率过低的比较例1、4中,与铜箔的剥离强度低。在粘接层的断裂伸长率过高的比较例2中,与氟树脂基板的剥离强度及与铜箔的剥离强度均低。在粘接层的断裂伸长率过高的比较例3中,与铜箔的剥离强度低。另外,在表1中虽然并未记载,但是,比较例1的粘接层的传输损耗为―3.6dB。
如上所述,本发明的多层布线基板通过使用抑制层间的位置偏移的热固性树脂并且使用剥离强度优异的粘接层,从而使用氟树脂基板时的电信号的传输损耗低。因此,本发明的多层布线基板非常有用。
符号的说明
1 多层布线基板
10 粘接层
20 导体图案
30 氟树脂基板
40 通孔(through hole)
Claims (6)
1.一种多层布线基板,其特征在于,包含具有至少形成在其一面的导体图案的第一氟树脂基板、至少形成在其一面的导体图案的第二氟树脂基板,和用于粘接所述第一和第二氟树脂基板的粘接层,
至少一个所述氟树脂基板上的导体图案形成在与所述粘接层接触的表面上,
所述粘接层含有热固性树脂的固化物和苯乙烯系热塑性弹性体且具有80%以上且300%以下的断裂伸长率。
2.根据权利要求1所述的多层布线基板,其中,所述粘接层的拉伸弹性模量为1GPa以下。
3.根据权利要求1或2所述的多层布线基板,其中,所述粘接层包含具有0.002以下的介质损耗角正切的填料。
4.根据权利要求1或2所述的多层布线基板,其中,所述第一或第二氟树脂基板的介电常数为100%时的所述粘接层的介电常数为70~130%。
5.根据权利要求1或2所述的多层布线基板,其中,所述粘接层上的传输损耗在20GHz下为0~―3dB/70mm。
6.一种半导体装置,其包含权利要求1~5中任一项所述的多层布线基板。
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