TWI837306B - 樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及印刷配線板 - Google Patents
樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及印刷配線板 Download PDFInfo
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- TWI837306B TWI837306B TW109105016A TW109105016A TWI837306B TW I837306 B TWI837306 B TW I837306B TW 109105016 A TW109105016 A TW 109105016A TW 109105016 A TW109105016 A TW 109105016A TW I837306 B TWI837306 B TW I837306B
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- Prior art keywords
- resin composition
- resin
- epoxy compound
- phosphorus
- cured product
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 94
- 229920005989 resin Polymers 0.000 title claims description 83
- 239000011347 resin Substances 0.000 title claims description 83
- 229910052751 metal Inorganic materials 0.000 title claims description 77
- 239000002184 metal Substances 0.000 title claims description 77
- 239000011888 foil Substances 0.000 title claims description 61
- -1 prepreg Substances 0.000 title description 13
- 239000004593 Epoxy Substances 0.000 claims abstract description 146
- 150000001875 compounds Chemical class 0.000 claims abstract description 145
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 74
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 62
- 239000011574 phosphorus Substances 0.000 claims abstract description 55
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 54
- 150000008064 anhydrides Chemical class 0.000 claims abstract description 34
- 125000004437 phosphorous atom Chemical group 0.000 claims abstract description 19
- 125000004018 acid anhydride group Chemical group 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 19
- 239000011256 inorganic filler Substances 0.000 claims description 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 17
- 150000008065 acid anhydrides Chemical class 0.000 claims description 15
- 229920000147 Styrene maleic anhydride Polymers 0.000 claims description 14
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims description 13
- 125000002723 alicyclic group Chemical group 0.000 claims description 10
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 6
- 125000003700 epoxy group Chemical group 0.000 claims description 6
- 125000001624 naphthyl group Chemical group 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 133
- 230000009477 glass transition Effects 0.000 description 28
- 239000000463 material Substances 0.000 description 24
- 239000000126 substance Substances 0.000 description 24
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 20
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 15
- 239000003063 flame retardant Substances 0.000 description 15
- 239000011521 glass Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000002585 base Substances 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 9
- 230000007423 decrease Effects 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000005984 hydrogenation reaction Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- NQMUGNMMFTYOHK-UHFFFAOYSA-N 1-methoxynaphthalene Chemical compound C1=CC=C2C(OC)=CC=CC2=C1 NQMUGNMMFTYOHK-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- DGQOZCNCJKEVOA-UHFFFAOYSA-N 5-(2,5-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1CC(=O)OC1=O DGQOZCNCJKEVOA-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 210000004742 mc(tc) Anatomy 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000012783 reinforcing fiber Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 125000006839 xylylene group Chemical group 0.000 description 2
- WBODDOZXDKQEFS-UHFFFAOYSA-N 1,2,3,4-tetramethyl-5-phenylbenzene Chemical group CC1=C(C)C(C)=CC(C=2C=CC=CC=2)=C1C WBODDOZXDKQEFS-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000579895 Chlorostilbon Species 0.000 description 1
- ZTTFLCGNQCKBRY-UHFFFAOYSA-N O=C1c2ccccc2-c2ccccc2P1=O Chemical compound O=C1c2ccccc2-c2ccccc2P1=O ZTTFLCGNQCKBRY-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 239000004113 Sepiolite Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- FGUJWQZQKHUJMW-UHFFFAOYSA-N [AlH3].[B] Chemical compound [AlH3].[B] FGUJWQZQKHUJMW-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 229920005603 alternating copolymer Polymers 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- HJJOHHHEKFECQI-UHFFFAOYSA-N aluminum;phosphite Chemical compound [Al+3].[O-]P([O-])[O-] HJJOHHHEKFECQI-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000003588 decontaminative effect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229910052876 emerald Inorganic materials 0.000 description 1
- 239000010976 emerald Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 235000021588 free fatty acids Nutrition 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000927 poly(p-phenylene benzobisoxazole) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- RKFCDGOVCBYSEW-AUUKWEANSA-N tmeg Chemical compound COC=1C(OC)=CC(C(OC(C=2OC)=C34)=O)=C3C=1OC(=O)C4=CC=2O[C@@H]1O[C@H](CO)[C@@H](O)[C@H](O)[C@H]1O RKFCDGOVCBYSEW-AUUKWEANSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract
本發明的樹脂組成物含有環氧化合物及固化劑。上述環氧化合物包含在分子中具有磷原子的含磷環氧化合物。上述固化劑包含在分子中具有磷原子及酸酐基的含磷酸酐。
Description
發明領域
本發明一般而言涉及樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及印刷配線板。更詳細而言,本發明涉及含有環氧化合物及固化劑的樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及印刷配線板。
發明背景
專利文獻1(日本特開2001-283639號公報)揭示一種增層(build-up)基板用絕緣樹脂組成物。該增層基板用絕緣樹脂組成物以成分A及成分B作為必須成分。成分A為具有2個以上環氧基的環氧低聚物。成分B為包含10-(2,5-二羥基苯基)-10H-9-氧雜-10-磷雜菲-10-氧化物、或二氫-3-((6-氧化-6H-二苯并(c,e)(1,2)氧雜磷雜環己-6-基)甲基)-2,5-呋喃二酮的環氧固化劑。
專利文獻1的增層基板用絕緣樹脂組成物不含鹵素,對於鹼等的耐性優異,機械特性也優異。
然而,專利文獻1的增層基板用絕緣樹脂組成物難以獲得良好的介電特性。預測通訊技術在今後也會持續發展,對於承擔高速通訊技術的一端的印刷配線板的材料而言,尋求介電特性等的進一步提高。
發明概要
本發明的目的在於,提供能夠獲得玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物的樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及印刷配線板。
本發明的一個態樣所述的樹脂組成物含有環氧化合物及固化劑。上述環氧化合物包含在分子中具有磷原子的含磷環氧化合物。上述固化劑包含在分子中具有磷原子及酸酐基的含磷酸酐。
本發明的一個態樣所述的預浸體具備:基材、以及由含浸至上述基材的上述樹脂組成物的半固化物形成的樹脂層。
本發明的一個態樣所述的附樹脂之薄膜具備:由上述樹脂組成物的半固化物形成的樹脂層、以及支撐上述樹脂層的支撐薄膜。
本發明的一個態樣所述的附樹脂之金屬箔具備:由上述樹脂組成物的半固化物形成的樹脂層、以及黏接有上述樹脂層的金屬箔。
本發明的一個態樣所述的覆金屬積層板具備:由上述樹脂組成物的固化物或上述預浸體的固化物形成的絕緣層、以及在上述絕緣層的單面或兩面形成的金屬層。
本發明的一個態樣所述的印刷配線板具備:由上述樹脂組成物的固化物或上述預浸體的固化物形成的絕緣層、以及在上述絕緣層的單面或兩面形成的導體配線。
較佳實施例之詳細說明
(1)概要
本案發明人在開發能夠獲得介電特性優異的固化物的樹脂組成物時,著眼於低介電常數樹脂的耐燃性低的這一點。若想要利用現有方法來提高耐燃性,則存在有玻璃化轉變溫度(Tg)降低或黏接性等降低之虞,但本案發明人進行深入研究的結果,開發了以下的樹脂組成物。
本案實施形態所述的樹脂組成物含有環氧化合物及固化劑。環氧化合物包含在分子中具有磷原子的含磷環氧化合物。固化劑包含在分子中具有磷原子及酸酐基的含磷酸酐。
本案實施形態的一個特徵在於,樹脂組成物含有含磷環氧化合物及含磷酸酐這兩者的這一點。如此,如果併用含磷環氧化合物及含磷酸酐,則能夠得到玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物。固化物可形成印刷配線板5的絕緣層50等(參照圖5)。
本案實施形態的另一個特徵在於,含磷環氧化合物與含磷酸酐能夠發生反應的這一點。在併用含磷環氧化合物及含磷酸酐的情況下,若將兩者發生反應的固化物(以下稱為第一固化物)與兩者未發生反應的固化物(以下稱為第二固化物)進行對比,則即使第一固化物及第二固化物的磷含量相同,第一固化物的耐燃性也比第二固化物優異。
此處,提高玻璃化轉變溫度(Tg)的一個技術意義如下所示。即,若玻璃化轉變溫度(Tg)高,則耐焊熱性(耐回流焊熱性)提高。若耐焊熱性提高,則在利用回流焊方式等將電子零件焊接至印刷配線板5的情況下,能夠抑制絕緣層50的膨脹或者抑制導體配線51的斷線。特別是,就具有高密度配線的多層印刷配線板而言,係尋求良好的耐焊熱性。如果耐焊熱性高,則即使是多層印刷配線板也能夠確保層間連接的可靠性。
此外,介電特性優異的固化物在將印刷配線板5用於高速通訊用途時是有效的。作為對高速通訊用的印刷配線板5要求的項目,可列舉出例如(1)減小信號的傳播延遲;(2)減小信號的介電損失;(3)控制特性阻抗;(4)減少串擾等。
就項目(1)的減小傳播延遲而言,在縮短導體配線51、即進行高密度配線化的同時,降低絕緣層50的相對介電常數即可。相對介電常數越低,則傳播速度越快。
關於項目(2),若頻率變高,則同時降低相對介電常數及介電損耗正切變得重要。
關於項目(3),作為特性阻抗的變動要素,可列舉出絕緣層50的相對介電常數、絕緣層50的厚度、導體配線51的長度及導體配線51的寬度。此處,在使特性阻抗恒定的情況下,若絕緣層50的相對介電常數低,則能夠減薄絕緣層50的厚度,在實現輕量化的同時,能夠進一步縮短導體配線51。换言之,可有助於項目(1)。此外,若絕緣層50的相對介電常數低,則在使層間厚度相同的情況下,能夠拓寬導體配線51的寬度,因此,容易控制特性阻抗,也可有助於項目(4)的串擾減少。
此外,耐化學品性優異的固化物對於用於去除抗蝕劑的鹼性水溶液具有耐性。即使反復進行抗蝕劑的形成及去除,固化物對於鹼性水溶液也具有耐性。作為鹼性水溶液,沒有特別限定,可列舉出例如氫氧化鈉水溶液及氫氧化鉀水溶液。又,耐化學品性優異的固化物即使進行去污處理,孔的內徑也難以擴大。
(2)詳細說明
(2.1)樹脂組成物
本案實施形態所述的樹脂組成物具有電絕緣性,可用作印刷配線板等的基板材料。作為基板材料的具體例,可列舉出預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及印刷配線板,但不特別限定於此等。
樹脂組成物含有環氧化合物及固化劑。較佳地,樹脂組成物較佳進一步含有無機填料。樹脂組成物可以進一步含有固化促進劑。
樹脂組成物可以進一步含有阻燃劑。此時的阻燃劑不是廣義的阻燃劑,而是狹義的阻燃劑。即,廣義的阻燃劑中包括含磷環氧化合物及含磷酸酐,但狹義的阻燃劑中則不包括含磷環氧化合物及含磷酸酐。然而,若將不含阻燃劑的樹脂組成物的固化物(以下稱為第三固化物)與進一步含有阻燃劑的樹脂組成物的固化物(以下稱為第四固化物)進行對比,即使第三固化物及第四固化物的磷含量相同,第三固化物的耐燃性也比第四固化物優異。
樹脂組成物例如如下製備。即,配合環氧化合物及固化劑,根據需要配合無機填料及固化促進劑,用適當的溶劑稀釋,將其攪拌及混合而進行均一化。
樹脂組成物具有熱固化性。樹脂組成物若經加熱則形成半固化物,若進一步加熱則形成固化物。半固化物是半固化狀態的物質,固化物是固化狀態(不熔不融狀態)的物質。此處,半固化狀態是指固化反應的中間階段(B階段)的狀態。中間階段是指清漆狀態的階段(A階段)與固化狀態的階段(C階段)之間的階段。
以下,針對樹脂組成物的構成成分進行說明。
(2.1.1) 環氧化合物
環氧化合物是預聚物,是在分子內具有至少2個以上環氧基的化合物。然而,通常稱為“樹脂”的術語存在作為交聯反應前的材料的樹脂(例如環氧化合物等)及作為交聯反應後的產物(製品)的樹脂這兩種含義。本案說明書中,“樹脂”基本是指前者。
本案實施形態中,環氧化合物包含含磷環氧化合物。含磷環氧化合物在分子中具有磷原子。含磷環氧化合物相對於後述含磷酸酐具有反應性。
較佳地,含磷環氧化合物具有下述式(1)的結構。
[化1]
式(1):
(式中,*表示鍵結鍵)
若含磷環氧化合物具有上述式(1)的結構,則容易獲得玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物。含磷環氧化合物可以在分子中具有多個上述式(1)的結構。含磷環氧化合物只要在分子中具有磷原子就沒有特別限定,較佳為在分子中包含1個以上源自選自雙酚A型環氧化合物、雙酚F型環氧化合物、雙酚S型環氧化合物、苯基型環氧化合物、亞二甲苯基型環氧化合物、芳基亞烷基型環氧化合物、三苯基甲烷型環氧化合物、蒽型環氧化合物、降冰片烯型環氧化合物、芴型環氧化合物、萘型環氧化合物、二環戊二烯型環氧化合物、9,10-二氫-9-氧雜-10-磷雜菲-10-氧化物及10-[2-(二羥基萘基)]-9,10-二氫-9-氧雜-10-磷雜菲-10-氧化物之群中的物質的結構。
環氧化合物較佳更包含多官能環氧化合物。多官能環氧化合物在分子中不含磷原子,且具有至少2個以上的環氧基。如果環氧化合物更包含多官能環氧化合物,則能夠對固化物賦予多官能環氧化合物所特有的性質。
作為多官能環氧化合物,沒有特別限定,可列舉出例如雙酚型環氧化合物、酚醛型環氧化合物、聯苯基型環氧化合物、亞二甲苯基型環氧化合物、芳基亞烷基型環氧化合物、三苯基甲烷型環氧化合物、蒽型環氧化合物、降冰片烯型環氧化合物及芴型環氧化合物等。樹脂組成物中含有的環氧化合物可以僅為1種,也可以為2種以上。
作為雙酚型環氧化合物的具體例,可列舉出雙酚A型環氧化合物、雙酚F型環氧化合物及雙酚S型環氧化合物等,但不特別限定於此等。
作為酚醛型環氧化合物的具體例,可列舉出苯酚酚醛型環氧化合物及甲酚酚醛型環氧化合物等,但不特別限定於此等。
作為芳基亞烷基型環氧化合物的具體例,可列舉出苯酚芳烷基型環氧化合物、聯苯基芳烷基型環氧化合物、聯苯基酚醛型環氧化合物、聯苯基二亞甲基型環氧化合物、三苯酚甲烷酚醛型環氧化合物及四甲基聯苯基型環氧化合物等,但不特別限定於此等。
較佳地,多官能環氧化合物包含在分子中具有萘骨架及二環戊二烯骨架中至少任一種骨架的多官能環氧化合物。以下,特別是有將在分子中具有萘骨架的多官能環氧化合物稱為“萘型環氧化合物”,將在分子中具有二環戊二烯骨架的多官能環氧化合物稱為“二環戊二烯型環氧化合物”的情況。
萘骨架具有剛性及疏水性。因此,如果多官能環氧化合物包含萘型環氧化合物,則能夠對固化物賦予耐熱性、低吸濕性及低線膨脹率性。
作為萘型環氧化合物的具體例,可列舉出萘骨架改性甲酚酚醛型環氧化合物、萘二醇芳烷基型環氧化合物、萘酚芳烷基型環氧化合物、甲氧基萘改性甲酚酚醛型環氧化合物及甲氧基萘二亞甲基型環氧化合物等,但不特別限定於此等。
二環戊二烯骨架是大體積的環狀脂肪族烴。因此,如果多官能環氧化合物包含二環戊二烯型環氧化合物,則能夠對固化物賦予良好的介電特性、低吸濕性及耐熱性。
(2.1.2)固化劑
固化劑包含含磷酸酐。含磷酸酐在分子中具有磷原子及酸酐基。含磷酸酐相對於上述含磷環氧化合物具有反應性。
含磷酸酐沒有特別限定,例如較佳在分子中包含下述式(A)及/或下述式(B)所示的結構且包含酸酐基。酸酐基較佳包含環狀酸酐基。
[化2]
式(A):
式(B):
(式中,*表示鍵結鍵)
特別地,含磷酸酐以在分子中包含上述式(A)為佳。作為在分子中包含上述式(A)的含磷酸酐,可列舉出例如下述式(2)所示的二氫-3-((6-氧化-6H-二苯并(c,e)(1,2)氧雜磷雜環己-6-基)甲基)-2,5-呋喃二酮。如果是下述式(2)所示的含磷酸酐,則容易得到玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物。
[化3]
式(2):
較佳地,固化劑更包含不含磷的固化劑。不含磷的固化劑在分子中不含磷原子。如果固化劑更包含不含磷的固化劑,則能夠對固化物賦予不含磷的固化劑所特有的性質。
較佳地,不含磷的固化劑包含選自於由多官能酸酐、脂環式多官能酸酐及苯乙烯馬來酸酐共聚物所構成之群中的1種以上化合物。由此,能夠對固化物賦予多官能酸酐、脂環式多官能酸酐及苯乙烯馬來酸酐共聚物各自所特有的性質。
多官能酸酐是在分子內具有至少2個以上酸酐基的化合物。作為多官能酸酐,沒有特別限定,可列舉出例如乙二醇雙脫水偏苯三酸酯(TMEG)、均苯四酸酐(PMDA)、3,3’,4,4’-聯苯四甲酸二酐(BPDA)及2,2-雙[4-(3,4-二羧基苯氧基)苯基]丙酸二酐(BPADA)。與單官能酸酐(在分子內具有1個酸酐基的化合物)相比,藉由使用多官能酸酐,固化物的交聯密度容易變高。因此,多官能酸酐能夠提高固化物的玻璃化轉變溫度(Tg)。
脂環式多官能酸酐為多官能酸酐,且更具有至少1個以上不具備芳香族性的飽和或不飽和碳環的化合物。作為脂環式多官能酸酐,沒有特別限定,可列舉出例如5-(2,5-二氧代四氫-3-呋喃基)-3-甲基-3-環己烯-1,2-二羧酸酐(MCTC)及氫化環己烷-1,2,4,5-四羧酸二酐(H-PMDA)。脂環式多官能酸酐能夠使固化物實現低介電常數化。特別是經加氫的脂環式多官能酸酐是有效的。又,加氫與氫化或加氫反應的含義相同。
苯乙烯馬來酸酐共聚物是藉由苯乙烯單體與馬來酸酐的共聚而生成的二元共聚物(共聚物),為具有2個以上酸酐基的酸酐。苯乙烯馬來酸酐共聚物能夠提高固化物的耐化學品性(特別是耐鹼性)。
根據苯乙烯單體與馬來酸酐的排列所導致的差異,苯乙烯馬來酸酐共聚物被分類為交替共聚物、無規共聚物、嵌段共聚物及接枝共聚物。可以使用此等共聚物中的任一者。
苯乙烯馬來酸酐共聚物的酸值較佳為275以上且550以下的範圍內。酸值用以下表示:將1g苯乙烯馬來酸酐共聚物中存在的游離脂肪酸中和所需的氫氧化鉀的mg數。若酸值為275以上,則能够提高固化物的黏接性。具體而言,能夠提高覆金屬積層板4及印刷配線板5的剝離強度。
在苯乙烯馬來酸酐共聚物中,苯乙烯單體與馬來酸酐的摩爾比沒有特別限定。例如,摩爾比為1:1~3:1。
苯乙烯馬來酸酐共聚物的重量平均分子量沒有特別限定。例如,重量平均分子量在4500以上且9000以下的範圍內。
較佳地,相對於環氧化合物及固化劑的合計質量,磷含量在1.3質量%以上且3.7質量%以下的範圍內。藉由使磷含量為1.3質量%以上,能夠提高固化物的耐燃性。藉由使固化物的磷含量為3.7質量%以下,能夠抑制固化物的耐化學品性(特別是耐鹼性)的降低。又,在樹脂組成物更含有阻燃劑的情況下,磷含量以環氧化合物、固化劑及阻燃劑的合計質量作為基準。
相對於含磷環氧化合物及含磷酸酐的合計100質量份,含磷酸酐的含量較佳在5質量份以上且70質量份以下的範圍內,更佳在7質量份以上且66質量份以下的範圍內,進一步更佳在25質量份以上且55質量份以下的範圍內。藉由使含磷酸酐的含量為5質量份以上,能夠抑制固化物的耐燃性及玻璃化轉變溫度(Tg)的降低。藉由使含磷酸酐的含量為70質量份以下,能夠抑制固化物的耐燃性的降低。
較佳地,環氧化合物與固化劑的當量比在1:0.75~1:1.25的範圍內。換言之,(固化劑的當量)/(環氧化合物的當量)在0.75以上且1.25以下的範圍內。藉由使環氧化合物與固化劑的當量比在上述範圍內,能夠抑制固化物的耐燃性及玻璃化轉變溫度(Tg)的降低。
此處,環氧化合物的當量(eq)係以樹脂組成物所含有的環氧化合物的質量(g)除以該環氧化合物的環氧當量(g/eq)而得。又,環氧當量是指包含1當量環氧基的環氧化合物的質量。
在樹脂組成物含有多個環氧化合物的情況下,樹脂組成物的環氧化合物的當量是各環氧化合物的合計當量。
固化劑(酸酐)的當量(eq)係以樹脂組成物所含有的固化劑的質量(g)除以該固化劑的酸酐當量(g/eq)而得。又,酸酐當量是指包含1當量酸酐基的固化劑的質量。
在樹脂組成物含有多個固化劑的情況下,樹脂組成物的固化劑的當量是各固化劑的合計當量。
(2.1.3) 無機填料
作為無機填料,沒有特別限定,可列舉出例如二氧化矽、碳酸鈣、氧化鈦、高嶺土、黏土、硫酸鋇、氧化鋅、氫氧化鋁、氫氧化鎂、滑石、雲母、矽灰石、鈦酸鉀、硼鋁、海泡石、氮化硼及氮化矽。無機填料的形狀以球形為佳。
在樹脂組成物更含有無機填料的情況下,相對於環氧化合物及固化劑的合計100質量份,無機填料的含量較佳在20質量份以上且150質量份以下的範圍內。藉由使無機填料的含量為20質量份以上,能夠提高固化物的耐燃性。此外,能夠降低固化物的線膨脹率或者抑制固化收縮或者提高導熱性。由此,也能够提高耐回流焊热性。進而,就具有2層以上的導體配線51的印刷配線板5而言,也能夠確保層間連接的可靠性。藉由使無機填料的含量為150質量份以下,固化物能夠實現低介電常數化。此外,能夠提高覆金屬積層板4及印刷配線板5的剝離強度。進而,能夠抑制樹脂組成物在熔融時的流動性的降低,且維持適於成形的流動性。
(2.1.4)固化促進劑
作為固化促進劑,沒有特別限定,可列舉出例如咪唑化合物及雙氰胺。作為咪唑化合物,沒有特別限定,可列舉出例如2-乙基-4-甲基咪唑、2-甲基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、2-苯基咪唑及2-苯基-4-甲基咪唑。
(2.2) 預浸體
圖1顯示本案實施形態所述的預浸體1。預浸體1整體呈現片狀或薄膜狀。預浸體1可利用覆金屬積層板4的材料、印刷配線板5的材料及印刷配線板5的多層化(增層法)等。
預浸體1具備基材11及樹脂層10。樹脂層10由含浸至基材11的樹脂組成物的半固化物形成。
1片預浸體1至少具備1片基材11。基材11的厚度沒有特別限定,例如在8μm以上且100μm以下的範圍內。作為基材11的具體例,可列舉出織布及不織布。作為織布的具體例,可列舉出玻璃布,但不特別限定於此。作為不織布的具體例,可列舉出玻璃不織布,但不特別限定於此。玻璃布及玻璃不織布由玻璃纖維形成,但也可以由玻璃纖維之外的強化纖維形成。作為構成玻璃纖維的玻璃的種類,沒有特別限定,可列舉出例如E玻璃、T玻璃、S玻璃、Q玻璃、UT玻璃、NE玻璃及L玻璃。作為強化纖維的具體例,可列舉出芳香族聚醯胺纖維、液晶聚酯纖維、聚(對亞苯基苯并二噁唑)(PBO)纖維及聚苯硫醚(PPS)樹脂纖維,但不特別限定於此等。
預浸體1一經加熱,則在一度熔融後,完全固化而呈現固化狀態。預浸體1的固化物能夠形成基板的絕緣層。
預浸體1的厚度沒有特別限定,較佳為120μm以下、更佳為100μm以下、進一步更佳為60μm以下、再進一步更佳為40μm以下。藉此,能夠減薄絕緣層的厚度,能夠實現基板的薄型化。預浸體1的厚度以10μm以上為佳。
由於預浸體1的樹脂層10以本案實施形態所述的樹脂組成物形成,因此,能夠得到玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物。
(2.3)附樹脂之薄膜
圖2A顯示本案實施形態所述的附樹脂之薄膜2。附樹脂之薄膜2整體呈現薄膜狀或片狀。附樹脂之薄膜2具備樹脂層20及支撐薄膜21。附樹脂之薄膜2被利用於印刷配線板5的多層化(增層法)等。
樹脂層20以樹脂組成物的半固化物形成。半固化物藉由被加熱而能夠形成固化物。如此操作,樹脂層20能夠形成絕緣層。
樹脂層20的厚度沒有特別限定,較佳為120μm以下、更佳為100μm以下、進一步更佳為60μm以下、再進一步更佳為40μm以下。藉此,能夠減薄絕緣層的厚度,能夠實現基板的薄型化。樹脂層20的厚度以10μm以上為佳。
支撐薄膜21係支撐樹脂層20。藉由如此進行支撐,從而容易處理樹脂層20。
支撐薄膜21為例如電絕緣性薄膜,但不特別限定於此。作為支撐薄膜21的具體例,可列舉出聚對苯二甲酸乙二醇酯(PET)薄膜、聚醯亞胺薄膜、聚酯薄膜、聚仲班酸薄膜、聚醚醚酮薄膜、聚苯硫醚薄膜、芳族聚醯胺薄膜、聚碳酸酯薄膜及聚芳酯薄膜等。支撐薄膜21不限定於此等薄膜。
可以在支撐薄膜21的支撐樹脂層20的面設置有脫模劑層(未圖示)。利用脫模劑層,支撐薄膜21可根據需要從樹脂層20剝離。較佳地,在使樹脂層20固化而形成絕緣層後,從該絕緣層剝離支撐薄膜21。
圖2A中,樹脂層20的一個面覆蓋有支撐薄膜21,如圖2B所示,可以用保護薄膜22覆蓋樹脂層20的另一個面。藉由如此覆蓋樹脂層20的兩面,從而更容易處理樹脂層20。此外,能夠抑制異物附著於樹脂層20。
保護薄膜22為例如電絕緣性薄膜,但不特別限定於此。作為保護薄膜22的具體例,可列舉出聚對苯二甲酸乙二醇酯(PET)薄膜、聚烯烴薄膜、聚酯薄膜及聚甲基戊烯薄膜等。保護薄膜22不限定於此等薄膜。
可以在保護薄膜22重疊於樹脂層20的面設置有脫模劑層(未圖示)。利用脫模劑層,保護薄膜22根據需要可以從樹脂層20剝離。
附樹脂之薄膜2的樹脂層20以本案實施形態所述的樹脂組成物形成,因此,能夠得到玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物。
(2.4)附樹脂之金屬箔
圖3顯示本案實施形態所述的附樹脂之金屬箔3。附樹脂之金屬箔3整體為薄膜狀或片狀。附樹脂之金屬箔3具備樹脂層30及金屬箔31。附樹脂之金屬箔3被利用於印刷配線板5的多層化(增層法)等。
樹脂層30以樹脂組成物的半固化物形成。半固化物藉由被加熱而能夠形成固化物。如此操作,樹脂層30能夠形成絕緣層。
樹脂層30的厚度沒有特別限定,較佳為120μm以下、更佳為100μm以下、進一步更佳為60μm以下、再進一步更佳為40μm以下。藉此,能夠減薄由樹脂層30固化而形成的絕緣層的厚度,能夠實現基板的薄型化。樹脂層30的厚度以10μm以上為佳。
金屬箔31黏接有樹脂層30。作為金屬箔31的具體例,可列舉出銅箔,但不特別限定於此。金屬箔31藉由在減成法等中利用蝕刻來去除不需要部分,能夠形成導體配線。
金屬箔31的厚度沒有特別限定,較佳為35μm以下、更佳為18μm以下。金屬箔31的厚度以5μm以上為佳。
此外,金屬箔31可以由所謂的附載體之極薄金屬箔(省略圖示)的極薄金屬箔(例如極薄銅箔)構成。附載體之極薄金屬箔為3層結構。即,附載體之極薄金屬箔具備載體、設置在載體表面的剝離層、以及設置在剝離層表面的極薄金屬箔。極薄金屬箔係難以單獨處理程度的極薄,當然比載體為薄。載體是具有保護並支撐極薄金屬箔作用的金屬箔(例如銅箔)。附載體之極薄金屬箔具有某種程度的厚度,因此容易處理。極薄金屬箔及載體的厚度沒有特別限定,例如,極薄金屬箔的厚度在1μm以上且10μm以下的範圍內,載體的厚度在18μm以上且35μm以下的範圍內。極薄金屬箔根據需要可從剝離層剝離。
使用附載體之極薄金屬箔時,可如下操作來製造附樹脂之金屬箔3。即,在附載體之極薄金屬箔中的極薄金屬箔表面塗布樹脂組成物,進行加熱而形成樹脂層30。其後,從極薄金屬箔剝離載體。極薄金屬箔作為金屬箔31而黏接於樹脂層30的表面。剝離層較佳與載體一同被剝離而不殘留於極薄金屬箔的表面,即使殘留也可輕易去除。黏接於樹脂層30表面的極薄金屬箔可用作改良半加成法(MSAP:Modified Semi Additive Process)中的晶種層,可對該晶種層進行電解鍍敷處理而形成導體配線。
附樹脂之金屬箔3的樹脂層30以本案實施形態所述的樹脂組成物形成,因此,能夠得到玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物。
(2.5) 覆金屬積層板
圖4顯示本案實施形態所述的覆金屬積層板4。覆金屬積層板4具備絕緣層40及金屬層41。覆金屬積層板4被利用於印刷配線板5的材料等。
絕緣層40以樹脂組成物的固化物或預浸體1的固化物形成。圖4中,絕緣層40具有1片基材42,也可以具有2片以上的基材42。
絕緣層40的厚度沒有特別限定。如果絕緣層40的厚度較薄,則對於基板的薄型化而言是有效的。絕緣層40的厚度較佳為120μm以下、更佳為100μm以下、進一步更佳為60μm以下、再進一步更佳為40μm以下。絕緣層40的厚度較佳為10μm以上、更佳為15μm以上。
金屬層41形成於絕緣層40的單面或兩面。作為金屬層41,沒有特別限定,可列舉出例如金屬箔。作為金屬箔,沒有特別限定,可列舉出例如銅箔。圖4中,在絕緣層40的兩面形成有金屬層41,也可以僅在絕緣層40的單面形成有金屬層41。在絕緣層40的兩面形成有金屬層41的覆金屬積層板4是兩面覆金屬積層板。僅在絕緣層40的單面形成有金屬層41的覆金屬積層板4是單面覆金屬積層板。
金屬層41的厚度沒有特別限定,較佳為35μm以下、更佳為18μm以下。金屬層41的厚度較佳為5μm以上。
此外,金屬層41可以由上述附載體之極薄金屬箔的極薄金屬箔構成。在使用附載體之極薄金屬箔的情況下,可以如下操作來製造覆金屬積層板4。即,可以在1片預浸體1的單面或兩面積層附載體之極薄金屬箔並進行成形,也可以重疊多片預浸體1,在其單面或兩面積層附載體之極薄金屬箔並進行成形。此時,在預浸體1的表面重疊附載體之極薄金屬箔的極薄金屬箔。在積層成形後,從極薄金屬箔剝離載體。極薄金屬箔作為金屬層41而黏接於作為預浸體1的固化物的絕緣層40的表面。剝離層較佳與載體一同被剝離而不殘留於極薄金屬箔的表面,即使殘留也能夠輕易去除。黏接於絕緣層40表面的極薄金屬箔可用作改良半加成法(MSAP:Modified Semi Additive Process)中的晶種層。將晶種層的特定部分用鍍敷抗蝕劑覆蓋,除此之外的部分進行電解鍍敷處理。其後,剝離鍍敷抗蝕劑,藉由蝕刻等將露出的晶種層去除,能夠形成導體配線。
覆金屬積層板4的絕緣層40以本案實施形態所述的樹脂組成物形成,因此,玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異。玻璃化轉變溫度(Tg)較佳為170℃以上。相對介電常數較佳為3.60以下。
(2.6) 印刷配線板
圖5顯示本案實施形態所述的印刷配線板5。印刷配線板5具備絕緣層50及導體配線51。本案說明書中,“印刷配線板”是指:未焊接有電子零件,僅為配線狀態的印刷配線板。
絕緣層50以樹脂組成物的固化物或預浸體1的固化物形成。絕緣層50與上述覆金屬積層板4的絕緣層40相同。
導體配線51形成於絕緣層50的單面或兩面。圖5中,在絕緣層50的兩面形成有導體配線51,也可以僅在絕緣層50的單面形成有導體配線51。作為導體配線51的形成方法,沒有特別限定,可列舉出例如減成法、半加成法(SAP:Semi-Additive Process)、改良半加成法(MSAP:Modified Semi-Additive Process)等。由於絕緣層50的黏接性提高,因此即使導體配線51的寬度較細,導體配線51也難以從絕緣層50剝離。換言之,如果是本案實施形態所述的印刷配線板5,則能夠實現高密度配線化。
印刷配線板5的絕緣層50以本案實施形態所述的樹脂組成物形成,因此,玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異。因此可以認為:本案實施形態所述的印刷配線板5特別是對於高速通訊用途而言是有效的。
(3)總結
由上述實施形態可以明確:本發明包括下述態樣。以下,僅是為了明確顯示與實施形態的對應關係,標註附在括號中的符號。
第一態樣所述的樹脂組成物含有環氧化合物及固化劑。上述環氧化合物包含在分子中具有磷原子的含磷環氧化合物。上述固化劑包含在分子中具有磷原子及酸酐基的含磷酸酐。
根據該態樣,能夠得到玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物。
就第二態樣所述的樹脂組成物而言,係在第一態樣中,上述環氧化合物更包含在分子中不含磷原子且具有至少2個以上環氧基的多官能環氧化合物。
根據該態樣,能夠對固化物賦予多官能環氧化合物所特有的性質。
就第三態樣所述的樹脂組成物而言,係在第一或第二態樣中,上述固化劑更包含在分子中不含磷原子的不含磷的固化劑。
根據該態樣,能夠對固化物賦予不含磷的固化劑所特有的性質。
就第四態樣所述的樹脂組成物而言,係在第一~第三的任一態樣中,相對於上述環氧化合物及上述固化劑的合計質量,磷含量在1.3質量%以上且3.7質量%以下的範圍內。
根據該態樣,藉由使磷含量為1.3質量%以上,能夠提高固化物的耐燃性。藉由使固化物的磷含量為3.7質量%以下,能夠抑制固化物的耐化學品性(特別是耐鹼性)的降低。
就第五態樣所述的樹脂組成物而言,係在第一~第四的任一態樣中,相對於上述含磷環氧化合物及上述含磷酸酐的合計100質量份,上述含磷酸酐的含量在5質量份以上且70質量份以下的範圍內。
根據該態樣,藉由使含磷酸酐的含量為5質量份以上,能夠抑制固化物的耐燃性及玻璃化轉變溫度(Tg)的降低。藉由使含磷酸酐的含量為70質量份以下,能夠抑制固化物的耐燃性的降低。
就第六態樣所述的樹脂組成物而言,係在第二~第五的任一態樣中,上述多官能環氧化合物包含在分子中具有萘骨架及二環戊二烯骨架中至少任一種骨架的多官能環氧化合物。
根據該態樣,如果多官能環氧化合物包含萘型環氧化合物,則能夠對固化物賦予耐熱性、低吸濕性及低線膨脹率性。如果多官能環氧化合物包含二環戊二烯型環氧化合物,則能夠對固化物賦予良好的介電特性、低吸濕性及耐熱性。
就第七態樣所述的樹脂組成物而言,係在第三~第六的任一態樣中,上述不含磷的固化劑包含選自於由多官能酸酐、脂環式多官能酸酐及苯乙烯馬來酸酐共聚物所構成之群中的1種以上化合物。
根據該態樣,能夠對固化物賦予多官能酸酐、脂環式多官能酸酐及苯乙烯馬來酸酐共聚物各自所特有的性質。
就第八態樣所述的樹脂組成物而言,係在第一~第七的任一態樣中,上述含磷環氧化合物具有下述式(1)的結構。
[化4]
式(1):
(式中,*表示鍵結鍵)
根據該態樣,容易獲得玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物。
就第九態樣所述的樹脂組成物而言,係在第一~第八的任一態樣中,上述環氧化合物與上述固化劑的當量比在1:0.75~1:1.25的範圍內。
根據該態樣,藉由使環氧化合物與固化劑的當量比在上述範圍內,能夠抑制固化物的耐燃性及玻璃化轉變溫度(Tg)的降低。
就第十態樣所述的樹脂組成物而言,係在第一~第九的任一態樣中,更含有無機填料。相對於上述環氧化合物及上述固化劑的合計100質量份,上述無機填料的含量在20質量份以上且150質量份以下的範圍內。
根據該態樣,藉由使無機填料的含量為20質量份以上,能夠降低固化物的線膨脹率或者抑制固化收縮或者提高導熱性。藉由使無機填料的含量為150質量份以下,能夠抑制樹脂組成物在熔融時的流動性的降低。
第十一態樣所述的預浸體(1)具備基材(11)、以及由含浸至上述基材(11)的第一~第十中任一態樣所述的樹脂組成物的半固化物形成的樹脂層(10)。
根據該態樣,能夠得到玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物。
第十二態樣所述的附樹脂之薄膜(2)具備由第一~第十中任一態樣所述的樹脂組成物的半固化物形成的樹脂層(20)、以及支撐上述樹脂層(20)的支撐薄膜(21)。
根據該態樣,能夠得到玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物。
第十三態樣所述的附樹脂之金屬箔(3)具備由第一~第十中任一態樣所述的樹脂組成物的半固化物形成的樹脂層(30)、以及黏接有上述樹脂層(30)的金屬箔(31)。
根據該態樣,能夠得到玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異的固化物。
第十四態樣所述的覆金屬積層板(4)具備由第一~第十中任一態樣所述的樹脂組成物的固化物或第十一態樣所述的預浸體(1)的固化物形成的絕緣層(40)、以及在上述絕緣層(40)的單面或兩面形成的金屬層(41)。
根據該態樣,絕緣層(40)的玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異。
第十五態樣所述的印刷配線板(5)具備由第一~第十中任一態樣所述的樹脂組成物的固化物或第十一態樣所述的預浸體(1)的固化物形成的絕緣層(50)、以及在上述絕緣層(50)的單面或兩面形成的導體配線(51)。
根據該態樣,絕緣層(50)的玻璃化轉變溫度(Tg)高,且介電特性、黏接性、耐化學品性及耐燃性優異。
實施例
以下,藉由實施例來具體說明本發明。其中,本發明不限定於實施例。
(1)樹脂組成物
作為樹脂組成物的原料,準備以下的原料。
(1.1)環氧化合物
・含磷環氧化合物(新日鐵住金化學株式會社製、商品名“FX-289-P”、環氧當量:390g/eq、磷含量:3.5質量%)
・二環戊二烯型環氧化合物(DIC株式會社製、商品名“HP-7200HHH”、環氧當量:280~290g/eq、軟化點:100~105℃)
・萘型環氧化合物(DIC株式會社製、商品名“HP-9500”、環氧當量:230g/eq)
(1.2)固化劑
・含磷酸酐(二氫-3-((6-氧化-6H-二苯并(c,e)(1,2)氧雜磷雜環己-6-基)甲基)-2,5-呋喃二酮、酸酐當量:332g/eq、參照式(2))
・多官能酸酐(新日本理化株式會社製、商品名“RIKACID TMEG-S”、乙二醇雙脫水偏苯三酸酯、酸酐當量:204g/eq、軟化點:64~76℃)
・脂環式多官能酸酐(DIC株式會社製、商品名“B-4500”、5-(2,5-二氧代四氫-3-呋喃基)-3-甲基-3-環己烯-1,2-二羧酸酐(MCTC)、粉末狀酸酐、酸酐當量:132g/eq)
・苯乙烯馬來酸酐共聚物(CRAY VALLEY公司製、商品名“SMA EF30”、苯乙烯:馬來酸酐(摩爾比)=3:1、酸值:275~285KOHmg/g、酸酐當量:280g/eq、重量平均分子量:9500)
(1.3)無機填料
・二氧化矽(浙江華飛電子基材有限公司製、商品名“VF-40-YE3”、球狀、粒徑:1.51μm(D50)/頂切10μm)
(1.4)固化促進劑
・咪唑化合物(四國化成工業株式會社製、商品名“2E4MZ”、2-乙基-4-甲基咪唑)
(1.5)阻燃劑
・分散型阻燃劑(科萊恩日本株式會社製、商品名“OP-935”、次膦酸鋁、磷含量:23質量%)
・反應型阻燃劑(Chemtura Japan株式會社製、商品名“Emerald 2000”、磷含量:9.8質量%)
將上述樹脂組成物的原料總結示於表1。
[表1]
並且,將環氧化合物、固化劑、無機填料、固化促進劑及阻燃劑以表2所示的配合量進行配合,用溶劑(甲乙酮)稀釋,將其進行攪拌及混合實現均勻化,由此製備清漆狀態的樹脂組成物。
[表2]
表3中顯示環氧化合物及固化劑的當量、兩者的當量比、以及環氧化合物、固化劑、阻燃劑及樹脂組成物的磷含量。
[表3]
(2)預浸體
預浸體如下製造:使上述樹脂組成物含浸至作為基材的玻璃布(日東紡績株式會社製、商品名“7628 type cloth”),利用非接觸型的加熱單元,將其以110~140℃進行加熱乾燥,去除樹脂組成物中的溶劑,使樹脂組成物半固化,由此製造。相對於預浸體的總質量,預浸體的樹脂含量(樹脂組成物的含量)在65質量%以上且75質量%以下的範圍內。
(3) 覆金屬積層板
對於覆金屬積層板,藉由在重疊8片預浸體(340mm×510mm)的同時,在其兩側以粗化面作為內側而重疊銅箔(三井金屬礦業株式會社製、厚度為18μm、ST箔),將其進行加熱加壓並積層成形,由此製造成為覆銅積層板。加熱加壓的條件為180℃、2.94MPa、60分鐘。
(4)試驗
(4.1)玻璃化轉變溫度(Tg)
使用Seiko Instruments株式會社製的黏彈性光譜儀“DMS6100”,測定預浸體的玻璃化轉變温度。具體而言,利用彎曲模組將頻率設為10Hz並進行測定,將在升溫速度為5℃/分鐘的條件下從室溫升溫至280℃為止時的tanα顯示極大值的溫度作為玻璃化轉變溫度。
(4.2)相對介電常數(Dk)
使用Hewlett-Packard公司製的“阻抗/材料分析儀4291A”,按照IPC-TM-650 2.5.5.9測定1GHz下的覆銅積層板的相對介電常數。
(4.3)剝離強度
按照JIS C 6481測定覆銅積層板表面的銅箔(厚度為18μm)的撕離強度。即,將銅箔以每分鐘約50mm的速度進行撕扯,測定此時的撕離強度(kN/m)來作為剝離強度。
(4.4)耐鹼性
與上述同樣地製造板厚為0.8mm的覆銅積層板。利用蝕刻來去除該覆銅積層板表面的銅箔後,使其在70℃的氫氧化鈉水溶液(10質量%)中浸漬30分鐘。並且,由浸漬前後的質量算出質量減少率。將其結果如下分類並顯示於表4。
“A”:質量減少率為0質量%以上且小於0.2質量%
“B”:質量減少率為0.2質量%以上且小於0.3質量%
“C”:質量減少率為0.3質量%以上
(4.5)耐燃性
調整預浸體的片數,並與上述同樣地製造板厚為0.8mm、1.2mm、1.6mm的覆銅積層板。藉由蝕刻去除各覆銅積層板表面的銅箔後,按照Underwriters Laboratories的“Test for Flammability of Plastic Materials-UL 94”進行耐燃性試驗,評價耐燃性。滿足V-0時記為“OK”、不滿足V-0時記作“NG”。表4中,顯示板厚及該板厚下是否滿足V-0。
“1.6mm OK”:1.6mm、1.2mm及0.8mm均為OK
“1.2mm OK”:1.6mm為NG、1.2mm及0.8mm為OK
“0.8mm NG”:1.6mm、1.2mm及0.8mm均為NG
[表4]
1:預浸體
2:附樹脂之薄膜
3:附樹脂之金屬箔
4:覆金屬積層板
5:印刷配線板
10:樹脂層
11:基材
20:樹脂層
21:支撐薄膜
22:保護薄膜
30:樹脂層
31:金屬箔
40:絕緣層
41:金屬層
42:基材
50:絕緣層
51:導體配線
圖1是本發明的一個實施形態所述的預浸體的概略截面圖。
圖2A是本發明的一個實施形態所述的附樹脂之薄膜(無保護薄膜)的概略截面圖。
圖2B是本發明的一個實施形態所述的附樹脂之薄膜(有保護薄膜)的概略截面圖。
圖3是本發明的一個實施形態所述的附樹脂之金屬箔的概略截面圖。
圖4是本發明的一個實施形態所述的覆金屬積層板的概略截面圖。
圖5是本發明的一個實施形態所述的印刷配線板的概略截面圖。
1:預浸體
10:樹脂層
11:基材
Claims (15)
- 一種樹脂組成物,其含有環氧化合物及固化劑, 所述環氧化合物包含在分子中具有磷原子的含磷環氧化合物, 所述固化劑包含在分子中具有磷原子及酸酐基的含磷酸酐。
- 如請求項1所述的樹脂組成物,其中,所述環氧化合物更包含在分子中不含磷原子且具有至少2個以上環氧基的多官能環氧化合物。
- 如請求項1所述的樹脂組成物,其中,所述固化劑更包含在分子中不含磷原子的不含磷的固化劑。
- 如請求項1所述的樹脂組成物,其中,相對於所述環氧化合物及所述固化劑的合計質量,磷含量為1.3質量%以上且3.7質量%以下的範圍內。
- 如請求項1所述的樹脂組成物,其中,相對於所述含磷環氧化合物及所述含磷酸酐的合計100質量份,所述含磷酸酐的含量為5質量份以上且70質量份以下的範圍內。
- 如請求項2所述的樹脂組成物,其中,所述多官能環氧化合物包含在分子中具有萘骨架及二環戊二烯骨架中至少任一種骨架的多官能環氧化合物。
- 如請求項3所述的樹脂組成物,其中,所述不含磷的固化劑包含選自於由多官能酸酐、脂環式多官能酸酐及苯乙烯馬來酸酐共聚物所構成之群中的1種以上化合物。
- 如請求項1所述的樹脂組成物,其中,所述含磷環氧化合物具有下述式(1)的結構, 式(1): 式中,*表示鍵結键。
- 如請求項1所述的樹脂組成物,其中,所述環氧化合物與所述固化劑的當量比為1:0.75~1:1.25的範圍內。
- 如請求項1所述的樹脂組成物,其更含有無機填料, 相對於所述環氧化合物及所述固化劑的合計100質量份,所述無機填料的含量為20質量份以上且150質量份以下的範圍內。
- 一種預浸體,其具備: 基材;以及 以含浸至所述基材之如請求項1所述的樹脂組成物的半固化物形成的樹脂層。
- 一種附樹脂之薄膜,其具備: 以如請求項1所述的樹脂組成物的半固化物形成的樹脂層;以及 支撐所述樹脂層的支撐薄膜。
- 一種附樹脂之金屬箔,其具備: 以如請求項1所述的樹脂組成物的半固化物形成的樹脂層;以及 黏接有所述樹脂層的金屬箔。
- 一種覆金屬積層板,其具備: 以如請求項1所述的樹脂組成物的固化物或如請求項11所述的預浸體的固化物形成的絕緣層;以及 在所述絕緣層的單面或兩面形成的金屬層。
- 一種印刷配線板,其具備: 以如請求項1所述的樹脂組成物的固化物或如請求項11所述的預浸體的固化物形成的絕緣層;以及 在所述絕緣層的單面或兩面形成的導體配線。
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JPWO2020203469A1 (zh) | 2020-10-08 |
CN111748174A (zh) | 2020-10-09 |
SE2151138A1 (en) | 2021-09-17 |
WO2020203469A1 (ja) | 2020-10-08 |
JP7352799B2 (ja) | 2023-09-29 |
KR20210146914A (ko) | 2021-12-06 |
TW202041562A (zh) | 2020-11-16 |
CN113574087A (zh) | 2021-10-29 |
US20220185945A1 (en) | 2022-06-16 |
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