WO2020203469A1 - 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板 - Google Patents
樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板 Download PDFInfo
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- WO2020203469A1 WO2020203469A1 PCT/JP2020/013020 JP2020013020W WO2020203469A1 WO 2020203469 A1 WO2020203469 A1 WO 2020203469A1 JP 2020013020 W JP2020013020 W JP 2020013020W WO 2020203469 A1 WO2020203469 A1 WO 2020203469A1
- Authority
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- WIPO (PCT)
- Prior art keywords
- epoxy compound
- resin composition
- resin
- phosphorus
- cured product
- Prior art date
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
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- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
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Definitions
- the present disclosure generally relates to resin compositions, prepregs, films with resins, metal foils with resins, metal-clad laminates, and printed wiring boards. More specifically, the present disclosure relates to a resin composition containing an epoxy compound and a curing agent, a prepreg, a film with a resin, a metal foil with a resin, a metal-clad laminate, and a printed wiring board.
- Patent Document 1 Japanese Unexamined Patent Publication No. 2001-283369 discloses an insulating resin composition for a build-up substrate.
- This insulating resin composition for a build-up substrate contains component A and component B as essential components.
- Component A is an epoxy oligoma having two or more epoxy groups.
- Ingredient B is 10- (2.5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenanthrene-10-oxide or dihydro-3-((6-oxide-6H-dibenz (c, e)) ( 1,2) Oxaphosphorin-6-yl) Methyl) -2,5-Frangion is an epoxy curing agent.
- An object of the present disclosure is a resin composition, a prepreg, a film with a resin, a metal foil with a resin, which has a high glass transition temperature (Tg) and can obtain a cured product having excellent dielectric properties, adhesiveness, chemical resistance, and flame resistance. , Metal-clad laminates, and printed wiring boards.
- the resin composition according to one aspect of the present disclosure contains an epoxy compound and a curing agent.
- the epoxy compound contains a phosphorus-containing epoxy compound having a phosphorus atom in the molecule.
- the curing agent contains a phosphorus-containing acid anhydride having a phosphorus atom and an acid anhydride group in the molecule.
- the prepreg according to one aspect of the present disclosure includes a base material and a resin layer formed of a semi-cured product of the resin composition impregnated in the base material.
- the resin-attached film according to one aspect of the present disclosure includes a resin layer formed of a semi-cured product of the resin composition and a support film that supports the resin layer.
- the resin-attached metal foil according to one aspect of the present disclosure includes a resin layer formed of a semi-cured product of the resin composition and a metal foil to which the resin layer is adhered.
- the metal-clad laminate according to one aspect of the present disclosure comprises an insulating layer formed of a cured product of the resin composition or a cured product of the prepreg, and a metal layer formed on one or both sides of the insulating layer. Be prepared.
- the printed wiring board according to one aspect of the present disclosure includes an insulating layer formed of a cured product of the resin composition or a cured product of the prepreg, and conductor wiring formed on one or both sides of the insulating layer. ..
- FIG. 1 is a schematic cross-sectional view of a prepreg according to an embodiment of the present disclosure.
- FIG. 2A is a schematic cross-sectional view of a resin-coated film (without a protective film) according to an embodiment of the present disclosure.
- FIG. 2B is a schematic cross-sectional view of a resin-coated film (with a protective film) according to an embodiment of the present disclosure.
- FIG. 3 is a schematic cross-sectional view of the metal foil with resin according to the embodiment of the present disclosure.
- FIG. 4 is a schematic cross-sectional view of the metal-clad laminate according to the embodiment of the present disclosure.
- FIG. 5 is a schematic cross-sectional view of a printed wiring board according to an embodiment of the present disclosure.
- the resin composition according to this embodiment contains an epoxy compound and a curing agent.
- Epoxy compounds include phosphorus-containing epoxy compounds that have a phosphorus atom in the molecule.
- the curing agent contains a phosphorus-containing acid anhydride having a phosphorus atom and an acid anhydride group in the molecule.
- the resin composition contains both a phosphorus-containing epoxy compound and a phosphorus-containing acid anhydride.
- a cured product having a high glass transition temperature (Tg) and excellent dielectric properties, adhesiveness, chemical resistance, and flame resistance can be obtained. ..
- the cured product can form an insulating layer 50 or the like of the printed wiring board 5 (see FIG. 5).
- one of the features of this embodiment is that the phosphorus-containing epoxy compound and the phosphorus-containing acid anhydride can react with each other.
- a phosphorus-containing epoxy compound and a phosphorus-containing acid anhydride are used in combination, a cured product in which both react with each other (hereinafter referred to as a first cured product) and a cured product in which both do not react (hereinafter referred to as a second cured product).
- a first cured product a cured product in which both react with each other
- a second cured product a cured product in which both do not react
- one of the technical significance of increasing the glass transition temperature (Tg) is as follows. That is, when the glass transition temperature (Tg) is high, the solder heat resistance (reflow heat resistance) is improved. When the solder heat resistance is improved, it is possible to suppress the swelling of the insulating layer 50 and the disconnection of the conductor wiring 51 when the electronic components are soldered to the printed wiring board 5 by a reflow method or the like. In particular, a multilayer printed wiring board having high-density wiring is required to have good solder heat resistance. If the solder heat resistance is high, the reliability of interlayer connection can be ensured even in a multilayer printed wiring board.
- a cured product having excellent dielectric properties is effective when the printed wiring board 5 is used for high-speed communication.
- the items required for the printed wiring board 5 for high-speed communication are, for example, (1) to reduce the signal propagation delay, (2) to reduce the dielectric loss of the signal, and (3) to control the characteristic impedance. , (4) Reducing crosstalk, etc.
- the conductor wiring 51 may be shortened, that is, high-density wiring may be performed, and the relative permittivity of the insulating layer 50 may be lowered. The lower the relative permittivity, the faster the propagation speed.
- the cured product with excellent chemical resistance is resistant to the alkaline aqueous solution used for resist removal. Even if the resist is repeatedly formed and removed, the cured product is resistant to the alkaline aqueous solution.
- the alkaline aqueous solution is not particularly limited, and examples thereof include a sodium hydroxide aqueous solution and a potassium hydroxide aqueous solution. It should be noted that the inner diameter of the hole of the cured product having excellent chemical resistance does not easily expand even if it is desmeared.
- the resin composition according to this embodiment has electrical insulation properties and can be used as a substrate material for printed wiring boards and the like.
- the substrate material include, but are not limited to, a prepreg, a film with a resin, a metal foil with a resin, a metal-clad laminate, and a printed wiring board.
- the resin composition contains an epoxy compound and a curing agent.
- the resin composition further contains an inorganic filler.
- the resin composition may further contain a curing accelerator.
- the resin composition may further contain a flame retardant.
- the flame retardant in this case is not a flame retardant in a broad sense, but a flame retardant in a narrow sense. That is, the flame retardant in the broad sense includes a phosphorus-containing epoxy compound and a phosphorus-containing acid anhydride, but the flame retardant in a narrow sense does not include a phosphorus-containing epoxy compound and a phosphorus-containing acid anhydride.
- the third cured product the cured product of the resin composition containing no flame retardant
- the cured product of the resin composition further containing the flame retardant hereinafter referred to as the fourth cured product
- the resin composition is prepared, for example, as follows. That is, an epoxy compound and a curing agent are blended, an inorganic filler and a curing accelerator are blended as necessary, diluted with an appropriate solvent, and this is stirred and mixed to homogenize.
- the resin composition has thermosetting properties. When the resin composition is heated, it becomes a semi-cured product, and when it is further heated, it becomes a cured product.
- the semi-cured product is a substance in a semi-cured state
- the cured product is a substance in a cured state (insoluble and insoluble state).
- the semi-cured state means a state in an intermediate stage (B stage) of the curing reaction.
- the intermediate stage is a stage between the varnished stage (A stage) and the cured stage (C stage).
- Epoxy compound is a prepolymer and is a compound having at least two or more epoxy groups in the molecule.
- the term "resin” has two meanings: a resin as a material before the cross-linking reaction (for example, an epoxy compound) and a resin as a product (product) after the cross-linking reaction.
- the term "resin” basically means the former.
- the epoxy compound includes a phosphorus-containing epoxy compound.
- Phosphorus-containing epoxy compounds have a phosphorus atom in the molecule.
- the phosphorus-containing epoxy compound is reactive with the phosphorus-containing acid anhydride described below.
- the phosphorus-containing epoxy compound has the structure of the following formula (1).
- the phosphorus-containing epoxy compound When the phosphorus-containing epoxy compound has the structure of the above formula (1), a cured product having a high glass transition temperature (Tg) and excellent dielectric properties, adhesiveness, chemical resistance, and flame resistance can be easily obtained.
- the phosphorus-containing epoxy compound may have a plurality of structures of the above formula (1) in the molecule.
- the phosphorus-containing epoxy compound is not particularly limited as long as it has a phosphorus atom in the molecule, but is preferably a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a bisphenol S type epoxy compound, a phenyl type epoxy compound, or a xylylene type.
- the molecule contains one or more structures derived from the above-mentioned substances.
- the epoxy compound further contains a polyfunctional epoxy compound.
- the polyfunctional epoxy compound does not contain a phosphorus atom in the molecule and has at least two or more epoxy groups. If the epoxy compound further contains the polyfunctional epoxy compound, the cured product can be imparted with the properties peculiar to the polyfunctional epoxy compound.
- the polyfunctional epoxy compound is not particularly limited, and for example, a bisphenol type epoxy compound, a novolak type epoxy compound, a biphenyl type epoxy compound, a xylylene type epoxy compound, an arylalkylene type epoxy compound, a triphenylmethane type epoxy compound, and an anthracene type epoxy compound. Examples thereof include compounds, norbornene type epoxy compounds, and fluorene type epoxy compounds.
- the epoxy compound contained in the resin composition may be only one type or two or more types.
- bisphenol type epoxy compound examples include, but are not limited to, a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, and a bisphenol S type epoxy compound.
- novolac type epoxy compound examples include, but are not limited to, a phenol novolac type epoxy compound and a cresol novolac type epoxy compound.
- arylalkylene type epoxy compound examples include phenol aralkyl type epoxy compound, biphenyl aralkyl type epoxy compound, biphenyl novolac type epoxy compound, biphenyl dimethylene type epoxy compound, trisphenol methane novolac type epoxy compound, and tetramethyl biphenyl type epoxy compound. Etc., but are not particularly limited to these.
- the polyfunctional epoxy compound contains a polyfunctional epoxy compound having at least one of a naphthalene skeleton and a dicyclopentadiene skeleton in the molecule.
- a polyfunctional epoxy compound having a naphthalene skeleton in the molecule may be referred to as a "naphthalene type epoxy compound”
- a polyfunctional epoxy compound having a dicyclopentadiene skeleton in the molecule may be referred to as a "dicyclopentadiene type epoxy compound”. is there.
- the naphthalene skeleton has rigidity and hydrophobicity. Therefore, if the polyfunctional epoxy compound contains a naphthalene-type epoxy compound, the cured product can be imparted with heat resistance, low hygroscopicity, and low coefficient of linear expansion.
- naphthalene type epoxy compound examples include naphthalene skeleton-modified cresol novolac type epoxy compound, naphthalenediol aralkyl type epoxy compound, naphthol aralkyl type epoxy compound, methoxynaphthalene modified cresol novolac type epoxy compound, and methoxynaphthalenedimethylene type epoxy compound.
- the present invention is not particularly limited to these.
- the dicyclopentadiene skeleton is a bulky cyclic aliphatic hydrocarbon. Therefore, if the polyfunctional epoxy compound contains a dicyclopentadiene type epoxy compound, good dielectric properties, low hygroscopicity, and heat resistance can be imparted to the cured product.
- the hardener contains a phosphorus-containing acid anhydride.
- Phosphorus-containing acid anhydrides have a phosphorus atom and an acid anhydride group in the molecule.
- the phosphorus-containing acid anhydride has reactivity with the above-mentioned phosphorus-containing epoxy compound.
- the phosphorus-containing acid anhydride is not particularly limited, but it is preferable that the molecule contains, for example, a structure represented by the following formula (A) and / or the following formula (B) and an acid anhydride group.
- the acid anhydride group preferably contains a cyclic acid anhydride group.
- the phosphorus-containing acid anhydride preferably contains the above formula (A) in its molecule.
- a phosphorus-containing acid anhydride containing the above formula (A) in the molecule for example, dihydro-3-((6-oxide-6H-dibenz (c, e) (1, 2)) represented by the following formula (2). ) Oxaphosphorin-6-yl) Methyl) -2,5-Frangion.
- a phosphorus-containing acid anhydride represented by the following formula (2) has a high glass transition temperature (Tg), and a cured product having excellent dielectric properties, adhesiveness, chemical resistance, and flame resistance can be easily obtained.
- the curing agent further contains a phosphorus-free curing agent.
- Phosphorus-free curing agents do not contain phosphorus atoms in their molecules. If the curing agent further contains a phosphorus-free curing agent, the cured product can be imparted with properties peculiar to the phosphorus-free curing agent.
- the phosphorus-free curing agent contains one or more compounds selected from the group consisting of polyfunctional acid anhydrides, alicyclic polyfunctional acid anhydrides, and styrene maleic anhydride copolymers.
- polyfunctional acid anhydride alicyclic polyfunctional acid anhydrides
- styrene maleic anhydride copolymers styrene maleic anhydride copolymers
- a polyfunctional acid anhydride is a compound having at least two or more acid anhydride groups in the molecule.
- the polyfunctional acid anhydride is not particularly limited, and is, for example, ethylene glycol bisamhydrotrimeritate (TMEG), pyromellitic anhydride (PMDA), 3,3', 4,4'-biphenyltetracarboxylic dianhydride.
- TMEG ethylene glycol bisamhydrotrimeritate
- PMDA pyromellitic anhydride
- BPDA 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propanoic dianhydride
- BPADA 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propanoic dianhydride
- the crosslink density of the cured product tends to be higher than that of a monofunctional acid anhydride (a compound having one acid anhydride group in the molecule). Therefore, the polyfunctional acid anhydride can improve the glass transition temperature (Tg) of the cured product.
- Tg glass transition temperature
- the alicyclic polyfunctional acid anhydride is a polyfunctional acid anhydride and is a compound having at least one saturated or unsaturated carbon ring having no aromaticity.
- the alicyclic polyfunctional acid anhydride is not particularly limited, but for example, 5- (2,5-dioxotetrahydro-3-furanyl) -3-methyl-3-cyclohexene-1,2-dicarboxylic acid anhydride. (MCTC) and hydrogenated cyclohexane-1,2,4,5-tetracarboxylic dianhydride (H-PMDA).
- the alicyclic polyfunctional acid anhydride can reduce the dielectric constant of the cured product.
- hydrogenated alicyclic polyfunctional acid anhydrides are effective. Hydrogenation is synonymous with hydrogenation or hydrogenation reaction.
- the styrene maleic anhydride copolymer is a binary copolymer (copolymer) produced by copolymerization of a styrene monomer and maleic anhydride, and is an acid anhydride having two or more acid anhydride groups.
- the styrene maleic anhydride copolymer can improve the chemical resistance (particularly alkali resistance) of the cured product.
- Styrene maleic anhydride copolymers are classified into alternating copolymers, random copolymers, block copolymers, and graft copolymers according to the difference in the arrangement of the styrene monomer and maleic anhydride. Any of these copolymers may be used.
- the acid value of the styrene maleic anhydride copolymer is preferably in the range of 275 or more and 550 or less.
- the acid value is represented by the number of mg of potassium hydroxide required to neutralize the free fatty acids present in 1 g of the styrene maleic anhydride copolymer.
- the adhesiveness of the cured product can be improved.
- the peel strength of the metal-clad laminate 4 and the printed wiring board 5 can be improved.
- the molar ratio of the styrene monomer to maleic anhydride is not particularly limited.
- the molar ratio is 1: 1 to 3: 1.
- the weight average molecular weight of the styrene maleic anhydride copolymer is not particularly limited.
- the weight average molecular weight is in the range of 4500 or more and 9000 or less.
- the phosphorus content with respect to the total mass of the epoxy compound and the curing agent is in the range of 1.3% by mass or more and 3.7% by mass or less.
- the flame resistance of the cured product can be improved.
- the phosphorus content of the cured product is 3.7% by mass or less, it is possible to suppress a decrease in chemical resistance (particularly alkali resistance) of the cured product.
- the resin composition further contains a flame retardant, the phosphorus content is based on the total mass of the epoxy compound, the curing agent and the flame retardant.
- the content of the phosphorus-containing acid anhydride is preferably in the range of 5 parts by mass or more and 70 parts by mass or less, more preferably 7 parts by mass, based on 100 parts by mass of the total of the phosphorus-containing epoxy compound and the phosphorus-containing acid anhydride. It is in the range of 6 parts by mass or more, and more preferably 25 parts by mass or more and 55 parts by mass or less.
- the content of the phosphorus-containing acid anhydride is 5 parts by mass or more, the flame resistance of the cured product and the decrease in the glass transition temperature (Tg) can be suppressed.
- Tg glass transition temperature
- the content of the phosphorus-containing acid anhydride is 70 parts by mass or less, it is possible to suppress a decrease in the flame resistance of the cured product.
- the equivalent ratio of the epoxy compound and the curing agent is in the range of 1: 0.75 to 1: 1.25.
- (equivalent of curing agent) / (equivalent of epoxy compound) is in the range of 0.75 or more and 1.25 or less.
- the equivalent of the epoxy compound (eq) is obtained by dividing the mass (g) of the epoxy compound contained in the resin composition by the epoxy equivalent (g / eq) of the epoxy compound.
- the epoxy equivalent is the mass of the epoxy compound containing 1 equivalent of the epoxy group.
- the equivalent of the epoxy compounds in the resin composition is the sum of the equivalents of each epoxy compound.
- the equivalent (eq) of the curing agent (acid anhydride) is obtained by dividing the mass (g) of the curing agent contained in the resin composition by the acid anhydride equivalent (g / eq) of the curing agent.
- the acid anhydride equivalent is the mass of the curing agent containing 1 equivalent of the acid anhydride group.
- the equivalent of the curing agent of the resin composition is the sum of the equivalents of each curing agent.
- the inorganic filler is not particularly limited, and is, for example, silica, calcium carbonate, titanium oxide, kaolin, clay, barium sulfate, zinc oxide, aluminum hydroxide, magnesium hydroxide, talc, mica. , Wollastonite, potassium titanate, boroaluminum, sepiolite, boron nitride, and silicon nitride.
- the shape of the inorganic filler is preferably spherical.
- the content of the inorganic filler is preferably in the range of 20 parts by mass or more and 150 parts by mass or less with respect to 100 parts by mass of the total of the epoxy compound and the curing agent.
- the content of the inorganic filler is 20 parts by mass or more, the flame resistance of the cured product can be improved. Further, the coefficient of linear expansion of the cured product can be reduced, the curing shrinkage can be suppressed, and the thermal conductivity can be improved. As a result, the reflow heat resistance can also be improved. Further, in the printed wiring board 5 having two or more layers of conductor wiring 51, the reliability of interlayer connection can be ensured.
- the cured product can have a low dielectric constant. Further, the peel strength of the metal-clad laminate 4 and the printed wiring board 5 can be improved. Further, it is possible to maintain the fluidity suitable for molding while suppressing the decrease in the fluidity of the resin composition at the time of melting.
- the curing accelerator is not particularly limited, and examples thereof include an imidazole compound and dicyandiamide.
- the imidazole compound is not particularly limited, and is, for example, 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, and 2-phenyl-4-. Methylimidazole can be mentioned.
- FIG. 1 shows a prepreg 1 according to the present embodiment.
- the prepreg 1 is in the form of a sheet or a film as a whole.
- the prepreg 1 is used for the material of the metal-clad laminate 4, the material of the printed wiring board 5, and the multi-layered (build-up method) of the printed wiring board 5.
- the prepreg 1 includes a base material 11 and a resin layer 10.
- the resin layer 10 is formed of a semi-cured product of the resin composition impregnated in the base material 11.
- One prepreg 1 includes at least one base material 11.
- the thickness of the base material 11 is not particularly limited, but is, for example, in the range of 8 ⁇ m or more and 100 ⁇ m or less.
- Specific examples of the base material 11 include woven fabrics and non-woven fabrics.
- Specific examples of the woven fabric include, but are not limited to, glass cloth.
- Specific examples of the non-woven fabric include, but are not limited to, glass non-woven fabric.
- the glass cloth and the glass non-woven fabric are made of glass fibers, but may be made of reinforcing fibers other than glass fibers.
- the type of glass constituting the glass fiber is not particularly limited, and examples thereof include E glass, T glass, S glass, Q glass, UT glass, NE glass, and L glass.
- the reinforcing fibers include, but are not limited to, aromatic polyamide fibers, liquid crystal polyester fibers, poly (paraphenylene benzobisoxazole) (PBO) fibers, and polyphenylene sulfide (PPS) resin fibers.
- aromatic polyamide fibers liquid crystal polyester fibers
- PBO poly (paraphenylene benzobisoxazole)
- PPS polyphenylene sulfide
- prepreg 1 When prepreg 1 is heated, it melts once and then completely cures to a cured state. The cured product of prepreg 1 can form an insulating layer on the substrate.
- the thickness of the prepreg 1 is not particularly limited, but is preferably 120 ⁇ m or less, more preferably 100 ⁇ m or less, still more preferably 60 ⁇ m or less, still more preferably 40 ⁇ m or less. As a result, the thickness of the insulating layer can be reduced, and the thickness of the substrate can be reduced.
- the thickness of the prepreg 1 is preferably 10 ⁇ m or more.
- the resin layer 10 of the prepreg 1 is formed of the resin composition according to the present embodiment, it has a high glass transition temperature (Tg) and is a cured product having excellent dielectric properties, adhesiveness, chemical resistance, and flame resistance. Is obtained.
- Tg glass transition temperature
- FIG. 2A shows the resin-attached film 2 according to the present embodiment.
- the resin-attached film 2 is in the form of a film or a sheet as a whole.
- the resin-attached film 2 includes a resin layer 20 and a support film 21.
- the resin-attached film 2 is used for multi-layering (build-up method) of the printed wiring board 5.
- the resin layer 20 is formed of a semi-cured product of the resin composition.
- the semi-cured product can become a cured product by being heated. In this way, the resin layer 20 can form an insulating layer.
- the thickness of the resin layer 20 is not particularly limited, but is preferably 120 ⁇ m or less, more preferably 100 ⁇ m or less, still more preferably 60 ⁇ m or less, and even more preferably 40 ⁇ m or less. As a result, the thickness of the insulating layer can be reduced, and the thickness of the substrate can be reduced.
- the thickness of the resin layer 20 is preferably 10 ⁇ m or more.
- the support film 21 supports the resin layer 20. By supporting in this way, the resin layer 20 becomes easy to handle.
- the support film 21 is, for example, an electrically insulating film, but is not particularly limited thereto.
- Specific examples of the support film 21 include polyethylene terephthalate (PET) film, polyimide film, polyester film, polyparavanic acid film, polyether ether ketone film, polyphenylene sulfide film, aramid film, polycarbonate film, polyarylate film and the like.
- PET polyethylene terephthalate
- polyimide film polyimide film
- polyester film polyparavanic acid film
- polyether ether ketone film polyphenylene sulfide film
- aramid film polycarbonate film
- polyarylate film and the like polycarbonate film
- a mold release agent layer (not shown) may be provided on the surface of the support film 21 that supports the resin layer 20.
- the release agent layer allows the support film 21 to be peeled off from the resin layer 20 if necessary.
- the support film 21 is peeled from the insulating layer.
- one surface of the resin layer 20 is covered with the support film 21, but as shown in FIG. 2B, the other surface of the resin layer 20 may be covered with the protective film 22.
- the resin layer 20 becomes easier to handle. Further, it is possible to prevent foreign matter from adhering to the resin layer 20.
- the protective film 22 is, for example, an electrically insulating film, but is not particularly limited thereto.
- Specific examples of the protective film 22 include polyethylene terephthalate (PET) film, polyolefin film, polyester film, polymethylpentene film and the like.
- PET polyethylene terephthalate
- the protective film 22 is not limited to these films.
- a mold release agent layer (not shown) may be provided on the surface of the protective film 22 that is overlapped with the resin layer 20.
- the release agent layer allows the protective film 22 to be peeled off from the resin layer 20 if necessary.
- the resin layer 20 of the resin-attached film 2 is formed of the resin composition according to the present embodiment, it has a high glass transition temperature (Tg) and is excellent in dielectric properties, adhesiveness, chemical resistance, and flame resistance. A cured product is obtained.
- Tg glass transition temperature
- FIG. 3 shows the metal foil 3 with resin according to the present embodiment.
- the metal foil 3 with resin is in the form of a film or a sheet as a whole.
- the resin-attached metal foil 3 includes a resin layer 30 and a metal foil 31.
- the metal foil 3 with resin is used for multi-layering (build-up method) of the printed wiring board 5.
- the resin layer 30 is formed of a semi-cured product of the resin composition.
- the semi-cured product can become a cured product by being heated. In this way, the resin layer 30 can form an insulating layer.
- the thickness of the resin layer 30 is not particularly limited, but is preferably 120 ⁇ m or less, more preferably 100 ⁇ m or less, still more preferably 60 ⁇ m or less, and even more preferably 40 ⁇ m or less. As a result, the thickness of the insulating layer formed by curing the resin layer 30 can be reduced, and the thickness of the substrate can be reduced.
- the thickness of the resin layer 30 is preferably 10 ⁇ m or more.
- the resin layer 30 is adhered to the metal foil 31.
- the metal foil 31 include, but are not limited to, copper foil.
- the metal foil 31 can form a conductor wiring by removing unnecessary portions by etching in a subtractive method or the like.
- the thickness of the metal foil 31 is not particularly limited, but is preferably 35 ⁇ m or less, more preferably 18 ⁇ m or less.
- the thickness of the metal foil 31 is preferably 5 ⁇ m or more.
- the metal foil 31 may be composed of a so-called ultra-thin metal foil with a carrier (not shown), an ultra-thin metal foil (for example, an ultra-thin copper foil).
- the ultra-thin metal foil with a carrier has a three-layer structure. That is, the ultra-thin metal foil with a carrier includes a carrier, a release layer provided on the surface of the carrier, and an ultra-thin metal foil provided on the surface of the release layer. Ultra-thin metal foils are so thin that they are difficult to handle on their own, and of course thinner than carriers.
- the carrier is a metal foil (for example, copper foil) that has a role of protecting and supporting the ultrathin metal foil.
- the ultra-thin metal foil with a carrier has a certain thickness and is easy to handle.
- the thickness of the ultrathin metal foil and the carrier is not particularly limited.
- the thickness of the ultrathin metal foil is in the range of 1 ⁇ m or more and 10 ⁇ m or less, and the thickness of the carrier is in the range of 18 ⁇ m or more and 35 ⁇ m or less.
- the ultrathin metal foil can be peeled off from the peeling layer if necessary.
- the metal foil 3 with a resin can be manufactured as follows. That is, the resin composition is applied to the surface of the ultrathin metal foil with a carrier and heated to form the resin layer 30. Then, the carrier is peeled off from the ultrathin metal foil. The ultrathin metal foil is adhered to the surface of the resin layer 30 as the metal foil 31. It is preferable that the release layer is peeled off together with the carrier and does not remain on the surface of the ultrathin metal foil, but even if it remains, it can be easily removed. The ultra-thin metal foil adhered to the surface of the resin layer 30 can be used as a seed layer in the modified semi-additive method (MSAP: Modified Semi Additive Process), and the seed layer is electroplated to provide conductor wiring. Can be formed.
- MSAP Modified Semi Additive Process
- the resin layer 30 of the resin-attached metal foil 3 is formed of the resin composition according to the present embodiment, it has a high glass transition temperature (Tg) and is excellent in dielectric properties, adhesiveness, chemical resistance, and flame resistance. A cured product is obtained.
- Tg glass transition temperature
- FIG. 4 shows the metal-clad laminate 4 according to the present embodiment.
- the metal-clad laminate 4 includes an insulating layer 40 and a metal layer 41.
- the metal-clad laminate 4 is used as a material for the printed wiring board 5.
- the insulating layer 40 is formed of a cured product of the resin composition or a cured product of prepreg 1.
- the insulating layer 40 has one base material 42, but may have two or more base materials 42.
- the thickness of the insulating layer 40 is not particularly limited. If the thickness of the insulating layer 40 is thin, it is effective in reducing the thickness of the substrate.
- the thickness of the insulating layer 40 is preferably 120 ⁇ m or less, more preferably 100 ⁇ m or less, still more preferably 60 ⁇ m or less, still more preferably 40 ⁇ m or less.
- the thickness of the insulating layer 40 is preferably 10 ⁇ m or more, and more preferably 15 ⁇ m or more.
- the metal layer 41 is formed on one side or both sides of the insulating layer 40.
- the metal layer 41 is not particularly limited, and examples thereof include a metal foil.
- the metal foil is not particularly limited, and examples thereof include a copper foil.
- the metal layer 41 is formed on both sides of the insulating layer 40, but the metal layer 41 may be formed on only one side of the insulating layer 40.
- the metal-clad laminate 4 in which the metal layers 41 are formed on both sides of the insulating layer 40 is a double-sided metal-clad laminate.
- the metal-clad laminate 4 in which the metal layer 41 is formed only on one side of the insulating layer 40 is a single-sided metal-clad laminate.
- the thickness of the metal layer 41 is not particularly limited, but is preferably 35 ⁇ m or less, more preferably 18 ⁇ m or less.
- the thickness of the metal layer 41 is preferably 5 ⁇ m or more.
- the metal layer 41 may be composed of the ultra-thin metal foil of the above-mentioned ultra-thin metal foil with a carrier.
- the metal-clad laminate 4 can be manufactured as follows. That is, an ultrathin metal foil with a carrier may be laminated on one side or both sides of one prepreg 1, or a plurality of prepregs 1 may be laminated and an ultrathin metal foil with a carrier may be laminated on one side or both sides. And may be molded. In this case, an ultra-thin metal foil with a carrier is superposed on the surface of the prepreg 1. After laminating molding, the carrier is peeled off from the ultrathin metal foil.
- the ultrathin metal foil is adhered as a metal layer 41 to the surface of the insulating layer 40 which is a cured product of the prepreg 1. It is preferable that the release layer is peeled off together with the carrier and does not remain on the surface of the ultrathin metal foil, but even if it remains, it can be easily removed.
- the ultra-thin metal foil adhered to the surface of the insulating layer 40 can be used as a seed layer in the modified semi-additive method (MSAP: Modified Semi Additive Process). A predetermined portion of the seed layer is covered with a plating resist, and the other portion is electroplated. After that, the conductor wiring can be formed by peeling off the plating resist and removing the exposed seed layer by etching or the like.
- the insulating layer 40 of the metal-clad laminate 4 is formed of the resin composition according to the present embodiment, it has a high glass transition temperature (Tg) and is excellent in dielectric properties, adhesiveness, chemical resistance, and flame resistance. ing.
- the glass transition temperature (Tg) is preferably 170 ° C. or higher.
- the relative permittivity is preferably 3.60 or less.
- FIG. 5 shows the printed wiring board 5 according to the present embodiment.
- the printed wiring board 5 includes an insulating layer 50 and a conductor wiring 51.
- the "printed wiring board” means a circuit board in which electronic components are not soldered and only wiring is performed.
- the insulating layer 50 is formed of a cured product of the resin composition or a cured product of prepreg 1.
- the insulating layer 50 is the same as the insulating layer 40 of the metal-clad laminate 4 described above.
- the conductor wiring 51 is formed on one side or both sides of the insulating layer 50.
- the conductor wiring 51 is formed on both sides of the insulating layer 50, but the conductor wiring 51 may be formed on only one side of the insulating layer 50.
- the method for forming the conductor wiring 51 is not particularly limited, and examples thereof include a subtractive method, a semi-additive method (SAP: Semi-Additive Process), and a modified semi-additive method (MSAP: Modified Semi-Additive Process). Since the adhesiveness of the insulating layer 50 is improved, the conductor wiring 51 is difficult to peel off from the insulating layer 50 even if the width of the conductor wiring 51 is narrow. That is, the printed wiring board 5 according to the present embodiment can realize high-density wiring.
- the insulating layer 50 of the printed wiring board 5 is formed of the resin composition according to the present embodiment, it has a high glass transition temperature (Tg) and is excellent in dielectric properties, adhesiveness, chemical resistance, and flame resistance. There is. Therefore, the printed wiring board 5 according to the present embodiment is considered to be particularly effective for high-speed communication.
- Tg glass transition temperature
- the resin composition according to the first aspect contains an epoxy compound and a curing agent.
- the epoxy compound contains a phosphorus-containing epoxy compound having a phosphorus atom in the molecule.
- the curing agent contains a phosphorus-containing acid anhydride having a phosphorus atom and an acid anhydride group in the molecule.
- a cured product having a high glass transition temperature (Tg) and excellent dielectric properties, adhesiveness, chemical resistance, and flame resistance can be obtained.
- the epoxy compound in the first aspect, further contains a polyfunctional epoxy compound which does not contain a phosphorus atom in the molecule and has at least two or more epoxy groups.
- the cured product can be imparted with properties peculiar to the polyfunctional epoxy compound.
- the curing agent in the first or second aspect, further contains a phosphorus-free curing agent containing no phosphorus atom in the molecule.
- the cured product can be imparted with properties peculiar to the phosphorus-free curing agent.
- the phosphorus content with respect to the total mass of the epoxy compound and the curing agent is 1.3% by mass or more and 3.7% by mass or less. It is within the range.
- the flame resistance of the cured product can be improved.
- the phosphorus content of the cured product is 3.7% by mass or less, it is possible to suppress a decrease in chemical resistance (particularly alkali resistance) of the cured product.
- the content of the phosphorus-containing acid anhydride is 100 parts by mass in total of the phosphorus-containing epoxy compound and the phosphorus-containing acid anhydride. On the other hand, it is in the range of 5 parts by mass or more and 70 parts by mass or less.
- the content of the phosphorus-containing acid anhydride is 5 parts by mass or more, the flame resistance of the cured product and the decrease in the glass transition temperature (Tg) can be suppressed.
- the content of the phosphorus-containing acid anhydride is 70 parts by mass or less, it is possible to suppress a decrease in the flame resistance of the cured product.
- the polyfunctional epoxy compound has a polyfunctional epoxy having at least one of a naphthalene skeleton and a dicyclopentadiene skeleton in the molecule. Contains compounds.
- the cured product can be imparted with heat resistance, low hygroscopicity, and low coefficient of linear expansion. If the polyfunctional epoxy compound contains a dicyclopentadiene type epoxy compound, good dielectric properties, low hygroscopicity, and heat resistance can be imparted to the cured product.
- the phosphorus-free curing agent is a polyfunctional acid anhydride, an alicyclic polyfunctional acid anhydride, and styrene maleic anhydride. Contains one or more compounds selected from the group consisting of copolymers.
- the cured product can be imparted with properties peculiar to each of the polyfunctional acid anhydride, the alicyclic polyfunctional acid anhydride, and the styrene maleic anhydride copolymer.
- the phosphorus-containing epoxy compound has the structure of the following formula (1).
- a cured product having a high glass transition temperature (Tg) and excellent dielectric properties, adhesiveness, chemical resistance, and flame resistance can be easily obtained.
- the equivalent ratio of the epoxy compound to the curing agent is in the range of 1: 0.75 to 1: 1.25. ..
- the equivalent ratio of the epoxy compound and the curing agent is within the above range, the flame resistance of the cured product and the decrease in the glass transition temperature (Tg) can be suppressed.
- the resin composition according to the tenth aspect further contains an inorganic filler in any one of the first to ninth aspects.
- the content of the inorganic filler is in the range of 20 parts by mass or more and 150 parts by mass or less with respect to 100 parts by mass in total of the epoxy compound and the curing agent.
- the content of the inorganic filler when the content of the inorganic filler is 20 parts by mass or more, the linear expansion coefficient of the cured product can be reduced, the curing shrinkage can be suppressed, and the thermal conductivity can be improved. ..
- the content of the inorganic filler is 150 parts by mass or less, it is possible to suppress a decrease in fluidity of the resin composition at the time of melting.
- the prepreg (1) according to the eleventh aspect is formed of a base material (11) and a semi-cured product of the resin composition according to any one of the first to tenth aspects impregnated in the base material (11).
- the resin layer (10) is provided.
- a cured product having a high glass transition temperature (Tg) and excellent dielectric properties, adhesiveness, chemical resistance, and flame resistance can be obtained.
- the resin-attached film (2) according to the twelfth aspect comprises a resin layer (20) formed of a semi-cured product of the resin composition according to any one of the first to tenth aspects and the resin layer (20).
- a support film (21) for supporting is provided.
- a cured product having a high glass transition temperature (Tg) and excellent dielectric properties, adhesiveness, chemical resistance, and flame resistance can be obtained.
- the resin-attached metal foil (3) according to the thirteenth aspect includes a resin layer (30) formed of a semi-cured product of the resin composition according to any one of the first to tenth aspects and the resin layer (30).
- a metal foil (31) to which is bonded is provided.
- a cured product having a high glass transition temperature (Tg) and excellent dielectric properties, adhesiveness, chemical resistance, and flame resistance can be obtained.
- the metal-clad laminate (4) according to the fourteenth aspect was formed of a cured product of the resin composition according to any one of the first to tenth aspects or a cured product of the prepreg (1) according to the eleventh aspect. It includes an insulating layer (40) and a metal layer (41) formed on one or both sides of the insulating layer (40).
- the insulating layer (40) has a high glass transition temperature (Tg) and is excellent in dielectric properties, adhesiveness, chemical resistance, and flame resistance.
- the printed wiring board (5) according to the fifteenth aspect is an insulation formed of a cured product of the resin composition according to any one of the first to tenth aspects or a cured product of the prepreg (1) according to the eleventh aspect.
- a layer (50) and a conductor wiring (51) formed on one side or both sides of the insulating layer (50) are provided.
- the insulating layer (50) has a high glass transition temperature (Tg) and is excellent in dielectric properties, adhesiveness, chemical resistance, and flame resistance.
- Resin Composition The following materials were prepared as raw materials for the resin composition.
- the epoxy compound, the curing agent, the inorganic filler, the curing accelerator and the flame retardant are blended in the blending amounts shown in Table 2, diluted with a solvent (methyl ethyl ketone), and stirred and mixed to homogenize the varnish.
- a state resin composition was prepared.
- Table 3 shows the equivalents of the epoxy compound and the curing agent, the equivalent ratio of the two, and the phosphorus content of the epoxy compound, the curing agent, the flame retardant and the resin composition.
- the prepreg is obtained by impregnating a glass cloth (manufactured by Nitto Boseki Co., Ltd., trade name "7628 type cloth") as a base material with the above resin composition, and using a non-contact type heating unit to impregnate the prepreg. It was produced by heating and drying at ⁇ 140 ° C. to remove the solvent in the resin composition and semi-curing the resin composition.
- the resin content (content of the resin composition) of the prepreg was in the range of 65% by mass or more and 75% by mass or less with respect to the total mass of the prepreg.
- the metal-clad laminate is made by stacking eight prepregs (340 mm x 510 mm) and copper foil (manufactured by Mitsui Mining & Smelting Co., Ltd., thickness 18 ⁇ m, with roughened surfaces inside) on both sides. ST foil) was laminated, and this was heated and pressed for lamination and molding to produce a copper-clad laminate.
- the conditions for heating and pressurizing are 180 ° C., 2.94 MPa, and 60 minutes.
- Tg Glass transition temperature
- DMS6100 viscoelastic spectrometer
- peeling strength of the copper foil (thickness 18 ⁇ m) on the surface of the copper-clad laminate was measured in accordance with JIS C 6481. That is, the copper foil was peeled off at a speed of about 50 mm per minute, and the peeling strength (kN / m) at that time was measured as the peel strength.
- 1.6mm OK 1.6mm, 1.2mm, and 0.8mm are all OK
- 1.2mm OK 1.6mm is NG
- 1.2mm and 0.8mm are OK
- 0.8mm NG 1.6mm, 1.2mm, and 0.8mm are all NG
Abstract
Description
本発明者は、誘電特性に優れた硬化物が得られる樹脂組成物を開発するにあたって、低誘電率樹脂の耐燃性が低い点に着目した。従来の手法で耐燃性を向上させようとすると、ガラス転移温度(Tg)が低下したり、接着性などが低下したりするおそれがあるが、本発明者は、鋭意研究の結果、以下のような樹脂組成物を開発した。
(2.1)樹脂組成物
本実施形態に係る樹脂組成物は、電気絶縁性を有し、プリント配線板などの基板材料として使用可能である。基板材料の具体例として、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板が挙げられるが、特にこれらに限定されない。
エポキシ化合物は、プレポリマーであり、分子内に少なくとも2つ以上のエポキシ基を有する化合物である。ところで、一般に「樹脂」という用語には、架橋反応前の材料としての樹脂(例えばエポキシ化合物など)と、架橋反応後の生成物(製品)としての樹脂との2つの意味がある。本明細書において「樹脂」とは、基本的には前者を意味する。
硬化剤は、リン含有酸無水物を含む。リン含有酸無水物は、分子中にリン原子及び酸無水物基を有する。リン含有酸無水物は、上述のリン含有エポキシ化合物に対して反応性を有する。
無機フィラーとしては、特に限定されないが、例えば、シリカ、炭酸カルシウム、酸化チタン、カオリン、クレー、硫酸バリウム、酸化亜鉛、水酸化アルミニウム、水酸化マグネシウム、タルク、マイカ、ウォラストナイト、チタン酸カリウム、ホウアルミニウム、セピオライト、窒化ホウ素、及び窒化ケイ素が挙げられる。無機フィラーの形状は、球形が好ましい。
硬化促進剤としては、特に限定されないが、例えば、イミダゾール化合物及びジシアンジアミドが挙げられる。イミダゾール化合物としては、特に限定されないが、例えば、2-エチル-4-メチルイミダゾール、2-メチルイミダゾール、2-ウンデシルイミダゾール、2-ヘプタデシルイミダゾール、2-フェニルイミダゾール、及び2-フェニル-4-メチルイミダゾールが挙げられる。
図1に本実施形態に係るプリプレグ1を示す。プリプレグ1は、全体としてシート状又はフィルム状である。プリプレグ1は、金属張積層板4の材料、プリント配線板5の材料、及びプリント配線板5の多層化(ビルドアップ法)などに利用される。
図2Aに本実施形態に係る樹脂付きフィルム2を示す。樹脂付きフィルム2は、全体としてフィルム状又はシート状である。樹脂付きフィルム2は、樹脂層20と、支持フィルム21と、を備える。樹脂付きフィルム2は、プリント配線板5の多層化(ビルドアップ法)などに利用される。
図3に本実施形態に係る樹脂付き金属箔3を示す。樹脂付き金属箔3は、全体としてフィルム状又はシート状である。樹脂付き金属箔3は、樹脂層30と、金属箔31と、を備える。樹脂付き金属箔3は、プリント配線板5の多層化(ビルドアップ法)などに利用される。
図4に本実施形態に係る金属張積層板4を示す。金属張積層板4は、絶縁層40と、金属層41と、を備える。金属張積層板4は、プリント配線板5の材料などに利用される。
図5に本実施形態に係るプリント配線板5を示す。プリント配線板5は、絶縁層50と、導体配線51と、を備える。本明細書において「プリント配線板」とは、電子部品がはんだ付けされておらず、配線だけの状態のものを意味する。
上記実施形態から明らかなように、本開示は、下記の態様を含む。以下では、実施形態との対応関係を明示するためだけに、符号を括弧付きで付している。
樹脂組成物の原料として、以下のものを用意した。
・リン含有エポキシ化合物(新日鉄住金化学株式会社製、商品名「FX-289-P」、エポキシ当量:390g/eq、リン含有量:3.5質量%)
・ジシクロペンタジエン型エポキシ化合物(DIC株式会社製、商品名「HP-7200HHH」、エポキシ当量:280~290g/eq、軟化点:100~105℃)
・ナフタレン型エポキシ化合物(DIC株式会社製、商品名「HP-9500」、エポキシ当量:230g/eq)
(1.2)硬化剤
・リン含有酸無水物(ジヒドロ-3-((6-オキシド-6H-ジベンズ(c,e)(1,2)オキサフォスフォリン-6-イル)メチル)-2,5-フランジオン、酸無水物当量:332g/eq、式(2)参照)
・多官能酸無水物(新日本理化株式会社製、商品名「リカシッド TMEG-S」、エチレングリコールビスアンヒドロトリメリテート、酸無水物当量:204g/eq、軟化点:64~76℃)
・脂環式多官能酸無水物(DIC株式会社製、商品名「B-4500」、5-(2,5-ジオキソテトラヒドロ-3-フラニル)-3-メチル-3-シクロヘキセン-1,2-ジカルボン酸無水物(MCTC)、粉末状酸無水物、酸無水物当量:132g/eq)
・スチレン無水マレイン酸共重合体(CRAY VALLEY社製、商品名「SMA EF30」、スチレン:無水マレイン酸(モル比)=3:1、酸価:275~285KOHmg/g、酸無水物当量:280g/eq、重量平均分子量:9500)
(1.3)無機フィラー
・シリカ(浙江華飛電子基材有限公司製、商品名「VF-40-YE3」、球状、粒径:1.51μm(D50)/トップカット10μm)
(1.4)硬化促進剤
・イミダゾール化合物(四国化成工業株式会社製、商品名「2E4MZ」、2-エチル-4-メチルイミダゾール)
(1.5)難燃剤
・分散型難燃剤(クラリアントジャパン株式会社製、商品名「OP-935」、ホスフィン酸アルミニウム、リン含有量:23質量%)
・反応型難燃剤(ケムチュラ・ジャパン株式会社製、商品名「Emerald 2000」、リン含有量:9.8質量%)
以上の樹脂組成物の原料を表1にまとめて示す。
プリプレグは、上記の樹脂組成物を、基材であるガラスクロス(日東紡績株式会社製、商品名「7628タイプクロス」)に含浸させ、これを非接触タイプの加熱ユニットにより、110~140℃で加熱乾燥し、樹脂組成物中の溶媒を除去して、樹脂組成物を半硬化させることによって製造した。プリプレグのレジンコンテント(樹脂組成物の含有量)は、プリプレグの全質量に対して65質量%以上75質量%以下の範囲内であった。
金属張積層板は、8枚のプリプレグ(340mm×510mm)を重ねるとともに、この両側に粗化面を内側にして銅箔(三井金属鉱業株式会社製、厚さ18μm、ST箔)を重ね、これを加熱加圧して積層成形することによって、銅張積層板として製造した。加熱加圧の条件は、180℃、2.94MPa、60分間である。
(4.1)ガラス転移温度(Tg)
セイコーインスツル株式会社製粘弾性スペクトロメータ「DMS6100」を用いて、プリプレグのガラス転移温度を測定した。具体的には、曲げモジュールで周波数を10Hzとして測定を行い、昇温速度5℃/分の条件で室温から280℃まで昇温した際のtanαが極大を示す温度をガラス転移温度とした。
Hewlett-Packard社製「インピーダンス/マテリアルアナライザー4291A」を用いて、1GHzにおける銅張積層板の比誘電率をIPC-TM-650 2.5.5.9に準じて測定した。
銅張積層板の表面の銅箔(厚さ18μm)の引きはがし強さをJIS C 6481に準拠して測定した。すなわち、銅箔を毎分約50mmの速さではがし、そのときの引きはがし強さ(kN/m)をピール強度として測定した。
板厚が0.8mmの銅張積層板を上記と同様に製造した。この銅張積層板の表面の銅箔をエッチングにより除去した後、70℃の水酸化ナトリウム水溶液(10質量%)に30分間浸漬させた。そして、浸漬前後の質量から質量減少率を算出した。その結果を以下のように分けて表4に示す。
「B」:質量減少率が0.2質量%以上0.3質量%未満
「C」:質量減少率が0.3質量%以上
(4.5)耐燃性
板厚が0.8mm、1.2mm、1.6mmの銅張積層板をプリプレグの枚数を調整して上記と同様に製造した。各銅張積層板の表面の銅箔をエッチングにより除去した後、UnderwritersLaboratoriesの“Test for Flammability of Plastic Materials-UL 94”に準じて耐燃性試験を行って、耐燃性を評価した。V-0を満たすものが「OK」、満たさないものが「NG」である。表4では、板厚とその板厚でV-0を満たすか否かを示す。
「1.2mm OK」:1.6mmはNG、1.2mm及び0.8mmはOK
「0.8mm NG」:1.6mm、1.2mm、及び0.8mmの全てがNG
10 樹脂層
11 基材
2 樹脂付きフィルム
20 樹脂層
21 支持フィルム
22 保護フィルム
3 樹脂付き金属箔
30 樹脂層
31 金属箔
4 金属張積層板
40 絶縁層
41 金属層
5 プリント配線板
50 絶縁層
51 導体配線
Claims (15)
- エポキシ化合物と、硬化剤と、を含有し、
前記エポキシ化合物は、分子中にリン原子を有するリン含有エポキシ化合物を含み、
前記硬化剤は、分子中にリン原子及び酸無水物基を有するリン含有酸無水物を含む、
樹脂組成物。 - 前記エポキシ化合物は、分子中にリン原子を含まず、かつ、エポキシ基を少なくとも2つ以上有する多官能エポキシ化合物を更に含む、
請求項1に記載の樹脂組成物。 - 前記硬化剤は、分子中にリン原子を含まないリン非含有硬化剤を更に含む、
請求項1に記載の樹脂組成物。 - 前記エポキシ化合物及び前記硬化剤の合計質量に対するリン含有量が1.3質量%以上3.7質量%以下の範囲内である、
請求項1に記載の樹脂組成物。 - 前記リン含有酸無水物の含有量が、前記リン含有エポキシ化合物及び前記リン含有酸無水物の合計100質量部に対して、5質量部以上70質量部以下の範囲内である、
請求項1に記載の樹脂組成物。 - 前記多官能エポキシ化合物は、分子中にナフタレン骨格及びジシクロペンタジエン骨格の少なくともいずれかの骨格を有する多官能エポキシ化合物を含む、
請求項2に記載の樹脂組成物。 - 前記リン非含有硬化剤は、多官能酸無水物、脂環式多官能酸無水物、及びスチレン無水マレイン酸共重合体からなる群より選ばれた1種以上の化合物を含む、
請求項3に記載の樹脂組成物。 - 前記エポキシ化合物と前記硬化剤との当量比が1:0.75~1:1.25の範囲内である、
請求項1に記載の樹脂組成物。 - 無機フィラーを更に含有し、
前記無機フィラーの含有量が、前記エポキシ化合物及び前記硬化剤の合計100質量部に対して、20質量部以上150質量部以下の範囲内である、
請求項1に記載の樹脂組成物。 - 基材と、前記基材に含浸された請求項1に記載の樹脂組成物の半硬化物で形成された樹脂層と、を備える、
プリプレグ。 - 請求項1に記載の樹脂組成物の半硬化物で形成された樹脂層と、前記樹脂層を支持する支持フィルムと、を備える、
樹脂付きフィルム。 - 請求項1に記載の樹脂組成物の半硬化物で形成された樹脂層と、前記樹脂層が接着された金属箔と、を備える、
樹脂付き金属箔。 - 請求項1に記載の樹脂組成物の硬化物又は請求項11に記載のプリプレグの硬化物で形成された絶縁層と、前記絶縁層の片面又は両面に形成された金属層と、を備える、
金属張積層板。 - 請求項1に記載の樹脂組成物の硬化物又は請求項11に記載のプリプレグの硬化物で形成された絶縁層と、前記絶縁層の片面又は両面に形成された導体配線と、を備える、
プリント配線板。
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- 2020-03-24 US US17/599,274 patent/US20220185945A1/en active Pending
- 2020-03-24 KR KR1020217030599A patent/KR20210146914A/ko unknown
- 2020-03-24 JP JP2021511499A patent/JP7352799B2/ja active Active
- 2020-03-24 WO PCT/JP2020/013020 patent/WO2020203469A1/ja active Application Filing
- 2020-03-24 CN CN202080021843.3A patent/CN113574087A/zh active Pending
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CN111748174A (zh) | 2020-10-09 |
SE2151138A1 (en) | 2021-09-17 |
JPWO2020203469A1 (ja) | 2020-10-08 |
TW202041562A (zh) | 2020-11-16 |
KR20210146914A (ko) | 2021-12-06 |
US20220185945A1 (en) | 2022-06-16 |
SE544815C2 (en) | 2022-11-29 |
JP7352799B2 (ja) | 2023-09-29 |
CN113574087A (zh) | 2021-10-29 |
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