TWI636885B - 金屬箔積層板的製造方法及其應用 - Google Patents

金屬箔積層板的製造方法及其應用 Download PDF

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Publication number
TWI636885B
TWI636885B TW106117171A TW106117171A TWI636885B TW I636885 B TWI636885 B TW I636885B TW 106117171 A TW106117171 A TW 106117171A TW 106117171 A TW106117171 A TW 106117171A TW I636885 B TWI636885 B TW I636885B
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Taiwan
Prior art keywords
fluorine
containing polymer
metal foil
prepreg
fluoropolymer
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TW106117171A
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English (en)
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TW201900425A (zh
Inventor
陳文仁
劉淑芬
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台燿科技股份有限公司
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Application filed by 台燿科技股份有限公司 filed Critical 台燿科技股份有限公司
Priority to TW106117171A priority Critical patent/TWI636885B/zh
Priority to CN201710385288.2A priority patent/CN108966534B/zh
Priority to US15/812,243 priority patent/US11529797B2/en
Application granted granted Critical
Publication of TWI636885B publication Critical patent/TWI636885B/zh
Publication of TW201900425A publication Critical patent/TW201900425A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/022—Non-woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B2037/0092—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding in which absence of adhesives is explicitly presented as an advantage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0253—Polyolefin fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B32B2262/0269—Aromatic polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0276—Polyester fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B32B2264/0257—Polyolefin particles, e.g. polyethylene or polypropylene homopolymers or ethylene-propylene copolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/101—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B32B2264/108—Carbon, e.g. graphite particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/12—Mixture of at least two particles made of different materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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Abstract

本發明提供一種金屬箔積層板的製造方法及其應用。該方法包含以下步驟：(a)以第一含氟高分子溶液浸漬一補強材，接著在第一溫度下乾燥該經浸漬之補強材，得到第一預浸漬體；(b)以第二含氟高分子溶液浸漬該第一預浸漬體，接著在第二溫度下乾燥該經浸漬之第一預浸漬體，得到第二預浸漬體；以及(c)壓合該第二預浸漬體與一金屬箔，得到一金屬箔積層板，其中，該第一含氟高分子溶液含有一第一含氟高分子，該第二含氟高分子溶液含有一第二含氟高分子，且該第一含氟高分子與該第二含氟高分子係不相同。

Description

金屬箔積層板的製造方法及其應用
本發明係關於一種金屬箔積層板的製造方法及其應用，特別關於一種含氟高分子(fluoropolymer)金屬箔積層板的製造方法以及由該方法所製得之含氟高分子金屬箔積層板與印刷電路板。由本發明方法所製得之含氟高分子金屬箔積層板係特別適合作為高頻技術領域之電路基板，包括射頻(radio frequency，RF)、微波(microwave)、天線(antenna)、雷達(radar)等技術領域。
隨著電子產品越趨小型化、輕量化、高密度化，對電子材料的物化性質要求也隨之提升。在信號傳輸高頻化與高速化、電子元件小型化、及電路板線路高密度化之趨勢下，傳統環氧樹脂製電子材料之特性早已不敷使用。目前對於電子材料的研究著重於含氟高分子(fluoropolymer)(例如聚四氟乙烯(polytetrafluoroethylene，PTFE))製電子材料，亦即以含氟高分子作為電子材料中的介電層。一般而言，以含氟高分子作為電子 材料中的介電層時，所製電子材料可具備極佳電學性質(介電常數(Dk)、損耗因數(Df)皆低)，以及良好耐化學酸鹼性、吸溼性與難燃性。然而，以含氟高分子作為介電材料時，往往因為含氟高分子與金屬箔的附著力不佳，導致使用含氟高分子作為介電層之金屬箔積層板通常存在抗撕強度(peeling strength)不足的問題。尤其，當因為電學性質的考量(例如，更低的介電耗損(dielectric loss))而使用「低粗糙度(low profile)金屬箔」時，由於金屬箔與介電層接著的面粗糙度較低，含氟高分子與金屬的附著力將會更差。
在先前技術中，為了解決上述附著力的問題，通常使用環氧樹脂系接著劑來提升金屬箔與介電層(含氟高分子層)之間的附著力(bonding)。然而，環氧樹脂系接著劑的介電特性不佳，將使所製電子材料的電學性質變差。
CN 101277816 B揭露一種使用含氟高分子黏著層製備銅箔積層板之方法。如第1圖之示意，該方法係提供一液晶高分子(liquid crystal polymer，LCP)與全氟烷基乙烯基醚共聚物(polyfluoroalkoxy，PFA)複合膜作為黏著層12，將該黏著層12對位貼合至一作為介電層之PTFE膠片11上，接著再將銅箔13與黏著層12及PTFE膠片11壓合形成含氟高分子銅箔積層板1(為使各元件獨立且清晰地呈現，銅箔積層板之堆疊結構係以分離形式表示)，藉由黏著層12來提升銅箔積層板的抗撕強度。
然而，該方法在實際應用上存在以下問題：(1)使 用黏著層需要精確的對位貼合步驟，一旦貼合出現偏差，將使基板報廢的邊料增加；(2)該黏著層通常與離型膜一起以成卷的型式提供，不僅成本較高，且在分離黏著層與離型膜時容易產生靜電，造成貼合製程操作上的困難，並且靜電的累積亦存有潛在的危險；以及(3)該含PFA之黏著層的貼合溫度需達至少370℃。因此，上述使用含氟高分子黏著層的方法存在有製程複雜、良率不佳、製程難度及成本較高等缺點。目前仍需要更好的作法來改善含氟高分子介電層與金屬箔之間附著力不佳的問題。
有鑑於以上技術問題，本發明提供一種含氟高分子金屬箔積層板的製造方法，該方法不需要使用額外的含氟高分子薄膜作為黏著層，無須進行黏著層貼合步驟，並且可在較低溫度下進行，可適用於烘箱可操作溫度較低(如低於約340℃)的傳統上膠機(treater)。
本發明之一目的在於提供一種金屬箔積層板的製造方法，其包含以下步驟：(a)以一第一含氟高分子溶液浸漬一補強材，接著在第一溫度下乾燥該經浸漬之補強材，得到一第一預浸漬體；(b)以一第二含氟高分子溶液浸漬該第一預浸漬體，接著在第二溫度下乾燥該經浸漬之第一預浸漬體，得到一第二預浸漬體；以及(c)壓合該第二預浸漬體與一金屬箔，得到一金屬箔積層板， 其中，該第一含氟高分子溶液含有一第一含氟高分子，該第二含氟高分子溶液含有一第二含氟高分子，且該第一含氟高分子與該第二含氟高分子係不相同。
本發明之另一目的在於提供一種金屬箔積層板，其係由上述製造方法所製得。
本發明之再一目的在於提供一種印刷電路板，其係由上述金屬箔積層板所製得。
為使本發明之上述目的、技術特徵及優點能更明顯易懂，下文係以部分具體實施態樣進行詳細說明。
1‧‧‧銅箔積層板
2‧‧‧金屬箔積層板
11、21‧‧‧PTFE膠片
12‧‧‧黏著層
13‧‧‧銅箔
22‧‧‧PFA層
23‧‧‧金屬箔
第1圖係習知金屬箔積層板之堆疊示意圖。
第2圖係根據本發明方法所製金屬箔積層板之一實施態樣之堆疊示意圖。
以下將具體地描述根據本發明之部分具體實施態樣；惟，在不背離本發明之精神下，本發明尚可以多種不同形式之態樣來實踐，不應將本發明保護範圍解釋為限於說明書所陳述者。此外，除非文中有另外說明，於本說明書中(尤其是在後述專利申請範圍中)所使用之「一」、「該」及類似用語應理解為包含單數及複數形式。再者，除非文中有另外說明，於本說明書中描述溶液、混合物或組合物中所含之成分時，係以該成分所含之固形物計算，即，未納入溶劑之重量。此外，於本說明書中提及 「浸漬(impregnate)」作為一技術手段時，應理解，該技術手段包括含浸(dip)、塗佈(coat)、噴塗(spray)或其它具有實質上相同功能效果的技術手段，亦即，本發明所屬技術領域中具通常知識者可依實際需求來選擇不同的浸漬手段，包括含浸、塗佈、噴塗等技術手段，且應被理解為皆包括在本發明的範圍中。
本發明提供一種金屬箔積層板之製造方法，藉由在第一道浸漬與乾燥步驟之後，再進行第二道浸漬與乾燥步驟，且第一道浸漬步驟與第二道浸漬步驟分別使用不同含氟高分子溶液的技術手段，可提供具優異抗撕強度與電學性質之含氟高分子金屬箔積層板。本發明方法無須另外使用黏著層進行金屬箔貼合，因此可避免相關對位貼合步驟所衍生的成本及良率問題。此外，本發明製造方法可在較低溫度(例如約300℃以下)下進行電子材料之介電層部分的製備，可適用於傳統上膠設備。以下茲就本發明提供詳細說明。
本發明金屬箔積層板的製造方法包含以下步驟：(a)以一第一含氟高分子溶液浸漬一補強材，接著在第一溫度下乾燥該經浸漬之補強材，得到一第一預浸漬體；(b)以一第二含氟高分子溶液浸漬該第一預浸漬體，接著在第二溫度下乾燥該經浸漬之第一預浸漬體，得到一第二預浸漬體；以及(c)壓合該第二預浸漬體與一金屬箔，得到一金屬箔積層板，其中，該第一含氟高分子溶液含有一第一含氟高分子，該第二含 氟高分子溶液含有一第二含氟高分子，且該第一含氟高分子與該第二含氟高分子係不相同。
「第一含氟高分子」或「第二含氟高分子」係指含有氟原子的同元高分子(homopolymer)或共聚物(copolymer)，特定言之，係指具有多重強碳-氟鍵之氟碳系(fluorocarbon-based)高分子。一般而言，含氟高分子具有耐溶劑性、耐酸性、耐鹼性等特性，且因具有強碳-氟鍵而具有優良的穩定性。此外，含氟高分子亦具有優良的介電特性及寬廣的使用溫度範圍，可應用於電子、化學、機械製造等多種工業或產業上。
具體言之，含氟高分子可為選自以下群組之單體的聚合物，或選自以下群組之單體與其他共單體的共聚物：四氟乙烯、三氟氯乙烯、二氟亞乙烯(vinylidene fluoride)、氟乙烯、全氟醚(perfluoroether)、四氟乙烯-全氟丙烯乙烯醚(tetrafluoroethylene-perfluoropropylene vinyl ether)、及三氟氯乙烯(chlorotrifluoroethylene)。共單體之實例包括但不限於：全氟甲基乙烯醚(perfluoro methyl vinyl ether)、全氟丙烯乙烯醚(perfluoro propylene vinyl ether)、六氟丙烯(hexafluoropropylene)、全氟丁基乙烯(perfluorobutyl ethylene)、乙烯、丙烯、及丁烯。含氟高分子之具體實例包括但不限於：PTFE、PFA、FEP、聚二氟亞乙烯(polyvinylidene fluoride，PVDF)、聚氟乙烯、聚三氟氯乙烯(polychloro trifluoroethylene，PCTFE)、全氟聚醚(perfluoropolyether，PFPE)、四氟乙烯-乙烯共聚物 (ethylene-tetrafluroethylene，ETFE)、及三氟氯乙烯-乙烯共聚物(ethylene-chloro trifluoroethylene，ECTFE)。
於本發明方法中，第一含氟高分子係不同於第二含氟高分子，其中第一含氟高分子係作為積層板之介電層的主要成分，第二含氟高分子則用於提高積層板應用上的可行性。舉例言之，於本發明之部分實施態樣中，第二含氟高分子的熔融溫度係低於第一含氟高分子的熔融溫度，例如第一含氟高分子的熔融溫度可為約325℃至約340℃，而第二含氟高分子的熔融溫度可為約250℃至約320℃。在第二含氟高分子的熔融溫度低於第一含氟高分子的熔融溫度的情況下，第二含氟高分子在熱壓過程中的流膠(resin flow)特性將優於第一含氟高分子，由此可提高介電層與金屬箔之間的黏著性能。於本發明之部分實施態樣中，係使用PTFE作為第一含氟高分子，以及使用FEP、PFA、或其組合作為第二含氟高分子。
「補強材」係指由纖維材料所構成的布狀結構增強材料，例如織布(woven fabric)及不織布(non-woven fabric)。較佳地，用於構成補強材之纖維材料係具有較高熱穩定性的材料，其實例包括但不限於E級玻璃纖維(E-glass fiber)、NE級玻璃纖維(NE-glass fiber)、S級玻璃纖維(S-glass fiber)、L級玻璃纖維(L-glass fiber)、D級玻璃纖維(D-glass fiber)、石英玻璃(quartz glass)、克維拉(Kevlar)、PTFE、芳香族聚酯(aromatic polyester)、液晶高分子(LCP)等。於本發明之部分實施態樣中，係使用由E 級玻璃纖維所構成的E級玻璃纖維布作為補強材。
「金屬箔」係指由具有良好導電性的金屬材料或合金材料所形成的金屬薄片，其製備方式並無特殊限制，例如可經由鎚打或軋延等機械加工方式形成。所述金屬材料或合金材料之實例包括但不限於不鏽鋼、銅、鋁、鋅、鐵、鎳、金、銀、過渡金屬、及前述之二或多者之合金材料。金屬箔之表面可經粗化、未經粗化或經低度粗化，表面經粗化之金屬箔的表面粗糙度(Ra)例如是約5微米至約10微米，表面未經粗化或經低度粗化之金屬箔的表面粗糙度(Ra)例如是約0.1微米至約5微米，其中金屬箔之表面粗糙度(Ra)測試標準可參照IPC-4562及IPC-TM-650。表面粗糙度通常係例如經由接觸式(contact)或光學式(optical)表面量測儀(profilometer)所確定，例如Wyko光學式表面量測儀(Veeco公司提供)。以銅箔為例，依據銅箔之表面粗糙度(Ra)的不同，可分為高溫延展(high temperature elongation，HTE)型銅箔(Ra為6微米至10微米)、箔反面處理(reversed treated foil，RTF)型銅箔(Ra為2微米至5微米)、極低粗糙度(very low profile，VLP；或very small profile，VSP)型銅箔(Ra小於2微米)、超極低粗糙度(hyper very low profile，HVLP)型銅箔(Ra小於1.5微米)等類型。較高的表面粗糙度雖可提高金屬箔與含氟高分子介電層的附著力，但在高頻化應用中，高表面粗糙度會不利地影響高頻時的電學特性。因此，於本發明之部分實施態樣中，係採用表面粗糙度(Ra)小於約5微米的低粗糙度(low profile)金屬箔。
根據本發明之方法，為了達到所需之介電層厚度，在步驟(a)中，以第一含氟高分子溶液浸漬補強材之浸漬操作及相應之乾燥操作可進行多次，例如可進行二次、三次、四次、五次等，以提供足夠厚的介電層。類似地，為了應用上的需要，例如為了增強介電層與金屬箔之間的黏著性能(即增加金屬箔積層板之抗撕強度)，在步驟(b)中以第二含氟高分子溶液浸漬第一預浸漬體之浸漬操作及相應之乾燥操作亦可進行多次，例如可進行二次、三次、四次、五次等。
本發明方法形成金屬箔積層板之介電層的步驟包括步驟(a)及步驟(b)。於步驟(a)中，經浸漬第一含氟高分子溶液之補強材係於第一溫度下進行乾燥，以移除溶劑從而形成第一預浸漬體，第一溫度可為約300℃或更低的溫度，例如約200℃、約210℃、約220℃、約230℃、約240℃、約250℃、約260℃、約270℃、約280℃、或約290℃。於步驟(b)中，第一預浸漬體接著進一步浸漬第二含氟高分子溶液，並於第二溫度下進行乾燥以形成第二預浸漬體，其中第二溫度同樣可於約300℃或更低的溫度下進行，例如約200℃、約210℃、約220℃、約230℃、約240℃、約250℃、約260℃、約270℃、約280℃、或約290℃。第二預浸漬體隨後與金屬箔進行壓合操作後即可得到金屬箔積層板。因此，本發明方法之一優點在於可以較低之製程溫度(例如約300℃或更低的溫度)完成電子材料之介電層的製備，無須進行額外之高溫熟成步驟(340℃或更高溫的熟成步驟)，因此可適用於烘箱溫度 無法超過340℃的傳統上膠機，應用範圍更為廣泛。
於本發明製造方法中，步驟(c)係第二預浸漬體與金屬箔之壓合操作。所述壓合操作並無特殊限制，可以積層板技術領域或印刷電路板技術領域中常見的任何壓合方式實施。於本發明之部分實施態樣中，係採用高溫壓合機(如真空高溫壓合機)以約360℃至約395℃及3兆帕(MPa)至60兆帕之條件熱壓30至360分鐘，但本發明方法並不以此為限。
第一含氟高分子溶液與第二含氟高分子溶液可各自進一步包含其他選用成分，例如填料、分散劑、增韌劑、黏度調整劑等，以改良所製金屬箔積層板之物化性質或各含氟高分子溶液在金屬箔積層板製造過程中的可加工性。舉例言之，第一含氟高分子溶液與第二含氟高分子溶液可各自進一步含有選自以下群組之填料：二氧化矽、氧化鋁、氧化鎂、氫氧化鎂、碳酸鈣、滑石、黏土、氮化鋁、氮化硼、氫氧化鋁、碳化鋁矽、碳化矽、碳酸鈉、二氧化鈦、氧化鋅、氧化鋯、石英、鑽石、類鑽石、石墨、煅燒高嶺土、白嶺土、雲母、水滑石、中空二氧化矽、PTFE粉末、玻璃珠、陶瓷晶鬚、奈米碳管、奈米級無機粉體、及其組合。
第一含氟高分子溶液係藉由將第一含氟高分子與其他選用成分溶解或分散於合適的溶劑中而製得，類似地，第二含氟高分子溶液係藉由將第二含氟高分子與其他選用組分溶解或分散於合適的溶劑中而製得。所述溶劑可為任何可溶解或分散第一含氟高分子、第二含氟高分子及其他選用成分，但不與第一含氟 高分子、第二含氟高分子及其他選用成分反應之惰性溶劑。所述溶劑之實例包含但不限於水、γ-丁內酯、甲乙酮、環己酮、丁酮、丙酮、二甲苯、甲基異丁基酮、N,N-二甲基甲醯胺(N,N-dimethyl formamide，DMF)、N,N-二甲基乙醯胺(N,N-dimethyl acetamide，DMAc)、N-甲基吡咯烷酮(N-methyl-pyrolidone，NMP)、二甲亞碸(dimethyl sulfoxide，DMSO)、四氫呋喃(tetrahydrofuran，THF)、碳酸二乙酯、碳酸伸丙酯、及六甲基磷醯胺(hexamethylphosphoramide，HMPA)，且各該溶劑可單獨使用或組合使用。溶劑之用量並無特殊限制，原則上只要能使第一含氟高分子、第二含氟高分子與其他選用成分均勻溶解或分散於其中即可。
本發明亦提供一種由上述金屬箔積層板的製造方法所製得之金屬箔積層板。第2圖係根據本發明方法所製得之金屬箔積層板之一實施態樣之堆疊示意圖(為使各元件獨立且清晰地呈現，堆疊結構係以分離形式表示)，其中係以PTFE作為第一含氟高分子，以PFA作為第二含氟高分子，透過以下方式製備金屬箔積層板2：以PTFE分散乳液(即，第一含氟高分子溶液)浸漬一玻璃纖維布(即，補強材)，並在約100℃至約300℃下烘烤以得到PTFE膠片21(即，第一預浸漬體)，隨後以PFA分散乳液(即，第二含氟高分子溶液)浸漬PTFE膠片21，並在約100℃至約300℃下烘烤以得到帶有PFA層22的PTFE膠片21(即，第二預浸漬體)，之後，再將帶有PFA層22的PTFE膠片21與金屬箔23進行熱壓，得到金屬 箔積層板2。
本發明亦提供一種由上述金屬箔積層板所製得之印刷電路板，其係藉由圖案化金屬箔積層板之外側金屬箔的單面或雙面而製得。
茲以下列具體實施態樣進一步例示說明本發明，其中，所採用之量測儀器及方法分別如下：
[抗撕強度測試]
抗撕強度係指金屬箔對經層合之預浸漬片的附著力而言，以1/8英寸寬度的銅箔自板面上垂直撕起，以其所需力量的大小來表達附著力的強弱。
[介電常數(Dk)與損耗因數(Df)量測]
根據ASTM D150規範，在工作頻率10GHz下，計算金屬箔積層板之介電常數(Dk)與損耗因數(Df)。
實施例
[銅箔積層板之製備]
<實施例1>
如表1所示，以PTFE分散乳液(型號：DISP 30，購自杜邦(DuPont)，PTFE固含量為60重量%)浸漬E級玻璃纖維布(1080型式)，隨後在低溫250℃下烘烤經浸漬的E級玻璃纖維布來乾燥PTFE分散乳液，並重複以上浸漬與烘烤步驟，使得PTFE分散乳液的總浸漬次數為二次，由此得到PTFE膠片。接著，以PFA分散乳液(型號：PFA355D，購自杜邦，PFA固含量為60重量%)浸 漬PTFE膠片，在200℃下烘烤經浸漬PFA分散乳液的PTFE膠片來乾燥PFA分散乳液，並重複以上浸漬與烘烤步驟，使得PFA分散乳液的總浸漬次數為二次，由此得到經PFA塗覆的PTFE膠片。之後，在經PFA塗覆的PTFE膠片上下二側各放置一片0.5盎司的HTE型銅箔(型號：PLS，購自長春(CCP))，藉由真空高溫壓機於360℃及3兆帕(MPa)之條件下熱壓90分鐘，由此得到銅箔積層板1。
<實施例2>
以與實施例1相同之方式製備銅箔積層板2，惟改在高溫370℃下烘烤經浸漬的E級玻璃纖維布來乾燥PTFE分散乳液，如表1所示。
<實施例3>
以與實施例1相同之方式製備銅箔積層板3，惟PFA分散乳液的總浸漬次數僅為一次，如表1所示。
<實施例4>
以與實施例3相同之方式製備銅箔積層板4，惟改在高溫370℃下烘烤經浸漬的E級玻璃纖維布來乾燥PTFE分散乳液，如表1所示。
<實施例5>
以與實施例1相同之方式製備銅箔積層板5，惟改使用0.5盎司的VLP型銅箔(低粗糙度銅箔)(型號：T9FZ，購自福田(Fukuda))，如表1所示。
<實施例6>
以與實施例5相同之方式製備銅箔積層板6，惟改在高溫370℃下烘烤經浸漬的E級玻璃纖維布來乾燥PTFE分散乳液，如表1所示。
<比較實施例1>
如表1所示，以PTFE分散乳液(型號：DISP 30)浸漬E級玻璃纖維布(1080型式)，隨後在高溫370℃下烘烤經浸漬的E級玻璃纖維布來乾燥PTFE分散乳液，並重複以上浸漬與烘烤步驟，使得PTFE分散乳液的總浸漬次數為二次，由此得到PTFE膠片。接著，在PTFE膠片的上下二側各放置一片PFA膜(型號：CHEMFILM，購自聖戈班(Saint Gobain))作為黏著層，並進行PFA膜之對位程序。之後，再於放置有PFA膜之PTFE膠片的上下二側各放置一片0.5盎司的HTE型銅箔(型號：PLS)，藉由真空高溫壓機於360℃及3兆帕之條件下熱壓90分鐘，由此得到比較銅箔積層板1。
測量銅箔積層板1至6(樹脂含量(resin content，RC)皆為85%)以及比較銅箔積層板1(樹脂含量(RC)為85%)之抗撕強度、損耗因數(Df)及介電常數(Dk)，並將結果紀錄於表2中。
如表2所示，本發明方法所製得之銅箔積層板1至6的電學性質與使用PFA膜作為黏著層(比較銅箔積層板1)之習知方法所製銅箔積層板的電學性質相當，且在PFA分散乳液總浸漬次數為一次之情況下，所製銅箔積層板(銅箔積層板3及4)之抗撕強度已達可接受之程度，尤其在PFA分散乳液總浸漬次數為二次之情況下，所製銅箔積層板之抗撕強度更是優於使用黏著層之習知方法所製之銅箔積層板(參銅箔積層板1及2與比較銅箔積層板1之比較)。此外，本發明方法即使採用低粗糙度的銅箔，所製銅箔積層板(銅箔積層板5及6)仍具有相當優異之抗撕強度。以上結果顯示，本發明方法可在不另外進行黏著層貼合步驟之情況下，提供電學性質及抗撕強度優異的金屬箔積層板。
上述實施例僅為例示性說明本發明之原理及其功效，並闡述本發明之技術特徵，而非用於限制本發明之保護範疇。任何熟悉本技術者在不違背本發明之技術原理及精神下，可輕易完成之改變或安排，均屬本發明所主張之範圍。因此，本發明之權利保護範圍係如後附申請專利範圍所列。

Claims (11)

  1. 一種金屬箔積層板的製造方法，包含以下步驟：(a)以一第一含氟高分子溶液浸漬一補強材，接著在第一溫度下乾燥該經浸漬之補強材，得到一第一預浸漬體；(b)以一第二含氟高分子溶液浸漬該第一預浸漬體，接著在第二溫度下乾燥該經浸漬之第一預浸漬體，得到一第二預浸漬體；以及(c)壓合該第二預浸漬體與一金屬箔，得到一金屬箔積層板，其中，該第一含氟高分子溶液含有一第一含氟高分子，該第二含氟高分子溶液含有一第二含氟高分子，且該第一含氟高分子與該第二含氟高分子係不相同。
  2. 如請求項1之製造方法，其中該第二含氟高分子的熔融溫度係低於該第一含氟高分子的熔融溫度。
  3. 如請求項1之製造方法，其中該第一含氟高分子係聚四氟乙烯(polytetrafluoroethylene，PTFE)。
  4. 如請求項1之製造方法，其中該第二含氟高分子係選自以下群組：四氟乙烯-六氟丙烯共聚物(fluorinated ethylene propylene，FEP)、四氟乙烯-全氟烷基乙烯基醚共聚物(polyfluoroalkoxy，PFA)、及其組合。
  5. 如請求項1至4中任一項之製造方法，其中第一溫度係不超過約300℃。
  6. 如請求項1至4中任一項之製造方法，其中第二溫度係不超過約300℃。
  7. 如請求項1至4中任一項之製造方法，其中於步驟(a)中，以該第一含氟高分子溶液浸漬該補強材之浸漬操作及相應之乾燥操作係進行至少二次。
  8. 如請求項1至4中任一項之製造方法，其中於步驟(b)中，以該第二含氟高分子溶液浸漬該第一預浸漬體之浸漬操作及相應之乾燥操作係進行至少二次。
  9. 如請求項1至4中任一項之製造方法，其中該金屬箔係一低粗糙度(low profile)金屬箔。
  10. 一種金屬箔積層板，其係由如請求項1至9中任一項之製造方法所製得。
  11. 一種印刷電路板，其係由如請求項10之金屬箔積層板所製得。
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