CN108966534A - 金属箔积层板的制造方法及其应用 - Google Patents

金属箔积层板的制造方法及其应用 Download PDF

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Publication number
CN108966534A
CN108966534A CN201710385288.2A CN201710385288A CN108966534A CN 108966534 A CN108966534 A CN 108966534A CN 201710385288 A CN201710385288 A CN 201710385288A CN 108966534 A CN108966534 A CN 108966534A
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containing polymers
metal foil
fluoro containing
manufacturing
prepreg
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CN108966534B (zh
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陈文仁
刘淑芬
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Taiwan Union Technology Corp
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Taiwan Union Technology Corp
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
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    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
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Abstract

本发明提供一种金属箔积层板的制造方法及其应用。该方法包含以下步骤：(a)以第一含氟高分子溶液浸渍一补强材，接着在第一温度下干燥该经浸渍的补强材，得到第一预浸渍体；(b)以第二含氟高分子溶液浸渍该第一预浸渍体，接着在第二温度下干燥该经浸渍的第一预浸渍体，得到第二预浸渍体；以及(c)压合该第二预浸渍体与一金属箔，得到一金属箔积层板，其中，该第一含氟高分子溶液含有一第一含氟高分子，该第二含氟高分子溶液含有一第二含氟高分子，且该第一含氟高分子与该第二含氟高分子不相同。

Description

金属箔积层板的制造方法及其应用
技术领域
本发明关于一种金属箔积层板的制造方法及其应用，特别关于一种含氟高分子(fluoropolymer)金属箔积层板的制造方法以及由该方法所制得的含氟高分子金属箔积层板与印刷电路板。由本发明方法所制得的含氟高分子金属箔积层板特别适合作为高频技术领域的电路基板，包括射频(radio frequency，RF)、微波(microwave)、天线(antenna)、雷达(radar)等技术领域。
背景技术
随着电子产品越趋小型化、轻量化、高密度化的发展，对电子材料的物化性质要求也随之提升。在信号传输高频化与高速化、电子组件小型化、及电路板线路高密度化的趋势下，传统环氧树脂制电子材料的特性早已不敷使用。目前对于电子材料的研究着重于含氟高分子(fluoropolymer)(例如聚四氟乙烯(polytetrafluoroethylene，PTFE))制电子材料，也即以含氟高分子作为电子材料中的介电层。一般而言，以含氟高分子作为电子材料中的介电层时，所制电子材料可具备极佳电学性质(介电常数(Dk)、损耗因子(Df)皆低)，以及良好耐化学酸碱性、吸湿性与难燃性。然而，以含氟高分子作为介电材料时，往往因为含氟高分子与金属箔的附着力不佳，导致使用含氟高分子作为介电层的金属箔积层板通常存在抗撕强度(peeling strength)不足的问题。尤其，当因为电学性质的考虑(例如，更低的介电耗损(dielectric loss))而使用“低粗糙度(low profile)金属箔”时，由于金属箔与介电层接着的面粗糙度较低，含氟高分子与金属的附着力将会更差。
在现有技术中，为了解决上述附着力的问题，通常使用环氧树脂系接着剂来提升金属箔与介电层(含氟高分子层)之间的附着力(bonding)。然而，环氧树脂系接着剂的介电特性不佳，将使所制电子材料的电学性质变差。
中国专利CN 101277816 B公开了一种使用含氟高分子黏着层制备铜箔积层板的方法。如图1的示意，该方法提供一液晶高分子(liquid crystal polymer，LCP)与全氟烷基乙烯基醚共聚物(polyfluoroalkoxy，PFA)复合膜作为黏着层12，将该黏着层12对位贴合至一作为介电层的PTFE胶片11上，接着再将铜箔13与黏着层12及PTFE胶片11压合形成含氟高分子铜箔积层板1(为使各组件独立且清晰地呈现，铜箔积层板的堆叠结构以分离形式表示)，通过黏着层12来提升铜箔积层板的抗撕强度。
然而，该方法在实际应用上存在以下问题：(1)使用黏着层需要精确的对位贴合步骤，一旦贴合出现偏差，将使基板报废的边料增加；(2)该黏着层通常与离型膜一起以成卷的型式提供，不仅成本较高，且在分离黏着层与离型膜时容易产生静电，造成贴合制程操作上的困难，并且静电的累积也存有潜在的危险；以及(3)该含PFA的黏着层的贴合温度需达至少370℃。因此，上述使用含氟高分子黏着层的方法存在有制程复杂、合格率不佳、制造过程难度大及成本较高等缺点。目前仍需要更好的作法来改善含氟高分子介电层与金属箔之间附着力不佳的问题。
发明内容
有鉴于以上技术问题，本发明提供一种含氟高分子金属箔积层板的制造方法，该方法不需要使用额外的含氟高分子薄膜作为黏着层，无须进行黏着层贴合步骤，并且可在较低温度下进行，可适用于烘箱可操作温度较低(如低于约340℃)的传统上胶机(treater)。
本发明的一个目的在于提供一种金属箔积层板的制造方法，其包含以下步骤：
(a)以一第一含氟高分子溶液浸渍一补强材，接着在第一温度下干燥该经浸渍的补强材，得到一第一预浸渍体；
(b)以一第二含氟高分子溶液浸渍该第一预浸渍体，接着在第二温度下干燥该经浸渍的第一预浸渍体，得到一第二预浸渍体；以及
(c)压合该第二预浸渍体与一金属箔，得到一金属箔积层板，
其中，该第一含氟高分子溶液含有一第一含氟高分子，该第二含氟高分子溶液含有一第二含氟高分子，且该第一含氟高分子与该第二含氟高分子不相同。
其中，该第二含氟高分子的熔融温度低于该第一含氟高分子的熔融温度。
其中，该第一含氟高分子是聚四氟乙烯(polytetrafluoroethylene，PTFE)。
其中，该第二含氟高分子选自以下群组：四氟乙烯-六氟丙烯共聚物(fluorinatedethylene propylene，FEP)、四氟乙烯-全氟烷基乙烯基醚共聚物(polyfluoroalkoxy，PFA)、及其组合。
其中，第一温度不超过约300℃。
其中，第二温度不超过约300℃。
其中，于步骤(a)中，以该第一含氟高分子溶液浸渍该补强材的浸渍操作及相应的干燥操作进行至少两次。
其中，于步骤(b)中，以该第二含氟高分子溶液浸渍该第一预浸渍体的浸渍操作及相应的干燥操作进行至少两次。
其中，该金属箔是一低粗糙度(low profile)金属箔。
本发明的另一个目的在于提供一种金属箔积层板，其是由上述制造方法所制得。
本发明的再一个目的在于提供一种印刷电路板，其是由上述金属箔积层板所制得。
为使本发明的上述目的、技术特征及优点能更明显易懂，下文以部分具体实施例进行详细说明。
本发明的有益效果是：
本发明方法可在不另外进行黏着层贴合步骤的情况下，提供电学性质及抗撕强度优异的金属箔积层板。
附图说明
下面结合附图和具体实施方式对本发明作进一步详细的说明。
图1：现有金属箔积层板的堆叠示意图；
图2：根据本发明方法所制金属箔积层板的一实施例的堆叠示意图。
附图标记说明
1：铜箔积层板
2：金属箔积层板
11、21：PTFE胶片
12：黏着层
13：铜箔
22：PFA层
23：金属箔。
具体实施方式
以下将具体地描述根据本发明的部分具体实施例；但是，在不背离本发明的精神下，本发明还可以多种不同形式的例来实践，不应将本发明保护范围解释为限于说明书所陈述的内容。此外，除非文中有另外说明，于本说明书中(尤其是在权利要求书中)所使用的“一”、“该”及类似用语应理解为包含单数及复数形式。同时，除非文中有另外说明，于本说明书中描述溶液、混合物或组合物中所含的成分时，是以该成分所含的固态物计算，即，未纳入溶剂的重量。此外，于本说明书中提及“浸渍(impregnate)”作为一技术手段时，应理解，该技术手段包括含浸(dip)、涂布(coat)、喷涂(spray)或其它具有实质上相同功能效果的技术手段，也即，本发明所属技术领域中普通技术人员可依实际需求来选择不同的浸渍手段，包括含浸、涂布、喷涂等技术手段，且应被理解为都包括在本发明的范围中。
本发明提供一种金属箔积层板的制造方法，通过在第一道浸渍与干燥步骤之后，再进行第二道浸渍与干燥步骤，且第一道浸渍步骤与第二道浸渍步骤分别使用不同含氟高分子溶液的技术手段，可提供具优异抗撕强度与电学性质的含氟高分子金属箔积层板。本发明方法无须另外使用黏着层进行金属箔贴合，因此可避免相关对位贴合步骤所衍生的成本及合格率问题。此外，本发明制造方法可在较低温度(例如约300℃以下)下进行电子材料的介电层部分的制备，可适用于传统上胶设备。以下就本发明提供详细说明。
本发明金属箔积层板的制造方法包含以下步骤：
(a)以一第一含氟高分子溶液浸渍一补强材，接着在第一温度下干燥该经浸渍的补强材，得到一第一预浸渍体；
(b)以一第二含氟高分子溶液浸渍该第一预浸渍体，接着在第二温度下干燥该经浸渍的第一预浸渍体，得到一第二预浸渍体；以及
(c)压合该第二预浸渍体与一金属箔，得到一金属箔积层板，
其中，该第一含氟高分子溶液含有一第一含氟高分子，该第二含氟高分子溶液含有一第二含氟高分子，且该第一含氟高分子与该第二含氟高分子不相同。
“第一含氟高分子”或“第二含氟高分子”指含有氟原子的同元高分子(homopolymer)或共聚物(copolymer)，特定言之，是指具有多重强碳-氟键的氟碳系(fluorocarbon-based)高分子。一般而言，含氟高分子具有耐溶剂性、耐酸性、耐碱性等特性，且因具有强碳-氟键而具有优良的稳定性。此外，含氟高分子也具有优良的介电特性及宽广的使用温度范围，可应用于电子、化学、机械制造等多种工业或产业上。
具体言之，含氟高分子可为选自以下群组的单体的聚合物，或选自以下群组的单体与其他共单体的共聚物：四氟乙烯、三氟氯乙烯、二氟亚乙烯(vinylidene fluoride)、氟乙烯、全氟醚(perfluoroether)、四氟乙烯-全氟丙烯乙烯醚(tetrafluoroethylene-perfluoropropylene vinyl ether)、及三氟氯乙烯(chlorotrifluoroethylene)。共单体的实例包括但不限于：全氟甲基乙烯醚(perfluoro methyl vinyl ether)、全氟丙烯乙烯醚(perfluoro propylene vinyl ether)、六氟丙烯(hexafluoropropylene)、全氟丁基乙烯(perfluorobutyl ethylene)、乙烯、丙烯、及丁烯。含氟高分子的具体实例包括但不限于：PTFE、PFA、FEP、聚二氟亚乙烯(polyvinylidene fluoride，PVDF)、聚氟乙烯、聚三氟氯乙烯(polychloro trifluoroethylene，PCTFE)、全氟聚醚(perfluoropolyether，PFPE)、四氟乙烯-乙烯共聚物(ethylene-tetrafluroethylene，ETFE)、及三氟氯乙烯-乙烯共聚物(ethylene-chloro trifluoroethylene，ECTFE)。
于本发明方法中，第一含氟高分子不同于第二含氟高分子，其中第一含氟高分子作为积层板的介电层的主要成分，第二含氟高分子则用于提高积层板应用上的可行性。举例言之，于本发明的部分实施例中，第二含氟高分子的熔融温度低于第一含氟高分子的熔融温度，例如第一含氟高分子的熔融温度可为约325℃至约340℃，而第二含氟高分子的熔融温度可为约250℃至约320℃。在第二含氟高分子的熔融温度低于第一含氟高分子的熔融温度的情况下，第二含氟高分子在热压过程中的流胶(resin flow)特性将优于第一含氟高分子，由此可提高介电层与金属箔之间的黏着性能。于本发明的部分实施例中，使用PTFE作为第一含氟高分子，以及使用FEP、PFA、或其组合作为第二含氟高分子。
“补强材”指由纤维材料所构成的布状结构增强材料，例如织布(woven fabric)及不织布(non-woven fabric)。较佳地，用于构成补强材的纤维材料是具有较高热稳定性的材料，其实例包括但不限于E级玻璃纤维(E-glass fiber)、NE级玻璃纤维(NE-glassfiber)、S级玻璃纤维(S-glass fiber)、L级玻璃纤维(L-glass fiber)、D级玻璃纤维(D-glass fiber)、石英玻璃(quartz glass)、克维拉(Kevlar)、PTFE、芳香族聚酯(aromaticpolyester)、液晶高分子(LCP)等。于本发明的部分实施例中，使用由E级玻璃纤维所构成的E级玻璃纤维布作为补强材。
“金属箔”指由具有良好导电性的金属材料或合金材料所形成的金属薄片，其制备方式并无特殊限制，例如可通过锤打或轧延等机械加工方式形成。所述金属材料或合金材料的实例包括但不限于不锈钢、铜、铝、锌、铁、镍、金、银、过渡金属、及前述的两种或多种的合金材料。金属箔的表面可经粗化、未经粗化或经低度粗化，表面经粗化的金属箔的表面粗糙度(Ra)例如是约5微米至约10微米，表面未经粗化或经低度粗化的金属箔的表面粗糙度(Ra)例如是约0.1微米至约5微米，其中金属箔的表面粗糙度(Ra)测试标准可参照IPC-4562及IPC-TM-650。表面粗糙度通常是通过接触式(contact)或光学式(optical)表面量测仪(profilometer)所确定，例如Wyko光学式表面量测仪(Veeco公司提供)。以铜箔为例，依据铜箔的表面粗糙度(Ra)的不同，可分为高温延展(high temperature elongation，HTE)型铜箔(Ra为6微米至10微米)、箔反面处理(reversed treated foil，RTF)型铜箔(Ra为2微米至5微米)、极低粗糙度(very low profile，VLP；或very small profile，VSP)型铜箔(Ra小于2微米)、超极低粗糙度(hyper very low profile，HVLP)型铜箔(Ra小于1.5微米)等类型。较高的表面粗糙度虽可提高金属箔与含氟高分子介电层的附着力，但在高频化应用中，高表面粗糙度会不利地影响高频时的电学特性。因此，于本发明的部分实施例中，采用表面粗糙度(Ra)小于约5微米的低粗糙度(low profile)金属箔。
根据本发明的方法，为了达到所需的介电层厚度，在步骤(a)中，以第一含氟高分子溶液浸渍补强材的浸渍操作及相应的干燥操作可进行多次，例如可进行两次、三次、四次、五次等，以提供足够厚的介电层。类似地，为了应用上的需要，例如为了增强介电层与金属箔之间的黏着性能(即增加金属箔积层板的抗撕强度)，在步骤(b)中以第二含氟高分子溶液浸渍第一预浸渍体的浸渍操作及相应的干燥操作也可进行多次，例如可进行两次、三次、四次、五次等。
本发明方法形成金属箔积层板的介电层的步骤包括步骤(a)及步骤(b)。于步骤(a)中，经浸渍第一含氟高分子溶液的补强材是于第一温度下进行干燥，以移除溶剂从而形成第一预浸渍体，第一温度可为约300℃或更低的温度，例如约200℃、约210℃、约220℃、约230℃、约240℃、约250℃、约260℃、约270℃、约280℃、或约290℃。于步骤(b)中，第一预浸渍体接着进一步浸渍第二含氟高分子溶液，并于第二温度下进行干燥以形成第二预浸渍体，其中第二温度同样可于约300℃或更低的温度下进行，例如约200℃、约210℃、约220℃、约230℃、约240℃、约250℃、约260℃、约270℃、约280℃、或约290℃。第二预浸渍体随后与金属箔进行压合操作后即可得到金属箔积层板。因此，本发明方法的一个优点在于可以较低的工艺温度(例如约300℃或更低的温度)完成电子材料的介电层的制备，无须进行额外的高温熟成步骤(340℃或更高温的熟成步骤)，因此可适用于烘箱温度无法超过340℃的传统上胶机，应用范围更为广泛。
于本发明制造方法中，步骤(c)是第二预浸渍体与金属箔的压合操作。所述压合操作并无特殊限制，可以积层板技术领域或印刷电路板技术领域中常见的任何压合方式实施。于本发明的部分实施例中，采用高温压合机(如真空高温压合机)以约360℃至约395℃及3兆帕(MPa)至60兆帕的条件热压30至360分钟，但本发明方法并不以此为限。
第一含氟高分子溶液与第二含氟高分子溶液可各自进一步包含其他选用成分，例如填料、分散剂、增韧剂、黏度调整剂等，以改良所制金属箔积层板的物化性质或各含氟高分子溶液在金属箔积层板制造过程中的可加工性。举例言之，第一含氟高分子溶液与第二含氟高分子溶液可各自进一步含有选自以下群组的填料：二氧化硅、氧化铝、氧化镁、氢氧化镁、碳酸钙、滑石、黏土、氮化铝、氮化硼、氢氧化铝、碳化铝硅、碳化硅、碳酸钠、二氧化钛、氧化锌、氧化锆、石英、钻石、类钻石、石墨、煅烧高岭土、白岭土、云母、水滑石、中空二氧化硅、PTFE粉末、玻璃珠、陶瓷晶须、奈米碳管、奈米级无机粉体、及其组合。
第一含氟高分子溶液是通过将第一含氟高分子与其他选用成分溶解或分散于合适的溶剂中而制得，类似地，第二含氟高分子溶液是通过将第二含氟高分子与其他选用组分溶解或分散于合适的溶剂中而制得。所述溶剂可为任何可溶解或分散第一含氟高分子、第二含氟高分子及其他选用成分，但不与第一含氟高分子、第二含氟高分子及其他选用成分反应的惰性溶剂。所述溶剂的实例包含但不限于水、γ-丁内酯、甲乙酮、环己酮、丁酮、丙酮、二甲苯、甲基异丁基酮、N,N-二甲基甲酰胺(N,N-dimethyl formamide，DMF)、N,N-二甲基乙酰胺(N,N-dimethyl acetamide，DMAc)、N-甲基吡咯烷酮(N-methyl-pyrolidone，NMP)、二甲亚砜(dimethyl sulfoxide，DMSO)、四氢呋喃(tetrahydrofuran，THF)、碳酸二乙酯、碳酸伸丙酯、及六甲基磷酰胺(hexamethylphosphoramide，HMPA)，且各溶剂可单独使用或组合使用。溶剂的用量并无特殊限制，原则上只要能使第一含氟高分子、第二含氟高分子与其他选用成分均匀溶解或分散于其中即可。
本发明也提供一种由上述金属箔积层板的制造方法所制得的金属箔积层板。图2是根据本发明方法所制得的金属箔积层板的一个实施例的堆叠示意图(为使各组件独立且清晰地呈现，堆叠结构以分离形式表示)，其中以PTFE作为第一含氟高分子，以PFA作为第二含氟高分子，通过以下方式制备金属箔积层板2：以PTFE分散乳液(即，第一含氟高分子溶液)浸渍一玻璃纤维布(即，补强材)，并在约100℃至约300℃下烘烤以得到PTFE胶片21(即，第一预浸渍体)，随后以PFA分散乳液(即，第二含氟高分子溶液)浸渍PTFE胶片21，并在约100℃至约300℃下烘烤以得到带有PFA层22的PTFE胶片21(即，第二预浸渍体)，之后，再将带有PFA层22的PTFE胶片21与金属箔23进行热压，得到金属箔积层板2。
本发明还提供一种由上述金属箔积层板所制得的印刷电路板，其通过图案化金属箔积层板的外侧金属箔的单面或双面而制得。
以下列具体实施例进一步例示说明本发明，其中，所采用的量测仪器及方法分别如下：
[抗撕强度测试]
抗撕强度是指金属箔对经层合的预浸渍片的附着力而言，以1/8英寸宽度的铜箔自板面上垂直撕起，以其所需力量的大小来表达附着力的强弱。
[介电常数(Dk)与损耗因子(Df)量测]
根据ASTM D150规范，在工作频率10GHz下，计算金属箔积层板的介电常数(Dk)与损耗因子(Df)。
实施例
[铜箔积层板的制备]
<实施例1>
如表1所示，以PTFE分散乳液(型号：DISP 30，购自杜邦(DuPont)，PTFE固含量为60重量％)浸渍E级玻璃纤维布(1080型式)，随后在低温250℃下烘烤经浸渍的E级玻璃纤维布来干燥PTFE分散乳液，并重复以上浸渍与烘烤步骤，使得PTFE分散乳液的总浸渍次数为两次，由此得到PTFE胶片。接着，以PFA分散乳液(型号：PFA355D，购自杜邦，PFA固含量为60重量％)浸渍PTFE胶片，在200℃下烘烤经浸渍PFA分散乳液的PTFE胶片来干燥PFA分散乳液，并重复以上浸渍与烘烤步骤，使得PFA分散乳液的总浸渍次数为两次，由此得到经PFA涂覆的PTFE胶片。之后，在经PFA涂覆的PTFE胶片上下两侧各放置一片0.5盎司的HTE型铜箔(型号：PLS，购自长春(CCP))，通过真空高温压机于360℃及3兆帕(MPa)的条件下热压90分钟，由此得到铜箔积层板1。
<实施例2>
以与实施例1相同的方式制备铜箔积层板2，但是改在高温370℃下烘烤经浸渍的E级玻璃纤维布来干燥PTFE分散乳液，如表1所示。
<实施例3>
以与实施例1相同的方式制备铜箔积层板3，但是PFA分散乳液的总浸渍次数仅为一次，如表1所示。
<实施例4>
以与实施例3相同的方式制备铜箔积层板4，但是改在高温370℃下烘烤经浸渍的E级玻璃纤维布来干燥PTFE分散乳液，如表1所示。
<实施例5>
以与实施例1相同的方式制备铜箔积层板5，但是改使用0.5盎司的VLP型铜箔(低粗糙度铜箔)(型号：T9FZ，购自福田(Fukuda))，如表1所示。
<实施例6>
以与实施例5相同的方式制备铜箔积层板6，但是改在高温370℃下烘烤经浸渍的E级玻璃纤维布来干燥PTFE分散乳液，如表1所示。
<比较实施例1>
如表1所示，以PTFE分散乳液(型号：DISP 30)浸渍E级玻璃纤维布(1080型式)，随后在高温370℃下烘烤经浸渍的E级玻璃纤维布来干燥PTFE分散乳液，并重复以上浸渍与烘烤步骤，使得PTFE分散乳液的总浸渍次数为两次，由此得到PTFE胶片。接着，在PTFE胶片的上下两侧各放置一片PFA膜(型号：CHEMFILM，购自圣戈班(Saint Gobain))作为黏着层，并进行PFA膜的对位程序。之后，再于放置有PFA膜的PTFE胶片的上下两侧各放置一片0.5盎司的HTE型铜箔(型号：PLS)，通过真空高温压机于360℃及3兆帕的条件下热压90分钟，由此得到比较铜箔积层板1。
表1：铜箔积层板的制备
测量铜箔积层板1至6(树脂含量(resin content，RC)皆为85％)以及比较铜箔积层板1(树脂含量(RC)为85％)的抗撕强度、损耗因子(Df)及介电常数(Dk)，并将结果纪录于表2中。
表2：铜箔积层板的性质
如表2所示，本发明方法所制得的铜箔积层板1至6的电学性质与使用PFA膜作为黏着层(比较铜箔积层板1)的现有方法所制铜箔积层板的电学性质相当，且在PFA分散乳液总浸渍次数为一次的情况下，所制铜箔积层板(铜箔积层板3及4)的抗撕强度已达可接受的程度，尤其在PFA分散乳液总浸渍次数为两次的情况下，所制铜箔积层板的抗撕强度更是优于使用黏着层的现有方法所制的铜箔积层板(参铜箔积层板1及2与比较铜箔积层板1的比较)。此外，本发明方法即使采用低粗糙度的铜箔，所制铜箔积层板(铜箔积层板5及6)仍具有相当优异的抗撕强度。以上结果显示，本发明方法可在不另外进行黏着层贴合步骤的情况下，提供电学性质及抗撕强度优异的金属箔积层板。
上述实施例仅为例示性说明本发明的原理及其功效，并阐述本发明的技术特征，而非用于限制本发明的保护范畴。任何本领域技术人员在不违背本发明的技术原理及精神下，可轻易完成的改变或安排，均属本发明所主张的范围。因此，本发明的权利保护范围如权利要求书所列。

Claims (11)

1.一种金属箔积层板的制造方法，包含以下步骤：
(a)以一第一含氟高分子溶液浸渍一补强材，接着在第一温度下干燥该经浸渍的补强材，得到一第一预浸渍体；
(b)以一第二含氟高分子溶液浸渍该第一预浸渍体，接着在第二温度下干燥该经浸渍的第一预浸渍体，得到一第二预浸渍体；以及
(c)压合该第二预浸渍体与一金属箔，得到一金属箔积层板，
其特征在于，该第一含氟高分子溶液含有一第一含氟高分子，该第二含氟高分子溶液含有一第二含氟高分子，且该第一含氟高分子与该第二含氟高分子不相同。
2.如权利要求1所述的制造方法，其特征在于，该第二含氟高分子的熔融温度低于该第一含氟高分子的熔融温度。
3.如权利要求1所述的制造方法，其特征在于，该第一含氟高分子是聚四氟乙烯(polytetrafluoroethylene，PTFE)。
4.如权利要求1所述的制造方法，其特征在于，该第二含氟高分子选自以下群组：四氟乙烯-六氟丙烯共聚物(fluorinated ethylene propylene，FEP)、四氟乙烯-全氟烷基乙烯基醚共聚物(polyfluoroalkoxy，PFA)、及其组合。
5.如权利要求1至4中任一项所述的制造方法，其特征在于，第一温度不超过约300℃。
6.如权利要求1至4中任一项所述的制造方法，其特征在于，第二温度不超过约300℃。
7.如权利要求1至4中任一项所述的制造方法，其特征在于，于步骤(a)中，以该第一含氟高分子溶液浸渍该补强材的浸渍操作及相应的干燥操作进行至少两次。
8.如权利要求1至4中任一项所述的制造方法，其特征在于，于步骤(b)中，以该第二含氟高分子溶液浸渍该第一预浸渍体的浸渍操作及相应的干燥操作进行至少两次。
9.如权利要求1至4中任一项所述的制造方法，其特征在于，该金属箔是一低粗糙度(low profile)金属箔。
10.一种金属箔积层板，其特征在于，其是由如权利要求1至9中任一项所述的制造方法所制得。
11.一种印刷电路板，其特征在于，其是由如权利要求10所述的金属箔积层板所制得。
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