WO2003067667A1 - Structure de semiconducteur organique, procede de production et dispositif a semiconducteur organique - Google Patents
Structure de semiconducteur organique, procede de production et dispositif a semiconducteur organique Download PDFInfo
- Publication number
- WO2003067667A1 WO2003067667A1 PCT/JP2003/001339 JP0301339W WO03067667A1 WO 2003067667 A1 WO2003067667 A1 WO 2003067667A1 JP 0301339 W JP0301339 W JP 0301339W WO 03067667 A1 WO03067667 A1 WO 03067667A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- organic semiconductor
- liquid crystal
- electron
- ring
- rings
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 342
- 238000000034 method Methods 0.000 title description 30
- 230000008569 process Effects 0.000 title description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 173
- 239000000463 material Substances 0.000 claims abstract description 163
- 238000005979 thermal decomposition reaction Methods 0.000 claims abstract description 12
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 84
- 239000000758 substrate Substances 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 239000004990 Smectic liquid crystal Substances 0.000 claims description 18
- 229920001721 polyimide Polymers 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 3
- 230000005525 hole transport Effects 0.000 claims description 3
- 238000011161 development Methods 0.000 claims description 2
- 238000012546 transfer Methods 0.000 abstract description 12
- 229910052760 oxygen Inorganic materials 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 199
- 239000013078 crystal Substances 0.000 description 24
- 239000010408 film Substances 0.000 description 23
- 150000001875 compounds Chemical class 0.000 description 17
- 239000000126 substance Substances 0.000 description 10
- -1 polychloropyrene Substances 0.000 description 8
- 239000000470 constituent Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 230000001747 exhibiting effect Effects 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 4
- 239000002178 crystalline material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- IYDMICQAKLQHLA-UHFFFAOYSA-N 1-phenylnaphthalene Chemical group C1=CC=CC=C1C1=CC=CC2=CC=CC=C12 IYDMICQAKLQHLA-UHFFFAOYSA-N 0.000 description 3
- LLHYUTAZNLPRHF-UHFFFAOYSA-N 2-(5-dodecylthiophen-2-yl)-5-(5-hexylthiophen-2-yl)thiophene Chemical compound S1C(CCCCCCCCCCCC)=CC=C1C1=CC=C(C=2SC(CCCCCC)=CC=2)S1 LLHYUTAZNLPRHF-UHFFFAOYSA-N 0.000 description 3
- 229920001218 Pullulan Polymers 0.000 description 3
- 239000004373 Pullulan Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 125000004093 cyano group Chemical group *C#N 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 235000019423 pullulan Nutrition 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- IUSARDYWEPUTPN-OZBXUNDUSA-N (2r)-n-[(2s,3r)-4-[[(4s)-6-(2,2-dimethylpropyl)spiro[3,4-dihydropyrano[2,3-b]pyridine-2,1'-cyclobutane]-4-yl]amino]-3-hydroxy-1-[3-(1,3-thiazol-2-yl)phenyl]butan-2-yl]-2-methoxypropanamide Chemical compound C([C@H](NC(=O)[C@@H](C)OC)[C@H](O)CN[C@@H]1C2=CC(CC(C)(C)C)=CN=C2OC2(CCC2)C1)C(C=1)=CC=CC=1C1=NC=CS1 IUSARDYWEPUTPN-OZBXUNDUSA-N 0.000 description 2
- FCEHBMOGCRZNNI-UHFFFAOYSA-N 1-benzothiophene Chemical compound C1=CC=C2SC=CC2=C1 FCEHBMOGCRZNNI-UHFFFAOYSA-N 0.000 description 2
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 2
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004985 Discotic Liquid Crystal Substance Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- 125000004423 acyloxy group Chemical group 0.000 description 2
- 125000004414 alkyl thio group Chemical group 0.000 description 2
- 125000004104 aryloxy group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229940125807 compound 37 Drugs 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000013081 microcrystal Substances 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 125000001791 phenazinyl group Chemical group C1(=CC=CC2=NC3=CC=CC=C3N=C12)* 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- XSCHRSMBECNVNS-UHFFFAOYSA-N quinoxaline Chemical compound N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000010583 slow cooling Methods 0.000 description 2
- 230000007847 structural defect Effects 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 2
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical group C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- FLBAYUMRQUHISI-UHFFFAOYSA-N 1,8-naphthyridine Chemical group N1=CC=CC2=CC=CN=C21 FLBAYUMRQUHISI-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical group C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- 125000005955 1H-indazolyl group Chemical group 0.000 description 1
- MFJCPDOGFAYSTF-UHFFFAOYSA-N 1H-isochromene Chemical group C1=CC=C2COC=CC2=C1 MFJCPDOGFAYSTF-UHFFFAOYSA-N 0.000 description 1
- UXGVMFHEKMGWMA-UHFFFAOYSA-N 2-benzofuran Chemical compound C1=CC=CC2=COC=C21 UXGVMFHEKMGWMA-UHFFFAOYSA-N 0.000 description 1
- LYTMVABTDYMBQK-UHFFFAOYSA-N 2-benzothiophene Chemical group C1=CC=CC2=CSC=C21 LYTMVABTDYMBQK-UHFFFAOYSA-N 0.000 description 1
- XBHOUXSGHYZCNH-UHFFFAOYSA-N 2-phenyl-1,3-benzothiazole Chemical class C1=CC=CC=C1C1=NC2=CC=CC=C2S1 XBHOUXSGHYZCNH-UHFFFAOYSA-N 0.000 description 1
- MGADZUXDNSDTHW-UHFFFAOYSA-N 2H-pyran Chemical group C1OC=CC=C1 MGADZUXDNSDTHW-UHFFFAOYSA-N 0.000 description 1
- STBGWNRZMPCVTG-UHFFFAOYSA-N 4h-thiopyran Chemical group C1C=CSC=C1 STBGWNRZMPCVTG-UHFFFAOYSA-N 0.000 description 1
- KYNSBQPICQTCGU-UHFFFAOYSA-N Benzopyrane Chemical compound C1=CC=C2C=CCOC2=C1 KYNSBQPICQTCGU-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical group C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 229930184840 Phorbazole Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical group C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- JDPAVWAQGBGGHD-UHFFFAOYSA-N aceanthrylene Chemical group C1=CC=C2C(C=CC3=CC=C4)=C3C4=CC2=C1 JDPAVWAQGBGGHD-UHFFFAOYSA-N 0.000 description 1
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 description 1
- SQFPKRNUGBRTAR-UHFFFAOYSA-N acephenanthrylene Chemical group C1=CC(C=C2)=C3C2=CC2=CC=CC=C2C3=C1 SQFPKRNUGBRTAR-UHFFFAOYSA-N 0.000 description 1
- 125000000641 acridinyl group Chemical group C1(=CC=CC2=NC3=CC=CC=C3C=C12)* 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000004448 alkyl carbonyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000005577 anthracene group Chemical group 0.000 description 1
- 125000002908 as-indacenyl group Chemical group C1(=CC=C2C=CC3=CC=CC3=C12)* 0.000 description 1
- 125000003828 azulenyl group Chemical group 0.000 description 1
- 125000003785 benzimidazolyl group Chemical group N1=C(NC2=C1C=CC=C2)* 0.000 description 1
- 125000001164 benzothiazolyl group Chemical group S1C(=NC2=C1C=CC=C2)* 0.000 description 1
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 125000005578 chrysene group Chemical group 0.000 description 1
- 125000000259 cinnolinyl group Chemical group N1=NC(=CC2=CC=CC=C12)* 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 125000005583 coronene group Chemical group 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 125000003914 fluoranthenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC=C4C1=C23)* 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000003838 furazanyl group Chemical group 0.000 description 1
- DDTGNKBZWQHIEH-UHFFFAOYSA-N heptalene Chemical compound C1=CC=CC=C2C=CC=CC=C21 DDTGNKBZWQHIEH-UHFFFAOYSA-N 0.000 description 1
- 125000001633 hexacenyl group Chemical group C1(=CC=CC2=CC3=CC4=CC5=CC6=CC=CC=C6C=C5C=C4C=C3C=C12)* 0.000 description 1
- PKIFBGYEEVFWTJ-UHFFFAOYSA-N hexaphene Chemical group C1=CC=C2C=C3C4=CC5=CC6=CC=CC=C6C=C5C=C4C=CC3=CC2=C1 PKIFBGYEEVFWTJ-UHFFFAOYSA-N 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 125000003406 indolizinyl group Chemical group C=1(C=CN2C=CC=CC12)* 0.000 description 1
- 125000001041 indolyl group Chemical group 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 125000000904 isoindolyl group Chemical group C=1(NC=C2C=CC=CC12)* 0.000 description 1
- 125000002183 isoquinolinyl group Chemical group C1(=NC=CC2=CC=CC=C12)* 0.000 description 1
- ZLTPDFXIESTBQG-UHFFFAOYSA-N isothiazole Chemical group C=1C=NSC=1 ZLTPDFXIESTBQG-UHFFFAOYSA-N 0.000 description 1
- CTAPFRYPJLPFDF-UHFFFAOYSA-N isoxazole Chemical compound C=1C=NOC=1 CTAPFRYPJLPFDF-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000002971 oxazolyl group Chemical group 0.000 description 1
- 125000005704 oxymethylene group Chemical group [H]C([H])([*:2])O[*:1] 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- 125000005327 perimidinyl group Chemical group N1C(=NC2=CC=CC3=CC=CC1=C23)* 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- 238000000819 phase cycle Methods 0.000 description 1
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical group C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 1
- RDOWQLZANAYVLL-UHFFFAOYSA-N phenanthridine Chemical group C1=CC=C2C3=CC=CC=C3C=NC2=C1 RDOWQLZANAYVLL-UHFFFAOYSA-N 0.000 description 1
- 125000001484 phenothiazinyl group Chemical group C1(=CC=CC=2SC3=CC=CC=C3NC12)* 0.000 description 1
- 125000001644 phenoxazinyl group Chemical group C1(=CC=CC=2OC3=CC=CC=C3NC12)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- LFSXCDWNBUNEEM-UHFFFAOYSA-N phthalazine Chemical group C1=NN=CC2=CC=CC=C21 LFSXCDWNBUNEEM-UHFFFAOYSA-N 0.000 description 1
- 125000001388 picenyl group Chemical group C1(=CC=CC2=CC=C3C4=CC=C5C=CC=CC5=C4C=CC3=C21)* 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- CPNGPNLZQNNVQM-UHFFFAOYSA-N pteridine Chemical compound N1=CN=CC2=NC=CN=C21 CPNGPNLZQNNVQM-UHFFFAOYSA-N 0.000 description 1
- 125000003373 pyrazinyl group Chemical group 0.000 description 1
- 125000003226 pyrazolyl group Chemical group 0.000 description 1
- 125000005581 pyrene group Chemical group 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical group C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- 125000000714 pyrimidinyl group Chemical group 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 125000002294 quinazolinyl group Chemical group N1=C(N=CC2=CC=CC=C12)* 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000005268 rod-like liquid crystal Substances 0.000 description 1
- WEMQMWWWCBYPOV-UHFFFAOYSA-N s-indacene group Chemical group C1=CC=C2C=C3C=CC=C3C=C12 WEMQMWWWCBYPOV-UHFFFAOYSA-N 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- FHCPAXDKURNIOZ-UHFFFAOYSA-N tetrathiafulvalene Chemical group S1C=CSC1=C1SC=CS1 FHCPAXDKURNIOZ-UHFFFAOYSA-N 0.000 description 1
- GVIJJXMXTUZIOD-UHFFFAOYSA-N thianthrene Chemical group C1=CC=C2SC3=CC=CC=C3SC2=C1 GVIJJXMXTUZIOD-UHFFFAOYSA-N 0.000 description 1
- 125000000335 thiazolyl group Chemical group 0.000 description 1
- 238000002366 time-of-flight method Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 125000005580 triphenylene group Chemical group 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000001834 xanthenyl group Chemical group C1=CC=CC=2OC3=CC=CC=C3C(C12)* 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/731—Liquid crystalline materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/484—Insulated gate field-effect transistors [IGFETs] characterised by the channel regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
- H10K85/622—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene containing four rings, e.g. pyrene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
- H10K85/623—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene containing five rings, e.g. pentacene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
- H10K85/626—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene containing more than one polycyclic condensed aromatic rings, e.g. bis-anthracene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/652—Cyanine dyes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/654—Aromatic compounds comprising a hetero atom comprising only nitrogen as heteroatom
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/491—Vertical transistors, e.g. vertical carbon nanotube field effect transistors [CNT-FETs]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/655—Aromatic compounds comprising a hetero atom comprising only sulfur as heteroatom
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/656—Aromatic compounds comprising a hetero atom comprising two or more different heteroatoms per ring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/657—Polycyclic condensed heteroaromatic hydrocarbons
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to an organic semiconductor structure in which an organic semiconductor layer is formed using a liquid crystal organic semiconductor material, a method for manufacturing the same, and an organic semiconductor device.
- a typical example of a constituent element of an organic semiconductor device is a thin film transistor (also referred to as organic TFT) using an organic semiconductor as an active layer (hereinafter, referred to as an organic semiconductor layer).
- the organic semiconductor layer is formed by vacuum-forming a molecular crystal typified by Pensium Sen.
- Pensium Sen a molecular crystal typified by Pensium Sen.
- an organic semiconductor layer with a high charge mobility exceeding 1 cm 2 / Vs can be obtained by optimizing the film formation conditions (Y. -Y. Lin, DJ Gundlach, S. Nels on, and TN Jackson, "Stacked Pentacene Layer Organic Thin-Film Transistors with Improved Characteristics," IEEE Electron Device Lett. 18, June 06 (1997).
- the organic semiconductor layer formed by the above-described vacuum film formation is generally in a polycrystalline state in which microcrystals are aggregated, so that many grain boundaries are easily present and defects are easily generated. Inhibits charge transport. Therefore, when the organic semiconductor layer is formed by vacuum deposition, it has been practically difficult to continuously form the organic semiconductor layer, which is a constituent element of the organic semiconductor device, with a uniform performance over a sufficiently large area.
- Discotech liquid crystals are known as materials exhibiting high charge mobility (D. Adam, F. Closss, T. Frey, D. Funhoff, D. Haarer, H. Ringsdorf, P. Schunaher, and K. Siemensmyer, Phys. Rev. Lett., 70, 457 (1993)).
- charge is transported based on a one-dimensional charge transport mechanism along a columnar molecular alignment, and therefore strict control of molecular alignment is required.
- rod-like (rod-like) liquid crystalline materials such as phenyl benzothiazole derivatives also exhibit high charge mobility in the liquid crystal state (M. Funahashi and J. Hanna, Jpn. J. Appl. Phys., 35, L703-L705 (1996).).
- rod-shaped liquid crystalline material has several liquid crystal states, but the mobility of charges tends to increase as the structural regularity of the liquid crystalline material increases.
- the liquid crystalline material transitions to a crystalline state with higher structural regularity, the mobility of the charges is not reduced or observed, and the performance of the thin film transistor is not manifested.
- an organic semiconductor layer having uniform charge transfer characteristics over a large area can be formed by applying the organic semiconductor material.
- the organic semiconductor layer is formed, there is a problem that the mobility of the charge as low as 1 0- 5 ⁇ 1 0- 6 cm 2 / V ⁇ s, moreover temperature dependent and field dependence is.
- the present invention has solved the above-mentioned problems, and has provided an organic semiconductor structure formed by forming an organic semiconductor layer having a relatively large area and uniform and high charge transfer characteristics, which has been considered difficult in the past. It is intended to provide a manufacturing method and an organic semiconductor device. Disclosure of the invention
- an organic semiconductor structure of the present invention is an organic semiconductor structure having an organic semiconductor layer made of an oriented liquid crystalline organic semiconductor material, at least in part, wherein the liquid crystalline organic semiconductor material is , L 67 ⁇ -electron rings, M 8 ⁇ -electron rings, N ⁇ ⁇ ⁇ -electron rings, 0 1 2 ⁇ -electron rings, P 14- ⁇ -electron rings, Q 16 16-electron rings, R 1 87 T-electron rings, S 2 0 7-electron rings, T 2 2-electron rings, U 2 4-electron rings, V 2 6 electron systems ⁇ (L, M, N, 0, P, Q, R, S, T, Us V each represent an integer of 0 to 6, L + M +
- It is composed of three compounds, and has at least one kind of liquid crystal state at a temperature below the thermal decomposition temperature.
- the organic semiconductor layer is made of the liquid crystalline organic semiconductor material that
- the organic semiconductor layer is laminated in a state of being in contact with a liquid crystal alignment layer, so that the liquid crystalline organic semiconductor material is oriented in a specific direction or direction.
- a polyimide-based material That they are laminated and aligned on a liquid crystal alignment layer made of, that they are laminated and aligned on a liquid crystal alignment layer made of a curable resin having fine irregularities on the surface, or that fine irregularities are formed. Consists of curable resin on the surface It is preferably formed on a substrate.
- an organic semiconductor structure is an organic semiconductor structure including an organic semiconductor layer and a liquid crystal alignment layer, wherein the organic semiconductor layer has at least one temperature at a predetermined temperature equal to or lower than a thermal decomposition temperature. It is composed of a liquid crystalline organic semiconductor material having various kinds of liquid crystal states, and at least a part of the liquid crystalline organic semiconductor material is oriented and crystallized by being in contact with the liquid crystal alignment layer.
- the organic semiconductor layer has a liquid crystal organic semiconductor having a terminal structure (also referred to as a terminal group) exhibiting liquid crystal properties at an end (both ends or one end). Since it is formed of a material, molecular orientation is spontaneously realized by the self-organization of the liquid crystalline organic semiconductor material, and has a crystal-like orientation. As a result, excellent charge transport characteristics such as molecular crystals can be exhibited. When a liquid crystalline organic semiconductor material having a higher smectic liquid crystal phase is used, an organic semiconductor layer having extremely high crystallinity can be formed.
- the organic semiconductor material having a liquid crystal state has fluidity at a temperature at which the liquid crystal state is maintained, it can be applied in the liquid crystal state, and thereafter can be brought into the above-mentioned crystalline state. As a result, a large-area organic semiconductor layer having uniform charge transfer characteristics can be formed.
- the organic semiconductor layer formed of a liquid crystalline organic semiconductor material has high crystallinity due to molecular orientational order and extremely small intermolecular distance, so that it exhibits excellent charge transfer characteristics due to hopping conduction. Can be.
- liquid crystal molecules can be formed so as to be oriented in a specific direction or direction by appropriately selecting the means for orienting the liquid crystal organic semiconductor material. And electrical characteristics can be exhibited.
- a method for producing an organic semiconductor structure includes a step of temporarily bringing the liquid crystalline organic semiconductor material into a liquid crystal state by passing or maintaining a liquid crystal development temperature of the liquid crystalline organic semiconductor material. Cooling the liquid crystalline organic semiconductor material in a liquid crystal state to orient and crystallize the liquid crystalline organic semiconductor material.
- the liquid crystal organic semiconductor material is a liquid crystal material having fluidity at a temperature at which a liquid crystal state is maintained.
- An organic semiconductor device is an organic semiconductor device including a substrate, a gate electrode, a gate insulating layer, an organic semiconductor layer, a drain electrode, and a source electrode.
- 6-electron rings, M 8-electron rings, N ⁇ ⁇ -electron rings, 0 1 2 ⁇ -electron rings, 11 4 7 ⁇ -electron rings, and Q 16 ⁇ Electronic system ⁇ , R 18 ⁇ Electronic ring, S 207 ⁇ Electronic ring, 22 27 ⁇ Electronic ring, U 247 4Electronic ring, V 26 ⁇ electron system ring (however, L, M, N, 0, P, Q, R, S, T, U, and V each represent an integer of 0 to 6, and L + M + N + 0 + P + Q + R + S + T + U + V 1 to 6.) It is made of a liquid crystalline organic semiconductor material having a core containing: In the organic semiconductor device of the present invention, if the orientation direction of the liquid
- the orientation of the liquid crystalline organic semiconductor material is determined by forming an orientation film on the surface on which the organic semiconductor material is to be formed (referred to as a surface to be formed, for example, the surface of a gate insulating layer, etc.) It can be performed by making a form in contact with the treated layer.
- the organic semiconductor molecules in the liquid crystalline organic semiconductor material are orthogonal to the thickness direction of the drain electrode and the source electrode formed on the gate insulating layer, and It is preferable that the electrodes are arranged in a row between the drain electrode and the source electrode. Further, it is preferable that the organic semiconductor molecules in the liquid crystalline organic semiconductor material are oriented in parallel in the thickness direction of the drain electrode and the source electrode formed on the gate insulating layer. According to these inventions, the liquid crystal molecules in the liquid crystal organic semiconductor material can be formed so as to be oriented in a specific direction or direction, and specific functions or electrical characteristics corresponding to the direction or direction in which the liquid crystal molecules are oriented can be exhibited. be able to.
- the organic semiconductor material has a smectic liquid crystal property at a predetermined temperature equal to or lower than a thermal decomposition temperature, and has a charge mobility of 10 to 5 cm 2 / V ′. s or more, or a hole transport mobility of 10 to 5 cm 2 / V ⁇ s or more.
- FIG. 1 shows the results of measuring the photoconductivity of an organic semiconductor layer formed by forming an organic semiconductor material on a substrate that has not been subjected to an orientation treatment.
- FIG. 2 shows the measurement results of the photoconductivity of the organic semiconductor layer formed on the substrate on which the organic semiconductor material has been subjected to the alignment treatment.
- FIG. 3 is a sectional view showing an example of the organic semiconductor device of the present invention.
- FIG. 4 is a sectional view showing another example of the organic semiconductor device of the present invention.
- the organic semiconductor structure of the present invention has, at least in part, an organic semiconductor layer made of an aligned liquid crystalline organic semiconductor material (hereinafter, also simply referred to as “organic semiconductor material”). Further, in the method for producing an organic semiconductor structure of the present invention, a liquid crystalline organic semiconductor material forming an organic semiconductor layer is cooled to a crystalline state after being maintained at a temperature at which a liquid crystal state is formed.
- organic semiconductor material also simply referred to as “organic semiconductor material”.
- the organic semiconductor layer is made of an oriented liquid crystalline organic semiconductor material.
- the organic semiconductor layer is formed on an alignment layer for aligning the molecular alignment in the liquid crystal phase, on a base that has been subjected to alignment processing for that purpose, or in contact with an electrode and a layer having alignment ability.
- the layer having the electrode and the alignment ability may be a layer formed subsequent to the formation of the organic semiconductor layer.
- Organic semiconductor materials include L 6-electron rings, M 8 ⁇ -electron rings, ⁇ 1 ⁇ electron ring, 0 1 2 ⁇ electron rings, ⁇ 14 ⁇ electron rings, Q 167 ⁇ electron rings, R 187 ⁇ electron rings, S 20-electron rings, ⁇ 22 ⁇ electron system ring, U 247 ⁇ electron system ring, and V 267 ⁇ electron system ring are part of the skeletal structure (this is also called “coa”). It is preferably made of an organic compound having a terminal structure exhibiting liquid crystallinity (this is also referred to as a “terminal group”). With these structures, an organic semiconductor layer having a characteristic of exhibiting high charge transport characteristics by self-organization can be formed.
- the 67-electron ring includes, for example, a benzene ring, a furan ring, a thiophene ring, a pyrrolyl group, a 2H-pyran ring, a 4H-thiopyran ring, a pyridine ring, and an oxazole ring.
- Len ring, indene ring, indolizine ring, and 4H-quinolidine ring can be mentioned.
- Examples of the 107-electron ring include naphthylene ring, azulene ring, benzofuran ring, isobenzofuran, and 1-benzothiophene.
- Examples of the 147T electron system ring include a phenanthrene ring, an anthracene ring, a phorbazole ring, a xanthene ring, an acridine ring, a phenanthridine ring, a perimidine ring, a 1,10-phenanthone ring, a phenazine ring, and a phenazine ring.
- 16-electron system ring examples include a fluoranthene ring, an acephenanthrylene ring, an aceanthrylene, a pyrene ring, a thianthrene ring, a phenoxatiin ring, a phenoxazine ring, and a phenothiazine ring.
- Examples of the ⁇ electron system ring include a triphenylene ring, a chrysene ring, a naphthocene ring, and a preyaden ⁇ , and examples of the 2 ⁇ electron system ring include a perylene ring;
- the 2 2 ⁇ electron system ring includes, for example, a picene ring, a Pennen phen ring, and a Pennen ring, and the 2 4 ⁇ electron system includes, for example, tetrahedral; ⁇ nylene ⁇ , coronene ring
- Examples of the 267-electron ring include, for example, a hexaphen ring, a hexacene ring, and a rubycene ring. That.
- R 1 and R 2 in the above formula represent the following terminal structures, and R 3 represents a trifluoromethyl group, an alkyl group, a nitro group, a halogen atom or a hydrogen atom, all of which may be the same or different. May be.
- X represents CH or N
- Y represents S or 0.
- terminal structure of R 1 and R 2 include, at one end of a rigid skeleton structure, one of H (hydrogen atom), a halogen atom, a cyano group, a nitro group, and a hydroxyl group, and the other end.
- H hydrogen atom
- a halogen atom a cyano group
- a nitro group a nitro group
- a hydroxyl group a substituted or unsubstituted alkyl group
- substituted or unsubstituted alkylthio group or a substituted or unsubstituted alkoxyl group, or a substituted or unsubstituted alkoxycarbonyl group, or a substituted or unsubstituted alkyl carbonyl group.
- substituent in this case examples include a halogen atom, a cyano group, a sulfo group, an alkoxycarbonyl group, an alkoxy group, a hydroxy group, an aryloxy group, an acyloxy group, an aryl group, and an acyl group. it can.
- a substituted or unsubstituted alkyl group a substituted or unsubstituted alkylthio group, a substituted or unsubstituted alkoxyl group, a substituted or unsubstituted alkoxycarbonyl group, or a substituted or unsubstituted alkyl group Those having a rubonyl group are exemplified.
- substituents in this case include those having a structure such as a halogen atom, a cyano group, a sulfo group, an alkoxycarbonyl group, an alkoxy group, a hydroxy group, an aryloxy group, an acyloxy group, an aryl group, and an acyl group.
- This organic semiconductor material has at least one type of Has a liquid crystal state.
- the expression “at a temperature equal to or lower than the thermal decomposition temperature” means that the organic semiconductor material itself is not thermally decomposed. The pyrolysis temperature depends on the organic semiconductor material applied and accordingly.
- “at least one type of liquid crystal state” means that at least one type of liquid crystal state is used even when an organic semiconductor material having a plurality of liquid crystal states or an organic semiconductor material having a portion that is not a liquid crystal state is applied. It means that what you have is used.
- a smectic (hereinafter, also referred to as Sm) liquid crystal described below has a plurality of liquid crystal states such as SmA phase, SmB phase, SmC phase, SmD phase, and so on. It must have at least one kind of liquid crystal state.
- the organic semiconductor material of the present invention is adopted in consideration of the charge transfer characteristics and the characteristics required for the organic semiconductor structure to be manufactured.
- An organic semiconductor material is selected.
- the characteristics that are the selection criteria include that the charge mobility 1 0- 5 cm 2 / V ⁇ s or more.
- Liquid crystals are materials having a self-organizing action.
- smectic liquid crystals are spontaneously realized in molecular orientation and formed with a high orientational order like crystals.
- An organic semiconductor layer formed by having a smectic liquid crystal property can exhibit excellent charge transport properties such as molecular crystals.
- the higher the order of the organic semiconductor layer formed of a smectic liquid crystal the more the molecules are orientated and exhibit a high degree of orientation like a crystal. It has a remarkable effect that excellent charge transfer characteristics can be exhibited.
- liquid crystalline organic semiconductor material having a phenylnaphthalene skeleton and represented by the following chemical formula 36 can also be exemplified.
- Organic semiconductor layer formed Te Confucius, charge mobility 10- 5 ⁇ 5 x 10 - can have a 2 cm 2 / V ⁇ s, obtaining an organic semiconductor layer with excellent charge transport properties.
- This compound is in a crystalline state below 56 ° C. Therefore, the compound is heated to a temperature of 57 to 88 ° C, which is a temperature at which the liquid crystal phase (SmF phase) can be maintained or passed, and then gradually cooled at a rate of 0.1 to 1.0 ° C / min. To 56 ° C or less. As a result, the compound can be brought into a crystalline state while maintaining a favorable orientation state.
- the charge mobility 10- 5 ⁇ 5 X 1 O ⁇ cm 2, V - have s, it is possible to obtain an excellent organic semiconductor layer to the charge transport properties.
- liquid crystalline organic semiconductor material having a thiophene skeleton represented by the following chemical formula 38 can also be exemplified.
- This compound is in a crystalline state below 54 ° C. Therefore, the compound is brought to a temperature of 55 to 84 ° C, which is the temperature at which the liquid crystal phase (SmB phase) can be maintained or passed, and then gradually cooled at a rate of 0.1 to 1.0 ° C / min. To below 54 ° C. As a result, the compound can be brought into a crystalline state while maintaining a favorable orientation state.
- the charge mobility 10- ⁇ ⁇ 5 X 10- 3 cm 2 / V - have s, it is possible to obtain an organic semiconductor layer with excellent charge transport properties.
- a liquid crystalline organic semiconductor material having a phenylpentazothiazole skeleton represented by the following chemical formula 39 can also be exemplified.
- This compound is in a crystalline state below 90 ° C. Therefore, this compound is heated to a temperature of 91 to 100 ° C, which is the temperature at which the liquid crystal phase (SmA phase) can be maintained or passed, and then gradually cooled at a rate of 0.1 to 1.0 ° C / min. To 90 ° C or less. As a result, this compound can be brought into a crystalline state while maintaining a favorable orientation state.
- the charge mobility 10- 6 ⁇ 5 X 10- 3 cm Z / V - have s, it is possible to obtain an organic semiconductor layer with excellent charge transport properties.
- materials suitable for the present invention can be selected from the materials described in JP-A-9-316442 and US Pat. No. 5,766,510.
- the characteristics of the above-mentioned liquid crystalline organic semiconductor material are that it is capable of “bipolar transport” for transporting both electron and hole charges, and that the charge transfer is the same in the liquid crystal phase state. Is less dependent on the electric field strength and temperature.
- a temperature at which the liquid crystalline organic semiconductor material becomes a crystalline phase and a temperature at which the liquid crystalline phase can be maintained or passed depending on the type of the liquid crystalline organic semiconductor material used to form the organic semiconductor layer.
- the organic semiconductor material is formed at a temperature at which the liquid crystal phase can be maintained or decomposed, and then slowly cooled at a rate of 0.1 to 1.0 ° C./min to form a crystal phase.
- Temperature the temperature at which the liquid crystalline organic semiconductor material can maintain or pass through the liquid crystal phase varies depending on the type, but in the present invention, at least one type of liquid crystal is used below the thermal decomposition temperature of each organic semiconductor material.
- Any liquid crystalline organic semiconductor material having a state may be used.
- the slow cooling rate is less than 0.1 ° C / min, the required time will be too long, which is inconvenient. If the slow cooling rate exceeds 1.0 ° C / min, the charge due to rapid volume shrinkage of the crystal phase will occur. This results in the occurrence of structural defects in transportation, which is not preferable.
- a method for forming an organic semiconductor material on a surface to be formed at a temperature at which a liquid crystal phase (a phase composed of a liquid crystal state) can be maintained or passed is to apply the organic semiconductor material to the surface to be formed in a liquid crystal state. After that, it is gradually cooled to a crystalline state, or an organic semiconductor material is formed on a surface to be formed by vapor deposition (including a PVC method or a CVD method), and then heated to a temperature at which a liquid crystal phase is exhibited. After passing through a phase, and then gradually cooled to a crystalline state.
- the organic semiconductor material described above since the organic semiconductor material described above has fluidity at a temperature that maintains a liquid crystal state, it can be applied in the liquid crystal state and then slowly cooled to a crystalline state. According to this method, a large-area organic semiconductor layer having uniform charge transfer characteristics can be formed very easily.
- various coating methods and printing methods can be applied.
- the term “crystalline phase or crystalline state” means that a liquid crystalline organic semiconductor material is in an aggregated state at a liquid crystal-single-crystal phase transition temperature or lower.
- the liquid crystal molecules are oriented in a certain direction or direction by the orientation means described later, so that the liquid crystal molecules are regularly arranged like molecular crystals, and
- the average value of the intermolecular distance is also 0.3 to 0.4 nm, and the interval can be made extremely small.
- the organic semiconductor layer in which the crystal state having such an intermolecular distance is formed has an effect that the electron correlation between molecules is extremely large, the hopping probability of the carrier is large, and high charge transport characteristics are exhibited.
- the liquid crystal molecules having a smectic liquid crystal of the above formula 3 5 the average value of the intermolecular distance is 0.3 to 0.4 in the case of nm, the charge mobility 1 0 3 to 1 0 -High charge transport properties of 2 cm 2 / V ⁇ s.
- the above-described organic semiconductor layer is formed in a state of being in contact with the liquid crystal alignment layer, and is formed of a liquid crystal organic semiconductor material which is anisotropically aligned in a specific direction by this contact formation.
- a liquid crystal alignment means an alignment layer is provided so as to be in contact with the organic semiconductor layer.
- Conductive material is anisotropically oriented.
- a liquid crystal alignment layer is formed on a surface on which a liquid crystalline organic semiconductor material is formed (for example, a surface to be formed; for example, a surface of a gate insulating layer described later), or an alignment process such as a rubbing process is performed. Alternatively, it can be carried out by means of contact with a layer that has been subjected to an orientation treatment.
- the liquid crystal molecules of the liquid crystal organic semiconductor material can be formed so as to be oriented in a specific direction or direction, so that specific functionalities and electrical characteristics according to the direction or direction of the alignment are exhibited. be able to.
- the liquid crystal organic semiconductor material is laminated and aligned on the liquid crystal alignment layer made of polyimide-based material, and the liquid crystal organic semiconductor material is formed on the liquid crystal alignment layer made of the curable resin having fine irregularities on the surface. It is preferable that they are laminated and oriented, or that they are formed on a substrate made of a curable resin having fine irregularities on the surface.
- liquid crystal alignment layer various liquid crystal alignment layers can be applied.
- a polyimide material is applied and then subjected to a rubbing treatment, and a curable resin having fine irregularities is used.
- the liquid crystal alignment layer and the substrate are made of a curable resin having fine irregularities, and the substrate is made of a resin. It is also possible to orient liquid crystal molecules by an electric field, a magnetic field, or the like.
- a typical example of the liquid crystal alignment layer is obtained by applying a rubbing treatment after applying a polyimide resin.
- Other materials include resin materials such as acrylic, polychloropyrene, polyethylene terephthalate, polyoxymethylene, polyvinyl chloride, polyvinylidene fluoride, cyanoethyl pullulan, polymethyl methacrylate, polysulfone, polycarbonate, and polyimide. Can be listed. Note that these materials can be classified into those having a vertical alignment ability and those having a horizontal alignment ability with respect to the liquid crystal depending on the type.
- Application specific Examples of the method include a spin coating method, a casting method, and a lifting method.
- Such a liquid crystal alignment layer can be provided between the substrate and the organic semiconductor layer or in an overcoat layer on the organic semiconductor layer.
- the resin made of a curable resin having minute irregularities include, for example, forming a layer made of a curable resin and rubbing the surface of the layer to form irregularities, or to form an uncured curable resin. It can be formed by pressing a shaping member capable of shaping minute irregularities on the surface of the resin, and then curing the resin layer. Fine irregularities are formed on the surface of the curable resin thus obtained, and the liquid crystal molecules of the liquid crystal organic semiconductor material can be arranged in that direction.
- the curable resin include an acrylic ultraviolet curable resin, a fluorine ultraviolet curable resin, and the like. At this time, it is particularly preferable that the liquid crystal alignment layer made of a curable resin having fine irregularities is integrated with the substrate.
- the minute irregularities consist of minute grooves with uniform directions.
- the depth of the groove in the uneven portion is about 0.01 to 1.0 ⁇ 111, preferably about 0.03 to 0.3 zm, and the width is about 0.05 to 1.0 / m.
- the pitch between adjacent grooves is about 0.1 to 2.0 zm. If the depth of the groove is less than 0.01 zm, the liquid crystal molecules cannot be aligned properly. If the depth exceeds 1.0 zm, the alignment of the liquid crystal may be disturbed at the edge of the groove. If the width of the groove is less than 0.05 ⁇ m, it is difficult to fabricate the groove, and if the width exceeds 1.0 zm, the alignment force at the center of the groove may decrease. Further, if the groove formation pitch is less than 0.1 m, it is difficult to form the groove, and if it exceeds 2.0 m, the alignment of the liquid crystal tends to be disordered.
- a substrate, a liquid crystal alignment layer, and an organic semiconductor layer may be sequentially laminated, and as a second embodiment of the liquid crystal alignment layer,
- the third embodiment of the liquid crystal alignment layer includes a substrate, an organic semiconductor layer, and a liquid crystal alignment layer.
- the third embodiment of the liquid crystal alignment layer includes a substrate, a liquid crystal alignment layer, an organic semiconductor layer, and a liquid crystal alignment layer.
- the organic semiconductor layer is configured to be in contact with the layer subjected to the alignment treatment, so that the liquid crystal molecules constituting the liquid crystal organic semiconductor material have high alignment properties. Can be granted.
- Figure 1 shows the results obtained by forming an organic semiconductor layer made of an organic semiconductor material having a phenylnaphthylene skeleton on a substrate that is not subjected to an orientation treatment, and measuring the photoconductivity of the obtained organic semiconductor layer.
- Fig. 1 (A) shows the photoconductivity measurement results in the liquid crystal phase (90 ° C, SmB phase), and
- Fig. 1 (B) shows the photoconductivity in the crystal phase (65 ° C). This is the measurement result of conductivity. Without orientation treatment, almost no photoconductivity was obtained due to the effect of crystal grain boundaries (structural defects) in the crystal phase.
- FIG. 2 shows that an organic semiconductor layer made of an organic semiconductor material having a phenylnaphthalene skeleton is formed on a substrate, and the organic semiconductor material is gradually cooled after being brought into a liquid crystal state, and subjected to a directing treatment.
- the photoconductivity of the obtained organic semiconductor layer was measured.
- the orientation treatment was performed, high photoconductivity was obtained even in a crystalline state.
- a larger photocurrent is observed than in the smectic layer.
- IS0 is an isotropic phase
- SmA is a smectic A phase
- SmB is a smectic B phase
- K is a crystal phase.
- the crystalline phase of the rod-shaped organic semiconductor material having liquid crystal properties has high charge mobility, and the organic semiconductor structure using this has high performance.
- Such organic semiconductor structures For example, a transistor, an organic EL, a solar cell, a sensor, etc., as an organic semiconductor device having the above, can exhibit unprecedentedly high performance. In particular, when used for an organic EL device, high polarized light emission due to molecular orientation can be exhibited.
- a rod-shaped organic semiconductor material having liquid crystal properties itself shows electorescence, but by introducing a side chain into an organic substance that can be a luminescent center and adding it to a liquid crystal organic semiconductor as a base material.
- the positional relationship between the charge transfer path of the organic semiconductor and the organic substance in the center of light emission can be controlled, and the luminous efficiency can be improved.
- the organic semiconductor device 101 of the present invention comprises at least a substrate 11, a gate electrode 12, a gate insulating layer 13, and an organic semiconductor layer 1 made of an oriented liquid crystalline organic semiconductor material. 4. Consists of a drain electrode 15 and a source electrode 16.
- the organic semiconductor layer 14 is formed of the organic semiconductor material constituting the organic semiconductor structure of the present invention described above.
- a gate electrode 12, a gate insulating layer 13, an oriented organic semiconductor layer 14 made of a liquid crystal organic semiconductor material, a drain electrode 15 and a source electrode 16 are formed on a substrate 11.
- One example is a coplanar structure in which an organic semiconductor layer 14 made of a semiconductor material and a protective film (not shown) are arranged in this order.
- the organic semiconductor device 101 having such a configuration responds to the polarity of the voltage applied to the gate electrode 12. It operates in either the accumulation state or the depletion state.
- the substrate 11 can be selected from a wide range of materials as long as it is an insulating material. Examples include inorganic materials such as glass and sintered alumina, and various insulating materials such as polyimide films, polyester films, polyethylene films, polyphenylene sulfide films, and polyparaxylene films. In particular, when a film made of a polymer compound is used, a lightweight and flexible organic semiconductor device can be manufactured, which is extremely useful. Note that the thickness of the substrate 11 applied in the present invention is about 25 mm to 1.5 mm.
- the gate electrode 12 is preferably an electrode made of an organic material such as polyaniline or polythiophene or an electrode formed by applying a conductive ink. Since these electrodes can be formed by applying an organic material or a conductive ink, there is an advantage that the electrode forming process is extremely simple. Specific methods of the coating method include a spin coating method, a casting method, a lifting method, and the like.
- a metal film is formed as an electrode
- an existing vacuum film forming method can be used, and specifically, a mask film forming method or a photolithographic method can be used.
- metals such as gold, platinum, chromium, palladium, aluminum, indium, molybdenum, and nickel, alloys using these metals, polysilicon, amoris silicon, tin oxide, indium oxide, indium tin Inorganic materials such as oxides (ITO) can be mentioned as materials for forming electrodes. Further, two or more of these materials may be used in combination.
- the thickness of the gate electrode depends on the conductivity of the material, but is preferably about 50 to 100 nm.
- the lower limit of the thickness of the gate electrode varies depending on the conductivity of the electrode material and the adhesion strength to the underlying substrate.
- the upper limit of the thickness of the gate electrode is such that when the gate insulating layer and the source / drain electrode pair described later are provided, the insulating coating with the gate insulating layer at the step between the base substrate and the gate electrode is sufficient, and It is necessary that the electrode pattern to be formed does not cause disconnection.
- flexible substrates When used, the balance of stress must be considered.
- the gate insulating layer 13 is preferably formed by applying an organic material in the same manner as the gate electrode 12 described above.
- the organic material used include poly (propylene), polyethylene terephthalate, and poly (ethylene terephthalate). Examples thereof include oxymethylene, polyvinyl chloride, polyvinylidene fluoride, cyanoethyl pullulan, polymethyl methacrylate, polysulfone, polycarbonate, polyimide and the like.
- Specific methods of the coating method include a spin coating method, a casting method, a lifting method, and the like.
- it may be one formed by using the conventional pattern process such as CVD, in its case, S I_ ⁇ 2, S i N x, inorganic materials such as A 1 2 0 3 is preferably used. Further, two or more of these materials may be used in combination.
- the thickness of the gate insulating layer is preferably about 50 to 300 nm.
- the withstand voltage at this time is desirably 2 MV / cm or more.
- the drain electrode 15 and the source electrode 16 are formed of a metal having a large work function.
- the reason for this is that, in the liquid crystal organic semiconductor material described later, since the carrier for transporting charges is a hole, it is necessary that the organic semiconductor layer 14 is in intimate contact with the organic semiconductor layer 14.
- the work function here is the potential difference required to extract electrons in a solid to the outside, and is defined as the value obtained by dividing the energy difference between the vacuum level and the Fermi level by the amount of charge.
- a preferable work function is about 4.6 to 5.2 eV, and specific examples thereof include gold, platinum, and a transparent conductive film (such as indium tin oxide and indium zinc oxide).
- the transparent conductive film can be formed by a sputtering ring method or an electron beam (EB) evaporation method.
- the thickness of the drain electrode 15 and the source electrode 16 applied in the present invention is about 50 to: L 0 0 nm.
- the organic semiconductor layer 14 is a layer formed of an oriented liquid crystalline organic semiconductor material.
- the oriented liquid crystal organic semiconductor material is formed into a crystalline state. Specific organic semiconductor materials are as described above.
- the alignment treatment of the organic semiconductor material, the liquid crystal alignment layer, and the like are also as described above. That is, in the present invention, since a liquid crystalline organic semiconductor material is used, the liquid crystalline molecules are oriented in a certain direction or direction by the above-described alignment treatment.
- the organic semiconductor layer 14 that has been subjected to the orientation treatment to have a crystal phase has no cracks or the like as compared with conventionally known organic semiconductor layers, and has a disadvantage such as a reduction in the charge transport speed due to such cracks. It has an excellent effect of not occurring.
- the orientation of the liquid crystal molecules is as follows: (i) As shown in FIG. 3, the direction perpendicular to the thickness direction of the drain electrode 15 and the source electrode 16 formed on the gate insulating layer 13 and A mode in which it is oriented so as to be arranged in a row between the drain electrode 15 and the source electrode 16, or (ii) as shown in FIG. 4, a drain electrode 15 formed on the gate insulating layer 13 and Examples include a mode in which the source electrode 16 is oriented in parallel to the film thickness direction.
- adjacent rod-like liquid crystalline molecules are arranged so that the intermolecular distance is about 0.3 to 0.4 nm as described above.
- the in-plane direction of the Sm layer where the intermolecular distance is small and the interplane direction perpendicular to the Sm layer where the intermolecular distance is 3 nm or more are large.
- a large anisotropy appears in the charge transport characteristics.
- Such anisotropy of the charge transport property is based on the fact that the molecular orientation is spontaneously realized by the self-assembly of the liquid crystalline organic semiconductor material, and the material is formed with crystal-like orientation.
- the organic semiconductor layer thus formed has a characteristic effect that a uniform large-area organic semiconductor layer without defects can be formed.
- the organic semiconductor layer can be formed by examining a liquid crystalline organic semiconductor material, an alignment treatment, and the like at any time so as to obtain such a characteristic value.
- the organic semiconductor layer 14 has such a charge transport speed. For example, there is an advantage that it can contribute to a reduction in the driving voltage of the organic thin film transistor and an improvement in the response speed.
- the gate insulating layer or the substrate is subjected to a rubbing treatment so that the orientation processing film, the gate insulating layer or the substrate, Can be integrated.
- the thickness of the orientation control layer is desirably in a range (0.5 to 1 nm) that does not prevent ohmic contact between the drain electrode 15 and the source electrode 16 and the organic semiconductor layer 14. It is desirable that the organic semiconductor device 101 be provided with an interlayer insulating layer.
- the interlayer insulating layer is formed for the purpose of preventing contamination of the surface of the gate electrode 12 when the drain electrode 15 and the source electrode 16 are formed on the gate insulating layer 13. Therefore, the interlayer insulating layer is formed on the gate insulating layer 13 before forming the drain electrode 15 and the source electrode 16. Then, after the source electrode 15 and the drain electrode 16 are formed, processing is performed so as to completely or partially remove the portion located above the channel region. It is desirable that the interlayer insulating layer region to be removed is equal to the size of the gate electrode 12.
- S i O, S i N x, A 1 2 0 3 or the like inorganic materials of or, polychloroprene, polyethylene terephthalate evening rate, polyoxymethylene, polyvinyl chloride Lai de, Porifudzu of Organic materials such as vinylidene, cyanoethyl pullulan, polymethyl methacrylate, polysulfone, polycarbonate, polyimide and the like can be mentioned.
- Substrate Z gate electrode / gate insulating layer also serves as liquid crystal alignment layer
- source / drain electrode / liquid crystalline organic semiconductor layer (/ protective layer)
- substrate / gate electrode / gate insulating layer also serves as liquid crystal alignment layer
- Substrate Z gate electrode / gate insulating layer also serves as liquid crystal alignment layer
- liquid crystalline organic semiconductor layer / substrate with source / drain electrode patterned also serves as protective layer
- V substrate / source / drain electrode / liquid crystalline organic semiconductor layer / gate insulating layer (also serves as liquid crystal alignment layer) / gate electrode / substrate (also serves as protective layer), or
- the structure of the organic semiconductor device was formed as a substrate / gate electrode / gate insulating layer (also serving as a liquid crystal alignment layer) Z source / drain electrode Liquid crystalline organic semiconductor layer (/ protective layer).
- a liquid crystalline organic semiconductor material was formed on a glass substrate, then heated to a liquid crystal phase to be in a liquid crystal state, and then gradually cooled to a crystalline phase.
- a glass substrate (thickness: 1.1 mm, Corning: 173 7) ultrasonically cleaned using a neutral detergent, pure water, acetone, and IPA in this order was used.
- the gate electrode is on the substrate to form A u (thickness 3 0 0 nm) strip-like pattern (electrode width 1 0 0 / m, 5 mm between the electrodes) of the by resistance heating vapor deposition through a metal mask (The same electrode pattern can be formed by patterning the IT0 electrode by a wet process.
- a photosensitive polyimide (Toray: 109 samples of UR-3140, diluted with 25 g of n-methylpyrrolidone) is spin-coated, dried at 100 ° C, and exposed to light to develop the gate electrode. The terminals were exposed. After baking at a maximum temperature of 350 ° C, a gate insulating layer with a thickness of 30 Onm was formed.
- the surface of the polyimide film thus formed was rubbed (polyester wrapped around a 48 mm roller was used as a rubbing cloth, and subjected to orientation treatment at 1200 rpm and a substrate moving speed of 600 mm / min).
- the rubbing direction was parallel to the channel length direction (charge transport direction) and perpendicular to the channel length direction.
- the liquid crystalline organic semiconductor material used in this embodiment is horizontally aligned with respect to this alignment treatment, and therefore, the charge transport anisotropy (molecular long axis direction, uniaxial direction) due to the liquid crystal alignment direction.
- the difference in the charge transport characteristics in different directions) was compared on the TFT characteristics.
- Au was formed as a source / drain electrode pad (channel length 50 10m, channel width 4mm) by resistance heating evaporation using a metal mask (electrode thickness 10 On m). A1 was used as an electrode line extending from the source and drain electrode pads.
- Liquid crystalline organic semiconductor layer Liquid crystalline organic semiconductor layer
- liquid crystalline organic semiconductor material 6-TTP-12 represented by Chemical Formula 37 was used as the liquid crystalline organic semiconductor material.
- This liquid crystalline organic semiconductor material was formed by resistance heating evaporation using a metal mask in such a way that a channel was formed between the source and drain with a rectangular pattern of 4 mm x 100 mm formed above. .
- After obtaining a 50-nm-thick organic semiconductor layer it was heated to 60 ° C. to be transferred to a liquid crystal phase. Thereafter, the film was cooled at a rate of 0.1 ° C./min to obtain a functional film of a crystalline phase which maintained a good alignment state derived from the alignment state of the liquid crystal phase.
- This organic semiconductor device was in a microcrystalline state immediately after fabrication (Comparative Example 1), and after a phase transition to a liquid crystal phase by raising the temperature to 60 ° C, at a rate of 0.1 ° C / min.
- a device (Example 1), which was gradually cooled to form a crystal phase, was manufactured. Then, for each element, a voltage is applied in the range of source-drain voltage Vds: 0 30 V, gate voltage Vg: 0 to 130 V, and source-drain current 1 ds is equal to gate voltage Vg. The behavior changing by the application was measured and evaluated.
- the device of Comparative Example 1 did not pass through the liquid crystal phase. In the device, no remarkable change in the drain current depending on the gate voltage was observed in the above-mentioned measured voltage range.
- the device of Example 1 is a device having a crystal phase via the liquid crystal phase, and the absolute value of the gate voltage is increased under a constant Vds condition within the above measurement range.
- the drain current increases with increasing the absolute value of the applied voltage between the source and the drain under the condition that the gate voltage is kept constant, and the absolute value of the applied voltage between the source and the drain also increases. As the value was increased, the drain current in the so-called organic transistor reached the saturation region.
- the device of Comparative Example 1 corresponding to the conventional method could not obtain a high-speed charge transport phenomenon and good transistor characteristics even in a crystalline phase.
- the devices of the examples according to the present invention have a good charge mobility and can be realized by an extremely simple method as compared with conventional organic transistors exhibiting high mobility.
- the organic semiconductor layer As for the charge mobility, a value of 5 ⁇ 10 ⁇ 5 cm 2 / V ⁇ s or less was obtained based on Vg and Vds in the saturation region of the drain current and the structure of the device of Example 1. This value is smaller than that of an element rubbed in the “channel width direction” described above.
- the hopping site related to the charge transport of the liquid crystalline organic semiconductor material used is an overlap of conjugated systems in the skeletal structure in the material molecules, whereas the terminal group used in this example was It is considered that the anisotropic alkyl chain acts as an insulating layer between the molecular arrangements of the skeletal structure as a conductive path, so that the same material has realized anisotropy in conductive properties according to the molecular arrangement direction of the organic semiconductor.
- the channel length is determined by using Sio 2 formed on the gate insulating layer with a thickness of 10 Onm.
- a source electrode and a drain electrode are formed so as to have a thickness of 50 / m and a channel width of 4 mm, and 6-TPP-12 shown in Compound 37 is used as an organic semiconductor layer;
- Example 2 a device in a microcrystalline state immediately after fabrication (Comparative Example 2), After a phase transition to a liquid crystal phase by raising the temperature to 60 ° C., the device was gradually cooled at a rate of 0.1 ° C./min to obtain a crystal phase (Example 2). Then, for each element, a voltage is applied in the range of the source-drain voltage Vds: 0 to 130 V and the gate voltage Vg: 0 to 130 V, and the current Ids between the source and the drain is gained. The behavior that changes with the application of the scanning voltage Vg was measured and evaluated.
- the device of Example 2 is a device having a crystal phase via a liquid crystal phase, and exhibits transistor characteristics as in the case of (a) described above, and the charge of the organic semiconductor layer.
- a value of 2 to 4 ⁇ 10 ⁇ 4 cm 2 / V ⁇ s was obtained as the mobility, indicating that an organic transistor can be easily realized by the present invention.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/502,529 US7102154B2 (en) | 2002-02-08 | 2003-02-07 | Organic semiconductor structure, process for producing the same, and organic semiconductor device |
JP2003566906A JP4857519B2 (ja) | 2002-02-08 | 2003-02-07 | 有機半導体構造物、その製造方法、および有機半導体装置 |
AU2003207185A AU2003207185A1 (en) | 2002-02-08 | 2003-02-07 | Organic semiconductor structure, process for producing the same, and organic semiconductor device |
EP03703270A EP1482561B1 (en) | 2002-02-08 | 2003-02-07 | A process for producing an organic semiconductor structure |
KR1020047011958A KR100943362B1 (ko) | 2002-02-08 | 2003-02-07 | 유기반도체 구조물, 그 제조방법 및, 유기반도체 장치 |
US11/390,667 US7638795B2 (en) | 2002-02-08 | 2006-03-28 | Organic semiconductor structure, process for producing the same, and organic semiconductor device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002032722 | 2002-02-08 | ||
JP2002-032722 | 2002-02-08 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10502529 A-371-Of-International | 2003-02-07 | ||
US11/390,667 Division US7638795B2 (en) | 2002-02-08 | 2006-03-28 | Organic semiconductor structure, process for producing the same, and organic semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003067667A1 true WO2003067667A1 (fr) | 2003-08-14 |
Family
ID=27677978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/001339 WO2003067667A1 (fr) | 2002-02-08 | 2003-02-07 | Structure de semiconducteur organique, procede de production et dispositif a semiconducteur organique |
Country Status (7)
Country | Link |
---|---|
US (2) | US7102154B2 (ja) |
EP (1) | EP1482561B1 (ja) |
JP (1) | JP4857519B2 (ja) |
KR (1) | KR100943362B1 (ja) |
CN (1) | CN100459164C (ja) |
AU (1) | AU2003207185A1 (ja) |
WO (1) | WO2003067667A1 (ja) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005093955A (ja) * | 2003-09-19 | 2005-04-07 | Dainippon Printing Co Ltd | 有機半導体素子及びその製造方法 |
JP2005117042A (ja) * | 2003-10-10 | 2005-04-28 | Samsung Electronics Co Ltd | 表面凸凹構造によって向上した電荷移動度を有する有機薄膜トランジスタ |
JP2005142233A (ja) * | 2003-11-04 | 2005-06-02 | Yamanashi Tlo:Kk | 液晶化合物薄膜の配向制御方法及びこれを用いて形成された液晶化合物薄膜の膜構造、薄膜トランジスタ並びに有機エレクトロルミネッセンス素子 |
JP2005142526A (ja) * | 2003-11-04 | 2005-06-02 | Lucent Technol Inc | 大きな有機半導体結晶を有するデバイスおよび該デバイスを作製する方法 |
JP2005167256A (ja) * | 2003-12-04 | 2005-06-23 | Lucent Technol Inc | 高密度化層で形成された能動チャネルを有する有機電界効果トランジスタ |
JP2005277204A (ja) * | 2004-03-25 | 2005-10-06 | Mitsubishi Chemicals Corp | 有機電界効果トランジスタ |
JP2005294530A (ja) * | 2004-03-31 | 2005-10-20 | Dainippon Printing Co Ltd | 有機半導体構造物、その製造方法及び有機半導体装置 |
JP2005294603A (ja) * | 2004-03-31 | 2005-10-20 | Dainippon Printing Co Ltd | 有機半導体構造物、その製造方法及び有機半導体装置 |
JP2005294785A (ja) * | 2004-03-31 | 2005-10-20 | Dainippon Printing Co Ltd | 有機半導体装置 |
JP2006156983A (ja) * | 2004-10-29 | 2006-06-15 | Semiconductor Energy Lab Co Ltd | 半導体装置とその作製方法 |
JP2006210920A (ja) * | 2005-01-29 | 2006-08-10 | Samsung Sdi Co Ltd | 薄膜トランジスタ及びそれを備えた平板表示装置 |
JP2006339473A (ja) * | 2005-06-03 | 2006-12-14 | Dainippon Printing Co Ltd | 有機半導体層の形成方法、有機半導体構造物及び有機半導体装置 |
WO2009093606A1 (ja) * | 2008-01-22 | 2009-07-30 | Dai Nippon Printing Co., Ltd. | 有機半導体素子の製造方法 |
WO2009122956A1 (ja) * | 2008-03-31 | 2009-10-08 | 住友化学株式会社 | 有機半導体組成物、並びに有機薄膜及びこれを備える有機薄膜素子 |
WO2011052721A1 (ja) * | 2009-10-29 | 2011-05-05 | 大日精化工業株式会社 | 有機半導体材料、有機半導体薄膜および有機薄膜トランジスタ |
US8134144B2 (en) * | 2005-12-23 | 2012-03-13 | Xerox Corporation | Thin-film transistor |
KR101147262B1 (ko) * | 2005-06-20 | 2012-05-18 | 엘지디스플레이 주식회사 | 유기 박막 트랜지스터 소자 및 그의 제조 방법 |
JP2013021189A (ja) * | 2011-07-12 | 2013-01-31 | Dainippon Printing Co Ltd | 有機半導体素子の製造方法および有機半導体素子 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100459164C (zh) * | 2002-02-08 | 2009-02-04 | 大日本印刷株式会社 | 有机半导体结构物、其制造方法和有机半导体装置 |
JP4343516B2 (ja) * | 2002-10-31 | 2009-10-14 | 大日本印刷株式会社 | 有機半導体材料と有機半導体素子の製造方法 |
JP2004260119A (ja) * | 2003-02-27 | 2004-09-16 | Dainippon Printing Co Ltd | 有機半導体材料 |
JP4945885B2 (ja) * | 2004-03-31 | 2012-06-06 | 大日本印刷株式会社 | 有機半導体材料、有機半導体装置、装置、及び有機半導体構造物の製造方法 |
KR100615237B1 (ko) * | 2004-08-07 | 2006-08-25 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 그의 제조방법 |
JP4349307B2 (ja) * | 2005-03-16 | 2009-10-21 | セイコーエプソン株式会社 | 有機半導体装置の製造方法、有機半導体装置、電子デバイスおよび電子機器 |
KR20060116534A (ko) * | 2005-05-10 | 2006-11-15 | 삼성에스디아이 주식회사 | 박막 트랜지스터, 그 제조 방법 및 이를 구비한 평판 표시장치 |
JP4934995B2 (ja) * | 2005-06-03 | 2012-05-23 | 大日本印刷株式会社 | 有機半導体材料、有機半導体構造物及び有機半導体装置 |
US7521710B2 (en) * | 2006-02-16 | 2009-04-21 | Idemitsu Kosan Co., Ltd. | Organic thin film transistor |
CN100555702C (zh) * | 2006-04-29 | 2009-10-28 | 中国科学院长春应用化学研究所 | 有机半导体晶体薄膜及弱取向外延生长制备方法和应用 |
US20090184347A1 (en) * | 2006-05-24 | 2009-07-23 | Nissan Chemical Industries, Ltd. | Coating liquid for gate insulating film, gate insulating film and organic transistor |
US20080311738A1 (en) * | 2007-06-18 | 2008-12-18 | Lakshmi Supriya | Method of forming an interconnect joint |
EP2893548A1 (en) * | 2012-09-07 | 2015-07-15 | HaWilKo GmbH | Nano Granular Materials (NGM) material, methods and arrangements for manufacturing said material and electrical components comprising said material |
KR101478125B1 (ko) | 2014-03-21 | 2015-01-05 | 경북대학교 산학협력단 | 트랜지스터, 및 이의 제조 방법 |
JP6873034B2 (ja) * | 2014-08-18 | 2021-05-19 | クラップ カンパニー リミテッドClap Co., Ltd. | 結晶性有機半導体材料の製造方法 |
WO2016047587A1 (ja) * | 2014-09-25 | 2016-03-31 | 富士フイルム株式会社 | 有機電界効果トランジスタ、有機半導体結晶の製造方法、及び、有機半導体素子 |
CN111799361B (zh) * | 2020-06-12 | 2024-04-02 | 深圳大学 | 液晶碳纳米管复合热电材料及其制备方法 |
US20220045274A1 (en) * | 2020-08-06 | 2022-02-10 | Facebook Technologies Llc | Ofets having organic semiconductor layer with high carrier mobility and in situ isolation |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08181364A (ja) * | 1994-12-21 | 1996-07-12 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
EP0786820A2 (en) * | 1996-01-29 | 1997-07-30 | Motorola, Inc. | Organic thin film transistor with enhanced carrier mobility |
US5766510A (en) * | 1995-08-25 | 1998-06-16 | Dai Nippon Printing Co., Ltd. | Liquid crystalline compound and use thereof |
JP2001075297A (ja) * | 1998-07-13 | 2001-03-23 | Dainippon Printing Co Ltd | 強誘電性液晶性電荷輸送材料 |
US6224787B1 (en) * | 1997-03-10 | 2001-05-01 | Dai Nippon Printing Co., Ltd. | Liquid crystalline charge transport material |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0983040A (ja) * | 1995-09-12 | 1997-03-28 | Sharp Corp | 薄膜トランジスタ及びその製造方法 |
JPH09116163A (ja) * | 1995-10-23 | 1997-05-02 | Sharp Corp | 電界効果トランジスタ及びその製造方法 |
JPH09316442A (ja) | 1996-03-25 | 1997-12-09 | Dainippon Printing Co Ltd | 液晶性電荷輸送材料 |
US6107117A (en) * | 1996-12-20 | 2000-08-22 | Lucent Technologies Inc. | Method of making an organic thin film transistor |
JPH10312711A (ja) | 1997-03-10 | 1998-11-24 | Dainippon Printing Co Ltd | 液晶性電荷輸送材料 |
JP3472189B2 (ja) * | 1999-04-08 | 2003-12-02 | キヤノン株式会社 | キャリア輸送素子及び発光素子 |
US6723394B1 (en) * | 1999-06-21 | 2004-04-20 | Cambridge University Technical Services Limited | Aligned polymers for an organic TFT |
JP2001291594A (ja) * | 2000-04-07 | 2001-10-19 | Canon Inc | 導電性液晶素子 |
CN100459164C (zh) | 2002-02-08 | 2009-02-04 | 大日本印刷株式会社 | 有机半导体结构物、其制造方法和有机半导体装置 |
US7847284B2 (en) * | 2002-03-26 | 2010-12-07 | Dai Nippon Printing Co., Ltd. | Organic semiconductor material, organic semiconductor structure, and organic semiconductor device |
JP4343516B2 (ja) * | 2002-10-31 | 2009-10-14 | 大日本印刷株式会社 | 有機半導体材料と有機半導体素子の製造方法 |
JP4945885B2 (ja) * | 2004-03-31 | 2012-06-06 | 大日本印刷株式会社 | 有機半導体材料、有機半導体装置、装置、及び有機半導体構造物の製造方法 |
JP4668544B2 (ja) * | 2004-03-31 | 2011-04-13 | 大日本印刷株式会社 | 有機半導体材料、有機半導体構造物及び有機半導体装置 |
-
2003
- 2003-02-07 CN CNB038035545A patent/CN100459164C/zh not_active Expired - Fee Related
- 2003-02-07 US US10/502,529 patent/US7102154B2/en not_active Expired - Fee Related
- 2003-02-07 AU AU2003207185A patent/AU2003207185A1/en not_active Abandoned
- 2003-02-07 EP EP03703270A patent/EP1482561B1/en not_active Expired - Fee Related
- 2003-02-07 WO PCT/JP2003/001339 patent/WO2003067667A1/ja active Application Filing
- 2003-02-07 JP JP2003566906A patent/JP4857519B2/ja not_active Expired - Fee Related
- 2003-02-07 KR KR1020047011958A patent/KR100943362B1/ko not_active IP Right Cessation
-
2006
- 2006-03-28 US US11/390,667 patent/US7638795B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08181364A (ja) * | 1994-12-21 | 1996-07-12 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
US5766510A (en) * | 1995-08-25 | 1998-06-16 | Dai Nippon Printing Co., Ltd. | Liquid crystalline compound and use thereof |
EP0786820A2 (en) * | 1996-01-29 | 1997-07-30 | Motorola, Inc. | Organic thin film transistor with enhanced carrier mobility |
US6224787B1 (en) * | 1997-03-10 | 2001-05-01 | Dai Nippon Printing Co., Ltd. | Liquid crystalline charge transport material |
JP2001075297A (ja) * | 1998-07-13 | 2001-03-23 | Dainippon Printing Co Ltd | 強誘電性液晶性電荷輸送材料 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1482561A4 * |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005093955A (ja) * | 2003-09-19 | 2005-04-07 | Dainippon Printing Co Ltd | 有機半導体素子及びその製造方法 |
JP2005117042A (ja) * | 2003-10-10 | 2005-04-28 | Samsung Electronics Co Ltd | 表面凸凹構造によって向上した電荷移動度を有する有機薄膜トランジスタ |
US8450723B2 (en) | 2003-11-04 | 2013-05-28 | Alcatel Lucent | Apparatus having an aromatic dielectric and an aromatic organic semiconductor including an alkyl chain |
JP2005142233A (ja) * | 2003-11-04 | 2005-06-02 | Yamanashi Tlo:Kk | 液晶化合物薄膜の配向制御方法及びこれを用いて形成された液晶化合物薄膜の膜構造、薄膜トランジスタ並びに有機エレクトロルミネッセンス素子 |
JP2005142526A (ja) * | 2003-11-04 | 2005-06-02 | Lucent Technol Inc | 大きな有機半導体結晶を有するデバイスおよび該デバイスを作製する方法 |
JP2005167256A (ja) * | 2003-12-04 | 2005-06-23 | Lucent Technol Inc | 高密度化層で形成された能動チャネルを有する有機電界効果トランジスタ |
JP2005277204A (ja) * | 2004-03-25 | 2005-10-06 | Mitsubishi Chemicals Corp | 有機電界効果トランジスタ |
JP2005294530A (ja) * | 2004-03-31 | 2005-10-20 | Dainippon Printing Co Ltd | 有機半導体構造物、その製造方法及び有機半導体装置 |
JP2005294785A (ja) * | 2004-03-31 | 2005-10-20 | Dainippon Printing Co Ltd | 有機半導体装置 |
JP2005294603A (ja) * | 2004-03-31 | 2005-10-20 | Dainippon Printing Co Ltd | 有機半導体構造物、その製造方法及び有機半導体装置 |
JP4736340B2 (ja) * | 2004-03-31 | 2011-07-27 | 大日本印刷株式会社 | 有機半導体構造物、その製造方法及び有機半導体装置 |
JP2006156983A (ja) * | 2004-10-29 | 2006-06-15 | Semiconductor Energy Lab Co Ltd | 半導体装置とその作製方法 |
JP2006210920A (ja) * | 2005-01-29 | 2006-08-10 | Samsung Sdi Co Ltd | 薄膜トランジスタ及びそれを備えた平板表示装置 |
JP2006339473A (ja) * | 2005-06-03 | 2006-12-14 | Dainippon Printing Co Ltd | 有機半導体層の形成方法、有機半導体構造物及び有機半導体装置 |
JP4673135B2 (ja) * | 2005-06-03 | 2011-04-20 | 大日本印刷株式会社 | 有機半導体層の形成方法 |
KR101147262B1 (ko) * | 2005-06-20 | 2012-05-18 | 엘지디스플레이 주식회사 | 유기 박막 트랜지스터 소자 및 그의 제조 방법 |
US8134144B2 (en) * | 2005-12-23 | 2012-03-13 | Xerox Corporation | Thin-film transistor |
US8202759B2 (en) | 2008-01-22 | 2012-06-19 | Dai Nippon Printing Co., Ltd. | Manufacturing method of organic semiconductor device |
WO2009093606A1 (ja) * | 2008-01-22 | 2009-07-30 | Dai Nippon Printing Co., Ltd. | 有機半導体素子の製造方法 |
WO2009122956A1 (ja) * | 2008-03-31 | 2009-10-08 | 住友化学株式会社 | 有機半導体組成物、並びに有機薄膜及びこれを備える有機薄膜素子 |
CN101981722B (zh) * | 2008-03-31 | 2012-11-07 | 住友化学株式会社 | 有机半导体组合物以及有机薄膜和具有该有机薄膜的有机薄膜元件 |
US8492750B2 (en) | 2008-03-31 | 2013-07-23 | Sumitomo Chemical Company, Limited | Organic semiconductor composition, organic thin film and organic thin film element provided with organic thin film |
WO2011052721A1 (ja) * | 2009-10-29 | 2011-05-05 | 大日精化工業株式会社 | 有機半導体材料、有機半導体薄膜および有機薄膜トランジスタ |
JP5665137B2 (ja) * | 2009-10-29 | 2015-02-04 | 大日精化工業株式会社 | 有機半導体材料、有機半導体薄膜および有機薄膜トランジスタ |
US9133193B2 (en) | 2009-10-29 | 2015-09-15 | Dainichiseika Color & Chemicals Mfg. Co., Ltd. | Organic semiconductor material, organic semiconductor thin film, and organic thin film transistor |
JP2013021189A (ja) * | 2011-07-12 | 2013-01-31 | Dainippon Printing Co Ltd | 有機半導体素子の製造方法および有機半導体素子 |
Also Published As
Publication number | Publication date |
---|---|
US20060166396A1 (en) | 2006-07-27 |
US20050156161A1 (en) | 2005-07-21 |
CN1630948A (zh) | 2005-06-22 |
CN100459164C (zh) | 2009-02-04 |
KR100943362B1 (ko) | 2010-02-18 |
EP1482561A1 (en) | 2004-12-01 |
KR20040081171A (ko) | 2004-09-20 |
EP1482561B1 (en) | 2012-03-28 |
JPWO2003067667A1 (ja) | 2005-06-02 |
JP4857519B2 (ja) | 2012-01-18 |
US7638795B2 (en) | 2009-12-29 |
AU2003207185A1 (en) | 2003-09-02 |
US7102154B2 (en) | 2006-09-05 |
EP1482561A4 (en) | 2009-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4857519B2 (ja) | 有機半導体構造物、その製造方法、および有機半導体装置 | |
JP4774679B2 (ja) | 有機半導体装置 | |
Chen et al. | Morphological and transistor studies of organic molecular semiconductors with anisotropic electrical characteristics | |
US7470561B2 (en) | Organic semiconductor material, organic semiconductor structure, and organic semiconductor device | |
US7135702B2 (en) | Organic semiconductor structure, manufacturing method of the same, and organic semiconductor device | |
US7605396B2 (en) | Field effect type organic transistor and process for production t hereof | |
KR101003624B1 (ko) | 유기반도체 재료, 유기반도체 구조물 및, 유기반도체 장치 | |
JP2006339474A (ja) | 有機半導体材料、有機半導体構造物及び有機半導体装置 | |
JP4343566B2 (ja) | 有機半導体材料、有機半導体構造物、および、有機半導体装置 | |
JP2004179249A (ja) | 有機半導体材料及びそれを用いた有機電子デバイス、及び有機電子デバイスの製造方法 | |
JP4867135B2 (ja) | 有機半導体構造物の製造方法 | |
JP4673135B2 (ja) | 有機半導体層の形成方法 | |
Nakano et al. | Bulk mobility of polycrystalline thin films of quaterthiophene derivatives | |
JP4471571B2 (ja) | 有機半導体素子、有機半導体装置、有機エレクトロルミネッセンス素子および有機エレクトロルミネッセンス装置 | |
Yasuda et al. | Conjugation-length dependency of unsubstituted oligo-p-phenylenevinylenes on the performance of organic field-effect transistors | |
JP4934995B2 (ja) | 有機半導体材料、有機半導体構造物及び有機半導体装置 | |
JP2006060169A (ja) | 電界効果型トランジスタ及びその製造方法 | |
JP2005072200A (ja) | 電界効果型有機トランジスタ | |
HANNA et al. | Liquid Crystals as an Organic Semiconductor for Printed Electronics | |
JP2006049775A (ja) | 電界効果型有機トランジスタ及びその製造方法 | |
飯野裕明 et al. | Liquid Crystalline Materials for Organic Polycrystalline Field Effect | |
JP2006049776A (ja) | 電界効果型有機トランジスタ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2003566906 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10502529 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020047011958 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 20038035545 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2003703270 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 2003703270 Country of ref document: EP |