WO2003060010A1 - Composition de copolyimide sequence soluble dans le solvant et procede de preparation associe - Google Patents
Composition de copolyimide sequence soluble dans le solvant et procede de preparation associe Download PDFInfo
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- WO2003060010A1 WO2003060010A1 PCT/JP2003/000252 JP0300252W WO03060010A1 WO 2003060010 A1 WO2003060010 A1 WO 2003060010A1 JP 0300252 W JP0300252 W JP 0300252W WO 03060010 A1 WO03060010 A1 WO 03060010A1
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- polyimide
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- methyl
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1021—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the catalyst used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
- C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
Definitions
- the present invention relates to a solvent-soluble polyimide composition.
- Polyimide has excellent heat resistance, electrical insulation, mechanical properties, and chemical resistance, and is therefore widely used in electrical, electronic components, semiconductors, communication devices and their circuit components, and peripheral devices.
- the polyimide resin Since the polyimide resin is hardly soluble in organic solvents, it was necessary to convert it into a polyamic acid in a polar solvent, and then heat and dehydrate to form a film.
- solvent-soluble polyimides have been discovered and used as coatings, alignment films for liquid crystals, and insulating films for flexible substrates.
- Polar solvents such as N-methylpyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, and dimethylsulfoxide are used as solvents for dissolving polyimide.
- Polyimide varnishes and polyimide inks using these non-aqueous solvents have a problem that when used in an environment where the relative humidity exceeds 50%, the surfaces of the obtained films and molded products become white.
- Heating or drying a whitened film, molded product, etc. not only does not yield the polyimide's original tough film, but also fails to provide the original electrical and other characteristics.
- the solvent used to dissolve the polyimide Polyar solvents such as N-methylpyrrolidone, N, N-dimethylformamide, and dimethylsulfoxide have high water absorption, and absorb large amounts of moisture in the air. It is believed to be the cause. Therefore, when using a polyimide resin dissolved in these solvents in the coating process, it was necessary to devise measures such as blowing dry air or nitrogen gas into the coating device, or covering the coating device to prevent moisture from entering from the surroundings. .
- the receiver such as the filtration device or bottle must be dried air or nitrogen. Replace with gas or prevent moisture from entering from surroundings It was necessary to devise a device such as covering it.
- the film whitened due to the influence of moisture during the coating process may become transparent after pre-baking, but the photoacid generator, such as naphthoquinonediazide, is altered by water absorption and the sensitivity changes. There is a problem in the work.
- the whitened film has a problem that not only the polyimide's original tough film cannot be obtained, but also the original characteristics such as electric characteristics cannot be obtained.
- An object of the present invention is to provide a block copolymer polyimide composition that is soluble in a solvent and does not cause a whitening phenomenon due to the influence of moisture in the air and the like.
- Another object of the present invention is to provide a positive photosensitive polyimide which does not swell with an aqueous alkali solution used as a developer, has high resolution performance, and has excellent reliability. Disclosure of the invention
- the present invention relates to a block copolymerized polyimide composition, in which a block copolymerized polyimide obtained from tetracarboxylic dianhydride and diamine is dissolved in a solvent comprising at least one selected from ketones, ethers and esters. Is a block copolymer polyimide composition.
- the block copolymerized polyimide is prepared by mixing tetracarboxylic dianhydride and diamine in a solvent consisting of at least one selected from ketones, ethers and esters with ratatatone and a base.
- the above block copolymerized polyimide composition which is a polyimide obtained by heating in the presence of the above catalyst.
- tetracarboxylic dianhydride is 3.3 ', 4,4'-biphenyltetracarboxylic dianhydride (BPDA), 3.3'.4,4'-benzophenonetetracarboxylic dianhydride (BTDA), 3, 3 ', 4, 4'-biphenyl ether tetracarboxylic dianhydride (OPDA), 3, 3', 4, 4'-diphenyl sulfone tetracarbonic dianhydride (DSDA), Bicyclo (2.2, 2)
- Diamine is silicondiamine, bis (3-aminopropyl) ether ethane, 3,3 'diamino-4,4'dihydroxydiphenylsulfone (S ⁇ 2-HOA B), 4,4' diamino-1-3.3 'dihydroxy Biphenyl (HOAB), 2,
- DAB ⁇ 2,6-diaminopyridine
- DAPy 2,6-diaminopyridine
- (FDA) The above-mentioned block copolymer polyimide composition comprising at least one member selected from the group consisting of (FDA).
- the ketones are methyl ethyl ketone, methyl propyl ketone, methyl isopropyl ketone, methyl butyl ketone, methyl isobutyl ketone, methyl n-hexyl ketone, getyl ketone, diisopropyl ketone, diisobutyl ketone, cyclopentanone, cyclohexanone
- the block copolymer polyimide composition is at least one selected from the group consisting of: methylcyclohexanone, acetylacetone, diacetone alcohol, and cyclohexen-1-one.
- the ether is a group consisting of dipropyl ether, diisopropyl ether, dibutyl ether, tetrahydrofuran, tetrahydropyran, ethylisoamyl ether, ethyl-t-butylether, ethylpentyl ether, cresyl methyl ether, anisol, and phenol
- the block copolymer polyimide composition is at least one selected from the group consisting of:
- ester is methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, amyl acetate, isoamyl acetate, 2-ethylhexyl acetate, cyclohexyl acetate, methylcyclohexyl acetate, benzyl acetate, acetate acetate Methyl, ethyl acetate, methyl propionate, ethyl ethyl propionate, butyl propionate, benzyl propionate, methyl butyrate, ethyl butyrate, isopropyl butyrate, butyrate Butyl acid, isoamyl butyrate, methyl lactate, ethyl lactate, butyl lactate, ethyl isovalerate, isoamyl isovalerate, getyl oxalate
- the lactone is one valerolactone
- the base is the block copolymer polyimide composition described above, wherein the base is at least one of pyridine and N-methylmorpholine.
- the block copolymer polyimide has the weight-average molecular weight of 100,000 to 200,000 in terms of polystyrene, and is the above-described block copolymer polyimide composition.
- a positive photosensitive polyimide composition in a positive photosensitive polyimide composition, it comprises a block copolymerized polyimide soluble in at least one of ether, ketone and ester solvents composed of tetracarboxylic dianhydride and diamine, and a photoacid generator compound.
- a block copolymerized polyimide soluble in at least one of ether, ketone and ester solvents composed of tetracarboxylic dianhydride and diamine, and a photoacid generator compound.
- tetracarboxylic dianhydride and diamine are contained in the presence of an acid catalyst formed by a lactone and a base, and at least one of ketone, ether and ester is contained.
- This is a method for producing a block copolymerized polyimide composition in which a polyimide oligomer is prepared by heating in a solvent, and at least one of tetracarboxylic dianhydride and diamine is added and reacted. .
- tetra-disulfonic acid dianhydride and diamine are combined with N-methylpyrrolidone, N, N-dimethylformamide in the presence of an acid catalyst formed by a lactone and a base.
- N, N-dimethylacetamide and dimethylsulfoxide in a solvent selected from the group consisting of a polyimide, an oligomer, and a tetracarboxylic dianhydride or diamine.
- a composition containing polyimide as a solvent containing at least one of ketone, ether and ester, it is hardly affected by moisture from the surroundings, hardly causes whitening, etc. It has been found that polyimide films and the like can be formed.
- Polyimides are prepared by dissolving raw materials in a solvent consisting of at least one of ketones, ethers and esters to form polyimides, or reacting in other solvents and then in poor solvents. It has been found that by dissolving the precipitated polyimide, a solvent-soluble polyimide composition having similarly excellent properties can be obtained.
- a phenolic hydroxyl group was introduced into the main chain of the polyimide, and it was combined with a photoacid generator, naphthoquinonediazide, to make it soluble in the aqueous solution of Arikari. It was found that it could be provided.
- An object of the present invention is to provide a photosensitive polyimide having a sufficient difference in solubility between an unexposed portion and a non-exposed portion, which is hardly affected by moisture in the atmosphere, and a method for producing the same.
- Tetracarboxylic dianhydride used in the synthesis of the polyimide of the present invention includes Lacarboxylic dianhydride is 3, 3 ', 4, 4' monobiphenyl tetracarboxylic dianhydride (BPDA), 3, 3 ', 4, 4' Benzophenone tetracarboxylic dianhydride (BTDA), 3, 3 ', 4, 4'-biphenyl ether tetracarboxylic dianhydride (0PDA), 3, 3', 4, 4'-diphenyl sulfone tetracarboxylic dianhydride (DSDA ), Bicyclo (2,2,2) oct-1-ene-2,3,5,6-tetracarboxylic dianhydride (BCD), 1,2,4,5-cyclohexanetetracarboxylic dianhydride ( H-PMDA), pyromellitic dianhydride (PMDA), 2,2-bis (3,4-dicarboxyphenyl) hexa
- diamine is silicone diamine, bis (3-aminopropyl) etherethane, 3, 3'-diamino-4,4' dihydroxydiphenylsulfone (SO 2-HOAB), 4,4 'diamino-1,3,3 '' Dihydroxybiphenyl (HOAB), 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane (HOCF 3 AB), siloxanediamine, bis (3-aminopropyl) etherethane, N, N —Bis (3-aminopropyl) ether, 1,4-bis (3-aminopropyl) piperazine, isophoronediamine, 1,3'-bis (aminomethyl) cyclohexane, 3,3'-dimethyl 4,4'-Diaminodicyclohexylmethane, 4,4'-Methylenebis (cyclohexylamine), 4,4'Diaminodiphenyl
- silicone diamines include BY16-853U, BY16-853C made by Toray Dow Corning Silicone, X-22-1660B-3 made by Shin-Etsu Chemical, KF-8010, X — 22— 161 A and the like.
- the block copolymerized polyimide in ketone, ether, ester, or a mixed solvent thereof can be used in the presence of ketone, ether, ester, or the like in the presence of an acid catalyst formed by y-valerolactone and a base.
- the mixture is heated in a mixed solvent of (1) and (2) to perform dehydration and imidization of tetracarboxylic dianhydride and diamine, and remove water generated during the reaction out of the reaction system by azeotropy with the reaction solvent. It can be manufactured by this.
- the block copolymerizable polyimide of the present invention can be obtained by using an acid generated by the following equilibrium reaction between a valerolactone and a base selected from pyridine, N-methylmorpholine, etc. as a catalyst. Can be combined.
- multi-component block copolymers can improve photosensitivity, adhesiveness, water repellency, mechanical properties, etc. by incorporating a functional part and a structural part into the molecule. Increase the solubility of poorly soluble polyimides in ketones, ethers, esters, or a mixture of these by converting them into solvent-soluble polyimide oligomers in the first step Can be done.
- Ketones must have a boiling point of 60 ° C or more and 200 ° C or less because they must be easy to work in the polyimide application and mixing steps, and the solvent after molding must be easily removed. It is preferable that
- ketones include methyl ethyl ketone, methyl propyl ketone, methyl isopropyl ketone, methyl butyl ketone, methyl isobutyl ketone, methyl n-hexyl ketone, getyl ketone, diisopropyl ketone, diisobutyl ketone, cyclopentanone, cyclo Hexanone, methylcyclohexanone, acetylaceton, diacetone alcohol, cyclohexene-1-one, y-butyrolactone, y-valerolactone, aprolactolactone, heptalatatatone, acetyl-a-peptidyl ratatone, ⁇ - Force prolactone.
- cyclohexanone, methylethyl ketone, methyl isobutyl ketone, acetylacetone, diacetone alcohol, cyclohexen-1-one, and ptyrrolactone are general-purpose solvents and are preferred.
- the work in the coating step and the mixing step is easy, and it is necessary that the solvent after the molding is easily removed, and the boiling point is 60 ° C or more and 200 ° C or more. The following is preferred.
- ethers examples include dipropyl ether, diisopropyl ether, dibutyl ether, tetrahydrofuran, tetrahydropyran, ethylisoamylether, ethyl-t-butylethylether, ethylbenzylether, cresylmethylether, anisol, phenol
- examples include diethylene glycol, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, diethylene glycol getyl ether, and diethylene glycol dibutyl ether.
- tetrahydrofuran, anisol, phenetole, methyl glycol dimethyl ether, and triethylene glycol dimethyl ether are general solvents and preferred.
- Esters used as solvents include methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, amyl acetate, isoamyl acetate, 2-ethylhexyl acetate, cyclohexyl acetate, Methylcyclohexyl sulphate Benzyl acetate, methyl acetate acetate, ethyl acetate acetate, methyl propionate, ethyl ethyl propionate, butyl propionate, benzyl propionate, methyl butyrate, ethyl butyrate, isopropyl butyrate, butyl butyrate, isoamyl butyrate, methyl lactate, ethyl lactate, At least one selected from the group consisting of butyl lactate, ethyl isovalerate, isoa
- a mixed solvent is preferable because the polyimide resin composition can be used stably.
- ketone ether, ester, or ketone
- N-methylpyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, dimethylsulfoxide, etc. can be mixed.
- the amount is at most 40% by mass of the total solvent, preferably at most 20% by mass. If it exceeds 40% by mass, whitening occurs, which is not preferable.
- the dried block copolymer polyimide powder dissolves in ketones, ethers, esters, or mixed solvents of these, but the time required for dissolution can be reduced by heating or stirring up to the boiling point of the solvent. .
- the weight average molecular weight in terms of polystyrene of the block copolymer polyimide soluble in ketones, ethers, esters, or a mixed solvent thereof is as follows. It is preferably in the range of 100,000 to 200,000.
- a positive-type photosensitive polyimide is introduced by introducing a photoacid generator that generates an acid upon irradiation with light. It can be a composition.
- Examples of the photoacid generator to be added to the polyimide solution include low molecular weight compounds such as 1,2-naphthoquinone-12-diazido-15-sulfonate, 1,2-naphthoquinone-12-diazido-4-sulfonate, and the like.
- Use aromatic hydroxy compounds 1.2-naphthoquinone-l-diazido-5-sulfonic acid-l-ortho-taresole ester, 1,2-naphthoquinone_2-diazido-5-sulfonic acid-l-para-cresol ester You can also.
- the positive photosensitive polyimide composition of the present invention can be applied onto a supporting substrate and subjected to a prebaking step, an exposure step, a developing step, and a solvent removing step to form a polyimide pattern.
- a photosensitive polyimide is applied to a spinner, roll coder, die-copper, etc.
- a hot plate or oven One night, after application by screen printing, pre-bake using a hot plate or oven.
- the positive-type photosensitive composition that has been coated on the support Irradiation with actinic rays such as ultraviolet rays is performed through a mask. Exposure causes the formation of indene carboxylic acid in the exposed area, and a difference in solubility in the aqueous solution between the exposed area and the unexposed area occurs in the subsequent development step.
- a relief pattern can be obtained by removing the exposed portion with a developing solution.
- the developer include sodium hydroxide, potassium hydroxide, tetramethylammonium hydroxide and the like.
- solvents such as N-methylpyrrolidone or alcohols may be contained in the developing solution.
- Surfactants may be added.
- fumed silica, spherical silica, amorphous silica, milled fiber, titanium dioxide, barium sulfate, calcium carbonate, magnesium oxide are examples of the filler insoluble in the solvent mixed in the polyimide ink of the present invention.
- Inorganic fillers selected from Rippon Black, fluororesins, polyethylene resins, polypropylene resins, crosslinked styrene, epoxy resins, synthetic resins selected from polyimide resins, phthalocyanine resins, phthalocyanine green, isoindolinone green
- Organic pigments selected from linisch, isodoindolinone yellow redish, and quinacridone can be added.
- the amount of the filler added is preferably 0.05 to 95% by mass based on the solid content of polyimide, and more preferably, the fumed silica is contained in an amount of 0.05 to 95% by mass based on the solid content of polyimide. It is 15% by mass.
- Spherical silica, amorphous silica, milled phosphine, titanium dioxide, titanium sulfate, calcium carbonate, magnesium oxide, iron black, etc. may be 1 to 50% by mass based on the solid content of polyimide. preferable.
- the content is preferably 1 to 50% by mass based on the solid content of polyimide, and when an organic pigment is added, 0.05 to 1% by mass based on the solid content of polyimide. 0% by mass is preferred.
- the positive photosensitive polyimide ink is printed on the entire surface of the printing material using a metal mask and screen stencil metal mesh during the printing process, and then the image is exposed to 365 to 436 nm ultraviolet light through a predetermined photomask.
- the pattern can be formed by removing the irradiated area with an aqueous solution of alkali.
- the mixture was stirred at 25 rpm under a nitrogen atmosphere at 100 rpm for 0.5 hour. After a uniform solution was formed, the temperature was increased to 180 ° C. in an oil bath, and the mixture was stirred at 180 rpm for 1 hour. During the reaction, azeotropic water was removed.
- the polymer concentration of the obtained polyimide solution was 15% by mass.
- the molecular weight of this polyimide was measured by gel permeation chromatography (GPC).
- the molecular weight in terms of polystyrene was found to be the number average molecular weight (Mn) 9225 , Weight average molecular weight
- the polymer concentration of the obtained polyimide solution was 18% by mass.
- the mixture was stirred at 25 ° C under nitrogen atmosphere at 100 rpm for 0.5 hours, and after a homogeneous solution was formed, the temperature was raised in an oil bath at 180 ° C and stirred at 180 rpm for 1 hour. did. During the reaction, azeotropic water was removed.
- the reaction mixture was cooled to room temperature, and BAPP8.21 g (20 mmol) and cyclohexanone 40.64 g as a solvent were charged. After stirring at 100 rpm for 1 hour at 25 ° C, the temperature was raised to 180 ° C in an oil bath, and the reaction was stirred for 2 hours at 180 rpm. During this time, water generated every hour was removed.
- the polymer concentration of the obtained polyimide solution was 30% by mass.
- the molecular weight of this polyimide was measured by gel permeation chromatography (GPC), and the molecular weight in terms of polystyrene was found to be the number average molecular weight (Mn) 7042.
- the weight average molecular weight (Mw) was 11574
- the Z average molecular weight (Mz) was 17551
- Mw / Mn 1.64
- Mz / Mn 2.49.
- the polymer concentration of the obtained polyimide solution was 30% by mass. After cooling the obtained polyimide solution to 25 ° C, the precipitate of polyimide formed by mixing methanol little by little with stirring is finely pulverized, and the pulverized polyimide powder is washed three times with methanol. Wash and filter with suction filtration. The polyimide powder thus obtained was dried using a vacuum drier at 25 ° C. for 3 hours, at 60 ° C. for 1 hour, and at 90 ° C. for 1 hour.
- the dried polyimide powder was mixed with anisol so that the solid content was 24% by mass, and the mixture was stirred at 25 ° C for 30 minutes. As a result, some of the powder was melted but most of the powder was still in a powder state. Was. The temperature was raised to 100 ° C and the mixture was stirred for 30 minutes to dissolve the polyimide powder to form a homogeneous solution. The fluidity was maintained even when cooled to 25 ° C.
- the viscosity of the polyimide solution did not increase even after 2 weeks, and the fluidity was maintained.
- An ink for screen printing was produced using this liquid in an environment at a temperature of 25 ° C and a relative humidity of 60%.
- Polyimide varnish uses three rolls to mix the filler, and while kneading by mouth, the surface area of the polyimide that comes into contact with the air increases, making it quite susceptible to the effects of moisture contained in the air.
- anisol which is a kind of ether
- it is hardly affected by moisture in the air when kneading with a roll. No whitening phenomenon could be observed on the surface of the polyimide even after 40 minutes of exposure to air.
- the polyimide powder thus obtained was dried in a vacuum dryer at room temperature for 3 hours, at 60 ° C for 1 hour, and at 90 ° C for 1 hour.
- Cyclohexanone was added to the dried polyimide powder so that the solid content became 20% by mass, and the mixture was stirred at 25 ° C for 30 minutes. Some of the powder was dissolved and most of the powder remained, so the temperature was raised to 100 ° C and the mixture was stirred for 30 minutes to uniformly dissolve the polyimide powder.
- the molecular weight of the obtained polyimide was measured by gel permeation chromatography (GPC), the molecular weight in terms of polystyrene was found to be the number average molecular weight (Mn) 18.
- this polyimide solution was applied on a stainless steel plate using a spinner and left in the air. Even after 30 minutes, no whitening phenomenon was observed on the surface of the polyimide coating film.
- Example 1-4 without separating the powdered polyimid from the N-methylpyrrolidone solution of polyimide, using a three-necked roll with the N-methylpyrrolidone solution of polyimide, And kneaded. The area exposed to the air was increased by kneading, and the surface of the polyimide turned white after 10 minutes due to the effect of moisture contained in the air.
- Example 15-5 without separating the powdery polyimid from the N-methylpyrrolidone solution of polyimide, using a N-methylpyrrolidone solution of polyimide, a three-necked roll was used. And kneaded. The area exposed to the air was increased by the kneading, and the surface of the polyimide gradually became white from around after 5 minutes due to the influence of the moisture contained in the air. After 10 minutes, the entire surface became white.
- the mixture was stirred at room temperature under a nitrogen atmosphere at 100 rpm for 10 minutes. After the monomer was dissolved to form a uniform solution, the temperature was increased in an oil bath at 180 ° C., and the mixture was stirred at 180 rpm for 1 hour. During the reaction, azeotropic water was removed. After reacting at 180 rpm at 180 rpm, the one-step reaction was terminated, and the sample was sampled by molecular weight measurement. The weight average molecular weight was 4,300 and the molecular weight distribution was measured by gel permeation chromatography. Mw / Mn) 1.8.
- the mixture was stirred at 25 ° C at 100 rpm for 1 hour, heated to 180 ° C in an oil bath, and stirred at 180 rpm for 2 hours and 45 minutes to react. During this time, the water generated was removed every hour.
- 1,2-naphthoquinone-12-diazido-5-sulfonic acid ester manufactured by Toyo Gosei Kogyo Co., Ltd .; hereinafter, referred to as PC5
- PC5 1,2-naphthoquinone-12-diazido-5-sulfonic acid ester
- the obtained positive photosensitive polyimide composition was spin-coated on a silicon wafer using a spinner under an environment of a relative humidity of 80%, a uniform film could be formed without whitening of the film. Subsequently, the film was prebaked on a hot plate at 90 ° C for 10 minutes to obtain a 6.5 m-thick coating film. This coating film was exposed to light through a resolution measuring mask while changing the exposure amount in the range of 400 to 800 mJ / cm 2 .
- Example 2-1 Except that the tetracarboxylic dianhydride and diamine in the first step reaction in Example 2-1 and the tetracarboxylic dianhydride and diamine in the second step reaction were respectively changed to those shown in Table 1, After preparing the block copolymerized polyimide composition, a positive photosensitive polyimide composition was prepared in the same manner as in Example 21-11, and evaluated in the same manner as in Example 2-1. See Table 1.
- the polymer concentration of the obtained polyimide solution was 20% by mass.
- fumed silica (R-200, manufactured by Nippon Aerosil Co., Ltd.) was added to the obtained block copolymerized polyimide solution in an amount of 1.0% by mass based on the polyimide resin, and the mixture was thoroughly mixed with three rolls. Then, photoacid generator 1, 2-naphthoquinone 1-2-diazido 5-Sulfonate (manufactured by Toyo Gosei Kogyo Co., Ltd .; hereinafter, referred to as PC5) was added at 20% by mass based on the solid content of polyimide to obtain a positive photosensitive polyimide ink.
- PC5 photoacid generator 1
- a photosensitive film was formed on the wafer from the obtained positive photosensitive polyimide composition ink at a squeegee speed of 1 Omm / sec using a 400 mesh screen printing plate. Pre-beta was performed on a hot plate at 90 ° C for 10 minutes to obtain a 6.5 ⁇ m coating film. This coating film was exposed to ultraviolet light at 80 OmJ / cm 2 through a mask.
- a developing solution is prepared by using a 5% by mass aqueous solution of tetramethylammonium hydroxide as a developing solution, and developing is performed for 2 minutes at room temperature. After rinsing with pure water, the obtained relief pattern is heated at 120 ° C and 180 ° C. It was dried in a hot air drier at 250 ° C. in three stages for 20 minutes each. When the relief pattern was observed with a scanning electron microscope, a line-and-space pattern of 1 m was obtained. At this time, the remaining film ratio of the unexposed portion was 78%.
- Example 3-1 a polyimide oligomer coma comprising tetracarboxylic dianhydride and diamine shown in Table 2 was prepared, and then tetracarbonic dianhydride and diamine shown in Table 3 were prepared. This was added to prepare a block copolymer type polyimide solution. Table 2 shows the molecular weight of the obtained polyimide.
- a photosensitive film was formed on a copper foil of the obtained positive photosensitive polyimide composition ink in a room at a relative humidity of 80% using a screen printing plate of 400 mesh at a squeegee speed of 1 Omra sec.
- the film was pre-betaed on a hot plate at 90 ° C for 10 minutes to obtain a coating film having a thickness of 6.5 m.
- This coating film was exposed to ultraviolet light at 80 OmJ / cm 2 through a photomask for measuring resolution.
- the relief pattern was observed with a scanning electron microscope, and the resolution at which a good line-and-space pattern was obtained is shown in Table 3.
- silica was manufactured by a wet method, and the particle size was shown by number average.
- Example 3-3 Fumed silica 0.016 10 Spherical silica 0.5 5 None
- Example 3-5 Fumed silica 0.016 7 Barium sulfate 3 15 None
- Example 3-7 5 Form K Sirika 0.016 10 Phthalocyanine Green 0.1 3 None
- Example 3-10 7 Formed Silica 0.016 5 Silica 3 50 Phthalocyanine Buzore 0.15
- 3,3 ', 4,4'-biphenylethertetracarboxylic dianhydride (manac company product, molecular weight, hereinafter referred to as ODPA) 37. 23 g (120 mmol), diaminosiloxane (Toray Dow Corning Silicone Co., Ltd.) Manufactured by Tono, product number By 16-853 U, amine equivalent: 447) 53.
- the mixture was stirred at 25 ° C. under a nitrogen atmosphere at 100 rpm for 0.5 hour, heated to 180 ° C. in an oil bath, and stirred at 180 rpm for 1 hour. During the reaction, generated water was removed.
- the obtained imido oligomer had a number average molecular weight (Mn) of 2,133, a weight average molecular weight (Mw) of 3,200, and Mw / Mn of 1.5.
- the polymer concentration of the obtained polyimide solution was 30% by mass.
- the molecular weight of this polyimide was measured by gel permeation chromatography (GPC)
- the obtained positive photosensitive polyimide ink is cleaned at a temperature of 24 ° C and a relative humidity of 60%.
- a 300-mesh screen printing plate was used to form a photosensitive polyimide film on a 35-m copper foil at a squeegee speed of 2 Omm / sec.After printing, the coating film was allowed to stand for about 10 minutes. Leveling. At this time, no whitening phenomenon on the polyimide film surface due to moisture absorption of the solvent was observed.
- the sample was sampled by gel permeation chromatography after being sampled for molecular weight and found to have a weight average molecular weight of 3800 and a molecular weight distribution (MwZMn) of 1.88.
- the polymer concentration of the obtained polyimide solution was 20% by mass.
- fumed silica (R-200 manufactured by Nippon Aerosil Co., Ltd.) was added to the obtained block copolymer polyimide solution in an atmosphere of 80% relative humidity in an amount of 1.0% by mass with respect to the polyimide resin.
- fumed silica R-200 manufactured by Nippon Aerosil Co., Ltd.
- the mixture was stirred at room temperature under a nitrogen atmosphere at 100 rpm for 10 minutes.
- the temperature was increased in an oil bath at 180 ° C., and the mixture was stirred at 180 rpm for 1 hour.
- azeotropic water was removed.
- the —step reaction was terminated, and the sample was sampled for molecular weight measurement and measured by gel permeation mouth chromatography. As a result, the weight average molecular weight was 3,800, and the molecular weight distribution (Mw / Mn) 1.88.
- the polymer concentration of the obtained polyimide solution was 19.5% by mass.
- the molecular weight of this polyimide was measured by gel permeation chromatography (GPC).
- the number average molecular weight (Mn) was 25300
- the weight average molecular weight (Mw) was 53200
- Mw / Mn was 2.10.
- Fumed silica (R-200, manufactured by Nippon Aerosil Co., Ltd.) was added to the block copolymerized polyimide solution at a relative humidity of 20% at 1.0% by mass with respect to the polyimide resin, and mixed well with a three-roll mill. It could be mixed evenly. Subsequently, as a photoacid generator, 1,2-naphthoquinone-12-diazido-5-sulfonic acid ester (manufactured by Toyo Gosei Kogyo Co., Ltd .; hereinafter, referred to as PC5) was added in an amount of 20% by mass based on the solid content of the polyimide. A photosensitive polyimide ink was obtained.
- the obtained positive photosensitive polyimide composition ink was exposed on a 30-m-thick stainless steel plate at a squeegee speed of 1 Omm / sec using a 400-mesh screen printing plate in an atmosphere with a relative humidity of 75%.
- a conductive film was formed, the film gradually whitened after printing. This was prebaked on a hot plate at 90 ° C for 10 minutes, but the whitened film did not become a transparent film.
- the present invention can provide a block copolymer type polyimide which does not whiten in the air like a conventional solvent-soluble polyimide, and a positive type block copolymer type polyimide produced in combination with a photoacid generator.
- Polyimide and ink can form a relief image or the like with excellent resolution.
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
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Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/501,452 US20050272907A1 (en) | 2002-01-15 | 2003-01-15 | Solvent-soluble block copolymide composition and process for producing the same |
DE60322663T DE60322663D1 (de) | 2002-01-15 | 2003-01-15 | Lösungsmittellösliche block-copolyimidzusammensetzung und herstellungsverfahren dafür |
CNB038052202A CN1307260C (zh) | 2002-01-15 | 2003-01-15 | 溶剂可溶的嵌段共聚聚酰亚胺组合物及其制造方法 |
KR10-2004-7010996A KR20040071778A (ko) | 2002-01-15 | 2003-01-15 | 용매 가용인 블록 공중합 폴리이미드 조성물 및 그 제조방법 |
EP03700559A EP1469037B1 (en) | 2002-01-15 | 2003-01-15 | Solvent-soluble block copolyimide composition and process for producing the same |
JP2003560102A JPWO2003060010A1 (ja) | 2002-01-15 | 2003-01-15 | 溶媒可溶なブロック共重合ポリイミド組成物およびその製造方法 |
AU2003201880A AU2003201880A1 (en) | 2002-01-15 | 2003-01-15 | Solvent-soluble block copolyimide composition and process for producing the same |
Applications Claiming Priority (4)
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---|---|---|---|
JP2002005414 | 2002-01-15 | ||
JP2002005413 | 2002-01-15 | ||
JP2002-5414 | 2002-01-15 | ||
JP2002-5413 | 2002-01-15 |
Publications (1)
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WO2003060010A1 true WO2003060010A1 (fr) | 2003-07-24 |
Family
ID=26625510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2003/000252 WO2003060010A1 (fr) | 2002-01-15 | 2003-01-15 | Composition de copolyimide sequence soluble dans le solvant et procede de preparation associe |
Country Status (9)
Country | Link |
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US (1) | US20050272907A1 (ja) |
EP (1) | EP1469037B1 (ja) |
JP (1) | JPWO2003060010A1 (ja) |
KR (1) | KR20040071778A (ja) |
CN (1) | CN1307260C (ja) |
AU (1) | AU2003201880A1 (ja) |
DE (1) | DE60322663D1 (ja) |
TW (1) | TW200302253A (ja) |
WO (1) | WO2003060010A1 (ja) |
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- 2003-01-15 EP EP03700559A patent/EP1469037B1/en not_active Expired - Fee Related
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KR20190143015A (ko) * | 2018-06-19 | 2019-12-30 | 주식회사 동진쎄미켐 | 폴리이미드 바니쉬 조성물 및 이를 이용한 필름 제조방법 |
KR102566319B1 (ko) | 2018-06-19 | 2023-08-16 | 주식회사 동진쎄미켐 | 폴리이미드 바니쉬 조성물 및 이를 이용한 필름 제조방법 |
CN109678178A (zh) * | 2019-01-28 | 2019-04-26 | 青岛科技大学 | 具有cha结构的sapo-34型分子筛的合成方法及所得mto催化剂 |
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WO2023058385A1 (ja) * | 2021-10-05 | 2023-04-13 | 東京応化工業株式会社 | ブロック共重合体 |
Also Published As
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CN1307260C (zh) | 2007-03-28 |
US20050272907A1 (en) | 2005-12-08 |
JPWO2003060010A1 (ja) | 2005-05-19 |
EP1469037A4 (en) | 2005-04-20 |
CN1639262A (zh) | 2005-07-13 |
AU2003201880A1 (en) | 2003-07-30 |
EP1469037B1 (en) | 2008-08-06 |
KR20040071778A (ko) | 2004-08-12 |
DE60322663D1 (de) | 2008-09-18 |
TW200302253A (en) | 2003-08-01 |
EP1469037A1 (en) | 2004-10-20 |
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