DE60322663D1 - Lösungsmittellösliche block-copolyimidzusammensetzung und herstellungsverfahren dafür - Google Patents

Lösungsmittellösliche block-copolyimidzusammensetzung und herstellungsverfahren dafür

Info

Publication number
DE60322663D1
DE60322663D1 DE60322663T DE60322663T DE60322663D1 DE 60322663 D1 DE60322663 D1 DE 60322663D1 DE 60322663 T DE60322663 T DE 60322663T DE 60322663 T DE60322663 T DE 60322663T DE 60322663 D1 DE60322663 D1 DE 60322663D1
Authority
DE
Germany
Prior art keywords
copolymide
manufacturing
composition
solvent soluble
soluble block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60322663T
Other languages
English (en)
Inventor
Xingzhou Jin
Hiroyuki Ishii
Masataka Miyamura
Hiroshi Itatani
Shinichiro Hori
Akihito Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PI R&D Co Ltd
Original Assignee
PI R&D Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PI R&D Co Ltd filed Critical PI R&D Co Ltd
Application granted granted Critical
Publication of DE60322663D1 publication Critical patent/DE60322663D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1021—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the catalyst used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE60322663T 2002-01-15 2003-01-15 Lösungsmittellösliche block-copolyimidzusammensetzung und herstellungsverfahren dafür Expired - Lifetime DE60322663D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002005413 2002-01-15
JP2002005414 2002-01-15
PCT/JP2003/000252 WO2003060010A1 (fr) 2002-01-15 2003-01-15 Composition de copolyimide sequence soluble dans le solvant et procede de preparation associe

Publications (1)

Publication Number Publication Date
DE60322663D1 true DE60322663D1 (de) 2008-09-18

Family

ID=26625510

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60322663T Expired - Lifetime DE60322663D1 (de) 2002-01-15 2003-01-15 Lösungsmittellösliche block-copolyimidzusammensetzung und herstellungsverfahren dafür

Country Status (9)

Country Link
US (1) US20050272907A1 (de)
EP (1) EP1469037B1 (de)
JP (1) JPWO2003060010A1 (de)
KR (1) KR20040071778A (de)
CN (1) CN1307260C (de)
AU (1) AU2003201880A1 (de)
DE (1) DE60322663D1 (de)
TW (1) TW200302253A (de)
WO (1) WO2003060010A1 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100594223C (zh) * 2004-05-27 2010-03-17 株式会社Pi技术研究所 印刷用嵌段共聚聚酰亚胺油墨组合物
JP2006022173A (ja) * 2004-07-07 2006-01-26 Mitsubishi Gas Chem Co Inc 皮膜形成用組成物および皮膜形成法および皮膜加工法
US7892651B2 (en) * 2004-09-14 2011-02-22 Mitsubishi Gas Chemical Company, Inc. Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
KR20070053799A (ko) * 2004-09-24 2007-05-25 가부시키가이샤 가네카 접착성이 개량된 신규한 폴리이미드 필름
KR20100017883A (ko) * 2004-09-24 2010-02-16 가부시키가이샤 가네카 높은 접착성을 갖는 폴리이미드 필름의 제조 방법
JP2006160958A (ja) * 2004-12-09 2006-06-22 Kaneka Corp ポリイミド前駆体およびそれを用いた感光性樹脂組成物
DE102005034969A1 (de) * 2005-07-22 2007-02-08 Inspec Fibres Gmbh Verfahren zur Herstellung eines Blockcopolymeren aus Polyimiden und Verwendung des Blockcopolymeren zur Herstellung von Pulvern und Formteilen
CN101278234B (zh) * 2005-09-05 2011-07-13 旭化成电子材料株式会社 正型感光性树脂组合物
US20090186295A1 (en) * 2006-03-03 2009-07-23 Maw Soe Win Photosensitive Ink Composition for Screen Printing and Method of Forming Positive Relief Pattern with Use Thereof
US20090202793A1 (en) * 2006-07-11 2009-08-13 Nippon Kayaku Kabushiki Kaisha Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin and Photosensitive Resin Composition Containing the same
JP4878525B2 (ja) * 2006-09-01 2012-02-15 旭化成イーマテリアルズ株式会社 ポジ型感光性樹脂組成物
US7592119B2 (en) * 2007-02-09 2009-09-22 Sony Corporation Photosensitive polyimide resin composition
JP5021337B2 (ja) * 2007-02-28 2012-09-05 旭化成イーマテリアルズ株式会社 熱塩基発生剤を含有する樹脂組成物
JP5281568B2 (ja) * 2007-04-03 2013-09-04 ソルピー工業株式会社 溶剤に可溶な６，６−ポリイミド共重合体及びその製造方法
WO2008155811A1 (ja) * 2007-06-18 2008-12-24 Solpit Industries, Ltd. ６，６－ポリイミド共重合体及びその製造方法
JP5602339B2 (ja) * 2007-08-27 2014-10-08 ニッタ株式会社 イミド変性エラストマー
JP5041169B2 (ja) * 2008-09-11 2012-10-03 Ｊｓｒ株式会社 液晶配向剤および液晶表示素子
JP2010134116A (ja) * 2008-12-03 2010-06-17 Asahi Kasei E-Materials Corp ポジ型感光性樹脂組成物
KR101804308B1 (ko) * 2009-04-23 2017-12-08 닛산 가가쿠 고교 가부시키 가이샤 폴리히드록시이미드의 제조방법
JPWO2011033690A1 (ja) * 2009-09-16 2013-02-07 ソルピー工業株式会社 Ｐｍｄａ、ｄａｄｅ、ｂｐｄａ及びｂｃｄを含有する有機溶媒に可溶のポリイミド
EP2501741A1 (de) * 2009-11-20 2012-09-26 E. I. du Pont de Nemours and Company Deckschichtzusammensetzungen und entsprechende verfahren
TWI401252B (zh) 2010-06-22 2013-07-11 Chi Mei Corp 液晶配向劑，以及以其製得的液晶配向膜與液晶顯示元件
KR101299651B1 (ko) * 2010-07-14 2013-08-23 주식회사 엘지화학 저온 경화가 가능한 폴리이미드 수지 및 이의 제조 방법
CN102336910B (zh) * 2010-07-14 2015-04-08 株式会社Lg化学 可低温固化的聚酰亚胺树脂及其制备方法
EP2636056B1 (de) * 2010-11-01 2018-07-04 Basf Se Polyimide als nichtleiter
US9427900B2 (en) * 2010-11-12 2016-08-30 Basf Se Composite component comprising a polymer phase and a foamed phase, and processes for producing the same
TWI465483B (zh) * 2010-12-28 2014-12-21 Chi Mei Corp 液晶配向劑，液晶配向膜，及含有該液晶配向膜的液晶顯示元件
JP5939066B2 (ja) * 2011-11-15 2016-06-22 Jsr株式会社 液晶配向剤の製造方法
CN103890859B (zh) * 2012-01-13 2017-02-22 株式会社Lg化学 用于电子器件的绝缘材料
CN102993750A (zh) * 2012-12-12 2013-03-27 中国科学院长春应用化学研究所 一种聚酰亚胺薄膜及其制备方法
KR102196061B1 (ko) * 2013-08-06 2020-12-30 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지조성물 및 폴리이미드 수지-섬유복합재
JP6413434B2 (ja) * 2014-07-25 2018-10-31 富士ゼロックス株式会社 ポリイミド前駆体組成物、ポリイミド前駆体の製造方法、ポリイミド成形体、及びポリイミド成形体の製造方法
KR102510370B1 (ko) * 2014-10-06 2023-03-17 도레이 카부시키가이샤 수지 조성물, 내열성 수지막의 제조 방법, 및 표시 장치
KR101690058B1 (ko) * 2014-12-19 2016-12-28 주식회사 이녹스 슬립성이 우수한 열가소성 폴리이미드 접착 필름 및 이를 적용한 연성 동박적층판
CN107531911B (zh) * 2015-04-23 2021-03-02 心脏起搏器股份公司 用于具有高重量百分比共聚物的共聚物溶液的组合物和方法
JP2018188626A (ja) * 2017-05-11 2018-11-29 信越化学工業株式会社 シリコーン変性ポリイミド樹脂組成物
CN107760105A (zh) * 2017-11-08 2018-03-06 常州武城服饰有限公司 一种中性墨水
KR102566319B1 (ko) * 2018-06-19 2023-08-16 주식회사 동진쎄미켐 폴리이미드 바니쉬 조성물 및 이를 이용한 필름 제조방법
WO2020022088A1 (ja) * 2018-07-25 2020-01-30 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法、電子デバイスの製造方法
CN109337437A (zh) * 2018-10-12 2019-02-15 楼乐超 一种可溶性环保油墨的制备工艺
CN109678178B (zh) * 2019-01-28 2020-06-30 青岛科技大学 具有cha结构的sapo-34型分子筛的合成方法及所得mto催化剂
KR102650282B1 (ko) * 2021-02-04 2024-03-22 주식회사 엘지화학 폴리이미드 수지 및 이를 포함하는 포지티브형 감광성 수지 조성물
JP2024535634A (ja) * 2021-09-22 2024-09-30 ウルバリン・アドバンスド・マテリアルズ，エルエルシー シーリング用途のための高温コーティング（ｈｔｃ）
WO2023058385A1 (ja) * 2021-10-05 2023-04-13 東京応化工業株式会社 ブロック共重合体
TWI847678B (zh) * 2023-05-05 2024-07-01 新應材股份有限公司 正型光阻組成物、負型光阻圖案的微影製程方法及其光阻膜

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04108880A (ja) * 1990-08-30 1992-04-09 Nippon Steel Chem Co Ltd ポリイミド樹脂コーテイング剤組成物
JP3486012B2 (ja) * 1995-07-28 2004-01-13 株式会社巴川製紙所 ポリイミドシロキサンブロック共重合体、それを含むワニスおよびその使用方法
JP3445440B2 (ja) * 1996-06-26 2003-09-08 石川島播磨重工業株式会社 トンネル構築装置及び方法
US6025461A (en) * 1997-09-26 2000-02-15 Nippon Mektron, Limited Photosensitive polyimide
WO1999019771A1 (fr) * 1997-10-13 1999-04-22 Pi R & D Co., Ltd. Composition de polyimide photosensible positive
JP4034403B2 (ja) * 1998-01-16 2008-01-16 株式会社ピーアイ技術研究所 ポジ型感光性ポリイミド組成物及び絶縁膜
JP3968886B2 (ja) * 1998-05-14 2007-08-29 日本メクトロン株式会社 感光性組成物
JP2000202970A (ja) * 1999-01-13 2000-07-25 Pi Gijutsu Kenkyusho:Kk ポリイミド被覆フィルム
US6630064B1 (en) * 1999-08-06 2003-10-07 Pi R&D Co., Ltd. Composition for electrodeposition of polyimides and method for producing patterned polyimide membranes using the same

Also Published As

Publication number Publication date
JPWO2003060010A1 (ja) 2005-05-19
EP1469037A4 (de) 2005-04-20
WO2003060010A1 (fr) 2003-07-24
AU2003201880A1 (en) 2003-07-30
TW200302253A (en) 2003-08-01
CN1307260C (zh) 2007-03-28
EP1469037B1 (de) 2008-08-06
EP1469037A1 (de) 2004-10-20
US20050272907A1 (en) 2005-12-08
KR20040071778A (ko) 2004-08-12
CN1639262A (zh) 2005-07-13

Similar Documents

Publication Publication Date Title
DE60322663D1 (de) Lösungsmittellösliche block-copolyimidzusammensetzung und herstellungsverfahren dafür
DE602004016970D1 (de) P38 inhibitor und anwendungsverfahren dafür
DE60311063D1 (de) Ausziehleiter und zugehörige herstellungsverfahren
DE60317799D1 (de) Antimikrobielle zusammensetzung und anwendungsverfahren
DE60319310D1 (de) Gatterdielektrikum und Verfahren
DK1542668T3 (da) Formulering af aripiprazolkompleks og fremgangsmåde
DE602005015421D1 (de) Direktkomprimierte formulierung und verfahren
DE60219117D1 (de) Photohärtbare Grundierungszusammensetzung und Beschichtungsverfahren
DE60229770D1 (de) Reibungsreduzierende zusammensetzung und verfahren
DE60325690D1 (de) Halbleiterbauelement und verfahren zu seiner herstellung
DE60319810D1 (de) Anschwemmfiltermedien und herstellungs- und verwendungsverfahren
DE60132732D1 (de) Primerzusammensetzung und Verbindungsverfahren
ATE509668T1 (de) Zusammensetzung mit kontrollierter freisetzung und herstellungsverfahren dafür
DE60317772D1 (de) Zweirichtungenmischrotor und verfahren
DE602004018286D1 (de) Nagellackzusammensetzung und herstellungsverfahren dafür
DE60231538D1 (de) Sputtertarget und herstellungsverfahren dafür
DE60239493D1 (de) Halbleiterbauelement und verfahren zu seiner herstellung
DE60219261D1 (de) Lageranordnung und Verfahren
DE602004027703D1 (de) Schwefelfreie zusammensetzung und schmiermittelzusammensetzung und verfahren davon
DE60236994D1 (de) Halbleiterbauelement und dessen Herstellungsverfahren
DE60324697D1 (de) Flüssigkeitsausstossvorrichtung und herstellungsverfahren dafür
DE60317431D1 (de) Flachkabelbaum und Herstellungsverfahren desselben
DE602004006815D1 (de) Monolithischer Halbleiterlaser und dessen Herstellungsverfahren
DE602004003232D1 (de) Eine mikropulpe enthaltende polymervorläuferdispersion und herstellungsverfahren dafür
ATE418339T1 (de) Zusammensetzung und verfahren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition