DE60231538D1 - Sputtertarget und herstellungsverfahren dafür - Google Patents
Sputtertarget und herstellungsverfahren dafürInfo
- Publication number
- DE60231538D1 DE60231538D1 DE60231538T DE60231538T DE60231538D1 DE 60231538 D1 DE60231538 D1 DE 60231538D1 DE 60231538 T DE60231538 T DE 60231538T DE 60231538 T DE60231538 T DE 60231538T DE 60231538 D1 DE60231538 D1 DE 60231538D1
- Authority
- DE
- Germany
- Prior art keywords
- sputtertarget
- manufacturing
- method therefor
- therefor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
- C22F1/18—High-melting or refractory metals or alloys based thereon
- C22F1/183—High-melting or refractory metals or alloys based thereon of titanium or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Forging (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001358713 | 2001-11-26 | ||
PCT/JP2002/007715 WO2003046250A1 (fr) | 2001-11-26 | 2002-07-30 | Cible de pulverisation et procede de fabrication associe |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60231538D1 true DE60231538D1 (de) | 2009-04-23 |
Family
ID=19169846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60231538T Expired - Lifetime DE60231538D1 (de) | 2001-11-26 | 2002-07-30 | Sputtertarget und herstellungsverfahren dafür |
Country Status (8)
Country | Link |
---|---|
US (2) | US20040245099A1 (de) |
EP (1) | EP1449935B1 (de) |
JP (1) | JP4110476B2 (de) |
KR (1) | KR100572263B1 (de) |
CN (1) | CN1329552C (de) |
DE (1) | DE60231538D1 (de) |
TW (1) | TW589233B (de) |
WO (1) | WO2003046250A1 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4384453B2 (ja) | 2003-07-16 | 2009-12-16 | 株式会社神戸製鋼所 | Ag系スパッタリングターゲット及びその製造方法 |
JP4468302B2 (ja) * | 2003-09-12 | 2010-05-26 | 日鉱金属株式会社 | スパッタリングターゲット及び同ターゲットの表面仕上げ方法 |
US7788882B2 (en) * | 2003-10-15 | 2010-09-07 | Nippon Mining & Metals Co., Ltd. | Packaging device and packaging method for hollow cathode type sputtering target |
CN101857950B (zh) * | 2003-11-06 | 2012-08-08 | Jx日矿日石金属株式会社 | 钽溅射靶 |
CN1985021A (zh) * | 2003-12-22 | 2007-06-20 | 卡伯特公司 | 高完整性溅射靶材以及其批量制造方法 |
EP1865090B1 (de) * | 2005-03-28 | 2010-04-07 | Nippon Mining & Metals Co., Ltd. | Tieftopfgeformtes kupfersputtertarget |
WO2007103309A2 (en) * | 2006-03-07 | 2007-09-13 | Cabot Corporation | Methods of producing deformed metal articles |
US20070251819A1 (en) * | 2006-05-01 | 2007-11-01 | Kardokus Janine K | Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targets |
JP5187713B2 (ja) * | 2006-06-09 | 2013-04-24 | 国立大学法人電気通信大学 | 金属材料の微細化加工方法 |
US8702919B2 (en) | 2007-08-13 | 2014-04-22 | Honeywell International Inc. | Target designs and related methods for coupled target assemblies, methods of production and uses thereof |
JP2012505311A (ja) * | 2008-10-10 | 2012-03-01 | トーソー エスエムディー,インク. | 円形溝プレス装置とスパッターリングターゲットの製造方法 |
WO2010085316A1 (en) | 2009-01-22 | 2010-07-29 | Tosoh Smd, Inc. | Monolithic aluminum alloy target and method of manufacturing |
WO2011111373A1 (ja) | 2010-03-11 | 2011-09-15 | 株式会社 東芝 | スパッタリングターゲットとその製造方法、および半導体素子の製造方法 |
CN102400073A (zh) * | 2011-11-18 | 2012-04-04 | 宁波江丰电子材料有限公司 | 镍靶坯及靶材的制造方法 |
CN102418058A (zh) * | 2011-12-02 | 2012-04-18 | 宁波江丰电子材料有限公司 | 镍靶坯及靶材的制造方法 |
CN102424940A (zh) * | 2011-12-20 | 2012-04-25 | 宁波江丰电子材料有限公司 | 高纯钴靶材的制备方法 |
CN103572223B (zh) * | 2012-08-01 | 2016-01-27 | 宁波江丰电子材料股份有限公司 | 钽靶材及钽靶材组件的制造方法 |
CN103572225B (zh) * | 2012-08-01 | 2016-05-04 | 宁波江丰电子材料股份有限公司 | 钽靶材及钽靶材组件的制造方法 |
CN104419901B (zh) * | 2013-08-27 | 2017-06-30 | 宁波江丰电子材料股份有限公司 | 一种钽靶材的制造方法 |
SG11201810964UA (en) | 2016-06-07 | 2019-01-30 | Jx Nippon Mining & Metals Corp | Sputtering target and production method therefor |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5635036A (en) * | 1990-01-26 | 1997-06-03 | Varian Associates, Inc. | Collimated deposition apparatus and method |
JP3338476B2 (ja) * | 1992-06-29 | 2002-10-28 | 住友チタニウム株式会社 | スパッタリング用の金属Tiターゲットの製造方法 |
US5772860A (en) * | 1993-09-27 | 1998-06-30 | Japan Energy Corporation | High purity titanium sputtering targets |
US5687600A (en) * | 1994-10-26 | 1997-11-18 | Johnson Matthey Electronics, Inc. | Metal sputtering target assembly |
US6045634A (en) * | 1997-08-14 | 2000-04-04 | Praxair S. T. Technology, Inc. | High purity titanium sputtering target and method of making |
JPH11269621A (ja) * | 1997-12-24 | 1999-10-05 | Toho Titanium Co Ltd | 高純度チタン材の加工方法 |
US6226171B1 (en) * | 1998-04-27 | 2001-05-01 | Fujitsu Limited | Power conducting substrates with high-yield integrated substrate capacitor |
JP3802683B2 (ja) * | 1998-07-27 | 2006-07-26 | 新日本製鐵株式会社 | チタンターゲット材用高純度チタン板およびその製造方法 |
US6283357B1 (en) * | 1999-08-03 | 2001-09-04 | Praxair S.T. Technology, Inc. | Fabrication of clad hollow cathode magnetron sputter targets |
US6342133B2 (en) * | 2000-03-14 | 2002-01-29 | Novellus Systems, Inc. | PVD deposition of titanium and titanium nitride layers in the same chamber without use of a collimator or a shutter |
US6887356B2 (en) * | 2000-11-27 | 2005-05-03 | Cabot Corporation | Hollow cathode target and methods of making same |
JP4263900B2 (ja) | 2002-11-13 | 2009-05-13 | 日鉱金属株式会社 | Taスパッタリングターゲット及びその製造方法 |
WO2004090193A1 (ja) | 2003-04-01 | 2004-10-21 | Nikko Materials Co., Ltd. | タンタルスパッタリングターゲット及びその製造方法 |
JP4468302B2 (ja) | 2003-09-12 | 2010-05-26 | 日鉱金属株式会社 | スパッタリングターゲット及び同ターゲットの表面仕上げ方法 |
EP1865090B1 (de) | 2005-03-28 | 2010-04-07 | Nippon Mining & Metals Co., Ltd. | Tieftopfgeformtes kupfersputtertarget |
-
2002
- 2002-07-30 EP EP02755683A patent/EP1449935B1/de not_active Expired - Lifetime
- 2002-07-30 CN CNB028215451A patent/CN1329552C/zh not_active Expired - Lifetime
- 2002-07-30 WO PCT/JP2002/007715 patent/WO2003046250A1/ja active Application Filing
- 2002-07-30 DE DE60231538T patent/DE60231538D1/de not_active Expired - Lifetime
- 2002-07-30 US US10/492,310 patent/US20040245099A1/en not_active Abandoned
- 2002-07-30 KR KR1020047005075A patent/KR100572263B1/ko active IP Right Grant
- 2002-07-30 JP JP2003547676A patent/JP4110476B2/ja not_active Expired - Lifetime
- 2002-10-29 TW TW091132044A patent/TW589233B/zh not_active IP Right Cessation
-
2009
- 2009-11-13 US US12/617,966 patent/US8029629B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW589233B (en) | 2004-06-01 |
US20040245099A1 (en) | 2004-12-09 |
CN1578849A (zh) | 2005-02-09 |
US8029629B2 (en) | 2011-10-04 |
EP1449935B1 (de) | 2009-03-11 |
US20100058827A1 (en) | 2010-03-11 |
EP1449935A1 (de) | 2004-08-25 |
TW200301166A (en) | 2003-07-01 |
JP4110476B2 (ja) | 2008-07-02 |
EP1449935A4 (de) | 2005-01-19 |
WO2003046250A1 (fr) | 2003-06-05 |
CN1329552C (zh) | 2007-08-01 |
KR100572263B1 (ko) | 2006-04-24 |
JPWO2003046250A1 (ja) | 2005-04-07 |
KR20040047893A (ko) | 2004-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: NIPPON MINING & METALS CO., LTD., TOKIO/TOKYO, JP |
|
8364 | No opposition during term of opposition | ||
R082 | Change of representative |
Ref document number: 1449935 Country of ref document: EP Representative=s name: BOEHMERT & BOEHMERT, 28209 BREMEN, DE |