WO2003055067A1 - Filtre de derivation - Google Patents
Filtre de derivation Download PDFInfo
- Publication number
- WO2003055067A1 WO2003055067A1 PCT/JP2002/010781 JP0210781W WO03055067A1 WO 2003055067 A1 WO2003055067 A1 WO 2003055067A1 JP 0210781 W JP0210781 W JP 0210781W WO 03055067 A1 WO03055067 A1 WO 03055067A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- acoustic wave
- surface acoustic
- duplexer
- layer
- filter
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/644—Coupled resonator filters having two acoustic tracks
- H03H9/6456—Coupled resonator filters having two acoustic tracks being electrically coupled
- H03H9/6469—Coupled resonator filters having two acoustic tracks being electrically coupled via two connecting electrodes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/0023—Balance-unbalance or balance-balance networks
- H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/0023—Balance-unbalance or balance-balance networks
- H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
- H03H9/0047—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks
- H03H9/0066—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks being electrically parallel
- H03H9/0076—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks being electrically parallel the balanced terminals being on opposite sides of the tracks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/0023—Balance-unbalance or balance-balance networks
- H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
- H03H9/0085—Balance-unbalance or balance-balance networks using surface acoustic wave devices having four acoustic tracks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6436—Coupled resonator filters having one acoustic track only
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/644—Coupled resonator filters having two acoustic tracks
- H03H9/6456—Coupled resonator filters having two acoustic tracks being electrically coupled
- H03H9/6469—Coupled resonator filters having two acoustic tracks being electrically coupled via two connecting electrodes
- H03H9/6476—Coupled resonator filters having two acoustic tracks being electrically coupled via two connecting electrodes the tracks being electrically parallel
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H2250/00—Indexing scheme relating to dual- or multi-band filters
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020037015471A KR100593355B1 (ko) | 2001-12-21 | 2002-10-17 | 분파기 및 이것을 이용한 전자 장치 |
EP02805469A EP1465337A4 (en) | 2001-12-21 | 2002-10-17 | BRANCH FILTER AND ELECTRONIC EQUIPMENT THUS EQUIPPED |
US10/474,513 US7135944B2 (en) | 2001-12-21 | 2002-10-17 | Branching filter having both saw ladder and dual mode filters, and electronic apparatus using the branching filter |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-390706 | 2001-12-21 | ||
JP2001390706 | 2001-12-21 | ||
JP2002134770A JP3833569B2 (ja) | 2001-12-21 | 2002-05-10 | 分波器及びこれを用いた電子装置 |
JP2002-134770 | 2002-05-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003055067A1 true WO2003055067A1 (fr) | 2003-07-03 |
Family
ID=26625227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/010781 WO2003055067A1 (fr) | 2001-12-21 | 2002-10-17 | Filtre de derivation |
Country Status (7)
Country | Link |
---|---|
US (1) | US7135944B2 (ja) |
EP (1) | EP1465337A4 (ja) |
JP (1) | JP3833569B2 (ja) |
KR (1) | KR100593355B1 (ja) |
CN (1) | CN100426669C (ja) |
TW (1) | TWI311858B (ja) |
WO (1) | WO2003055067A1 (ja) |
Families Citing this family (71)
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KR100638780B1 (ko) | 2003-04-25 | 2006-10-30 | 후지쓰 메디아 데바이스 가부시키가이샤 | 분파기 |
JP3778902B2 (ja) * | 2003-04-28 | 2006-05-24 | 富士通メディアデバイス株式会社 | 分波器及び電子装置 |
JP3853303B2 (ja) | 2003-04-28 | 2006-12-06 | 富士通メディアデバイス株式会社 | 分波器 |
JP3967289B2 (ja) * | 2003-04-30 | 2007-08-29 | 富士通メディアデバイス株式会社 | 分波器及び電子装置 |
JP2005235977A (ja) * | 2004-02-19 | 2005-09-02 | Matsushita Electric Ind Co Ltd | 半導体集積回路 |
JP4504278B2 (ja) * | 2004-08-04 | 2010-07-14 | パナソニック株式会社 | アンテナ共用器、ならびに、それを用いた高周波モジュールおよび通信機器 |
US7446629B2 (en) | 2004-08-04 | 2008-11-04 | Matsushita Electric Industrial Co., Ltd. | Antenna duplexer, and RF module and communication apparatus using the same |
JP4303178B2 (ja) * | 2004-08-31 | 2009-07-29 | 富士通メディアデバイス株式会社 | 弾性表面波装置 |
WO2006038421A1 (ja) * | 2004-09-30 | 2006-04-13 | Sanyo Electric Co., Ltd. | 電子デバイス及びこれに用いるパッケージ |
JPWO2006040927A1 (ja) * | 2004-10-08 | 2008-05-15 | 株式会社村田製作所 | 分波器 |
WO2006040923A1 (ja) * | 2004-10-08 | 2006-04-20 | Murata Manufacturing Co., Ltd. | 分波器 |
JP2006135447A (ja) | 2004-11-02 | 2006-05-25 | Fujitsu Media Device Kk | 分波器 |
JP4541853B2 (ja) * | 2004-11-25 | 2010-09-08 | 日本電波工業株式会社 | アンテナ分波器およびアンテナ分波器用表面弾性波フィルタ |
DE102005010658A1 (de) * | 2005-03-08 | 2006-09-14 | Epcos Ag | Duplexer mit verbesserter Leistungsverträglichkeit |
JP4537254B2 (ja) | 2005-04-28 | 2010-09-01 | 富士通メディアデバイス株式会社 | 弾性表面波フィルタおよび分波器 |
DE102005032058B4 (de) * | 2005-07-08 | 2016-12-29 | Epcos Ag | HF-Filter mit verbesserter Gegenbandunterdrückung |
JP2007074698A (ja) * | 2005-08-08 | 2007-03-22 | Fujitsu Media Device Kk | 分波器及びラダー型フィルタ |
JP2007104052A (ja) * | 2005-09-30 | 2007-04-19 | Nippon Dempa Kogyo Co Ltd | 弾性表面波フィルタ |
JP4534990B2 (ja) * | 2006-01-12 | 2010-09-01 | 株式会社村田製作所 | 弾性表面波フィルタ装置及び分波器 |
EP1976118A4 (en) * | 2006-01-18 | 2011-12-14 | Murata Manufacturing Co | ACOUSTIC SURFACE WAVE DEVICE AND LIMIT ACOUSTIC WAVE DEVICE |
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EP2031755B1 (en) * | 2006-06-12 | 2013-11-20 | Murata Manufacturing Co. Ltd. | Wave demultiplexer |
WO2007148510A1 (ja) * | 2006-06-21 | 2007-12-27 | Murata Manufacturing Co., Ltd. | 弾性波フィルタ装置及びデュプレクサ |
JP2008035007A (ja) | 2006-07-27 | 2008-02-14 | Fujitsu Media Device Kk | フィルタ |
JP4244057B2 (ja) | 2006-08-30 | 2009-03-25 | 富士通メディアデバイス株式会社 | バランスフィルタおよび分波器 |
KR100790699B1 (ko) | 2006-09-07 | 2008-01-02 | 삼성전기주식회사 | 듀플렉서 |
KR100793544B1 (ko) | 2006-09-07 | 2008-01-14 | 엘지이노텍 주식회사 | 듀플렉서 |
JPWO2008038459A1 (ja) * | 2006-09-25 | 2010-01-28 | 株式会社村田製作所 | 弾性境界波フィルタ装置 |
JP4867997B2 (ja) * | 2006-12-25 | 2012-02-01 | 株式会社村田製作所 | 弾性波装置 |
KR100847737B1 (ko) | 2007-02-07 | 2008-07-23 | 주식회사 아이.티.에프 | Rf 중계기에서의 저 형상 필터 |
EP2117120A1 (en) * | 2007-03-01 | 2009-11-11 | Murata Manufacturing Co. Ltd. | Elastic wave filter device and duplexer |
JP5073355B2 (ja) * | 2007-04-20 | 2012-11-14 | 太陽誘電株式会社 | アンテナ分波器 |
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KR101027593B1 (ko) | 2007-05-29 | 2011-04-06 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 분파기 |
WO2009013974A1 (ja) * | 2007-07-26 | 2009-01-29 | Kyocera Corporation | 弾性表面波装置及び通信装置 |
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JP5528791B2 (ja) * | 2009-12-28 | 2014-06-25 | 京セラ株式会社 | 弾性波装置および弾性波装置の製造方法ならびに実装基板に弾性波装置が実装された装置 |
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JP2019054216A (ja) * | 2017-09-19 | 2019-04-04 | 東芝メモリ株式会社 | 半導体装置 |
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JP7188556B2 (ja) | 2019-03-13 | 2022-12-13 | 株式会社村田製作所 | 弾性波フィルタ装置およびマルチプレクサ |
JP7344662B2 (ja) * | 2019-03-26 | 2023-09-14 | 太陽誘電株式会社 | マルチプレクサ |
DE102019119239A1 (de) * | 2019-07-16 | 2021-01-21 | RF360 Europe GmbH | Multiplexer |
CN112511131B (zh) * | 2021-02-05 | 2021-05-25 | 成都频岢微电子有限公司 | 一种具有高隔离度和高通频带低频侧高陡峭度的双工器 |
CN112532201B (zh) * | 2021-02-07 | 2021-08-17 | 成都频岢微电子有限公司 | 一种用于提高声表面波接收滤波器带外抑制的layout结构 |
RU205909U1 (ru) * | 2021-03-18 | 2021-08-12 | Общество с ограниченной ответственностью "БУТИС" | Дуплексерный фильтр на поверхностных акустических волнах |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000049565A (ja) * | 1998-05-29 | 2000-02-18 | Fujitsu Ltd | 弾性表面波フィルタ装置 |
JP2001189639A (ja) * | 1998-12-29 | 2001-07-10 | Toshiba Corp | 弾性表面波装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH07226607A (ja) | 1994-02-10 | 1995-08-22 | Hitachi Ltd | 分波器、分波器モジュールおよび無線通信装置 |
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JP3186604B2 (ja) | 1996-10-09 | 2001-07-11 | 株式会社村田製作所 | 弾性表面波フィルタ装置 |
JP3222072B2 (ja) | 1996-10-15 | 2001-10-22 | 富士通株式会社 | 分波器パッケージ |
JP3224202B2 (ja) | 1996-11-28 | 2001-10-29 | 富士通株式会社 | 弾性表面波装置 |
JPH10261936A (ja) | 1997-03-19 | 1998-09-29 | Mitsubishi Electric Corp | 弾性表面波フィルタ |
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-
2002
- 2002-05-10 JP JP2002134770A patent/JP3833569B2/ja not_active Expired - Lifetime
- 2002-10-17 EP EP02805469A patent/EP1465337A4/en not_active Withdrawn
- 2002-10-17 CN CNB028109597A patent/CN100426669C/zh not_active Expired - Lifetime
- 2002-10-17 KR KR1020037015471A patent/KR100593355B1/ko active IP Right Grant
- 2002-10-17 WO PCT/JP2002/010781 patent/WO2003055067A1/ja active Application Filing
- 2002-10-17 US US10/474,513 patent/US7135944B2/en not_active Expired - Lifetime
- 2002-11-19 TW TW091133738A patent/TWI311858B/zh not_active IP Right Cessation
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JP2000049565A (ja) * | 1998-05-29 | 2000-02-18 | Fujitsu Ltd | 弾性表面波フィルタ装置 |
JP2001189639A (ja) * | 1998-12-29 | 2001-07-10 | Toshiba Corp | 弾性表面波装置 |
Non-Patent Citations (1)
Title |
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See also references of EP1465337A4 * |
Also Published As
Publication number | Publication date |
---|---|
CN1513229A (zh) | 2004-07-14 |
TW200301617A (en) | 2003-07-01 |
US20040155730A1 (en) | 2004-08-12 |
JP2003249842A (ja) | 2003-09-05 |
KR100593355B1 (ko) | 2006-06-28 |
US7135944B2 (en) | 2006-11-14 |
KR20040075707A (ko) | 2004-08-30 |
EP1465337A4 (en) | 2009-11-11 |
CN100426669C (zh) | 2008-10-15 |
EP1465337A1 (en) | 2004-10-06 |
TWI311858B (en) | 2009-07-01 |
JP3833569B2 (ja) | 2006-10-11 |
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