WO1998016092A1 - Composant avec carte a circuit imprime - Google Patents
Composant avec carte a circuit imprime Download PDFInfo
- Publication number
- WO1998016092A1 WO1998016092A1 PCT/JP1997/003566 JP9703566W WO9816092A1 WO 1998016092 A1 WO1998016092 A1 WO 1998016092A1 JP 9703566 W JP9703566 W JP 9703566W WO 9816092 A1 WO9816092 A1 WO 9816092A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- capacitor
- wiring board
- printed wiring
- power supply
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a printed wiring board device used for an electronic device such as an information device, and an electronic device such as an information device using the printed wiring board device.
- the electromagnetic wave actually observed on the printed wiring board has a frequency distribution different from that predicted from the current distribution on the signal line, and is sharp at a specific frequency regardless of the characteristics of the signal line. It is known that it has peaks and other characteristics.
- the main cause of electromagnetic radiation from the printed wiring board is not the signal line but the power supply system. Predicted to be electrical resonance of power supply and ground layers of substrate Have been.
- a first capacitor disposed along a peripheral portion of a substrate portion where the power supply layer and the ground layer face each other, and coupling the power supply layer and the ground layer in high frequency;
- a second core disposed between a power supply pin of the respective active elements on the wiring board or a power supply layer near the power supply pin and the ground layer, and serving as a source of a transient current to the respective active elements.
- a capacitor disposed between a power supply pin of the respective active elements on the wiring board or a power supply layer near the power supply pin and the ground layer, and serving as a source of a transient current to the respective active elements.
- the peripheral portion of the substrate portion on which the first capacitor is arranged may be a peripheral portion on one end side in the direction of the electric resonance current unique to the printed wiring board, or It may be a peripheral portion facing the one end side and the other end side, or may be a peripheral portion extending all around the substrate portion.
- the peripheral portion of the substrate portion on which the first capacitor is arranged is a peripheral portion on one end side and the other end side in the direction of the electric resonance current unique to the printed wiring board.
- the first capacitor is arranged symmetrically with respect to an axis perpendicular to the direction of the electric resonance current.
- the power supply device has a power supply layer and a ground layer, and the power supply layer and the ground layer are provided.
- a printed wiring board connected to the power supply layer and the ground layer, the printed wiring board being connected to the ground layer and having an active element mounted thereon.
- a first capacitor disposed along a node of an electric resonance current specific to the power supply layer and coupling the power supply layer and the ground layer in high frequency; and a first capacitor on the printed wiring board.
- a second capacitor disposed between a power supply pin of the active element or a power supply layer near the active element and the ground layer, and serving as a transient current supply source for the respective active element; And are provided.
- the node of the electric resonance current where the first capacitor is disposed is a node which is a peripheral portion on one end side of the substrate portion in the direction of the electric resonance current, or one end and the other end.
- the peripheral portion may be a knot portion which is a peripheral portion facing the side, or a peripheral portion which covers the entire periphery of the substrate portion.
- the capacitance of the first capacitor is equal to or more than 10 minus 9th power, and the second capacitor is used. It is desirable that the capacitance of the capacitor be equal to or greater than 10 minus the eighth power.
- the first capacitor is arranged at a linear density of 20 or more per meter.
- a resistor may be connected in series with the first capacitor.
- the printed wiring board device in an electronic device using the printed wiring board device, is the one according to the first or second invention.
- the inventor actually used a four-layer printed wiring board to measure the electric resonance between the power supply layer and the ground layer of the printed wiring board and the electromagnetic radiation from the printed wiring board. Investigated the relationship. As a result, it was found that standing waves were generated on the power supply layer and the ground layer with the board edge as the open end, and the standing waves generated electromagnetic radiation from the printed wiring board. did.
- the standing wave generated on the power supply layer and the ground layer has a width W in the direction of the electric resonance current of the substrate portion where the power supply layer and the ground layer oppose each other;
- a fundamental wave with a frequency of f c / (2W ⁇ 1 / 2 ) (where c is the speed of light, £ is the relative permittivity of the substrate material), the second and third harmonics And the like.
- the inventor firstly found that the peripheral portion of the substrate portion where the power supply layer and the ground layer face each other at one end in the direction of the electric resonance current unique to the printed wiring board, Or along the opposing perimeters at one end and the other end, or along the nodes of the electrical resonance current inherent in the printed wiring board.
- the small effect of reducing electromagnetic radiation due to electrical resonance between the power supply layer and the ground layer is that the electric charge stored in the capacitor that couples the power supply layer and the ground layer at high frequency is due to the printed wiring board. It becomes a low-impedance current source when viewed from the power supply terminal of an active element such as a digital IC mounted on it, and when the active element operates, it becomes a source of electric charge to the active element. It is considered that a transient current flows through the active element, and the transient current couples with the resonance of the power supply layer and the ground layer to become a resonance current on the substrate surface.
- the digital ICs 3 and 4 are connected between the power pins 3V and 4V and the ground layer 12 respectively.
- the second capacitor 2 that supplies the transient current to 3 and 4 is placed.
- the power supply pins 3 V and 4 V of the digital ICs 3 and 4 are connected to the power supply layer 11 via the via holes 17 via one electrode 2 a of the second capacitor 2, respectively.
- the other electrode 2 b of the second capacitor 2 is connected to the ground layer 12 via a via hole 18.
- Fig. 11 shows a 4-cm square glass epoxy 4-layer printed wiring board as the printed wiring board 10.
- the distance between the power supply layer 11 and the ground layer 12 is 8 mm
- the substrate part of the power supply layer 11 and the ground layer 12 facing each other is 40 cm square
- the first capacitor 1 and the second capacitor 2 are not provided. It is the result of the actual measurement of the electromagnetic radiation level in the case.
- one gate of TTLIC 74 ALS04 was operated at a clock of 10 MHz, and the electromagnetic field was measured by the 3 m method.
- the figure (A) shows the case where the first capacitor 1 and the second capacitor 2 are not installed, and the peak radiated electric field intensity at around 170 MHz due to the first-order natural vibration of the substrate.
- E showed 37 dB; u VZm.
- Figure 14 shows the measurement results of the relationship between the density of the first capacitor 1 per side of the substrate and the suppression effect of electromagnetic radiation, and the plots with circles indicate the two opposing substrates. This is a case where the first capacitor 1 is arranged on the side of the substrate in a line symmetrical manner with respect to an axis perpendicular to the facing direction, and the triangle mark plots the first capacitor 1 only on one side of the substrate. This is the case when they are arranged.
- the first capacitors 1 are arranged at a line density of 40 or more per 40 cm, that is, 20 or more per lm on one side of the substrate. As a result, electromagnetic radiation can be sufficiently reduced.
- the first capacitor 1 When the first capacitor 1 is disposed on two opposing sides of the substrate, generally, as shown in FIG. 16 (A), the first capacitor 1 is disposed asymmetrically with respect to an axis orthogonal to the opposing direction of the two sides. Rather, it is more desirable to arrange them symmetrically with respect to an axis orthogonal to the opposite direction as shown in FIG. In particular, for those whose current flows almost along the substrate axis, such as primary resonance, such a line-symmetric arrangement increases the effect of suppressing electromagnetic radiation.
- the active element such as an IC and the second capacitor are omitted, if the active element such as an IC is disposed near a node of the electric resonance current, the power pin of the active element is connected to the electric pin. By placing it at the node of the resonance current, the second capacitor for the power supply pin can also serve as the first capacitor to be placed at the node of the electrical resonance current. It can be.
- a resistor 21 may be connected to each of the first capacitors 1 in series.
- the high-frequency current bypassing the first capacitor 1 is consumed as energy in the resistor 21, and the potential of the power supply layer 11 and the ground layer 12 is reduced. Has the advantage of being stabilized.
- the printed wiring board device of the present invention can be suitably used for electronic devices such as information devices.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/068,763 US6166457A (en) | 1996-10-07 | 1997-10-06 | Printed-circuit assembly |
DE69733118T DE69733118T2 (de) | 1996-10-07 | 1997-10-06 | Anordnung mit gedruckter schaltungsplatte |
EP97942258A EP0873046B1 (en) | 1996-10-07 | 1997-10-06 | Printed wiring board device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8284688A JP3036629B2 (ja) | 1996-10-07 | 1996-10-07 | プリント配線基板装置 |
JP8/284688 | 1996-10-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998016092A1 true WO1998016092A1 (fr) | 1998-04-16 |
Family
ID=17681697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1997/003566 WO1998016092A1 (fr) | 1996-10-07 | 1997-10-06 | Composant avec carte a circuit imprime |
Country Status (8)
Country | Link |
---|---|
US (1) | US6166457A (ja) |
EP (1) | EP0873046B1 (ja) |
JP (1) | JP3036629B2 (ja) |
KR (1) | KR100494821B1 (ja) |
CN (1) | CN1113584C (ja) |
DE (1) | DE69733118T2 (ja) |
TW (1) | TW351909B (ja) |
WO (1) | WO1998016092A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6166457A (en) * | 1996-10-07 | 2000-12-26 | Fuji Xerox Co., Ltd. | Printed-circuit assembly |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2970660B1 (ja) | 1998-06-30 | 1999-11-02 | 日本電気株式会社 | プリント基板 |
JP3471679B2 (ja) * | 1999-10-15 | 2003-12-02 | 日本電気株式会社 | プリント基板 |
US6775122B1 (en) * | 1999-12-28 | 2004-08-10 | Intel Corporation | Circuit board with added impedance |
US6337798B1 (en) * | 2000-01-25 | 2002-01-08 | Dell Usa, L.P. | Digital circuit decoupling for EMI reduction |
NL1014192C2 (nl) * | 2000-01-26 | 2001-08-08 | Industree B V | Printplaat. |
JP3925032B2 (ja) * | 2000-03-14 | 2007-06-06 | 富士ゼロックス株式会社 | プリント配線基板 |
JP2001332825A (ja) | 2000-03-14 | 2001-11-30 | Fuji Xerox Co Ltd | 回路基板装置及び設計支援装置 |
US6418031B1 (en) * | 2000-05-01 | 2002-07-09 | International Business Machines Corporation | Method and means for decoupling a printed circuit board |
JP3455498B2 (ja) * | 2000-05-31 | 2003-10-14 | 株式会社東芝 | プリント基板および情報処理装置 |
US6727774B1 (en) * | 2000-06-19 | 2004-04-27 | Sun Microsystems, Inc. | Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures |
US6501664B1 (en) * | 2000-06-30 | 2002-12-31 | Intel Corporation | Decoupling structure and method for printed circuit board component |
JP4599678B2 (ja) * | 2000-07-19 | 2010-12-15 | 日本電気株式会社 | 多層プリント回路基板 |
US6525622B1 (en) | 2000-11-17 | 2003-02-25 | Sun Microsystems, Inc. | Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conducts of an electrical power distribution structure |
JP3531621B2 (ja) * | 2001-04-12 | 2004-05-31 | 日本電気株式会社 | 携帯型無線利用機器 |
KR100720410B1 (ko) * | 2001-07-13 | 2007-05-22 | 앰코 테크놀로지 코리아 주식회사 | 수동소자가 패턴된 반도체 패키지용 섭스트레이트 |
US20030042044A1 (en) * | 2001-08-30 | 2003-03-06 | Micron Technology, Inc. | Circuit board plane interleave apparatus and method |
US6900992B2 (en) * | 2001-09-18 | 2005-05-31 | Intel Corporation | Printed circuit board routing and power delivery for high frequency integrated circuits |
US6646425B2 (en) * | 2002-02-21 | 2003-11-11 | Texas Instruments Incorporated | Multi-cell voltage regulator and method thereof |
US7061772B2 (en) | 2002-08-05 | 2006-06-13 | Nec Tokin Corporation | Electronic circuit with transmission line type noise filter |
US6856209B2 (en) * | 2002-09-27 | 2005-02-15 | Visteon Global Technologies, Inc. | EMI suppression method for powertrain control modules |
DE10305520A1 (de) * | 2003-02-11 | 2004-08-19 | Robert Bosch Gmbh | Vorrichtung und Verfahren zur Dämpfung von Hohlraumresonanzen in einer mehrschichtigen Trägereinrichtung |
US7120398B2 (en) * | 2003-09-18 | 2006-10-10 | Kyocera Wireless Corp. | Mobile communication devices having high frequency noise reduction and methods of making such devices |
CN1322386C (zh) * | 2004-01-09 | 2007-06-20 | 佛山市顺德区顺达电脑厂有限公司 | 可抑制电磁干扰的抵销电路及其运行方法 |
KR100583458B1 (ko) * | 2004-01-28 | 2006-05-26 | 삼성전자주식회사 | Emi를 고려한 인쇄회로기판 |
JP4273098B2 (ja) * | 2004-09-07 | 2009-06-03 | キヤノン株式会社 | 多層プリント回路板 |
JP4967241B2 (ja) * | 2005-02-25 | 2012-07-04 | パナソニック株式会社 | コンデンサ内蔵配線基板及びその製造方法と電子機器 |
JP4689461B2 (ja) * | 2005-12-26 | 2011-05-25 | 富士通株式会社 | プリント基板 |
CN100562210C (zh) * | 2006-02-22 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | 电路板组合 |
KR100801288B1 (ko) | 2006-02-28 | 2008-02-11 | 인천대학교 산학협력단 | 평면 회로 기판〔pcb〕전력 공급 장치 |
JP5176736B2 (ja) | 2008-07-15 | 2013-04-03 | 富士ゼロックス株式会社 | プリント配線基板 |
JP5133813B2 (ja) * | 2008-08-11 | 2013-01-30 | レノボ・シンガポール・プライベート・リミテッド | 積層セラミック・コンデンサの単位配置構造、全体配置構造およびプリント配線基板 |
JP2010098162A (ja) * | 2008-10-17 | 2010-04-30 | Hitachi Ltd | プリント配線基板および設計支援システム |
CN101932192A (zh) * | 2009-06-18 | 2010-12-29 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
KR101038236B1 (ko) * | 2009-09-16 | 2011-06-01 | 삼성전기주식회사 | 전자기 밴드갭 구조를 구비하는 인쇄회로기판 |
DE102015223534B4 (de) * | 2015-11-27 | 2019-05-23 | Siemens Healthcare Gmbh | Schaltungsanordnung zur Reduzierung der maximalen elektrischen Feldstärke, Hochspannungserzeugungseinheit mit einer derartigen Schaltungsanordnung und Röntgengenerator mit einer derartigen Hochspannungserzeugungseinheit |
JP6669513B2 (ja) | 2016-02-03 | 2020-03-18 | 富士ゼロックス株式会社 | 回路基板および回路基板の製造方法 |
CN106102304B (zh) * | 2016-06-28 | 2017-10-17 | 广东欧珀移动通信有限公司 | 移动终端及其印刷电路板pcb |
CN111123065B (zh) * | 2018-10-30 | 2022-05-10 | 浙江宇视科技有限公司 | 印刷电路板布线检视方法及装置 |
CN112910246B (zh) * | 2021-01-20 | 2022-07-05 | 华中科技大学 | 一种pcb功率环路emi抑制电路 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0290587A (ja) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | プリント基板 |
JPH02237091A (ja) * | 1989-03-09 | 1990-09-19 | Fujitsu Ltd | 印刷配線板 |
JPH08242047A (ja) * | 1995-03-06 | 1996-09-17 | Oki Electric Ind Co Ltd | プリント配線板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63107187A (ja) * | 1986-10-24 | 1988-05-12 | 株式会社東芝 | 実装基板 |
JPH02187093A (ja) * | 1989-01-13 | 1990-07-23 | Toshiba Corp | 印刷配線板 |
US4904988A (en) * | 1989-03-06 | 1990-02-27 | Nesbit Charles E | Toy with a smoke detector |
JP2819775B2 (ja) * | 1990-05-21 | 1998-11-05 | 日本電気株式会社 | 混成集積回路装置 |
JPH04202477A (ja) * | 1990-11-30 | 1992-07-23 | Titan Kogyo Kk | 樹脂組成物 |
US5376759A (en) * | 1993-06-24 | 1994-12-27 | Northern Telecom Limited | Multiple layer printed circuit board |
JPH07202477A (ja) * | 1993-12-28 | 1995-08-04 | Nec Corp | 電磁妨害雑音対策用プリント板 |
JPH07235775A (ja) * | 1994-02-21 | 1995-09-05 | Mitsubishi Electric Corp | 多層プリント配線基板 |
US5523921A (en) * | 1994-12-22 | 1996-06-04 | Hewlett-Packard Company | Printed circuit assembly having improved reference plane isolation |
JP3036629B2 (ja) * | 1996-10-07 | 2000-04-24 | 富士ゼロックス株式会社 | プリント配線基板装置 |
JP3926880B2 (ja) * | 1997-03-31 | 2007-06-06 | 富士通株式会社 | 多層プリント板 |
JP3058121B2 (ja) * | 1997-05-19 | 2000-07-04 | 日本電気株式会社 | プリント基板 |
-
1996
- 1996-10-07 JP JP8284688A patent/JP3036629B2/ja not_active Expired - Lifetime
-
1997
- 1997-10-04 TW TW086114498A patent/TW351909B/zh not_active IP Right Cessation
- 1997-10-06 EP EP97942258A patent/EP0873046B1/en not_active Expired - Lifetime
- 1997-10-06 WO PCT/JP1997/003566 patent/WO1998016092A1/ja active IP Right Grant
- 1997-10-06 DE DE69733118T patent/DE69733118T2/de not_active Expired - Lifetime
- 1997-10-06 KR KR10-1998-0704231A patent/KR100494821B1/ko not_active IP Right Cessation
- 1997-10-06 US US09/068,763 patent/US6166457A/en not_active Expired - Lifetime
- 1997-10-06 CN CN97192035A patent/CN1113584C/zh not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0290587A (ja) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | プリント基板 |
JPH02237091A (ja) * | 1989-03-09 | 1990-09-19 | Fujitsu Ltd | 印刷配線板 |
JPH08242047A (ja) * | 1995-03-06 | 1996-09-17 | Oki Electric Ind Co Ltd | プリント配線板 |
Non-Patent Citations (1)
Title |
---|
See also references of EP0873046A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6166457A (en) * | 1996-10-07 | 2000-12-26 | Fuji Xerox Co., Ltd. | Printed-circuit assembly |
Also Published As
Publication number | Publication date |
---|---|
TW351909B (en) | 1999-02-01 |
EP0873046A4 (en) | 2001-02-07 |
JP3036629B2 (ja) | 2000-04-24 |
EP0873046A1 (en) | 1998-10-21 |
KR100494821B1 (ko) | 2005-09-30 |
DE69733118D1 (de) | 2005-06-02 |
DE69733118T2 (de) | 2005-12-01 |
CN1210661A (zh) | 1999-03-10 |
JPH10112574A (ja) | 1998-04-28 |
CN1113584C (zh) | 2003-07-02 |
KR19990071943A (ko) | 1999-09-27 |
US6166457A (en) | 2000-12-26 |
EP0873046B1 (en) | 2005-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO1998016092A1 (fr) | Composant avec carte a circuit imprime | |
US6624536B1 (en) | Electromagnetic noise reducing device, noise reducing electronic component and electronic appliance manufacturing method | |
US6188297B1 (en) | Low-EMI circuit board and low-EMI cable connector | |
US6297965B1 (en) | Wiring arrangement including capacitors for suppressing electromagnetic wave radiation from a printed circuit board | |
US6359237B1 (en) | Multi-layer printed board | |
EP0766503B1 (en) | Multi-layered printed circuit board, and grid array package adopting the same | |
US6980074B1 (en) | Low noise full integrated multilayers magnetic for power converters | |
JP3471679B2 (ja) | プリント基板 | |
US6985364B2 (en) | Voltage converter module | |
US6603668B2 (en) | Interlayer structure with multiple insulative layers with different frequency characteristics | |
JPH1140915A (ja) | プリント配線板 | |
US6614663B1 (en) | Reducing impedance of power supplying system in a circuit board by connecting two points in one of a power supply pattern and a ground pattern by a resistive member | |
JP2000183541A (ja) | 多層プリント基板 | |
US5912597A (en) | Printed circuit board | |
WO2002091515A1 (en) | Transmission line type components | |
US7606018B2 (en) | Surge absorbing circuit | |
US6215076B1 (en) | Printed circuit board with noise suppression | |
US5132650A (en) | Lc noise filter | |
JPH09199818A (ja) | グランド間接続構造 | |
CN115299184B (zh) | 电路基板及电子设备 | |
KR100404791B1 (ko) | 전자회로패키지 | |
JP2008198761A (ja) | 半導体装置 | |
JP4190040B2 (ja) | 回路基板装置及び電子機器 | |
JPH1140905A (ja) | 回路基板及び電子機器 | |
KR100484827B1 (ko) | 회로기판의 고주파 노이즈 제거구조 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 97192035.4 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CN KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1019980704231 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1997942258 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 09068763 Country of ref document: US |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWP | Wipo information: published in national office |
Ref document number: 1997942258 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1019980704231 Country of ref document: KR |
|
WWG | Wipo information: grant in national office |
Ref document number: 1019980704231 Country of ref document: KR |
|
WWG | Wipo information: grant in national office |
Ref document number: 1997942258 Country of ref document: EP |