JP4689461B2 - プリント基板 - Google Patents
プリント基板 Download PDFInfo
- Publication number
- JP4689461B2 JP4689461B2 JP2005371512A JP2005371512A JP4689461B2 JP 4689461 B2 JP4689461 B2 JP 4689461B2 JP 2005371512 A JP2005371512 A JP 2005371512A JP 2005371512 A JP2005371512 A JP 2005371512A JP 4689461 B2 JP4689461 B2 JP 4689461B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive
- conductive layer
- power supply
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (3)
- 第1絶縁層と、前記第1絶縁層の表面に形成される電源用の第1導電層と、電子回路部品の投影像で象られ、前記第1絶縁層の表面で前記第1導電層から隔てられる島状の電源用第2導電層と、前記第1および第2導電層を相互に接続する第1導電片と、第2絶縁層と、前記第2絶縁層の表面に形成されるグラウンド用の第3導電層と、前記電子回路部品の前記投影像で象られ、前記第2絶縁層の表面で前記第3導電層から隔てられる島状のグラウンド用第4導電層と、前記第3および第4導電層を相互に接続する第2導電片とを備え、前記第1導電片は前記電子回路部品のクロック端子に最も近い位置で前記第2導電層に接続され、前記第2導電片は前記電子回路部品の前記クロック端子に最も近い位置で前記第4導電層に接続されることを特徴とするプリント基板。
- 請求項1に記載のプリント基板において、前記第1および第2導電層並びに前記第1導電片の組み合わせと、前記第3および第4導電層並びに前記第2導電片の組み合わせとは交互に複数対で配置されることを特徴とするプリント基板。
- 請求項1に記載のプリント基板において、第3絶縁層と、前記第3絶縁層の表面に形成される電源用の第5導電層と、前記電子回路部品の前記投影像で象られ、前記第3絶縁層の表面で前記第5導電層から隔てられる島状の電源用第6導電層と、前記第5および第6導電層を相互に接続する第3導電片とをさらに備えることを特徴とするプリント基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005371512A JP4689461B2 (ja) | 2005-12-26 | 2005-12-26 | プリント基板 |
US11/376,331 US7428155B2 (en) | 2005-12-26 | 2006-03-16 | Printed wiring board including power supply layer and ground layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005371512A JP4689461B2 (ja) | 2005-12-26 | 2005-12-26 | プリント基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007173665A JP2007173665A (ja) | 2007-07-05 |
JP4689461B2 true JP4689461B2 (ja) | 2011-05-25 |
Family
ID=38192283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005371512A Expired - Fee Related JP4689461B2 (ja) | 2005-12-26 | 2005-12-26 | プリント基板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7428155B2 (ja) |
JP (1) | JP4689461B2 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101730377A (zh) * | 2008-10-29 | 2010-06-09 | 鸿富锦精密工业(深圳)有限公司 | 耦合层及具有该耦合层的印刷电路板 |
KR101609597B1 (ko) * | 2009-02-16 | 2016-04-07 | 삼성디스플레이 주식회사 | 회로기판 및 이를 갖는 표시패널 어셈블리 |
KR101072591B1 (ko) * | 2009-08-10 | 2011-10-11 | 삼성전기주식회사 | Emi 노이즈 저감 인쇄회로기판 |
KR101021551B1 (ko) * | 2009-09-22 | 2011-03-16 | 삼성전기주식회사 | 전자기 밴드갭 구조를 구비하는 인쇄회로기판 |
KR101023541B1 (ko) * | 2009-09-22 | 2011-03-21 | 삼성전기주식회사 | Emi 노이즈 저감 인쇄회로기판 |
JP2011187809A (ja) * | 2010-03-10 | 2011-09-22 | Renesas Electronics Corp | 半導体装置および多層配線基板 |
JP5333366B2 (ja) * | 2010-07-07 | 2013-11-06 | オムロン株式会社 | ネットワーク機器および通信モジュール |
US8982576B2 (en) * | 2010-09-21 | 2015-03-17 | Nec Corporation | Printed wiring board, and method of supplying power and forming wiring for printed wiring board |
JP5669499B2 (ja) * | 2010-09-24 | 2015-02-12 | キヤノン株式会社 | プリント回路板 |
JP5634822B2 (ja) * | 2010-10-20 | 2014-12-03 | 矢崎総業株式会社 | 電気接続箱 |
JP5634823B2 (ja) * | 2010-10-20 | 2014-12-03 | 矢崎総業株式会社 | メタルコア基板、それを備えた電気接続箱 |
TW201316895A (zh) * | 2011-10-14 | 2013-04-16 | Hon Hai Prec Ind Co Ltd | 可抑制電磁干擾的電路板 |
JP6153319B2 (ja) * | 2011-12-08 | 2017-06-28 | キヤノン株式会社 | プリント回路板、プリント配線板及び電子機器 |
KR102032887B1 (ko) * | 2012-12-10 | 2019-10-16 | 삼성전자 주식회사 | 반도체 패키지 및 반도체 패키지의 라우팅 방법 |
JP6098802B2 (ja) * | 2013-03-25 | 2017-03-22 | セイコーエプソン株式会社 | 液体噴射装置及び印刷装置 |
JP5756958B2 (ja) * | 2013-10-21 | 2015-07-29 | 株式会社野田スクリーン | 多層回路基板 |
JP6691762B2 (ja) * | 2015-11-03 | 2020-05-13 | 日本特殊陶業株式会社 | 検査用配線基板 |
WO2024022449A1 (zh) * | 2022-07-27 | 2024-02-01 | 摩尔线程智能科技(北京)有限责任公司 | 印刷电路板和包括印刷电路板的电子设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0290587A (ja) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | プリント基板 |
JPH06216541A (ja) * | 1993-01-19 | 1994-08-05 | Nippondenso Co Ltd | プリント基板 |
JPH10275981A (ja) * | 1997-03-31 | 1998-10-13 | Fujitsu Ltd | 多層プリント板 |
JPH11233951A (ja) * | 1998-02-16 | 1999-08-27 | Canon Inc | プリント配線板 |
JP2003110046A (ja) * | 2001-09-28 | 2003-04-11 | Kyocera Corp | 多層配線基板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06244562A (ja) | 1993-02-19 | 1994-09-02 | Hitachi Ltd | プリント回路基板 |
JP3036629B2 (ja) * | 1996-10-07 | 2000-04-24 | 富士ゼロックス株式会社 | プリント配線基板装置 |
JP3055136B2 (ja) * | 1998-03-16 | 2000-06-26 | 日本電気株式会社 | プリント回路基板 |
US6104258A (en) * | 1998-05-19 | 2000-08-15 | Sun Microsystems, Inc. | System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus |
US6937480B2 (en) * | 2001-05-14 | 2005-08-30 | Fuji Xerox Co., Ltd. | Printed wiring board |
-
2005
- 2005-12-26 JP JP2005371512A patent/JP4689461B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-16 US US11/376,331 patent/US7428155B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0290587A (ja) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | プリント基板 |
JPH06216541A (ja) * | 1993-01-19 | 1994-08-05 | Nippondenso Co Ltd | プリント基板 |
JPH10275981A (ja) * | 1997-03-31 | 1998-10-13 | Fujitsu Ltd | 多層プリント板 |
JPH11233951A (ja) * | 1998-02-16 | 1999-08-27 | Canon Inc | プリント配線板 |
JP2003110046A (ja) * | 2001-09-28 | 2003-04-11 | Kyocera Corp | 多層配線基板 |
Also Published As
Publication number | Publication date |
---|---|
US7428155B2 (en) | 2008-09-23 |
US20070144770A1 (en) | 2007-06-28 |
JP2007173665A (ja) | 2007-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4689461B2 (ja) | プリント基板 | |
US6621012B2 (en) | Insertion of electrical component within a via of a printed circuit board | |
US8913401B2 (en) | Multilayer wiring board | |
US7271348B1 (en) | Providing decoupling capacitors in a circuit board | |
CN101502187A (zh) | 具有可构形的接地联接、共面的电路和接地轨迹的电路板 | |
US20200045815A1 (en) | Circuit board and electronic device including the same | |
JP6671551B1 (ja) | 多層プリント基板 | |
EP2728976B1 (en) | Printed circuit board with reduced emission of electro-magnetic radiation | |
KR100822109B1 (ko) | 회로기판 어셈블리 및 그를 이용하는 전자장치 | |
US9226386B2 (en) | Printed circuit board with reduced emission of electro-magnetic radiation | |
JP2020025076A (ja) | モジュール | |
WO2022071235A1 (ja) | 回路モジュール | |
CN104637906A (zh) | 用于电路基板和半导体封装的焊料桥接阻止结构 | |
JP2002057418A (ja) | プリント配線基板 | |
CN105376962A (zh) | 电路板结构的改良方法 | |
JP2008098251A (ja) | 配線基板 | |
JP5939137B2 (ja) | 多層配線基板 | |
US6842344B1 (en) | Multi-layer printed circuit board and signal routing therein | |
US20090255723A1 (en) | Printed circuit board with ground grid | |
TWI444115B (zh) | 印刷電路板和晶片系統 | |
JP2010062180A (ja) | 多層プリント配線板 | |
JP2007281004A (ja) | 多層配線構造体および多層プリント基板 | |
KR102279152B1 (ko) | 배선용 인터포저 및 이를 구비하는 전자 모듈 | |
JP4280141B2 (ja) | 多層プリント配線板 | |
JP2005310895A (ja) | 多層配線板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080416 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20101022 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101026 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101227 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110215 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110216 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4689461 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140225 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |