CN100562210C - 电路板组合 - Google Patents

电路板组合 Download PDF

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CN100562210C
CN100562210C CNB2006100339247A CN200610033924A CN100562210C CN 100562210 C CN100562210 C CN 100562210C CN B2006100339247 A CNB2006100339247 A CN B2006100339247A CN 200610033924 A CN200610033924 A CN 200610033924A CN 100562210 C CN100562210 C CN 100562210C
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weld pad
motherboard
shell fragment
daughter board
power supply
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CN101026922A (zh
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谢明志
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNB2006100339247A priority Critical patent/CN100562210C/zh
Priority to US11/309,718 priority patent/US7390193B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

一种电路板组合，其包括一母板与一子板，该子板通过连接器与该母板电性连接，该母板包括至少一焊垫，该子板对应包括至少一焊垫，该电路板组合还包括至少一弹片，该弹片的两端分别与该母板及该子板的焊垫电性连接。

Description

电路板组合
【技术领域】
本发明涉及一种电路板组合。
【背景技术】
现有的电路板系统一般包括有母板(也称母卡、主卡或主板)及若干子板。母板及子板分别包括有电源层、接地层及信号层。母板一般采用无源设计且结构上是固定的；子板则是可以活动的，通过可插拔的连接器与母板电性连接。在母板与子板之间的信号互连方面，如果母板与子板的位置相互垂直，母板可采用直公(straight male)连接器，而子板一般采用弯母(right angle female)连接器。如果母板与子板处于同一平面，母板及子板可采用弯公(right angle male)和弯母(right anglefemale)连接器达成电性连接。母板与子板采用的连接器中分别对应包括有接地端子、电源端子及信号端子。如中国专利第02130034.8号所揭示的技术内容。
在计算机主频频率较低时，一般不会因为接地不良或电压供给不稳而影响信号传输的正确性，或使集成电路操作不正常。但是，当计算机的主频达到数百MHz(百万赫兹)的高频时，仅靠连接器中数量有限的端子提供电源或进行接地，这样就容易造成电源与接地回路的不足，从而使得传输信号不稳，以及使电磁干扰(EMI)无法宣泄。
【发明内容】
鉴于以上所述，有必要提供一种增加电流回路的电路板组合。
一种电路板组合，其包括一母板与一子板，该子板通过连接器与该母板电性连接，该母板包括至少一焊垫，该子板对应包括至少一焊垫，该电路板组合还包括至少一弹片，该弹片的两端分别与该母板及该子板的焊垫电性连接。
该母板上的焊垫是电源焊垫，其与该母板的电源层电性连接，该子板上的焊垫是电源焊垫，其与该子板的电源层电性连接。
该母板上的焊垫是接地焊垫，其与该母板的接地层电性连接，该子板上的焊垫是接地焊垫，其与该子板的接地层电性连接。
该母板上的焊垫分别为电源焊垫及接地焊垫，该子板上对应设有电源焊垫及接地焊垫，所述弹片包括一与该母板及该子板上的接地焊垫电性连接的第一弹片及一与该母板及该子板上的电源焊垫电性连接的第二弹片。
该母板及该子板之间通过金属弹片增加母板与子板间电源与接地的接触面积，提供了充足的电源与接地回路。
【附图说明】
图1是本发明电路板组合的较佳实施方式的示意分解图。
图2是图1的组装图。
图3及图4是本发明电路板组合的其他较佳实施方式的示意图。
【具体实施方式】
请参考图1，本发明电路板组合的较佳实施方式包括一母板1、一子板2、一第一弹片3及一第二弹片4。
该母板1设有一电源焊垫10及一接地焊垫14。该电源焊垫10电性连接于该母板1的电源层；该接地焊垫14电性连接于该母板1的接地层；该母板1设有一连接器11。
该子板2对应设有一电源焊垫20及一接地焊垫24。该电源焊垫20电性连接于该子板2的电源层；该接地焊垫24电性连接于该子板2的接地层。该子板20上设有一可与该母板10的连接器11电性连接的连接器21。
该第一弹片3与该第二弹片4是选用导电性能优良及弹性好的金属材料弯折制成，该第一弹片3及该第二弹片4分别包括大致呈U型的弹性部32、42及平直的固定部31、41。
请参考图2，该子板2的连接器21插接于该母板1的连接器11。该第一弹片3的固定部31焊接在该母板1的电源焊垫10，其弹性部32弹性抵接在该子板2的电源焊垫20上。该第二弹片4的固定部41焊接在该母板2的接地焊垫14，其弹性部42弹性抵接在该子板2的接地焊垫24上。使用该第一弹片3及第二弹片4相当于增加了母板1及子板2之间电源及接地的接触面积，从而稳定了电源及接地，并可防止电磁干扰。根据需要，可相应增加第一弹片3及第二弹片4的数量，以更好的实现稳定电源及加强接地。本实施例中该固定部31、41也可焊接于该子板2的焊垫20、24上，相应地，该弹性部32、42抵接在该母板1的焊垫10、14上。
图3及图4是本发明电路板组合的其他较佳实施方式。图3仅是为稳定电源，该弹片5的一端是焊接在该母板1的电源焊垫10上，另一端弹性抵接在该子板2的电源焊垫20上。该弹片5根据需要可设置多个。图4仅是为增强接地，该弹片6的一端是焊接在该子板2的接地焊垫24上，另一端弹性抵接在该母板1的接地焊垫14上。该弹片6根据需要亦可设置多个。

Claims (10)

1.一种电路板组合，其包括一母板与一子板，该子板通过连接器与该母板电性连接，其特征在于：该电路板组合还包括至少一弹片，该母板包括至少一与母板的电源层电性连接的电源焊垫或一与该母板的接地层电性连接接地焊垫，该子板对应包括至少一与该子板的电源层电性连接的电源焊垫或一与该子板的接地层电性连接的接地焊垫，该弹片的两端分别与该母板及该子板的电源焊垫或接地焊垫电性连接。
2.如权利要求1所述的电路板组合，其特征在于：所述弹片的一端是焊接于所述母板的电源焊垫上，所述弹片的另一端与所述子板的电源焊垫电性连接。
3.如权利要求1所述的电路板组合，其特征在于：所述弹片的一端是焊接于所述母板的接地焊垫上，所述弹片的另一端与所述子板的接地焊垫电性连接。
4.如权利要求1所述的电路板组合，其特征在于：所述弹片的一端与所述母板的电源焊垫电性连接，所述弹片的另一端是焊接于所述子板的电源焊垫电性连接。
5.如权利要求1所述的电路板组合，其特征在于：所述弹片的一端与所述母板的接地焊垫电性连接，所述弹片的另一端是焊接于所述子板的接地焊垫电性连接。
6.一种电路板组合，其包括一母板与一子板，该子板通过连接器与该母板电性连接，其特征在于：该电路板组合还包括第一、第二弹片，该母板包括一与母板的电源层电性连接的电源焊垫及一与该母板的接地层电性连接接地焊垫，该子板对应包括一与该子板的电源层电性连接的电源焊垫及一与该子板的接地层电性连接的接地焊垫，所述第一弹片的两端分别与该母板及该子板的电源焊垫电性连接，所述第二弹片的两端分别与该母板及该子板的接地焊垫电性连接。
7.如权利要求6所述的电路板组合，其特征在于：所述第一弹片的一端是焊接于母板的电源焊垫上，所述第一弹片的另一端与所述子板的电源焊垫电性连接，所述第二弹片的一端是焊接于母板的接地焊垫上，所述第二弹片的另一端与所述子板的接地焊垫电性连接。
8.如权利要求6所述的电路板组合，其特征在于：所述第一弹片的一端是焊接于母板的电源焊垫上，所述第一弹片的另一端与所述子板的电源焊垫电性连接，所述第二弹片的一端与所述母板的接地焊垫电性连接，所述第二弹片的另一端是焊接于所述子板的接地焊垫上。
9.如权利要求6所述的电路板组合，其特征在于：所述第一弹片的一端与所述母板的电源焊垫电性连接，所述第一弹片的另一端是焊接于所述子板的电源焊垫电性连接，所述第二弹片的一端是焊接于母板的接地焊垫上，所述第二弹片的另一端与所述子板的接地焊垫电性连接。
10.如权利要求6所述的电路板组合，其特征在于：所述第一弹片的一端与所述母板的电源焊垫电性连接，所述第一弹片的另一端是焊接于所述子板的电源焊垫电性连接，所述第二弹片的一端与所述母板的接地焊垫电性连接，所述第二弹片的另一端是焊接于所述子板的接地焊垫上。
CNB2006100339247A 2006-02-22 2006-02-22 电路板组合 Expired - Fee Related CN100562210C (zh)

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US11/309,718 US7390193B2 (en) 2006-02-22 2006-09-15 Printed circuit board assembly

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TWI403231B (zh) * 2008-03-11 2013-07-21 Delta Electronics Inc 表面黏著型電路板件模組及其製法
DE102008001557A1 (de) * 2008-05-05 2009-11-12 Robert Bosch Gmbh Messerleisten-Kontaktierung über Zwischenleiterplatten
JP5310239B2 (ja) 2009-05-09 2013-10-09 富士通株式会社 接続端子および伝送線路
US20110124209A1 (en) * 2009-11-24 2011-05-26 Moxa Inc. Converter
CN101968731B (zh) * 2010-11-02 2013-01-02 北京安天电子设备有限公司 一种电路板组合
TWI464563B (zh) * 2012-04-20 2014-12-11 Gemtek Technology Co Ltd 電子裝置組合結構
TWI596996B (zh) 2016-01-08 2017-08-21 和碩聯合科技股份有限公司 電路板組合
CN209298384U (zh) * 2019-03-04 2019-08-23 台达电子企业管理（上海）有限公司 通用型电源输入组件
CN110808492A (zh) * 2019-10-25 2020-02-18 天津航空机电有限公司 一种基于pcb的航空功率继电器安装模块
CN111711032A (zh) * 2020-06-30 2020-09-25 瑞声精密制造科技(常州)有限公司 传输线模组及电磁兼容处理方法
CN212542862U (zh) * 2020-06-30 2021-02-12 瑞声精密制造科技(常州)有限公司 一种连接器

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US20070197091A1 (en) 2007-08-23
US7390193B2 (en) 2008-06-24

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