TWI895705B - 維護裝置 - Google Patents

維護裝置

Info

Publication number
TWI895705B
TWI895705B TW112110168A TW112110168A TWI895705B TW I895705 B TWI895705 B TW I895705B TW 112110168 A TW112110168 A TW 112110168A TW 112110168 A TW112110168 A TW 112110168A TW I895705 B TWI895705 B TW I895705B
Authority
TW
Taiwan
Prior art keywords
maintenance
maintenance device
unit
gate
housing
Prior art date
Application number
TW112110168A
Other languages
English (en)
Chinese (zh)
Other versions
TW202329241A (zh
Inventor
上田雄大
廣瀬潤
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202329241A publication Critical patent/TW202329241A/zh
Application granted granted Critical
Publication of TWI895705B publication Critical patent/TWI895705B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32807—Construction (includes replacing parts of the apparatus)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32889—Connection or combination with other apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
TW112110168A 2017-02-16 2018-02-06 維護裝置 TWI895705B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-026524 2017-02-16
JP2017026524A JP6812264B2 (ja) 2017-02-16 2017-02-16 真空処理装置、及びメンテナンス装置

Publications (2)

Publication Number Publication Date
TW202329241A TW202329241A (zh) 2023-07-16
TWI895705B true TWI895705B (zh) 2025-09-01

Family

ID=63104815

Family Applications (2)

Application Number Title Priority Date Filing Date
TW112110168A TWI895705B (zh) 2017-02-16 2018-02-06 維護裝置
TW107104109A TWI799406B (zh) 2017-02-16 2018-02-06 真空處理裝置及維護裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107104109A TWI799406B (zh) 2017-02-16 2018-02-06 真空處理裝置及維護裝置

Country Status (5)

Country Link
US (2) US11309168B2 (enExample)
JP (1) JP6812264B2 (enExample)
KR (2) KR102517504B1 (enExample)
CN (2) CN110808202B (enExample)
TW (2) TWI895705B (enExample)

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JP6888007B2 (ja) 2016-01-26 2021-06-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェハエッジリングの持ち上げに関する解決
KR102689380B1 (ko) 2016-01-26 2024-07-26 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼 에지 링 리프팅 솔루션
JP6635888B2 (ja) 2016-07-14 2020-01-29 東京エレクトロン株式会社 プラズマ処理システム
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US10553404B2 (en) 2017-02-01 2020-02-04 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
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JP7378318B2 (ja) * 2020-02-28 2023-11-13 東京エレクトロン株式会社 部品交換方法
JP7471106B2 (ja) * 2020-02-28 2024-04-19 東京エレクトロン株式会社 部品運搬装置
TWI871434B (zh) * 2020-03-03 2025-02-01 日商東京威力科創股份有限公司 電漿處理系統及邊緣環的更換方法
US12486120B2 (en) 2020-03-23 2025-12-02 Applied Materials, Inc. Substrate processing system carrier
US12027397B2 (en) 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features
JP7419154B2 (ja) * 2020-05-01 2024-01-22 東京エレクトロン株式会社 部品交換システムおよび部品交換装置
USD980176S1 (en) 2020-06-02 2023-03-07 Applied Materials, Inc. Substrate processing system carrier
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JP7409976B2 (ja) * 2020-06-22 2024-01-09 東京エレクトロン株式会社 プラズマ処理システム、プラズマ処理装置及びエッジリングの交換方法
JP7566526B2 (ja) * 2020-07-29 2024-10-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
CN121215503A (zh) 2020-12-25 2025-12-26 东京毅力科创株式会社 维护装置、真空处理系统和维护方法
JP7534048B2 (ja) * 2021-01-20 2024-08-14 東京エレクトロン株式会社 プラズマ処理システム及びプラズマ処理方法
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JP2022154234A (ja) * 2021-03-30 2022-10-13 東京エレクトロン株式会社 プラズマ処理システム、搬送アーム及び環状部材の搬送方法
JP7504058B2 (ja) * 2021-06-03 2024-06-21 東京エレクトロン株式会社 部品交換方法、部品交換装置、および部品交換システム
JP7743379B2 (ja) * 2021-09-06 2025-09-24 東京エレクトロン株式会社 基板処理装置及び基板処理装置のメンテナンス方法
CN114300393A (zh) * 2021-12-30 2022-04-08 北京北方华创微电子装备有限公司 半导体工艺设备及其检修方法
KR20240137104A (ko) * 2022-03-14 2024-09-19 주식회사 히타치하이테크 진공 처리 장치 및 이물 배출 방법
TWI804373B (zh) * 2022-07-01 2023-06-01 天虹科技股份有限公司 具有可調式對位裝置的承載機構及其沉積機台
KR102735586B1 (ko) * 2022-12-28 2024-11-28 주식회사 에스지에스코리아 웨이퍼 공정 챔버의 부품 분리 장치
TW202439517A (zh) * 2023-03-16 2024-10-01 日商東京威力科創股份有限公司 維護作業支援系統、控制方法及控制程式
TW202500278A (zh) * 2023-06-01 2025-01-01 日商東京威力科創股份有限公司 洗淨方法及電漿處理裝置
TWI873962B (zh) * 2023-06-30 2025-02-21 家崎科技股份有限公司 自動維修裝置及自動維修方法
CN119905419A (zh) * 2023-10-26 2025-04-29 北京北方华创微电子装备有限公司 半导体设备

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Also Published As

Publication number Publication date
JP6812264B2 (ja) 2021-01-13
US20220216035A1 (en) 2022-07-07
JP2018133464A (ja) 2018-08-23
TW201834060A (zh) 2018-09-16
CN110808202A (zh) 2020-02-18
KR20180094809A (ko) 2018-08-24
TWI799406B (zh) 2023-04-21
CN108447760B (zh) 2019-11-12
TW202329241A (zh) 2023-07-16
US20180233328A1 (en) 2018-08-16
CN110808202B (zh) 2022-05-24
KR102713574B1 (ko) 2024-10-04
KR20230047069A (ko) 2023-04-06
US11309168B2 (en) 2022-04-19
KR102517504B1 (ko) 2023-04-03
CN108447760A (zh) 2018-08-24

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