JP6812264B2 - 真空処理装置、及びメンテナンス装置 - Google Patents

真空処理装置、及びメンテナンス装置 Download PDF

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Publication number
JP6812264B2
JP6812264B2 JP2017026524A JP2017026524A JP6812264B2 JP 6812264 B2 JP6812264 B2 JP 6812264B2 JP 2017026524 A JP2017026524 A JP 2017026524A JP 2017026524 A JP2017026524 A JP 2017026524A JP 6812264 B2 JP6812264 B2 JP 6812264B2
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Prior art keywords
processing container
gate
unit
case
maintenance device
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Japanese (ja)
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JP2018133464A5 (enExample
JP2018133464A (ja
Inventor
上田　雄大
雄大 上田
廣瀬　潤
潤 廣瀬
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2017026524A priority Critical patent/JP6812264B2/ja
Priority to TW112110168A priority patent/TWI895705B/zh
Priority to TW107104109A priority patent/TWI799406B/zh
Priority to CN201911006282.5A priority patent/CN110808202B/zh
Priority to CN201810150376.9A priority patent/CN108447760B/zh
Priority to KR1020180018282A priority patent/KR102517504B1/ko
Priority to US15/897,228 priority patent/US11309168B2/en
Publication of JP2018133464A publication Critical patent/JP2018133464A/ja
Publication of JP2018133464A5 publication Critical patent/JP2018133464A5/ja
Application granted granted Critical
Publication of JP6812264B2 publication Critical patent/JP6812264B2/ja
Priority to US17/703,503 priority patent/US20220216035A1/en
Priority to KR1020230040274A priority patent/KR102713574B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32807—Construction (includes replacing parts of the apparatus)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32889—Connection or combination with other apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
JP2017026524A 2017-02-16 2017-02-16 真空処理装置、及びメンテナンス装置 Active JP6812264B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2017026524A JP6812264B2 (ja) 2017-02-16 2017-02-16 真空処理装置、及びメンテナンス装置
TW112110168A TWI895705B (zh) 2017-02-16 2018-02-06 維護裝置
TW107104109A TWI799406B (zh) 2017-02-16 2018-02-06 真空處理裝置及維護裝置
CN201911006282.5A CN110808202B (zh) 2017-02-16 2018-02-13 真空处理装置和维护装置
CN201810150376.9A CN108447760B (zh) 2017-02-16 2018-02-13 真空处理装置和维护装置
KR1020180018282A KR102517504B1 (ko) 2017-02-16 2018-02-14 진공 처리 장치, 및 유지보수 장치
US15/897,228 US11309168B2 (en) 2017-02-16 2018-02-15 Vacuum processing apparatus and maintenance apparatus
US17/703,503 US20220216035A1 (en) 2017-02-16 2022-03-24 Vacuum processing apparatus and maintenance apparatus
KR1020230040274A KR102713574B1 (ko) 2017-02-16 2023-03-28 진공 처리 장치, 및 유지보수 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017026524A JP6812264B2 (ja) 2017-02-16 2017-02-16 真空処理装置、及びメンテナンス装置

Publications (3)

Publication Number Publication Date
JP2018133464A JP2018133464A (ja) 2018-08-23
JP2018133464A5 JP2018133464A5 (enExample) 2019-11-14
JP6812264B2 true JP6812264B2 (ja) 2021-01-13

Family

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JP2017026524A Active JP6812264B2 (ja) 2017-02-16 2017-02-16 真空処理装置、及びメンテナンス装置

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US (2) US11309168B2 (enExample)
JP (1) JP6812264B2 (enExample)
KR (2) KR102517504B1 (enExample)
CN (2) CN110808202B (enExample)
TW (2) TWI799406B (enExample)

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Also Published As

Publication number Publication date
KR20180094809A (ko) 2018-08-24
TW201834060A (zh) 2018-09-16
CN108447760A (zh) 2018-08-24
US20220216035A1 (en) 2022-07-07
CN110808202A (zh) 2020-02-18
TWI799406B (zh) 2023-04-21
TWI895705B (zh) 2025-09-01
US20180233328A1 (en) 2018-08-16
US11309168B2 (en) 2022-04-19
CN110808202B (zh) 2022-05-24
CN108447760B (zh) 2019-11-12
TW202329241A (zh) 2023-07-16
KR20230047069A (ko) 2023-04-06
KR102517504B1 (ko) 2023-04-03
KR102713574B1 (ko) 2024-10-04
JP2018133464A (ja) 2018-08-23

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