US20220216035A1 - Vacuum processing apparatus and maintenance apparatus - Google Patents
Vacuum processing apparatus and maintenance apparatus Download PDFInfo
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- US20220216035A1 US20220216035A1 US17/703,503 US202217703503A US2022216035A1 US 20220216035 A1 US20220216035 A1 US 20220216035A1 US 202217703503 A US202217703503 A US 202217703503A US 2022216035 A1 US2022216035 A1 US 2022216035A1
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- 238000012423 maintenance Methods 0.000 title claims abstract description 172
- 238000012545 processing Methods 0.000 title claims abstract description 115
- 238000004140 cleaning Methods 0.000 claims abstract description 63
- 230000008531 maintenance mechanism Effects 0.000 claims abstract description 14
- 238000012546 transfer Methods 0.000 claims description 77
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 abstract description 31
- 238000001020 plasma etching Methods 0.000 description 64
- 235000012431 wafers Nutrition 0.000 description 48
- 230000007246 mechanism Effects 0.000 description 44
- 238000000034 method Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 13
- 238000005530 etching Methods 0.000 description 12
- 239000002826 coolant Substances 0.000 description 7
- 239000000969 carrier Substances 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 230000003247 decreasing effect Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
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- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
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- -1 e.g. Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
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- 239000004065 semiconductor Substances 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
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- 239000006227 byproduct Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 239000000498 cooling water Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 238000005192 partition Methods 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/3288—Maintenance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32807—Construction (includes replacing parts of the apparatus)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32889—Connection or combination with other apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Definitions
- FIG. 6B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment
- FIG. 12B is a perspective view schematically showing a connection unit
- FIG. 16A is a top view schematically showing the maintenance apparatus according to the second embodiment
- the electrostatic chuck 36 has a flat disc-shaped upper surface.
- the upper surface serves as the mounting surface 36 d on which the wafer W is mounted.
- the electrostatic chuck 36 is provided at a center of the mounting table 31 when seen from the top.
- the electrostatic chuck 36 includes an electrode 36 a and an insulator 36 b .
- the electrode 36 a is embedded in the insulator 36 b.
- a DC power supply 42 is connected to the electrode 36 a.
- the wafer W is attracted and held on the electrostatic chuck 36 by a Coulomb force generated by applying a DC voltage from the DC power supply 42 to the electrode 36 a.
- a heater 36 c is provided in the insulator 36 b of the electrostatic chuck 36 .
- the heater 36 c controls a temperature of the wafer W by a power supplied through a power supply unit to be described later.
- the maintenance apparatus 100 to be described later can be attached to and detached from the second gate 95 .
- the first gate 84 is connected to the transfer system for the wafer W. Therefore, it is difficult to ensure a space near the first gate 84 of the plasma etching apparatus 10 , whereas it is easy to ensure a space near the opposite side of the first gate 84 . Accordingly, in the plasma etching apparatus 10 , the space for the maintenance apparatus 100 can be easily ensured by providing the second gate 95 at the opposite side of the first gate 84 .
- the maintenance apparatus 100 of the present embodiment further includes the robot arm 110 , the detaching unit 120 that can be attached to and detached from the robot arm 110 , the attaching unit 140 and the cleaning unit 130 . Accordingly, the maintenance apparatus 100 can perform the operation of detaching the focus ring 35 in the processing chamber 30 , the operation of attaching the focus ring 35 in the processing chamber 30 and the operation of cleaning the processing chamber 30 .
- a ball screw 105 and a shaft 106 are disposed in parallel at an upper portion in the case 101 .
- the ball screw 105 can be rotated by a handle H 1 provided at the outside of the case 101 while maintaining airtightness through, e.g., an O-ring or the like.
- a linear stage 150 is attached to the ball screw 105 and the shaft 106 .
- An adaptor detaching unit 160 is detachably attached to the linear stage 150 . In an initial state of the maintenance operation, the adaptor detaching unit 160 is attached to the linear stage 150 .
- the manually operated arm 200 has a flat plate-shaped base portion 240 , a head portion 250 provided with the attaching unit 220 , and an extensible/contractible mechanism 260 for extending/contracting the head portion 250 to/from the base portion 240 .
- the manually operated arm 200 has, as the extensible/contractible mechanism 260 , a ball screw 262 rotatably supported by the base portion 240 .
- An end portion of the ball screw 262 is coaxially connected to an engaging portion 265 , e.g., a bevel gear or the like.
- the engaging portion 265 is engaged with the engaging portion 231 when the linear stage 150 and the manually operated arm 200 are located at the left end at the side of the adaptor 96 .
- the manually operated arm 200 has an elevation mechanism 270 for vertically moving the head portion 250 .
- the engaging portion 273 is engaged with the engaging portion 281 . Accordingly, when the handle H 5 is rotated, the driving force is transferred to the head portion 250 through the rotation shaft 280 , the engaging portion 281 , the engaging portion 273 , the pulley 274 , the belt 277 , the pulley 276 and the rotation shaft 275 and, thus, the base portion 240 is vertically moved.
- the maintenance apparatus 100 performs the maintenance of the plasma etching apparatus 10 by attaching the respective units to the linear stage 150 by using the elevation table 114 .
Abstract
A maintenance apparatus includes a case and a maintenance mechanism. The case includes an opening having a size corresponding to a second gate of a vacuum processing apparatus including a processing chamber having a first gate through which a substrate is loaded and unloaded and the second gate different from the first gate. The case is attachable to the second gate while maintaining airtightness. The maintenance mechanism is provided in the case and is configured to perform at least one of an operation of detaching a consumed part in the processing chamber through the opening, an operation of attaching a replacement part in the processing chamber and an operation of cleaning the processing chamber.
Description
- This application is a Continuation application of U.S. application Ser. No. 15/897,228, filed on Feb. 15, 2018, which claims priority to Japanese Patent Application No. 2017-026524 filed on Feb. 16, 2017, the entire contents of which are incorporated herein by reference and priority is claimed to each.
- The present disclosure relates to a vacuum processing apparatus and a maintenance apparatus.
- Conventionally, there is known a vacuum processing apparatus for performing various processes on a substrate such as a semiconductor wafer (hereinafter, referred to as “wafer”) or the like in a processing chamber in a vacuum state. For example, a plasma etching apparatus for etching a wafer in a processing chamber in a vacuum state by using plasma is known as the vacuum processing apparatus.
- In the vacuum processing apparatus, it is required to replace a consumable part in the processing chamber which has been consumed by processing the substrate. For example, in the plasma etching apparatus, a focus ring provided at an outer periphery of the wafer is consumed by etching. In the plasma etching apparatus, an etching rate or the like is affected by the consumption of the focus ring. Therefore, in the plasma etching apparatus, the focus ring that has been consumed by a certain degree needs to be replaced.
- When the consumed part is replaced, the processing chamber is exposed to the atmosphere. However, in the vacuum processing apparatus, once the processing chamber is exposed to the atmosphere, a considerably long time is required for temperature control and moisture control until the substrate processing is restarted. As a result, the productivity is decreased.
- Therefore, there has been suggested a technique for replacing a consumed part without exposing the processing chamber to the atmosphere by replacing the consumed part through a transfer system for transferring a substrate to a vacuum processing apparatus while maintaining a vacuum state (see, e.g., Japanese Patent Application Publication No. 2006-196691).
- However, in the case of replacing the consumed part through the transfer system for transferring a substrate, the transfer system may be contaminated. For example, the focus ring is subjected to a considerable number of etching processes until it is replaced with a new focus ring, compared to a single wafer. Therefore, a large number of deposits are adhered to the focus ring during the etching processes. In the case of replacing the focus ring through the transfer system such as a transfer arm for transferring a wafer or the like, particles may be generated in the transfer system. When the particles are generated in the transfer system, it is required to stop the operation of the transfer system and perform a maintenance operation for cleaning.
- In accordance with an aspect, there is provided a vacuum processing apparatus including: a consumable part which is consumed by processing a substrate; and a processing chamber in which the consumable part is provided, the processing chamber having a first gate through which the substrate is loaded and unloaded and a second gate to and from which a maintenance apparatus for replacing a consumed part is attachable and detachable.
- In accordance with another aspect, there is provided a maintenance apparatus including: a case with an opening having a size corresponding to a second gate of a vacuum processing apparatus including a processing chamber having a first gate through which a substrate is loaded and unloaded and the second gate different from the first gate, the case being attachable to the second gate while maintaining airtightness; and a maintenance mechanism provided in the case and configured to perform at least one of an operation of detaching a consumed part in the processing chamber through the opening, an operation of attaching a replacement part in the processing chamber and an operation of cleaning the processing chamber.
- In accordance with the substrate processing apparatus, the consumed part can be replaced while suppressing contamination of the transfer system for transferring a substrate.
- The objects and features of the present disclosure will become apparent from the following description of embodiments, given in conjunction with the accompanying drawings, in which:
-
FIG. 1 schematically shows a configuration of a substrate processing system according to an embodiment; -
FIG. 2 schematically shows a plasma etching apparatus according to an embodiment; -
FIG. 3A is a top view schematically showing a maintenance apparatus according to a first embodiment; -
FIG. 3B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment; -
FIG. 4A explains an operation of detaching an adaptor; -
FIG. 4B is a perspective view of a detachment mechanism; -
FIG. 5A is a top view schematically showing the maintenance apparatus according to the first embodiment; -
FIG. 5B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment; -
FIG. 6A is a top view schematically showing the maintenance apparatus according to the first embodiment; -
FIG. 6B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment; -
FIG. 7A is a top view schematically showing the maintenance apparatus according to the first embodiment; -
FIG. 7B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment; -
FIG. 8A is a top view schematically showing the maintenance apparatus according to the first embodiment; -
FIG. 8B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment; -
FIG. 9 is a top view schematically showing an attaching unit according to the first embodiment; -
FIG. 10A is a top view schematically showing the maintenance apparatus according to the first embodiment; -
FIG. 10B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment; -
FIG. 11A is a top view schematically showing a maintenance apparatus according to a second embodiment; -
FIG. 11B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment; -
FIG. 12A explains a configuration for attaching/detaching an adaptor detaching unit and a linear stage; -
FIG. 12B is a perspective view schematically showing a connection unit; -
FIG. 12C is a cross sectional view schematically showing the connection unit; -
FIG. 13A is a top view schematically showing the maintenance apparatus according to the second embodiment; -
FIG. 13B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment; -
FIG. 14 is a perspective view schematically showing an adaptor support; -
FIG. 15A is a top view schematically showing the maintenance apparatus according to the second embodiment; -
FIG. 15B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment; -
FIG. 16A is a top view schematically showing the maintenance apparatus according to the second embodiment; -
FIG. 16B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment; -
FIG. 17A is a top view schematically showing the maintenance apparatus according to the second embodiment; -
FIG. 17B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment; -
FIG. 18A is a top view schematically showing the maintenance apparatus according to the second embodiment; -
FIG. 18B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment; -
FIGS. 19 to 22 are cross sectional views schematically showing the maintenance apparatus according to the second embodiment; -
FIGS. 23 and 24 are cross sectional views schematically showing a maintenance apparatus according to a third embodiment; -
FIG. 25 is a perspective view schematically showing an example of a frame; and -
FIG. 26 is a perspective view schematically showing an example of a case formed by stacking a plurality of frames. - Hereinafter, embodiments of a vacuum processing apparatus and a maintenance apparatus of the present disclosure will be described in detail with reference to the accompanying drawings. Like reference numerals will be given to like or corresponding parts throughout the drawings. The embodiments are not intended to limit the present disclosure. The embodiments can be appropriately combined without contradicting the processing contents.
- (Configuration of Substrate Processing System)
- First, a schematic configuration of a substrate processing system according to an embodiment will be described. The substrate processing system performs a predetermined process on a substrate such as a wafer or the like. In the present embodiment, a case in which a plasma etching process is performed on a substrate will be described as an example.
FIG. 1 shows the schematic configuration of the substrate processing system according to the embodiment. Thesubstrate processing system 1 includes an atmospheric transfer chamber 11 for loading a wafer W that is a substrate for manufacturing a semiconductor device into thesubstrate processing system 1, two load-lock chambers 12A and 12B, avacuum transfer chamber 13, and four vacuum processing apparatuses. Each of the vacuum processing apparatuses performs a predetermined process on the substrate. In the present embodiment, a case in which the vacuum processing apparatus is configured as aplasma etching apparatus 10 for performing a plasma etching process on a wafer W as a substrate will be described as an example. - The atmospheric transfer chamber 11 is connected to the
vacuum transfer chamber 13 via the load-lock chambers 12A and 12B. Theplasma etching apparatus 10 is connected to thevacuum transfer chamber 13 while being partitioned from the load-lock chambers 12A and 12B. - The inside of the atmospheric transfer chamber 11 is in an atmospheric atmosphere and
carrier mounting stages 14 for mounting thereon carriers C are attached to the atmospheric transfer chamber 11. Each of the carriers C accommodates therein a plurality of wafers W. Gate doors GT, which are opened/closed in association with lids of the carriers C connected to the carriers C, are provided at a front wall of the atmospheric transfer chamber 11. Astocker 2 serving as a storage part is provided at one side surface of the atmospheric transfer chamber 11. Analignment chamber 3 serving as a position alignment mechanism is provided at the other side surface of the atmospheric transfer chamber 11. Thestocker 2 includes ahousing 21 for accommodating and temporarily storing the wafer W or the like. Anopening 22 for a first transfer mechanism 15 and ashutter 23 for opening/closing theopening 22 are provided at thehousing 21. In thealignment chamber 3, a horizontal rotation stage is provided and various alignment controls such as control of a rotation position of the wafer W and the like can be performed. - The first transfer mechanism 15 is provided in the atmospheric transfer chamber 11. The first transfer mechanism 15 transfers the wafer W between the carriers C, the load-
lock chambers 12A and 12B, thealignment chamber 3 and thestocker 2. The first transfer mechanism 15 includes abase portion 15 a, a multi-joint arm 15 b and a holding portion 15 c. The arm 15 b has a base end connected to thebase portion 15 a and a leading end connected to the holding portion 15 c. Thebase portion 15 a is movable horizontally and vertically. The holding portion 15 c has a U shape when seen from the top. The holding portion 15 c holds the wafer W. - A stage on which the wafer W is mounted and supporting pins capable of moving vertically are provided in each of the load-
lock chambers 12A and 12B. The wafer W can be transferred between the first transfer mechanism 15 and asecond transfer mechanism 16 to be described later by the supporting pins in the load-lock chambers 12A and 12B. Further, a vacuum pump and a leakage valve (both not shown) are provided in each of the load-lock chambers 12A and 12B. Thus, an atmosphere in each of the load-lock chambers 12A and 12B can be switched between an atmospheric atmosphere and a vacuum atmosphere. In other words, it is possible to switch an atmosphere in each of the load-lock chambers 12A and 12B for transferring the wafer W between the atmospheric transfer chamber 11 maintained in an atmospheric atmosphere and thevacuum transfer chamber 13 maintained in a vacuum atmosphere. - The
vacuum transfer chamber 13 is maintained in a vacuum atmosphere. Thesecond transfer mechanism 16 is provided in thevacuum transfer chamber 13. Thesecond transfer mechanism 16 is substantially the same as the first transfer mechanism 15 except that two arms and two holding portions are provided at one base. The base, the arms and the holding portions of thesecond transfer mechanism 16 are indicated byreference numerals 16 a, 16 b and 16 c, respectively. - Notation “G” in
FIG. 1 denotes an openable/closable gate valve (partition valve) for partitioning between the chambers and partitioning between theplasma etching apparatuses 10 and thevacuum transfer chamber 13. The gate valve G is closed normally and opened when the wafer W is transferred between the chambers and between the respective modules and thevacuum transfer chamber 13. - (Configuration of the Plasma Etching Apparatus)
- Next, a configuration of the
plasma etching apparatus 10 according to an embodiment will be described.FIG. 2 schematically shows the plasma etching apparatus according to the embodiment. Theplasma etching apparatus 10 includes anairtight processing chamber 30 that is electrically grounded. Theprocessing chamber 30 is formed in a cylindrical shape and made of, e.g., aluminum having an anodically oxidized surface or the like. Theprocessing chamber 30 defines a processing space where a plasma is generated. A mounting table 31 for horizontally supporting a wafer W is provided in theprocessing chamber 30. - The mounting table 31 has a substantially cylindrical shape with an upper and a lower surface directed vertically. The upper surface of the mounting table 31 serves as a mounting
surface 36 d. The mountingsurface 36 d of the mounting table 31 is greater than the wafer W. The mounting table 31 includes abase 33 and anelectrostatic chuck 36. - The
base 33 is made of metal, e.g., aluminum or the like. Thebase 33 serves as a lower electrode. Thebase 33 is supported by a supportingmember 34 made of an insulator. The supportingmember 34 is installed at a bottom portion of theprocessing chamber 30. - The
electrostatic chuck 36 has a flat disc-shaped upper surface. The upper surface serves as the mountingsurface 36 d on which the wafer W is mounted. Theelectrostatic chuck 36 is provided at a center of the mounting table 31 when seen from the top. Theelectrostatic chuck 36 includes anelectrode 36 a and aninsulator 36 b. Theelectrode 36 a is embedded in theinsulator 36 b. ADC power supply 42 is connected to theelectrode 36 a. The wafer W is attracted and held on theelectrostatic chuck 36 by a Coulomb force generated by applying a DC voltage from theDC power supply 42 to theelectrode 36 a. Aheater 36 c is provided in theinsulator 36 b of theelectrostatic chuck 36. Theheater 36 c controls a temperature of the wafer W by a power supplied through a power supply unit to be described later. - A
focus ring 35 made of, e.g., single crystalline silicon, is provided on an upper outer periphery of the mounting table 31. A cylindricalinner wall member 37 made of, e.g., quartz or the like, is provided to surround an edge of the mounting table 31 and an edge of the supportingmember 34. - A
power feed rod 50 is connected to thebase 33. Thepower feed rod 50 is connected to a firstRF power supply 40 a via afirst matcher 41 a and connected to a secondRF power supply 40 b via asecond matcher 41 b. The firstRF power supply 40 a generates power for plasma generation. A high frequency power having a predetermined frequency is supplied from the firstRF power supply 40 a to thebase 33 of the mounting table 31. The secondRF power supply 40 b generates power for ion attraction (bias). A high frequency power having a predetermined frequency lower than that from the firstRF power supply 40 a is supplied from the secondRF power supply 40 b to thebase 33 of the mounting table 31. - A
coolant path 33 d is formed in thebase 33. Thecoolant path 33 d has one end connected to acoolant inlet line 33 b and the other end connected to acoolant outlet line 33 c. In theplasma etching apparatus 10, a temperature of the mounting table 31 can be controlled by circulating a coolant, e.g., cooling water or the like, through thecoolant path 33 d. In theplasma etching apparatus 10, it is also possible to form coolant paths at portions of the base 33 which correspond to a region on which the wafer W is mounted and a region on which thefocus ring 35 is mounted and separately control temperatures of the wafer W and thefocus ring 35. Further, theplasma etching apparatus 10 may be configured such that a cold heat transfer gas is supplied to a backside of the wafer W and to a bottom surface of thefocus ring 35 to separately control the temperatures thereof. For example, a gas supply line for supplying a cold heat transfer gas (backside gas) such as He gas or the like to a backside of the wafer W may be provided to penetrate through the mounting table 31 and the like. The gas supply line is connected to a gas supply source. With this configuration, the wafer W attracted and held on theelectrostatic chuck 36 on the top surface of the mounting table 31 can be controlled to a predetermined temperature. - A
shower head 46 serving as an upper electrode is provided above the mounting table 31 to face the mounting table 31 in parallel therewith. Theshower head 46 and the mounting table 31 function as a pair of electrodes (upper electrode and lower electrode). - The
shower head 46 is provided at a ceiling wall portion of theprocessing chamber 30. Theshower head 46 includes amain body 46 a and anupper ceiling plate 46 b serving as an electrode plate. Theshower head 46 is supported at an upper portion of theprocessing chamber 30 through an insulatingmember 47. Themain body 46 a is made of a conductive material, e.g., aluminum having an anodically oxidized surface. Theupper ceiling plate 46 b is detachably held at a bottom portion of themain body 46 a. - A
gas diffusion space 46 c is formed in themain body 46 a. A plurality of gas throughholes 46 d is formed in the bottom portion of themain body 46 a to be positioned below thegas diffusion space 46 c. Gas injection holes 46 e are formed through theupper ceiling plate 46 b in a thickness direction thereof. The gas injection holes 46 e communicate with the gas throughholes 46 d. With this configuration, the processing gas supplied to thegas diffusion space 46 c is distributed in a shower form into theprocessing chamber 30 through the gas throughholes 46 d and the gas injection holes 46 e. - A
gas inlet port 46 g for introducing the processing gas into thegas diffusion space 46 c is formed in themain body 46 a. One end ofgas supply line 45 a is connected to thegas inlet port 46 g and the other end of thegas supply line 45 a is connected to a processinggas supply source 45 for supplying a processing gas. A mass flow controller (MFC) 45 b and an opening/closing valve V2 are disposed in thegas supply line 45 a in that order from an upstream side. The processing gas for plasma etching is supplied from the processinggas supply source 45 to thegas diffusion space 46 c through thegas supply line 45 a and distributed in a shower form into theprocessing chamber 30 through the gas throughholes 46 d and the gas injection holes 46 e. - A variable
DC power supply 48 b is electrically connected to theshower head 46 serving as the upper electrode via a low pass filter (LPF) 48 a. A power supply of the variableDC power supply 48 b is on-off controlled by an on/offswitch 48 c. Current/voltage of the variableDC power supply 48 b and on/off of the on/offswitch 48 c are controlled by acontrol unit 90 to be described later. As will be described later, when a plasma is generated in the processing space by applying the high frequency power from the first and the secondRF power supply switch 48 c is turned on by thecontrol unit 90 and a predetermined DC voltage is applied to theshower head 46 serving as the upper electrode, if necessary. - A
cylindrical ground conductor 30 a extends upward from a sidewall of theprocessing chamber 30 to a position higher than a height of theshower head 46. Thecylindrical ground conductor 30 a has a ceiling wall at the top thereof. - A
gas exhaust port 81 is formed at a bottom portion of theprocessing chamber 30. Agas exhaust unit 83 is connected to thegas exhaust port 81 through agas exhaust line 82. Thegas exhaust unit 83 has a vacuum pump. By operating the vacuum pump, a pressure in theprocessing chamber 30 can be decreased to a predetermined vacuum level. - A
first gate 84 through which the wafer W is loaded/unloaded is provided at an inner sidewall of theprocessing chamber 30. A gate valve G for opening/closing thefirst gate 84 is provided at thefirst gate 84. As shown inFIG. 1 , thefirst gate 84 is connected to thevacuum transfer chamber 13 through the gate valve G while maintaining airtightness. The wafer W can be loaded into and unloaded from thevacuum transfer chamber 13 in a state where a vacuum atmosphere is maintained. - A
deposition shield 86 is provided along an inner wall of theprocessing chamber 30. Thedeposition shield 86 has a function of preventing etching by-products (deposits) from being attached to the inner wall of theprocessing chamber 30. Thedeposition shield 86 is detachably provided. - The overall operation of the plasma etching apparatus configured as described above is controlled by the
control unit 90. Thecontrol unit 90 is, e.g., a computer, and controls the respective components of theplasma etching apparatus 10. - In the
plasma etching apparatus 10, it is required to replace a consumed part in theprocessing chamber 30 which has been consumed by the etching process using plasma. For example, in theplasma etching apparatus 10, thefocus ring 35 provided at an outer periphery of the wafer W is consumed by the etching process. In theplasma etching apparatus 10, when the consumed part such as thefocus ring 35 or the like is replaced, theprocessing chamber 30 is exposed to the atmosphere. In that case, a considerably long time is required for temperature control and moisture control until the etching process for the wafer W is restarted. As a result, the productivity is decreased. - Therefore, it may be considered to replace the consumed part without exposing the
processing chamber 30 to the atmosphere by replacing the consumed part through a transfer system for transferring a wafer W to theplasma etching apparatus 10. For example, in thesubstrate processing system 1 shown inFIG. 1 , thefocus ring 35 may be replaced through the transfer system for transferring the wafer W to theplasma etching apparatus 10, such as the first transfer mechanism 15 in the atmospheric transfer chamber 11, the load-lock chambers 12A and 12B, thesecond transfer mechanism 16 in thevacuum transfer chamber 13 and the like. - However, in the case of replacing the
focus ring 35 through the transfer system for transferring the wafer W, the transfer system may be contaminated. For example, thefocus ring 35 is subjected to a considerable number of etching processes until it is replaced with a new focus ring, compared to a single wafer W. Therefore, a large number of deposits are adhered to thefocus ring 35 during the etching processes. In the case of replacing thefocus ring 35, deposits adhered to thesecond transfer mechanism 16 of thevacuum transfer chamber 13 become a cause of particles. When the particles are generated in the transfer system, it is required to stop the operation of the transfer system and perform a maintenance operation for cleaning. For example, in thesubstrate processing system 1 shown inFIG. 1 , the operation of the entire system is stopped when the operation of the transfer system is stopped to perform the maintenance operation. - For example, as shown in
FIG. 1 , in thesubstrate processing system 1 in which a plurality ofplasma etching apparatuses 10 is connected to thevacuum transfer chamber 13, when all theplasma etching apparatuses 10 are driven, the transfer system consecutively transfers wafers W to theplasma etching apparatuses 10. However, in thesubstrate processing system 1, if one of theplasma etching apparatuses 10 uses the transfer system to replace thefocus ring 35, the otherplasma etching apparatuses 10 are stopped. - Therefore, in the
plasma etching apparatus 10 according to the embodiment, a gate for replacing a consumed part is provided in addition to thefirst gate 84. For example, as shown inFIG. 2 , in theplasma etching apparatus 10, asecond gate 95 is provided at an opposite side of thefirst gate 84 with respect to the mounting table 31 on which the wafer W is mounted. Thesecond gate 95 is an opening greater than a consumed part to be replaced. Thesecond gate 95 is blocked by anadaptor 96 while maintaining airtightness. For example, thesecond gate 95 has an outer opening greater than an inner opening and anend surface 95A is formed between the outer opening and the inner opening. An O-ring and screw holes are provided at theend surface 95A to be in contact with theadaptor 96 and theadaptor 96 is fixed by screws. Themaintenance apparatus 100 to be described later can be attached to and detached from thesecond gate 95. For example, as shown inFIG. 1 , in theplasma etching apparatus 10, thefirst gate 84 is connected to the transfer system for the wafer W. Therefore, it is difficult to ensure a space near thefirst gate 84 of theplasma etching apparatus 10, whereas it is easy to ensure a space near the opposite side of thefirst gate 84. Accordingly, in theplasma etching apparatus 10, the space for themaintenance apparatus 100 can be easily ensured by providing thesecond gate 95 at the opposite side of thefirst gate 84. When a consumed part needs to be replaced, an operator loosens the screws fixing theadaptor 95 from theplasma etching apparatus 10 having the consumed part to be replaced. Then, the operator attaches themaintenance apparatus 100 to theplasma etching apparatus 10 having the consumed part to be replaced, as indicated by a broken line inFIG. 1 . - (Configuration of the Maintenance Apparatus)
- Next, a configuration of the
maintenance apparatus 100 according to the first embodiment will be described.FIG. 3A is a top view schematically showing the maintenance apparatus according to the first embodiment.FIG. 3B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment.FIG. 3B is a cross sectional view seen from a bottom side ofFIG. 3A which is taken along a dashedline 3B-3B inFIG. 3A .FIGS. 3A and 3B show a state in which themaintenance apparatus 100 is attached to theplasma etching apparatus 10. In the following drawings, theplasma etching apparatus 10 is simply illustrated. Hereinafter, the configuration of themaintenance apparatus 100 will be appropriately described along the sequence of replacing thefocus ring 35 as a consumed part. - The
maintenance apparatus 100 includes acase 101 with anopening 101A having a size corresponding to that of thesecond gate 95 of theplasma etching apparatus 10. An O-ring or the like is provided at a portion around theopening 101A of thecase 101 which is brought into contact with theplasma etching apparatus 10. Themaintenance apparatus 100 is disposed such that theopening 101A corresponds to thesecond gate 95 and theopening 101A is fixed to thesecond gate 95 by screws or the like while maintaining airtightness. - A
vacuum gauge 101B capable of measuring a degree of vacuum is provided in thecase 101. When a consumed part is replaced, an atmosphere in thecase 101 of themaintenance apparatus 100 becomes substantially the same as the vacuum atmosphere in theprocessing chamber 30. For example, themaintenance apparatus 100 is connected to thegas exhaust unit 83 of theplasma etching apparatus 10 through a gas exhaust line (not shown) and a pressure in thecase 101 is decreased to a predetermined vacuum level by thegas exhaust unit 83. Alternatively, themaintenance apparatus 100 may include a gas exhaust unit for exhausting thecase 101. - In the
maintenance apparatus 100, thecase 101 has therein a maintenance mechanism for performing at least one of an operation of detaching the consumed part in theprocessing chamber 30, an operation of attaching a replacement part in theprocessing chamber 30 and an operation of cleaning theprocessing chamber 30. In themaintenance apparatus 100 of the present embodiment, arobot arm 110, a detachingunit 120 for detaching thefocus ring 35, acleaning unit 130 for cleaning theprocessing chamber 30 and an attachingunit 140 for attaching a new focus ring in theprocessing chamber 30 are provided as the maintenance mechanism. - In the
case 101, supporting tables 102 are arranged at three height levels at a predetermined interval. The detachingunit 120, thecleaning unit 130 and the attachingunit 140 are placed on the three supporting tables 102, respectively. Thecase 101 is partially openable/closeable, and the detachingunit 120, thecleaning unit 130 and the attachingunit 140 are separately attachable and detachable. In other words, the detachingunit 120, thecleaning unit 130 and the attachingunit 140 can be separately replaced. - The
robot arm 110 includes anarm unit 111 having three arms connected by joints, a supportingportion 112 for supporting thearm unit 111 and ahand 113 provided at a leading end of thearm unit 111. Therobot arm 110 can be extended by linearly stretching the three arms of thearm unit 111 or contracted by folding them. Therobot arm 110 can hold an object by using thehand 113. Therobot arm 110 is fixed to an elevation table 114 and vertically moved by vertical movement of the elevation table 114. The overall operations of therobot arm 110 and the elevation table 114 are controlled by a control unit (not shown). The control unit includes a user interface for displaying reception of various manipulation instructions or operational states. An operator inputs an operation instruction through the user interface. The operation instruction may separately specify the vertical movement of the supporting tables 102 or the movement of therobot arm 110. Or, the manipulation instruction may specify a series of movements. For example, the operation instruction may specify, as an instruction of detaching thefocus ring 35, the vertical movement of the supporting table 102 and a series of movements of therobot arm 110 at the time of detaching thefocus ring 35. - The
maintenance apparatus 100 includes a detaching unit for detaching theadaptor 96 of theplasma etching apparatus 10. For example, in themaintenance apparatus 100, aball screw 105 and ashaft 106 are provided in parallel at an upper portion of thecase 101. Theball screw 105 can be rotated by a handle H1 provided at the outside of thecase 101 while maintaining airtightness through, e.g., an O-ring or the like. Alinear stage 150 is attached to theball screw 105 and theshaft 106. Anadaptor detaching unit 160 is attached to thelinear stage 150. A groove is formed at a portion of thelinear stage 150, to which theball screw 105 is attached, to correspond to theball screw 105. Thelinear stage 150 and theadaptor detaching unit 160 are moved along theball screw 105 and theshaft 106 by the rotation of theball screw 105. - In the case of detaching the
adaptor 96, an operator rotates the handle H1 so that thelinear stage 150 and theadaptor detaching unit 160 can be moved toward theadaptor 96 as indicated by dashed lines inFIGS. 3A and 3B . - Handles H2L and H2R for fixing the
adaptor detaching unit 160 to theadaptor 96 are provided at side surfaces of thecase 101 near theopening 101A. The handles H2L and H2R can transfer a rotational driving force of the handles H2L and H2R to theadaptor detaching unit 160 when theadaptor detaching unit 160 and theadaptor 96 are brought into contact with each other. - Since the
processing chamber 30 is in a vacuum state during the etching process, theadaptor 96 is fixed to theprocessing chamber 30 and may not be easily detached even when setting thecase 101 of themaintenance apparatus 100 to a vacuum state. Therefore,detachment mechanisms 170 for detaching theadaptor 96 are respectively provided near both end portions of theadaptor detaching unit 160 of the present embodiment. -
FIG. 4A explains the detachment of the adaptor. Since thedetachment mechanism 170 provided at the handle H2L side has the same configuration as that of thedetachment mechanism 170 provided at the handle H2R side, thedetachment mechanism 170 provided at the handle H2L side will be described with reference toFIG. 4A . Apositioning hole 96A for stably fixing theadaptor detaching unit 160 is formed in an end portion of theadaptor 96. A through-hole 96B is formed in a portion of theadaptor 96 which faces theend surface 95A of thesecond gate 95. The through-hole 96B has threads and is internal-threaded (female-threaded). Apositioning pin 171 is provided at a portion of theadaptor detaching unit 160 which corresponds to thepositioning hole 96A. A detachingpin 172 constituting thedetachment mechanism 170 is provided at a portion of theadaptor detaching unit 160 which corresponds to the through-hole 96B. - The handle H2L is coaxially connected to a protruding
engagement portion 181 through arotation shaft 180. Therotation shaft 180 can be rotated while maintaining airtightness by an O-ring 183 or the like. The protrudingengagement portion 181 is rotated by rotating the handle H2L. - The
detachment mechanism 170 has a recessedengagement portion 173 to be engaged with the protrudingengagement portion 181 when theadaptor detaching unit 160 is brought into contact with theadaptor 96 at the same height position as the protrudingengagement portion 181. -
FIG. 4B is a perspective view of the detachment mechanism. In thedetachment mechanism 170, agroove 174 is formed in a side surface thereof facing the handle H2L and vertical width of thegroove 174 is increased as it goes away from the recessedengagement portion 173. Thedetachment mechanism 170 can guide the protrudingengagement portion 181 to the recessedengagement portion 173 through thegroove 174. In thedetachment mechanism 170, when the protrudingengagement portion 181 and the recessedengaging portion 173 are coaxially engaged, the protrudingengagement portion 181 and the recessedengagement portion 173 can rotate together and the rotational driving force of the handle H2L can be transferred to thedetachment mechanism 170. - A
worm gear 175 is coaxially connected to the recessedengagement portion 173. Theworm gear 175 is rotatably held by abearing 176 and rotated by rotation of the recessedengagement portion 173. Awheel 177 is rotated by rotation of theworm gear 175. The detachingpin 172 has an external-threaded (male-threaded) leadingend portion 172A and an extensible/contractible shaft 172B. Thewheel 177 and thetelescopic shaft 172B have a ball spline structure. Thetelescopic shaft 172B is rotatably held by abearing 178. - In the case of detaching the
adaptor 96, an operator rotates the handle H1 so that thelinear stage 150 and theadaptor detaching unit 160 can be moved toward theadaptor 96 as indicated by the dashed lines inFIGS. 3A and 3B . When theadaptor detaching unit 160 is brought into contact with theadaptor 96, thepositioning pin 171 is insertion-fitted to thepositioning hole 96A and the detachingpin 172 is insertion-fitted to the through-hole 96B. Then, the operator rotates the handles H2L and H2R so that the external threads (male threads) of theleading end portion 172A of the detachingpin 172 are further insertion-fitted to the internal threads (female threads) of the through-hole 96B and brought into contact with theend surface 95A while passing through the through-hole 96B. Therefore, theend surface 95A is pressed. Accordingly, even when theadaptor 96 is fixed to theprocessing chamber 30, it is possible to detach theadaptor 96. - When the
adaptor 96 is detached, the operator rotates the handle H1 in a reverse direction to that used in the detaching operation so that thelinear stage 150 and theadaptor detaching unit 160 can be moved to the original positions.FIGS. 5A and 5B show a state in which theadaptor 96 is detached.FIG. 5A is a top view schematically showing the maintenance apparatus according to the first embodiment.FIG. 5B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment.FIG. 5B is a cross sectional view seen from a bottom side ofFIG. 5A which is taken along a dashedline 5B-5B inFIG. 5A . Thedetached adaptor 96 is moved to a right side while being held by theadaptor detaching unit 160. - Next, an operation of detaching the
focus ring 35 will be described.FIGS. 6A and 6B show the operation of detaching thefocus ring 35.FIG. 6A is a top view schematically showing the maintenance apparatus according to the first embodiment.FIG. 6B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment.FIG. 6B is a cross sectional view seen from a bottom side ofFIG. 6A which is taken along a dashedline 6B-6B inFIG. 6A . - The detaching
unit 120 is formed in a disc shape having a size that is substantially the same as that of thefocus ring 35. Anadhesive layer 121 is formed at an outer peripheral region of a bottom surface of the detachingunit 120 which corresponds to thefocus ring 35. - In the case of detaching the
focus ring 35 of theplasma etching apparatus 10, the elevation table 114 moves to a height position corresponding to the supporting table 102 on which thedetaching unit 120 is mounted. Therobot arm 110 extends thearm unit 111 toward the detachingunit 120 so that thehand 113 can hold thedetaching unit 120. Then, therobot arm 110 contracts thearm unit 111 while holding the detachingunit 120. - Next, the elevation table 114 moves to a height position corresponding to the
opening 101A as indicated by dashed lines inFIGS. 6A and 6B . Therobot arm 110 extends thearm unit 111 toward theopening 101A, and moves the detachingunit 120 to a position above the mounting table 31 through theopening 101A. Then, therobot arm 110 lowers thearm unit 111 so that the detachingunit 120 comes in contact with the mounting table 31. Accordingly, thefocus ring 35 mounted on the mounting table 31 is adhered to thedetaching unit 120 by theadhesive layer 121. - The
robot arm 110 detaches thefocus ring 35 from the mounting table 31 by lifting thearm unit 111. Then, therobot arm 110 and the elevation table 114 operate in a reverse sequence to that in the case of moving the detachingunit 120 from the supporting table 102 to the position above the mounting table 31. As a consequence, the detachingunit 120 to which thefocus ring 35 is adhered is stored in the original supporting table 102. - Next, an operation of cleaning the mounting
surface 36 d of the mounting table 31 will be described.FIGS. 7A and 7B illustrate the operation of cleaning the mountingsurface 36 d of the mounting table 31.FIG. 7A is a top view schematically showing the maintenance apparatus according to the first embodiment.FIG. 7B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment.FIG. 7B is a cross sectional view seen from a bottom side ofFIG. 7A which is taken along a dashedline 7B-7B inFIG. 7A . - The
cleaning unit 130 is formed in a disc shape having a size that is substantially the same as that of the mountingsurface 36 d of the mounting table 31. Anadhesive layer 131 is formed on the entire bottom surface of thecleaning unit 130. - In the case of cleaning the mounting
surface 36 d of the mounting table 31, the elevation table 114 is moved to a height position corresponding to the supporting table 102 on which thecleaning unit 130 is mounted. Therobot arm 110 extends thearm unit 111 toward thecleaning unit 130 and holds thecleaning unit 130 through thehand 113. Then, therobot arm 110 contracts thearm unit 111 while holding thecleaning unit 130. - Next, the elevation table 114 is moved to a height position corresponding to the
opening 101A as indicated by the dashed lines ofFIGS. 7A and 7B . Therobot arm 110 extends thearm unit 111 toward theopening 101A, and moves thecleaning unit 130 to a position above the mounting table 31 through theopening 101A and then lowers thearm unit 111 so that thecleaning unit 130 comes in contact with the mounting table 31. Accordingly, undesired substances, such as deposits, dust and the like, on the mounting table 31 are adhered to theadhesive layer 131 of thecleaning unit 130. As a result, the mounting table 31 is cleaned. - The
robot arm 110 separates thecleaning unit 130 from the mounting table 31 by lifting thearm unit 111. Then, therobot arm 110 and the elevation table 114 operate in a reverse sequence to that in the case of moving thecleaning unit 130 from the supporting table 102 to the position above the mounting table 31. As a consequence, thecleaning unit 130 to which the undesired substances are adhered is stored in the original supporting table 102. - Next, an operation of attaching a
new focus ring 35 to the mounting table 31 will be described.FIGS. 8A and 8B illustrate the operation of attaching anew focus ring 35 to the mounting table 31.FIG. 8A is a top view schematically showing the maintenance apparatus according to the first embodiment.FIG. 8B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment.FIG. 8B is a cross sectional view seen from a bottom side ofFIG. 8A which is taken along a dashed line 8B-8B inFIG. 8A . - The attaching
unit 140 has substantially the same size as that of themounding surface 36 d of the mounting table 31 and thefocus ring 35 can be attached thereto and detached therefrom. Anew focus ring 35 is set to the attachingunit 140. The attachingunit 140 will be described in detail later. - In the case of attaching a
new focus ring 35 to the mounting table 31, the elevation table 114 is moved to a height position corresponding to the supporting table 102 on which the attachingunit 140 is mounted. Therobot arm 110 extends thearm unit 111 toward the attachingunit 140 and holds the attachingunit 140 through thehand 113. Then, therobot arm 110 contracts thearm unit 111 while holding the attachingunit 140. - Next, the elevation table 114 is moved to a height position corresponding to the
opening 101A as indicated by the dashed lines inFIGS. 8A and 8B . Therobot arm 110 extends thearm unit 111 toward theopening 101A, moves the attachingunit 140 to a position above the mounting table 31 through theopening 101A, and then lowers thearm unit 111 so that the attachingunit 140 comes in contact with the mounting table 31. - The attaching
unit 140 can release thenew focus ring 35 when contacting with the mounting table 31. -
FIG. 9 is a top view schematically showing the attaching unit according to the first embodiment. Positioning pins 141 are provided at a bottom surface of the attachingunit 140. When the attachingunit 140 is mounted on the mounting table 31, the positioning pins 141 are insertion-fitted topositioning holes 36 e formed in the mountingsurface 36 d of the mounting table 31. The positioning holes 36 e may be provided at the mounting table for a single purpose. Or, it is also possible to use existing holes, e.g., holes through which lifter pins for vertically moving the wafer W mounted on the mounting table 31 are inserted. - The attaching
unit 140 includes acontact pin 142 and apin 143 for releasing thefocus ring 35. Thepin 143 is in contact with a side surface of thecontact pin 142 and biased toward thecontact pin 142 by aspring 144. Thecontact pin 142 has a leading end projecting from the bottom surface of the attachingunit 140. When the attachingunit 140 is mounted on the mounting table 31, the leading end of thecontact pin 142 is brought into contact with the mounting table 31 and pressed and put in the attaching unit 140 (see (1) inFIG. 9 ). Agroove 142A is formed at a position on the side surface of thecontact pin 142 which corresponds to with the leading end of thepin 143 when thecontact pin 142 is put in the attachingunit 140. When thecontact pin 142 is put in the attachingunit 140, the leading end of thepin 143 is biased and fitted into thegroove 142A of thepin contact 142 by the spring 144 (see (2) inFIG. 9 ). - One end portion of an engaging
member 145 is fixed to thepin 143. The other end portion of the engagingmember 145 protrudes from the end of the attachingunit 140 by a distance smaller than the depth of thegroove 142A. Anew focus ring 35 is engaged with a protrudingportion 145A of the engagingmember 145 protruding from the end of the attachingunit 140. The engagingmember 145 is moved as the leading end of thepin 143 is moved into thegroove 142A and, thus, the protrudingportion 145A does not project from the end of the attaching unit 140 (see (3) inFIG. 9 ). Accordingly, the engagement between the protrudingportion 145A and thenew focus ring 35 is released, and thenew focus ring 35 is mounted on the mounting table 31 (see (4) inFIG. 9 ). - After the
focus ring 35 is mounted on the mounting table 31, therobot arm 110 detaches the attachingunit 140 from the mounting table 31 by lifting thearm unit 111. Then, therobot arm 110 and the elevation table 114 operate in a reverse sequence to that used in the case of moving the attachingunit 140 from the supporting table 102 to the position above the mounting table 31. As a consequence, the attachingunit 140 is stored in the original supporting table 102. - After the
focus ring 35 is replaced in the above-described manner, the operator attaches theadaptor 96 to thesecond gate 95 in a reverse sequence to that used in the case of detaching theadaptor 96. Then, the operator returns the pressure in thecase 101 of themaintenance apparatus 100 to an atmospheric pressure.FIGS. 10A and 10B show a state in which the replacement of thefocus ring 35 is completed.FIG. 10A is a top view schematically showing the maintenance apparatus according to the first embodiment.FIG. 10B is a cross sectional view schematically showing the maintenance apparatus according to the first embodiment.FIG. 10B is a cross sectional view seen from a bottom side ofFIG. 10A which is taken along a dashedline 10B-10B inFIG. 10A . - In the
plasma etching apparatus 10 of the present embodiment, thefocus ring 35 which is consumed by the processing of the wafer W is provided in theprocessing chamber 30. Further, in theplasma etching apparatus 10, thefirst gate 84 used for loading/unloading the wafer W and thesecond gate 95 to/from which themaintenance apparatus 100 can be attached/detached are provided in theprocessing chamber 30. Accordingly, theplasma etching apparatus 10 can replace thefocus ring 35 without using the transfer system for transferring a wafer W. As a result, theplasma etching apparatus 10 can replace thefocus ring 35 while suppressing contamination of the transfer system for transferring a wafer W. - In the
plasma etching apparatus 10 of the present embodiment, thesecond gate 95 is provided at the opposite side of thefirst gate 84 with respect to the mounting table 31 in theprocessing chamber 30. Accordingly, theplasma etching apparatus 10 can ensure a space for themaintenance apparatus 100. - The
maintenance apparatus 100 of the present embodiment includes thecase 101 with theopening 101A having a size corresponding to that of thesecond gate 95 of theplasma etching apparatus 10. Themaintenance apparatus 100 can be attached to thesecond gate 95 while maintaining airtightness. Themaintenance apparatus 100 further includes the maintenance mechanism provided in thecase 101. The maintenance mechanism performs at least one of the operation of detaching thefocus ring 35 in theprocessing chamber 30 through theopening 101A, the operation of attaching thefocus ring 35 in theprocessing chamber 30 and the operation of cleaning theprocessing chamber 30. Accordingly, themaintenance apparatus 100 can replace thefocus ring 35 without using the transfer system for transferring a wafer W. As a result, themaintenance apparatus 100 can replace thefocus ring 35 while suppressing contamination of the transfer system for transferring a wafer W. - The
maintenance apparatus 100 of the present embodiment further includes therobot arm 110, the detachingunit 120 that can be attached to and detached from therobot arm 110, the attachingunit 140 and thecleaning unit 130. Accordingly, themaintenance apparatus 100 can perform the operation of detaching thefocus ring 35 in theprocessing chamber 30, the operation of attaching thefocus ring 35 in theprocessing chamber 30 and the operation of cleaning theprocessing chamber 30. - The detaching
unit 120 of the present embodiment has theadhesive layer 121 on its surface to be in contact with thefocus ring 35. Accordingly, the detachingunit 120 can simply detach thefocus ring 35 only through the contact with thefocus ring 35. - In the
maintenance apparatus 100 of the present embodiment, the detachingunit 120, the attachingunit 140 and thecleaning unit 130 can be separately provided in and detached from thecase 101. Accordingly, themaintenance apparatus 100 can simply replace thedetaching unit 120, the attachingunit 140 and thecleaning unit 130. Further, a unit required for a maintenance operation to be performed can be provided to themaintenance apparatus 100. - Hereinafter, a second embodiment will be described. Since the
substrate processing system 1 and theplasma etching apparatus 10 according to the second embodiment have the same configurations as those of thesubstrate processing system 1 and theplasma etching apparatus 10 according to the first embodiment shown inFIGS. 1 and 2 , redundant description thereof will be omitted. - The configuration of the
maintenance apparatus 100 according to the second embodiment will be described. FIG. - 11A is a top view schematically showing the maintenance apparatus according to the second embodiment.
FIG. 11B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment.FIG. 11B is a cross sectional view seen from a bottom side ofFIG. 11A which is taken along a dashed line 11B-11B inFIG. 11A .FIGS. 11A and 11B show a state in which themaintenance apparatus 100 is attached to theplasma etching apparatus 10. Like or corresponding parts will be indicated by like reference numerals used in themaintenance apparatus 100 according to the first embodiment. Hereinafter, the configuration of themaintenance apparatus 100 will be appropriately described with reference to the sequence of replacing thefocus ring 35 as a consumed part. - The
maintenance apparatus 100 includes acase 101 with anopening 101A having a size corresponding to that of thesecond gate 95 of theplasma etching apparatus 10. An O-ring or the like is provided at a portion around theopening 101A of thecase 101 which is brought into contact with theplasma etching apparatus 10. Themaintenance apparatus 100 is attached to thesecond gate 95 by screw fixing or the like while maintaining airtightness. - A
vacuum gauge 101B capable of measuring a degree of vacuum is provided to thecase 101. When a consumed part is replaced, an atmosphere in thecase 101 of themaintenance apparatus 100 becomes substantially the same as the vacuum atmosphere in theprocessing chamber 30. - In the
maintenance apparatus 100, thecase 101 has therein a maintenance mechanism for performing at least one of an operation of detaching the consumed part in theprocessing chamber 30, an operation of attaching a replacement part in theprocessing chamber 30 and an operation of cleaning theprocessing chamber 30. In themaintenance apparatus 100 of the present embodiment, a manually operatedarm 200, a detachingunit 120, an attachingunit 140 and acleaning unit 130 constitute the maintenance mechanism. - For example, the manually operated
arm 200, the detachingunit 120, thecleaning unit 130 and the attachingunit 140 are vertically disposed and horizontally arranged side by side near and below theopening 101A in thecase 101. Thecase 101 is partially openable/closeable, and the manually operatedarm 200, the detachingunit 120, thecleaning unit 130 and the attachingunit 140 can be separately provided in thecase 101 and removed from thecase 101. In other words, the manually operatedarm 200, the detachingunit 120, thecleaning unit 130 and the attachingunit 140 can be separately replaced. - In the
maintenance apparatus 100, aball screw 105 and ashaft 106 are disposed in parallel at an upper portion in thecase 101. Theball screw 105 can be rotated by a handle H1 provided at the outside of thecase 101 while maintaining airtightness through, e.g., an O-ring or the like. Alinear stage 150 is attached to theball screw 105 and theshaft 106. Anadaptor detaching unit 160 is detachably attached to thelinear stage 150. In an initial state of the maintenance operation, theadaptor detaching unit 160 is attached to thelinear stage 150. -
FIG. 12A explains a configuration for attaching/detaching the adaptor detaching unit to/from the linear stage. Thelinear stage 150 is provided with tworods 151 which are spaced apart from each other at a predetermined interval.Connection units 161 to be connected to the two rods 152 are provided at portions of theadaptor detaching unit 160 which correspond to the tworods 151. -
FIG. 12B is a perspective view schematically showing theconnection unit 161.FIG. 12C is a cross sectional view schematically showing theconnection unit 161. In theconnection unit 161, twoconnection members 161A and 161B, each of which has a recessedportion 162, are arranged with the recessedportions 162 facing each other. The recessedportions 162 of theconnection members 161A and 161B are slightly smaller than a radius of therod 151. Theconnection member 161A hasscrew holes 163A and is fixed to theadaptor detaching unit 160 by screws 163B. The connection member 161B hasscrew holes 164A and is fixed to theadaptor detaching unit 160 by screws 164B. The screw holes 164A are elongated along the arrangement direction of theconnection members 161A and 161B. The connection member 161B is fixed to be movable back and forth along the arrangement direction of theconnection members 161A and 161B. Theconnection unit 161 includes aball screw 166 rotatably supported by a supportingportion 165. Theball screw 166 has one end engaged with a recessedengaging portion 167 and the other end in contact with the connection member 161B. - In the
connection unit 161, the gap between theconnection member 161A and the connection member 161B can be changed by rotating the recessedengaging portion 167 to bias the connection member 161B through theball screw 166. Theconnection unit 161 is connected to therod 151 by providing therod 151 in the recessedportions 162 of theconnection members 161A and 161B and clamping therod 151 with theconnection members 161A and 161B by narrowing the gap between theconnection members 161A and 161B by rotating the recessedengaging portion 167. It is preferable to set a diameter of therod 151 to be slightly greater at a lower portion than at a portion in contact with theconnection members 161A and 161B in order to prevent theconnection unit 161 from being removed from therod 151. - Referring back to
FIGS. 11A and 11B , a hole is formed in a portion of thelinear stage 150 to correspond to theball screw 105. Thelinear stage 150 and theadaptor detaching unit 160 are moved along theball screw 105 and theshaft 106 by the rotation of theball screw 105. Theadaptor detaching unit 160 is provided with thedetachment mechanism 170. - When detaching the
adaptor 96, the operator rotates the handle H1 so that thelinear stage 150 and theadaptor detaching unit 160 is moved to theadaptor 96 as indicated by broken lines inFIGS. 11A and 11B . Then, the operator rotates the handles H2L and H2R so that theadaptor 96 can be detached from theprocessing chamber 30 by thedetachment mechanism 170. - After the
adaptor 96 is detached, the operator rotates the handle H1 in a reverse direction to the rotation direction in the detaching operation so that thelinear stage 150 and theadaptor detaching unit 160 is moved to the original positions.FIGS. 13A and 13B show a state in which theadaptor 96 is detached.FIG. 13A is a top view schematically showing a maintenance apparatus according to the second embodiment.FIG. 13B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment.FIG. 13B is a cross sectional view seen from a bottom side ofFIG. 13A which is taken along the dashedline 13B-13B inFIG. 13A . Thedetached adaptor 96 is moved to the right side while being held by theadaptor detaching unit 160. - Handles H3L and H3R for attaching/detaching the
adaptor detaching unit 160 to/from thelinear stage 150 are provided at a side surface of thecase 101 which is opposite to the side where theopening 101A is formed. The handle H3L is coaxially connected to a projectingengaging portion 191L through arotation shaft 190L. The handle H3R is connected to a projectedengaging portion 191R through arotation shaft 190R. Therotation shafts engaging portion 191L is rotated by rotating the handle H3L. The projectingengaging portion 191R is rotated by rotating the handle H4R. When thelinear stage 150 is located at the right end, the handle H3L, therotation shaft 190L and the projectingengaging portion 191L are engaged with the recessedengaging portion 167 of theconnection unit 161 of theadaptor detaching unit 160 at an upper portion inFIG. 13A . When thelinear stage 150 is located at the right end, the handle H3R, therotation shaft 190R and the projectingengaging portion 191R are engaged with the recessedengaging portion 167 of theconnection unit 161 of theadaptor detaching unit 160 at a lower portion inFIG. 13A . - When the
linear stage 150 is located at the right end, the projectingengaging portions engaging portion 167. Hence, theconnection unit 161 can be manipulated by rotating the handles H3L and H3R, and theadaptor detaching unit 160 can be detached from thelinear stage 150. - An
adaptor support 210 is provided at a right bottom portion of themaintenance apparatus 100.FIG. 14 is a perspective view schematically showing theadaptor support 210. Theadaptor support 210 is formed in a flat plate shape and has a recess 211 formed to correspond to a protrusion on the bottom surface of theadaptor detaching unit 160 and theadaptor 96 so thatadaptor 96 and theadaptor detaching unit 160 can be horizontally supported. The recess 211 may be formed through theadaptor support 210. In the example shown inFIG. 14 , the recess 211 penetrates through theadaptor support 210. - The
adaptor support 210 can be vertically moved along arail 212 vertically formed on an inner surface of thecase 101 by manipulating a handle (not shown). The operator manipulates the handle (not shown) so that theadaptor support 210 can be lifted to support theadaptor 96 and theadaptor detaching unit 160. Then, the operator rotates the handles H3L and H3R so that theadaptor detaching unit 160 can be detached from thelinear stage 150. Then, the operator manipulates the handle (not shown) so that theadaptor support 210 can be lowered and theadaptor 96 and theadaptor detaching unit 160 can be moved to the bottom portion of thecase 101. - In the
maintenance apparatus 100 according to the second embodiment, the manually operatedarm 200 is shared by the detachingunit 120, the attachingunit 140 and thecleaning unit 130. In themaintenance apparatus 100 according to the second embodiment, the manually operatedarm 200 is firstly attached to thelinear stage 150 in the case of using thedetaching unit 120, the attachingunit 140 and thecleaning unit 130. - Next, the operation of attaching the manually operated
arm 200 to thelinear stage 150 will be described.FIGS. 15A and 15B illustrate the operation of attaching the manually operatedarm 200 to thelinear stage 150.FIG. 15A is a top view schematically showing the maintenance apparatus according to the second embodiment.FIG. 15B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment.FIG. 15B is a cross sectional view seen from a bottom side ofFIG. 15A which is taken along a dashedline 15B-15B inFIG. 15A . - The manually operated
arm 200 disposed vertically is rotated to be disposed horizontally by a transfer mechanism (not shown) (see (1) inFIG. 15B ) and transferred to a position below the linear stage 150 (see (2) inFIG. 15B ). The manually operatedarm 200 is provided with aconnection unit 201 that is the same as theconnection unit 161 of theadaptor detaching unit 160. The projectingengaging portions connection unit 201 provided at the manually operatedarm 200. The operator rotates the handles H3L and H3R to attach the manually operatedarm 200 to thelinear stage 150. - Next, the operation of detaching the
focus ring 35 will be described. When detaching thefocus ring 35, the detachingunit 120 is attached to the manually operatedarm 200.FIGS. 16A and 16B show the operation of attaching the detachingunit 120 to the manually operatedarm 200.FIG. 16A is a top view schematically showing the maintenance apparatus according to the second embodiment.FIG. 16B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment.FIG. 16B is a cross sectional view seen from a bottom side ofFIG. 16A which is taken along a dashedline 16B-16B inFIG. 16A . - The detaching
unit 120 disposed vertically is rotated to be disposed horizontally by the transfer mechanism (not shown) (see (1) inFIG. 16B ) and transferred to a position below the manually operated arm 200 (see (2) to (4) inFIG. 16B ). Thepassive arm 200 has an attachingunit 220 for detachably attaching a unit. For example, the attachingunit 220 has a vertical rotation shaft, and an engagingportion 221 such as a bevel gear or the like is provided at an upper end of the rotation shaft. - A handle H4 is provided on a top surface of the
case 101. The handle H4 is coaxially connected to an engagingportion 231, e.g., a bevel gear or the like, through arotation shaft 230. Therotation shaft 230 can be rotated while maintaining airtightness by an O-ring or the like. The engagingportion 231 is rotated by rotating the handle H4. The handle H4, therotation shaft 230 and the engagingportion 231 are disposed at a position where the engagingportion 221 and the engagingportion 231 are engaged when thelinear stage 150 attached with the manually operatedarm 200 is located at the right end. - When the
linear stage 150 is located at the right end, the engagingportion 221 is engaged with the engagingportion 231. Accordingly, when the handle H4 is rotated, the rotation shaft of the attachingunit 220 is rotated through therotation shaft 230, the engagingportion 231 and the engagingportion 221 and, thus, the attachingunit 220 can be manipulated. The attachingunit 220 is provided with a holding mechanism for detachably holding a unit by the rotation of the rotation shaft. The holding mechanism may have any structure as long as it can detachably hold a unit. For example, when a holding portion such as a pin or the like is provided at a center of a disc-shaped unit, the attachingunit 220 holds the holding portion. - The operator rotates the handle H4 to attach the
detaching unit 120 to the manually operatedarm 200. Then, the operator rotates the handle H1 so that thelinear stage 150 and the manually operatedarm 200 can be moved toward theadaptor 96.FIGS. 17A and 17B show a state in which thelinear stage 150 and the manually operatedarm 200 are moved to the left end toward theadaptor 96.FIG. 17A is a top view schematically showing the maintenance apparatus according to the second embodiment.FIG. 17B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment. Further,FIG. 17B is a cross sectional view seen from a bottom side ofFIG. 17A which is taken along a dashed line 17B-17B inFIG. 17A . - The manually operated
arm 200 has a flat plate-shapedbase portion 240, ahead portion 250 provided with the attachingunit 220, and an extensible/contractible mechanism 260 for extending/contracting thehead portion 250 to/from thebase portion 240. For example, the manually operatedarm 200 has, as the extensible/contractible mechanism 260, aball screw 262 rotatably supported by thebase portion 240. An end portion of theball screw 262 is coaxially connected to an engagingportion 265, e.g., a bevel gear or the like. The engagingportion 265 is engaged with the engagingportion 231 when thelinear stage 150 and the manually operatedarm 200 are located at the left end at the side of theadaptor 96. - The engaging
portion 265 is engaged with the engagingportion 231 when thelinear stage 150 and the manually operatedarm 200 are located at the left end at the side of theadaptor 96. Accordingly, when the handle H4 is rotated, theball screw 262 is rotated. To theball screw 262, a supporting member 263 having a groove formed to correspond to theball screw 262 is attached. The supporting member 263 has aguide hole 264 formed in parallel with theball screw 262. The supporting member 263 is fixed to thehead portion 250 through theguide hole 264. Accordingly, when theball screw 262 is rotated, the supporting member 263 and thehead portion 250 are moved along the ball screw 26. In the manually operatedarm 200, when theball screw 262 is rotated, thehead portion 250 is moved toward and away from thebase portion 240 by the extensible/contractible mechanism 260. - In the case of detaching the
focus ring 35, the operator rotates the handle H4 to extend thehead portion 250 from thebase portion 240.FIGS. 18A and 18B show a state in which thehead portion 250 is extended from thebase portion 240.FIG. 18A is a top view schematically showing the maintenance apparatus according to the second embodiment.FIG. 18B is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment.FIG. 18B is a cross sectional view seen from a bottom side ofFIG. 18A which is taken along a dashed line A-A inFIG. 18A . - The manually operated
arm 200 has anelevation mechanism 270 for vertically moving thehead portion 250. - The manually operated
arm 200 has, e.g., a rotatably supportedrotation shaft 272 extending vertically. An engagingportion 273, e.g., a bevel gear or the like, is provided at an upper end portion of therotation shaft 272. Apulley 274 is provided at therotation shaft 272 and rotated by the rotation of therotation shaft 272. Thehead portion 250 is provided with acylindrical rotation shaft 275 extending vertically and coaxially around the rotation shaft of the attachingunit 220. Apulley 276 is provided at therotation shaft 275. Abelt 277 is wound around thepulleys belt 277. Thepulley 276 is rotated by the rotation of thepulley 274. The rotation of thepulley 276 leads to the rotation of therotation shaft 275 and, thus, thebase portion 240 is vertically moved. - A handle H5 is provided on a top surface of the
case 101. The handle H5 is coaxially connected to an engagingportion 281, e.g., a bevel gear or the like, through arotation shaft 280. Therotation shaft 280 can be rotated while maintaining airtightness by an O-ring or the like. The engagingportion 281 is rotated by rotating the handle H5. The handle H5, therotation shaft 280 and the engagingportion 281 are disposed at a position where the engagingportion 273 and the engagingportion 281 are engaged when thehead portion 250 is extended from thebase portion 240 to a position above the mounting table 31. - When the
head portion 250 is extended from thebase portion 240 to the position above the mounting table 31, the engagingportion 273 is engaged with the engagingportion 281. Accordingly, when the handle H5 is rotated, the driving force is transferred to thehead portion 250 through therotation shaft 280, the engagingportion 281, the engagingportion 273, thepulley 274, thebelt 277, thepulley 276 and therotation shaft 275 and, thus, thebase portion 240 is vertically moved. - In the case of detaching the
focus ring 35, the operator rotates the handle H5 to lower thebase portion 240 so that the detachingunit 120 comes in contact with the mounting table 31.FIG. 19 shows a state in which thedetaching unit 120 is brought into contact with the mounting table 31.FIG. 19 is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment. Thefocus ring 35 mounted on the mounting table 31 is adhered to thedetaching unit 120 by theadhesive layer 121. Then, the operator manipulates the handles H1, H4 and H5, in a reverse sequence to that in the case of moving the detachingunit 120 to the position above the mounting table 31, to move the manually operatedarm 200 and the detachingunit 120 to the position shown in (4) inFIG. 16B . Then, the operator manipulates the handle H4 to detach thedetaching unit 120 from the manually operatedarm 200. The detachingunit 120 detached from the manually operatedarm 200 is transferred to a side surface of thecase 101, which is opposite to the side where theopening 101A is formed, by the transfer mechanism (not shown). -
FIG. 20 shows the operation of transferring thedetached detaching unit 120.FIG. 20 is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment. For example, the detachingunit 120 detached from the manually operatedarm 200 is lowered by the transfer mechanism (not shown) (see (1) inFIG. 20 ), rotated to be disposed vertically (see (2) inFIG. 20 ), and transferred as a processed unit to a side surface of thecase 101 which is opposite to the side where theopening 101A is formed (see (3) inFIG. 20 ). - Next, the operation of cleaning the mounting
surface 36 d of the mounting table 31 will be described. In the case of cleaning the mountingsurface 36 d of the mounting table 31, thecleaning unit 130 is attached to the manually operatedarm 200.FIG. 21 shows the operation of attaching thecleaning unit 130 to the manually operatedarm 200.FIG. 21 is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment. - The
cleaning unit 130 disposed vertically is rotated to be disposed horizontally by a transfer mechanism (not shown) (see (1) inFIG. 21 ) and transferred to a position below the manually operated arm 200 (see (2) to (4) inFIG. 21 ). - The operator rotates the handle H4 to attach the
cleaning unit 130 to the manually operatedarm 200. Then, as in the case of detaching thefocus ring 35, the operator manipulates the hands H1, H4 and H5 so that thecleaning unit 130 is transferred to a position above the mounting table 31 and then lowered and brought into contact with mounting table 31. Then, the operator manipulates the handles H1 and H5 in a reverse sequence to that used in the case of moving thecleaning unit 130 to the position above the mounting table 31 to move the manually operatedarm 200 and thecleaning unit 130 to the position indicated as (4) inFIG. 21 . Then, the operator manipulates the handle H4 to detach thecleaning unit 130 from the manually operatedarm 200. Thecleaning unit 130 detached from the manually operatedarm 200 is transferred to a side surface of thecase 101, which is opposite to the side surface where theopening 101A is formed, by the transfer mechanism (not shown). - Next, the operation of attaching a
new focus ring 35 to the mounting table 31 will be described. In the case of attaching anew focus ring 35 to the mounting table 31, the attachingunit 140 is attached to the manually operatedarm 200.FIG. 22 shows the operation of attaching the attachingunit 140 to the manually operatedarm 200.FIG. 22 is a cross sectional view schematically showing the maintenance apparatus according to the second embodiment. InFIG. 22 , thecleaning unit 130 is transferred to a position near the side surface of thecase 101 which is opposite to theopening 101A and and disposed side by side with the detachingunit 120. Thus, thecleaning unit 130 and the detachingunit 120 are disposed side by side. - The attaching
unit 140 disposed vertically is rotated to be disposed horizontally by the transfer mechanism (not shown) (see (1) inFIG. 22 ) and transferred to a position below the manually operated arm 200 (see (2) to (4) inFIG. 22 ). - The operator rotates the handle H4 to attach the attaching
unit 140 to the manually operatedarm 200. Then, as in the case of detaching thefocus ring 35, the operator manipulates the handles H1, H4 and H5 so that the attachingunit 140 is transferred to the position above the mounting table 31 and then lowered and brought into contact with the mounting table 31. The attachingunit 140 in contact with the mounting table 31 releases thenew focus ring 35. Accordingly, thenew focus ring 35 is mounted on the mounting table 31. Then, the operator manipulates the handles H4, H5 in a reverse sequence to that used in the case of moving the attachingunit 140 to the position above the mounting table 31 to move the manually operatedarm 200 and the attachingunit 140 to the position indicated as (4) inFIG. 22 . Then, the operator manipulates the handle H4 to detach the attachingunit 140 from the manually operatedarm 200. The attachingunit 140 detached from the manually operatedarm 200 is transferred to a side position in thecase 101 which is opposite to theopening 101A by the transfer mechanism (not shown). - In the case of attaching the
adaptor 96 to theopening 101A, the operator rotates the handles H3L and H3R to detach the manually operatedarm 200 from thelinear stage 150. The manually operatedarm 200 detached from thelinear stage 150 is transferred to a side position in thecase 101 near theopening 101A by the transfer mechanism (not shown). The detachingunit 120, thecleaning unit 130 and the attachingunit 140 disposed at the opposite side to of the side surface where theopening 101A is formed are also transferred to a side position in thecase 101 near theopening 101A by the transfer mechanism (not shown). - The operator attaches the
adaptor 96 to thesecond gate 95 in a reverse sequence to that used in the case of detaching theadaptor 96. Then, the operator returns a pressure in thecase 101 of themaintenance apparatus 100 to an atmospheric pressure. - In the
maintenance apparatus 100 of the present embodiment, thefocus ring 35 can be replaced without using the transfer system for transferring a wafer W, as in the case of themaintenance apparatus 100 of the first embodiment. - Hereinafter, a third embodiment will be described. A
substrate processing system 1 and a plasma etching apparatus according to the third embodiment have the same configurations as those of thesubstrate processing system 1 and theplasma etching apparatus 10 according to the first embodiment shown inFIGS. 1 and 2 . Therefore, redundant description thereof will be omitted. - The configuration of the
maintenance apparatus 100 according to the third embodiment will be described.FIG. 23 is a cross sectional view schematically showing the maintenance apparatus according to the third embodiment. Like or corresponding parts will be indicated by like reference numerals used in themaintenance apparatuses 100 according to the first and the second embodiment. - The
maintenance apparatus 100 includes acase 101 with anopening 101A having a size corresponding to that of thesecond gate 95 of theplasma etching apparatus 10. An O-ring or the like is provided at a portion around theopening 101A of thecase 101 which is brought into contact with theplasma etching apparatus 10. Themaintenance apparatus 100 is attached to thesecond gate 95 by screw fixing or the like while maintaining airtightness. - A
vacuum gauge 101B capable of measuring a degree of vacuum is provided in thecase 101. When a consumed part is replaced, an atmosphere in thecase 101 of themaintenance apparatus 100 becomes substantially the same as the vacuum atmosphere in theprocessing chamber 30. - In the
maintenance apparatus 100, thecase 101 has therein a maintenance mechanism for performing at least one of an operation of detaching the consumed part in theprocessing chamber 30, an operation of attaching a replacement part in theprocessing chamber 30 and an operation of cleaning theprocessing chamber 30. In themaintenance apparatus 100 of the present embodiment, a manually operatedarm 200, a detachingunit 120, acleaning unit 130 and an attachingunit 140 constitute the maintenance mechanism. The manually operatedarm 200 is previously attached to thedetaching unit 120. - In the
case 101, supporting tables 102 are arranged at three height levels at a predetermined interval near theopening 101A. The detachingunit 120 attached with the manually operatedarm 200, thecleaning unit 130 and the attachingunit 140 are mounted on the supporting tables 102, respectively. Thecase 101 is partially openable/closeable, and the detachingunit 120, thecleaning unit 130 and the attachingunit 140 can be separately attached and detached. In other words, the detachingunit 120, thecleaning unit 130 and the attachingunit 140 can be separately replaced. - In the
maintenance apparatus 100, aball screw 105 and a shaft (not shown) are provided in parallel at an upper portion in thecase 101. Alinear stage 150 is attached to theball screw 105 and the shaft (not shown). Anadaptor detaching unit 160 is attached to thelinear stage 150. - In the
maintenance apparatus 100, an elevation table 114 is provided in a lower portion at a side in thecase 101 which is opposite to theopening 101A. - The
maintenance apparatus 100 performs the maintenance of theplasma etching apparatus 10 by attaching the respective units to thelinear stage 150 by using the elevation table 114. - For example, in the case of detaching the
adaptor 96, the operator rotates the handle H1 to move that thelinear stage 150 and theadaptor detaching unit 160 toward theadaptor 96 as indicated by a dashed line inFIG. 23 . For example, theadaptor 96 is detached by performing the same operation as that in the second embodiment. - For example, in the case of detaching the
focus ring 35, the detachingunit 120 is attached to thelinear stage 150 by using the elevation table 114.FIG. 24 shows the operation of detaching thefocus ring 35.FIG. 24 is a cross sectional view schematically showing the maintenance apparatus according to the third embodiment. For example, theadaptor 96 is detached as shown inFIG. 24 by performing the same operation as that in the second embodiment. - In the
maintenance apparatus 100 according to the third embodiment, thefocus ring 35 can be replaced without using the transfer system for transferring a wafer W, as in the case of themaintenance apparatus 100 according to the first and the second embodiment. - While the embodiments of the present disclosure have been described, the technical scope of the present disclosure is not limited to the above-described embodiments. It is obvious to those skilled in the art that various modifications and changes can be made. Any such modifications and changes may be included within the technical scope of the present disclosure as defined by the following claims.
- For example, in the first to the third embodiment, the case of replacing the
focus ring 34 as the consumed part has been described. However, the consumed part is not limited thereto. Themaintenance apparatus 100 may also be used for the maintenance such as cleaning of theprocessing chamber 30 or the like, other than the replacement of the consumed part. - In the first to the third embodiment, the case of using the
maintenance apparatus 100 for maintenance of theplasma etching apparatus 10 has been described. However, themaintenance apparatus 100 may be used for maintenance of any apparatus having a processing chamber in a vacuum state without being limited thereto. - In the first to the third embodiment, the example in which the
case 101 is an inseparable container has been described. However, thecase 101 of the first to the third embodiment is not limited thereto and may be formed by stacking a plurality of frames including a frame in which a unit can be accommodated.FIG. 25 is a perspective view schematically showing an example of a frame. Aframe 300 shown inFIG. 25 has a rectangular shape with an open top and an open bottom. Arail 301 to be coupled with a unit is formed on an inner side surface of theframe 300. The unit can be coupled to and held by therail 301. Arecess 302 for positioning at the time of stacking theframes 300 is formed on a top surface of each of four corners of theframe 300. A protrusion corresponding to therecess 302 is formed on a bottom surface of each of the four corners of theframe 300. Thecase 101 may be formed by stacking a plurality offrames 300.FIG. 26 is a perspective view schematically showing an example of a case formed by stacking a plurality of frames. Thecase 101 shown inFIG. 26 is formed by stacking three frames 300 (300A to 300C). A top surface of theuppermost frame 300A is sealed by a ceiling plate. A bottom surface of thelowermost frame 300A is sealed by a bottom plate. As for theuppermost frame 300A, it is possible to use a box-shaped frame with a closed top and an open bottom. As for thelowermost frame 300C, it is possible to use a box-shaped frame with an open top and a closed bottom. Theframe 300 may be made of any material as long as it ensures a strength against a vacuum atmosphere that is substantially the same as that in theprocessing chamber 30. For example, theframe 300 may be made of resin or the like. Anopening 101A may be formed at theuppermost frame 300. Or, aframe 300 having anopening 101A may be coupled. By using thecase 101 in which a plurality offrames 300 is stacked, it is possible to easily change a unit in response to a maintenance operation to be performed by themaintenance apparatus 100. In themaintenance apparatus 100, thecase 101 can only have frames for units used for the maintenance operation and, thus, the size of thecase 101 can be reduced in accordance with the maintenance operation to be performed. For example, in the case of performing only the cleaning of theprocessing chamber 30, aball screw 105 and ashaft 106 are provided in parallel and thelinear stage 140 attached with theadaptor detaching unit 160 is accommodated in theframe 300A. The manually operatedarm 200 and thecleaning unit 130 are accommodated in the frame 300B. The elevation table 114 is accommodated in theframe 300C. With the configuration in which theframes 300A to 300C are stacked, themaintenance apparatus 100 can perform the cleaning of theprocessing chamber 30 only. In addition, themaintenance apparatus 100 can be easily transferred on the basis of thecase 101. - In the first to the third embodiment, the case in which the operator rotates the handle to move the unit or to detach the
adaptor 96 has been described. However, themaintenance apparatus 100 may perform all the maintenance operations by using, e.g., a driving force of an actuator such as a motor or the like. Or, themaintenance apparatus 100 may perform all the maintenance operations by using a driving force of an operator. - In the first to the third embodiment, the case in which the
second gate 95 of theplasma etching apparatus 10 is blocked by theadaptor 96 while maintaining airtightness has been described. However, a gate valve G may be openably/closeably provided at thesecond gate 95 of theplasma etching apparatus 10. In that case, themaintenance apparatus 100 does not require a unit for detaching theadaptor 96. - While the present disclosure has been shown and described with respect to the embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present disclosure as defined in the following claims.
Claims (17)
1. A maintenance apparatus, comprising,
a case detachably connectable to a plasma processing apparatus; and
a maintenance mechanism configured to selectively perform one of maintenance operations when the case is connected to the plasma processing apparatus, the maintenance mechanism including:
a robot arm; and
a plurality of maintenance units designed to perform the respective maintenance operations, one of the plurality of maintenance units being selectively held by the robot arm to perform the corresponding maintenance operation, the plurality of maintenance units including a cleaning unit designed to clean an inside of a chamber of the plasma processing apparatus.
2. The maintenance apparatus of claim 1 , wherein the plurality of maintenance units further includes one or more replacement units designed to replace a used consumable part with a new consumable part in the chamber.
3. The maintenance apparatus of claim 2 , wherein the one or more replacement units includes a detaching unit designed to detach the used consumable part in the chamber, and an attaching unit designed to attach the new consumable part in the chamber.
4. The maintenance apparatus of claim 1 , wherein the plurality of maintenance units further includes one or more replacement units designed to replace a used focus ring with a new focus ring in the chamber.
5. The maintenance apparatus of claim 4 , wherein the one or more replacement units includes a detaching unit designed to detach the used focus ring from a wafer stage in the chamber, and an attaching unit designed to attach the new consumable part to the wafer stage in the chamber.
6. The maintenance apparatus of claim 5 , wherein the detaching unit has an adhesive layer designed to contact with the used focus ring on the wafer stage.
7. The maintenance apparatus of claim 1 , wherein the cleaning unit is designed to clean a wafer stage in the chamber.
8. The maintenance apparatus of claim 7 , wherein the cleaning unit has an adhesive layer designed to contact with a surface of the wafer stage.
9. The maintenance apparatus of claim 1 , further comprising an elevation table, wherein the robot arm is fixed to the elevation table.
10. The maintenance apparatus of claim 1 , wherein the case is detachably connectable to the plasma processing apparatus at an opposite side of a first gate between the chamber and a wafer transfer system.
11. The maintenance apparatus of claim 10 , wherein the maintenance mechanism is configured to selectively perform one of the maintenance operations through a second gate disposed at an opposite side of the first gate.
12. The maintenance apparatus of claim 11 , wherein a size of the second gate is greater than a size of the first gate.
13. The maintenance apparatus of claim 11 , wherein one of the maintenance operations is selectively performed without exposing the chamber to an atmosphere.
14. The maintenance apparatus of claim 13 , wherein the case is connectable to the plasma processing apparatus while maintaining airtightness.
15. The maintenance apparatus of claim 14 , wherein the case is connectable to a vacuum pump of the plasma processing apparatus.
16. The maintenance apparatus of claim 14 , further comprising a vacuum pump connected to the case.
17. The maintenance apparatus of claim 1 , further comprising a plurality of supporting tables configured to store the plurality of maintenance units in the case.
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Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108369922B (en) | 2016-01-26 | 2023-03-21 | 应用材料公司 | Wafer edge ring lifting solution |
JP6635888B2 (en) * | 2016-07-14 | 2020-01-29 | 東京エレクトロン株式会社 | Plasma processing system |
US9947517B1 (en) | 2016-12-16 | 2018-04-17 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
US10553404B2 (en) | 2017-02-01 | 2020-02-04 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
JP6797079B2 (en) * | 2017-06-06 | 2020-12-09 | 東京エレクトロン株式会社 | Plasma processing equipment, plasma control method, and plasma control program |
US11075105B2 (en) | 2017-09-21 | 2021-07-27 | Applied Materials, Inc. | In-situ apparatus for semiconductor process module |
US11043400B2 (en) | 2017-12-21 | 2021-06-22 | Applied Materials, Inc. | Movable and removable process kit |
US10600623B2 (en) | 2018-05-28 | 2020-03-24 | Applied Materials, Inc. | Process kit with adjustable tuning ring for edge uniformity control |
US11935773B2 (en) | 2018-06-14 | 2024-03-19 | Applied Materials, Inc. | Calibration jig and calibration method |
US11289310B2 (en) | 2018-11-21 | 2022-03-29 | Applied Materials, Inc. | Circuits for edge ring control in shaped DC pulsed plasma process device |
JP7154986B2 (en) * | 2018-12-11 | 2022-10-18 | 平田機工株式会社 | Substrate transfer device and substrate transfer system |
US11279032B2 (en) | 2019-04-11 | 2022-03-22 | Applied Materials, Inc. | Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots |
US11101115B2 (en) | 2019-04-19 | 2021-08-24 | Applied Materials, Inc. | Ring removal from processing chamber |
US10964584B2 (en) | 2019-05-20 | 2021-03-30 | Applied Materials, Inc. | Process kit ring adaptor |
CN112103166A (en) * | 2019-06-18 | 2020-12-18 | 东京毅力科创株式会社 | Substrate processing apparatus |
US11626305B2 (en) | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
US11211269B2 (en) | 2019-07-19 | 2021-12-28 | Applied Materials, Inc. | Multi-object capable loadlock system |
JP7365878B2 (en) * | 2019-12-06 | 2023-10-20 | 東京エレクトロン株式会社 | Measuring device and method |
US11370114B2 (en) | 2019-12-09 | 2022-06-28 | Applied Materials, Inc. | Autoteach enclosure system |
JP7419154B2 (en) | 2020-05-01 | 2024-01-22 | 東京エレクトロン株式会社 | Parts replacement system and equipment |
USD954769S1 (en) | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
USD980176S1 (en) | 2020-06-02 | 2023-03-07 | Applied Materials, Inc. | Substrate processing system carrier |
JP7409976B2 (en) * | 2020-06-22 | 2024-01-09 | 東京エレクトロン株式会社 | How to replace plasma processing system, plasma processing equipment and edge ring |
JP2022025428A (en) * | 2020-07-29 | 2022-02-10 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate transfer method |
WO2022138847A1 (en) * | 2020-12-25 | 2022-06-30 | 東京エレクトロン株式会社 | Maintenance device, vacuum processing system, and maintenance method |
JP2022111771A (en) * | 2021-01-20 | 2022-08-01 | 東京エレクトロン株式会社 | Plasma processing system and plasma processing method |
JP2022185689A (en) * | 2021-06-03 | 2022-12-15 | 東京エレクトロン株式会社 | Component replacement method, component replacement device, and component replacement system |
TWI804373B (en) * | 2022-07-01 | 2023-06-01 | 天虹科技股份有限公司 | Carrying mechanism with adjustable alignment devices and deposition machine thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060260648A1 (en) * | 2005-05-13 | 2006-11-23 | King Yuan Electronics Co., Ltd. | Apparatus and method of automatically cleaning a pick-up head |
US8006340B2 (en) * | 2008-08-26 | 2011-08-30 | Hitachi High-Technologies Corporation | Cleaning apparatus |
US8764907B2 (en) * | 2005-03-28 | 2014-07-01 | Lam Research Corporation | Servicing a plasma processing system with a robot |
US20150262854A1 (en) * | 2012-11-30 | 2015-09-17 | Rorez Systems Corporation | Wafer etching system and wafer etching process using the same |
US20170117172A1 (en) * | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Automated Replacement of Consumable Parts Using Interfacing Chambers |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4838990A (en) * | 1987-07-16 | 1989-06-13 | Texas Instruments Incorporated | Method for plasma etching tungsten |
JP2905857B2 (en) * | 1989-08-11 | 1999-06-14 | 東京エレクトロン株式会社 | Vertical processing equipment |
US5218459A (en) * | 1991-09-16 | 1993-06-08 | Eastman Kodak Company | Print scanner with soft key variable magnification |
JPH06267858A (en) * | 1993-03-11 | 1994-09-22 | Canon Inc | Vacuum film forming apparatus |
US5855679A (en) * | 1995-03-30 | 1999-01-05 | Nec Corporation | Semiconductor manufacturing apparatus |
JP2778574B2 (en) * | 1995-03-30 | 1998-07-23 | 日本電気株式会社 | Semiconductor manufacturing equipment |
JP3380652B2 (en) * | 1995-05-26 | 2003-02-24 | 東京エレクトロン株式会社 | Processing equipment |
JPH0931656A (en) * | 1995-07-24 | 1997-02-04 | Ebara Corp | Thin film vapor growth apparatus |
US6098637A (en) * | 1998-03-03 | 2000-08-08 | Applied Materials, Inc. | In situ cleaning of the surface inside a vacuum processing chamber |
JP3954287B2 (en) * | 1999-06-28 | 2007-08-08 | 東京エレクトロン株式会社 | Wafer carrier lid attachment / detachment device |
JP2002110548A (en) * | 2000-09-27 | 2002-04-12 | Hitachi Kokusai Electric Inc | Method for attaching or detaching reaction furnace chamber |
TWI290589B (en) * | 2000-10-02 | 2007-12-01 | Tokyo Electron Ltd | Vacuum processing device |
JP4100466B2 (en) * | 2000-12-25 | 2008-06-11 | 東京エレクトロン株式会社 | Liquid processing equipment |
JP2004103971A (en) * | 2002-09-12 | 2004-04-02 | Hitachi High-Technologies Corp | Method and apparatus for damascene processing, and damascene structure |
JP4420380B2 (en) * | 2003-09-10 | 2010-02-24 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
KR100555620B1 (en) * | 2003-10-28 | 2006-03-03 | 주식회사 디엠에스 | System for carrying flat panel display and the carrying method using the same |
JP2006140238A (en) * | 2004-11-10 | 2006-06-01 | Tokyo Electron Ltd | Component for substrate treatment device and its manufacturing method |
US7699021B2 (en) * | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
JP2006196691A (en) * | 2005-01-13 | 2006-07-27 | Toshiba Corp | Device for manufacturing semiconductor and manufacturing method for semiconductor device |
US7654010B2 (en) * | 2006-02-23 | 2010-02-02 | Tokyo Electron Limited | Substrate processing system, substrate processing method, and storage medium |
JP2009239013A (en) * | 2008-03-27 | 2009-10-15 | Tokyo Electron Ltd | Cleaning substrate and cleaning method |
CN102272350B (en) * | 2009-01-14 | 2014-12-24 | 株式会社爱发科 | Plasma cvd apparatus |
KR20100100269A (en) * | 2009-03-06 | 2010-09-15 | 주식회사 코미코 | Lift pin and apparatus for processing a wafer including the same |
JP5655793B2 (en) * | 2009-12-18 | 2015-01-21 | 株式会社ニコン | Maintenance method and safety device for substrate processing apparatus |
JP6003011B2 (en) * | 2011-03-31 | 2016-10-05 | 東京エレクトロン株式会社 | Substrate processing equipment |
CN103247507A (en) * | 2013-04-08 | 2013-08-14 | 上海华力微电子有限公司 | Compound plasma focusing ring and method for replacing same |
US20150340209A1 (en) * | 2014-05-20 | 2015-11-26 | Micron Technology, Inc. | Focus ring replacement method for a plasma reactor, and associated systems and methods |
JP2016211030A (en) * | 2015-05-07 | 2016-12-15 | 日新電機株式会社 | Vacuum treatment apparatus |
-
2017
- 2017-02-16 JP JP2017026524A patent/JP6812264B2/en active Active
-
2018
- 2018-02-06 TW TW107104109A patent/TWI799406B/en active
- 2018-02-06 TW TW112110168A patent/TW202329241A/en unknown
- 2018-02-13 CN CN201810150376.9A patent/CN108447760B/en active Active
- 2018-02-13 CN CN201911006282.5A patent/CN110808202B/en active Active
- 2018-02-14 KR KR1020180018282A patent/KR102517504B1/en active IP Right Grant
- 2018-02-15 US US15/897,228 patent/US11309168B2/en active Active
-
2022
- 2022-03-24 US US17/703,503 patent/US20220216035A1/en active Pending
-
2023
- 2023-03-28 KR KR1020230040274A patent/KR20230047069A/en not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8764907B2 (en) * | 2005-03-28 | 2014-07-01 | Lam Research Corporation | Servicing a plasma processing system with a robot |
US20060260648A1 (en) * | 2005-05-13 | 2006-11-23 | King Yuan Electronics Co., Ltd. | Apparatus and method of automatically cleaning a pick-up head |
US8006340B2 (en) * | 2008-08-26 | 2011-08-30 | Hitachi High-Technologies Corporation | Cleaning apparatus |
US20150262854A1 (en) * | 2012-11-30 | 2015-09-17 | Rorez Systems Corporation | Wafer etching system and wafer etching process using the same |
US20170117172A1 (en) * | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Automated Replacement of Consumable Parts Using Interfacing Chambers |
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US20180233328A1 (en) | 2018-08-16 |
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CN108447760A (en) | 2018-08-24 |
TW202329241A (en) | 2023-07-16 |
CN110808202A (en) | 2020-02-18 |
KR20230047069A (en) | 2023-04-06 |
CN108447760B (en) | 2019-11-12 |
JP6812264B2 (en) | 2021-01-13 |
CN110808202B (en) | 2022-05-24 |
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KR20180094809A (en) | 2018-08-24 |
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