TWI667554B - Substrate transfer device and method - Google Patents

Substrate transfer device and method Download PDF

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TWI667554B
TWI667554B TW107106001A TW107106001A TWI667554B TW I667554 B TWI667554 B TW I667554B TW 107106001 A TW107106001 A TW 107106001A TW 107106001 A TW107106001 A TW 107106001A TW I667554 B TWI667554 B TW I667554B
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substrate
transfer
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TW201833688A (zh
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梁校
李洋
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大陸商上海微電子裝備（集團）股份有限公司
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    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
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    • B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
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    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
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    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
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    • H01—ELECTRIC ELEMENTS
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
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    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass

Abstract

本發明揭露了一種基板傳輸裝置及方法，基板傳輸裝置包括：基板傳送台，設置於機械手和工件台之間且包括沿第一方向平行設置的基板上板傳送台和基板下板傳送台，用於將基板沿與第一方向垂直的第二方向在工件台和機械手之間傳送；以及整體框架和基板過渡氣浮組件，基板過渡氣浮組件固定連接於整體框架靠近工件台的一側且能夠與基板上板傳送台和基板下板傳送台中的每一個相接，用於在基板上板傳送台或基板下板傳送台傳送基板的過程中産生空氣膜將基板頂起。透過使用基板過渡氣浮組件與導向輥輪的配合，實現了基板在機械手和工件台之間高效安全地傳輸，並且極大降低了傳送分系統的成本。

Description

基板傳輸裝置及方法
本發明涉及光刻機技術領域，具體涉及一種基板傳輸裝置及方法。
作爲光刻機中的一個重要組成部分，基板傳送台的安全傳輸對提高光刻機的生産效率起著至關重要的作用。基板傳送一般透過輥輪台或者氣浮台來實現玻璃基板在工件台和機械手之間的交接。隨著積體電路製造行業的高速發展，要傳輸的基板越來越大，這就對傳送台傳輸速度和安全性能有了更高的要求。目前使用的輥輪台和氣浮台存在一些不足，其中採用單一的輥輪傳送台無法保證基板傳輸過程中的順利交接；而採用單一的氣浮工件台成本太高，不利於其大規模推廣使用。
本發明提供了一種基板傳輸裝置及方法，以解决現有技術中存在的問題。
爲了解决上述技術問題，本發明提供一種基板傳輸裝置，包括：基板傳送台，設置於機械手和工件台之間且包括沿第一方向平行設置的基板上板傳送台和基板下板傳送台，用於將基板沿與第一方向垂直的第二方向在工件台和機械手之間傳送；以及整體框架和基板過渡氣浮組件，基板過渡氣浮組件固定連接於整體框架靠近工件台的一側且能夠與基板上板傳送台和基板下板傳送台中的每一個相接，用於在基板上板傳送台或基板下板傳送台傳送基板的過程中産生空氣膜將基板頂起。
進一步的，基板上板傳送台和基板下板傳送台的相對位置不變，作爲一個整體平行於整體框架且與整體框架滑動連接。
進一步的，基板上板傳送台和基板下板傳送台的靠近機械手的一側分別設有基板傳送組件。
進一步的，包括設置在整體框架上的運動模組和設置於運動模組上的複數個吸盤，該吸盤用於吸附基板並在運動模組的運動下帶動基板沿第二方向運動。
進一步的，運動模組爲電機與絲槓的組合。
進一步的，基板上板傳送台和基板下板傳送台分別包括沿第一方向設置且高度相同的基板導向組件和前端氣浮組件。
進一步的，基板導向組件包括平行設置的複數個導向輥輪排，每個導向輥輪排包括沿第二方向間隔設置的複數個導向輥輪。
進一步的，前端氣浮組件用於産生空氣膜將基板頂起。
進一步的，基板上板傳送台和基板下板傳送台還分別包括與基板導向組件間隔分布的基板位置調節組件。
進一步的，基板位置調節組件包括與導向輥輪排間隔分布的複數個萬向滾珠組，每個萬向滾珠組包括沿第二方向間隔設置的複數個萬向滾珠單元。
進一步的，每個萬向滾珠單元包括支架、設於支架上的複數個萬向滾珠和帶動支架上下運動的氣缸。
進一步的，基板上板傳送台和基板下板傳送台還分別包括沿第一方向設置於基板導向組件兩側的邊緣保護組件，用於防止基板在第一方向發生偏移。
進一步的，邊緣保護組件包括沿第一方向設置於基板導向組件兩側的複數個T型支柱。
進一步的，基板上板傳送台和基板下板傳送台的結構相同。
本發明還提供一種基板傳輸裝置的傳輸方法，包括以下步驟：
步驟S1：機械手將基板置於基板傳送台上；
步驟S2：設於基板傳送台上的基板傳送組件吸附基板並帶動基板向工件台方向運動；以及
步驟S3：當基板運動至基板傳送台靠近工件台一側時，基板過渡氣浮組件産生空氣膜，將基板頂起並由基板傳送組件將基板沿第二方向傳送至工件台。
進一步的，步驟S2中，基板傳送組件中的吸盤吸附基板，接著運動模組帶動基板向工件台一側運動，基板的運動帶動基板傳送台上的導向輥輪滾動，對基板的移動進行導向。
進一步的，基板傳送台還包括沿第一方向間隔設置的複數個萬向滾珠單元，每個萬向滾珠單元包括支架、設於支架上的多個萬向滾珠和帶動支架上下運動的氣缸，步驟S1和步驟S2之間，還包括萬向滾珠單元中的氣缸帶動支架上升，使基板置於萬向滾珠的平面上，實現位置調整，接著氣缸帶動支架下降，將基板重新置於基板傳送台上。
本發明提供的基板傳輸裝置包括設於機械手和工件台之間的基板傳送台和基板過渡氣浮組件，基板傳送台包括沿X向平行設置的基板上板傳送台和基板下板傳送台，基板上板傳送台和基板下板傳送台靠近機械手的一側分別設有基板傳送組件。透過設置基板傳送台和基板過渡氣浮組件，在基板傳送台與工件台進行工件交接的過程中，透過使用基板過渡氣浮組件與導向輥輪的配合，實現了基板在機械手和工件台之間高效安全地傳輸，並且極大降低了傳送分系統的成本。
下面結合圖式對本發明作詳細描述。
實施例1
如圖1a到圖3所示，本發明提供了一種基板傳輸裝置，包括依次設於機械手1和工件台2之間的基板傳送台3和基板過渡氣浮組件4，基板傳送台3包括沿X向平行設置的基板上板傳送台5和基板下板傳送台6，基板上板傳送台5和基板下板傳送台6靠近機械手1的一側分別設有基板傳送組件15（如圖1c所示）。具體的，基板上板傳送台5和基板下板傳送台6二者相對位置不變，作爲一個整體平行於整體框架8，且與整體框架8滑動連接；基板上板傳送台5和基板下板傳送台6可沿X向移動，基板上板傳送台5用於將機械手1上的基板7傳送至工件台2，基板下板傳送台6則用於將工件台2上的基板7傳送至機械手1。基板過渡氣浮組件4固定連接於整體框架8上。透過設置基板傳送台3和基板過渡氣浮組件4，實現了基板7在機械手1和工件台2之間高效安全地傳輸，並且極大降低了傳送分系統的成本。
基板上板傳送台5與基板下板傳送台6的結構相同，當需要將機械手1上的基板7傳送至工件台2時，基板上板傳送台5和基板下板傳送台6整體進行滑動，使基板上板傳送台5滑動到與基板過渡氣浮組件4對應的位置進行工作；當需要將工件台2上的基板7傳送至機械手1上時，基板上板傳送台5和基板下板傳送台6整體進行滑動，使基板下板傳送台6滑動到與基板過渡氣浮組件4對應的位置進行工作。
基板上板傳送台5和基板下板傳送台6可透過固定在一個框架上作爲一個整體，也可以簡單地透過杆狀物等直接連接，只要二者相對位置不變即可，本發明不對二者的具體連接方式做出限定。
因基板上板傳送台5和基板下板傳送台6的結構一樣，而工作過程是逆過程。以下僅以基板上板傳送台5上板的工作過程爲例。
較佳地，如圖1c所示，基板傳送組件15包括運動模組20和設於運動模組20上的複數個吸盤19，運動模組20可設置在整體框架8上，吸盤19設置在運動模組20上，透過運動模組20的運動帶動吸盤19運動，而吸盤19吸附了基板，進一步帶動基板運動。此處爲簡單的直線運動，有許多可以實現直線運動的模組，例如電機與絲槓組合。當機械手1將基板7置於基板上板傳送台5上時，基板傳送組件15透過吸盤19對其進行吸附，接著運動模組20帶動其向工件台2一側運動。
如圖4a到圖4b所示，基板過渡氣浮組件4設置於整體框架8靠近工件台2的一側且能夠與基板上板傳送台5相接，當基板7運動至基板上板傳送台靠近工件台2一側但未達到工件台2時，較佳爲當基板7的一側達到基板過渡氣浮組件4時，基板過渡氣浮組件4産生空氣膜，使基板7上浮，同時，運動模組20繼續驅動基板向工件台2運動，以便順利交接至工件台2上。
如圖1a到圖3所示，基板傳送台3滑動設於整體框架8上，透過整體框架8進行支撑，整體框架8上沿X向設有滑軌，基板傳送台3底部設有與滑軌對應的滑槽，根據上下板的需要，基板傳送台3相對整體框架8沿X向移動，使其中的基板上板傳送台5或基板下板傳送台6位於機械手1和工件台2之間，且與基板過渡氣浮組件4對應的位置。基板上板傳送台5和基板下板傳送台6分別包括沿X向依次設置且高度相同的基板導向組件9和前端氣浮組件10，其中基板導向組件9包括平行設置的複數個導向輥輪排，每個導向輥輪排包括沿X向間隔設置的複數個導向輥輪91，具體的，機械手1將基板7置於導向輥輪91上方，此時基板傳送組件15中的吸盤19對其進行吸附，接著運動模組20帶動其向工件台2一側運動，基板7的運動帶動導向輥輪91轉動使其滾動（圖中所示爲沿順時針方向滾動），對基板7的傳輸起到導向的作用，導向輥輪91良好的導向性能使得基板7順利沿Y方向運動，並且避免了其沿X方向移動，從而提高了傳送精度。
參照圖2到圖3，基板上板傳送台5和基板下板傳送台6還分別包括沿X向設置於基板導向組件9兩側的邊緣保護組件，邊緣保護組件包括沿X向設置於基板導向組件9兩側的複數個T型支柱11，即T型支柱11設有兩行，沿X向分設於基板導向組件9的兩側，每行T型支柱11沿Y向間隔排列，T型支柱11的上端高出基板導向組件9，對傳輸中的基板7進行保護，避免其在X方向發生偏移，進一步提高了傳輸安全性。
本發明提供一種基板傳輸裝置的傳輸方法，包括以下步驟：
步驟S1：機械手1將基板7置於基板傳送台3上，具體的，本實施例主要針對上板過程，此時基板7置於基板傳送台3上的基板上板傳送台5上，與基板上板傳送台5上的導向輥輪91接觸。
步驟S2：基板傳送組件15吸附基板7並帶動基板7沿工件台2方向運動；具體的，基板傳送組件15中的吸盤19吸附基板7，接著運動模組20帶動其向工件台2一側運動，基板7的運動同時給導向輥輪91施加力，使其沿順時針方向滾動，對基板7的傳輸起到導向的作用，導向輥輪91良好的導向性能使得基板7順利沿Y方向運動，並且避免了其沿X方向移動，進一步提高了傳送精度，在整個過程中，基板導向組件9沿X向設置於基板導向組件兩側的邊緣保護組件對其基板進行保護，避免其在X向發生偏移。
步驟S3：當基板7運動至基板傳送台3靠近工件台2一側時，基板過渡氣浮組件4産生空氣膜，將基板7頂起並送至工件台2。需要說明的是，在基板7靠近基板傳送台3靠近工件台2一側時，首先前端氣浮組件10産生空氣膜，將基板7頂起並送至基板過渡氣浮組件4上方，接著基板過渡氣浮組件4産生空氣膜，將基板7頂起並送至工件台2上。
實施例2
與實施例1不同的是，如圖5到圖6所示，基板上板傳送台5和基板下板傳送台6進一步包括與基板導向組件9間隔分布的基板位置調節組件。具體的，基板位置調節組件包括與導向輥輪排間隔分布的複數個萬向滾珠組，每個萬向滾珠組包括複數個沿X向間隔設置的複數個萬向滾珠單元12，其中，滾珠被動適應基板的調節過程，防止位置調節過程中産生的摩擦損壞基板。每個萬向滾珠單元12包括支架13、設於支架13上的複數個萬向滾珠14和帶動支架13上下運動的氣缸（圖中未標出）。具體的，支架13固定於整體框架8上，當機械手1將基板7置於基板傳送台3上時，首先萬向滾珠單元12中的氣缸帶動支架13上升，使基板置於萬向滾珠12的平面上，透過定位氣缸21和夾緊氣缸22的配合，基板會在萬向滾輪平面上移動到指定位置，從而實現位置調整，但實現方式並不限於此。此實施例中基板爲矩形，在基板兩個邊設置定位氣缸21，基板另外兩個邊設置夾緊氣缸22，放置基板時對準定位氣缸21，然後夾緊氣缸22運動，對位置進行定位微調。如圖7a所示，由於萬向滾珠具有任意方向可轉動的良好特性，避免了在調整過程中，劃傷基板。待完成基板7的位置調節後，氣缸帶動支架13下降，如圖7b所示，將基板7重新置於基板傳送台3上導向輥輪91的位置，此時基板傳送組件15中的吸盤19在氣缸帶動下上升，同時吸盤19真空打開，吸附住基板，接著運動模組20帶動基板傳送組件15以及吸附住的基板一起向工件台2一側運動，同時基板的運動給導向輥輪91施加力，使其沿順時針方向滾動，對基板7的傳輸起到導向的作用，導向輥輪91良好的導向性能使得基板7順利沿Y方向運動，並且避免了其沿X方向移動，從而提高了傳送精度。
綜上所述，本發明提供的基板傳輸裝置及方法，包括依次設於機械手1和工件台2之間的基板傳送台3和基板過渡氣浮組件4，基板傳送台3包括沿X向平行設置的基板上板傳送台5和基板下板傳送台6，基板上板傳送台5和基板下板傳送台6靠近機械手1的一側分別設有基板傳送組件15。透過設置基板傳送台3和基板過渡氣浮組件4，在基板傳送台3與工件台2進行工件交接的過程中，透過使用基板過渡氣浮組件4與導向輥輪91的配合，實現了基板7在機械手1和工件台2之間高效安全地傳輸，並且極大降低了傳送分系統的成本。
雖然說明書中對本發明的實施方式進行了說明，但這些實施方式只是作爲提示，不應限定本發明的保護範圍。在不脫離本發明宗旨的範疇內進行各種省略、置換和變更均應包含在本發明的保護範圍內。
1‧‧‧機械手
10‧‧‧前端氣浮組件
11‧‧‧T型支柱
12‧‧‧萬向滾珠單元
13‧‧‧支架
14‧‧‧萬向滾珠
15‧‧‧基板傳送組件
16‧‧‧X向運動方向
17‧‧‧Y向運動方向
18‧‧‧X軸
19‧‧‧吸盤
2‧‧‧工件台
20‧‧‧運動模組
21‧‧‧定位氣缸
22‧‧‧夾緊氣缸
3‧‧‧基板傳送台
4‧‧‧基板過渡氣浮組件
5‧‧‧基板上板傳送台
6‧‧‧基板下板傳送台
7‧‧‧基板
8‧‧‧整體框架
9‧‧‧基板導向組件
91‧‧‧導向輥輪
圖1a是本發明實施例1中基板傳輸裝置的結構示意圖；
圖1b是本發明實施例1中基板傳輸裝置的結構立體圖；
圖1c是本發明實施例1中運動模組的結構立體圖；
圖2是本發明實施例1中基板上板傳送台的主視圖；
圖3是本發明實施例1中基板上板傳送台的側視圖；
圖4a到圖4b是本發明實施例1中基板靠近工件台時的狀態示意圖；
圖5是本發明實施例2中基板上板傳送台的主視圖；
圖6是本發明實施例2中基板上板傳送台的側視圖；以及
圖7a到圖7b分別是本發明實施例2中萬向滾珠單元上升和下降時的狀態示意圖。

Claims (18)

  1. 一種基板傳輸裝置，包括： 一基板傳送台，設置於一機械手和一工件台之間且包括沿一第一方向平行設置的一基板上板傳送台和一基板下板傳送台，用於將一基板沿與該第一方向垂直的一第二方向在該工件台和該機械手之間傳送；以及 一整體框架和一基板過渡氣浮組件，該基板過渡氣浮組件固定連接於該整體框架靠近該工件台的一側且能夠與該基板上板傳送台和該基板下板傳送台中的每一個相接，用於在該基板上板傳送台或該基板下板傳送台傳送該基板的過程中産生一空氣膜將該基板頂起。
  2. 如申請專利範圍第1項所述之基板傳輸裝置，其中，該基板上板傳送台和該基板下板傳送台的相對位置不變，作爲一個整體平行於該整體框架且與該整體框架滑動連接。
  3. 如申請專利範圍第1項所述之基板傳輸裝置，其中，該基板上板傳送台和該基板下板傳送台的靠近該機械手的一側分別設有一基板傳送組件。
  4. 如申請專利範圍第3項所述之基板傳輸裝置，其中，該基板傳送組件包括設置在該整體框架上的一運動模組和設置於該運動模組上的複數個吸盤，該吸盤用於吸附該基板並在該運動模組的運動下帶動該基板沿該第二方向運動。
  5. 如申請專利範圍第4項所述之基板傳輸裝置，其中，該運動模組爲一電機與一絲槓的組合。
  6. 如申請專利範圍第1項所述之基板傳輸裝置，其中，該基板上板傳送台和該基板下板傳送台分別包括沿該第一方向設置且高度相同的一基板導向組件和一前端氣浮組件。
  7. 如申請專利範圍第6項所述之基板傳輸裝置，其中，該基板導向組件包括平行設置的複數個導向輥輪排，每個該導向輥輪排包括沿該第二方向間隔設置的複數個導向輥輪。
  8. 如申請專利範圍第6項所述之基板傳輸裝置，其中，該前端氣浮組件用於産生該空氣膜將該基板頂起。
  9. 如申請專利範圍第7項所述之基板傳輸裝置，其中，該基板上板傳送台和該基板下板傳送台還分別包括與該基板導向組件間隔分布的一基板位置調節組件。
  10. 如申請專利範圍第9項所述之基板傳輸裝置，其中，該基板位置調節組件包括與該導向輥輪排間隔分布的複數個萬向滾珠組，每個該萬向滾珠組包括沿該第二方向間隔設置的複數個萬向滾珠單元。
  11. 如申請專利範圍第10項所述之基板傳輸裝置，其中，每個該萬向滾珠單元包括一支架、設於該支架上的複數個萬向滾珠和帶動該支架上下運動的一氣缸。
  12. 如申請專利範圍第6項所述之基板傳輸裝置，其中，該基板上板傳送台和該基板下板傳送台還分別包括沿該第一方向設置於該基板導向組件兩側的一邊緣保護組件，用於防止該基板在該第一方向發生偏移。
  13. 如申請專利範圍第12項所述之基板傳輸裝置，其中，該邊緣保護組件包括沿該第一方向設置於該基板導向組件兩側的複數個T型支柱。
  14. 如申請專利範圍第1項所述之基板傳輸裝置，其中，該基板上板傳送台和該基板下板傳送台的結構相同。
  15. 一種如申請專利範圍第1項到第14項中任一項所述之基板傳輸裝置的傳輸方法，包括以下步驟： 步驟S1：一機械手將一基板置於一基板傳送台上； 步驟S2：設於該基板傳送台上的一基板傳送組件吸附該基板並帶動該基板向一工件台方向運動；以及 步驟S3：當該基板運動至該基板傳送台靠近該工件台一側時，一基板過渡氣浮組件産生一空氣膜，將該基板頂起並由該基板傳送組件將該基板沿一第二方向傳送至該工件台。
  16. 如申請專利範圍第15項所述之傳輸方法，其中，步驟S2中，該基板傳送組件中的複數個吸盤吸附該基板，接著運動模組帶動該基板向該工件台一側運動，該基板的運動帶動該基板傳送台上的複數個導向輥輪滾動，對該基板的移動進行導向。
  17. 如申請專利範圍第15項所述之傳輸方法，其中，該基板傳送台還包括沿一第一方向間隔設置的複數個萬向滾珠單元，每個該萬向滾珠單元包括一支架、設於該支架上的複數個萬向滾珠和帶動該支架上下運動的一氣缸，步驟S1和步驟S2之間，還包括該萬向滾珠單元中的該氣缸帶動該支架上升，使該基板置於該萬向滾珠的平面上，實現位置調整，接著該氣缸帶動該支架下降，將該基板重新置於該基板傳送台上。
  18. 一種如申請專利範圍第1項到第14項中任一項所述之基板傳輸裝置的傳輸方法，其特徵在於，包括以下步驟： 步驟S10：當一基板運動至一基板傳送台靠近一工件台一側時，一基板過渡氣浮組件産生一空氣膜，將該基板頂起並由一基板傳送組件將該基板沿一第二方向從該工件台傳送至該基板傳送台上； 步驟S20：設於該基板傳送台上的該基板傳送組件吸附該基板並帶動該基板向一機械手方向運動；以及 步驟S30：該機械手將該基板從該基板傳送台上取下。
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