TWI639898B - Exposure apparatus, exposure method, and component manufacturing method - Google Patents
Exposure apparatus, exposure method, and component manufacturing method Download PDFInfo
- Publication number
- TWI639898B TWI639898B TW106131243A TW106131243A TWI639898B TW I639898 B TWI639898 B TW I639898B TW 106131243 A TW106131243 A TW 106131243A TW 106131243 A TW106131243 A TW 106131243A TW I639898 B TWI639898 B TW I639898B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid
- substrate
- optical system
- exposure
- lens
- Prior art date
Links
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Microscoopes, Condenser (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004172569 | 2004-06-10 | ||
| JP2004-172569 | 2004-06-10 | ||
| JP2004-245260 | 2004-08-25 | ||
| JP2004245260 | 2004-08-25 | ||
| JP2004330582 | 2004-11-15 | ||
| JP2004-330582 | 2004-11-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201809907A TW201809907A (zh) | 2018-03-16 |
| TWI639898B true TWI639898B (zh) | 2018-11-01 |
Family
ID=35503358
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106131243A TWI639898B (zh) | 2004-06-10 | 2005-06-10 | Exposure apparatus, exposure method, and component manufacturing method |
| TW102130777A TWI531869B (zh) | 2004-06-10 | 2005-06-10 | Exposure apparatus, exposure method, and device manufacturing method |
| TW102130776A TWI531868B (zh) | 2004-06-10 | 2005-06-10 | An exposure apparatus, an element manufacturing method, and a liquid recovery method |
| TW107132103A TW201903538A (zh) | 2004-06-10 | 2005-06-10 | 曝光裝置、曝光方法及元件製造方法 |
| TW104141698A TWI612393B (zh) | 2004-06-10 | 2005-06-10 | 曝光裝置、曝光方法及元件製造方法 |
| TW94119279A TWI417670B (zh) | 2004-06-10 | 2005-06-10 | Exposure apparatus, exposure method, and device manufacturing method |
Family Applications After (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102130777A TWI531869B (zh) | 2004-06-10 | 2005-06-10 | Exposure apparatus, exposure method, and device manufacturing method |
| TW102130776A TWI531868B (zh) | 2004-06-10 | 2005-06-10 | An exposure apparatus, an element manufacturing method, and a liquid recovery method |
| TW107132103A TW201903538A (zh) | 2004-06-10 | 2005-06-10 | 曝光裝置、曝光方法及元件製造方法 |
| TW104141698A TWI612393B (zh) | 2004-06-10 | 2005-06-10 | 曝光裝置、曝光方法及元件製造方法 |
| TW94119279A TWI417670B (zh) | 2004-06-10 | 2005-06-10 | Exposure apparatus, exposure method, and device manufacturing method |
Country Status (9)
| Country | Link |
|---|---|
| US (7) | US8482716B2 (enExample) |
| EP (4) | EP3203321A1 (enExample) |
| JP (10) | JP5295165B2 (enExample) |
| KR (8) | KR101310472B1 (enExample) |
| CN (1) | CN102736446B (enExample) |
| IL (4) | IL179787A (enExample) |
| SG (3) | SG188877A1 (enExample) |
| TW (6) | TWI639898B (enExample) |
| WO (1) | WO2005122221A1 (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170070264A (ko) * | 2003-09-03 | 2017-06-21 | 가부시키가이샤 니콘 | 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법 |
| JP4973754B2 (ja) * | 2004-03-04 | 2012-07-11 | 株式会社ニコン | 露光方法及び露光装置、デバイス製造方法 |
| KR101310472B1 (ko) * | 2004-06-10 | 2013-09-24 | 가부시키가이샤 니콘 엔지니어링 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
| US7481867B2 (en) | 2004-06-16 | 2009-01-27 | Edwards Limited | Vacuum system for immersion photolithography |
| US7701550B2 (en) | 2004-08-19 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7133114B2 (en) * | 2004-09-20 | 2006-11-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7379155B2 (en) | 2004-10-18 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| TW200644079A (en) * | 2005-03-31 | 2006-12-16 | Nikon Corp | Exposure apparatus, exposure method, and device production method |
| KR101555707B1 (ko) * | 2005-04-18 | 2015-09-25 | 가부시키가이샤 니콘 | 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
| US7474379B2 (en) | 2005-06-28 | 2009-01-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7411658B2 (en) * | 2005-10-06 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| TWI397945B (zh) | 2005-11-14 | 2013-06-01 | 尼康股份有限公司 | A liquid recovery member, an exposure apparatus, an exposure method, and an element manufacturing method |
| EP2023378B1 (en) * | 2006-05-10 | 2013-03-13 | Nikon Corporation | Exposure apparatus and device manufacturing method |
| US7532309B2 (en) * | 2006-06-06 | 2009-05-12 | Nikon Corporation | Immersion lithography system and method having an immersion fluid containment plate for submerging the substrate to be imaged in immersion fluid |
| US7567338B2 (en) * | 2006-08-30 | 2009-07-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US8004651B2 (en) * | 2007-01-23 | 2011-08-23 | Nikon Corporation | Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method |
| KR100843709B1 (ko) * | 2007-02-05 | 2008-07-04 | 삼성전자주식회사 | 액체 실링 유니트 및 이를 갖는 이멀젼 포토리소그래피장치 |
| US8134685B2 (en) | 2007-03-23 | 2012-03-13 | Nikon Corporation | Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method |
| US8300207B2 (en) | 2007-05-17 | 2012-10-30 | Nikon Corporation | Exposure apparatus, immersion system, exposing method, and device fabricating method |
| US8681308B2 (en) * | 2007-09-13 | 2014-03-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| NL1036253A1 (nl) * | 2007-12-10 | 2009-06-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| ATE548679T1 (de) * | 2008-05-08 | 2012-03-15 | Asml Netherlands Bv | Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung |
| EP2131241B1 (en) * | 2008-05-08 | 2019-07-31 | ASML Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method |
| US8421993B2 (en) * | 2008-05-08 | 2013-04-16 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method |
| NL2004362A (en) * | 2009-04-10 | 2010-10-12 | Asml Netherlands Bv | A fluid handling device, an immersion lithographic apparatus and a device manufacturing method. |
| TWI603155B (zh) | 2009-11-09 | 2017-10-21 | 尼康股份有限公司 | 曝光裝置、曝光方法、曝光裝置之維修方法、曝光裝置之調整方法、以及元件製造方法 |
| US20110134400A1 (en) | 2009-12-04 | 2011-06-09 | Nikon Corporation | Exposure apparatus, liquid immersion member, and device manufacturing method |
| KR20120112615A (ko) | 2009-12-28 | 2012-10-11 | 가부시키가이샤 니콘 | 액침 부재, 액침 부재의 제조 방법, 노광 장치, 및 디바이스 제조 방법 |
| CN102714141B (zh) * | 2010-01-08 | 2016-03-23 | 株式会社尼康 | 液浸构件、曝光装置、曝光方法及元件制造方法 |
| NL2007439A (en) | 2010-10-19 | 2012-04-23 | Asml Netherlands Bv | Gas manifold, module for a lithographic apparatus, lithographic apparatus and device manufacturing method. |
| US9329496B2 (en) | 2011-07-21 | 2016-05-03 | Nikon Corporation | Exposure apparatus, exposure method, method of manufacturing device, program, and storage medium |
| US9256137B2 (en) | 2011-08-25 | 2016-02-09 | Nikon Corporation | Exposure apparatus, liquid holding method, and device manufacturing method |
| US20130050666A1 (en) | 2011-08-26 | 2013-02-28 | Nikon Corporation | Exposure apparatus, liquid holding method, and device manufacturing method |
| KR102050822B1 (ko) * | 2012-12-27 | 2019-12-02 | 세메스 주식회사 | 기판 처리 장치 |
| US9057955B2 (en) | 2013-01-22 | 2015-06-16 | Nikon Corporation | Functional film, liquid immersion member, method of manufacturing liquid immersion member, exposure apparatus, and device manufacturing method |
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