TWI613826B - 薄膜電晶體的製造方法、薄膜電晶體、顯示裝置、影像感測器及x線感測器 - Google Patents
薄膜電晶體的製造方法、薄膜電晶體、顯示裝置、影像感測器及x線感測器 Download PDFInfo
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- TWI613826B TWI613826B TW102121005A TW102121005A TWI613826B TW I613826 B TWI613826 B TW I613826B TW 102121005 A TW102121005 A TW 102121005A TW 102121005 A TW102121005 A TW 102121005A TW I613826 B TWI613826 B TW I613826B
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- H01L21/02612—Formation types
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- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
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- H01L21/02518—Deposited layers
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- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
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- H10D30/60—Insulated-gate field-effect transistors [IGFET]
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- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
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- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
- H10D30/6756—Amorphous oxide semiconductors
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- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
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- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0241—Manufacture or treatment of multiple TFTs using liquid deposition, e.g. printing
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- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
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- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012139187A JP5972065B2 (ja) | 2012-06-20 | 2012-06-20 | 薄膜トランジスタの製造方法 |
| JP2012-139187 | 2012-06-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201405832A TW201405832A (zh) | 2014-02-01 |
| TWI613826B true TWI613826B (zh) | 2018-02-01 |
Family
ID=49768594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102121005A TWI613826B (zh) | 2012-06-20 | 2013-06-14 | 薄膜電晶體的製造方法、薄膜電晶體、顯示裝置、影像感測器及x線感測器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9673048B2 (enExample) |
| JP (1) | JP5972065B2 (enExample) |
| KR (1) | KR101634482B1 (enExample) |
| TW (1) | TWI613826B (enExample) |
| WO (1) | WO2013190992A1 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5972065B2 (ja) * | 2012-06-20 | 2016-08-17 | 富士フイルム株式会社 | 薄膜トランジスタの製造方法 |
| KR102279459B1 (ko) | 2012-10-24 | 2021-07-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| US9377419B2 (en) * | 2012-12-12 | 2016-06-28 | Jose Maria Las Navas Garcia | Method and apparatus for multiple sample preparation and simultaneous loss of ignition/gain on ignition analysis, for use in X-ray fluorescence spectrometry |
| KR20140078543A (ko) * | 2012-12-14 | 2014-06-25 | 한국화학연구원 | 자발적 연소 반응이 발생하는 인듐아연 산화물계 반도체 잉크 조성물 및 이를 통해 제조되는 무기 반도체 박막 |
| US9670232B2 (en) * | 2014-02-06 | 2017-06-06 | Transtron Solutions Llc | Molecular precursor compounds for zinc-group 13 mixed oxide materials |
| US9404002B2 (en) | 2014-02-06 | 2016-08-02 | Transtron Solutions Llc | Molecular precursor compounds for indium gallium zinc oxide materials |
| WO2015132694A1 (en) * | 2014-03-07 | 2015-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Touch sensor, touch panel, and manufacturing method of touch panel |
| US9379190B2 (en) * | 2014-05-08 | 2016-06-28 | Flosfia, Inc. | Crystalline multilayer structure and semiconductor device |
| US10325774B2 (en) | 2014-09-18 | 2019-06-18 | Intel Corporation | Wurtzite heteroepitaxial structures with inclined sidewall facets for defect propagation control in silicon CMOS-compatible semiconductor devices |
| JP6376575B2 (ja) | 2014-09-25 | 2018-08-22 | インテル・コーポレーション | 自立シリコンメサ上のiii−nエピタキシャル素子構造 |
| JP2016092413A (ja) * | 2014-10-29 | 2016-05-23 | 株式会社半導体エネルギー研究所 | 撮像装置および電子機器 |
| EP3221886A4 (en) | 2014-11-18 | 2018-07-11 | Intel Corporation | Cmos circuits using n-channel and p-channel gallium nitride transistors |
| EP3235005A4 (en) | 2014-12-18 | 2018-09-12 | Intel Corporation | N-channel gallium nitride transistors |
| KR20170093912A (ko) * | 2015-01-28 | 2017-08-16 | 후지필름 가부시키가이샤 | 산화물 보호막의 제조 방법, 산화물 보호막, 박막 트랜지스터의 제조 방법, 박막 트랜지스터, 및 전자 디바이스 |
| CN104716152B (zh) * | 2015-04-01 | 2018-09-14 | 京东方科技集团股份有限公司 | X射线平板探测器及其制备方法与白色绝缘材料 |
| WO2016167277A1 (ja) * | 2015-04-17 | 2016-10-20 | シャープ株式会社 | 撮像パネル、及びそれを備えたx線撮像装置 |
| CN107949914B (zh) * | 2015-05-19 | 2022-01-18 | 英特尔公司 | 具有凸起掺杂晶体结构的半导体器件 |
| WO2016209283A1 (en) | 2015-06-26 | 2016-12-29 | Intel Corporation | Heteroepitaxial structures with high temperature stable substrate interface material |
| US9496415B1 (en) | 2015-12-02 | 2016-11-15 | International Business Machines Corporation | Structure and process for overturned thin film device with self-aligned gate and S/D contacts |
| KR102865888B1 (ko) * | 2016-03-11 | 2025-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 복합체 및 트랜지스터 |
| US10388738B2 (en) * | 2016-04-01 | 2019-08-20 | Semiconductor Energy Laboratory Co., Ltd. | Composite oxide semiconductor and method for manufacturing the same |
| CN106927689A (zh) * | 2017-04-17 | 2017-07-07 | 华南理工大学 | 一种氧化物半导体薄膜及其制备工艺 |
| TWI613804B (zh) | 2017-09-04 | 2018-02-01 | 友達光電股份有限公司 | 光感測裝置 |
| US11233053B2 (en) | 2017-09-29 | 2022-01-25 | Intel Corporation | Group III-nitride (III-N) devices with reduced contact resistance and their methods of fabrication |
| US12125888B2 (en) | 2017-09-29 | 2024-10-22 | Intel Corporation | Group III-nitride (III-N) devices with reduced contact resistance and their methods of fabrication |
| CN109980086A (zh) * | 2017-12-28 | 2019-07-05 | 深圳Tcl工业研究院有限公司 | 氧化物薄膜晶体管及其制备方法 |
| JP6706638B2 (ja) * | 2018-03-07 | 2020-06-10 | シャープ株式会社 | 半導体装置およびその製造方法 |
| CN116240630A (zh) * | 2018-08-01 | 2023-06-09 | 出光兴产株式会社 | 晶体化合物、氧化物烧结体、溅射靶、晶质及无定形氧化物薄膜、薄膜晶体管及电子设备 |
| CN109860106B (zh) * | 2019-02-28 | 2020-11-03 | 合肥京东方光电科技有限公司 | 一种显示基板的制备方法 |
| EP3790057A1 (en) * | 2019-09-06 | 2021-03-10 | SABIC Global Technologies B.V. | Low temperature processed semiconductor thin-film transistor |
| WO2021046734A1 (zh) * | 2019-09-11 | 2021-03-18 | 咸阳彩虹光电科技有限公司 | 开关元件和显示面板 |
| US20220045069A1 (en) * | 2020-08-06 | 2022-02-10 | Micron Technology, Inc. | Source/drain integration in a three-node access device for vertical three dimensional (3d) memory |
| US20220045061A1 (en) * | 2020-08-06 | 2022-02-10 | Micron Technology, Inc. | Three-node access device for vertical three dimensional (3d) memory |
| KR102725971B1 (ko) * | 2022-10-26 | 2024-11-05 | 충북대학교 산학협력단 | 포토트랜지스터 및 그 제조 방법 |
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| TW201405832A (zh) | 2014-02-01 |
| US20150103977A1 (en) | 2015-04-16 |
| JP5972065B2 (ja) | 2016-08-17 |
| US9673048B2 (en) | 2017-06-06 |
| JP2014003244A (ja) | 2014-01-09 |
| WO2013190992A1 (ja) | 2013-12-27 |
| KR20150021051A (ko) | 2015-02-27 |
| KR101634482B1 (ko) | 2016-07-08 |
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