JP5972065B2 - 薄膜トランジスタの製造方法 - Google Patents

薄膜トランジスタの製造方法 Download PDF

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JP5972065B2
JP5972065B2 JP2012139187A JP2012139187A JP5972065B2 JP 5972065 B2 JP5972065 B2 JP 5972065B2 JP 2012139187 A JP2012139187 A JP 2012139187A JP 2012139187 A JP2012139187 A JP 2012139187A JP 5972065 B2 JP5972065 B2 JP 5972065B2
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film transistor
thin film
oxide semiconductor
semiconductor layer
region
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JP2014003244A5 (enExample
JP2014003244A (ja
Inventor
雅司 小野
雅司 小野
真宏 高田
真宏 高田
敏也 井手上
敏也 井手上
田中 淳
淳 田中
鈴木 真之
真之 鈴木
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Fujifilm Corp
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Fujifilm Corp
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Priority to JP2012139187A priority Critical patent/JP5972065B2/ja
Priority to KR1020147035502A priority patent/KR101634482B1/ko
Priority to PCT/JP2013/065489 priority patent/WO2013190992A1/ja
Priority to TW102121005A priority patent/TWI613826B/zh
Publication of JP2014003244A publication Critical patent/JP2014003244A/ja
Priority to US14/571,293 priority patent/US9673048B2/en
Publication of JP2014003244A5 publication Critical patent/JP2014003244A5/ja
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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    • H10P14/265—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using solutions
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    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
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    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
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    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
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    • H10D30/67—Thin-film transistors [TFT]
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    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
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    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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JP2012139187A 2012-06-20 2012-06-20 薄膜トランジスタの製造方法 Active JP5972065B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012139187A JP5972065B2 (ja) 2012-06-20 2012-06-20 薄膜トランジスタの製造方法
KR1020147035502A KR101634482B1 (ko) 2012-06-20 2013-06-04 박막 트랜지스터의 제조 방법
PCT/JP2013/065489 WO2013190992A1 (ja) 2012-06-20 2013-06-04 薄膜トランジスタの製造方法
TW102121005A TWI613826B (zh) 2012-06-20 2013-06-14 薄膜電晶體的製造方法、薄膜電晶體、顯示裝置、影像感測器及x線感測器
US14/571,293 US9673048B2 (en) 2012-06-20 2014-12-16 Method of producing thin film transistor, thin film transistor, display device, image sensor, and X-ray sensor

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Application Number Priority Date Filing Date Title
JP2012139187A JP5972065B2 (ja) 2012-06-20 2012-06-20 薄膜トランジスタの製造方法

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JP2014003244A JP2014003244A (ja) 2014-01-09
JP2014003244A5 JP2014003244A5 (enExample) 2015-01-08
JP5972065B2 true JP5972065B2 (ja) 2016-08-17

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US (1) US9673048B2 (enExample)
JP (1) JP5972065B2 (enExample)
KR (1) KR101634482B1 (enExample)
TW (1) TWI613826B (enExample)
WO (1) WO2013190992A1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5972065B2 (ja) * 2012-06-20 2016-08-17 富士フイルム株式会社 薄膜トランジスタの製造方法
KR102279459B1 (ko) * 2012-10-24 2021-07-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
US9377419B2 (en) * 2012-12-12 2016-06-28 Jose Maria Las Navas Garcia Method and apparatus for multiple sample preparation and simultaneous loss of ignition/gain on ignition analysis, for use in X-ray fluorescence spectrometry
KR20140078543A (ko) * 2012-12-14 2014-06-25 한국화학연구원 자발적 연소 반응이 발생하는 인듐아연 산화물계 반도체 잉크 조성물 및 이를 통해 제조되는 무기 반도체 박막
US9670232B2 (en) * 2014-02-06 2017-06-06 Transtron Solutions Llc Molecular precursor compounds for zinc-group 13 mixed oxide materials
US9404002B2 (en) * 2014-02-06 2016-08-02 Transtron Solutions Llc Molecular precursor compounds for indium gallium zinc oxide materials
WO2015132694A1 (en) * 2014-03-07 2015-09-11 Semiconductor Energy Laboratory Co., Ltd. Touch sensor, touch panel, and manufacturing method of touch panel
EP2942803B1 (en) * 2014-05-08 2019-08-21 Flosfia Inc. Crystalline multilayer structure and semiconductor device
JP2017533574A (ja) 2014-09-18 2017-11-09 インテル・コーポレーション シリコンcmos互換性半導体装置における欠陥伝播制御のための傾斜側壁カット面を有するウルツ鉱ヘテロエピタキシャル構造物
WO2016048328A1 (en) 2014-09-25 2016-03-31 Intel Corporation Iii-n epitaxial device structures on free standing silicon mesas
JP2016092413A (ja) * 2014-10-29 2016-05-23 株式会社半導体エネルギー研究所 撮像装置および電子機器
US10573647B2 (en) 2014-11-18 2020-02-25 Intel Corporation CMOS circuits using n-channel and p-channel gallium nitride transistors
CN106922200B (zh) 2014-12-18 2021-11-09 英特尔公司 N沟道氮化镓晶体管
KR20170093912A (ko) * 2015-01-28 2017-08-16 후지필름 가부시키가이샤 산화물 보호막의 제조 방법, 산화물 보호막, 박막 트랜지스터의 제조 방법, 박막 트랜지스터, 및 전자 디바이스
CN104716152B (zh) * 2015-04-01 2018-09-14 京东方科技集团股份有限公司 X射线平板探测器及其制备方法与白色绝缘材料
US20180097027A1 (en) * 2015-04-17 2018-04-05 Sharp Kabushiki Kaisha Imaging panel and x-ray imaging device including same
US10211327B2 (en) * 2015-05-19 2019-02-19 Intel Corporation Semiconductor devices with raised doped crystalline structures
EP3314659A4 (en) 2015-06-26 2019-01-23 INTEL Corporation HETEROEPITAXISTRUCTURES WITH HIGH-TEMPERATURE-RESISTANT SUBSTRATE INTERMEDIATE MATERIAL
US9496415B1 (en) 2015-12-02 2016-11-15 International Business Machines Corporation Structure and process for overturned thin film device with self-aligned gate and S/D contacts
CN108780819B (zh) * 2016-03-11 2022-06-14 株式会社半导体能源研究所 复合体及晶体管
US10388738B2 (en) * 2016-04-01 2019-08-20 Semiconductor Energy Laboratory Co., Ltd. Composite oxide semiconductor and method for manufacturing the same
CN106927689A (zh) * 2017-04-17 2017-07-07 华南理工大学 一种氧化物半导体薄膜及其制备工艺
TWI613804B (zh) 2017-09-04 2018-02-01 友達光電股份有限公司 光感測裝置
WO2019066935A1 (en) 2017-09-29 2019-04-04 Intel Corporation REDUCED CONTACT RESISTANCE GROUP III (N-N) NITRIDE DEVICES AND METHODS OF MAKING THE SAME
US11233053B2 (en) 2017-09-29 2022-01-25 Intel Corporation Group III-nitride (III-N) devices with reduced contact resistance and their methods of fabrication
CN109980086A (zh) * 2017-12-28 2019-07-05 深圳Tcl工业研究院有限公司 氧化物薄膜晶体管及其制备方法
JP6706638B2 (ja) * 2018-03-07 2020-06-10 シャープ株式会社 半導体装置およびその製造方法
KR102598375B1 (ko) * 2018-08-01 2023-11-06 이데미쓰 고산 가부시키가이샤 결정 구조 화합물, 산화물 소결체, 스퍼터링 타깃, 결정질 산화물 박막, 아모르퍼스 산화물 박막, 박막 트랜지스터, 및 전자 기기
CN109860106B (zh) * 2019-02-28 2020-11-03 合肥京东方光电科技有限公司 一种显示基板的制备方法
EP3790057A1 (en) * 2019-09-06 2021-03-10 SABIC Global Technologies B.V. Low temperature processed semiconductor thin-film transistor
WO2021046734A1 (zh) * 2019-09-11 2021-03-18 咸阳彩虹光电科技有限公司 开关元件和显示面板
US20220045061A1 (en) * 2020-08-06 2022-02-10 Micron Technology, Inc. Three-node access device for vertical three dimensional (3d) memory
US20220045069A1 (en) * 2020-08-06 2022-02-10 Micron Technology, Inc. Source/drain integration in a three-node access device for vertical three dimensional (3d) memory
CN117795688A (zh) 2021-07-13 2024-03-29 任耐特公司 薄膜半导体开关器件
KR102725971B1 (ko) * 2022-10-26 2024-11-05 충북대학교 산학협력단 포토트랜지스터 및 그 제조 방법

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7211825B2 (en) * 2004-06-14 2007-05-01 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
US7674662B2 (en) * 2006-07-19 2010-03-09 Applied Materials, Inc. Process for making thin film field effect transistors using zinc oxide
KR101334181B1 (ko) * 2007-04-20 2013-11-28 삼성전자주식회사 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법
US20080286907A1 (en) * 2007-05-16 2008-11-20 Xerox Corporation Semiconductor layer for thin film transistors
US7935964B2 (en) * 2007-06-19 2011-05-03 Samsung Electronics Co., Ltd. Oxide semiconductors and thin film transistors comprising the same
JP4555358B2 (ja) * 2008-03-24 2010-09-29 富士フイルム株式会社 薄膜電界効果型トランジスタおよび表示装置
JP5430248B2 (ja) * 2008-06-24 2014-02-26 富士フイルム株式会社 薄膜電界効果型トランジスタおよび表示装置
US8258511B2 (en) * 2008-07-02 2012-09-04 Applied Materials, Inc. Thin film transistors using multiple active channel layers
JP5123768B2 (ja) 2008-07-10 2013-01-23 富士フイルム株式会社 金属酸化物膜とその製造方法、及び半導体装置
JP5250322B2 (ja) * 2008-07-10 2013-07-31 富士フイルム株式会社 金属酸化物膜とその製造方法、及び半導体装置
EP2146379B1 (en) 2008-07-14 2015-01-28 Samsung Electronics Co., Ltd. Transistor comprising ZnO based channel layer
JP5258475B2 (ja) * 2008-09-22 2013-08-07 富士フイルム株式会社 薄膜電界効果型トランジスタ
US20110220895A1 (en) * 2008-11-27 2011-09-15 Konica Minolta Holdings, Inc. Thin film transistor and method of manufacturing thin film transistor
US8367486B2 (en) * 2009-02-05 2013-02-05 Semiconductor Energy Laboratory Co., Ltd. Transistor and method for manufacturing the transistor
JP5328414B2 (ja) * 2009-02-25 2013-10-30 富士フイルム株式会社 トップゲート型の電界効果型トランジスタ及びその製造方法並びにそれを備えた表示装置
JP5763876B2 (ja) * 2009-05-08 2015-08-12 コニカミノルタ株式会社 薄膜トランジスタ、及びその製造方法
JP4571221B1 (ja) * 2009-06-22 2010-10-27 富士フイルム株式会社 Igzo系酸化物材料及びigzo系酸化物材料の製造方法
JP4415062B1 (ja) * 2009-06-22 2010-02-17 富士フイルム株式会社 薄膜トランジスタ及び薄膜トランジスタの製造方法
JP5497417B2 (ja) * 2009-12-10 2014-05-21 富士フイルム株式会社 薄膜トランジスタおよびその製造方法、並びにその薄膜トランジスタを備えた装置
KR20130057439A (ko) * 2010-04-28 2013-05-31 바스프 에스이 아연 착물 용액의 제조 방법
EP2426720A1 (en) * 2010-09-03 2012-03-07 Applied Materials, Inc. Staggered thin film transistor and method of forming the same
JP5626978B2 (ja) * 2010-09-08 2014-11-19 富士フイルム株式会社 薄膜トランジスタおよびその製造方法、並びにその薄膜トランジスタを備えた装置
TWI405335B (zh) * 2010-09-13 2013-08-11 友達光電股份有限公司 半導體結構及其製造方法
WO2012040637A2 (en) * 2010-09-24 2012-03-29 The Regents Of The University Of California Nanowire-polymer composite electrodes
JP2014507794A (ja) * 2010-12-30 2014-03-27 ジュスン エンジニアリング カンパニー リミテッド 薄膜トランジスタ及びその製造方法
JP5871263B2 (ja) * 2011-06-14 2016-03-01 富士フイルム株式会社 非晶質酸化物薄膜の製造方法
JP5052693B1 (ja) * 2011-08-12 2012-10-17 富士フイルム株式会社 薄膜トランジスタ及びその製造方法、表示装置、イメージセンサー、x線センサー並びにx線デジタル撮影装置
KR101665829B1 (ko) * 2011-11-18 2016-10-12 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 비정질 도전성 산화물 막의 형성 방법
KR101301215B1 (ko) * 2011-12-27 2013-08-29 연세대학교 산학협력단 산화물 박막용 조성물, 산화물 박막용 조성물 제조 방법, 산화물 박막용 조성물을 이용한 산화물 박막 및 전자소자
CN104335353B (zh) * 2012-06-06 2017-04-05 株式会社神户制钢所 薄膜晶体管
JP5972065B2 (ja) * 2012-06-20 2016-08-17 富士フイルム株式会社 薄膜トランジスタの製造方法
JP6134230B2 (ja) * 2012-08-31 2017-05-24 株式会社神戸製鋼所 薄膜トランジスタおよび表示装置
JP6117124B2 (ja) * 2013-03-19 2017-04-19 富士フイルム株式会社 酸化物半導体膜及びその製造方法
JP6454974B2 (ja) * 2013-03-29 2019-01-23 株式会社リコー 金属酸化物膜形成用塗布液、金属酸化物膜の製造方法、及び電界効果型トランジスタの製造方法
US20150087110A1 (en) * 2013-09-21 2015-03-26 Northwestern University Low-Temperature Fabrication of Spray-Coated Metal Oxide Thin Film Transistors
US9691906B2 (en) * 2013-10-24 2017-06-27 Joled Inc. Method for producing thin film transistor
JP6180908B2 (ja) * 2013-12-06 2017-08-16 富士フイルム株式会社 金属酸化物半導体膜、薄膜トランジスタ、表示装置、イメージセンサ及びx線センサ

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