TWI573250B - 半導體裝置 - Google Patents
半導體裝置 Download PDFInfo
- Publication number
- TWI573250B TWI573250B TW100101801A TW100101801A TWI573250B TW I573250 B TWI573250 B TW I573250B TW 100101801 A TW100101801 A TW 100101801A TW 100101801 A TW100101801 A TW 100101801A TW I573250 B TWI573250 B TW I573250B
- Authority
- TW
- Taiwan
- Prior art keywords
- transistor
- insulating layer
- electrode
- gate
- source
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/70—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D87/00—Integrated devices comprising both bulk components and either SOI or SOS components on the same substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
- H10D88/01—Manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
Landscapes
- Semiconductor Memories (AREA)
- Thin Film Transistor (AREA)
- Non-Volatile Memory (AREA)
- Dram (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010010527 | 2010-01-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201143029A TW201143029A (en) | 2011-12-01 |
| TWI573250B true TWI573250B (zh) | 2017-03-01 |
Family
ID=44276922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100101801A TWI573250B (zh) | 2010-01-20 | 2011-01-18 | 半導體裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8415731B2 (enExample) |
| JP (4) | JP5649461B2 (enExample) |
| KR (1) | KR101763969B1 (enExample) |
| TW (1) | TWI573250B (enExample) |
| WO (1) | WO2011090037A1 (enExample) |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2519969A4 (en) | 2009-12-28 | 2016-07-06 | Semiconductor Energy Lab | SEMICONDUCTOR COMPONENT |
| KR101762316B1 (ko) | 2009-12-28 | 2017-07-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101848516B1 (ko) | 2010-01-15 | 2018-04-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101822962B1 (ko) | 2010-02-05 | 2018-01-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101921618B1 (ko) * | 2010-02-05 | 2018-11-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 구동 방법 |
| KR101926336B1 (ko) | 2010-02-05 | 2019-03-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101862823B1 (ko) | 2010-02-05 | 2018-05-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 구동 방법 |
| CN106449649B (zh) | 2010-03-08 | 2019-09-27 | 株式会社半导体能源研究所 | 半导体装置及半导体装置的制造方法 |
| KR20180020327A (ko) | 2010-03-08 | 2018-02-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치를 제작하는 방법 |
| WO2011114919A1 (en) | 2010-03-19 | 2011-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8207025B2 (en) | 2010-04-09 | 2012-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| US8416622B2 (en) | 2010-05-20 | 2013-04-09 | Semiconductor Energy Laboratory Co., Ltd. | Driving method of a semiconductor device with an inverted period having a negative potential applied to a gate of an oxide semiconductor transistor |
| US8779433B2 (en) | 2010-06-04 | 2014-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2011152233A1 (en) | 2010-06-04 | 2011-12-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP5739257B2 (ja) | 2010-08-05 | 2015-06-24 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US8582348B2 (en) | 2010-08-06 | 2013-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for driving semiconductor device |
| US8422272B2 (en) | 2010-08-06 | 2013-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
| JP5727892B2 (ja) | 2010-08-26 | 2015-06-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8902637B2 (en) * | 2010-11-08 | 2014-12-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device comprising inverting amplifier circuit and driving method thereof |
| US9048142B2 (en) | 2010-12-28 | 2015-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP5898527B2 (ja) * | 2011-03-04 | 2016-04-06 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| TWI548057B (zh) | 2011-04-22 | 2016-09-01 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| KR101919056B1 (ko) | 2011-04-28 | 2018-11-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 회로 |
| US8729545B2 (en) | 2011-04-28 | 2014-05-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
| JP6013682B2 (ja) | 2011-05-20 | 2016-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置の駆動方法 |
| CN103022012B (zh) | 2011-09-21 | 2017-03-01 | 株式会社半导体能源研究所 | 半导体存储装置 |
| US9431545B2 (en) | 2011-09-23 | 2016-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP5912394B2 (ja) | 2011-10-13 | 2016-04-27 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9117916B2 (en) * | 2011-10-13 | 2015-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising oxide semiconductor film |
| US8637864B2 (en) | 2011-10-13 | 2014-01-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| US8796682B2 (en) | 2011-11-11 | 2014-08-05 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
| US8878177B2 (en) | 2011-11-11 | 2014-11-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| JP6053490B2 (ja) | 2011-12-23 | 2016-12-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US9099560B2 (en) | 2012-01-20 | 2015-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9324449B2 (en) | 2012-03-28 | 2016-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Driver circuit, signal processing unit having the driver circuit, method for manufacturing the signal processing unit, and display device |
| US9349849B2 (en) | 2012-03-28 | 2016-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device including the semiconductor device |
| US9208826B2 (en) * | 2012-03-30 | 2015-12-08 | Sharp Kabushiki Kaisha | Semiconductor storage device with two control lines |
| CN104205228B (zh) * | 2012-04-12 | 2016-09-07 | 夏普株式会社 | 半导体存储装置 |
| JP6250955B2 (ja) | 2012-05-25 | 2017-12-20 | 株式会社半導体エネルギー研究所 | 半導体装置の駆動方法 |
| JP6224931B2 (ja) * | 2012-07-27 | 2017-11-01 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| TWI613813B (zh) | 2012-11-16 | 2018-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| JP2014195243A (ja) | 2013-02-28 | 2014-10-09 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US9612795B2 (en) | 2013-03-14 | 2017-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Data processing device, data processing method, and computer program |
| CN103236402B (zh) * | 2013-04-27 | 2016-02-03 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法、阵列基板及显示装置 |
| KR102244460B1 (ko) | 2013-10-22 | 2021-04-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US9349418B2 (en) | 2013-12-27 | 2016-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for driving the same |
| KR102166898B1 (ko) * | 2014-01-10 | 2020-10-19 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
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| CN105321948A (zh) * | 2014-06-18 | 2016-02-10 | 亿而得微电子股份有限公司 | 一种单闸源极共线的非挥发性内存及其操作方法 |
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| JP6689062B2 (ja) | 2014-12-10 | 2020-04-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR102582523B1 (ko) | 2015-03-19 | 2023-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 전자 기기 |
| US10056497B2 (en) * | 2015-04-15 | 2018-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
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| CN109643572A (zh) * | 2016-09-12 | 2019-04-16 | 株式会社半导体能源研究所 | 存储装置及其工作方法、半导体装置、电子构件以及电子设备 |
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| CN107818991B (zh) * | 2017-10-23 | 2020-06-05 | 京东方科技集团股份有限公司 | 一种阵列基板及其制备方法、显示面板 |
| KR20220017936A (ko) | 2019-06-07 | 2022-02-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
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| US8415731B2 (en) | 2013-04-09 |
| KR101763969B1 (ko) | 2017-08-01 |
| WO2011090037A1 (en) | 2011-07-28 |
| JP2016131260A (ja) | 2016-07-21 |
| JP2011171718A (ja) | 2011-09-01 |
| KR20120116443A (ko) | 2012-10-22 |
| US20110175087A1 (en) | 2011-07-21 |
| JP5927271B2 (ja) | 2016-06-01 |
| JP6322749B2 (ja) | 2018-05-09 |
| JP6130953B2 (ja) | 2017-05-17 |
| JP5649461B2 (ja) | 2015-01-07 |
| TW201143029A (en) | 2011-12-01 |
| JP2015065454A (ja) | 2015-04-09 |
| JP2017157846A (ja) | 2017-09-07 |
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