TWI562167B - - Google Patents

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Publication number
TWI562167B
TWI562167B TW104124133A TW104124133A TWI562167B TW I562167 B TWI562167 B TW I562167B TW 104124133 A TW104124133 A TW 104124133A TW 104124133 A TW104124133 A TW 104124133A TW I562167 B TWI562167 B TW I562167B
Authority
TW
Taiwan
Application number
TW104124133A
Other versions
TW201643890A (zh
Inventor
Takashi Yamada
Daizo Oda
Teruo Haibara
Ryo Oishi
Kazuyuki Saito
Tomohiro Uno
Original Assignee
Nippon Micrometal Corp
Nippon Steel & Sumikin Mat Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micrometal Corp, Nippon Steel & Sumikin Mat Co filed Critical Nippon Micrometal Corp
Application granted granted Critical
Publication of TWI562167B publication Critical patent/TWI562167B/zh
Publication of TW201643890A publication Critical patent/TW201643890A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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  • Engineering & Computer Science (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Wire Bonding (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
TW104124133A 2015-06-15 2015-07-24 半導體裝置用接合導線 TW201643890A (zh)

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TW105133324A TW201709217A (zh) 2015-06-15 2015-07-24 半導體裝置用接合導線
TW104124133A TW201643890A (zh) 2015-06-15 2015-07-24 半導體裝置用接合導線
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TW105116514A TWI567211B (zh) 2015-06-15 2016-05-26 Connection lines for semiconductor devices
TW105137924A TWI618802B (zh) 2015-06-15 2016-05-26 Bonding wire for semiconductor device
TW105118619A TWI631227B (zh) 2015-06-15 2016-06-14 Bonding wire for semiconductor device
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TW105116514A TWI567211B (zh) 2015-06-15 2016-05-26 Connection lines for semiconductor devices
TW105137924A TWI618802B (zh) 2015-06-15 2016-05-26 Bonding wire for semiconductor device
TW105118619A TWI631227B (zh) 2015-06-15 2016-06-14 Bonding wire for semiconductor device
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KR101659254B1 (ko) 2015-07-23 2016-09-22 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 반도체 장치용 본딩 와이어
WO2017221434A1 (ja) * 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
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CN109564881A (zh) * 2017-02-22 2019-04-02 日铁化学材料株式会社 半导体装置用接合线
JP6618662B2 (ja) * 2017-08-09 2019-12-11 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
KR102187539B1 (ko) * 2017-12-28 2020-12-07 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
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JP6651065B1 (ja) * 2018-09-21 2020-02-19 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
CN109402445B (zh) * 2018-11-09 2021-01-15 上海理工大学 一种抗氧化铜基合金键合引线及其制备方法
JP6487108B1 (ja) * 2018-11-26 2019-03-20 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ及びその製造方法
JP6507329B1 (ja) 2019-02-08 2019-04-24 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、ワイヤ接合構造、半導体装置及び半導体装置の製造方法
WO2020183748A1 (ja) * 2019-03-12 2020-09-17 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、パラジウム被覆銅ボンディングワイヤの製造方法、及びこれを用いたワイヤ接合構造、半導体装置並びにその製造方法
KR102712974B1 (ko) * 2019-03-13 2024-10-07 닛데쓰마이크로메탈가부시키가이샤 본딩 와이어
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JP7168779B2 (ja) 2019-06-04 2022-11-09 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、パラジウム被覆銅ボンディングワイヤの製造方法、これを用いた半導体装置及びその製造方法
CN110284023B (zh) * 2019-07-22 2021-02-26 安徽广宇电子材料有限公司 一种铜合金键合丝及其制备方法和应用
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