JP5116101B2 - 半導体実装用ボンディングワイヤ及びその製造方法 - Google Patents
半導体実装用ボンディングワイヤ及びその製造方法 Download PDFInfo
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- JP5116101B2 JP5116101B2 JP2008163617A JP2008163617A JP5116101B2 JP 5116101 B2 JP5116101 B2 JP 5116101B2 JP 2008163617 A JP2008163617 A JP 2008163617A JP 2008163617 A JP2008163617 A JP 2008163617A JP 5116101 B2 JP5116101 B2 JP 5116101B2
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Description
Claims (8)
- 20質量%を超え90質量%以下のAgを含有し、残部がAu、Auの不可避不純物及びAgの不可避不純物からなり、破断伸びが7〜20%であり、伸び1%における応力が引張り強さの90〜100%の範囲内であることを特徴とする半導体実装用ボンディングワイヤ。
- 55〜75質量%のAgを含有し、残部がAu、Auの不可避不純物及びAgの不可避不純物であることを特徴とする請求項1に記載の半導体実装用ボンディングワイヤ。
- 20質量%を超え45質量%以下のAgを含有し、残部がAu、Auの不可避不純物及びAgの不可避不純物であることを特徴とする請求項1に記載の半導体実装用ボンディングワイヤ。
- 更に、Cu、Pr、Ti及びVの中から選ばれる1種もしくは2種以上の元素の総量が2〜10,000質量ppmであることを特徴とする請求項1〜3のいずれか1項に記載の半導体実装用ボンディングワイヤ。
- 更に、Al、Co、Fe、Ge、Mn、Ca、Be、In、Hf、Pd、La及びPt中から選ばれる1種もしくは2種以上の元素の総量が2〜100,000質量ppmであることを特徴とする請求項4記載の半導体実装用ボンディングワイヤ。
- 請求項1〜5のいずれか1項に記載の半導体実装用ボンディングワイヤを用い、Al又はAl合金である配線電極と接続したことを特徴とする半導体素子。
- 請求項1〜5のいずれか1項に記載の半導体実装用ボンディングワイヤを用い、半導体基板上の配線電極と、リード上のAgメッキ面又はPdメッキ面とを接続したことを特徴とする半導体素子。
- 伸線工程において、線径100μm以上の太さではダイスの減面率を10〜18%として伸線し、線径100μm未満の太さではダイスの減面率を6〜14%として伸線することを特徴とする、10〜90質量%のAgを含有し、残部がAu、Auの不可避不純物及びAgの不可避不純物からなり、破断伸びが7〜20%であり、伸び1%における応力が引張り強さの90〜100%の範囲内である半導体実装用ボンディングワイヤの製造方法。
Priority Applications (2)
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JP2008163617A JP5116101B2 (ja) | 2007-06-28 | 2008-06-23 | 半導体実装用ボンディングワイヤ及びその製造方法 |
US12/146,792 US8097960B2 (en) | 2007-06-28 | 2008-06-26 | Semiconductor mounting bonding wire |
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JP2007170613 | 2007-06-28 | ||
JP2007170613 | 2007-06-28 | ||
JP2008163617A JP5116101B2 (ja) | 2007-06-28 | 2008-06-23 | 半導体実装用ボンディングワイヤ及びその製造方法 |
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JP5116101B2 true JP5116101B2 (ja) | 2013-01-09 |
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JP (1) | JP5116101B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015037876A1 (ko) * | 2013-09-12 | 2015-03-19 | 엠케이전자 주식회사 | 은 합금 본딩 와이어 및 이를 이용한 반도체 장치 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4947670B2 (ja) * | 2009-12-16 | 2012-06-06 | 田中電子工業株式会社 | 半導体素子用ボンディングワイヤの熱処理方法 |
CN102589753B (zh) | 2011-01-05 | 2016-05-04 | 飞思卡尔半导体公司 | 压力传感器及其封装方法 |
JP5064577B2 (ja) * | 2011-01-20 | 2012-10-31 | タツタ電線株式会社 | ボールボンディング用ワイヤ |
JP4771562B1 (ja) * | 2011-02-10 | 2011-09-14 | 田中電子工業株式会社 | Ag−Au−Pd三元合金系ボンディングワイヤ |
US20120312428A1 (en) | 2011-06-10 | 2012-12-13 | Tanaka Denshi Kogyo K.K. | High strength and high elongation ratio of au alloy bonding wire |
JP5996853B2 (ja) * | 2011-08-29 | 2016-09-21 | タツタ電線株式会社 | ボールボンディング用ワイヤ |
US8643169B2 (en) | 2011-11-09 | 2014-02-04 | Freescale Semiconductor, Inc. | Semiconductor sensor device with over-molded lid |
CN102418001A (zh) * | 2011-11-16 | 2012-04-18 | 浙江佳博科技股份有限公司 | 一种键合金丝及其制备方法 |
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WO2015037876A1 (ko) * | 2013-09-12 | 2015-03-19 | 엠케이전자 주식회사 | 은 합금 본딩 와이어 및 이를 이용한 반도체 장치 |
KR20150030554A (ko) * | 2013-09-12 | 2015-03-20 | 엠케이전자 주식회사 | 은 합금 본딩 와이어 및 이를 이용한 반도체 장치 |
KR101582449B1 (ko) * | 2013-09-12 | 2016-01-05 | 엠케이전자 주식회사 | 은 합금 본딩 와이어 및 이를 이용한 반도체 장치 |
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US8097960B2 (en) | 2012-01-17 |
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US20090072399A1 (en) | 2009-03-19 |
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