JP2007012776A - 半導体装置用ボンディングワイヤ - Google Patents
半導体装置用ボンディングワイヤ Download PDFInfo
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- JP2007012776A JP2007012776A JP2005189915A JP2005189915A JP2007012776A JP 2007012776 A JP2007012776 A JP 2007012776A JP 2005189915 A JP2005189915 A JP 2005189915A JP 2005189915 A JP2005189915 A JP 2005189915A JP 2007012776 A JP2007012776 A JP 2007012776A
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Abstract
【解決手段】 銅を主成分とする芯材と、該芯材の上に芯材と異なる組成の導電性金属及び銅を主成分とする外皮層を有するボンディングワイヤであって、前記外皮層の厚さが0.01μm未満であること、及び、前記外皮層内においてワイヤ径方向に導電性金属の濃度勾配を有する領域の厚さが0.01μm未満であることを、特徴とする半導体装置用ボンディングワイヤである。
【選択図】 なし
Description
(2) 前記外皮層内において、ワイヤ径方向に銅以外の導電性金属の濃度勾配を有する領域の厚さが0.001〜0.02μmである前記(1)に記載の半導体装置用ボンディングワイヤ。
(3) 前記外皮層内において、銅以外の導電性金属濃度が20mol%以上である領域の厚さが0.001〜0.008μmである前記(1)又は(2)に記載の半導体装置用ボンディングワイヤ。
(4) 前記外皮層内において、銅以外の導電性金属濃度が40mol%以上である領域の厚さが0.001〜0.006μmである前記(1)又は(2)に記載の半導体装置用ボンディングワイヤ。
(5) 前記外皮層の表面側において、ワイヤ径方向の銅以外の導電性金属濃度が一定の領域の厚さが0.007μm以下である前記(1)〜(4)のいずれかに記載の半導体装置用ボンディングワイヤ。
(6) 銅を主成分とする芯材と、該芯材の上に芯材と成分又は組成の一方又は両方の異なる導電性金属と銅を含有する外皮層を有するボンディングワイヤであって、前記外皮層内では銅以外の導電性金属の最高濃度が40mol%未満であり、ワイヤ径方向に銅以外の導電性金属の濃度勾配を有しており、外皮層の厚さが0.001〜0.02μmの範囲であることを特徴とする半導体装置用ボンディングワイヤ。
(7) 銅を主成分とする芯材と、該芯材の上に芯材と成分又は組成の一方又は両方の異なる導電性金属と銅を含有する外皮層を有するボンディングワイヤであって、最表面の銅濃度が50〜95mol%の範囲で、前記外皮層内にワイヤ径方向に銅の濃度勾配を有しており、外皮層の厚さが0.001〜0.02μmの範囲であることを特徴とする半導体装置用ボンディングワイヤ。
(8) 前記外前記外皮層の表面で導電性金属又は銅が濃度偏重を有することを特徴とする前記(1)〜(7)のいずれかに記載の半導体装置用ボンディングワイヤ。
(9) 前記外皮層の結晶粒界に銅が濃化していることを特徴とする前記(1)〜(4)、(6)、(7)のいずれかに記載の半導体装置用ボンディングワイヤ。
(10) 前記外皮層又は前記外皮層を構成する導電性金属が、金、パラジウム、白金、銀又はニッケルから選ばれる1種以上を主成分とする前記(1)〜(7)のいずれかに記載の半導体装置用ボンディングワイヤ。
(11) ワイヤ全体に占める銅以外の導電性金属濃度が総計で0.002〜0.3mol%の範囲である前記(1)〜(10)のいずれかに記載の半導体装置用ボンディングワイヤ。
(12) 前記銅を主成分とする芯材が、Ba、Ca、Sr、Be、Al又は希土類元素から選ばれる1種以上の添加元素を含有し、ワイヤ全体に占める該添加元素濃度が総計で0.0001〜0.03質量%の範囲である前記(1)、(6)又は(7)のいずれかに記載の半導体装置用ボンディングワイヤ。
(13) 前記銅を主成分とする芯材が、Ag、Pt、Pd、Sn又はZnの1種以上の添加元素を含有し、ワイヤ全体に占める該添加元素濃度が総計で0.01〜0.3mol%の範囲である前記(1)〜(6)又は(7)のいずれかに記載の半導体装置用ボンディングワイヤ。
本発明において、導電性金属には銅は含まれない。
Claims (13)
- 銅を主成分とする芯材と、該芯材の上に芯材と成分又は組成の一方又は両方の異なる導電性金属と銅を含有する外皮層を有するボンディングワイヤであって、前記外皮層の厚さが0.001〜0.02μmであることを特徴とする半導体装置用ボンディングワイヤ。
- 前記外皮層内において、ワイヤ径方向に銅以外の導電性金属の濃度勾配を有する領域の厚さが0.001〜0.02μmである請求項1に記載の半導体装置用ボンディングワイヤ。
- 前記外皮層内において、銅以外の導電性金属濃度が20mol%以上である領域の厚さが0.001〜0.008μmである請求項1又は2に記載の半導体装置用ボンディングワイヤ。
- 前記外皮層内において、銅以外の導電性金属濃度が40mol%以上である領域の厚さが0.001〜0.006μmである請求項1又は2に記載の半導体装置用ボンディングワイヤ。
- 前記外皮層の表面側において、ワイヤ径方向の銅以外の導電性金属濃度が一定の領域の厚さが0.007μm以下である請求項1〜4のいずれかに記載の半導体装置用ボンディングワイヤ。
- 銅を主成分とする芯材と、該芯材の上に芯材と成分又は組成の一方又は両方の異なる導電性金属と銅を含有する外皮層を有するボンディングワイヤであって、前記外皮層内では銅以外の導電性金属の最高濃度が40mol%未満であり、ワイヤ径方向に銅以外の導電性金属の濃度勾配を有しており、外皮層の厚さが0.001〜0.02μmの範囲であることを特徴とする半導体装置用ボンディングワイヤ。
- 銅を主成分とする芯材と、該芯材の上に芯材と成分又は組成の一方又は両方の異なる導電性金属と銅を含有する外皮層を有するボンディングワイヤであって、最表面の銅濃度が50〜95mol%の範囲で、前記外皮層内にワイヤ径方向に銅の濃度勾配を有しており、外皮層の厚さが0.001〜0.02μmの範囲であることを特徴とする半導体装置用ボンディングワイヤ。
- 前記外皮層の表面で導電性金属又は銅が濃度偏重を有することを特徴とする請求項1〜7のいずれかに記載の半導体装置用ボンディングワイヤ。
- 前記外皮層の結晶粒界に銅が濃化していることを特徴とする請求項1〜4、6、7のいずれかに記載の半導体装置用ボンディングワイヤ。
- 前記外皮層を構成する導電性金属が、金、パラジウム、白金、銀又はニッケルから選ばれる1種以上を主成分とする請求項1〜7のいずれかに記載の半導体装置用ボンディングワイヤ。
- ワイヤ全体に占める銅以外の導電性金属濃度が総計で0.002〜0.3mol%の範囲である請求項1〜10のいずれかに記載の半導体装置用ボンディングワイヤ。
- 前記銅を主成分とする芯材が、Ba、Ca、Sr、Be、Al又は希土類元素から選ばれる1種以上の添加元素を含有し、ワイヤ全体に占める該添加元素濃度が総計で0.0001〜0.03質量%の範囲である請求項1、6又は7のいずれかに記載の半導体装置用ボンディングワイヤ。
- 前記銅を主成分とする芯材が、Ag、Pt、Pd、Sn又はZnの1種以上の添加元素を含有し、ワイヤ全体に占める該添加元素濃度が総計で0.01〜0.3mol%の範囲である請求項1、6又は7のいずれかに記載の半導体装置用ボンディングワイヤ。
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PCT/JP2006/300312 WO2006073206A1 (ja) | 2005-01-05 | 2006-01-05 | 半導体装置用ボンディングワイヤ |
KR1020107003399A KR101019811B1 (ko) | 2005-01-05 | 2006-01-05 | 반도체 장치용 본딩 와이어 |
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