TWI510156B - Multilayer substrate and manufacturing method thereof - Google Patents

Multilayer substrate and manufacturing method thereof Download PDF

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Publication number
TWI510156B
TWI510156B TW103114843A TW103114843A TWI510156B TW I510156 B TWI510156 B TW I510156B TW 103114843 A TW103114843 A TW 103114843A TW 103114843 A TW103114843 A TW 103114843A TW I510156 B TWI510156 B TW I510156B
Authority
TW
Taiwan
Prior art keywords
hole
resin film
electronic component
resin films
conductor pattern
Prior art date
Application number
TW103114843A
Other languages
English (en)
Chinese (zh)
Other versions
TW201511633A (zh
Inventor
Toshikazu Harada
Tomohiro Yokochi
Kenichirou Hasegawa
Yasunori Kasama
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of TW201511633A publication Critical patent/TW201511633A/zh
Application granted granted Critical
Publication of TWI510156B publication Critical patent/TWI510156B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW103114843A 2013-05-09 2014-04-24 Multilayer substrate and manufacturing method thereof TWI510156B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013099586A JP5999022B2 (ja) 2013-05-09 2013-05-09 多層基板およびその製造方法

Publications (2)

Publication Number Publication Date
TW201511633A TW201511633A (zh) 2015-03-16
TWI510156B true TWI510156B (zh) 2015-11-21

Family

ID=51853605

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103114843A TWI510156B (zh) 2013-05-09 2014-04-24 Multilayer substrate and manufacturing method thereof

Country Status (4)

Country Link
JP (1) JP5999022B2 (ko)
KR (1) KR101594241B1 (ko)
CN (1) CN104144566B (ko)
TW (1) TWI510156B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021146894A1 (zh) * 2020-01-21 2021-07-29 鹏鼎控股(深圳)股份有限公司 内埋电子元件的电路板及制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7061076B2 (en) * 2004-08-12 2006-06-13 Honeywell International Inc. Solderless component packaging and mounting
TWI301739B (en) * 2004-12-03 2008-10-01 Via Tech Inc Structure and method for embedded passive component assembly
WO2010038489A1 (ja) * 2008-09-30 2010-04-08 イビデン株式会社 電子部品内蔵配線板及びその製造方法
TWI357292B (en) * 2007-11-13 2012-01-21 Advanced Semiconductor Eng Multilayer circuit board with embedded electronic

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211295A (ja) * 1983-05-16 1984-11-30 東洋通信機株式会社 無半田接続プリント配線板
JPH0685425A (ja) * 1992-08-31 1994-03-25 Nec Corp 電子部品搭載用基板
JPH10294564A (ja) * 1997-04-17 1998-11-04 Advantest Corp 多層プリント配線基板
JPH10321987A (ja) * 1997-05-15 1998-12-04 Sony Corp プリント配線基板及びその製造方法
JP2002329977A (ja) * 2001-05-01 2002-11-15 Hisashi Hirano 多層回路基板及びその製造方法
US6747217B1 (en) * 2001-11-20 2004-06-08 Unisys Corporation Alternative to through-hole-plating in a printed circuit board
JP3905802B2 (ja) * 2002-07-31 2007-04-18 日本アビオニクス株式会社 プリント配線板及びその製造方法
JP2004200448A (ja) * 2002-12-19 2004-07-15 Nissan Motor Co Ltd 電子部品の基板実装方法
JP4259311B2 (ja) * 2003-12-19 2009-04-30 株式会社日立製作所 多層配線基板
JP2007317806A (ja) * 2006-05-24 2007-12-06 Fujitsu Ltd プリント基板ユニット
JP4930417B2 (ja) * 2008-03-06 2012-05-16 株式会社デンソー 多層配線板の製造方法
JP4862871B2 (ja) * 2008-09-18 2012-01-25 株式会社デンソー 半導体装置
JP5786472B2 (ja) * 2011-06-10 2015-09-30 大日本印刷株式会社 部品内蔵配線板
JP5760260B2 (ja) * 2011-08-11 2015-08-05 株式会社フジクラ 部品内蔵プリント基板及びその製造方法
WO2014125973A1 (ja) * 2013-02-12 2014-08-21 株式会社村田製作所 部品内蔵樹脂多層基板および樹脂多層基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7061076B2 (en) * 2004-08-12 2006-06-13 Honeywell International Inc. Solderless component packaging and mounting
TWI301739B (en) * 2004-12-03 2008-10-01 Via Tech Inc Structure and method for embedded passive component assembly
TWI357292B (en) * 2007-11-13 2012-01-21 Advanced Semiconductor Eng Multilayer circuit board with embedded electronic
WO2010038489A1 (ja) * 2008-09-30 2010-04-08 イビデン株式会社 電子部品内蔵配線板及びその製造方法

Also Published As

Publication number Publication date
JP2014220428A (ja) 2014-11-20
KR20140133462A (ko) 2014-11-19
CN104144566A (zh) 2014-11-12
CN104144566B (zh) 2018-01-02
JP5999022B2 (ja) 2016-09-28
KR101594241B1 (ko) 2016-02-15
TW201511633A (zh) 2015-03-16

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