TWI509732B - 具有增強射頻及溫度均勻性的靜電夾盤 - Google Patents

具有增強射頻及溫度均勻性的靜電夾盤 Download PDF

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Publication number
TWI509732B
TWI509732B TW102114636A TW102114636A TWI509732B TW I509732 B TWI509732 B TW I509732B TW 102114636 A TW102114636 A TW 102114636A TW 102114636 A TW102114636 A TW 102114636A TW I509732 B TWI509732 B TW I509732B
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TW
Taiwan
Prior art keywords
dielectric layer
esc
layer
disposed
metal base
Prior art date
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TW102114636A
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English (en)
Chinese (zh)
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TW201401426A (zh
Inventor
Dmitry Lubomirsky
Jennifer Sun
Mark Markovsky
Konstantin Makhratchev
Douglas A Buchberger Jr
Samer Banna
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Applied Materials Inc
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Publication of TW201401426A publication Critical patent/TW201401426A/zh
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Publication of TWI509732B publication Critical patent/TWI509732B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical Vapour Deposition (AREA)
TW102114636A 2012-04-24 2013-04-24 具有增強射頻及溫度均勻性的靜電夾盤 TWI509732B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261637500P 2012-04-24 2012-04-24
US201361775372P 2013-03-08 2013-03-08
US13/867,515 US8937800B2 (en) 2012-04-24 2013-04-22 Electrostatic chuck with advanced RF and temperature uniformity

Publications (2)

Publication Number Publication Date
TW201401426A TW201401426A (zh) 2014-01-01
TWI509732B true TWI509732B (zh) 2015-11-21

Family

ID=49379898

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102114636A TWI509732B (zh) 2012-04-24 2013-04-24 具有增強射頻及溫度均勻性的靜電夾盤

Country Status (6)

Country Link
US (1) US8937800B2 (enExample)
JP (2) JP5938140B2 (enExample)
KR (3) KR101584538B1 (enExample)
CN (2) CN105515450B (enExample)
TW (1) TWI509732B (enExample)
WO (1) WO2013163220A1 (enExample)

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* Cited by examiner, † Cited by third party
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