TWI480966B - Method of manufacturing a connecting structure - Google Patents
Method of manufacturing a connecting structure Download PDFInfo
- Publication number
- TWI480966B TWI480966B TW100120096A TW100120096A TWI480966B TW I480966 B TWI480966 B TW I480966B TW 100120096 A TW100120096 A TW 100120096A TW 100120096 A TW100120096 A TW 100120096A TW I480966 B TWI480966 B TW I480966B
- Authority
- TW
- Taiwan
- Prior art keywords
- heating
- temperature
- anisotropic conductive
- solder particles
- conductive adhesive
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0242—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections comprising means for controlling the temperature, e.g. making use of the curie point
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24826—Spot bonds connect components
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wire Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010136180A JP5540916B2 (ja) | 2010-06-15 | 2010-06-15 | 接続構造体の製造方法 |
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TW201207972A TW201207972A (en) | 2012-02-16 |
TWI480966B true TWI480966B (zh) | 2015-04-11 |
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TW100120096A TWI480966B (zh) | 2010-06-15 | 2011-06-09 | Method of manufacturing a connecting structure |
Country Status (7)
Country | Link |
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US (1) | US8835772B2 (ko) |
JP (1) | JP5540916B2 (ko) |
KR (1) | KR101355709B1 (ko) |
CN (1) | CN102939645B (ko) |
HK (1) | HK1178688A1 (ko) |
TW (1) | TWI480966B (ko) |
WO (1) | WO2011158666A1 (ko) |
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JP5703061B2 (ja) * | 2011-02-23 | 2015-04-15 | 積水化学工業株式会社 | 接続構造体の製造方法 |
JP6231257B2 (ja) * | 2011-12-15 | 2017-11-15 | デクセリアルズ株式会社 | 導電性接着剤、及び電子部品の接続方法 |
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JP2014026963A (ja) * | 2012-06-18 | 2014-02-06 | Sekisui Chem Co Ltd | 接続構造体の製造方法 |
JP2014049646A (ja) * | 2012-08-31 | 2014-03-17 | Panasonic Corp | 部品実装方法および部品実装システム |
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JP6068106B2 (ja) * | 2012-09-24 | 2017-01-25 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いたプリント配線基板 |
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JP6393039B2 (ja) * | 2014-02-12 | 2018-09-19 | デクセリアルズ株式会社 | 接続体の製造方法、接続方法及び接続体 |
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CN105900180B (zh) * | 2014-06-05 | 2018-07-06 | 积水化学工业株式会社 | 导电糊剂、连接结构体及连接结构体的制造方法 |
WO2016104276A1 (ja) * | 2014-12-26 | 2016-06-30 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
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JP6710120B2 (ja) * | 2015-09-30 | 2020-06-17 | 太陽インキ製造株式会社 | 導電性接着剤、電子部品および電子部品の製造方法 |
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JP6782413B2 (ja) * | 2015-12-18 | 2020-11-11 | 昭和電工マテリアルズ株式会社 | 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板 |
JP6587107B2 (ja) * | 2016-05-12 | 2019-10-09 | パナソニックIpマネジメント株式会社 | 回路部材の接続方法 |
JP6772012B2 (ja) * | 2016-09-28 | 2020-10-21 | 株式会社タムラ製作所 | 異方性導電フィルムの製造方法 |
JP6474008B2 (ja) * | 2017-03-29 | 2019-02-27 | パナソニックIpマネジメント株式会社 | 接続材料 |
JP6536968B2 (ja) * | 2017-07-20 | 2019-07-03 | パナソニックIpマネジメント株式会社 | 接続材料 |
JP6709944B2 (ja) * | 2018-10-01 | 2020-06-17 | 株式会社弘輝 | 接合構造体の製造方法 |
JPWO2020085372A1 (ja) * | 2018-10-24 | 2021-09-02 | 住友ベークライト株式会社 | 導電性樹脂組成物および半導体装置 |
JP6691998B1 (ja) * | 2019-12-24 | 2020-05-13 | 株式会社鈴木 | 半導体装置の製造方法及び半導体装置の製造装置 |
CN111261053B (zh) * | 2020-01-20 | 2023-10-13 | 京东方科技集团股份有限公司 | 微型发光二极管显示面板及其制备方法和显示装置 |
JP7405196B2 (ja) * | 2020-07-14 | 2023-12-26 | 株式会社レゾナック | 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板 |
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-
2010
- 2010-06-15 JP JP2010136180A patent/JP5540916B2/ja active Active
-
2011
- 2011-06-03 US US13/515,425 patent/US8835772B2/en active Active
- 2011-06-03 KR KR1020127026255A patent/KR101355709B1/ko active IP Right Grant
- 2011-06-03 WO PCT/JP2011/062779 patent/WO2011158666A1/ja active Application Filing
- 2011-06-03 CN CN201180029598.1A patent/CN102939645B/zh active Active
- 2011-06-09 TW TW100120096A patent/TWI480966B/zh active
-
2013
- 2013-05-02 HK HK13105305.4A patent/HK1178688A1/xx unknown
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JPH08325543A (ja) * | 1995-06-05 | 1996-12-10 | Soken Chem & Eng Co Ltd | 異方導電性接着剤 |
TW492215B (en) * | 2000-03-23 | 2002-06-21 | Sony Corp | Electric connection material and electric connection method |
US20090161328A1 (en) * | 2006-09-15 | 2009-06-25 | Matsushita Electric Industrial Co., Ltd. | Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure |
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Also Published As
Publication number | Publication date |
---|---|
CN102939645B (zh) | 2015-06-10 |
JP2010226140A (ja) | 2010-10-07 |
WO2011158666A1 (ja) | 2011-12-22 |
US20120255766A1 (en) | 2012-10-11 |
KR20120136386A (ko) | 2012-12-18 |
TW201207972A (en) | 2012-02-16 |
JP5540916B2 (ja) | 2014-07-02 |
CN102939645A (zh) | 2013-02-20 |
KR101355709B1 (ko) | 2014-01-27 |
HK1178688A1 (en) | 2013-09-13 |
US8835772B2 (en) | 2014-09-16 |
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