TWI412123B - 半導體記憶裝置 - Google Patents
半導體記憶裝置 Download PDFInfo
- Publication number
- TWI412123B TWI412123B TW099131002A TW99131002A TWI412123B TW I412123 B TWI412123 B TW I412123B TW 099131002 A TW099131002 A TW 099131002A TW 99131002 A TW99131002 A TW 99131002A TW I412123 B TWI412123 B TW I412123B
- Authority
- TW
- Taiwan
- Prior art keywords
- diffusion layer
- nmos
- layer
- row
- transistor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/63—Vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/15—Static random access memory [SRAM] devices comprising a resistor load element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/10—Integrated device layouts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/40—Resistors
- H10D1/47—Resistors having no potential barriers
Landscapes
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009214094A JP2011066109A (ja) | 2009-09-16 | 2009-09-16 | 半導体記憶装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201112402A TW201112402A (en) | 2011-04-01 |
| TWI412123B true TWI412123B (zh) | 2013-10-11 |
Family
ID=43033127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099131002A TWI412123B (zh) | 2009-09-16 | 2010-09-14 | 半導體記憶裝置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8507995B2 (enExample) |
| EP (1) | EP2299485A1 (enExample) |
| JP (1) | JP2011066109A (enExample) |
| KR (1) | KR20110030354A (enExample) |
| CN (1) | CN102024818A (enExample) |
| TW (1) | TWI412123B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5990401B2 (ja) * | 2012-05-29 | 2016-09-14 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
| KR102191215B1 (ko) | 2013-12-20 | 2020-12-16 | 삼성전자주식회사 | 에스램 셀 및 그 제조 방법 |
| JP2015141726A (ja) | 2014-01-28 | 2015-08-03 | 株式会社東芝 | 半導体記憶装置 |
| US9653563B2 (en) * | 2014-04-18 | 2017-05-16 | Taiwan Semiconductor Manufacturing Company Limited | Connection structure for vertical gate all around (VGAA) devices on semiconductor on insulator (SOI) substrate |
| JP5986618B2 (ja) * | 2014-12-04 | 2016-09-06 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置 |
| JP6375316B2 (ja) * | 2016-01-06 | 2018-08-15 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置の製造方法、及び、半導体装置 |
| JP6235662B2 (ja) * | 2016-08-05 | 2017-11-22 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置 |
| KR102699046B1 (ko) * | 2016-12-15 | 2024-08-27 | 삼성전자주식회사 | 수직형 트랜지스터를 구비하는 집적 회로 및 이를 포함하는 반도체 장치 |
| JP7185149B2 (ja) * | 2018-08-31 | 2022-12-07 | 株式会社ソシオネクスト | 半導体装置 |
| US10818324B2 (en) | 2018-12-18 | 2020-10-27 | Micron Technology, Inc. | Memory array decoding and interconnects |
| KR102796871B1 (ko) * | 2020-07-20 | 2025-04-17 | 삼성전자주식회사 | 메모리 셀 스트링을 포함하는 수직형 비휘발성 메모리 장치 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009096467A1 (ja) * | 2008-01-29 | 2009-08-06 | Unisantis Electronics (Japan) Ltd. | 半導体記憶装置 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6113661A (ja) | 1984-06-29 | 1986-01-21 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置およびその製造方法 |
| US4890144A (en) * | 1987-09-14 | 1989-12-26 | Motorola, Inc. | Integrated circuit trench cell |
| JP3057661B2 (ja) | 1988-09-06 | 2000-07-04 | 株式会社東芝 | 半導体装置 |
| JP2703970B2 (ja) | 1989-01-17 | 1998-01-26 | 株式会社東芝 | Mos型半導体装置 |
| JP2825244B2 (ja) * | 1988-12-09 | 1998-11-18 | 株式会社東芝 | 半導体装置 |
| US5258635A (en) * | 1988-09-06 | 1993-11-02 | Kabushiki Kaisha Toshiba | MOS-type semiconductor integrated circuit device |
| JP2950558B2 (ja) | 1989-11-01 | 1999-09-20 | 株式会社東芝 | 半導体装置 |
| KR920022532A (ko) * | 1991-05-13 | 1992-12-19 | 문정환 | 이중 수직 채널을 갖는 스태틱램 및 그 제조방법 |
| US5308782A (en) * | 1992-03-02 | 1994-05-03 | Motorola | Semiconductor memory device and method of formation |
| JP3325072B2 (ja) | 1992-03-02 | 2002-09-17 | モトローラ・インコーポレイテッド | 半導体メモリ装置 |
| US5398200A (en) * | 1992-03-02 | 1995-03-14 | Motorola, Inc. | Vertically formed semiconductor random access memory device |
| US5612563A (en) * | 1992-03-02 | 1997-03-18 | Motorola Inc. | Vertically stacked vertical transistors used to form vertical logic gate structures |
| JPH06268173A (ja) * | 1993-03-15 | 1994-09-22 | Toshiba Corp | 半導体記憶装置 |
| JP3403231B2 (ja) * | 1993-05-12 | 2003-05-06 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| US5576238A (en) * | 1995-06-15 | 1996-11-19 | United Microelectronics Corporation | Process for fabricating static random access memory having stacked transistors |
| JPH1079482A (ja) | 1996-08-09 | 1998-03-24 | Rai Hai | 超高密度集積回路 |
| KR100331845B1 (ko) * | 1998-01-10 | 2002-05-10 | 박종섭 | 박막트랜지스터제조방법 |
| US6304483B1 (en) * | 1998-02-24 | 2001-10-16 | Micron Technology, Inc. | Circuits and methods for a static random access memory using vertical transistors |
| JP4078721B2 (ja) | 1998-08-24 | 2008-04-23 | ソニー株式会社 | 半導体装置とその製造方法 |
| JP3376302B2 (ja) * | 1998-12-04 | 2003-02-10 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US6107660A (en) * | 1999-05-19 | 2000-08-22 | Worldwide Semiconductor Manufacturing Corp. | Vertical thin film transistor |
| JP4064607B2 (ja) * | 2000-09-08 | 2008-03-19 | 株式会社東芝 | 半導体メモリ装置 |
| KR100401130B1 (ko) * | 2001-03-28 | 2003-10-10 | 한국전자통신연구원 | 수직형 채널을 가지는 초미세 mos 트랜지스터 제조방법 |
| DE10130766B4 (de) * | 2001-06-26 | 2005-08-11 | Infineon Technologies Ag | Vertikal-Transistor, Speicheranordnung sowie Verfahren zum Herstellen eines Vertikal-Transistors |
| US6461900B1 (en) | 2001-10-18 | 2002-10-08 | Chartered Semiconductor Manufacturing Ltd. | Method to form a self-aligned CMOS inverter using vertical device integration |
| US6670642B2 (en) | 2002-01-22 | 2003-12-30 | Renesas Technology Corporation. | Semiconductor memory device using vertical-channel transistors |
| US7476228B2 (en) * | 2002-10-11 | 2009-01-13 | Abdou M Samy | Distraction screw for skeletal surgery and method of use |
| US7138685B2 (en) | 2002-12-11 | 2006-11-21 | International Business Machines Corporation | Vertical MOSFET SRAM cell |
| KR100467027B1 (ko) | 2003-01-07 | 2005-01-24 | 삼성전자주식회사 | 수직 트랜지스터로 구성된 에스램 소자 및 그 제조방법 |
| US20040253143A1 (en) * | 2003-06-16 | 2004-12-16 | Yokogawa Electric Corporation | Method for processing waste liquid in cartridges and a chemical reaction cartridge applying the method |
| WO2005079182A2 (en) * | 2004-01-22 | 2005-09-01 | International Business Machines Corporation | Vertical fin-fet mos devices |
| US20080057636A1 (en) * | 2006-08-31 | 2008-03-06 | Richard Lindsay | Strained semiconductor device and method of making same |
| JP5114968B2 (ja) | 2007-02-20 | 2013-01-09 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
| WO2009095998A1 (ja) * | 2008-01-29 | 2009-08-06 | Unisantis Electronics (Japan) Ltd. | 半導体記憶装置 |
| WO2009095999A1 (ja) * | 2008-01-29 | 2009-08-06 | Unisantis Electronics (Japan) Ltd. | 半導体記憶装置 |
| US8154086B2 (en) * | 2008-01-29 | 2012-04-10 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor surround gate SRAM storage device |
| WO2009096001A1 (ja) | 2008-01-29 | 2009-08-06 | Unisantis Electronics (Japan) Ltd. | 半導体記憶装置およびメモリ混載半導体装置、並びにそれらの製造方法 |
| US8158468B2 (en) * | 2008-02-15 | 2012-04-17 | Unisantis Electronics Singapore Pte Ltd. | Production method for surrounding gate transistor semiconductor device |
-
2009
- 2009-09-16 JP JP2009214094A patent/JP2011066109A/ja active Pending
-
2010
- 2010-09-14 KR KR1020100089927A patent/KR20110030354A/ko not_active Ceased
- 2010-09-14 EP EP10009571A patent/EP2299485A1/en not_active Withdrawn
- 2010-09-14 TW TW099131002A patent/TWI412123B/zh not_active IP Right Cessation
- 2010-09-15 US US12/882,847 patent/US8507995B2/en active Active
- 2010-09-16 CN CN201010285007.4A patent/CN102024818A/zh active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009096467A1 (ja) * | 2008-01-29 | 2009-08-06 | Unisantis Electronics (Japan) Ltd. | 半導体記憶装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2299485A1 (en) | 2011-03-23 |
| JP2011066109A (ja) | 2011-03-31 |
| US8507995B2 (en) | 2013-08-13 |
| US20110062529A1 (en) | 2011-03-17 |
| KR20110030354A (ko) | 2011-03-23 |
| TW201112402A (en) | 2011-04-01 |
| CN102024818A (zh) | 2011-04-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |