TWI399822B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TWI399822B
TWI399822B TW099105336A TW99105336A TWI399822B TW I399822 B TWI399822 B TW I399822B TW 099105336 A TW099105336 A TW 099105336A TW 99105336 A TW99105336 A TW 99105336A TW I399822 B TWI399822 B TW I399822B
Authority
TW
Taiwan
Prior art keywords
nozzle
liquid
cleaning
substrate
roller
Prior art date
Application number
TW099105336A
Other languages
English (en)
Chinese (zh)
Other versions
TW201041066A (en
Inventor
Yoshinori Takagi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW201041066A publication Critical patent/TW201041066A/zh
Application granted granted Critical
Publication of TWI399822B publication Critical patent/TWI399822B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0204—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to the edges of essentially flat articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/023—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epidemiology (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Coating Apparatus (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW099105336A 2009-04-03 2010-02-24 基板處理裝置 TWI399822B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009090925A JP2010240550A (ja) 2009-04-03 2009-04-03 基板処理装置

Publications (2)

Publication Number Publication Date
TW201041066A TW201041066A (en) 2010-11-16
TWI399822B true TWI399822B (zh) 2013-06-21

Family

ID=42942939

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099105336A TWI399822B (zh) 2009-04-03 2010-02-24 基板處理裝置

Country Status (4)

Country Link
JP (1) JP2010240550A (enExample)
KR (1) KR101202141B1 (enExample)
CN (1) CN101856646B (enExample)
TW (1) TWI399822B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI640369B (zh) * 2017-05-26 2018-11-11 弘塑科技股份有限公司 基板處理裝置、噴頭清洗裝置和噴頭清洗方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101842824B1 (ko) * 2014-03-10 2018-03-27 가부시키가이샤 스크린 홀딩스 기판 처리 시스템 및 배관 세정 방법
KR102250362B1 (ko) * 2014-07-08 2021-05-12 세메스 주식회사 예비 토출 유닛, 이를 가지는 기판 처리 장치 및 방법
JP6347708B2 (ja) * 2014-09-26 2018-06-27 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および洗浄方法
JP6697324B2 (ja) * 2016-05-26 2020-05-20 株式会社Ｓｃｒｅｅｎホールディングス ノズル清掃装置、塗布装置およびノズル清掃方法
CN106427219B (zh) * 2016-11-18 2018-07-06 深圳华云数码有限公司 清洗机构、喷墨打印机以及清洗方法
JP6905830B2 (ja) * 2017-01-11 2021-07-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN108933092A (zh) * 2017-05-26 2018-12-04 弘塑科技股份有限公司 基板处理装置、喷头清洗装置和喷头清洗方法
JP7018323B2 (ja) * 2018-01-22 2022-02-10 Ｔｏｗａ株式会社 加工装置、及び製品の製造方法
JP6939627B2 (ja) * 2018-02-16 2021-09-22 株式会社アイシン 塗布装置
JP7279096B2 (ja) * 2021-02-26 2023-05-22 株式会社Ｓｃｒｅｅｎホールディングス ノズル洗浄装置、ノズル洗浄方法および塗布装置
CN113733274B (zh) * 2021-09-22 2022-04-26 淮阴工学院 一种工业设计用木工加工装置
KR102629496B1 (ko) * 2021-12-24 2024-01-29 세메스 주식회사 홈 포트 및 기판 처리 장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI234797B (en) * 2002-10-07 2005-06-21 Dainippon Screen Mfg Nozzle cleaning apparatus and substrate treating apparatus having the same
TWI263542B (en) * 2004-10-04 2006-10-11 Dainippon Screen Mfg Apparatus for and method of processing substrate
TWI265831B (en) * 2003-11-18 2006-11-11 Dainippon Screen Mfg Substrate processing apparatus, slit nozzle, structure for determining degree of liquid filling in body to be filled, and structure for determining degree of air mixed in body to be filled
TWI293578B (en) * 2004-03-19 2008-02-21 Dainippon Screen Mfg Nozzle cleaning apparatus and substrate processing apparatus
TWI295590B (en) * 2004-08-27 2008-04-11 Dainippon Screen Mfg Substrate processing apparatus
TWI296211B (en) * 2004-01-23 2008-05-01 Dainippon Screen Mfg Substrate processing apparatus
TW200821047A (en) * 2006-11-13 2008-05-16 Dainippon Screen Mfg Substrate processing apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3518948B2 (ja) * 1995-08-24 2004-04-12 大日本スクリーン製造株式会社 基板の回転処理装置
JP2001310147A (ja) * 2000-05-02 2001-11-06 Tokyo Ohka Kogyo Co Ltd スリットコータの予備吐出装置および予備吐出方法
JP2004175525A (ja) * 2002-11-27 2004-06-24 Showa Mfg Co Ltd 薄型パネルの起立装置
JP4455102B2 (ja) * 2004-03-10 2010-04-21 大日本スクリーン製造株式会社 基板処理装置
JP4526288B2 (ja) * 2004-03-25 2010-08-18 東京応化工業株式会社 スリットノズル先端の調整装置及び調整方法
JP4324538B2 (ja) * 2004-10-04 2009-09-02 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4725273B2 (ja) 2005-09-29 2011-07-13 凸版印刷株式会社 予備吐出部を有するスピンレスコート装置及びそれを用いたカラーフィルタの製造方法
JP2007165554A (ja) * 2005-12-13 2007-06-28 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理方法
JP4472630B2 (ja) * 2005-12-28 2010-06-02 大日本スクリーン製造株式会社 基板処理装置
JP4986490B2 (ja) 2006-03-31 2012-07-25 東京応化工業株式会社 予備吐出装置
JP4859242B2 (ja) * 2006-07-27 2012-01-25 芝浦メカトロニクス株式会社 基板の処理装置
JP2008114106A (ja) 2006-11-01 2008-05-22 Seiko Epson Corp 吐出方法及び液滴吐出装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI234797B (en) * 2002-10-07 2005-06-21 Dainippon Screen Mfg Nozzle cleaning apparatus and substrate treating apparatus having the same
TWI265831B (en) * 2003-11-18 2006-11-11 Dainippon Screen Mfg Substrate processing apparatus, slit nozzle, structure for determining degree of liquid filling in body to be filled, and structure for determining degree of air mixed in body to be filled
TWI296211B (en) * 2004-01-23 2008-05-01 Dainippon Screen Mfg Substrate processing apparatus
TWI293578B (en) * 2004-03-19 2008-02-21 Dainippon Screen Mfg Nozzle cleaning apparatus and substrate processing apparatus
TWI295590B (en) * 2004-08-27 2008-04-11 Dainippon Screen Mfg Substrate processing apparatus
TWI263542B (en) * 2004-10-04 2006-10-11 Dainippon Screen Mfg Apparatus for and method of processing substrate
TW200821047A (en) * 2006-11-13 2008-05-16 Dainippon Screen Mfg Substrate processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI640369B (zh) * 2017-05-26 2018-11-11 弘塑科技股份有限公司 基板處理裝置、噴頭清洗裝置和噴頭清洗方法

Also Published As

Publication number Publication date
JP2010240550A (ja) 2010-10-28
CN101856646A (zh) 2010-10-13
CN101856646B (zh) 2013-08-07
TW201041066A (en) 2010-11-16
KR20100110726A (ko) 2010-10-13
KR101202141B1 (ko) 2012-11-15

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