201041066 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種例如液晶用玻璃方型基板、半導體基 板、薄膜液晶用可撓性基板、光罩用基板、彩色濾光片用 • 基板等之精密電子裝置用基板、或者與其等類似之各種基 ， 板的基板處理裝置。 【先前技術】 先前’於各種基板之製造步驟中，使用有於基板之表面 Ο 塗佈處理液之基板處理裝置。作為此種基板處理裝置，已 知有如下之狹縫塗佈機：一邊自狹縫喷嘴吐出處理液，一 邊使該狹縫噴嘴相對於基板而相對性地直線移動，從而於 整個基板上塗佈處理液。 為了高精度地執行狹縫塗佈機之塗佈處理，重要的是狹 縫噴嘴之前端部於其長度方向、寬度方向上處於均一之狀 態。然而，因重複進行塗佈處理，狹縫喷嘴之前端部無論 Q 如何亦會附著有處理液，因此難以將狹縫喷嘴之前端部保 持為均一之狀態，從而導致塗佈處理之精度降低。因此， 於狹縫塗佈機中，需要用以清洗狹縫噴嘴之前端部以使其 • 處於均一之狀態之噴嘴維護單元。 • 例如，如專利文獻1之記載所示，已知有一種具有如下 喷嘴初始化機構之基板處理裝置，該噴嘴初始化機構進行 如下處理：於對基板進行塗佈處理之前進行狹縫噴嘴前端 之β洗處理，然後於使狹縫噴嘴接近旋轉之大致圓筒形狀 之輥之外周面的狀態下吐出固定之處理液，從而將喷嘴之 146584.doc 201041066 前端部調整為均一之狀態（以下稱作「預吐出處理 [先前技術文獻] [專利文獻] [專利文獻1]曰本專利特開2005-254090號公報 【發明内容】 [發明所欲解決之問題] 然而，於上述噴嘴初始化機構中，進行狹缝噴嘴之預吐 出之預吐出機構、進行狹缝噴嘴之吐出口之清洗之噴嘴清 洗機構、及喷嘴待機之待機埠分別係各自分開之構成。二 該等各機構巾產生之用於處理之清洗液係與濃度或使用狀 態無關而無法特別有效地利用。 又’各個機構必須設置有用以將溶液排出至系統外之廢 液配管、及排出溶液環境氣體之排氣配管，因此配管構成 變得複雜，維護性存在問題。 本發明係#於如上所述之問題而完成者，其第丨目的在 於提供—種於喷嘴初純機構巾可有效地湘各個機構所 使用之清洗液之基板處理裝置。 、本發明之第2目的在於簡化噴嘴初始化機構之配管構 [解決問題之技術手段] 清求項1之發明係一種基板處理裝置，其特徵在於： 係於基板塗佈特定之處理液者，且包括：㈣，其設置 沿大致水平之第丨方向而搬送之上述基板之上方，可吐 上述處理液，且沿與上述第】方向正交之大致水平的第2 146584.doc 201041066 向而延伸；預吐出用之輥，其沿上述第2方向而延伸，藉 」吏上述處理液自上述喷嘴吐出至外周面而將上述噴嘴之 月j而。p之處理液調整為特定之狀態；框體，其沿上述第2 方向而延伸’ 收納上述輥；及喷嘴清洗機構，其利用清 、液而進行上述嘴嘴之清洗；且來自上述噴嘴之吐出液、 及來自上述噴嘴清洗機構之吐出液f積於共用之上述框體[Technical Field] The present invention relates to, for example, a glass square substrate for liquid crystal, a semiconductor substrate, a flexible substrate for a thin film liquid crystal, a substrate for a photomask, a substrate for a color filter, and the like. A substrate for a precision electronic device, or a substrate processing device of various substrates and the like. [Prior Art] Previously, in the manufacturing steps of various substrates, a substrate processing apparatus having a coating liquid on the surface of the substrate was used. As such a substrate processing apparatus, there is known a slit coater that relatively linearly moves the slit nozzle relative to the substrate while discharging the processing liquid from the slit nozzle, thereby coating the entire substrate Treatment fluid. In order to perform the coating process of the slit coater with high precision, it is important that the front end portion of the slit nozzle is in a uniform state in the longitudinal direction and the width direction thereof. However, since the coating liquid is repeatedly applied to the end portion of the slit nozzle, the processing liquid is adhered to the end portion of the slit nozzle. Therefore, it is difficult to maintain the front end portion of the slit nozzle in a uniform state, and the precision of the coating process is lowered. Therefore, in the slit coater, a nozzle maintenance unit for cleaning the front end portion of the slit nozzle to be in a uniform state is required. For example, as disclosed in Patent Document 1, there is known a substrate processing apparatus having a nozzle initializing mechanism that performs a β-wash of the tip of the slit nozzle before applying the substrate to the coating process. After the treatment, the fixed processing liquid is discharged in a state in which the slit nozzle is close to the outer circumferential surface of the substantially cylindrical roller, and the tip end portion of the nozzle 146584.doc 201041066 is adjusted to a uniform state (hereinafter referred to as "pre- [Preparation of the prior art] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2005-254090 [Draft of the Invention] [Problems to be Solved by the Invention] However, in the nozzle initializing mechanism, slits are performed. The pre-discharge mechanism for pre-discharging of the nozzle, the nozzle cleaning mechanism for cleaning the discharge port of the slit nozzle, and the standby hopper for standby of the nozzle are respectively separated. The cleaning liquid for processing by the respective tissue towels It is not particularly efficient to use regardless of the concentration or state of use. Also, 'each body must be set up to drain the solution. The waste liquid piping to the outside of the system and the exhaust gas piping for discharging the ambient gas of the solution are complicated, and the maintenance is problematic. The present invention is completed in the above-mentioned problems, and the Provided is a substrate processing apparatus for cleaning fluid used in various mechanisms of a nozzle, and a second object of the present invention is to simplify a piping structure of a nozzle initializing mechanism [Technical means for solving the problem] According to a first aspect of the invention, a substrate processing apparatus is characterized in that: a method of applying a specific processing liquid to a substrate, and comprising: (4) providing a top surface of the substrate conveyed in a substantially horizontal direction, wherein the processing can be performed. The liquid is extended along the second level 146584.doc 201041066 which is substantially horizontal to the direction of the first direction; the pre-discharge roller extends in the second direction, and the processing liquid is discharged from the nozzle Adjusting the processing liquid of the month j of the nozzle to a specific state to the outer peripheral surface; the frame extending along the second direction to accommodate the roller; and spraying Purging mechanism using clear, the washing liquid of the above-described Zuizui; and discharging the liquid from the nozzle, and discharging the liquid f from the nozzle cleaning mechanism to the product of the common housing
、用长項2之發明係如請求項J之基板處理裝置，其特徵在 於更包括：待機槽，其與上述框體連結，並使上述喷嘴清 洗機構於其±方待機’·及配管，其使上述喷嘴清洗機構之 待機槽内之液體導入至上述框體内。 請求項3之發明係如請求項1之基板處理裝置，其特徵在 於.上述框體與上述喷嘴清洗機構中，僅於上述框體設置 有廢液配管及排氣配管。 請求項4之發明係如請求項2之基板處理裝置，其特徵在 於：上述框體、上述喷嘴清洗機構及上述待機槽中，僅於 上述框體設置有上述廢液配管及上述排氣配管。 請求項5之發明係如請求項丨至4中任一項之基板處理裝 置其特徵在於：自上述噴嘴清洗機構朝向上述噴嘴之前 端和土出之清洗液、及向基板吐出處理液之前自上述喷嘴 預吐出至上述輥上之處理液，係f積於共用之上述框體 内。 請求項6之發明係如請求項丨至4中任一項之基板處理裝 置，其特徵在於··通過上述喷嘴内部而自上述喷嘴吐出之 146584.doc 201041066 清洗液、及向基板吐出處理液之前自上述噴嘴預〇土出至上 述輥上之處理液，係蓄積於共用之上述框體内。 請求項7之發明係如請求項丨至4中任一項之基板處理裝 置，其特徵在於：自上述噴嘴清洗機構朝向上述噴嘴之前 端部吐出之清洗液、通過上述噴嘴内部而自上述噴嘴吐出 之清洗液、及向基板吐出處理液之前自上述噴嘴預吐出至 上述輥上之處理液，係蓄積於共用之上述框體内。 請求項8之發明係如請求項丨至4中任一項之基板處理裝 置’其特徵在於：使上純之下部浸漬於f積在上述框體 内且包含上述清洗液之蓄積液中，藉此將上述蓄積液用於 上述輥之清洗。 請求項9之發明係如請求項中任一項之基板處理裝 置，其特徵在於更包括：清洗液供給機構，其設置於上述 =之Γ側面，1向上述框體内供給清洗液；液面檢測 =，：檢測上述框體内之液面高度；及清洗液供給控制 、、於藉由上述液面檢測機構所檢測出之 平時’使清洗液自上述清洗液供給機構供 請之發明係如請求項〗至4中任一項之基板處理裝 徵在於：於上述喷嘴下降至上述框體之内部之狀 内部清洗。、出上心月洗液’藉此進行上述噴嘴之 [發明之效果] 可將來自喷嘴之吐出 根據請求項丨至1〇記載之發明 146584.doc 201041066 液、及來自喷嘴清洗機構之排出液蓄積於共用之框體内。 於框體内設置妹’可利用框體内之溶液來清洗附著於報 上之處理液。藉此，可削減供給至_之清洗液之供給量 及廢液量’從而可降低處理成太 驭丰又，將用於排氣或廢液 等之配管設置於共用之框體上g 體上即可，故與先前相比可簡化 配管構成。 又’特別是根據請求項2記恭夕A n 口 戰之电明’收集於噴嘴清洗 Ο 〇 機構之待機槽内之清洗液， 乃j精宙配官而導入至共用之 框體内。 又，特別是根據請求項3記#夕欲η口 、 $汜戰之發明，於框體與噴嘴清 洗機構上均無需設置廢液配管 次徘乱配管，因此可削減廢 液配官與排氣配管之使用數量。 f 數 量 特別是根據請求項4記載之發明，無需於框體、噴 構及喷嘴清洗機構之待機槽之各個上設置廢液配 :及排氣配官，因此可削減廢液配管與排氣配 又，特別是根據請求項5記載之發明，可使自噴嘴預吐 出至輥上之處理液、及自噴嘴、生 ,.^ 贺腎'月'先機構朝向噴嘴之前端邻 吐出之岣洗液蓄積於共用之框體内。 ° 特別是根據請求項6記載之發明，可使自喷嘴預吐 I上之處理液、及作為内部清洗 嘴吐出之清洗液蓄積於共用之框體内。h内… 又，特別是根據請求項7記载之發 而自喷嘴吐出至輥上„ 使為了預吐出 出至輥上之處理液、為了清洗喷嘴而自噴嘴清 146584.doc 201041066 洗機構朝向噴嘴之前端部 工出之清洗液、及作為内Λ 而通過喷嘴内部自喷嘴吐 ” ，月洗 ,出之清洗液蓄積於共用之框體 又’特別是根據請求項4 體。 之荄藉y田 載之發明，可將框體内蓄稽 之畜積液用於輥之清洗。闵 w積 因此，可削減為了清洗輥而佴认 ^ 妁使用篁。又，亦會帶來廢液# 之削減，因此亦可削叙、A + 文里 丌’削减廢液處理所花費之成本。 又’特別是根據請求項9纪恭夕技na — L a 己载之發明，藉由液面檢測撫 構而檢測框體内之液面高度， '機 欠可基於此而自清洗液供认 機構向框體内供給清洗液。 因此，可防止框體内之液體晷 不足而導致輥之清洗不良之情形。 又’特別是根據請求物記載之發明，可防止自嘴嘴吐 出之清洗液向周圍飛散。 【實施方式】 以下 邊參照圖式一邊對本發明之實施形態加以 說 再者，於以下之說明中，當表示方向及朝向時，適當地 使用圖中所示之三維XYZ正交座標。此處，χ軸及γ二方 向表示水平方向，Ζ轴方向表示鉛垂方向（+ζ側為上側、 側為下侧）。又，為方便起見，將χ軸方向設為左右方向 (+Χ側為下游側、-X側為上游側），將γ軸方向設為深度方 向（+Υ側、-Υ側）。 <1.基板處理裝置1之概要> 圖1係本發明之實施形態之基板處理裝置1之頂視圖。式 板處理裝置1係作為裝置（狹縫塗佈機）而構成：使形成有吐 146584. doc 201041066 出處理液之狹縫之長條狀之喷嘴與基板w相對性地移動， 而於基板w之表面上塗佈處理液。該基板處理裝置1用於 將作為處理液之抗蝕液塗佈於基板上而作為選擇性地對基 板W之表面所形成之電極層等進行蝕刻之前處理的製程等 中。作為狹縫塗佈機之塗佈對象之基板w代表性的是液晶 顯不裂置中用以製造晝面面板之方形之玻璃基板，但亦可 為半導體基板、薄膜液晶用可撓性基板、光罩用基板、彩 〇 色濾光片用基板等之其他基板。 基板處理裝置1中以搬送為主要目的而包括：滚子輸送 機3〇，其搬送自上游單元輸送而來之基板w;入口懸浮平 台10，其藉由壓縮空氣而使基板w懸浮；傳送單元6，其 自滾子輸送機30將基板W傳送至入口懸浮平台1〇;及基板 搬送吸盤8，其吸附保持基板貿之兩側端，並將其搬送至 下游。 又，為了於基板W上塗佈處理液而包括：喷嘴單元5， Ο ”具備可吐出處理液之狹縫噴嘴55 ;噴嘴維護單元9 ,其 進行狹縫喷嘴55之清洗；及塗佈平台4，其進行塗佈處 理。 圖2係表示基板處理裝置i之控制部7、與藉由該控制部7 ""主要控制之各功能部之關係的圖。控制部7係使用電腦 2構成’亚按照安裝於電腦中之程式、裝置各部分之特性 資料、及各基板W之處理順序（參 而 分，進行-系列之基板w之連續處理。 置各# 圖3係基板搬送吸盤8、噴嘴單元5及噴嘴維護單元9之 146584.doc 201041066 yz剖面圖。 基板搬送吸盤8係用以保持下表面處於非接觸狀態之基 板W之邊緣並向下游方向搬送基板w之裝置。於原點狀態 下，基板搬送吸盤8係位於橫跨懸浮墊64與入口懸浮平台 10而停止之基板W之與X軸方向平行之兩端部的正下方。 如圖3所示，基板搬送吸盤8形成為左右對稱（+γ側與_γ 側對稱）之結構，且於左右分別包括：搬送吸盤移動導軌 81，其用以使搬送吸盤向χ軸方向移動；搬送吸盤線性馬 達83，其產生用於上述移動之驅動力；及搬送吸盤線性標 度尺8 2，其用以檢測基板w之位置。 於基板搬送路徑之兩端（_γ側、+γ側），在較喷嘴單元移 動導轨51更内側之位置處，沿χ軸方向而設置搬送吸盤移 動導軌81 ^ 兩個搬送吸盤線性馬達83(_γ側、+丫側）之各個定子係沿 X軸方向而設在基板處理裝置丨之¥軸方向之最内側之側面 上。各個動子係固定設置於基板搬送吸盤8上。藉由於該 等定子與動子之間產生之磁性相互作用，基板搬送吸盤8 沿搬送吸盤移動導軌81而移動。 關於兩個搬送吸盤線性標度尺82，亦係分別設置於基板 處理裝置1之兩端（-Υ側、+γ側）處。該搬送吸盤線性標度 尺82對基板搬送吸盤8之移動位置進行檢測，因此控制部7 根據其檢測結果而進行基板位置之控制。 於基板W之表面上塗佈抗蝕液之喷嘴單元5係設置於塗 佈平台4之上方，且具有圖3所示之橋接結構。此種橋接結 146584.doc •10- 201041066 構例如由以碳纖維強化樹脂作為骨架之噴嘴支持部、及支 持其兩端並其升降之升降機構而構成。於噴嘴支持部設置 有狹縫喷嘴55。狹縫喷嘴55將自處理液供給機構（未圖示） . 所供給之抗蝕液自形成於其下端之狹縫狀之吐出口 5“向 基板W之上表面吐出。該吐出口 55a相對於塗佈平台4而大 . 致水平，且沿Y軸方向延伸。 狹縫噴嘴Η之升降機構係設置於噴嘴支持部之兩端，主 〇 要由作為驅動源之升降馬達％、及滾珠螺桿58而構成。藉 由該升降馬達59，喷嘴支持部沿著相對於塗佈平台4而於 鉛垂方向上延伸之滾珠螺桿58而升降驅動，並調節狹縫噴 嘴55之吐出口 55a與基板w的間隔。 於該升降機構上，在基板搬送路徑之兩端（-Y側、+γ 側），於不與基板W接觸之位置處沿又軸方向而設置喷 元移動導執、 兩個噴嘴單元線性馬達53(_γ側、+¥側）之各定子係沿χ 〇 軸方向而设在本體裝置之γ軸方向之側面上，且各動子係 固定設置於升降機構之外側。藉由於該等定子與動子之間 產生之磁性相互作用，喷嘴單元5沿喷嘴單元移動導執51 * 而移動。 • 關於兩個喷嘴單元線性標度尺52,係分別設置於本基板 處理裝置1之兩端（_γ側、+γ側）處。該喷嘴單元線性標度 尺52對喷嘴單π 5之移動位置進行檢測，因此控制部7根據 其檢測結果而控制喷嘴單元線性馬達53之驅動，並對喷嘴 單元5之於X軸方向上之移動、即利用狹縫嘴嘴“向基板表 146584.doc 201041066 面之掃描進行控制。 進行塗佈處理時，係於自狹縫噴嘴55之吐出口 55a吐出 抗蝕液之狀態下，由基板搬送吸盤8保持基板评之兩端並 使其於（+x)軸方向上以特定之速度水平移動。 ·基板處理裝置I之基板W之處理流程> 作為藉由該基板處理裝置丨而對基板w進行之處理流 程’係如以下所示。 藉由上游單元而前處理後之基板謂由滾子輸送機30之 驅動而被向下游方向搬送。於滾子輸送機30之下游側設置 專送單元6 „亥傳送單元6構纟4 :包括藉由自所形成之 】孔嘴出之I氣之屋力而使基板w懸浮之懸浮塾64、及傳 达升降滾子輸送機6〇，且沿γ軸方向而於懸浮塾M之空隙 處設置有傳送升降滾子輸送機6〇之滾子群。 、 傳送升降滾子輸㈣6G可相對於基板料㈣而於錯垂 方向上升降’ #處於上升位置時，傳送升降滾子輸送機⑼ 之滾子之外周面之頂部位於與滚子輪送機3g之滾子之外周 =頂部同等的高度處，當下降時，下降至較懸浮塾咐 下方。當基板W自上游單元搬送而來時，傳送升 :輪送機6°於處於上升位置之狀態下與滾子輸送機3。 =動’藉此職^自料輸送機顺送輯送單元 板^^ “歸平台1G。入口料平㈣遍及一塊 嗔出壓：個表面而分布形成有多個小孔，並自小孔 力，/目空乳。因此，藉由噴出壓縮空氣而形成之氣體壓 '入口懸浮平台1 0上基板w係處於懸浮狀態。 146584.doc -12- 201041066 右基板W之後轉移至傳送單元6上，則傳送升降滾子 輸送機60下降至較懸浮墊64之上表面更下方。因此，傳送 單元6對基板W之支持僅靠懸浮墊64之懸浮力，與入口懸 浮平σ 1 0之懸浮力協動而使基板W懸浮，並於與滾子等下 部機構非接觸之狀態下過渡。基板搬送吸盤8保持如此之 處於非接觸狀態之基板w之與搬送方向平行之兩邊的兩 端，並將其向下游方向搬送。基板搬送吸盤8保持並驅動 ◎ 基板w，藉此基板w以特定之速度依序向入口懸浮平台 10、塗佈平台4、然後向出口懸浮平台j j搬送。 噴嘴單元5及喷嘴維護單元9係位於塗佈平台4上。於喷 嘴維護單元9中進行清洗及預吐出處理之喷嘴單元5之狹縫 喷嘴5 5為對基板w進行塗佈處理，而下降至塗佈平台4上 之塗佈開始位置為止。藉由基板搬送吸盤8之驅動而將基 板w搬送至塗佈開始位置之狹縫喷嘴55之吐出口 55&與塗 佈平台4之上表面之間。此時，自狹縫噴嘴55之吐出口乃还 〇 將處理液供給至基板W之表面，而對基板W進行塗佈處 理。 將塗佈處理後之基板W搬向出口懸浮平台u。於出口懸 浮平oil上’解除基板搬送吸盤8之吸附保持。接著，藉 由叹置於出口懸浮平台丨丨之提昇銷115群之上升驅動，基 板W之下表面被支持並被提昇。傳送機器人36之傳送叉進 入已上升之提昇銷115群之間，藉此自提昇銷115群上接收 基板W，並將該基板w傳送至設置於下游之減壓乾燥單元 37 ' 38中的任一者，對所塗佈之處理液進行減壓乾燥。其 146584.doc 】3 201041066 後，將基板w傳送至與減壓乾燥單元38於上下方向上 之交付位置39’進而提交給用以進行下一步驟之其2 置。以上係將基板…搬人至本基板處理裝並 、 處理裝置1中搬出為止之一系列流程。 土板 <3.噴嘴維護單元9之概要> 喷嘴维護單元9係如下裝置：對附著於對基板w之表面 進行塗佈處理之狹縫噴嘴55之吐出口…的處理液進^清 洗’並面向下-塗佈處理，對特定之輥上進行預吐出（= 塗佈)以調整狹縫噴嘴55之吐出口 55a之狀態，從而使〇 於可順暢地進行處理液之吐出的狀態。因此，具備作= 自狹縫噴嘴55之抗㈣之吐出對象之大致圓筒狀之親％。 如圖I及圖3所示，該喷嘴維護單元9係沿χ軸方向、於較 基板搬送路徑更外側且較噴嘴單元5更内側之位置處自下 方被支持。於噴嘴維護單元9上亦左右（_γ側、+γ側）分別 包括喷嘴維護單元移動導軌91、喷嘴維護單元線性馬達 93、及噴嘴維護單元線性標度尺92。 自γ軸方向觀察時，喷嘴維護單元移動導軌91係位於噴 嘴單元移動導執51與搬送吸盤移動導執81之間，且以沿乂 轴方向之方式設置於基板搬送路徑之兩端（-Υ側、+Υ側） 處。喷嘴維護單元移動導軌91沿基板搬送路徑不僅於入口 懸浮平台10、塗佈平台4及出口懸浮平台η之兩側部延 伸’亦於傳送單元6之兩側部延伸。 設置於兩端（_γ側、+γ側）之兩個喷嘴維護單元線性馬達 93沿Χ軸方向而於基板處理裝置1之Υ軸方向之内側之側面 146584.doc -14- 201041066 上δΧ置有各定子。又，各動子係固定設置於噴嘴維護單元 9上。藉由於該等定子與動子之間產生之磁性相互作用， 喷嘴維護單元9沿喷嘴維護單元移動導執91而移動。 • 關於兩個噴嘴維護單元線性標度尺92，亦分別設置於基 板處理裝置1之兩端（_γ側、+¥側）處。該喷嘴維護單元線 .#標度尺92對嘴嘴維護單元9之移動位置進行檢測，因此 控制邛7可根據其檢测結果而對噴嘴維護單元9之 ❹控制。 如此’噴嘴維護單元9可沿噴嘴雉護單元移動導軌㈣ 與基板處理裝置1之Χ軸方向大致平行地移動。因此，當進 行噴嘴維護單元9下部之保養作業時等的情況下，由於可 使噴嘴維護單元9移動，故可容易地進行作業。又，冬操 作者使噴嘴維護單元9移動至便於作業之位置處之後田亦 可進行噴嘴維護單元9自身之保養作業。 圖係嗔嘴維遵單凡9之ΧΖ剖面圖。該喷嘴維護單元9構 Ο成為包括：吐出調整部从，其自狹縫噴嘴55預吐出處理液 並使其塗佈於輥95之周面上，藉此預先調整狹縫喷嘴^之 前端:之處理液的狀態；喷嘴清洗部9β，其清洗狹縫喷嘴 55之則端部’及基台9C，其支持該等吐出調整部$績噴 嘴清洗部9B之結合體。 於吐出調整部9A中，作為為進行預吐出處理而自狹縫喷 嘴吐出之處理液之承接構件的輕％係設置於作為框體之 輥槽灿。該輥95係較狹缝噴嘴55之¥軸方向之長度稍長 之大致圓筒狀之構件，且配置為長度方向與Y轴方向平 146584.doc -15· 201041066 一者上設置有輥旋轉馬達 ，輥95於圖4中順時針旋 行。於該輥95之旋轉軸之其中 98，藉由輥旋轉馬達98之驅動 轉。 吐出調整部9A之輥槽96形成為盒狀’且自其上部在其中 側方。P (圖4中為（_χ)方向之左侧方部）形成開口。於 口 4以輥95之頂部自輥槽％之上部起向上方略微突出' 並且供給清洗液之新液之清洗液供給配㈣可一邊對輕样 96内進^洗—邊供給清洗液的方式，將輥95設置於親样 96内部之（+Χ)側之長度方向的側面附近。於親槽96内以^ 浸潰輥95之下端部分之程度而蓄積有清洗液。因此，藉由 輥95凝轉，因預吐出而自狹縫喷嘴^吐出處理液之㈣之 外周面依序浸入所蓄積的清洗液。並且，浸入所蓄積之主 洗液之外周面藉由輥95之旋轉而自清洗液中被拉升。， 為良好地保持时於㈣上之處縣之脫液，The invention of claim 2, wherein the substrate processing apparatus according to claim J, further comprising: a standby tank that is coupled to the casing, and that the nozzle cleaning mechanism is in standby of the ± side and a pipe, The liquid in the waiting tank of the nozzle cleaning mechanism is introduced into the casing. The invention of claim 3 is the substrate processing apparatus according to claim 1, wherein the housing and the nozzle cleaning mechanism are provided with a waste liquid pipe and an exhaust pipe only in the casing. The invention of claim 2 is the substrate processing apparatus according to claim 2, wherein the frame body, the nozzle cleaning mechanism, and the standby tank are provided with the waste liquid pipe and the exhaust pipe only in the casing. The substrate processing apparatus according to any one of claims 1 to 4, wherein the nozzle cleaning mechanism is configured to move from the nozzle cleaning mechanism toward the front end of the nozzle and the cleaning liquid from the soil, and before discharging the processing liquid to the substrate. The treatment liquid pre-discharged from the nozzle onto the roller is accumulated in the common casing. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that the 146584.doc 201041066 cleaning liquid discharged from the nozzle through the inside of the nozzle and before the processing liquid is discharged to the substrate The treatment liquid that has been preliminarily discharged from the nozzle to the roller is stored in the common casing. The substrate processing apparatus according to any one of claims 1 to 4, wherein the cleaning liquid discharged from the nozzle cleaning mechanism toward the front end of the nozzle is discharged from the nozzle through the inside of the nozzle The cleaning liquid and the treatment liquid pre-discharged from the nozzle to the roller before discharging the treatment liquid onto the substrate are accumulated in the common casing. The substrate processing apparatus according to any one of claims 4 to 4, characterized in that the upper pure portion is immersed in the accumulation liquid containing the cleaning liquid in the frame, and This uses the above-mentioned accumulation liquid for the cleaning of the above rolls. The substrate processing apparatus according to any one of the preceding claims, further comprising: a cleaning liquid supply mechanism provided on the side surface of the above-mentioned =, 1 for supplying a cleaning liquid to the casing; Detection =, detecting the liquid level in the casing; and controlling the supply of the cleaning liquid, and detecting the cleaning liquid from the cleaning liquid supply mechanism by the liquid level detecting means The substrate processing apparatus according to any one of claims 4 to 4, wherein the nozzle is cleaned in a state in which the nozzle is lowered to the inside of the casing. [Effect of the invention] The above-mentioned nozzle can be used to perform the above-described nozzles. The discharge from the nozzle can be stored according to the requirements of the invention 146584.doc 201041066, and the discharge liquid from the nozzle cleaning mechanism In the shared box. The girl in the frame can use the solution in the frame to clean the treatment liquid attached to the newspaper. Thereby, the supply amount and the amount of the waste liquid supplied to the cleaning liquid can be reduced, and the treatment can be reduced to be too rich, and the piping for exhaust gas or waste liquid can be placed on the common housing. That is, the piping configuration can be simplified as compared with the prior art. In addition, the cleaning liquid collected in the standby tank of the nozzle cleaning Ο 机构 mechanism is introduced into the shared casing, in particular, according to the request item 2. In addition, according to the invention of claim 3, the invention of the 夕 η η 、 、 、 、 、 、 、 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴The number of piping used. In particular, according to the invention described in claim 4, it is not necessary to provide a waste liquid distribution and an exhaust gas distribution in each of the standby grooves of the frame, the spray structure, and the nozzle cleaning mechanism, so that the waste liquid piping and the exhaust gas distribution can be reduced. Further, in particular, according to the invention of claim 5, the treatment liquid which is pre-discharged from the nozzle to the roller, and the rinsing liquid which is discharged from the nozzle, the raw material, and the front side of the nozzle toward the nozzle end can be used. Accumulate in the shared frame. In particular, according to the invention of claim 6, the treatment liquid from the nozzle pre-discharge I and the cleaning liquid discharged from the internal cleaning nozzle can be accumulated in the common casing. h... In particular, it is discharged from the nozzle to the roller according to the request described in the claim 7 „ so that the treatment liquid for pre-discharging onto the roller is cleaned from the nozzle for cleaning the nozzle 146584.doc 201041066 Washing mechanism toward the nozzle The cleaning liquid that was previously produced at the end and the inside of the nozzle are spit out from the nozzle as a lining, and the cleaning liquid is accumulated in the common frame and is in particular according to the request item 4. After the invention of y Tian, the animal effusion stored in the frame can be used for the cleaning of the roller.闵 w Product Therefore, it is possible to reduce the use of 篁 for cleaning the rollers. In addition, it will also bring about the reduction of waste liquid #, so it is also possible to reduce the cost of waste disposal by A + Wenli. In addition, according to the invention of claim 9, the method of detecting the liquid level in the frame by liquid level detection, the machine can be based on the self-cleaning liquid supply mechanism. The cleaning liquid is supplied to the casing. Therefore, it is possible to prevent the liquid in the casing from being insufficient and causing a poor cleaning of the roller. Further, in particular, according to the invention described in the request, it is possible to prevent the cleaning liquid discharged from the mouth from scattering to the surroundings. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, when indicating the direction and orientation, the three-dimensional XYZ orthogonal coordinates shown in the drawings are appropriately used. Here, the χ axis and the γ directions indicate the horizontal direction, and the Ζ axis direction indicates the vertical direction (the + ζ side is the upper side and the side is the lower side). Further, for the sake of convenience, the x-axis direction is set to the left-right direction (the +Χ side is the downstream side, the -X side is the upstream side), and the γ-axis direction is the depth direction (+Υ side, -Υ side). <1. Outline of Substrate Processing Apparatus 1> Fig. 1 is a top plan view of a substrate processing apparatus 1 according to an embodiment of the present invention. The plate processing apparatus 1 is configured as a device (slit coater) that moves a long nozzle having a slit of a processing liquid formed thereon to a substrate w, and a substrate w is formed on the substrate w. The treatment liquid is applied to the surface. The substrate processing apparatus 1 is used for applying a resist liquid as a processing liquid onto a substrate as a process for selectively etching an electrode layer or the like formed on the surface of the substrate W. The substrate w to be coated by the slit coater is typically a square glass substrate for producing a facet panel in the case where the liquid crystal is not diced, but may be a semiconductor substrate or a flexible substrate for a thin film liquid crystal. Other substrates such as a photomask substrate and a color filter substrate. The substrate processing apparatus 1 includes, for the main purpose of transportation, a roller conveyor 3 that transports a substrate w transported from an upstream unit, and an inlet suspension platform 10 that suspends the substrate w by compressed air; 6. The self-roller conveyor 30 transports the substrate W to the inlet suspension platform 1; and the substrate transfer suction cup 8, which adsorbs and holds the both sides of the substrate and transports it to the downstream. Further, in order to apply the processing liquid onto the substrate W, the nozzle unit 5 includes a slit nozzle 55 that can discharge the processing liquid, a nozzle maintenance unit 9 that performs cleaning of the slit nozzle 55, and a coating stage 4 Fig. 2 is a view showing the relationship between the control unit 7 of the substrate processing apparatus i and the functional units mainly controlled by the control unit. The control unit 7 is constituted by the computer 2. 'According to the program installed in the computer, the characteristic data of each part of the device, and the processing order of each substrate W (to participate in the continuous processing of the substrate w of the series.) # Figure 3 is the substrate transfer chuck 8, 146584.doc 201041066 yz cross-sectional view of the nozzle unit 5 and the nozzle maintenance unit 9. The substrate transfer chuck 8 is a device for holding the substrate W with the lower surface in a non-contact state and transporting the substrate w in the downstream direction. Next, the substrate transfer chuck 8 is located directly below the both ends of the substrate W that is stopped across the suspension pad 64 and the inlet suspension stage 10, and is parallel to the X-axis direction. As shown in FIG. 3, the substrate transfer chuck 8 is formed to be left and right. symmetry The structure of the +γ side and the γ γ side is symmetrical, and includes, on the right and left sides, a transfer chuck moving rail 81 for moving the suction chuck in the z-axis direction, and a suction cup linear motor 83 for generating the drive for the above movement. And a suction suction linear scale 8 2 for detecting the position of the substrate w. At both ends of the substrate transfer path (_γ side, +γ side), at a position further inside than the nozzle unit moving rail 51 The transfer chuck moving rail 81 is disposed along the x-axis direction. The stators of the two transfer chuck linear motors 83 (_γ side, +丫 side) are provided on the innermost side of the substrate processing apparatus in the x-axis direction along the X-axis direction. On the side surface, each mover is fixedly disposed on the substrate transfer chuck 8. The substrate transfer chuck 8 moves along the transfer chuck moving rail 81 due to the magnetic interaction between the stator and the mover. The suction cup linear scales 82 are also respectively disposed at both ends (-Υ side, +γ side) of the substrate processing apparatus 1. The transporting suction cup linear scale 82 detects the moving position of the substrate carrying suction cup 8, because The control unit 7 controls the substrate position based on the detection result. The nozzle unit 5 on which the resist liquid is applied on the surface of the substrate W is disposed above the coating stage 4 and has a bridge structure as shown in Fig. 3 . Such a bridge junction 146584.doc • 10 - 201041066 is constituted by, for example, a nozzle support portion having a carbon fiber reinforced resin as a skeleton, and an elevating mechanism supporting both ends thereof and moving up and down. The nozzle support portion is provided with a slit nozzle 55. The slit nozzle 55 is supplied from a processing liquid supply means (not shown). The supplied resist liquid is discharged from the slit-shaped discharge port 5 formed at the lower end thereof toward the upper surface of the substrate W. The discharge port 55a is opposed to the discharge port 55a. The coating platform 4 is large. It is horizontal and extends in the Y-axis direction. The elevating mechanism of the slit nozzle 设置 is provided at both ends of the nozzle support portion, and the main cymbal is constituted by a lift motor % as a drive source and a ball screw 58. By the lift motor 59, the nozzle support portion is driven up and down along the ball screw 58 extending in the vertical direction with respect to the coating stage 4, and the interval between the discharge port 55a of the slit nozzle 55 and the substrate w is adjusted. In the elevating mechanism, at both ends (-Y side, +γ side) of the substrate transport path, a nozzle moving guide, two nozzle unit linear motors are disposed along the axis direction at a position not in contact with the substrate W. Each stator of the 53 (_γ side, +¥ side) is provided on the side surface of the main body device in the γ-axis direction along the 〇-axis direction, and each mover is fixedly disposed on the outer side of the elevating mechanism. The nozzle unit 5 moves along the nozzle unit moving guide 51* by the magnetic interaction between the stator and the mover. • Two nozzle unit linear scales 52 are provided at the opposite ends (_γ side, +γ side) of the substrate processing apparatus 1, respectively. The nozzle unit linear scale 52 detects the moving position of the nozzle unit π 5 , so the control unit 7 controls the driving of the nozzle unit linear motor 53 based on the detection result thereof, and moves the nozzle unit 5 in the X-axis direction. In other words, the slit nozzle is used to control the scanning of the surface of the substrate table 146584.doc 201041066. When the coating process is performed, the substrate is conveyed by the substrate in a state where the liquid is discharged from the discharge port 55a of the slit nozzle 55. 8: Maintaining both ends of the substrate and moving it horizontally at a specific speed in the (+x) axis direction. · Process flow of the substrate W of the substrate processing apparatus I> As the substrate processing device 丨The processing flow performed is as follows. The substrate pre-processed by the upstream unit is transported in the downstream direction by the driving of the roller conveyor 30. The delivery unit is disposed on the downstream side of the roller conveyor 30. 6 "Hui transmission unit 6 configuration 4: including the suspension 塾 64 for suspending the substrate w by the I gas generated from the formed nozzle, and conveying the lifting roller conveyor 6 〇, and along Γ-axis direction and suspension M is provided with a gap at the conveying rollers lift the roller groups of the conveyor 6〇. , conveying the lifting roller (4) 6G can be raised and lowered in the wrong direction with respect to the substrate material (4). When the vehicle is in the rising position, the top of the outer peripheral surface of the roller for conveying the lifting roller conveyor (9) is located at the top of the roller conveyor 3g. The circumference of the roller is equal to the height of the top, and when it is lowered, it falls below the lower suspension. When the substrate W is transported from the upstream unit, the transfer is performed: the roller conveyor 6 is in the state of being raised and the roller conveyor 3 is in the state of being raised. = move 'by this job ^ self-feed conveyor to send the unit board ^ ^ "return to the platform 1G. The inlet material is flat (four) throughout a piece of pressure: a surface is distributed with a number of small holes, and from the small hole force Therefore, the gas pressure formed by the discharge of the compressed air 'the inlet suspension platform 10 is on the upper substrate w in a suspended state. 146584.doc -12- 201041066 The right substrate W is transferred to the transfer unit 6, Then, the conveying lift roller conveyor 60 is lowered to be lower than the upper surface of the suspension pad 64. Therefore, the support of the transfer unit 6 to the substrate W depends only on the suspension force of the suspension pad 64, and the suspension force of the inlet suspension level σ 1 0 The substrate W is suspended and moved in a state of being in non-contact with a lower mechanism such as a roller. The substrate transfer chuck 8 holds both ends of the substrate w in a non-contact state parallel to the transport direction, and The substrate transporting chuck 8 holds and drives the ◎ substrate w, whereby the substrate w is sequentially transported to the inlet floating platform 10, the coating platform 4, and then to the outlet floating platform jj at a specific speed. The nozzle unit 5 and the nozzle Maintenance unit 9 Located on the coating platform 4. The slit nozzles 5 of the nozzle unit 5 that perform cleaning and pre-discharging treatment in the nozzle maintenance unit 9 apply coating treatment to the substrate w, and the coating is lowered onto the coating platform 4. The substrate w is transported to the discharge port 55& of the slit nozzle 55 at the application start position and the upper surface of the coating stage 4 by the driving of the substrate transfer chuck 8. At this time, the slit nozzle 55 is used. The discharge port is supplied to the surface of the substrate W, and the substrate W is coated. The substrate W after the coating process is transferred to the exit floating platform u. The substrate transfer is performed on the outlet suspension flat oil. The adsorption of the suction cup 8 is maintained. Then, the lower surface of the substrate W is supported and lifted by the ascending drive of the lift pin 115 which is placed on the exit suspension platform, and the transfer fork of the transfer robot 36 enters the raised lift pin. Between the 115 groups, the substrate W is received from the lift pin 115 group, and the substrate w is transferred to any of the vacuum drying units 37' 38 disposed downstream, and the applied treatment liquid is subtracted. Pressure drying. Its 146584 .doc 】3 201041066, the substrate w is transported to the delivery position 39' in the up-and-down direction with the reduced-pressure drying unit 38, and then submitted to the next step for performing the next step. One of the series of processes for the substrate processing and packaging and the processing device 1 is carried out. The earth plate <3. Outline of the nozzle maintenance unit 9> The nozzle maintenance unit 9 is a device for coating the surface attached to the counter substrate w. The processing liquid of the discharge port of the slit nozzle 55 is processed and cleaned and coated downward, and pre-discharge (= coating) is performed on a specific roller to adjust the state of the discharge port 55a of the slit nozzle 55. Therefore, the state in which the discharge of the treatment liquid can be smoothly performed can be performed. Therefore, it has a substantially cylindrical pro-% of the object to be ejected from the resistance (4) of the slit nozzle 55. As shown in Figs. 1 and 3, the nozzle maintenance unit 9 is supported from the lower side in the z-axis direction at a position outside the substrate transport path and further inside than the nozzle unit 5. Also on the nozzle maintenance unit 9, left and right (_γ side, +γ side) include a nozzle maintenance unit moving rail 91, a nozzle maintenance unit linear motor 93, and a nozzle maintenance unit linear scale 92, respectively. When viewed from the γ-axis direction, the nozzle maintenance unit moving rail 91 is located between the nozzle unit moving guide 51 and the conveying chuck moving guide 81, and is disposed at both ends of the substrate conveying path in the z-axis direction (-Υ Side, +Υ side). The nozzle maintenance unit moving rail 91 extends along the substrate conveying path not only on the inlet suspension platform 10, the coating platform 4, and the both sides of the outlet suspension platform η but also on both sides of the conveying unit 6. Two nozzle maintenance unit linear motors 93 disposed at both ends (_γ side, +γ side) are disposed on the side 146584.doc -14- 201041066 on the inner side in the z-axis direction of the substrate processing apparatus 1 in the z-axis direction. Each stator. Further, each mover is fixedly disposed on the nozzle maintenance unit 9. The nozzle maintenance unit 9 moves along the nozzle maintenance unit movement guide 91 by the magnetic interaction generated between the stators and the movers. • The two nozzle maintenance unit linear scales 92 are also placed at the ends (_γ side, +¥ side) of the substrate processing unit 1, respectively. The nozzle maintenance unit line .# scale 92 detects the moving position of the nozzle maintenance unit 9, so that the control unit 7 can control the nozzle maintenance unit 9 based on the detection result. Thus, the nozzle maintenance unit 9 is movable substantially parallel to the axis direction of the substrate processing apparatus 1 along the nozzle guard unit moving rail (4). Therefore, when the maintenance work of the lower portion of the nozzle maintenance unit 9 is performed, the nozzle maintenance unit 9 can be moved, so that the work can be easily performed. Further, the winter operator can carry out the maintenance work of the nozzle maintenance unit 9 itself after moving the nozzle maintenance unit 9 to a position convenient for work. The figure is a cross-sectional view of the mouth of the mouth. The nozzle maintenance unit 9 is configured to include a discharge adjustment unit that pre-discharges the treatment liquid from the slit nozzle 55 and applies it to the circumferential surface of the roller 95, thereby adjusting the front end of the slit nozzle. The state of the treatment liquid; the nozzle cleaning unit 9β that cleans the end portion ' of the slit nozzle 55 and the base 9C, and supports the combination of the discharge adjustment unit and the nozzle cleaning unit 9B. In the discharge adjusting portion 9A, the light member of the receiving member which is the processing liquid discharged from the slit nozzle for performing the pre-discharging treatment is provided in the roll groove as the casing. The roller 95 is a substantially cylindrical member that is slightly longer than the length of the slit nozzle 55 in the axial direction, and is disposed such that the longitudinal direction is flat with the Y-axis direction. 146584.doc -15· 201041066 One is provided with a roller rotation motor Roller 95 is rotated clockwise in Figure 4. Among them, the rotation axis of the roller 95 is driven by the rotation of the roller rotation motor 98. The roller groove 96 of the discharge adjusting portion 9A is formed in a box shape' and is laterally formed from the upper portion thereof. P (the left side of the (_χ) direction in Fig. 4) forms an opening. In the mouth 4, the top of the roll 95 is slightly protruded upward from the upper portion of the roll groove %, and the cleaning liquid supply (4) for supplying the new liquid of the cleaning liquid can supply the cleaning liquid while washing the light sample 96. The roller 95 is placed near the side surface in the longitudinal direction of the (+Χ) side inside the sample 96. The cleaning liquid is accumulated in the inner tank 96 to the extent that the lower end portion of the roller 95 is immersed. Therefore, by the roll 95 being condensed, the outer peripheral surface of the fourth liquid discharged from the slit nozzle 2 by the pre-discharge is sequentially immersed in the accumulated cleaning liquid. Further, the outer peripheral surface of the main washing liquid accumulated in the immersion is pulled up from the washing liquid by the rotation of the roller 95. , in order to maintain the deliquoring of the county at the time of (4)
C 槽96内之清洗液之濃度較理想的是飢以下，處理心 2理想的是議以下，特別理想的是4〇%以下。為調節 畜積於輥槽96内之處理液之濃度，流入輥槽％内之溶液量 及流出之溶液量係藉由控制部7監控，並被控制。具體而 吕，關於流入量’係基於安裝於清洗液之供給流路上之累 計流量計之值、及根據處理液之控制泵之驅動而算出的 值’於控制部7中進行運算。Μ , ^關於流出量，係根據安裝於 各廢液配管上之累計流量計之值、及相對於時間經過而算 出的蒸發量之值，於控制部7令進行運算。如此，對親槽 96内之處理液及清洗液之濃度進行管理。 146584.doc -16 - 201041066The concentration of the cleaning liquid in the C tank 96 is preferably below the hunger, and it is desirable to treat the heart 2 below, and particularly preferably 4% or less. In order to adjust the concentration of the treatment liquid accumulated in the roller tank 96, the amount of the solution flowing into the roller tank % and the amount of the solution flowing out are monitored by the control unit 7 and controlled. Specifically, the inflow amount is calculated by the control unit 7 based on the value of the cumulative flow meter attached to the supply flow path of the cleaning liquid and the value calculated based on the driving of the control liquid. Μ , ^ The outflow amount is calculated by the control unit 7 based on the value of the cumulative flow meter installed on each waste liquid pipe and the value of the evaporation amount calculated with respect to the passage of time. Thus, the concentration of the treatment liquid and the cleaning liquid in the parent tank 96 is managed. 146584.doc -16 - 201041066
〇 喷嘴清洗部9Β構成為包括喷嘴清洗單元4〇、及待機槽 41，該待機槽41提供用以使喷嘴清洗單元4〇於其上方待機 之待機場所。將吐出調整部9Α之輥槽96之（_χ)側之側方 部、與待機槽41之（+χ)側之側方部加以連結，進而藉由連 結管42將該待機槽41與輥槽96加以連接。該連結管42構成 為第1配管部》、與平行之第2配管部分以彼此連通之方式 直角地連接，該第i配管部分於作為鉛垂方向之冗軸方向上 延伸且於待機槽41之底面形成開口’該第2配管部分於作 為水平方向之X軸方向上延伸且於輥槽96之側面形成開 口。落入待機槽41上之清洗液及處理液於待機槽41中蓄積 之後，自待機槽41之底面所形成之連結管42之入口開口而 落入連結管42之内部並因自重而流下，然後自輥槽％之側 面所形成之連結管42之出口開口而向輥槽％内流出。 於輥槽96之内部，在輥95之側方設置有刮刀27。該刮刀 27係沿輥95而於Y軸方向上延伸之板狀，且與輥％^外周 面相抵接。藉由輥95旋轉，刮刀27掃描輥％之外周面，而 將附著於輥95之外周面之清洗液及殘留處理液刮去。 於輥槽96之内部側面，在輥槽96與待機槽“連結而成之 部位和連結管42之出口之間的位置虛，讯罢 〜u w m罝匙，δ又置有用以向輥槽 96内供給清洗液之新液之清洗液供給配管26。該清洗液供 給配管26係沿Υ轴方向而延伸之直管， π <且e且與清洗液供給機 構（未圖示）連接，並且於輥槽96内具有清洗液之吐出開 口。如此，於較連結管42之出口開口更上方、且輥槽％内 部之側面上方形成有清洗液供給配管26之吐出開口，因此 146584.doc -17- 201041066 除了自待機槽41通過連結管42而流出至輥槽％之内壁面之 處理液及清洗液之外，還利用自狹縫喷嘴55吐出後藉由親 95之旋轉而飛散之處理液及清洗液' &自清洗液供給配管 26吐出的清洗液之新液來對上述輥槽％之内壁面進行沖 刷。藉此，可清洗輥槽96之内壁面，並且可確實地使已使 用之處理液及清洗液蓄積於輥槽96之底部。 於輥槽96之外部側方，在輥槽96之側面之下部、與較輥 槽96内之蓄積液（處理液及清洗液）之上限水平更高之位置 之間’分別連接有大致^字形之連結配f28之兩端並形成 開口。因此，輥槽96内之溶液亦流入大致〕字形之連結配 管28内，輥槽96内之蓄積液之液面之高度、與連結配管28 内之液面之高度相等。於該連結配管28之特定位置處設置 有液面檢測感測器29，其檢測輥槽96内之蓄積液之液面的 高度。當該液面檢測感測器29檢測出之液面水平為特定之 基準水平以下時，表示輥槽96内之蓄積液之液量不足，響 應於控制部7根據液面檢測感測器29之檢測信號而產生之 指令信號，而自清洗液供給配管26供給追加之清洗液。 於輥槽96内在下表面設置有用以將輥槽％内之蓄積液排 出至外部之溢流廢液配管23及親槽廢液配f以此兩種廢液 配官，該等配管23、24貫穿基台9C而向下方延伸。 溢流廢液配管23之上端部23a始終為「開」之狀態，位 ;幸把ί曰96内之端（朝向系統外之導出口）係位於輥槽96内 之蓄積液之上限水平處。因此，隨著清洗液及處理液等流 入，即便超過輥槽96内之蓄積量之上限水平，亦可自該溢 1465S4.doc -18- 201041066 流廢液配管23向系統外排出，因此輥槽96内之蓄積液決不 會超過允許蓄積量之上限。 輥槽廢液配管24之上端部24a係設置於輥槽96之底面 上。於通常之處理時併設於輥槽廢液配管24上之閥為 關」，以即可蓄積清洗液及處理液等。然而，於要將輥 槽96内之蓄積液全部排出之情形時，根據來自控制部7之 〇 〇 信號，輥槽廢液配管24之閥變為「開」，將輥槽96内之蓄 積液全部排出至系統外。 於核槽96之與X軸方向平行之面之上部設置有排氣配 管25(圖5)。排氣配管25係設置於輥槽96之兩端（_Y側及+γ 側）’將親槽96内之蓄積液之環境氣體排出至系統外。 +喷U單元40自外部直接清洗進行塗佈處理後之狹縫 嘴脅55之吐出n55a ’通f時候係位於待機槽4ι之上方（以 下稱作「避讓位置」）。於喷嘴清洗單元4〇上連接有嘴嘴 清洗單元氣缸（未圖示）’藉由該氣缸之驅動，喷嘴清洗單The nozzle cleaning unit 9 is configured to include a nozzle cleaning unit 4A and a standby tank 41 that provides a standby place for the nozzle cleaning unit 4 to stand by. The side portion on the (_χ) side of the roll groove 96 of the discharge adjustment portion 9 is connected to the side portion on the (+χ) side of the standby groove 41, and the standby groove 41 and the roll groove are further connected by the connection pipe 42. 96 to connect. The connecting pipe 42 is configured such that the first pipe portion ′′ and the parallel second pipe portions are connected to each other at right angles, and the ith pipe portion extends in the direction of the redundant axis in the vertical direction and is in the standby groove 41 . The bottom surface is formed with an opening. The second pipe portion extends in the X-axis direction as the horizontal direction and forms an opening on the side surface of the roll groove 96. After the cleaning liquid and the processing liquid that have fallen into the standby tank 41 are accumulated in the standby tank 41, the inlet opening of the connecting pipe 42 formed on the bottom surface of the standby groove 41 falls into the inside of the connecting pipe 42 and flows down by its own weight, and then The outlet opening of the connecting pipe 42 formed on the side of the roll groove % flows out into the groove %. Inside the roller groove 96, a blade 27 is provided on the side of the roller 95. The scraper blade 27 is formed in a plate shape extending in the Y-axis direction along the roller 95, and is in contact with the outer peripheral surface of the roller. By the rotation of the roller 95, the blade 27 scans the outer peripheral surface of the roller %, and scrapes off the cleaning liquid and the residual treatment liquid adhering to the outer peripheral surface of the roller 95. On the inner side surface of the roller groove 96, the position between the portion where the roller groove 96 and the standby groove are "joined" and the outlet of the connecting pipe 42 are imaginary, and the δmwm key is applied to the roller groove 96. a cleaning liquid supply pipe 26 for supplying a new liquid of the cleaning liquid. The cleaning liquid supply pipe 26 is a straight pipe extending in the z-axis direction, and is connected to a cleaning liquid supply mechanism (not shown), and is connected to The discharge opening of the cleaning liquid is provided in the groove 96. Thus, the discharge opening of the cleaning liquid supply pipe 26 is formed above the outlet opening of the connection pipe 42 and above the side surface of the groove %, so that the discharge opening is provided. 201041066 In addition to the treatment liquid and the cleaning liquid that have flowed out from the standby tank 41 to the inner wall surface of the roller groove by the connection pipe 42, the treatment liquid and the cleaning which are scattered by the rotation of the pro-95 after being discharged from the slit nozzle 55 are used. The liquid & fresh liquid of the cleaning liquid discharged from the cleaning liquid supply pipe 26 flushes the inner wall surface of the roller groove %. Thereby, the inner wall surface of the roller groove 96 can be cleaned, and the used treatment can be surely used. Liquid and cleaning fluid accumulate in the roller groove 96 The bottom side of the roll groove 96 is connected to the lower side of the side of the roll groove 96 and the upper limit of the upper limit level of the accumulated liquid (treatment liquid and cleaning liquid) in the roll groove 96. The connection of the glyphs is provided at both ends of the f28 to form an opening. Therefore, the solution in the groove 96 also flows into the substantially U-shaped connecting pipe 28, and the height of the liquid level of the accumulating liquid in the groove 96 and the connecting pipe 28 The liquid level is equal in height. At a specific position of the connecting pipe 28, a liquid level detecting sensor 29 is provided which detects the height of the liquid level of the accumulated liquid in the roll groove 96. When the liquid level detecting sensor 29 When the detected liquid level is below a specific reference level, the liquid amount of the accumulated liquid in the roll tank 96 is insufficient, and the command signal generated by the control unit 7 based on the detection signal of the liquid level detecting sensor 29 is detected. The additional cleaning liquid is supplied from the cleaning liquid supply pipe 26. The overflow liquid supply pipe 23 and the in-situ waste liquid distribution f are provided on the lower surface of the roll tank 96 to discharge the accumulation liquid in the roll groove %. Disposal of waste liquid, these pipes 23, 24 The base portion 9C extends downward through the base 9C. The upper end portion 23a of the overflow waste liquid pipe 23 is always in the "open" state, and the end of the inner portion (the outlet port toward the outside of the system) is placed in the groove 96. The upper limit of the accumulation liquid inside. Therefore, as the cleaning liquid, the processing liquid, and the like flow in, even if the upper limit level of the accumulation amount in the roll tank 96 is exceeded, the flow waste liquid pipe 23 can be discharged from the overflow pipe 1465S4.doc -18- 201041066, so that the roll groove The accumulation of liquid in 96 will never exceed the upper limit of the allowable accumulation. The upper end portion 24a of the roll tank waste liquid pipe 24 is provided on the bottom surface of the roll groove 96. The valve provided on the roll tank waste pipe 24 during the normal process is closed, so that the cleaning liquid, the treatment liquid, and the like can be accumulated. However, when all of the accumulated liquid in the roll tank 96 is to be discharged, the valve of the roll waste liquid pipe 24 is turned "on" based on the signal from the control unit 7, and the liquid in the roll tank 96 is accumulated. All are discharged outside the system. An exhaust pipe 25 (Fig. 5) is provided above the surface of the core groove 96 that is parallel to the X-axis direction. The exhaust pipe 25 is provided at both ends (_Y side and +γ side) of the roll groove 96 to discharge the ambient gas of the accumulated liquid in the parent tank 96 to the outside of the system. + The spray U unit 40 is directly cleaned from the outside to perform the coating process. The slit of the nozzle 55 is n55a. When it is f, it is placed above the standby groove 4 (hereinafter referred to as "avoidance position"). A nozzle cleaning unit cylinder (not shown) is connected to the nozzle cleaning unit 4A. The nozzle cleaning sheet is driven by the cylinder.
所處之位置（以下稱作 「清洗位置」）°於該清洗位置處，㈣清洗單元40進行 狹縫喷嘴55之吐出口 553之清洗。 T 如圖5所示，噴嘴清洗單元4〇可沿γ轴方向而移動， 用使用有馬達及滾珠螺桿之普通的直接傳動機構1噴嘴 清W於χζ剖面圖中係以與狹缝喷嘴55之前端形狀 相付之方式而凹下成V字形。於該凹處與狹縫喷嘴 出口…相符之位置處’隔開特定之距離而將自清 給機構所供給之清洗液朝向狹縫嘴嘴55之吐出口…： 146584.doc -19- 201041066 出狹缝噴嘴55係/σ Y軸方向而延伸，故喷嘴清洗單元 -邊吐出處理液一邊沿γ轴方向移動，從而自外側清洗狹 缝喷嘴55之吐出口 55a。 <4_喷嘴維護單元9之處理動作> 對喷嘴維護單元9中進行之處理加以說明。圖6表示喷嘴 清洗早兀40對狹縫噴嘴55之吐出口…進行清洗處理時之 位置關係。於待機槽41上之避讓位置處停止之嗔嘴清洗單 兀40藉由喷嘴清洗單元氣紅之驅動，而與X軸方向大致平 行地向清洗位置移動。狹縫嘴嘴55藉由喷嘴軍元5之升降 移動、噴嘴維護單元9與喷嘴單元5之於水平方向上之相對 移動，而移動至喷嘴清洗單元40之上方為止。 於喷嘴清洗單元4G與狹㈣嘴55已料清洗位置之階段 :先ΓΤ單元4°—邊沿狹缝喷嘴55之吐―出 /月洗液一邊於γ軸方， 朴 上私動。稭由以此方式掃描狹縫喷 之吐出口 55a ’附著於狹缝喷嘴55之吐出口 “a上之 1液藉由自噴嘴清洗單元⑽吐出的清洗液而被沖洗。此 方之It 直接f積於位於下 嗔嘴产Γ 1 原本蓄積有清洗液，直接蓄積用於 月自之’月洗液及經清洗液沖洗之處理液，當超過蓄積 夺，自溢流廢液配管23之上端部23a排出。 、、主:…丁進订嘴嘴之預吐出處理時之狹縫嘴嘴55與噴嘴 /月洗早7G 40之位置關係。 精由贺嘴清洗單元4〇而對狹縫噴嘴55進行清洗之後，如 所不，狹縫噴臂55自藉由喷嘴清洗單元4〇而清洗之清 I46584.doc -20- 201041066 、位置起移動至輥95之外周面之頂部，並配置成與親％之 外周面隔開特定間隔。輥95於圖7中開始順時針旋轉，並 自狹縫喷嘴55將固定量之處理液以固定時間向旋轉之輥％ 之外周面吐出。 輥95之外周面之經處理液吐出之區域藉由輥％之旋轉而 依序於報95之下方浸潰於輥槽96内之蓄積液中。該蓄積液 之，度係根據溶液之供給量、廢液量及蒸發量之值而由控 〇 制部7管理，蓄積液之濃度控制在可充分發揮其效果之程 j。因此，附著於輥9S之外周面之處理液藉由蓄積液中之 β洗液成分之效果而自輥95之外周面被去除。 藉由》又置於& 95之側方之刮刀27，相對性地掃描因旋轉 而自蓄積液中拉升之輥95之外周面。藉此，刮去未完全去 除=殘留處理液、及附著於親95之外周面之清洗液、存在 於蓄積液中而附著於輥95之外周面的異物等。如此，作為 預吐出處理而自狹縫喷嘴55吐出處理液之處理，始終係於 〇 輥95之外周面未附著處理液及清洗液之狀態下進行。 進行預吐出之期間，噴嘴清洗單元40移動至待機槽41上 之避讓位置處。自噴嘴清洗單元4〇吐出之清洗液及喷嘴清 洗時所附著之處理液等蓄積於待機槽4i上。由於該待機槽 41與輥槽96係藉由連結管42而連接，因此蓄積於待機槽μ 上之清洗液全部流下至輥槽96，只要未超過輥槽96内之蓄 積量之上限水平則加以蓄積。 如此，該實施形態之裝置可將若是在以往則係作為廢液 而處理之蓄積於待機槽41上之清洗液及處理液、用於喷嘴 146584.doc •21· 201041066 清洗的清洗液及經油 Λ ^ 、冲洗之處理液暫時蓄積於共用之輥槽96 内。因此，可用於對 理而吐出至㈣之外^ 縫喷嘴55之預吐出處 外周面的處理液進行清洗。輕槽96内之 -先液及處理液之濃度係藉由 可，揮清洗液效果之程度之濃度。藉此 用自清洗液供給配管 …、而予令利 内蓄積之溶液之不足之清洗液之新液來補充報槽96 加供給量。又，隨刀’因此可削減清洗液之新液之追 * , 亦可削減來自噴嘴維護單元9之廢液 重口此亦可抑制廢液處理之成本。 二表示進行噴嘴内部清洗時之配置。如 55自猎由噴嘴清嗦 伙縫贺腎 先早7040而進行清洗之清洗位置起谁A — 下方移動，下降至輥㈣/月况位置起進而向 r以下㈣「 輥槽96之側面、與輥95側面之間之位置 (以下％作「内部位置」）處。 位置 所謂喷嘴内部清、穿，& ^ i 清洗液，㈣料55之㈣配管流入 月欣 使清洗液自吐出口 55以日a π ^ 直至吐出口 V Κ〜朝向外部吐出’藉此對 旦芏土出口 55a之内部配管 使用噴嘴、、眘味《 _ 丁，月洗。该喷嘴内部清洗與 、萆π洗早το 40而僅對狹縫嘖 清洗之喷嘴清洗不同。於喷嘴内n σ出口〜進行 清洗更多量之,、主洗、 σ〉月洗中，係使用較噴嘴 里< β洗液，並使狹鏠喷嘴 %之内部下方移動，以便自吐出t:55向内：位置的輕槽 可將吐出液之向 a吐出π洗液，藉此 於涂佑1 圍之飛散抑制在最小限度。 ^ ♦理之待機時，以不使狹 之處理液凝固之方彳„ ·、貨嘴55之吐出口 55a 破固之方式，於自狹縫嘴嘴55吐 時、或為更換卢柯^二± 出處理液之情形 、处 部配管内之處理液全部排出至 146584.doc -22- 201041066 外部之情形時，狹縫喷嘴55亦移動至内部位置，並吐出清 洗液及處理液。 如此，於自内部位置處之狹縫喷嘴55之清洗液及處理液 之吐出、特別是於喷嘴内部清洗中，自狹縫喷嘴55吐出的 清洗液，與用於喷嘴清洗之清洗液及經沖洗之處理液、蓄 積於待機槽上之清洗液及處理液同樣地，暫時蓄積於輥槽 96内。因此，可用於對因狹縫噴嘴55之預吐出而附著有處 ❹ 理液之輥外周面進行清洗。 於噴嘴内部清洗中使用較噴嘴清洗時量更多之清洗液並 自狹縫喷嘴55吐出，但於以往係全部作為廢液來處理。由 於可再-人利用其等，故可削減作為新液而供給至輥槽％内 之清洗液之使用量。又，由於亦可削減廢液量，故亦可抑 制廢液處理之成本。 又，若在以往，則必須於噴嘴清洗單元4〇及待機槽41、 親槽96之各個上’設置用以排出溶液環境氣體之排氣配管 ❹25、及用以將所蓄積之清洗液、處理液排出至外部之廢液 管路（相當於溢流廢液配管23、輥槽廢液配管24之管路）。 然而，根據該實施形態之裝置，喷嘴維護單元9上所吐出 =處理液及清洗液全部暫時蓄積於輥槽则，因此排氣配 吕25及廢液管路（溢流廢液配管23、輥槽廢液配管μ)僅設 置於噴嘴清洗單元40、待機槽41、及輥槽外中之輥槽卯上 即可。因此，可削減噴嘴維護單元9所必需之配管數，故 可簡化噴嘴維護單元9之裝置構成。 <5.變形例> 146584.doc -23- 201041066 於上述實施形態中，係構成為設置有待機槽41，但並不 限於此種形態。 圖9係變形例之噴嘴維護單元9iXZ剖面圖。於該例 中，不設置待機槽41，而是將噴嘴清洗單元4〇固定設置於 輥槽96内。於圖9之圖示方向上可見喷嘴清洗單元4〇係懸 浮於輥槽96中，實際上喷嘴清洗單元4〇係以+γ方向及_γ 方向之端部連結於輥槽96。該情形時，由於預先將噴嘴清 洗單凡40設置於輥槽96内，故無需安裝噴嘴清洗單元氣 缸。因此，可進一步縮小喷嘴維護單元9整體。 當狹缝噴嘴55移動至内部位置時，狹縫喷嘴5S下降至噴 嘴π洗早凡40之（+χ)側之側方與輥％之卜χ)側之側方之間 的空間。 /、上述貫施形態同樣地，該變形例中亦可將進行喷嘴清 洗或喷嘴内部清洗時所吐出之清洗液及經沖洗之處理液 :部暫時蓄積於輥槽96内，故可用於利用預吐出處理對附 者於較95上之處理液進行清洗。因此，可削減以去除附著 於輥95上之處理液為目的而作為新液供給至輥槽 洗液之使用晋。7 丄 ’由於亦可削減廢液量’故亦可抑制廢 液處理之成本。 a 2右在先前，必須於喷嘴清洗單元40及輥槽96之各個 二：置用以排出溶液環境氣體之排氣配管25、及用以排出 斤蓄積之'月洗液、處理液之廢液管路(溢流廢液配管23、 輥槽廢液配管24)。 0 、而’根據本申請案發明，喷嘴維1 單元9上所吐出老 、、’·设 K之處理液及清洗液全部暫時蓄積於輕槽9 6 146584.doc -24- 201041066 内，因此排氣配管2 5及廢液管路（溢流廢液配管2 &二〇、親彳番 廢液配管24)僅設置於噴嘴清洗單元4〇及輥槽％中之輥^ 96上即可。因此，可削減噴嘴維護單元9所必需之配二 數’從而可簡化喷嘴維護單元9之裝置構成。 & 又，於上述實施形態中，噴嘴清洗單元4〇係—邊於Y軸 方向上移動一邊進行狭缝喷嘴55之吐出口 55a之清洗， 並不限於此種形態。 仁 ΟThe position (hereinafter referred to as "cleaning position") is at the cleaning position, and (4) the cleaning unit 40 performs cleaning of the discharge port 553 of the slit nozzle 55. T, as shown in FIG. 5, the nozzle cleaning unit 4〇 is movable in the γ-axis direction, and the nozzle is cleaned in the χζ cross-sectional view by a conventional direct transmission mechanism 1 using a motor and a ball screw. The shape of the front end is concave and formed into a V shape. At the position where the recess coincides with the slit nozzle outlet, the cleaning liquid supplied from the cleaning mechanism is directed to the discharge port of the slit nozzle 55 at a specific distance...: 146584.doc -19- 201041066 Since the slit nozzle 55 is extended in the y-axis direction, the nozzle cleaning unit moves the y-axis in the γ-axis direction, thereby cleaning the discharge port 55a of the slit nozzle 55 from the outside. <4_Processing Operation of Nozzle Maintenance Unit 9> The processing performed in the nozzle maintenance unit 9 will be described. Fig. 6 is a view showing the positional relationship when the nozzle cleaning front 40 is used to clean the discharge port of the slit nozzle 55. The nozzle cleaning unit 40, which is stopped at the avoidance position on the standby groove 41, is driven by the nozzle cleaning unit gas red, and moves to the cleaning position substantially in parallel with the X-axis direction. The slit nozzle 55 is moved to the upper side of the nozzle cleaning unit 40 by the movement of the nozzle arm 5 and the relative movement of the nozzle maintenance unit 9 and the nozzle unit 5 in the horizontal direction. At the stage where the nozzle cleaning unit 4G and the narrow (four) nozzle 55 have been cleaned: the first unit 4°—the edge slit nozzle 55 is spouted out/monthly on the γ axis side, and the board is privately moved. The straw is scanned by the discharge port 55a of the slit jet in this manner. The liquid attached to the discharge port "a of the slit nozzle 55 is flushed by the cleaning liquid discharged from the nozzle cleaning unit (10). It is accumulated in the lower mouth of the sputum. 1 The original cleaning liquid is accumulated, and the treatment liquid for the monthly washing liquid and the washing liquid is directly accumulated for the month. When it exceeds the accumulation, the upper end of the overflow liquid piping 23 is over. 23a is discharged.,, main: ... the positional relationship between the slit nozzle 55 and the nozzle/month wash early 7G 40 during the pre-discharge processing of the nozzle. The nozzle nozzle 55 is closed by the nozzle cleaning unit 4 After the cleaning, if not, the slit spray arm 55 is cleaned from the top surface of the outer surface of the roller 95 by the cleaning of the nozzle cleaning unit 4, and is configured to be in contact with the pro The outer peripheral surface is separated by a specific interval. The roller 95 starts to rotate clockwise in Fig. 7, and a fixed amount of the treatment liquid is discharged from the slit nozzle 55 to the outer peripheral surface of the rotating roller % at a fixed time. The area where the treated liquid is discharged is sequentially reported by the rotation of the roller % 5 is immersed in the accumulation liquid in the roller tank 96. The degree of the accumulation liquid is managed by the control unit 7 according to the supply amount of the solution, the amount of the waste liquid, and the evaporation amount, and the concentration control of the accumulation liquid Therefore, the treatment liquid which adheres to the outer peripheral surface of the roll 9S is removed from the outer peripheral surface of the roll 95 by the effect of the β lotion component in the accumulating liquid. The blade 27 on the side of the & 95 relatively scans the outer peripheral surface of the roller 95 which is pulled up from the accumulated liquid by the rotation. Thereby, the scraping is not completely removed = the residual treatment liquid is adhered to, and the outer circumference of the pro-95 is adhered The surface cleaning liquid, the foreign matter which adheres to the outer peripheral surface of the roll 95 in the accumulation liquid, etc. The process of discharging the process liquid from the slit nozzle 55 as a pre-discharge process is always the outer surface of the roll 95. The process of attaching the treatment liquid and the cleaning liquid is performed. During the pre-discharging, the nozzle cleaning unit 40 moves to the escape position on the standby tank 41. The cleaning liquid discharged from the nozzle cleaning unit 4 and the processing attached to the nozzle cleaning Liquid or the like is accumulated in the standby tank 4i. Since the standby groove 41 and the groove 96 are connected by the connection pipe 42, the cleaning liquid accumulated in the standby groove μ flows down to the groove 96, and the upper limit level of the accumulation amount in the groove 96 is not exceeded. In the apparatus of the embodiment, the cleaning liquid and the processing liquid which are stored in the standby tank 41 and are used as the waste liquid, and the cleaning liquid for the nozzle 146584.doc • 21· 201041066 and The treatment liquid which has been immersed in oil Λ and rinsing is temporarily stored in the common roller groove 96. Therefore, it can be used for cleaning the treatment liquid which is discharged to the outer peripheral surface of the pre-discharge nozzle of the (s) nozzle 55. The concentration of the first liquid and the treatment liquid is the concentration of the effect of the cleaning liquid. Thereby, the supply of the tank 96 is supplied with a new liquid of the cleaning liquid which is insufficient for the solution accumulated in the inside of the cleaning liquid. Further, with the knife, it is possible to reduce the chasing of the new liquid of the cleaning liquid, and it is also possible to reduce the waste liquid from the nozzle maintenance unit 9 and also suppress the cost of the waste liquid treatment. The second indicates the configuration when the nozzle is cleaned internally. For example, the 55-self-hunting is cleaned by the nozzle, and the cleaning position of the patient is as early as 7040. The A-lower movement moves down to the roll (four)/month position and then to the r (4) "the side of the roll groove 96, and The position between the sides of the roller 95 (the following is the "internal position"). The position is called the inside of the nozzle, clearing, wearing, & ^ i cleaning solution, (4) material 55 (4) piping flowing into the moon, so that the cleaning liquid is discharged from the outlet 55 for a day π ^ until the discharge port V Κ ~ is discharged to the outside. Use the nozzle for the internal piping of the bauxite outlet 55a, and carefully _ ding, monthly washing. The internal cleaning of the nozzle is different from that of the nozzle cleaning of the slit 清洗. In the nozzle n σ outlet ~ to wash a larger amount, the main wash, σ > month wash, the use of the nozzle in the < β lotion, and the lower part of the narrow nozzle to move below, so that self-spit t : 55 Inward: The light trough at the position can discharge the π washing liquid to the a discharge liquid, thereby suppressing the scattering of the coating area to a minimum. ^ ♦ In the standby mode, the method is to prevent the narrowing of the treatment liquid from solidifying, and the discharge port 55a of the nozzle 55 is broken, when it is spit from the slit nozzle 55, or for replacing Lu Ke ^ 2 ± When the treatment liquid is discharged and the treatment liquid in the piping at the end is discharged to the outside of 146584.doc -22- 201041066, the slit nozzle 55 is also moved to the internal position, and the cleaning liquid and the treatment liquid are discharged. The discharge of the cleaning liquid and the treatment liquid from the slit nozzle 55 at the internal position, particularly in the internal cleaning of the nozzle, the cleaning liquid discharged from the slit nozzle 55, the cleaning liquid for nozzle cleaning, and the processing liquid for rinsing In the same manner, the cleaning liquid and the processing liquid accumulated in the standby tank are temporarily stored in the roll tank 96. Therefore, the cleaning liquid can be used to clean the outer peripheral surface of the roll to which the liquid is adhered by the pre-discharge of the slit nozzle 55. In the internal cleaning of the nozzle, a cleaning liquid having a larger amount than that of the nozzle cleaning is used and discharged from the slit nozzle 55. However, in the past, all of the cleaning liquid is used as a waste liquid. Since it can be reused, it can be reduced as a new liquid. And supplied to the roller slot % Since the amount of the cleaning liquid can be reduced, the amount of the waste liquid can be reduced, so that the cost of the waste liquid treatment can be suppressed. In the related art, it is necessary to use the nozzle cleaning unit 4, the standby tank 41, and the in-slot 96. Each of the upper exhaust gas piping 25 for discharging the ambient gas of the solution, and the waste liquid piping for discharging the accumulated cleaning liquid and the processing liquid to the outside (corresponding to the overflow waste liquid piping 23 and the rolling tank waste liquid) However, according to the apparatus of the embodiment, the discharge/treatment liquid and the cleaning liquid on the nozzle maintenance unit 9 are all temporarily accumulated in the roller groove, so that the exhaust gas distribution 25 and the waste liquid line (overflow) The flow waste liquid pipe 23 and the roll waste liquid pipe μ) may be provided only in the nozzle cleaning unit 40, the standby tank 41, and the roll groove in the outside of the roll groove. Therefore, the piping necessary for the nozzle maintenance unit 9 can be reduced. The number of the device configuration of the nozzle maintenance unit 9 can be simplified. <5. Modifications> 146584.doc -23- 201041066 In the above embodiment, the standby groove 41 is provided, but the configuration is not limited thereto. Figure 9 is a nozzle maintenance unit 9 of a modification In this example, the nozzle cleaning unit 4 is not fixed, but the nozzle cleaning unit 4 is fixedly disposed in the roller groove 96. In the direction shown in Fig. 9, the nozzle cleaning unit 4 is suspended in the roller groove. In the case of 96, the nozzle cleaning unit 4 is connected to the roller groove 96 at the end in the +γ direction and the _γ direction. In this case, since the nozzle cleaning unit 40 is previously disposed in the roller groove 96, it is not necessary to install. The nozzle cleaning unit cylinder. Therefore, the entire nozzle maintenance unit 9 can be further reduced. When the slit nozzle 55 is moved to the internal position, the slit nozzle 5S is lowered to the side of the nozzle π washing 40 (+χ) side and the roller % χ χ) The space between the sides of the side. In the same manner as in the above-described embodiment, in the modification, the cleaning liquid and the rinsed processing liquid discharged during the nozzle cleaning or the internal cleaning of the nozzle may be temporarily accumulated in the roller groove 96, so that the use can be utilized. The discharge treatment cleans the treatment liquid attached to the apparatus at 95. Therefore, it is possible to reduce the use of the fresh liquid as a new liquid to the roller bath for the purpose of removing the treatment liquid adhering to the roller 95. 7 丄 'Because the amount of waste liquid can also be reduced, the cost of waste liquid treatment can also be suppressed. a 2 right before, must be in each of the nozzle cleaning unit 40 and the roller tank 96: an exhaust pipe 25 for discharging the ambient gas of the solution, and a waste liquid for discharging the monthly liquid and the treatment liquid Pipeline (overflow waste pipe 23, roll tank waste pipe 24). According to the invention of the present application, the processing liquid and the cleaning liquid which are discharged from the nozzle 1 unit 9 are all temporarily accumulated in the light tank 9 6 146584.doc -24- 201041066, so The gas piping 2 5 and the waste liquid piping (overflow waste liquid piping 2 & 2, and the relative waste liquid piping 24) may be provided only on the nozzle cleaning unit 4 and the roller 96 of the roller groove %. Therefore, the number of configurations necessary for the nozzle maintenance unit 9 can be reduced, so that the device configuration of the nozzle maintenance unit 9 can be simplified. Further, in the above-described embodiment, the nozzle cleaning unit 4 performs cleaning of the discharge port 55a of the slit nozzle 55 while moving in the Y-axis direction, and is not limited to this embodiment. Ren
只要喷嘴清洗單元4〇於.方向上具有至少與狹缝嘴嘴 55之吐出口 553之丫軸方向同等的長度，則亦可不於γ軸方 向切動。該情料’喷嘴清洗單元鄉藉㈣嘴清洗單 兀氣缸之驅動而已移動至清洗位置之階段 I♦ 早 …、尚彳見吐^出 口 553於¥軸方向上掃描即可進行吐出口 55a之清洗。因 此，無需設置用以使喷嘴清洗單元4〇於γ軸方向上移動2 馬達及滾珠螺桿之類的直接傳動機構。 夕之 如此，喷嘴清洗單元戦需於丫軸方向上移動，因 订狹縫噴嘴55之吐出口 5&之清洗眸 態更短。 “先之時間可較上述實施形 π上迷貫施形 ,. u°Τ於X軸方向 移動可能之機構，但亦可無法移動。即，只要係 ^移動之形態，㈣嘴維護單元9亦可固定。該情形時， 構成^設置喷嘴維護單元9之喷嘴維護單元線性標度尺 嘴維料元線性馬物。以可手動移㈣嘴維護單 理設置有噴嘴維護單元移動導執91，於基板處 理裝置1運轉之期間，藉由鎖止機構加以固定以便使喷嘴 146584.doc 25- 201041066 維護單元9不移動。 【圖式簡單說明】 圖Η系本發明之實施形態之基板處理裝置之頂視圖； 圖2係表示基板處理裝置之控制機構之方塊圖； 圖3係本發明之實施形態之基板處理裝置之ΥΖ剖面圖； 圖4係本發明之實施形態之基板處理裝置之喷嘴維護單 元之ΧΖ剖面圖； 圖5係本發明之實施形態之基板處理裝置之喷嘴維護單 元之頂視圖； 圖6係部分性地表示本發明之實施形態之基板處理裝置 之喷嘴維護單元之處理流程之ΧΖ剖面圖； 圖7係部分性地表示本發明之實施形態之基板處理裝置 之噴嘴維護單元之處理流程之ΧΖ剖面圖； 圖8係部分性地表示本發明之實施形態之基板處理袭置 之喷嘴維護單元之處理流程之ΧΖ剖面圖；及 圖9係部分性地表示本發明之變形例之基板處理裝置之 喷嘴維護單元之處理流程之ΧΖ剖面圖。 【主要元件符號說明】 1 基板處理裝置 5 噴嘴單元 7 控制部 8 基板搬送吸盤 9 噴嘴維護單元 23 溢流廢液配管 146584.doc •26- 201041066 24 輥槽廢液配管 25 排氣配管 26 清洗液供給配管 27 刮刀 29 液面檢測感測器 40 喷嘴清洗單元 41 待機槽 42 連結管 55 狹縫喷嘴 55a 吐出口 95 輥 96 輥槽（框體） 98 輥旋轉馬達 〇 146584.doc -27-As long as the nozzle cleaning unit 4 has a length equal to at least the axial direction of the discharge port 553 of the slit nozzle 55 in the direction, the nozzle cleaning unit 4 may not be cut in the γ-axis direction. In the case of the nozzle cleaning unit (4) nozzle cleaning single cylinder, the stage has been moved to the cleaning position. I♦ As early as possible, the spout exit 553 is scanned in the direction of the ¥ axis to perform the cleaning of the discharge port 55a. . Therefore, it is not necessary to provide a direct transmission mechanism for moving the nozzle cleaning unit 4 in the γ-axis direction by the 2 motor and the ball screw. In this case, the nozzle cleaning unit does not need to be moved in the direction of the x-axis, and the cleaning state of the discharge port 5& of the slit nozzle 55 is shorter. "The first time can be compared with the above-mentioned implementation of the shape π, the u ° Τ in the X-axis direction of the possible mechanism, but can not move. That is, as long as the movement of the shape, (four) mouth maintenance unit 9 In this case, the nozzle maintenance unit of the nozzle maintenance unit 9 is provided with a linear scale mouth and a linear element of the material. The nozzle can be manually moved (four) to maintain the nozzle. During the operation of the substrate processing apparatus 1, the locking mechanism is fixed so that the nozzle 146584.doc 25- 201041066 maintenance unit 9 does not move. [Schematic Description] The top of the substrate processing apparatus of the embodiment of the present invention 2 is a block diagram showing a control mechanism of a substrate processing apparatus; FIG. 3 is a cross-sectional view showing a substrate processing apparatus according to an embodiment of the present invention; and FIG. 4 is a nozzle maintenance unit of a substrate processing apparatus according to an embodiment of the present invention; 5 is a top view of a nozzle maintenance unit of a substrate processing apparatus according to an embodiment of the present invention; and FIG. 6 is a partial view showing a substrate processing of an embodiment of the present invention. FIG. 7 is a cross-sectional view showing a process flow of a nozzle maintenance unit of a substrate processing apparatus according to an embodiment of the present invention. FIG. 8 is a partial cross-sectional view showing the present invention. FIG. 9 is a cross-sectional view showing a process flow of a nozzle maintenance unit of a substrate processing apparatus according to a modification of the present invention. FIG. 9 is a cross-sectional view showing a process flow of a nozzle maintenance unit of a substrate processing apparatus according to a modification of the present invention. Explanation of main component symbols: 1 Substrate processing apparatus 5 Nozzle unit 7 Control part 8 Substrate transfer suction cup 9 Nozzle maintenance unit 23 Overflow waste liquid piping 146584.doc • 26- 201041066 24 Roller waste liquid piping 25 Exhaust piping 26 Cleaning liquid supply Piping 27 Scraper 29 Liquid level detecting sensor 40 Nozzle cleaning unit 41 Standby tank 42 Connecting tube 55 Slit nozzle 55a Spit 95 Roller 96 Roller (frame) 98 Roller motor 〇146584.doc -27-